JP5073617B2 - Vehicle lighting - Google Patents

Description

  The present invention relates to a vehicular lamp, and more particularly to a vehicular lamp that uses a semiconductor light emitting element as a light source.

  In recent years, a vehicular lamp using a semiconductor light emitting element such as a light emitting diode (LED) as a light source has been proposed (see Patent Document 1).

The vehicular lamp disclosed in Patent Document 1 has the following configuration. That is, the vehicular lamp includes a light emitting module having a semiconductor light emitting element and a ceramic substrate on which a planar electrode portion for transmitting electric power to the semiconductor light emitting element is formed and which supports the semiconductor light emitting element. The power supply terminal includes a power supply attachment that holds the ceramic substrate and supplies power to the light emitting module. The holder is slidably fitted to the power supply attachment, and the light emitting module is fixed to the power supply attachment. And the attachment for electric power feeding with which this light source module was hold | maintained is attached to the heat radiator, and is positioned and fixed to the heat radiator by the clip.
JP 2008-16362 A

  Under such circumstances, the present inventors have recognized the following problems. Generally, a light source module using a semiconductor light emitting element as a light source has a protective cover for covering the semiconductor light emitting element. When such a light source module is applied to a vehicle lamp, the protective cover may be peeled off from the substrate due to an external impact or the like. When the protective cover is peeled off from the substrate, the peeled protective cover is detached from the substrate and touches or adheres to the semiconductor light emitting element or other optical system to obtain a desired light distribution pattern. There is a risk of being lost. Usually, the protective cover is bonded and fixed to the substrate with, for example, a resin adhesive, or is bonded and fixed by melting a metal inserted into the end of the protective cover. However, the protective cover is adhered and fixed to the substrate in consideration of prevention of peeling.

  Here, when it is intended to further improve the reliability of the vehicular lamp by eliminating the risk of contact or adhesion of the protective cover that has fallen off the substrate to the semiconductor element or other optical system, one method is as follows. It is conceivable that the protective cover is more securely fixed to the substrate to prevent peeling. In this case, for example, it can be realized by newly developing or improving an adhesive. However, such a method requires a large amount of cost and time.

  On the other hand, as another method, it is possible to eliminate the possibility of contact of the protective cover with the semiconductor light emitting element or other optical system by preventing the peeled off protective cover from the substrate. Can be improved.

  The present invention has been made based on such recognition by the inventors, and an object thereof is to provide a technique for preventing the protective cover peeled off from the substrate from falling off the substrate.

  In order to solve the above problems, an aspect of the present invention is a vehicular lamp. The vehicular lamp includes a light source module and a power supply module. The light source module includes a semiconductor light emitting element and power to the semiconductor light emitting element. And a protective cover that covers the semiconductor light-emitting element, and includes a substrate that supports the semiconductor light-emitting element, and a flange that protrudes from at least a part of the outer peripheral edge of the end contacting the substrate. The power supply module is formed on the main body portion for locking the substrate, the power supply terminal formed on the main body portion for supplying power to the semiconductor light emitting element, and on the side facing the substrate when viewed from the flange portion. And a cover drop-off preventing part for preventing the protective cover from falling off.

  According to this aspect, the protective cover peeled off from the substrate can be prevented from falling off from the substrate.

  In the above aspect, the main body includes an opening, the power supply terminal and the cover drop-off prevention portion are provided at the periphery of the opening, and the light source module is locked to the main body so that the semiconductor light emitting element faces the opening. In the state where the light source module is locked to the main body, the flange portion may be at least partially in contact with the peripheral edge, whereby the light source module and the power supply module may be positioned. According to this, the light source module and the power supply module can be positioned more easily, and the effect of facilitating the assembly work of the vehicle lamp can be obtained. In addition, since the positioning of the light source module and the power supply module can be easily performed, there is an effect that reliable power supply to the semiconductor light emitting element can be realized more easily.

  In the above aspect, the opening and the flange may be substantially square. According to this, it becomes possible to position the light source module and the power supply module more easily, and it is possible to obtain an effect that the assembly work becomes easier and reliable power supply to the semiconductor light emitting element can be realized more easily. .

  Moreover, in the said aspect, the protective cover may be adhesively fixed to the board | substrate, and the cover drop-off prevention part may be provided with a predetermined clearance with respect to the flange part. According to this, it is possible to reduce the possibility that the protective cover falls off due to contact between the cover fall-off prevention part and the protective cover.

  According to the present invention, it is possible to prevent the protective cover peeled off from the substrate from falling off the substrate.

  The present invention will be described below based on preferred embodiments with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. The embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

(Embodiment 1)
FIG. 1 is a schematic vertical sectional view of a vehicular lamp according to the first embodiment. FIG. 2 is a schematic perspective view showing the lamp unit and the bracket in an exploded state. In FIG. 2, the bracket has shown the state which extracted the part.

  As shown in FIG. 1, the vehicular lamp 1 according to the first embodiment includes a light source in a lamp chamber 3 formed by a lamp body 2 and a translucent cover 4 attached to a front end opening of the lamp body 2. The lamp unit 10 including the module 100 is accommodated. A bracket 200 that supports the light source module 100 is housed in the lamp chamber 3, and the lamp unit 10 is fixed to the bracket 200. As shown in FIG. 2, the bracket 200 has a power supply terminal 330 and a power supply module 300 for supplying power from the outside to the light source module 100 is attached.

  The lamp unit 10 is a reflection-type projector-type lamp unit, and includes a light source module 100 and a reflector 20 that reflects light from the light source module 100 toward the front of the vehicle. The lamp unit 10 also includes a shade 30 fixed to the bracket 200 and a projection lens 40 held by the shade 30.

  The light source module 100 includes a semiconductor light emitting element 110 such as a light emitting diode (LED) as a light source. The light source module 100 has a light source mounting portion 220 (to be described later) of the bracket 200 in a state where the irradiation axis of the semiconductor light emitting element 110 is directed substantially vertically upward, which is substantially perpendicular to the irradiation direction of the lamp unit 10 (left direction in FIG. 1). It is placed on top. Note that the irradiation axis of the semiconductor light emitting device 110 can be adjusted according to its shape and the light distribution irradiated forward.

  The reflector 20 is a reflecting member formed on the inside with a reflecting surface formed of a part of a spheroidal surface, for example, and is fixed to the shade 30 by an engaging portion 22 provided at the front end thereof.

  The shade 30 is screwed and fixed to the front side of the light source mounting portion 220 of the bracket 200 with a bolt 38. The shade 30 has a flat portion 32 arranged substantially horizontally, and a front region of the flat portion 32 is configured as a curved portion 34 that is concavely curved downward, and light emitted from the semiconductor light emitting device 110. Is not reflected. The shade 30 is designed and arranged so that its first focal point is located in the vicinity of the semiconductor light emitting element 110 and its second focal point is located in the vicinity of the ridge 36 formed by the flat portion 32 and the curved portion 34 of the shade 30. .

  The projection lens 40 is a plano-convex aspheric lens that projects light reflected by the reflecting surface of the reflector 20 in front of the lamp, has a convex front surface and a flat rear surface, and extends in the vehicle front-rear direction. It arrange | positions above and is fixed in the vehicle front side front-end | tip part of the shade 30. FIG. For example, the rear focal point of the projection lens 40 is configured to substantially coincide with the second focal point of the reflector 20. The projection lens 40 is configured to project an image on the rear focal plane including the rear focal point as a reverse image on a vertical virtual screen disposed in front of the lamp.

  The light emitted from the semiconductor light emitting device 110 of the light source module 100 is reflected by the reflecting surface of the reflector 20 and enters the projection lens 40 through the second focal point. The light incident on the projection lens 40 is collected by the projection lens 40 and irradiated forward as substantially parallel light. Further, with the ridge line 36 of the shade 30 as a boundary line, a part of the light is reflected by the flat portion 32, and the oblique cut-off line is formed in the light distribution pattern that is selectively cut and projected forward of the vehicle. .

  The bracket 200 includes a flat mounting portion 210 and a light source mounting portion 220 on which the light source module 100 is mounted. The mounting part 210 and the light source mounting part 220 are made of, for example, a metal material having high thermal conductivity. The mounting part 210 is disposed on the vehicle rear side of the light source mounting part 220, and each part is integrally formed.

  The mounting portion 210 has a screw hole (not shown) at a predetermined edge, and the bracket 200 includes an aiming screw 60 in which the screw hole of the mounting portion 210 extends through the lamp body 2 and a leveling shaft 62. It is attached to the lamp body 2 by being screwed together. The leveling shaft 62 is connected to a leveling actuator 64. The vehicular lamp 1 is configured so that the optical axis of the lamp unit 10 can be adjusted in a horizontal direction or a vertical direction by an aiming screw 60, a leveling shaft 62, and a leveling actuator 64.

  Moreover, the attachment part 210 has the radiation fin 212 on the main surface of the vehicle rear side. A plurality of heat radiation fins 212 are provided at equal intervals on the left and right, and heat generated in the light source module 100 is transmitted from the light source mounting part 220 to the mounting part 210 and efficiently diffused in the heat radiation fins 212.

  The light source mounting portion 220 protrudes forward from the main surface of the mounting portion 210 on the vehicle front side, and the light source module 100 is placed on the upper surface thereof. The light source mounting portion 220 has an annular convex portion 222 for positioning the shade 30 on the main surface on the front side of the vehicle. The annular convex portion 222 has a notch in a part thereof, and the central axis thereof is provided so as to coincide with the central axis of the insertion hole 250 described later.

  The bracket 200 has an insertion hole 250 that penetrates in the vehicle front-rear direction and into which the bolt 38 is inserted. The bolt 38 is inserted from the vehicle rear side of the insertion hole 250, and the screw groove portion projects from the front end face of the light source mounting portion 220. Then, the shade 30 is fixed to the light source mounting portion 220 by screwing the shade 30 into the protruding screw groove portion. At that time, the shade 30 is positioned with respect to the light source mounting portion 220 by the annular convex portion 222.

  Hereinafter, the configuration of the light source module 100, the bracket 200, and the power supply module 300 and the method of assembling them will be described in detail. FIG. 3 is a schematic perspective view of the light source module 100. FIG. 4 is a schematic perspective view showing the light source module 100, the bracket 200, and the power supply module 300 in an exploded state. FIG. 5 is a schematic perspective view showing an assembled state of the light source module 100 and the power supply module 300. In addition, in FIG. 4, the bracket 200 has shown the state which extracted the part.

  As shown in FIG. 3, the light source module 100 includes a semiconductor light emitting device 110, a substrate 120 that supports the semiconductor light emitting device 110, and a protective cover 130 that covers the semiconductor light emitting device 110.

  The substrate 120 is a thermally conductive insulating substrate made of, for example, ceramic. The substrate 120 has a substantially rectangular parallelepiped shape, and electrodes 140 for transmitting power to the semiconductor light emitting element 110 are formed at both ends in the longitudinal direction on one surface. A pair of wiring layers 142 is formed on the surface layer portion on the one surface side inside the substrate 120, and one end of the wiring layer 142 and the electrode 140 are electrically connected.

  The end of each wiring layer 142 that is not connected to the electrode 140 extends in the center direction of the substrate 120, and a part of the end is exposed from the substrate 120. The semiconductor light emitting device 110 is mounted on the one surface of the substrate 120, and device electrodes (not shown) are electrically connected to the end portions of the wiring layer 142 exposed from the substrate 120. As a result, the semiconductor light emitting device 110 is electrically connected to the electrode 140 through the wiring layer 142. In this embodiment, the electrode 140 and the wiring layer 142 are integrally formed, one end of the wiring layer 142 is exposed at the end of the substrate 120, and the exposed portion forms the electrode 140. A plurality of semiconductor light emitting elements 110 may be mounted on the substrate 120.

  The protective cover 130 includes a substantially hemispherical dome portion 132 and a flange portion 134 having a substantially rectangular shape in plan view, protruding from an outer peripheral edge of an end portion of the dome portion 132 that contacts the substrate 120. The protective cover 130 is fixed to the surface of the substrate 120 on the side where the semiconductor light emitting element 110 is mounted so as to cover the semiconductor light emitting element 110 with a dome portion 132. When the protective cover 130 is mounted on the substrate 120, for example, a through-hole (not shown) provided at a predetermined position of the flange portion 134 is filled with a resin adhesive, molten metal, or the like. Bonded and fixed. In addition, the flange part 134 should just protrude from at least one part of the outer periphery of the dome part 132 edge part.

  As shown in FIG. 4, the power supply module 300 is formed in the main body 310 that locks the substrate 120, the power supply terminal 330 that is formed in the main body 310 and supplies power to the semiconductor light emitting device 110, and the main body 310. And a cover drop-off prevention unit 340 for preventing the protective cover 130 from dropping off. The power supply module 300 is attached to the bracket 200 in order to supply power to the semiconductor light emitting element 110 from a position where the irradiation light of the semiconductor light emitting element 110 is not blocked.

  The main body 310 has a substantially rectangular shape in plan view, and protrudes downward from one main surface in a base portion 312 formed in a substantially flat plate shape and one end region in the longitudinal direction of the base portion 312. And a protruding portion 314. Each part of the main body 310 is integrally formed of a resin material.

  The base portion 312 is formed with an opening 316 having a substantially rectangular shape in plan view, penetrating from one main surface side to the other main surface side, that is, in the vertical direction. A feeding terminal 330 is provided at each of the peripheral edge of the opening 316, that is, each of the pair of short sides on the inner peripheral surface. The power supply terminal 330 protrudes from the periphery of the opening 316 so that one end of the power supply terminal 330 extends toward the other short side, and the other end is connected to a power supply input unit 318 described later.

  In addition, a cover drop-off prevention portion 340 is provided so as to protrude from the pair of long side portions at the peripheral edge portion of the opening 316 so as to extend to the other long side portion. Two cover drop prevention portions 340 are provided at predetermined intervals on each of one long side portion and the other long side portion of the opening 316. The cover drop-off prevention part 340 of the present embodiment has a substantially right triangle shape in plan view, and is provided on the periphery of the opening 316 so that the oblique sides of the cover drop-off prevention parts 340 face the center direction of the opening 316. Further, the hypotenuse of the cover drop-off prevention part 340 is curved in an arc shape in accordance with the curved surface of the dome part 132. Therefore, a substantially circular opening formed by the hypotenuses of the four cover drop-off prevention parts 340 is formed in the approximate center of the opening 316.

  The protruding portion 314 is provided with a power feeding input portion 318. The power supply input unit 318 is, for example, a connector terminal connected to an external power source (not shown).

  The light source module 100 is fixed to the power supply module 300 by a holder 350. The holder 350 has a base portion 352 extending left and right, and side portions 354 projecting rearward from both left and right end portions of the base portion 352. Each of the two side portions 354 is provided with a receiving protrusion 356 protruding so as to extend toward the other side portion 354.

  The light source module 100 is inserted into the opening 316 of the power supply module 300 from below, and is connected to the electrodes 140 by pressing the power supply terminals 330 from above. The holder 350 is supplied with power while the dome part 132 of the protective cover 130 protrudes from the substantially circular opening formed by the oblique sides of the four cover drop-off prevention parts 340 and the semiconductor light emitting element 110 faces the opening 316. The module 300 is slid from the front. As shown in FIG. 5, the holder 350 is coupled in a state where the base portion 352 and the side portion 354 are in contact with the lower surface of the base portion 312. When the holder 350 is inserted into the power supply module 300, a part of the lower surface of the substrate 120 is received from below by the receiving protrusion 356 of the holder 350, and the light source module 100 is locked to the main body 310 of the power supply module 300. By connecting the power supply terminal 330 to the electrode 140, the semiconductor light emitting device 110 is electrically connected to the power supply input unit 318 via the wiring layer 142, the electrode 140, and the power supply terminal 330.

  In a state where the light source module 100 is fixed to the power supply module 300, the cover drop-off prevention unit 340 is located on the side facing the substrate 120 when viewed from the flange unit 134. Therefore, the movement of the protective cover 130 peeled from the substrate 120 is restricted by the cover drop prevention unit 340, and as a result, the drop off from the substrate 120 is prevented. In this state, the flange portion 134 is in a state where two sides extending in parallel with the long side portion of the opening 316 are in contact with the long side portion of the opening 316. Thereby, the light source module 100 is positioned with respect to the power supply module 300.

  The cover drop-off prevention part 340 is provided with a predetermined clearance with respect to the flange part 134 in a state where the light source module 100 is fixed to the power supply module 300. That is, the cover drop-off prevention part 340 is provided on the base 312 so as to have a predetermined clearance between the lower surface of the cover drop-off prevention part 340 and the upper surface of the flange part 134.

  When a through-hole provided at a predetermined position of the flange portion 134 is filled with a resin adhesive or a molten metal, and the protective cover 130 is adhered and fixed to the substrate 120, the filled adhesive or the like The height may exceed the height of the flange portion 134. In this case, the adhesive or the like may interfere with the lower surface of the cover drop-off prevention unit 340, leading to peeling of the protective cover 130 from the substrate 120, damage to the protective cover 130, and poor connection between the electrode 140 and the power supply terminal 330. There is. On the other hand, such a situation is achieved by providing a clearance between the cover drop prevention portion 340 and the flange portion 134 so as not to interfere with the flange portion 134 or the adhesive and to prevent the protective cover 130 from dropping off. Can be avoided. For example, if the relative height of the flange portion 134 is 0.18 and the maximum height of the adhesive is 0.5, the distance from the substrate 120 to the lower surface of the flange portion 134 is 0.55 at the maximum. . That is, the clearance is set to 0.37 at the maximum.

  Further, the cover drop-off prevention part 340 is provided with a predetermined clearance with respect to the dome part 132 in a state where the light source module 100 is fixed to the power supply module 300. That is, the cover drop-off prevention part 340 is provided on the base 312 so as to have a predetermined clearance between the curved oblique side of the cover drop-off prevention part 340 and the side surface of the dome part 132.

  The light source module 100 is attached to the power supply module 300 due to errors such as the dimensional accuracy of the protective cover 130, the mounting accuracy of the protective cover 130 to the substrate 120, the dimensional accuracy of the substrate 120, and the mounting accuracy of the substrate 120 to the main body 310. At this time, the cover drop-off prevention part 340 and the dome part 132 may interfere with each other. In this case, the protective cover 130 may be peeled off from the substrate 120, the protective cover 130 may be damaged, and the connection between the electrode 140 and the power supply terminal 330 may be poor. On the other hand, such a situation is avoided by providing a clearance that does not interfere with the dome portion 132 and prevents the protective cover 130 from falling off between the cover drop-off prevention portion 340 and the dome portion 132. be able to.

  The shape of the opening 316 is not particularly limited, and can be appropriately changed according to the shapes of the semiconductor light emitting element 110 and the protective cover 130. Further, the shape of the flange portion 134 is not particularly limited, and at least a part of the flange portion 134 is in contact with the periphery of the opening 316 in a state where the light source module 100 is locked to the power supply module 300. It is only necessary that the power supply module 300 can be positioned. Further, the shape of the cover drop-off prevention portion 340 is not particularly limited as long as it is a shape that can prevent the protective cover 130 from falling off the substrate 120 by engaging with the flange portion 134 of the protective cover 130 peeled from the substrate 120. .

  The power supply module 300 to which the light source module 100 is fixed as described above is fixed to the light source mounting part 220 of the bracket 200.

  The light source mounting part 220 includes a base part 224 and a mounting protrusion 226 that protrudes downward from the base part 224. On the front end surface of the mounting projection 226, an annular convex portion 222 is projected. A positioning portion 228 is provided on the upper surface of the base portion 224. The positioning unit 228 has a first positioning surface 228a facing forward and a second positioning surface 228b facing in the left-right direction. On the rear end side of the base portion 224, a rear end side insertion hole 230 that is separated from the left and right and extends forward and backward is formed. A front end side insertion hole 232 is formed on the front end surface of the base portion 224, and an engagement hole 234 opened upward is formed inside the front end side insertion hole 232.

  The power supply module 300 is fixed to the light source mounting unit 220 by a clip 240. Each part of the clip 240 is integrally formed of, for example, a plate-like metal material having a spring property. The clip 240 includes a connecting portion 242 that extends in the left-right direction, a pressing protrusion 244 that protrudes backward from the upper edge at both left and right ends of the connecting portion 242, and an insertion that protrudes rearward from the lower edge at the center of the connecting portion 242. And a protrusion 246. The pressing protrusion 244 has an engaging protrusion 244a that protrudes downward at an intermediate portion in the protruding direction. The engaging protrusion 244a is formed to extend from side to side. A cut-and-raised engagement protrusion 246a is formed on the insertion protrusion 246, and the engagement protrusion 246a is cut and raised so as to protrude obliquely downward to the front.

  The power supply module 300 to which the light source module 100 is fixed is slid from the front and disposed on the base portion 224 of the light source mounting portion 220. When the power supply module 300 is disposed on the base portion 224, the rear end surface of the substrate 120 is abutted against the first positioning surface 228a of the positioning portion 228 from the front, and in the front-rear direction with respect to the light source mounting portion 220 of the light source module 100. Positioning is done. Further, the rear end portions of the left and right side surfaces of the substrate 120 are in contact with the second positioning surfaces 228b of the positioning portions 228, respectively, so that the light source module 100 is positioned in the left-right direction with respect to the light source mounting portion 220. In a state where the light source module 100 is positioned with respect to the light source mounting part 220, the lower surface of the substrate 120 is in surface contact with the light source mounting part 220.

  In this state where the light source module 100 is positioned with respect to the light source mounting part 220, the pressing protrusions 244 of the clips 240 are respectively inserted into the rear end side insertion holes 230 of the light source mounting part 220 from the front, and the light source mounting is performed. The insertion protrusion 246 of the clip 240 is inserted into the front end side insertion hole 232 of the portion 220 from the front. The power supply module 300 is pressed in the direction of the light source mounting portion 220 by the engagement protrusion 244a of the clip 240, and the engagement protrusion 246a of the clip 240 is engaged with the front opening edge of the engagement hole 234 of the light source mounting portion 220. By joining, it is fixed to the light source mounting part 220 by the clip 240.

  In a state where the power supply module 300 is fixed to the light source mounting unit 220, a power cord connector (not shown) connected to an external power supply is connected to the power supply input unit 318 of the power supply module 300.

  In summary, in the vehicular lamp 1 according to the present embodiment, the protective cover 130 of the light source module 100 has the flange portion 134 protruding from at least a part of the outer peripheral edge of the end portion in contact with the substrate 120. A protective cover 130 having The power supply module 300 includes a cover drop prevention unit 340 that is provided on the side facing the substrate 120 when viewed from the flange portion 134 and prevents the protective cover 130 from dropping. Accordingly, even when the protective cover 130 is peeled off from the substrate 120, the flange portion 134 is caught by the cover drop-off preventing portion 340, so that the protective cover 130 peeled off from the substrate 120 can be prevented from falling off from the substrate 120. In addition, the vehicular lamp 1 according to the present embodiment has a simple configuration in which the flange portion 134 is provided on the protective cover 130 and the cover drop-off preventing portion 340 is provided on the main body portion 310. Therefore, the manufacturing cost and the manufacturing time are increased. Can be suppressed. Further, since the protective cover 130 can be prevented from falling off, the reliability of the vehicular lamp 1 can be improved.

  In the vehicular lamp 1 according to this embodiment, the main body 310 of the power supply module 300 includes the opening 316, and the power supply terminal 330 and the cover drop-off prevention unit 340 are provided on the periphery of the opening 316. In a state where the light source module 100 is locked to the main body 310, at least a part of the cover drop-off prevention unit 340 is in contact with the periphery of the opening 316, thereby positioning the light source module 100 and the power supply module 300. Therefore, the light source module 100 and the power supply module 300 can be positioned more easily, and the effect of facilitating the assembling work of the vehicular lamp 1 can be obtained. In addition, since the positioning of the light source module 100 and the power supply module 300 can be easily performed, there is an effect that reliable power supply to the semiconductor light emitting element 110 can be realized more easily.

  Furthermore, in the vehicular lamp 1 of the present embodiment, the opening 316 and the flange portion 134 are substantially rectangular. As a result, the light source module 100 and the power supply module 300 can be positioned more easily, and the assembling work is facilitated, and reliable power supply to the semiconductor light emitting element 110 can be realized more easily. .

  Further, in the vehicular lamp 1 of the present embodiment, the cover drop-off prevention part 340 is provided with a predetermined clearance with respect to the flange part 134. Therefore, it is possible to reduce the possibility that the protective cover 130 may come off due to contact between the cover falling prevention part 340 and the protective cover 130.

  The present invention is not limited to the above-described embodiment, and various modifications such as design changes can be added based on the knowledge of those skilled in the art. The embodiment to which such a modification is added is also the present embodiment. It is included in the scope of the invention.

  For example, in the first embodiment, the lamp unit 10 is a low beam lamp unit in which an oblique cut-off line is formed in a light distribution pattern projected in front of the vehicle, but a high beam lamp unit that does not form an oblique cut-off line. It may be. Further, the lamp unit 10 is a projector type, but it is also possible to use a parabolic type or a direct-type lamp unit.

  Further, the vehicular lamp of each of the embodiments described above can be applied to, for example, an automotive headlamp, a tail lamp, an auxiliary headlamp such as a fog lamp, and a driving lamp.

1 is a schematic vertical sectional view of a vehicular lamp according to a first embodiment. It is a schematic perspective view which shows a lamp unit and a bracket in an exploded state. It is a schematic perspective view of a light source module. It is a schematic perspective view which shows a light source module, a bracket, and an electric power feeding module in an exploded state. It is a schematic perspective view which shows the assembly | attachment state of a light source module and an electric power feeding module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Vehicle lamp, 2 Lamp body, 3 Lamp chamber, 4 Light transmission cover, 10 Lamp unit, 20 Reflector, 22 Engagement part, 100 Light source module, 110 Semiconductor light emitting element, 120 Board | substrate, 130 Protection cover, 132 Dome part, 134 flange portion, 140 electrode, 142 wiring layer, 200 bracket, 210 mounting portion, 212 heat radiation fin, 220 light source mounting portion, 224 base portion, 226 mounting protrusion, 228 positioning portion, 228a first positioning surface, 228b second positioning 230, rear end side insertion hole, 232 front end side insertion hole, 234 engagement hole, 240 clip, 242 connecting portion, 244 pressing projection, 244a engagement projection, 246 insertion projection, 246a engagement projection piece, 250 Insertion hole, 300 Joule, 310 main body, 312 base, 314 protrusion, 316 opening, 318 supply input section, 330 feed terminal, 340 a cover disengagement prevention part, 350 holder, 352 base, 354 side, 356 receiving protruding portion.

Claims (4)

A light source module and a power supply module;
The light source module is
A semiconductor light emitting device;
An electrode for transmitting electric power to the semiconductor light emitting element is formed, and a substrate for supporting the semiconductor light emitting element;
A flange that protrudes from at least a part of the outer peripheral edge of the end that contacts the substrate, and includes a protective cover that covers the semiconductor light emitting element;
The power supply module is
A body portion for locking the substrate;
A power supply terminal formed on the main body and supplying the power to the semiconductor light emitting element;
A vehicular lamp, comprising: a cover drop-off prevention portion that is formed on the main body portion and is provided on a side facing the substrate when viewed from the flange portion, and prevents the protective cover from dropping off. The main body includes an opening, and the power supply terminal and the cover drop-off prevention unit are provided on the periphery of the opening.
The light source module is locked to the main body so that the semiconductor light emitting element faces from the opening,
The flange portion is in a state in which the light source module is locked to the main body, and at least a part thereof is in contact with the peripheral edge, whereby the light source module and the power supply module are positioned. Item 2. A vehicle lamp according to Item 1.   The vehicular lamp according to claim 2, wherein the opening and the flange are substantially square.   4. The protective cover according to claim 1, wherein the protective cover is bonded and fixed to the substrate, and the cover drop-off prevention portion is provided with a predetermined clearance with respect to the flange portion. Item 1. A vehicle lamp according to item 1.

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