JP4967797B2 - Method for producing polyimide film - Google Patents
Method for producing polyimide film Download PDFInfo
- Publication number
- JP4967797B2 JP4967797B2 JP2007129077A JP2007129077A JP4967797B2 JP 4967797 B2 JP4967797 B2 JP 4967797B2 JP 2007129077 A JP2007129077 A JP 2007129077A JP 2007129077 A JP2007129077 A JP 2007129077A JP 4967797 B2 JP4967797 B2 JP 4967797B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyimide
- bis
- clip
- aminophenoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001721 polyimide Polymers 0.000 title claims description 91
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000010408 film Substances 0.000 claims description 174
- 229920005575 poly(amic acid) Polymers 0.000 claims description 42
- -1 aromatic tetracarboxylic acid Chemical class 0.000 claims description 36
- 239000004642 Polyimide Substances 0.000 claims description 25
- 239000002243 precursor Substances 0.000 claims description 23
- 150000004984 aromatic diamines Chemical class 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- 150000007513 acids Chemical class 0.000 claims description 6
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical class OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 5
- 150000002170 ethers Chemical class 0.000 claims description 2
- 150000004989 p-phenylenediamines Chemical class 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 23
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 18
- 238000001816 cooling Methods 0.000 description 15
- 238000001035 drying Methods 0.000 description 14
- 239000000835 fiber Substances 0.000 description 11
- 230000032258 transport Effects 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000012024 dehydrating agents Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000003779 heat-resistant material Substances 0.000 description 6
- 239000000314 lubricant Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000006798 ring closing metathesis reaction Methods 0.000 description 5
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical group C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 238000001802 infusion Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical group OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical group NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 0 *c(cc1)cc(C(O2)=O)c1C2=O Chemical compound *c(cc1)cc(C(O2)=O)c1C2=O 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 235000012255 calcium oxide Nutrition 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000003495 polar organic solvent Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005594 polymer fiber Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- GSHMRKDZYYLPNZ-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)C=C1OC1=CC=CC=C1 GSHMRKDZYYLPNZ-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- NILYJZJYFZUPPO-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C(OC=2C=CC=CC=2)=C1 NILYJZJYFZUPPO-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- YLHUPYSUKYAIBW-UHFFFAOYSA-N 1-acetylpyrrolidin-2-one Chemical compound CC(=O)N1CCCC1=O YLHUPYSUKYAIBW-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- BCMLMVXTJIMQTK-UHFFFAOYSA-N 2-[(4-phenoxyphenyl)sulfinylmethyl]thiirane Chemical compound C=1C=C(OC=2C=CC=CC=2)C=CC=1S(=O)CC1CS1 BCMLMVXTJIMQTK-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- ZDBWYUOUYNQZBM-UHFFFAOYSA-N 3-(aminomethyl)aniline Chemical compound NCC1=CC=CC(N)=C1 ZDBWYUOUYNQZBM-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- GBUNNYTXPDCASY-UHFFFAOYSA-N 3-[3-[2-[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(C=CC=2)C(C=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 GBUNNYTXPDCASY-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- UQHPRIRSWZEGEK-UHFFFAOYSA-N 3-[4-[1-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 UQHPRIRSWZEGEK-UHFFFAOYSA-N 0.000 description 1
- PHVQYQDTIMAIKY-UHFFFAOYSA-N 3-[4-[1-[4-(3-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(CC)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 PHVQYQDTIMAIKY-UHFFFAOYSA-N 0.000 description 1
- MFTFTIALAXXIMU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MFTFTIALAXXIMU-UHFFFAOYSA-N 0.000 description 1
- BDROEGDWWLIVJF-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CCC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 BDROEGDWWLIVJF-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- TZFAMRKTHYOODK-UHFFFAOYSA-N 3-[4-[3-[4-(3-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CCCC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 TZFAMRKTHYOODK-UHFFFAOYSA-N 0.000 description 1
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 description 1
- JERFEOKUSPGKGV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(SC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 JERFEOKUSPGKGV-UHFFFAOYSA-N 0.000 description 1
- VTHWGYHNEDIPTO-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfinylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 VTHWGYHNEDIPTO-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- YSMXOEWEUZTWAK-UHFFFAOYSA-N 3-[4-[[4-(3-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 YSMXOEWEUZTWAK-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- BFWYZZPDZZGSLJ-UHFFFAOYSA-N 4-(aminomethyl)aniline Chemical compound NCC1=CC=C(N)C=C1 BFWYZZPDZZGSLJ-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- QLSRQQLSYOMIAB-UHFFFAOYSA-N 4-[4-[1-[4-(4-aminophenoxy)phenyl]butyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(CCC)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 QLSRQQLSYOMIAB-UHFFFAOYSA-N 0.000 description 1
- KWLWYFNIQHOJMF-UHFFFAOYSA-N 4-[4-[1-[4-(4-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KWLWYFNIQHOJMF-UHFFFAOYSA-N 0.000 description 1
- DDUOTTYELMRWJE-UHFFFAOYSA-N 4-[4-[1-[4-(4-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(CC)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 DDUOTTYELMRWJE-UHFFFAOYSA-N 0.000 description 1
- QXCRYCTXLXDDST-UHFFFAOYSA-N 4-[4-[2-[3-[2-[4-(4-amino-2-fluorophenoxy)phenyl]propan-2-yl]phenyl]propan-2-yl]phenoxy]-3-fluoroaniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)F)=CC=2)=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1F QXCRYCTXLXDDST-UHFFFAOYSA-N 0.000 description 1
- RIMWCPQXJPPTHR-UHFFFAOYSA-N 4-[4-[2-[3-[2-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]propan-2-yl]phenyl]propan-2-yl]phenoxy]-3-(trifluoromethyl)aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F RIMWCPQXJPPTHR-UHFFFAOYSA-N 0.000 description 1
- FDLMASCMQVDQHD-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)=CC(C)=C1OC1=CC=C(N)C=C1 FDLMASCMQVDQHD-UHFFFAOYSA-N 0.000 description 1
- ALFOPRUBEYLKCR-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]propan-2-yl]-2-methylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=CC=2)=CC=C1OC1=CC=C(N)C=C1 ALFOPRUBEYLKCR-UHFFFAOYSA-N 0.000 description 1
- USUYHTDSFPTEFF-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)=CC=C1OC1=CC=C(N)C=C1 USUYHTDSFPTEFF-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- UXBSLADVESNJEO-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(CC)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 UXBSLADVESNJEO-UHFFFAOYSA-N 0.000 description 1
- QZTURPSSWBAQMO-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 QZTURPSSWBAQMO-UHFFFAOYSA-N 0.000 description 1
- AUOBMHBCOTUSTJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)CC(C=C1)=CC=C1OC1=CC=C(N)C=C1 AUOBMHBCOTUSTJ-UHFFFAOYSA-N 0.000 description 1
- HBVLEOCILWODGB-UHFFFAOYSA-N 4-[4-[3-[4-(4-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)C(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 HBVLEOCILWODGB-UHFFFAOYSA-N 0.000 description 1
- GIQDBONDPVCPBF-UHFFFAOYSA-N 4-[4-[3-[4-(4-aminophenoxy)phenyl]butyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)CCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 GIQDBONDPVCPBF-UHFFFAOYSA-N 0.000 description 1
- IEPTWJUEKGSTAQ-UHFFFAOYSA-N 4-[4-[3-[4-(4-aminophenoxy)phenyl]propyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CCCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 IEPTWJUEKGSTAQ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- SXTPNMJRVQKNRN-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1SC(C=C1)=CC=C1OC1=CC=C(N)C=C1 SXTPNMJRVQKNRN-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- ORIJQRKZCCBPAX-UHFFFAOYSA-N 4-[4-[4-[4-(4-aminophenoxy)phenyl]butyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CCCCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 ORIJQRKZCCBPAX-UHFFFAOYSA-N 0.000 description 1
- PJCCVNKHRXIAHZ-UHFFFAOYSA-N 4-[4-[[4-(4-aminophenoxy)phenyl]methyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CC(C=C1)=CC=C1OC1=CC=C(N)C=C1 PJCCVNKHRXIAHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- BGMMSYYKJDBARS-UHFFFAOYSA-N NC=1C=C(C(=O)C2=CC=C(C(=C2)OC2=CC=CC=C2)N)C=CC1.NC=1C=C(C(=O)C2=CC=C(C=C2)N)C=CC1OC1=CC=CC=C1 Chemical compound NC=1C=C(C(=O)C2=CC=C(C(=C2)OC2=CC=CC=C2)N)C=CC1.NC=1C=C(C(=O)C2=CC=C(C=C2)N)C=CC1OC1=CC=CC=C1 BGMMSYYKJDBARS-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HJNTWZFZPOUDDG-UHFFFAOYSA-N [2-(3-aminophenoxy)phenyl]-phenylmethanone Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)C(=O)C=2C=CC=CC=2)=C1 HJNTWZFZPOUDDG-UHFFFAOYSA-N 0.000 description 1
- VSZMHWHJMHITJR-UHFFFAOYSA-N [3-(3-amino-4-phenoxybenzoyl)phenyl]-(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(C=CC=2)C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 VSZMHWHJMHITJR-UHFFFAOYSA-N 0.000 description 1
- JYYBEGXDDHNJMX-UHFFFAOYSA-N [3-(4-amino-3-phenoxybenzoyl)phenyl]-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(C=CC=2)C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 JYYBEGXDDHNJMX-UHFFFAOYSA-N 0.000 description 1
- WYYLAHMAYZBJOI-UHFFFAOYSA-N [3-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=C(C=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WYYLAHMAYZBJOI-UHFFFAOYSA-N 0.000 description 1
- CTEMSXOAFRWUOU-UHFFFAOYSA-N [4-(3-amino-4-phenoxybenzoyl)phenyl]-(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 CTEMSXOAFRWUOU-UHFFFAOYSA-N 0.000 description 1
- VQXJDOIQDHMFPQ-UHFFFAOYSA-N [4-(4-amino-3-phenoxybenzoyl)phenyl]-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 VQXJDOIQDHMFPQ-UHFFFAOYSA-N 0.000 description 1
- JAGJCSPSIXPCAK-UHFFFAOYSA-N [4-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 JAGJCSPSIXPCAK-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- SONDVQSYBUQGDH-UHFFFAOYSA-N bis(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 SONDVQSYBUQGDH-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- LRSFHOCOLGECMQ-UHFFFAOYSA-N bis(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 LRSFHOCOLGECMQ-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- JUNWLZAGQLJVLR-UHFFFAOYSA-J calcium diphosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])(=O)OP([O-])([O-])=O JUNWLZAGQLJVLR-UHFFFAOYSA-J 0.000 description 1
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229940043256 calcium pyrophosphate Drugs 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000019821 dicalcium diphosphate Nutrition 0.000 description 1
- 235000019700 dicalcium phosphate Nutrition 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006376 polybenzimidazole fiber Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Images
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulding By Coating Moulds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本発明はポリイミドフィルムの製造方法に関するものであり、特に厚さが7.5μm以下のポリイミドフィルムを製造する際の最終熱処理時に、ポリイミド前駆体フィルムを高温熱処理してポリイミドフィルムとなす際におけるクリップテンター式(フィルム搬送)処理部におけるフィルムの幅方向の両側端部におけるフィルム把持に特徴を有するポリイミドフィルムの製造方法に関する。 The present invention relates to a method for producing a polyimide film, and in particular, a clip tenter when a polyimide precursor film is subjected to high-temperature heat treatment to form a polyimide film during final heat treatment in producing a polyimide film having a thickness of 7.5 μm or less. It is related with the manufacturing method of the polyimide film which has the characteristics in the film holding | grip in the both-sides edge part of the width direction of a film in a formula (film conveyance) process part.
ポリイミドフィルムを製造するとき、溶媒の一部が残っているポリイミド前駆体フィルム(グリーンフィルムともいう)を高温でイミド化する。この場合該ポリイミド前駆体フィルムを搬送しながら加熱して乾燥および熱処理を行うが、これらの溶媒を少なからず保有しているフィルムは一般的に乾燥されるに従って収縮する。このようなフィルムの搬送・乾燥・熱処理において、フィルムの幅方向の両側端部を多数のピンやクリップで保持することによりフィルムの幅方向を張設した状態で搬送しフィルムを製造する装置として、所謂テンターと呼ばれるフィルムのテンター式搬送装置が知られている(特許文献1参照)。
また、ポリイミドフィルムの製造にテンター式搬送装置を使用することも多数知られている(特許文献2参照)。
When producing a polyimide film, a polyimide precursor film (also referred to as a green film) in which a part of the solvent remains is imidized at a high temperature. In this case, drying and heat treatment are carried out by heating the polyimide precursor film while it is being transported. However, a film that has at least these solvents generally shrinks as it is dried. In such film transport / drying / heat treatment, as an apparatus for manufacturing a film by transporting the film in the stretched width direction by holding both ends in the width direction of the film with a large number of pins and clips, A film tenter type conveying device called a so-called tenter is known (see Patent Document 1).
In addition, it is also known to use a tenter type conveying device for manufacturing a polyimide film (see Patent Document 2).
フィルム搬送装置は、布を染色した後の乾燥工程で布に皺が発生しないように乾燥する用途への使用も古くから良く知られている。布の乾燥の他にも溶剤製膜法での未乾燥なプラスチックフィルムのフィルムを乾燥工程で搬送しながら乾燥する場合にも使用される。 フィルム搬送装置を使用することにより乾燥・熱処理時の熱でフィルムがその幅方向に収縮するのを抑制し、乾燥・熱処理後のフィルムに収縮による皺が発生しないようにすることができる。
フィルムの収縮はフィルムの幅方向に限らず全方向に生じるが、フィルムの搬送方向は搬送テンションが作用しており収縮に対しての抑制効果があるとされているが、フィルム厚さが極端に薄くなるとフィルムの搬送方向においても収縮などによる把持部における損傷が大きくなる。このように、未乾燥のフィルムを熱処理する際にフィルムのテンター式搬送装置を使用して搬送することにより、乾燥・熱処理されたフィルムに必要な強度及び平面性を確保せんとしている。
The film conveying apparatus has been well known for a long time to be used for drying so as not to cause wrinkles in the drying process after dyeing the cloth. In addition to drying the cloth, it is also used for drying an undried plastic film by a solvent casting method while transporting it in the drying step. By using the film conveying apparatus, it is possible to suppress shrinkage of the film in the width direction due to heat during drying and heat treatment, and to prevent wrinkles due to shrinkage from occurring in the film after drying and heat treatment.
Film shrinkage occurs not only in the width direction of the film but in all directions, but the film transport direction is said to have a restraining effect on the shrinkage because the transport tension is acting, but the film thickness is extremely When the thickness is reduced, damage to the gripping portion due to shrinkage or the like also increases in the film transport direction. Thus, when the undried film is heat-treated, it is transported using a film tenter-type transport device, thereby ensuring the strength and flatness necessary for the dried and heat-treated film.
フィルムテンター式搬送装置のうち、フィルムの両側端部に沿って多数のピンを喰い込ませることによりフィルムを幅方向に張設した状態で保持するフィルムのテンター式搬送装置は、平行に配置された一対の移動チェンに列設支持されたピンシート上に多数のピンが配設されて構成される。このフィルムのテンター式搬送装置は、前記クリップ等のフィルム搬送装置に比べ構造が簡単であることあるいは乾燥室内での搬送コンベアの経路を反転させる構造にできる等のことから、装置コスト、装置のコンパクト化の点で優れている一方、フィルムにピンを喰い込ませる際にフィルムの微小片が発塵するために、なるべくピン本数を少なくする必要がある。また、フィルムの収縮力が大きくなると、フィルム面にピンを喰い込ませた孔がフィルムの幅方向に長孔状に破断するなどの課題を抱えている。 Among the film tenter type conveying devices, the tenter type conveying device for the film that holds the film stretched in the width direction by biting a large number of pins along both side edges of the film was arranged in parallel A large number of pins are arranged on a pin sheet supported in a row by a pair of moving chains. This film tenter type transport device is simpler in structure than the film transport device such as the clip, or can be structured to reverse the transport conveyor path in the drying chamber. On the other hand, since the fine pieces of the film generate dust when the pins are bitten into the film, it is necessary to reduce the number of pins as much as possible. Moreover, when the shrinkage force of the film becomes large, there are problems such as the holes that have pinned the film surface break into long holes in the width direction of the film.
これらの改良のために、フィルムのピンによる把持部において引き裂き強度大きいフィルムを別途補強用として重ねて使用する方式も提案されている(特許文献3参照))が、当該技術は引き裂き強度が低い、50〜150μmの厚さの高分子樹脂フィルムをフィルム端部固定式テンターにて処理する際に、特に幅方向に延伸する際に、該フィルム端部のシート把持部に該フイルムより引き裂き強度が高く且つ該フイルムと付着可能な補強フィルムを重ねあわせて付着し、該補強フィルムに力を加えて処理する引き裂き強度が低い高分子樹脂フィルムを安定にテンター処理する方法である。極薄ポリイミドフィルムについてのものではなく、処理されるべきフィルムがポリイミドフィルムの場合は、かかる厚さであれば把持部であえて補強する必要がないほど強度を保有しているものであり、しかもポリイミドのイミド化は500℃にも達する高温処理である。
従来のフィルムのテンター式搬送装置は、クリップでフィルム両側端部を挟持喰い込ませた部位でのフィルムの幅方向に破断する問題、皺の発生などの品質不良が発生し易く、生産ロスの原因となると共に生産効率の低下を招き、使用者にとって十分満足できるものではなかった。
特に極端に薄いポリイミドフィルムをテンター式搬送方法によって製造せんとするときは、上記の課題が顕著となり、従来の提案技術では克服することができなかった。
For these improvements, a method in which a film having a large tear strength is additionally used for reinforcement in the grip portion by the pin of the film has been proposed (see Patent Document 3), but the technique has a low tear strength. When processing a polymer resin film having a thickness of 50 to 150 μm with a film end fixed type tenter, particularly when stretched in the width direction, the sheet gripping portion at the film end has a higher tear strength than the film. In addition, the method is a method of stably tentering a polymer resin film having a low tear strength, in which the film and the reinforcing film that can be attached are overlapped and attached, and the reinforcing film is subjected to a force treatment. If the film to be processed is a polyimide film, not an ultra-thin polyimide film, it has such a strength that it does not need to be reinforced by the gripping part as long as it is such a thickness. The imidization is a high temperature treatment reaching 500 ° C.
Conventional film tenter type transport devices are prone to quality defects such as problems of breaking in the width direction of the film at the part where both ends of the film are sandwiched and caught by clips, and wrinkles, causing production loss. At the same time, the production efficiency was lowered, which was not satisfactory for the user.
In particular, when an extremely thin polyimide film is manufactured by a tenter type conveying method, the above-mentioned problem becomes remarkable and cannot be overcome by the conventional proposed technique.
本発明は、電子部品の基材や絶縁材などとして好適である平面性および均質性に優れ、しかも高温処理しても変質しない耐熱性に優れたポリイミドフィルム、中でも7.5μm以下の厚さを有する極薄のポリイミドフィルムを、クリップテンター式搬送方法によってフィルムの両側端部で把持し製造せんとする際に、効率よく、フィルムの幅方向および縦方向での、クリップによって挟持された部分で破断することなどによる品質不良が発生し易い課題を解消するためのポリイミドフィルムの製造方法を提供することを目的とする。 The present invention is a polyimide film excellent in flatness and homogeneity that is suitable as a base material or insulating material for electronic parts, and excellent in heat resistance that does not change even when subjected to high-temperature treatment, and has a thickness of 7.5 μm or less. When an ultra-thin polyimide film is held and manufactured at both ends of the film by the clip tenter type conveying method, it is efficiently broken at the portion sandwiched by the clips in the width direction and longitudinal direction of the film. It aims at providing the manufacturing method of the polyimide film for eliminating the subject which the quality defect by performing etc. tends to generate | occur | produce.
すなわち本発明は、以下の構成によるものである。
(1)芳香族テトラカルボン酸類と芳香族ジアミン類とを反応させて得られるポリアミド酸を流延・乾燥しポリイミド前駆体フィルムを得て、該ポリイミド前駆体フィルムをフィルムの幅方向の両側端部を多数のクリップで挟み込むことによって把持し幅方向および/または搬送方向に張設した状態でフィルムを搬送するクリップテンター方式でイミド化させて、厚さが7.5μm以下のポリイミドフィルムを得るポリイミドフィルムの製造方法であって、ポリイミド前駆体フィルムの幅方向の両側端部におけるフィルム把持を、ポリイミド前駆体フィルムの幅方向両側端部のクリップで挟み込む部分に別に用意された細幅のフィルムを重ねて細幅のフィルムを重ねた部分をクリップで挟み込んで固定することによって行うことを特徴とするポリイミドフィルムの製造方法。
(2)芳香族テトラカルボン酸類がピロメリット酸類、ビフェニルテトラカルボン酸類から選ばれる少なくとも一種であり、芳香族ジアミン類がp−フェニレンジアミン類、ジアミノジフェニルエーテル類から選ばれる少なくとも一種である前記1記載のポリイミドフィルムの製造方法。
(3)ポリイミドフィルムの幅が500〜10000mm、長さが100〜100000mである前記1又は2いずれかに記載のポリイミドフィルムの製造方法。
(4)細幅のフィルムがポリイミドの前駆体フィルムであって、その幅が20〜60mmである前記1〜3いずれかに記載のポリイミドフィルムの製造方法。
That is, this invention is based on the following structures.
(1) A polyamic acid obtained by reacting an aromatic tetracarboxylic acid and an aromatic diamine is cast and dried to obtain a polyimide precursor film, and the polyimide precursor film is formed at both end portions in the width direction of the film. A polyimide film having a thickness of 7.5 μm or less is obtained by imidizing with a clip tenter method in which the film is conveyed in a state where the film is sandwiched between a plurality of clips and stretched in the width direction and / or the conveying direction. A thin film prepared separately is overlapped with a portion sandwiched between clips at both end portions in the width direction of the polyimide precursor film, with the film gripping at both end portions in the width direction of the polyimide precursor film. It is performed by sandwiching and fixing a portion where thin films are stacked with a clip. Method for producing Li imide film.
(2) The above-mentioned
(3) The manufacturing method of the polyimide film in any one of said 1 or 2 whose width | variety of a polyimide film is 500-10000 mm and length is 100-100000 m.
(4) The method for producing a polyimide film as described in any one of 1 to 3, wherein the narrow film is a polyimide precursor film, and the width is 20 to 60 mm.
本発明のポリイミドフィルム製造方法は、厚さが7.5μm以下のポリイミドフィルム製造時におけるクリップテンター式処理部(搬送装置)において、フィルムの両側端部において、処理製造されるフィルムとは別の細幅のフィルムとを重ね合わせてクリップで把持することで、フィルムが破断し、収率の低下や品質不良が発生し易いという課題を解消することができ、結果的に製造されたポリイミドフィルムにおける品質上の課題が解消可能となり、極薄ポリイミドフィルム製造の生産性にも寄与し、工業的に極めて有効である。 The method for producing a polyimide film according to the present invention is a clip tenter type processing unit (conveying device) for manufacturing a polyimide film having a thickness of 7.5 μm or less. By overlapping the film with the width and holding it with a clip, the film breaks, and it is possible to solve the problem that the yield and the quality defect are likely to occur. As a result, the quality of the manufactured polyimide film The above problems can be solved, contributing to the productivity of ultra-thin polyimide film production, and extremely effective industrially.
本発明のポリイミドフィルムは、芳香族テトラカルボン酸類(無水物、酸、およびアミド結合性誘導体を総称して類という、以下同じ)と芳香族ジアミン類(アミン、およびアミド結合性誘導体を総称して類という、以下同じ)とを反応させて得られるポリアミド酸溶液を流延、乾燥、熱処理してポリイミドフィルムとなす。これらの溶液に用いられる溶剤としては、N−メチル−2−ピロリドン、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミドなどの極性有機溶媒が挙げられる。 The polyimide film of the present invention includes aromatic tetracarboxylic acids (anhydrides, acids, and amide bond derivatives are collectively referred to as classes hereinafter) and aromatic diamines (amines, and amide bond derivatives are collectively referred to as classes). A polyamic acid solution obtained by reacting with the same) is cast, dried and heat-treated to form a polyimide film. Examples of the solvent used in these solutions include polar organic solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, and N, N-dimethylacetamide.
本発明のポリイミドフィルムの製造方法は、特にポリイミド前駆体であるポリアミド酸のN−メチル−2−ピロリドンやN,N−ジメチルアセトアミドなどの溶液を使用する流延製膜方法による場合に最も好ましく適用し得る。
本発明に好ましく適用し得る、ポリイミドフィルムを得るための芳香族ジアミン類と、芳香族テトラカルボン酸類との反応は、溶媒中で芳香族ジアミン類と芳香族テトラカルボン酸(無水物)類とを(開環)重付加反応に供してポリアミド酸の溶液を得て、次いで、このポリアミド酸の溶液をフィルム状に成形した後に乾燥しポリイミド前駆体をフィルム(グリーンフィルムともいう)を得て、ついでイミド化(熱処理や脱水縮合)することにより製造される。
The method for producing a polyimide film of the present invention is most preferably applied particularly when a casting film forming method using a solution of polyamide acid such as N-methyl-2-pyrrolidone or N, N-dimethylacetamide as a polyimide precursor is used. Can do.
The reaction between an aromatic diamine for obtaining a polyimide film, which can be preferably applied to the present invention, and an aromatic tetracarboxylic acid is carried out by reacting an aromatic diamine and an aromatic tetracarboxylic acid (anhydride) in a solvent. (Ring-opening) A polyamic acid solution is obtained by subjecting it to a polyaddition reaction, and then the polyamic acid solution is formed into a film and then dried to obtain a polyimide precursor film (also referred to as a green film). It is produced by imidization (heat treatment or dehydration condensation).
本発明におけるポリイミドフィルムは、特に限定されるものではないが、下記の芳香族ジアミン類と芳香族テトラカルボン酸(無水物)類との組み合わせが好ましい例として挙げられる。
A.ジアミノジフェニルエーテル骨格を有する芳香族ジアミン類とピロメリット酸骨格を有する芳香族テトラカルボン酸類との組み合わせ。
B.フェニレンジアミン骨格を有する芳香族ジアミン類とビフェニルテトラカルボン酸骨格を有する芳香族テトラカルボン酸類との組み合わせ。
C.上記のABの一種以上の組み合わせ。
Although the polyimide film in this invention is not specifically limited, The combination of the following aromatic diamine and aromatic tetracarboxylic acid (anhydride) is mentioned as a preferable example.
A. A combination of an aromatic diamine having a diaminodiphenyl ether skeleton and an aromatic tetracarboxylic acid having a pyromellitic acid skeleton.
B. A combination of an aromatic diamine having a phenylenediamine skeleton and an aromatic tetracarboxylic acid having a biphenyltetracarboxylic acid skeleton.
C. One or more combinations of the above AB.
本発明におけるジアミノジフェニルエーテル骨格を有する芳香族ジアミン類としては、4,4’−ジアミノジフェニルエーテル(DADE)、3,3’−ジアミノジフェニルエーテルおよび3,4’−ジアミノジフェニルエーテルおよびそれらの誘導体が挙げられ、本発明におけるフェニレンジアミン骨格を有する芳香族ジアミン類としては、p−フェニレンジアミン、m−フェニレンジアミン、o−フェニレンジアミンおよびそれらの誘導体が挙げられるが、これらのジアミンは全ジアミンの70モル%以上使用することが好ましい。
本発明におけるポリイミドフィルムには前記に限定されない下記の芳香族ジアミンを全ジアミンに対して30モル%未満で使用してもよい。
Examples of the aromatic diamine having a diaminodiphenyl ether skeleton in the present invention include 4,4′-diaminodiphenyl ether (DADE), 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, and derivatives thereof. Examples of the aromatic diamine having a phenylenediamine skeleton in the invention include p-phenylenediamine, m-phenylenediamine, o-phenylenediamine and derivatives thereof, and these diamines are used in an amount of 70 mol% or more of the total diamine. It is preferable.
In the polyimide film of the present invention, the following aromatic diamines not limited to the above may be used in an amount of less than 30 mol% based on the total diamines.
例えば、4,4’−ビス(3−アミノフェノキシ)ビフェニル、ビス[4−(3−アミノフェノキシ)フェニル]ケトン、ビス[4−(3−アミノフェノキシ)フェニル]スルフィド、ビス[4−(3−アミノフェノキシ)フェニル]スルホン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、m−アミノベンジルアミン、p−アミノベンジルアミン、3,3’−ジアミノジフェニルスルフィド、3,3’−ジアミノジフェニルスルホキシド、3,4’−ジアミノジフェニルスルホキシド、4,4’−ジアミノジフェニルスルホキシド、3,3’−ジアミノジフェニルスルホン、3,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルスルホン、3,3’−ジアミノベンゾフェノン、3,4’−ジアミノベンゾフェノン、4,4’−ジアミノベンゾフェノン、3,3’−ジアミノジフェニルメタン、3,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、ビス[4−(4−アミノフェノキシ)フェニル]メタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、1,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、1,3−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、
For example, 4,4′-bis (3-aminophenoxy) biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (3 -Aminophenoxy) phenyl] sulfone, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] -1,1,1,3 , 3,3-hexafluoropropane, m-aminobenzylamine, p-aminobenzylamine, 3,3′-diaminodiphenyl sulfide, 3,3′-diaminodiphenyl sulfoxide, 3,4′-diaminodiphenyl sulfoxide, 4, 4'-diaminodiphenyl sulfoxide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl Sulfone, 4,4′-diaminodiphenylsulfone, 3,3′-diaminobenzophenone, 3,4′-diaminobenzophenone, 4,4′-diaminobenzophenone, 3,3′-diaminodiphenylmethane, 3,4′-
1,1−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、1,3−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、1,4−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、2,2−ビス[4−(4−アミノフェノシ)フェニル]ブタン、2,3−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、2−[4−(4−アミノフェノキシ)フェニル]−2−[4−(4−アミノフェノキシ)−3−メチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)−3−メチルフェニル]プロパン、2−[4−(4−アミノフェノキシ)フェニル]−2−[4−(4−アミノフェノキシ)−3,5−ジメチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)−3,5−ジメチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、
1,4−ビス(3−アミノフェノキシ)ベンゼン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,4−ビス(4−アミノフェノキシ)ベンゼン、4,4’−ビス(4−アミノフェノキシ)ビフェニル、ビス[4−(4−アミノフェノキシ)フェニル]ケトン、ビス[4−(4−アミノフェノキシ)フェニル]スルフィド、ビス[4−(4−アミノフェノキシ)フェニル]スルホキシド、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、ビス[4−(3−アミノフェノキシ)フェニル]エーテル、ビス[4−(4−アミノフェノキシ)フェニル]エーテル、1,3−ビス[4−(4−アミノフェノキシ)ベンゾイル]ベンゼン、1,3−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、1,4−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、4,4’−ビス[(3−アミノフェノキシ)ベンゾイル]ベンゼン、1,1−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、1,3−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、3,4’−ジアミノジフェニルスルフィド、
1,1-bis [4- (4-aminophenoxy) phenyl] butane, 1,3-bis [4- (4-aminophenoxy) phenyl] butane, 1,4-bis [4- (4-aminophenoxy) Phenyl] butane, 2,2-bis [4- (4-aminophenoxy) phenyl] butane, 2,3-bis [4- (4-aminophenoxy) phenyl] butane, 2- [4- (4-aminophenoxy) Phenyl] -2- [4- (4-aminophenoxy) -3-methylphenyl] propane, 2,2-bis [4- (4-aminophenoxy) -3-methylphenyl] propane, 2- [4- ( 4-aminophenoxy) phenyl] -2- [4- (4-aminophenoxy) -3,5-dimethylphenyl] propane, 2,2-bis [4- (4-aminophenoxy) -3,5-dimethylphen Le] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane,
1,4-bis (3-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4,4′-bis (4-aminophenoxy) ) Biphenyl, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] sulfide, bis [4- (4-aminophenoxy) phenyl] sulfoxide, bis [4- ( 4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 1,3-bis [4- (4-aminophenoxy) ) Benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,4-bis [4- (3- Aminophenoxy) benzoyl] benzene, 4,4′-bis [(3-aminophenoxy) benzoyl] benzene, 1,1-bis [4- (3-aminophenoxy) phenyl] propane, 1,3-bis [4- (3-aminophenoxy) phenyl] propane, 3,4'-diaminodiphenyl sulfide,
2,2−ビス[3−(3−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、ビス[4−(3−アミノフェノキシ)フェニル]メタン、1,1−ビス[4−(3−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(3−アミノフェノキシ)フェニル]エタン、ビス[4−(3−アミノフェノキシ)フェニル]スルホキシド、4,4’−ビス[3−(4−アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’−ビス[3−(3−アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ベンゾフェノン、4,4’−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ジフェニルスルホン、ビス[4−{4−(4−アミノフェノキシ)フェノキシ}フェニル]スルホン、1,4−ビス[4−(4−アミノフェノキシ)フェノキシ−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノフェノキシ)フェノキシ−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−トリフルオロメチルフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−フルオロフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−メチルフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−シアノフェノキシ)−α,α−ジメチルベンジル]ベンゼン、 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, bis [4- (3-aminophenoxy) phenyl] methane, 1,1 -Bis [4- (3-aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl] ethane, bis [4- (3-aminophenoxy) phenyl] sulfoxide, 4,4 '-Bis [3- (4-aminophenoxy) benzoyl] diphenyl ether, 4,4'-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether, 4,4'-bis [4- (4-amino-α) , Α-dimethylbenzyl) phenoxy] benzophenone, 4,4′-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] diphenylsulfone, bis 4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone, 1,4-bis [4- (4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-trifluoromethylphenoxy) -α, α-dimethylbenzyl] benzene, 1,3 -Bis [4- (4-amino-6-fluorophenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-methylphenoxy) -α, α-dimethylbenzyl Benzene, 1,3-bis [4- (4-amino-6-cyanophenoxy) -α, α-dimethylbenzyl] benzene,
3,3’−ジアミノ−4,4’−ジフェノキシベンゾフェノン、4,4’−ジアミノ5,5’−ジフェノキシベンゾフェノン、3,4’−ジアミノ−4,5’−ジフェノキシベンゾフェノン、3,3’−ジアミノ−4−フェノキシベンゾフェノン、4,4’−ジアミノ−5−フェノキシベンゾフェノン、3,4’−ジアミノ−4−フェノキシベンゾフェノン3,4’−ジアミノ−5’−フェノキシベンゾフェノン、3,3’−ジアミノ−4,4’−ジビフェノキシベンゾフェノン、4,4’−ジアミノ−5,5’−ジビフェノキシベンゾフェノン、3,4’−ジアミノ−4,5’−ジビフェノキシベンゾフェノン、3,3’−ジアミノ−4−ビフェノキシベンゾフェノン、4,4’−ジアミノ−5−ビフェノキシベンゾフェノン、3,4’−ジアミノ−4−ビフェノキシベンゾフェノン、3,4’−ジアミノ−5’−ビフェノキシベンゾフェノン、1,3−ビス(3−アミノ−4−フェノキシベンゾイル)ベンゼン、1,4−ビス(3−アミノ−4−フェノキシベンゾイル)ベンゼン、1,3−ビス(4−アミノ−5−フェノキシベンゾイル)ベンゼン、1,4−ビス(4−アミノ−5−フェノキシベンゾイル)ベンゼン、1,3−ビス(3−アミノ−4−ビフェノキシベンゾイル)ベンゼン、1,4−ビス(3−アミノ−4−ビフェノキシベンゾイル)ベンゼン、1,3−ビス(4−アミノ−5−ビフェノキシベンゾイル)ベンゼン、1,4−ビス(4−アミノ−5−ビフェノキシベンゾイル)ベンゼン、2,6−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ベンゾニトリルおよび上記芳香族ジアミンにおける芳香環上の水素原子の一部もしくは全てがハロゲン原子、炭素数1〜3のアルキル基又はアルコキシル基、シアノ基、又はアルキル基又はアルコキシル基の水素原子の一部もしくは全部がハロゲン原子で置換された炭素数1〜3のハロゲン化アルキル基又はアルコキシル基で置換された芳香族ジアミン等が挙げられる。
3,3′-diamino-4,4′-diphenoxybenzophenone, 4,4′-diamino 5,5′-diphenoxybenzophenone, 3,4′-diamino-4,5′-diphenoxybenzophenone, 3,3 '-Diamino-4-phenoxybenzophenone, 4,4'-diamino-5-phenoxybenzophenone, 3,4'-diamino-4-
本発明におけるポリイミドフィルムに置ける好ましく使用できる芳香族テトラカルボン
酸類として、ピロメリット酸骨格を有する芳香族テトラカルボン酸類すなわちピロメリッ
ト酸およびその無水物またはハロゲン化物、ビフェニルテトラカルボン酸骨格を有する芳
香族テトラカルボン酸類すなわちビフェニルテトラカルボン酸およびその無水物またはハ
ロゲン化物が挙げられこれらは全酸類の70モル%以上使用することが好ましい。
前記に限定されないで下記の芳香族テトラカルボン酸を全酸類の30モル%未満でなら使用してもよい。
As aromatic tetracarboxylic acids that can be preferably used in the polyimide film of the present invention, aromatic tetracarboxylic acids having a pyromellitic acid skeleton, that is, pyromellitic acid and anhydrides or halides thereof, and aromatic tetracarboxylic acids having a biphenyltetracarboxylic acid skeleton are used. Examples thereof include carboxylic acids, that is, biphenyltetracarboxylic acid and anhydrides or halides thereof, and these are preferably used in an amount of 70 mol% or more of the total acids.
Without being limited thereto, the following aromatic tetracarboxylic acid may be used if it is less than 30 mol% of the total acids.
芳香族ジアミン類と、芳香族テトラカルボン酸無水物類とを重合してポリアミド酸を得るときに用いる溶媒は、原料となるモノマーおよび生成するポリアミド酸のいずれをも溶解するものであれば特に限定されないが、極性有機溶媒が好ましく、例えば、N−メチル−2−ピロリドン、N−アセチル−2−ピロリドン、N,N−ジメチルホルムアミド、N,N−ジエチルホルムアミド、N,N−ジメチルアセトアミド、ジメチルスルホキシド、ヘキサメチルホスホリックアミド、エチルセロソルブアセテート、ジエチレングリコールジメチルエーテル、スルホラン、ハロゲン化フェノール類等があげられるが、なかでもN−メチル−2−ピロリドン、N,N−ジメチルアセトアミドが好ましく適用される。これらの溶媒は、単独あるいは混合して使用することができる。溶媒の使用量は、原料となるモノマーを溶解するのに十分な量であればよく、具体的な使用量としては、モノマーを溶解した溶液に占めるモノマーの重量が、通常5〜40質量%、好ましくは10〜20質量%となるような量が挙げられる。 The solvent used when polyamic acid is obtained by polymerizing aromatic diamines and aromatic tetracarboxylic acid anhydrides is particularly limited as long as it dissolves both the raw material monomer and the polyamic acid to be produced. Although not preferred, polar organic solvents are preferred, such as N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N, N-dimethylformamide, N, N-diethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide Hexamethylphosphoric amide, ethyl cellosolve acetate, diethylene glycol dimethyl ether, sulfolane, halogenated phenols and the like, among which N-methyl-2-pyrrolidone and N, N-dimethylacetamide are preferably applied. These solvents can be used alone or in combination. The amount of the solvent used may be an amount sufficient to dissolve the monomer as a raw material. As a specific amount used, the weight of the monomer in the solution in which the monomer is dissolved is usually 5 to 40% by mass, The amount is preferably 10 to 20% by mass.
ポリアミド酸を得るための重合反応(以下、単に「重合反応」ともいう)の条件は従来公知の条件を適用すればよく、具体例として、有機溶媒中、0〜80℃の温度範囲で、10分〜30時間連続して撹拌および/又は混合することが挙げられる。必要により重合反応を分割したり、温度を上下させてもかまわない。この場合に、両モノマーの添加順序には特に制限はないが、芳香族ジアミン類の溶液中に芳香族テトラカルボン酸無水物類を添加するのが好ましい。重合反応によって得られるポリアミド酸溶液に占めるポリアミド酸の重量は、好ましくは5〜40質量%、より好ましくは10〜30質量%であり、前記溶液の粘度はブルックフィールド粘度計による測定(25℃)で、送液の安定性の点から、好ましくは10〜2000Pa・sであり、より好ましくは100〜1000Pa・sである。
本発明におけるポリアミド酸の還元粘度(ηsp/C)は、特に限定するものではないが1.5dl/g以上が好ましく、2.0dl/g以上がさらに好ましく、なおさらに2.5dl/g以上が好ましい。
また、重合反応の前に芳香族ジアミン類に少量の末端封止剤を添加して重合を制御することを行ってもよい。末端封止剤としては、無水マレイン酸等といった炭素−炭素二重結合を有する化合物が挙げられる。無水マレイン酸を使用する場合の使用量は、芳香族ジアミン類1モル当たり好ましくは0.001〜1.0モルである。
重合反応中に真空脱泡することは、良質なポリアミド酸の溶液を製造するのに有効である。
さらに、以下述べるポリアミド酸の溶液を支持体上に流延・塗布するに際して予め減圧などの処理によって該溶液中の気泡や溶存気体を除去しておくことも、本発明のポリイミドフィルムを得るために有効な処理である。
Conventionally known conditions may be applied for the polymerization reaction for obtaining the polyamic acid (hereinafter also simply referred to as “polymerization reaction”). As a specific example, in a temperature range of 0 to 80 ° C., 10 Stirring and / or mixing continuously for 30 minutes. If necessary, the polymerization reaction may be divided or the temperature may be increased or decreased. In this case, the order of adding both monomers is not particularly limited, but it is preferable to add aromatic tetracarboxylic acid anhydrides to the solution of aromatic diamines. The weight of the polyamic acid in the polyamic acid solution obtained by the polymerization reaction is preferably 5 to 40% by mass, more preferably 10 to 30% by mass, and the viscosity of the solution is measured with a Brookfield viscometer (25 ° C.). From the viewpoint of the stability of liquid feeding, it is preferably 10 to 2000 Pa · s, and more preferably 100 to 1000 Pa · s.
The reduced viscosity (ηsp / C) of the polyamic acid in the present invention is not particularly limited, but is preferably 1.5 dl / g or more, more preferably 2.0 dl / g or more, still more preferably 2.5 dl / g or more. preferable.
Moreover, you may perform superposition | polymerization by adding a small amount of terminal blockers to aromatic diamines before a polymerization reaction. Examples of the end capping agent include compounds having a carbon-carbon double bond such as maleic anhydride. The amount of maleic anhydride used is preferably 0.001 to 1.0 mol per mol of aromatic diamine.
Vacuum degassing during the polymerization reaction is effective in producing a good quality polyamic acid solution.
Furthermore, in order to obtain the polyimide film of the present invention, it is possible to remove bubbles and dissolved gas in the solution in advance by treatment such as decompression when casting and applying a polyamic acid solution described below onto the support. This is an effective process.
ポリアミド酸溶液を流延(塗布)する支持体は、ポリアミド酸溶液をフィルム状に成形するに足る程度の平滑性、剛性を有していればよく、表面が金属、プラスチック、ガラス、磁器などであるドラム又はベルト状回転体などが挙げられる。また、適度な剛性と高い平滑性を有するポリイミドフィルムを利用する方法も好ましい態様である。中でも、支持体の表面は好ましくは金属であり、より好ましくは錆びなくて耐腐食に優れるステンレスである。支持体の表面にはCr、Ni、Snなどの金属メッキを施してもよい。支持体表面は必要に応じて鏡面にしたり、あるいは梨地状に加工することができる。また支持体の差によって乾燥における風量や温度は適宜選択採用すればよく、支持体へのポリアミド酸溶液の塗布は、スリット付き口金からの流延、押出機による押出し、スキージコーティング、リバースコーティング、ダイコーティング、アプリケータコーティング、ワイヤーバーコーティング等を含むが、これらに限られず、従来公知の溶液の塗布手段を適宜用いることができる。
イミド化工程として、閉環(イミド化)触媒や脱水剤を含まないポリアミド酸溶液を用いて、熱処理に供することでイミド化反応を進行させる方法(所謂、熱閉環法)やポリアミド酸溶液に閉環触媒および脱水剤を含有させておいて、上記閉環触媒および脱水剤の作用によってイミド化反応を行わせる、化学閉環法を挙げることができる。
熱閉環法の熱処理温度は、150〜500℃が好ましく、熱処理温度がこの範囲より低いと充分に閉環されづらくなり、またこの範囲より高いと劣化が進行し、フィルムが脆くなりやすくなる。より好ましい態様としては、150〜250℃で3〜20分間処理した後に350〜500℃で3〜20分間熱処理するところの初期段階熱処理と後段階熱処理とを有する2段階熱処理工程が挙げられる。
閉環触媒をポリアミド酸溶液に加えるタイミングは特に限定はなく、ポリアミド酸を得るための重合反応を行う前に予め加えておいてもよい。閉環触媒の具体例としては、トリメチルアミン、トリエチルアミンなどといった脂肪族第3級アミンや、イソキノリン、ピリジン、ベータピコリンなどといった複素環式第3級アミンなどが挙げられ、中でも、複素環式第3級アミンから選ばれる少なくとも一種のアミンが好ましい。ポリアミド酸1モルに対する閉環触媒の使用量は特に限定はないが、好ましくは0.5〜8モルである。
脱水剤をポリアミド酸溶液に加えるタイミングも特に限定はなく、ポリアミド酸を得るための重合反応を行う前に予め加えておいてもよい。脱水剤の具体例としては、無水酢酸、無水プロピオン酸、無水酪酸などといった脂肪族カルボン酸無水物や、無水安息香酸などといった芳香族カルボン酸無水物などが挙げられ、中でも、無水酢酸、無水安息香酸あるいはそれらの混合物が好ましい。また、ポリアミド酸1モルに対する脱水剤の使用量は特に限定はないが、好ましくは0.1〜4モルである。脱水剤を用いる場合には、アセチルアセトンなどといったゲル化遅延剤を併用してもよい。
The support on which the polyamic acid solution is cast (applied) only needs to have smoothness and rigidity sufficient to form the polyamic acid solution into a film, and the surface is made of metal, plastic, glass, porcelain, etc. A certain drum or a belt-like rotating body may be used. A method using a polyimide film having moderate rigidity and high smoothness is also a preferred embodiment. Among them, the surface of the support is preferably a metal, more preferably stainless steel that does not rust and has excellent corrosion resistance. The surface of the support may be plated with metal such as Cr, Ni, or Sn. The surface of the support can be mirror-finished or processed into a satin finish as required. The air volume and temperature in drying may be appropriately selected and adopted depending on the difference in the support, and the polyamic acid solution can be applied to the support by casting from a nozzle with a slit, extrusion by an extruder, squeegee coating, reverse coating, die Including, but not limited to, coating, applicator coating, wire bar coating and the like, conventionally known solution application means can be used as appropriate.
In the imidization step, a ring closure (imidation) catalyst or a polyamic acid solution that does not contain a dehydrating agent is used for heat treatment to advance the imidization reaction (so-called thermal ring closure method) or a ring closure catalyst in the polyamic acid solution. And a chemical ring closure method in which a dehydrating agent is contained and an imidization reaction is performed by the action of the ring closing catalyst and the dehydrating agent.
The heat treatment temperature of the thermal ring closure method is preferably 150 to 500 ° C. If the heat treatment temperature is lower than this range, it is difficult to sufficiently close the ring, and if it is higher than this range, the deterioration proceeds and the film tends to become brittle. A more preferable embodiment includes a two-stage heat treatment step having an initial stage heat treatment and a subsequent stage heat treatment in which a heat treatment is performed at 150 to 250 ° C. for 3 to 20 minutes and then heat treatment at 350 to 500 ° C. for 3 to 20 minutes.
The timing for adding the ring-closing catalyst to the polyamic acid solution is not particularly limited, and may be added in advance before the polymerization reaction for obtaining the polyamic acid. Specific examples of the ring-closing catalyst include aliphatic tertiary amines such as trimethylamine and triethylamine, and heterocyclic tertiary amines such as isoquinoline, pyridine, and betapicoline. Among them, heterocyclic tertiary amines are mentioned. At least one amine selected from is preferred. Although the usage-amount of a ring-closing catalyst with respect to 1 mol of polyamic acids does not have limitation in particular, Preferably it is 0.5-8 mol.
The timing of adding the dehydrating agent to the polyamic acid solution is not particularly limited, and may be added in advance before the polymerization reaction for obtaining the polyamic acid. Specific examples of the dehydrating agent include aliphatic carboxylic acid anhydrides such as acetic anhydride, propionic anhydride, butyric anhydride, and aromatic carboxylic acid anhydrides such as benzoic anhydride. Among them, acetic anhydride, benzoic anhydride, etc. Acids or mixtures thereof are preferred. Moreover, the usage-amount of the dehydrating agent with respect to 1 mol of polyamic acids is not particularly limited, but is preferably 0.1 to 4 mol. When a dehydrating agent is used, a gelation retarder such as acetylacetone may be used in combination.
熱閉環反応であっても、化学閉環法であっても、支持体に形成されたポリイミドフィルムの前駆体フィルム(グリーンフィルムともいう)を、イミド化する前に支持体から剥離して実施する方法が本発明において好適である。 Whether the thermal ring-closing reaction or the chemical ring-closing method, the polyimide film precursor film (also called green film) formed on the support is peeled off from the support before imidization. Is preferred in the present invention.
本発明におけるポリイミドフィルムの厚さは7.5μm以下であり、より好ましくは5μm以下である。
従来7.5μm以下、特に5μm以下のポリアミドフィルムの長尺フィルムを工業的に安定的に製造することが困難であったが、本発明のポリイミドフィルムの製造方法はこの課題を解決せんとするものである。ポリイミドフィルムの厚さはポリアミド酸溶液を支持体に塗布する際の塗布量や、ポリアミド酸溶液の濃度によって容易に制御し得る。
本発明におけるポリイミドフィルムの幅は、例えば、500〜10000mm、長さは100〜100000mであり、電子機器の部品や機械部品などの連続生産にも利用することができる。
The thickness of the polyimide film in this invention is 7.5 micrometers or less, More preferably, it is 5 micrometers or less.
Conventionally, it has been difficult to industrially stably produce a long film of a polyamide film of 7.5 μm or less, particularly 5 μm or less, but the method for producing a polyimide film of the present invention does not solve this problem. It is. The thickness of the polyimide film can be easily controlled by the amount applied when the polyamic acid solution is applied to the support and the concentration of the polyamic acid solution.
The width | variety of the polyimide film in this invention is 500-10000 mm, for example, and length is 100-100000 m, and can be utilized also for continuous production of the component of an electronic device, a machine part, etc.
本発明におけるポリイミドフィルムには、滑剤をポリイミド中に添加含有せしめるなどしてフィルム表面に微細な凹凸を付与しフィルムの滑り性を改善することが好ましい。
滑剤としては、無機や有機の0.03〜1μm程度の平均粒子径を有する微粒子が使用でき、具体例として、酸化チタン、アルミナ、シリカ、炭酸カルシウム、燐酸カルシウム、燐酸水素カルシウム、ピロ燐酸カルシウム、酸化マグネシウム、酸化カルシウム、粘土鉱物などが挙げられる。
In the polyimide film of the present invention, it is preferable to improve the slipping property of the film by adding fine lubricant to the surface of the film by adding a lubricant to the polyimide.
As the lubricant, inorganic or organic fine particles having an average particle diameter of about 0.03 to 1 μm can be used. Specific examples include titanium oxide, alumina, silica, calcium carbonate, calcium phosphate, calcium hydrogen phosphate, calcium pyrophosphate, Examples include magnesium oxide, calcium oxide, and clay minerals.
本発明においては、ポリイミド前駆体フィルムをフィルム端部固定式クリップテンターにてイミド化処理をする際に、フィルムの幅方向の両側端部におけるフィルム端部把持が、多数のクリップによりフィルム両側端部を挟持することでなされ、幅方向および又は搬送方向に張設した状態でフィルムを搬送するクリップテンター式処理部を有するポリイミドフィルム製造方法において、クリップによりフィルム両側端部を把持する部位で、処理されるポリイミド前駆体フィルムとは別に用意された細幅のフィルムを重ね合わされた状態でクリップに固定して把持することを必須とする製造方法である。
ここで、別に用意された細幅のフィルムは、特に限定されるものではないが、処理されるポリイミド前駆体フィルムと同質のものが好ましく、製造されるポリイミドフィルムとは別に、同じポリアミド酸溶液を流延・乾燥して別のポリイミド前駆体フィルムを作製し、予め細幅にスリットし用意したものが好ましく、その細幅フィルムの幅は20〜200mmが好ましく、特に20〜60mmが好ましい。またこの処理されるポリイミド前駆体フィルムとは別に用意された細幅のフィルムの厚さは、特に限定されないが、好ましくはポリイミドフィルムとして製造されるためのポリイミド前駆体フィルムと同程度の厚さが好ましく、ポリイミド前駆体フィルムの厚さの0.5〜4倍、例えば5〜20μmである。厚さが薄く5μm未満の場合には重ね合わせの補強効果が低減しがちとなり、また厚すぎて20μmを超える場合には重ね合わせの補強効果にばらつきが発生する場合がある。
In the present invention, when the polyimide precursor film is imidized with a film end fixed clip tenter, the film end gripping at both side end portions in the width direction of the film is performed on both sides of the film by a number of clips. In a polyimide film manufacturing method having a clip tenter type processing section that transports a film in a state of being stretched in the width direction and / or the transport direction, the film is processed at a portion that grips both side edges of the film with a clip. It is a manufacturing method which makes it essential to fix and hold onto a clip in a state where a thin film prepared separately from the polyimide precursor film is overlapped.
Here, the thin film prepared separately is not particularly limited, but preferably has the same quality as the polyimide precursor film to be processed, and the same polyamic acid solution is used separately from the polyimide film to be manufactured. Another polyimide precursor film is prepared by casting and drying, and is prepared by slitting in advance to a narrow width. The width of the narrow film is preferably 20 to 200 mm, particularly preferably 20 to 60 mm. The thickness of the thin film prepared separately from the polyimide precursor film to be treated is not particularly limited, but preferably the same thickness as the polyimide precursor film to be produced as a polyimide film. Preferably, it is 0.5 to 4 times the thickness of the polyimide precursor film, for example 5 to 20 μm. When the thickness is thin and less than 5 μm, the reinforcement effect of the overlay tends to be reduced, and when it is too thick and exceeds 20 μm, the overlay reinforcement effect may vary.
本発明においてポリイミドフィルムを熱処理する端部固定テンターのクリップ部は、公知のクリップ部であれば、特に限定されるものではないが、クリップ部に通気性のある耐熱素材を用いたものが好ましく、その形態、性状については特に限定されないが、好ましくは、熱分解温度が400℃以下の多孔質物体ないし繊維集合体である通気性耐熱素材を使用する。本発明における通気性耐熱素材として、多孔性のセラミックスを用いることができる。セラミックスの材質そのものに特段の制限はなく、アルミナ、カルシア、マグネシア、シリカなどの単独または複数からなる素材を用いればよい、多孔質度合いを示す空隙率は体積比で30%以上が好ましく40%以上がなお好ましく50%以上がなおさらに好ましい。多孔質度合いがこの範囲より低いと、ポリマーフィルムからの揮発成分の自由な発散が妨げられる。また90%を超えるとセラミックス自体が脆くなり実用性に乏しくなる。同様に多孔質体としては発泡セメント、石膏、ガラス、金属、その他リン酸塩、炭酸塩、硫酸塩、金属酸塩等の無機の固体を用いることができる。
本発明における通気性耐熱素材として、無機繊維の集合体を用いることができる。本発明において用いられる無機繊維とはカーボンファイバー、アルミナウール、ガラスウール、石綿、各種の硝子繊維等を用いることができる。これらは織布形状でも不織布形状、あるいはフェルトのごとき厚手でもかまわない。
本発明における通気性耐熱素材として金属繊維の集合体を用いることができる。金属種としては耐食性に優れるステンレス系の素材が好ましい。
本発明における通気性耐熱素材として、耐熱高分子繊維の集合体を用いることができる。耐熱高分子繊維としては、芳香族ポリアミド繊維、ポリイミド繊維、ポリベンゾオキサゾール繊維、ポリベンゾチアゾール繊維、ポリベンゾイミダゾール繊維、ポリイミドベンゾオキサゾール繊維などを用いることができる。
In the present invention, the clip portion of the end fixing tenter for heat-treating the polyimide film is not particularly limited as long as it is a known clip portion, but preferably uses a breathable heat-resistant material for the clip portion, The form and properties are not particularly limited, but preferably a breathable heat-resistant material that is a porous object or fiber aggregate having a thermal decomposition temperature of 400 ° C. or lower is used. Porous ceramics can be used as the breathable heat-resistant material in the present invention. There is no particular restriction on the material of the ceramic itself, and it is sufficient to use a single material or a plurality of materials such as alumina, calcia, magnesia, silica, etc. The porosity indicating the degree of porosity is preferably 30% or more by volume ratio, preferably 40% or more. Is more preferably 50% or more. When the degree of porosity is lower than this range, free emission of volatile components from the polymer film is prevented. On the other hand, if it exceeds 90%, the ceramic itself becomes brittle and becomes impractical. Similarly, as the porous body, foamed cement, gypsum, glass, metal, and other inorganic solids such as phosphates, carbonates, sulfates, and metal acid salts can be used.
As the breathable heat-resistant material in the present invention, an aggregate of inorganic fibers can be used. As the inorganic fibers used in the present invention, carbon fibers, alumina wool, glass wool, asbestos, various glass fibers, and the like can be used. These may be woven, non-woven, or thick like felt.
An aggregate of metal fibers can be used as the breathable heat-resistant material in the present invention. As the metal species, a stainless steel material having excellent corrosion resistance is preferable.
An aggregate of heat-resistant polymer fibers can be used as the breathable heat-resistant material in the present invention. As the heat resistant polymer fiber, aromatic polyamide fiber, polyimide fiber, polybenzoxazole fiber, polybenzothiazole fiber, polybenzimidazole fiber, polyimide benzoxazole fiber, or the like can be used.
フィルム端部把持を多数のクリップで挟み込むことによってなす本発明のテンターは該クリップがフィルムと接する把持部の温度が180℃未満となるように冷却する手段を有することがさらに好ましい。
以下、クリップ冷却手段を詳述する。かかるクリップを固定手段として用いるテンターはクリップテンターと称される。クリップテンターのクリップは多くの場合駆動チェーンに組み合わせれ、無限軌道として設置される。クリップテンターの駆動チェーンは、往復とも処理炉内を通る型式と、復路は処理路の外を通るように配置される型式が知られているが、本発明では、往復とも処理炉内を通る型式に適用されることが好ましい。このような型式の場合には装置全体をコンパクトにすることが可能である。
図3に示すように熱処理などの処理を受ける処理室内では、クリップが配されたクリップブロックが多数フィルム両端部に配されており、これらのクリップがフィルム両端を把持して搬送し、処理室内ではこれらクリップはフィルム両端で互いに並行に走行しているものであり、かつ極めて高温に維持されてフィルムの熱処理がおこなわれるもので、少なくともこの処理室内ではクリップも高温に曝され、フィルム熱処理が終了してターンして元の位置にてまた新たにフィルムを把持する様になっている。
本発明においてクリップおよびクリップブロックの冷却は、処理炉の入り口側における駆動チェーンの復路からクリップニングゾーンまでの間にて行うことが好ましい。
It is more preferable that the tenter of the present invention formed by sandwiching the film end gripping with a plurality of clips has means for cooling so that the temperature of the gripping portion where the clip is in contact with the film is less than 180 ° C.
Hereinafter, the clip cooling means will be described in detail. A tenter using such a clip as a fixing means is called a clip tenter. Clip tenter clips are often combined with drive chains and installed as endless tracks. As for the drive chain of the clip tenter, a type that passes through the inside of the processing furnace is known for both reciprocation, and a type that the return path passes through the inside of the processing furnace is known. It is preferable to apply to. In the case of such a type, the entire apparatus can be made compact.
As shown in FIG. 3, in a processing chamber that receives a heat treatment or the like, a large number of clip blocks in which clips are arranged are arranged at both ends of the film, and these clips grip and convey both ends of the film. These clips run parallel to each other at both ends of the film, and are kept at a very high temperature for heat treatment of the film. At least in this processing chamber, the clips are also exposed to high temperature, and the film heat treatment is completed. It turns and grips the film again in its original position.
In the present invention, the cooling of the clip and the clip block is preferably performed between the return path of the drive chain on the inlet side of the processing furnace and the clipping zone.
従来のテンター式搬送装置では、これらのクリップがフィルム両端を把持して搬送を開始する時点で、一端熱処理温度例えば490℃に加熱され冷却手段、温度制御手段がなく高温にて温度バラツキが維持されており、クリップによるフィルム両端の把持において、フィルム把持の均一性が保たれ難く、クリップにて挟んだ部分近傍にてフィルム厚み斑や亀裂が入りやすく、亀裂の拡大によりフィルム破断が生じ易い。さらに、フィルム全体での歪の増加、フィルム厚み斑の拡大が生じる。そのため本発明ではクリップがフィルム熱処理が終了してターンしてフィルム把持を開始する位置に戻る直前の部位において冷却手段を設けて、クリップがフィルム把持開始時点においては充分に冷却され、かつ温度制御されており、クリップによるフィルム把持の均一性が保たれ、クリップ近傍での破れやフィルム全体での歪の減少、フィルム厚み斑の低減が達成できる。
本発明における冷却手段としては、空冷、水冷いずれでもよく、また空気、水以外の冷媒を用いても良い。冷却効率の点からは液体の冷媒を用いることが好ましく、さらに、テンター自身が一般の有機溶剤の発火点以上に加熱されることを考えると、水冷仕様による冷却手段にすることが最も好ましい。また冷却部付近においては結露を防止するため、雰囲気、並びに冷媒として空気を用いる場合には冷風の露点制御することが好ましい。
さらに本発明においては該クリップ部の温度を測定する手段と、測定結果に応じて冷却度合いを制御する制御系を備えることが好ましい。温度測定手段については熱電対、あるいは放射温度計などの公知の手段を用いることができる。制御系は通常の負帰還制御を用いればよい。
In the conventional tenter type transfer device, when these clips grip the both ends of the film and start to transfer, one end is heated to a heat treatment temperature of 490 ° C., for example, 490 ° C., and there is no cooling means or temperature control means, and temperature variation is maintained at a high temperature. In the gripping of both ends of the film by the clip, the film gripping uniformity is difficult to be maintained, film thickness spots and cracks are likely to occur in the vicinity of the portion sandwiched between the clips, and the film breaks easily due to the expansion of the cracks. Furthermore, the distortion of the whole film increases and the film thickness unevenness increases. Therefore, in the present invention, a cooling means is provided at a position immediately before the clip is turned after the film heat treatment is finished and returned to the position where film gripping is started, and the clip is sufficiently cooled and temperature controlled at the time of starting film gripping. Therefore, uniformity of film gripping by the clip can be maintained, tearing in the vicinity of the clip, distortion reduction in the entire film, and reduction in film thickness unevenness can be achieved.
As a cooling means in the present invention, either air cooling or water cooling may be used, and a refrigerant other than air or water may be used. From the viewpoint of cooling efficiency, it is preferable to use a liquid refrigerant. Further, considering that the tenter itself is heated above the ignition point of a general organic solvent, it is most preferable to use a cooling means based on water cooling specifications. In order to prevent dew condensation in the vicinity of the cooling part, it is preferable to control the dew point of the cold air when air is used as the atmosphere and the refrigerant.
Furthermore, in the present invention, it is preferable to include a means for measuring the temperature of the clip portion and a control system for controlling the degree of cooling according to the measurement result. As the temperature measuring means, a known means such as a thermocouple or a radiation thermometer can be used. The control system may use normal negative feedback control.
以下、実施例及び比較例を示して本発明をより具体的に説明するが、本発明は以下の実施例によって限定されるものではない。なお、以下の実施例における物性の評価方法は以下の通りである。
1.ポリアミド酸の還元粘度(ηsp/C)
ポリマー濃度が0.2g/dlとなるようにN−メチル−2−ピロリドン(又は、N,N−ジメチルアセトアミド)に溶解した溶液をウベローデ型の粘度管により30℃で測定した。(ポリアミド酸溶液の調製に使用した溶媒がN,N−ジメチルアセトアミドの場合は、N,N−ジメチルアセトアミドを使用してポリマーを溶解し、測定した。)
EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated more concretely, this invention is not limited by a following example. In addition, the evaluation method of the physical property in the following examples is as follows.
1. Reduced viscosity of polyamic acid (ηsp / C)
A solution dissolved in N-methyl-2-pyrrolidone (or N, N-dimethylacetamide) so that the polymer concentration was 0.2 g / dl was measured at 30 ° C. with an Ubbelohde type viscosity tube. (When the solvent used for preparing the polyamic acid solution was N, N-dimethylacetamide, the polymer was dissolved using N, N-dimethylacetamide and measured.)
2.ポリイミドフィルムの厚さ
マイクロメーター(ファインリューフ社製、ミリトロン1254D)を用いて測定した。
2. The thickness of the polyimide film The thickness was measured using a micrometer (Millitron 1254D manufactured by Fine Reef).
3.ポリイミドフィルムの引張弾性率、引張破断強度および引張破断伸度
測定対象のポリイミドフィルムを、流れ方向(MD方向)および幅方向(TD方向)にそれぞれ100mm×10mmの短冊状に切り出したものを試験片とした。引張試験機(島津製作所製、オートグラフ(商品名)、機種名AG−5000A)を用い、引張速度50mm/分、チャック間距離40mmの条件で、MD方向、TD方向それぞれについて、引張弾性率、引張破断強度および引張破断伸度を測定した。
3. Specimen obtained by cutting a polyimide film to be measured into a strip of 100 mm × 10 mm in the flow direction (MD direction) and the width direction (TD direction), respectively. It was. Using a tensile tester (manufactured by Shimadzu Corporation, Autograph (trade name), model name AG-5000A) under the conditions of a tensile speed of 50 mm / min and a distance between chucks of 40 mm, the tensile modulus of elasticity in each of the MD direction and TD direction, Tensile rupture strength and tensile rupture elongation were measured.
4.フィルムの線膨張係数(CTE)
下記条件で伸縮率を測定し、30〜300℃までを15℃間隔で分割し、各分割範囲の伸縮率/温度の平均値より求めた。MD方向、TD方向の意味は上記と同様である。
装置名 ; MACサイエンス社製TMA4000S
試料長さ ; 20mm
試料幅 ; 2mm
昇温開始温度 ; 25℃
昇温終了温度 ; 400℃
昇温速度 ; 5℃/min
雰囲気 ; アルゴン
4). Film linear expansion coefficient (CTE)
The expansion / contraction rate was measured under the following conditions, and the range from 30 to 300 ° C. was divided at 15 ° C. intervals and obtained from the average value of the expansion / contraction rate / temperature of each divided range. The meanings of the MD direction and the TD direction are the same as described above.
Device name: TMA4000S manufactured by MAC Science
Sample length; 20mm
Sample width: 2 mm
Temperature rise start temperature: 25 ° C
Temperature rising end temperature: 400 ° C
Temperature increase rate: 5 ° C / min
Atmosphere: Argon
〔参考例1〕
(無機粒子の予備分散)
アモルファスシリカの球状粒子シーホスターKE−P10(日本触媒株式会社製)を7.6質量部、N−メチル−2−ピロリドン390質量部を容器の接液部、および輸液用配管はオーステナイト系ステンレス鋼SUS316Lである容器に入れホモジナイザーT−25ベイシック(IKA Labor technik社製)にて、回転数1000回転/分で1分間攪拌し予備分散液を得た。
(ポリアミド酸溶液の調製)
窒素導入管、温度計、攪拌棒を備えた容器の接液部、および輸液用配管はオーステナイト系ステンレス鋼SUS316Lである反応容器内を窒素置換した後、200質量部の4,4’−ジアミノジフェニルエーテルを入れた。次いで、3800質量部のN−メチル−2−ピロリドンを加えて完全に溶解させてから、先に得た予備分散液を390質量部と217質量部のピロメリット酸二無水物を加えて、25℃にて5時間攪拌すると、褐色の粘調なポリアミド酸溶液Aが得られた。この還元粘度(ηsp/C)は3.7dl/gであった。
[Reference Example 1]
(Preliminary dispersion of inorganic particles)
7.6 parts by weight of amorphous silica spherical particle Seahoster KE-P10 (manufactured by Nippon Shokubai Co., Ltd.), 390 parts by weight of N-methyl-2-pyrrolidone, the liquid contact part of the container, and the infusion pipe are austenitic stainless steel SUS316L And stirred for 1 minute at a rotation speed of 1000 rpm with a homogenizer T-25 basic (manufactured by IKA Labortechnik) to obtain a preliminary dispersion.
(Preparation of polyamic acid solution)
Nitrogen introduction pipe, thermometer, wetted part of vessel equipped with stir bar, and infusion pipe were replaced with nitrogen in reaction vessel made of austenitic stainless steel SUS316L, and then 200 parts by mass of 4,4′-diaminodiphenyl ether Put. Next, after 3800 parts by mass of N-methyl-2-pyrrolidone was added and completely dissolved, 390 parts by mass and 217 parts by mass of pyromellitic dianhydride were added to the preliminary dispersion obtained above. When stirred for 5 hours at 0 ° C., a brown viscous polyamic acid solution A was obtained. The reduced viscosity (ηsp / C) was 3.7 dl / g.
〔参考例2〕
(無機粒子の予備分散)
アモルファスシリカの球状粒子シーホスターKE−P10(日本触媒株式会社製)を3.7質量部、N−メチル−2−ピロリドン420質量部を容器の接液部、および輸液用配管はオーステナイト系ステンレス鋼SUS316Lである容器に入れホモジナイザーT−25ベイシック(IKA Labor technik社製)にて、回転数1000回転/分で1分間攪拌し予備分散液を得た。
(ポリアミド酸溶液の調製)
窒素導入管、温度計、攪拌棒を備えた容器の接液部、および輸液用配管はオーステナイト系ステンレス鋼SUS316Lである反応容器内を窒素置換した後、108質量部のp−フェニレンジアミンを入れた。次いで、3600質量部のN−メチル−2−ピロリドンを加えて完全に溶解させてから、先に得た予備分散液を420質量部と292.5質量部の3,3’,4,4’−ジフェニルテトラカルボン酸二無水物を加えて、25℃にて12時間攪拌すると、褐色の粘調なポリアミド酸溶液Bが得られた。この還元粘度(ηsp/C)は4.5dl/gであった。
[Reference Example 2]
(Preliminary dispersion of inorganic particles)
3.7 parts by mass of amorphous silica spherical particles Seahoster KE-P10 (manufactured by Nippon Shokubai Co., Ltd.), 420 parts by mass of N-methyl-2-pyrrolidone, and the infusion part are austenitic stainless steel SUS316L And stirred for 1 minute at a rotation speed of 1000 rpm with a homogenizer T-25 basic (manufactured by IKA Labortechnik) to obtain a preliminary dispersion.
(Preparation of polyamic acid solution)
The wetted part of the vessel equipped with a nitrogen introduction tube, a thermometer, a stirring rod, and the infusion pipe were purged with nitrogen in the reaction vessel made of austenitic stainless steel SUS316L, and then 108 parts by mass of p-phenylenediamine was added. . Next, after 3600 parts by mass of N-methyl-2-pyrrolidone was added and completely dissolved, 420 parts by mass and 292.5 parts by mass of 3,3 ′, 4,4 ′ -Diphenyltetracarboxylic dianhydride was added and stirred at 25 ° C for 12 hours to obtain a brown viscous polyamic acid solution B. The reduced viscosity (ηsp / C) was 4.5 dl / g.
(細幅フィルムの作製)
参考例1〜2で得たポリアミド酸溶液を、ポリエチレンテレフタレート製フィルムA−4100(東洋紡績株式会社製)の無滑剤面上に、コンマコーターを用いてコーティングし(塗工幅1240mm)、90℃にて60分間乾燥した。乾燥後に自己支持性となったポリアミド酸フィルムを支持体から剥離して両端をカットし、厚さ8μm、幅1200mmのそれぞれのグリーンフィルムA、グリーンフィルムBを得た。
このグリーンフィルムA、グリーンフィルムBをそれぞれスリットし、幅30mmの細幅長尺スリットフィルムAと細幅長尺スリットフィルムBを用意した。
(Production of narrow film)
The polyamic acid solution obtained in Reference Examples 1 and 2 was coated on the non-lubricant surface of polyethylene terephthalate film A-4100 (manufactured by Toyobo Co., Ltd.) using a comma coater (coating width 1240 mm), and 90 ° C. For 60 minutes. The polyamic acid film which became self-supporting after drying was peeled off from the support and cut at both ends to obtain green film A and green film B having a thickness of 8 μm and a width of 1200 mm, respectively.
Each of the green film A and the green film B was slit to prepare a narrow long slit film A and a narrow long slit film B having a width of 30 mm.
(ポリイミドフィルムの製造)
<実施例1>
参考例1で得たポリアミド酸溶液を、ポリエチレンテレフタレート製フィルムA−4100(東洋紡績株式会社製)の無滑剤面上に、コンマコーターを用いてコーティングし(ギャップは、150μm、塗工幅1240mm)、90℃にて60分間乾燥した。乾燥後に自己支持性となったポリアミド酸フィルムを支持体から剥離して両端をカットし、厚さ8μm、幅1200mmのそれぞれのグリーンフィルムを得た。
得られたこれらのグリーンフィルムを、前記幅30mmの細幅長尺スリットフィルムAを両側端部に重ね合わせながら、図1〜図2に示すクリップであってフィルムに接する部分の素材として繊維径8μmのナスロン繊維製のフェルト(厚さ約2mm)を使用したクリップを使用し、放射温度計によるクリップ把持部の温度測定手段を備え、さらに図3に模式的に示すように冷却部を設けたクリップテンターに通し、クリップシート間隔を1140mm、すなわちグリーンフィルム両端の各30mmをクリップにて把持し、第1段が170℃で5分、第2段220℃5分、第3段480℃5分にて加熱を施して、イミド化反応を進行させた。なお、クリップ把持部での温度は160℃プラスマイナス5℃の範囲にて制御された。ここにナスロン繊維とは日本精線株式会社製のステンレススチール繊維である。
フィルムの搬送状態は良好であり、テンター内での「クリップはずれ」は生じなかった。またテンター出口でのクリップ把持部にてもフィルム裂けはほとんど観察されなかった。
得られたフィルムを室温にまで冷却し、フィルムの両端部の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、褐色を呈する実施例1のポリイミドフィルムを得た。得られたポリイミドフィルムの特性を表1に記載する。
(Manufacture of polyimide film)
<Example 1>
The polyamic acid solution obtained in Reference Example 1 was coated on the non-lubricant surface of polyethylene terephthalate film A-4100 (manufactured by Toyobo Co., Ltd.) using a comma coater (gap: 150 μm, coating width: 1240 mm). And dried at 90 ° C. for 60 minutes. The polyamic acid film which became self-supporting after drying was peeled from the support and cut at both ends to obtain respective green films having a thickness of 8 μm and a width of 1200 mm.
The obtained green film is a clip shown in FIGS. 1 to 2 having a fiber diameter of 8 μm as a material of a portion in contact with the film while the narrow slit film A having a width of 30 mm is superposed on both end portions. Using a clip made of Naslon fiber felt (thickness of about 2 mm), equipped with a temperature measuring means for the clip gripping part by a radiation thermometer, and further provided with a cooling part as schematically shown in FIG. Pass through the tenter, clip sheet spacing is 1140mm, that is, each 30mm of green film is gripped with clips, the first stage is 170 ° C for 5 minutes, the second stage is 220 ° C for 5 minutes, the third stage is 480 ° C for 5 minutes Then, the imidization reaction was allowed to proceed. The temperature at the clip gripping part was controlled in the range of 160 ° C. plus or minus 5 ° C. Here, NASLON fiber is a stainless steel fiber manufactured by Nippon Seisen Co., Ltd.
The conveyance state of the film was good, and “clip disengagement” did not occur in the tenter. Also, almost no film tearing was observed even at the clip gripping portion at the tenter exit.
The obtained film was cooled to room temperature, portions with poor flatness at both ends of the film were cut off with a slitter, rolled up into a roll, and the polyimide film of Example 1 exhibiting brown color was obtained. Table 1 shows the properties of the obtained polyimide film.
なお、フィルムの平面性、有効幅は、以下のように定義した。
まず得られたフィルムを清浄な表面を有する定盤に広げ、フィルム端部にてウネリにより定盤との間に空間が空いてしまう部分を平面性不良な部分として捉えた。フィルムの端部が定盤表面から持ち上がらずに、フィルム全体が定盤に密着するようになるまで、フィルム両端をカットし、その時のフィルム幅を有効幅と定義した。
また、クリップ部での裂けは、フィルムの先頭から10m程度の部分にて、クリップ部での幅方向、縦方向でのフィルム裂けを目視判定し、該裂け部位が10ヶ以上あるものを×、10〜3ヶ程度のものを△、2ヶ以下のものを○とした。
クリップ部からのフィルム剥離性は、熱処理(イミド化)が終了してフィルムが引き離しロールにより各クリップより剥離するときの状態を目視評価し,スムースな引き離しは良好とし,クリップにフィルムが引っ掛りが生じる場合をやや不良とし、引っ掛りによりフィルムに流れ方向の裂けが生じる場合は不良とした。
The flatness and effective width of the film were defined as follows.
First, the obtained film was spread on a surface plate having a clean surface, and a portion where a space was left between the surface plate due to undulation at the end of the film was regarded as a portion having poor flatness. The ends of the film were not lifted from the surface of the platen, and both ends of the film were cut until the entire film was in close contact with the platen, and the film width at that time was defined as the effective width.
In addition, the tear at the clip part is determined by visually judging the film tear in the width direction and the longitudinal direction at the clip part at a portion of about 10 m from the top of the film, and those having 10 or more tear parts, About 10 to 3 pieces were evaluated as △, and 2 or less pieces as ◯.
The film peelability from the clip part is determined by visual evaluation of the state when the heat treatment (imidization) is completed and the film is peeled off from each clip by the roll, and the smooth peeling is good, and the film is caught on the clip. The case where it occurred was regarded as slightly defective, and the case where the film teared in the flow direction due to catching was regarded as defective.
<実施例2>
参考例2で得たポリアミド酸溶液Bを使用し、細幅長尺スリットフィルムBを両側端部に重ね合わすこと以外は実施例1と同様にしてポリイミドフィルムBを得た。
同様にしてその評価をした。結果を表1に示す。
<Example 2>
A polyimide film B was obtained in the same manner as in Example 1 except that the polyamic acid solution B obtained in Reference Example 2 was used and the narrow slit film B was overlapped on both side ends.
The evaluation was made in the same manner. The results are shown in Table 1.
<比較例1>
細幅長尺スリットフィルムAを両側端部に重ね合わすことをせずに厚さ8μm、幅1200mmのグリーンフィルムをそのまま使用して処理すること以外は、実施例1と同様にしてポリイミドフィルムを製造したが、連続して評価できるほどの長尺ポリイミドフィルムを得ることができなかった。
<Comparative Example 1>
A polyimide film is produced in the same manner as in Example 1 except that the narrow-width long slit film A is processed using a green film having a thickness of 8 μm and a width of 1200 mm as it is without being overlapped on both ends. However, a long polyimide film that could be continuously evaluated could not be obtained.
<比較例2>
細幅長尺スリットフィルムBを両側端部に重ね合わすことをせずに厚さ8μm、幅1200mmのグリーンフィルムをそのまま使用して処理すること以外は、実施例2と同様にしてポリイミドフィルムを製造したが、連続して評価できるほどの長尺ポリイミドフィルムを得ることができなかった。
<Comparative example 2>
A polyimide film is produced in the same manner as in Example 2, except that the narrow and long slit film B is processed by using a green film having a thickness of 8 μm and a width of 1200 mm as it is without being overlapped on both ends. However, a long polyimide film that could be continuously evaluated could not be obtained.
<実施例3>
ポリアミド酸溶液Aを、ポリエチレンテレフタレート製フィルムA−4100(東洋紡績株式会社製)の無滑剤面上に、コンマコーターを用いてコーティングし(塗工幅1240mm)、90℃にて60分間乾燥し、厚さ11.0μm、幅1200mmのグリーンフィルムを得て、得られたグリーンフィルムに前記幅30mmの細幅長尺スリットフィルムAを両側端部に重ね合わせながら、実施例1と同様にしてポリイミドフィルムを得た。同様にしてその評価をした。結果を表1に示す。
<Example 3>
The polyamic acid solution A was coated on the non-lubricant surface of polyethylene terephthalate film A-4100 (manufactured by Toyobo Co., Ltd.) using a comma coater (coating width 1240 mm), and dried at 90 ° C. for 60 minutes. A polyimide film was obtained in the same manner as in Example 1 while obtaining a green film having a thickness of 11.0 μm and a width of 1200 mm, and superposing the narrow slit film A having a width of 30 mm on both side ends on the obtained green film. Got. The evaluation was made in the same manner. The results are shown in Table 1.
<実施例4>
ポリアミド酸溶液Bを使用し、細幅長尺スリットフィルムBを両側端部に重ね合わすこと以外は実施例3と同様にしてポリイミドフィルムを得た。
同様にしてその評価をした。結果を表1に示す。
<Example 4>
A polyimide film was obtained in the same manner as in Example 3 except that the polyamic acid solution B was used and the narrow slit film B was superposed on both side ends.
The evaluation was made in the same manner. The results are shown in Table 1.
<実施例5>
ポリアミド酸溶液Aを使用し、コンマコーターの塗工厚を変えた以外は実施例1と同様に操作しポリイミドフィルムを得た。
同様にしてその評価をした。結果を表1に示す。
<Example 5>
A polyimide film was obtained in the same manner as in Example 1 except that the polyamic acid solution A was used and the coating thickness of the comma coater was changed.
The evaluation was made in the same manner. The results are shown in Table 1.
<実施例6>
ポリアミド酸溶液Bを使用し、コンマコーターの塗工厚を変えた以外は実施例1と同様に操作しポリイミドフィルムを得た。
同様にしてその評価をした。結果を表1に示す。
<Example 6>
A polyimide film was obtained in the same manner as in Example 1 except that the polyamide acid solution B was used and the coating thickness of the comma coater was changed.
The evaluation was made in the same manner. The results are shown in Table 1.
<比較例3>
細幅長尺スリットフィルムAを両側端部に重ね合わすことをせずに厚さ5.0μm、幅1200mmのグリーンフィルムをそのまま使用して処理すること以外は、実施例3と同様にしてポリイミドフィルムを製造したが、連続して評価できるほどの長尺ポリイミドフィルムを得ることができなかった。
<Comparative Example 3>
A polyimide film in the same manner as in Example 3 except that the thin long slit film A is processed by using a green film having a thickness of 5.0 μm and a width of 1200 mm as it is without being overlapped on both ends. However, a long polyimide film that could be continuously evaluated could not be obtained.
<比較例4>
細幅長尺スリットフィルムBを両側端部に重ね合わすことをせずに厚さ5.0μm、幅1200mmのグリーンフィルムをそのまま使用して処理すること以外は、実施例4と同様にしてポリイミドフィルムを製造したが、連続して評価できるほどの長尺ポリイミドフィルムを得ることができなかった。
<Comparative example 4>
A polyimide film in the same manner as in Example 4 except that a thin film having a thickness of 5.0 μm and a width of 1200 mm is used as it is without superimposing the narrow slit film B on both ends. However, a long polyimide film that could be continuously evaluated could not be obtained.
以上述べてきたように、本発明のイミド化させる工程のフィルム端部固定式クリップテンターでフィルムの幅方向の両側端部におけるフィルム把持が、イミド化されるポリアミド酸フィルムと別の細幅のフィルムとを重ねてクリップで挟持固定することで、フィルムの縦方向、幅方向に破断する問題、カールの発生、皺や歪みなどの発生による品質不良が発生し易い課題を解消することができ、厚さが7.5μm以下の長尺極薄ポリイミドフィルムの安定的生産が可能となる。厚さが7.5μm以下の長尺極薄ポリイミドフィルムは、電子機器の部品や機械部品などとして利用することができる。 As described above, the film gripping at both ends in the width direction of the film in the film end fixing type clip tenter in the imidizing step of the present invention is a thin film different from the polyamic acid film to be imidized. By overlapping and fixing with clips, it is possible to eliminate the problem of breakage in the longitudinal and width directions of the film, the occurrence of curling, and quality defects due to wrinkles and distortions. It becomes possible to stably produce a long ultrathin polyimide film having a thickness of 7.5 μm or less. A long ultrathin polyimide film having a thickness of 7.5 μm or less can be used as a part of an electronic device or a machine part.
1.クリップ可動部
2.ローラー
3.クリップ把持部
4.回転軸
11.冷却部
12.熱処理ゾーン
13.クリップ駆動チェーン
1. Clip
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007129077A JP4967797B2 (en) | 2007-05-15 | 2007-05-15 | Method for producing polyimide film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007129077A JP4967797B2 (en) | 2007-05-15 | 2007-05-15 | Method for producing polyimide film |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008284701A JP2008284701A (en) | 2008-11-27 |
JP4967797B2 true JP4967797B2 (en) | 2012-07-04 |
Family
ID=40144901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007129077A Active JP4967797B2 (en) | 2007-05-15 | 2007-05-15 | Method for producing polyimide film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4967797B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010083984A (en) * | 2008-09-30 | 2010-04-15 | Unitika Ltd | Polyimide film |
US9352498B2 (en) | 2009-10-09 | 2016-05-31 | Ube Industries, Ltd. | Method of manufacturing polyimide film and tenter apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6174821A (en) * | 1984-09-20 | 1986-04-17 | Mitsui Toatsu Chem Inc | Manufacture of highly-oriented film in traverse direction |
JPS6274607A (en) * | 1985-09-30 | 1987-04-06 | Hitachi Chem Co Ltd | Manufacture of polyimide film |
JPH09220726A (en) * | 1996-02-20 | 1997-08-26 | Asahi Chem Ind Co Ltd | Production of heat-resistant film |
-
2007
- 2007-05-15 JP JP2007129077A patent/JP4967797B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008284701A (en) | 2008-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4839914B2 (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
KR20080007388A (en) | Manufacturing apparatus of polymer film and manufacturing method of polymer film | |
JP4967797B2 (en) | Method for producing polyimide film | |
JP5621310B2 (en) | Coating die for solution casting and solution casting method | |
JP2009013245A (en) | Polyimide film | |
JP4900032B2 (en) | Method for producing polyimide film | |
JP4900033B2 (en) | Method for producing polyimide film | |
JP2008156090A (en) | Method and device for manufacturing polymeric film | |
JP2008285514A (en) | Method for producing polyimide film | |
JP4821955B2 (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
JP2007253517A (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
JP5549360B2 (en) | Method for producing polyimide film and polyimide film roll | |
JP4967635B2 (en) | Polymer film manufacturing method and polymer film manufacturing apparatus | |
JP5874184B2 (en) | Coating die for solution casting and solution casting method | |
JP4821960B2 (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
JP4821956B2 (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
JP2008285515A (en) | Method for producing polyimide film | |
JP4835088B2 (en) | Method and apparatus for producing polymer film | |
JP4843996B2 (en) | Polymer film manufacturing apparatus and polymer film manufacturing method | |
JP4894504B2 (en) | Method for producing polyimide film | |
JP5114668B2 (en) | Heat-resistant polymer film manufacturing apparatus and heat-resistant polymer film manufacturing method | |
JP5023463B2 (en) | Method and apparatus for producing polymer film | |
JP5023464B2 (en) | Method and apparatus for producing polymer film | |
JP2008285516A (en) | Method for producing polyimide film | |
JP2007021948A (en) | Manufacturing apparatus of polymer film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100426 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120216 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120306 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120319 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150413 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4967797 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150413 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |