JP4940680B2 - Resin composition and prepreg and laminate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition based on a cyanate resin excellent in high thermal resistance while sustaining flame retardancy, and to provide a prepreg and a laminated plate using the same. <P>SOLUTION: The invention relates to the resin composition comprising (a) the cyanate resin, (b) a bismaleimide compound, (c) an brominated epoxy resin, and (d) non-halogenated epoxy resin, wherein the bromine content in the solid content of the resin is 4-10 wt.%., and to the resin composition compounded with an inorganic filler to the resin composition. The invention relates to the prepreg obtained by impregnating the resin composition into a base or coating the same. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a cyanate ester resin-based resin composition used as a printed wiring board material for forming an electric circuit, a prepreg and a laminate using the same.

  Cyanate ester resin has long been known as a thermosetting resin with excellent heat resistance and electrical characteristics. Resin compositions using a combination of a cyanate ester resin with a bismaleimide compound or an epoxy resin have recently been used for semiconductor plastic packages. It is widely used for high-performance printed wiring board materials such as (see, for example, Patent Document 1). Currently, lead-free solder having a high melting temperature has begun to be used for environmental reasons (see, for example, Patent Document 2). When mounting this lead-free solder, printed wiring boards using conventional laminated boards are heat resistant. Therefore, a laminate having higher heat resistance that can cope with the mounting temperature is demanded (see, for example, Patent Document 3). In order to achieve high heat resistance in laminated boards using cyanate ester resin compositions, it is conceivable to increase the glass transition temperature, and methods such as increasing the press temperature, increasing the press time, and baking after pressing have been studied. It was. However, in order to impart flame retardancy to these resin compositions, usually about 12 to 18% by weight of bromine is blended as a brominated epoxy resin or the like (for example, see Patent Documents 1 and 4: Examples). Since the laminates obtained by curing these resin compositions are likely to swell when exposed to high temperatures for a long time, it has been difficult to improve the glass transition temperature by the above method.

Japanese Patent Laid-Open No. 08-240661 JP 2001-308509 A JP 2005-112981 A JP 2001-329080 A

  The present invention aims to provide a resin composition excellent in high heat resistance while maintaining flame retardancy in a cyanate ester resin composition used for printed wiring board materials and the like. A prepreg and a laminate using the same are provided.

  As a result of intensive studies to solve the above problems, the present inventor has found it difficult to achieve high heat resistance by suppressing the bromine content in a resin composition in which a bismaleimide compound is blended with a cyanate ester resin. The inventors have found that a flammable copper-clad laminate can be obtained and have reached the present invention. That is, the present invention contains a cyanate ester resin (a), a bismaleimide compound (b), a brominated epoxy resin (c), a non-halogen epoxy resin (d), and a bromine content in the resin solid content. Is a resin composition having 4 to 10% by weight, preferably a brominated epoxy resin (c) is a resin composition having a resin solid content of 10 to 25% by weight, and these resin compositions are inorganicly filled. A resin composition containing the material (e), more preferably a prepreg obtained by impregnating or applying the resin composition to the substrate (f), and the prepreg combined with a metal foil and cured. It is a metal foil-clad laminate.

  The metal foil-clad laminate obtained by curing the prepreg obtained from the resin composition according to the present invention has a feature of excellent heat resistance while maintaining flame retardancy, and therefore can be applied to lead-free solder mounting. Therefore, it is suitable for the printed wiring board material corresponding to high density, and the industrial practicality is extremely high.

  The cyanate ester resin (a) used in the present invention is not particularly limited as long as it is a compound having two or more cyanate groups in one molecule. Specific examples thereof include 1,3- or 1,4-dicyanate benzene, 1,3,5-tricyanate benzene, 1,3-, 1,4-, 1,6-, 1,8-, 2 , 6- or 2,7-dicyanate naphthalene, 1,3,6-tricyanate naphthalene, 4,4-dicyanate biphenyl, bis (4-cyanatephenyl) methane, bis (3,5-dimethyl-4-cyanatephenyl) ) Methane, 2,2-bis (4-cyanatephenyl) propane, 2,2-bis (3,5-dimethyl-4-cyanatephenyl) propane, bis (4-cyanatephenyl) ether, various novolaks and hydroxyl group-containing heat Cyanate esters obtained by reacting oligomers of plastic resins (for example, hydroxypolyphenylene ether, hydroxypolystyrene, hydroxypolycarbonate, etc.) with cyanogen halides, polyfunctional phenols formed by bonding phenol with dicyclopentadiene and Gen cyanide and cyanate esters obtained by reacting (Japanese publication No. 61-501094) and the like, can also be used by mixing one or two or more appropriately. Preferred cyanate ester resins (a) include 2,2-bis (4-cyanatephenyl) propane, phenol novolac type cyanate ester resins, and naphthol aralkyl type cyanate ester resins. The blending amount of the cyanate ester resin (a) is not particularly limited. However, if the blending amount is too small, the heat resistance of the resulting laminate is lowered, and if it is too much, the moisture resistance is lowered. A range of 10 to 70% by weight is preferred, and a range of 20 to 50% by weight is particularly suitable.

  The bismaleimide compound (b) used in the present invention is not particularly limited as long as it is a compound having two or more maleimide groups in one molecule. Specific examples thereof include bis (4-maleimidophenyl) methane, 2,2-bis {4- (4-maleimidophenoxy) -phenyl} propane, bis (3,5-dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bis (3,5-diethyl-4-maleimidophenyl) methane, prepolymers of these bismaleimide compounds, or prepolymers of bismaleimide compounds and amine compounds, etc. It is also possible to use one kind or a mixture of two or more kinds as appropriate. More preferred are bis (4-maleimidophenyl) methane, 2,2-bis {4- (4-maleimidophenoxy) -phenyl} propane, bis (3-ethyl-5-methyl-4-maleimidophenyl) Methane is mentioned. The blending amount of the bismaleimide compound (b) is not particularly limited, but if the blending amount is too small, the heat resistance of the resulting laminated plate is lowered, and if it is too much, the hygroscopic property is lowered. A range of 50% by weight is preferred, and a range of 3-40% by weight is particularly suitable.

  The brominated epoxy resin (c) used in the present invention is not particularly limited as long as it is a bromine compound having two or more epoxy groups in one molecule. Specific examples include brominated bisphenol A type epoxy resins and brominated phenol novolac type epoxy resins. These brominated epoxy resins (c) can be used alone or in admixture of two or more. The amount of the brominated epoxy resin (c) is such that the bromine content of the resin solids is in the range of 4 to 10% by weight, preferably in the range of 5 to 8% by weight. More preferably, it is a resin composition in which the brominated epoxy resin (c) is 10 to 25% by weight of the resin solid content.

  The non-halogen epoxy resin (d) used in the present invention is not particularly limited as long as it is a non-halogen compound having two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, trifunctional phenol type epoxy resin, tetrafunctional phenol type epoxy resin, naphthalene type epoxy Resin, biphenyl type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, cycloaliphatic epoxy resin, polyol type epoxy resin, glycidylamine, glycidyl ester, butadiene and other double bonds And compounds obtained by the reaction of hydroxyl group-containing silicon resins with epichlorohydrin. Preferable examples include phenol novolac type epoxy resins, biphenyl type epoxy resins, phenol aralkyl type epoxy resins, biphenyl aralkyl type epoxy resins, and naphthol aralkyl type epoxy resins. These non-halogen epoxy resins (d) can be used alone or in combination of two or more. The blending amount of the non-halogen epoxy resin (d) is preferably in the range of 15 to 60% by weight, particularly preferably in the range of 25 to 50% by weight, based on the resin solid content.

  If necessary, the resin composition of the present invention can be used in combination with a curing accelerator in order to adjust the curing rate as appropriate. These are not particularly limited as long as they are generally used as curing accelerators for cyanate ester resins (a) and epoxy resins. Specific examples thereof include organic metal salts such as copper, zinc, cobalt and nickel, imidazoles and derivatives thereof, and tertiary amines.

  It is preferable to use an inorganic filler (e) in combination with the resin composition of the present invention. Specific examples of the inorganic filler (e) include natural silica, fused silica, amorphous silica, silica such as hollow silica, molybdenum compounds such as molybdenum oxide and zinc molybdate, alumina, clay, kaolin, talc, calcined clay, Examples include calcined kaolin, calcined talc, mica, short glass fibers (fine glass powders such as E glass and D glass), and hollow glass. The average particle size of the inorganic filler (e) is 0.1 to 10 μm, preferably 0.2 to 5 μm, and those having a changed particle size distribution or average particle size can be used in appropriate combination. The blending ratio of the inorganic filler (e) is not particularly limited, but is preferably 10 to 150 parts by weight, and particularly preferably 30 to 100 parts by weight with respect to 100 parts by weight of the resin solid content.

  A silane coupling agent can be used in combination with the inorganic filler (e) used in the present invention. These silane coupling agents are not particularly limited as long as they are silane coupling agents generally used for inorganic surface treatment. Specific examples include aminosilanes such as γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, epoxysilanes such as γ-glycidoxypropyltrimethoxysilane, γ Vinyl silanes such as -methacryloxypropyltrimethoxysilane, cationic silanes such as N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride, phenylsilanes, etc. It is also possible to use one kind or a combination of two or more kinds as appropriate.

  The resin composition of the present invention may be used in combination with other thermosetting resins, thermoplastic resins and oligomers thereof, various polymer compounds such as elastomers, additives, etc., as long as the desired properties are not impaired. Is possible. These are not particularly limited as long as they are generally used. For example, as additives, ultraviolet absorbers, antioxidants, photopolymerization initiators, fluorescent brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, A brightener, a polymerization inhibitor, and the like can be used in appropriate combination as desired.

  In the resin composition of the present invention, an organic solvent can be used as necessary. As the organic solvent, in particular, a mixture of the cyanate ester resin (a), the bismaleimide compound (b), the brominated epoxy resin (c), and the non-halogen epoxy resin (d) is compatible. It is not limited. Specific examples include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, aromatic hydrocarbons such as benzene, toluene, and xylene, amides such as dimethylformamide and dimethylacetamide, and the like.

  As the base material (f) used in the present invention, known materials used for various printed wiring board materials can be used. For example, inorganic fibers such as E glass, D glass, S glass, NE glass, and quartz, and organic fibers such as polyimide, polyamide, and polyester can be used. It is also possible to use in combination. Examples of the shape include woven fabric, non-woven fabric, roving, chopped strand mat, and surfacing mat. The thickness is not particularly limited, but usually about 0.01 to 0.3 mm is used. Moreover, what surface-treated with the silane coupling agent etc., and what carried out the fiber opening process physically in the woven fabric can use it suitably from the surface of moisture absorption heat resistance. In addition, a film of polyimide, polyamide, polyester or the like can be used as the base material (f), and the thickness of the film is not particularly limited, but is preferably about 0.002 to 0.05 mm, and more preferably surface-treated by plasma treatment or the like. .

  The method for producing a prepreg of the present invention comprises a resin composition comprising a cyanate ester resin (a), a bismaleimide compound (b), a brominated epoxy resin (c) and a non-halogen epoxy resin (d) as essential components. If it is a method which can manufacture a prepreg combining a base material and a base material (f), it will not specifically limit. For example, after impregnating or applying the resin composition to the base material (f), it is semi-cured by a method of heating in a dryer at 100 to 200 ° C. for 1 to 60 minutes, etc. to produce a prepreg, etc. Can be mentioned. The amount of the resin composition attached to the substrate (f) is preferably in the range of 20 to 95% by weight in terms of the amount of prepreg resin (including inorganic filler).

The metal foil-clad laminate of the present invention is formed by lamination using the above prepreg. Specifically, it is manufactured by laminating one or more of the above-described prepregs and laminating with a configuration in which a metal foil such as copper or aluminum is arranged on one or both sides as desired. The metal foil to be used is not particularly limited as long as it is used for a printed wiring board material. As a molding condition, a general laminated board for a printed wiring board and a multilayer board can be applied. For example, using a multi-stage press, multi-stage vacuum press, continuous molding, autoclave molding machine, etc., the temperature is generally 150 to 300 ° C., the pressure is ^{2 to} 100 kgf / cm ² , and the heating time is generally in the range of 0.05 to 5 hours. . Moreover, it is also possible to make a multilayer board by combining the prepreg of the present invention and a separately prepared wiring board for an inner layer, and performing lamination molding.
Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.

Example 1
2,2-bis (4-cyanatephenyl) propane (Mitsubishi Gas Chemical Co., Ltd.) 60 parts by weight, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (BMI-70, manufactured by Kay Kasei) 40 A part by weight was heated and melted at 160 ° C. and reacted for 6 hours with stirring to obtain an oligomer resin composition. Dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide, 70 parts by weight of phenol novolac epoxy resin (Epicron N-770, manufactured by Dainippon Ink and Chemicals), brominated phenol novolac epoxy resin (BREN-S, Br Content: 35.5 wt%, Nippon Kayaku 30 parts by weight, silane coupling agent (Silane A187, Nihon Unicar) 2 parts by weight dissolved and mixed with methyl ethyl ketone, and further calcined talc (BST-200L, Nippon Talc) ) 100 parts by weight and 0.08 parts by weight of zinc octylate were mixed to obtain a varnish (bromine content 5.3% by weight in the resin solid content). This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 8 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four sheets of this prepreg are stacked, and 12 μm thick electrolytic copper foil is placed one above the other, and pressed at a pressure of 30 kgf / cm ² and a temperature of 220 ° C. for 120 minutes, a 0.4 mm thick copper clad laminate A Got. Next, this laminate A was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper clad laminate B having a further increased degree of resin curing. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Example 2)
In Example 1, instead of 70 parts by weight of phenol novolac type epoxy resin and 30 parts by weight of brominated phenol novolac type epoxy resin, 50 parts by weight of phenol novolac type epoxy resin (Epiclon N-770), brominated phenol novolak type epoxy resin (BREN-S) The procedure of Example 1 was repeated except that 30 parts by weight and 20 parts by weight of brominated bisphenol A type epoxy resin (DER515, Br content: 23% by weight, manufactured by Dow Chemical) were used. The bromine content in the resin solids was 7.6% by weight). This varnish was diluted with methyl ethyl ketone, impregnated on 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 10 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate C having a thickness of 0.4 mm. Next, this laminate C was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper clad laminate D having a further increased degree of resin curing. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Example 3)
In Example 1, instead of 70 parts by weight of phenol novolac type epoxy resin, 70 parts by weight of cresol novolac type epoxy resin (Epicron N-680, manufactured by Dainippon Ink & Chemicals) was used, and instead of 100 parts by weight of calcined talc, Except for using 150 parts by weight of fused silica (SC-2050, manufactured by Admatech), the same procedure as in Example 1 was carried out to obtain a varnish (bromine content in resin solid content: 5.3% by weight). This varnish was diluted with methyl ethyl ketone, impregnated on 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 12 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate E having a thickness of 0.4 mm. Next, this laminate E was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper clad laminate F with a further increased degree of resin curing. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

Example 4
36 parts by weight of 2,2-bis (4-cyanatephenyl) propane (Mitsubishi Gas Chemical) and 54 parts by weight of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (BMI-70) at 160 ° C The mixture was heated and melted and reacted for 6 hours with stirring to obtain an oligomer resin composition. Dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide, 70 parts by weight of phenol novolac epoxy resin (Epiclon N-770), 40 parts by weight of brominated phenol novolac epoxy resin (BREN-S), silane coupling agent (Silane A187) 2 parts by weight is dissolved and mixed with methyl ethyl ketone, and further 80 parts by weight of calcined talc (BST-200L) and 0.10 parts by weight of zinc octylate are mixed to form varnish (bromine content 7.1% by weight in resin solids) ) This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 7 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate G having a thickness of 0.4 mm. Next, this laminated board G was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper clad laminated board H in which the degree of curing of the resin was further increased. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Example 5)
48 parts by weight of 2,2-bis (4-cyanatephenyl) propane (Mitsubishi Gas Chemical), 28 parts by weight of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (BMI-70), bis (4 -Maleimidophenyl) methane (BMI-H) 4 parts by weight was melted at 160 ° C. and reacted for 6 hours with stirring to obtain an oligomer resin composition. Dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide, 20 parts by weight of phenol novolac type epoxy resin (Epiclon N-770), 60 parts by weight of biphenyl aralkyl type epoxy resin (NC-3000-H, Nippon Kayaku) , 40 parts by weight of brominated phenol novolac type epoxy resin (BREN-S), 2 parts by weight of silane coupling agent (silane A187) are dissolved and mixed with methyl ethyl ketone, and further 80 parts by weight of calcined talc (BST-200L), zinc octylate 0.12 part by weight was mixed to obtain a varnish (bromine content in resin solid content: 7.1% by weight). This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and heated and dried at 160 ° C. for 15 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate I having a thickness of 0.4 mm (Example 9). Next, this laminated board I was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper-clad laminated board J in which the degree of curing of the resin was further increased. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Example 6)
2,2-bis (4-cyanatephenyl) propane (manufactured by Mitsubishi Gas Chemical), 72 parts by weight, 8 parts by weight of bis (4-maleimidophenyl) methane (BMI-H) are heated and melted at 150 ° C. with stirring. The mixture was reacted for 4 hours to obtain a prepolymer. This is dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide, 74 parts by weight of cresol novolac type epoxy resin (Epiclon N-680), 6 parts by weight of bisphenol A type epoxy resin (Epicoat 1001, made by Japan Epoxy Resin), brominated phenol novolak Type epoxy resin (BREN-S) 40 parts by weight, silane coupling agent (silane A187) 2 parts by weight dissolved and mixed with methyl ethyl ketone, and further calcined talc (BST-200L) 80 parts by weight, zinc octylate 0.08 parts by weight Thus, a varnish (bromine content in the resin solid content: 7.1% by weight) was obtained. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 8 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate K having a thickness of 0.4 mm. Next, this laminated board K was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper clad laminated board L in which the degree of curing of the resin was further increased. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Comparative Example 1)
In Example 1, instead of 70 parts by weight of phenol novolac type epoxy resin and 30 parts by weight of brominated phenol novolac type epoxy resin, 30 parts by weight of phenol novolac type epoxy resin (Epiclon N-770), brominated phenol novolak type epoxy resin (BREN-S) The same procedure as in Example 1 was conducted except that 70 parts by weight and the amount of zinc octylate was changed to 0.04 parts by weight. Varnish (12.4% by weight bromine content in the resin solids) Got. This varnish was diluted with methyl ethyl ketone, impregnated on 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 10 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Example 1 to obtain a copper clad laminate M having a thickness of 0.4 mm. Next, this laminated board M was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper-clad laminated board N with a further increased degree of resin curing, but some swelling was observed. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Comparative Example 2)
In Comparative Example 1, Comparative Example 1 except that 100 parts by weight of brominated bisphenol A type epoxy resin (DER515) was used instead of 30 parts by weight of phenol novolac type epoxy resin and 70 parts by weight of brominated phenol novolac type epoxy resin. In the same manner as above, a varnish (bromine content in the resin solid content 11.5% by weight) was obtained. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 8 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Comparative Example 1 to obtain a copper clad laminate O having a thickness of 0.4 mm. Next, this laminated board O was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper-clad laminated board P in which the degree of curing of the resin was further increased, but some swelling was observed. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Comparative Example 3)
In Example 2, instead of 100 parts by weight of brominated bisphenol A type epoxy resin, 100 parts by weight of bisphenol A type epoxy resin (Epicoat 1001) was used. The bromine content was 0% by weight. This varnish was diluted with methyl ethyl ketone, impregnated on 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 9 minutes to obtain a prepreg having a resin content of 48% by weight. Next, four prepregs were stacked and performed in the same manner as in Comparative Example 1 to obtain a copper clad laminate Q having a thickness of 0.4 mm. Next, this laminated board Q was heated in a constant temperature bath at 240 ° C. for 2 hours to obtain a copper-clad laminated board R in which the degree of curing of the resin was further increased. Tables 1 and 2 show the physical property measurement results of the obtained copper-clad laminate.

(Measuring method)
1) Heat resistance in the air: Using a test piece with double-sided copper foil of size 150mm x 150mm, visually check for the presence of blistering after heating for 1 hour and 2 hours in a constant temperature bath at 240 ° C. (Number of swelling plates / number of tests (n = 4))
2) Glass transition temperature: Measured with a DMA measuring device (TA Instrument 2980 type) under a temperature rising rate of 5 ° C./min using a test piece obtained by etching away a copper foil of size 40 mm × 13 mm. (Average value of n = 2)
3) Solder heat resistance: Using a test piece with double-sided copper foil of size 50 mm x 50 mm, float it in a solder bath at 280 ° C and measure the time until blistering occurs. However, the maximum time is 30 minutes. If no swelling occurs at that time,> 30 is displayed. (N = 3)
4) Moisture absorption and heat resistance: Use a test piece from which copper foil other than half of one side of size 50mm x 50mm is removed by etching, and pressurize cooker tester (Hirayama Seisakusho, PC-3 type) at 121 ° C, 2 atm. After 5 hours of treatment, visually check for the appearance of blisters after being immersed in 260 ° C solder for 60 seconds. (Number of swelling plates / number of tests (n = 3))
5) Flame resistance: Measured according to UL94 vertical test method. (N = 5)

In addition, about copper clad laminated board N and P, it measured using the part which has not generate | occur | produced.

Claims (5)

It contains a cyanate ester resin (a), a bismaleimide compound (b), a brominated epoxy resin (c), a non-halogen epoxy resin (d) and an inorganic filler (e), and the blending amount of the inorganic filler is The resin composition which is 10-150 weight part with respect to 100 weight part of resin solid content, and the bromine content in resin solid content is 4-10 weight%.   The resin composition according to claim 1, wherein the content of the brominated epoxy resin (c) is 10 to 25% by weight of the resin solid content. The resin composition which mix | blended the silane coupling agent with the resin composition of Claim 1 or 2.   A prepreg obtained by impregnating or coating the base material (f) with the resin composition according to claim 1.   A metal foil-clad laminate obtained by combining and curing the prepreg according to claim 4 and a metal foil.