JP5105597B2 - LED mounting device - Google Patents

Description

The present invention relates to an apparatus for mounting one or more LEDs in a heat dissipative state.

An LED as a light source, particularly a high-intensity LED, is accompanied by self-heating during lighting, but the heat adversely affects the light emission efficiency and the life of the light emitting element. For this reason, a heat dissipating means is required for mounting the LED.

Conventionally, heat radiation of a high-brightness LED is performed by transmitting it to the LED mounting surface, for example, the surface of a printed circuit board or the surface of a metal heat dissipation plate via an LED mold resin. According to the heat dissipation means, the heat dissipation efficiency is poor because the thermal conductivity of the mold resin is low.

In addition, when the LED is soldered to the conductive pattern of the printed circuit board with a lead wire, there is a means for promoting heat dissipation by enlarging the area of the conductive pattern, but since the heat capacity of the conductive pattern is small, There was a limit to heat dissipation.

On the other hand, as disclosed in Patent Document 1, if the LED element itself is assembled on a heat dissipating substrate, the heat dissipation countermeasure can be set within a design-required range. However, since the countermeasure can be taken only at the manufacturing stage of the LED element, it cannot be a heat radiating means that can be applied to the LED at a general user use / incorporation stage of a general LED.
JP 2007-158242 A

Accordingly, an object of the invention is to attach an LED to a heat radiating body and efficiently dissipate the heat generated by the LED from the heat radiating body in a general LED use stage.

Based on the above problems, the present invention provides an LED mounting device (1) in which the flat surface of the mold case (9) of the LED (4) is attached to the mounting surface (3) of the conductive radiator (2). A plurality of LEDs (4) are mounted on the mounting surface (3) of the conductive radiator (2) in close contact, and one lead wire (5) of the LED (4) is connected to the conductive radiator (2). The other lead wire (6) of the LED (4) is connected to the lighting circuit (8) of the printed circuit board (7), and the conductive radiator (2) is connected to the lighting circuit (8). As a common, a common conductive circuit is configured for the plurality of LEDs (4) .

As described above, LED (4) mold case (9), the to the flat surface in close contact with the mounting surface (3) of the conductive heat dissipation member (2), Ru mounted on a mounting surface (3). The conductive heat radiating body (2) constitutes a common conductive circuit for the plurality of LEDs (4), with the common for the lighting circuit (8).

In the present invention, the following effects can be obtained. The heat of the LED (4) is conducted to the heat radiating body (2) having a large heat capacity via the one lead wire (5) and efficiently dissipated from the heat radiating body (2). Well, the LED (4) can have a long life and the light emission characteristics are stable over a long period of time. Since one lead wire (5) of the LED (4) is directly connected to the conductive radiator (2), welding of the conductive radiator (2) lead wire (5) (brazing method / laser bonding) ) Can be easily performed on the surface of the heat dissipating body (2), and the welding work of the lead wires (5) of the plurality of LEDs (4) is also facilitated.

If the mold case (9) of the LED (4) is attached in close contact with the mounting surface (3) of the radiator (2), heat can be dissipated from the mold case (9) to the radiator (2). The effect goes up. In addition, in the LED (4) mounting step, one lead wire (5) is directly connected to the conductive radiator (2), so the conductive radiator (2) and the lead wire (5) Can be easily performed on the surface of the radiator (2), and the welding work of the lead wires (5) of the plurality of LEDs (4) is also facilitated.

1 and 2 show an LED mounting device 1 according to the present invention. The LED mounting device 1 includes a conductive heat dissipating body 2 for mounting one or more LEDs 4 and a lighting circuit 8 on a printed circuit board 7 for controlling the lighting of the LEDs 4. One or two or more LEDs 4 are electrically connected to the mounting surface 3 of the conductive radiator 2 by directly welding one lead wire 5 of the LED 4 to the upper surface of the radiator 2. The other lead wire 6 is electrically connected to the conductive pattern 13 of the lighting circuit 8 of the printed circuit board 7 by welding.

The conductive heat dissipating body 2 is composed of a block body made of aluminum or copper as a metal material having a good heat conductivity and a large heat capacity from the viewpoint of heat dissipating characteristics, and the mounting surface 3 is formed by a flat surface thereof. A large number of fins 11 for heat dissipation are integrally formed on other portions such as a lower surface.

The LED 4 is mounted with the bottom surface of the mold case 9 of the LED 4 in close contact with the mounting surface 3 of the radiator 2 for heat dissipation, and the lens 12 faces the light emitting direction.

When the radiator 2 is made of aluminum, one lead wire 5 of the LED 4 is directly fixed and electrically connected to the mounting surface 3 of the radiator 2 by means such as laser welding or high-frequency welding. When the radiator 2 is made of copper, one lead wire 5 of the LED 4 is directly fixed and electrically connected to the mounting surface 3 of the radiator 2 by brazing means such as soldering. In this way, the radiator 2 constitutes a conductive circuit common to the plurality of LEDs 4 as a common of the lighting circuit 8 by a conductive function.

In the LED 4 mounting process, one lead wire 5 is directly connected to the conductive heat radiating body 2, so welding (brazing method / laser bonding) between the conductive heat radiating body 2 and the lead wire 5 is performed by the heat radiating body. 2 can be easily performed, and the welding work of the lead wires 5 of the plurality of LEDs 4 is also facilitated. The other lead wire 6 of the LED 4 is electrically connected to a predetermined position of the conductive pattern 13 of the lighting circuit 8 by fixing means such as soldering.

The printed circuit board 7 is attached to and integrated with the radiator 2 for unitization. For this unitization, the radiator 2 is integrally formed with, for example, a storage groove 10 having the same size as the outline of the printed circuit board 7 on the mounting surface 3. 10 and is attached to the inside of the groove 10 by fixing means such as fitting. In this mounted state, the common side terminal (not shown) of the lighting circuit 8 of the printed circuit board 7 is electrically connected to the conductive heat radiating body 2 which is a common conductive circuit by means such as soldering or pressure contact. Is done.

The lighting circuit 8 includes a plurality of electric elements 14 and a conductive pattern 13 that connects them, and is connected to a power supply circuit (not shown) or a lighting condition determination circuit, and determines the lighting conditions for one or more LEDs 4. When the lighting condition is satisfied, the corresponding LED 4 is turned on in a desired lighting mode, and light is emitted from the lens 12.

When the LED 4 is turned on, heat is generated in the LED 4 due to self-heating, but this heat is conducted to the heat radiating body 2 having a large heat capacity via one lead wire 5, and is stored in the heat radiating body 2, and at the same time Efficiently dissipates. If there are a large number of fins 11 for heat dissipation in the heat dissipating body 2, the heat dissipating area of the heat dissipating body 2 is increased. Thus, the heat dissipation efficiency of the LED 4 is good, the LED 4 can have a long life, and the light emission characteristics are stable over a long period of time. If the mold case 9 of the LED 4 is attached in close contact with the attachment surface 3 of the radiator 2, heat can be radiated from the mold case 9 to the radiator 2.

The present invention can be applied to all types of LEDs, and can be used for various types of apparatuses using the LED 4 as a light source. The printed circuit board 7 and its lighting circuit 8 are a circuit board and a circuit attached to the LED mounting device 1, but can be incorporated into a printed circuit board of another device and a circuit of the printed circuit board.

It is a top view of LED mounting device 1 concerning the present invention. It is a side view of LED mounting device 1 concerning the present invention.

1 LED mounting device 2 radiator 3 mounting surface 4 LED
5 Lead wire 6 Lead wire 7 Printed circuit board 8 Lighting circuit 9 Mold case 10 Groove for housing 11 Fin 12 Lens 13 Conductive pattern 14 Electrical element

Claims (1)

The flat surface of the mold case (9) of the LED (4) is brought into close contact with the mounting surface (3) of the conductive radiator (2), and the mounting surface (3) of the conductive radiator (2) A plurality of LEDs (4) are mounted, and one lead wire (5) of the LED (4) is directly connected to the conductive heat radiating body (2) by welding, and the other lead wire (6) of the LED (4). Is connected to the lighting circuit (8) of the printed circuit board (7), and the conductive radiator (2) is used as the common of the lighting circuit (8) to form a common conductive circuit for the plurality of LEDs (4). LED mounting device (1) characterized by the above.

Images