JP4963336B2 - Heat treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat treatment equipment.
[0002]
[Prior art]
In the manufacture of semiconductor devices, various heat treatment apparatuses are used for performing heat treatments such as oxidation, diffusion, CVD, and annealing on an object to be processed such as a semiconductor wafer. This heat treatment apparatus accommodates a semiconductor wafer in a processing container having an exhaust port, and performs a predetermined heat treatment such as a CVD process in a predetermined processing gas atmosphere.
[0003]
In particular, when processing under reduced pressure is possible and the exhaust port is made of quartz, an exhaust pipe is connected to an end surface of the exhaust port via an O-ring as an airtight material. Specifically, flange portions are respectively provided at the connection ends of the exhaust port and the exhaust pipe, and an O-ring is interposed between the flange portions. In this case, in order to suppress thermal deterioration of the O-ring, it is necessary to provide a cooling portion, for example, a cooling water passage, in the vicinity of the O-ring, for example, the flange portion of the exhaust pipe.
[0004]
[Problems to be solved by the invention]
However, in the heat treatment apparatus, heat is released to the outside from the connection part (flange part) of the exhaust port and the exhaust pipe, and the temperature near the end surface of the exhaust port is lowered. When the processing gas component comes into contact, it tends to adhere as a by-product due to condensation. When the vicinity of the end face of the exhaust port is actively cooled by the cooling water passage, the by-product is more likely to adhere. When a by-product adheres to the vicinity of the end face of the exhaust port and the by-product becomes particles and flows back into the processing container, the semiconductor wafer may be contaminated.
[0005]
The present invention has been made in consideration of the above circumstances, provide a heat treatment equipment which can suppress the deposition of by-product in the vicinity of the end surface of the exhaust port of the processing chamber to prevent particle contamination of the object to be processed The purpose is to do.
[0006]
[Means for Solving the Problems]
Vicinity of the present invention is to accommodate the object to be processed into the processing chamber connected to the exhaust pipe via the first hermetic material to the end face of the exhaust port of the processing chamber for performing a predetermined heat treatment, the first hermetic material Provided with a cooling water passage for suppressing thermal degradation, and a plurality of gas blown out from the inner peripheral surface of the gas passage on the outer peripheral side in order to suppress adhesion of by-products near the end face of the exhaust port. in the heat treatment apparatus of the inner tube is provided in a predetermined range of the exhaust mouth from an exhaust pipe having a gas blowout unit, connected between the exhaust port exhaust pipe is extended on the exhaust pipe side from the position of the exhaust port side end portion of the inner tube Provided with a cylindrical extension part that contacts the inner periphery of the periphery of the part and covers the inner periphery, and a tip for smoothly introducing exhaust gas into the inner pipe at the inner periphery of the tip part of the cylindrical extension part A tapered portion that gradually increases in diameter toward the tip, and from the rear end of the tapered portion to the tip of the inner tube The extending portion to form a gap for blown gas from the gas passage between the inner tube is provided extending inwardly of the exhaust pipe and the downstream tip outer periphery of the tubular extension portion A second airtight member is interposed between the periphery and the cooling water passage .
[0008]
It is preferred before SL gas is an inert gas which is temperature warm suppress adhesion of by-products.
[0009]
It is preferred before SL gas is a cleaning gas.
[0012]
It pre Symbol processing vessel from a single tubular structure of the vertical, it is preferable to provide the air outlet on the top.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing a configuration of a heat treatment apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view showing a main part of the heat treatment apparatus, FIG. 3 is a diagram showing a configuration of an inner tube, and FIG. Sectional drawing of a front-end | tip member, (b) is sectional drawing of an intermediate member, (c) is sectional drawing of a rear-end member.
[0015]
In FIG. 1, reference numeral 1 denotes a vertical heat treatment apparatus. The heat treatment apparatus 1 includes a processing container (process tube) 2 for accommodating a plurality of objects to be processed such as a semiconductor wafer w from below and performing a predetermined heat treatment such as a CVD process. I have. The processing container 2 has a vertical single tube structure and is formed of a material having heat resistance and corrosion resistance, for example, quartz glass.
[0016]
A lower end portion of the processing vessel 2 is opened as a furnace port, and a flange portion (opening flange portion) 4 is formed on the outer periphery of the furnace port (opening) 3. A gas introduction pipe 5 for introducing a processing gas and an inert gas for purging the inside of the processing container, for example, nitrogen (N ₂ ) gas, is provided in an airtight manner in the lower portion of the processing container 2, in the illustrated example, the flange portion 4. The gas introduction pipe 5 is connected to a gas supply system pipe (gas supply pipe) (not shown) for supplying a processing gas and an inert gas at a predetermined flow rate. The upper end portion (top portion) of the processing vessel 2 is reduced in diameter, and an inverted L-shaped exhaust port (exhaust port) 6 is formed in the center portion, which rises upward and opens toward one side. An exhaust system pipe (exhaust pipe) 7 to be described later is connected to the port 6.
[0017]
A heater 8 for heating the wafer w in the processing container 2 to a predetermined heat treatment temperature is provided around the processing container 2. The heater 8 includes a water cooling jacket 9 that surrounds and surrounds the processing vessel 2, and a resistance heating element 10 is disposed on the inner periphery of the water cooling jacket 9. The water cooling jacket 9 is provided with a resistance heating element (upper heating part) 11 for heating the upper part of the processing vessel 2 and a resistance heating element (exhaust opening heating part) 12 for heating the periphery of the exhaust port 6.
[0018]
The heater 8 has an annular bottom plate 13 and is installed on the base plate 14 via the bottom plate 13. An annular support 15 is attached to the lower surface of the opening flange portion 4 of the processing container 2 via a flange retainer 16, and this support 15 is attached to the bottom plate 13 of the heater 8 via an attachment member 17. Yes.
[0019]
In order to mount and hold a large number of, for example, about 25 to 150 semiconductor wafers w in the processing container 2 at a predetermined interval in the height direction, the wafers w are held by a boat 18 made of, for example, quartz glass. Yes. A lid 19 made of, for example, SUS for sealing the furnace port (opening) 3 of the processing container 2 is provided below the processing container 2.
[0020]
A thermo plug 20 is provided on the lid 19 as a heat insulating means (furnace port heat insulating means) for suppressing heat radiation from the furnace port 3 of the processing vessel 2 in the illustrated example. The thermo plug 20 is mainly composed of a plurality of leg columns 21 standing on the lid body 19 and a lower heating unit 22 made of a resistance heating element provided substantially horizontally at the upper end of the leg columns 21. It is configured. A mounting table 23 for mounting the boat 18 at a position higher than the thermo plug 20 is provided on the lid 19. The mounting table 23 has a column 24 that rises loosely from the center of the lid 19 through the center of the thermoplug 20. A rotating mechanism 25 for horizontally rotating the mounting table 23 via a support column 24 is provided at the lower part of the lid body 19.
[0021]
Below the processing container 2, an elevating mechanism 26 is provided for raising and lowering the lid body 19 to open and close the lid body 19 and to load (unload) the boat 18 into and out of the processing container 2. In addition, a loading area 27 as a work area is provided. The upper surface of the lid 19 is preferably covered with a cover material 28 made of, for example, quartz glass in order to prevent corrosion due to contact with corrosive gas.
[0022]
On the other hand, the exhaust pipe 7 includes a horizontal pipe 30 connected to an end surface 6a of the exhaust port 6 of the processing container 2 via an O-ring 29 which is an airtight material, and the horizontal pipe 30 downwardly via an elbow 31. An exhaust trap 33 is provided at the lower end portion of the vertical pipe 32 for capturing a by-product of the processing gas component from the exhaust gas. Since the exhaust trap 33 is in a low position, maintenance such as element replacement can be easily performed. Since the processing vessel 2 has a single-pipe top exhaust structure and the exhaust port 6 is at a high place, the by-product is postponed and captured by the low-level exhaust trap 33 by measures for by-products of the exhaust port 6 described later. As a result, the maintenance of the exhaust port 6 and the maintenance of the exhaust trap 33 can be reduced, and the maintainability can be improved.
[0023]
A pressure variable valve 34 and a pressure reducing pump 35 that can be opened and closed and adjusted in flow rate are provided downstream of the exhaust trap 33 in the exhaust pipe 7 so that the pressure in the processing container 2 can be controlled to a predetermined pressure reducing processing pressure. It is configured. The exhaust pipe 7 is made of, for example, a pipe made of SUS, preferably a pipe whose inner surface is coated with a fluorine-based resin coating material.
[0024]
As shown in FIG. 2, flange portions 36 and 37 are provided at the connection ends of the exhaust port 6 and the exhaust pipe 7, and O is a first airtight material between the opposing surfaces of the flange portions 36 and 37. A ring 29 is interposed, and in the vicinity of the O-ring 29, a cooling water passage 39 is provided as a cooling unit for suppressing thermal deterioration. In the illustrated example, an O-ring 29 is provided on the flange 37 side of the exhaust pipe 7, and a cooling water passage 39 is provided so as to approach the O-ring 29. The flange portions 36 and 37 are fastened by a clamp mechanism (not shown).
[0025]
In the heat treatment apparatus 1, the exhaust port 6 is provided at the top of the processing vessel 2, and the vicinity of the end surface 6 a of the exhaust port 6 is cooled by the cooling water passage 39 that cools the O-ring 29. In addition to the gas components coming into contact and easily attaching by-products, the by-products may fall into particles from the exhaust port 6 onto the wafer w in the processing container 2 and contaminate the wafer w. is there. Therefore, in order to prevent adhesion of by-products in the vicinity of the end surface 6a of the exhaust port 6 of the processing container 2 and prevent particle contamination of the wafer w, a plurality of gas blowing portions 40 for blowing gas from the inner peripheral surface are provided. An inner pipe 41 is provided in a predetermined range in the exhaust pipe 6, in the illustrated example, from the horizontal pipe 30 to the exhaust port 6.
[0026]
An annular gas passage 42 is formed between the inner pipe 41 and the inner periphery of the exhaust pipe (exhaust port 6 and horizontal pipe 30). In the horizontal pipe 30, a gas such as an inert gas, preferably nitrogen is passed through the gas passage 42. A gas supply port (gas supply port) 43 for supplying (N ₂ ) gas is provided. A gas supply source is connected to the gas supply port 43 via a flow rate adjusting mechanism (not shown).
[0027]
In order to prevent gas from leaking from both ends of the gas passage 42, the inner periphery of the exhaust pipe is provided at the exhaust port side front end portion (front end member) and the exhaust pipe side rear end portion (rear end member) of the inner pipe 41. O-rings 44 and 45, which are second and third airtight materials for sealing between the two, are disposed. These O-rings 44 and 45 and before Symbol O-ring 29 is preferably made of a material such as fluorine-based resin having heat resistance. The exhaust gas flowing into the exhaust pipe 7 from the inside of the processing container 2 through the exhaust port 6 is hot in the processing container 2, but the temperature is lowered by natural heat radiation as it proceeds in the exhaust passage in the flow direction. The ring 45 is less likely to be thermally degraded, but the upstream O-ring 44 is likely to be thermally degraded. Therefore, in order to prevent thermal deterioration of the O-ring 44 at the exhaust port side tip, the exhaust port side tip of the inner tube 41 extends from the outer periphery to the exhaust tube side (horizontal tube side). An outlet 46 is provided, and an O-ring 44 is interposed between the cylindrical extension 46 and the inner periphery of the exhaust pipe 7 so as to approach the cooling water passage 39.
[0028]
Specifically, as shown in FIG. 3, the inner pipe 41 includes an annular front end member 41a disposed upstream in the exhaust gas flow direction, an annular rear end member 41c disposed downstream, and the distal ends thereof. It is comprised from the some cyclic | annular intermediate member 41b interposed between the member 41a and the rear-end member 41c. A female screw portion 47 is provided on the inner periphery of the front end side of the intermediate member 41b, and a male screw portion 48 having a screw pitch that can be screwed with the female screw portion 47 is provided on the outer periphery of the rear end side of the intermediate member 41b. The intermediate member 41 b is provided with a plurality of vent holes 49 in the circumferential direction on the downstream side adjacent to the female screw portion 47.
[0029]
The inner peripheral surface of the intermediate member 41b is a substantially horizontal flat surface 50 on the upstream side (the position of the female screw portion and the vent), but the downstream side is a tapered surface 51 that is gradually reduced in diameter. Further, an outer peripheral surface (step portion) 52 having a smaller diameter than the inner peripheral flat surface 50 on the distal end side is formed on the intermediate member 41b adjacent to the male screw portion 47 on the downstream side. With such a configuration, the plurality of intermediate members 41b can be connected in the longitudinal direction by screwing the male screw portion 48 of the other intermediate member 41c into the female screw portion 47 of the one intermediate member 41b, and an annular gas The gas that has entered the vent hole 49 from the passage 42 passes along the inner peripheral surface of the inner pipe 41 from the gap (gas blowing portion) 40 between the one front end side inner peripheral flat surface 50 and the other rear end side outer peripheral surface 52. It is blown out downstream.
[0030]
The rear end member 41 c is provided with a female screw portion 53 that is screwed into the male screw portion 48 of the intermediate member 41 b on the inner periphery on the front end side, and a plurality of vent holes on the downstream side adjacent to the female screw portion 53. 54 is provided in the circumferential direction. Further, a flange portion 55 is formed on the outer periphery of the rear end side of the rear end member 41c, and the O-ring 45 that seals the gap between the flange portion 55 and the inner periphery of the horizontal pipe 30 is interposed. Has been.
[0031]
The distal end member 41a is provided with an annular engagement groove 56 that engages with the distal end portion of the intermediate member 41b, and the cylindrical extending portion 46 that extends from the outer periphery to the downstream side. . The engaging groove 56 may be formed with a male screw portion into which the female screw portion 47 of the intermediate member 41b is screwed. The cylindrical extension 46 covers the outer periphery of one or several adjacent intermediate members 41b, and the annular gas is between the outer periphery of the intermediate member 41b and the inner periphery of the cylindrical extension 46. An annular gas passage 57 communicating with the passage 42 is formed. Further, in the inner periphery of the tip member 41a, there is a gap (gas blowing portion) for blowing the gas that has entered the vent hole 49 of the intermediate member 41b from the gas passage 57 to the downstream side along the inner peripheral surface of the intermediate member 41b. ) 40 is formed between the intermediate member 50 and the inner flat surface 50 of the intermediate member.
[0032]
The outer periphery of the tip member 41 a and the outer periphery of the cylindrical extension 46 are in contact with the inner periphery of the exhaust port 6 and the inlet-side inner periphery of the horizontal pipe 30. Further, a tapered portion 59 is formed on the inner periphery of the tip member 41a. The taper portion 59 gradually increases in diameter toward the tip in order to smoothly introduce the exhaust gas from the exhaust port 6 into the inner tube 41. In the illustrated example, an O-ring 44 is interposed between the outer periphery of the downstream end of the cylindrical extension piece 46 and the inner periphery of the horizontal tube 30, so that the inner periphery of the horizontal tube 30 has its inlet. A step portion 60 having a diameter larger than that of the side inner periphery is provided. However, if the O-ring 44 is embedded in the inner periphery of the horizontal tube 30, the step portion 60 is not necessarily provided.
[0033]
Heating portions such as pipe heaters 61 and 62 that heat the exhaust pipe near the end face 6a of the exhaust port 6, that is, the outer periphery of the exhaust port 6 and the outer periphery of the horizontal tube 30 at a temperature that suppresses adhesion of by-products, for example, about 250 ° C. Is preferably provided. Moreover, it is preferable that the same heating part, for example, the flange heaters 63 and 64, is provided on the surface (back surface) opposite to the opposing surfaces of the flanges 36 and 37 of the exhaust port 6 and the horizontal pipe 30. Furthermore, it is preferable that the gas is an inert gas, for example, nitrogen gas, heated to a temperature that suppresses adhesion of by-products.
[0034]
Next, the operation of the heat treatment apparatus having the above configuration and the heat treatment method will be described. When the transfer of the wafer w from the cassette (not shown) to the boat 18 is completed in the loading area 27, the boat 18 is loaded into the processing container 2 from the lower furnace port 3 by the ascending / descending mechanism 26 ascending the lid body 19. 3 is hermetically closed with a lid 19.
[0035]
Then, the inside of the processing container 2 is controlled to a predetermined pressure or degree of vacuum by depressurization exhausted by the exhaust pipe 7 connected to the exhaust port 6 and controlled to a predetermined processing temperature by the heater 8. Then, a processing gas is introduced into the gas introduction pipe 5 to start a predetermined heat treatment such as a CVD process on the wafer w. When the heat treatment is completed, the introduction of the processing gas is stopped, the inside of the processing container 2 is purged by the introduction of the inert gas, the lid 19 is lowered to open the inside of the processing container 2 and the boat 18 is opened. What is necessary is just to unload to the loading area 27.
[0036]
According to the heat treatment apparatus 1, since the processing vessel 2 has a single tube structure and a heat capacity smaller than that of the double tube structure, the characteristics of the heater 8 capable of rapid temperature rise and fall can be fully utilized. Improve ability. In addition, since the processing gas is introduced into the processing container 2 from the gas introduction pipe 5 provided on the lower side of the processing container 2, the processing gas is exhausted from the exhaust port 6 provided on the top of the processing container 2. A straight and uniform gas flow (upward flow) without a single flow or a biased flow from the lower side to the upper side in the processing container 2 can be formed, and the wafer w can be uniformly processed in the surface, thereby improving the yield and processing. Improve ability.
[0037]
In particular, the exhaust pipe 7 is connected to the end surface 6 a of the exhaust port 6 via an O-ring 29 and a cooling unit 39 is provided in the vicinity of the O-ring 29, so that by-products adhere to the vicinity of the end surface 6 a of the exhaust port 6. An inner tube 41 having a plurality of gas blowing portions 40 for blowing out gas from the inner peripheral surface to suppress gas is provided in a predetermined range from the exhaust pipe 7 to the exhaust port 6, and along the inner peripheral surface of the inner tube 41. By flowing gas, the adhesion of by-products in the vicinity of the end surface 6a of the exhaust port 6 is suppressed, so that the adhesion of by-products in the vicinity of the end surface 6a of the exhaust port 6 of the processing vessel 2 is suppressed. Particle contamination of w can be prevented, and the yield and processing capacity can be improved.
[0038]
Further, if a heating unit, for example, pipe heaters 61 and 62 for heating the exhaust pipe near the end surface 6a of the exhaust port 6 to a temperature that suppresses adhesion of by-products is provided, by-products near the end surface 6a of the exhaust port 6 are provided. Can be further suppressed, and the problem of particle contamination of the wafer w can be solved. Furthermore, if an inert gas heated to a temperature that suppresses by-product adhesion is used as the gas, adhesion of by-products in the vicinity of the end surface 6a of the exhaust port 6 of the processing vessel 2 can be further suppressed. And the problem of particle contamination of the wafer w can be solved.
[0039]
FIG. 4 is a cross-sectional view showing a reference example of an inner tube that is not an embodiment of the present invention . In this figure, the same parts as those of the above embodiment are given the same reference numerals, and the description thereof is omitted, and different parts are described. In the reference example of FIG. 4, no O-ring is provided between the cylindrical extension 46 at the tip of the inner pipe and the inner periphery of the horizontal pipe 30. Instead, the cylindrical extension 46 Is provided with a flange portion 65 that abuts and engages with a step portion 60 in the horizontal pipe 30. According to this, an O-ring can be made unnecessary.
[0040]
In the reference example which is not the embodiment of the present invention shown in FIG. 5, the distal end portion of the inner tube 41 is not provided with a cylindrical extending portion and an O-ring. The outer periphery of the tip portion (tip member) of the inner tube 41 is in contact with the inner periphery of the exhaust port 6, but a minute gap (tip) between the outer periphery of the tip portion of the inner tube 41 and the inner periphery of the exhaust port 6. By blowing out gas from the blowing part) 66, the adhering of by-products in the gap 66 is suppressed. In other words, the exhaust pipe side tip portion of the inner pipe 41 is provided with a tip blow-out portion 66 for blowing out gas so as to suppress adhesion of by-products between the inner periphery of the exhaust port 6, Adhesion of by-products that penetrate and adhere between the tip of the tube 41 and the inner periphery of the exhaust port 6 can be suppressed.
[0041]
Although the embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited to the above-described embodiments, and various design changes and the like can be made without departing from the scope of the present invention. is there. For example, in the above-described embodiment, an example in which the present invention is applied to a batch processing type vertical heat treatment apparatus is shown. However, the present invention according to claim 1 is not limited thereto, and for example, a horizontal heat treatment apparatus or a single wafer. It can also be applied to a heat treatment apparatus of the type. Moreover, although the example which provided the exhaust port in the top part of the process container and was made into the upper exhaust structure is shown in the said embodiment, this invention which concerns on Claim 1 is not limited to this, For example, the downward direction of a process container The present invention can also be applied to a bottom exhaust structure provided with an exhaust port. The heat treatment in the present invention includes, for example, oxidation, diffusion, annealing and the like in addition to CVD. In addition to the O-ring, for example, a metal seal or the like may be used as the airtight material.
[0042]
Further, the gas supplied to the inner pipe is not limited to the inert gas, and may be, for example, a cleaning gas. For example, ClF ₃ , NF ₃ , HCl, HF, F ₂ , and Cl ₂ can be used as the cleaning gas. Thereby, adhesion of by-products in the vicinity of the end face of the exhaust port of the processing container can be further suppressed, and the particle contamination problem of the wafer can be solved. In addition to the semiconductor wafer, for example, a glass substrate, an LCD substrate, or the like is applicable as the object to be processed.
[0043]
【Effect of the invention】
In short, according to the present invention, the following effects can be obtained.
[0044]
According to the present invention, the exhaust pipe is connected to the end face of the exhaust port of the processing container for accommodating the object to be processed in the processing container and subjected to predetermined heat treatment via the first airtight material, and the first airtight material A cooling water passage that suppresses thermal degradation is provided in the vicinity of the exhaust gas, and a plurality of gases are blown out from the inner peripheral surface of the gas passage on the outer peripheral side so as to suppress adhesion of by-products near the end surface of the exhaust port. in the heat treatment apparatus of the inner tube is provided in a predetermined range of the exhaust mouth from an exhaust pipe having a gas blowout unit, connected between the exhaust port exhaust pipe is extended on the exhaust pipe side from the position of the exhaust port side end portion of the inner tube A cylindrical extension that covers the inner circumference in contact with the periphery of the portion and covers the inner circumference , and smoothly introduces exhaust gas into the inner pipe at the inner circumference of the tip of the cylindrical extension. Provided with a tapered portion that gradually increases in diameter toward the distal end, and from the rear end of the tapered portion to the distal end of the inner tube Of extending inwardly extending portion to form a gap for blown gas from the gas passage between the inner tube is provided with a downstream distal end outer periphery of the tubular extension portion of the exhaust pipe Since the second hermetic material is interposed between the inner periphery and the cooling water passage, the adhesion of by-products in the vicinity of the end face of the exhaust port of the processing container is suppressed, and particle contamination of the object to be processed is prevented. While being able to prevent , thermal deterioration of the 1st airtight material and the 2nd airtight material can be prevented with a common cooling water passage .
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged sectional view showing a main part of the heat treatment apparatus.
FIGS. 3A and 3B are diagrams showing a configuration of an inner tube, in which FIG. 3A is a cross-sectional view of a front end member, FIG. 3B is a cross-sectional view of an intermediate member, and FIG.
FIG. 4 is a cross-sectional view showing a modified example of the inner tube.
FIG. 5 is a cross-sectional view showing a modified example of the inner tube.
[Explanation of symbols]
1 Heat treatment apparatus w Semiconductor wafer (object to be processed)
2 Processing container 6 Exhaust port 7 Exhaust pipe 29 O-ring (airtight material)
39 Cooling water passage (cooling part)
40 Gas outlet 41 Inner tube 44 O-ring (airtight material)
46 Cylindrical extension 66 Tip outlet

Claims (4)

An exhaust pipe is connected to the end face of the exhaust port of the processing container for accommodating a target object in the processing container and subjected to a predetermined heat treatment via a first hermetic material, and the thermal conductivity is provided in the vicinity of the first hermetic material. A cooling water passage for suppressing deterioration is provided, and a plurality of gas blowing portions for blowing out gas from the gas passage on the outer peripheral side from the inner peripheral surface in order to suppress adhesion of by-products near the end face of the exhaust port. In the heat treatment apparatus in which the inner pipe is provided in a predetermined range from the exhaust pipe to the exhaust outlet, the inner pipe extends from the position of the tip on the exhaust outlet side of the inner pipe to the exhaust pipe side and around the connection portion between the exhaust outlet and the exhaust pipe . A cylindrical extension part is provided in contact with the inner periphery to cover the inner periphery , and gradually toward the tip for smoothly introducing exhaust gas into the inner pipe at the inner periphery of the tip of the cylindrical extension. A tapered portion having an enlarged diameter is provided and extends from the rear end of the tapered portion to the inner end of the inner tube. The extending portion to form a gap for blown gas from the gas passage between the inner tube is provided with, the inner periphery of the downstream side tip outer periphery and the exhaust pipe of the tubular extending portion A heat treatment apparatus characterized in that a second hermetic material is interposed between the cooling water passages . The heat treatment apparatus according to claim 1 wherein said gas and said inert gas der Rukoto which is heated to suppress temperature adhesion of by-products. The heat treatment apparatus according to claim 1 wherein said gas and said cleaning gas der Rukoto. Wherein the processing container is made of single tubular structure of a vertical heat treatment apparatus according to claim 1, wherein that you have provided the exhaust port on the top.

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