JP5040829B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting an electronic component such as a semiconductor bare chip and an electronic circuit package and a component other than an electronic component on a target workpiece, and in particular, a component at the time of component mounting in a component supply unit. It relates to the extraction technology.

  FIG. 6 is a schematic configuration diagram of a conventional component mounting apparatus.

  In FIG. 6, components 102 such as IC and glass are arranged in a matrix on a tray 101 having areas partitioned at regular intervals. In order to pick up the component 102 by suction, the supply head 104 having the suction nozzle 103 is provided with a drive unit 105 that drives in the vertical direction and a drive unit 106 that drives in the horizontal rotation direction, and holds the tray 101. The tray stage 107 is provided with driving units 108 and 109 that drive in the XY horizontal directions.

  The illumination light reflected from the upper surface of the component 102 placed on the tray 101 passes through the objective lens 110 and enters the supply camera 111, and an image reception signal in the supply camera 111 is input to the image processing unit 112. The center point of the component 102 and the rotation angle of the component 102 are obtained by the image processing unit 112. Then, the drive units 108 and 109 that drive the tray stage 107 in the horizontal direction are moved so that the tip of the suction nozzle 103 provided in the supply head 104 coincides with the component center position, and at the same time, the component 102 rotates. After the supply head 104 is moved by the drive unit 106 that drives in the horizontal rotation direction so as to form an angle, the suction nozzle 103 may suck the component 102 by the drive unit 105 that drives the supply head 104 in the vertical direction. The part 102 is lowered to a possible suction position to suck the component 102.

  The entire lower surface of the component 102 is set in contact with the upper surface of the tray 101, and the supply camera 111 recognizes that the component 102 is set on the tray 101. In this example, as shown in FIG. 6, the component 102 is irradiated with light from four directions by oblique illumination 113, and the supplied component 102 is illuminated to recognize the outer shape of the component 102.

  When the component 102 is mounted on the tray 101 having the areas partitioned at regular intervals, the component 102 is conventionally mounted so that the entire lower surface of the component 102 is in contact with the upper surface of the tray 101. The quality defect increases due to adhesion to the component 102.

  In order to reduce this quality defect, a step is provided at the corners in the four directions in an area partitioned at a certain interval, and the step in the four directions is prevented so that the entire lower surface of the component 102 does not contact the upper surface of the tray 101. Recently, efforts have been made to reduce the adhesion of dust and the like by reducing the surface where the tray 101 and the component 102 contact by mounting the component 102 thereon.

  However, when the above-described approach is implemented, only a part of the part 102 rides on a part of the step provided in four directions in an area partitioned at a certain interval, and the part 102 is inclined. Will occur. When the supply head 104 descends and picks up the component 102 in a state where the component 102 is tilted in an area partitioned at regular intervals on the tray 101, the component 102 is moved by the suction nozzle 103 provided at the tip of the supply head 104. It may be damaged.

  As a prior art relating to a semiconductor chip positioning method, Patent Document 1 discloses a relative positional deviation between a position where a semiconductor chip is picked up by imaging an image of the semiconductor chip with an optical device and processing the image pickup signal. A configuration is described in which pre-positioning can be performed automatically with high accuracy by detecting the amount.

  In the configuration described in Patent Document 1, the illumination light emitted from the light source of the optical device irradiates the semiconductor chip placed on the tray on the upper surface of the XYθ table of the preliminary positioning mechanism via the condenser lens, Illumination light specularly reflected by the semiconductor chip passes through the objective lens and is incident on the ITV camera, and an imaging signal incident on the ITV camera is input to the image processing unit.

In the image processing unit, the center of gravity of the semiconductor chip is calculated to obtain the center, the amount of deviation between the center and the optical axis is calculated, and the calculated value is driven by the XY table via the computer. The position where the semiconductor chip is picked up and the set position of the semiconductor chip are made to coincide with each other.
JP 61-44304 A

  However, in the conventional configuration, there is no means for measuring the inclination of the component without reducing the productivity of mounting the component, and therefore, the inclination of the component cannot be measured and checked before the adsorption of the component is lowered. Therefore, there is a problem that the parts are damaged.

  The present invention solves the above-mentioned conventional problems, and without damaging the productivity of mounting the component, the component inclination is measured and checked before the component adsorption is lowered, and the component is damaged. An object is to provide a component mounting apparatus and a component mounting method which are eliminated.

  In order to achieve the object, the invention according to the component mounting apparatus according to claim 1 includes a supply head unit having a suction nozzle for sucking a component on a tray, a tray stage unit for holding the tray, An illumination unit capable of irradiating light on the upper surface of the component at a certain irradiation angle, a camera unit for receiving reflected light reflected from the upper surface of the component, and the component based on a measurement result of surface luminance distribution obtained from the reflected light And a control unit for controlling the suction nozzle based on the inclination of the component calculated by the calculation unit.

  According to a second aspect of the present invention, in the component mounting apparatus according to the first aspect, the control unit performs a component suction operation when the tilt of the component is larger than a component tilt threshold value set in advance for each component. It is a thing to stop.

  A third aspect of the present invention is the component mounting apparatus according to the first aspect, further comprising a tilt mechanism that tilts the tray stage unit, wherein the control unit is configured such that the tilt of the component is preset for each component. When the inclination is larger than the tilt threshold, the tray stage portion is tilted by the tilt mechanism, the tip surface of the suction nozzle and the upper surface of the component are in a parallel state, and the component is sucked by the suction nozzle. It is characterized by that.

  According to a fourth aspect of the present invention, in the component mounting apparatus according to the first aspect of the present invention, the component mounting apparatus further includes a tilting mechanism that tilts the supply head, and the control unit tilts the component in which the tilt of the component is preset for each component. When larger than a threshold value, the supply head is tilted by the tilt mechanism, the tip surface of the suction nozzle and the upper surface of the component are in a parallel state, and the component is sucked by the suction nozzle. Features.

  In the invention according to the component mounting method of claim 5, after the component is set on the tray so that the reflected light reflected from the upper surface of the component on the tray is received and the center of the component is reflected, the component is mounted at regular intervals. While relatively changing the inclination of the tray, the surface luminance distribution of the reflected light on the upper surface of the component was measured a plurality of times to determine the inclination / luminance distribution relationship between the inclination of the component and the surface luminance distribution of the component. The component is picked up based on the inclination / brightness distribution relationship.

  According to a sixth aspect of the present invention, in the component mounting method according to the fifth aspect, the surface luminance distribution is measured simultaneously with the recognition of the outer shape of the component, and the component is determined based on the obtained inclination / luminance distribution relationship. When the calculated inclination of the part is larger than a part inclination threshold set in advance for each part, the suction of the part is stopped.

  According to a seventh aspect of the present invention, in the component mounting method according to the fifth aspect, the surface luminance distribution is measured simultaneously with the recognition of the outer shape of the component, and the component is determined based on the obtained inclination / luminance distribution relationship. When the calculated inclination of the component is larger than a component inclination threshold set in advance for each component, the tray stage portion holding the tray is inclined and the suction nozzle that sucks the component is The component is adsorbed by bringing the tip surface and the upper surface of the component into a parallel state.

  According to an eighth aspect of the present invention, in the component mounting method according to the fifth aspect, the surface luminance distribution is measured at the same time when the outer shape of the component is recognized, and the component is determined based on the obtained inclination / luminance distribution relationship. When the calculated inclination of the component is larger than a component inclination threshold set in advance for each component, the suction nozzle that sucks the component is tilted, and the tip surface of the suction nozzle and the component The above-mentioned parts are adsorbed in a parallel state with the upper surface.

  According to the present invention, since it is possible to measure and check the inclination of a component before the suction of the component is lowered, it is possible to prevent the occurrence of problems such as damage to the component due to the suction nozzle at the tip of the supply head. In particular, the inclination of the component is measured from the surface luminance distribution of the supplied component in parallel with the component outline recognition performed at the time of supplying the component, and the supplied component is inclined more than the threshold of the component inclination allowable value input in the data input unit. In such a case, the operation of picking up the supply parts is stopped, or the tray stage holding the supply parts is tilted by the inclination of the parts and then taken out without lowering the current productivity (tact). Further, it is possible to eliminate the damage of the parts in the suction nozzle at the tip of the supply head.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic configuration diagram of a component mounting apparatus according to a first embodiment of the present invention, and FIG. 2 is a configuration diagram of an optical system according to the present embodiment, where 1 is a tray, 2 is a component, 3 is a suction nozzle, 4 Is a supply head vertical drive unit, 6 is a supply head horizontal rotation drive unit, 7 is a tray stage, 8 is a tray stage horizontal X direction drive unit, 9 is a tray stage horizontal Y direction drive unit, and 10 is an objective lens. , 11 is a supply camera, 12 is an image processing unit, 13 is a tray step, 14 is a light source, 15 is a half mirror, 16 is a main body control data storage unit, and 17 is a CPU (central processing unit) as a control unit for controlling each unit. Unit).

  The configuration and operation of this embodiment will be described with reference to the process flow shown in FIG.

  In the present embodiment, components 2 such as IC and glass are arranged in a matrix on a tray 1 provided with areas partitioned at regular intervals. In order to pick up the component 2 by suction, a feed head vertical drive unit 5 that drives the feed head 4 provided with the suction nozzle 3 in the vertical direction, a feed head horizontal rotation drive unit 6 that drives in the horizontal rotation direction, and a tray A tray stage horizontal X-direction drive unit 8 and a tray stage horizontal Y-direction drive unit 9 for driving the tray stage 7 holding 1 in the XY horizontal directions orthogonal to each other are provided.

  The parts 2 set on the tray stage 7 are positioned directly below the supply camera 11 by the driving units 5, 6, 8 and 9 (S1). The illumination light reflected from the upper surface of the component 2 passes through the objective lens 10 and enters the supply camera 11, and an image reception signal obtained by entering the supply camera 11 is input to the image processing unit 12 (S2). .

  As will be described in detail later, in the image processing unit 12 having a function as a calculation unit as a general rule, the center point of the component 2 and the rotation angle of the component are obtained (S3). The tray stage horizontal X and Y direction driving units 8 and 9 are moved so that the tips of the suction nozzles 3 provided on the supply head 4 coincide with each other (S9), and at the same time, the rotation angle is the same as that of the component 2. After the supply head horizontal rotation drive unit 6 is moved (S10), the supply head vertical drive unit 5 of the supply head 4 is lowered to a suction position where the component 2 can be sucked, and the suction nozzle 3 sucks the component 2 (S11). Thereafter, the supply head 4 is raised (S12).

  As shown in FIG. 1, the shape of the tray 1 is such that steps 13 are provided at corners in four directions in an area partitioned at a certain interval so that the entire lower surface of the component 2 does not contact the upper surface of the tray. The component 2 is mounted on the step 13, and the contact surface between the tray 1 and the component 2 is reduced as much as possible to reduce the adhesion of dust and the like.

  In the present embodiment, the inclination of the component 2 is checked simultaneously with the outer shape recognition of the component 2, the inclination of the component 2 is detected (S4), the detected angle is corrected, and the component 2 is sucked. It is configured.

  Specifically, as shown in FIG. 2, the back surface is a mirror-finished component 2 such as an IC chip or glass having a component size of about 6 mm, and the back surface is placed in each area of the tray 1 divided into an area of about 8 mm. The tray 1 is set on the upper surface, and the tray 1 is set on the tray stage 7. The illumination light reflected on the upper surface of the component 2 set on the tray 1 in this way passes through the objective lens 10 and enters the supply camera 11. An image reception signal from the supply camera 11 is input to the image processing unit 12, and the image processing unit 12 performs external shape recognition and inclination check of the component 2.

  The principle of component inclination check will be described.

  As shown in FIG. 4, the surface emitting power LED 18 with the irradiation angle ± A ° on which the power LED element is mounted is disposed so that the illumination surface with the irradiation angle of −A ° to A ° is continuously irradiated onto the target component surface. By doing so, the mirror surface which is the upper surface of the component 2 is configured to be continuously irradiated with illumination light having an irradiation angle of −A ° to A °.

  In this example, the irradiation angle ± 10 degrees so that each area surface of the tray 1 of 8 × 8 mm including the target component size 6 × 6 mm is continuously irradiated with illumination light having an irradiation angle of −10 degrees to 10 degrees. The surface light-emitting power LED 18 is arranged so that illumination light with an irradiation angle of −10 ° to 10 ° is continuously irradiated onto the mirror surface which is the upper surface of the component 2, and all the light reflected by the mirror surface which is the upper surface of the component 2 Is configured to enter the image receiving portion of the supply camera 11 through the objective lens 3. Further, the lens system of the objective lens 2 is uniformly irradiated with illumination light having an irradiation angle of −10 ° to 10 ° on the upper surface of the component 2 when the component inclination is 0 degree because the upper surface of the component 2 is a mirror surface. Then, the lens diameter is set so that all reflected illumination light can be received by the objective lens 10.

  As a result, when the component 2 is inclined at an arbitrary angle, the reflected light obtained by uniformly irradiating the illumination light with the irradiation angle of −10 ° to 10 ° onto the mirror surface of the upper surface of the component 2 is partially reflected. The inclination angle of the component 2 is measured by using the fact that the amount of light entering the image receiving portion of the supply camera 11 is reduced so that it does not pass through the lens 10 and the component inclination becomes darker than in the case of 0 degree. Can do.

  Next, the configuration of the optical system constituting the principle will be described. First, a method for obtaining the diameter of the objective lens 10 will be described. For example, when the minimum verification angle of the minimum component inclination that can measure the inclination of the 6 × 6 mm component 2 is set to 2 ° with respect to the irradiation area of 8 × 8 mm area, When the x8 mm area is uniformly irradiated with illumination light having an irradiation angle of −10 ° to 10 °, the minimum lens diameter at which the objective lens 10 can receive all the illumination light reflected by the mirror surface on the upper surface of the component 2 is When the work distance from the lens 10 to the upper surface of the component 2 is WD, the following expression (1) is established.

Irradiation area + 2 x WD x Tan (irradiation angle) ··· Equation (1)
In the case of this example, 8 mm + 2 × WD × Tan (10 °) is established. When the minimum verification angle is set to 2 °, the mirror surface on the upper surface of the component 2 is uniformly irradiated with illumination light having an irradiation angle of −10 ° to 10 °, and the minimum verification angle of the component 2 is tilted by 2 ° or more. In order to prevent the reflected light from the mirror surface on the upper surface of the component from passing through the objective lens 10, the following equation (2) must be established.

Irradiation area + WD × Tan (irradiation angle) <WD × Tan (irradiation angle + minimum verification angle × 2) (2)
In this example, the minimum WD that satisfies 8 mm + WD × Tan (10 °) <WD × Tan (10 ° + 2 ° × 2) is 109.5875 mm. If the WD is 110 mm, the objective lens diameter is 8 mm + 2 × 110 × Tan (10 °) = 46.79 mm from the above equation (1).

  When the irradiation area is 8 × 8, the relationship between the irradiation angle satisfying the equation (2), the WD, and the lens diameter obtained from the equation (1) is as shown in (Table 1).

表１より、１０°の照射角のＬＥＤ光源を設定した場合、レンズ径は約４７ｍｍとなり、照射角が１０°よりも大きくなると、レンズ径が大きくなるため、構成が難しくなることが分る。一方、ＬＥＤの照射角の小さくなればなるほど実現性がないため、現在最適な設定として照射角１０°、ＷＤを１１０ｍｍ、レンズ径を４６．７９ｍｍと設定した。

From Table 1, it can be seen that when an LED light source with an irradiation angle of 10 ° is set, the lens diameter is about 47 mm, and when the irradiation angle is larger than 10 °, the lens diameter is increased, which makes the configuration difficult. On the other hand, as the irradiation angle of the LED becomes smaller, there is no feasibility. Therefore, as the currently optimal settings, the irradiation angle is set to 10 °, the WD is set to 110 mm, and the lens diameter is set to 46.79 mm.

  Next, a configuration in which illumination light is uniformly irradiated to the target irradiation area at a constant irradiation angle will be described. For example, a configuration for uniformly irradiating illumination light on an 8 × 8 mm area at an irradiation angle of −10 ° to 10 ° will be described.

  As a light source, a surface-emitting power LED 18 having an irradiation angle of ± 10 degrees and having a power LED element having a diameter of 24 mm is provided. The light source 14 is irradiated from the lateral direction, and the component 2 in the downward direction can be irradiated with light through the half mirror 15 installed at 45 °. In order to irradiate the target illumination area uniformly with a constant illumination angle, when the distance from the light source 14 to the upper surface of the component 2 is LWD (light work distance), the following equation (3) is obtained: It is necessary to satisfy the LWD.

2 × LWD × Tan (irradiation angle) + illumination area = light source diameter—formula (3)
Moreover, the dimension of the half mirror 15 is calculated | required by the following Formula (4).

Light source diameter x √2 + 2 x LWD x Tan (irradiation angle) ··· Equation (4)
In the case of this example, in order to uniformly illuminate the upper surface of the 8 × 8 mm area at an irradiation angle of −10 ° to 10 °, LWD (light work distance) from the light source 14 to the upper surface of the component 2 is used. Needs to be LWD satisfying the formula 2 × LWD × Tan (10 °) + illumination area 8 mm = light source diameter 24 mm.

  In this case, the LWD (light work distance) is 45.37 mm. Further, the dimension of the half mirror 15 is 24 mm × √2 + 2 × 45.37 × Tan (10 °) = 49.91 mm with the diameter of the light source 14 being 24 mm. From the above, the configuration of the optical system of the light source 14, the component 2, and the objective lens 10 is the numerical value shown in FIG.

  Next, a method for obtaining the inclination of the component 2 by measuring the surface luminance distribution of the component 2 after obtaining the relationship between the inclination of the component 2 and the surface luminance distribution of the upper surface of the component 2 in advance will be described.

  First, the relationship between the inclination of the component 2 and the illuminance is obtained in advance by measurement as in the graph shown in FIG. Then, simultaneously with the recognition of the external shape of the component 2, the surface luminance distribution of the mirror surface on the upper surface of the target component 2 is measured to determine the inclination of the component.

  As shown in FIG. 3, the CPU 17 compares the calculated component inclination (S4) with a component inclination threshold set as data that can be set for each component that can be used in the present apparatus. When the component tilt is large (S5), in the case of an apparatus that does not include a tray stage tilt correction means such as a tilt mechanism (in the case of “None” in S6), the main part of the operation of the apparatus is stopped (S7). ) Or an apparatus equipped with a tray stage tilt correction means such as a tilt mechanism (in the case of “Yes” in S6), a tilt mechanism that holds the tray 1 by the measured component tilt angle is provided. The tray stage 7 is tilted so that the front end surface of the suction nozzle 3 and the upper surface of the component 2 are parallel to each other (S8), and the component 2 is sucked in the steps (S9) to (S11) described above. , Offering Head 4 is raised to move (S12).

  In the present embodiment, since the mirror surface state of the upper surface of the component 2 also differs for each component, a calibration function for obtaining the relationship between the component tilt and the surface luminance distribution is mounted. As a calibration function, a tilt mechanism is provided on the tray stage 7 holding the tray 1, the component 2 is set on the tray 1, and the tray stage 7 is moved so that the component 2 is reflected on the supply camera 11. The surface luminance distribution on the upper surface of the component 2 is measured each time the inclination of the tray 1, that is, the inclination of the component 2 is changed at a certain interval, and the relationship between the inclination of the component 2 and the surface luminance distribution of the component 2 is obtained. The configuration is adopted.

  Then, the obtained result is stored in the main body control data storage unit 16 as target part data. At the time of production, when a production target part is selected, the relationship between the surface luminance distribution of the target part and the inclination of the part stored in the main body control data storage unit 16 for each selected production target part is represented by the main body control data storage unit 16. , And the surface luminance distribution on the upper surface of the target component 2 is measured to obtain the inclination of the component 2.

  In the present embodiment, the case where the tray stage 7 is tilted by the tilt mechanism has been described. However, the same effect can be obtained by tilting the supply head 4 relatively by the tilt mechanism instead of the tray stage 7. .

  The present invention is applicable to a component mounting apparatus that mounts a component on a target workpiece.

Schematic configuration diagram of a component mounting apparatus according to Embodiment 1 Configuration diagram of a configuration example of an optical system according to Embodiment 1 Flowchart according to component mounting operation process in the first embodiment Explanatory drawing of the irradiation method to the object part surface in Embodiment 1 The graph which shows the relationship between the inclination of the components in Embodiment 1, and illumination intensity Schematic configuration diagram of a conventional component mounting device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tray 2 Component 3 Adsorption nozzle 4 Supply head 5 Supply head vertical drive part 6 Supply head horizontal rotation drive part 7 Tray stage 8 Tray stage horizontal X direction drive part 9 Tray stage horizontal Y direction drive part 10 Objective lens 11 Supply camera 12 Image Processing unit 13 Tray step 14 Light source 15 Half mirror 16 Main body control data storage unit 17 CPU (Central processing unit)
18 Surface emitting power LED

Claims (8)

A supply head having a suction nozzle for sucking parts on the tray;
A tray stage unit for holding the tray;
An illumination unit capable of irradiating light on the upper surface of the component at a certain irradiation angle;
A camera unit that receives reflected light reflected from the upper surface of the component;
A calculation unit for calculating the inclination of the component based on the measurement result of the surface luminance distribution obtained from the reflected light;
A component mounting apparatus comprising: a control unit that controls the suction nozzle based on the inclination of the component calculated by the calculation unit.   The component mounting apparatus according to claim 1, wherein the control unit is configured to stop a component suction operation when the tilt of the component is larger than a component tilt threshold set in advance for each component. A tilt mechanism for tilting the tray stage unit;
When the tilt of the component is larger than a component tilt threshold set in advance for each component, the control unit tilts the tray stage unit by the tilt mechanism, and the tip surface of the suction nozzle and the top surface of the component The component mounting apparatus according to claim 1, wherein the component is sucked by the suction nozzle in a parallel state. A tilt mechanism for tilting the supply head;
When the tilt of the component is larger than a preset component tilt threshold for each component, the control unit tilts the supply head by the tilt mechanism, and a tip surface of the suction nozzle and an upper surface of the component The component mounting apparatus according to claim 1, wherein the component is sucked by the suction nozzle in a parallel state.   After the component is set on the tray so as to receive the reflected light reflected from the upper surface of the component on the tray and the center of the component is reflected, the upper surface of the component is changed while relatively changing the inclination of the tray at regular intervals. The surface luminance distribution of the reflected light is measured a plurality of times to determine the inclination / luminance distribution relationship between the inclination of the component and the surface luminance distribution of the component, and the component is adsorbed based on the obtained inclination / luminance distribution relationship A component mounting method characterized by the above.   The surface brightness distribution is measured simultaneously with the outer shape recognition of the part, the inclination of the part is calculated based on the obtained inclination / brightness distribution relationship, and the calculated inclination of the part is preset for each part. The component mounting method according to claim 5, wherein the suction of the component is stopped when the component tilt threshold is larger than the component tilt threshold.   The surface brightness distribution is measured simultaneously with the outer shape recognition of the part, the inclination of the part is calculated based on the obtained inclination / brightness distribution relationship, and the calculated inclination of the part is preset for each part. If the component tilt threshold is greater than the component tilt threshold, the tray stage portion that holds the tray is tilted, and the tip surface of the suction nozzle that sucks the component is parallel to the top surface of the component to suck the component. The component mounting method according to claim 5.   The surface brightness distribution is measured simultaneously with the outer shape recognition of the part, the inclination of the part is calculated based on the obtained inclination / brightness distribution relationship, and the calculated inclination of the part is preset for each part. The suction nozzle that sucks the component is tilted when the component tilt threshold is larger than the component tilt threshold, and the tip surface of the suction nozzle and the upper surface of the component are parallel to suck the component. Item 5. The component mounting method according to Item 5.

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