JP4962903B2 - Utility supply device, moving body system, pattern forming apparatus, and moving body device - Google Patents

Description

  The present invention relates to a power supply device, a mobile body system, a pattern forming apparatus, and a mobile body device. More specifically, the present invention relates to a power supply device that supplies power to a mobile body, and a mobile body system including the power supply device. The present invention relates to a pattern forming apparatus including the moving body system, and a moving body device including a moving body and a power supply device.

  In recent years, in the lithography process in the manufacture of semiconductor elements, liquid crystal display elements, etc., step-and-repeat type reduction projection exposure apparatuses (so-called steppers) and step-and-scan type scanning projection exposure apparatuses (so-called scanning steppers). (Also called a scanner)) is used mainly. In this type of exposure apparatus, a driving device for driving a photosensitive object such as a wafer or a glass plate (hereinafter referred to as “wafer”) is levitated and supported on a surface plate by an air bearing or the like and is two-dimensionally supported by a two-axis linear motor. A coarse / fine movement structure wafer stage apparatus having an XY stage driven in-plane and a wafer table that holds a wafer on the XY stage and is finely driven in a Z-axis direction and an inclination direction by a voice coil motor or the like is used. It was done. Recently, a wafer stage apparatus having a single stage driven in a direction of six degrees of freedom by a linear motor or a voice coil motor has been developed.

  However, in the above-described wafer stage apparatus, wiring used for the linear motor and voice coil motor or piping (tube) used for the air bearing is connected to the stage from the outside. Wiring, pipes (tubes), and the like are dragged, and this is a factor that reduces the position controllability of the wafer.

  In order to improve this, for example, the linear motor that drives the stage is a moving magnet type, and connected to the stage by supplying pressurized gas from the surface plate side to support the stage floating on the surface plate. It is conceivable to eliminate the piping and wiring that are used (for example, see Patent Document 1).

  However, the configuration in which pressurized gas (compressed air or the like) is supplied from the surface plate side to the stage side described in Patent Document 1 is used for a stage that is scanned in a uniaxial direction (for example, the scanning direction) like a reticle stage of a scanner. Although it can be adopted relatively easily, it is difficult to adopt it for a wafer stage that requires two-dimensional movement. For this reason, in the wafer stage apparatus, the pressurized gas supply pipe must be connected to the stage, and this dragging of the pipe still causes a decrease in the position controllability of the stage. Of course, even in the reticle stage apparatus, when piping or the like must be connected to the reticle stage, there is a concern that the position controllability is similarly lowered.

JP 2001-20951 A

The present invention has been made under the circumstances described above. From the first viewpoint, the present invention is a power supply device that supplies power to the moving body, and is a first supply for supplying power to the moving body. A main body part having a path formed therein; and a pad member fixed to the main body part and sandwiched between the first surface and the second surface facing the movable body, wherein the pad member includes the first member And a hydrostatic bearing that maintains a predetermined interval between the second surface and the movable body-side supply path in which an opening end is formed on at least one of the first and second surfaces via the predetermined interval. supplying the utility, have a, a second supply passage formed in a state of communicating with the first supply passage, said main body portion includes a first portion in which the pad member is fixed to said first portion A second portion connected via an elastic portion, wherein the first supply path is the first portion. A first sub-supply passage provided in the minute, the second sub-supply passage and for power supply devices that have a provided in the second portion.

  According to this, the pad member fixed to the main body portion in which the first supply path for supplying the working force to the moving body is formed has a predetermined interval between the first and second surfaces facing the moving body. Communicating with the first supply path for supplying a working force through the predetermined interval to the static gas bearing portion to be maintained and the moving body side supply path having an opening end formed on at least one of the first and second surfaces And a second supply path formed in the above state. For this reason, each of the 1st supply path formed in the main-body part, the 2nd supply path formed in the pad member, and the mobile body side supply path in which the opening end was formed in at least one of the 1st, 2nd surface, respectively. The utility can be supplied to the moving body via the. In this case, since the first surface and the second surface are not in contact with the pad member, it is possible to supply the working force to the moving body without contact.

  From a second aspect, the present invention is a moving body system comprising: a moving body that moves while holding an object; and the utility supply device according to the present invention that supplies a utility force to the moving body.

  According to this, since the power supply device capable of supplying power without contact with the moving body is provided, the mobile body drags the tube for supplying power as in the conventional case. Compared with, it is possible to realize a highly accurate movement of the moving body.

  From a third aspect, the present invention is a pattern forming apparatus for forming a pattern on an object by irradiation with an energy beam, the patterning apparatus for irradiating the object with the energy beam; the mobile system of the present invention; Is a pattern forming apparatus.

  According to this, since the moving body system capable of moving the moving body with high accuracy is provided, it is possible to accurately irradiate the object with the energy beam by the patterning device.

According to a fourth aspect of the present invention, there is provided a moving body that moves along a moving plane that is parallel to a plane that includes first and second axes that are orthogonal to each other ; and use force feeder; a pipe connected to the for power supply device; and follows the moving object, the moving member and that holds and moves the for power supplying device and the pipe; said first axis before SL with the moving member together moves in a direction, the guide bar and having a vertical guide surface on the moving surface for guiding the movement of the said second axial direction of said moving member; provided on said moving member, predetermined between the guide surface And a bearing unit that maintains a distance.

According to this, the piping is connected to the power supply device that supplies the power to the moving body that moves along the moving surface in a non-contact manner, and the power supply device and the moving member that holds the piping are not in contact with each other. While following the above, move following the moving body. Thereby, unlike the conventional case, the moving body does not drag the piping, and the moving body can be moved with high accuracy. Further, the moving member is provided with a bearing portion, and this bearing portion maintains a predetermined distance from the guide surface of the guide bar that moves in the uniaxial direction together with the driving portion, so that the guide bar moves in the uniaxial direction. Accordingly, the drive unit can also be moved in the uniaxial direction.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a schematic configuration of an exposure apparatus 100 according to an embodiment of the present invention. The exposure apparatus 100 is a step-and-scan projection exposure apparatus. The exposure apparatus 100 includes a light source and an illumination optical system, and includes an illumination system IOP that illuminates the reticle R with illumination light IL, a reticle stage RST that holds the reticle R, a projection optical system PL, and a wafer stage WST that holds the wafer W. And a main control unit 20 that performs overall control of the entire apparatus.

  The illumination system IOP illuminates a slit-like illumination area extending in the X-axis direction on the reticle R defined by a reticle blind (not shown) with illumination light IL with a substantially uniform illuminance. Here, as the illumination light IL, for example, ArF excimer laser light (wavelength 193 nm) is used.

  On reticle stage RST, reticle R on which a circuit pattern or the like is drawn is fixed, for example, by vacuum suction. Reticle stage RST can be slightly driven in the XY plane perpendicular to the optical axis of illumination system IOP (which coincides with optical axis AX of projection optical system PL described later) by reticle stage drive system 23 for the position control of reticle R. In addition, it can be driven at a scanning speed designated in a predetermined scanning direction (here, the Y-axis direction).

  The position of the reticle stage RST in the moving plane is always detected by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 through the moving mirror 15 with a resolution of about 0.5 to 1 nm, for example. Position information of reticle stage RST from reticle interferometer 16 is sent to main controller 20. Main controller 20 drives reticle stage RST via reticle stage drive system 23 based on the position information of reticle stage RST. Instead of the movable mirror 15, a reflection surface may be formed on the end surface of the reticle stage RST, and the position of the reticle stage RST may be measured via the reflection surface.

  As the projection optical system PL, for example, a refractive optical system including a plurality of lenses (lens elements) having a common optical axis AX in the Z-axis direction is used. This projection optical system PL is, for example, both-side telecentric and has a predetermined projection magnification (for example, 1/4 or 1/5). For this reason, when the illumination area is illuminated by the illumination light IL from the illumination system IOP, the illumination light that has passed through the reticle R arranged so that the first surface (object surface) and the pattern surface of the projection optical system PL substantially coincide with each other. A reduced image of the reticle circuit pattern in the illumination area (a reduced image of a part of the circuit pattern) is disposed on the second surface (image surface side) of the reticle via the projection optical system PL by the IL. It is formed in an area (exposure area) conjugate to the illumination area on the wafer W coated with a resist (photosensitive agent). Then, by synchronous driving of reticle stage RST and wafer stage WST, reticle R is moved relative to the illumination area (illumination light IL) in the scanning direction (Y-axis direction) and at the same time with respect to the exposure area (illumination light IL). By relatively moving the wafer W in the scanning direction (Y-axis direction), scanning exposure of one shot area (partition area) on the wafer W is performed, and a reticle pattern is formed in the shot area. That is, in this embodiment, a pattern is generated on the wafer W by the illumination system IOP, the reticle R, and the projection optical system PL, and the sensitive layer (resist layer) on the wafer W is exposed on the wafer W by the illumination light IL. A pattern is formed.

  FIG. 2 shows a plan view of wafer stage WST and its periphery. Wafer stage WST holds wafer W via wafer holder WH. Wafer stage WST is levitated and supported above base BS arranged on the floor surface by a self-weight canceller (not shown) with a small gap. Wafer stage WST is moved in the XY two-dimensional plane (including rotation about the Z axis) by wafer stage drive system 24 (see FIG. 1) including a linear motor, a voice coil motor (VCM), and the like. It is configured to be drivable. As this stage drive system 24, in this embodiment, as shown in FIG. 2, for example, an X-axis linear motor LMX (including a stator 16C), a Y-axis linear motor LMY1 (Y stator 16A, Y mover 14A). And a Y-axis linear motor LMY2 (including a Y stator 16B and a Y mover 14B). Among these, the Y movers 14A and 14B are fixed to the stator 16C via a pair of plate-like members 13A and 13B provided at both ends of the stator 16C.

  Returning to FIG. 1, the position of wafer stage WST in the XY plane is set to, for example, 0.5 to 1 nm by wafer laser interferometer 18 (hereinafter abbreviated as “wafer interferometer 18”) via movable mirror 17. It is always detected with a resolution of the order (in FIG. 2, neither wafer interferometer 18 nor moving mirror 17 is shown). The position information of wafer stage WST is sent to main controller 20, and main controller 20 controls the position of wafer stage WST based on this position information. Instead of moving mirror 17, a reflection surface may be formed on the end surface of wafer stage WST, and the position of wafer stage WST may be measured via the reflection surface.

  Near the wafer stage WST, although not shown in FIG. 1, a utility supply system 210 is provided as shown in FIG. This power supply system 210 includes a power transmission device 60 that is connected to wafer stage WST in a non-contact manner. The specific configuration of the utility supply system 210 will be described in detail later.

  The main controller 20 includes a so-called microcomputer (or workstation) comprising a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory) and the like, and the entire exposure apparatus 100. Control all over.

  Next, the utility supply system 210 will be specifically described. FIG. 3 shows a cross-sectional view taken along line AA of FIG. As shown in FIG. 3, the power supply system 210 includes a tube carrier 74 and seven tubes 101A to 101G having one end connected to the tube carrier 74 (however, in FIG. 3, these seven tubes Are collectively shown as “tube 101.” See FIG. 6, FIG. 7 (A) to FIG. 8 (C)), and a power supply having a power transmission device 60 to which the other end of the tube 101 is connected. And a drive mechanism 90 that drives the utility supply unit 80 in the XY plane.

  The tube carrier 74 is connected to the other end of a plurality of tubes 200 having one end connected to, for example, a gas supply device that supplies compressed air installed outside or a vacuum pump that performs vacuum suction. The tube carrier 74 is held so as to be slidable in the X-axis direction on a guide bar 72 installed between the plate-like members 13A and 13B shown in FIG.

  The power transmission device 60 transmits the power (compressed air and vacuum suction force) supplied from the tube carrier 74 via the tube 101 to the wafer stage WST in a non-contact manner. The configuration and the like of the power transmission device 60 will be described in detail later.

  As shown in FIG. 3, the drive mechanism 90 includes an X linear motor 62 having an X mover 64A that supports the power transmission device 60 from below and an X stator 64B in a state in which the X mover 64A is engaged. A slider 66 fixed to the lower surface of the X mover 64A, a yaw pad 70 attached to the -Y side surface of the X mover 64A via an attachment member 68, the X mover 64A, and the tube carrier 74 described above. And a guide bar 72 are connected to each other. Among these, the X stator 64B and the guide bar 72 are installed between the plate-like members 13A and 13B shown in FIG.

  The X mover 64A includes a mover body having a rectangular frame shape when viewed from the + X side, and magnetic pole units provided on the upper and lower surfaces of the mover body. The X stator 64B includes a stator body whose longitudinal direction is the X-axis direction, and a plurality of armature coils (armature units) provided in the stator body along the X-axis direction. It is out.

  In the present embodiment, due to electromagnetic interaction between the magnetic field generated by the magnetic pole unit of the X mover 64A constituting the X linear motor 62 and the current flowing through the armature coil (armature unit) of the X stator 64B, A driving force in the X-axis direction acts on the X mover 64A.

  The slider 66 has a plurality of air pads 69 on its bottom surface (surface on the −Z side). The plurality of air pads 69 maintain a predetermined interval (a minute interval) between the lower surface of the slider 66 and the upper surface of the base BS.

  The yaw pad 70 has a plurality of vacuum preload type hydrostatic bearings 71 on the surface at the -Y side. The end face on the + Y side of the guide bar 72 provided on the −Y side of the yaw pad 70 is set to have a very high flatness, and the jet power of the gas generated by the vacuum preload type static gas bearing 71 and the vacuum A predetermined interval (a minute interval) is maintained between the yaw pad 70 and the guide bar 72 due to the balance with the suction force.

  The mounting member 68 has a hinge portion 68A at the substantially central portion in the Y-axis direction. For this reason, the yaw pad 70 described above is in a state in which rotation around the X axis is allowed with respect to the X movable element 64A.

  In actuality, as shown in FIG. 2, two connecting members 78 are provided at a predetermined interval in the X-axis direction. According to this connecting member 78, since the driving force acting on the X movable element 64A can be transmitted to the tube carrier 74, the X movable element 64A, the force transmission device 60 held by the X movable element 64A, The tube carrier 74 can be integrally driven in the X-axis direction.

  According to the drive mechanism 90 configured in this way, the X transmission element 60A and the tube carrier 74 are driven in the X-axis direction by driving the X mover 64A in the X-axis direction in the X linear motor 62. At this time, the X movable element 64A is driven by the slider 66 (air pad 69) with reference to the upper surface of the base BS (that is, the X movable element 64A slides on the base BS). For this reason, for example, when compared with the case where the X mover 64A is driven with reference to the beam-shaped X stator 64B (the weight of the X mover 64A is driven while being supported by the X stator 64B), Since the deformation of the member serving as the reference for movement is small, the X mover 64A, the force transmission device 60, and the tube carrier 74 can be driven in the X-axis direction with high accuracy. Further, in this embodiment, the vacuum preload type gas hydrostatic bearing 71 always maintains a predetermined distance between the −Y side surface of the yaw pad 70 and the + Y side surface of the guide bar 72, so that FIG. The Y linear motors LMY1 and LMY2 shown are driven in the Y-axis direction, and the guide bar 72 is driven in the Y-axis direction together with the wafer stage WST, so that the X mover 64A, The power transmission device 60 and the tube carrier 74 can be driven in the Y-axis direction. Therefore, the force transmission device 60 can follow the wafer stage WST in the Y-axis direction. Further, since the yaw pad 70 is fixed to the X mover 64A via the attachment member 68, even if a force in the rotational direction around the X axis acts on the mover 64A, the force is absorbed by the hinge 68A. It is possible.

  Next, the power transmission device 60 will be described in detail with reference to FIGS. 4 to 12B. FIG. 4 is a perspective view of the utility transmission device 60 and the surrounding mechanism.

  As shown in FIG. 4, the force transmission device 60 includes a leg portion 102 having a substantially inverted T-shape when viewed from the −Y direction, and an arm portion 104 fixed to the upper end portion of the leg portion 102. Including the main body 103, the air supply pad 106 </ b> A fixed (adhered) to the end of the arm 104 of the main body 103 on the −X side, and fixed (adhered) to the end of the arm 104 on the + X side. Air supply pad 106B. The force transmission device 60 is engaged with delivery blocks 140A and 140B fixed to the lower surface of wafer stage WST at air supply pads 106A and 106B.

  The leg portion 102 is made of, for example, a lightweight, high-strength titanium alloy (for example, Ti-6Al-4V (also referred to as “64 titanium”)), and seven utility supply ports 108A to 108G are attached to a part thereof. It has been. Of these, the utility supply port 108A is provided in the vicinity of the lower end of the −X side half of the leg portion 102, and is formed in a substantially L shape inside the leg portion 102 as shown in FIG. It is in a state connected to one end of the first pipeline 110A. As shown in FIGS. 4 and 6, one end of a tube 101 </ b> A is connected to the utility supply port 108 </ b> A. The other end of the tube 101A is connected to the tube carrier 74 as described above. In the drawings other than FIGS. 4 and 6, the tube 101 </ b> A is omitted in order to avoid complication of the drawings.

  As shown in FIG. 7A, the utility supply port 108 </ b> B is provided near the upper end of the −X side half of the leg 102, and is one end of the first conduit 110 </ b> B formed inside the leg 102. It is in a connected state. One end of the tube 101B is connected to the utility supply port 108B (however, the illustration of the tube 101B is omitted in drawings other than FIG. 7A). Further, as shown in FIG. 7B, the utility supply port 108 </ b> C is provided slightly below the center in the Z-axis direction of the −X side half of the leg portion 102, and is substantially inside the leg portion 102. It is in a state of being connected to one end of the first pipe line 110C formed in an L shape. One end of the tube 101C is connected to the utility supply port 108C (however, the illustration of the tube 101C is omitted in drawings other than FIG. 7B). Further, as shown in FIG. 7C, the utility supply port 108D is provided in the vicinity of the aforementioned utility supply port 108A, and is formed in a substantially L shape inside the leg portion 102. It is in the state connected to one end of. One end of the tube 101D is connected to the utility supply port 108D (however, the tube 101D is not shown in drawings other than FIG. 7C).

  As shown in FIG. 8A, the utility supply port 108E is provided in the vicinity of the lower end of the + X side half of the leg portion 102, and is formed in a substantially L shape inside the leg portion 102. It is in a state of being connected to one end of the path 110E. One end of a tube 101E is connected to the utility supply port 108E (however, the tube 101E is not shown in drawings other than FIG. 8A). Further, as shown in FIG. 8 (B), the utility supply port 108F is provided in the vicinity of the utility supply port 108E, and the first pipeline 110F formed in a substantially L shape inside the leg portion 102. It is in a state connected to one end. One end of a tube 101F is connected to the utility supply port 108F (however, the illustration of the tube 101F is omitted in drawings other than FIG. 8B). Further, as shown in FIG. 8C, the utility supply port 108 </ b> G is provided near the upper end of the + X side half of the leg 102, and the first pipeline 110 </ b> G formed inside the leg 102. It is in a state connected to one end. One end of the tube 101G is connected to the utility supply port 108G (however, the tube 101G is not shown in drawings other than FIG. 8C).

  Returning to FIG. 4, the arm portion 104 is made of a substantially rectangular parallelepiped member made of, for example, 64 titanium, like the leg portion 102 described above, and as shown in FIG. 5 which is a partially exploded perspective view of FIG. A recess 104a is formed at the center of the upper surface (+ Z side surface), and recesses 104b and 104c are formed on the −X side and + X side of the recess 104a, respectively. Lid members 142A, 142B, and 142C made of plate-like members are fixed to the recesses 104a to 104c, respectively (in FIG. 5, the lid members 142A to 142C are removed).

A through-hole 104f that penetrates in the Z-axis direction is formed between the recesses 104a and 104b of the arm 104, and a through-hole 104g that penetrates in the Z-axis direction is formed between the recess 104a and the recess 104c. Is formed. As shown in FIG. 9A, leaf spring structures 104d ₁ and 104d ₂ are formed in the −Y side and + Y side portions of the through hole 104f, and the −Y side and + Y side portions of the through hole 104g are formed. The leaf spring structures 104e ₁ and 104e ₂ are formed.

One of these plates spring structure, the plate spring structure 104d _1, as shown enlarged in FIG. 9 (B), a plate spring portion 204a, a convex located on the + Z side of the plate spring portion 204a Parts 204c and 204d, and convex parts 204e and 204f located on the −Z side of the leaf spring part 204a. The leaf spring structure 104d ₁ is formed by wire cutting a part of the arm portion 104. The other leaf spring structures 104d ₂ , 104e ₁ , 104e ₂ have the same configuration.

According to these four leaf spring structures 104d ₁ , 104d ₂ , 104e ₁ , 104e ₂ , a portion 211A (hereinafter referred to as “center portion 211A”) shown in FIG. Between the leaf spring structures 104d ₁ and 104d ₂ (104e ₁ and 104e ₂ ) and a portion 211B (hereinafter referred to as an “end portion 211B”) located on the opposite side of the central portion 211A. Are set very weakly in the Z-axis direction, the rotation direction around the X-axis (θx direction), and the rotation direction around the Y-axis (θy direction), and set high in the X-axis direction.

Moreover, since the leaf spring structures 104d _{1 to} 104e ₂ are provided with the convex portions 204c and 204d and the convex portions 204e and 204f as described above, even if the central portion 211A and the end portion 211B move relative to each other. As shown in FIGS. 9C and 9D, the convex portions 204c and 204d (or the convex portions 204e and 204f) come into contact with each other, so that the central portion 211A and the end portion 211B are relatively moved. It is possible to limit within a predetermined range. This limitation can be suppressed as much as possible damage to the leaf spring portion 204a constituting the plate spring structure 104d ₁ ~104e _2. Hereinafter, a structure including these convex portions 204c to 204f is also referred to as a “self-limit structure”.

  Returning to FIG. 5, eight grooves 114 </ b> A to 114 </ b> H are formed on the upper surface (+ Z side surface) of the recess 104 a of the arm portion 104. From the groove 114A, as shown in a plan view in FIG. 10, a second conduit 112A and a third conduit 116A are formed. Of these, as shown in FIG. 6, the second pipeline 112 </ b> A is in communication with the first pipeline 110 </ b> A described above, and the third pipeline 112 </ b> A is located below the arm portion 104 (−Z side). ) In a state of being slackened, it is in a state of communicating with the pipe line in the tube 118A. Since the groove 114A is closed from above by the lid member 142A described above, the groove 114A also forms a conduit for supplying a working force together with the lid member 142A.

  Returning to FIG. 10, from the grooves 114B, 114C, 114E to 114G, the second pipes 112B, 112C, 112E to 112G and the third pipes 116B, 116C, 116E to 116G are respectively the same as the groove 114A described above. Is formed. Of these, the second pipes 112B, 112C, 112E to 112G are respectively described above as shown in FIGS. 7A, 7B, and 8A to 8C. The first pipelines 110B, 110C, and 110E to 110G are in communication with each other, and the third pipelines 116B, 116C, and 116E to 116G are respectively disposed on the lower side (−Z side) of the arm portion 104. The tubes 118B, 118C, and 118E to 118G connected in a slack state are in communication with the pipelines. The grooves 114B, 114C, and 114E to 114G also form a conduit for supplying a working force together with the lid member 142A, similarly to the groove 114A.

  As shown in FIG. 7C, the remaining grooves 114 </ b> D and 114 </ b> H are respectively formed with open ends of the second duct 112 </ b> D formed in the arm portion 104. Further, a third pipe line 116D is formed from the groove 114D, and a third pipe line 116H is formed from the groove 114H. Among these, the second pipe 112D is in communication with the first pipe 110D described above, and the third pipes 116D and 116H have slack on the lower side (−Z side) of the arm portion 104. In this state, the tubes 118D and 116H connected to each other are in communication with the pipelines. These grooves 114D and 114H also form a conduit for supplying power together with the lid member 142A.

  Returning to FIG. 10, four grooves 122A to 122D are formed in the recess 104b. Of these, the groove 122A has a substantially L-shape in plan view (as viewed from the + Z side), and a fourth pipe line 120A and a fifth pipe line 124A are formed from the groove 122A. . Among these, as shown in FIG. 6, the fourth conduit 120A is in communication with the conduit in the tube 118A described above, and the fifth conduit 124A is substantially viewed from the Y-axis direction. It has an L shape. Since the groove 122A is closed from above by the lid member 142B described above, the groove 122A also forms a conduit for supplying a working force together with the lid member 142B.

  Similarly, the fourth pipes 120B to 120D and the fifth pipes 124B to 124D are formed from the other grooves 122B to 122D, respectively. Among these, as shown in FIGS. 7A to 7C, the fourth pipes 120B to 120D communicate with the pipes in the tubes 118B to 118D, respectively, and the fifth pipe 124B. ˜124D has a substantially L-shape when viewed from the Y-axis direction. In FIG. 10, the positions of the upper ends of the fourth pipe line 120B (120C) and the fifth pipe line 124B (124C) in the X-axis direction are the same, but FIG. 7 (A) and FIG. In (B), for convenience of illustration, each upper end portion is shown in a state of being separated with respect to the X-axis direction. In addition, the grooves 122B to 122D form a conduit for supplying a working force together with the lid member 142B described above.

  Also in the recess 104c, four grooves 122E to 122H are formed as in the above-described recess 104d (see FIG. 10). From these grooves 122E to 122H, fourth pipelines 120E to 120H and fifth pipelines 124E to 124H are formed, respectively. As shown in FIGS. 7C and 8A to 8C, the fourth pipelines 120E to 120H are in communication with the pipelines in the tubes 118E to 118H described above. The fifth pipes 124E to 124H have a substantially L shape when viewed from the Y-axis direction. Note that the grooves 122E to 122H form a conduit for supplying utility together with the lid member 142C described above.

  The one air supply pad 106A is made of, for example, aluminum oxide (alumina) or the like, and has a substantially rectangular parallelepiped shape as shown in FIGS. 11 (A) and 11 (B). Sixth pipes 126A to 126D are formed from the + X side end of the air supply pad 106A.

  As shown in FIG. 6, the sixth conduit 126A has an L-shaped cross section formed through the supply pad 106A from the surface on the + X side to the surface on the −Z side. It is in a state of communicating with the conduit 124A. As shown in FIG. 7A, the sixth conduit 126B has an L-shaped cross section formed through the supply pad 106A from the + X side surface to the −Z side surface. It is in the state of communicating with the 5th pipeline 124B.

  As shown in FIG. 7B, the sixth conduit 126C communicates with the fifth conduit 124C described above, and branches into three inside the air supply pad 106A. Of these three branch paths, the ends of the two branch paths 134a and 134b (the end on the + Z side) are formed at the center of the upper surface of the air supply pad 106A as shown in FIG. It is located in the rectangular annular shallow groove 196a (that is, the bottom portion). The remaining one branch passage penetrates the surface on the −Z side (see FIG. 11B).

  As shown in FIG. 7C, the sixth pipeline 126D is in communication with the fifth pipeline 124D described above, and is branched into three inside the air supply pad 106A. Of these three branch paths, the vicinity of the ends (+ Z side ends) of two branch paths 136a and 136b is an orifice, and each end is as shown in FIG. In addition, they are located in shallow grooves 196b and 196c having an H shape in plan view formed on the upper surface of the air supply pad 106A. The remaining one branch passage penetrates the surface on the −Z side (see FIG. 11B).

  As shown in FIGS. 12A and 12B, the other air supply pad 106B has a substantially rectangular parallelepiped shape, and the sixth pipe line 126E to 126H is formed.

  As shown in FIG. 8 (A), the sixth pipe 126E has an L-shaped cross section that is formed through the supply pad 106B from the -X side surface to the -Z side surface, It is in a state of communicating with the fifth pipe 124E described above. As shown in FIG. 8B, the sixth pipeline 126F communicates with the fifth pipeline 124F described above and branches into three inside the air supply pad 106B. As shown in FIG. 12A, the end portions (+ Z side end portions) of the two branch paths 134c and 134d among these branch paths are rectangular formed at the center of the upper surface of the air supply pad 106B. It is located in the annular shallow groove 196d (that is, the bottom portion). The remaining one branch passage penetrates the surface on the −Z side (see FIG. 12B).

  As shown in FIG. 8C, the sixth pipe 126G has an L-shaped cross section formed through the supply pad 106B from the −X side surface to the −Z side surface. It is in a state communicating with the fifth pipe 124G described above. Further, as shown in FIG. 7C, the sixth pipe 126H communicates with the fifth pipe 124H described above, and is branched into two inside the air supply pad 106B. Yes. The vicinity of the end portions (the end portion on the + Z side) of these two branch paths 136c and 136d is an orifice, and each end portion is an upper surface of the air supply pad 106B as shown in FIG. Are formed in the shallow grooves 196e and 196f having a H shape in plan view.

  Next, a pair of delivery blocks 140A and 140B (see FIG. 4) fixed to wafer stage WST will be described based on FIGS. 11 (A) and 12 (A).

  One delivery block 140A is made of alumina or the like, for example, and has a substantially U-shape when viewed in the X-axis direction, as shown in FIG. On the surface 141a of the delivery block 140A facing the lower surface of the air supply pad 106A, four supply grooves 128A to 128D whose longitudinal direction is the X-axis direction are arranged at equal intervals in the Y-axis direction. Seventh pipelines 130A to 130D are formed from the supply grooves 128A to 128D, respectively. The seventh pipelines 130A to 130D are in communication with the utility supply ports 132A to 132D shown in FIG. 4 (see FIGS. 6, 7A to 7C).

  Similarly to the one delivery block 140A, the other delivery block 140B is made of, for example, alumina or the like, and has a substantially U-shape when viewed in the X-axis direction, as shown in FIG. Three supply grooves 128E to 128G whose longitudinal direction is the X-axis direction are formed at equal intervals along the Y-axis direction on a surface 141b of the delivery block 140B that faces the lower surface of the air supply pad 106B. . Seventh pipelines 130E to 130G are formed from the supply grooves 128E to 128G, respectively. The seventh pipelines 130E to 130G are in communication with the utility supply ports 132E to 132G shown in FIG. 4 (see FIGS. 8A to 8C).

  As shown in FIGS. 6 to 8C, the utility power supply ports 132A to 132G are connected to the other ends of tubes 150A to 150F, one end of which is connected to wafer stage WST. 6 to 8C, for convenience of illustration, only one of the tubes 150A to 150F is illustrated, and the other tubes are not illustrated. In FIG. 4, only the tube 150D is shown, and the other tubes are not shown.

  According to the power transmission device 60 configured as described above, the power supplied through the tube 200 and the tube carrier 74 is supplied to the wafer stage WST as follows.

  That is, compressed air is supplied from the gas supply device installed outside to the utility transmission device 60 (utility supply port 108A) through the tube 200 shown in FIG. 3, the tube carrier 74, and the tube 101A shown in FIG. When sent, the compressed air passes through the first pipe 110A, the second pipe 112A, the groove 114A, the third pipe 116A, the tube 118A, the fourth pipe 120A, the groove 122A, and the fifth pipe in the main body 103. The fluid passes through the passage 124A and the sixth pipe 126A in the air supply pad 106A, and is sent to the utility supply groove 128A of the delivery block 140A. Then, the compressed air is sent from the power supply groove 128A to the wafer stage WST through the seventh conduit 130A, the power supply port 132A, and the tube 150A.

  Further, as shown in FIG. 8C, the same applies when compressed air is sent to the utility supply port 108G of the utility transmission device 60 via the tube 101G, and the compressed air is supplied to the first pipeline 110G. → second pipe 112G → groove 114G → third pipe 116G → tube 118G → fourth pipe 120G → groove 122G → fifth pipe 124G → sixth pipe 126G → power supply groove 128G → seventh pipe 130G It is sent to wafer stage WST via the order of utility supply port 132G → tube 150G.

  Further, as shown in FIG. 7C, when compressed air is sent to the utility supply port 108D of the utility transmission device 60 via the tube 101D, the first pipeline 110D → the second pipeline 112D → the groove 114D. → the third pipe 116D → the tube 118D → the fourth pipe 120D → the groove 122D → the fifth pipe 124D → the sixth pipe 126D → the power supply groove 128D → the seventh pipe 130D → the power supply port 132D → the tube 150D. In order, it is sent to wafer stage WST. Further, a part of the compressed air sent to the utility supply port 108D passes through the branch paths 136a and 136b of the sixth pipe 126D, and the shallow grooves 196b and 196c having an H shape in plan view (see FIG. 11A). To the lower surface of wafer stage WST. The compressed air passing through the second pipe 112D is also sent to the groove 114H side, and the third pipe 116H → the tube 118H → the fourth pipe 120H → the groove 122H → the fifth pipe 124H → the sixth pipe 126H. → Blown paths 136c and 136d are blown onto the lower surface of wafer stage WST from shallow grooves 196b and 196c (see FIG. 12A) that are H-shaped in plan view.

  On the other hand, as shown in FIGS. 7 (A), 7 (B), 8 (A), and 8 (B), when vacuum suction is performed by a vacuum pump installed outside, the compressed air described above is used. Contrary to the supply of the tube, the tube 150B (150C, 150E, 150F) → the force supply port 132B (132C, 132E, 132F) → the seventh conduit 130B (130C, 130E, 130F) → the force supply groove 128B (128C, 128E) , 128F) → the sixth pipe 126B (126C, 126E, 126F) → the fifth pipe 124B (124C, 124E, 124F) → the groove 122B (122C, 122E, 122F) → the fourth pipe 120B (120C, 120E, 120F) → Tube 118B (118C, 118E, 118F) → Third pipeline 116B (116C, 116E, 116F) → Groove 11 B (114C, 114E, 114F) → second pipe 112B (112C, 112E, 112F) → first pipe 110B (110C, 110E, 110F) → utility supply port 108B (108C, 108E, 108F) → tube 101B ( 101C, 101E, 101F) gas flows are generated.

  Further, by the above vacuum suction, vacuum suction is also performed via the branch paths 134a and 134b shown in FIG. 7B and the branch paths 134c and 134d shown in FIG. A shallow groove 196a (see FIG. 11A) formed on the upper surface (+ Z side surface) and a shallow groove 196d (see FIG. 12A) formed on the upper surface (+ Z side surface) of the air supply pad 106B. The pressure inside is reduced.

  That is, in the air supply pad 106A (106B), as described above, compressed air is blown from the shallow grooves 196b, 196c (196e, 196f) to the lower surface of the wafer stage WST, and the inside of the shallow grooves 196a, 196d is depressurized (vacuum). Therefore, it has a function equivalent to that of a so-called vacuum preload type static air bearing provided on the upper surface of the air supply pad.

  By this vacuum preload type static air bearing, not only between the upper surfaces of the air supply pads 106A and 106B and the lower surface of the wafer stage WST, but also between the lower surfaces of the air supply pads 106A and 106B and the upper surfaces of the delivery blocks 140A and 140B. In the meantime, a predetermined interval is maintained. Therefore, in the present embodiment, it is possible to supply the use force from the use force transmission device 60 to the wafer stage WST in a state where the contact between the use force transmission device 60 and the wafer stage WST is maintained in a non-contact state. .

  In addition, since the supply blocks 140A and 140B are formed with force supply grooves 128A to 128D and 128E to 128G whose longitudinal direction is the X-axis direction, the transfer blocks 140A and 140B and the air supply pads 106A and 106B are provided. Even in the case of relative movement in the X-axis direction, it is possible to supply utility power without any problem.

  Of the utility force supplied to wafer stage WST in this way, the vacuum suction force is used, for example, for vacuum suction of wafer W by the wafer holder, and the compressed air is supplied to, for example, a self-weight canceller that supports the self-weight of wafer stage WST. Used.

  Next, the flow of an exposure operation performed by the exposure apparatus 100 configured as described above will be briefly described.

  First, under the control of the main controller 20, the reticle loader (not shown) loads the reticle R onto the reticle stage RST, and the wafer loader (not shown) loads the wafer W onto the wafer stage WST. Preliminary operations such as reticle alignment and baseline measurement (measurement of the distance from the detection center of the alignment system to the optical axis of the projection optical system PL) are performed in a predetermined procedure using an alignment system (not shown).

  Thereafter, the main controller 20 performs alignment measurement such as EGA (Enhanced Global Alignment) disclosed in Japanese Patent Application Laid-Open No. 61-44429 using the alignment detection system. A step-and-scan exposure operation is performed. Since this exposure operation is the same as the conventional step-and-scan method, its description is omitted.

  While these alignment operation and exposure operation are performed, main controller 20 controls driving of power supply system 210 so that power transmission device 60 follows the movement of wafer stage WST.

  As described above in detail, according to the present embodiment, the upper surfaces of the air supply pads 106A and 106B and the lower surface of the wafer stage WST are provided by the static gas bearings of the air supply pads 106A and 106B fixed to the main body 103. In addition, a predetermined distance is maintained between the lower surfaces of the air supply pads 106A and 106B and the upper surfaces of the delivery blocks 140A and 140B corresponding thereto, and the air supply pads 106A and 106B are arranged on the upper surfaces of the delivery blocks 140A and 140B. A pipe line (such as 130A) that supplies a working force to the pipe line (such as 130A) having an open end at a predetermined interval is provided. Therefore, via each of the conduit formed in the main body 103 and the conduit formed in the air supply pad, and the conduit (such as 130A) in which the open end is formed on the upper surface of the delivery block 140A, 140B, Utility force can be supplied to wafer stage WST in a non-contact manner. Thus, since wafer stage WST does not drag the tube as in the prior art, wafer stage WST can be moved with high accuracy.

  Further, according to the present embodiment, since wafer stage WST can be moved with high accuracy as described above, high-precision exposure can be realized.

  In the present embodiment, the air supply pads 106A and 106B are fixed at substantially symmetrical positions with respect to the main body 103 in the XY plane, so that the positional relationship between the power transmission device 60 and the wafer stage WST. Can be stably maintained.

Further, in the above embodiment, since the leaf spring structures 104d _{1 to} 104e ₂ are provided in a part of the arm portion 104 that constitutes the main body portion 103, the rigidity of the arm portion 104 is set around the Z axis direction and the X axis. The rotation direction (θx direction) and the rotation direction around the Y axis (θy direction) can be set very weakly, and transmission of vibrations in these directions to the wafer stage side can be reduced. Further, since the tubes 118A to 118H provided on the arm portion 104 are connected in a slack state, vibration transmission to the wafer stage WST side via these tubes 118A to 118H can be reduced as much as possible. it can.

In addition, since the leaf spring structures 104d _{1 to} 104e ₂ are provided with self-limit structures (204c to 204f), the positional relationship between the central portion and the end portion of the arm portion 104 tends to change greatly due to some influence. Even in this case, the leaf spring portion 204a can be prevented from being damaged. As a result, it is possible to suppress damage to the power transmission device 60 during conveyance or when the exposure apparatus 100 is assembled.

  In addition, according to the present embodiment, the pipes 150A to 150G are connected to the power transmission device 60 that supplies a power to the wafer stage WST that moves along the upper surface of the base BS, and these power transmission device 60 and the pipe 150A. The X mover 64A holding ~ 150G moves following the wafer stage WST. Thus, unlike the conventional case, wafer stage WST itself does not drag the piping, so that wafer stage WST can be moved with high accuracy. Further, the X mover 64X is provided with a vacuum preload type gas static pressure bearing 71, and the vacuum preload type gas static pressure bearing 71 is between the guide surface (XZ surface) of the guide bar 72 moving in the Y-axis direction. Since the predetermined interval is maintained, the X mover 64A and the Y axis direction can move in the X axis direction as the guide bar 72 moves along the X axis direction.

  Further, since the slider 66 having the air pad 69 is provided on the lower surface of the X movable element 64A, the air pad 69 can be slid on the base BS serving as a reference for the movement of the wafer stage WST. Accordingly, for example, compared to the case where the X movable element 64A is driven with a beam-shaped member as a reference, the X movable element 64A (and the utility force) are not affected by the bending of the reference member or the like. It is possible to drive the transmission device 60).

  In the above embodiment, the case where the vacuum preload type air bearing is directly formed on the upper surface of the air supply pad has been described. However, the present invention is not limited to this. For example, a separately manufactured bearing mechanism is provided on the upper surface of the air supply pad. It is good also as providing in. In addition, as in the above embodiment, the air bearing is provided on the upper surface side of the air supply pad, and the opening of the gas supply conduit is disposed on the lower surface side of the air supply pad. Both the opening of the pipe line may be arranged on the upper surface side and the lower surface side, the air bearing may be arranged on the lower surface side, and the opening of the gas supply pipe line may be arranged on the upper surface side. good.

In the above-described embodiment, the leaf spring structures 104d _{1 to} 104e ₂ are formed by wire-cutting a part of the arm part 104. However, the present invention is not limited to this, and for example, the central part 211A of the arm part 104 And the end portion 211B may be formed of separate members, and a leaf spring may be separately provided between the central portion and the end portion. Further, when the vibration transmission is negligible, the leaf spring structures 104d _{1 to} 104e ₂ and the leaf spring may not be provided. In addition, the self-limit structure is not formed by wire cutting, and a limit mechanism is provided between the central portion and the end portion of the arm portion 104 so as to come into contact when both portions relatively move by a predetermined amount or more. It may be provided.

  In addition, arrangement | positioning of the pipe line in the power transmission apparatus 60 in the said embodiment, the kind of power to pass through each pipe line, etc. are only examples, and various structures are employ | adopted in the range which does not deviate from the summary of this invention. It is possible.

  In the above embodiment, the configuration shown in FIG. 3 is adopted as the drive mechanism for driving the utility transmission device 60. However, the configuration is not limited to this, and other configurations may be adopted. In addition, while the configuration of the drive mechanism 90 shown in FIG. 3 is employed, a utility supply device having another configuration may be employed as the utility supply device.

  In the above embodiment, the case where the exposure apparatus includes a single wafer stage WST has been described. However, the present invention is not limited to this. For example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US) As disclosed in Japanese Patent No. 6,590,634), Japanese Translation of PCT International Publication No. 2000-505958 (corresponding US Pat. No. 5,969,441), US Pat. No. 6,208,407, etc. The present invention can also be applied to a multi-stage type exposure apparatus provided with a wafer stage. In this case, a power supply device and a drive mechanism for driving the power supply device may be provided for each wafer stage. Moreover, as disclosed in, for example, International Publication No. 2005/0774014 pamphlet, a configuration including a measurement stage separately from the wafer stage may be employed.

  Note that the present invention can also be applied to an immersion exposure apparatus disclosed in International Publication No. 2004/53955 pamphlet. In this case, the liquid remaining on the wafer stage may be recovered by using the power (vacuum suction force) supplied via the power transmission device 60.

  In the above-described embodiment, the case where the power supply device of the present invention is used for supplying power to wafer stage WST has been described. However, the present invention is not limited to this, and it may be used for supplying power to reticle stage RST. It is possible to adopt.

  In the above embodiment, the case where the present invention is applied to a scanning exposure apparatus such as a step-and-scan method has been described. However, the present invention is not limited to this, and the present invention is applied to a stationary exposure apparatus such as a stepper. May be. The present invention can also be applied to a step-and-stitch type exposure apparatus that synthesizes a shot area and a shot area.

  Further, the magnification of the projection optical system in the exposure apparatus of the above embodiment may be not only a reduction system but also an equal magnification and an enlargement system, and the projection optical system is not only a refraction system but also a reflection system or a catadioptric system. The projected image may be either an inverted image or an erect image.

The illumination light IL is not limited to ArF excimer laser light (wavelength 193 nm), but may be ultraviolet light such as KrF excimer laser light (wavelength 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). . For example, as disclosed in the pamphlet of International Publication No. 1999/46835 (corresponding US Pat. No. 7,023,610), an infrared region or a single visible region oscillated from a DFB semiconductor laser or a fiber laser as vacuum ultraviolet light is disclosed. For example, a single wavelength laser beam may be amplified with a fiber amplifier doped with erbium (or both erbium and ytterbium), and a harmonic wave converted into an ultraviolet region using a nonlinear optical crystal may be used.

  In the above embodiment, it is needless to say that the illumination light IL of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, in recent years, in order to expose a pattern of 70 nm or less, EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm) is generated using an SOR or a plasma laser as a light source, and the exposure wavelength thereof Development of an EUV exposure apparatus using an all-reflection reduction optical system designed under (for example, 13.5 nm) and a reflective mask is underway. In this apparatus, since a configuration in which scanning exposure is performed by synchronously scanning the mask and the wafer using arc illumination is conceivable, the present invention can be suitably applied to such apparatus. In addition, the present invention can be applied to an exposure apparatus using a charged particle beam such as an electron beam or an ion beam.

  In the above embodiment, a light transmissive mask (reticle) in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. Instead of this reticle, for example, As disclosed in US Pat. No. 6,778,257, an electronic mask (also called a variable shaping mask) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. For example, a DMD (Digital Micro-mirror Device) which is a kind of non-light-emitting image display element (spatial light modulator) may be used.

  The present invention also relates to an exposure apparatus (lithography system) that forms a line and space pattern on a wafer by forming interference fringes on the wafer as disclosed in International Publication No. 2001/035168. Can be applied.

  Further, as disclosed in, for example, Japanese translations of PCT publication No. 2004-51850 (corresponding US Pat. No. 6,611,316), two reticle patterns are synthesized on a wafer via a projection optical system, and The present invention can also be applied to an exposure apparatus that performs double exposure of one shot area on a wafer almost simultaneously by scanning exposure.

  The apparatus for forming a pattern on an object is not limited to the above-described exposure apparatus (lithography system), and the present invention can also be applied to an apparatus for forming a pattern on an object by, for example, an inkjet method.

  In the above embodiment, the object on which the pattern is to be formed (the object to be exposed to which the energy beam is irradiated) is not limited to the wafer, but may be another object such as a glass plate, a ceramic substrate, or a mask blank.

  The use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers and forms a liquid crystal display element pattern on a square glass plate, an organic EL, a thin magnetic head, an imaging The present invention can be widely applied to an exposure apparatus for manufacturing elements (CCD, etc.), micromachines, DNA chips and the like. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

  Further, the exposure apparatus of the above embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  In addition, a semiconductor device is used as a reticle by using a step of performing a function / performance design of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and the exposure apparatus of each of the above embodiments. It is manufactured through a lithography step for transferring the formed pattern onto an object such as a wafer, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like. In this case, since the device pattern is formed on the object using the exposure apparatus of the above embodiment in the lithography step, the productivity of a highly integrated device can be improved.

  As described above, the utility supply device of the present invention is suitable for supplying utility to a moving body. Moreover, the mobile body system and mobile body apparatus of this invention are suitable for driving a mobile body. The pattern forming apparatus of the present invention is suitable for forming a pattern on an object.

It is the schematic which shows the exposure apparatus which concerns on one Embodiment. It is a top view which shows a wafer stage and a power supply system. It is the sectional view on the AA line of FIG. It is a perspective view which shows a utility power supply apparatus. FIG. 5 is a perspective view showing the utility supply device of FIG. 4 taken out and partially disassembled. It is FIG. (1) for demonstrating the internal structure of a utility power supply apparatus. Drawing 7 (A)-Drawing 7 (C) are figures (the 2) for explaining an internal configuration of a utility power supply device. FIGS. 8A to 8C are views (No. 3) for describing the internal configuration of the utility power supply device. FIG. 9A is a diagram showing a state in which the arm portion 104 is viewed from the + Y side, and FIG. 9B is an enlarged view of the leaf spring structure, and FIG. 9C and FIG. (D) is a figure for demonstrating the self-limit structure which a leaf | plate spring structure has. 4 is a plan view showing an arm 104. FIG. FIG. 11A is a perspective view showing a state where the air supply pad 106A and the delivery block 140A corresponding to the air supply pad 106A are viewed from above, and FIG. 11B is a state where the air supply pad 106A is viewed from below. FIG. 12A is a perspective view showing a state where the air supply pad 106B and the delivery block 140B corresponding to the air supply pad 106B are viewed from above, and FIG. 12B is a state where the air supply pad 106B is viewed from below. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 60 ... Power transmission apparatus (utility supply apparatus), 66 ... Slider (1st bearing part), 68A ... Hinge part, 70 ... Yaw pad (2nd bearing part), 72 ... Guide bar, 90 ... Drive mechanism (drive part) , Piping drive unit), 100 ... exposure device (pattern forming device), 101A ... tube (pipe for power supply), 103 ... main body unit, 106A, 106B ... air supply pad (pad member), 110A, 112A, 114A, 116A ... pipe (first supply path, first sub supply path), 118A ... tube, 120A, 122A, 124A ... pipe (first supply path, second sub supply path), 126A ... sixth pipe ( (Second supply path), 130A ... seventh pipe (moving body side supply path), 196a to 196f ... shallow groove (gas hydrostatic bearing part), 204a ... leaf spring part (leaf spring), 204c-204f ... self-limit structure (Restricted machine ), IL ... illumination light (energy beam), IOP ... illumination system (part of patterning apparatus), PL ... projection optical system (part of patterning apparatus), W ... wafer (object), WST ... moving body (wafer stage) ).

Claims (24)

A power supply device for supplying power to a moving body,
A main body part in which a first supply path for supplying power to the moving body is formed;
A pad member fixed to the main body portion and sandwiched between first and second surfaces facing each other of the movable body;
The pad member is
The gas static pressure bearing portion that maintains a predetermined interval between the first and second surfaces, and the predetermined interval with respect to the moving body side supply path in which an opening end is formed on at least one of the first and second surfaces. supplying the utility through, have a, a second supply passage formed in a state of communicating with the first supply passage,
The main body is
A first portion to which the pad member is fixed; and a second portion connected to the first portion via an elastic portion;
The first supply path is
Wherein the first sub-supply passage provided in the first portion, the second sub-supply channel and that for power supply device having a provided in the second portion.   The utility supply apparatus according to claim 1, wherein the static gas bearing portion has a planar bearing surface.   3. The utility power supply device according to claim 1, wherein the static gas bearing portion maintains the predetermined interval by using a part of the utility force that is supplied to the moving body via the first supply path.   The said main body part is a utility supply apparatus as described in any one of Claims 1-3 which follow the said mobile body and move within the moving surface of the said mobile body. Two pad members are provided,
The utility power supply apparatus according to claim 4, wherein the two pad members are fixed at positions substantially symmetrical with respect to the main body portion within the moving surface. A pipe for supplying power from the outside is connected to the main body,
The utility power supply apparatus according to any one of claims 1 to 5, wherein a utility force supplied from the pipe is supplied to the movable body via the main body portion and the pad member. The utility power supply apparatus according to any one of claims 1 to 6, wherein the first sub supply path and the second sub supply path are connected by a tube. The utility supply device according to claim 7 , wherein the tubes are connected in a state of having a predetermined slack. The elastic portion is a leaf spring;
Wherein the first portion and the second portion and the plate spring, the utility supply device according to any one of claims 1 to 8 that is formed by cutting a single member. Between the first portion and the second portion, said first, relative movement of the second part, in any one of claims 1 to 9, limiting mechanism for limiting within a predetermined range is provided The utility supply device described. The utility supply apparatus according to any one of claims 1 to 10 , further comprising a drive unit that drives the main body unit and the pad member along at least one axial direction in a moving plane of the moving body. The drive unit is provided in the moving member that moves along the uniaxial direction together with the main body unit and the pad member, and maintains a predetermined interval between the moving member and the moving surface of the moving body. The utility supply device according to claim 11 , further comprising: a first bearing portion. The power supply device according to claim 12 , wherein the driving unit drives the main body unit and the pad unit in a direction intersecting the one axis in the moving surface. The drive unit further includes a guide bar that extends in the uniaxial direction and is perpendicular to the moving surface, and that moves together with the moving body in the other axial direction perpendicular to the uniaxial axis in the moving surface ;
The utility supply device according to claim 12 or 13 , wherein the moving member has a second bearing portion that moves in the uniaxial direction along the guide surface and maintains a predetermined distance from the guide surface. The power supply device according to claim 14 , wherein the second bearing portion is provided on the moving member via a hinge portion that allows rotation about the one axis. The working force according to claim 11 , further comprising a pipe driving unit that drives a pipe holding member that holds the other end of the working power supply pipe having one end connected to the main body along at least one axial direction of the moving surface. Feeding device. The pipe drive unit is provided in the moving member that moves along the uniaxial direction together with the main body unit, and a first member that maintains a predetermined interval between the moving member and a moving surface of the moving body. The power supply device according to claim 16 , comprising: a bearing portion. The pipe drive unit further includes a guide bar that extends in the uniaxial direction and is perpendicular to the moving surface, and that moves together with the moving body in the other axial direction perpendicular to the one axis in the moving surface .
The moving member, the moving uniaxially along the guide surface, the utility supply apparatus according to claim 16 or 17 having a second bearing portion to maintain between the guide surface at a predetermined interval. The power supply device according to claim 18 , wherein the second bearing portion is provided on the moving member via a hinge portion that allows rotation about the one axis. A moving object that moves while holding the object;
A utility system comprising: the utility supply device according to any one of claims 1 to 19 that supplies a utility force to the movable body. A pattern forming apparatus for forming a pattern on an object by irradiation with an energy beam,
A patterning device for irradiating the object with the energy beam;
A pattern forming apparatus comprising: the moving body system according to claim 20 . A moving body that moves along a moving plane parallel to a plane that includes first and second axes orthogonal to each other ;
A power supply device that supplies power to the moving body without contact;
Piping connected to the utility supply device;
To follow the moving object, a moving member that moves while holding the for power supplying device and the pipe;
With move before Symbol in a first axial direction together with the moving member, and a guide bar having a vertical guide surface on the moving surface for guiding the movement of the said second axial direction of said moving member;
Provided on the moving member, the bearing portion maintaining a predetermined distance between the guide surfaces; mobile device comprising a. The moving body device according to claim 22 , wherein the moving member moves while maintaining a predetermined interval with respect to the moving surface. The moving body device according to claim 22 or 23 , wherein the bearing portion is provided on the moving member via a hinge portion that allows rotation about the second axis.

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