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JP5016587B2 - LED lamp - Google Patents

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JP5016587B2
JP5016587B2 JP2008313603A JP2008313603A JP5016587B2 JP 5016587 B2 JP5016587 B2 JP 5016587B2 JP 2008313603 A JP2008313603 A JP 2008313603A JP 2008313603 A JP2008313603 A JP 2008313603A JP 5016587 B2 JP5016587 B2 JP 5016587B2
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support
heat
peripheral surface
led
back side
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JP2010140677A (en
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豊作 塩原
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Ssec株式会社
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Description

この発明は、事務所、一般住宅、店舗、学校、冷凍庫、看板などに用いられるLEDランプに関するものである。 The present invention office, residential, shop, school, freezer, on the L ED lamps that are used to, such as billboards.

最近は、白熱電球による照明灯に代えて弾丸型や表面実装型などのLED(発光ダイオード)を組み込んでいるLEDランプ(発光ダイオード照明灯)が使用されている例が多い。これは、このLEDランプは白熱照明灯と比較して長寿命であってかつ消費電力が少ないからである。
LEDランプは、LED単独では発光量が小さいために、複数のLEDを直線状に単一列又は複数列に配置した状態で用いられている(特開2001−351402号公報及び特開2004−335426号公報など)。
しかしながら、例えば特開2004−335426号公報に記載の蛍光灯兌換型発光ダイオード灯において、棒状合成樹脂外管体内の温度は複数の白色発光ダイオードから発生する熱によって上昇し、温度上昇が白色発光ダイオードの劣化を招く課題がある。
このような温度上昇によるLEDランプの短命化の課題を解決するために、放熱板を有するLEDランプが提案されている(特開2008−77948号公報及び実用新案登録第3145174号公報)。
特開2008−77948号公報に記載の照明灯用灯具(以下「従来例1」という。)は、当該公報の図2に示すように発光体である発光ダイオード3から生じる熱を除く放熱板を兼用している反射板6を備えている。反射板6は略W字状に形成され、中央山型状の2個の傾斜面61に、発光ダイオード3を配置した基板5がねじなどの固定手段Kによって取り付けられている。
実用新案登録第3145174号公報に記載の合成樹脂製蛍光灯用ランプシェード(以下「従来例2」という。)は、当該公報の図3に示すようにパイプ状ランプシェード1に設けた切れ込み溝には、LEDランプ4をセットした基盤3をその下部に取り付けたアルミニウム製放熱板2を嵌合させてあり、この放熱板によってLEDランプ4からの熱を逃がすものである。
特開2001−351402公報 特開2004−335426号公報 特開2008−77948号公報 実用新案登録第3145174号公報
Recently, there are many examples in which LED lamps (light emitting diode lighting) incorporating LEDs (light emitting diodes) such as bullet type or surface mount type are used instead of the lighting lamps of incandescent bulbs. This is because this LED lamp has a longer life and consumes less power than an incandescent lamp.
LED lamps are used in a state where a plurality of LEDs are linearly arranged in a single row or a plurality of rows because the amount of light emitted by the LED alone is small (Japanese Patent Laid-Open Nos. 2001-351402 and 2004-335426). Gazette).
However, in the fluorescent lamp-converting light-emitting diode lamp described in, for example, Japanese Patent Application Laid-Open No. 2004-335426, the temperature inside the rod-shaped synthetic resin outer tube rises due to heat generated from a plurality of white light-emitting diodes, and the temperature rise is white light-emitting diodes There is a problem that causes deterioration.
In order to solve the problem of shortening the life of the LED lamp due to such a temperature rise, an LED lamp having a heat sink has been proposed (Japanese Patent Laid-Open No. 2008-77948 and Utility Model Registration No. 3145174).
An illumination lamp device described in Japanese Patent Application Laid-Open No. 2008-77948 (hereinafter referred to as “conventional example 1”) has a heat radiating plate for removing heat generated from the light emitting diode 3 as a light emitter as shown in FIG. A reflector 6 is also provided. The reflecting plate 6 is formed in a substantially W shape, and a substrate 5 on which the light emitting diode 3 is arranged is attached to two central mountain-shaped inclined surfaces 61 by fixing means K such as screws.
A synthetic resin fluorescent lamp lamp shade (hereinafter referred to as “conventional example 2”) described in Japanese Utility Model Registration No. 3145174 is formed in a cut groove provided in a pipe-shaped lamp shade 1 as shown in FIG. Is fitted with an aluminum heat dissipating plate 2 to which a base 3 on which an LED lamp 4 is set is attached, and heat from the LED lamp 4 is released by the heat dissipating plate.
JP 2001-351402 A JP 2004-335426 A JP 2008-77948 A Utility Model Registration No. 3145174

従来例1及び従来例2のいずれも、LEDから発生される熱を除く(逃す)機能を果たすことができる利点があるものの、従来例1では反射板6と発光ダイオード3を配置した基板5との組み立てが面倒であり、従来例2についても放熱板2とLEDランプ4をセットした基盤3との関係において従来例1と同様の課題がある。
この発明の目的は、組み立てが容易となるLEDランプを提供することにある。
Although both Conventional Example 1 and Conventional Example 2 have the advantage of being able to fulfill the function of removing (dissipating) the heat generated from the LEDs, in Conventional Example 1, the substrate 5 on which the reflector 6 and the light emitting diode 3 are arranged, The conventional example 2 has the same problems as the conventional example 1 in relation to the heat sink 2 and the substrate 3 on which the LED lamp 4 is set.
The purpose of the invention is to provide a L ED lamp assembly that facilitates the Do.

この発明に係るLEDランプの第1の特徴は、支持溝を有するLEDランプ用の放熱支持体と、この放熱支持体の支持溝内に挿入支持してありかつその長さ方向に光源であるLEDを複数配置してある基板と、保持手段及び内部の背部側に設けてある収納室をそれぞれ有する円筒形の管体とを備えていることにある。上記放熱支持体の本体には、その背部側の外周面から上記支持溝側に向けて切り込んである配線溝を形成し、上記背部側とは反対側である支持側に上記支持溝を形成し、この支持溝の開口が上記LEDの照射方向に向けて設けられており、上記外周面が凸状の円弧面に形成されていると共に、上記管体の内周面に密着可能である。上記LEDは、上記収納室から上記管体の上記背部側とは反対側である照射側に向けて照射可能である。上記保持手段は、上記管体の背面側の位置の内周面から内方に向けて互いに対向するように突出している板状の保持部からなる。上記板状の両保持部は、上記管体の長さ方向に沿って全長に亘って形成され、かつ両保持部の先端部間に間隙が形成されている。上記収納室は、上記管体内の背部側の内周面と上記保持部によって囲まれた空間によって形成されている。上記管体の収納室内に挿入配置されている上記放熱支持体は、上記両保持部と上記収納室の管体の内周面とによって挟まれた状態で保持されている。
上記本体の背部側の外周面は、上記放熱支持体のLEDランプの円筒形の管体内における位置保持安定のために、上述したように、凸状の円弧面を形成し、上記管体の内周面に密着可能にしている。
この発明に係るLEDランプの第2の特徴は、上記第1の特徴を前提とし、上記両保持部の先端部が管体の背部側に屈曲された押え部となっており、収納室内の放熱支持体は上記両保持部の押え部と、上記管体の内周面とによって挟まれた状態で保持されていることにある。
この発明に係るLEDランプの第3の特徴は、上記第1又は上記第2の特徴を前提とし、上記放熱支持体の背部側の外周面は放熱性膜によって被覆されていると共に、管体の内周面に上記放熱性膜を介して密着されており、基板のLEDの取付け面とは反対側の面である背面は放熱性膜によって被覆されかつ上記放熱支持体の支持溝内面に密着されており、上記管体の背部の外周面には上記放熱支持体の背部側の外周面に対向位置関係に帯状の放熱性膜をその長さ方向に沿って形成してあり、外側に位置している上記管体の放熱性膜、中間に位置している上記放熱支持体の放熱性膜及び内側に位置している上記基板の放熱性膜は間隔を置いて配置された三層の放熱性膜となっていることにある。
A first feature of the LED lamp according to the present invention is a heat dissipation support for an LED lamp having a support groove, and an LED which is inserted and supported in the support groove of the heat dissipation support and is a light source in its length direction. And a cylindrical tube body each having a holding means and a storage chamber provided on the inner back side. A wiring groove that is cut from the outer peripheral surface on the back side toward the support groove side is formed in the main body of the heat dissipation support, and the support groove is formed on the support side that is opposite to the back side. , the opening of the supporting groove is provided towards the irradiation direction of the LED, together with the outer peripheral surface is formed in a convex arc surface, it can be in close contact with the inner peripheral surface of the tube. The LED can be irradiated from the storage chamber toward an irradiation side opposite to the back side of the tubular body. The holding means includes a plate-like holding portion protruding so as to face each other inward from an inner peripheral surface at a position on the back surface side of the tubular body. The two plate-like holding portions are formed over the entire length along the length direction of the tubular body, and a gap is formed between the tip portions of the two holding portions. The storage chamber is formed by a space surrounded by the inner peripheral surface on the back side in the tubular body and the holding portion. The heat dissipating support body inserted and arranged in the storage chamber of the tube body is held in a state of being sandwiched between the both holding portions and the inner peripheral surface of the tube body of the storage chamber.
The outer peripheral surface of the back side of the body, for location stably held in the tube body of a cylindrical LED lamp of the radiator support, as described above, to form a convex arc surface, of the tubular body It is possible to adhere to the peripheral surface .
The second feature of the LED lamp according to the present invention is based on the first feature, and is a holding portion in which the tip portions of both the holding portions are bent toward the back side of the tubular body, and heat dissipation in the storage chamber. The support body is held in a state of being sandwiched between the pressing portions of the both holding portions and the inner peripheral surface of the tubular body.
A third feature of the LED lamp according to the present invention is based on the first or second feature described above, and the outer peripheral surface on the back side of the heat radiating support is covered with a heat radiating film. It is in close contact with the inner peripheral surface through the heat dissipating film, and the back surface, which is the surface opposite to the LED mounting surface, is covered with the heat dissipating film and is in close contact with the inner surface of the support groove of the heat dissipating support. A strip-shaped heat-dissipating film is formed on the outer peripheral surface of the back portion of the tube body in the longitudinal direction so as to face the outer peripheral surface on the back side of the heat-dissipating support body, and is positioned outside. The heat-dissipating film of the tube body, the heat-dissipating film of the heat-dissipating support located in the middle, and the heat-dissipating film of the substrate located inside are three layers of heat-dissipating properties arranged at intervals It is in the film.

この発明のLEDランプによれば、管体内の収納室に放熱支持体を挿入配置し、放熱支持体の支持溝を通じてLEDを取り付けている基板を挿入支持可能であるから組み立てが容易となり、簡単な構成によって上記基板からの熱を放熱支持体を通じて除くことができ、上記収納室が上記管体の背部側に設けられているので、管体の表面にLEDの影がドット状に表れにくくなる。 According to the LED lamp of the present invention , the heat radiation support is inserted and disposed in the housing chamber of the tube body, and the substrate to which the LED is attached can be inserted and supported through the support groove of the heat radiation support. According to the configuration, heat from the substrate can be removed through the heat radiating support, and the housing chamber is provided on the back side of the tubular body, so that the shadow of the LED hardly appears in a dot shape on the surface of the tubular body.

この発明に係るLEDランプ用の放熱支持体を用いるLEDランプについて図面を参照して説明する。
まず、LEDランプ用の放熱支持体について図1〜図9を参照して説明する。
図1〜図6に示す放熱支持体1は、その本体1aが放熱部材であるアルミニウム材を用いた棒状体で構成され、ヒートシンクの機能を果たしているものである。
放熱支持体1(本体1a)には、その背部側(図1上側)とは反対側(下側)にその長さ方向に全長に亘って支持溝11を形成してある。支持溝11の開口16は下側である照射側(後述するLED3の光の照射方向側)に向けられており、開口の両側縁部に受け部15を設けてある。
放熱支持体1(本体1a)の背部側(図1上側)の外周面1a1にはその長さ方向に全長に亘って単一又は複数の配線溝(図1に示す例では複数の配線溝12,13,14)を形成してある。放熱支持体1の上側の外周面1a1の外形は凸状の円弧面を形成している。放熱支持体1の外周面1a1は、後述するLEDランプ5の円筒形の管体6の内周面に密着可能である(図13)。
また、放熱支持体1の外周面1a1は、図6に示すように放熱性膜17、例えばセラミックコート膜を塗布してあり、この外周面全面を上記放熱性膜によって被覆している。
放熱支持体1は押出し機を用いて押出成形法により加工される。
An LED lamp using a heat dissipation support for an LED lamp according to the present invention will be described with reference to the drawings.
First, a heat dissipation support for an LED lamp will be described with reference to FIGS.
The heat dissipation support 1 shown in FIGS. 1 to 6 has a main body 1a made of a rod-shaped body using an aluminum material that is a heat dissipation member, and functions as a heat sink.
The heat radiation support 1 (main body 1a) is provided with a support groove 11 on the opposite side (lower side) to the back side (upper side in FIG. 1) in the length direction over the entire length. The opening 16 of the support groove 11 is directed to the lower irradiation side (the light irradiation direction side of the LED 3 described later), and receiving portions 15 are provided at both side edges of the opening.
On the outer peripheral surface 1a1 on the back side (upper side in FIG. 1) of the heat radiation support body 1 (main body 1a), a single or a plurality of wiring grooves (in the example shown in FIG. 1, a plurality of wiring grooves 12 in the length direction). , 13, 14). The outer shape of the upper outer peripheral surface 1a1 of the heat dissipation support 1 forms a convex arc surface. The outer peripheral surface 1a1 of the heat radiating support 1 can be in close contact with the inner peripheral surface of a cylindrical tube 6 of the LED lamp 5 described later (FIG. 13).
Further, as shown in FIG. 6, the outer peripheral surface 1a1 of the heat dissipation support 1 is coated with a heat dissipating film 17, for example, a ceramic coat film, and the entire outer peripheral surface is covered with the heat dissipating film.
The heat radiating support 1 is processed by an extrusion method using an extruder.

放熱支持体1は、図7〜図9に示すように支持溝11内においてLED(発光ダイオード)3を実装したLED付きの基板2を挿入支持可能である。
LED付きの基板2は、その本体が細長い板体からなり、組み立て時に放熱支持体1の支持溝11内に嵌め込まれる。基板2には、LED3に電気的に接続している制御部(図示せず。)を設けてある。基板2の一側面(図7下面)には単一又は複数列のLED3を直線状に間隔を置いて配置し、一端部にブリッジ整流器(ブリッジダイオード)4を取り付けてある。図7〜図9に示す例では、基板2には、複数の白色発光のLED3をその長さ方向に沿って等間隔を置いて一直線状に配列され、そして基板の一側片面である表面(図7下面)全面に白色の印刷又は白色シート(図示せず。)の貼付をすることによって、内部反射光の取り出し効率を上げるようにしている。また基板2のLED3の取付け面とは反対側である裏面(図7上面)の全面には、例えばセラミックコート膜からなる放熱性膜21(図7)を塗布してある。
LED付きの基板2が放熱支持体1の支持溝11内に収納されているとき、図7に示すように本体両側が受け部15上に載せられた状態で支持され、また各LED3はその下部が開口16より下方に露出されているため、光を下方に照射可能である。
LED付きの基板2を放熱支持体1に支持するためには、この基板を支持溝11の一側方(図9左方又は右方)の開口から支持溝内に差し入れてから、他側方に向けてスライドさせる。
As shown in FIGS. 7 to 9, the heat dissipation support 1 can insert and support a substrate 2 with an LED on which an LED (light emitting diode) 3 is mounted in a support groove 11.
The board | substrate 2 with LED consists of an elongate board body, and is inserted in the support groove | channel 11 of the thermal radiation support body 1 at the time of an assembly. The substrate 2 is provided with a control unit (not shown) that is electrically connected to the LEDs 3. Single or multiple rows of LEDs 3 are linearly spaced on one side surface (lower surface in FIG. 7) of the substrate 2, and a bridge rectifier (bridge diode) 4 is attached to one end. In the example shown in FIGS. 7 to 9, a plurality of white light emitting LEDs 3 are arranged on the substrate 2 in a straight line at equal intervals along the length direction, and a surface (one side surface of the substrate) ( The lower surface of FIG. 7) White printing or a white sheet (not shown) is applied to the entire surface to increase the efficiency of extracting internal reflected light. Further, a heat dissipating film 21 (FIG. 7) made of, for example, a ceramic coat film is applied to the entire back surface (upper surface of FIG. 7) opposite to the LED 3 mounting surface of the substrate 2.
When the board | substrate 2 with LED is accommodated in the support groove | channel 11 of the thermal radiation support body 1, as shown in FIG. 7, it supports with the body both sides mounted on the receiving part 15, and each LED3 is the lower part. Is exposed below the opening 16, it is possible to irradiate light downward.
In order to support the substrate 2 with the LED on the heat dissipation support 1, the substrate is inserted into the support groove from one side (left or right side of FIG. 9) of the support groove 11 and then the other side. Slide towards.

次に、放熱支持体1を組み込んだLEDランプ(発光ダイオードランプ)5について図10〜図17を参照して説明する。
LEDランプ5は、細長い円筒形パイプからなる管体6と、この管体の背部側である底部側(図11上側)に設けてある収納室63の内部に配置してある放熱支持体1と、この放熱支持体の支持溝11内に挿入かつ離脱可能に支持している基板2と、この基板に実装してある光源であるLED3と、上記管体の両端部に取り付けてある口金7とを備えている。LEDランプ5のLED3は、管体6の背部側とは反対側(図11下側)に向けて光を照射可能である。
Next, an LED lamp (light emitting diode lamp) 5 incorporating the heat dissipation support 1 will be described with reference to FIGS.
The LED lamp 5 includes a tube body 6 made of an elongated cylindrical pipe, and a heat radiation support body 1 disposed inside a storage chamber 63 provided on the bottom side (upper side in FIG. 11) which is the back side of the tube body. A substrate 2 that is detachably supported in the support groove 11 of the heat dissipation support, an LED 3 that is a light source mounted on the substrate, and a base 7 that is attached to both ends of the tube. It has. The LED 3 of the LED lamp 5 can irradiate light toward the side opposite to the back side of the tube body 6 (the lower side in FIG. 11).

管体6はプラスチック製パイプからなり、本例では蛍光塗料、拡散材及び変色防止材が配合されている乳白色のものが使用されている。
管体6は、図15〜図17に示すように、背部側(図14上側)の内周面に接近している位置に保持手段(図15に示す例では平板状の保持部61,62)を設けてある。保持部61,62は、管体6の長さ方向に沿って全長に亘って設けられている。保持部61,62は、図15左右両側に位置し、内方に向けてかつ互いに対向するように管体6の内周面から突出されている。保持部61,62は、それぞれの先端部が上側に屈曲している押え部61a,62aであり、両先端部が互いに間隙64を置いて対向位置関係にある。間隙64は、図17に示す例では管体6に全長に亘って形成されているスリット状のものである。管体6内の背部側の内周面と保持部61,62によって囲まれた空間が収納室63となっている。
管体6は、背部側である底部側(図13上側)の外周面に所定の幅Wの帯状の放熱性膜65を形成してある。放熱性膜65は、図12及び図13に示すように、管体6の長さ方向に沿って管体の一端から他端まで全長に亘って設けられている。放熱性膜65は例えばセラミックコート膜であり、管体6内の熱を吸収して管体外へ逃すことによって管体内の熱を下げる役割を果たしている。
管体6は、例えばパイプ押出し機を用いて押出成形法により加工され、その管本体と保持部61,62とが一体成形されている。
The tubular body 6 is made of a plastic pipe, and in this example, a milky white one containing a fluorescent paint, a diffusing material, and a discoloration preventing material is used.
As shown in FIGS. 15 to 17, the pipe body 6 is provided with holding means (in the example shown in FIG. 15, flat holding parts 61 and 62) at a position approaching the inner peripheral surface on the back side (upper side of FIG. 14). ) Is provided. The holding portions 61 and 62 are provided over the entire length along the length direction of the tube body 6. The holding portions 61 and 62 are located on both the left and right sides in FIG. 15 and protrude from the inner peripheral surface of the tubular body 6 so as to face inward and face each other. The holding portions 61 and 62 are presser portions 61 a and 62 a whose front end portions are bent upward, and the front end portions are in a facing positional relationship with a gap 64 therebetween. In the example shown in FIG. 17, the gap 64 has a slit shape formed over the entire length of the tube body 6. A space surrounded by the inner peripheral surface on the back side in the tubular body 6 and the holding portions 61 and 62 is a storage chamber 63.
The tubular body 6 is formed with a belt-like heat-dissipating film 65 having a predetermined width W on the outer peripheral surface on the bottom side (upper side in FIG. 13) which is the back side. As shown in FIGS. 12 and 13, the heat dissipation film 65 is provided over the entire length from one end of the tube body to the other end along the length direction of the tube body 6. The heat dissipating film 65 is, for example, a ceramic coat film, and plays the role of lowering the heat in the pipe body by absorbing the heat in the pipe body 6 and letting it out of the pipe body.
The tube body 6 is processed by an extrusion method using, for example, a pipe extruder, and the tube body and the holding portions 61 and 62 are integrally formed.

LED付きの基板2を支持溝11内に嵌め込んでいる放熱支持体1は、図10及び図11に示すように、管体6の収納室63の内部に配置されており、保持部61,62の押え部61a,62aと、収納室の管体の内周面とによって挟まれた状態で保持されている。この保持状態において、放熱支持体1の上側の外周面1a1は管体6の内周面に放熱性膜17を介して密着されて、放熱支持体の安定的な位置保持が保たれている。
また、放熱支持体1の外周面1a1は管体6の内周面への密着面を構成しており、この密着面に対して管体6の放熱性膜65が対向位置関係にある。上記の幅は、全長に亘って図12及び図13に示すように管体6を挟んで放熱性膜65の幅Wに対応している。このため、放熱支持体1の放熱性膜17と、管体6の放熱性膜65が管体を挟んで重なっている状態にあるために、放熱支持体1からの放熱は放熱性膜17から管体6を経て放熱性膜65へ円滑に逃すことができる。
As shown in FIGS. 10 and 11, the heat dissipation support 1 in which the substrate 2 with LED is fitted in the support groove 11 is arranged inside the storage chamber 63 of the tube body 6, and includes a holding portion 61, The holding parts 61a, 62a of 62 and the inner peripheral surface of the tubular body of the storage chamber are held in a sandwiched state. In this holding state, the outer peripheral surface 1a1 on the upper side of the heat dissipation support 1 is brought into close contact with the inner peripheral surface of the tube body 6 via the heat dissipation film 17, so that the stable position holding of the heat dissipation support is maintained.
Moreover, the outer peripheral surface 1a1 of the heat radiating support body 1 constitutes a close contact surface with the inner peripheral surface of the tube body 6, and the heat dissipating film 65 of the tube body 6 is in an opposing positional relationship with this close contact surface. The above-mentioned width corresponds to the width W of the heat radiation film 65 with the tubular body 6 interposed therebetween as shown in FIGS. For this reason, since the heat dissipating film 17 of the heat dissipating support 1 and the heat dissipating film 65 of the tube body 6 are overlapped with each other with the tube interposed therebetween, the heat dissipating from the heat dissipating support 1 is from the heat dissipating film 17 It is possible to smoothly escape to the heat dissipation film 65 through the tube body 6.

放熱支持体1の配線溝12,13,14は使用されるLEDの種類及び基板2の構成によって利用されるが、本例では配線を不要としている。また管体6の両端側に位置している口金7は幅広のものが使用されている。各口金7には端子ピン8を設けてあり、各端子ピンは基板2に電気的に接続されている。   The wiring grooves 12, 13, and 14 of the heat dissipation support 1 are used depending on the type of LED used and the configuration of the substrate 2, but no wiring is required in this example. Further, a wide base 7 is used at both ends of the tube body 6. Each base 7 is provided with a terminal pin 8, and each terminal pin is electrically connected to the substrate 2.

上記構成のLEDランプ5において、LED3からの放射光は、その光軸を中心として円錐状(放射状)に広がり、管体6の背部側と反対側の照射面を照射する。この際、LED3を取り付けている基板2は、管体6の背部側の収納室63内の放熱支持体1に支持されているために、LED3の放射角度が広がり、この結果、面発光としての効果が発揮され、管体の一側の表面へのLED3の影がドット状に表れにくくなり、この効果は管体6の色彩が乳白色であることによってより一層発揮されている。
LED3から発生される熱は、基板2から放熱支持体1に吸収され、吸収された熱は放熱支持体から管体6を経て外部に放出されてLEDランプ5内の高熱化が抑制される。放熱支持体1、基板2及び管体6のそれぞれの放熱性膜17,21,65によって高熱化の抑制がより一層効果的になる。
In the LED lamp 5 having the above configuration, the emitted light from the LED 3 spreads conically (radially) around the optical axis, and irradiates the irradiation surface opposite to the back side of the tube body 6. At this time, since the substrate 2 to which the LED 3 is attached is supported by the heat dissipation support 1 in the storage chamber 63 on the back side of the tube body 6, the emission angle of the LED 3 is widened. The effect is exerted, and the shadow of the LED 3 on the surface of one side of the tube is less likely to appear in the form of dots, and this effect is further exhibited by the fact that the color of the tube 6 is milky white.
Heat generated from the LED 3 is absorbed from the substrate 2 to the heat radiating support 1, and the absorbed heat is released from the heat radiating support through the tube 6 to the outside, and high temperature inside the LED lamp 5 is suppressed. The heat dissipation films 17, 21 and 65 of the heat dissipation support 1, the substrate 2 and the tube body 6 make the suppression of high heat even more effective.

管体6は、その材質の一つであるプラスチックとして、例えばポリカーボネートなどが使用される。管体6は、押出し成形法により加工する場合には、図示の例では予め乳白色のポリカーボネートペレット、蛍光塗料ペレット、拡散材ペレット及び変色防止材のそれぞれの配分比率を所定の値に設定しておく。これらの材質の配合比率を適宜変更することによって、LEDランプ5から照射される光の拡散、透視度及び光源からの照射率量の調整が図られる。
管体6の長さ、内径及び肉厚、そしてLED付きの基板2の長さ及び横幅、また保持部の突出長、さらに口金7の幅はいずれも適宜である。
The tube 6 is made of, for example, polycarbonate as a plastic material. When the tube body 6 is processed by an extrusion molding method, in the illustrated example, the distribution ratios of milky white polycarbonate pellets, fluorescent paint pellets, diffusing material pellets, and discoloration preventing materials are set to predetermined values in advance. . By appropriately changing the blending ratio of these materials, the diffusion of light irradiated from the LED lamp 5, the degree of transparency, and the amount of irradiation from the light source can be adjusted.
The length, inner diameter and thickness of the tube body 6, the length and width of the substrate 2 with LED, the protruding length of the holding portion, and the width of the base 7 are all appropriate.

図示するLEDランプ用の放熱支持体1では、支持溝11内にLED3を取り付けている基板2を挿脱可能に支持することができるから、組み立て解体が容易であり、基板からの熱を確実に逃すことができ、しかも放熱性膜17によってより一層放熱が確実になる。放熱支持体1の外周面に配線溝12,13,14を設けて、配線用のスペースを確保することができるので、上記スペース分だけ収納室63の空間を節約することでき、そして放熱支持体の放熱面積の拡大によってヒートシンクとしての効果を高めることができる。放熱支持体1の外周面を円弧面として管体6の内周面に密着可能とすることにより、放熱支持体の位置保持の安定化と熱を円滑かつ確実に管体側へ逃すことができ、放熱性膜65が放熱支持体1の放熱性膜17と接近しかつ対向しているので放熱効果がより一層高められる。
図示するLEDランプ5によれば、LED3を取り付けている基板2を支持している放熱支持体1を管体6内の背部側(底部側)に設けてある収納室63に配置されているので、光軸を中心として放射状に広がるLEDの光は、照射面までの距離が長くなるので、放射エリアが広がり、管体の表面に各LED3の影がドット状に表れにくく、LEDランプの設置場所やその用途の範囲が広がり、換言すれば、LEDランプの利用範囲を広げることができる。また、管体6はポリカーボネート、蛍光塗料、拡散材及び変色防止材を混合配分して乳白色のプラスチックパイプによって構成されているので、光の拡散、透視度及び光源であるLED3からの照射率量を調整することができ、管体6の背部側に基板2をその内周面に接近して配置してあることと相俟って管体の表面に各LED3の影がドット状に表れにくくする効果がより良く発揮され、LEDランプ5を多方面の照明手段として利用することができる。LEDランプ5の組み立て時に、収納室63内にLED付きの基板2を支持している放熱支持体1は、これをスライド挿入するだけで、管体6内に位置保持することができるので、組立作業が容易であると共に、離脱が可能であるので解体も容易である。基板2の放熱性膜21、放熱支持体1の放熱性膜17及び管体6の放熱性膜65は、図13に示すように、三層状態に配置されているので、LED3からの熱を基板2から放熱支持体1へ、さらに放熱支持体から管体6へと円滑にかつ確実に放熱されるので、効率的かつ効果的な放熱が可能となる。
In the heat dissipation support 1 for the LED lamp shown in the figure, the substrate 2 on which the LED 3 is mounted can be removably supported in the support groove 11, so that assembly and disassembly is easy, and heat from the substrate is reliably ensured. In addition, the heat dissipation film 17 further ensures heat dissipation. Since the wiring grooves 12, 13, and 14 can be provided on the outer peripheral surface of the heat dissipation support 1 to secure a space for wiring, the space of the storage chamber 63 can be saved by the space, and the heat dissipation support. The effect as a heat sink can be enhanced by expanding the heat radiation area. By allowing the outer peripheral surface of the heat dissipation support 1 to be in close contact with the inner peripheral surface of the tube body 6 as an arc surface, stabilization of the position holding of the heat dissipation support body and heat can be smoothly and reliably released to the tube body side, Since the heat dissipation film 65 is close to and faces the heat dissipation film 17 of the heat dissipation support 1, the heat dissipation effect is further enhanced.
According to the LED lamp 5 shown in the figure, the heat radiation support 1 that supports the substrate 2 to which the LED 3 is attached is disposed in the storage chamber 63 provided on the back side (bottom side) in the tube 6. LED light spreading radially around the optical axis increases the distance to the irradiation surface, so the radiation area is widened, and the shadow of each LED 3 is less likely to appear in the form of dots on the surface of the tube. In other words, the application range of the LED lamp can be expanded. The tube 6 is composed of milky white plastic pipe by mixing and distributing polycarbonate, fluorescent paint, diffusing material, and anti-discoloring material, so that the diffusion of light, transparency and the amount of irradiation from the LED 3 as the light source can be adjusted. It can be adjusted, and combined with the fact that the substrate 2 is arranged close to the inner peripheral surface on the back side of the tube body 6, the shadow of each LED 3 is less likely to appear in the form of dots on the surface of the tube body. The effect is better exhibited, and the LED lamp 5 can be used as a multi-directional illumination means. When the LED lamp 5 is assembled, the heat dissipating support 1 that supports the substrate 2 with the LED in the storage chamber 63 can be held in the tube 6 simply by sliding the assembly. The work is easy and the disassembly is easy because it can be detached. Since the heat dissipating film 21 of the substrate 2, the heat dissipating film 17 of the heat dissipating support 1, and the heat dissipating film 65 of the tube 6 are arranged in three layers as shown in FIG. Since heat is smoothly and reliably radiated from the substrate 2 to the heat radiating support 1 and from the heat radiating support to the tube 6, efficient and effective heat radiation is possible.

放熱支持体1の支持溝11内にLED付きの基板2を挿入した状態において、図11に示すように基板の裏面が支持溝11内面に密着するのが良い。もちろん、基板の裏面の構成によっては、この裏面を必ずしも支持溝11内面に密着することを要しない。また、配線溝12,13,14は、放熱支持体1に必要に応じて設けられるものである。配線溝を設けている場合、その数や断面形状は図示の例に限定されない。
上述した例では、管体6である乳白色のプラスチックパイプ内に白色光のLED3が配置されているが、このように管体における色彩は、LEDの発光色と同系色(同一色を含む。)とすることが、管体の表面にLEDの影が表れることを極力制限する観点から望ましい。同様の観点から、管体6は、透光性を有すると共に、非透明(不透明、半透明)部材であるのが良いが、透明であっても良い。もちろん、管体6の材質やLED3の発光色は上例に限定されない。
管体6の各保持部61,62は、いずれも管体に全長に亘って設けられているが、適宜間隔を置いて設けても良い。各保持部61,62の先端部に、上方に屈曲した押え部61a,62aを設けることによって放熱支持体1の安定的な保持に役立つ。しかし、各保持部61,62の先端部を屈曲させることなく、水平状態にしても良い。
LED3は、図示の例によれば、形状及び大きさがいずれも同一のものを用いているが、これに限定されず、またLED3は表面実装型のものを使用しているが、砲弾型など適宜の種類のものを用途などに応じて用いる。
In a state where the substrate 2 with LED is inserted into the support groove 11 of the heat dissipation support 1, it is preferable that the back surface of the substrate is in close contact with the inner surface of the support groove 11 as shown in FIG. Of course, depending on the configuration of the back surface of the substrate, the back surface does not necessarily need to be in close contact with the inner surface of the support groove 11. Moreover, the wiring grooves 12, 13, and 14 are provided in the heat dissipation support 1 as necessary. When wiring grooves are provided, the number and cross-sectional shape thereof are not limited to the illustrated example.
In the example described above, the white light LED 3 is arranged in the milky white plastic pipe that is the tube body 6, but the color in the tube body is similar to the emission color of the LED (including the same color). It is desirable from the viewpoint of limiting the appearance of LED shadows on the surface of the tube as much as possible. From the same point of view, the tube body 6 is translucent and may be a non-transparent (opaque or translucent) member, but may be transparent. Of course, the material of the tube 6 and the emission color of the LED 3 are not limited to the above example.
Each of the holding portions 61 and 62 of the tubular body 6 is provided over the entire length of the tubular body, but may be provided at an appropriate interval. By providing the holding portions 61 a and 62 a bent upward at the tip portions of the holding portions 61 and 62, it is useful for stably holding the heat dissipation support 1. However, the holding portions 61 and 62 may be in a horizontal state without bending the tip portions.
According to the illustrated example, the LED 3 has the same shape and size. However, the LED 3 is not limited to this, and the LED 3 uses a surface-mount type, but cannonball type, etc. An appropriate type is used according to the application.

この発明に係るLEDランプに用いる放熱支持体を示す斜視図である。It is a perspective view which shows the thermal radiation support body used for the LED lamp which concerns on this invention. この発明に係るLEDランプに用いる放熱支持体を示す平面図である。It is a top view which shows the thermal radiation support body used for the LED lamp which concerns on this invention. この発明に係るLEDランプに用いる放熱支持体を示す正面図である。It is a front view which shows the thermal radiation support body used for the LED lamp which concerns on this invention. この発明に係るLEDランプに用いる放熱支持体を示す底面図である。It is a bottom view which shows the thermal radiation support body used for the LED lamp which concerns on this invention. 図1のV−V線断面図である。It is the VV sectional view taken on the line of FIG. 図3のVI−VI線拡大断面図である。It is the VI-VI line expanded sectional view of FIG. この発明に係るLEDランプに用いるLED付きの基板を支持している放熱支持体を示す拡大側面図である。It is an enlarged side view which shows the thermal radiation support body which is supporting the board | substrate with LED used for the LED lamp which concerns on this invention. この発明に係るLEDランプに用いるLED付きの基板を支持している放熱支持体を示す底面図である。It is a bottom view which shows the thermal radiation support body which is supporting the board | substrate with LED used for the LED lamp which concerns on this invention. この発明に係るLEDランプに用いるLED付きの基板を支持している放熱支持体を示す一部切欠正面図である。It is a partially notched front view which shows the thermal radiation support body which is supporting the board | substrate with LED used for the LED lamp which concerns on this invention. この発明に係るLEDランプを示す一部切欠正面図である。It is a partially cutaway front view which shows the LED lamp which concerns on this invention. 図10のXI−XI線拡大断面図である。It is the XI-XI line expanded sectional view of FIG. この発明に係るLEDランプに用いる放熱支持体を保持している管体を示す一部切欠平図である。Is a plan view partially cut away showing the tube holding the radiator support used in the LED lamp according to the present invention. この発明に係るLEDランプに用いる放熱支持体を保持している管体を示す拡大側面図である。It is an enlarged side view which shows the tubular body holding the thermal radiation support body used for the LED lamp which concerns on this invention. 図13のXIV−XIV線断面図である。It is the XIV-XIV sectional view taken on the line of FIG. この発明に係るLEDランプに用いる管体を示す側面図である。It is a side view which shows the tubular body used for the LED lamp which concerns on this invention. 図15のXVI−XVI線断面図である。It is the XVI-XVI sectional view taken on the line of FIG. 図15のXVII−XVII線断面図である。It is the XVII-XVII sectional view taken on the line of FIG.

符号の説明Explanation of symbols

1 放熱支持体
1a 放熱支持体の本体
1a1 外周面
11 支持溝
12,13,14 配線溝
16 開口
17 放熱性膜
2 LED付きの基板
21 放熱性膜
3 LED(発光ダイオード)
5 LEDランプ
6 管体
61,62 保持部(保持手段)
61a,62a 押え部
63 収納室
65 放熱性膜
DESCRIPTION OF SYMBOLS 1 Heat radiation support body 1a Body of heat radiation support body 1a1 Outer peripheral surface 11 Support groove 12, 13, 14 Wiring groove 16 Opening 17 Heat radiation film 2 Substrate with LED 21 Heat radiation film 3 LED (light emitting diode)
5 LED lamp 6 Tube 61, 62 Holding part (holding means)
61a, 62a Holding part 63 Storage chamber 65 Heat radiation film

Claims (3)

支持溝を有するLEDランプ用の放熱支持体と、この放熱支持体の支持溝内に挿入支持してありかつその長さ方向に光源であるLEDを複数配置してある基板と、保持手段及び内部の背部側に設けてある収納室をそれぞれ有する円筒形の管体とを備えており、
上記放熱支持体の本体には、その背部側の外周面から上記支持溝側に向けて切り込んである配線溝を形成し、上記背部側とは反対側である支持側に上記支持溝を形成し、この支持溝の開口が上記LEDの照射方向に向けて設けられており、上記外周面が凸状の円弧面に形成されていると共に、上記管体の内周面に密着可能であり、
上記LEDは、上記収納室から上記管体の上記背部側とは反対側である照射側に向けて照射可能であり、
上記保持手段は、上記管体の背面側の位置の内周面から内方に向けて互いに対向するように突出している板状の保持部からなり、
上記板状の両保持部は、上記管体の長さ方向に沿って全長に亘って形成され、かつ両保持部の先端部間に間隙が形成されており、
上記収納室は、上記管体内の背部側の内周面と上記保持部によって囲まれた空間によって形成されており、
上記管体の収納室内に挿入配置されている上記放熱支持体は、上記両保持部と上記収納室の管体の内周面とによって挟まれた状態で保持されている
ことを特徴とするLEDランプ。
A heat dissipating support for an LED lamp having a support groove, a substrate inserted and supported in the support groove of the heat dissipating support, and a plurality of LEDs serving as light sources in its length direction, a holding means, and an interior And a cylindrical tube body each having a storage chamber provided on the back side of
A wiring groove that is cut from the outer peripheral surface on the back side toward the support groove side is formed in the main body of the heat dissipation support, and the support groove is formed on the support side that is opposite to the back side. , the opening of the supporting groove is provided towards the irradiation direction of the LED, together with the outer peripheral surface is formed in a convex arc surface, it is possible close contact with the inner peripheral surface of the tube,
The LED can be irradiated from the storage chamber toward an irradiation side opposite to the back side of the tubular body,
The holding means comprises a plate-like holding portion protruding so as to face each other inward from the inner peripheral surface at the position on the back side of the tubular body,
The two plate-like holding portions are formed over the entire length along the length direction of the tubular body, and a gap is formed between the tip portions of both holding portions,
The storage chamber is formed by a space surrounded by the inner peripheral surface on the back side in the tubular body and the holding portion,
The heat dissipating support inserted and arranged in the storage chamber of the tubular body is held in a state sandwiched between the both holding portions and the inner peripheral surface of the tubular body of the storage chamber. lamp.
両保持部の先端部は管体の背部側に屈曲された押え部となっており、収納室内の放熱支持体は上記両保持部の押え部と、上記管体の内周面とによって挟まれた状態で保持されていることを特徴とする請求項1記載のLEDランプ。 The front ends of both holding portions are holding portions bent toward the back side of the tube, and the heat dissipation support in the storage chamber is sandwiched between the holding portions of the holding portions and the inner peripheral surface of the tube. LED lamp according to claim 1, characterized in that it is held in a state. 放熱支持体の背部側の外周面は放熱性膜によって被覆されていると共に、管体の内周面に上記放熱性膜を介して密着されており、基板のLEDの取付け面とは反対側の面である背面は放熱性膜によって被覆されかつ上記放熱支持体の支持溝内面に密着されており、上記管体の背部の外周面には上記放熱支持体の背部側の外周面に対向位置関係に帯状の放熱性膜をその長さ方向に沿って形成してあり、外側に位置している上記管体の放熱性膜、中間に位置している上記放熱支持体の放熱性膜及び内側に位置している上記基板の放熱性膜は間隔を置いて配置された三層の放熱性膜となっていることを特徴とする請求項1又は請求項2記載のLEDランプ。 The outer peripheral surface on the back side of the heat radiating support is covered with a heat radiating film, and is in close contact with the inner peripheral surface of the tube through the heat radiating film, and is opposite to the LED mounting surface of the substrate. The back surface, which is a surface, is covered with a heat radiating film and is in close contact with the inner surface of the support groove of the heat radiating support, and the outer peripheral surface of the back portion of the tubular body is opposed to the outer peripheral surface on the back side of the heat radiating support member A strip-shaped heat-dissipating film is formed along the length direction, and the heat-dissipating film of the tube located outside, the heat-dissipating film of the heat-dissipating support located in the middle, and the inside position to that claim 1 or claim 2 LED lamps according heat dissipation film of the substrate is characterized that you have a heat dissipation film of three layers spaced.
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