JP4926236B2 - Mounting method of electronic parts - Google Patents

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component taken out from a component supply unit arranged in parallel on a feeder base of a cart detachable from a mounting apparatus main body on a substrate.

  An electronic component mounting apparatus for mounting an electronic component on a substrate is disclosed in, for example, Patent Document 1. In this type of electronic component mounting device, it is common that a cart having a plurality of component supply units arranged side by side on a feeder base is detachable from the mounting device body. In the work of arranging the supply unit and the work of attaching which cart to which type of substrate to be mounted on the mounting apparatus main body, it is easy to make a mistake in the correspondence, and it takes time.

JP 2007-96176 A

  Moreover, in today's handling of many types of printed circuit boards, it has become a very difficult task.

  Therefore, the present invention makes it possible to easily perform work on where to place which component supply unit on the feeder base of the cart, and which kind of board is attached to the mounting apparatus main body, Therefore, it aims at improving the productivity of a board | substrate.

For this reason, the first invention is a mounting method of an electronic component in which an electronic component taken out from a component supply unit arranged in parallel on a feeder base of a cart detachable from the mounting device body is mounted on a substrate.
Collating the component arrangement data of the component supply unit arranged in parallel with the cart related to the predetermined model of the board and the component arrangement data of the component supply unit related to another model,
It is determined whether or not both placement data match by this collation,
If they match, make them the same group,
The board types of the same group are displayed on a monitor.

According to a second aspect of the present invention, there is provided an electronic component mounting method in which an electronic component taken out from a component supply unit arranged in parallel on a feeder base of a cart detachable from the mounting device body is mounted on a substrate.
Collating the component arrangement data of the component supply unit arranged in parallel with the cart related to the predetermined model of the board and the component arrangement data of the component supply unit related to another model,
It is determined whether or not both placement data match by this collation,
If they match, make them the same group,
It is characterized by printing the model of the board made into the same group.

  The present invention makes it easy to work on which part supply unit is arranged on the feeder base of the cart and which cart is attached to the mounting apparatus body when producing which type of board. Thus, the productivity of the substrate can be improved.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is the figure which represented typically about component arrangement | positioning of the apparatus number "apparatus 1", "apparatus 2", and "apparatus 3" of the electronic component mounting apparatus of printed circuit board model DATA-1. It is a figure which shows the component arrangement | positioning data for every model of a printed circuit board for every block for every apparatus number. It is a figure which shows the components arrangement | positioning data for every model of a printed circuit board. It is a figure which shows the flowchart for collating and classifying the component arrangement | positioning data of the component supply unit which concerns on the predetermined model of a board | substrate, and the component arrangement | positioning data of the component supply unit which concerns on another model. It is a figure which shows the group classified. It is a figure which shows the flowchart which concerns on acquisition of a production possible model list. It is a figure which shows the screen for a setup change instruction | indication.

  Hereinafter, embodiments of the present invention will be described. First, in FIG. 1, an electronic component mounting apparatus 1 constituting a board assembly / mounting line includes a transport apparatus 2 that transports a printed board P as a board, and a front side and a back side across the transport apparatus 2. Component supply device 3 for supplying the electronic components to be used, a pair of beams 4A and 4B movable in one direction (Y direction) by a drive source, and a plurality of (for example, twelve) holding means, each of which is suction A nozzle 5 is detachably provided, and a mounting head 6 that is movable and rotatable by each drive source in a direction along each of the beams 4A and 4B is provided.

  The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1, and the substrate supply unit 2 </ b> A that inherits the printed circuit board P from the upstream device and the electrons held by the suction nozzles 5 of the mounting heads 6. A substrate positioning unit 2B for positioning and fixing the printed circuit board P supplied from the substrate supply unit 2A for mounting components, and the printed circuit board P on which electronic components are mounted by the substrate positioning unit 2B are inherited and conveyed to a downstream device. The substrate supply unit 2C, the substrate positioning unit 2B, and the substrate discharge unit 2C can be adjusted in accordance with the width of the printed circuit board P (the width in the direction orthogonal to the transport direction). Consists of a conveyor.

  The component supply device 3 includes a plurality of component supply units 3B arranged in parallel on a feeder base 3A of a cart with casters, and the mounting device main body so that the tip portion on the component supply side faces the conveyance path of the printed circuit board P. 2 is detachably disposed via a connector (not shown), and can be moved by a caster provided on the lower surface when the connector is released and the handle is pulled. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, the electronic components are supplied one by one to the component extraction position of the component supply unit 3B, and are extracted from each storage portion by the suction nozzle 5 of the mounting head 6.

  The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved by sliding the sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 7. Move in the Y direction. The Y-direction linear motor 7 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 9, respectively. A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the component take-out position of the printed board P and the component supply unit 3B on the substrate positioning unit 2B of the transport device 2.

  Each mounting head 6 is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor 10, and the mounting head 6 is rotated around a vertical axis by a θ-axis motor 11. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 8 denotes a component recognition camera that images the electronic component sucked and held by the suction nozzle 5, and reference numeral 12 denotes a substrate recognition camera 12 for imaging recognition marks M1 and M2 for confirming the position of the printed circuit board P. 6 is installed. 13A and 13B are nozzle stockers for storing various suction nozzles 5, and the maximum number of nozzles that can be arranged is 24.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a control device 21 including a microcomputer as a control means and a determination means, and a storage device 23 is connected to the control device 21 via a bus line 24. Yes. Further, a monitor 25 as a display device for displaying an operation screen and the like, and a touch panel switch 26 as an input means formed on the display screen of the monitor 25 are connected to the control device 21 via an interface 27. The Y-direction linear motor 9 and the like are connected to the control device 21 via a drive circuit 28 and an interface 27.

  The storage device 23 stores pattern program data for moving the electronic component mounting apparatus 1 for each type of printed circuit board P to be produced. Each pattern program data includes the size of the printed circuit board P in the X and Y directions, Board information data composed of thickness, presence / absence of board recognition, etc., X coordinate, Y coordinate, angle information in the printed circuit board P for each mounting order (step number), arrangement number of the component supply unit 3B, etc. Data, component placement data which is information on the type of each electronic component corresponding to the placement number on the feeder base 3A of each component supply unit 3B), and which type of suction nozzle at which position of which mounting head 6 Nozzle arrangement data indicating whether 5 is attached or the like.

  The storage device 23 stores component library data relating to the characteristics of electronic components for each component ID. That is, the component library data is constituted of, for example, the size in the X direction and the Y direction, the type of the storage tape C (embossed tape, paper tape), and the like for each component ID.

  A recognition processing device 29 is connected to the control device 21 via an interface 27. The recognition processing device 29 performs recognition processing of an image captured by the board recognition camera 8 or the component recognition camera 12. The processing result is sent to the control device 21. That is, the control device 21 performs recognition processing (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 18 or the position of the printed printed circuit board P) by the image captured by the board recognition camera 8 or the component recognition camera 12. Thus, the instruction is output to the recognition processing device 29 and the recognition processing result is received from the recognition processing device 29.

  Next, the case where three electronic component mounting apparatuses 1 are connected and arranged in parallel as a mounting line will be described as an example with reference to FIGS. FIG. 3 schematically shows the component arrangement of the device numbers “device 1”, “device 2”, and “device 3” of the electronic component mounting device 1 of the model DATA-1 of the printed circuit board P. FIG. The component arrangement data for each type of printed circuit board for each block is shown. As a result, the component arrangement data for each cart is created and stored in the storage device 23.

  That is, in FIG. 4, each electronic component mounting device 1 has a component supply device 3 on the back side (“block 1”) for each type of printed circuit board P (DATA-1, 2,...). A plurality of component supply units 3B are arranged on the feeder base 3A of the cart (the arrangement of the component supply units 3B group is represented by component arrangements 1, 7,...), And the component supply on the near side is provided. For the device 3 (represented by “block 2”), a plurality of component supply units 3B are arranged on the feeder base 3A of the cart (the arrangement of the component supply units 3B group is divided into component arrangements 2, 8,... -)

  The component arrangement data constituting the pattern program for each model of the printed circuit board P is information on the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 3B, as shown in FIG. The component arrangement data is data relating to which position of which feeder base 3A the component supply unit 3B is mounted. The arrangement numbers F101 to Fn belong to the block 1, and the arrangement numbers F201 to FN are assigned to the block 2. belong to.

  Here, based on FIG. 6, the flowchart which concerns on a production possible model list classification is demonstrated. First, the control device 21 selects “block 1” in order to select one block (step S01). Next, the control device 21 selects “component arrangement 1”, which is the component arrangement of “block 1” in the pattern program “DATA-1” of the printed circuit board that has not yet been classified (step S02).

  Then, the control device 21 assigns “component arrangement 1” of the block 1 to the group 1 (step S03). Next, the control device 21 compares the component arrangement data of “component arrangement 1” of the model DATA-1 of “block 1” with the component arrangement data of “component arrangement 7” of DATA-2 of “block 1”. Is performed (step S04).

  The controller 21 determines whether or not the result completely matches the component arrangement data of the corresponding block (step S05). In this case, the component arrangement data related to the component supply unit 3B group of “component arrangement 1” of the production model DATA-1 of “block 1” and the component of “component arrangement 7” of the production model DATA-2 of “block 1” When it is determined that the component arrangement data related to the supply unit 3B group completely coincides with each other, “component arrangement 7” is added to “group 1” and stored in the storage device 23 as shown in FIG. Step S06).

  Further, according to the following comparison, the control device 21 uses the component arrangement data related to the component supply unit 3B group of “component arrangement 1” of the production model DATA-1 of “block 1” and the production model DATA-3 of “block 1”. When “part placement 13” is determined to be completely coincident with the part placement data related to the part supply unit 3B group, “part placement 13” is added to “group 1” and stored in the storage device 23. (Step S06).

  However, according to the next comparison, the control device 21 performs the component arrangement data related to the component supply unit 3B group of the “component arrangement 1” of the production model DATA-1 of “Block 1” and the production model DATA− of “Block 1”. 4, when it is determined that the component arrangement data related to the component supply unit 3B group of “component arrangement 19” in FIG. 4 does not completely match, another “group 2” is created and “component arrangement 19” is changed to “group 2”. And stored in the storage device 23 (see step S07, FIG. 7).

  In this way, the control device 21 performs all the production up to the component arrangement data related to the component supply unit 3B group of the “component arrangement 1” of the production model DATA-1 of “block 1” and the “component arrangement N1” of the block 1. The part arrangement data of the model is collated and classified into groups (step S08), and stored in the storage device 23 as data for each group.

  The above is the classification of all the printed circuit board production models of “Block 1” of the device number “Device 1” of the electronic component mounting device 1 into each group, and this is classified into “Block 2” of the device number “Device 1”. "Is repeatedly performed to classify the production models of all the printed circuit boards into each group (step S09). For such classification, the device number “device 1” of the electronic component mounting device 1 is followed by “block 1” and “block 2” of “device 2” and “device 3”. Is called.

  Next, a flowchart relating to acquisition of the production possible model list of FIG. 8 will be described. First, in the screen for instructing the setup change displayed on the monitor 25 shown in FIG. 9, "DATA-1" is used as the production model name of the printed circuit board, and the device name: XYZ of the electronic component mounting device 1 is used as a block. The work manager selects “Block 1” using the input means (step S11). In this case, selecting “block 1” means that “component arrangement 1”, which is the arrangement number of the component supply unit 3B group, has been selected.

  Next, as described above, the control device 21 searches and searches for a group including “component arrangement 1” among the classified groups (step S12). And the control apparatus 21 controls so that all the production models of the printed circuit board P included in the group found by the search are displayed on the monitor 25 (step S13).

  That is, as shown in FIG. 7, the group including “component arrangement 1” of “block 1” is “group 1”, and this “group 1” includes “component arrangement 1”, “component arrangement 7” and “ 9, the model name of the printed circuit board P corresponding to “component layout 1”: DATA-1, and the model name of the printed circuit board P corresponding to “component layout 7”, as shown in FIG. -2 and the model name of the printed circuit board P corresponding to “component arrangement 13”: model names of the three types of printed circuit boards P in total: DATA-3 are displayed on the monitor 25.

  In FIG. 9, when “DATA-1” is selected as the production model name of the printed circuit board, the device name: XYZ of the electronic component mounting apparatus 1 is selected, and “Block 2” is selected as the block, The control device 21 performs control so that a group including “component arrangement 2” is searched and all the production models of the printed circuit boards P included in the group found by the search are displayed on the monitor 25.

  Then, when the work manager instructs printing from the file F shown in FIG. 9, the content displayed on this screen is printed out by a printer (not shown). Then, the work manager looks at the printed out setup change instruction, and the work manager includes the model name of the printed circuit board P, for example, along the part arrangement data of model name: DATA-1 (see FIG. 5). Then, the component supply units 3B corresponding to the order of the component arrangement numbers are placed and mounted on the feeder base 3A of the cart.

  Furthermore, this cart, to which the component supply unit 3B group is attached, is attached to the mounting device main body 2 as the component supply device 3 (“Block 1”) on the back side. Then, the “group 1” can correspond to 10 types of the printed circuit boards P, and when changing to a model other than the 10 types, a cart corresponding to another group is attached to the mounting apparatus body 2. This can be dealt with.

  As described above, according to the present embodiment, the work relating to which part supply unit 3B is arranged where on the feeder base 3A of the cart, and which cart is mounted when producing which type of board. Thus, the productivity of the substrate can be improved.

  The operation of mounting the electronic component on the printed circuit board P is performed as follows. That is, when the printed circuit board P is inherited from the upstream device and exists on the substrate supply unit 2A of the transport device 2, the printed circuit board P on the substrate supply unit 2A is moved to the substrate positioning unit 2B and positioned and fixed. When the printed circuit board P is positioned, one beam 4A provided in the electronic component mounting apparatus 1 moves in the Y direction by driving the Y direction linear motor 7, and is provided in the beam 4A by the X direction linear motor 9. The mounted head 6 is moved in the X direction, moved to the upper position of the corresponding component supply unit 3B, and the suction nozzle 5 provided on the mounting head 6 is lowered by driving the vertical axis motor 10 to supply the components. An electronic component is taken out from the unit 3B.

  After the removal, the suction nozzle 5 of the mounting head 6 is raised, the mounting head 6 of the beam 4A is passed over the component recognition camera 8, and a plurality of suction nozzles 5 are held by suction during this movement. The electronic components are picked up collectively, and the picked-up image is recognized by the recognition processing device 29 so as to grasp the positional deviation with respect to the suction nozzle.

  Further, the board recognition camera 12 provided in each mounting head 6 moves to a position above the printed circuit board P, images the positioning marks M1 and M2 attached to the printed circuit board P, and recognizes the captured images. 29 recognizes and grasps the position of the printed circuit board.

  Then, by adding the recognition processing result of the positioning mark of the printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, the electronic components are mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. To do. When all the electronic components are mounted on the printed board P in this way, the printed board is transferred from the board positioning unit 2B to the downstream device via the board discharging unit 2C, and the electronic components on the printed board P are transferred. The mounting operation ends.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3A Feeder base 3B Component supply unit 5 Suction nozzle 21 Control apparatus 23 Storage apparatus 25 Monitor 26 Touch panel switch

Claims (2)

In the electronic component mounting method of mounting the electronic component taken out from the component supply unit arranged in parallel on the feeder base of the cart detachable from the mounting device body on the substrate,
Collating the component arrangement data of the component supply unit arranged in parallel with the cart related to the predetermined model of the board and the component arrangement data of the component supply unit related to another model,
It is determined whether or not both placement data match by this collation,
If they match, make them the same group,
A method for mounting an electronic component, comprising: displaying a model of the board in the same group on a monitor. In the electronic component mounting method of mounting the electronic component taken out from the component supply unit arranged in parallel on the feeder base of the cart detachable from the mounting device body on the substrate,
Collating the component arrangement data of the component supply unit arranged in parallel with the cart related to the predetermined model of the board and the component arrangement data of the component supply unit related to another model,
It is determined whether or not both placement data match by this collation,
If they match, make them the same group,
A method of mounting an electronic component, wherein the model of the board in the same group is printed.

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