JP4912187B2 - Surface mount connector - Google Patents

Description

  The present invention relates to a surface mount connector.

  Conventionally, a connector such as a card edge connector has been used to electrically connect a substrate such as a circuit board to another substrate (see, for example, Patent Document 1). In such a connector, the positions of the connecting portions that connect the terminals to the substrate are staggered by being alternately shifted in the lateral direction with respect to the terminal arrangement direction.

  FIG. 7 is a sectional view of a conventional connector. 7A is a cross-sectional view showing the first terminal, and FIG. 7B is a cross-sectional view showing the second terminal.

  As shown in the figure, the connector includes a housing 301 made of an insulating material such as a synthetic resin, and a plurality of first terminals 311A and a plurality of first terminals 311A made of a conductive material such as metal and loaded in the housing 301. 2 terminals 311B. The first terminal 311A and the second terminal 311B are mounted in the housing 301 so as to be alternated with respect to the terminal arrangement direction (direction perpendicular to the drawing). The housing 301 is attached to a substrate 302 such as a mother board by fixing means such as a bolt (not shown).

  In the first cavity 303 of the housing 301, the fixed contact portion 312 and the spring contact portion 313 of the first terminal 311A and the second terminal 311B are accommodated. Further, a press-fit portion 315 is connected to the fixed contact portion 312 of the first terminal 311A and the second terminal 311B via a turn-back portion 314, and the press-fit portion 315 is placed in the second cavity 304 of the housing 301. It is press-fitted and fixed. Further, a lower end portion 317 is connected to the press-fit portion 315 via a bending portion 316, and the lower end portion 317 is inserted into the through hole 306 of the substrate 302 and soldered. Thereby, the first terminal 311A and the second terminal 311B are electrically connected to a conductive trace (not shown) connected to the corresponding through hole 306. Since the lower end portion 317 is soldered from the back side (right side in the figure) of the substrate 302, a solder fillet 321 is formed. In addition, since the melted solder flows between the gaps of the through hole 306 by capillary action, a solder fillet 322 is also formed on the front side of the substrate 302.

7A and 7B, the lower end portion 317 of the first terminal 311A and the lower end portion 317 of the second terminal 311B are lateral to the arrangement direction of the terminals (see FIG. In the vertical direction). The through hole 306 is also disposed so as to correspond to the lower end portion 317. As a result, the portion where the lower end portion 317 is connected to the substrate 302 is staggered. A notch 305 is formed at the end of the housing 301 on the substrate 302 side. Therefore, it is confirmed by visually observing the solder fillet 321 from the back side of the substrate 302 and visually observing the solder fillet 322 from the front side of the substrate 302, whether or not the lower end portion 317 and the through hole 306 are properly soldered. can do.
Japanese Patent Laid-Open No. 10-335025

  However, in the conventional connector, since the lower end portion 317 is inserted into the through hole 306 of the substrate 302 and soldered, it cannot be used for high-density mounting. In high-density mounting in which electronic components and connectors are mounted on a substrate at a high density, the electronic components and connectors are generally mounted on both sides of the substrate. However, in the conventional connector, since the lower end portion 317 projects to the back surface of the substrate 302, it becomes impossible to mount another connector or electronic component on the back side of the connector. In addition, since a board used for high-density mounting generally has a shield plate sandwiched therein, if the through hole is formed, the shield will not function. However, in the conventional connector, it is necessary to insert the lower end portion 317 into the through hole 306, so that it cannot be mounted on the board in which the shield plate is sandwiched. In the first place, since the conventional connector is a card edge connector for connecting a board to another board, it is not intended for high-density mounting in which minute-sized electronic components and connectors are mounted on the board at a high density.

  The present invention solves the problems of the conventional connector, and is connected to a connection portion connected to a counterpart terminal of a counterpart connector, a fixing portion connected to the outside of the connection portion, and connected to the outside of the fixing portion. A first terminal having a soldering part for surface mounting, and a second terminal having a soldering part for surface mounting connected to the tip of the connection part, the fixing part, and the fixing part. By forming a notch portion including a tapered surface at the mounting surface side end outside the housing, the arrangement of the soldering portions can be staggered, and the soldering state of the soldering portion of the second terminal is visually confirmed. An object of the present invention is to provide a highly reliable surface-mount connector that can be mounted on a substrate, does not cause poor connection, has a low manufacturing cost, and is highly reliable.

Therefore, in the surface mount connector of the present invention, the first terminal and the second terminal connected to the mating terminal of the mating connector, and the housing in which the first terminal and the second terminal are alternately arranged are loaded. The first terminal has a connection portion connected to the counterpart terminal, a fixing portion connected to the outside of the connection portion and fixed to the housing, and an outer side of the fixing portion. A soldered portion for surface mounting, wherein the second terminal is connected to the counterpart terminal, connected to the outside of the connecting portion, and fixed to the housing; and A soldering portion for surface mounting connected to a mounting surface side end of the fixed portion; and the housing includes a notch portion including a tapered surface formed at an outer mounting surface side end, and the first terminal and the first terminal Solder for surface mounting of 2 terminals Parts are located on the mounting surface side from the lower end portion of the fixed portion of the first terminal, and that are arranged in a staggered manner viewed from the mounting surface side.

  In another surface mount connector of the present invention, the connecting portion further includes a front side wall portion and a rear side wall portion extending in a fitting (engagement) direction with the mating connector, and the fitting direction. The trough bottom extends in a vertical direction and connects the front side wall and the rear side wall, and the housing extends in a direction perpendicular to the fitting direction on the mounting surface side of the trough bottom. A bottom plate is provided.

  In still another surface mount connector of the present invention, the housing further includes a side wall portion in which a terminal fixing hole into which the fixing portion is press-fitted is disposed, and the fixing portion is opposite to the side wall portion. By moving from the side where the connector is fitted toward the mounting surface, the connector is press-fitted into the terminal fixing hole.

  In still another surface mount connector of the present invention, the soldering portion of the first terminal extends along the outer side surface of the side wall portion, and the soldering portion of the second terminal is the terminal. Extends from the fixing hole to the mounting surface.

  In still another surface mount connector according to the present invention, the tapered surface is formed at a mounting surface side end of a portion outside the terminal fixing hole of the side wall portion.

  In still another surface mount connector of the present invention, the soldered portion of the second terminal protrudes to the mounting surface side of the extended surface extending the tapered surface toward the mounting surface.

  According to the present invention, a surface mount connector includes a connection portion connected to a counterpart terminal of a counterpart connector, a fixing portion connected to the outside of the connection portion, and a surface mounting connected to the outside of the fixing portion. Mounting on the outside of the housing in which a first terminal including a soldering portion and a second terminal including a soldering portion for surface mounting connected to the tip of the connection portion, the fixing portion, and the fixing portion are loaded. A notch including a tapered surface is formed at the surface side end. Thereby, arrangement | positioning of a soldering part can be made into a zigzag shape, the soldering state of the soldering part of a 2nd terminal can be visually recognized, the mounting to a board | substrate is reliable, and a connection failure may generate | occur | produce. The manufacturing cost is low and the reliability can be increased.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a board mounted state and a mating state with a mating connector of a surface mount connector according to the first embodiment of the present invention, and FIG. 2 is a surface mount connector according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view of the surface mount connector according to the first embodiment of the present invention, and is a cross-sectional view taken along the line AA of FIG. 2, and FIG. 4 is according to the first embodiment of the present invention. It is sectional drawing of a surface-mount connector, and is BB arrow sectional drawing of FIG.

  In the figure, 10 is a surface mount connector in the present embodiment, and 80 is a mating connector fitted to the surface mount connector 10. The surface mount connector 10 is a surface mount type connector mounted on the surface of a substrate 40 such as a printed circuit board (PCB). The mating connector 80 is surface-mounted on the lower surface of the upper printed circuit board (not shown) facing the board 40. The mating connector 80 is soldered to a pattern in which the solder tail portion 83 of the terminal is formed on the lower surface of the upper printed circuit board, and the housing 81 is fixed to the upper printed circuit board with an adhesive or the like. In this case, the lower surface in FIGS. 3 and 4 is the mounting surface of the surface mounting connector 10 and faces the mounting surface of the substrate 40. Since the surface mount connector 10 is line symmetric with respect to the center line CC shown in FIG. 2, only the cross section of one half of the center line CC is shown in FIGS. Drawing of the cross section of one half is omitted. Further, the mating connector 80 moves from the upper side to the lower side in FIGS. The mating connector 80 shown in FIG. 1 is a surface mount connector that is surface-mounted on the mating substrate, but may be any type of connector.

  In the present embodiment, expressions indicating directions such as upper, lower, left, right, front, rear, etc. used for explaining the configuration and operation of each part of the surface mount connector 10 are absolute. It is relative and suitable when each part of the surface mount connector 10 is in the posture shown in the figure, but when the posture changes, it is changed and interpreted according to the change in posture. It should be.

  The surface mount connector 10 has a housing 11 as a connector body integrally formed of an insulating material such as synthetic resin. As shown in FIGS. 1 and 2, the housing 11 has a substantially rectangular thick plate shape, and a substantially rectangular concave portion surrounded by the periphery is formed on the upper surface. A convex strip 13 is formed integrally with the housing 11 in the concave portion, and side walls 14 extending in parallel with the convex strip 13 are formed on both sides of the convex strip 13 with the housing 11. It is integrally formed. In this case, the protrusion 13 and the side wall 14 protrude upward from the surface of the recess and extend in the longitudinal direction of the housing 11. As a result, on both sides of the ridge 13, elongated groove portions 12 extending in the longitudinal direction of the housing 11 are formed between the ridge 13 and the side wall 14.

  Here, the housing 11 straddles the side surfaces on both sides of the ridge 13, the bottom surface of the concave groove 12, the side surface inside the side wall portion 14, the top surface of the side wall portion 14, and the side surface outside the side wall portion 14. In this manner, a groove-like terminal accommodating cavity 15 is formed. The first terminal 21 and the second terminal 31 as terminals are accommodated in the terminal accommodating cavity 15 and loaded into the housing 11. Note that ten terminal receiving cavities 15 are formed on each side surface of each ridge portion 13 and on the bottom surface of the groove portion 12 at a pitch of about 0.3 mm, for example. The first terminal 21 and the second terminal 31 accommodated in each of the terminal accommodating cavities 15 are also accommodated in the terminal accommodating cavities 15, so that the housing 11 is loaded at the same pitch as the terminal accommodating cavities 15. Is done. The number and pitch of the terminal receiving cavities 15 can be changed as appropriate.

  The first terminal 21 and the second terminal 31 are alternately accommodated in the terminal accommodating cavity 15 as shown in FIGS. In the illustrated example, the first terminals 21 are accommodated in the odd-numbered terminal accommodating cavities 15 from the left, and the second terminals 31 are accommodated in the even-numbered terminal accommodating cavities 15 from the left. Further, as shown in FIGS. 3 and 4, a terminal fixing hole 16 penetrating through the side wall portion 14 is formed in a portion corresponding to the upper surface of the side wall portion 14 in the terminal accommodating cavity 15.

  Next, the configuration of the first terminal 21 will be described.

  As shown in FIG. 3, the first terminal 21 includes a press-fit portion 22 as a fixing portion, a solder tail portion 23 as a soldering portion for surface mounting, and a connection portion connected to the counterpart terminal of the counterpart connector 80. 24, preferably formed integrally by punching a conductive metal plate. Here, the connecting part 24 is formed in a substantially U shape by a front side wall part 24a, a rear side wall part 24c and a valley bottom part 24d, which will be described later, and the other part (the part outside the connecting part 24) is a press-fit part 22 and a solder. The tail portion 23 and a horizontal portion 25 (to be described later) are formed in a substantially F shape, and the first terminal 21 has a side shape that connects the U shape and the F shape as a whole.

  The connecting portion 24 includes a front side wall portion 24a as a side wall portion closer to the tip 26 and extending in a fitting direction with the counterpart connector 80, that is, a direction perpendicular to the mounting surface (vertical direction in FIG. 3). A rear side wall portion 24c as a side wall portion closer to the solder tail portion 23 is provided. The front side wall portion 24 a is a portion located inside the housing 11 in the connection portion 24, and is accommodated in a terminal accommodating cavity 15 formed on a side surface of the protruding strip portion 13. The rear side wall portion 24 c is a portion located outside the housing 11 in the connection portion 24 and is accommodated in a terminal accommodating cavity 15 formed on the inner side surface of the side wall portion 14.

  Further, a portion connecting the front side wall portion 24 a and the rear side wall portion 24 c in the connection portion 24, that is, a valley bottom portion 24 d corresponding to a U-shaped valley bottom is a direction perpendicular to the mating direction with the mating connector 80. That is, it extends in a direction parallel to the mounting surface (lateral direction in FIG. 3), and is accommodated in a terminal accommodating cavity 15 formed on the bottom surface of the groove 12. A bottom plate portion 18 of the housing 11 is disposed below the valley bottom portion 24d in the connection portion 24. As described above, since the bottom plate portion 18 is interposed between the connection portion 24 and the mounting surface of the substrate 40, the connection portion 24 does not come into contact with the mounting surface of the substrate 40. Therefore, since the conductive traces can be disposed also on the lower portion of the surface mount connector 10 on the mounting surface of the substrate 40, the arrangement of the conductive traces on the substrate 40 can be increased in density.

  Further, a contact portion 24b that comes into contact with a mating terminal of the mating connector 80 is formed in the vicinity of the free end (upper end in FIG. 3) of the front side wall portion 24a. The contact portion 24b is formed so as to protrude from the outer side surface of the housing 11 in the front side wall portion 24a, that is, the surface facing inward of the concave groove portion 12, and at least the tip 26 thereof is the ridge portion 13. It protrudes to the outside of the terminal accommodating cavity 15 formed on the side surface, and is located in the recessed groove portion 12. The rear side wall portion 24c is mostly located in the terminal accommodating cavity 15 formed on the inner side surface of the side wall portion 14.

  The connecting portion 24 has a spring property generated by elastic deformation. Therefore, when the mating connector 80 is fitted to the surface mount connector 10 and the contact portion 24b is pressed in the direction of the ridge 13 by contacting the mating terminal, the contact portion repels due to the spring property. Since 24b is pressed against the counterpart terminal, the electrical connection between the first terminal 21 and the counterpart terminal can be reliably maintained.

  Further, the horizontal portion 25 of the first terminal 21, that is, the portion connecting the upper end of the rear side wall portion 24c of the connecting portion 24, the upper end of the press-fit portion 22, and the upper end of the solder tail portion 23 is parallel to the mounting surface. It extends in the direction and is accommodated in a terminal accommodating cavity 15 formed on the upper surface of the side wall portion 14. The upper end of the rear side wall 24c of the connecting portion 24 is connected to the inner end of the horizontal portion 25, that is, the inner end of the housing 11, and the outer end of the horizontal portion 25, that is, the outer end of the housing 11. Is connected to the upper end of the solder tail portion 23.

  The solder tail portion 23 extends in the fitting direction with the mating connector 80, and the lower end portion thereof, that is, the substrate side end portion is connected to the connection pad 41 formed on the mounting surface of the substrate 40 by soldering. It functions as a soldered 23 part a. The soldering portion 23 a is in the same position as the lower surface of the housing 11 or in a position protruding toward the board 40 with respect to the fitting direction with the mating connector 80. In this case, the path along the member of the first terminal 21 from the soldered portion 23a to the contact portion 24b of the solder tail portion 23 has a long distance and is refracted in a complicated manner. There is nothing to do. That is, the solder does not climb up through the path along the member and adhere to the contact portion 24b.

  Furthermore, a solder barrier portion (not shown) can be formed in the middle of the path along the member from the solder tail portion 23 to the contact portion 24b, if necessary. The solder barrier portion is, for example, a nickel (Ni) film formed by plating, but may be any kind of film as long as it is a film to which solder does not easily adhere, and is formed by any method. It may be. The soldered portion 23a of the solder tail portion 23 is preferably formed with a gold (Au) film formed by plating in order to improve solder adhesion. Similarly, in order to reduce electrical contact resistance, it is desirable that a gold film formed by plating is also formed on at least the contact portion 24b.

  Here, the lower end outside the housing 11, that is, the mounting surface side end of the outer side surface of the side wall portion 14, includes a tapered portion 17 as a notched portion formed by notching a member, and serves as an inclined surface. A tapered surface 17a is formed. The tapered portion 17 and the tapered surface 17a extend in the terminal arrangement direction, that is, in the lateral direction in FIG. In the illustrated example, the tapered surface 17a is formed to have an inclination angle of about 45 degrees with respect to the mounting surface, but the inclination angle can be arbitrarily set.

  In the illustrated example, the solder tail portion 23 extends along the outer side surface of the side wall portion 14, and the upper half range is formed in the terminal receiving cavity 15 formed on the outer side surface of the side wall portion 14. The lower half is located in the tapered portion 17 and is exposed below the tapered surface 17a.

  Further, the upper end of the press-fit portion 22 is connected between the upper end of the rear side wall portion 24 c of the connecting portion 24 and the upper end of the solder tail portion 23 in the horizontal portion 25 of the first terminal 21. The press-fit portion 22 extends in the fitting direction with the mating connector 80, and a convex portion 22a and a concave portion 22b are formed on the lower end portion thereof, that is, on the side surface in the vicinity of the mounting surface side end portion. .

  On the other hand, the side wall portion 14 of the housing 11 is formed with a terminal fixing hole 16 as a through hole extending in the fitting direction with the mating connector 80. In order to load the first terminal 21 into the housing 11, the first terminal 21 is moved from the upper surface side of the housing 11 in the fitting direction, that is, moved from the upper side to the lower side in FIG. When inserting into the terminal 15, the press-fitting portion 22 is press-fitted into the terminal fixing hole 16 from above in FIG. 3. In this case, the concave portion 22 b of the press-fit portion 22 engages with the convex portion 16 a protruding from the side surface of the terminal fixing hole 16. Further, the lower end portion of the press-fit portion 22 protrudes below the terminal fixing hole 16, and the convex portion 22a engages with the lower engagement surface 14c of the side wall portion 14 parallel to the mounting surface. As a result, the press-fit portion 22 cannot be moved upward and removed from the terminal fixing hole 16, and the first terminal 21 is fixed to the housing 11. The lower engagement surface 14c is connected to the lower end of the tapered surface 17a and forms a stepped portion. Further, the lower end portion of the press-fit portion 22 is positioned above the lower surface of the housing 11 so as not to contact the mounting surface of the substrate 40.

  Thus, since the 1st terminal 21 and the housing 11 are fixed when the press-fit part 22 is press-fitted into the terminal fixing hole 16, the outer part 14a and the terminal located outside the terminal fixing hole 16 in the side wall part 14. Since the inner part 14b located inside the fixing hole 16 needs to exhibit sufficient strength, it is formed thick. The tapered portion 17 is formed by cutting out the lower end portion of the thick outer portion 14a. Further, the inner portion 14 b extends below the lower engagement surface 14 c and is connected to the bottom plate portion 18.

  Next, the configuration of the second terminal 31 will be described.

  As shown in FIG. 4, the second terminal 31 is a conductive member including a press-fit portion 32 as a fixing portion and a connection portion 34 connected to the counterpart terminal of the counterpart connector 80, and preferably conductive. These are integrally formed by punching a metal plate. Here, the connecting portion 34 is formed in a substantially U-shape, the other portions are formed in a substantially L-shape, and the second terminal 31 has a side surface that connects the U-shape and the L-shape as a whole. It has a shape.

  And the said connection part 34 is extended in the fitting direction with the other party connector 80, ie, the direction (vertical direction in FIG. 4) perpendicular | vertical with respect to a mounting surface similarly to the connection part 24 of the said 1st terminal 21. The front side wall 34a as the side wall near the tip 36 and the rear side wall 34c as the side wall near the solder tail 33 are provided. The front side wall portion 34 a is a portion located inside the housing 11 in the connection portion 34, and is housed in a terminal housing cavity 15 formed on the side surface of the protruding strip portion 13. The rear side wall portion 34 c is a portion located outside the housing 11 in the connection portion 34 and is accommodated in a terminal accommodating cavity 15 formed on the inner side surface of the side wall portion 14.

  Further, a portion connecting the front side wall portion 34 a and the rear side wall portion 34 c in the connection portion 34, that is, a valley bottom portion 34 d corresponding to a U-shaped valley bottom, is mounted similarly to the connection portion 24 of the first terminal 21. It extends in a direction parallel to the surface (lateral direction in FIG. 4) and is accommodated in a terminal accommodating cavity 15 formed on the bottom surface of the recessed groove portion 12. Since the bottom plate portion 18 is interposed between the connecting portion 34 and the mounting surface of the substrate 40, the connecting portion 34 does not come into contact with the mounting surface of the substrate 40. Therefore, since the conductive traces can be disposed also on the lower portion of the surface mount connector 10 on the mounting surface of the substrate 40, the arrangement of the conductive traces on the substrate 40 can be increased in density.

  Further, a contact portion 34b is formed in the vicinity of the free end (upper end in FIG. 4) of the front side wall portion 34a so as to contact the mating terminal of the mating connector 80. The contact portion 34b is formed so as to protrude from the outer side surface of the housing 11 in the front side wall portion 34a, that is, the surface facing inward of the concave groove portion 12, and at least the tip 36 thereof is the ridge portion 13. It protrudes to the outside of the terminal accommodating cavity 15 formed on the side surface, and is located in the recessed groove portion 12. The rear side wall portion 34c is mostly located in the terminal accommodating cavity 15 formed on the inner side surface of the side wall portion 14.

  The connection portion 34 has a spring property generated by elastic deformation, like the connection portion 24 of the first terminal 21. Therefore, when the mating connector 80 is fitted to the surface mount connector 10 and the contact portion 34b is pressed in the direction of the ridge 13 by contacting the mating terminal, the contact portion repels due to the spring property. Since 34b is pressed against the counterpart terminal, the electrical connection between the second terminal 31 and the counterpart terminal can be reliably maintained.

  Incidentally, the solder tail portion 33 of the second terminal 31 is connected to the lower end portion of the press-fit portion 32. Therefore, the horizontal portion 35 of the second terminal 31, that is, the portion connecting the upper end of the rear side wall portion 34 c of the connection portion 34 and the upper end of the press-fit portion 32 is parallel to the mounting surface, like the first terminal 21. And is accommodated in a terminal accommodating cavity 15 formed on the upper surface of the side wall portion 14. In the case of the second terminal 31, since the solder tail portion 33 is connected via the press-fit portion 32, the outer portion of the connection portion 34 of the second terminal 31 does not form an F-shape, and the horizontal portion 35 and the press-fit portion 32. It is almost T-shaped.

  The press-fit portion 32 extends in the fitting direction with the mating connector 80, and a convex portion 32a and a concave portion 32b are formed on the lower end portion thereof, that is, on the side surface in the vicinity of the mounting surface side end portion. On the other hand, the side wall portion 14 of the housing 11 is formed with a terminal fixing hole 16 as a through hole extending in the fitting direction with the mating connector 80. Then, in order to load the second terminal 31 into the housing 11, the second terminal 31 is moved in the fitting direction from the upper surface side of the housing 11, that is, moved from the upper side to the lower side in FIG. When inserting into the terminal 15, the press-fit portion 32 is press-fitted into the terminal fixing hole 16 from above in FIG. 4.

  In this case, similarly to the first terminal 21, the concave portion 32 b of the press-fit portion 32 engages with the convex portion 16 a protruding from the side surface of the terminal fixing hole 16. Further, the lower end portion of the press-fit portion 32 protrudes below the terminal fixing hole 16, and the convex portion 32a engages with the lower engagement surface 14c of the side wall portion 14 parallel to the mounting surface. As a result, the press-fit portion 32 cannot be moved upward to be extracted from the terminal fixing hole 16, and the second terminal 31 is fixed to the housing 11.

  Thus, since the 2nd terminal 31 and the housing 11 are fixed by press-fitting the press-fit portion 32 into the terminal fixing hole 16, the outer portion 14a and the terminal located outside the terminal fixing hole 16 in the side wall portion 14. Since the inner part 14b located inside the fixing hole 16 needs to exhibit sufficient strength, it is formed thick. The tapered portion 17 is formed by cutting out the lower end portion of the thick outer portion 14a. Further, the inner portion 14 b extends below the lower engagement surface 14 c and is connected to the bottom plate portion 18. Further, the horizontal portion 35 of the second terminal 31 extends toward the outside of the housing 11 from the press-fit portion 32 in order to stabilize the posture of the second terminal 31, and as shown in FIG. It is desirable that the entire upper surface of the outer portion 14a on which 15 is formed is in contact with the entire upper surface.

  Further, a solder tail portion 33 as a soldering portion extending in the fitting direction with the counterpart connector 80 is connected to the lower end portion of the press-fit portion 32. That is, the solder tail portion 33 extends from the terminal fixing hole 16 to the mounting surface side. The lower end portion of the solder tail portion 33, that is, the end portion on the mounting surface side functions as a soldering portion 33a connected to the connection pad 42 formed on the mounting surface of the substrate 40 by soldering. The soldering portion 33a is in the same position as the lower surface of the housing 11 or in a position protruding toward the board 40 with respect to the fitting direction with the mating connector 80. In this case, like the first terminal 21, the path along the member of the second terminal 31 from the soldered portion 33 a to the contact portion 34 b of the solder tail portion 33 has a long distance and is refracted in a complicated manner. Therefore, the phenomenon of solder rise does not occur. That is, the solder does not crawl up along the path along the member and adhere to the contact portion 34b.

  Furthermore, a solder barrier portion (not shown) can be formed in the middle of the path along the member from the solder tail portion 33 to the contact portion 34b as necessary. Further, it is desirable that a gold film formed by plating is formed on the soldered portion 33a of the solder tail portion 33 in order to improve the adhesion of the solder. Similarly, in order to reduce electrical contact resistance, it is desirable that a gold film formed by plating is also formed at least on the contact portion 34b.

  By the way, in the 2nd terminal 31, since the solder tail part 33 is connected to the lower end part of the press-fit part 32, the soldering part 33a is located closer to the inside of the housing 11 than the soldering part 23a of the first terminal 21. To do. The first terminal 21 and the second terminal 31 are alternately accommodated in the terminal accommodating cavity 15 as described above. Therefore, the arrangement of the soldering portion 23a and the soldering portion 33a and the connection pads 41 and 42 formed on the mounting surface of the substrate 40 so as to correspond to them is as follows. With respect to the arrangement direction, that is, the left-right direction in FIG. 1, a staggered pattern alternately shifted in the horizontal direction. Therefore, even if the pitch between the adjacent first terminal 21 and the second terminal 31 is narrow, the interval between the soldered portion 23a of the first terminal 21 and the soldered portion 33a of the second terminal 31, and the soldered portion. The distance between the connection pad 41 formed on the mounting surface of the substrate 40 so as to correspond to 23a and the connection pad 42 formed on the mounting surface of the substrate 40 so as to correspond to the soldering portion 33a may be increased. it can. Therefore, the connection pads 41 and 42 can be easily manufactured, and when the soldering portion 23a of the first terminal 21 and the soldering portion 33a of the second terminal 31 are soldered to the corresponding connection pads 41 and 42. However, a solder bridge does not occur, and a short circuit does not occur between adjacent connection pads 41 and 42.

  Further, the soldered portion 33a of the second terminal 31 is located closer to the inside of the housing 11, but as shown in FIG. 4, the tapered portion 17 is formed below the outer portion 14a. Therefore, even when the surface mount connector 10 is mounted on the mounting surface of the substrate 40, the soldered portion 33 a is soldered to the corresponding connection pad 42 from the side of the surface mount connector 10. The solder fillet formed at the connection portion between the soldering portion 33a and the connection pad 42 can be visually confirmed. In particular, in the illustrated example, the soldering portion 33 a is located on the mounting surface side of the substrate 40, which is an extended surface obtained by extending the tapered surface 17 a toward the mounting surface of the substrate 40. That is, the solder tail part 33 protrudes to the lower side of the extended surface which extended the taper surface 17a toward the downward direction. Therefore, the state of the soldered portion 33a can be easily visually recognized from the side of the surface mount connector 10.

  Since the solder tail portion 23 of the first terminal 21 extends along the side surface of the housing 11, the state of the soldered portion 23 a located at the lower end portion thereof is easy from the side of the surface mount connector 10. Can be visually recognized.

  As described above, in the present embodiment, the first terminal 21 is connected to the counterpart terminal 24, connected to the outside of the connection part 24, and fixed to the housing 11. The surface mount solder tail portion 23 is connected to the outside of the portion 22, and the second terminal 31 is connected to the counterpart terminal 34, connected to the outside of the connection portion 34, and fixed to the housing 11. The housing 11 includes a tapered surface 17a formed on the outer mounting surface side end. The housing 11 includes a press fitting portion 32 and a surface mounting solder tail portion 33 connected to the mounting surface side end of the press fitting portion 32. A tapered portion 17 is provided.

  Thereby, the arrangement of the soldering portion 23a and the soldering portion 33a can be staggered, and the soldering state of the soldering portion 33a of the second terminal 31 can be easily visually recognized from the side of the surface mount connector 10. be able to. Therefore, it is possible to visually inspect the soldering state between the soldering portion 33a and the connection pad 42 of the substrate 40, and thus the mounting of the surface mount connector 10 on the substrate 40 can be ensured. Since no connection failure occurs, the reliability can be increased, and the manufacturing cost can be kept low.

  The housing 11 also includes a bottom plate portion 18 that extends in a direction perpendicular to the fitting direction on the mounting surface side of the connecting portion 24 and the valley bottom portion 34d of the connecting portion 34. For this reason, the connection portion 24 and the connection portion 34 are prevented from coming into contact with the mounting surface of the substrate 40, and conductive traces can be disposed on the lower portion of the surface mounting connector 10 on the mounting surface of the substrate 40. Therefore, the arrangement of the conductive traces on the substrate 40 can be increased.

  Further, the solder tail portion 33 of the second terminal 31 protrudes to the mounting surface side of the extended surface obtained by extending the tapered surface 17a toward the mounting surface. Therefore, the state of the soldered portion 33a can be easily visually recognized from the side of the surface mount connector 10.

  Next, a second embodiment of the present invention will be described. In addition, about the thing which has the same structure as 1st Embodiment, the description is abbreviate | omitted by providing the same code | symbol. The description of the same operation and the same effect as those of the first embodiment is also omitted.

  FIG. 5 is a perspective view of the surface mount connector according to the second embodiment of the present invention, and FIG. 6 is a cross-sectional view of the surface mount connector according to the second embodiment of the present invention, as viewed in the direction of arrows DD in FIG. It is sectional drawing.

  In the figure, reference numeral 50 denotes a surface mount connector according to the present embodiment, which is a surface mount type connector mounted on a surface of a substrate (not shown) such as a printed circuit board. In this case, the lower surface in FIG. 6 is the mounting surface of the surface mounting connector 50 and faces the mounting surface of the substrate. The surface mount connector 50 can function as a mating connector of the surface mount connector 10 in the first embodiment. In this case, the surface mount connector 10 in the first embodiment moves downward from above in FIG. The surface mount connector 50 does not necessarily function as a counterpart connector of the surface mount connector 10 in the first embodiment.

  Further, in the present embodiment, the expressions indicating directions such as upper, lower, left, right, front, rear, etc. used for explaining the configuration and operation of each part of the surface mount connector 50 are absolute. It is relative and suitable when each part of the surface mount connector 50 is in the posture shown in the figure. However, when the posture changes, it is changed and interpreted according to the change in posture. It should be.

  The surface mount connector 50 has a housing 51 as a connector body integrally formed of an insulating material such as synthetic resin. As shown in FIG. 5, the housing 51 has a substantially rectangular thick plate shape, and on the upper surface, a protruding strip portion 52 extending in the longitudinal direction is formed integrally with the housing 51. The ridges 52 are formed along both sides of the housing 51. In addition, an elongated groove 53 extending in the longitudinal direction of the housing 51 is formed between the protruding ridges 52 on both sides.

  A groove-like terminal accommodating cavity 54 for accommodating the terminal 61 is formed so as to straddle the side walls and the upper surface on both sides of the ridge 52. The terminal accommodating cavities 54 are formed on the side walls and the upper surface on both sides of each ridge 52, for example, at a pitch of about 0.3 mm. Further, 20 terminals 61 accommodated in each of the terminal accommodating cavities 54 are also arranged on the side walls and the upper surface on both sides of each ridge 52, for example, at a pitch of about 0.3 [mm]. Furthermore, a terminal tip accommodation hole 55 is formed at a position corresponding to each of the terminal accommodation cavities 54 at a boundary portion of the concave groove 53 with the ridge 52. The pitch and number of the terminal tip receiving holes 55 are the same as the terminal receiving cavities 54. The pitch and number of the terminal receiving cavity 54, the terminal tip receiving hole 55, and the terminal 61 can be changed as appropriate.

  Further, when the surface mount connector 50 functions as a counterpart connector of the surface mount connector 10 in the first embodiment, the terminal 61 also includes the first terminal 21 of the surface mount connector 10 in the first embodiment and It functions as a counterpart terminal of the second terminal 31. In this case, the pitch and number of the terminal receiving cavity 54, the terminal tip receiving hole 55, and the terminal 61 are set so as to correspond to the surface mount connector 10 in the first embodiment.

  Next, the configuration of the terminal 61 will be described.

  As shown in FIG. 6, the terminal 61 is a conductive member including a surface-mounting solder tail portion 63 and a connection portion 64, and is preferably formed integrally by punching a conductive metal plate. ing. Here, the terminal 61 has a side shape such as a ladle, the connection portion 64 is formed in a substantially U shape, and the solder tail portion 63 is formed in a straight shape.

  The connecting portion 64 extends in the vertical direction, and includes a front side wall portion 64a as a side wall portion closer to the front end and accommodated in a terminal accommodating cavity 54 formed on the inner side wall of the ridge 52, and It has a rear side wall part 64b as a side wall part close to the solder tail part 63 that extends in the direction and is accommodated in a terminal accommodating cavity 54 formed on the outer side wall of the ridge 52. Note that a bottom portion between the front side wall portion 64 a and the rear side wall portion 64 b, that is, a portion corresponding to a U-shaped valley extends in the lateral direction, and is formed on the upper surface of the ridge portion 52. Housed inside. Further, the front end portion of the front side wall portion 64 a is accommodated in the terminal front end accommodating hole 55. The terminal 61 is fixed to the housing 51 by press-fitting the connecting portion 64 into the terminal accommodating cavity 54.

  In addition, the solder tail portion 63 is connected to the rear side wall portion 64b at the inner end, that is, the end on the concave groove portion 53 side, and extends in the lateral direction. Then, the lower surface of the solder tail portion 63 is soldered to a connection pad or the like formed on a mounting surface of a substrate (not shown). When the surface mount connector 50 functions as a counterpart connector of the surface mount connector 10 in the first embodiment, the front side wall portion 64a is in contact with the contact portion 24b of the first terminal 21 and the second terminal 31. It functions as a contact part of the other party terminal which contacts the part 34b. A solder barrier portion (not shown) can be formed in the middle of the path along the member from the solder tail portion 63 to the front side wall portion 64a as necessary. The solder barrier portion is, for example, a nickel (Ni) film formed by plating, but may be any kind of film as long as it is a film to which solder does not easily adhere, and is formed by any method. It may be. When the solder tail portion 63 is soldered to the connection pad or the like of the substrate by the solder barrier portion, the solder rises along the member of the terminal 61 and adheres to the surface of the front side wall portion 64a. The phenomenon can be prevented.

  In addition, it is desirable that a gold (Au) film formed by plating is formed on the soldered portion of the solder tail portion 63 in order to improve solder adhesion. Similarly, in order to reduce the electrical contact resistance, it is desirable that a gold film formed by plating is also formed on at least the front side wall 64a.

  Incidentally, a shield member 71 made of a conductive member is attached to the housing 51. The shield member 71 is accommodated in a holding groove 56 formed in the vicinity of both ends in the longitudinal direction of the housing 51 and is held by the housing 51, and surrounds the side surface of the housing 51 so as to surround the entire surface mount connector 50. Established. More specifically, the shield member 71 has a substantially U-shaped shape, an elongated strip-like main body portion 72 extending in the longitudinal direction of the housing 51, and held portions connected to both ends of the main body portion 72. A pair of members having 73. Note that the pair of shield members 71 may be integrated to form a substantially square-shaped member.

  The shield member 71 surrounds at least the periphery of the region where the terminal 61 is disposed, and the main body portion 72 faces the outer side wall of the ridge portion 52 and extends so as to be parallel to the side wall. . Further, in the illustrated example, the dimension of the shield member 71 in the fitting direction of the surface mount connector 50, that is, the vertical direction in FIG. 6 is set to an extent corresponding to the rear side wall portion 64 b of the terminal 61. As a result, most of the outer side surface of the rear side wall portion 64 b faces the shield member 71, so that the terminal 61 is reliably prevented from being affected by electromagnetics outside the surface mount connector 50.

  Since the shield member 71 is a member for shielding electromagnetism, a gap between the mounting surface of the substrate on which the surface mount connector 50 is mounted and the shield member 71, and a surface mount connector are provided. It is desirable to make the gap between the mounting surface of the board on which the mating connector fitted to 50 and the shield member 71 are as small as possible. However, when the gap between the mounting surface of the substrate on which the surface mounting connector 50 is mounted and the shield member 71 is reduced, the solder pad 63 is soldered to the corresponding connection pad from the side of the surface mounting connector 50 to the lower surface of the solder tail portion 63. It becomes difficult to visually recognize the attached state.

  Therefore, in the present embodiment, the outer lower end of the shield member 71 includes a tapered portion 74 as a notched portion formed by notching the member, and a tapered surface 74a as an inclined surface is formed. The tapered portion 74 and the tapered surface 74 a extend in the arrangement direction of the terminals 61, that is, in the longitudinal direction of the main body portion 72. In the illustrated example, the tapered surface 74a is formed to have an inclination angle of about 45 degrees with respect to the mounting surface, but the inclination angle can be arbitrarily set.

  As described above, in the present embodiment, the surface mount connector 50 includes the terminal 61 and the shield member 71 attached to the housing 51, and the terminal 61 extends for the outside of the side surface of the housing 51. The solder tail 71 surrounds the side surface of the housing 51, and includes a tapered portion 74 including a tapered surface 74a formed at the outer end of the mounting surface.

  Thereby, the soldering state of the soldering part of the terminal 61 can be easily visually recognized from the side of the surface mount connector 50. Therefore, the soldering state between the soldered portion and the connection pads of the board can be visually inspected, so that the mounting of the surface mount connector 50 on the board can be ensured. Since no connection failure occurs, the reliability can be increased, and the manufacturing cost can be kept low.

  In addition, this invention is not limited to the said embodiment, It can change variously based on the meaning of this invention, and does not exclude them from the scope of the present invention.

It is a perspective view which shows the board | substrate mounting state of the surface mounting connector in the 1st Embodiment of this invention, and a fitting state with the other party connector. It is a top view of the surface mount connector in the 1st Embodiment of this invention. It is sectional drawing of the surface mount connector in the 1st Embodiment of this invention, Comprising: It is AA arrow sectional drawing of FIG. It is sectional drawing of the surface mount connector in the 1st Embodiment of this invention, Comprising: It is BB arrow sectional drawing of FIG. It is a perspective view of the surface mount connector in the 2nd Embodiment of this invention. It is sectional drawing of the surface mount connector in the 2nd Embodiment of this invention, Comprising: It is DD arrow sectional drawing of FIG. It is sectional drawing of the conventional connector, Comprising: (A) is sectional drawing which shows a 1st terminal, (B) is sectional drawing which shows a 2nd terminal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 50 Surface mount connector 11, 51, 81, 301 Housing 12, 53 Groove part 13, 52 Projection part 14 Side wall part 14a Outer part 14b Inner part 14c Lower engagement surface 15, 54 Terminal accommodation cavity 16 Terminal fixing hole 16a, 22a, 32a Convex part 17, 74 Tapered part 17a, 74a Tapered surface 18 Bottom plate part 21 First terminal 22, 32, 315 Press fit part 22b, 32b Concave part 23, 33, 63, 83 Solder tail part 23a, 33a Soldering Portions 24, 34, 64 Connecting portions 24a, 34a, 64a Front side wall portions 24b, 34b Contact portions 24c, 34c, 64b Rear side wall portions 24d, 34d Valley bottom portions 25, 35 Horizontal portions 26, 36 Tip 31 Second terminals 40, 302 Substrate 41, 42 Connection pad 55 Terminal tip receiving hole 56 Holding groove 61 Terminal 71 Shield member 72 Main body 73 Retained portion 80 Mating connector 303 First cavity 304 Second cavity 305 Notch 306 Through hole 311A First terminal 311B Second terminal 312 Fixed contact portion 313 Spring contact portion 314 Turned back portion 316 Curved portion 317 Lower end portions 321 and 322 Solder fillet

Claims (6)

(A) has a first pin及 beauty second pin connected to the counterpart terminal of the counterpart connector, and a Haujin grayed said first pin及 beauty second pin is loaded alternately arranged a surface-mounted connector,
(B) said first pin, the connection portion connected to the counterpart terminal, is connected to the outer side of the connecting portion, the fixed portion fixed to the Haujin grayed, and, connected to the outer side of the fixing part It has a soldering part for surface mounting,
(C) the second pin, the connection portion connected to the counterpart terminal, is connected to the outer side of the connecting portion, the fixed portion fixed to the Haujin grayed, and, on the mounting surface side end of the fixing part Provided with soldered parts for connected surface mounting,
; (D) Haujin grayed includes a notch portion including an outer mounting surface side tapered surface formed on end,
(E) The surface mounting soldering portions of the first terminal and the second terminal are located closer to the mounting surface than the lower end portion of the fixing portion of the first terminal, and are staggered when viewed from the mounting surface side. surface mount connector characterized that you have arranged. (A) the connecting portion, the mating connector front side wall portion及 beauty rear side wall portion extending in the fitting direction of the motor, and extend in a direction perpendicular to the fitting direction, the front side wall comprising a root portion which connects the parts及 beauty rear side wall,
(B) the Haujin grayed, the surface mount connector of claim 1, further comprising a bottom plate portion extending in a direction perpendicular to the fitting direction in mounting surface side of the root portion. (A) the Haujin grayed includes a side wall portion of the terminal fixing hole into which the fixing portion is press-fitted is arranged,
(B) the fixing unit, by moving toward the mounting surface from the side where the other party connector is fitted against the side wall portion, a surface mount according to claim 1 which is press-fitted into the terminal fixing hole connector. (A) the soldering portion of the first pin extends along an outer side surface of the side wall portion,
(B) the soldering portion of the second pin, the surface mount connector of claim 3 extending to the terminal fixing hole or al mounting surface side. The tapered surface is a surface mount connector of claim 3 which is formed on the mounting surface side end of the terminal fixing hole by Ri outer part of the side wall portion. The soldering portion of the second pin, the surface mount connector of claim 5 which projects up to the mounting surface side of the extended surface that extends toward the mounting surface of the tapered surface.

Images