JP4979260B2 - How to create control data - Google Patents

Description

  The present invention relates to a control data creation method, and more particularly, to a control data creation method for creating control data of a workpiece manufacturing apparatus that performs work by relatively moving a work head and a workpiece from CAD data of a workpiece created by CAD.

Conventionally, workpieces such as semiconductor devices are designed using CAD (computer aided design), and a workpiece manufacturing apparatus that manufactures these workpieces creates control data for operating the device for each type of workpiece to be manufactured. ing.
Such control data is created by manual input by the operator with reference to the design drawing of the designed workpiece or by directly teaching the workpiece manufacturing apparatus.
On the other hand, when a lot of time and labor are required to input bonding coordinate points and the creation of control data is complicated, such as a wire bonding apparatus, the CAD data for the workpiece created by CAD is used. It is known to create control data. (Patent Document 1)
In the method for creating control data in Patent Document 1, when CAD data is created by CAD, pattern and coordinate data are attached to all of the components indicating wires, and the components are wire data. Attribute data to the effect is added.
When creating control data using this CAD data, a component with attribute data indicating a wire is specified, a coordinate value is read from the data of the component indicating the wire, and this is used as a bonding coordinate. It is set as a point.
JP 2000-3932 A

However, according to the method of the above-mentioned Patent Document 1, although problems such as complexity and time required for creating control data, such as when creating control data by manual input or teaching by an operator, are solved, When CAD data is created, a task of adding the attribute data to each component is added, and if at least one of them is forgotten, there is a problem that the control data becomes incomplete.
In view of such a problem, the present invention provides a control data creation method capable of quickly and accurately creating control data from CAD data.

That is, the invention of claim 1 is a control data creation method for creating control data of a workpiece manufacturing apparatus that performs work by relatively moving a work head and a workpiece from CAD data of a workpiece created by CAD.
In the CAD, the work is divided into a plurality of layers for each required component and drawn, and one layer is used as a reference point layer on which a plurality of reference points are drawn, and at least one other layer is drawn . The layer is a work point layer on which a work target element to be worked by the work head is drawn, and the work point layer includes a work corresponding to a required first reference point among the plurality of reference points. Draw only the target element,
When creating control data from CAD data,
While selecting the data of the work target element drawn on the work point layer, using the required position of the work target element as a work point, the coordinate value of the work point in the CAD coordinate system is extracted,
Further, from the coordinate value of the first reference point drawn on the reference point image layer in the CAD coordinate system and the coordinate value of the work point drawn on the work point image layer in the CAD coordinate system, the first reference point Calculate the relative coordinate value of the above work point with the origin as
From the relative coordinate value of the work point with the first reference point as the origin and the interval between the first reference point and another reference point in the reference point layer, the coordinates of the work point not drawn on the work point layer The control data is generated by calculating a value .

  According to the above-described invention, CAD data can be obtained even if attribute data is not attached to each component by dividing the layer as a work point layer for a work target element to be worked in the work manufacturing apparatus. Can select only the data of the work target element, and the coordinate value of the work point can be extracted from the required position of the work target element, so that the control data can be quickly and accurately used using the CAD data. Can be created.

The illustrated embodiment will be described below. FIG. 1 shows a workpiece 1 according to the present embodiment. The workpiece 1 is a semiconductor device or a component in the course of its manufacturing process, and includes a substrate 2 made of a plate-like member and solder balls 3 placed on the substrate 2. It consists of and.
A plurality of chips 4 are bonded to the back surface of the substrate 2 vertically and horizontally in a subsequent process, and alignment marks 5 for positioning are printed on each chip 4 at diagonal positions on the upper left and lower right in the figure. . In FIG. 1, the chip 4 and the alignment mark 5 are indicated by two-dot chain lines for the sake of explanation, and the alignment mark 6 is printed at the diagonal positions on the upper left and lower right of the substrate 2, and FIG. The upper left alignment mark 6 is shown.
The solder balls 3 are arranged in a predetermined number within a range where the chips 4 are joined, and the solder balls 3 are not placed on the center portion of the chips 4. ing.
In this embodiment, a plate-like member to which the chip 4 is bonded to the back surface is shown as the substrate 2 on which the solder balls 3 are placed. However, in addition to the plate-like member, a wafer, a chip obtained by dividing the wafer, or the like In addition, a placement object on which various solder balls are placed according to the form of the semiconductor device and the manufacturing process is included.

FIG. 2 shows a workpiece manufacturing apparatus according to the present embodiment, which is configured as a ball mounter 11 for mounting solder balls 3 one by one on the substrate 2.
The ball mounter 11 includes a work table 12 that supports the substrate 2, an XY moving mechanism 13 that moves the work table 12 in two orthogonal horizontal directions, and a suction head 14 as a work head that holds the solder balls 3 by suction. A solder ball supply unit 15 for supplying the solder balls 3 to the suction head 14, a reciprocating mechanism 16 for reciprocating the suction head 14 between the work table 12 and the solder ball supply unit 15, and raising and lowering the suction head 14 And a lifting mechanism 17 to be moved.
The ball mounter 11 is controlled by a control means 18, and the control means 18 moves the work table 12 by the XY movement mechanism 13 according to the control data registered in the control means 18, and sucks by the reciprocation mechanism 16 and the lifting mechanism 17. The movement operation of the head 14, the suction operation of the suction head 14, and the like are controlled.
The ball mounter 11 supports the substrate 2 at a predetermined position on the work table 12 and moves the suction head 14 to the solder ball supply unit 15 by the reciprocating mechanism 16 so that the suction head 14 sucks and holds the solder ball. Then, the suction head 14 holding the solder ball 3 is stopped above the substrate 2 by the reciprocating mechanism 16.
Thereafter, the XY moving mechanism 13 is operated to relatively move the suction head 14 and the substrate 2 in the horizontal direction, and when the placement position of the solder ball 3 set on the substrate 2 is positioned below the suction head 14, the lift and lowering are performed. The suction head 14 is lowered by the mechanism 17 to release the suction and holding, and the solder ball 3 is placed at a predetermined placement position on the substrate 2.
Then, by repeatedly performing such placement work continuously, the solder balls 3 can be placed sequentially on a predetermined position on the substrate 2.

Further, the ball mounter 11 in this embodiment is connected to a registration means 19 for registering control data in the control means 18, and a personal computer can be used for the registration means 19. Yes.
A plurality of software is installed in the registration means 19, and the CAD software 21 for creating the design drawing of the work 1 and the work point indicating the mounting position of the solder ball 3 from the CAD data created by the CAD software 21. Work point creation software 22 for calculating coordinate values and registration software 23 for creating control data of the ball mounter 11 from the coordinate values of the work points and registering the control data in the control means 18 are installed.
Note that these software programs do not necessarily have to be installed on one computer, and may be installed on different computers. The work point creation software 22 can read and use not only the CAD data created by the CAD software 21 but also CAD data created by other CAD software recorded in a storage medium or storage device. is there.

Next, a design drawing of the workpiece 1 created by the CAD software 21 will be described with reference to FIG.
FIG. 3A shows a design drawing of the workpiece 1 displayed on the display of the registration means 19. In the following description, the workpiece 1, the substrate 2, the solder ball 3, the chip 4, and the alignment mark created by the CAD software 21. In the following description, each constituent element 5 is denoted by a symbol (′) for members constituting the workpiece 1. Further, in FIG. 3, the work 1 shown in FIG. 1 is shown in a simplified manner within a range that does not hinder the description.
First, the CAD software 21 is set with a CAD coordinate system in which the horizontal direction with a predetermined position as the origin is set as the X coordinate and the vertical direction is set as the Y coordinate, and the relative positional relationship is recognized by the CAD coordinate system. It is like that. In this embodiment, the work is drawn at a 1: 1 scale.
In the CAD software 21, the substrate 2 'is drawn in a horizontally long rectangle, the chip 4' is drawn in a horizontally long rectangle in the upper left part inside the substrate 2 ', and the solder ball 3' is drawn in a circle within the range of the chip 4 '. The alignment mark 5 ′ is drawn as a circle surrounding the solder ball 3 ′ at diagonal positions on the upper left and lower right of the chip 4 ′. Note that the chip 4 ′ and the alignment mark 5 ′ are actually arranged on the back side of the substrate 2, but are drawn with solid lines here.
Then, as shown in FIG. 3A, the workpiece 1 ′ drawn by the CAD software 21 is different from the workpiece 1 as the product of FIG. 1 in that the chip 4 ′ positioned at the inner left upper portion of the substrate 2 ′. Only the solder ball 3 located within the range of the chip 4 ′ and the alignment mark 5 ′ indicating the direction of the chip 4 ′ are drawn, and the other chip 4 ′ and the solder ball 3 ′ to be originally drawn are drawn. The alignment mark 5 'is omitted.
This is because, in the case of the workpiece 1 of this embodiment, the position of the solder ball 3 placed in the range of the chip 4 to be bonded to the substrate 2 and the position of the alignment mark 5 indicating the direction of each chip 4 are: This is because all the chips 4 have the same arrangement. By drawing a pitch line P described below, the other chips 4, solder balls 3, and alignment marks 5 that are actually arranged on the substrate 2 are as follows. The drawing is omitted.

The pitch line P includes the Y-direction pitch line PX1 and the X-direction pitch line PY1 drawn so as to pass through the center of the chip 4 ′ drawn on the design drawing of the work 1, and the non-drawn chip 4. The pitch lines PX2 and PX3 in the Y direction and the pitch lines PY2 and PY3 in the X direction are drawn so as to pass through the center.
The intersection of each pitch line P intersects at the center of the chip 4 ', and the center of these chips 4' is hereinafter referred to as a reference point P '. Further, the number of chips 4 ′ that are not drawn in the X direction and the Y direction and the distance between the center positions of the chips 4 ′ can be recognized by the distance between the pitch lines P.
Further, since the solder balls 3 and the alignment marks 5 are arranged in the same arrangement within the range of each chip 4 to be bonded to the substrate 2, in other words, the reference point P ′ of each chip 4 and the solder ball 3 and The relative positional relationship with the alignment mark 5 is the same for all chips.
Accordingly, the positions of the solder balls 3 ′ and the alignment marks 5 ′ that are not drawn can be guided by the pitch line P and the reference point P ′.
In the following description, the reference point P ′ located at the intersection of the pitch line PX1 and the pitch line PY1 intersecting at the center of the chip 4 ′ drawn on the upper left of the drawing is referred to as the first reference point P ′. Call it 1.

Next, in the present embodiment, by using the layer function provided in the CAD software 21, a plurality of images are provided for each component of the substrate 2 ′, solder ball 3 ′, chip 4 ′, alignment mark 5 ′, and pitch line P. The drawing is divided into layers.
FIG. 3B conceptually displays this, and the design drawing for the workpiece 1 ′ shown in FIG. 3A is the substrate image layer 31 on which only the substrate 2 ′ is drawn, and the chip 4. Only the chip layer 32 on which only 'is drawn, the mark layer 33 on which only the alignment mark 5' is drawn, the ball layer 34 on which only the solder ball 3 'is drawn, and only the pitch line P are drawn. It is divided and drawn on a pitch image layer 35 as a reference point image layer.
The CAD software 21 can display only the necessary layers on the display of the registration means 19 by the layer function, and can superimpose the layers and display the relative components as shown in FIG. It can be expressed by matching the positions.
Further, the CAD software 21 can save each component drawn on each layer as CAD data, and can save each component drawn on a plurality of layers as CAD data. is there.

Next, a procedure for creating control data for the ball mounter 11 using CAD data of the design drawing of the workpiece 1 created by the CAD will be described.
First, the control means 18 of the ball mounter 11 in this embodiment relatively moves the suction head 14 holding the solder balls 3 and the substrate 2 supported by the work table 12 to place a large number of the solder balls 3 held thereon. Relative movement is sequentially made to the placement position.
For this reason, as control data for controlling the ball mounter 11, information on the placement position where each solder ball 3 is placed on the substrate 2, that is, the coordinate value of the work point, is required. Among the constituent elements of the work 1 ′ created in 21, the center point of a circle indicating each solder ball 3 ′ corresponds.
On the other hand, since the apparatus coordinate system set in the XY movement mechanism 13 for moving the suction head 14 and the substrate 2 relative to each other may be different from the CAD coordinate system in the CAD software 21, it is created by the CAD software 21. It is necessary to convert the coordinate value of the work point in the CAD coordinate system into the coordinate value in the apparatus coordinate system.
In the CAD software 21 of the present embodiment, since all of the solder balls to be placed on the substrate 2 are not drawn, work points for the solder balls 3 ′ that are not drawn are created, It is necessary to obtain the coordinate value of the work point.

Based on these points, the procedure for creating the control data of the ball mounter 11 using CAD data will be specifically described below using the procedure flow of FIG.
First, CAD data for the work 1 is output from the CAD software 21 to the work point creation software 22 in a text format composed only of characters (for example, DXF format of Autodesk). (A-1)
The CAD data output in the text format has the shape of the component drawn on the design drawing and the coordinate value expressed in text (characters, numerical values), and the name of the layer to which the component belongs. The
For example, the data of the solder ball 3 includes characters “BALL” indicating the layer name of the ball layer 34, characters “CIRCLE” indicating the circle indicating the solder ball 3 ′ on the design drawing, And a numerical value indicating the coordinate value of the center point in the CAD coordinate system.

When the text-format CAD data output in this way is input to the work point creation software 22, the work point creation software 22 converts the component data contained in the CAD data based on the characters indicating the layer names. And stored in a memory provided for each layer. (A-2)
Next, the work point creation software 22 selects a memory storing the data of the pitch layer 35, and uses the data of the pitch lines P stored in the memory, and the number and interval of the pitch lines PY in the X direction, The number and interval of pitch lines PX in the Y direction are recognized.
Further, among the pitch lines PX, the coordinate value in the CAD coordinate system of the intersection of the pitch line PX1 having the smallest X coordinate value and the pitch line PY1 having the largest Y coordinate value is calculated, and this is calculated as the first reference point P. Recognized as a coordinate value of '1.
As described above, the first reference point P′1 indicates the center position of the chip 4 ′ drawn by the CAD software 21, and the reference points P ′ other than the first reference point P′1 are not drawn. Since the center position of the chip 4 is indicated, the position of all the chips 4 on the substrate 2 can be determined by recognizing the coordinate value of the first reference point P′1 and the number and interval of the pitch lines P. Sequence information about the interval can be recognized. (A-3)

Further, the work point creation software 22 selects the memory storing the data of the ball layer 34, and the coordinate value of the center point of the circle indicating each solder ball 3 ′ from the data of the solder ball 3 ′ stored in the memory. Is extracted as the coordinate value of the work point. The coordinate value of the work point extracted here is a coordinate value in the CAD coordinate system.
Subsequently, the work point creation software 22 converts the coordinate value of the extracted work point into a relative coordinate value with the first reference point P′1 as the origin (A-4). Specifically, the coordinate value of the first reference point P′1 in the CAD coordinate system is subtracted from the coordinate value of the work point in the CAD coordinate system, and the first reference point P′1 is defined as the origin (0, 0). The calculated relative coordinate value is calculated.
Here, since the converted relative coordinate value of the work point is for the solder ball 3 ′ corresponding to the chip 4 ′ actually drawn on the upper left of the substrate 2 ′ in the CAD software 21, the work point creation is performed. The software 22 also calculates the relative coordinate value of the work point with the first reference point P′1 as the origin (0, 0) for the other solder balls 3 not drawn by the CAD software 21. (A-5)
Specifically, the relative coordinate value of the work point obtained in the above (A-4), the interval value between the pitch lines PX obtained in the above (A-3), the interval value between the pitch lines PY, or both of them. It is calculated by adding the values of.
For example, the relative coordinate values of the work points related to the solder balls 3 placed in the range of the chip 4 located on the right side of the chip 4 ′ drawn on the CAD software 21 are all obtained in (A-4) above. It is calculated by adding the interval value between the pitch line PX1 and the pitch line PX2 to the relative coordinate value of the work point.
In this way, the relative coordinate values of the work points related to all the solder balls 3 placed on the substrate 2 with the center position (first reference point P′1) of the upper left chip 4 ′ on the substrate 2 as the origin. Is calculated, the work point creation software 22 outputs the relative coordinate value to the registration software 23. (A-6)

Then, the registration software 23 stores the relative coordinate value of the work point related to the solder ball 3 with the first reference point P′1 calculated by the work point creation software 22 as the origin in a predetermined CAD coordinate system and the ball mounter 11. Control data to be converted into the coordinate value of the work point in the device coordinate system based on the set relationship with the device coordinate system, and registered in the control means 18 using the converted coordinate value of the work point in the device coordinate system Create
In the case of the ball mounter 11 of this embodiment, it is difficult to support the substrate 2 on the work table 12 at the same position every time. Therefore, each time the substrate 2 is supported on the work table 12, the CAD coordinate system and the apparatus are used. It is designed to relate to the coordinate system.
In the present embodiment, the first reference point P′1 (center position of the upper left chip 4) is used as a reference point that relates the CAD coordinate system and the apparatus coordinate system, and the first reference point P′1 in the CAD coordinate system, The relative position between the origin of the CAD coordinate system and the origin of the apparatus coordinate system of the ball mounter 11 when the center position of the chip 4 bonded to the upper left of FIG. From the inclination, the CAD coordinate system and the apparatus coordinate system are related.
Specifically, the ball mounter 11 of the present embodiment includes a camera (not shown), and when the substrate 2 is supported by the work table 12, the two alignment marks 6 printed on the substrate 2 are photographed by the camera, The position of the alignment mark 6 is recognized as a coordinate value in the apparatus coordinate system by conventionally known image recognition. As a result, the actual position and inclination of the substrate 2 on the work table 12 are recognized from the positional relationship between the two alignment marks 6.
The registration software 23 stores in advance a relative positional relationship between the position of the upper left alignment mark 6 of the substrate 2 and the center position of the chip 4 bonded to the upper left of the substrate 2. The coordinate value of the center position of the chip 4 on the work table 12 is calculated from the positional relationship and the actual position and inclination of the substrate 2, and this is recognized as the coordinate value in the apparatus coordinate system of the first reference point P′1. .
Subsequently, the registration software 23 determines the first reference point P′1 on the CAD coordinate system recognized by the work point creation software 22 and the first reference point P′1 on the apparatus coordinate system for the actual substrate 2. Then, the inclination of the CAD coordinate system is corrected around the first reference point P′1, and the CAD coordinate system is made to coincide with the actual inclination of the substrate 2.
As a result, the substrate 2 ′ and the actual substrate 2 in the CAD data can be overlapped, and the relationship between the relative position and inclination of the origin of the CAD coordinate system and the apparatus coordinate system of the ball mounter 11 at this time is expressed as CAD coordinates. It is set as the relationship between the system and the device coordinate system.
The registration software 23 determines the device coordinates for all the solder balls 3 from the relative coordinate values of the work points for all the solder balls 3 calculated by the work point creation software 22 and the relationship between the CAD coordinate system and the device coordinate system. The coordinate value of the work point in the system is calculated.
The registration software 23 uses the coordinate values of the work points in the apparatus coordinate system thus obtained to create control data for relative movement of the suction head 14 and the work table 12, and outputs the control data to the control means 18. I am doing so.
Note that the above-described procedure for associating the CAD coordinate system with the device coordinate system and the procedure for calculating the coordinate value of the work point in the device coordinate system related to the solder ball 3 are merely examples, and other methods are used to calculate the CAD data. It goes without saying that the relationship between the CAD coordinate system and the apparatus coordinate system may be set based on the positional relationship between the substrate 2 ′ and the actual substrate 2 to calculate the coordinate value of the work point in the apparatus coordinate system.

According to the above embodiment, even when the control data of the ball mounter 11 for placing a large number of solder balls 3 on the substrate 2 is created, manual input by the operator is unnecessary, and the control data is complicated. The problem of requiring a lot of time is solved.
Further, in this embodiment, it is only necessary to divide and draw the component to be a work target element into at least one work point layer, and it is not necessary to assign attribute data to each component. Can be created.

In the above embodiment, control data for the ball mounter 11 for placing the solder balls 3 on the substrate 2 is created. In addition to this, a chip mounter for placing the chip 4 on the substrate 2 using the same CAD data. Alternatively, control data of a flux application device that applies a flux to the mounting position of the solder ball 3 on the substrate 2 can be created.
In the case of the chip mounter, the work point creation software 22 selects the data of the alignment mark 5 ′ of the mark layer 33 as the work point image layer, and uses the center position of the alignment mark 5 ′ as the work point. As in the above embodiment, control data for the chip mounter can be created.
Further, the control data of the ball mounter 11 can be used almost as it is for the control data of the flux coating apparatus.
Further, in the case where control data is created for each work head for work in different processes such as flux application, ball mount, and chip mount, the ball image layer 34, mark image corresponding to the work of the work head, respectively. By selecting the data of the work target element (solder ball 3 ′, alignment mark 5 ′) from the layer 33, the CAD data of the workpiece 1 ′ created by the CAD can be used as control data of each device.

In the above embodiment, the pitch line P is drawn in the X direction and the Y direction by the CAD software 21 and the intersection of the pitch lines P is set as the reference point P ′. However, the reference point P is used instead of the pitch line P. It is also possible to draw 'directly.
In this case, the work point creation software 22 recognizes the interval and the number of the adjacent reference points P ′ so that the coordinate values of the work points can be obtained for the solder balls 3 not drawn by the CAD software 21 as in the above embodiment. Can be calculated.

The top view about the workpiece | work in a present Example. The figure which shows the workpiece manufacturing apparatus used by a present Example. The figure about the workpiece | work drawn with CAD software in a present Example is shown, (a) is the figure which displayed all the layers superimposed, (b) shows the figure which showed the concept about a layer. The flow which shows the procedure which produces control data from CAD data.

Explanation of symbols

1 Workpiece 2 Substrate 3 Solder ball 4 Chip 11 Ball mounter (Workpiece manufacturing equipment)
DESCRIPTION OF SYMBOLS 14 Suction head (work head) 18 Control means 19 Registration means 21 CAD software 22 Work point creation software 23 Registration software 34 Ball layer (work point layer) 35 Pitch layer (reference point layer)
P Pitch line P 'Reference point

Claims (4)

In a control data creation method for creating control data of a workpiece manufacturing apparatus that performs work by relatively moving a work head and a workpiece from CAD data of a workpiece created by CAD,
In the CAD, the work is divided into a plurality of layers for each required component and drawn, and one layer is used as a reference point layer on which a plurality of reference points are drawn, and at least one other layer is drawn . The layer is a work point layer on which a work target element to be worked by the work head is drawn, and the work point layer includes a work corresponding to a required first reference point among the plurality of reference points. Draw only the target element,
When creating control data from CAD data,
While selecting the data of the work target element drawn on the work point layer, using the required position of the work target element as a work point, the coordinate value of the work point in the CAD coordinate system is extracted,
Further, from the coordinate value of the first reference point drawn on the reference point image layer in the CAD coordinate system and the coordinate value of the work point drawn on the work point image layer in the CAD coordinate system, the first reference point Calculate the relative coordinate value of the above work point with the origin as
From the relative coordinate value of the work point with the first reference point as the origin and the interval between the first reference point and another reference point in the reference point layer, the coordinates of the work point not drawn on the work point layer A control data creation method characterized by calculating a value and creating the control data. When creating control data from the CAD data,
The coordinate value of the work point in the CAD coordinate system is converted into the coordinate value of the work point in the apparatus coordinate system based on a predetermined relationship between the CAD coordinate system and the apparatus coordinate system of the workpiece manufacturing apparatus,
2. The control data creation method according to claim 1, wherein the control data is created based on the coordinate value of the work point in the converted apparatus coordinate system. The workpiece is composed of a substrate and solder balls placed on the substrate,
In the CAD, control data creation method according to claim 1 or claim 2, characterized in that to draw a figure indicating a solder ball as a work target element of the work stipple layer. In the CAD, for each work head performing work in different processes, a work point layer is created to draw work target elements,
When creating control data from the CAD data,
In response to the work of the working head, the control data creation according to any one of claims 3 to claims 1 and selects the data of the work object elements drawn to the work stipple layer from the CAD data Method.

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