JP5138024B2 - Electrode substrate unit for charging device or static eliminator - Google Patents

Description

  The present invention relates to an electrode substrate unit used in a charging device for charging a processing object with a positive or negative charge or a static eliminating device for discharging a charged object charged with a positive or negative charge.

Conventionally, a charging device that outputs positive ions or negative ions from the discharge electrode needle connected to the output part of the high voltage generation circuit that outputs AC or DC high voltage, or positive ions and negative ions alternately Or the static elimination apparatus which was made to output simultaneously is known.
In order to efficiently perform charging or discharging in a wide range, such as when charging or discharging a charged object that moves at high speed, an apparatus including a rod-shaped discharge unit in which a plurality of discharge electrode needles are linearly arranged It has been known.

For example, the static eliminator of Patent Document 1 uses an electrode substrate unit in which a plurality of positive and negative discharge electrode needles are arranged in two rows as a discharge unit that emits ions.
Specifically, a plus-side electrode lead connected to a positive high-voltage generation circuit and a negative-side electrode lead connected to a negative high-voltage generation circuit are parallel to each other on a long plate-like printed circuit board. A plurality of discharge electrode needles are connected to the positive and negative electrode leads via current limiting resistors, respectively.
Then, the printed circuit board as described above is embedded in an insulating resin material in a hollow insulating holder, and the tip of the discharge electrode needle protrudes from the resin to constitute an electrode substrate unit.
Thus, the reason why the printed board is buried in the insulating resin material in the insulating holder is to prevent creeping discharge on the printed board.
The charging device can also be configured by applying a positive or negative high voltage to the positive electrode lead and the negative electrode lead of such an electrode substrate unit.

JP 05-299191 A JP 2000-058290 A

The conventional electrode substrate unit is formed by pouring a molten insulating resin material into an insulating holder, pressing the printed circuit board into a predetermined position, and then solidifying the insulating resin material. It was.
In the electrode unit formed in such a process, the solidified insulating resin material must be in close contact with the printed circuit board surface. This is because creeping discharge due to an applied high voltage cannot be reliably prevented unless the insulating resin material is in close contact with the substrate surface.
In addition, if air bubbles remain in the solidified insulating resin material, a streamer discharge may partially occur inside the resin material, and a reliable insulation state may not be maintained. It is necessary to prevent bubbles from entering.

However, it is difficult to pour bubbles into the insulating holder so as not to be caught in the molten insulating resin material, and it takes a long time to pour the resin. I need it.
Further, if the printed circuit board is simply pushed into the molten resin, the adhesion between the surface of the printed circuit board and the resin may be insufficient, resulting in a defective product.
That is, the conventional electrode substrate unit for the charging device or the static eliminator has a problem that its manufacturing process is complicated and productivity is poor.
An object of the present invention is to provide an electrode substrate unit for a charging device or a static eliminator that can reliably prevent creeping discharge on the surface of the electrode substrate and has high productivity.

According to a first aspect of the present invention, a high voltage line connected to a high voltage generating circuit and a base end side of a discharge electrode needle that discharges an ion current according to an output voltage of the high voltage generating circuit are connected to the substrate body. A substrate on which a current limiting resistance element is mounted between the high voltage line and the discharge electrode contact, and a substrate case member made of an insulating resin material for holding the substrate; And the substrate case member covers the contact connecting the high voltage line, the current limiting resistor, and the current limiting resistor and exposes the discharge electrode contact, and in the formation process, the substrate case is insulated resin. It is characterized by being integrated with the substrate by injection molding included in the material.

The second invention is characterized in that the substrate body is provided with one or a plurality of holes, and the holes are filled with the insulating resin material .

A third invention is for connecting a high voltage line connected to a high voltage generation circuit and a base end side of a discharge electrode needle that discharges an ion current according to an output voltage of the high voltage generation circuit to a substrate body. A substrate on which a current limiting resistance element is mounted between the high voltage line and the discharge electrode contact, and a substrate case member made of an insulating resin material for holding the substrate; A hole is formed between the contact connecting the current limiting resistance element and the high voltage line in the substrate body, and the substrate case member forms an insulating resin material in the formation process. An electrode substrate unit is provided which is integrated with the substrate by injection molding included in the substrate, is filled with the insulating resin in the hole, and increases the distance of creeping discharge between the high voltage line and the contact. It is characterized by that.

According to a fourth aspect of the present invention, the hole in the second or third aspect is a through-hole penetrating the substrate, and the insulating resin material forming the substrate case member is continuous on both surfaces of the substrate through the through-hole. It is characterized by having the structure to do.

According to a fifth aspect of the present invention, the current limiting resistance element is a resistance element with a lead wire terminal .

In this invention, when the substrate case is formed by injection molding, the step of filling the substrate case with the insulating resin material and the step of embedding the substrate in one step are included so that the substrate is included and integrated. And the manufacturing process can be simplified. In addition, the adhesion between the insulating resin material and the substrate surface can be enhanced by injection molding of the substrate case under pressure. Thereby, creeping discharge on the substrate surface can be prevented.
Moreover, at the time of injection molding, compared with the case where a resin material is poured into an insulating holder as in the prior art, bubbles are less likely to enter the insulating resin material, and the insulating property can be maintained.

According to the 2nd -5th invention, the insulating resin with which the hole formed in the board | substrate body was filled can exhibit an anchor effect, and can improve the adhesiveness of a board | substrate and a board | substrate case. As a result, creeping discharge can be reliably prevented.

In the third to fifth inventions, since a hole is formed between the contact of the current limiting resistance element and the high voltage line and the resin is filled in the loss, the creepage distance of the portion where discharge is particularly easy is increased. As a result, creeping discharge can be efficiently and reliably prevented.

According to the fourth invention, the integrity of the substrate and the substrate case can be further enhanced.
In the fifth invention, the lead wire absorbs the external force acting on the current limiting resistor element during the formation process due to the difference in thermal expansion coefficient between the insulating resin material constituting the substrate case and the material constituting the substrate body. be able to. Therefore, it is possible to prevent the current limiting resistance element from being damaged during the formation process.

FIG. 1 is a circuit diagram of a static eliminator using the electrode substrate unit of the embodiment. FIG. 2 is an external perspective view of an electrode substrate unit in which a cover is attached to the substrate case member . FIG. 3 is a perspective view of the discharge electrode needle holder of the embodiment. FIG. 4 is an enlarged cross-sectional view of FIG. FIG. 5 is a perspective view of the substrate case member of the embodiment. FIG. 6 is a perspective view of the substrate according to the embodiment as viewed from one surface side. FIG. 7 is a perspective view of the substrate of the embodiment as viewed from the other surface side. 8 is a cross-sectional view taken along line VIII-VIII in a state in which a discharge electrode needle holder is attached to the electrode substrate unit of FIG.

FIG. 1 is a circuit diagram of a static eliminator using the electrode substrate unit of the present invention.
As shown in FIG. 1, the static eliminator includes a high-frequency boost transformer T1 that boosts a positive-side high-frequency voltage and a high-frequency boost transformer T2 that boosts a negative-side high-frequency voltage. The voltage doubler rectifier circuits 1 and 2 are connected to the secondary side, respectively.
The step-up transformers T1 and T2 have a function of boosting the high-frequency voltage. Although not shown in the figure, the high-frequency voltage source and the input of the high-frequency voltage are connected to the plus side and the minus side. Is connected to a switch mechanism that switches alternately.

  The plus-side voltage doubler rectifier circuit 1 and the minus-side voltage doubler rectifier circuit 2 each include a plurality of sets of capacitors C0 and C1 and diodes D. As the number of stages increases, the step-up rate of the voltage input from the secondary side of the high-frequency step-up transformers T1 and T2 increases, and a high voltage can be output from the voltage doubler rectifier circuits 1 and 2. However, the number of stages may be set according to the required voltage. In FIG. 1, a part of the steps is omitted.

Each stage of the plus side voltage doubler rectifier circuit 1 and the minus side voltage doubler rectifier circuit 2 is provided with a capacitor C0 or C1, and each of the final stages in the plus side voltage doubler rectifier circuit 1 and the minus side voltage doubler rectifier circuit 2 is provided. A current limiting resistor R1 is connected in series to the diode D of the stage.
In FIG. 1, the capacitor at the stage to which the current limiting resistor R1 is connected is represented as C1, and the capacitor at the other stage is represented as C0.
Accordingly, an RC parallel circuit including the capacitor C1 and the current limiting resistor R1 is formed in the final stage, and in this embodiment, the capacity of the capacitor C1 is larger than the capacity of the capacitor C0. As described above, the capacitance of the capacitor C1 of the RC parallel circuit is made larger than the capacitance of the other capacitor C0 when the positive voltage and the negative voltage in the high voltage generating circuit are switched. It is for improving.

Further, the output terminal 3 of the plus side voltage doubler rectifier circuit 1 and the output terminal 4 of the minus side voltage doubler circuit 2 are connected without a resistor, and an electrode substrate unit 6 is connected to an intermediate connection point 5 between them. Yes.
A plurality of discharge electrode needles 7 that output positive or negative ions are connected to the electrode substrate unit 6 in accordance with the output voltages of the positive side voltage doubler rectifier circuit 1 and the negative side voltage doubler rectifier circuit 2.
That is, the positive side and negative side voltage doubler rectifier circuits 1 and 2, transformers T1 and T2, and the primary side circuit of the transformer constitute the high voltage generation circuit of the present invention.
However, any high voltage generating circuit may be used as long as a necessary high voltage can be applied to the electrode substrate unit 6.

As described above, the current limiting resistor R1 is provided in each of the positive side voltage doubler rectifier circuit 1 and the negative side voltage doubler rectifier circuit 2 because the negative side voltage doubler is supplied from the output terminal 3 of the positive side voltage doubler rectifier circuit 1. This is to prevent a short-circuit current from flowing through the rectifier circuit 2 to the ground. Therefore, the current limiting resistor R1 may be provided at any stage of the voltage doubler rectifier circuits 1 and 2, or may be provided between the output units 3 and 4 and the connection point 5.
Since stray capacitance is generated between each discharge electrode needle 7 and the ground, in FIG. 1, this stray capacitance is illustrated as a stray capacitance cf using a capacitor symbol.

As shown in FIG. 1, the electrode substrate unit 6 has a plurality of discharge electrode needles 7 connected to a high voltage line 8 connected to a connection point 5 via a current limiting resistor 9 which is a current limiting resistor according to the present invention. doing.
Thus, the reason why the current limiting resistor 9 is connected in series with each discharge electrode needle 7 is to prevent a large current from flowing through the discharge electrode needle 7.
If the current limiting resistor 9 is connected in this way, even if a person accidentally contacts the discharge electrode needle 7 to which a high voltage is applied, a large current will not flow, Safety can be ensured.

In addition, this static eliminator is for neutralizing a charged object to be neutralized by positive and negative ions generated from the discharge electrode needle 7. If the current limiting resistor 9 is not provided, the charged quantity of the charged object is large and the potential is high. The potential of the output terminal of the high voltage generating circuit changes to the same potential as that of the charged object due to electrostatic induction, causing an accident that damages the components of the positive / negative high voltage generating circuit due to static electricity. For example, there are many cases where the static electricity generation potential of a resin film or the like is generated from 50 [kV] to 100 [kV]. Even in such a case, if the current limiting resistor 9 is provided, the potential of the connecting portion 5 to which the electrode substrate unit 6 is connected is kept low, and parts such as a high voltage generation circuit are damaged by a high voltage due to electrostatic induction. Can be prevented.
Furthermore, since the current limiting resistor 9 is connected to each discharge electrode needle 7, the discharge current value is individually controlled even if the charging potential on the surface facing each discharge electrode needle 7 is different.

Next, a specific configuration of the electrode substrate unit 6 connected to the connection point 5 will be described in detail with reference to FIGS.
FIG. 2 is an external view of the electrode substrate unit 6 of this embodiment. This electrode substrate unit 6 is obtained by attaching a cover 11 to a case body 10 which is a substrate case member of the present invention.
A mounting hole 11a is formed in the cover 11, and a discharge electrode needle holder 13 (see FIG. 3), which will be described later, is attached to the mounting hole 11a and used as an electrode substrate unit for a charging device or a charge removal device.
FIG. 8 is a sectional view showing a state in which only one discharge electrode needle holder 13 is attached. Further, in FIG. 8, it marks No. 19 is an O-ring.

The electrode substrate unit 6 shown in FIG. 2 is provided with two mounting holes 11a for the discharge electrode needle holder 13, but the number of mounting holes 11a may be any number.
However, in this embodiment, a plurality of the electrode substrate units 6 in FIG. 2 are connected in the longitudinal direction by inserting the connecting portion 11 c at one end of the cover 11 into the inside of the connecting portion 11 d of another electrode substrate unit 6. To be able to.
The cover 11 is provided with a ground plate 12 that is continuous in the longitudinal direction. The ground plate 12 is provided in the mold when the cover 11 is molded and integrated with the cover 11. When the plurality of electrode substrate units 6 are connected, the ground plate 12 is also connected. ing. Then, the earth plate 12, by connecting to the body grounding of the charging device or discharging device, it by the electrostatic induction based on high charged object static electric circuit of the neutralization device is prevented from being damaged.

A coupling recess 11b for coupling the discharge electrode needle holder 13 is formed on the inner periphery of the mounting hole 11a of the cover 11.
On the other hand, as shown in FIGS. 3 and 4, the discharge electrode needle holder 13 is a holder provided with a discharge electrode needle 7 at the center thereof, and a cylindrical electrode holding portion 13a for holding the base end side of the electrode, And a disk-shaped gripping portion 13b surrounding the periphery of the electrode tip protruding outward.
A contact member 14 is provided in the electrode holding portion 13a so as to be movable in the axial direction while maintaining electrical connection with the discharge electrode needle 7 (see FIGS. 4 and 8). The contact member 14 is subjected to an elastic force in a direction in which the contact member 14 protrudes downward in FIG. 3 by a spring member (not shown) in the electrode holding portion 13a. Due to this elastic force, when the discharge electrode needle holder 13 is attached to the electrode substrate unit 6, the contact member 14 can be reliably brought into contact with the electrode contact 16 on the printed circuit board 15 described later. I have to.

Further, the gripping portion 13 b of the discharge electrode needle holder 13 is a portion for an operator to grip when the holder 13 is attached to the cover 11.
Further, a coupling convex portion 13c that engages with the coupling concave portion 11b of the cover 11 is formed between the electrode holding portion 13a and the gripping portion 13b. When the discharge electrode needle holder 13 is attached to the cover 11, the coupling convex portion 13c is fitted into the coupling concave portion 11b so as to couple them together.
In this discharge electrode needle holder 13, a slight gap 13d is formed around the discharge electrode needle 7, and an air introduction space 13e is formed below the grip portion 13b in FIGS. Furthermore, a plurality of small holes 13g are formed in the partition wall 13f that partitions the air introduction space 13e from the electrode holding portion 13a, and the air introduction space 13e communicates with the outside (see FIG. 4).
If air is introduced into the air introduction space 13e from the small hole 13g in a state where a high voltage is applied to the discharge electrode needle 7, an air flow along the discharge electrode needle 7 is formed, thereby releasing an ion flow. Will be.

FIG. 5 is a perspective view of the case main body 10 with the cover 11 removed from the unit 6 of FIG. 2. The case main body 10 is a board case member of the present invention, and is integrally formed with a printed board 15 included therein. It is an electrode substrate unit of this invention.
As shown in FIGS. 6 and 7, the printed circuit board 15 integrated with the case body 10 includes a discharge electrode contact 16 and a resistance contact 17 on one surface 15 a side, and these discharge electrode contacts 16. The lead terminals 9a and 9b of the current limiting resistor 9 (see FIG. 1) are connected to the contact 17 and the resistor contact 17, respectively.
Further, a through hole 18 is formed around the current resistor 9.

Further, on the other surface 15b of the printed board 15 shown in FIG. 7, a pair of electrode leads 8a and 8b along the longitudinal direction are formed on both sides thereof. These electrode leads 8a and 8b are connected to a connection point 5 shown in FIG. 1 at a position (not shown) to constitute the high voltage line 8 of FIG.
Further, a contact portion 8c projecting inward from each electrode lead 8a, 8b is formed on the other surface 15b of the printed board 15, and the tip of the contact portion 8c is connected to the through hole 15c. Through the through hole 15c (see FIGS. 7 and 8), the electrode leads 8a and 8b are connected to the resistance contact 17 on the one surface 15a side. That is, the current limiting resistor 9 is connected between the high voltage line 8 and the discharge electrode contact 16.

As described above, the case main body shown in FIG. 5 is formed by injection molding in which the printed circuit board 15 to which the current limiting resistor 9 is connected is held at a predetermined position in the mold and the insulating resin material is injected into the mold. 10 is configured. The printed circuit board 15 provided with electrical elements such as the electrode leads 8a and 8b, the contacts 16 and 17, and the current limiting resistor 9 is the substrate of the present invention, and the plate material provided with these elements is the substrate body. is there.
The case body 10 includes an electrode support cylinder 10 a and a resistance coating portion 10 b on one surface 15 a of the printed circuit board 15.
The electrode support cylinder 10a is for inserting and holding the electrode holding portion 13a of the discharge electrode needle holder 13 of FIG.
The resistance coating portion 10b covers the current limiting resistor 9 and the resistance contact 17 provided on the one surface 15a side of the printed circuit board 15, and prevents creeping discharge on the surface of the resistance element.
Note that the electrode leads 8a and 8b and the contacts 8c are also covered with the insulating resin material constituting the case body 10 on the other surface 15b side of the substrate.

Since the case body 10 is integrally formed with the substrate by injection molding, bubbles are not left in the insulating resin material or on the substrate surface, and high insulation can be maintained.
In addition, since the case body 10 having high insulation can be formed only by the injection molding process, there is an advantage that the productivity is higher than the manufacturing of the conventional electrode substrate unit.

  In this embodiment, a resistor element having lead terminals 9 a and 9 b is used as the current limiting resistor 9. As described above, the resistive element including the lead terminals 9a and 9b is used in the process of integrally forming the case body 10 and the printed board 15 by injection molding, and the printed board 15 is warped and an external force acts on the resistive element. Even if it does, it is for preventing a resistive element from damaging or a contact breaking.

The reason why the printed board 15 is warped is as follows.
As described above, in this embodiment, the case body 10 is formed by injection molding using an insulating resin, but the printed circuit board 15 provided in the mold is not melted in that process. The melting temperature of the resin material constituting the printed circuit board 15 must be higher than the melting temperature of the insulating resin material. Usually, a glass epoxy resin having a high melting point is used for the substrate body of the printed circuit board 15, and an ABS (acrylonitrile-butadiene-styrene copolymer) resin having a lower melting point is used for the insulating resin material for the case. Etc. are used.
Such a different material also has a different coefficient of thermal expansion, so that the substrate body warps in one direction during the manufacturing process.

When the printed circuit board 15 is warped, an external force acts on the resistance element connected on the board, and the resistance element may be damaged or the contact may be broken by the external force.
In this embodiment, the current limiting resistor 9 having the lead terminals 9a and 9b is used, and the external force is absorbed by the lead terminals 9a and 9b to prevent the resistance element from being damaged.
For example, when a surface mount type resistance element having no lead terminals 9a and 9b is used, when the deformation of the printed circuit board 15 is increased, the resistance element is damaged or the contact is broken. May be frustrated.
In this embodiment, by using a resistance element with lead terminals 9a and 9b as the current limiting resistor 9, it is possible to prevent the current limiting resistor from being damaged or from causing a connection failure.

  Furthermore, in this embodiment, the through hole 18 is formed in the printed circuit board 15. The through hole 18 is filled with an insulating resin material at the time of injection molding of the case main body 10, and it is continuous with both surfaces of the printed circuit board 15 so that the printed circuit board 15 and the insulating resin material are in close contact with each other. You can be sure. Therefore, creeping discharge on the printed circuit board 15 when a high voltage is applied to the electrode leads 8a and 8b can be more reliably prevented.

In this embodiment, the through hole 18 is formed in the printed circuit board 15. However, even if the hole does not penetrate, if the insulating resin material is filled therein, the insulating resin is obtained due to the anchor effect. The adhesion between the material and the printed circuit board 15 is improved.
Further, the through hole 18, Suruho Le 15c and the electrode lead 8a of the resistor contacts 17 the same potential of the current limiting resistor 9, so is interposed between the 8b, is a high-voltage line and the resistor contacts 17 It is possible to reliably prevent discharge between the electrode leads 8a and 8b.
However, the through holes 18 and the holes that do not penetrate are not essential components of the present invention, and even if these holes are not formed, bubbles remain in the insulating resin material according to injection molding. Thus, the case body 10 having excellent adhesion between the insulating resin material and the printed board 15 can be realized with high productivity.

In the static eliminator of this embodiment, positive and negative ions are alternately output from the same discharge electrode needle 7 by alternately applying a positive high voltage and a negative high voltage to the high voltage line 8. However, a positive high voltage and a negative high voltage are separately applied to each of the pair of electrode leads 8a and 8b, and one is connected to the electrode lead 8a from the discharge electrode needle 7 with a positive voltage. Ions and negative ions may be output from the discharge electrode needle 7 connected to the other electrode lead 8b.
As described above, when voltages having different polarities are applied to the electrode leads 8a and 8b, the possibility of discharge between the electrode leads 8a and 8b is increased. Increasing the creepage distance by filling the hole 18 with an insulating resin material is particularly effective for preventing creeping discharge.

Further, a power supply case along the power supply substrate unit 6 is attached to the outside of the electrode substrate unit 6 shown in FIG. 2, and a high voltage generation circuit for connecting to the connection point 5 in FIG. 1 is incorporated therein. By doing so, it is possible to incorporate all the components into the bar-shaped static eliminator.
If a bar-shaped static eliminator is configured as described above, and an air flow is supplied from one end of the electrode substrate unit 6 to the inside thereof, for example, as indicated by an arrow A in FIG. The discharge electrode needle holder 13 can flow out along the discharge electrode needle 7 through the air introduction space 13e from the small hole 13g. In this embodiment, since the electrode substrate unit 6 can be used as an air supply duct for forming an air flow along the discharge electrode needle 7, it is not necessary to separately provide an air supply duct.

Further, if the air flow along the discharge electrode needle 7 is discharged during the generation of ions in this way, it is possible to prevent dust from adhering to the surface of the discharge electrode needle 7. If dust adheres to the discharge electrode needle 7, the ion generation ability may be reduced or the discharge electrode needle 7 may be corroded. However, the air flow along the discharge electrode needle 7 using the discharge electrode holder 13 is not limited. This is not the case.
Furthermore, the power supply board unit 6 of this embodiment can also be applied to a charging device by changing its high voltage generation circuit.

  The electrode substrate unit according to the present invention includes a static eliminator that alternately generates positive ions and negative ions on the same discharge electrode, and discharge needles arranged in two rows, with a positive DC voltage in one row and the other row Can be applied to both a static eliminator that applies a negative DC voltage and a charging device that outputs positive ions or negative ions from a discharge electrode.

6 Electrode board unit 7 Discharge electrode needle 8 High voltage lines 8a and 8b Electrode lead 9 Current limiting resistors 9a and 9b Lead terminal 10 Case body 13 Discharge electrode needle holder 14 Contact member 15 Printed circuit board 16 Electrode contact 17 Resistance contact 18 Through Hole

Claims (5)

A high voltage line connected to the high voltage generating circuit and a discharge electrode contact for connecting the base end side of the discharge electrode needle that discharges an ion flow according to the output voltage of the high voltage generating circuit to the substrate body. And a substrate case member made of an insulating resin material for holding the substrate, the substrate case having a current limiting resistance element mounted between the high voltage line and the discharge electrode contact. The member covers the contact connecting the high-voltage line, the current limiting resistor and the current limiting resistor, and exposes the discharge electrode contact, and in the formation process, the molding includes the substrate in an insulating resin material. An electrode substrate unit for a charging device or a static eliminator that is integrated with the substrate. The electrode substrate unit for a charging device or a charge eliminating device according to claim 1, wherein the substrate body is provided with one or a plurality of holes, and the holes are filled with the insulating resin material . A high voltage line connected to the high voltage generating circuit and a discharge electrode contact for connecting the base end side of the discharge electrode needle that discharges an ion flow according to the output voltage of the high voltage generating circuit to the substrate body. A substrate case member made of an insulating resin material for holding the substrate, and a substrate on which a current limiting resistance element is mounted between the high voltage line and the discharge electrode contact; Is formed by injection molding in which a hole is formed between the contact for connecting the current limiting resistance element and the high voltage line, and the substrate case member encloses the substrate in an insulating resin material in the formation process. For a charging device or a static eliminator provided with an electrode substrate unit that is integrated with a substrate and is filled with the insulating resin in the hole and increases the distance of creeping discharge between the high voltage line and the contact Electrode substrate Knit. 4. The charging device according to claim 2 , wherein the hole is a through-hole penetrating the substrate, and an insulating resin material forming the substrate case member is continuous on both surfaces of the substrate through the through-hole. Or an electrode substrate unit for a static eliminator. The electrode substrate unit for a charging device or a charge removal device according to claim 1, wherein the current limiting resistance element is a resistance element with a lead wire terminal .

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