JP5149147B2 - Component inspection device and component transfer device - Google Patents

Description

  The present invention relates to a component inspection device and a component transfer device, and more particularly to a component inspection device including an imaging unit that images a terminal of a component, and a component transfer device including a component inspection unit.

  2. Description of the Related Art Conventionally, a component inspection apparatus including an imaging unit that images a terminal such as a lead terminal of a component or a substantially spherical terminal and a component transfer apparatus including a component inspection unit are known (for example, see Patent Document 1). .

  In the above-mentioned Patent Document 1, a CCD camera that captures an image of a substantially spherical terminal provided on the bottom surface side of a component sucked by the suction nozzle from below, and light is irradiated from the horizontal direction to the substantially spherical terminal. On the other hand, a component inspection apparatus including two lights arranged so as to face each other is disclosed. In this component inspection apparatus, the reflected light that is incident from the horizontal direction and is reflected downward by the substantially spherical terminal is imaged by the CCD camera, so that an annular imaging that excludes the top of the substantially spherical terminal is taken. An image can be obtained. Thereby, in the component inspection apparatus by the said patent document 1, it is comprised so that the lack of the substantially spherical terminal of the imaged components can be detected. However, in this patent document 1, since the substantially spherical terminal provided on the bottom surface side of the component is imaged from below, it is difficult to detect the protruding height of the terminal (height in the depth direction of the image). there were.

  Therefore, conventionally, a component inspection apparatus (component inspection unit) that can detect the protruding height of the terminal of a component has also been proposed (for example, see Patent Document 2). This Patent Document 2 includes a suction unit that sucks a component, includes a head unit that transfers the sucked component, and a component inspection unit that measures the flatness of the terminal of the component sucked by the suction nozzle. A component transfer device is disclosed. The component inspection unit of this component transfer apparatus includes a camera that captures an image of a terminal provided on a component sucked by a suction nozzle from an oblique direction, and light incident on the terminal is reflected light with respect to a vertical line passing through the terminal ( And an illuminating device arranged to be incident from the opposite side. In this component transfer device, incident light from the illumination device is reflected at the top of the substantially spherical terminal and reflected to the opposite side of the incident light with respect to a vertical line passing through the substantially spherical terminal. By capturing this reflected light with a camera, an image of the top of the substantially spherical terminal can be obtained. This component transfer device measures the coplanarity (flatness) of a component terminal by taking images of the top of the terminal from multiple angles and measuring the protruding height of the terminal based on the resulting image. It is configured to be able to. On the other hand, in recent years, spherical terminal parts including a substantially spherical terminal on the bottom side, such as BGA (Ball Grid Array) and CSP (Chip Size Package), have been developed from the bottom surface of the part (base material bottom surface) by reducing the thickness of the package. The protruding height of the terminal tends to be small.

Japanese Patent Laid-Open No. 11-251799 JP 2008-78399 A

  However, in the component transfer device of Patent Document 2, incident light from the illumination device is reflected on the opposite side with respect to the vertical line passing through the substantially spherical terminal and is captured by the camera. When the protruding height of the shaped terminal is small, the difference in the distance between the top of the terminal and the bottom of the component (the bottom of the base material on which the terminal is provided) is reduced, which is reflected at the top of the terminal. Both the reflected light and the reflected light reflected from the bottom surface of the component (the bottom surface of the substrate on which the terminals are provided) are imaged by the camera. For this reason, when the protruding height of the substantially spherical terminal is small, the reflection from the bottom surface of the substrate (the bottom surface of the component) other than the substantially spherical terminal is reflected in the captured image, so that There is a problem that it becomes difficult to accurately identify a substantially spherical terminal. In addition, as a component inspection apparatus and a component transfer apparatus, it is requested | required that the terminal of the component which has a lead terminal may be identified accurately.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a component inspection apparatus and component transfer capable of accurately identifying a component terminal from a captured image. Is to provide a device.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, a component inspection apparatus according to a first aspect of the present invention includes an oblique imaging unit that captures an image of a terminal of a component from an oblique direction, and imaging light to the component when the oblique imaging unit captures an image. First illumination and second illumination to be irradiated, and switching means for switching between the first illumination and the second illumination according to the type of component imaged by the oblique imaging unit, the oblique imaging unit is connected to the terminal of the component It is configured to image reflected light that is irradiated from one illumination or the second illumination and reflected obliquely downward from the terminal of the component, and the first illumination is from one side in a predetermined direction in the horizontal direction to the component during imaging . The first incident light to the component terminal is the same as the reflected light from the component terminal with respect to a vertical line that irradiates light and passes through the imaging position of the component terminal and is orthogonal to the bottom surface of the component It is arranged so as to be inclined to the side The second illumination irradiates the component with light from the other side in a predetermined direction in the horizontal direction at the time of imaging, and passes through the imaging position of the component terminal and is perpendicular to the bottom surface of the component. On the other hand, the second incident light to the terminal of the component is arranged so as to be inclined to the opposite side to the first incident light, and the switching means is configured such that the component to be imaged has a substantially spherical shape at the time of imaging by the oblique imaging unit. When the terminal having the portion is a spherical terminal component provided on the bottom surface, the first illumination is switched to, and when the component to be imaged is a lead terminal component having a lead wire terminal, the second It is configured to switch to lighting.

In the component inspection apparatus according to the first aspect, as described above, the oblique imaging unit that captures an image of the component terminal from the oblique direction is reflected on the component terminal from the first illumination and reflected from the component terminal. In the first illumination, the first incident light to the component terminal at the time of imaging passes through the imaging position of the component terminal and is perpendicular to the vertical line of the component bottom surface. By placing the component terminal so as to be inclined to the same side as the reflected light from the component terminal, the component terminal passes through the imaging position of the component terminal and is perpendicular to the vertical line of the component bottom surface. Thus, imaging can be performed using reflected light reflected on the same side as the first incident light from the first illumination. In this case, the reflected light irradiated from the first illumination and reflected by the bottom surface (base surface) of the component sucked by the suction nozzle passes through the imaging position of the component terminal and is orthogonal to the bottom surface of the component. Therefore, the reflected light from the bottom surface (base material bottom surface) other than the terminal can be prevented from being reflected in the captured image by the oblique imaging unit. As a result, it is possible to obtain a captured image of the terminal in which unnecessary reflected light is suppressed, and thus it is possible to accurately identify the terminal of the component from the captured image. In addition, even when there are a plurality of types of components having different terminal shapes and positions where the terminals are provided, by switching between the first illumination and the second illumination, an appropriate direction according to the shape and arrangement of the component terminals The terminal can be irradiated with incident light from. Thereby, even when there are a plurality of types of parts having different terminal shapes and arrangements, a captured image of the terminal can be obtained while suppressing reflection of unnecessary reflected light from the bottom surface of the substrate. For example, in a spherical terminal component having a spherical terminal on the bottom surface such as BGA, reflection of reflected light on the bottom surface of the substrate of the component can be suppressed by imaging using the first illumination. In addition, for example, QFP (Quad Flat Package), reflection of the captured image from the bottom surface of the base material to a component provided with a lead-line terminal (lead) protruding outward from the outer edge of the component Since the reflection of light does not easily occur, the second is disposed so as to be inclined to the opposite side of the first incident light with respect to a vertical line that passes through the imaging position of the terminal of the component and is orthogonal to the bottom surface of the component. By irradiating the second incident light using illumination, the bottom surface side of the lead (terminal) can be clearly imaged. In this way, the switching means can acquire a captured image in which reflection of reflected light from the bottom surface of the base material onto the captured image is suppressed by the first illumination for the spherical terminal component, and other than the spherical terminal component. For the component, a captured image on the bottom surface side of the terminal can be acquired by the second illumination. As a result, it is possible to further improve the identification accuracy of the component terminals from the captured image.

In the component inspection apparatus according to the first aspect, preferably, the inclination angle of the first incident light at the time of imaging with respect to a vertical line that passes through the imaging position of the terminal of the component and is orthogonal to the bottom surface of the component, It is more than the inclination angle of the reflected light from the terminal of the component. If comprised in this way, since the incident angle with respect to the base material bottom face of the component of the 1st incident light from 1st illumination can be enlarged, it passes along the imaging position and is perpendicular | vertical orthogonal to the bottom face of the said component. The reflected light from the bottom surface of the substrate can be reflected on the side opposite to the first incident light at a larger reflection angle with respect to the line. Thereby, reflection of reflected light from the bottom surface of the substrate can be further suppressed.

In the component inspection apparatus according to the first aspect, preferably, the first illumination is arranged so as to irradiate the component with light for imaging from below the component during imaging, and is provided on one side of the oblique imaging unit. An elevating mechanism unit that is fixedly provided on the side surface and supports the first illumination so as to be movable up and down at an ascending position during imaging and a descending position during non-imaging. With this configuration, the first illumination is disposed at a lowered position that does not hinder the relative movement of components during non-imaging, and the height position of the first illumination is raised during imaging so Since the incident angle of the incident light with respect to the bottom surface of the material can be further increased, reflection of reflected light from the bottom surface of the base material into the captured image can be suppressed.

A component transfer apparatus according to a second aspect of the present invention includes a plurality of suction nozzles arranged on a straight line, each of which sucks a component, a head unit that transfers the sucked component, and an array of the plurality of suction nozzles and direction, is configured such that the horizontal direction a predetermined direction coincides, Ru and a component inspecting apparatus according to the first aspect of performing flatness measurement of components of the terminal adsorbed by the suction nozzle.

In the component transfer apparatus according to the second aspect, as described above, the oblique imaging unit that images the component terminal from the oblique direction is reflected from the first illumination on the component terminal and reflected from the component terminal. The light is configured to be imaged, and the first illumination is set to a vertical line in which the first incident light to the component terminal during imaging passes through the imaging position of the component terminal and is orthogonal to the bottom surface of the component. On the other hand, by arranging to be inclined to the same side as the reflected light from the component terminal, the component terminal sucked by the suction nozzle passes through the imaging position of the component terminal and is relative to the bottom surface of the component. Thus, it is possible to take an image using reflected light reflected on the same side as the first incident light from the first illumination with respect to a perpendicular line. In this case, the reflected light irradiated from the first illumination and reflected by the bottom surface (base surface) of the component sucked by the suction nozzle passes through the imaging position of the component terminal and is orthogonal to the bottom surface of the component. Therefore, the reflected light from the bottom surface (base material bottom surface) other than the terminal can be prevented from being reflected in the captured image by the oblique imaging unit. Thereby, since the captured image of the terminal in which unnecessary reflected light is suppressed from being captured can be obtained, the terminal of the component can be accurately identified from the captured image. In addition, even when there are a plurality of types of components having different terminal shapes and positions where the terminals are provided, by switching between the first illumination and the second illumination, an appropriate direction according to the shape and arrangement of the component terminals The terminal can be irradiated with incident light from. Thereby, even when there are a plurality of types of parts having different terminal shapes and arrangements, a captured image of the terminal can be obtained while suppressing reflection of unnecessary reflected light from the bottom surface of the substrate. For example, in a spherical terminal component having a spherical terminal on the bottom surface such as BGA, reflection of reflected light on the bottom surface of the substrate of the component can be suppressed by imaging using the first illumination. In addition, for example, QFP (Quad Flat Package), reflection of the captured image from the bottom surface of the base material to a component provided with a lead-line terminal (lead) protruding outward from the outer edge of the component Since the reflection of light does not easily occur, the second is disposed so as to be inclined to the opposite side of the first incident light with respect to a vertical line that passes through the imaging position of the terminal of the component and is orthogonal to the bottom surface of the component. By irradiating the second incident light using illumination, the bottom surface side of the lead (terminal) can be clearly imaged. In this way, the switching means can acquire a captured image in which reflection of reflected light from the bottom surface of the base material onto the captured image is suppressed by the first illumination for the spherical terminal component, and other than the spherical terminal component. For the component, a captured image on the bottom surface side of the terminal can be acquired by the second illumination. As a result, it is possible to further improve the identification accuracy of the component terminals from the captured image.

In the component transfer apparatus according to the second aspect, preferably, a base for movably supporting the head unit, and a component recognition imaging unit for imaging the bottom surface of the component sucked by the suction nozzle and recognizing the component. DOO further comprising a, the parts goods inspection apparatus and the component recognition imaging unit, so as to be aligned in a direction along the arrangement direction of the plurality of suction nozzles are provided in a fixed manner on the base. With this configuration, for each component sucked by a plurality of suction nozzles, the head unit is moved linearly in the suction nozzle arrangement direction and placed at the respective imaging positions to recognize the suction positions of the components. It is possible to perform both imaging of the bottom surface of the terminal and imaging of the terminal for measuring the coplanarity.
In the component transfer apparatus according to the second aspect described above, preferably, the component inspection apparatus is fixedly provided on one side surface of the oblique imaging unit, and the first illumination is set to the raised position during imaging and non-imaging. An elevating mechanism that supports the elevating position at the time descending position is further provided, and the component recognition imaging unit is disposed on the other side of the oblique imaging unit.

In component placing apparatus according to the second aspect, preferably, attached to f head unit, further comprising a moving mechanism that is movable in a direction along the arrangement direction of the plurality of suction nozzles, the moving mechanism The component inspection device is provided, and the oblique imaging unit of the component inspection device moves relative to the component sucked by the suction nozzle of the head unit by the moving mechanism unit, and at least the component sucked by the suction nozzle It is comprised so that the diagonal image of this may be imaged. If comprised in this way, about each component adsorbed by a plurality of adsorption nozzles, at least a picked-up image of a terminal for coplanarity measurement only by moving the moving mechanism part with respect to the head unit while taking an image with an oblique image pickup unit Can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view showing the overall configuration of the surface mounter according to the first embodiment of the present invention. 2-8 is a figure for demonstrating the structure of the surface mounter shown in FIG. The structure of the surface mounter 100 according to the first embodiment of the present invention will be described below with reference to FIGS. In the first embodiment, an example in which the component inspection apparatus of the present invention is applied to a component inspection unit of a surface mounter will be described. The surface mounter 100 is an example of the “component transfer device” in the present invention.

  As shown in FIGS. 1 and 2, the surface mounter 100 according to the first embodiment is an apparatus for mounting a component 120 (see FIG. 2) on a printed board 130. As shown in FIG. 1, the surface mounter 100 includes a pair of substrate transport conveyors 105 extending in the X direction, and a head unit 20 that can move above the pair of substrate transport conveyors 105 in the XY direction on the horizontal plane. . A plurality of tape feeders 110 for supplying the components 120 are arranged on both sides of the pair of board conveyors 105. The head unit 20 has a function of acquiring the component 120 from the tape feeder 110 and mounting the component 120 on the printed circuit board 130 on the substrate transport conveyor 105. The substrate transfer conveyor 105 is installed on the base 1, and the head unit 20 is disposed above the base 1. Hereinafter, a specific structure of the surface mounter 100 will be described.

  The pair of board transfer conveyors 105 are configured to transfer the printed board 130 in the X direction, stop the printed board 130 at a predetermined mounting work position, and hold the printed board 130 by a board holding device (not shown). Yes.

  As shown in FIG. 1, the tape feeder 110 is arranged side by side in the X direction so as to face each other on the Y1 direction side and the Y2 direction side of the base 1. These tape feeders 110 are respectively attached to feeder plates (not shown) attached to the base 1. The tape feeder 110 holds a reel (not shown) around which a tape (not shown) holding a plurality of components 120 (see FIG. 2) at predetermined intervals is wound. The tape feeder 110 intermittently feeds the tape from the reel at a predetermined pitch, and conveys the component 120 held on the tape to the component take-out portion 111 provided at the tip of the tape feeder 110. Therefore, the component 120 is supplied. The component 120 is a small component such as an IC, a transistor, a capacitor, or a resistor.

Further, on the base 1, as shown in FIG. 1, between a pair of substrate transport conveyors 105 and a tape feeder 110 arranged so as to face each other on the Y1 direction side and the Y2 direction side of the base 1. In addition, one upper imaging device 2 and one terminal imaging device 3 are arranged. The upper image pickup device 2 and the terminal image pickup device 3 are arranged in six Z direction (vertical direction) suction nozzles 22 (see FIG. 2), which will be described later, provided in the head unit 20 so as to be linearly arranged in the X direction. Arranged in the X direction so as to be along the arrangement direction (X direction). The suction nozzle 22 descends in the Z direction in a state of being located above the component take-out part 111 and sucks the component 120, and then rises to a movable position. The upper imaging device 2 images the upper part, and has a function of imaging the bottom surface of the component 120 sucked by the suction nozzle 22 positioned above and outputting a bottom image of the component 120. Further, the terminal imaging device 3 images the terminal 121 of the component 120 sucked by the suction nozzle 22 (see the spherical terminal 121a... FIG. 3 and the lead-shaped terminal 121b... FIG. 4). It has a function of outputting 121 captured images. The terminal imaging device 3 is an example of the “ component inspection device” in the present invention. Also, since the configurations of the upper imaging device 2 and the terminal imaging device 3 provided in two are the same, the upper imaging device 2 and the terminal imaging device 3 arranged on the Y2 direction side of the base 1 will be described below. explain.

  As shown in FIG. 1, the upper imaging device 2 is a line sensor fixedly installed on the base 1 with the imaging direction facing upward (Z1 direction) so as to face the head unit 20 (see FIG. 2). And an upper illumination 2b provided on both sides of the upper imaging camera 2a and arranged to irradiate imaging light upward. The upper imaging device 2 irradiates light from the upper illumination 2b by moving the head unit 20 above the upper imaging device 2 with the suction nozzle 22 sucking the component 120, and the bottom surface of the component 120. It is configured so that the reflected light reflected by can be imaged. Accordingly, the upper imaging device 2 is configured to be able to take an image of the bottom surface of the component 120 sucked by the suction nozzle 22 by the upper imaging camera 2a and the upper illumination 2b. Based on the image of the bottom surface of the component 120, the suction position and posture of the component 120 by the suction nozzle 22 can be recognized. The upper imaging camera 2a is an example of the “component recognition imaging unit” in the present invention.

  As shown in FIG. 3, the terminal imaging device 3 includes an oblique imaging camera 10 that uses a line sensor, a first illumination 11, a second illumination 12, a mirror 13, and an elevating mechanism 14. The terminal imaging device 3 has an opening 3a on the upper side. Similar to the upper imaging device 2, the terminal imaging device 3 is located above the terminal imaging device 3 (Z1 direction) in a state where the component 120 is attracted to the suction nozzle 22. Is configured so that the terminal 121 of the component 120 can be imaged obliquely from below. By imaging the terminal 121 of the component 120 from a plurality of directions, it is possible to measure the protruding height of the terminal 121 from the bottom surface of the component 120 based on the captured image. The oblique imaging camera 10 and the elevating mechanism 14 are examples of the “oblique imaging unit” and the “elevating mechanism unit” of the present invention, respectively.

  The oblique imaging camera 10 of the terminal imaging device 3 is fixedly arranged in an inclined state in the terminal imaging device 3 so as to capture the reflected light 500 from an oblique direction in which the imaging direction is inclined at an angle θ from the vertical direction. ing. In the first embodiment, the oblique imaging camera 10 is arranged such that the inclination angle θ from the vertical direction of the imaging direction of the oblique imaging camera 10 is approximately 40 degrees. FIG. 3 shows the moment of the moving part 120. The center in the width direction of an image sensor (line sensor) (not shown) of the oblique imaging camera 10 and a slit (not shown) inside the camera. The reflected light incident on the center plane 500a of the line sensor connecting the two is captured by the oblique imaging camera 10. The reflected light 500 from the imaging position P1 at which the extended center plane 500b obtained by extending the center plane 500a and reflecting the mirror 13 like light is intersected with the surface of the terminal 121 is the center of the extended center plane 500b. The image is picked up by passing through the surface 500a and passing through the slit of the oblique imaging camera 10 and being received by the imaging device. As the component 120 moves in this manner, the imaging positions P1 of the plurality of terminals 121 of the component 120 are sequentially imaged while passing through the imaging position P1 that is an extension of the central axis of the oblique imaging camera 10. Is done.

  Moreover, the 1st illumination 11 and the 2nd illumination 12 of the terminal imaging device 3 are illumination which consists of several LED, and the filters 11a and 12a which each consist of a collimator lens etc. are provided. The first illumination 11 is incident light 600 toward the terminal 121 from the X1 direction side with respect to the vertical line Z3 passing through the imaging position P1 where the extended center plane 500b of the center plane 500a of the oblique imaging camera 10 intersects the surface of the terminal 121. It is comprised so that it may irradiate. The lower surface of the suction nozzle 22 is orthogonal to the central axis of the suction nozzle 22, and the vertical line Z3 is the bottom surface (horizontal) of the component 120 that is suctioned by the suction nozzle 22 that is arranged in the Z direction and moves up and down. ) Is a vertical line orthogonal to On the other hand, as shown in FIG. 4, in the second illumination 12, the extended center plane 500b of the center plane 500a of the oblique imaging camera 10 reflected by the mirror 13 is in contact with the lower surface of the terminal 121b during the movement of the lead terminal component 120b. The incident light 700 is irradiated from the X2 direction side toward the terminal 121 with respect to the vertical line Z3 passing through the imaging position P2, which is a position where the two intersect. The first illumination 11 and the second illumination 12 are arranged so as to irradiate the component 120 with imaging light from below the component 120, and the type of the component 120 (terminal 121) to be imaged. It is configured to be switched accordingly. Specifically, as shown in FIG. 3, when the part to be imaged is a spherical terminal part 120a (for example, BGA, CSP, etc.) in which a terminal 121a having a substantially spherical portion is provided on the bottom surface. The first illumination 11 is switched so that the incident light 600 is applied to the spherical terminal 121a. Also, as shown in FIG. 4, when the component to be imaged is a component 120 other than the spherical terminal component 120a, the second illumination 12 is switched and the terminal 121 is irradiated with the incident light 700. ing. In FIG. 4, as an example of a component other than the spherical terminal component 120a, a lead terminal component 120b (for example, QFP) provided with a lead-out terminal 121b protruding outward from the outer edge of the component is imaged. Is shown. The incident light 600 and the incident light 700 are examples of the “first incident light” and the “second incident light” in the present invention, respectively.

  In the first embodiment, as shown in FIG. 3, the first illumination 11 is directed to the terminal 121a in a state where the terminal 121a of the spherical terminal component 120a is moved in the X direction at a predetermined height position in the Z direction. The incident light 600 is tilted to the same side (X1 direction side) as the reflected light 500 from the terminal 121a to the oblique imaging camera 10 with respect to the vertical line Z3 passing through the imaging position P1. Therefore, as shown in FIG. 3, the incident light 600 emitted from the first illumination 11 is reflected at a predetermined reflection position on the X1 direction side of the terminal 121a of the spherical terminal component 120a. The reflected light 500 in the imaging direction from the terminal 121a to the oblique imaging camera 10 is configured to be imaged by the oblique imaging camera 10.

  In the first embodiment, the first illumination 11 is such that the incident light 600 at the time of imaging has an inclination angle α with respect to the vertical line Z3 passing through the imaging position P1 of the terminal 121a of the spherical terminal component 120a, and the reflected light from the terminal 121a. It is arranged to be larger than the inclination angle θ of 500. At this time, the incident angle of the incident light 600 to the terminal 121a is the angle β. In addition, although the imaging light irradiated from the 1st illumination 11 is also irradiated also to the bottom face (base material bottom face) of the spherical terminal components 120a other than the terminal 121a, the 1st illumination 11 is on the perpendicular line Z3 which passes the imaging position P1. On the other hand, by irradiating from the same X1 direction side as the reflected light 500 in the imaging direction, as shown in FIG. 3, the reflected light from the bottom surface of the spherical terminal component 120a (see the broken line in FIG. 3) The reflection angle α is reflected to the X2 direction side. When imaging the terminal 121a of the spherical terminal component 120a, as shown in FIGS. 1 to 3, as the head unit 20 moves in the X direction over the terminal imaging device 3, the terminal 121a of the spherical terminal component 120a. By sequentially moving the imaging position P1, the plurality of terminals 121a provided on the bottom surface of the spherical terminal component 120a are all imaged.

  Moreover, the 1st illumination 11 is supported so that raising / lowering to a Z direction is possible by the raising / lowering mechanism 14 provided in the X1 direction side surface of the terminal imaging device 3, as shown in FIG. As shown in FIG. 3, the first illumination 11 is arranged at the raised position Q1 to irradiate the imaging light when imaging the terminal 121a of the spherical terminal component 120a. Thereby, since it is not necessary to arrange | position the 1st illumination 11 on the extension line | wire of the incident light 600, it is possible to suppress the enlargement of the terminal imaging device 3. FIG. Also, as shown in FIG. 4, when the terminal 121a is not imaged, it is arranged at the lowered position Q2 so that the first illumination 11 does not interfere when the component 120 sucked by the suction nozzle 22 moves. Yes.

  Further, in the second illumination 12, inside the terminal imaging device 3, the extended center plane 500b of the center plane 500a of the oblique imaging camera 10 in which the incident light 700 to the terminal 121b is reflected by the mirror 13 is the lead terminal component 120b. Is inclined to the opposite side (X2 direction side) from the reflected light 500 from the terminal 121b to the oblique imaging camera 10 with respect to the vertical line Z3 passing through the imaging position P2, which is a position intersecting the lower surface of the terminal 121b during the movement of Is fixedly arranged. The second illumination 12 is disposed below the lead terminal component 120b in a state where the terminal 121b of the lead terminal component 120b is disposed at the imaging position P2, and relative to the component 120 (120b) by the head unit 20. It is installed at a height that does not hinder movement. As shown in FIG. 4, the incident light 700 emitted from the second illumination 12 is reflected on the lower surface of the terminal 121b when imaging the terminal 121b of the lead terminal component 120b such as QFP, for example. The reflected light 500 in the imaging direction from the terminal 121b to the oblique imaging camera 10 passes through the extended center plane 500b and the central plane 500a and is captured by the oblique imaging camera 10. At this time, the incident angle of the incident light 700 on the terminal 121b is an angle θ. The imaging light emitted from the second illumination 12 is also emitted to the bottom surface (base material bottom surface) of the lead terminal component 120b other than the terminal 121b, but is extracted from the outer peripheral edge of the lead terminal component 120b as in QFP. In the case of a lead terminal component provided in a linear shape, since the terminal 121b is not provided on the bottom surface of the lead terminal component 120b, the reflection of the bottom surface (base material bottom surface) of the lead terminal component 120b does not cause a problem. When imaging the terminal 121b of the lead terminal component 120b, as shown in FIGS. 1 to 3, as the head unit 20 moves in the X direction above the terminal imaging device 3, the imaging of the terminal 121b of the lead terminal component 120b is performed. By sequentially moving the position P2, the plurality of terminals 121b provided on the outer peripheral edge of the lead terminal component 120b are all imaged.

  As shown in FIGS. 3 and 4, the mirror 13 of the terminal imaging device 3 has a function of reflecting the reflected light 500 from the terminal 121 of the component 120 and guiding it to the oblique imaging camera 10. By arranging the mirror 13 in this way, even when the inclination angle θ from the vertical direction of the imaging direction is increased, the oblique imaging camera 10 is arranged below the imaging position of the terminal 121 of the component 120, and the terminal The imaging device 3 can be downsized.

  The elevating mechanism 14 is composed of an air cylinder or the like, is fixedly attached to the side surface of the terminal imaging device 3 on the X1 direction side, and supports the first illumination 11 by the rod 14a so as to be elevable. The elevating mechanism 14 is configured to elevate and lower the first illumination 11 in the Z direction by the inflow and outflow of air from an air circulation path (not shown).

  As shown in FIG. 1, the head unit 20 is configured to be movable in the X direction along a head unit support portion 30 extending in the X direction. Specifically, the head unit support section 30 includes a ball screw shaft 31, a servo motor 32 that rotates the ball screw shaft 31, and a guide rail (not shown) in the X direction. It has a ball nut 21 to which the shaft 31 is screwed. The head unit 20 is configured to move in the X direction with respect to the head unit support 30 when the ball screw shaft 31 is rotated by a servo motor 32. Further, the head unit support portion 30 is configured to be movable in the Y direction along a pair of fixed rail portions 40 provided on the base 1 and extending in the Y direction. Specifically, one fixed rail portion 40 has a guide rail 41 that supports both end portions of the head unit support portion 30 so as to be movable in the Y direction, and the other fixed rail portion 40 includes a guide rail 41, A ball screw shaft 42 extending in the Y direction and a servo motor 43 for rotating the ball screw shaft 42 are provided, and the head unit support portion 30 is provided with a ball nut 33 into which the ball screw shaft 42 is screwed. . The head unit support portion 30 is configured to move in the Y direction along the guide rail 41 when the ball screw shaft 42 is rotated by the servo motor 43. With such a configuration, the head unit 20 is configured to be able to move on the base 1 in the XY directions.

  The head unit 20 is provided with six suction nozzles 22 arranged linearly in the X direction so as to protrude downward. Each suction nozzle 22 is configured to be able to generate a negative pressure state at the tip thereof by a negative pressure generator (not shown). The suction nozzle 22 can suck and hold the component 120 supplied from the tape feeder 110 at the tip by this negative pressure. Each of the six suction nozzles 22 individually generates a negative pressure state for component suction, releases negative pressure for separating and mounting the suction component, and positive pressure for performing mounting in a short time. It is configured to be able to switch between occurrence of a state.

  Each suction nozzle 22 is configured to be movable in the vertical direction (Z direction) with respect to the head unit 20 by a mechanism (not shown) such as a servo motor. The surface-mount machine 100 conveys the component 120 with the suction nozzle 22 positioned at the raised position, performs imaging by the upper imaging device 2 and the terminal imaging device 3, and the suction nozzle 22 is positioned at the lowered position. The component 120 is configured to be sucked from the tape feeder 110 and mounted on the printed circuit board 130. Further, the suction nozzle 22 is configured to be rotatable about its axis by a mechanism (not shown). Thereby, in the surface mounting machine 100, it is possible to adjust the attitude | position (direction in a horizontal surface) of the components 120 hold | maintained at the front-end | tip of a nozzle by rotating the adsorption nozzle 22 in the middle of conveying the components 120. FIG. .

  The head unit 20 is attached with a moving imaging device 50 for imaging the posture of the component 120 sucked by the suction nozzle 22 from the side surface side. As shown in FIG. 2, the moving imaging device 50 is attached to the head unit 20 so as to be movable in the X direction (direction in which the six suction nozzles 22 are arranged). Specifically, the head unit 20 is provided with a ball screw shaft 23 extending in the X direction and a servo motor 24 that rotates the ball screw shaft 23, and the ball screw shaft 23 is screwed into the moving imaging device 50. A ball nut 51 is provided. The moving imaging device 50 is configured to move in the X direction with respect to the head unit 20 by rotating the ball screw shaft 23 by the servo motor 24. As a result, the moving imaging device 50 can sequentially image the components 120 held by the six suction nozzles 22 arranged in the head unit 20 in the X direction. Further, when the moving imaging device 50 is attached to the head unit 20, the head unit 20 is moved from above the component extraction unit 111 to the vicinity of the upper side of the terminal imaging device 3 with the component 120 held by the suction nozzle 22. Or, after passing over the terminal imaging device 3 for terminal imaging, moving the head unit 20 to the mounting position while moving the head unit 20 above the printed circuit board 130, moving imaging The device 50 can be moved relative to the head unit 20 to image the posture of the component 120 (the state of suction to the suction nozzle 22).

  As shown in FIG. 5, the mobile imaging device 50 includes a side illumination that irradiates illumination light 800 from one side to one side imaging camera 52 formed of a line sensor and the component 120 that is attracted to the suction nozzle 22. 53 and mirrors 54 to 56 for guiding the imaging light of the component 120 to the side imaging camera 52.

  As shown in FIG. 5, the side illumination 53 is composed of LEDs, and is a component when the moving imaging device 50 moves to a predetermined position (side imaging position) with respect to the suction nozzle 22 holding the imaging target component 120. It arrange | positions so that it may be located in 120 side. Further, as shown in FIG. 7, the mirror 54 is disposed so as to face the side illumination 53, and is configured to reflect the imaging light 800 in the Y2 direction from the side illumination 53 downward (Z2 direction). ing. As shown in FIG. 6, a mirror 55 is disposed below the mirror 54, and is configured to reflect the reflected light 801 reflected downward from the mirror 54 to the side (X2 direction). A mirror 56 is arranged on the side (X2 direction) of the mirror 55, and is configured to reflect the reflected light 802 reflected from the mirror 55 to the side (X2 direction) toward the side imaging camera 52. Yes. As shown in FIG. 5, the reflected light 803 reflected from the mirror 56 is configured to be imaged by the side imaging camera 52. Thereby, the transmitted light (imaging light) from the component 120 irradiated with the imaging light 800 by the side illumination 53 is captured by the side imaging camera 52 via the mirror 54, the mirror 55, and the mirror 56. It is configured as follows.

  The operation of the surface mounter 100 is controlled by the control device 60 shown in FIG. The control device 60 includes a main control unit 61, an illumination control unit 62, a storage unit 63, an image processing unit 64, and a drive control unit 65. The main control unit 61 is an example of the “switching unit” in the present invention.

  The main control unit 61 is composed of a CPU that executes logical operations. The main control unit 61 is connected to the upper imaging device 2, the terminal imaging device 3, and the moving imaging device via the illumination control unit 62, the storage unit 63, the image processing unit 64, and the drive control unit 65 in accordance with a program stored in the ROM. 50 and each servo motor are controlled.

  In the first embodiment, the main control unit 61 captures the upper imaging camera 2 a of the upper imaging device 2, the oblique imaging camera 10 of the terminal imaging device 3, and the side imaging of the moving imaging device 50 via the image processing unit 64. A captured image of the component 120 captured by the camera 52 is acquired, and based on the captured image of the component 120, the suction position and posture of the component 120 by the suction nozzle 22, the protruding height of the terminal 121 from the bottom surface of the component 120, etc. Is configured to measure. The protruding height of the terminal 121 is measured based on the position of the terminal 121 in each captured image by acquiring captured images of the terminal 121 from two different directions. Then, the main control unit 61 performs flatness (coplanarity) determination of the terminal 121 for determining whether or not the measured protruding height of the terminal 121 is within a predetermined reference range, and determines the flatness determination result. Based on this, it is configured to determine whether or not the component 120 can be used. Details of the flatness determination will be described later.

  The illumination control unit 62 is configured to turn on the upper illumination 2b, the first illumination 11, the second illumination 12, and the side illumination 53 at a predetermined timing based on a control signal output from the main control unit 61. Yes. Further, when controlling the first illumination 11 and the second illumination 12, the imaging target component 120 sucked by the suction nozzle 22 based on the component data stored in the storage unit 63 by the main control unit 61 is a spherical terminal component 120a. It is determined whether the component 120 is a component 120 other than the spherical terminal component 120a (see FIG. 3). When the imaging target component 120 is the spherical terminal component 120a, the main control unit 61 is configured to output a control signal so that the first illumination 11 is turned on. On the other hand, as shown in FIG. 4, when the imaging target component 120 is a component (lead terminal component 120 b) other than the spherical terminal component 120 a, a control signal is sent from the main control unit 61 to turn on the second illumination 12. Is output. That is, the first illumination 11 and the second illumination 12 are switched based on the control signal output from the main control unit 61 based on the component data.

  The storage unit 63 includes a ROM (Read Only Memory) that stores a program for controlling the CPU, and a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus. The storage unit 63 stores component data such as the types, dimensions, and shapes of all components 120 mounted on the printed circuit board 130. Since the shape of the terminal 121 of the component 120 varies depending on the type of the component 120, it is specified by this component data whether the component 120 is a spherical terminal component 120a or a component other than the spherical terminal component 120a such as the lead terminal component 120b. Is done.

  Based on the control signal output from the main control unit 61, the image processing unit 64 reads out the imaging signal from the upper imaging camera 2 a, the oblique imaging camera 10, and the side imaging camera 52 at a predetermined timing and reads out the imaging signal. Image data suitable for recognizing the component 120 is generated by performing predetermined image processing on the captured image signal. The generated image data is output to the main control unit 61, and the flatness determination of the terminal 121 of the component 120 is performed by the main control unit 61 based on this image data.

  Based on the control signal output from the main control unit 61, the drive control unit 65 is provided with each servo motor of the surface mounter 100 (servo motor 43 for moving the head unit support unit 30 in the Y direction (see FIG. 1)). , A servo motor 32 (see FIG. 1) for moving the head unit 20 in the X direction, a servo motor (not shown) for moving the suction nozzle 22 in the vertical direction, and rotating the suction nozzle 22 around the central axis A servo motor (not shown) for moving the moving imaging device 50 in the X direction, a lifting mechanism 14 for lifting and lowering the first illumination 11 in the Z direction, etc. It is comprised so that the drive of may be controlled.

  FIG. 9 is a flowchart for explaining the flatness (coplanarity) determination processing of the terminal of a component. Next, with reference to FIGS. 1-4 and FIG. 9, the operation | movement at the time of determining the flatness of the terminal 121 of the component 120 by the surface mounter 100 of 1st Embodiment is demonstrated.

  If there is no component 120 that needs to be determined for the flatness of the terminal 121 among the plurality of components 120 sucked by each suction nozzle 22, the component 120 is positioned above the upper imaging device 2 in the X1 direction or the X2 direction. When only the bottom surface of the component 120 is imaged so as to move in one direction, and there is an object that requires flatness determination, the component 120 moves above the upper imaging device 2 and the terminal imaging device 3 in the X1 direction and X2 The image of the bottom surface of the component 120 and the image of the terminal 121 are imaged twice so as to move in both directions.

  In FIG. 9, there is a part 120 that needs to be judged for flatness, and the parts 120 are sequentially picked up by the plurality of suction nozzles 22, and finally the parts 120 are picked up by the suction nozzles 22. In the state, it is assumed that the head unit 20 is located on the X2 side of the upper imaging device 2 in FIG.

  As shown in FIG. 9, first, in step S <b> 1, it is determined by the main control unit 61 whether or not the imaging target component 120 for flatness determination sucked by the suction nozzle 22 is a spherical terminal component 120 a. The Specifically, the component data of the component 120 sucked by the suction nozzle 22 by the main control unit 61 is read from the storage unit 63, and the type (terminal shape) of the component 120 is determined based on the component data. As shown in FIG. 3, when the component 120 sucked by the suction nozzle 22 is a spherical terminal component 120a such as BGA or CSP, the process proceeds to step S2. On the other hand, when the component 120 is the lead terminal component 120b other than the spherical terminal component 120a, the process proceeds to step S11.

  When the imaging target component 120 is a spherical terminal component 120a, the terminal imaging device 3 images the terminal 121a from two different directions. First, in step S2, the first illumination 11 is moved in the Z direction by the elevating mechanism 14, and is arranged at the raised position Q1. In step S3, an appropriate illumination level (irradiation light intensity) is selected by the main controller 61 based on the component data of the spherical terminal component 120a to be imaged. This illumination level is set in advance for each component 120 in the component data.

  In step S4, the head unit 20 starts moving in the X1 direction. Thereby, each spherical terminal component 120a sucked by the plurality of suction nozzles 22 moves above the upper imaging device 2 and the terminal imaging device 3. In step S5, the light from the upper illumination 2b is applied to the bottom surface of the spherical terminal component 120a that passes upward, and the reflected light from the bottom surface of the spherical terminal component 120a is imaged by the upper imaging camera 2a.

  In step S6, as shown in FIG. 3, light is emitted from the first illumination 11 to the terminal 121a at the raised position Q1, and the oblique imaging camera 10 captures an image from the oblique direction of the terminal 121a. That is, the incident light 600 emitted from the first illumination 11 is reflected by the terminal 121a, and the reflected light 500 is imaged by the oblique imaging camera 10. At this time, when the head unit 20 moves in the X1 direction, all the plurality of terminals 121a provided on the bottom surface of the spherical terminal component 120a are imaged. The captured image is subjected to predetermined image processing by the image processing unit 64 and output to the main control unit 61. Note that step S5 is performed at a timing when all the components 120 pass above the upper imaging device 2, and step S6 is a timing at which the spherical terminal component 120a passes above the terminal imaging device 3. To be implemented.

  Next, in step S7, the suction nozzle 22 that sucks the spherical terminal component 120a is rotated about 180 degrees about the nozzle axis. Thereby, the direction of the spherical terminal component 120a is rotated approximately 180 degrees within the same plane. In step S8, the head unit 20 that has finished moving above the upper imaging device 2 and the terminal imaging device 3 temporarily stops, then reverses and starts moving in the X2 direction.

  Next, in step S9, as shown in FIG. 3, the first illumination 11 irradiates the terminal 121a with light at the raised position Q1, and the oblique imaging camera 10 captures an image from the oblique direction of the terminal 121a. Is done. At this time, the illumination level of the first illumination 11 is maintained at the illumination level selected in step S4. Then, when the head unit 20 moves in the X2 direction, all of the plurality of terminals 121a provided on the bottom surface of the spherical terminal component 120a are imaged. When all the terminals 121a are imaged, in step S10, the first illumination 11 is lowered in the Z2 direction by the elevating mechanism 14 and is arranged at the lowered position Q2 (see FIG. 4), and the entire head unit 20 is also taken. Completes the upper passage of the terminal imaging device 3, and the movement of the head unit 20 is stopped. Note that step S9 is performed only on the spherical terminal component 120a at the timing when the spherical terminal component 120a passes above the terminal imaging device 3.

  Through the above steps S2 to S10, the bottom surfaces of all the components 120 sucked by the respective suction nozzles 22 are imaged by the upper imaging camera 2a, and two captured images in different directions of the terminal 121a of the spherical terminal component 120a are obtained. Acquired by the terminal imaging device 3. Thereafter, in step S16, the main controller 61 causes the least square plane (average height plane) for all the terminals 121a to be the target of the spherical terminal component 120a based on the respective positions in the two captured images of the terminal 121a. The protruding height of the individual terminal 121a from the terminal is detected.

  On the other hand, if the component to be imaged is the lead terminal component 120b (see FIG. 4), it is determined in step S1 that the component 120 sucked by the suction nozzle 22 is not the spherical terminal component 120a, and thus the process proceeds to step S11. Transition. In the case of the lead terminal component 120b, the flatness determination of the spherical terminal component 120a is performed based on the bottom image of the terminal 121b of the lead terminal component 120b by the upper imaging device 2 and the image from the oblique direction by the terminal imaging device 3. Similarly, the flatness determination of the terminal 121b of the lead terminal component 120b is performed.

  In step S11, an appropriate illumination level (intensity of irradiation light) is selected by the main controller 61 based on the component data of the lead terminal component 120b to be imaged. In step S12, the head unit 20 starts moving in the X1 direction. Thereby, each component 120 (lead terminal component 120) sucked by the plurality of suction nozzles 22 moves above the upper imaging device 2 and the terminal imaging device 3. In step S13, as shown in FIGS. 1 and 2, during the movement of the head unit 20, light from the upper illumination 2b is applied to the bottom surface of the component 120 (lead terminal component 120b) moving upward, and the suction nozzle The bottom surface of each component 120 (lead terminal component 120b) adsorbed by 22 is sequentially imaged. At this time, as for the lead terminal component 120b, as shown in FIG. 4, the terminal 121b drawn from the outer peripheral edge of the lead terminal component 120b is also imaged. The captured image is subjected to predetermined image processing by the image processing unit 64 and output to the main control unit 61.

  Next, in step S14, the head unit 20 moves in the X1 direction, and the terminal 121b of the lead terminal component 120b that passes above the terminal imaging device 3 disposed so as to be adjacent to the upper imaging device 2 is illustrated in FIG. 4, the second illumination 12 irradiates the terminal 121b with light, and the oblique imaging camera 10 captures an image from the oblique direction of the terminal 121b. That is, the incident light 700 emitted from the second illumination 12 is reflected on the bottom surface of the terminal 121 b, and the reflected light 500 is imaged by the oblique imaging camera 10. At this time, when the head unit 20 moves in the X1 direction, all of the plurality of terminals 121b of the lead terminal component 120b are imaged. The captured image is subjected to predetermined image processing by the image processing unit 64 and output to the main control unit 61. Thereafter, in step S15, the entire head unit 20 completes the upward passage of the terminal imaging device 3, and the movement of the head unit 20 is stopped.

  Through the above steps S11 to S15, the bottom image of all the components 120 sucked by the plurality of suction nozzles 22 (the bottom image including the bottom of the terminal 121b for the lead terminal component 120b) and the lead terminal component 120b An image (oblique image) from the oblique direction of the terminal 121b by the terminal imaging device 3 is acquired. Thereafter, in step S16, the main control unit 61 causes the least square plane (average height plane) for all the terminals 121a to be the target of the lead terminal component 120b based on the respective positions in the bottom image and the oblique image of the terminal 121b. ) From the individual lead terminals 121b.

  When the protrusion height from the least square plane (average height plane) of each terminal 121 (121a, 121b) provided in the component 120 (the spherical terminal component 120a and the lead terminal component 120b) is detected, in step S17, The main control unit 61 determines whether the protruding height of each terminal 121 (121a, 121b) is within a predetermined reference range, thereby determining the flatness (coplanarity) of the terminal 121. When it is determined that the protruding height of each terminal 121 provided on the component 120 is within the reference range, the process proceeds to step S18 to correspond to the suction nozzle 22 that sucks the terminal component 120. The flag is set to 0. When it is determined that the protruding height of each terminal 121 is not within the reference range, the process proceeds to step S19, and the flag is set to 1 corresponding to the suction nozzle 22 that sucks the component 120. Thereafter, in step S <b> 20, the head unit 20 moves above the substrate 130. During this movement, for each component 120 sucked by each suction nozzle 22, the position shift in the suction position and the suction direction is calculated based on the bottom image by the upper imaging device 3, and the X direction and Y for correcting the position shift Each mounting position correction value in the direction and the R direction around the Z axis (the rotation direction around the central axis of each suction nozzle 22) is calculated.

  Further, during the movement of the head unit 20 above the substrate 130 in step S20, the moving imaging device 50 attached to the head unit 20 moves sideways while moving along the arrangement direction (X direction) of the suction nozzles 22. The side surface of the component 120 is imaged by the imaging camera 52. The suction posture failure determination is performed based on the side image of the component 120, and if there is a suction posture failure, the suction nozzle flag is set to 1 before execution of step S21, and if there is no suction posture failure, the flag is set to 0. Thereby, in addition to avoiding the mounting of the component 120 having the flatness defect of the terminal 121, it is possible to avoid the mounting of the component 120 having the suction posture defect causing the mounting defect.

  In step S21, the head unit 20 moves to the mounting position for each component 120 above the substrate 130, and the suction nozzle 22 sequentially descends to mount the component. After mounting the component, the head unit 20 rises to a movable position. At this time, if the flag is 0 corresponding to the suction nozzle 22 to be mounted, the component mounting is performed while correcting the mounting position. On the other hand, if the flag is 1, the component is selected for the suction nozzle 22. Implementation is discontinued.

  When the mounting of all the components 120 of each suction nozzle 22 is completed, the movement of the head unit 20 from above the substrate 130 to above the component extraction unit 111 of the tape feeder 110 is started in step S22. During this movement, it is determined whether or not the flag is 1 for each suction nozzle 22 in step S23. And about the suction nozzle 22 with a flag of 1, the component 120 is collect | recovered by the collection | recovery part (not shown) in the middle of a movement, with the defective component 120 by which component mounting was stopped attracted | sucked.

  When the head unit 20 is positioned on the X1 direction side of the upper imaging device 2 in FIG. 1 in the state where the suction of the component 120 is finally performed by the suction nozzle 22, step S4, The movement direction of the head unit 20 in S12 is replaced from the X1 direction to the X2 direction, and the movement direction of the head unit 20 in Step S8 is replaced from the X2 direction to the X1 direction, and the order of Steps S5 and S6, Steps S13 and S14 The order may be reversed.

  In the first embodiment, as described above, the oblique imaging camera 10 of the terminal imaging device 3 is irradiated with the reflected light 500 that is irradiated from the first illumination 11 to the terminal 121 of the component 120 and reflected from the terminal 121 of the component 120. The first illumination 11 is configured to be imaged, and the incident light 600 to the terminal 121 of the component 120 at the time of imaging passes through the imaging position P1 and is perpendicular to the vertical line Z3 perpendicular to the bottom surface of the component. The reflected light reflected from the terminal 121 of the component 120 sucked by the suction nozzle 22 is reflected to the same side as the incident light 600 by being arranged to be inclined to the same side as the reflected light 500 (X1 direction in FIG. 3). 500 can be used for imaging. In this case, the reflected light emitted from the first illumination 11 and reflected by the bottom surface (base surface) of the spherical terminal component 120a is opposite to the incident light 600 (in the X2 direction in FIG. 3) with respect to the vertical line Z3. Since it is reflected, it is possible to suppress reflection of reflected light from the bottom surface (base surface of the base material) onto the captured image by the oblique imaging camera 10. As a result, a captured image of the terminal 121a in which unnecessary reflected light is prevented from being captured can be obtained, and the terminal 121a of the spherical terminal component 120a can be accurately identified from the captured image.

  In the first embodiment, as described above, the first illumination 11 is captured at the time of imaging the terminal imaging device 3 that is arranged to irradiate the component 120 with imaging light from below the component 120. By providing the elevating mechanism 14 that supports the elevating position Q1 and the lowered position Q2 during non-imaging so as to be movable up and down, the elevating mechanism 14 can be moved to the lowered position Q2 that does not hinder the relative movement of the component 120 by the head unit 20 during non-imaging. While arranging the first illumination 11 and at the time of imaging, by raising the height position of the first illumination 11 to the ascending position Q1, and increasing the incident angle α of the incident light 600 with respect to the base surface of the component 120, Reflection of reflected light from the bottom surface of the base material into the captured image can be suppressed.

  In the first embodiment, as described above, the second illumination 12 is incident on the vertical line Z3 where the incident light 700 passes through the imaging position of the terminal 121 of the component 120 and is orthogonal to the bottom surface of the component. The component 120 to be imaged that is disposed so as to be inclined to the side opposite to the incident light 600 (X2 direction in FIG. 4) and is imaged by the oblique imaging camera 10 is the spherical terminal component 120a. In this case, by switching to the first illumination 11 by the main control unit 61, it is possible to suppress reflection of reflected light on the bottom surface of the base material of the spherical terminal component 120a by imaging using the first illumination 11. Further, when the component 120 to be imaged is not the spherical terminal component 120a, the main controller 61 is configured to switch to the second illumination 12, so that, for example, the lead terminal component 120b shown in FIG. The light 700 can clearly image the bottom surface side of the terminal 121b of the lead terminal component 120b. As a result, it is possible to further improve the identification accuracy of the component terminals from the captured image.

  In the first embodiment, as described above, the incident light 600 of the first illumination 11 at the time of imaging has an inclination angle α with respect to the vertical line Z3 that passes through the imaging position P1 and is orthogonal to the bottom surface of the component. The incident angle of the incident light 600 from the first illumination 11 with respect to the bottom surface of the base material of the spherical terminal component 120a is configured to be larger than the inclination angle θ of the reflected light 500 from the terminal 121a of the spherical terminal component 120a. Since α can be increased, the reflected light from the bottom surface of the substrate can be reflected to the side opposite to the incident light 600 (X2 direction in FIG. 3) at a larger reflection angle α with respect to the vertical line Z3. Thereby, reflection of reflected light from the bottom surface of the substrate can be further suppressed.

  In the first embodiment, as described above, the terminal imaging device 3 and the lower surface imaging device 2 are fixed on the base 1 so as to be aligned in a direction along the arrangement direction (X direction) of the suction nozzles 22. For each component 120 sucked by the six suction nozzles 22, the head unit 20 is simply moved in the arrangement direction (X direction) of the suction nozzles 22 and passed through the respective imaging positions. Both imaging of the bottom surface of the component 120 and imaging of the terminal 121 for determining flatness (coplanarity) can be performed.

(Second Embodiment)
FIG. 10 is a plan view showing the overall configuration of the surface mounter according to the second embodiment of the present invention. FIG. 11 is a side view showing the overall configuration of the surface mounter according to the second embodiment. 12 and 13 are schematic views showing a moving imaging apparatus of a surface mounter according to the second embodiment of the present invention. In the second embodiment, the upper imaging device 2, the terminal imaging device 3, and the moving imaging device 50 respectively capture the bottom image of the component 120, the oblique image of the terminal 121, and the side image of the component 120. Unlike the first embodiment configured as described above, an example in which a bottom image, an oblique direction image, and a side image are captured by the moving imaging device 250 provided movably on the head unit 20 is described. explain.

  In the surface mounter 200 of the second embodiment, as shown in FIG. 10, the head unit 20 has an oblique image of the terminal 121 of the component 120 sucked by the suction nozzle 22, a bottom image of the component 120, and the component 120. A moving image pickup device 250 for picking up the side images is attached. The moving imaging device 250 is attached to the head unit 20 so as to be movable in the X direction (the direction in which the six suction nozzles 22 are arranged). Specifically, as shown in FIG. 11, the head unit 20 is provided with a ball screw shaft 23 extending in the X direction and a servo motor 24 that rotates the ball screw shaft 23. A ball nut 251 to which the ball screw shaft 23 is screwed is provided. The moving image pickup device 250 is configured to move in the X direction with respect to the head unit 20 when the ball screw shaft 23 is rotated by the servo motor 24. As a result, the moving imaging device 250 can sequentially image the components 120 held by the six suction nozzles 22 arranged side by side in the X direction on the head unit 20. The surface mounter 200 and the moving imaging device 250 are examples of the “component transfer device” and the “moving mechanism unit” of the present invention, respectively. In addition, by attaching the moving imaging device 250 to the head unit 20, the moving imaging device 250 is moved relative to the head unit 20 while moving the head unit 20 to the mounting position while the component 120 is held by the suction nozzle 22. The part 120 can be moved and imaged.

As shown in FIG. 12, the moving imaging apparatus 250 according to the second embodiment mainly captures one imaging camera 210 and the terminal 121 of the component 120 sucked by the suction nozzle 22 on the X2 direction side. It includes a terminal imaging unit 203 made of illumination, and on the X1 direction side, mainly consists of a side imaging unit 251 made mainly of illumination for imaging the side surface of the component 120, and mainly illumination for imaging the bottom surface of the component 120. And an upper imaging unit 202. Further, the reflected light from the component 120 (terminal 121) of the irradiation light from the terminal imaging unit 203 and the upper imaging unit 202 and the component of the irradiation light from the side imaging unit 251 so as to face the imaging camera 210. A mirror 256 for guiding transmitted light on the outer periphery of 120 to the imaging camera 210 is disposed. The terminal imaging unit 203 is an example of the “component inspection apparatus ” in the present invention.

  The terminal imaging unit 203 includes a first illumination 211 and a second illumination 212, a mirror 213, and a reflection surface 256a on the X2 direction side of the mirror 256. As shown in FIG. 13, the first illumination 211 is directed from the X2 direction side to the terminal 121a of the spherical terminal component 120a with respect to the vertical line Z3 that passes through the imaging position P3 and is orthogonal to the bottom surface of the component 120. Are arranged to irradiate incident light 600. On the other hand, the second illumination 212 irradiates incident light 700 from the X1 direction side to the vertical line Z3 passing through the imaging position P3 toward the terminal 121b of the lead terminal component 120b (see FIG. 4) other than the spherical terminal component 120a. Is configured to do. When the moving imaging device 250 moves in the X direction and passes the imaging position P3, the first illumination 211 or the terminal 121 (121a, 121b) of the component 120 (120a, 120b) sucked by the suction nozzle 22 is applied. Imaging light is emitted from the second illumination 212. Reflection that passes through a slit (not shown) inside the imaging camera 210 and reaches a row of imaging elements that function as a line sensor that captures a terminal image in the imaging element array on the imaging surface (not shown) of the imaging camera 210. The light 502 is traced in the opposite direction to the mirrors 256 and 213, and the position where the retroactive plane intersects the terminal 121 (121a, 121b) is the imaging position P3. With respect to the vertical line Z3 passing through the imaging position P3, the reflected light 500 in the oblique direction inclined by the angle θ toward the X2 direction is reflected by the mirror 213 and the mirror 256, and taken into the imaging camera 210 as the reflected light 502, and is described above. An image is formed on the row of image sensors, and an image of the terminal 121 (121a, 121b) is obtained by detecting charges generated in the row of image sensors.

  The first illumination 211 and the second illumination 212 are switched by the main control unit 61 depending on whether the component 120 to be imaged is a spherical terminal component 120a or a lead terminal component 120b, as in the first embodiment. It is configured.

  Incident light 600 from the first illumination 211 is configured to be reflected obliquely on the X2 direction side of the terminal 121a of the spherical terminal component 120a. Therefore, it is reflected on the same side (X2 direction side) as the incident light 600 with respect to the vertical line Z3. Although not shown in FIG. 13, the incident light 700 from the second illumination 212 is on the bottom side of the terminal 121b (see FIG. 4) such as the lead terminal component 120b (see FIG. 4) other than the spherical terminal component 120a. It is configured to be reflected and reflected obliquely toward the X2 direction. Therefore, it is reflected on the opposite side (X2 direction side) to the incident light 700 with respect to the vertical line Z3.

  As shown in FIG. 13, the reflected light 500 in the oblique direction is reflected by the mirror 213 in the X1 direction and is directed toward the reflection surface 256 a of the mirror 256. Then, as shown in FIG. 12, the reflected light 501 reflected by the mirror 213 is configured to be reflected in the Y1 direction from the reflecting surface 256a of the mirror 256 toward the imaging camera 210. Then, the reflected light 502 from the reflecting surface 256 a is imaged by the imaging camera 210. Thereby, it is possible to image the terminal 121 arranged at the imaging position P3 from an oblique direction inclined by the angle θ.

  The side imaging unit 251 includes a side illumination 53, a mirror 54, a mirror 55, and a reflection surface 256b of the mirror 256. The side illumination 53 is positioned to the side of the component 120 when the moving imaging device 250 passes a predetermined position P4 (side surface imaging position) with respect to the suction nozzle 22 holding the component 120 to be imaged. Has been placed. As shown in FIG. 12, the mirror 54 is disposed so as to face the side illumination 53, and the imaging light 800 in the Y2 direction (transmitted light that has passed through the outer periphery of the component 120) from the side illumination 53 is below (Z2). Direction). As shown in FIG. 13, a mirror 55 is disposed below the mirror 54 (Z2 direction), and reflected light 801 reflected downward from the mirror 54 is reflected laterally (X2 direction). It is comprised so that it may reflect toward the reflective surface 256b. As shown in FIG. 12, the reflection surface 256 b of the mirror 256 is configured to reflect the reflected light 802 reflected from the mirror 55 to the side (X2 direction) toward the imaging camera 210 in the Y1 direction. Then, the reflected light 803 reflected from the reflecting surface 256b of the mirror 256 passes through the slits described above in the imaging camera 210, and is the above-described one row of imaging elements in the imaging element array on the imaging surface of the imaging camera 210. An image is formed on a row of image pickup devices at different positions, and electric charges generated in the row of image pickup devices are detected to obtain a side image.

  The upper imaging unit 202 includes an upper illumination 202b, a mirror 202a, and a reflection surface 256b of the mirror 256 that are arranged to face each other. As shown in FIG. 13, the upper illumination 202 b is arranged such that when the moving imaging device 250 passes the bottom surface imaging position P <b> 5 with respect to the suction nozzle 22 holding the imaging target component 120, the X 120 direction side and X 2 of the component 120, respectively. It arrange | positions so that it may be located in the diagonally downward direction side. The upper illumination 202b irradiates the bottom surface of the component 120 with imaging light 900 irradiated from an oblique direction. Then, the reflected light 901 reflected downward (Z2 direction) from the bottom surface of the component 120 is guided through the mirror 202a and is imaged by the imaging camera 210. As shown in FIG. 13, the mirror 202a is disposed below so as to face the bottom surface of the component 120 disposed at the bottom surface imaging position P5, and reflects the reflected light 901 in the downward direction (Z2 direction) from the bottom surface of the component 120. The mirror 256 is configured to reflect laterally (in the X2 direction) toward the reflecting surface 256a. As shown in FIG. 12, the reflection surface 256b of the mirror 256 is configured to reflect the reflected light 902 reflected from the mirror 202a to the side (X2 direction) toward the imaging camera 210 in the Y1 direction. Then, the reflected light 903 reflected from the reflecting surface 256b of the mirror 256 passes through the slits described above in the imaging camera 210, and the above-described two rows of imaging elements in the imaging element array on the imaging surface of the imaging camera 210. An image is formed on a row of image pickup devices at different positions, and electric charges generated in the row of image pickup devices are detected, so that a bottom surface image of the component 120 can be obtained.

  With the above-described configuration, the moving imaging apparatus 250 according to the second embodiment uses the single imaging camera 210 to capture an image captured from the oblique direction of the terminal 121 of the component 120 (an oblique image) and an image captured from the side of the component 120. An image and a bottom image of the component 120 can be taken. Further, by attaching the moving imaging device 250 to the head unit 20 so as to be movable, it is possible to move the moving imaging device 250 relative to the head unit 20 without moving the head unit 20 to a predetermined imaging position. 120 images can be captured. Thus, when the component 120 is taken out from the tape feeder 110 by the suction nozzle 22 of the head unit 20, the moving imaging device 250 images the terminal 121 of the component 120 while moving to the mounting position of the component 120 on the printed circuit board 130. It is possible to perform flatness (coplanarity) determination.

  Since other configurations are the same as those in the first embodiment, description thereof is omitted.

  In the second embodiment, the moving imaging device 250 is provided with an imaging camera 210, a first illumination 211, a second illumination 212, an upper illumination 202b, and a side illumination 53, and a plurality of mirrors 54, 55, 202a. 213 and 256 are configured to be able to capture an oblique image (an oblique image) of the terminal 121 of the component 120 sucked by the suction nozzle 22, an image of the bottom surface of the component 120, and an image of the side surface of the component 120, respectively. Thus, for each component 120 sucked by the six suction nozzles 22, the moving image pickup device 250 is moved with respect to the head unit 20 while picking up the image by the image pickup camera 210, and the flatness (coplanarity) is measured. The captured image (diagonal image) of the terminal 121, the lower surface image of the component 120, and the side image of the component 120 can be respectively acquired. That.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first embodiment, the example in which the first illumination 11 is configured to be movable up and down by the lifting mechanism 14 provided on the side surface of the terminal imaging device 3 is shown, but the present invention is not limited thereto, and FIG. As shown in the first modified example, the first illumination 311 a may be fixedly provided inside the terminal imaging device 3.

As shown in FIG. 14, in the terminal imaging device 303a according to the first modification, the first illumination 311a is fixedly installed inside the terminal imaging device 303a. The first illumination 311a includes a vertical line Z3 in which incident light 601 on the terminal 121a of the spherical terminal component 120a passes through the imaging position P6 of the terminal 121a and is orthogonal to the bottom surface of the component 120 (spherical terminal component 120a). On the other hand, it is arranged so as to incline to the same side (X1 direction side) as the reflected light 500 from the terminal 121a to the oblique imaging camera 10. Also, the incident light 601 is arranged such that the inclination angle α1 with respect to the vertical line Z3 passing through the imaging position P6 of the terminal 121a of the spherical terminal component 120a is larger than the inclination angle θ of the reflected light 500 from the terminal 121a. Yes. Similarly to the first embodiment, the second illumination 12 is disposed below the component 120 in a state where the terminal 121 of the component 120 is disposed at the imaging position P6. It is placed at a height that does not prevent proper movement. The first illumination 311 a is provided at the same height as the second illumination 12. Incident light 601 emitted from the first illumination 311a is reflected at a predetermined reflection position on the X1 direction side of the terminal 121a of the spherical terminal component 120a. As a result, the reflected light 500 in the imaging direction from the terminal 121a to the oblique imaging camera 10 is configured to be imaged by the oblique imaging camera 10. The terminal imaging device 303a is an example of the “ component inspection device” in the present invention. The incident light 601 is an example of the “first incident light” in the present invention. Other configurations are the same as those in the first embodiment.

  In the first modification, the second illumination 12 is fixedly provided at a height that does not hinder the movement of the component 120 sucked by the suction nozzle 22, and the first illumination 311 a is equivalent to the second illumination 12. When the first illumination 311a and the second illumination 12 are fixedly provided by being fixedly provided at the height position, the component 120 is at a height that does not hinder the transfer of the component 120 by the head unit 20. It is possible to acquire a captured image in which reflection of reflected light from the bottom surface of the substrate is suppressed.

  In the first embodiment, the example in which the first illumination 11 is configured to directly irradiate light to the terminal 121a of the spherical terminal component 120a from the X1 direction side of the terminal imaging device 3 has been described. However, the present invention is not limited to this, and as shown in the second modified example of FIG. 15, the first incident light from the first illumination may be irradiated to the terminal of the component via the mirror.

In the second modified example shown in FIG. 15, the first illumination 311b is arranged in the vicinity of the X2 direction side of the oblique imaging camera 10 inside the terminal imaging device 303b, and is connected to the terminal of the spherical terminal component 120a via the mirror 13. It is comprised so that light may be irradiated to 121a. For this reason, in the 1st illumination 311b of a 2nd modification, the light irradiated to the X1 direction side is first reflected by the mirror 13 to the X2 direction side. The reflected light from the mirror 13 is configured to be incident light 602 to the terminal 121a. Also in this case, the incident light 602 passes through the imaging position P7 of the terminal 121a and is obliquely imaged from the terminal 121a with respect to the vertical line Z3 orthogonal to the bottom surface of the component 120 (spherical terminal component 120a). 10 is configured to incline to the same side (X1 direction side) as the reflected light 500. In addition, the inclination angle α2 of the incident light 602 with respect to the vertical line Z3 passing through the imaging position P7 of the terminal 121a of the spherical terminal component 120a is arranged to be larger than the inclination angle θ of the reflected light 500 from the terminal 121a. . In the second modification, incident light 602 irradiated to the terminal 121a through the mirror 13 is reflected on the X1 direction side of the terminal 121a. The reflected light 500 from the terminal 121 a is reflected again by the mirror 13 and is imaged by the oblique imaging camera 10. The terminal imaging device 303b is an example of the “ component inspection device” in the present invention. The incident light 602 is an example of the “first incident light” in the present invention. In this case, since the 1st illumination 311b is arrange | positioned under the components 120 adsorbed | sucked by the adsorption nozzle 22, compared with the case where incident light is directly irradiated with respect to the terminal 121a, size reduction of the terminal imaging device 3 is achieved. Is possible.

  In the first embodiment, as shown in FIG. 3, the first illumination 11 is obliquely supported by the elevating mechanism 14 fixedly attached to the side surface of the terminal imaging device 3 in the X1 direction. Although the example arrange | positioned at the X1 direction side of the imaging camera 10 was shown, this invention is not limited to this, As shown in the 2nd modification of FIG. You may arrange | position on the X2 direction side. The first illumination is obliquely imaged from the terminal 121a with respect to a vertical line Z3 in which the first incident light to the terminal of the component passes through the imaging position and is orthogonal to the bottom surface of the component 120 (spherical terminal component 120a). What is necessary is just to comprise so that it may incline to the same side (X1 direction side) as the reflected light 500 to the camera 10, and it is not necessary to arrange | position the position of 1st illumination itself on the X1 direction side. The same applies to the oblique imaging unit. That is, the oblique imaging unit only needs to be configured to capture the reflected light 500 in the oblique direction from the terminal 121 of the component 120, and the position of the oblique imaging unit itself can be freely arranged. It may be arranged on the extended line of the reflected light 500 so as to take an image without passing through the mirror 13, or as shown in the second embodiment, two mirrors 213 (see FIG. 13) and a mirror. The imaging light may be reflected using 256 (see FIG. 13) and arranged at an arbitrary position. Also, two or more mirrors may be used for imaging the terminal of the component.

  In the first embodiment, the first illumination 11 passes through the imaging position P1 of the terminal 121a of the spherical terminal component 120a of the incident light 600 and is orthogonal to the bottom surface of the component 120 (spherical terminal component 120a). Although an example in which the inclination angle α with respect to the vertical line Z3 is configured to be larger than the inclination angle θ of the reflected light 500 from the terminal 121a of the spherical terminal component 120a is shown, the present invention is not limited to this, and FIG. As shown in the third modified example, the inclination angle of the first incident light from the first illumination and the inclination angle of the reflected light from the terminal of the component may be configured to be substantially the same inclination angle. Good.

In the third modification shown in FIG. 16, the first illumination 311c of the terminal imaging device 303c uses the half mirror 315, passes through the imaging position P8 of the terminal 121a, and is the bottom surface of the component 120 (spherical terminal component 120a). The inclination angle of the incident light 603 with respect to the vertical line Z3 orthogonal to the vertical line Z3 is configured to substantially coincide with the inclination angle θ of the reflected light 500 from the spherical terminal component 120a with respect to the vertical line Z3. In the third modification, the first illumination 311c is configured to irradiate light to the terminal 121a of the spherical terminal component 120a via the half mirror 315 and the mirror 13. Then, the path of incident light 603 from being reflected by the half mirror 315 to entering the terminal 121a, and the reflected light 500 from being reflected by the terminal 121a to being reflected by the mirror 13 and passing through the half mirror 315. Are configured to coincide with each other. The terminal imaging device 303b is an example of the “ component inspection device” in the present invention. The incident light 603 is an example of the “first incident light” in the present invention. Even in such a configuration, the reflected light of the incident light 603 reflected from the bottom surface (base material bottom surface) of the spherical terminal component 120a is reflected in the X2 direction at the reflection angle θ. Reflection of reflected light from the bottom surface (base surface of the base material) of the spherical terminal component 120a on the image can be suppressed. The 1st incident light should just be comprised so that it may incline to the same side as the reflected light from a terminal with respect to the perpendicular line which passes the imaging position of a terminal.

  In the first embodiment, the inclination angle θ of the reflected light 500 from the terminal 121a of the spherical terminal component 120a with respect to the vertical line Z3 that passes through the imaging position P1 and is orthogonal to the bottom surface of the component 120 is substantially equal. Although an example configured to be 40 degrees has been shown, the present invention is not limited to this, and the inclination angle θ may be set to an angle different from 40 degrees such as 35 degrees and 45 degrees, for example. The inclination angle is such that the captured image of the terminal to be imaged is clear both when the spherical terminal component is imaged by the first illumination and when the component other than the spherical terminal component is imaged by the second illumination. What is necessary is just to image from the angle which can be imaged.

  Further, in the first embodiment, the example in which the elevating mechanism 14 is configured by an air cylinder has been described. However, the present invention is not limited thereto, and the elevating mechanism unit is configured by a ball screw, a servo motor, a linear motor, or the like. May be.

  In the first and second embodiments, the example in which the component transfer device of the present invention is applied to the surface mounters 100 and 200 has been shown. However, the component transfer device of the present invention can be used for component tests other than the surface mounter. It can be widely applied to devices (IC handlers) and the like. Moreover, you may apply to the components inspection apparatus as an independent apparatus provided with the diagonal imaging part for a coplanarity measurement, and 1st illumination.

  Moreover, although the said 1st Embodiment and 2nd Embodiment showed the example comprised so that the flatness determination of the terminal 121 of the component 120 might be performed by the main control part 61 of the surface mounter 100, this invention was shown. However, the present invention is not limited to this, and a separate dedicated control unit may be provided in the terminal imaging device 3 or the moving imaging device 250, and the flatness determination may be performed by this control unit.

  Moreover, in the said 1st Embodiment, although the example comprised so that the 1st illumination 11 and the 2nd illumination 12 could be switched by the main control part 61 of the surface mounter 100 was shown, this invention is not limited to this. As the switching means, a dedicated control unit for switching between the first illumination and the second illumination may be separately provided. Moreover, you may provide the changeover switch etc. for switching a 1st illumination and a 2nd illumination as a switching means.

  In the second embodiment, the moving imaging device 250 is provided with the imaging camera 210, the first illumination 211, the second illumination 212, the upper illumination 202 b, and the side illumination 53, and is adsorbed by the adsorption nozzle 22. An example is shown in which an image in an oblique direction (an oblique image) of the terminal 121 of the component 120, an image of a bottom surface of the component 120, and an image of a side surface of the component 120 can be captured. However, the moving mechanism unit may include only a component inspection unit including the oblique imaging unit and the first illumination, and the oblique imaging unit may capture only an oblique image of the component.

  In the first and second embodiments, line sensors are used for the upper imaging camera 2a, the oblique imaging camera 10, the side imaging camera 52, and the imaging camera 210, and the component 120 is relative to these cameras. Although an example in which imaging is performed while moving in a moving manner has been shown, it takes a long time to capture an image by using a CCD area camera and imaging the component 120 in a stationary state with respect to the camera. Image recognition processing can be simplified. In addition, the upper imaging camera 2a, the oblique imaging camera 10, the side imaging camera 52, and the imaging camera 210 use a storage type line sensor that accumulates charges by a plurality of stages of line sensors instead of a line sensor, a so-called TDI sensor. Also good. As a result, an image can be recognized even with a small amount of light, so that the relative speed between the camera and the component 120 can be increased, and the imaging time can be shortened to improve efficiency.

It is a top view which shows the surface mounting machine by 1st Embodiment of this invention. It is a side view of the surface mounting machine by 1st Embodiment shown in FIG. It is sectional drawing which shows the structure of the terminal imaging device of the surface mounter by 1st Embodiment shown in FIG. It is sectional drawing which shows the structure of the terminal imaging device of the surface mounter by 1st Embodiment shown in FIG. FIG. 2 is a layout diagram illustrating a configuration of a moving imaging device of the surface mounter according to the first embodiment illustrated in FIG. 1. FIG. 6 is a layout diagram illustrating a mirror layout as viewed from the side imaging camera side of the mobile imaging device illustrated in FIG. 5. FIG. 6 is a layout diagram illustrating a side illumination and a mirror layout of the mobile imaging device illustrated in FIG. 5 from the side surface side. It is a block diagram which shows the structure in connection with control of the surface mounter by 1st Embodiment shown in FIG. It is a flowchart for demonstrating the flatness determination operation | movement of the terminal of the components by the surface mounter by 1st Embodiment of this invention. It is a top view which shows the surface mounter by 2nd Embodiment of this invention. It is a side view of the surface mounting machine by 2nd Embodiment shown in FIG. FIG. 11 is a layout diagram illustrating a planar configuration of the mobile imaging device of the surface mounter according to the second embodiment illustrated in FIG. 10. FIG. 13 is a layout diagram illustrating the layout of each unit viewed from the imaging camera side of the mobile imaging device illustrated in FIG. 12. It is sectional drawing which shows the structure of the terminal imaging device by the 1st modification of 1st Embodiment of this invention. It is sectional drawing which shows the structure of the terminal imaging device by the 2nd modification of 1st Embodiment of this invention. It is sectional drawing which shows the structure of the terminal imaging device by the 3rd modification of 1st Embodiment of this invention.

Explanation of symbols

1 Base 2a Upper imaging camera (component recognition imaging unit)
3,303a, 303b, 303c terminals imaging device (Part goods inspection device)
10. Oblique imaging camera (oblique imaging unit)
11, 211, 311a, 311b, 311c 1st illumination 12, 212 2nd illumination 14 Elevating mechanism (elevating mechanism part)
20 Head unit 22 Suction nozzle 61 Main control unit (switching means)
100, 200 Surface mounter 120 Component 120a Spherical terminal component 203 Terminal imaging unit (component inspection device )
210 Imaging camera (oblique imaging unit)
250 Moving imaging device (moving mechanism)
500 Reflected light 600, 601, 602, 603 Incident light (first incident light)
700 Incident light (second incident light)

Claims (7)

An oblique imaging unit that images the terminal of the component from an oblique direction;
A first illumination and a second illumination for irradiating the component with light for imaging when imaging by the oblique imaging unit ;
Switching means for switching between the first illumination and the second illumination according to the type of the component imaged by the oblique imaging unit ;
The oblique imaging unit is configured to image reflected light that is irradiated from the first illumination or the second illumination to the terminal of the component and reflected obliquely downward from the terminal of the component;
The first illumination irradiates the component with light from one side in a predetermined horizontal direction during imaging, passes through the imaging position of the terminal of the component, and is perpendicular to the bottom surface of the component. The first incident light on the terminal of the component is arranged to be inclined with respect to the line on the same side as the reflected light from the terminal of the component ,
The second illumination irradiates the component with light from the other side in a predetermined direction in the horizontal direction during imaging, passes through the imaging position of the terminal of the component, and is perpendicular to the bottom surface of the component. The second incident light to the terminal of the component is arranged so as to be inclined to the opposite side to the first incident light with respect to the line,
The switching means switches to the first illumination when the imaging target part is a spherical terminal part provided with a terminal having a substantially spherical portion at the bottom during imaging by the oblique imaging unit, A component inspection apparatus configured to switch to the second illumination when the component to be imaged is a lead terminal component having a lead-line terminal . The first illumination has an inclination angle with respect to a vertical line that passes through the imaging position of the terminal of the component of the first incident light at the time of imaging and is orthogonal to the bottom surface of the component, from the terminal of the component. The component inspection apparatus according to claim 1, wherein the angle is equal to or greater than an inclination angle of the reflected light. The first illumination is arranged so as to irradiate the component with imaging light from below the component during imaging.
An elevating mechanism unit that is fixedly provided on the side surface on the one side of the oblique imaging unit and further supports the first illumination so as to be movable up and down at an ascending position during imaging and a descending position during non-imaging. The part inspection apparatus according to claim 1 or 2 . A head unit arranged in a straight line, each including a plurality of suction nozzles for sucking parts, and transferring the sucked parts;
4. The flatness measurement of the terminal of the component that is configured so that the arrangement direction of the plurality of suction nozzles and the predetermined direction in the horizontal direction coincide with each other and sucked by the suction nozzle is performed . Ru and a component inspecting apparatus according to, parts products transfer device. A base for movably supporting the head unit;
Further comprising a component recognition imaging unit for imaging the bottom surface of the component sucked by the suction nozzle and recognizing the component ;
The before and SL component inspecting apparatus wherein component recognition imaging unit, the plurality of in alignment in the direction along the array direction of the suction nozzle, is provided fixedly on the base, according to claim 4 Parts transfer device. The component inspection apparatus is fixedly provided on the side surface on the one side of the oblique imaging unit, and supports the first illumination so as to be movable up and down at an ascending position during imaging and a descending position during non-imaging. It further includes a lifting mechanism,
The component transfer apparatus according to claim 5, wherein the component recognition imaging unit is disposed on the other side of the oblique imaging unit. Attached to the front SL head unit, further comprising a moving mechanism that is movable in a direction along the arrangement direction of the plurality of suction nozzles,
The moving mechanism unit is provided with the component inspection device ,
The oblique imaging unit of the component inspection apparatus moves at least relative to the component sucked by the suction nozzle of the head unit by the moving mechanism unit, and at least an oblique image of the component sucked by the suction nozzle The component transfer device according to claim 4 , wherein the component transfer device is configured to take an image.

Images