JP5065999B2 - Conveyor device for defective parts and electronic component mounting device - Google Patents

Description

  The present invention relates to a defective component conveying conveyor device that conveys a component determined to be defective in the mounting device, and an electronic component mounting device including the defective component conveying conveyor device.

In the mounting line, a component pass / fail judgment device having a component recognition camera is provided between a component supply device that supplies electronic components and a transport device that transports a substrate on which the electronic components are mounted by a mounting head. Yes. By this component quality determination device, the quality of the electronic component sucked by the mounting head is determined. Here, if the electronic component itself is not defective, for example, if the suction posture is defective or the lead wire attached to the electronic component is defective, the electronic component is not discarded by re-adsorbing or reworking only the lead wire. Can be used. However, an electronic component determined to be defective is discarded in a disposal box, and even if the electronic component itself is not defective due to the impact of disposal, it is damaged and cannot be recovered for use. Therefore, according to Patent Document 1, a discharge device with a conveyor is provided, and the electronic components once judged to be defective are arranged in order on the conveyor, thereby enabling recovery by an operator, reworking of lead wires, etc. It can be reused by adsorption.
Japanese Patent No. 2688642

  However, in order to improve the wettability of solder before the electronic component is mounted on the substrate with solder, flux may be attached to bumps or terminals of the electronic component. In addition, when the sub board is assembled on the main board and electronic components are mounted on the sub board, screen printing cannot be performed on the sub board. Soldering is performed. Similarly, when a small electronic component is mounted on a large electronic component, it is impossible to screen-print on the upper surface of the large electronic component. Adhering is performed.

  Therefore, if the electronic parts with flux or solder attached are placed on the conveyor of the disposal device and the conveyor is contaminated with flux or solder, the surface of the conveyor can be cleaned from the adhesiveness of the flux or solder. There was a problem of difficulty. In addition, when the conveyor is contaminated with flux or solder, there is a problem that clean electronic components that can be reused become dirty due to adhesion of the flux or solder to unnecessary portions and cannot be used.

  SUMMARY OF THE INVENTION The present invention has been made in view of the conventional problems, and reduces the maintenance for cleaning the conveyor even if the electronic components to which flux or solder adheres contaminate the conveyor for disposal. The present invention provides a conveyor device and an electronic component mounting apparatus for defective parts.

In order to solve the above-mentioned problem, the structural feature of the invention according to claim 1 is that a reel is wound around the reel, and is fed out from the reel and arranged horizontally so that a defective part is placed thereon. A conveyor tape to be placed; a take-up reel that conveys a defective part placed by feeding the conveyor tape from the feed reel by winding the conveyor tape; and a driving device that drives the take-up reel. The take-up reel is configured to take up the conveyor tape with a surface on which a defective part is placed facing inward .

The structural features of the invention according to claim 2 are: a feeding reel, a conveyor tape wound around the feeding reel, fed out from the feeding reel and arranged horizontally, and on which defective parts are placed, and the conveyor When the conveyor tape is damaged, the take-up reel includes a take-up reel that feeds a defective part placed by feeding the conveyor tape from the feed reel by winding the tape, and a driving device that drives the take-up reel. In addition, the apparatus further includes a damage detection device for detecting the damage .

The structural features of the invention according to claim 3 are: a feeding reel, a conveyor tape wound around the feeding reel, fed out from the feeding reel and arranged horizontally, on which defective parts are placed, and the conveyor A take-up reel that conveys defective parts placed by feeding a conveyor tape from the feed reel by winding the tape, and a drive device that drives the take-up reel, the feed reel, and the conveyor tape The take-up reel is unitized and provided with a moving mechanism that can move as a unit from a use position where the electronic component is placed and transported to a removal position where the placed electronic component is removed. It is.

According to the first aspect of the present invention, even if flux or solder adheres to the defective component to be placed and the conveyor tape is dirty, the dirty portion of the conveyor tape is taken up by the take-up reel for cleaning. Since no maintenance is required, the maintenance cost of the conveyor can be reduced.
And, by winding the winding surface with the surface to which dirt is attached, the vicinity of the part where the take-up reel is arranged is prevented from being newly soiled, and the operator's hand, etc. is soiled when replacing the reel. Can be prevented.

According to the second aspect of the present invention, even if flux or solder adheres to the defective component to be placed and the conveyor tape is soiled, the soiled portion of the conveyor tape is taken up by the take-up reel and is used for cleaning. Since no maintenance is required, the maintenance cost of the conveyor can be reduced.
Then, when the conveyor tape is damaged and the parts cannot be conveyed, it is possible to quickly deal with replacement or repair of the conveyor tape.

According to the invention of claim 3 , even if flux or solder adheres to a defective part to be placed and the conveyor tape becomes dirty, the dirty portion of the conveyor tape is taken up by the take-up reel for cleaning. Since no maintenance is required, the maintenance cost of the conveyor can be reduced.
And even if there is no operation space due to the position attached to the component supply device and there is no operation space, it is moved to the removal position as a unit to easily remove the electronic components and replace the conveyor tape be able to.

  A mounting apparatus that implements a conveyor system for defective parts according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an outline of the electronic component mounting apparatus 2, and FIG. 2 is a perspective view showing a conveying conveyor device 6 for defective parts assembled in the component supply apparatus 4.

  As shown in FIG. 1, the electronic component mounting apparatus 2 has two rows of substrate transport lanes 26 and 27 for transporting the substrate S to a carry-in position and positioning the substrate S at a predetermined position, and the X direction (transport) Direction) and a component transfer device 34 having a component mounting head 32 provided on a moving table 30 supported so as to be movable in the Y direction (direction perpendicular to the X direction), and board recognition provided on the moving table 30 Camera (CCD camera) 36 and a control device (not shown) for control.

  Each of the substrate transfer lanes 26 and 27 is arranged along a guide rail (not shown) extending in the X direction (transfer direction), and conveys the substrate S to a position where the substrate S is positioned. A support frame (not shown) for supporting the substrate S, a lifting device (not shown) for raising the supported substrate S to a mounting position (predetermined position), and clamping the substrate S at the mounting position A clamping device (not shown).

  A Y-direction beam 44 extending in the Y direction is provided above the substrate transfer lanes 26 and 27. The Y-direction beam 44 is placed on an X-direction rail (not shown) and can move in the X direction. . The Y-direction beam 44 is provided with a movable table 30 so as to be movable in the Y direction. The moving table 30 holds a component transfer device 34 having a component mounting head 32 and a CCD camera 36 as a substrate recognition camera. The component transfer device 34 and the CCD camera 36 have a Y-direction beam 44 in the X direction. It is configured to be movable in the X direction by moving to. The movement of the Y direction beam 44 in the X direction is driven by an X direction linear guide (not shown) and an X axis servo motor (not shown) via a ball screw (not shown). The movement of the movable table 30 in the Y direction is driven by a Y direction linear guide (not shown) and a Y-axis servo motor (not shown) via a ball screw (not shown). These servo motors are controlled by the control device.

  The component transfer device 34 is supported by a support base (not shown) attached to the moving table 30, and supported by the support base so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction, and by a servo motor (not shown). The component mounting head 32 is driven up and down, and is composed of a suction nozzle (not shown) protruding downward from the component mounting head 32. The suction nozzle is formed in a cylindrical shape, and holds and holds electronic components at the lower end. The mounting operation of the component transfer device 34 is controlled by the control device.

  On one side of the electronic component mounting apparatus 8 (the lower side in FIG. 1), the component supply device 4 is arranged side by side in the first and second board transfer lanes 26 and 27, and these component supply devices 4 are mainly used. A tape feeder supply component composed of small electronic components is supplied, and a number of cassette-type feeders 54 that can be attached to and detached from the mounting portion 52 of the component supply device 4 are arranged in parallel. The cassette type feeder 54 holds a supply reel (not shown) around which a long and narrow tape in which electronic components are sealed at a predetermined pitch is wound. The tape is pulled out from the supply reel at a predetermined pitch, and the electronic components are released from the encapsulated state and sequentially fed into a component take-out portion (not shown).

  In addition, the component supply device is provided with a conveyor belt device 6 and a flux transfer device 71 for the defective components in a detachable manner in the mounting portion 52 in parallel with the cassette type feeder 54 (see FIG. 2). The mounting portion 52 is formed with a mounting portion side connector and engagement hole (not shown) and an edge portion, and a plurality of mounting guide grooves 56 extending in the attaching / detaching direction are formed on the edge portion. Is configured to be fitted to a convex strip (not shown) provided on the lower surfaces of the conveyor belt device 6 and the flux transfer device 71 for defective parts. As shown in FIG. 3 to FIG. 5, the conveyor belt device 6 for defective parts is provided with an elongated casing base 60, and a signal line / power supply line of the conveyor belt device 6 is attached to the front end portion of the casing base 60. The connector plug 62 is connected to the engagement hole 64 and the engagement pin 64 is engaged and fixed to the engagement hole (not shown) on the mounting portion side. An ID is given to each of the defective conveyor conveyor device 6 and the flux transfer device 71 so that it can be recognized in which position of the mounting portion 52 it is mounted. The casing base 60 is provided with a guide rail 66 extending in the longitudinal direction of the casing base 60 at the inner bottom, and the guide rail 66 is slidably provided with a transport unit 68 having a slider piece (not shown) at the bottom. . The guide rail 66 and the slider piece constitute a moving mechanism. A feeding-side cantilever shaft (not shown) and a winding-side cantilever shaft (not shown) protrude horizontally from one side wall of the transport unit 68, and a feeding reel 70 is provided on the feeding-side cantilever shaft. A take-up reel 72 is rotatably and detachably supported on the take-up side cantilever shaft. A first guide roller 74 is provided on the upstream side of the feed reel 70 (in front of the transport unit 68), and the first guide roller 74 guides the conveyor tape 78 fed from the feed reel 70 in the horizontal direction. For the conveyor tape 78, roll paper that is generally commercially available is used. A rotation sensor 80 is directly connected to the first guide roller 74, and the rotation amount of the conveyor tape 78 is detected by the rotation sensor 80. Further, when the conveyor tape 78 is lost or damaged, the first guide roller 74 does not rotate even when the winding operation by the take-up reel 72 is performed. Therefore, the breakage or exhaustion of the conveyor tape 78 is detected. . The rotation sensor 80 constitutes a damage detection device. A conveyance table 82 extending in the horizontal direction is provided on the downstream side of the first guide roller 74, and a second guide roller 76 is provided on the downstream side of the conveyance table 82, and the conveyor tape 78 moved on the conveyance table 82. Is guided to the take-up reel 72 side. In this case, the upper surface of the conveyor tape 78 on which the parts to be conveyed are directly placed is wound so as to be inside the take-up reel 72. An optical sensor 84 is provided above the downstream end of the transport table 82, and the optical sensor 84 detects the leading part that is arranged on the conveyor tape 78 and sent in order, so that the part is full on the conveyor tape. It is detected that An interlocking pulley 86 is adjacent to the take-up reel 72, and the interlocking pulley 86 rotates in contact with the drive shaft 90 of the drive motor 88. A cable bearer 92 is attached to the downstream end, and the power line of the drive motor 88 and the signal lines of the sensors 80 and 84 are flexibly protected corresponding to the slide of the transport unit 68.

  A grip frame 94 and an unlock lever 96 are assembled at the rear end of the transport unit 68, and an unillustrated lock mechanism operated by the unlock lever is provided between the transport unit 68 and the casing base 60. Yes. This lock mechanism is mainly composed of a lock piece and a lock hole. An unillustrated locking piece urged downward by an unillustrated spring is provided below the transport unit 68 so as to be movable up and down, and the lower end of the locking piece is the use position of the casing base 60 (electronic component mounting apparatus 2). And the removal unit (outside of the electronic component mounting apparatus 2) are fitted into lock holes (not shown) formed so as to correspond to the two positions, so that the transport unit 68 is locked. It has become. The lock release lever 96 is pivotally biased in a locking direction by a coil member (not shown), and performs a lock release operation for gripping the lock release lever 96 together with the gripping frame 94, thereby preventing the lock piece against the elastic force of the coil member. Is lifted from the lock hole to be unlocked, and the transport unit 68 can slide with respect to the casing base 60. A stopper 97 is provided at the rear end portion of the casing base, and the rearward movement of the transport unit 68 is restricted by the stopper 97.

  The flux transfer device 71 includes a mounting base 73 mounted on the mounting portion 52 of the electronic component mounting apparatus 2 and a flux transfer device main body 75 mounted on the mounting base 73, and the mounting base 73 and the flux transfer device main body. 75 is covered by a cover device 77 as shown in FIG. The flux transfer device main body 75 can slide between an inner set position and an outer drawing position of the electronic component mounting apparatus 2 along two guide rails (not shown) provided on the upper surface of the mounting base 73. It is configured as follows. A plate-like rotary table 79 is detachably provided on the flux transfer apparatus main body 75, and a squeegee 81 is detachably provided above the rotary table 79. The flux transfer device main body 75 is provided with a flux supply device 83 for supplying flux into the rotary table 79. The flux supply device 83 includes a storage tank 83a that stores a certain amount of flux, and an injection nozzle 83b that communicates with the storage tank 83a and opens on the rotary table 79. The flux supplied into the rotary table 79 is spread by the squeegee 81 to form a uniform flux film when the rotary table 79 rotates intermittently. The bumps and terminals of the electronic components attracted to the component mounting head 32 of the component transfer device 34 are lowered until they contact the bottom surface of the rotary table 79, so that the flux is transferred to the bumps and terminals by being immersed in the flux film. To do.

  The cover device 77 includes a box-shaped cover main body 87 that covers the lower part, the side, and the upper part of the rear part of the mounting base 73 (outside of the electronic component mounting apparatus 2), and the front of the cover main body part 87 (of the electronic component mounting apparatus 2). And an ejection portion 89 that protrudes inwardly and covers the side surface of the flux transfer apparatus main body 75. The ejection portion 89 is cut out in a rectangular shape above the rotary table 79. An operation door 91 that can be opened and closed is provided on the rear surface of the cover main body 87, and the operation door 91 is opened so that operations such as maintenance can be performed. One end of the air duct 93 is connected to the bottom of the cover main body 87, and the other end of the air duct 93 is connected to a cooling device 95 as a temperature adjusting device. As a result, the cool air of the cooling device 95 cools the storage tank 83a of the flux supply device 83 provided inside the cover main body 87, and at the same time, the cool air can be blown onto the flux in the rotary table 79 to cool it. . A temperature sensor 99 is disposed at a position facing the opening at one end of the blower duct 93 to detect the temperature of the cold air injected into the cover main body 87. In addition, a temperature sensor 100 is disposed on the ceiling of the ejection unit 89 and detects the temperature of the cold air blown into the rotary table 79. Although the physical properties such as viscosity change depending on the temperature, the flux is applied to the parts by managing the temperature of the flux in the flux transfer device 71 at a constant based on the temperature detected by the temperature sensors 99 and 100. The film thickness and other quality can be stabilized.

  Further, as shown in FIGS. 1 and 2, a component recognition camera (component quality determination device) 98 is provided between the board transfer lanes 26 and 27 and the component supply device 52, and the component recognition camera 98 is provided. As a result, the electronic component, the cover component, and the like sucked by the suction nozzle (not shown) of the component mounting head 32 of the component transfer device 34 are imaged to determine whether the suction state is good or bad and whether the component itself is good or bad. .

The operation of the embodiment configured as described above will be described below with reference to the drawings.
First, the substrate S supplied to the electronic component mounting apparatus 2 is transported, for example, on the substrate transport lane 26, stopped at a predetermined stop position, and lifted by a lifting device (not shown) and clamped (not shown) at the mounting position. Clamped to the device and held. The component transfer device 34 is moved to the component supply device 4 and sucks the electronic components supplied by the cassette type feeder 54 with a suction nozzle (not shown) of the component transfer device 34. For example, when flux transfer is necessary for the terminal of the sucked electronic component, the component transfer device 34 moves above the rotary table 79 of the flux transfer device 71 while sucking the electronic component. Then, the suction nozzle is lowered until the terminal of the electronic component comes into contact with the bottom surface of the turntable 79. Only the thickness of the flux film formed on the bottom surface of the rotary table 79 is transferred to the terminals of the electronic component. The electronic component with the flux transferred to the terminal is moved onto the component recognition camera 98 by the component transfer device 34 and is imaged by the component recognition camera 98 to determine whether the electronic component is good or bad. Is done. At this time, the electronic component determined to be defective is placed on the conveyor tape 78 on the upstream side (inside the electronic component mounting apparatus 2) of the defective conveyor conveyor 6. The conveyor tape 78 is moved downstream by the take-up reel 72 being intermittently rotated by a drive motor 88.

  In this way, in the defective component carrying conveyor device 6 provided in the electronic component mounting device 2 described above, the dirty portion of the conveyor tape 78 is taken up by the take-up reel 72, so that maintenance for cleaning is reduced. be able to. Further, in the case where the flux application part and the flux non-application part are used in common, even if the flux adheres to the mounted defective part and the conveyor tape 78 becomes dirty, the dirty part of the conveyor tape 78 is wound. Since the new tape 78 is taken out from the take-up reel 72 and is fed out from the take-out reel 70, it is possible to prevent the electronic parts and the like to which the flux or the like is not attached from becoming dirty with the flux or the like and becoming unusable.

  Further, by making the conveyor tape 78 made of paper that is inexpensive and easily available, the conveyor tape 78 can be used up and discarded after the electronic parts are conveyed.

  In addition, when the conveyor tape 78 is damaged and the electronic components cannot be conveyed, it is possible to promptly replace the conveyor tape 78 or to repair it.

  In addition, the surface on which the dirt is attached is wound inside and taken up, so that the vicinity of the portion where the take-up reel 72 is disposed is prevented from being newly soiled. Can be prevented.

  In addition, when the defective conveyor conveyor 6 is assembled to the component feeder 4, existing connection equipment can be used, and it can be placed at an optimal position where the component transfer device 34 can be mounted.

  Further, even when there is no operation space due to the position where the component supply device 4 is attached, there is no operation space, and the transport unit is moved to the removal position as a unit to remove the electronic components and the conveyor tape. 78 can be easily exchanged.

  Further, in the electronic component mounting apparatus 2, even if flux or solder adheres to a defective component to be placed and the conveyor tape 78 becomes dirty in the conveyor conveyor 6 for defective components, the dirty portion of the conveyor tape 78 is wound. Since it is wound around the take-up reel 72 and does not require maintenance for cleaning, the maintenance cost of the entire electronic component mounting apparatus 2 can be reduced.

  In addition, in the said embodiment, although the commercially available roll paper was used for the conveyor tape, it is not limited to this, For example, a cloth tape may be sufficient.

  In addition, although the component recognition camera is arranged between the component supply device and the board transfer lane, the present invention is not limited to this. For example, a laser sensor is mounted on the head to recognize the position and angle of the sucked component. A component transfer device equipped with a so-called on-the-fly recognition device may be used. In this case, it is not necessary to stop at a specific position where the component recognition camera is installed, and the mounting process can be shortened. Therefore, the production time of the printed circuit board can be shortened and the productivity can be improved.

  Moreover, although it was set as the cooling device as a temperature control apparatus, it is not limited to a cooling device, For example, a heater apparatus may be sufficient.

  Moreover, although the take-up reel is assumed to be a drive reel, the present invention is not limited to this. For example, a means capable of driving the feed reel to rotate in reverse may be provided. Thus, for example, in the case of a non-flux coated part, once the part is placed on the conveyor tape, the tape will not become dirty. After removing the part, the conveyor tape is rotated in the reverse direction and wound on the feeding reel. The roll paper can be reused, and the cost of the consumable equipment can be reduced.

  Moreover, although the electronic component mounting apparatus in the said embodiment was provided with the flux transfer apparatus, it is not limited to this, For example, you may provide the small solder printing apparatus which performs solder printing.

  In the above embodiment, the substrate recognition camera is a CCD camera. However, the present invention is not limited to this. For example, a CMOS sensor or a line sensor camera may be used.

The top view which shows the outline | summary of the electronic component mounting apparatus which concerns on this invention. The perspective view which shows the attachment arrangement | positioning to the components supply apparatus of the conveyance conveyor apparatus and flux transfer apparatus of a defective part. The perspective view which shows the conveyance conveyor apparatus of a defective part. The perspective view of the conveyance conveyor apparatus of the defective components shown by notching a part. The side view of FIG. The perspective view of the flux transcription | transfer apparatus shown through a part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Electronic component mounting apparatus, 4 ... Component supply apparatus, 6 ... Defective part conveyance conveyor apparatus, 34 ... Component transfer apparatus, 66 ... Movement mechanism (guide rail), 70 ... Delivery reel, 72 ... Take-up reel, 78 ... conveyor tape, 80 ... breakage detection device (rotation sensor), 88 ... drive device (drive motor), 98 ... component pass / fail judgment device (component recognition camera), S ... substrate.

Claims (3)

A feeding reel,
A conveyor tape wound around the payout reel, drawn out from the payout reel and arranged horizontally, on which defective parts are placed;
A take-up reel that conveys defective parts placed by unwinding the conveyor tape from the pay-out reel by winding the conveyor tape;
A drive device for driving the take-up reel ,
The take-up reel takes up the conveyor tape with the surface on which the defective part is placed facing inward, and conveys the defective part. A feeding reel,
A conveyor tape wound around the payout reel, drawn out from the payout reel and arranged horizontally, on which defective parts are placed;
A take-up reel that conveys defective parts placed by unwinding the conveyor tape from the pay-out reel by winding the conveyor tape;
A driving device for driving the take-up reel;
With
A conveyance conveyor device for defective parts, further comprising a failure detection device for detecting the failure when the conveyor tape is damaged . A feeding reel,
A conveyor tape wound around the payout reel, drawn out from the payout reel and arranged horizontally, on which defective parts are placed;
A take-up reel that conveys defective parts placed by unwinding the conveyor tape from the pay-out reel by winding the conveyor tape;
A driving device for driving the take-up reel;
With
The feeding reel, the conveyor tape, and the take-up reel are unitized and moved to be movable as a unit from a use position where the electronic component is placed and transported to a removal position where the placed electronic component is removed. A conveyor device for defective parts, characterized in that a mechanism is provided .

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