JP4988801B2 - Bonding apparatus and bonding method - Google Patents

Description

  The present invention relates to a bonding apparatus for bonding members such as a semiconductor wafer and a bonding method using the bonding apparatus.

  In recent years, in the manufacture of semiconductor devices (hereinafter referred to as “devices”), higher integration of devices has progressed. On the other hand, when a plurality of highly integrated devices are connected by wiring to produce a product, the wiring length increases, thereby increasing wiring resistance and wiring delay. .

  As a technique for solving this problem, a three-dimensional integration technique in which devices are three-dimensionally stacked is used. In this three-dimensional integration technique, a thin semiconductor wafer (hereinafter referred to as “wafer”) is usually used to suppress the height of stacked devices. However, the thin plate-like wafer has low rigidity and may be broken when processing such as polishing or cutting. Therefore, when processing a thin wafer, the wafer support substrate (hereinafter referred to as “support substrate”) with an adhesive sheet attached is bonded to the wafer while pressing it with a roller, etc., to give rigidity to the wafer. A method to do this has been proposed (Patent Document 1).

JP 2007-258210 A

  By the way, in order to bond the wafer and the support substrate with high accuracy, it is necessary to press the wafer and the support substrate with a uniform and high load. However, for example, when the wafer held by the holding body and the support substrate shown in Patent Document 1 are bonded using a roller, the length of the portion where the roller is in contact with the wafer changes as the place where the roller presses the wafer changes. It also changes. Specifically, for example, as shown in FIG. 16, when the roller 100 presses the wafer W on the holding body 101 and the vicinity of the outer periphery of the support substrate G, the wafer W and the roller 100 shown in FIG. The length of the portion D1 to be different from the length of the portion D2 that contacts when the vicinity of the center portion of the wafer W is pressed is different. For this reason, even if the wafer W is pressed while the load on the holding body 101 side by the roller 100 is kept constant, the load per unit area on the wafer W by the roller 100, that is, the pressure is the contact between the wafer W and the roller 100. It changes with the length of the part to be changed and is not constant. For this reason, the bonding could not be performed with high accuracy over the entire surface of the wafer W. In particular, since the outer peripheral end portion of the wafer W is in contact with the roller 100 at a point, there is a significant difference in pressure between the vicinity of the central portion of the wafer W.

  The present invention has been made in view of such a point, and reduces the pressure difference when the substrate and the support substrate supporting the substrate are pressed and bonded together, and the substrates are bonded accurately over the entire surface. It is aimed.

The present invention for achieving the above object is a bonding apparatus for bonding a substrate and a support substrate that supports the substrate, wherein the substrate and the support substrate are overlapped, and the outer surface of the substrate is overlapped. A frame fitted to the outer surface of the support substrate, the substrate fitted to the frame, a holding body for holding the support substrate, and the substrate and the support substrate together with the frame has a pressing member for pressing the side, and the pressing member is larger than the length in the longitudinal direction of the diameter of the substrate, and the length of the short side direction rather smaller than the diameter of the substrate, said support The diameter of the substrate is larger than the diameter of the substrate, and a protruding portion that protrudes toward the substrate is formed on the inner surface of the frame .

  According to the present invention, the substrate and the support substrate that are fitted to the frame body are pressed by a roller whose width in the rotation axis direction is larger than the diameter of the substrate. Therefore, when the roller presses the substrate, the substrate and the support substrate are pressed. The roller comes into contact with both the substrate and the frame fitted to the outer surface of the substrate. Thereby, the load by the roller is dispersed not only in the substrate and the support substrate but also in the frame. In particular, at the outer peripheral edge of the wafer W, the roller and the substrate can be prevented from coming into contact with each other at a point. Therefore, it is possible to reduce the pressure difference due to the roller that changes with the shape of the substrate, particularly the pressure difference between the vicinity of the outer peripheral end and the vicinity of the center. Therefore, bonding can be performed with high accuracy over the entire surface of the wafer W.

  The surface of the pressing member may have elasticity.

  Further, the holding body may be another pressing member disposed to face the pressing member.

  The frame may be formed in a rectangular shape in plan view, and the pressing member may be arranged in parallel with one side of the frame.

  The substrate may have a circular planar shape.

  The pressing member may be a roller.

  The substrate and the support substrate are bonded to each other with a fluid adhesive, and the adhesive flows out between the substrate and the support substrate between the projecting portion of the frame and the support substrate. A gap may be formed.

  Moreover, the groove | channel for discharging | emitting the said adhesive agent to the surface of the said frame from between the said board | substrate and the said support substrate may be formed in the inner surface of the said frame. In such a case, a plurality of the groove portions may be formed along the inner periphery of the frame body.

  The surface of the frame may have liquid repellency with respect to the adhesive.

The present invention according to another aspect, the support and the base plate, a supporting substrate and be bonded bonding method for supporting the substrate, in a state of superposing the supporting substrate and the substrate, the outer surface of the substrate and A frame body is fitted to the outer surface of the substrate, the length of the longitudinal direction is larger than the diameter of the substrate, and the length in the lateral direction is smaller than the diameter of the substrate, and the holding member and the substrate The support substrate is sandwiched together with the frame body, and the substrate and the support substrate are bonded together while being pressed by the pressing member, and the diameter of the support substrate is larger than the diameter of the substrate, and the inner surface of the frame body has the It is characterized in that a projecting portion with an inner surface projecting into the support substrate is formed .

  The surface of the pressing member may have elasticity.

  The holding body may be another pressing member disposed to face the pressing member.

  The frame body may have a rectangular planar shape, and may be pressed while keeping the pressing member parallel to one side of the frame body and moving the pressing member relative to the frame body.

  The substrate may have a circular planar shape.

  The pressing member may be a roller.

  ADVANTAGE OF THE INVENTION According to this invention, the pressure difference at the time of pressing and bonding a board | substrate and the support substrate which supports the said board | substrate can be reduced, and it can bond together accurately over the whole surface of a board | substrate.

It is a side view which shows the outline of a structure of the bonding apparatus concerning this Embodiment. It is a top view which shows the outline of a structure of the bonding apparatus concerning this Embodiment. It is explanatory drawing which shows the outline of a structure of a frame. It is sectional drawing which shows a mode that the wafer and the support substrate were fitted by the frame, and a mode that the frame and the roller contacted. It is explanatory drawing which shows the state which the roller and the frame contacted. It is explanatory drawing which shows the contact state of a roller, a wafer, a support substrate, and a frame. It is explanatory drawing which shows the mode of bonding by a roller. It is explanatory drawing which shows the state by which the frame was inclined with respect to the roller. It is explanatory drawing which shows the outline of a structure of the frame concerning other embodiment. It is explanatory drawing which shows the outline of a structure of the frame concerning other embodiment. It is explanatory drawing which shows the state in which the clearance gap was formed between the frame and the wafer. It is explanatory drawing which shows the frame in which the protrusion part was formed. It is a top view which shows the outline of a structure of the frame in which the some groove | channel was formed. It is explanatory drawing which shows the state which provided the clearance gap between the protrusion part of a frame, and a support substrate. It is a side view which shows the outline of a structure of the bonding apparatus concerning other embodiment. It is a side view which shows the outline of a structure of the conventional bonding apparatus. It is explanatory drawing which shows the contact state of a roller, a wafer, and a support substrate.

  Embodiments of the present invention will be described below. FIG. 1 is a longitudinal sectional view showing an outline of a configuration of a bonding apparatus 1 according to the embodiment, and FIG. 2 is a plan view showing an outline of a structure of the bonding apparatus 1 according to the embodiment.

  The bonding apparatus 1 includes a wafer 10 as a substrate and a frame 10 fitted to a support substrate G superimposed on the wafer W via an adhesive B for supporting the wafer W, and the wafer W and the support substrate G. A pair of rollers 11 that sandwich and press the frame 10 together, and a transport mechanism 12 that transports the wafer W and the support substrate G together with the frame 10. For example, a plate-like glass substrate is used as the support substrate G in the present embodiment. In addition, as the adhesive B in the present embodiment, for example, a paste having fluidity is used, but as the adhesive B, an adhesive sheet or the like in which an adhesive material is applied on both sides may be used. .

  As shown in FIGS. 3 and 4, the wafer W has a thickness of A1 and is formed in a substantially disk shape having a diameter R in plan view. The support substrate G also has the same diameter R as the wafer W in plan view, and is formed in a substantially disk shape with a thickness of A2.

  As shown in FIG. 3, the frame body 10 is formed in a plate shape having a substantially rectangular shape with a side length of C in plan view and a thickness of A3, for example. The frame 10 is formed with an opening 20 having a diameter R following the planar shape of the wafer W and the support substrate G. The opening 20 has an outer surface of the wafer W as shown in FIG. Wa and the outer surface Ga of the support substrate G are fitted together. The wafer W and the support substrate G are overlapped in the order of the wafer W, the adhesive B, and the support substrate G, for example, from below in the opening 20 of the frame 10. Note that the order of superimposing the wafer W and the support substrate G is not limited to this embodiment, and the wafer W may be superimposed on the support substrate G.

  As shown in FIG. 4, the thickness A3 of the frame 10 is, for example, the thickness A1 of the wafer W, the thickness A2 of the support substrate G, and the thickness A4 of the adhesive B applied between the wafer W and the support substrate G. It is formed to be equal to the sum of. Therefore, the lower surface of the frame body 10 and the lower surface of the wafer W fitted to the frame body 10 and the upper surface of the frame body 10 and the upper surface of the support substrate G fitted to the frame body 10 are on the same plane without any step. Is located.

  The frame body 10 is made of a material having rigidity that does not bend when pressed by the roller 11. In the present embodiment, for example, aluminum is used. The surface of the frame 10 has a liquid repellency with respect to the adhesive B. For example, the surface of the frame 10 is subjected to a liquid repellency treatment using a fluororesin-based material, and the adhesive B attached to the frame 10 can be easily removed from the frame 10. It comes to peel off. For this reason, the wafer W and the support substrate G fitted in the frame body 10 are not attached to the frame body 10 by the adhesive B.

  As shown in FIG. 1, the roller 11 includes a substantially cylindrical upper roller 30 and a lower roller 31 as pressing members, which are vertically opposed to each other at a predetermined interval H. The axial length L of the upper roller 30 and the lower roller 31 is formed larger than the diameter R of the wafer W as shown in FIG. For example, the roller 11 is arranged so that one side of the frame 10 and the axial direction of the roller 11 are parallel to each other.

  For example, as shown in FIG. 1, a shaft bar 32 is inserted through the central shaft of the upper roller 30. The shaft rod 32 is provided with a rotation mechanism 33 that rotationally drives the shaft rod 32. The upper roller 30 is rotated by the rotation mechanism 33, for example, clockwise at a predetermined speed. The shaft bar 32 is supported from above by a support bar 34 that slidably supports the shaft bar 32. The upper end of the support bar 34 is connected to an elevating mechanism 35 that elevates and lowers the upper roller 30 in the vertical direction (X direction in FIG. 1), and the wafer sandwiched between the rollers 11 by lowering the upper roller 30 vertically downward. W and the support substrate G can be pressed to the lower roller 31 side. Therefore, by adjusting the vertical position of the upper roller 30, that is, the distance H between the upper roller 30 and the lower roller 31 by the elevating mechanism 35, the load pressing the wafer W sandwiched between the rollers 11 and the support substrate G is reduced. Can be controlled.

  The lower roller 31 has a shaft rod 32 and a rotation mechanism 33 like the upper roller 30 and rotates counterclockwise at the same speed as the upper roller 30. Therefore, the wafer W sandwiched between the upper roller 30 and the lower roller 31 that rotate in opposite directions, the support substrate G, and the frame body 10 are pressed by the upper roller 30 and the lower roller 31, respectively, That is, it is conveyed in the left direction in FIG. The shaft rod 32 of the lower roller 31 is supported from below by a support rod 36 that slidably supports the shaft rod 32. The lower end portion of the support bar 36 is fixed to a pedestal 37, and a vertically downward load by the upper roller 30 is supported.

  The surfaces of the upper roller 30 and the lower roller 31 are formed of an elastic body 50 having elasticity, such as silicon rubber. Therefore, when the wafer 11 and the support substrate G are pressed by the roller 11, the elastic body 50 on the surface bends. For example, as shown in FIG. 4, the support substrate G and the frame body 10 and the upper roller 30 are not a line but a predetermined line. Contact with a surface having a width Z of In FIG. 4, only the upper roller 30 is illustrated for convenience of illustration, but the wafer W, the frame body 10 and the lower roller 31 are also in contact with each other on a surface having a predetermined width Z.

  The transport mechanism 12 that transports the wafer W and the support substrate G together with the frame body 10 is provided on both sides of the roller 11 along the rotation direction of the roller 11 (Y direction in FIG. 1), for example, as shown in FIG. Yes. As the transport mechanism 12, for example, a belt conveyor or the like is used. The transport mechanism 12 is adjusted in the height direction so that, for example, the upper surface thereof is flush with the upper end of the lower roller 31, and transports the wafer W, the support substrate G, and the frame body 10 toward the roller 11. At the same time, the wafer W pressed by the roller 11, the support substrate G, and the frame 10 are unloaded from the bonding apparatus 1.

  The bonding apparatus 1 according to the present embodiment is configured as described above. Next, bonding of the wafer W and the support substrate G performed in the bonding apparatus 1 will be described.

  First, the wafer W is fitted to the frame 10 so that the lower surface of the frame 10 and the lower surface of the wafer W are flush with each other, and the adhesive B is applied to the upper surface of the wafer W. Next, the support substrate G is fitted on the upper surface of the wafer W to which the adhesive B is applied. At this time, the thickness of the adhesive B applied to the upper surface of the wafer W is adjusted to A4 so that the upper surface of the support substrate G and the upper surface of the frame body 10 are flush with each other. When the wafer W and the support substrate W are fitted to the frame body 10, the wafer W and the support substrate G may be preliminarily overlapped with the adhesive B and then fitted to the frame body 10, The procedure can be arbitrarily determined regardless of this embodiment.

  Next, the wafer W and the support substrate G fitted in the frame body 10 are placed on the transport mechanism 12 together with the frame body 10 and transported toward the roller 11. At this time, the vertical position of the upper roller 30 is adjusted by the elevating mechanism 35 so that the distance H between the upper roller 30 and the lower roller 31 is larger than the thickness A3 of the frame 10, for example, as shown in FIG. ing.

  Thereafter, when the end portion in the traveling direction of the frame body 10 transported by the transport mechanism 12 crosses between the rollers 11, the upper roller 30 descends to a predetermined position as shown in FIG. The upper surface of the body 10 is pressed. At this time, the vertical position of the upper roller 30, that is, the distance H between the upper roller 30 and the lower roller 31, is determined in advance so that the load pressing the frame body 10 becomes a predetermined value by a test or the like. . The upper roller 30 may be lowered to a predetermined position in advance before the frame body 10 is conveyed between the rollers 11.

  After that, the wafer W and the support substrate G are transported together with the frame body 10 by the roller 11 and the transport mechanism 12 toward the rotation direction of the roller 11 (X direction negative direction side in FIG. 5). Sequential pressing is performed by the rollers 11 and bonding is performed. At this time, for example, as indicated by oblique lines in FIG. 6, the portion Y1 corresponding to the wafer W and the support substrate G in the roller 11 is the wafer W and the support substrate G, and the portion Y2 corresponding to the frame body 10 is the frame body 10. Contact with a predetermined width Z. That is, the roller 11 contacts the frame body 10, the wafer W, and the support substrate G while maintaining a contact area represented by the product of the length C of the frame body 10 and the width Z of the contact portion of the roller 11. As shown in FIG. 7, the wafer W and the support substrate G are pressed together with the frame 10 while being conveyed in the rotation direction of the roller 11, and the bonding of the wafer W and the support substrate G is completed. The wafer W and the support substrate G that have been bonded together are transferred to the outside of the bonding apparatus 1 by the transfer mechanism 12 together with the frame body 10, and this operation is repeated.

  According to the above embodiment, the roller 11 presses the wafer W and the support substrate G together with the frame body 10 by the roller 11 whose length L is larger than the diameter R of the wafer W. When doing so, the frame 10 is also pressed by the roller 11. For this reason, the load by the roller 11 at the time of bonding is distributed to the wafer W and the frame body 10, and in particular, the roller 11 and the wafer W are prevented from coming into contact with each other at the outer peripheral end portion of the wafer W. it can. Therefore, for example, the pressure difference between the vicinity of the outer peripheral end of the wafer W and the vicinity of the center, which has occurred when the conventional bonding method, that is, bonding without using the frame body 10, can be reduced. Therefore, bonding can be performed with high accuracy over the entire surface of the wafer W.

  Further, the roller 11 presses the frame body 10 before pressing the wafer W and the support substrate G, and the vertical position of the upper roller 30 is controlled at that time so that the load by the roller 11 becomes a predetermined value. Since it can be adjusted, the load by which the roller 11 presses the wafer W and the support substrate G does not become excessive or small. Therefore, the wafer W and the support substrate G can be bonded together with an appropriate pressure.

  Furthermore, since the frame body 10 has a rectangular shape and the roller 11 is provided in parallel to one side of the frame body 10, the roller 11 contacts the wafer W and the support substrate G as shown in FIG. The contact area represented by the product of the length C of the frame 10 and the width Z of the contact portion of the roller 11, which is the sum of the areas of the portion Y1 and the portion Y2 where the roller 11 contacts the frame 10, is the frame. 10 is constant over the entire surface. Therefore, by keeping the load of the roller 11 constant, the wafer W and the support substrate G can be pressed with a uniform pressure, and bonding with higher accuracy can be performed. For example, as shown in FIG. 8, even when the roller 11 and one side of the frame 10 are inclined, the roller 11 is connected to the wafer W and the support substrate G as shown by the hatched portion in FIG. Since the sum of the areas of the portions Y1 and Y2 that are in contact with the roller 11 shown in FIG. 6 is constant in a region N that is, for example, a parallelogram in plan view, the roller 11 and the frame 10 are It does not necessarily have to be parallel. This means that it is not necessary to strictly align the roller 11 and the frame body 10.

  When the surface of the roller 11 is not formed of the elastic body 50, that is, when the surface of the roller 11 does not have elasticity, the roller 11, the wafer W, the support substrate G, and the frame body 10 are not a plane but a line. In this case as well, since the load by the roller 11 is appropriately distributed between the wafer W and the frame body 10, the surface of the roller 11 is elastic by using the frame body 10 according to the present invention. Regardless of whether or not the wafer W is present, the bonding can be performed with high accuracy over the entire surface of the wafer W.

  Note that the shape of the frame 10 is not limited to a rectangle, and may be approximately elliptical in plan view as shown in FIG. 9, for example, as long as the load by the roller 11 can be dispersed. The opening 20 does not need to be provided at the center of the frame 10, and the center of the opening 20 may be eccentric with respect to the center of the frame 10 as shown in FIG. 10. Further, the shape of the wafer W as the substrate is not limited to a circle. That is, when conventional bonding without using the frame 10 as shown in FIGS. 16 and 17 is performed, the lengths of the portions where the roller 100 and the wafer W are in contact with each other are different from each other. In addition to the circular shape, a shape such as a trapezoidal shape or an elliptical shape is conceivable. However, the present invention can be suitably used for wafers W having all such shapes.

  In the above embodiment, since the surface of the roller 11 is formed by the elastic body 50, for example, as shown in FIG. 11, the inner surface 10 a of the frame 10 and the outer surface Wa of the wafer W, or the frame Even if there is a gap U between the body 10 and the support substrate G, the roller 11 can contact the frame body 10 and the wafer W or both the frame body 10 and the support substrate G across the gap U. . For this reason, the roller 11 does not contact the outer peripheral end of the wafer W or the outer peripheral end of the support substrate G with a point or line, and the wafer W and the support substrate G and the roller 11 are always in surface contact. Can keep. Therefore, even when there is a gap U between the wafer W or the support substrate and the frame body 10, the load is concentrated on the outer peripheral end portion of the wafer W or the outer peripheral end portion of the support substrate G. An excessive force can be prevented from being applied to the part. Therefore, it is possible to perform bonding with high accuracy and stability.

  Moreover, according to the above embodiment, since the wafer W and the support substrate G are fitted in the opening part 20 of the frame 10, the alignment of the wafer W and the support substrate G can be performed accurately. Further, when the wafer W and the support substrate G are pressed by the roller 11, horizontal force due to the rotation of the roller 11 acts on the wafer W and the support substrate G, but the outer surfaces Wa and Ga are the openings of the frame body 10. Since it is supported by the inner surface of the portion 20, it is possible to prevent the relative position between the wafer W and the support substrate G from being displaced due to a horizontal force.

  In the above embodiment, the diameter R of the wafer W and the support substrate G is the same, but the diameter of the wafer W and the diameter of the support substrate G may be large or small. The one where the diameter of the support substrate G is larger is preferable.

  When the diameter of the support substrate G is larger than the diameter of the wafer W, for example, as shown in FIG. 12, a protrusion 10 a that protrudes toward the outer surface Wa of the wafer W is provided on the inner surface of the opening 20 of the frame 10. It may be formed. By forming the protrusion 10a, the wafer W can be fitted into the protrusion 10a, and the support substrate G having a diameter larger than the diameter R of the wafer W can be fitted into the inner surface of the opening 20. Even when the protruding portion 10 a is provided, accurate alignment can be performed by fitting the wafer W to the protruding portion 10 a and the support substrate G to the inner surface of the opening 20.

  In the above embodiment, the opening 20 of the frame 10 has a shape that follows the outer surface Wa of the wafer W and the outer surface Ga of the support substrate G. However, as shown by a broken line in FIG. A groove M communicating with the upper surface of the frame body 10 may be formed on the inner surface of the frame. By forming the groove M, for example, even when the amount of the adhesive B applied between the wafer W and the support substrate G is applied more than a predetermined amount, the adhesive is applied when pressing the wafer W and the support substrate G. The excess of B flows into the groove M, and the sum of the thickness A3 of the frame 10 and the thicknesses A1, A2, and A4 of the wafer W, the support substrate G, and the adhesive B becomes equal. Therefore, it is not necessary to strictly adjust the application amount of the adhesive B. In addition, the adhesive B that has flowed into the groove M can be appropriately discharged, and the discharged adhesive B can be temporarily stored in the groove M, so that the adhesive B leaks to the outside of the frame 12, and the roller It is possible to prevent the adhesive B from adhering to 11 etc. In addition, the groove | channel M may be formed in multiple numbers along the inner periphery of the frame 10, for example, as shown in FIG.

  Further, when the protrusion 10a is provided in the frame 10, the groove M is formed in the frame 10, and the protrusion 10a is made to have the same thickness as the thickness A2 of the wafer W as shown in FIG. A gap V may be formed between 10a and the support substrate G. In such a case, the excess adhesive B can be discharged more easily. The gap V may be provided in communication with the groove M.

  In the above embodiment, the wafer W and the support substrate G are sandwiched between the pair of rollers 11 and bonded together while being pressed by the rollers 11. However, the rollers 11 do not necessarily have to be provided in pairs. For example, as shown in FIG. 15, a chuck 60 as a holding body that holds the wafer W by suction may be used instead of the lower roller 31. When the chuck 60 is used, a horizontal movement mechanism 61 that moves the upper roller 30 in the horizontal direction is provided, and the wafer W and the support substrate G placed on the chuck 60 are pressed together with the frame 10 by the upper roller 30. Bonding is performed while moving the upper roller 30 by the horizontal movement mechanism 61.

  In the above embodiment, the upper roller 30 or the like is used as the pressing member. However, the shape of the pressing member is not necessarily a roller shape, and the wafer W and the upper surface of the frame 10 are slid on the wafer. For example, a rod-shaped member or the like that presses W and the support substrate G together with the frame body 10 may be used.

  In the above embodiment, the bonding apparatus 1 is used to bond the wafer W and the support substrate G. However, the bonding apparatus 1 according to the present embodiment bonds the wafer W to each other or bonds the chip to the chip. It can also be used in the case of bonding, or in the case of bonding with solder instead of the adhesive B. That is, the bonding apparatus 1 can be used effectively when three-dimensionally stacking semiconductor devices. The bonding apparatus 1 can also be used when the member to be bonded is another member such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

  The present invention is useful when bonding substrates together.

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 10 Frame 10a Protrusion part 11 Roller 12 Conveyance mechanism 20 Opening part 30 Upper roller 31 Lower roller 32 Shaft bar 33 Rotating mechanism 34 Support bar 35 Lifting mechanism 36 Support bar 37 Base 50 Elastic body 60 Chuck 61 Horizontal movement mechanism G Support substrate W Wafer

Claims (16)

A laminating apparatus for laminating a substrate and a supporting substrate that supports the substrate,
In a state where the substrate and the support substrate are overlaid, a frame body fitted to the outer surface of the substrate and the outer surface of the support substrate;
A holding body that holds the substrate and the support substrate fitted in the frame;
A pressing member that presses the substrate and the support substrate together with the frame toward the holding body,
The pressing member is larger than the length in the longitudinal direction of the diameter of the substrate, and the length of the short side direction rather smaller than the diameter of the substrate,
The diameter of the support substrate is larger than the diameter of the substrate,
The bonding apparatus according to claim 1, wherein a protrusion projecting toward the substrate is formed on an inner surface of the frame . The bonding apparatus according to claim 1, wherein a surface of the pressing member has elasticity. The bonding apparatus according to claim 1, wherein the holding body is another pressing member arranged to face the pressing member. The frame is formed in a rectangular shape in plan view,
The bonding apparatus according to claim 1, wherein the pressing member is arranged in parallel with one side of the frame. The bonding apparatus according to claim 1, wherein the substrate has a circular planar shape. The laminating device according to claim 1, wherein the pressing member is a roller. The substrate and the support substrate are bonded together with an adhesive having fluidity,
A gap for allowing the adhesive to flow out from between the substrate and the support substrate is formed between the projecting portion of the frame and the support substrate. The bonding apparatus according to any one of the above. The groove for discharging the adhesive to the surface of the frame body from between the substrate and the support substrate is formed on the inner surface of the frame body. The bonding apparatus according to any one of the above. The bonding apparatus according to claim 8, wherein a plurality of the grooves are formed along an inner periphery of the frame body. The bonding apparatus according to claim 7, wherein a surface of the frame body has liquid repellency with respect to the adhesive. A bonding method of bonding a substrate and a support substrate that supports the substrate,
In a state where the substrate and the support substrate are overlapped, a frame is fitted to the outer surface of the substrate and the outer surface of the support substrate,
The length of the longitudinal direction is larger than the diameter of the substrate and the length in the short direction is smaller than the diameter of the substrate, and the holding body sandwiches the substrate and the support substrate together with the frame,
Bonding the substrate and the support substrate while pressing with the pressing member,
The diameter of the support substrate is larger than the diameter of the substrate,
The bonding method according to claim 1, wherein a projecting portion is formed on the inner side surface of the frame body so as to project the inner side surface fitted to the support substrate. The bonding method according to claim 11, wherein a surface of the pressing member has elasticity. The bonding method according to claim 11, wherein the holding body is another pressing member disposed to face the pressing member. The frame has a rectangular planar shape;
The pressure member is pressed while keeping the pressing member parallel to one side of the frame and moving the pressing member relative to the frame. Method of pasting. The bonding method according to claim 11, wherein the substrate has a circular planar shape. The bonding method according to claim 11, wherein the pressing member is a roller.

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