JP4978653B2 - Electronic component temperature control device and handler device - Google Patents

Description

  The present invention relates to an electronic component temperature control device used in an electronic component characteristic inspection and the like, and a handler device including the temperature control device.

  In a characteristic inspection of an electronic component such as an IC, there is a temperature load test in which the electronic component is inspected while being held at a predetermined temperature. In this temperature load test, it is necessary to inspect the electronic component under an accurate temperature load by complementing the temperature change due to self-heating of the electronic component. Recently, as represented by the CPUs of personal computers, electronic components are becoming faster, more integrated, and more miniaturized, and the amount of heat generated tends to increase. Is required. For this reason, various temperature control techniques for electronic components have been developed (for example, Patent Documents 1 to 3).

JP 2001-526837 A Japanese translation of PCT publication No. 2002-520622 JP-T-2004-527764

In the method of circulating the cooling liquid as in Patent Document 1 and Patent Document 2, a liquid cooling device (chiller) having a large tank is required to circulate the cooling liquid, and before the operation for cooling the electronic components is started. It takes a lot of time to cool the coolant in the tank.
Moreover, in the cooling system provided with the compressor and condenser like patent document 3, it was not necessarily satisfactory at the point of the heating responsiveness at the time of switching from cooling to heating.
Further, in the case of this type of conventional temperature control device, there is a problem that condensation occurs in the movable part piping due to cooling.
Furthermore, in the measurement hand of the handler device that integrates the function of transporting the electronic component and the function of cooling the electronic component being measured, the suction pad that adsorbs the electronic component is placed on the upper surface of the electronic component in order to improve thermal conductivity. There was also a problem of sucking the applied heat conductive liquid.

  The present invention has been made in view of the above problems, and an object of the present invention is to obtain an electronic component temperature control device and a handler device excellent in responsiveness in both cases of cooling and heating. It is another object of the present invention to provide a temperature control device and a handler device that prevent condensation on the movable part piping due to cooling. Furthermore, a temperature control device and a handler capable of adsorbing an electronic component without sucking the thermally conductive liquid discharged onto the upper surface of the electronic component in an apparatus including an adsorption pad that vacuum-adsorbs the electronic component to be temperature controlled It is also an object to obtain a device.

An electronic component temperature control apparatus according to the present invention is
A heat sink that takes heat of the electronic component subject to temperature control using heat conduction and participates in temperature control of the electronic component;
A heat conduction block having a first surface in contact with the electronic component and a second surface opposite to the first surface, the second surface being disposed to face and separate from the heat sink;
A compressed air supply circuit that supplies compressed air that separates the heat sink and the heat conduction block is provided between the heat sink and the heat conduction block.

The compressed air supply circuit includes a flow rate controller that controls supply of compressed air passing through the circuit.
Further, the compressed air supply circuit is provided with a device for drying the compressed air passing through the circuit.

  Further, at least one first heater is provided in the heat conduction block. And a controller for controlling the temperature of the first heater based on a detection value of the first temperature detector. The controller includes at least one first temperature detector for detecting the temperature of the heat conduction block. is there.

The heat sink is an evaporator constituting a refrigeration cycle apparatus.
Moreover, the 2nd heater which heats the piping which returns to the compressor which comprises the said refrigerating-cycle apparatus from the said evaporator is provided. Furthermore, the second heater is provided with an excessive temperature rise prevention device that prevents the temperature from becoming higher than a predetermined temperature.
In addition, a second temperature detector for detecting the temperature of the second heater is provided, and a controller for controlling the temperature of the second heater based on a detection value of the second temperature detector is provided.

  In addition, the heat conduction block has a shape surrounding the heat sink, and a side wall of the heat conduction block extending from the periphery of the outer surface is disposed through the gap with the heat sink, the gap and the compressed air The supply circuit is in communication. Furthermore, in this case, the first heater is arranged on a side wall of the heat conduction block.

Further, the heat sink and the second surface of the heat conduction block are in contact with each other through a heat conductive liquid.
In addition, at least one suction pad that vacuum-sucks the electronic component and presses the electronic component against the heat-conductive block is provided on the outer periphery of the heat-conductive block. In this case, the suction pad is configured to be extendable and contracted. When the suction pad is not sucked, the tip of the suction pad is extended and the tip protrudes from the electronic component contact surface of the heat conduction block. The pad is changed to a contracted state.

  In addition, a heat conductive liquid supply device is provided that supplies a heat conductive liquid having insulating properties to the upper surface of the electronic component pressed against the heat conductive block.

A handler device according to the present invention is a handler device including a robot hand that presses an electronic component against a tester, including the temperature control device according to any one of the above, and the heat sink and the heat conduction block of the temperature control device. It is arranged in the robot hand.
With this handler device, it is possible to obtain an electronic component temperature control device and a handler device with excellent responsiveness in both cases of cooling and heating. Moreover, the temperature control apparatus and handler apparatus which prevented the dew condensation to the movable part piping resulting from cooling can be obtained. Furthermore, a temperature control device and a handler capable of adsorbing an electronic component without sucking the thermally conductive liquid discharged onto the upper surface of the electronic component in an apparatus including an adsorption pad that vacuum-adsorbs the electronic component to be temperature controlled A device can also be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS The whole block diagram of the temperature control apparatus of the electronic component which concerns on Embodiment 1 of this invention. Sectional drawing (a) of the electronic component cooling part which comprises the temperature control apparatus of FIG. 1, and sectional drawing (b) concerning the deformation | transformation. The top view (a) of another electronic component cooling part which comprises the temperature control apparatus of FIG. 1, and the synthetic | combination sectional view (b) of the XX direction. The block diagram of the handler apparatus which concerns on Embodiment 2 of this invention.

Embodiment 1
FIG. 1 is an overall configuration diagram of a temperature control apparatus for an electronic component according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of an electronic component cooling unit (a part composed of an evaporator, a heat conduction block, and a suction pad, which will be described later, but there may be no suction pad) of the temperature control device of FIG. The main difference between (a) and (b) in FIG. 2 is the presence or absence of an O-ring between the evaporator and the heat conduction block.
The temperature control device includes a refrigerant circulation circuit in which a compressor 1, a condenser 2, an expander (for example, an expansion valve) 6 and an evaporator 7 are connected by pipes 17 and 18, and cooling is performed by the refrigerant circulation circuit. A cycle device is configured. Of these, the evaporator 7 is directly involved in the temperature control of the electronic component 40 as a heat sink. A heat conduction block 9 having an outer surface in contact with the electronic component 40, in this example, a bottom outer surface 9A, is fitted to the evaporator 7 through an elastic body such as a spring 19 so as to be relatively movable with the evaporator 7. ing. A first heater 10 for heating the heat conduction block 9 and a first temperature sensor 11 as a temperature detector for detecting the temperature of the upper surface of the heat conduction block 9 or the electronic component 40 are incorporated in the heat conduction block 9. The first temperature sensor 11 is connected to a controller (for example, a programmable controller) 30, and the controller 30 controls the operation of the first heater 10 according to the temperature detected by the first temperature sensor 11.
Note that the electronic component 40 is not in direct contact with the evaporator 7 but is in contact with the heat conducting block 9 because the heat conducting block 9 corresponding to the electronic component to be controlled having a different shape is used. This is because the heat conduction between the evaporator 7 and the electronic component 40 is always controlled in a good state regardless of the type of the electronic component.

The heat conduction block 9 is made of a metal having good heat conductivity (for example, copper), and has a bottom outer surface 9A that can come into contact with the electronic component 40, and a bottom inner surface 9B corresponding to the bottom outer surface 9A serves as an action of the spring 19. Thus, the evaporator 7 is disposed so as to be able to contact / separate (preferably close / separate). And between the opposing surfaces of the evaporator 7 and the heat conduction block 9, the compressed air supply circuit 90 which supplies the compressed air which separates them is connected. The compressed air supply circuit 90 includes an air pressure source 91 that is a supply source of compressed air, and a flow rate controller (for example, a compressed air supply valve) 92 that controls air supply from the air pressure source 91 to the evaporator 7 side. Further, in addition to these, the compressed air supply circuit 90 is preferably provided with a device (for example, a dryer) 93 for drying the compressed air.
The heat conduction block 9 has a shape surrounding the evaporator 7, for example, a box shape shown in FIG. 2, and is fitted and held in the box shape so as to be movable relative to the heat conduction block 9 by a spring 19. It can be set as the aspect which accommodated the evaporator 7 made. In this case, the side wall of the heat conduction block 9 extending from the periphery of the bottom outer surface 9A that can come into contact with the electronic component is disposed through the evaporator 7 with a minute gap, and the compressed air supply circuit 90 is communicated with the gap 20. It is preferable to do so. In this case, the first heater 10 is arranged on the side wall portion of the heat conduction block 9, and the first heater 10 is disposed at the bottom of the heat conduction block 9 positioned between the evaporator 7 and the electronic component 40. It is preferable not to intervene. The outer surface of the side wall of the heat conduction block 9 is represented by 9C, and the inner surface of the side wall is represented by 9D.

As the first heater 10, an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, a boron nitride heater, or the like can be employed.
The first temperature sensor 11 is not always essential. The reason is that the electronic component 40 itself may include a temperature sensor equivalent, and in this case, the detected value of the temperature sensor equivalent of the electronic component 40 is fed back to the controller 30 so that the first heater This is because ten operations can be controlled.

  Further, at least one, preferably a plurality of adsorption pads are provided on the outer periphery of the heat conduction block 9 as means for picking up and transporting the electronic component 40 from a tray or the like, or press-contacting to the heat conduction block 9. (Vacuum suction pad) 8 is preferably provided. The suction pad 8 is formed of a flexible pad having one end connected to a vacuuming circuit 81 communicated with a vacuum source and the other end (tip) opened so that the electronic component 40 can be vacuum-sucked.

  Furthermore, holes or grooves are made in the heat conduction block 9, and a temperature sensor (platinum resistor, etc.) is tightly fixed in the holes or grooves with a heat conduction material (such as a thermosetting resin mixed with high heat conduction). To do. Thereby, the instability of the contact thermal resistance between the heat conduction block 9 and the first temperature sensor 11 is eliminated, and the measurement temperature accuracy is greatly improved. Moreover, by doing in this way, even when the force which presses the electronic component 40 to an inspection socket is added, the heat conductive material becomes a buffer material, and a big force is not applied to the 1st temperature sensor 11, but it prevents the destruction Also contribute.

  In addition, when the electronic component 40 is a multi-core type and there are a plurality of heat generation locations, a plurality of first temperature sensors 11 and a plurality of first heaters 10 are mounted to monitor the temperature of the electronic component 40 at the plurality of locations. It is preferable to do this. A high-speed, highly-integrated CPU or the like has a very high heat density, and a temperature gradient is generated on the surface of the electronic component 40. Therefore, by dividing the heat generating area of the electronic component 40 and individually controlling the temperature, it is possible to reduce the temperature gradient and to take measures against a problem that the electronic component 40 is locally heated and damaged.

  A strainer 3, a filter dryer 4, an electromagnetic valve 5, and the like may be provided in the refrigerant supply side piping 17 from the compressor 1 through the condenser 2 and the expander 6 to the evaporator 7. The strainer 3 functions to absorb fluctuations in the amount of refrigerant in the evaporator 7 due to load fluctuations. The filter dryer 4 contains a kind of desiccant (silica gel, soba beads, molecular sheep, etc.) that removes moisture from the refrigerant. Is preferably provided. The electromagnetic valve 5 is for opening and closing the refrigerant supply passage where the refrigerant goes to the evaporator 7.

On the other hand, a second heater 12 such as a nichrome wire heater is provided in the refrigerant recovery side pipe 18 from the evaporator 7 to the compressor 1. It is preferable to incorporate a second temperature sensor 13 as a temperature detector for detecting the temperature of the second heater 12. The second temperature sensor 13 is connected to the controller 30, and the controller 30 controls the operation of the second heater 12 according to the temperature detected by the second temperature sensor 13. In addition, it is preferable that a thermostat or a thermal fuse is provided as an excessive temperature rise preventer that prevents the second heater 12 from exceeding a predetermined temperature. In this example, a thermostat 14 is disposed in the heating circuit of the second heater 12. In addition, when the 2nd heater 12 is provided in the distance close | similar to the evaporator 7, between the 2nd heater 12 and the evaporator 7 so that the heat of the 2nd heater 12 may not affect the evaporator 7. FIG. It is preferable to provide a heat insulating material in the pipe part.
Further, as shown in FIG. 2A, a dry air supply circuit 94 connected to the space above the O-ring 21 of the evaporator 7 and the heat conduction block 9 is provided, and the dry air is supplied from the dry air supply circuit 94. It may be supplied to the space to prevent condensation of the evaporator 7.

  Furthermore, an accumulator (not shown) for separating the refrigerant liquid that could not be evaporated by the evaporator 7 may be provided in the refrigerant recovery side pipe 18 in front of the compressor 1. Further, a heat exchanger 16 may be provided between the refrigerant supply side pipe 17 and the refrigerant recovery side pipe 18 so as to exchange heat between these pipes. In addition, the code | symbol 2A in FIG. 1 represents the condenser fan which cools the condenser 2. FIG.

  Next, the operation of the temperature control device shown in FIG. 1 will be described. The electronic component 40 is cooled using the cooling cycle apparatus of FIG. That is, the refrigerant that has come out of the compressor 1 and is condensed into a liquid at normal temperature and high pressure by the condenser 2 is transported to the evaporator 7 as a fluid in which low-pressure liquid and gas are mixed by the expander 6. Then, when the fluid is evaporated in the evaporator 7, the heat of the electronic component 40 pressed against the heat conducting block 9 is taken and the electronic component 40 is cooled. At this time, the evaporator 7 and the inner surface 9B of the heat conduction block 9 are in close contact with each other due to the repulsive force of the spring 19. However, in order to make the contact between the evaporator 7 and the heat conduction block 9 more dense, a heat conductive liquid may be supplied between them in advance from the heat conductive liquid supply circuit 51 or the like. In this case, as the heat conductive liquid, a liquid such as heat conductive grease, thermosetting resin, or silicone oil that does not evaporate below 200 ° C. can be used.

On the other hand, when the temperature of the electronic component 40 is excessively decreased or when a high temperature test is performed, the controller 30 acts on the flow rate controller 92 to connect the evaporator 7 and the bottom inner surface 9B of the heat conduction block 9. Compressed air is introduced into the evaporator 7 and the evaporator 7 and the heat conduction block 9 are separated by the pressure. At the same time, the first heater 10 is operated to heat the heat conduction block 9, thereby increasing the temperature of the electronic component 40. By separating the evaporator 7 and the heat conducting block 9 in this way, the influence of the cooling heat on the heat conducting block 9 of the evaporator 7 is reduced, so that the responsiveness during heating is improved.
When heating the electronic component 40, in addition to the above, the solenoid valve 5 may be turned off to interrupt the supply of the refrigerant to the evaporator 7.

In addition, when the refrigerant becomes cooler than the temperature of the installation environment of the evaporator 7 due to evaporation in the evaporator 7, the controller 30 operates the second heater 12 to extend the refrigerant on the refrigerant recovery side. The piping 18 is heated to prevent condensation. Note that the evaporator 7 takes heat from the electronic component 40 so that the temperature does not decrease as much as the refrigerant recovery side pipe 18 and the evaporator 7 itself can be fitted with a heat insulating material relatively easily. In the apparatus, it is particularly necessary to take measures against condensation on the pipe 18 on the refrigerant recovery side.
With respect to the heating for preventing the condensation on the refrigerant recovery side pipe 18, temperature accuracy is not required, so that the second heater 12 can be controlled by temperature control using an overheat prevention device such as a thermostat or a temperature fuse. . However, the second heater 12 may be controlled by the controller 30 by feeding back the detected value to the controller 30 using the same control as the first heater 10 and the second temperature sensor 13.
Further, as shown in FIG. 2B, the O-ring 21 between the evaporator 7 and the heat conduction block 9 is eliminated, and dry compressed air is supplied between them, so that the heat conduction with the evaporator 7 is achieved. Dry air leaks upward from a slight gap between the blocks 9 and the evaporator 7 can be filled with dry air. Further, by controlling the amount of leakage by the flow rate controller 92, it is possible to adjust the amount of separation between the evaporator 7 and the heat conduction block 9. Thus, by supplying dry air between the evaporator 7 and the heat conduction block 9, the evaporator 7 and the first heater 10 can be thermally separated by separating them, and the response at the time of heating The nature is further improved. Moreover, the dew condensation of the evaporator 7 which becomes low temperature can be prevented by supplying dry air.

FIG. 3 shows a plan view (a) of still another electronic component cooling section constituting the temperature control device of FIG. 1, and a combined sectional view (b) in the XX direction. The main difference between the electronic component cooling unit of FIG. 3 and the electronic component cooling unit of FIG. 2 is the structure of the suction pad. The suction pad 8A shown in FIG. 3 is configured such that its suction part has a bellows-like shape and can be expanded and contracted. The adsorption pad 8A changes to a contracted state at the time of adsorption.
In order to suck the electronic component 40 with the suction pad 8A, first, the electronic component cooling unit including the suction pad 8A is lowered to a position where the tip of the suction pad 8A contacts the upper surface of the electronic component 40. When the tip of the suction pad 8A comes into contact with the upper surface of the electronic component 40, evacuation is performed in the suction pad 8A, and the electronic component 40 is sucked by the suction pad 8A. Accompanying this evacuation, the elastic suction pad 8A shrinks in a state where the electronic component 40 is sucked. For the purpose of simply transporting the electronic component 40, the suction pad 8A only needs to hold the electronic component 40 by suction. However, when the temperature of the electronic component 40 is controlled, the electronic component 40 is thermally conducted. The electronic component 40 is preferably sucked so as to be in pressure contact with the block 9.

By the way, in order to improve the adhesion between the heat conduction block 9 and the electronic component 40 and improve the heat conduction efficiency between them, a heat conductive liquid is applied between the heat conduction block 9 and the electronic component 40. There is a case. In that case, first, a droplet of the heat conductive liquid 50 is dropped on the center of the upper surface of the electronic component 40, and the suction pad 8A is brought into contact with the periphery of the upper surface of the electronic component 40 on which the droplet is placed. Thereafter, vacuuming is performed in the suction pad 8 </ b> A so that the electronic component 40 is sucked by the suction pad 8 </ b> A, and the electronic component 40 is pressed into contact with the bottom outer surface 9 </ b> A of the heat conduction block 9. Due to the pressure contact between the electronic component 40 and the heat conduction block 9, the droplet of the heat conductive liquid 50 spreads on the surface at the pressure contact portion. However, since the suction pad 8A was in contact with the electronic component 40 before this pressure contact, the thermally conductive liquid 50 is not sucked into the suction pad 8A even if evacuation is performed in the suction pad 8A.
The thermally conductive liquid 50 used here has excellent thermal conductivity and is electrically insulating (electrical resistance is 1 × 10 ¹⁰ Ω or more). As such, for example, a fluorine-based inert liquid is commercially available.

  With this configuration, even if the heat conductive liquid 50 is applied between the heat conductive block 9 and the electronic component 40, the liquid 50 is not sucked. In addition, due to the series of adsorption operations, the droplets of the heat conductive liquid 50 spread as a thin film on the surface of the electronic component, so that there is no need for another mechanism for forming a film, and the liquid is interposed as a thin film on the surface of the electronic component. The operating tact time can be shortened. Moreover, since the heat conductive liquid 50 has electrical insulation, even if the liquid heat conductive material 50 spills or scatters from the electronic component, the electronic component or the tester side substrate may be short-circuited. Absent.

  Further, the temperature control device includes a refrigerant supply source 25 connected to the refrigerant flow path constituting the cooling cycle device, and a pressure regulator arranged in a connection flow path between the refrigerant flow path and the refrigerant supply source 25. A pressure regulating valve 26 is preferably provided. In that case, the pressure regulating valve 26 supplies the refrigerant from the refrigerant supply source 25 to the refrigerant channel when the pressure of the refrigerant channel decreases, and from the refrigerant channel when the pressure of the refrigerant channel increases. Is adjusted to return to the refrigerant supply source 25. Thereby, the refrigerant pressure in the refrigerant flow path constituting the cooling cycle device is kept constant, and temperature control with high accuracy is possible.

  According to the temperature control device having the above configuration, the electronic component 40 is excellent in responsiveness in both cases of cooling and heating, and rapid temperature setting is possible. Moreover, the dew condensation in the movable part piping 18 resulting from cooling is prevented. Further, in the case where the suction pad 8A that vacuum-sucks the electronic component 40 to be temperature-controlled is provided, the suction pad 8A sucks and holds the electronic component without sucking the thermally conductive liquid discharged on the upper surface of the electronic component. it can.

As described above, the temperature control device according to the present invention has been described according to the embodiment. However, the temperature control device according to the present invention can be modified as follows. That is, in the said embodiment, although the 1st heater 10 and the 2nd heater 12 were controlled by the same controller 30, they may be controlled by a separate controller. Further, the solenoid valve 5, the pressure regulating valve 26, and the flow rate controller 92 that perform flow path opening and closing and flow rate control may be controlled by individually provided controllers, or may be controlled by one common controller. . Further, the control of the electromagnetic valve 5, the pressure regulating valve 26 and the flow rate controller 93 may be performed by the controller 30 that controls the first heater 10 and the second heater 12.
Furthermore, the cooling capacity of the evaporator 7 can be adjusted by controlling the compressor 1 with an inverter.

Embodiment 2
FIG. 4 is a configuration diagram of a handler device according to the second embodiment of the present invention. This handler device is an electronic component handling device capable of holding an electronic component (including a device) at a predetermined temperature and pressing the electronic component against a tester separate from the handler device to inspect the characteristics of the electronic component. is there. This handling device includes the temperature control device described in the first embodiment for temperature control of an electronic component to be inspected. Note that reference numerals 1, 2, 17, and 18 shown in FIG. 4 correspond to the same reference numerals in the first embodiment. A measurement hand 60A constituting the measurement robot unit 60 shown in FIG. 4 corresponds to the electronic component cooling unit of the first embodiment. Hereinafter, an IC inspection process using the handler device according to the second embodiment will be described assuming that an electronic component to be inspected is an IC (not shown).

  First, the supply hand 63 of the supply robot unit 62 sucks and holds the IC by vacuum suction from the untested IC tray 61 and transports it onto the supply shuttle 64. Subsequently, the supply shuttle 64 transports the placed untested IC to the bottom of the dispenser 69 which is a thermally conductive liquid supply device, and after discharging the thermally conductive liquid 50 from the dispenser 69 to the upper surface of the IC, Transport to the measuring robot 60. Next, the measurement robot unit 60 sucks and holds the IC using the measurement hand 60A from the transport shuttle 64 that has been transported, and transports the IC to an inspection socket (not shown) of the tester 70. Therefore, the electrical characteristics of the IC are inspected by the tester 70 in a state where the measuring robot unit 60 is pressed and electrically connected to the inspection socket. When the IC generates heat during the electrical characteristic inspection, the IC is cooled by using an evaporator that constitutes the measuring hand 60A, and the IC is controlled to be kept within the target temperature range. Further, at the time of high temperature inspection, compressed air is introduced between the evaporator constituting the measuring hand 60A and the heat conduction block so as to be separated from each other and maintained within the target temperature range using the first heater. The IC is heated and controlled. When there is a variation in the heat generation of the IC, cooling and heating control is performed using the measuring hand 60A so as to maintain the IC within the target temperature range. After the electrical characteristic inspection is completed, the measuring robot 60 uses the measuring hand 60A to suck and hold the inspected IC from the inspection socket and convey it onto the recovery shuttle 65. The recovery shuttle 65 conveys the inspected IC from the measurement robot unit 60 to the recovery robot unit 66. Furthermore, a signal indicating the result of the electrical characteristic inspection is received from the tester 70, and the recovery hand 67 of the recovery robot unit 66 sucks and holds the IC from the recovery shuttle 65 according to the result, and is classified and stored in the inspected IC tray 68 according to the inspection result. To do. With the above steps, the IC characteristic inspection is completed.

The handler apparatus according to the second embodiment includes the temperature control device described in the first embodiment, and is applied to a measuring hand that presses the inspection target component against the tester 70 or holds the inspection target component against the tester 70 according to the first embodiment. Since this electronic component cooling unit is arranged, the corresponding effect can be obtained also in this handler device.
That is, a handler device with excellent responsiveness can be obtained in both cases of cooling and heating of the electronic component 40. Moreover, the handler apparatus which prevented the condensation to the movable part piping resulting from cooling can be obtained. Furthermore, when the suction pad 8A that vacuum-sucks the electronic component that is the temperature control target is provided, the suction pad 8A can suck the electronic component without sucking the thermally conductive liquid discharged to the upper surface of the electronic component. .

  1 compressor, 2 condenser, 2A condenser fan, 3 strainer, 4 filter dryer, 5 solenoid valve, 6 expander, 7 evaporator (heat sink), 8, 8A adsorption pad, 9 heat conduction block, 9A bottom outer surface, 9B Bottom inner surface, 9C Side wall outer surface, 9D Side wall inner surface, 10 First heater, 11 First temperature sensor, 12 Second heater, 13 Second temperature sensor, 14 Thermostat, 17 Refrigerant supply side piping, 18 Refrigerant recovery side Piping, 19 Spring, 20 Clearance, 21 O-ring, 25 Refrigerant supply source, 26 Pressure regulating valve, 30 Controller, 40 Electronic components, 50 Thermally conductive liquid, 51 Thermally conductive liquid supply circuit, 60 Measuring robot part, 60A Measuring hand, 69 dispenser, 70 tester, 81 evacuation circuit, 90 compressed air supply circuit, 91 air pressure source 92 flow controller, 93 dryer 94 dry air supply circuit.

Claims (16)

A heat sink that takes heat of the electronic component subject to temperature control using heat conduction and participates in temperature control of the electronic component;
A heat conduction block having a first surface in contact with the electronic component and a second surface opposite to the first surface, the second surface being disposed to face and separate from the heat sink;
A compressed air supply circuit for supplying compressed air separating the heat sink and the heat conduction block between the heat sink and the heat conduction block;
An electronic component temperature control apparatus comprising:   2. The temperature control device for an electronic component according to claim 1, further comprising a flow rate controller for controlling supply of compressed air passing through the compressed air supply circuit.   The temperature control apparatus of the electronic component of Claim 1 or 2 provided with the apparatus which dries the compressed air which passes through the inside of the said compressed air supply circuit.   The temperature control apparatus of the electronic component of any one of Claim 1 thru | or 3 with which the at least 1 1st heater is provided in the said heat conductive block. Comprising at least one first temperature detector for detecting the temperature of the heat conducting block;
The temperature control apparatus of the electronic component of Claim 4 provided with the controller which controls the temperature of a said 1st heater based on the detected value of a said 1st temperature detector.   The temperature control device for an electronic component according to claim 1, wherein the heat sink is an evaporator constituting a refrigeration cycle device.   The temperature control apparatus of the electronic component of Claim 6 provided with the 2nd heater which heats piping which returns to the compressor which comprises the said refrigeration cycle apparatus from the said evaporator.   The temperature control device for an electronic component according to claim 7, further comprising an overheat prevention device for preventing the second heater from exceeding a predetermined temperature.   Either of the Claims 7 or 8 provided with the 2nd temperature detector which detects the temperature of the said 2nd heater, and the controller which controls the temperature of the said 2nd heater based on the detected value of the said 2nd temperature detector. A temperature control device for an electronic component according to claim 1.   The heat conduction block has a shape surrounding the heat sink, and a side wall of the heat conduction block extending from the periphery of the outer surface is disposed via the heat sink and a gap, and the gap, the compressed air supply circuit, The temperature control device for an electronic component according to claim 1, wherein the temperature control device is in communication.   The temperature control device for an electronic component according to claim 10, wherein the first heater is disposed on a side wall of the heat conduction block.   The temperature control device for an electronic component according to claim 1, further comprising a heat conductive liquid supply circuit that supplies a heat conductive liquid between the heat sink and the heat conductive block.   13. The electronic component according to claim 1, further comprising at least one suction pad that vacuum-sucks the electronic component and presses the electronic component against the heat-conductive block on an outer periphery of the heat-conductive block. Temperature control device.   The suction pad is configured to be extendable and contracted. When the suction pad is not sucked, the tip of the suction pad is extended and the tip of the suction pad protrudes from the electronic component contact surface of the heat conduction block. 14. The temperature control device for an electronic component according to claim 13, wherein the temperature control device changes to a state.   The electron according to any one of claims 1 to 14, further comprising a thermally conductive liquid supply device that supplies an insulating thermally conductive liquid to an upper surface of the electronic component pressed against the thermally conductive block. Temperature control device for parts.   A handler device comprising a robot hand for pressing an electronic component against a tester, comprising the temperature control device according to any one of claims 1 to 15, wherein the heat sink and the heat conduction block of the temperature control device are connected to the robot. A handler device placed in the hand.

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