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JP5085624B2 - Light emitting diode - Google Patents

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JP5085624B2
JP5085624B2 JP2009225703A JP2009225703A JP5085624B2 JP 5085624 B2 JP5085624 B2 JP 5085624B2 JP 2009225703 A JP2009225703 A JP 2009225703A JP 2009225703 A JP2009225703 A JP 2009225703A JP 5085624 B2 JP5085624 B2 JP 5085624B2
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led chip
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phosphor
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JP2010135753A (en
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俊男 嶋田
彰人 雷久保
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Okaya Electric Industry Co Ltd
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Description

この発明は、発光ダイオードチップ(LEDチップ)と蛍光体を担持した不織布を備えた発光ダイオード(LED)に係り、特に、所定色の可視光を発光するLEDチップを枠部材で囲繞すると共に、該枠部材上に蛍光体を担持した不織布を載置することにより、LEDチップの上方に、蛍光体を担持した不織布を配置し、LEDチップから放射される可視光と蛍光体から放射される可視光とを混色させた可視光(以下、混色可視光と称する)を得る発光ダイオードに関する。
例えば、青色可視光を発光するLEDチップを枠部材で囲繞すると共に、該枠部材上に蛍光体を担持した不織布を載置することにより、LEDチップの上方に、蛍光体を担持した不織布を配置し、LEDチップから放射される青色可視光と蛍光体から放射される可視光との混色により白色光を得る発光ダイオードに関する。
The present invention relates to a light emitting diode (LED) including a light emitting diode chip (LED chip) and a nonwoven fabric carrying a phosphor, and in particular, surrounds an LED chip that emits visible light of a predetermined color with a frame member, By placing the nonwoven fabric carrying the phosphor on the frame member, the nonwoven fabric carrying the phosphor is placed above the LED chip, and visible light emitted from the LED chip and visible light emitted from the phosphor are arranged. The present invention relates to a light emitting diode that obtains visible light (hereinafter referred to as mixed color visible light).
For example, an LED chip that emits blue visible light is surrounded by a frame member, and a non-woven fabric carrying a phosphor is disposed above the LED chip by placing a non-woven fabric carrying a phosphor on the frame member. The present invention also relates to a light emitting diode that obtains white light by mixing color of blue visible light emitted from an LED chip and visible light emitted from a phosphor.

LEDチップと蛍光体を担持した不織布を備えたLEDとして、本出願人は先に、特開2006−60099号を提案した。このLEDは、LEDチップ上に蛍光体を担持させた不織布を配置した構造である。
そして、LEDチップの上方に、蛍光体を担持した上記不織布を配置すると共に、白色光を得ることのできるLEDとして、例えば、図8に示す構造のLED60がある。
As an LED including a nonwoven fabric carrying an LED chip and a phosphor, the present applicant has previously proposed Japanese Patent Application Laid-Open No. 2006-60099. This LED has a structure in which a non-woven fabric carrying a phosphor is placed on an LED chip.
And as LED which can obtain white light while arrange | positioning the said nonwoven fabric which carry | supported the fluorescent substance above LED chip, there exists LED60 of the structure shown in FIG. 8, for example.

すなわち、図8のLED60は、絶縁材料より成る基板62と、該基板62の表面から側面を経て裏面にまで延設された一対の外部電極64a,64bを備えており、基板62表面の一方の外部電極64a上に、青色可視光を発光するLEDチップ66ダイボンドすることにより、外部電極64aとLEDチップ66底面の一方の電極(図示せず)とを電気的に接続している。また、LEDチップ66上面の他方の電極(図示せず)と他方の外部電極64bとをボンディングワイヤ68を介して電気的に接続して成る。   That is, the LED 60 of FIG. 8 includes a substrate 62 made of an insulating material and a pair of external electrodes 64a and 64b extending from the surface of the substrate 62 to the back surface through the side surfaces. The LED chip 66 that emits blue visible light is die-bonded on the external electrode 64a, so that the external electrode 64a and one electrode (not shown) on the bottom surface of the LED chip 66 are electrically connected. Further, the other electrode (not shown) on the upper surface of the LED chip 66 is electrically connected to the other external electrode 64b through a bonding wire 68.

上記LEDチップ66は、基板62上に配置された所定高さを備えた枠部材70で囲繞されると共に、該枠部材70内に充填した透光性樹脂72で封止されている。
また、上記枠部材70上に、黄色発光用の蛍光体76を担持したシート状の不織布78の周縁部78aを載置することにより、LEDチップ66の上方に、蛍光体76を担持した不織布78を配置している。このように、LEDチップ66を囲繞する枠部材70上に不織布78を載置したので、LEDチップ66の上方に安定した状態で不織布78を配置することができる。
The LED chip 66 is surrounded by a frame member 70 provided on the substrate 62 and having a predetermined height, and is sealed with a translucent resin 72 filled in the frame member 70.
Further, by placing a peripheral portion 78a of a sheet-like nonwoven fabric 78 carrying a phosphor 76 for emitting yellow light on the frame member 70, a nonwoven fabric 78 carrying the phosphor 76 is placed above the LED chip 66. Is arranged. In this way, since the nonwoven fabric 78 is placed on the frame member 70 surrounding the LED chip 66, the nonwoven fabric 78 can be stably disposed above the LED chip 66.

上記不織布78は、図9乃至図11に示すように、多数の繊維80が絡み合ってシート状と成され、繊維80間には多数の空隙82(図11参照)が形成されており、また、多数の繊維80が立体的に絡み合っているため、単位体積当たりの繊維80の表面積が極めて大きいものである。
蛍光体76は、LEDチップ66から放射される光を黄色可視光に波長変換して放射するものであり、上記不織布78を構成する繊維80の表面に被着・担持されている。
As shown in FIGS. 9 to 11, the non-woven fabric 78 is formed into a sheet shape in which a large number of fibers 80 are intertwined, and a large number of voids 82 (see FIG. 11) are formed between the fibers 80. Since many fibers 80 are entangled three-dimensionally, the surface area of the fibers 80 per unit volume is extremely large.
The phosphor 76 emits light emitted from the LED chip 66 by converting the wavelength of the light into yellow visible light, and is attached to and supported on the surface of the fiber 80 constituting the nonwoven fabric 78.

尚、上記枠部材70の上端開口は、樹脂等より成る透光板84によって閉塞されている。   The upper end opening of the frame member 70 is closed by a translucent plate 84 made of resin or the like.

而して、一対の外部電極64a,64bを介してLEDチップ66に電圧が印加されると、LEDチップ66が発光して青色可視光及び紫外光が放射される。また、LEDチップ66の発光が不織布78に担持された蛍光体76に照射されることにより、蛍光体76から黄色可視光が放射される。そして、LEDチップ66から放射された青色可視光と、蛍光体76から放射された黄色可視光とが混色することにより白色光が得られるのである。
特開2006−60099
Thus, when a voltage is applied to the LED chip 66 through the pair of external electrodes 64a and 64b, the LED chip 66 emits light, and blue visible light and ultraviolet light are emitted. Further, the phosphor 76 supported on the nonwoven fabric 78 is irradiated with the light emitted from the LED chip 66, whereby yellow visible light is emitted from the phosphor 76. The blue visible light emitted from the LED chip 66 and the yellow visible light emitted from the phosphor 76 are mixed to obtain white light.
JP 2006-60099 A

上記LED60は、LEDチップ66を囲繞する枠部材70上に不織布78を載置したので、上記の通り、LEDチップ66の上方に安定した状態で不織布78を配置することができる利点を有するものの、LEDチップ66の光が枠部材70で遮られるため、該枠部材70上に載置された不織布78の周縁部78aには、LEDチップ66の発光が殆ど照射されなかった。このため、不織布78の周縁部78aに担持された蛍光体76から放射される黄色可視光とLEDチップ66から放射された青色可視光とが混色せず、不織布78の周縁部78aの蛍光体76から放射された黄色可視光がそのまま外部へ放射される事態を生じていた。   Since the LED 60 has the nonwoven fabric 78 placed on the frame member 70 surrounding the LED chip 66, as described above, the LED 60 has the advantage that the nonwoven fabric 78 can be disposed in a stable state, Since the light from the LED chip 66 is blocked by the frame member 70, the peripheral edge 78a of the nonwoven fabric 78 placed on the frame member 70 is hardly irradiated with light emitted from the LED chip 66. For this reason, the yellow visible light emitted from the phosphor 76 carried on the peripheral edge 78a of the nonwoven fabric 78 and the blue visible light emitted from the LED chip 66 are not mixed, and the phosphor 76 on the peripheral edge 78a of the nonwoven fabric 78 is not mixed. The yellow visible light radiated from was radiated to the outside as it was.

この場合、枠部材70を透明材料や透光材料で構成することが考えられるが、枠部材70を透明材料や透光材料で構成した場合には、LEDチップ66の青色可視光が枠部材70を透過してLED60外部へ放射される事態を生じることとなる。   In this case, it is conceivable that the frame member 70 is made of a transparent material or a translucent material. However, when the frame member 70 is made of a transparent material or a translucent material, the blue visible light of the LED chip 66 is transmitted to the frame member 70. Will be transmitted to the outside of the LED 60.

本発明は、上記問題を解決するためになされたものであり、その目的は、所定色の可視光を発光するLEDチップを枠部材で囲繞すると共に、該枠部材上に蛍光体を担持した不織布を載置することにより、LEDチップの上方に、蛍光体を担持した不織布を配置して成り、LEDチップから放射される可視光と蛍光体から放射される可視光との混色可視光を得る構造の発光ダイオードにおいて、発光ダイオード外部へ混色可視光以外の可視光が放射されることを防止できる発光ダイオードを実現することにある。
例えば、青色可視光を発光するLEDチップを枠部材で囲繞すると共に、該枠部材上に蛍光体を担持した不織布を載置することにより、LEDチップの上方に、蛍光体を担持した不織布を配置して成り、LEDチップから放射される青色可視光と蛍光体から放射される可視光との混色により白色光を得る構造の発光ダイオードにおいては、発光ダイオード外部へ白色光以外の可視光が放射されることを防止できる発光ダイオードを実現することにある。
The present invention has been made to solve the above-mentioned problems, and its object is to surround an LED chip that emits visible light of a predetermined color with a frame member and to carry a phosphor on the frame member. By placing a non-woven fabric carrying a phosphor above the LED chip, a structure that obtains mixed color visible light of visible light emitted from the LED chip and visible light emitted from the phosphor is obtained. It is an object of the present invention to provide a light emitting diode that can prevent visible light other than mixed color visible light from being emitted outside the light emitting diode.
For example, an LED chip that emits blue visible light is surrounded by a frame member, and a non-woven fabric carrying a phosphor is disposed above the LED chip by placing a non-woven fabric carrying a phosphor on the frame member. In a light emitting diode having a structure that obtains white light by mixing blue visible light emitted from an LED chip and visible light emitted from a phosphor, visible light other than white light is emitted outside the light emitting diode. An object of the present invention is to realize a light-emitting diode that can prevent this.

上記の目的を達成するため、本発明の請求項1に記載の発光ダイオードは、
所定色の可視光を放射するLEDチップと、屈折率が空気より大きい材料より成る透光性の結合剤が含浸されると共に蛍光体を担持した不織布を有し、上記LEDチップから放射される所定色の可視光と、上記蛍光体から放射される可視光とを混色させた混色可視光を得る発光ダイオードであって、
上記LEDチップを非透光性の第1の枠部材で囲繞すると共に、上記第1の枠部材上に、上記不織布の周縁部を載置することにより、LEDチップの上方に不織布を配置して成り、
また、上記LEDチップを囲繞する非透光性の第2の枠部材の内方端部を上記不織布上に配置すると共に、第2の枠部材の内方端部を、上記第1の枠部材の内方端部の先端から内方側へ突出させて成り、該第2の枠部材の内方端部の突出距離Lを、
L≧t・tanθ、θ=sin−1(1/n
[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]
の式を満たすように設定したことを特徴とする。
In order to achieve the above object, a light-emitting diode according to claim 1 of the present invention is provided.
An LED chip that emits visible light of a predetermined color and a non-woven fabric that is impregnated with a light-transmitting binder made of a material having a refractive index larger than that of air and carries a phosphor, and is emitted from the LED chip A light-emitting diode that obtains mixed color visible light obtained by mixing color visible light and visible light emitted from the phosphor,
The LED chip is surrounded by a non-translucent first frame member, and the non-woven fabric is disposed above the LED chip by placing the peripheral edge of the non-woven fabric on the first frame member. Consisting of
Further, the inner end portion of the non-translucent second frame member surrounding the LED chip is disposed on the nonwoven fabric, and the inner end portion of the second frame member is disposed on the first frame member. Projecting inward from the tip of the inner end of the second frame member, the projecting distance L of the inner end of the second frame member,
L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
[Where t is the thickness of the nonwoven fabric, n 1 is the refractive index of the binder, and θ 1 is the critical angle of light emitted from the binder into the air]
It is set to satisfy the formula of

また、本発明の請求項2に記載の発光ダイオードは、
青色可視光を放射するLEDチップと、屈折率が空気より大きい材料より成る透光性の結合剤が含浸されると共に蛍光体を担持した不織布を有し、上記LEDチップから放射される青色可視光と、上記蛍光体から放射される可視光との混色により白色光を得る発光ダイオードであって、
上記LEDチップを非透光性の第1の枠部材で囲繞すると共に、上記第1の枠部材上に、上記不織布の周縁部を載置することにより、LEDチップの上方に不織布を配置して成り、
また、上記LEDチップを囲繞する非透光性の第2の枠部材の内方端部を上記不織布上に配置すると共に、第2の枠部材の内方端部を、上記第1の枠部材の内方端部の先端から内方側へ突出させて成り、該第2の枠部材の内方端部の突出距離Lを、
L≧t・tanθ、θ=sin−1(1/n
[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]
の式を満たすように設定したことを特徴とする。
The light-emitting diode according to claim 2 of the present invention is
Blue visible light emitted from the LED chip, which has a LED chip that emits blue visible light, and a non-woven fabric that is impregnated with a translucent binder made of a material having a refractive index greater than that of air and carries a phosphor. And a light emitting diode that obtains white light by color mixing with visible light emitted from the phosphor,
The LED chip is surrounded by a non-translucent first frame member, and the non-woven fabric is disposed above the LED chip by placing the peripheral edge of the non-woven fabric on the first frame member. Consists of
Further, the inner end portion of the non-translucent second frame member surrounding the LED chip is disposed on the nonwoven fabric, and the inner end portion of the second frame member is disposed on the first frame member. Projecting inward from the tip of the inner end of the second frame member, the projecting distance L of the inner end of the second frame member,
L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
[Where t is the thickness of the nonwoven fabric, n 1 is the refractive index of the binder, and θ 1 is the critical angle of light emitted from the binder into the air]
It is set to satisfy the formula of

請求項3に記載の発光ダイオードは、請求項2に記載の発光ダイオードにおいて、上記第1の枠部材及び第2の枠部材を白色と成したことを特徴とする。   A light-emitting diode according to a third aspect is the light-emitting diode according to the second aspect, wherein the first frame member and the second frame member are white.

請求項4に記載の発光ダイオードは、請求項1乃至3に記載の発光ダイオードにおいて、上記第2の枠部材の内方端部に、上方に向かって拡開する傾斜面を形成したことを特徴とする。   The light-emitting diode according to claim 4 is the light-emitting diode according to claim 1, wherein an inclined surface that expands upward is formed at an inner end portion of the second frame member. And

本発明の請求項1に記載の発光ダイオードにあっては、第2の枠部材の内方端部を不織布上に配置すると共に、第2の枠部材の内方端部を、第1の枠部材の内方端部の先端から内方側へ突出させて成り、突出距離Lが、L≧t・tanθ、θ=sin−1(1/n)[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]の式を満たすように設定したので、不織布の周縁部の蛍光体から放射され、LEDチップの所定色の可視光と混色しない可視光が不織布外部へ出射することを防止できる。 In the light emitting diode according to claim 1 of the present invention, the inner end portion of the second frame member is disposed on the nonwoven fabric, and the inner end portion of the second frame member is disposed on the first frame. Projecting distance L is L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 ) [where t is the thickness of the nonwoven fabric. N 1 is the refractive index of the binder, and θ 1 is set to satisfy the equation of the critical angle of light emitted from the binder into the air]. Visible light that is not mixed with visible light of a predetermined color of the chip can be prevented from being emitted to the outside of the nonwoven fabric.

また、本発明の請求項2に記載の発光ダイオードにあっては、第2の枠部材の内方端部を不織布上に配置すると共に、第2の枠部材の内方端部を、第1の枠部材の内方端部の先端から内方側へ突出させて成り、突出距離Lが、L≧t・tanθ、θ=sin−1(1/n)[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]の式を満たすように設定したので、不織布の周縁部の蛍光体から放射され、LEDチップの青色可視光と混色しない可視光が不織布外部へ出射することを防止できる。 In the light-emitting diode according to claim 2 of the present invention, the inner end of the second frame member is disposed on the nonwoven fabric, and the inner end of the second frame member is The projecting distance L is L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 ) [where t is a non-woven fabric. N 1 is the refractive index of the binder, and θ 1 is the critical angle of light emitted from the binder into the air], so that it is emitted from the phosphor at the periphery of the nonwoven fabric. The visible light which is not mixed with the blue visible light of the LED chip can be prevented from being emitted to the outside of the nonwoven fabric.

請求項2に記載の発光ダイオードにおいて、第1の枠部材及び第2の枠部材を白色と成した場合には、白色光の吸収を防止して効率よく反射させることができる。   In the light emitting diode according to claim 2, when the first frame member and the second frame member are white, absorption of white light can be prevented and the light can be efficiently reflected.

請求項1乃至3に記載の発光ダイオードにおいて、第2の枠部材の内方端部に、上方に向かって拡開する傾斜面を形成した場合には、混色可視光(白色光)を効率良く上方に向かって反射できる。   4. The light emitting diode according to claim 1, wherein when an inclined surface that expands upward is formed at the inner end of the second frame member, the mixed color visible light (white light) is efficiently generated. It can be reflected upward.

以下、図面に基づき、本発明に係る発光ダイオードの実施形態を説明する。
図1に示すように、本発明に係るLED10は、樹脂やセラミック等の絶縁材料より成る基板12と、該基板12の表面から側面を経て裏面にまで延設された一対の外部電極14a,14bを備えており、基板12表面の一方の外部電極14a上に、青色可視光を発光するLEDチップ16ダイボンドすることにより、外部電極14aとLEDチップ16底面の一方の電極(図示せず)とを電気的に接続している。また、LEDチップ16上面の他方の電極(図示せず)と他方の外部電極14bとをボンディングワイヤ18を介して電気的に接続して成る。
上記LEDチップ16は、例えば、窒化ガリウム系半導体結晶で構成されており、電圧が印加されると、後述する蛍光体を励起する光を発光するものである。
Hereinafter, an embodiment of a light emitting diode according to the present invention will be described with reference to the drawings.
As shown in FIG. 1, an LED 10 according to the present invention includes a substrate 12 made of an insulating material such as resin or ceramic, and a pair of external electrodes 14a and 14b extending from the surface of the substrate 12 to the back surface through side surfaces. The LED chip 16 that emits blue visible light is die-bonded on one external electrode 14a on the surface of the substrate 12, thereby connecting the external electrode 14a and one electrode (not shown) on the bottom surface of the LED chip 16 to each other. Electrically connected. Further, the other electrode (not shown) on the upper surface of the LED chip 16 is electrically connected to the other external electrode 14b through a bonding wire 18.
The LED chip 16 is made of, for example, a gallium nitride-based semiconductor crystal, and emits light that excites a phosphor described later when a voltage is applied.

LEDチップ16は、基板12上に配置された所定高さを備えた環状の第1の枠部材20で囲繞されると共に、該第1の枠部材20内に充填したシリコン樹脂等より成る透光性のコーティング材22で封止されている。第1の枠部材20は非透光性と成されており、白色光の吸収を防止して効率よく反射させるため、白色と成すのが適当である。   The LED chip 16 is surrounded by an annular first frame member 20 having a predetermined height and disposed on the substrate 12, and a light transmitting material made of silicon resin or the like filled in the first frame member 20. It is sealed with a conductive coating material 22. The first frame member 20 is non-translucent, and it is appropriate that the first frame member 20 be white in order to prevent white light from being absorbed and efficiently reflect the light.

また、上記第1の枠部材20上、より具体的には、LEDチップ16側に位置する第1の枠部材20の内方端部20a上に、結合剤32が含浸されると共にYAG蛍光体等の黄色発光用の蛍光体24を担持したシート状の不織布26の周縁部26aを載置することにより、LEDチップ16の上方に、蛍光体24を担持した不織布26を配置している。LEDチップ16を囲繞する第1の枠部材20上に不織布26を載置することにより、LEDチップ16の上方に安定した状態で不織布26を配置できる。   Further, the binder 32 is impregnated on the first frame member 20, more specifically, the inner end portion 20 a of the first frame member 20 located on the LED chip 16 side, and the YAG phosphor. The non-woven fabric 26 carrying the phosphor 24 is disposed above the LED chip 16 by placing the peripheral edge portion 26a of the sheet-like non-woven fabric 26 carrying the yellow light emitting phosphor 24 such as the above. By placing the nonwoven fabric 26 on the first frame member 20 surrounding the LED chip 16, the nonwoven fabric 26 can be disposed in a stable state above the LED chip 16.

上記不織布26は、図2乃至図5に示すように、多数の繊維28が絡み合ってシート状と成され、繊維28間に多数の空隙30(図4参照)が形成されており、また、多数の繊維28が立体的に絡み合っているため、単位体積当たりの繊維28の表面積が極めて大きいものである。
尚、上記繊維28の繊維密度や、不織布の厚さ、目付等を適宜調整することにより、不織布を構成する繊維28の総表面積を任意に増減可能である。
As shown in FIGS. 2 to 5, the non-woven fabric 26 is formed into a sheet shape in which a large number of fibers 28 are intertwined, and a large number of voids 30 (see FIG. 4) are formed between the fibers 28. Since the fibers 28 are intertwined in three dimensions, the surface area of the fibers 28 per unit volume is extremely large.
The total surface area of the fibers 28 constituting the nonwoven fabric can be arbitrarily increased or decreased by appropriately adjusting the fiber density of the fibers 28, the thickness of the nonwoven fabric, the basis weight, and the like.

また、上記不織布26には、蛍光体24を分散・添加した透光性の結合剤32を含浸することにより、不織布26を構成する繊維28の表面に、結合剤32を介して蛍光体24を被着・担持させると共に、繊維28間の空隙30に、蛍光体24が添加された結合剤32を充填させて成る。
図4に示すように、繊維28間の全ての空隙30に結合剤32が充填されている。
また、図5に示すように、繊維28の表面に被着される蛍光体24の量は、空隙30に充填された結合剤32中の蛍光体24の量よりも多くなっており、さらに、空隙30に充填された結合剤32中の蛍光体24の分布状態は、繊維28に近づくに従って蛍光体24の量が多くなっている。
Further, the non-woven fabric 26 is impregnated with a translucent binder 32 in which the phosphor 24 is dispersed and added, so that the phosphor 24 is put on the surface of the fibers 28 constituting the non-woven fabric 26 via the binder 32. At the same time, the gap 30 between the fibers 28 is filled with a binder 32 to which a phosphor 24 is added.
As shown in FIG. 4, all the gaps 30 between the fibers 28 are filled with a binder 32.
Further, as shown in FIG. 5, the amount of the phosphor 24 deposited on the surface of the fiber 28 is larger than the amount of the phosphor 24 in the binder 32 filled in the gap 30, In the distribution state of the phosphors 24 in the binder 32 filled in the gaps 30, the amount of the phosphors 24 increases as the fiber 28 is approached.

上記透光性の結合剤32は、屈折率が空気より大きい材料で構成され、例えば、シリコン樹脂等の有機材料、ゾルゲルガラス等の無機材料を使用することができる。   The translucent binder 32 is made of a material having a refractive index larger than that of air, and for example, an organic material such as silicon resin or an inorganic material such as sol-gel glass can be used.

上記蛍光体24は、LEDチップ16から発光される光の照射を受けると、この光を黄色可視光に波長変換して放射するものであり、例えば、(Y,Gd)Al12:Ce、YAl12:Ce等のYAG蛍光体を用いることができる。 When the phosphor 24 is irradiated with light emitted from the LED chip 16, the phosphor 24 radiates the light by converting the wavelength into yellow visible light. For example, (Y, Gd) 3 Al 5 O 12 : A YAG phosphor such as Ce, Y 3 Al 5 O 12 : Ce can be used.

上記繊維28は、ナイロン、ポリエステル、アクリル、ポリプロピレン等の樹脂繊維、レーヨン等のセルロース系の化学繊維、ガラス繊維、金属繊維等の短繊維から成り、その直径は5〜20μm、長さは0.5〜20mm程度であるが、長さが50〜100mm程度の長繊維から成る繊維28を用いることも勿論可能である。
尚、光の透過性の観点から、透光性材料で繊維28を構成するのが好ましい。
The fibers 28 are made of resin fibers such as nylon, polyester, acrylic and polypropylene, cellulosic chemical fibers such as rayon, short fibers such as glass fibers and metal fibers, and the diameter is 5 to 20 μm and the length is 0.00. Of course, it is possible to use fibers 28 made of long fibers having a length of about 5 to 20 mm, but a length of about 50 to 100 mm.
From the viewpoint of light transmittance, it is preferable that the fiber 28 is made of a light transmissive material.

上記不織布26に蛍光体24を担持させる方法の一例として以下の方法を用いることができる。
先ず、所定長さのシート状の不織布26を準備すると共に、粒子状の蛍光体24が分散・添加された液状の結合剤32を液槽(図示せず)内に満たしておく。
The following method can be used as an example of a method for supporting the phosphor 24 on the non-woven fabric 26.
First, a sheet-like nonwoven fabric 26 having a predetermined length is prepared, and a liquid binder 32 in which particulate phosphors 24 are dispersed and added is filled in a liquid tank (not shown).

次に、上記不織布26を、液槽内の結合剤32中に浸漬した状態で真空雰囲気中に導入して脱気処理を行うことにより、繊維28間の空隙30内の空気と結合剤32とを置換させる。
この結果、不織布26を構成する繊維28間の全ての空隙30に、蛍光体24が添加された結合剤32が充填される。
尚、結合剤32に分散・添加された蛍光体24は、液状の結合剤32中で移動するが、固体である繊維28に衝突して移動が妨げられる結果、上記の通り、繊維28表面に被着される蛍光体24の量は、空隙30に充填された結合剤32中の蛍光体24の量よりも多くなり、さらに、空隙30に充填された結合剤32中の蛍光体24の分布状態は、繊維28に近づくに従って蛍光体24の量が多くなる。
Next, the nonwoven fabric 26 is introduced into a vacuum atmosphere in a state of being immersed in the binder 32 in the liquid tank and subjected to a deaeration treatment, whereby the air in the gap 30 between the fibers 28 and the binder 32 Is replaced.
As a result, all the gaps 30 between the fibers 28 constituting the nonwoven fabric 26 are filled with the binder 32 to which the phosphor 24 is added.
The phosphor 24 dispersed and added to the binder 32 moves in the liquid binder 32, but as a result of colliding with the solid fiber 28 and being prevented from moving, as described above, The amount of the phosphor 24 to be deposited is larger than the amount of the phosphor 24 in the binder 32 filled in the gap 30, and the distribution of the phosphor 24 in the binder 32 filled in the gap 30 is further increased. In the state, the amount of the phosphor 24 increases as the fiber 28 is approached.

その後、不織布26を所定温度で所定時間加熱して、液状の結合剤32を固化させれば良い。
例えば、結合剤32が熱硬化性樹脂であるシリコン樹脂の場合には、80〜150℃で2〜4時間加熱する。
また、結合剤32が液状のゾルゲルガラス材料の場合には、80〜120℃で0.5〜1時間加熱することにより、ゾルゲルガラス材料を加水分解、重合反応させて固体であるゾルゲルガラスを形成する。
上記ゾルゲルガラスは、金属アルコキシドや金属アセチルアセトネート、金属カルボキシレート等の金属有機化合物を出発物質として、その加水分解、重合反応を利用して合成されるものであり、溶液状態から出発するため、任意の形状のガラスに成形容易である。
上記ゾルゲルガラス材料は、一般式M(OR)n(M:金属元素、R:アルキル基、n:金属の酸化数)の金属有機化合物、水(加水分解のため)、溶媒としてメタノール、DMF(ヂメチルフォルムアミド)、加水分解・重合反応の調整剤としてアンモニアで構成することができ、このゾルゲルガラス材料を加水分解、重合反応させることにより、ゲル化し、硬いガラス状の無機質膜形成が生じてゾルゲルガラスが形成されるのである。
Thereafter, the nonwoven fabric 26 may be heated at a predetermined temperature for a predetermined time to solidify the liquid binder 32.
For example, when the binder 32 is a silicon resin that is a thermosetting resin, the binder 32 is heated at 80 to 150 ° C. for 2 to 4 hours.
When the binder 32 is a liquid sol-gel glass material, it is heated at 80 to 120 ° C. for 0.5 to 1 hour to hydrolyze and polymerize the sol-gel glass material to form a solid sol-gel glass. To do.
The sol-gel glass is synthesized using a metal organic compound such as metal alkoxide, metal acetylacetonate, or metal carboxylate as a starting material, and its hydrolysis and polymerization reaction. It is easy to mold into glass of any shape.
The sol-gel glass material includes a metal organic compound of the general formula M (OR) n (M: metal element, R: alkyl group, n: metal oxidation number), water (for hydrolysis), methanol as a solvent, DMF ( Dimethylformamide), which can be composed of ammonia as a regulator of hydrolysis / polymerization reaction. By hydrolyzing and polymerizing this sol-gel glass material, gelation occurs, resulting in the formation of a hard glassy inorganic film. A sol-gel glass is formed.

図1において、34は、LEDチップ16を囲繞する環状の第2の枠部材であり、この第2の枠部材34は、LEDチップ16側の内方端部34aが、不織布26上に配置されており、また、図6及び図7に示すように、第2の枠部材34の内方端部34aは、上記第1の枠部材20の内方端部20aの先端からLEDチップ16の在る内方側に向かって所定距離L突出して成る。この結果、第2の枠部材34の内方端部34aは、不織布26の周縁部26a上、及び、周縁部26aから上記突出距離Lに至るまでの不織布26上に配置されることとなる。
上記第2の枠部材34の内方端部34aには、上方に向かって拡開する傾斜面34bを形成することにより、白色光を効率良く上方に向かって反射できるようになっている。また、上記第2の枠部材34も、第1の枠部材20と同様に非透光性と成されており、白色光の吸収を防止して効率よく反射させるため、白色と成すのが適当である。
In FIG. 1, 34 is an annular second frame member that surrounds the LED chip 16, and the second frame member 34 has an inner end 34 a on the LED chip 16 side disposed on the nonwoven fabric 26. Further, as shown in FIGS. 6 and 7, the inner end 34a of the second frame member 34 extends from the tip of the inner end 20a of the first frame member 20 to the presence of the LED chip 16. And projecting a predetermined distance L toward the inward side. As a result, the inner end portion 34a of the second frame member 34 is disposed on the peripheral edge portion 26a of the nonwoven fabric 26 and on the nonwoven fabric 26 from the peripheral edge portion 26a to the protruding distance L.
An inclined surface 34b that expands upward is formed at the inner end 34a of the second frame member 34, so that white light can be efficiently reflected upward. Further, the second frame member 34 is also non-translucent like the first frame member 20, and it is appropriate that the second frame member 34 is white in order to prevent absorption of white light and reflect it efficiently. It is.

本発明のLED10は、上記第2の枠部材34の内方端部34aを、第1の枠部材20の内方端部20aの先端から内方側へ所定距離L突出させることにより、不織布26の周縁部26aの蛍光体24から放射された黄色可視光が不織布26外部へ出射することを防止できるよう構成したものである。   The LED 10 of the present invention has a non-woven fabric 26 by causing the inner end 34a of the second frame member 34 to protrude inward from the tip of the inner end 20a of the first frame member 20 by a predetermined distance L. The yellow visible light radiated from the phosphor 24 at the peripheral edge 26a is prevented from being emitted to the outside of the nonwoven fabric 26.

第1の枠部材20の内方端部20aの先端から突出する上記第2の枠部材34の内方端部34aの突出距離Lは、以下の如く設定される。
すなわち、図6に示すように、第1の枠部材20上に載置した不織布26の厚さをt、不織布26に含浸した結合剤32の屈折率をn、不織布26に含浸した結合剤32中から空気中へ出射する光の臨界角をθとしたとき、第2の枠部材34の内方端部34aの突出距離Lは、
L≧t・tanθ、θ=sin−1(1/n
の式を満たすように設定する。
The protruding distance L of the inner end portion 34a of the second frame member 34 protruding from the tip of the inner end portion 20a of the first frame member 20 is set as follows.
That is, as shown in FIG. 6, the thickness of the nonwoven fabric 26 placed on the first frame member 20 is t, the refractive index of the binder 32 impregnated in the nonwoven fabric 26 is n 1 , and the binder impregnated in the nonwoven fabric 26. When the critical angle of light emitted from the inside of the air 32 into the air is θ 1 , the protruding distance L of the inner end portion 34a of the second frame member 34 is:
L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
Set to satisfy

尚、ここで臨界角(θ)とは、不織布26に含浸した屈折率が大きい結合剤32の内部を進む光が、屈折率の小さい空気中へ進むときに全反射が起きる最も小さな入射角のことをいう。従って、入射角が臨界角(θ)以上となる場合には、不織布26に含浸した結合剤32と空気との境界面で光が全て反射(全反射)するため空気中に出ていく光がなくなるのである。
一方、入射角が臨界角(θ)未満の場合には、光が空気中に出射してしまうため、上記式を満たすように、第2の枠部材34の内方端部34aの突出距離Lを設定することにより、第1の枠部材20上に載置した不織布26の周縁部26aから出射する光を、第2の枠部材34で遮るようにしたのである。
Here, the critical angle (θ 1 ) is the smallest incident angle at which total reflection occurs when light traveling inside the binder 32 impregnated in the nonwoven fabric 26 has a large refractive index and travels into the air having a small refractive index. I mean. Therefore, when the incident angle is equal to or greater than the critical angle (θ 1 ), light is reflected in the boundary surface between the binder 32 impregnated in the nonwoven fabric 26 and the air, so that the light exits into the air. Is gone.
On the other hand, when the incident angle is less than the critical angle (θ 1 ), the light is emitted into the air, so that the protruding distance of the inner end portion 34a of the second frame member 34 satisfies the above formula. By setting L, the light emitted from the peripheral portion 26a of the nonwoven fabric 26 placed on the first frame member 20 is blocked by the second frame member 34.

例えば、第1の枠部材20上に載置した不織布26として厚さt=0.35mm、不織布26に含浸した結合剤32として屈折率n=1.42のシリコン樹脂を用いた場合を例に挙げて説明する。尚、小数点第3位以下は四捨五入とした。
θ=sin−1(1/n)の式より、
θ=sin−1(1/1.42)
=44.77°
L≧t・tanθの式より、
≧0.35・tan44.77°
≧0.35×0.99
≧0.35
以上の結果、第1の枠部材20の内方端部20aの先端から突出する上記第2の枠部材34の内方端部34aの突出距離Lは0.35mm以上と成される。
For example, a case where a silicon resin having a thickness t = 0.35 mm as the nonwoven fabric 26 placed on the first frame member 20 and a refractive index n 1 = 1.42 as the binder 32 impregnated in the nonwoven fabric 26 is used as an example. Will be described. The third decimal place is rounded off.
From the formula θ 1 = sin −1 (1 / n 1 ),
θ 1 = sin −1 (1 / 1.42)
= 44.77 °
From the equation L ≧ t · tan θ 1 ,
≧ 0.35 ・ tan44.77 °
≧ 0.35 × 0.99
≧ 0.35
As a result, the protruding distance L of the inner end portion 34a of the second frame member 34 protruding from the tip of the inner end portion 20a of the first frame member 20 is 0.35 mm or more.

また、第1の枠部材20上に載置した不織布26として厚さt=0.35mm、不織布26に含浸した結合剤32として屈折率n=1.49のアクリル樹脂を用いた場合を例に挙げて説明する。尚、小数点第3位以下は四捨五入とした。
θ=sin−1(1/n)の式より、
θ=sin−1(1/1.49)
=42.16°
L≧t・tanθの式より、
≧0.35・tan42.16°
≧0.35×0.91
≧0.32
以上の結果、第1の枠部材20の内方端部20aの先端から突出する上記第2の枠部材34の内方端部34aの突出距離Lは0.32mm以上と成される。
Further, an example in which an acrylic resin having a thickness t = 0.35 mm as the nonwoven fabric 26 placed on the first frame member 20 and a refractive index n 1 = 1.49 is used as the binder 32 impregnated in the nonwoven fabric 26 is used. Will be described. The third decimal place is rounded off.
From the formula θ 1 = sin −1 (1 / n 1 ),
θ 1 = sin −1 (1 / 1.49)
= 42.16 °
From the equation L ≧ t · tan θ 1 ,
≧ 0.35 · tan42.16 °
≧ 0.35 × 0.91
≧ 0.32
As a result, the protruding distance L of the inner end portion 34a of the second frame member 34 protruding from the tip of the inner end portion 20a of the first frame member 20 is 0.32 mm or more.

本発明の上記LED10は、一対の外部電極14a,14bを介してLEDチップ16に電圧が印加されると、LEDチップ16が発光して青色可視光及び紫外光が放射される。また、LEDチップ16の発光が不織布26に担持された蛍光体24に照射されることにより、蛍光体24から黄色可視光が放射される。そして、LEDチップ16から放射された青色可視光と、蛍光体24から放射された黄色可視光とが混色することにより白色光が得られるのである。   In the LED 10 of the present invention, when a voltage is applied to the LED chip 16 via a pair of external electrodes 14a and 14b, the LED chip 16 emits light and emits blue visible light and ultraviolet light. Further, yellow light is emitted from the phosphor 24 by irradiating the phosphor 24 carried on the nonwoven fabric 26 with the light emitted from the LED chip 16. The blue visible light emitted from the LED chip 16 and the yellow visible light emitted from the phosphor 24 are mixed to obtain white light.

尚、第1の枠部材20上に載置される不織布26の周縁部26aには、第1の枠部材20で遮られるためLEDチップ16の発光が殆ど照射されないので、不織布26の周縁部26aに担持された蛍光体24から放射される黄色可視光とLEDチップ16から放射される青色可視光とが混色せず、黄色可視光のままとなる。
而して、本発明のLED10にあっては、第2の枠部材34の内方端部34aを不織布26上に配置すると共に、第2の枠部材34の内方端部34aを、第1の枠部材20の内方端部20aの先端から内方側へ突出させて成り、突出距離Lが、L≧t・tanθ、θ=sin−1(1/n)[但し、tは不織布26の厚さ、nは結合剤32の屈折率、θは結合剤中から空気中へ出射する光の臨界角]の式を満たすように設定したので、不織布26の周縁部26aの蛍光体24から放射される黄色可視光が不織布26外部へ出射することを防止できる。
Since the peripheral edge 26a of the nonwoven fabric 26 placed on the first frame member 20 is blocked by the first frame member 20, light emitted from the LED chip 16 is hardly irradiated. The yellow visible light emitted from the phosphor 24 carried on the LED and the blue visible light emitted from the LED chip 16 are not mixed and remain yellow visible light.
Thus, in the LED 10 of the present invention, the inner end portion 34a of the second frame member 34 is disposed on the nonwoven fabric 26, and the inner end portion 34a of the second frame member 34 is disposed at the first end. Projecting inward from the tip of the inner end 20a of the frame member 20, and the projecting distance L is L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 ) [where t Is the thickness of the nonwoven fabric 26, n 1 is the refractive index of the binder 32, and θ 1 is the critical angle of light emitted from the binder into the air]. It is possible to prevent the yellow visible light emitted from the phosphor 24 from being emitted to the outside of the nonwoven fabric 26.

尚、第2の枠部材34の内方端部34aの突出距離Lが大きすぎると、LED10外部へ放射すべき白色光も相当量遮ってしまい輝度低下を招くことから、不織布26の周縁部26aから出射する黄色可視光を遮ると共に、白色光を遮ることがないようにするため、上記突出距離Lを、
L=t・tanθ、θ=sin−1(1/n
と設定するのが最も好ましいといえる。
If the protruding distance L of the inner end portion 34a of the second frame member 34 is too large, a considerable amount of white light to be radiated to the outside of the LED 10 is blocked, resulting in a decrease in luminance. In order to block yellow visible light emitted from the light source and not to block white light, the protrusion distance L is set to
L = t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
It can be said that the setting is most preferable.

上記において、LEDチップ16を封止している透光性のコーティング材22中にも黄色発光用の蛍光体24を混入しも良く、この場合、LED10の輝度向上を図ることができる。   In the above description, the phosphor 24 for yellow light emission may be mixed into the translucent coating material 22 sealing the LED chip 16, and in this case, the luminance of the LED 10 can be improved.

上記においては、不織布26に黄色発光用の蛍光体24を担持させた場合を例に挙げて説明したが、本発明はこれに限定されるものではなく、上記不織布26に緑色発光用の蛍光体と赤色発光用の蛍光体を担持させ、LEDチップ16から発光される青色可視光と、上記蛍光体から発光される緑色可視光及び赤色可視光とを混色させて白色光を得るLEDにも適用できる。
尚、LEDチップ16から発光される光を緑色可視光に波長変換して放射する蛍光体として、例えば、Y(Al,Ga)12:Ce、SrGa:Eu、CaScSi12:Ce、α−SiAlON:Eu、β−SiAlON:Eu等がある。
また、LEDチップ16から発光される光を赤色可視光に波長変換して放射する蛍光体として、例えば、(Sr,Ca)S:Eu、(Ca,Sr)Si:Eu、CaSiN:Eu、CaAlSiN:Eu等がある。
In the above, the case where the non-woven fabric 26 carries the phosphor 24 for emitting yellow light has been described as an example. However, the present invention is not limited to this, and the non-woven fabric 26 has a phosphor for emitting green light. And LED for red light emission, and also applicable to LEDs that obtain white light by mixing blue visible light emitted from the LED chip 16 with green visible light and red visible light emitted from the phosphor. it can.
For example, Y 3 (Al, Ga) 5 O 12 : Ce, SrGa 2 S 4 : Eu, Ca 3 Sc can be used as the phosphor that converts the wavelength of the light emitted from the LED chip 16 into green visible light. 2 Si 3 O 12 : Ce, α-SiAlON: Eu, β-SiAlON: Eu, and the like.
Further, as phosphors that radiate light emitted from the LED chip 16 by converting the wavelength into red visible light, for example, (Sr, Ca) S: Eu, (Ca, Sr) 2 Si 5 N 8 : Eu, CaSiN 2 : Eu, CaAlSiN 3 : Eu, etc.

また、上記においては、青色可視光を発光するLEDチップ16と、LEDチップ16から発光される光の照射を受けると、この光を黄色可視光に波長変換して放射する蛍光体24を用い、LEDチップ16の青色可視光と蛍光体24の黄色可視光とを混色させて白色光を得るLED10を例に挙げて説明したが、本発明はこれに限定されるものではない。
要するに、本発明は、上記LEDチップ16が所定色の可視光を発光するものであり、また、上記蛍光体24が、LEDチップ16の光を所定色の可視光に波長変換して放射するものであり、LEDチップ16から放射される可視光と蛍光体24から放射される可視光とを混色させた混色可視光を得る発光ダイオード10に適用可能である。
In addition, in the above, when the LED chip 16 that emits blue visible light and the light emitted from the LED chip 16 is irradiated, the phosphor 24 that converts the wavelength of the light into yellow visible light and emits the light is used. The LED 10 that obtains white light by mixing the blue visible light of the LED chip 16 and the yellow visible light of the phosphor 24 has been described as an example, but the present invention is not limited to this.
In short, the present invention is such that the LED chip 16 emits visible light of a predetermined color, and the phosphor 24 emits light of the LED chip 16 by converting the wavelength of the LED chip 16 into visible light of a predetermined color. The present invention is applicable to the light emitting diode 10 that obtains mixed color visible light obtained by mixing visible light emitted from the LED chip 16 and visible light emitted from the phosphor 24.

而して、本発明のLED10は、上記の通り、第2の枠部材34の内方端部34aを不織布26上に配置すると共に、第2の枠部材34の内方端部34aを、第1の枠部材20の内方端部20aの先端から内方側へ突出させて成り、突出距離Lが、L≧t・tanθ、θ=sin−1(1/n)[但し、tは不織布26の厚さ、nは結合剤32の屈折率、θは結合剤中から空気中へ出射する光の臨界角]の式を満たすように設定したことにより、LEDチップ16から放射される所定色の可視光と混色しない不織布26周縁部26aの蛍光体24から放射される所定色の可視光が、不織布26外部へ出射することを防止できるのである。 Thus, in the LED 10 of the present invention, as described above, the inner end 34a of the second frame member 34 is disposed on the nonwoven fabric 26, and the inner end 34a of the second frame member 34 is 1 is formed by projecting inward from the tip of the inner end portion 20a of the frame member 20, and the projecting distance L is L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 ) [where, t is the thickness of the nonwoven fabric 26, n 1 is the refractive index of the binder 32, and θ 1 is the critical angle of light emitted from the binder into the air]. It is possible to prevent the visible light of the predetermined color emitted from the phosphor 24 at the peripheral edge portion 26a of the nonwoven fabric 26 that does not mix with the emitted visible light of the predetermined color from being emitted to the outside of the nonwoven fabric 26.

尚、上記の通り、第2の枠部材34の内方端部34aの突出距離Lが大きすぎると、LED10外部へ放射すべき混色可視光も相当量遮ってしまい輝度低下を招くことから、不織布26の周縁部26aから出射する所定色の可視光を遮ると共に、混色可視光を遮ることがないようにするため、上記突出距離Lを、
L=t・tanθ、θ=sin−1(1/n
と設定するのが最も好ましい。
Note that, as described above, if the protruding distance L of the inner end portion 34a of the second frame member 34 is too large, the mixed color visible light to be radiated to the outside of the LED 10 is blocked by a considerable amount, resulting in a decrease in luminance. In order to block visible light of a predetermined color emitted from the peripheral edge portion 26a of 26 and not to block mixed color visible light, the protruding distance L is set as follows.
L = t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
It is most preferable to set.

上記で説明した青色可視光を発光するLEDチップ16と、LEDチップ16から発光された光を黄色可視光に波長変換して放射する蛍光体24を用いて混色可視光としての白色光を得る場合以外としては、例えば以下の場合がある。
先ず、青色可視光を発光するLEDチップ16と、LEDチップ16から発光された光を赤色可視光に波長変換して放射する赤色発光用の蛍光体24を用いる場合がある。この場合には、赤色可視光を放射する蛍光体24の量に応じて、青紫〜紫〜赤紫〜桃色の混色可視光が得られる。
尚、赤色発光用の蛍光体24としては、MS:Eu(Mは、La、Gd、Yの何れか1種)、0.5MgF・3.5MgO・GeO:Mn、2MgO・2LiO・Sb:Mn、Y(P,V)O4:Eu、YVO4:Eu、(SrMg)3(PO4):Sn、Y:Eu、CaSiO:Pb,Mn、、(Sr,Ca)S:Eu、(Ca,Sr)Si:Eu、CaSiN:Eu、CaAlSiN:Eu等がある。
When obtaining white light as mixed-colored visible light using the LED chip 16 that emits blue visible light described above and the phosphor 24 that emits the light emitted from the LED chip 16 by converting the wavelength of the light emitted from the LED chip 16 into yellow visible light. There are the following cases, for example.
First, there may be used an LED chip 16 that emits blue visible light and a red light emitting phosphor 24 that radiates light emitted from the LED chip 16 by converting the wavelength of the light into red visible light. In this case, a mixed color visible light of bluish purple to purple to reddish purple to pink is obtained according to the amount of the phosphor 24 that emits red visible light.
In addition, as the phosphor 24 for red light emission, M 2 O 2 S: Eu (M is any one of La, Gd, and Y), 0.5 MgF 2 .3.5MgO.GeO 2 : Mn, 2MgO · 2LiO 2 · Sb 2 O 3 : Mn, Y (P, V) O 4 : Eu, YVO 4 : Eu, (SrMg) 3 (PO 4 ): Sn, Y 2 O 3 : Eu, CaSiO 3 : Pb, Mn, , (Sr, Ca) S: Eu, (Ca, Sr) 2 Si 5 N 8: Eu, CaSiN 2: Eu, CaAlSiN 3: there is Eu and the like.

また、青色可視光を発光するLEDチップ16と、LEDチップ16から発光された光を緑色可視光に波長変換して放射する緑色発光用の蛍光体24を用いる場合がある。この場合には、青緑の混色可視光が得られ、蛍光体の量に応じて、その濃淡が変化する。
尚、緑色発光用の蛍光体24としては、BaMgAl1627:Eu,Mn、ZnSiO4:Mn、(Ce,Tb,Mn)MgAl1119、LaPO4:Ce,Tb、(Ce,Tb)MgAl1119、YSiO:Ce,Tb、ZnS:Cu,Al、ZnS:Cu,Au,Al、(Zn,Cd)S:Cu,Al、SrAl:Eu、SrAl:Eu,Dy、SrAl1425:Eu,Dy、YAl12:Tb、Y(Al,Ga)12:Tb、YAl12:Ce、Y(Al,Ga)12:Ce、SrGa:Eu、CaScSi12:Ce、α−SiAlON:Eu、β−SiAlON:Eu等がある
In some cases, an LED chip 16 that emits blue visible light and a green light-emitting phosphor 24 that converts the wavelength of the light emitted from the LED chip 16 into green visible light and emits it. In this case, blue-green mixed-color visible light is obtained, and the lightness and darkness changes according to the amount of phosphor.
As the phosphor 24 for green light emission, BaMg 2 Al 16 O 27 : Eu, Mn, Zn 2 SiO 4 : Mn, (Ce, Tb, Mn) MgAl 11 O 19 , LaPO 4 : Ce, Tb, ( Ce, Tb) MgAl 11 O 19 , Y 2 SiO 5: Ce, Tb, ZnS: Cu, Al, ZnS: Cu, Au, Al, (Zn, Cd) S: Cu, Al, SrAl 2 O 4: Eu, SrAl 2 O 4: Eu, Dy , Sr 4 Al 14 O 25: Eu, Dy, Y 3 Al 5 O 12: Tb, Y 3 (Al, Ga) 5 O 12: Tb, Y 3 Al 5 O 12: Ce Y 3 (Al, Ga) 5 O 12 : Ce, SrGa 2 S 4 : Eu, Ca 3 Sc 2 Si 3 O 12 : Ce, α-SiAlON: Eu, β-SiAlON: Eu, and the like.

尚、LEDチップ16の発光色は、上記した青色、赤色に限定されるものではなく、LEDチップ16からの発光によって励起される蛍光体24の発光色との混合色が所望の色になるように、適宜選定し得る。   Note that the emission color of the LED chip 16 is not limited to the above-described blue and red, but the mixed color with the emission color of the phosphor 24 excited by the emission from the LED chip 16 becomes a desired color. It can be selected as appropriate.

本発明に係る発光ダイオードを模式的に示す断面図である。It is sectional drawing which shows typically the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードにおける蛍光体を担持した不織布を模式的に示す斜視図である。It is a perspective view which shows typically the nonwoven fabric which carry | supported the fluorescent substance in the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードにおける蛍光体を担持した不織布を模式的に示す部分拡大図である。It is the elements on larger scale which show typically the nonwoven fabric which carry | supported the fluorescent substance in the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードにおける蛍光体を担持した不織布を模式的に示す要部拡大図である。It is a principal part enlarged view which shows typically the nonwoven fabric which carry | supported the fluorescent substance in the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードにおける蛍光体を担持した不織布を模式的に示す要部断面図である。It is principal part sectional drawing which shows typically the nonwoven fabric which carry | supported the fluorescent substance in the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードを模式的に示す要部拡大断面図である。It is a principal part expanded sectional view which shows typically the light emitting diode which concerns on this invention. 本発明に係る発光ダイオードにおける透光板を取り除いた状態の平面説明図である。It is plane explanatory drawing of the state which removed the translucent board in the light emitting diode which concerns on this invention. 従来の発光ダイオードを模式的に示す断面図である。It is sectional drawing which shows the conventional light emitting diode typically. 従来の発光ダイオードにおける蛍光体を担持した不織布を模式的に示す斜視図である。It is a perspective view which shows typically the nonwoven fabric which carry | supported the fluorescent substance in the conventional light emitting diode. 従来の発光ダイオードにおける蛍光体を担持した不織布を模式的に示す部分拡大図である。It is the elements on larger scale which show typically the nonwoven fabric which carry | supported the fluorescent substance in the conventional light emitting diode. 従来の発光ダイオードにおける不織布を構成する繊維を模式的に示す拡大図である。It is an enlarged view which shows typically the fiber which comprises the nonwoven fabric in the conventional light emitting diode.

10 発光ダイオード
12 基板
14a 外部電極
14b 外部電極
16 LEDチップ
18 ボンディングワイヤ
20 第1の枠部材
20a 第1の枠部材の内方端部
22 透光性樹脂
24 蛍光体
26 不織布
26a 不織布の周縁部
28 繊維
30 空隙
32 結合剤
34 第2の枠部材
34a 第2の枠部材の内方端部
34b 傾斜面
36 透光板
L 第1の枠部材20の内方端部の先端から突出する第2の枠部材の内方端部の突出距 離
結合剤の屈折率
t 不織布の厚さ
θ 不織布に含浸した結合剤中から空気中へ出射する光の臨界角
10 Light emitting diode
12 Board
14a External electrode
14b External electrode
16 LED chip
18 Bonding wire
20 First frame member
20a Inner end of first frame member
22 Translucent resin
24 phosphor
26 Nonwoven fabric
26a Non-woven fabric peripheral edge
28 fibers
30 Air gap
32 binder
34 Second frame member
34a Inner end of second frame member
34b Inclined surface
36 Translucent plate L Projection distance of inner end of second frame member protruding from tip of inner end of first frame member n 1 Refractive index of binder t Non-woven fabric thickness θ 1 Non-woven fabric Angle of light emitted from the binder impregnated into the air into the air

Claims (4)

所定色の可視光を放射するLEDチップと、屈折率が空気より大きい材料より成る透光性の結合剤が含浸されると共に蛍光体を担持した不織布を有し、上記LEDチップから放射される所定色の可視光と、上記蛍光体から放射される可視光とを混色させた混色可視光を得る発光ダイオードであって、
上記LEDチップを非透光性の第1の枠部材で囲繞すると共に、上記第1の枠部材上に、上記不織布の周縁部を載置することにより、LEDチップの上方に不織布を配置して成り、
また、上記LEDチップを囲繞する非透光性の第2の枠部材の内方端部を上記不織布上に配置すると共に、第2の枠部材の内方端部を、上記第1の枠部材の内方端部の先端から内方側へ突出させて成り、該第2の枠部材の内方端部の突出距離Lを、
L≧t・tanθ、θ=sin−1(1/n
[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]
の式を満たすように設定したことを特徴とする発光ダイオード。
An LED chip that emits visible light of a predetermined color and a non-woven fabric that is impregnated with a light-transmitting binder made of a material having a refractive index larger than that of air and carries a phosphor, and is emitted from the LED chip A light-emitting diode that obtains mixed color visible light obtained by mixing color visible light and visible light emitted from the phosphor,
The LED chip is surrounded by a non-translucent first frame member, and the non-woven fabric is disposed above the LED chip by placing the peripheral edge of the non-woven fabric on the first frame member. Consisting of
Further, the inner end portion of the non-translucent second frame member surrounding the LED chip is disposed on the nonwoven fabric, and the inner end portion of the second frame member is disposed on the first frame member. Projecting inward from the tip of the inner end of the second frame member, the projecting distance L of the inner end of the second frame member,
L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
[Where t is the thickness of the nonwoven fabric, n 1 is the refractive index of the binder, and θ 1 is the critical angle of light emitted from the binder into the air]
A light-emitting diode, which is set to satisfy the formula:
青色可視光を放射するLEDチップと、屈折率が空気より大きい材料より成る透光性の結合剤が含浸されると共に蛍光体を担持した不織布を有し、上記LEDチップから放射される青色可視光と、上記蛍光体から放射される可視光との混色により白色光を得る発光ダイオードであって、
上記LEDチップを非透光性の第1の枠部材で囲繞すると共に、上記第1の枠部材上に、上記不織布の周縁部を載置することにより、LEDチップの上方に不織布を配置して成り、
また、上記LEDチップを囲繞する非透光性の第2の枠部材の内方端部を上記不織布上に配置すると共に、第2の枠部材の内方端部を、上記第1の枠部材の内方端部の先端から内方側へ突出させて成り、該第2の枠部材の内方端部の突出距離Lを、
L≧t・tanθ、θ=sin−1(1/n
[但し、tは不織布の厚さ、nは結合剤の屈折率、θは結合剤中から空気中へ出射する光の臨界角]
の式を満たすように設定したことを特徴とする請求項1に記載の発光ダイオード。
Blue visible light emitted from the LED chip, which has a LED chip that emits blue visible light, and a non-woven fabric that is impregnated with a translucent binder made of a material having a refractive index greater than that of air and carries a phosphor. And a light emitting diode that obtains white light by color mixing with visible light emitted from the phosphor,
The LED chip is surrounded by a non-translucent first frame member, and the non-woven fabric is disposed above the LED chip by placing the peripheral edge of the non-woven fabric on the first frame member. Consisting of
Further, the inner end portion of the non-translucent second frame member surrounding the LED chip is disposed on the nonwoven fabric, and the inner end portion of the second frame member is disposed on the first frame member. Projecting inward from the tip of the inner end of the second frame member, the projecting distance L of the inner end of the second frame member,
L ≧ t · tan θ 1 , θ 1 = sin −1 (1 / n 1 )
[Where t is the thickness of the nonwoven fabric, n 1 is the refractive index of the binder, and θ 1 is the critical angle of light emitted from the binder into the air]
The light-emitting diode according to claim 1, wherein the light-emitting diode is set to satisfy the following formula.
上記第1の枠部材及び第2の枠部材を白色と成したことを特徴とする請求項2に記載の発光ダイオード。   The light emitting diode according to claim 2, wherein the first frame member and the second frame member are white. 上記第2の枠部材の内方端部に、上方に向かって拡開する傾斜面を形成したことを特徴とする請求項1乃至3の何れかに記載の発光ダイオード。   4. The light emitting diode according to claim 1, wherein an inclined surface expanding upward is formed at an inner end portion of the second frame member. 5.
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