JP5085851B2 - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
- Publication number
- JP5085851B2 JP5085851B2 JP2005081462A JP2005081462A JP5085851B2 JP 5085851 B2 JP5085851 B2 JP 5085851B2 JP 2005081462 A JP2005081462 A JP 2005081462A JP 2005081462 A JP2005081462 A JP 2005081462A JP 5085851 B2 JP5085851 B2 JP 5085851B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- emitting device
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
部材よりも屈折率が小さいことを特徴とする。
さらに、第1の透光性部材の屈折率が発光素子の屈折率よりも小さいことから、発光素子から出た光を屈折率差が小さい経路を通って発光装置の外部へ放出しやすくしつつ、第2の透光性部材の屈折率が第1の透光性部材の屈折率よりも小さいことから、穴部の内面での光の屈折を大きくして、光を上側のより広範囲に広げることができる。そのため、発光素子から出た光を屈折率差が小さい経路を介して効率よく外部に放出しつつも発光強度にむらが生じることを有効に抑制することができる。
2:基体
3:枠体
4:発光素子
5:透光性部材
6:穴部
7a,7b,7c:蛍光体層
Claims (4)
- 上面に発光素子が載置される載置部を有した基体と、該基体の上面に前記載置部を取り囲むように取着された、内周面を光反射面とされた枠体と、前記載置部に載置された前記発光素子と、前記発光素子の上方を覆うように配置されるとともに、上面であって前記発光素子の直上に位置する部位に傾斜面を有する穴部が部分的に設けられた第1の透光性部材と、前記穴部に充填された第2の透光性部材とを含んでなる発光装置において、前記第1の透光性部材の上面が凹曲面形状に窪んで傾斜しており、前記穴部の傾斜角が前記第1の透光性部材の上面の傾斜角よりも大きく、前記第1の透光性部材は前記発光素子よりも屈折率が小さく、かつ、前記第2の透光性部材は前記第1の透光性部材よりも屈折率が小さいことを特徴とする発光装置。
- 前記穴部の上方であって間に空気層を介して、前記発光素子からの光を波長変換する第1の蛍光体層を形成したことを特徴とする請求項1に記載の発光装置。
- 前記光反射面に、前記発光素子からの光を波長変換する第2の蛍光体層を形成したことを特徴とする請求項1または請求項2に記載の発光装置。
- 請求項1乃至請求項3のいずれかに記載の発光装置を光源として用いたことを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081462A JP5085851B2 (ja) | 2005-03-22 | 2005-03-22 | 発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081462A JP5085851B2 (ja) | 2005-03-22 | 2005-03-22 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269487A JP2006269487A (ja) | 2006-10-05 |
JP5085851B2 true JP5085851B2 (ja) | 2012-11-28 |
Family
ID=37205172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005081462A Expired - Fee Related JP5085851B2 (ja) | 2005-03-22 | 2005-03-22 | 発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5085851B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100993317B1 (ko) * | 2008-08-26 | 2010-11-09 | 삼성전기주식회사 | 발광 다이오드 패키지의 렌즈 제조방법 |
JP2013062393A (ja) | 2011-09-14 | 2013-04-04 | Sharp Corp | 発光装置 |
JP5312556B2 (ja) * | 2011-11-07 | 2013-10-09 | 京セラ株式会社 | 発光装置および照明装置 |
EP3095142B1 (en) * | 2013-12-19 | 2020-10-07 | Lumileds Holding B.V. | Led module with uniform phosphor illumination |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1441395B9 (de) * | 1996-06-26 | 2012-08-15 | OSRAM Opto Semiconductors GmbH | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
JP2002094129A (ja) * | 1999-11-30 | 2002-03-29 | Omron Corp | 光学装置及び当該光学装置を用いた機器 |
JP2002134793A (ja) * | 2000-10-26 | 2002-05-10 | Omron Corp | 光素子用光学デバイス |
JP2002299692A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 反射型led光源 |
JP3707688B2 (ja) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
-
2005
- 2005-03-22 JP JP2005081462A patent/JP5085851B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2006269487A (ja) | 2006-10-05 |
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