JP4966262B2 - Manufacturing method and manufacturing apparatus for hot press mold - Google Patents

Description

  The present invention relates to a hot press mold, and more particularly to a method and an apparatus for manufacturing a mold having a good uneven surface in the manufacture of a hot press mold.

  The press forming of a metal plate material is the most common processing method widely used for manufacturing automobiles, industrial machines, electrical equipment, transportation equipment and the like because it is highly productive and can be processed with high precision. Further, a hot press forming method has been invented as a method for processing a metal plate material such as high-strength steel or alloy that is inferior in cold press workability such as room temperature.

  In the hot press forming method, a metal plate material is heated using a heating device such as induction heating, energization heating, or radiant heating, the heated metal plate material is placed on a die, and the punch is placed at the bottom dead center from above. This is a technique in which the molded article having a desired strength is obtained by cooling to a predetermined temperature and cooling for a certain time.

  In the hot press forming method, when the press-formed steel sheet is removed from the die, a new steel sheet heated to a predetermined temperature is placed on the die. Thus, by continuously placing the heated steel plate on the die and press-molding it, it is possible to continuously produce a large amount of products with good shape stability.

  In this hot press forming, cooling of the metal plate material after forming is important from the viewpoint of productivity, and Patent Document 1 discloses a method of cooling using a refrigerant after press forming at a high temperature.

  FIG. 17 is a drawing of a mold used in a conventional hot press molding method, and FIG. 17 (a) is a sectional view of the entire mold. (B) is a perspective view of a lower mold, and shows a refrigerant ejection mechanism arranged inside the lower mold by a dotted line.

  The vertical wall portion of the die 102 is formed with an ejection port 103 for ejecting the coolant to the metal plate material in contact with the die 102. One end of a supply pipe 104 that is formed on the inner side of the die 102 and supplies a refrigerant is connected to the jet outlet 103, and the other end of the supply pipe 104 is disposed outside the die 102. It is connected to a refrigerant storage unit (not shown) that stores the refrigerant.

  When the metal plate 106 is press-molded using the hot press-molding die shown in FIG. 17, the punch 105 is lowered to the bottom dead center, and the pressed state of the metal plate 106 is held for a while. In this state, the refrigerant accommodated in the refrigerant accommodating portion is ejected from the ejection port 103 onto the metal plate member 106 through the supply pipe 104.

  Such a hot press molding die facilitates the flow of steam and refrigerant generated during cooling along the molding surface of the press molded product, so that the gap between the metal plate 106 and the die surface at the bottom dead center. It is necessary to provide a gap in Therefore, as shown in FIG. 18, a plurality of independent convex portions 107 having a certain depth are provided along the molding surface, and the concave portions, which are gaps formed by the convex portions 107 and the metal plate material 106, The nozzle 103 communicates with the nozzle 103.

  The size of the concavo-convex pattern formed by the concave portions and the convex portions 107 is smaller than the shape surface size so that the three-dimensional shape of the molded product obtained when the metal plate 106 is pressed and deformed does not collapse. It is required to be sufficiently small. Therefore, it is necessary to provide a large number of convex portions 107.

  In the above-mentioned Patent Document 1, as the shape of the large number of convex portions 107, a circular shape, a polygonal shape, and a star shape are specified as the horizontal cross-sectional shape, and a rectangular shape and a large trapezoidal shape are specified as the vertical cross-sectional shape. In addition, regarding these machining methods, there is a description that the periphery of the convex portion 107 is removed, and as a specific machining method, electrical discharge machining used for machining or high-precision machining is described.

  As another method for processing the surface of a three-dimensional shape mold, Patent Document 2 discloses a method by etching. In Patent Document 2, for the purpose of decorating a seamless pattern on the whole or part of a mold having a three-dimensional shape, a photomask is used for decoration using a general-purpose polyester film coated with a photosensitive material. A pattern is formed. Then, after pattern formation, it is molded into the same shape as the mold by vacuum forming, etc., and is adhered to the mold coated with photoresist, exposed, developed, and etched to decorate the mold surface with a predetermined pattern Yes.

JP-A-2005-169394 JP 2004-345286 A

  By the way, the concave / convex portion is formed in the hot pressing mold in order to cool the mold by flowing a coolant in the concave portion, and the concave portion is deeper and uniform than the concave portion depth in the pattern for decorative use. It is necessary. However, since the machining is machining along a three-dimensional curved surface, there is a problem that the machining accuracy required for the height of the convex portion 107 and the uneven pattern shape cannot be achieved with a standard machine tool. Even in the case of automatic processing devices such as NC machine tools, machining centers, 3D end mill processing machines including CAD and CAM systems capable of high-accuracy processing, if the size of the convex portion 107 is small, the processing time is enormous. In addition, there is a problem that the processing apparatus / system is expensive.

  In the case of electric discharge machining, a mold electrode having a shape opposite to that of a mold is manufactured, and a concave portion having a shape opposite to the convex portion is provided on the electrode surface. Producing electrodes requires the same time and effort as making the mold itself. Furthermore, the convex part 107 must be substantially perpendicular to the macro three-dimensional surface of the mold. Therefore, when electric discharge machining of the convex portion 107 is performed, according to the required accuracy, the mold electrode is disassembled into several parts according to the required accuracy, and the region to be convex processed at once is divided for each part. It is necessary to perform electrical discharge machining. For this reason, as the number of processing electrodes increases, the processing time also increases. Further, particularly in the mold R portion and the curved surface, the uneven depth becomes uneven, and the processing accuracy tends to deteriorate. Further, even when the convex portion 107 is formed by etching, Patent Document 2 does not describe a method for processing a three-dimensional mold deeply and uniformly.

  Accordingly, an object of the present invention is to provide a processing method and a manufacturing apparatus for processing a surface of a mold having a three-dimensional shape deeply and uniformly with high accuracy.

The inventors of the present application have focused on making the etching rate uniform by controlling the etching. The gist of the present invention is as follows.
(1) Soften a sheet on which a processed pattern to be applied to the surface of a three-dimensional mold is softened, and adhere the softened sheet to the surface of the mold or the mold of the same shape, and then attach the sheet. Curing to form a three-dimensional shape mask, bringing the three-dimensional shape mask into close contact with the mold on which a resist film is formed, and transferring and developing the processed shape pattern onto the resist film by exposure. Then, a hot press-molding mold is provided, in which a gap serving as a flow path is provided on the surface of the mold by forming a pattern of the processed shape transferred to the mold with an etching solution on the mold surface. In the manufacturing method, an etching solution is sprayed onto the mold surface by a plurality of spray nozzles, and one or more of the following (a) to (e) are selected according to the level of the processed surface of the mold : To control A method for producing a hot press molding die.
(A) Temperature of etching solution on the mold surface (b) Concentration of etching solution (c) Flow of etching solution on the mold surface (d) Residence time of etching solution on the mold surface (E) Mold surface temperature (2) The control of said (a) controls the temperature of the said etching liquid injected by the said injection nozzle, The hot press molding metal of Claim 1 characterized by the above-mentioned. Mold manufacturing method.
(3) The etching solution is injected onto the mold surface simultaneously with the injection of air or water, or after the injection of air or water, and by controlling the temperature of the injected air or water, The method for producing a hot press molding die according to claim 1 or 2, wherein one or more of (a) to (e) are further controlled.
(A) Temperature of etching solution on the mold surface (b) Concentration of etching solution (c) Flow of etching solution on the mold surface (d) Residence time of etching solution on the mold surface (E) Mold surface temperature (4) The injection of the etching liquid onto the mold surface is performed simultaneously with the injection of air at a predetermined time interval, and by controlling the injected air, the following (a), The method for producing a hot press molding die according to any one of claims 1 to 3, wherein one or more of (c), (d), and (e) are further controlled.
(A) Temperature of etchant on the mold surface (c) Flow of etchant on the mold surface (d) Residence time of etchant on the mold surface (e) Mold surface temperature (5) The injection of the etching solution onto the mold surface is performed simultaneously with the radiant heating to the mold surface, and the radiant heating is controlled, whereby one or two of the following (a) and (e) are performed. The method for producing a hot press molding die according to any one of claims 1 to 4, wherein the seed is further controlled.
(A) Temperature of the etching solution on the mold surface (e) Mold surface temperature (6) The mold is given a centrifugal force by rotating, and the injection of the etching solution onto the mold surface is Further, one or two of the following (c) and (d) are further controlled by controlling the centrifugal force simultaneously with or after the centrifugal force is applied to the mold. A method for producing a hot press molding die according to any one of claims 1 to 5.
(C) Flow of etching solution on the surface of the mold (d) Residence time of the etching solution on the surface of the mold (7) The pattern of the processed shape formed on the sheet has the shape of the processed shape on the sheet. It forms by printing a pattern, The manufacturing method of the hot press molding metal mold | die in any one of Claims 1-6 characterized by the above-mentioned.
(8) An apparatus for processing a predetermined shape on the surface of the mold after processing the shape of the hot press mold, and an apparatus for softening a sheet on which a pattern of the processed shape to be applied to the surface of the mold is formed An apparatus for forming the softened sheet into a three-dimensional shape by vacuum forming, and a pattern of the processed shape of the sheet formed into the three-dimensional shape by exposure is transferred to a resist film formed on the mold surface, An apparatus for developing, and an apparatus for removing an unnecessary surface of the mold surface by the etching method according to any one of claims 1 to 6 and processing an uneven shape on the mold surface. Production equipment for hot press molding dies.

  According to the present invention, since a pattern having a predetermined shape can be provided uniformly with high accuracy, the surface of a three-dimensional mold can be deeply and uniformly processed with high accuracy. Therefore, in hot press forming, while making the shape of the red hot steel sheet good, it is possible to provide a uniform gap between the steel sheet and the mold surface, which serves as a flow path for the refrigerant, etc., improving the cooling performance of the steel sheet. , Productivity of hot press is greatly improved.

  Hereinafter, embodiments of the present invention will be described in detail. When the mold size is large and the undulation of the mold shape is large, that is, when the etching surface is a three-dimensional shape, in the conventional etching process, the etchant temperature, etchant concentration, etchant and sludge mold surface There is a problem that the residence time, the film thickness of the etching solution and sludge on the mold surface, and the mold surface temperature are not the same in the processed surface. In the present invention, the etching rate on the mold surface is made uniform by controlling by any one or a combination of two or more of these factors.

  In particular, from the upper side of the mold 120 as shown in FIG. 19, the etching solution 121 heated by the heat exchanger 124 is dropped into the mold via a shower nozzle 123 communicating with the pipe 122 for supplying the etching solution 121. In the etching process to be sprayed, since it is affected by gravity, the etching rate varies depending on the level of the processed surface due to the above-mentioned factors. Usually, in order to ensure the uniformity of the unevenness processing, the etching processing must be performed a plurality of times for each processing surface at each level while adjusting the etching time by individually increasing or decreasing the etching time. However, according to the present invention, by arranging and spraying a plurality of nozzles, the etching solution temperature, the etching solution concentration, the flow rate and residence time of the etching solution and sludge on the mold surface according to the levelness of the processing surface The thickness of the mold surface of the etching solution and sludge, and the mold surface temperature are individually controlled, and the processing speed is the same, so that the depth of the recess is uniform even with one or fewer etchings. Can be obtained.

  Among the above-mentioned factors, the basic factor that affects the processing speed is the flow rate of the etching solution 121 and sludge on the surface of the mold 120. By arranging a plurality of etching solution spray nozzles, the processing surface can be leveled. A constant flow rate can be maintained regardless of the degree, and a certain effect can be obtained with respect to the uniformity of the recess depth.

  Further, the temperature or concentration of the etching solution is cited as the factor that most affects the processing speed. By controlling the temperature or concentration of the etching solution, the uniformity of the depth of the recess is greatly improved.

  The etchant transfers heat with the mold surface simultaneously with the chemical reaction during processing, and the difference in the mold surface temperature causes a difference in the etchant temperature, resulting in a non-uniform reaction temperature. Etching rate tends to be non-uniform. Therefore, by using air or water other than the etchant to control the mold surface temperature, the chemical reaction rate is made uniform at the uniform reaction temperature, and the processing speed is made uniform, so that the uniform recess depth is obtained. This etching can be performed with higher accuracy.

  The processing surface temperature can be controlled by radiant heat without using a heat transfer medium such as air or water, for example, by irradiation with a heating lamp. This leads to simplification of the etching apparatus and is economical.

  Sludge generated by etching is generated at the processing interface and hinders the progress of etching processing. The sludge itself flows with a certain amount of force. However, since the viscosity is high, the retention thickness and the unevenness of retention tend to occur according to the strength of the flow of the machining liquid and the cleaning liquid. Forcibly removing the staying sludge by using, for example, jetting of an etchant from a nozzle or centrifugal force enables more uniform uneven processing.

  In particular, when the workpiece is heavy, if it is removed using a fluid such as air regardless of the centrifugal force, a large rotating mechanism becomes unnecessary, which is economical.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows the procedure of the processing method according to the present invention. The manufacturing method of the present invention is roughly divided into a step S for forming a mask having a processing pattern and a step M for etching a mold.

  In the step S for forming the mask, the processing pattern is transferred to the sheet 1 by printing or the like, the printing step S1 for forming the printing sheet 1a, the printing sheet 1a to which the pattern is transferred is softened, and the softening sheet 1b is formed. The softening / plasticizing step S2 to be formed, and the softening sheet 1b, for example, are brought into close contact with the surface of the mold 2 and cured to form a three-dimensional masking 3 which is a three-dimensional masking molded body. And have. In the process M for etching the mold 2, a resist solution is applied to the mold 2 to form a resist film 4, and the three-dimensional masking 3 formed in the process S is applied to the mold 2. After the exposure process M2 for exposing the resist film 4 in close contact, the removal process M3 for removing the masking 3 from the mold 2 after exposure, the development process M4 for developing the exposed resist film 4, and the development of the resist film 4, And an etching step M5 for forming the pattern on the surface of the mold 2 with the etching solution 5.

  2 is a sheet printing step S1, FIGS. 3 to 4 are a sheet forming and adhesion step S3, FIG. 5 is an exposure step M2, FIG. 6 is a three-dimensional masking 3 removal step M3, and FIG. 7 is a development processing step. It is a figure explaining etching process M5.

  FIG. 2 illustrates details of the sheet printing step S1. The resist film 4 has a characteristic that it is cured and fixed by being irradiated with light of a constant wavelength at a constant intensity (time) and fixed to the mold surface. On the other hand, the part not exposed to light has a characteristic that it is not cured and can be decomposed and removed by a later developing solution. Patterning is performed on the sheet 1 with a material that does not transmit light having a wavelength necessary for the exposure reaction of the resist film 4 in the uneven pattern printing step S1 shown in FIG. In this case, the negative pattern (black part) of the pattern which finally becomes convex on the mold surface is printed, and the print sheet 1a is created. Subsequently, in the softening / plasticizing step S2, the above-described printing sheet 1a is softened by, for example, heating uniformly using a heater or the like to form the softening sheet 1b. Thereby, it becomes easier to form in the later forming step.

  3 to 4 show details of the sheet forming / adhering step S3. The softening sheet 1b is pressed and brought into close contact with the mold 2 on which the resist film 4 is formed in the molding / adhesion step S3 shown in FIG. At this time, by using the vacuum forming apparatus 8 shown in FIG. 3, it is possible to form the softened sheet 1 b that more closely follows the shape of the mold 2.

  The vacuum forming apparatus 8 includes a pedestal 9 on which the mold 2 is placed and a suction hole 10 communicating with a suction blower (not shown). A plurality of openings 11 communicating with the suction holes 10 are provided on the upper surface of the base 9 and in the vicinity of the mold 2. The vacuum forming apparatus 8 keeps the pressure in the base 9 lower than the atmospheric pressure when the softening sheet 1b is formed. When the softening sheet 1b is put on the mold 2, the air between the softening sheet 1b and the mold 2 is excluded, and as a result, the softening sheet 1b is in close contact with the mold 2 as shown in FIG.

  When the softened sheet 1b cools while being in close contact with the mold 2, the softened sheet 1b is cured while following the shape of the mold 2. At this point, the softening sheet 1b becomes the three-dimensional masking 3. In addition, as long as the softening sheet 1b and the mold 2 are in close contact with each other as long as the softening sheet 1b is in close contact with the mold 2, any method may be used, but vacuum forming with good followability to the mold 2 is possible. Is desirable.

  FIG. 5 illustrates an exposure process M2 in which the resist film 4 formed on the surface of the mold 2 is exposed. The resist film 4 is exposed for a predetermined time by an exposure lamp 15 after the three-dimensional masking 3 is brought into close contact with the mold 2 on which the resist film 4 is formed. As a result, portions other than the negative pattern of the three-dimensional masking 3 are cured, and the exposed portion becomes the cured / fixed resist film 4a.

  FIG. 6 illustrates details of the removal process M3 of the three-dimensional masking 3. After the exposure, the three-dimensional masking shown in FIG. 1 is removed, and the three-dimensional masking 3 and the mold 2 (including the resist film 4 and the cured / fixed resist film 4a) are separated in a step M3.

  FIG. 7 shows a flow image of the development process M4 to the etching process M5. The developer 7 is applied to the mold 2 (including the resist film 4 and the cured / fixed resist film 4a), and the portion of the resist film 4 that is not exposed to light (in this case, cured / fixed) is removed. At this stage, only the surface of the mold to be etched is exposed, and the cured / fixing resist film 4a remains on the other surface. The resist film 4a forms a protective film that prevents the mold 2 from being etched in a later etching step M5.

  In the etching step M5, the portion of the mold 2 where the surface is exposed is sprinkled with the etching solution 5 and dug down to a certain depth. In the present embodiment, the etching solution 5 is, for example, a ferric chloride solution. After completion of the etching, the cured / fixed resist film 4a is removed by washing as shown in FIG. A mold having a convex surface is completed by the above-described series of processes.

  FIG. 8 is a diagram illustrating a series of processing steps by enlarging the processing surface interface. First, the three-dimensional masking 3 is brought into close contact with the mold 2 on which the resist film 4 is formed (FIG. 8A). Next, the resist film 4 is exposed to light 6 and exposed to light to form a cured / fixed resist film 4a that is cured / fixed on the surface of the mold (FIG. 8 (c)). (FIG. 8 (d)), and the resist film 4 that has not been exposed is removed by the developing solution 7 (FIG. 8 (e)), and the mold 2 is etched by the etching solution 5 (FIG. 8 (f)). ) After the etching, the cured / fixed resist film 4a remaining on the surface of the mold 2 is removed by washing (FIGS. 8G and 8H).

  The mold 2 to be processed is generally processed by machining or electric discharge machining into the shape of the product manufactured by the mold 2, and in the stage of FIG. 8B, the mold 2 has a three-dimensional shape according to the product shape. Although the mold surface is smooth. A thin and uniform resist film 4 is formed on the surface of the smooth mold 2 on the surface on which the unevenness processing is performed by the film forming process M1 of the resist film 4 shown in FIG. The resist film 4 may be either a negative type or a positive type as long as it is a photoreactive material used for forming an uneven pattern by exposure. Hereinafter, the case of a photocurable resin which is a typical negative type resist film material will be described.

  Next, the vacuum forming apparatus 8 is mounted on one carriage 21, and a vacuum is formed between the softening apparatus 22 that heats and softens the sheet and the exposure apparatus 23 that exposes the resist film 4 formed on the surface of the mold 2. A masking molding device 24 that can move while being in close contact will be described with reference to FIG. As shown in FIG. 9 (a), the resist film 4 is formed on the mold 2 before the uneven processing (smooth surface), and the resist film 4 is placed on the carriage 21 having the vacuum forming apparatus 8. The carriage 21 is provided with a suction blower 30 for forming a vacuum, and is connected to a vacuum space 31 formed inside a base 9 having an opening 11 on which the mold 2 is placed. The carriage 21 can move on the rail 32, and after placing the mold 2, it can be moved directly below the softening device 22 shown in FIG.

  The softening device 22 includes a clamp 34 having a slide device 33 that can arbitrarily hold and remove the print sheet 1a and can slide in parallel up and down, and a heater 35 that heats and softens the print sheet 1a. When the softened sheet 1 b that has been softened by heating for a certain period of time is pressed down onto the upper surface of the carriage 21 that is evacuated by the operation of the suction blower 30, the softened sheet 1 b comes into close contact with the mold 2 and the surface of the base 9. When the softening sheet 1b is cooled, a three-dimensional masking 3 that follows the shape of the mold 2 is completed. The heater 35 only needs to be able to heat and soften the printing sheet 1a. In the present embodiment, an electric heater is used, but a halogen heater or the like may be used, for example.

  If the evacuation is continued, the adhesion between the mold 2 and the three-dimensional masking 3 is kept good. In this state, the clamp 34 is separated from the slide device 33 so that it can move together with the carriage 21. Thereafter, the above-described carriage 21 is moved directly below the exposure device 23. When evacuation is continued, in order to prevent the softening sheet 1b from being broken by excessive vacuum, it is desirable to provide a pressure adjusting device such as a vacuum breaker valve so as to keep the degree of vacuum constant.

  As shown in FIG. 9B, the exposure device 23 includes an exposure lamp 15, a reflex plate 36 that reflects the light 6 of the exposure lamp 15, and a case 37 that houses the lamp 15 and the reflex plate 36. The case 37 can move up and down via a guide device 38.

  After the carriage 21, the mold 2, and the three-dimensional masking 3 are moved directly below the case 37, the case 37 is lowered so as to cover the mold 2 and the three-dimensional masking 3. Irradiate the entire surface of the mold. As a result, all the portions of the three-dimensional masking 3 where the pattern is not printed are equally exposed, and the resist film 4 at the portion reacts in a shape corresponding to the uneven pattern on the surface of the mold 2 (for example, curing and curing). Fix). Thereafter, the carriage 21 is moved out of the exposure apparatus 23, and the mold 2 and the three-dimensional masking 3 are removed from the carriage 21. And the metal mold | die 2 is sent to the image development process M4 and the etching process M5, and the metal mold | die with an unevenness | corrugation on the surface is completed. Development is performed by placing the mold 2 in a separate tank and sprinkling the developer 7 (which can remove the resin that is not photocured) onto the surface of the mold 2 from which the three-dimensional masking 3 has been removed. This is done by washing with water. As a specific developing device, for example, the mold 2 is placed in a tank, and the developing solution 7 is supplied from above the mold 2 using, for example, a watering device, or the developing solution 7 is stored in the tank. The mold 2 may be dipped in it. After that, the surface of the mold 2 may be washed away with water.

  Next, the etching process M5 will be described in detail. FIG. 10 shows an example in which an injection nozzle 41 for injecting the etching solution 5 is provided for each processing surface having a different level. In the present embodiment, five injection nozzles 41a to 41e are provided. In FIG. 10A, the etching solution 5 is supplied to the injection nozzle 41 from the etching solution supply device (not shown) through the pipe P1. And before injecting the etching liquid 5 from the injection nozzle 41, the temperature of the etching liquid 5 is adjusted and sprayed with each temperature control apparatus, for example, the heat exchanger 43. The temperature of the etching solution 5 on the surface of the mold 2 can be controlled by controlling the temperature of the etching solution 5 injected from each of the injection nozzles 41 a to 41 e by the heat exchanger 43. The vertical surface 2a and the horizontal surface 2b of the mold 2 have different etching processing speeds because the residence time of the etching solution 5 and the amount of sludge generated during etching are different. For example, in the etching process of the surface having a low processing speed, that is, the vertical surface 2a, the difference in the processing speed due to the difference in the level of the processing surface can be reduced by increasing the temperature and concentration of the etching solution 5. . Depending on the required accuracy by dividing the area for each surface with different levelness and curvature of the processing surface and adjusting the number of spray nozzles 41 and the temperature and concentration of the etching solution 5 independently for each area Uneven processing is possible.

  FIG. 10B is an example in which a suction nozzle 45 that sucks and collects excess etching solution 5 is provided for each processed surface of the mold 2, in addition to the etching solution injection nozzles 41 a to 41 e. The suction nozzle 45 communicates with a suction device (not shown) through the pipe P2. By reducing the excess retention amount of the etching solution 5 on each surface of the mold 2 by the suction nozzle 45, the flow rate and the residence time can be adjusted, so that more uniform uneven processing can be performed. The spray nozzle 41 may be either a one-fluid nozzle or a two-fluid nozzle as long as it can spray the etching solution 5 uniformly on the surface of the mold 2. Nozzles that can be sprayed with are preferred.

  FIG. 11A shows an example in which a temperature adjusting nozzle 47 for injecting the fluid 46 is provided adjacent to the injection nozzle 41 separately from the injection nozzle 41. The temperature adjustment nozzle 47 communicates with a fluid supply device (not shown) via a pipe P3 and has a heat exchanger 48 that is a temperature adjustment function independent of the heat exchanger 43 of the injection nozzle 41. Therefore, before the etching process is performed by spraying the etching solution 5, the temperature 46 of the processed surface can be adjusted by spraying the fluid 46 whose temperature has been adjusted to each processed surface. As a result, the temperature at the boundary between the processing surfaces of the etching solution 5 and the mold 2 can be controlled more accurately in each divided processing area. Therefore, the etching processing speed is higher than when processing is performed only by controlling the temperature of the etching solution 5. Can be finely increased / decreased, and more uniform unevenness processing becomes possible. The fluid 46 is air or water in the present embodiment. The temperature adjusting nozzle 47 may be either a one-fluid nozzle or a two-fluid nozzle as long as it can spray the fluid 46 uniformly on the surface of the mold 2.

  The injection of the fluid 46 is not performed before the injection of the etching solution 5, but the injection times of the etching solution 5 and the fluid 46 can be determined and switched alternately. Alternatively, the fluid 46 and the etching solution may be sprayed at the same time. When the spray time (period) of the etching solution 5 is sufficiently shorter than the spray time (period) of the fluid 46, the temperature of the etchant 5 is the same for each spray nozzle 41a to 41e for each processing area. Is also possible.

  FIG. 11B shows an example in which the etching liquid spray and the fluid 46 for controlling the temperature of the surface of the mold 2 are alternately sprayed from the etching liquid spray nozzle 41. That is, the pipe P2 is connected to the jet nozzle 41 in addition to the pipe P1, and the etching liquid or fluid ejected from the jet nozzle 41 is switched by a valve (not shown). According to this example, the same effect as in FIG. 11A can be obtained, and the temperature adjusting nozzle 47 can be omitted. Similarly to FIG. 11A, when the spraying time (period) of the etching solution 5 is sufficiently short with respect to the spraying time (period) of the fluid 46, the temperature of the etching solution 5 is set to each spray for each processing area. It is also possible to use the same nozzle 41a-e.

  FIG. 12 shows a case where an irradiation lamp 49 for controlling the processing surface temperature of the mold 2 is installed in addition to the injection nozzle 41. Each processing surface temperature can be adjusted by the radiant heat of the irradiation lamp 49. As a result, the temperature at the boundary of the processed surface can be controlled with higher accuracy, so that more uniform uneven processing can be performed than when processing is performed only by adjusting the temperature of the etching solution 5. Irradiation by the irradiation lamp 49 may be always performed during processing, but it is also possible to control the processing surface temperature by blinking at regular intervals. In any case, the processing surface temperature can be arbitrarily adjusted by adjusting the irradiation intensity of the irradiation lamp 49. Further, by using the irradiation characteristics of the irradiation lamp 49, it is also possible to provide the processing surface temperature with strength and to determine the same irradiation intensity area as the processing area section.

  Further, by moving the irradiation lamp 49 relative to the mold 2, it is possible to irradiate a large area with a small number of irradiation lamps 49. In addition, the etching solution 5 can be sprayed during the irradiation of the lamp, but it is also possible to perform processing by alternately switching the irradiation of the irradiation lamp 49 and the spraying of the etching solution 5 for a certain period. When the intensity of the irradiation lamp 49 is sufficiently large, or when the spray time of the etching solution 5 is sufficiently short compared with the irradiation time of the irradiation lamp 49, the etching solution 5 is changed in the same manner as in FIG. The temperature can be the same for each of the spray nozzles 41a to 41e. The lamp used for the irradiation lamp 49 may be any lamp that emits light having a wavelength that contributes to heating of the processed surface, such as a far infrared lamp or a near infrared lamp.

  Each of the nozzles shown in FIGS. 10 to 12 may be such that the workpiece or the nozzle itself remains at a fixed position on the target processing surface. More preferably, it is desirable not to stay at a fixed position but to move relatively in either direction on the target machining surface. For example, when the nozzle position is fixed, it is desirable that the object to be processed move relative to the mold 2 by rotating or swinging when the object to be processed is fixed. Can also be adjusted.

  FIG. 13 shows an example in which the mold 2 to be processed is placed on the turntable 51 and the etching solution 5 is sprayed and processed while the turntable 51 is rotated. At this time, the number of injection nozzles 41 may be one or plural. In the present embodiment, three injection nozzles 41 are used. The mold 2 may be simply placed on the rotary table 51, but it is desirable to fix the mold 2 so that it does not move during rotation. The mold 2 to be processed may be placed at the rotation center of the rotary table 51. However, when the etching solution 5 and sludge generated during the processing are positively discharged, it is not necessary to increase the rotational speed of the rotary table 51. Since a larger centrifugal force can be obtained, it is desirable to place it away from the center of rotation. Further, when the etching solution 5 and the sludge are discharged in a random direction and the processing depth is more uniform, the mold 2 to be processed is in planetary motion, that is, the mold 2 itself rotates on the rotary table 51. However, the rotary table 51 itself may also be rotated.

  FIG. 14 shows an example in which the etching solution 5 and sludge are discharged by the liquid cutting nozzle 56 that injects the gas fluid 55 onto the surface of the mold 2. The liquid draining nozzle 56 communicates with a gas fluid supply device (not shown) through the pipe P4. In order to efficiently discharge the etching solution 5 and sludge, it is desirable to use a system that can freely fix the ejection strength and position of the liquid discharge nozzle 56, for example, a flexible pipe. In order to perform liquid draining quickly and precisely, it is desirable to use a device that moves the liquid draining nozzle 56, such as the liquid draining nozzle 56 shaking the neck. The liquid cutting nozzle 56 may be a linear flow type, a cone type or a parallel flow type. Moreover, you may use the slit nozzle from which a wide jet is obtained.

  When performing etching using the liquid cutting nozzle 56, first, the etching liquid 5 is sprayed from the spray nozzle 41 for a certain period of time. Thereafter, the injection of the etching solution 5 is once stopped, the gas fluid 55 is sprayed from the liquid draining nozzle 56, and the excess etching solution 5 and sludge can be discharged. Any gas fluid can be used for spraying from the liquid cutting nozzle 56, but inexpensive air is preferable. Although it is possible to inject a liquid or a gas-liquid two phase, it is desirable to select a liquid that dilutes or neutralizes the etching solution 5 in order to suppress unintended etching processing by the etching solution 5 in that case. . Industrially, water or the like can also be applied.

  The injection nozzle 41 and the liquid cutting nozzle 56 may move together as long as the etching liquid 5 and sludge can be removed at all positions on the processing surface. However, when moving integrally, after the spray nozzle 41 completes the spray of the etching solution 5, it is necessary to move the liquid drain nozzle 56 again to a position where the liquid drain is necessary. For this reason, it takes time to switch between the injection of the etching solution 5 and the injection of the gas fluid 55 for draining. Therefore, it is desirable that the liquid cutting nozzle 56 be moved independently so that the switching between the spraying of the etching liquid 5 and the spraying of the gas fluid 55 for liquid cutting can be performed quickly.

  FIG. 15 shows an example using the same liquid cutting nozzle 56, but the mold 2 to be processed is rotated while the liquid cutting nozzle 56 is fixed. By rotating the mold 2 to be processed, the moving device for the liquid cutting nozzle 56 and the etching liquid injection nozzle 41 is not necessary, and the structure can be simplified.

  Specific examples will be described below by taking a processing test in a prototype block assuming a mold having a three-dimensional free-form surface as an example. FIG. 16 shows the shape of the block 150 used in the test. The shape of the block 150 is a three-dimensional shape in which the curved portions of the four corners of the top portion are configured with different curvatures, and the curved portions continuously change along the ridge line continuously and smoothly between the corners. Is made. Each dimension is one side length a = d = 100 mm, height b = 80 mm, machining height c = 50 mm, radius of each corner (three dimensions) e = R10 mm, f = R20 mm, g = R30 mm, h = R40 mm.

  As a result of performing the processing test in Table 1, the time required for processing was listed and compared. In each of FIGS. 16A and 16B, a test was performed in which unevenness processing was performed on a portion (surface) indicated by oblique lines, and each processing depth of A (horizontal portion) B (R portion) C (vertical portion) was compared. All of the blocks 150 are the same die steel SKD61 and are not subjected to heat treatment such as quenching. The surface roughness of the block 150 is 25S on a normal machined surface.

  The size of the protrusion formed on the surface of the block 150 is a cylindrical protrusion, arranged in a staggered manner at a pitch 1.3 times the diameter of the protrusion, and a diameter of 3 mm and a pitch of 4 mm (hereinafter referred to as φ3p4). did. Moreover, the height of the convex part was 0.5 mm.

  The results are shown in Table 1. As an evaluation, when the ratio of the depth of A to the depth of C of the convex heights of each surface is within 1.5, the processing is more uniform as the value is closer to 1, It was considered better.

  In the prior art, the projection of φ3p4 was processed at a height of 0.5 mm for the block 150 in FIG. A vinyl chloride sheet that is thermoplastic is used as the sheet, and a sheet having a thickness of 0.5 mm that is not torn in vacuum forming in the block shape is used. On the sheet, a concavo-convex pattern of φ3p4 was printed with black ink (oil). At this time, the elongation of the sheet at the time of vacuum forming is measured in advance, and the uneven pattern at the time of planar printing of the sheet is such that the uneven pattern becomes φ3p4 when the sheet forms a three-dimensional masking after vacuum forming. A pattern having a concavo-convex shape obtained by partially deforming was printed.

  First, the block 150 to be processed was formed by spraying uniformly with a thickness of 0.1 mm using a photo-curing resin that is firmly cured and fixed by irradiation with light of ultraviolet wavelength as a resist film. . A chemical-resistant protective film is attached to the portion where the unevenness is not processed so that it is not eroded by later etching.

  The block 150 with the resist film and the protective film is subjected to patterning with a photoresist by the vacuum forming apparatus 8 shown in FIG. 9, and further subjected to chemical etching with a ferric chloride solution, which is wet etching, to a predetermined depth. Etching is performed with the target of 0.5 mm. Three-dimensional masking was performed by vacuum forming. The heating temperature of the sheet during vacuum forming was 150 ° C., and the negative pressure of the vacuum apparatus was −0.02 MPa.

  Etching was performed by spraying a ferric chloride solution onto each surface with a plurality of nozzles in a tank with a patterned resist film. In order to increase the chemical reaction rate of chemical etching, the ferric chloride solution is heated and kept at 40 ° C.

  In Example 1, the processes other than the etching process are performed by performing the same process as that of the conventional technique. For the etching process, the apparatus shown in FIG. At this time, five spray nozzles 41 are provided, and one spray nozzle 41a is disposed so as to spray from the horizontal plane side of the block 150 to the horizontal plane. The other four nozzles 41b to 41e were arranged so as to inject with respect to each vertical plane. The injection pressure and the injection amount of the injection nozzle 41 were adjusted so that the etching solution 5 was sprayed evenly in the range of each surface. The temperature of the etching solution was 30 ° C. for all.

  In the second embodiment, the same apparatus as shown in FIG. 10A is used as in the first embodiment, and the temperature of the etching solution 5 is 30 through the heat exchanger 43 and from one nozzle 41a to the upper surface of the block 150. At 4 ° C, the four nozzles 41b to 41e with respect to the vertical surface were jetted at 45 ° C.

  In Example 3, the apparatus shown in FIG. 10B is used. Here, not the temperature of the etching solution 5 but the concentration of the etching solution 5 is different for each surface, and the concentration ratio from one nozzle 41a to the horizontal surface 2b is 1, and the four nozzles 41b to 41e with respect to the vertical surface Injection was performed with a concentration ratio of 1.2. Excess processing liquid was collected by the suction nozzle 45 in each plane.

  In Example 4, etching was performed with the apparatus shown in FIG. The other processes are the same as in the prior art. Here, five nozzle units each including an etching liquid injection nozzle 41 and a temperature adjustment nozzle 47 for adjusting the processing surface temperature are provided. One nozzle unit was arranged to inject from the horizontal plane side of the block 150 to the horizontal plane, and the other four nozzle units were arranged to inject to each vertical plane. The temperature of the processing surface temperature adjusting water is adjusted by passing through the heat exchanger 48 for each nozzle unit. The water jetted from one nozzle unit for the upper surface of the block 150 was jetted at 45 ° C., and the four nozzle units for the vertical plane were jetted as 60 ° C. The temperature of the etching solution 5 was passed through the heat exchanger 43 so that it was jetted at 30 ° C. from one nozzle 41a for the horizontal plane and 45 ° C. from the four nozzles 41b to 41e for the vertical plane. The injection pressure and the injection amount were adjusted so that the etching solution 5 and the water were sprayed evenly in the range of each surface.

  First, water for adjusting the processing surface temperature was continuously sprayed until the temperature of the block 150 to be processed became substantially constant, and after stopping, the etching liquid was sprayed for 1 minute. Then, a series of switching between water injection and etching solution injection was repeated, and uneven processing up to a predetermined depth was performed. Incidentally, as shown in FIG. 11B, the temperature control nozzle 47 and the etching solution injection nozzle 41 are made the same nozzle, and water and the etching solution 5 are alternately switched from the same etching solution injection nozzle 41 and injected. Results.

  In Example 5, etching was performed with the apparatus shown in FIG. The other processes are the same as in the prior art. At this time, five injection nozzles 41 are provided, one injection nozzle 41a is arranged to inject from the horizontal plane side of the block 150 to the horizontal plane, and the other four injection nozzles 41b to 41e are arranged on each vertical plane. It arranged so that it might inject to. The injection pressure of the injection nozzle 41 and the injection amount were adjusted so that the etching solution was sprayed evenly in the range of each surface. In addition to the injection nozzle 41, five infrared lamps are provided as the irradiation lamp 49. One irradiation lamp 49a was arranged to irradiate the horizontal plane from the horizontal plane side of the block 150, and the other four irradiation lamps 49b to 49e were arranged to irradiate each vertical plane. And the irradiation intensity | strength of the irradiation lamp 49 was adjusted, the horizontal surface was adjusted to 40-45 degreeC, and each vertical surface was adjusted to 65-70 degreeC. The temperature of the etching solution 5 was passed through the heat exchanger 43 so that it was jetted at 30 ° C. from one jet nozzle 41a for the horizontal plane and 45 ° C. from the four jet nozzles 41b to 41e for the vertical plane. The irradiation time required for raising the temperature of each processed surface was set to 5 minutes, the irradiation lamp 49 was turned off after the heating was completed, and then the etching solution 5 was sprayed for 1 minute. By repeating the series of irradiation of the irradiation lamp 49 and the injection of the etching solution 5, the unevenness processing to a predetermined depth is performed.

  In Example 6, etching was performed using the apparatus shown in FIG. The other processes are the same as in the prior art. Here, three spray nozzles 41 for spraying the etching solution 5 are provided. One was injected from the horizontal plane side toward the horizontal plane, and two were arranged diagonally at 45 ° toward the center of the rotary table 51 and injected toward the rotating vertical plane. The rotation speed of the rotary table 51 is 100 rpm, the plane gravity center position of the processing target block 150 and the rotation center of the rotary table 51 are matched and fixed, and the rotary table 51 rotates together. The etching solution 5 was sprayed at 45 ° C. from each spray nozzle 41 by passing through the heat exchanger 43.

  In Example 7, etching was performed using the apparatus shown in FIG. The other processes are the same as in the prior art. Here, five nozzle units including the liquid cutting nozzle 56 and the spray nozzle 41 that can be swung are provided. One nozzle unit was arranged so as to eject and drain from the horizontal plane side of the block 150 to the horizontal plane, and the other four nozzle units were arranged so as to eject and drain from each vertical plane. A parallel jet type was used for the liquid cutting nozzle 56, and air was blown onto the block to be processed at a flow rate of 10 m / s so that sludge and excess etching solution 5 could be removed. First, after the etching solution 5 was sprayed for 10 seconds, air was sprayed from the liquid cutting nozzle 56 for 10 seconds while shaking the neck of the liquid cutting nozzle 56. A series of spraying of the etching liquid 5 and switching of the liquid draining were repeated to perform uneven processing up to a predetermined depth. At this time, the temperature of the etching solution 5 is 45 ° C. in any nozzle unit.

  In the eighth embodiment, the temperature of the etching solution 5 is set to 30 ° C. from one jet nozzle 41a with respect to the horizontal plane and 45 ° C. from the four jet nozzles 41b to 41e with respect to the vertical plane. It is a case where uneven | corrugated processing is carried out. Incidentally, even if the etching process is performed while rotating the mold on the rotary table 51 as shown in FIG.

  Example 9 is a case where the concave and convex processing was advanced under the same conditions as in Example 8 and processed deeper than Example 8.

  The results of Examples 1-9 are shown in Table 1. As shown in Table 1, with respect to the prior art, all of Examples 1 to 9 according to the present invention have an A / C value in the range of 0.5 to 1.5, and the surface of the three-dimensional mold is Uniform uneven processing was possible regardless of the level of the processed surface.

  The present invention is useful, for example, in producing a mold having a good uneven surface in the production of a hot press mold.

Process flow diagram of a method for manufacturing a hot press mold according to the present invention Explanatory drawing of uneven pattern printing process Illustration of sheet adhesion and molding process Illustration of sheet adhesion and molding process Explanatory drawing of exposure process Explanatory drawing of masking removal process of 3D shape Explanatory drawing of development process-etching process Explanatory drawing of process image with enlarged surface of machining surface Explanatory drawing of the masking molding apparatus by this invention Explanatory drawing of the etching apparatus by this invention Explanatory drawing of the etching apparatus by this invention Explanatory drawing of the etching apparatus by this invention Explanatory drawing of the etching apparatus by an Example Explanatory drawing of the etching apparatus by this invention Explanatory drawing of the etching apparatus by this invention Explanatory drawing of the block in a present Example Explanatory drawing of the metal mold to which the present invention is applied Explanatory drawing of the mold surface to which the present invention is applied Explanatory drawing of the etching equipment which dripping etching liquid from the upper part

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet 1a Print sheet 1b Softening sheet 2 Mold 3 Three-dimensional masking 4 Resist film 4a Curing / fixing resist film 5 Etching solution 6 Light 7 Developer 8 Vacuum forming device 9 Base 10 Suction hole 11 Opening portion 15 Exposure lamp 21 Base 22 Softening device 23 Exposure device 24 Masking molding device 31 Vacuum space 32 Rail 33 Slide device 34 Clamp 35 Heater 36 Ref plate 37 Case 38 Guide device 41 Injection nozzle 43 Heat exchanger 45 Suction nozzle 46 Fluid 47 Temperature adjustment nozzle 48 Heat exchanger 49 Irradiation lamp 51 Rotary table 55 Gas fluid 56 Liquid cutting nozzle P1 piping P2 piping P3 piping P4 piping

Claims (8)

Soften the sheet on which the pattern of the processed shape to be applied to the surface of the three-dimensional mold is formed,
The softened sheet is adhered to the surface of the mold or the same shape of the mold, and then the sheet is cured to form a three-dimensional masking;
The mask of the three-dimensional shape is brought into close contact with the mold on which a resist film is formed, and the pattern of the processed shape is transferred to the resist film by exposure and developed.
A method for producing a hot press molding die , wherein a gap serving as a flow path is provided on the surface of the mold by forming a pattern of the processed shape transferred to the mold by an etching solution on the surface of the mold. There,
Etching liquid is sprayed onto the mold surface by a plurality of spray nozzles, and one or more of the following (a) to (e) are controlled according to the level of the processed surface of the mold. A method for manufacturing a hot press mold.
(A) Temperature of etchant on the mold surface (b) Concentration of etchant (c) Flow rate of etchant on the mold surface (d) Residence time of etchant on the mold surface (E) Mold surface temperature The control of (a) is as follows:
The method of manufacturing a hot press molding die according to claim 1, wherein the temperature of the etching solution sprayed by the spray nozzle is controlled. The etching liquid is sprayed onto the mold surface.
Performed at the same time as the injection of air or water, or after the injection of air or water,
The heat according to claim 1 or 2, further comprising controlling one or more of the following (a) to (e) by controlling a temperature of the air or water to be injected. A method of manufacturing a mold for hot press molding.
(A) Temperature of etchant on the mold surface (b) Concentration of etchant (c) Flow rate of etchant on the mold surface (d) Residence time of etchant on the mold surface (E) Mold surface temperature The etching liquid is sprayed onto the mold surface at the same time as air is sprayed at a predetermined time interval.
The one or more of the following (a), (c), (d), and (e) are further controlled by controlling the air to be injected. A method for producing a hot press molding die according to any one of the above.
(A) Temperature of etchant on the mold surface (c) Flow rate of etchant on the mold surface (d) Residence time of etchant on the mold surface (e) Mold surface temperature The etching liquid is sprayed onto the mold surface.
Performed simultaneously with radiant heating to the mold surface,
5. The hot press-molding metal according to claim 1, wherein one or two of the following (a) and (e) are further controlled by controlling the radiant heating: 5. Mold manufacturing method.
(A) Temperature of the etching solution on the mold surface (e) Mold surface temperature The mold is given a centrifugal force by rotating,
The spray of the etching liquid onto the mold surface is performed simultaneously with the application of the centrifugal force to the mold or after the application of the centrifugal force,
The hot press molding according to any one of claims 1 to 5, wherein one or two of the following (c) and (d) are further controlled by controlling the centrifugal force: Mold manufacturing method.
(C) Flow rate of etchant on the mold surface (d) Residence time of etchant on the mold surface The pattern of the processed shape formed on the sheet is
It forms by printing the pattern of the said process shape on the said sheet | seat, The manufacturing method of the hot press molding metal mold | die in any one of Claims 1-6 characterized by the above-mentioned. An apparatus for processing a predetermined shape on the surface of a mold after processing the shape of a hot press molding mold,
An apparatus for softening a sheet on which a pattern of a processed shape applied to the surface of the mold is formed;
An apparatus for forming the softened sheet into a three-dimensional shape by vacuum forming;
An apparatus for transferring and developing a pattern of a processed shape of a sheet formed into a three-dimensional shape by exposure to a resist film formed on the mold surface;
A hot press molding die comprising: an apparatus for removing an unnecessary surface of a mold surface by the etching method according to any one of claims 1 to 6 and processing an uneven shape on the mold surface. Mold manufacturing equipment.

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