JP4954446B2 - Fiber reinforced substrate - Google Patents
Fiber reinforced substrate Download PDFInfo
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- JP4954446B2 JP4954446B2 JP2004003917A JP2004003917A JP4954446B2 JP 4954446 B2 JP4954446 B2 JP 4954446B2 JP 2004003917 A JP2004003917 A JP 2004003917A JP 2004003917 A JP2004003917 A JP 2004003917A JP 4954446 B2 JP4954446 B2 JP 4954446B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- fiber reinforced
- solvent
- reinforced substrate
- crystal polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000835 fiber Substances 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 title claims description 27
- 125000003118 aryl group Chemical group 0.000 claims description 43
- 229920000728 polyester Polymers 0.000 claims description 38
- 239000004973 liquid crystal related substance Substances 0.000 claims description 30
- -1 phenol compound Chemical class 0.000 claims description 27
- 239000002904 solvent Substances 0.000 claims description 22
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 19
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 15
- 239000010408 film Substances 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 238000005809 transesterification reaction Methods 0.000 description 8
- 238000005917 acylation reaction Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- 125000001309 chloro group Chemical group Cl* 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 150000004665 fatty acids Chemical class 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000007790 solid phase Substances 0.000 description 5
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000010933 acylation Effects 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000012783 reinforcing fiber Substances 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- LSACYLWPPQLVSM-UHFFFAOYSA-N isobutyric acid anhydride Chemical compound CC(C)C(=O)OC(=O)C(C)C LSACYLWPPQLVSM-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JFKMVXDFCXFYNM-UHFFFAOYSA-N (2,2,2-tribromoacetyl) 2,2,2-tribromoacetate Chemical compound BrC(Br)(Br)C(=O)OC(=O)C(Br)(Br)Br JFKMVXDFCXFYNM-UHFFFAOYSA-N 0.000 description 1
- MEFKFJOEVLUFAY-UHFFFAOYSA-N (2,2,2-trichloroacetyl) 2,2,2-trichloroacetate Chemical compound ClC(Cl)(Cl)C(=O)OC(=O)C(Cl)(Cl)Cl MEFKFJOEVLUFAY-UHFFFAOYSA-N 0.000 description 1
- VGCSPGQZLMQTHC-UHFFFAOYSA-N (2,2-dibromoacetyl) 2,2-dibromoacetate Chemical compound BrC(Br)C(=O)OC(=O)C(Br)Br VGCSPGQZLMQTHC-UHFFFAOYSA-N 0.000 description 1
- RQHMQURGSQBBJY-UHFFFAOYSA-N (2,2-dichloroacetyl) 2,2-dichloroacetate Chemical compound ClC(Cl)C(=O)OC(=O)C(Cl)Cl RQHMQURGSQBBJY-UHFFFAOYSA-N 0.000 description 1
- IYXUFOCLMOXQSL-UHFFFAOYSA-N (2,2-difluoroacetyl) 2,2-difluoroacetate Chemical compound FC(F)C(=O)OC(=O)C(F)F IYXUFOCLMOXQSL-UHFFFAOYSA-N 0.000 description 1
- FUKOTTQGWQVMQB-UHFFFAOYSA-N (2-bromoacetyl) 2-bromoacetate Chemical compound BrCC(=O)OC(=O)CBr FUKOTTQGWQVMQB-UHFFFAOYSA-N 0.000 description 1
- PNVPNXKRAUBJGW-UHFFFAOYSA-N (2-chloroacetyl) 2-chloroacetate Chemical compound ClCC(=O)OC(=O)CCl PNVPNXKRAUBJGW-UHFFFAOYSA-N 0.000 description 1
- KLLYGDXCCNXESW-UHFFFAOYSA-N (2-fluoroacetyl) 2-fluoroacetate Chemical compound FCC(=O)OC(=O)CF KLLYGDXCCNXESW-UHFFFAOYSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- PGZVFRAEAAXREB-UHFFFAOYSA-N 2,2-dimethylpropanoyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC(=O)C(C)(C)C PGZVFRAEAAXREB-UHFFFAOYSA-N 0.000 description 1
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 1
- QXYLYYZZWZQACI-UHFFFAOYSA-N 2,3,4,5-tetrafluorophenol Chemical compound OC1=CC(F)=C(F)C(F)=C1F QXYLYYZZWZQACI-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- TVPCUVQDVRZTAL-UHFFFAOYSA-N 2-ethylhexanoyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC(=O)C(CC)CCCC TVPCUVQDVRZTAL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ODSXJQYJADZFJX-UHFFFAOYSA-N 3,5-bis(trifluoromethyl)phenol Chemical compound OC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 ODSXJQYJADZFJX-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachloro-phenol Natural products OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 1
- DUCKXCGALKOSJF-UHFFFAOYSA-N pentanoyl pentanoate Chemical compound CCCCC(=O)OC(=O)CCCC DUCKXCGALKOSJF-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Description
本発明は、繊維強化基板に関する。 The present invention relates to a fiber reinforced substrate.
近年、電子・電子機器分野において、耐熱性、低吸湿性、寸法安定性、高周波特性などの特性の優れた絶縁樹脂基材の開発が望まれている。
絶縁樹脂基材としては、従来からガラスクロス等のシート状繊維強化材にエポキシ樹脂を含浸させた繊維強化基材が知られている(特許文献1参照)。
しかしながら、近年のハンダ鉛フリー化に伴うハンダ付け温度の高温化(260℃以上)により、ガラスクロスにエポキシ樹脂を含浸させた繊維強化基材では耐熱性が不十分であり、260℃以上の高温でハンダ付けを行うと、エポキシ樹脂が熱劣化して繊維強化基材が変形するという問題があった(特許文献1参照)。
In recent years, in the field of electronic / electronic equipment, development of insulating resin base materials having excellent characteristics such as heat resistance, low moisture absorption, dimensional stability, and high frequency characteristics has been desired.
As an insulating resin base material, a fiber reinforced base material in which a sheet-like fiber reinforcing material such as glass cloth is impregnated with an epoxy resin has been conventionally known (see Patent Document 1).
However, due to the increase in soldering temperature (260 ° C or higher) accompanying the recent lead-free soldering, the fiber reinforced base material in which the glass cloth is impregnated with epoxy resin has insufficient heat resistance, and the high temperature of 260 ° C or higher When soldering is performed, there is a problem that the epoxy resin is thermally deteriorated and the fiber-reinforced base material is deformed (see Patent Document 1).
本発明の目的は、260℃以上の高温でハンダ付けする際、変形が少ない繊維強化基板を提供することにある。 An object of the present invention is to provide a fiber-reinforced substrate with less deformation when soldering at a high temperature of 260 ° C. or higher.
即ち本発明は、下記溶媒100重量部および芳香族液晶ポリエステル0.5〜100重量部を含有してなる芳香族液晶ポリエステル溶液を、シート状繊維強化材に含浸せしめ、溶媒を除去して得られる繊維強化基板にかかるものである。
溶媒:下記一般式(I)で示されるハロゲン置換フェノール化合物を30重量%以上含有する溶媒。
(式中、Aはハロゲン原子またはトリハロゲン化メチル基を表わし、iはAの個数であって1〜5の整数を表わし、iが2以上の場合に複数あるAは互いに同一でも異なっていてもよい。)
That is, the present invention is obtained by impregnating a sheet-like fiber reinforcing material with an aromatic liquid crystal polyester solution containing 100 parts by weight of the following solvent and 0.5 to 100 parts by weight of an aromatic liquid crystal polyester and removing the solvent. It is applied to the fiber reinforced substrate.
Solvent: A solvent containing 30% by weight or more of the halogen-substituted phenol compound represented by the following general formula (I).
(In the formula, A represents a halogen atom or a trihalogenated methyl group, i represents the number of A and represents an integer of 1 to 5, and when i is 2 or more, a plurality of A's are the same or different from each other. May be good.)
本発明によれば、260℃以上の高温でハンダ付けする際、変形が少ない繊維強化基板を提供することが可能となる。 According to the present invention, it is possible to provide a fiber-reinforced substrate with less deformation when soldering at a high temperature of 260 ° C. or higher.
以下、本発明について詳細に説明する。
本発明の繊維強化基板は、芳香族液晶ポリエステル溶液をシート状繊維強化材に含浸せしめ、溶媒を除去して得られる。
本発明で使用される芳香族液晶ポリエステルは、サーモトロピック液晶ポリマーと呼ばれるポリエステルであり、450℃以下の温度で光学的に異方性を示す溶融体を形成するものである。
Hereinafter, the present invention will be described in detail.
The fiber reinforced substrate of the present invention is obtained by impregnating a sheet-like fiber reinforcement with an aromatic liquid crystal polyester solution and removing the solvent.
The aromatic liquid crystal polyester used in the present invention is a polyester called a thermotropic liquid crystal polymer, and forms a melt exhibiting optical anisotropy at a temperature of 450 ° C. or lower.
芳香族液晶ポリエステルとしては、例えば、
(1)芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸および芳香族ジオールの組み合わせを重合して得られるもの、
(2)異種の芳香族ヒドロキシカルボン酸を重合して得られるもの、
(3)芳香族ジカルボン酸と芳香族ジオールとの組み合わせを重合して得られるもの、
(4)ポリエチレンテレフタレートなどの結晶性ポリエステルに芳香族ヒドロキシカルボン酸を反応させたもの
などが挙げられる。
なお、これらの芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸または芳香族ジオールの代わりに、それらのエステル形成性誘導体を使用してもよい。
As an aromatic liquid crystal polyester, for example,
(1) What is obtained by polymerizing a combination of an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid and an aromatic diol,
(2) those obtained by polymerizing different kinds of aromatic hydroxycarboxylic acids,
(3) What is obtained by polymerizing a combination of an aromatic dicarboxylic acid and an aromatic diol,
(4) Crystalline polyesters such as polyethylene terephthalate are reacted with an aromatic hydroxycarboxylic acid.
In addition, you may use those ester-forming derivatives instead of these aromatic hydroxycarboxylic acid, aromatic dicarboxylic acid, or aromatic diol.
カルボン酸のエステル形成性誘導体としては、例えば、カルボキシル基が、ポリエステル生成反応を促進するような、酸塩化物、酸無水物などの反応性が高い誘導体となっているもの、カルボキシル基が、エステル交換反応によりポリエステルを生成するようなアルコール類やエチレングリコールなどとエステルを形成しているものなどが挙げられる。
また、フェノール性水酸基のエステル形成性誘導体としては、例えば、エステル交換反応によりポリエステルを生成するように、フェノール性水酸基がカルボン酸類とエステルを形成しているものなどが挙げられる。
Examples of the ester-forming derivative of carboxylic acid include those in which the carboxyl group is a highly reactive derivative such as an acid chloride or an acid anhydride that promotes the polyester formation reaction, and the carboxyl group is an ester. Examples include those that form esters with alcohols, ethylene glycol, or the like that form polyesters by an exchange reaction.
Examples of the ester-forming derivative of a phenolic hydroxyl group include those in which a phenolic hydroxyl group forms an ester with a carboxylic acid so that a polyester is produced by a transesterification reaction.
また、芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸および芳香族ジオールは、エステル形成性を阻害しない程度であれば、塩素原子、フッ素原子などのハロゲン原子、メチル基、エチル基などのアルキル基、フェニル基などのアリール基などで置換されていてもよい。 In addition, aromatic hydroxycarboxylic acids, aromatic dicarboxylic acids and aromatic diols are halogen atoms such as chlorine atoms and fluorine atoms, alkyl groups such as methyl groups and ethyl groups, phenyl groups, and the like, as long as they do not inhibit ester formation. It may be substituted with an aryl group such as a group.
該芳香族液晶ポリエステルの繰り返し構造単位としては、下記のものを例示することができるが、これらに限定されるものではない。 Examples of the repeating structural unit of the aromatic liquid crystal polyester include the following, but are not limited thereto.
芳香族ヒドロキシカルボン酸に由来する繰り返し構造単位:
上記の繰り返し構造単位は、ハロゲン原子またはアルキル基で置換されていてもよい。
Repeating structural units derived from aromatic hydroxycarboxylic acids:
The above repeating structural unit may be substituted with a halogen atom or an alkyl group.
芳香族ジカルボン酸に由来する繰り返し構造単位:
上記の繰り返し構造単位は、ハロゲン原子、アルキル基またはアリール基で置換されていてもよい。
Repeating structural units derived from aromatic dicarboxylic acids:
The above repeating structural unit may be substituted with a halogen atom, an alkyl group or an aryl group.
芳香族ジオールに由来する繰り返し構造単位:
上記の繰り返し構造単位は、ハロゲン原子、アルキル基またはアリール基で置換されていてもよい。
Repeating structural units derived from aromatic diols:
The above repeating structural unit may be substituted with a halogen atom, an alkyl group or an aryl group.
なお、上記のアルキル基としては、炭素数1〜10のアルキル基が好ましく、メチル基、エチル基またはブチル基がより好ましい。上記のアリール基としては、炭素数6〜20のアリール基が好ましく、フェニル基がより好ましい。 In addition, as said alkyl group, a C1-C10 alkyl group is preferable and a methyl group, an ethyl group, or a butyl group is more preferable. As said aryl group, a C6-C20 aryl group is preferable and a phenyl group is more preferable.
耐熱性、機械物性のバランスから芳香族液晶ポリエステルは、前記A1式で表される繰り返し単位を少なくとも30モル%含むことが好ましい。
繰り返し構造単位の好ましい組み合わせとしては、例えば、下記(a)〜(f)が挙げられる。
(a):
前記繰り返し構造単位(A1)、(B2)および(C3)の組み合わせ、
前記繰り返し構造単位(A2)、(B2)および(C3)の組み合わせ、
前記繰り返し構造単位(A1)、(B1)、(B2)および(C3)の組み合わせ、または、
前記繰り返し構造単位(A2)、(B1)、(B2)および(C3)の組み合わせ。
(b):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C1)に置換した組み合わせ。
(c):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C2)に置換した組み合わせ。
(d):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C4)に置換した組み合わせ。
(e):前記(a)の組み合わせのそれぞれにおいて、(C3)の一部または全部を(C4)と(C5)の混合物に置換した組み合わせ。
(f):前記(a)の組み合わせのそれぞれにおいて、(A1)の一部を(A2)に置換した組み合わせ。
Heat resistance, aromatic liquid crystal polyester from the balance of mechanical properties, preferably contains a repeating unit represented by A 1 expression at least 30 mol%.
Examples of preferable combinations of repeating structural units include the following (a) to (f).
(A):
A combination of the repeating structural units (A 1 ), (B 2 ) and (C 3 ),
A combination of the repeating structural units (A 2 ), (B 2 ) and (C 3 ),
A combination of the repeating structural units (A 1 ), (B 1 ), (B 2 ) and (C 3 ), or
A combination of the repeating structural units (A 2 ), (B 1 ), (B 2 ) and (C 3 ).
(B): In each of the combination of said (a), by substituting a part or all of (C 3) to (C 1) in combination.
(C): In each of the combination of said (a), by substituting a part or all of (C 3) to (C 2) combined.
(D): In each of the combination of said (a), by substituting a part or all of (C 3) to (C 4) combinations.
(E): In each of the combination of said (a), was replaced with a mixture of (C 3) of some or all the (C 4) (C 5) combinations.
(F): In each of the combination of said (a), by replacing part of (A 1) to (A 2) in combination.
該芳香族液晶ポリエステルとしては、耐熱性の観点から、p−ヒドロキシ安息香酸および2−ヒドロキシ−6−ナフトエ酸からなる群から選ばれた少なくとも一種の化合物に由来する繰り返し構造単位30〜80mol%、ヒドロキノンおよび4,4’−ジヒドロキシビフェニルからなる群から選ばれた少なくとも一種の化合物に由来する繰り返し構造単位10〜35mol%、テレフタル酸およびイソフタル酸からなる群から選ばれた少なくとも一種の化合物に由来する繰り返し構造単位10〜35mol%からなることが好ましい。 As the aromatic liquid crystal polyester, from the viewpoint of heat resistance, 30 to 80 mol% of repeating structural units derived from at least one compound selected from the group consisting of p-hydroxybenzoic acid and 2-hydroxy-6-naphthoic acid, 10 to 35 mol% of repeating structural units derived from at least one compound selected from the group consisting of hydroquinone and 4,4′-dihydroxybiphenyl, derived from at least one compound selected from the group consisting of terephthalic acid and isophthalic acid It preferably consists of 10 to 35 mol% of repeating structural units.
また、芳香族液晶ポリエステルの重量平均分子量は、特に限定されないが、10000〜100000であることが好ましい。 Moreover, the weight average molecular weight of the aromatic liquid crystal polyester is not particularly limited, but is preferably 10,000 to 100,000.
本発明に用いられる芳香族液晶ポリエステルの製造方法は、特に限定されないが、例えば、芳香族ヒドロキシカルボン酸および芳香族ジオールからなる群から選ばれる少なくとも1種を過剰量の脂肪酸無水物によりアシル化してアシル化物を得、得られたアシル化物と、芳香族ヒドロキシカルボン酸および芳香族ジカルボン酸からなる群から選ばれる少なくとも1種とをエステル交換(重縮合)することにより溶融重合する方法が挙げられる。アシル化物としては、予めアシル化して得た脂肪酸エステルを用いてもよい。 The method for producing the aromatic liquid crystal polyester used in the present invention is not particularly limited. For example, at least one selected from the group consisting of an aromatic hydroxycarboxylic acid and an aromatic diol is acylated with an excess amount of a fatty acid anhydride. A method of melt polymerization by obtaining an acylated product and subjecting the obtained acylated product to at least one selected from the group consisting of an aromatic hydroxycarboxylic acid and an aromatic dicarboxylic acid by transesterification (polycondensation) may be mentioned. As the acylated product, a fatty acid ester obtained by acylation in advance may be used.
アシル化反応においては、脂肪酸無水物の添加量がフェノール性水酸基の1.0〜1.2倍当量であることが好ましく、より好ましくは1.05〜1.1倍当量である。脂肪酸無水物の添加量が少ないと、エステル交換(重縮合)時にアシル化物や芳香族ヒドロキシカルボン酸、芳香族ジカルボン酸などが昇華し、反応系が閉塞し易い傾向があり、また、多すぎると、得られる芳香族液晶ポリエステルの着色が著しくなる傾向がある。 In the acylation reaction, the addition amount of the fatty acid anhydride is preferably 1.0 to 1.2 times equivalent, more preferably 1.05 to 1.1 times equivalent to the phenolic hydroxyl group. If the amount of fatty acid anhydride added is small, acylated products, aromatic hydroxycarboxylic acids, aromatic dicarboxylic acids, etc. will sublimate during transesterification (polycondensation), and the reaction system tends to be clogged. The resulting aromatic liquid crystal polyester tends to be remarkably colored.
アシル化反応は、130〜180℃で5分間〜10時間反応させることが好ましく、140〜160℃で10分間〜3時間反応させることがより好ましい。 The acylation reaction is preferably performed at 130 to 180 ° C. for 5 minutes to 10 hours, more preferably at 140 to 160 ° C. for 10 minutes to 3 hours.
アシル化反応に使用される脂肪酸無水物は,特に限定されないが、例えば、無水酢酸、無水プロピオン酸、無水酪酸、無水イソ酪酸、無水吉草酸、無水ピバル酸、無水2エチルヘキサン酸、無水モノクロル酢酸、無水ジクロル酢酸、無水トリクロル酢酸、無水モノブロモ酢酸、無水ジブロモ酢酸、無水トリブロモ酢酸、無水モノフルオロ酢酸、無水ジフルオロ酢酸、無水トリフルオロ酢酸、無水グルタル酸、無水マレイン酸、無水コハク酸、無水β−ブロモプロピオン酸などが挙げられ、これらは2種類以上を混合して用いてもよい。価格と取り扱い性の観点から、無水酢酸、無水プロピオン酸、無水酪酸、または無水イソ酪酸が好ましく用いられ、より好ましくは、無水酢酸が用いられる。 The fatty acid anhydride used in the acylation reaction is not particularly limited. For example, acetic anhydride, propionic anhydride, butyric anhydride, isobutyric anhydride, valeric anhydride, pivalic anhydride, 2-ethylhexanoic anhydride, monochloroacetic anhydride , Dichloroacetic anhydride, trichloroacetic anhydride, monobromoacetic anhydride, dibromoacetic anhydride, tribromoacetic anhydride, monofluoroacetic anhydride, difluoroacetic anhydride, trifluoroacetic anhydride, glutaric anhydride, maleic anhydride, succinic anhydride, β- Examples thereof include bromopropionic acid, and two or more of these may be used in combination. From the viewpoint of price and handleability, acetic anhydride, propionic anhydride, butyric anhydride, or isobutyric anhydride is preferably used, and acetic anhydride is more preferably used.
エステル交換においては、アシル化物のアシル基がカルボキシル基の0.8〜1.2倍当量であることが好ましい。 In the transesterification, the acyl group of the acylated product is preferably 0.8 to 1.2 times the carboxyl group.
エステル交換は、130〜400℃で0.1〜50℃/分の割合で昇温しながら行なうことが好ましく、150〜350℃で0.3〜5℃/分の割合で昇温しながら行なうことがより好ましい。 The transesterification is preferably performed while increasing the temperature at 130 to 400 ° C. at a rate of 0.1 to 50 ° C./min, and at 150 to 350 ° C. while increasing the temperature at a rate of 0.3 to 5 ° C./min. It is more preferable.
アシル化して得た脂肪酸エステルとカルボン酸とをエステル交換させる際、平衡を移動させるため、副生する脂肪酸と未反応の脂肪酸無水物は、蒸発させるなどして系外へ留去することが好ましい。 When transesterifying a fatty acid ester obtained by acylation with a carboxylic acid, it is preferable to distill out the by-product fatty acid and the unreacted fatty acid anhydride by evaporating or the like in order to move the equilibrium. .
なお、アシル化反応、エステル交換は、触媒の存在下に行なってもよい。該触媒としては、従来からポリエステルの重合用触媒として公知のものを使用することができ、例えば、酢酸マグネシウム、酢酸第一錫、テトラブチルチタネート、酢酸鉛、酢酸ナトリウム、酢酸カリウム、三酸化アンチモンなどの金属塩触媒、N,N−ジメチルアミノピリジン、N−メチルイミダゾールなどの有機化合物触媒などを挙げることができる。該触媒は、通常、モノマー類の投入時に投入され、アシル化後も除去することは必ずしも必要ではなく、該触媒を除去しない場合にはそのままエステル交換を行なうことができる。 The acylation reaction and transesterification may be performed in the presence of a catalyst. As the catalyst, those conventionally known as polyester polymerization catalysts can be used, such as magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, antimony trioxide and the like. And organic compound catalysts such as N, N-dimethylaminopyridine and N-methylimidazole. The catalyst is usually added when the monomers are added, and it is not always necessary to remove the catalyst after acylation. If the catalyst is not removed, transesterification can be carried out as it is.
エステル交換による重縮合は、通常、溶融重合により行なわれるが、溶融重合と固層重合とを併用してもよい。固相重合は、溶融重合工程からポリマーを抜き出し、その後、粉砕してパウダー状もしくはフレーク状にした後、公知の固相重合方法により行うことが好ましい。具体的には、例えば、窒素などの不活性雰囲気下、20〜350℃で、1〜30時間固相状態で熱処理する方法などが挙げられる。固相重合は、攪拌しながらでも、攪拌することなく静置した状態で行ってもよい。なお適当な攪拌機構を備えることにより溶融重合槽と固相重合槽とを同一の反応槽とすることもできる。固相重合後、得られた芳香族液晶ポリエステルは、公知の方法によりペレット化し、成形してもよい。
芳香族液晶ポリエステルの製造は、例えば、回分装置、連続装置等を用いて行うことができる。
Polycondensation by transesterification is usually performed by melt polymerization, but melt polymerization and solid phase polymerization may be used in combination. The solid phase polymerization is preferably carried out by a known solid phase polymerization method after the polymer is extracted from the melt polymerization step and then pulverized into powder or flakes. Specifically, for example, a method of heat treatment in a solid state at 20 to 350 ° C. for 1 to 30 hours under an inert atmosphere such as nitrogen can be used. Solid phase polymerization may be carried out while stirring or in a state of standing without stirring. In addition, by providing an appropriate stirring mechanism, the melt polymerization tank and the solid phase polymerization tank can be made the same reaction tank. After the solid state polymerization, the obtained aromatic liquid crystal polyester may be pelletized and molded by a known method.
The aromatic liquid crystal polyester can be produced using, for example, a batch apparatus, a continuous apparatus or the like.
本発明において芳香族液晶ポリエステル溶液を得るために用いられる溶媒は、下記一般式(I)で示されるハロゲン置換フェノール化合物を30重量%以上含有する溶媒であり、常温または加熱下に芳香族液晶ポリエステルを溶解する。該溶媒としては、該フェノール化合物を60重量%以上含有する溶媒であることが好ましく、実質的に100重量%の該フェノール化合物を溶媒として用いることが、他成分と混合する必要がないためさらに好ましい。
式中、Aはハロゲン原子またはトリハロゲン化メチル基を表わし、iはAの個数であって1〜5の整数を表わす。iが2以上の場合、複数あるAは互いに同一でも異なっていてもよいが、同一であることが好ましい。
iは好ましくは1〜3であり、より好ましくは1または2である。iが1のときのAの置換位置は4位であることが好ましく、iが2以上のとき少なくとも一つのAの置換位置は4位であることが好ましい(水酸基の置換位置を1位とする)。
The solvent used for obtaining the aromatic liquid crystal polyester solution in the present invention is a solvent containing 30% by weight or more of the halogen-substituted phenol compound represented by the following general formula (I), and the aromatic liquid crystal polyester is heated at room temperature or under heating. Dissolve. The solvent is preferably a solvent containing 60% by weight or more of the phenol compound, and more preferably 100% by weight of the phenol compound is used as the solvent because it is not necessary to mix with other components. .
In the formula, A represents a halogen atom or a trihalogenated methyl group, i represents the number of A and an integer of 1 to 5. When i is 2 or more, a plurality of A may be the same or different from each other, but are preferably the same.
i is preferably 1 to 3, more preferably 1 or 2. The substitution position of A when i is 1 is preferably the 4-position, and when i is 2 or more, the substitution position of at least one A is preferably the 4-position (the hydroxyl substitution position is the 1-position). ).
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、よう素原子が挙げられ、フッ素原子、または塩素原子が好ましく、塩素原子が特に好ましい。
ハロゲン原子がフッ素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、ペンタフルオロフェノール、テトラフルオロフェノール等が挙げられる。
ハロゲン原子が塩素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、o−クロロフェノール、p−クロロフェノールが挙げられ、溶解性の観点からp−クロロフェノールが好ましい。
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. A fluorine atom or a chlorine atom is preferable, and a chlorine atom is particularly preferable.
Examples of the halogen-substituted phenol compound represented by the general formula (I) in which the halogen atom is a fluorine atom include pentafluorophenol and tetrafluorophenol.
Examples of the halogen-substituted phenol compound represented by the general formula (I) in which the halogen atom is a chlorine atom include o-chlorophenol and p-chlorophenol, and p-chlorophenol is preferable from the viewpoint of solubility.
トリハロゲン化メチル基のハロゲンとしては、フッ素原子、塩素原子、臭素原子、よう素原子が挙げられる。
トリハロゲン化メチル基のハロゲンがフッ素原子である一般式(I)で示されるハロゲン置換フェノール化合物の例としては、3,5−ビストリフルオロメチルフェノールが挙げられる。
Examples of the halogen of the trihalogenated methyl group include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
Examples of the halogen-substituted phenol compound represented by the general formula (I) in which the halogen of the trihalogenated methyl group is a fluorine atom include 3,5-bistrifluoromethylphenol.
一般式(I)で示されるハロゲン置換フェノール化合物としては、価格と入手性の観点から、o−クロロフェノール、p−クロロフェノールなどの塩素置換フェノール化合物が好ましく使用され、溶解性の観点から、p−クロロフェノールがより好ましく使用される。 As the halogen-substituted phenol compound represented by the general formula (I), chlorine-substituted phenol compounds such as o-chlorophenol and p-chlorophenol are preferably used from the viewpoint of price and availability. -Chlorophenol is more preferably used.
該溶媒中には、溶液の保存時または後述の流延時に芳香族液晶ポリエステルを析出させるものでなければ、該ハロゲン置換フェノール化合物以外に他の成分を含有していてもよい。
含有していてもよい他の成分は、特に限定されるものではないが、例えば、クロロホルム、塩化メチレン、テトラクロロエタン等の塩素系化合物などが挙げられる。
The solvent may contain other components in addition to the halogen-substituted phenolic compound as long as the aromatic liquid crystalline polyester is not precipitated during storage of the solution or casting described later.
Other components that may be contained are not particularly limited, and examples thereof include chlorine compounds such as chloroform, methylene chloride, and tetrachloroethane.
本発明で使用される芳香族液晶ポリエステル溶液は、前記溶媒100重量部に対して、芳香族液晶ポリエステルを0.5〜100重量部含有し、作業性あるいは経済性の観点から、1〜50重量部含有することが好ましく、3〜10重量部含有することがより好ましい。芳香族液晶ポリエステルの量が少ないと、生産効率が低下する傾向があり、多いと溶解が困難になる傾向がある。 The aromatic liquid crystal polyester solution used in the present invention contains 0.5 to 100 parts by weight of the aromatic liquid crystal polyester with respect to 100 parts by weight of the solvent, and 1 to 50 weights from the viewpoint of workability or economy. It is preferable to contain 3 parts by weight, and more preferably 3 to 10 parts by weight. When the amount of the aromatic liquid crystal polyester is small, the production efficiency tends to decrease, and when the amount is large, the dissolution tends to be difficult.
本発明で使用される芳香族液晶ポリエステル溶液は、芳香族液晶ポリエステルを前記溶媒に溶解させることにより得ることができるが、該溶液は、必要に応じて、フィルターなどによってろ過して溶液中に含まれる微細な異物を除去することが好ましい。 The aromatic liquid crystal polyester solution used in the present invention can be obtained by dissolving the aromatic liquid crystal polyester in the above solvent, and the solution is included in the solution by filtration with a filter or the like, if necessary. It is preferable to remove fine foreign matters.
また、該芳香族液晶ポリエステル溶液には、本発明の目的を損なわない範囲で、シリカ、水酸化アルミニウム、炭酸カルシウムなどの無機フィラー、硬化エポキシ樹脂、架橋ベンゾグアナミン樹脂、架橋アクリルポリマーなどの有機フィラー、ポリアミド、ポリエステル、ポリフェニレンスルフィド、ポリエーテルケトン、ポリカーボネート、ポリエーテルスルホン、ポリフェニルエーテルおよびその変性物、ポリエーテルイミド等の熱可塑性樹脂、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、シアネート樹脂等の熱硬化性樹脂、シランカップリング剤、酸化防止剤、紫外線吸収剤などの各種添加剤が一種または二種以上添加されていてもよい。 In addition, the aromatic liquid crystal polyester solution includes an inorganic filler such as silica, aluminum hydroxide, and calcium carbonate, an organic filler such as a cured epoxy resin, a crosslinked benzoguanamine resin, and a crosslinked acrylic polymer, as long as the object of the present invention is not impaired. Thermosetting resins such as polyamide, polyester, polyphenylene sulfide, polyetherketone, polycarbonate, polyethersulfone, polyphenylether and modified products thereof, polyetherimide, thermoplastic resin, phenolic resin, epoxy resin, polyimide resin, cyanate resin Various additives such as a resin, a silane coupling agent, an antioxidant, and an ultraviolet absorber may be added alone or in combination.
本発明で使用されるシート状繊維強化材としては、例えば、強化繊維からなる織物、編物、不織布などが挙げられる。
強化繊維としては、例えば、ガラス繊維、炭素繊維、セラミックス繊維、ポリエステル繊維やアラミド繊維などの樹脂繊維が挙げられ、価格や耐熱性の面から、ガラス繊維が好ましく使用される。
ガラス繊維は、特に限定されないが、例えば、含アルカリガラス繊維、無アルカリガラス繊維、低誘電ガラスなどを使用することができる。
なお、強化繊維はアミノシラン系カップリング剤、エポキシシラン系カップリング剤、チタネート系カップリング剤などのカップリング処理剤等で表面処理されていてもよい。
シート状繊維強化材の厚さは、通常、5〜500μm程度である。
Examples of the sheet-like fiber reinforcement used in the present invention include woven fabrics, knitted fabrics, and nonwoven fabrics made of reinforcing fibers.
Examples of the reinforcing fibers include glass fibers, carbon fibers, ceramic fibers, polyester fibers, and aramid fibers, and glass fibers are preferably used from the viewpoint of cost and heat resistance.
Although glass fiber is not specifically limited, For example, alkali-containing glass fiber, alkali-free glass fiber, low dielectric glass, etc. can be used.
The reinforcing fiber may be surface-treated with a coupling treatment agent such as an aminosilane coupling agent, an epoxysilane coupling agent, or a titanate coupling agent.
The thickness of the sheet-like fiber reinforcement is usually about 5 to 500 μm.
本発明の繊維強化基板は、前記芳香族液晶ポリエステル溶液を前記シート状繊維強化材に含浸させ、溶媒を除去させることで得られるが、その厚みは、通常、10〜1000μm程度である。 The fiber-reinforced substrate of the present invention is obtained by impregnating the aromatic liquid crystal polyester solution into the sheet-like fiber reinforcing material and removing the solvent, and the thickness is usually about 10 to 1000 μm.
溶媒除去の方法は、特に限定されないが、溶媒の蒸発により行うことが好ましい。溶媒を蒸発させる方法としては、加熱、減圧、通風などの方法が挙げられる。
得られた繊維強化基板には、必要に応じて、熱処理を行ってもよい。
The method for removing the solvent is not particularly limited, but it is preferably performed by evaporation of the solvent. Examples of the method for evaporating the solvent include methods such as heating, decompression, and ventilation.
You may heat-process the obtained fiber reinforced board | substrate as needed.
得られた繊維強化基板は、単独で使用してもよいが、他のシートや膜などを積層して用いてもよい。
積層の方法は、特に限定されないが、得られた繊維強化基板に他のシートやフィルム(膜)などを接着剤により接着させる方法、熱プレスにより熱融着させる方法などが挙げられる。
ここで、積層される他のシートやフィルム(膜)としては、例えば、金属膜、樹脂製フィルムなどが挙げられる。
Although the obtained fiber reinforced board | substrate may be used independently, you may laminate | stack and use another sheet | seat, a film | membrane, etc.
The lamination method is not particularly limited, and examples thereof include a method in which another sheet or film (film) is adhered to the obtained fiber reinforced substrate with an adhesive, and a method in which heat fusion is performed by hot pressing.
Here, as another sheet | seat and film (film | membrane) laminated | stacked, a metal film, a resin film, etc. are mentioned, for example.
本発明の繊維強化基板は、該繊維強化基板の片面または両面に導電層を有することが好ましい。導電層の形成方法は、前述のように金属膜を積層させる方法、金属粉を繊維強化基板上にコートして導電層を形成させる方法等が一般的である。本発明の繊維強化基板は、該繊維強化基板の少なくとも片面に金属膜を積層せしめてなるものがより好ましい。
金属膜や金属粉の金属としては、銅、アルミ、銀等が挙げられるが、導電性やコストの観点から、銅が好ましく使用される。
金属膜の積層方法は、接着剤を用いて金属膜とガラス繊維強化基板とを接着する方法、熱プレスにより熱融着させる方法が一般的である。また、金属粉のコート方法としては、めっき法、スクリーン印刷法、スパッタリング法などが利用できる。
片面または両面に導電層を有する繊維強化基板は、プリント配線基材として使用することができる。
得られたプリント配線基材上には、導電層を保護する目的でカバーフィルムを更に積層してもよい。
The fiber reinforced substrate of the present invention preferably has a conductive layer on one side or both sides of the fiber reinforced substrate. As a method for forming a conductive layer, a method of laminating a metal film as described above, a method of forming a conductive layer by coating metal powder on a fiber reinforced substrate, and the like are common. The fiber reinforced substrate of the present invention is more preferably one in which a metal film is laminated on at least one surface of the fiber reinforced substrate.
Examples of the metal of the metal film or metal powder include copper, aluminum, silver, etc., but copper is preferably used from the viewpoint of conductivity and cost.
As a method for laminating a metal film, a method of bonding a metal film and a glass fiber reinforced substrate using an adhesive, or a method of heat-sealing by hot pressing is generally used. Moreover, as a coating method of the metal powder, a plating method, a screen printing method, a sputtering method, or the like can be used.
A fiber reinforced substrate having a conductive layer on one side or both sides can be used as a printed wiring substrate.
A cover film may be further laminated on the obtained printed wiring substrate for the purpose of protecting the conductive layer.
本発明の繊維強化基板は、耐熱性が高いという特徴の他に、芳香族液晶ポリエステル由来の低吸湿性などの優れた特性を生かして、携帯電話、半導体パッケージ、マザーボード用等の多層プリント基板、フレキシブルプリント配線板、リジットプリント配線板などのプリント配線板に好適に使用される。 The fiber reinforced substrate of the present invention, in addition to the feature of high heat resistance, taking advantage of excellent characteristics such as low hygroscopicity derived from aromatic liquid crystal polyester, multilayer printed circuit boards for mobile phones, semiconductor packages, motherboards, etc., It is suitably used for printed wiring boards such as flexible printed wiring boards and rigid printed wiring boards.
以下、本発明を実施例を用いて説明するが、本発明が実施例により限定されるものでないことは言うまでもない。 EXAMPLES Hereinafter, although this invention is demonstrated using an Example, it cannot be overemphasized that this invention is not what is limited by an Example.
実施例1
攪拌装置、トルクメータ、窒素ガス導入管、温度計および還流冷却器を備えた反応器に、p−ヒドロキシ安息香酸 141g(1.02モル)、4,4’−ジヒドロキシビフェニル 63.3g(0.34モル)、イソフタル酸 56.5g(0.34モル)および無水酢酸 191g(1.87モル)を仕込んだ。反応器内を十分に窒素ガスで置換した後、窒素ガス気流下で15分かけて150℃まで昇温し、温度を保持して3時間還流させた。
その後、留出する副生酢酸および未反応の無水酢酸を留去しながら170分かけて320℃まで昇温し、トルクの上昇が認められる時点を反応終了とみなし、内容物を取り出した。得られた固形分は室温まで冷却し、粗粉砕機で粉砕後、窒素雰囲気下250℃で3時間保持し、固層で重合反応を進めた。得られた粉末は350℃で偏向顕微鏡により液晶相に特有のシュリーレン模様が観察された。
Example 1
In a reactor equipped with a stirrer, a torque meter, a nitrogen gas inlet tube, a thermometer, and a reflux condenser, 141 g (1.02 mol) of p-hydroxybenzoic acid, 63.3 g of 4,4′-dihydroxybiphenyl (0. 34 mol), 56.5 g (0.34 mol) of isophthalic acid, and 191 g (1.87 mol) of acetic anhydride. After sufficiently replacing the inside of the reactor with nitrogen gas, the temperature was raised to 150 ° C. over 15 minutes under a nitrogen gas stream, and the temperature was maintained and refluxed for 3 hours.
Thereafter, while distilling off distilling by-product acetic acid and unreacted acetic anhydride, the temperature was raised to 320 ° C. over 170 minutes. The time point at which an increase in torque was observed was regarded as completion of the reaction, and the contents were taken out. The obtained solid content was cooled to room temperature, pulverized with a coarse pulverizer, held at 250 ° C. for 3 hours in a nitrogen atmosphere, and the polymerization reaction proceeded in a solid layer. In the obtained powder, a schlieren pattern peculiar to the liquid crystal phase was observed at 350 ° C. with a deflection microscope.
得られた芳香族液晶ポリエステル粉末 0.4gを、100kg荷重下、250℃で10分間、島津製作所(株)製フローテスタCFT−500を用いて圧縮成形し、厚さ3mmの円盤状の試験片を得た。この試験片を用いて、東洋製作所製の恒温恒湿機ADVANTEC AGX型により85℃/85%RH・168時間における吸水率を測定した結果、吸水率は0.1%以下であることを確認した。 0.4 g of the obtained aromatic liquid crystal polyester powder was compression molded using a flow tester CFT-500 manufactured by Shimadzu Corporation under a 100 kg load at 250 ° C. for 10 minutes, and a disk-shaped test piece having a thickness of 3 mm. Got. Using this test piece, the water absorption rate at 85 ° C./85% RH · 168 hours was measured by a constant temperature and humidity machine ADVANTEC AGX type manufactured by Toyo Seisakusho, and it was confirmed that the water absorption rate was 0.1% or less. .
上記工程により得られた芳香族液晶ポリエステル粉末 0.5gをp−クロロフェノール 9.5gに加え、120℃に加熱した結果、完全に溶解した溶液が得られた。この溶液をシート状繊維強化材であるガラスクロス(⇒旭ファイバーグラス製 MS100 厚み110μm)に含浸させ、ホットプレートにより設定温度100℃、1時間加熱して溶媒を蒸発させた。更にその後、熱風式乾燥機により300℃、1時間熱処理を行い、厚み100μmの芳香族液晶ポリエステル樹脂含浸シートを得た。得られた芳香族液晶ポリエステル樹脂含浸シートを一層単独で繊維強化基板として使用し、はんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。該繊維強化基板は変形や膨れも見られなかった。 As a result of adding 0.5 g of the aromatic liquid crystal polyester powder obtained in the above step to 9.5 g of p-chlorophenol and heating to 120 ° C., a completely dissolved solution was obtained. This solution was impregnated into a glass cloth (⇒Asahi Fiber Glass MS100 thickness 110 μm), which is a sheet-like fiber reinforcement, and heated on a hot plate at a set temperature of 100 ° C. for 1 hour to evaporate the solvent. Thereafter, heat treatment was performed at 300 ° C. for 1 hour using a hot air dryer to obtain an aromatic liquid crystal polyester resin-impregnated sheet having a thickness of 100 μm. The obtained aromatic liquid crystal polyester resin-impregnated sheet was used alone as a fiber reinforced substrate, and immersed in a solder bath having a solder temperature of 280 ° C. for 1 minute, and the surface state was observed. The fiber reinforced substrate was not deformed or swollen.
比較例1
エポキシ樹脂をガラスクロスに含浸させたもの(FR−4、日立化成製)をはんだ温度280℃のはんだ浴に1分間浸漬させ表面状態を観察した。FR−4は一部が熱劣化しており基板自体の変形も見られた。
Comparative Example 1
A glass cloth impregnated with an epoxy resin (FR-4, manufactured by Hitachi Chemical Co., Ltd.) was immersed in a solder bath having a solder temperature of 280 ° C. for 1 minute, and the surface state was observed. A part of FR-4 was thermally deteriorated, and the substrate itself was also deformed.
Claims (3)
溶媒:下記一般式(I)で示されるハロゲン置換フェノール化合物を30重量%以上含有する溶媒。
(式中、Aはハロゲン原子またはトリハロゲン化メチル基を表わし、iはAの個数であって1〜5の整数を表わし、iが2以上の場合に複数あるAは互いに同一でも異なっていてもよい。) A method for producing a fiber-reinforced substrate, comprising impregnating a glass cloth with an aromatic liquid crystal polyester solution containing 100 parts by weight of the following solvent and 0.5 to 100 parts by weight of an aromatic liquid crystal polyester, and removing the solvent.
Solvent: A solvent containing 30% by weight or more of the halogen-substituted phenol compound represented by the following general formula (I).
(In the formula, A represents a halogen atom or a trihalogenated methyl group, i represents the number of A and represents an integer of 1 to 5, and when i is 2 or more, a plurality of A's are the same or different from each other. May be good.)
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