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JP5146421B2 - Sensor cap, infrared sensor, sensor cap manufacturing method, and infrared sensor manufacturing method - Google Patents

Sensor cap, infrared sensor, sensor cap manufacturing method, and infrared sensor manufacturing method Download PDF

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JP5146421B2
JP5146421B2 JP2009167309A JP2009167309A JP5146421B2 JP 5146421 B2 JP5146421 B2 JP 5146421B2 JP 2009167309 A JP2009167309 A JP 2009167309A JP 2009167309 A JP2009167309 A JP 2009167309A JP 5146421 B2 JP5146421 B2 JP 5146421B2
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cap
sensor
manufacturing
window material
infrared sensor
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JP2011022006A (en
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康彦 古山
宣之 西居
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Shimadzu Corp
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Shimadzu Corp
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Description

本発明は、センサキャップ、赤外線センサ、センサキャップの製造方法及び赤外線センサの製造方法に関し、さらに詳しくは、窓材をキャップに接着するための接着剤が窓材の光透過部分へしみ出すことを防止できると共に接着性改善のための表面改質処理のコストを低減できるセンサキャップ、赤外線センサ、センサキャップの製造方法及び赤外線センサの製造方法に関する。   The present invention relates to a sensor cap, an infrared sensor, a method for manufacturing a sensor cap, and a method for manufacturing an infrared sensor. More specifically, the adhesive for adhering the window material to the cap oozes out to the light transmitting portion of the window material. The present invention relates to a sensor cap, an infrared sensor, a method of manufacturing a sensor cap, and a method of manufacturing an infrared sensor that can prevent the cost and can reduce the cost of surface modification treatment for improving adhesiveness.

従来、キャップの頭部に設けた開口に窓材の段差部が嵌合し且つキャップと窓材とが接着されてなる赤外線センサが知られている(特許文献1参照。)。   Conventionally, an infrared sensor is known in which a step portion of a window material is fitted into an opening provided in a head portion of a cap and the cap and the window material are bonded (see Patent Document 1).

特開2009−20077号公報JP 2009-20077 A

上記従来の赤外線センサでは、段差部を設ける前の窓材に対してダイサーを用いて段差部を形成している(特許文献1の[0009]参照。)。
しかし、段差部を設けた部分の外径寸法のバラツキ及びキャップの開口の内径寸法のバラツキによりキャップと窓材の嵌合部分の隙間が大きくなって、接着剤が窓材の光透過部分へしみ出すことがある問題点があった。
また、難接着性のポリオレフィン樹脂製の窓材の場合、接着性改善のための表面改質処理が必要となるが、従来は例えばプラズマ処理を行っており、装置コストおよび作業コストが増加する問題点があった。
そこで、本発明の目的は、窓材をキャップに接着するための接着剤が窓材の光透過部分へしみ出すことを防止できると共に接着性改善のための表面改質処理のコストを低減できるセンサキャップ、赤外線センサ、センサキャップの製造方法及び赤外線センサの製造方法を提供することにある。
In the conventional infrared sensor, the step portion is formed using a dicer on the window material before the step portion is provided (see [0009] of Patent Document 1).
However, the gap between the fitting part of the cap and window material becomes large due to the variation in the outer diameter of the stepped portion and the variation in the inner diameter of the opening of the cap, so that the adhesive penetrates into the light transmitting portion of the window material. There was a problem that could occur.
In addition, in the case of window materials made of polyolefin resin, which is difficult to adhere, surface modification treatment is required to improve adhesion, but conventionally, for example, plasma treatment is performed, which increases equipment costs and work costs. There was a point.
Accordingly, an object of the present invention is to provide a sensor that can prevent the adhesive for adhering the window material to the cap from oozing out to the light transmitting portion of the window material and reduce the cost of the surface modification treatment for improving the adhesion. It is providing the manufacturing method of a cap, an infrared sensor, a sensor cap, and an infrared sensor.

第1の観点では、本発明は、金属製のキャップ(1)の頭部に設けた開口(1a)にポリオレフィン樹脂製の窓材(2a)の段差部(2b)が嵌合し且つ前記キャップ(1)と前記窓材(2a)とが接着されてなるセンサキャップであって、前記段差部(2b)を設ける前の窓材(2)に、該窓材(2)の樹脂が軟化する温度以上に加熱した前記キャップ(1)の頭部を押し付けて前記段差部(2b)が形成されると共に接着性改善のための表面改質処理が行われていることを特徴とするセンサキャップ(200)を提供する。
上記第1の観点によるセンサキャップ(200)では、段差部(2b)を設ける前の窓材(2)に加熱したキャップ(1)の頭部を押し付けることにより段差部(2b)を形成しているため、キャップ(1)と窓材(2a)の嵌合部分の隙間が非常に小さくなり、接着剤(3)が窓材(2a)の光透過部分へしみ出すことが無くなる。また、キャップ(1)の頭部と当接した窓材(2a)の表面が加熱されることにより接着性改善のための表面改質処理が行われるため、例えばプラズマ処理のような別個の作業が不要になり、装置コストおよび作業コストを低減することが出来る。
In a first aspect, the present invention relates to the step (2b) of the window material (2a) made of polyolefin resin fitted into the opening (1a) provided in the head of the metal cap (1) and the cap. (1) and the window material (2a) are bonded to each other, and the resin of the window material (2) is softened to the window material (2) before the stepped portion (2b) is provided. The sensor cap (1), wherein the step (2b) is formed by pressing the head of the cap (1) heated to a temperature or higher, and a surface modification process for improving adhesion is performed. 200).
In the sensor cap (200) according to the first aspect, the step portion (2b) is formed by pressing the head of the heated cap (1) against the window material (2) before the step portion (2b) is provided. Therefore, the gap between the fitting portion of the cap (1) and the window material (2a) becomes very small, and the adhesive (3) does not ooze out to the light transmitting portion of the window material (2a). Further, since the surface modification treatment for improving the adhesion is performed by heating the surface of the window member (2a) that is in contact with the head of the cap (1), a separate operation such as plasma treatment is performed. Can be eliminated, and the apparatus cost and work cost can be reduced.

第2の観点では、本発明は、前記第1の観点によるセンサキャップ(200)を用いてパッケージングを施したことを特徴とする赤外線センサ(100)を提供する。
上記第2の観点による赤外線センサ(100)では、前記第1の観点によるセンサキャップ(200)を用いるため、シール性能が高いパッケージングが可能となる。また、コストを低減することが出来る。
In a second aspect, the present invention provides an infrared sensor (100) characterized by being packaged using the sensor cap (200) according to the first aspect.
In the infrared sensor (100) according to the second aspect, since the sensor cap (200) according to the first aspect is used, packaging with high sealing performance is possible. Further, the cost can be reduced.

第3の観点では、本発明は、金属製のキャップ(1)の頭部に設けた開口(1a)にポリオレフィン樹脂製の窓材(2a)の段差部(2b)が嵌合し且つ前記キャップ(1)と前記窓材(2a)とが接着されてなるセンサキャップの製造方法であって、前記段差部(2b)を設ける前の窓材(2)に、該窓材(2)の樹脂が軟化する温度以上に加熱した前記キャップ(1)の頭部を押し付けて前記段差部(2b)を形成するのと同時に接着性改善のための表面改質処理を行うことを特徴とするセンサキャップの製造方法を提供する。
上記第3の観点によるセンサキャップの製造方法では、段差部(2b)を設ける前の窓材(2)に加熱したキャップ(1)の頭部を押し付けることにより段差部(2b)を形成しているため、キャップ(1)と窓材(2a)の嵌合部分の隙間が非常に小さくなり、接着剤(3)が窓材(2a)の光透過部分へしみ出すことが無くなる。また、キャップ(1)の頭部と当接した窓材(2a)の表面が加熱されることにより接着性改善のための表面改質処理が行われるため、例えばプラズマ処理のような別個の作業が不要になり、装置コストおよび作業コストを低減することが出来る。
In a third aspect, the present invention relates to the step (2b) of the window material (2a) made of polyolefin resin fitted into the opening (1a) provided in the head of the metal cap (1) and the cap. A method of manufacturing a sensor cap in which (1) and the window material (2a) are bonded to each other on the window material (2) before the stepped portion (2b) is provided. The surface of the cap (1) heated above the temperature at which it softens is pressed to form the stepped portion (2b), and at the same time, a surface modification process for improving adhesion is performed. A manufacturing method is provided.
In the sensor cap manufacturing method according to the third aspect, the stepped portion (2b) is formed by pressing the head of the heated cap (1) against the window material (2) before the stepped portion (2b) is provided. Therefore, the gap between the fitting portion of the cap (1) and the window material (2a) becomes very small, and the adhesive (3) does not ooze out to the light transmitting portion of the window material (2a). Further, since the surface modification treatment for improving the adhesion is performed by heating the surface of the window member (2a) that is in contact with the head of the cap (1), a separate operation such as plasma treatment is performed. Can be eliminated, and the apparatus cost and work cost can be reduced.

第4の観点では、本発明は、前記第3の観点によるセンサキャップの製造方法により製造されたセンサキャップを用いてパッケージングを施すことを特徴とする赤外線センサの製造方法を提供する。
上記第4の観点による赤外線センサの製造方法では、前記第3の観点によるセンサキャップの製造方法により製造されたセンサキャップを用いるため、シール性能が高いパッケージングが可能となる。また、コストを低減することが出来る。
In a fourth aspect, the present invention provides a method for manufacturing an infrared sensor, wherein packaging is performed using a sensor cap manufactured by the method for manufacturing a sensor cap according to the third aspect.
In the infrared sensor manufacturing method according to the fourth aspect, since the sensor cap manufactured by the sensor cap manufacturing method according to the third aspect is used, packaging with high sealing performance is possible. Further, the cost can be reduced.

本発明のセンサキャップ、赤外線センサ、センサキャップの製造方法及び赤外線センサの製造方法によれば、窓材をキャップに接着するための接着剤が窓材の光透過部分へしみ出すことを防止できると共に接着性改善のための表面改質処理のコストを低減できる。   According to the sensor cap, the infrared sensor, the method of manufacturing the sensor cap, and the method of manufacturing the infrared sensor of the present invention, it is possible to prevent the adhesive for bonding the window material to the cap from oozing out to the light transmitting portion of the window material. The cost of the surface modification treatment for improving the adhesion can be reduced.

実施例1に係る赤外線センサを示す正面部分断面図である。1 is a partial front sectional view showing an infrared sensor according to Example 1. FIG. 実施例1に係る赤外線センサの回路図である。1 is a circuit diagram of an infrared sensor according to Embodiment 1. FIG. キャップの加熱工程を示す説明図である。It is explanatory drawing which shows the heating process of a cap. 窓材の予熱工程を示す説明図である。It is explanatory drawing which shows the preheating process of a window material. キャップを窓材の上に載せた状態を示す説明図である。It is explanatory drawing which shows the state which mounted the cap on the window material. 段差部の形成工程を示す説明図である。It is explanatory drawing which shows the formation process of a level | step-difference part. 接着剤の塗布工程を示す説明図である。It is explanatory drawing which shows the application | coating process of an adhesive agent. キャップと窓材の接着工程を示す説明図である。It is explanatory drawing which shows the adhesion process of a cap and a window material. 実施例1に係るセンサキャップを示す正面断面図である。1 is a front sectional view showing a sensor cap according to Embodiment 1. FIG.

以下、図に示す実施例により本発明をさらに詳細に説明する。なお、これにより本発明が限定されるものではない。   Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings. Note that the present invention is not limited thereby.

−実施例1−
図1は、実施例1に係る赤外線センサ100を示す正面部分断面図である。
この赤外線センサ100は、センサエレメント6aと負荷抵抗6bとFET6cとを搭載した回路基板7と、ステム9と、ステム9を貫通するピン10,11,12と、スペーサ8とからなるセンサ本体を、センサキャップ200によりパッケージングした構成である。ステム9は、コバール製である。
Example 1
FIG. 1 is a front partial cross-sectional view illustrating an infrared sensor 100 according to the first embodiment.
The infrared sensor 100 includes a sensor body including a circuit board 7 on which a sensor element 6a, a load resistor 6b, and an FET 6c are mounted, a stem 9, pins 10, 11, and 12 penetrating the stem 9, and a spacer 8. The sensor cap 200 is packaged. The stem 9 is made of Kovar.

センサキャップ200は、コバール製のキャップ1の頭部に設けた開口1aにポリオレフィン樹脂製の窓材2aの段差部2bが嵌合し且つ接着剤3によりキャップ1と窓材2aとが接着されてなる構成である。   In the sensor cap 200, the step portion 2b of the polyolefin resin window material 2a is fitted into the opening 1a provided in the head of the Kovar cap 1, and the cap 1 and the window material 2a are bonded by the adhesive 3. It is the composition which becomes.

図2は、赤外線センサ100の回路図である。   FIG. 2 is a circuit diagram of the infrared sensor 100.

センサキャップ200は、次の手順により製造される。
[1]図3に示すように、キャップ1の頭部をホットプレートHにより加熱し、ポリオレフィン樹脂の軟化点以上の温度(例えば160℃〜170℃)にする。
[2]図4に示すように、段差部を設ける前の窓材2を予熱台Pの載せ、ポリオレフィン樹脂の軟化点未満の温度(例えば100℃)に予熱する。
The sensor cap 200 is manufactured by the following procedure.
[1] As shown in FIG. 3, the head of the cap 1 is heated by a hot plate H to a temperature not lower than the softening point of the polyolefin resin (for example, 160 ° C. to 170 ° C.).
[2] As shown in FIG. 4, the window material 2 before providing the stepped portion is placed on the preheating table P and preheated to a temperature (for example, 100 ° C.) below the softening point of the polyolefin resin.

[3]図5に示すように、加熱したキャップ1の頭部をガイド治具Gで位置決めしながら、予熱台Pで予熱している窓材2の上に載せる。
[4]図6に示すように、荷重Waによりキャップ1を押し下げ、窓材2aに段差部2bを形成する。荷重Waはガイド治具GのフランジFの天面で止まるので、フランジFの天面の高さによって規定される深さの段差部2bが形成される。この後、キャップ1を取り外し、室温まで冷却する。また、予熱台Pの電源を切って、窓材2aを室温まで冷却する。
[3] As shown in FIG. 5, the head of the heated cap 1 is placed on the window material 2 preheated by the preheating table P while being positioned by the guide jig G.
[4] As shown in FIG. 6, the cap 1 is pushed down by the load Wa to form the stepped portion 2b in the window material 2a. Since the load Wa stops at the top surface of the flange F of the guide jig G, a step 2b having a depth defined by the height of the top surface of the flange F is formed. Thereafter, the cap 1 is removed and cooled to room temperature. Moreover, the power supply of the preheating stand P is turned off and the window material 2a is cooled to room temperature.

[5]図7に示すように、キャップ1の頭部に接着剤3(例えばエポキシ系接着剤やシアノアクリレート系瞬間接着剤)を塗布する。
[6]図8に示すように、接着剤3を塗布したキャップ1の頭部をガイド治具Gで位置決めしながら、予熱台Pで室温まで冷却した窓材2の上に載せ、荷重Wbによりキャップ1を押し下げ、窓材2aとキャップ1を接着する。荷重Wbはガイド治具Gの天面で止まるので、ガイド治具Gの天面の高さによって規定される厚さの接着剤3になる。
[7」以上により、図9に示す如きセンサキャップ200を製造できる。
[5] As shown in FIG. 7, an adhesive 3 (for example, an epoxy adhesive or a cyanoacrylate instantaneous adhesive) is applied to the head of the cap 1.
[6] As shown in FIG. 8, the head of the cap 1 coated with the adhesive 3 is placed on the window material 2 cooled to room temperature by the preheating table P while being positioned by the guide jig G, and is loaded by the load Wb. The cap 1 is pushed down, and the window material 2a and the cap 1 are bonded. Since the load Wb stops at the top surface of the guide jig G, the adhesive 3 has a thickness defined by the height of the top surface of the guide jig G.
[7] From the above, the sensor cap 200 as shown in FIG. 9 can be manufactured.

実施例1に係る赤外線センサ100およびセンサキャップ200によれば次の効果が得られる。
(a)加熱したキャップ1の頭部を窓材2に押し付けることにより段差部2bを形成しているため、キャップ1の開口1aと窓材2aの段差部2bの隙間が非常に小さくなり、接着剤3が窓材2aの光透過部分へしみ出すことが無くなる。
(b)窓材2aの表面がキャップ1の頭部と当接して加熱されることにより、接着性改善のための表面改質処理が行われる。このため、例えばプラズマ処理のような別個の表面改質処理作業が不要になり、装置コストおよび作業コストを低減することが出来る。
According to the infrared sensor 100 and the sensor cap 200 according to the first embodiment, the following effects can be obtained.
(A) Since the stepped portion 2b is formed by pressing the head of the heated cap 1 against the window material 2, the gap between the opening 1a of the cap 1 and the stepped portion 2b of the window material 2a becomes very small, and adhesion The agent 3 does not ooze out to the light transmitting portion of the window material 2a.
(B) When the surface of the window material 2a is in contact with the head of the cap 1 and heated, a surface modification process for improving adhesion is performed. For this reason, for example, a separate surface modification treatment operation such as plasma treatment is not required, and the apparatus cost and the operation cost can be reduced.

本発明のセンサキャップ、赤外線センサ、センサキャップの製造方法および赤外線センサの製造方法は、熱検出装置などに利用できる。   The sensor cap, the infrared sensor, the method for manufacturing the sensor cap, and the method for manufacturing the infrared sensor of the present invention can be used for a heat detection device or the like.

1 キャップ
1a 開口
2,2a 蓋材
2b 段差部
3 接着剤
100 赤外線センサ
200 センサキャップ
F フランジ
G ガイド治具
H ホットプレート
P 予熱台
Wa,Wb 荷重
DESCRIPTION OF SYMBOLS 1 Cap 1a Opening 2, 2a Lid 2b Step part 3 Adhesive 100 Infrared sensor 200 Sensor cap F Flange G Guide jig H Hot plate P Preheating stand Wa, Wb Load

Claims (2)

金属製のキャップ(1)の頭部に設けた開口(1a)にポリオレフィン樹脂製の窓材(2a)の段差部(2b)が嵌合し且つ前記キャップ(1)と前記窓材(2a)とが接着されてなるセンサキャップの製造方法であって、前記段差部(2b)を設ける前の窓材(2)に、該窓材(2)の樹脂が軟化する温度以上に加熱した前記キャップ(1)の頭部を押し付けて前記段差部(2b)を形成するのと同時に接着性改善のための表面改質処理を行うことを特徴とするセンサキャップの製造方法A step portion (2b) of a window material (2a) made of polyolefin resin is fitted into an opening (1a) provided in the head of a metal cap (1), and the cap (1) and the window material (2a) are fitted. A method of manufacturing a sensor cap in which the window member (2) is heated to a temperature at which the resin of the window member (2) is softened or higher before the step (2b) is provided. method for producing a sensor cap and performing a surface modification treatment for head and pressed at the same time improving the adhesiveness with the formation the stepped portion (2b) of (1). 請求項1に記載のセンサキャップの製造方法により製造されたセンサキャップを用いてパッケージングを施すことを特徴とする赤外線センサの製造方法 The method of manufacturing an infrared sensor, characterized in that applying the packaging using the sensor cap manufactured by the manufacturing method of the sensor cap according to claim 1.
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GB2165639B (en) * 1984-08-24 1988-01-27 Philips Electronic Associated Pyroelectric infra-red detector
JPS61274925A (en) * 1985-05-31 1986-12-05 Mitsubishi Rayon Co Ltd Manufacture of lens sheet
JPH11170257A (en) * 1997-12-12 1999-06-29 Matsushita Electric Ind Co Ltd Mold temperature control device and production of plastic molding
JP2009020077A (en) * 2007-07-13 2009-01-29 Nippon Ceramic Co Ltd Infrared sensor
DE102007039228B8 (en) * 2007-08-20 2009-12-17 Perkinelmer Optoelectronics Gmbh & Co.Kg Sensor cap assembly sensor circuit

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