JP4863480B2 - Alignment method in substrate inspection apparatus and substrate inspection apparatus - Google Patents

Description

The present invention relates to an alignment method and an apparatus therefor in a substrate inspection apparatus, and more specifically, when a substrate to be inspected is placed at a predetermined inspection position and inspected, the position where the substrate is placed is accurately determined. Provided are a positioning method and a substrate inspection apparatus in a substrate inspection apparatus that can be inspected and inspected.
The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In the present specification, these various wiring boards are collectively referred to as “substrates”.

  Conventionally, in order to perform board inspection to inspect the continuity of wiring patterns formed on a substrate such as a printed wiring board, the presence or absence of a short circuit between wiring patterns, or the resistance value between wiring patterns or wiring patterns, For example, a movable inspection contact or a plurality of inspection contacts held in a multi-needle shape is brought into contact with a plurality of inspection points such as pads or lands formed on the wiring pattern on the inspection object. 2. Description of the Related Art A substrate inspection apparatus that performs substrate inspection by measuring electric resistance between inspection points is known.

  In such a substrate, for example, the connection between the wiring pattern and the via hole may be incomplete, and the connection state may be unstable although conduction is established. In such a defect, it may be determined that there is conduction between inspection points at the time of inspection, and the defect may become apparent due to temperature stress in a use environment after being regarded as a non-defective product and incorporated in the product. In particular, an incomplete connection failure in a buried via hole that connects wiring patterns inside a substrate cannot be visually inspected from the outside of the substrate, and is difficult to detect by inspection.

  Therefore, at the time of substrate inspection, by switching between a heated high temperature environment and a cooled low temperature environment in the space where the substrate to be inspected is placed, inspection is performed in a state where temperature stress is applied. An inspection apparatus that detects a complete connection failure has been proposed (see, for example, Patent Document 1).

By the way, as described above, in an inspection apparatus that performs an inspection by applying a temperature stress by switching the mounting space of the substrate to be inspected to a high temperature or low temperature environment, the substrate is mounted in order to heat and cool the substrate. There is a problem that the mounting position of the substrate slightly moves under the influence of expansion and contraction of the mounting table (mounting unit) itself.
In particular, a substrate manufactured in recent years has a wiring pattern having a width of about several tens of μm. Therefore, expansion and contraction due to a temperature change of the mounting table is a serious problem.

JP 2001-215257 A

  The present invention has been made in view of such a situation, and for example, a position in a substrate inspection apparatus capable of performing position correction by grasping a displacement of a substrate due to expansion or contraction of a mounting table in a temperature stress environment. An alignment method and such a substrate inspection apparatus are provided.

The invention according to claim 1 is a substrate alignment method in a substrate inspection apparatus for placing a substrate on which a plurality of wiring patterns are formed at a predetermined inspection position and judging whether the wiring pattern is good or defective. The reference substrate is placed on the placement table on which the imaging device is placed, the placement table is moved to the imaging position where the imaging means is arranged, and the first position information of the reference substrate is acquired by the imaging means at the imaging position. Then, the mounting table is moved from the imaging position to an inspection position where the substrate is inspected, and the second position information of the reference substrate is transferred to the inspection position by the inspection means having a pair of conductive contacts. By obtaining and comparing the first position information and the second position information, the correction position information of the imaging position and the inspection position is obtained , and the second position information acquired by the inspection means is the pair of information. Contact Is contacted with the substrate, to provide a method of aligning a substrate inspection device, characterized in that it is obtained by detecting the continuity of said pair of contacts.
The invention described in claim 2 is characterized in that the mounting table is moved from the temperature adjustment position for heating or cooling the substrate mounted on the mounting table to the imaging position. A method for aligning a substrate inspection apparatus is provided.
According to a third aspect of the present invention, the first position information acquired by the imaging unit includes at least central position information of the center of the substrate and rotational position information of the substrate, and the second position information acquired by the inspection unit is 2. The alignment method for a substrate inspection apparatus according to claim 1, further comprising at least central position information of the center of the substrate and rotation position information of the substrate .
According to a fourth aspect of the present invention, there is provided a substrate inspection apparatus for mounting a substrate on which a plurality of wiring patterns are formed at a predetermined inspection position and judging whether the wiring pattern is good or defective, and for imaging the substrate In the imaging unit, imaging means for imaging a reference substrate placed on the placement table and creating first position information of the reference substrate, and an inspection unit for inspecting the substrate are placed on the placement table. an inspection means for the electrical contact with the reference substrate to create a second position information of the reference substrate, a mounting table, moving means for moving to the inspection unit from the imaging unit, the said first position information first Two-position information, and a control means for calculating a displacement of the position information of the substrate to be inspected, the inspection means has a pair of conductive contacts, and the pair of contacts is The contact of the pair of contacts is brought into contact with the reference substrate. Obtaining said second position information by detecting the providing a substrate inspection apparatus according to claim.
According to a fifth aspect of the present invention, there is provided the substrate inspection apparatus according to the fourth aspect, wherein the moving means is moved from a temperature adjusting unit for heating or cooling the mounting table to the imaging unit.
According to a sixth aspect of the present invention, the first position information acquired by the imaging unit includes at least central position information of the center of the substrate and rotational position information of the substrate, and the second position information acquired by the inspection unit is 5. The substrate inspection apparatus according to claim 4 , comprising at least central position information of the center of the substrate and rotational position information of the substrate .

According to the first or fourth aspect of the present invention, even if the substrate inspection apparatus is arranged at a position where the imaging unit and the inspection unit are different from each other, the imaging is performed by using the alignment method in the substrate inspection apparatus of the present invention. By comparing the first position information in the section and the second position information in the inspection section, the shift of the position information can be calculated.
For this reason, even if the imaging unit and the inspection unit are arranged at different positions, the positional information of the substrate can be surely corrected and the inspection unit can inspect, and an accurate inspection can be performed.
According to the second or fifth aspect of the present invention, even if a temperature adjusting unit that applies a temperature stress to the substrate is arranged, even if expansion or contraction of the substrate or the mounting table due to a temperature change occurs, the imaging unit and Since the positional deviation from the inspection unit can be accurately corrected, it is possible to perform inspection by grasping accurate position information.
According to the third or sixth aspect of the invention, since the first position information and the second position information include the center position information of the substrate and the rotation position information of the substrate, accurate position information of the substrate can be calculated. it can.
According to the invention described in claim 1 or 4 , since the inspection means has a pair of contacts, the contact for performing the inspection can be used as a contact for acquiring position information as it is. The position information can be acquired efficiently.
According to the first aspect of the present invention, since the reference substrate is used to align the substrate, accurate substrate position information can be grasped.

The best mode for carrying out the present invention will be described.
The substrate alignment method in the substrate inspection apparatus according to the present invention is effective in the substrate inspection apparatus in which the imaging unit that acquires the positional information of the substrate by the imaging unit and the inspection unit that inspects the substrate are not arranged at the same place. Can play.
Conventionally, in such a substrate inspection apparatus, it is used on the premise that there is no positional deviation between the imaging unit and the inspection unit, and the position of the substrate acquired by the imaging unit is the position of the substrate in the inspection unit. It was used.
In particular, in a substrate inspection apparatus that applies a temperature stress to the substrate in the previous stage of the imaging unit, the position of the substrate in the imaging unit and the position of the substrate in the inspection unit are misaligned due to a slight temperature change. However, the deviation can be accurately corrected by using the present invention.

An embodiment of a substrate inspection apparatus according to the present invention will be described.
FIG. 1 is an external perspective view showing an example of the configuration of a substrate inspection apparatus using a substrate inspection method according to an embodiment of the present invention. A substrate inspection apparatus 1 shown in FIG. 1 is housed in a substantially box-shaped housing 2. Outside the substrate inspection apparatus 1, for example, air is dried using silica gel, and the temperature is increased by the air dryer 3 that heats and drys the silica gel, and the silica gel that is dried and heated by the air dryer 3. The air cooler 4 that cools the air is connected to the board inspection apparatus 1 by a duct. Moreover, the air dryer 6 is connected with the board | substrate inspection apparatus 1 by the duct.

The air dryer 3 and the air cooler 4 circulate the air inside the housing 2 to have a dew point of, for example, zero degrees or less (although it is not particularly limited, the dew point temperature is 0 ° C. to −10 ° C.). To dry. The air dryer 6 is an air dryer that dries air by allowing air to pass through, for example, a polymer film. For example, a dew point that is lower than the cooling temperature of the substrate to be inspected (not particularly limited, but the dew point is not limited). Dry air having a temperature of −10 ° C. to −70 ° C. is supplied to the substrate inspection apparatus 1.
In the substrate inspection apparatus 1 according to this embodiment, the above-described functions are provided in order to apply a temperature stress to the substrate to be inspected.

  The housing 2 includes an operation display units 11 and 12, a receiving port 13 for receiving a substrate to be inspected, a discharge port 14 for discharging the substrate after the inspection, and a monitor constituted by, for example, a CRT (Cathode Ray Tube). 15 and windows 16 and 17 through which the inside of the housing 2 can be visually confirmed are provided. The operation display units 11 and 12 are composed of, for example, a touch panel type liquid crystal display or the like, and accept operation instructions such as an inspection execution instruction from a user or display an inspection result of a substrate to be inspected.

FIG. 2 is a schematic configuration diagram illustrating an example of an internal structure of the housing 2 in the substrate inspection apparatus 1. FIG. 3 is a plan view showing a schematic configuration of the inside of the housing 2 of the substrate inspection apparatus 1 as viewed from above. 2 and 3 show XYZ orthogonal coordinate axes in order to clarify the directional relationship with each figure. Here, the Y axis is the depth direction of the apparatus, the X axis is the direction in which the substrate to be inspected is transported to each inspection stage, and the Z axis is the direction perpendicular to the surface of the substrate to be inspected.
In the substrate inspection apparatus 1, a cooling unit, a heating unit, and a preheating unit are provided in order to apply a temperature stress to the substrate.

  The substrate inspection apparatus 1 shown in FIG. 2 includes an input work holder 21 (receiving part), a cooling holding part 22 (cooling part), a preheating holding part 23 (preheating part), a heating holding part 24 (heating part), and a storage work holder 25. (Storage unit), lids 26, 27, 30, fixed lids 28, 29, a plurality of nozzles 31 (air spraying unit), transport unit 32, imaging means 33, 34, non-contact thermometers 35, 36, movable type Probes 37 and 38, a suction pump 39 (suction unit), a dry air outlet 51 (second dry air supply unit), and a dry air discharge port 52 are provided.

  The dry air outlet 51 is connected to the air cooler 4 through a duct. The dehydration point is, for example, not more than zero degrees by the air dryer 3 and the air cooler 4, but the dew point temperature is not particularly limited. Dry air having 0 ° C. to −10 ° C.) is supplied into the housing 2. The dry air discharge port 52 is connected to the air dryer 3 through a duct, and discharges the air in the housing 2 to the air dryer 3 to circulate the air in the housing 2.

  The lid body 26 and the lid body 27 are configured to be slidable in the X-axis direction, and are slid and moved by a drive mechanism (not shown) so that the upper opening of the cooling holding unit 22 or the heating holding unit 24 can be opened and closed. . The lid 30 is configured to be slidable in the Y-axis direction, and is slid by a not-shown drive mechanism so that the upper opening of the preheat holding unit 23 can be opened and closed. The suction pump 39 sucks air through a tube (not shown) connected to the transport unit 32, the cooling holding unit 22, the preheating holding unit 23, and the heating holding unit 24.

  The board inspection apparatus 1 includes a guide rail 41 and a guide rail 42 extending in the Y-axis direction, a guide rail 43 extending in the X-axis direction, two guide rails 44 and 44 extending in the X-axis direction, and a guide rail 44. , 44 is provided with guide rails 45, 46 extending in the Y-axis direction so as to span between them. Then, the cooling holding unit 22 is configured to be slidable along the guide rail 41 and the heating holding unit 24 is configured to be slidable along the guide rail 42 by a drive mechanism (not shown), and is conveyed along the guide rail 43. The portion 32 is configured to be slidable, and the guide rails 45 and 46 are configured to be slidable along the guide rails 44 and 44, respectively.

  In addition, elevating mechanisms 47 and 48 are attached to the guide rails 45 and 46 in opposite directions, and the elevating mechanisms 47 and 48 are configured to be slidable along the guide rails 45 and 46 by a drive mechanism (not shown). ing. The movable probes 37 and 38 are attached to the opposing positions of the elevating mechanisms 47 and 48, respectively, and are movable up and down in the Z-axis direction by the elevating mechanisms 47 and 48. Accordingly, the movable probes 37 and 38 are movable in the X, Y, and Z axis directions, respectively.

FIG. 4 is a perspective view showing an example of details of the input work holder 21. The input work holder 21 shown in FIG. 4 shows a state in which a square inspection substrate 8 is placed. Further, five concave portions 211 formed so as to support the four corners of the substrate 8 to be inspected are formed in a line on the upper surface of the input work holder 21, and the user fits the substrate 8 to be inspected into the concave portion 211. Thus, the inspected substrate 8 is positioned at a predetermined position.
In this substrate inspection apparatus 1, five substrates can be inspected at the same time. However, the number is not particularly limited. However, since a temperature stress is applied at the same time and then inspection is performed one by one, about five substrates are preferable. It becomes the number of sheets.

  A handle 212 is attached to the end of the input work holder 21, and when the user pulls the handle 212, the input work holder 21 is pulled out of the housing 2 and the substrate 8 to be inspected is placed on the input work holder 21. When the user inserts the inspected substrate 8 into the recess 211 of the input work holder 21 and pushes the input work holder 21 into the housing 2, the inspected substrate 8 can be received by the substrate inspection apparatus 1. ing.

FIG. 5 is a view showing an example of the front and back of the substrate 8 to be inspected. A test substrate 8 shown in FIG. 5 is a package substrate used for an IC package such as a BGA (Ball Grid Array).
The die 82 is mounted. FIG. 5A shows the appearance of the side provided with a wiring pattern such as a pad 81 connected to the circuit board by solder balls, and FIG. 5B shows the side of the inspected substrate 8 on which the die 82 is mounted. FIG. 5C is a plan view showing the external appearance of the inspected substrate 8 on the side where the die 82 is mounted.

  In the inspected substrate 8 shown in FIG. 5, the pad 81 is connected to the die 82 via wiring such as a wiring pattern formed in the inner layer of the inspected substrate 8, an inner via, and a wiring pattern 83 formed on the substrate surface. , And connected to another pad 81 via a die 82. The substrate 8 to be inspected is not limited to a BGA package substrate, and there may be a case in which the die 82 is not mounted, and the wiring patterns serving as inspection points such as the pads 81 are directly connected without passing through the die 82. In some cases.

  FIG. 6 is an external perspective view showing an example of the configuration of the cooling holding unit 22. The cooling holding unit 22 shown in FIG. 6 includes, for example, a substantially plate-shaped cooling plate 221 made of a material having high thermal conductivity such as aluminum, and five mounted in a row on the cooling plate 221. A space surrounded by the placement portions 222a, 222b, 222c, 222d, and 222e, a wall-shaped side wall portion 223 that is provided to surround the placement portions 222a, 222b, 222c, 222d, and 222e, and the side wall portion 223 Is provided with a plurality of partition plates 224 for partitioning the mounting portions 222a, 222b, 222c, 222d, and 222e, and a cooler 220 that cools the cooling plate 221. The cooler 220 includes, for example, a Peltier element (not shown) disposed below the cooling plate 221 and a cooling fan 225 that air-cools the heat radiation portion of the Peltier element.

  FIG. 7 is a partially enlarged view showing the mounting portion 222a, the side wall portion 223 surrounding the mounting portion 222a, and the partition plate 224. In the mounting portion 222a shown in FIG. 7, the dew point temperature is closer to the four sides of the mounting portion 222a surrounded by the side wall portion 223 and the partition plate 224 than the cooling temperature of the substrate to be inspected supplied from the air dryer 6. A hole 226 (first dry air supply unit) for discharging low dry air is provided. In addition, a recess 227 having substantially the same shape as the die 82 is formed at the approximate center of the cooling plate 221 in the mounting portion 222a, and a hole connected to the suction pump 39 via a tube (not shown) at the approximate center of the recess 227. 228 is provided.

  Further, a sheet member 229 is attached in close contact with the upper surface of the cooling plate 221 in the mounting portion 222a so as to avoid the recess 227 and the hole 226. Furthermore, four small pieces of sheet members 272 are closely attached to the bottom of the concave portion 227 so as to form grooves 271 around the concave portion 227 and radially from the hole 228 around the hole 228. ing. That is, four substantially square sheet members 272 are attached to the bottom of the recess 227 in a grid pattern with a space between each other, so that the space forms a groove 271. The sheet member 229 and the sheet member 272 form a concave portion that fits into the die 82.

The sheet members 229 and 272 are heat conductive sheets having a substantially plate-like elasticity, and are made of, for example, silicon rubber. As the sheet members 229 and 272,
For example, a heat conductive sheet such as TC50TXE manufactured by Shin-Etsu Chemical Co., Ltd. or 5509S manufactured by 3M Corporation can be used. In this case, the cross-shaped central portion of the groove 271 corresponds to the through hole in the claims.

  The groove 271 only needs to expand radially from the hole 228 and is not limited to a cross-shaped groove. Further, the cooling plate 221 is flattened without forming the recess 227, and the sheet member 229 is attached to the flat upper surface of the cooling plate 221, so that the recess 227 is formed within the thickness of the sheet member 229. Also good. Further, without providing the recess 227, the sheet member 229 is attached in close contact with the upper surface of the flat cooling plate 221, a through hole that reaches the hole 228 through the flat sheet member 229, and a groove that radially expands from the through hole And may be provided. Alternatively, the suction pump 39 may not be provided, and low-pressure air supplied from the outside of the substrate inspection apparatus 1 may be supplied to the hole 228 through a tube (suction unit).

  Since the configuration of the placement units 222b, 222c, 222d, and 222e is the same as the configuration of the placement unit 222a, description thereof is omitted.

  FIG. 8 is an external perspective view showing an example of the configuration of the preheating holding unit 23 and the heating holding unit 24. The preheating holding unit 23 shown in FIG. 8 includes a substantially plate-like preheating plate 231 configured using a material having high thermal conductivity such as aluminum, and five mounting plates provided in a row on the preheating plate 231. A space surrounded by the placement portions 232a, 232b, 232c, 232d, and 232e, a wall-shaped side wall portion 233 provided to surround the placement portions 232a, 232b, 232c, 232d, and 232e, and the sidewall portion 233 Is provided with a plurality of partition plates 234 for partitioning each of the mounting portions 232a, 232b, 232c, 232d, and 232e, and a preheating heater 235 that is disposed below the preheating plate 231 and heats the preheating plate 231. .

  Further, the heating and holding unit 24 has substantially the same configuration as that of the preheating holding unit 23 shown in FIG. 8. For example, the heating and holding unit 24 includes a substantially plate-like heating plate 241 configured using a material having high thermal conductivity such as aluminum. The five mounting portions 242a, 242b, 242c, 242d, and 242e provided in a row on the heating plate 241 and the surroundings of the mounting portions 242a, 242b, 242c, 242d, and 242e are provided. A wall-shaped side wall portion 243, a plurality of partition plates 244 that partition the space surrounded by the side wall portion 243 for each of the mounting portions 242a, 242b, 242c, 242d, and 242e, and a lower portion of the heating plate 241 are provided. A heater 245 for heating the plate 241 is provided.

  FIG. 9 is a partially enlarged view showing the placement portion 242a and the side wall portion 243 surrounding the placement portion 242a and the partition plate 244 in the heating and holding portion 24. A recess 247 having substantially the same shape as that of the die 82 is formed at substantially the center of the heating plate 241 in the mounting portion 242a shown in FIG. 9, and is connected to the suction pump 39 via a tube (not shown) at approximately the center of the recess 247. A hole 248 is provided.

  In addition, a sheet member 249 is attached in close contact with the upper surface of the heating plate 241 in the mounting portion 242a so as to avoid the concave portion 247. Furthermore, four small pieces of sheet members 251 are closely attached to the bottom of the concave portion 247 so as to form a groove 250 radially around the concave portion 247 and around the concave portion 247, that is, from the hole 248. ing. That is, four substantially square sheet members 251 are attached to the bottom of the recess 247 in a grid pattern with a space therebetween, so that the space forms a groove 250. As a result, the sheet member 249 and the sheet member 251 form a recess that fits into the die 82.

  The sheet members 249 and 251 are heat conductive sheets having substantially plate-like elasticity similar to the sheet members 229 and 272, and are made of, for example, silicon rubber. In this case, the cross-shaped center portion of the groove 250 corresponds to the through hole in the claims.

  In addition, the groove | channel 250 should just expand radially from the hole 248, and is not restricted to a cross-shaped groove | channel. Further, the heating plate 241 is flat without forming the recess 247, and the sheet member 249 is attached to the flat upper surface of the heating plate 241 so that the recess 247 is formed within the thickness of the sheet member 249. Also good. Further, without providing the recess 247, the sheet member 249 is closely attached to the upper surface of the flat heating plate 241, and the through hole reaching the hole 248 through the flat sheet member 249 and the groove radially extending from the through hole And may be provided.

Since the configuration of the placement units 242b, 242c, 242d, and 242e in the heating holding unit 24 is the same as the configuration of the placement unit 242a, the description thereof is omitted. Further, the placement portions 232a, 232b, 232c, 232d, and 232e in the preheating holding portion 23 are the concave portions 247, the holes 248, and the sheet member 249 in the same manner as the placement portions 242a, 242b, 242c, 242d, and 242e in the heating holding portion 24. , 251 and a groove 250.
The cooling unit 22, the preheating unit 23, and the heating unit 24 are all mechanisms for applying a temperature stress, and are not particularly limited, and other mechanisms for cooling or heating may be used.

FIG. 10 is an exploded perspective view showing an example of the configuration of the lids 26 and 27. The lid body 26 and the lid body 27 are configured in the same manner, with four substantially plate-like sheets 261, the placement units 222 a to 222 e and the placement unit 242 a in the cooling holding unit 22 and the heating holding unit 24. The spacers 262 each having an opening provided in a plate-like member so as to correspond to the positions ˜242e are alternately stacked with the spacers 262 interposed between the sheets 261.
As a result, the lids 26 and 27 have a heat insulating structure in which the three air layers are sandwiched by the four sheets 261, and the heat intrusion into the cooling holding unit 22 and the heat release from the heating holding unit 24 are reduced. It is supposed to be.

  In addition, a long hole 263 extending in a direction perpendicular to the longitudinal direction of the lid bodies 26 and 27 is provided on one end side of the lid bodies 26 and 27. The long hole 263 is a hole for performing alignment of the substrate 8 to be inspected by the imaging means 33 and 34 and temperature measurement by the non-contact thermometers 35 and 36, and through the long hole 263 during alignment and temperature measurement. The cooling holding unit 22 when performing alignment or temperature measurement by taking an image of the inspection substrate 8 or setting the minimum size necessary for detecting infrared rays emitted from the inspection substrate 8. And the temperature change of the to-be-inspected board | substrate 8 mounted in the heating holding | maintenance part 24 is reduced.

  FIG. 11 is an explanatory diagram illustrating an example of the configuration of the lid 30. 11 includes four substantially plate-like sheets 301 and spacers in which openings are provided in plate-like members so as to correspond to the positions of the placement parts 232a to 232e in the preheating holding part 23. 302 are alternately stacked with the spacers 302 sandwiched between the sheets 301. Accordingly, the lid 30 is configured to reduce the release of heat from the preheat holding unit 23 in the same manner as the lids 26 and 27.

FIG. 12 is an explanatory diagram showing an example of the configuration of the fixed lid bodies 28 and 29. The fixed lid body 28 and the fixed lid body 29 have substantially the same configuration. Like the lid bodies 26 and 27, the four substantially plate-like sheets 281, the cooling holding unit 22, and the heating holding unit 24 are used. Spacers 282 in which openings are provided in plate-like members so as to correspond to the positions of the placement portions 222 a to 222 e and the placement portions 242 a to 242 e are alternately stacked with the spacers 282 interposed between the sheets 281. Configured.
As a result, the fixed lids 28 and 29 have a heat insulating structure in which the three air layers are sandwiched between the four sheets 281, and the heat intrusion into the cooling holding unit 22 and the heat release from the heating holding unit 24 are prevented. It comes to reduce.

  In addition, on one end side of the fixed lid bodies 28 and 29, an opening 283 having the same or smaller size as that of one placement portion in the placement portions 222a to 222e and the placement portions 242a to 242e is provided. It has been. The opening 283 is an opening for performing a continuity test of the wiring pattern of the substrate 8 to be inspected placed on the cooling holding unit 22 and the heating holding unit 24 using the movable probes 37 and 38. Since the size of the portion, that is, the minimum size necessary for the inspection of the substrate 8 to be inspected by the mobile probes 37 and 38 is set, the substrate 8 to be inspected during the inspection by the mobile probes 37 and 38. The temperature change in the inspected substrate 8 other than the above is reduced.

  Returning to FIG. 2, the storage work holder 25 is configured in a substantially rectangular table shape, and five substrates 8 to be inspected can be placed on the upper surface. Then, 10 pieces of dry air of normal temperature supplied from the air dryer 3 are sprayed on the side of the storage work holder 25 toward the five substrates 8 to be inspected placed on the upper part of the storage work holder 25. Nozzle 31 is provided. Since the inspected substrate 8 heated to a high temperature of, for example, about 100 ° C. by the heating holding unit 24 is placed on the storage work holder 25, the normal temperature is applied to the inspection substrate 8 on the storage work holder 25 by the nozzle 31. By blowing the air, it is possible to shorten the time for cooling the substrate to be inspected 8 to a temperature of about 40 ° C. when the substrate to be inspected 8 is gripped so that a person does not burn.

  A handle 252 is attached to the end of the storage work holder 25, and when the user pulls the handle 252, the storage work holder 25 is pulled out of the housing 2 and placed on the storage work holder 25. The substrate 8 to be inspected can be taken out.

  Five vacuum heads 321 for adsorbing the substrate 8 to be inspected are arranged below the transport unit 32, and the five vacuum heads 321 can be moved up and down in the Z-axis direction by an unillustrated lifting mechanism. . Further, the five vacuum heads 321 are connected to the suction pump 39 via a tube (not shown) so as to suck and hold the substrate 8 to be inspected.

  Then, the transport unit 32 sucks the substrate 8 to be inspected received by the input work holder 21 and fitted in the recess 211 by the vacuum head 321 and transports it to the placement units 222 a to 222 e in the cooling holding unit 22. The substrate to be inspected 8 placed on the substrate 22 is sucked by the vacuum head 321 and conveyed to the placement units 242a to 242e in the preheating holding unit 23, and the substrate 8 to be inspected placed on the preheating holding unit 23 is vacuumed. The substrate to be inspected 8 placed on the heating and holding unit 24 is sucked by the vacuum head 321 and conveyed to the storage work holder 25.

Reference numerals 33 and 34 indicate imaging means. As the imaging means 33 and 34, for example, a camera for creating an image can be used.
The imaging unit 33 and the imaging unit 34 are images for alignment of the inspected substrates 8 placed on the placement units 222a to 222e in the cooling holding unit 22 and the placement units 242a to 242e in the heating holding unit 24, respectively. Take a picture. Further, the images photographed by the imaging means 33 and 34 are output to the monitor 15 so that the user can check the images photographed by the imaging means 33 and 34.
Image information captured by the image capturing means 33 and 34 is transmitted to the control means.

  The non-contact thermometers 35 and 36 are non-contact thermometers that measure the surface temperature of an object using, for example, infrared rays. The non-contact thermometers 35 and 36 are mounted on the mounting units 222 a to 222 e in the cooling holding unit 22 and the mounting units 242 a to 242 e in the heating holding unit 24. The temperature of each substrate 8 to be inspected is measured.

  FIG. 13 is an external view showing details of a movable probe including a pair of contacts as inspection means. The movable probe 37 and the movable probe 38 which are the inspection means have the same configuration, and two probes 371 made of a linear conductive material having elasticity, and 2 inside the cylindrical body. A support member 372 that penetrates the probe 371 and supports it substantially perpendicularly to the inspection point of the substrate 8 to be inspected is provided. In addition, an insulating coating is formed on the surfaces of the two probes 371 except for the tip portion 373 which is a portion in contact with the inspection point in the two probes 371. Further, the opposite sides of the distal end portion 373 of the two probes 371 are connected to an inspection control means 50 described later via two signal lines 374, respectively.

  Thereby, when inspecting continuity between two inspection points, the two probes 371 of the movable probe 37 are pressed against one inspection point, and the two probes 371 of the movable probe 38 are connected to the other inspection point. A current is passed between one probe 371 in the movable probe 37 and one probe 371 in the movable probe 38, and the other probe 371 in the movable probe 37 and the other probe 371 in the movable probe 38 are By measuring the voltage generated between the two, a highly accurate resistance measurement is performed by a four-terminal measurement method.

  In addition, the movable probe 37 having the pair of contacts 373 can confirm contact when contacting the conductor. This contact confirmation operates so that a current flows from one terminal 373 of the pair of contacts 373 to the other terminal 373. At this time, if the movable probe is in contact with the conductor, a current flows from one terminal 373 to the other terminal, so that contact with the conductor can be confirmed.

  FIG. 14 is a block diagram illustrating an example of an electrical configuration of the substrate inspection apparatus 1. The substrate inspection apparatus 1 shown in FIG. 14 includes operation display units 11 and 12, a monitor 15, imaging means 33 and 34, non-contact thermometers 35 and 36, a suction pump 39, movable probes 37 and 38, a transport drive unit 40, A probe driving unit 49, an inspection control unit 50, a control unit 60, temperature controllers 61, 62, and 63, a cooler 220, a preheating heater 235, and a heating heater 245 are provided.

  The temperature controllers 61, 62, and 63 are configured by a control circuit that performs temperature control in accordance with the set temperature set by the control means 60. For example, a so-called electronic temperature controller that performs temperature control based on PID control or the like. Is used. The temperature controller 61 controls the operation of the cooler 220 so that the temperature of the cooling plate 221 becomes the set temperature set by the control means 60. The temperature controller 62 controls the operation of the preheating heater 235 so that the temperature of the preheating plate 231 is set to the set temperature set by the control means 60. The temperature controller 63 controls the operation of the heater 245 so that the temperature of the heating plate 241 is set to the set temperature set by the control means 60.

  The conveyance drive unit 40 (lid opening / closing unit) is configured by a drive mechanism such as a motor, a gear, or a belt, for example, and the cooling holding unit 22 is moved along the guide rail 41 in accordance with a control signal from the control unit 60. Transfer in the Y-axis direction, transfer the heating and holding unit 24 in the Y-axis direction along the guide rails 42, and slide the lid 26 in the X-axis direction to open and close the upper opening of the cooling holding unit 22 The lid 30 is slid in the Y-axis direction to open and close the upper opening of the preheating holding unit 23, the lid 27 is slid in the X-axis direction to open and close the upper opening of the heating holding unit 24, and the conveyance The part 32 is moved along the guide rail 43 in the X-axis direction, and the vacuum head 321 is moved up and down in the Z-axis direction.

  The probe driving unit 49 moves the movable probe 37 in the X and Y axis directions along the guide rails 44 and 45 in accordance with a control signal from the inspection control means 50 or moves it up and down in the Z axis direction by the lifting mechanism 47. Or The probe driving unit 49 moves the movable probe 38 in the X and Y axis directions along the guide rails 44 and 46 in accordance with a control signal from the inspection control means 50 or moves in the Z axis direction by the lifting mechanism 48. Move up and down.

  The inspection control means 50 is a control circuit for inspecting the substrate 8 to be inspected. For example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a ROM (Read Only Memory) in which a predetermined control program is recorded, It comprises a RAM (Random Access Memory) for temporarily recording data and its peripheral circuits.

  Specifically, the inspection control unit 50 outputs a control signal to the probe driving unit 49 in accordance with a control signal from the control unit 60 to cause the mobile probes 37 and 38 to be connected to the pads 81 and the like on the substrate 8 to be inspected. The resistance value between the two inspection points is measured by the four-terminal measurement method via the signal line 374 connected to the movable probes 37 and 38 while being moved to the inspection point and pressed. At this time, the inspection control means 50 corrects the position where the movable probes 37 and 38 are pressed in accordance with the alignment information of the position of the inspection point obtained from the control means 60.

  Then, the inspection control means 50 determines that the substrate 8 to be inspected is a non-defective product if the resistance value is not more than a preset threshold value between all the inspection points set in advance on the substrate 8 to be inspected. While a signal indicating the determination result is output to the control means 60, if the resistance value exceeds a preset threshold between any of the preset inspection points in the inspected substrate 8, the inspected substrate 8 determines that there is a continuity failure between the inspection points, and outputs a signal indicating the determination result to the control means 60.

  The inspection control unit 50 may output the resistance measurement value between the inspection points to the control unit 60 without performing pass / fail determination of the substrate 8 to be inspected. In addition, since the change in resistance value generated between the inspection points due to temperature stress is very small, the four-terminal measurement method capable of measuring the resistance value with high accuracy is suitable. May be any device that measures resistance between inspection points. Therefore, the inspection control means 50 is not necessarily limited to performing resistance measurement by the four-terminal measurement method, and each of the mobile probes 37 and 38 may include one probe 371.

  Further, instead of the movable probes 37 and 38, a plurality of inspection contacts held in a multi-needle shape are simultaneously pressed and brought into contact with a plurality of inspection points, and selective between the plurality of inspection contacts. Alternatively, the resistance between the inspection points may be measured by inputting / outputting inspection signals. Alternatively, the wiring pattern may be inspected in a non-contact manner using capacitance, laser light, or the like instead of the movable probes 37 and 38.

The control means 60 is a control circuit that controls the overall operation of the board inspection apparatus 1. For example, a CPU that executes predetermined arithmetic processing, a ROM that stores a predetermined control program, and a RAM that temporarily stores data. And its peripheral circuits and the like.
Specifically, the control means 60 receives a signal indicating a user's operation instruction received by the operation display units 11 and 12, and sends a control signal to the temperature regulators 61, 62, and 63 in accordance with the operation instruction. The temperature control by the temperature regulators 61, 62, 63 is started by outputting and setting the set temperatures of the temperature regulators 61, 62, 63, and the temperature is held in advance prior to cooling and heating of the inspected substrate 8. The cooling plate 221 in the unit 22 is cooled to a predetermined set temperature, for example, 0 ° C., and the preheating plate 231 and the heating plate 241 in the preheating holding unit 23 and the heating holding unit 24 are heated to a predetermined set temperature, for example, 100 ° C. .

  In addition, the control means 60 outputs a control signal to the suction pump 39 to start the suction operation, and places the inspected substrate 8 on the placement portions 222a to 222e, the placement portions 232a to 232e, the placement portions 242a to 242e, and Adsorbed to the vacuum head 321.

  Then, the control unit 60 outputs a control signal to the transport driving unit 40 to control the inspection control unit 50 while transporting the inspected substrate 8 sequentially to the cooling holding unit 22, the preheating holding unit 23, and the heating holding unit 24. A substrate is inspected in a state in which a signal is output and the inspected substrate 8 is cooled and in a heated state. Further, the control means 60 acquires the temperature of the inspected substrate 8 measured by the non-contact thermometers 35 and 36 when the inspection control means 50 inspects the inspected substrate 8, and has a preset temperature range. The inspection position alignment information is acquired from the images of the inspected substrate 8 imaged by the imaging means 33 and the imaging means 34 and transmitted to the inspection control means 50, and then the inspected substrate by the inspection control means 50 is obtained. 8 inspections are executed.

The control unit 60 operates to inspect the substrate 8 as described above, and creates position information for correcting position information on the mounting table on which the substrate is mounted in the imaging unit and the inspection unit. . Based on the corrected position information, the operation of the movable probes 37 and 38 is controlled.
The control means 60 receives first position information acquired by the imaging means and second position information acquired by the inspection means (movable probe).
The control means 60 compares the first position information with the second position information, calculates the difference, and grasps it as position deviation information. The position deviation information is used as corrected position information, and a mobile probe (inspection means) is obtained. ) 37, 38, the positional deviation between the imaging unit and the inspection unit can be corrected.

The first position information and the second position information received by the control means 60 are information indicating the position information of the substrate 8, but when obtaining the position information, a reference substrate serving as a reference is created, It is preferable to obtain alignment information.
Therefore, first, the reference substrate (master piece) will be described.

The reference substrate may have any shape or pattern, but is preferably a substrate as shown in FIG. The substrate 8 (reference substrate) shown in FIG. 6 has the same outer shape as the substrate to be inspected (substantially square in FIG. 9), a central point 84f at the center of the substrate 8, and a horizontal direction from the central point 84. Peripheral points 84a, 84b, 84c, and 85d are provided at positions separated by a predetermined distance d in the vertical direction. These points are formed of a conductive material and are formed so that their presence and position can be recognized in images captured by the imaging means 37 and 38.
The reference substrate itself is formed of an insulating material, and only the center point and the peripheral point are formed of a conductive material.
Further, a peripheral edge portion 84e having a color different from that of the central point 84f is provided at the peripheral edge of the central point 84f of the substrate 8 so that the central point 84f can be surely grasped more reliably.
Although these points are affected by the resolution of the imaging means 33 and 34 and the distance between the pair of contacts of the movable probes 37 and 38, they are provided so as to form a circle having a diameter of approximately 1 mm.

First position information acquired by the imaging unit will be described.
The first position information acquired by the imaging units 33 and 34 (hereinafter, reference numeral 34 is omitted) is created when the imaging unit 33 images the substrate.
First, the imaging means 33 searches for the center point 84 f of the substrate 8. The method of searching for the center point 84f is not particularly limited, but the peripheral edge (side) of the substrate 8 is determined by image recognition from the image captured by the imaging means 33, and the approximate center of the substrate 8 is calculated from the peripheral edge. Thereafter, the imaging means 33 is moved to approximately the vicinity of the center, and the center point 84f is found by image recognition.

When the center point 84f is found, two peripheral points 84a and 84b or peripheral points 84c and 84d in the horizontal direction or the vertical direction of the reference substrate 8 are searched.
In this method of searching for the two peripheral points, the positions of the two peripheral points can be determined to some extent from the position information of the central point 84f, and therefore the imaging means 33 is moved to an approximate position. And this one peripheral point is searched for by the image recognition which the imaging means 33 images as if it searched for the position of the center point 84f. When one peripheral point is found, the other peripheral point is similarly determined from the central point 84f, and the other peripheral point is searched for the vicinity by image recognition.

When two peripheral points (for example, peripheral points 84a and 84b) are found (position information of the central point 84f and the two peripheral points is acquired), the reference substrate 8 is set with respect to a preset reference axis. Get information on how much has been rotated.
For example, by calculating the positional relationship between the reference axis and the straight line formed by the three points of the central point 84f and the two peripheral points with respect to the reference axis, how much the reference substrate 8 is relative to the reference axis. It is possible to acquire information on whether the rotation is occurring (for example, θ degree rotation from the reference axis).
As described above, the first position information includes the position information of the center point 84f of the reference board 8 and the rotation position information (angle information) with respect to the reference axis of the reference board 8 in the imaging unit.
The first position information may include position information of each of the two peripheral points.

The second position information acquired by the inspection unit will be described.
The second position information acquired by the inspection means 37 and 38 (hereinafter, reference numeral 38 is omitted) is created when the inspection means 37 actually contacts the reference substrate 8.
As shown in FIG. 13, the inspection unit 37 has a pair of contacts 373, and acquires the position information of the reference substrate 8 by using the presence or absence of conduction between the pair of contacts 373.
The central point 84f of the substrate 8 is formed of a conductive material. For this reason, when a pair of contact 373 contacts this center point 84f, between a pair of contact 373 will be in a conduction | electrical_connection state. That is, when the pair of contacts 373 come into contact with the center point 84f and the peripheral points 84a,..., 84d, the pair of contacts 373 are in a conductive state. The position information of the peripheral point can be acquired.

The inspection unit 37 obtains the second position information by first obtaining the position information of the center point 84f as in the imaging unit 33. In this method, as described above, first, the inspection means 37 is moved to the vicinity of the center, the pair of contacts 373 are brought into contact with the reference substrate, and the presence / absence of the conduction is confirmed to find the center point 84f. When the pair of contacts 373 becomes conductive, the center point 84f exists at that position, and the position information of the center point 84f is acquired.
When the position information of the center point 84f is acquired, the two peripheral points 84a and 84b or the peripheral points 84c and 84d in the horizontal direction or the vertical direction of the reference substrate 8 are searched as in the case of the imaging unit 33.
Similarly to the acquisition of the position information of the center point 84f, the two peripheral points 84a and 84b are also brought into contact with the reference substrate 8 at a position away from the center point 84f by a predetermined distance d, and the presence or absence of conduction. These inspections are repeated to find one peripheral point and the other peripheral point.

When the inspection unit 37 acquires the position information of the center point 84f and the two peripheral points, as in the case of the acquisition of the first position information, which of the reference substrates 8 is set with respect to the reference axis set in advance. Get information about whether it is rotated to some extent.
For example, by calculating the positional relationship between the reference axis and the straight line formed by the three points of the central point 84f and the two peripheral points with respect to the reference axis, how much the reference substrate 8 is relative to the reference axis. It is possible to acquire information on whether the rotation is occurring (for example, θ degree rotation from the reference axis).
FIG. 15B is a conceptual diagram in the case of detecting a difference in substrate position information acquired by the imaging unit and the inspection unit. In FIG. 15B, position information (indicated by a dotted line in the figure) of the reference substrate 8b acquired by the imaging unit and position information of the reference substrate 8a acquired by the inspection unit are shown. The deviation is shown as angle θ. FIG. 15B shows a deviation of the substrate position information (second position information) by the inspection unit based on the substrate position information (first position information) by the imaging unit.
As described above, the second position information includes the position information of the center point 84f of the reference substrate 8 and the rotation position information (angle information) of the reference substrate 8 with respect to the reference axis in the inspection unit.
The second position information may include position information of each of the two peripheral points.

  The information acquired from the reference substrate 8 by the inspection means 37 can include height information in the z direction. This is because, when the position information of the center point 84f of the reference substrate 8 is acquired, the position information in the height direction is acquired by bringing the pair of contacts 373 into contact with the center point 84f while performing height control. To do. By this method, position information in the height direction (z direction) of the center point 84f can be acquired and used as second position information.

When the control means 60 receives the first position information and the second position information, the control means 60 compares the first position information and the second position information to detect a deviation between the imaging unit and the inspection unit. This deviation is acquired as correction position information. The control unit 60 corrects the position information of the substrate 8 to be inspected acquired by the imaging units 33 and 34 based on the corrected position information, and transfers it to the inspection units 37 and 38.
For this reason, the inspection means 37 and 38 can perform inspection using the position information of the substrate in the inspection unit from the position information of the substrate in the imaging unit, and can grasp the more accurate position of the substrate. Even if the imaging unit and the inspection unit are arranged at different positions, the position information can be grasped more accurately.
The above is the description of the configuration of the substrate inspection apparatus according to the present invention.

Next, a substrate alignment method using the reference substrate 8 of the substrate inspection apparatus 1 will be described. FIG. 16 is a flowchart of the substrate alignment method according to the present invention.
First, five reference substrates 8 (see FIG. 15) are loaded into the loading work holder 21 (step A).
Next, the input reference substrate 8 is placed on the placement unit of the cooling holding unit 22 by the transport unit 32. At this time, as shown in FIG. 17, the reference substrate 8 is cooled until a predetermined temperature is reached (step B).

When the reference substrate 8 is cooled to a predetermined temperature, next, as shown in FIG. 18, five reference substrates 8 are moved to the imaging unit.
At this time, the imaging means 33 acquires the first position information for each reference substrate 8 (step C).
This first position information includes the position information of the center point 84f of the reference substrate 8 and the rotation position information of the reference substrate in the imaging unit as described above. The acquired first position information is transmitted to the control means 60.

When the first position information is acquired by the imaging means 33, the five reference substrates 8 are moved to the inspection unit shown in FIG.
At this time, the inspection unit 37 acquires second position information for each reference substrate 8 (step D).
This second position information includes the position information of the center point 84f of the reference substrate 8 and the rotation position information of the reference substrate in the inspection section as described above. The acquired second position information is transmitted to the control means 60.

When receiving the first position information and the second position information, the control means 60 calculates corrected position information that is a difference between these position information (step E).
At this time, the calculated corrected position information is stored in a storage unit such as a memory included in the control unit 60, and the corrected position information is used when the substrate to be inspected is actually inspected. The movement of the movable probe) is controlled (Step F).
In addition, in the board | substrate inspection apparatus 1 shown by this embodiment, the heating holding | maintenance part 24 carries out said method similarly,

  Next, the operation of the substrate inspection apparatus 1 configured as described above will be described. First, when the power of the air dryer 3 and the air cooler 4 is turned on, dry air is supplied from the dry air outlet 51 into the housing 2 by the air dryer 3 and the air cooler 4 and the housing 2 The air is returned to the air cooler 4 from the dry air discharge port 52 and circulates, and the housing 2 is filled with dry air. Accordingly, it is possible to suppress the occurrence of dew condensation at a low temperature portion such as the surface of the substrate 8 to be inspected cooled by the cooling holding unit 22, the surface of the cooling holding unit 22, and its peripheral part.

  Next, when the power of the air dryer 6 is turned on, the air dried by the air dryer 6, for example, with a dew point temperature of −60 ° C., is placed from the hole 226 provided in the cooling plate 221 in the cooling holding unit 22. 222a to 222e. Thereby, it is suppressed that dew condensation occurs in mounting part 222a-222e used as the lowest temperature.

  20 and 21 are explanatory diagrams for explaining the operation of the substrate inspection apparatus 1. Hereinafter, the operation of the substrate inspection apparatus 1 will be described with reference to FIGS. 2, 14, 20, and 21. First, when the operation display unit 11 accepts an operation instruction to start execution of an examination from the user, suction by the suction pump 39 is started in accordance with a control signal from the control means 60, and the placement unit 222a. ˜222e, the placement portions 232a˜232e, the placement portions 242a˜242e, and the vacuum head 321 are brought into a state capable of sucking the substrate 8 to be inspected.

  Next, a control signal for setting the set temperature of the temperature regulator 61 to, for example, 0 ° C. is output by the control means 60, and the operation of the cooler 220 is controlled by the temperature regulator 61, and the cooling holding unit 22. The temperature of the cooling plate 221 is set to 0 ° C., for example (step S1).

  Similarly, the control means 60 outputs a control signal for setting the set temperature of the temperature regulators 62 and 63 to, for example, 100 ° C., and the operation of the preheating heater 235 is controlled by the temperature regulator 62 to keep the preheat. The temperature of the preheating plate 231 in the unit 23 is set to 100 ° C. (step S2), and the operation of the heating heater 245 is controlled by the temperature controller 63 so that the temperature of the heating plate 241 in the heating holding unit 24 is 100 ° C. (Step S3).

  Thus, prior to cooling of the substrate 8 to be inspected by the cooling holding unit 22, preheating of the substrate 8 to be inspected by the preheating holding unit 23, and heating of the substrate 8 to be inspected by the heating holding unit 24, the cooling plate 221 is set in advance. Cooling to the set temperature, the preheating plate 231 and the heating plate 241 are heated to a predetermined setting temperature, and the temperatures of the cooling plate 221, the preheating plate 231 and the heating plate 241 are respectively maintained at the set temperatures.

  Next, when the user pulls the handle 212, the input work holder 21 is pulled out of the housing 2, and the user places the five inspected substrates 8 into the five concave portions 211 of the input work holder 21. By pushing the input work holder 21, the inspected substrate 8 is input to the substrate inspection apparatus 1 and received (step S4).

Next, in response to a control signal from the control means 60, the five inspected substrates 8 placed on the input work holder 21 are placed on the placement holders 222 a, 222 b, 222 c, and 222 d by the transport unit 32. , 222e (step S5).
Then, the substrate 8 to be inspected has the die 82 fitted into the recess 227 in the mounting portion 222a shown in FIG. 7 so that the surface of the die 82 is in close contact with the sheet member 272, and the substrate around the die 82 in the substrate 8 to be inspected. The portion is in close contact with the sheet member 229. In this case, since the sheet members 229 and 272 have elasticity, the degree of adhesion with the inspected substrate 8 is improved.

  Since air is sucked from the hole 228 by the suction pump 39, the substrate 8 to be inspected is sucked and pressed against the sheet members 229 and 272, and the degree of adhesion is further improved. In this case, for example, when the substrate 8 to be inspected is not flat, for example, when the substrate 8 to be inspected is warped, the surface of the substrate 8 to be inspected is simply placed on the mounting portion 222a. , 272 and may partially float.

However, in the mounting portion 222a, air is sucked from the holes 228, and the substrate 8 to be inspected is adsorbed and pressed against the sheet members 229 and 272. Therefore, even if the substrate 8 to be inspected is warped, 8 and the sheet members 229 and 272 can be improved. Further, since the sheet member 272 has grooves 271 formed radially from the holes 228, the suction area of the substrate 8 to be inspected is expanded, and the suction force of the substrate 8 to be inspected in the mounting portion 222a is improved. be able to.
Further, when the substrate 8 to be inspected is convexly warped on the opposite side to the die 82, the warp of the substrate is corrected by attracting the die 82, that is, the vicinity of the center of the substrate 8 to be inspected, in the mounting portion 222a.
Although the placement unit 222a has been described as an example, similarly in the placement units 222b to 222e, the substrate 8 to be inspected is adsorbed and brought into close contact with the sheet members 229 and 272.

  Then, according to a control signal from the control means 60, the lid 26 is slid to the upper part of the cooling holding part 22 by the transport driving part 40, and the upper end part of the side wall part 223 and the partition plate 224 in the placement parts 222a to 222e. The opening made of is closed by the lid body 26. In this case, the upper end opening made up of the side wall 223 and the partition plate 224 and the lid 26 are closed with a very small interval so as to be slidable.

  Thereby, the to-be-inspected substrate 8 adsorbed on the placement portions 222a to 222e is covered with the side wall portion 223, the partition plate 224, and the lid body 26, and is substantially shielded from the outside air. In addition, since the lid body 26 has a heat insulating structure in which the three air layers are sandwiched between the four sheets 261, the side wall 223, the partition plate 224, and the space covered by the lid body 26 from the outside. Heat intrusion and turbulence of airflow around the substrate 8 to be inspected are reduced. In this case, the side wall 223, the partition plate 224, and the lid body 26 constitute a cover member.

  And in mounting part 222a-222e, the dry air discharge | released from the hole 226, for example, the air of dew point temperature-60 degreeC, is filled with the space covered with the side wall part 223, the partition plate 224, and the cover body 26. Therefore, the occurrence of dew condensation on the placement portions 222a to 222e and the inspected substrate 8 is suppressed.

  Further, the inspected substrate 8 is cooled by the cooling plate 221 that has been set to a predetermined set temperature, for example, 0 ° C. in advance, through the sheet members 229 and 272 that are thermally conductive sheets, and thus the placement portion 222a. The cooling rate of the inspected substrate 8 can be improved as compared with the case where the cooling plate 221 is cooled after the inspected substrate 8 is placed on the substrate.

  Further, since the inspected substrate 8 is attracted to the elastic sheet members 229 and 272 by the suction pump 39 and the adhesion is improved, the thermal conductivity between the inspected substrate 8 and the cooling plate 221 is increased, The cooling rate of the inspected substrate 8 by the cooling plate 221 is increased. Since the sheet members 229 and 272 are in close contact with the entire surface of the substrate 8 to be inspected, the sheet members 229 and 272 are uniformly cooled over the entire substrate 8 to be inspected, and the temperature of each part of the substrate 8 to be inspected can be made uniform. it can. Further, the substrate 8 to be inspected is covered with the side wall part 223, the partition plate 224, and the lid 26, and heat intrusion from outside and turbulence of the air current around the substrate 8 to be inspected are reduced. The uniformity of the temperature of each part in can be improved.

  In this way, the inspected substrate 8 is cooled by the cooling holding unit 22 (step S6). 17, 18, and 19 are explanatory diagrams for explaining alignment, temperature measurement, and substrate inspection operations. In FIGS. 17, 18, and 19, reference numerals of configurations related to the operation in the heating state are also described.

  Then, in step S6, as shown in FIG. 17, the inspected substrate 8 on the cooling plate 221 is cooled with the lid body 26 closed, and when a predetermined time, for example, 30 seconds elapses, the control means In response to the control signal from 60, the cooling and holding unit 22 is moved along the guide rail 41 by the transport driving unit 40, and the inspected substrate 8 adsorbed to the mounting unit 222a is long as shown in FIG. It is positioned at a position facing the hole 263.

Then, the image of the inspected substrate 8 attracted to the mounting portion 222a is transmitted to the control means 60 by the imaging means 33 through the long hole 263, and the inspection position is detected from the image of the inspected substrate 8 by the control means 60. Alignment information is acquired and transmitted to the inspection control means 50, and the position information for inspecting the substrate 8 to be inspected is corrected by the inspection control means 50 based on the alignment information from the control means 60 (step S7). ).
At this time, since the first position information acquired by the imaging unit 33 is sent to the inspection unit, the correction is performed based on the corrected position information.
Further, the non-contact thermometer 35 measures the temperature of the inspected substrate 8 adsorbed to the mounting portion 222a through the long hole 263, and transmits temperature data indicating the measured temperature to the control means 60 for control. The means 60 confirms whether or not the temperature of the substrate 8 to be inspected is within a preset temperature range, for example, 0 ° C. ± 3 ° C. (step S8).
In this case, the long hole 263 is the minimum necessary for taking an image of the substrate 8 to be inspected by the imaging means 33 and detecting infrared rays emitted from the substrate 8 to be inspected by the non-contact thermometer 35. Since the size is set, the entry / exit of air through the long hole 263 is reduced, and the temperature change of the inspected substrate 8 is reduced.

  If the temperature of the substrate 8 to be inspected is not in the range of 0 ° C. ± 3 ° C., for example, the temperature of the substrate 8 to be inspected is waited until the temperature is in the temperature range. When the temperature is in the range of ° C., the cooling drive unit 22 is moved along the guide rail 41 by one transfer unit according to the control signal from the control means 60, and the mounting unit 222b is long. Positioning is made at a position facing the hole 263, and the operations of steps S7 and S8 are repeated. In this case, since the placement portions 222 a to 222 e are partitioned by the partition plate 224, the inspected substrate 8 other than the inspected substrate 8 during the alignment process and during the temperature measurement enters and exits through the long hole 263. Without being exposed to air, the temperature change of the inspected substrate 8 is reduced.

  After the alignment process (step S7) and the temperature measurement (step S8) are repeated for the five substrates to be inspected 8 adsorbed on the placement portions 222a to 222e in this way, a control signal from the control means 60 is obtained. Accordingly, the cooling and holding unit 22 is transferred along the guide rail 41 by the transport driving unit 40, and the substrate 8 to be inspected attracted to the mounting unit 222a faces the opening 283 as shown in FIG. Positioned at a position (first inspection position).

  Then, the substrate inspection is performed by the inspection control unit 50 in accordance with the control signal from the control unit 60 (step S9). Specifically, in accordance with a control signal from the inspection control means 50, the movable probes 37 and 38 are moved by the probe driving unit 49, and two inspection points on the inspected substrate 8 are passed through the opening 283. The distal end portions 373 of the probes 371 in the movable probes 37 and 38 are pressed against each other, and the resistance value between the two inspection points is measured by the inspection control means 50 by the four-terminal measurement method.

  Then, if the resistance value is equal to or less than a preset threshold value between all the inspection points set in advance in the inspection substrate 8 attracted to the mounting portion 222a by the inspection control means 50, the inspection substrate 8 is determined to be a non-defective product, and a signal indicating the determination result is output to the control means 60, while a resistance value is set in advance between any inspection points set in advance on the substrate 8 to be inspected. If it exceeds, it is determined that the inspected substrate 8 has a continuity failure, and a signal indicating the determination result is output to the control means 60, whereby the substrate inspection is performed.

  In this case, the opening 283 has a size corresponding to one place of the placement portion, and the placement portions 222a to 222e are partitioned by the partition plate 224, so that the inspection control means 50 is performing the substrate inspection process. The substrates 8 to be inspected other than the substrate to be inspected 8 are not exposed to the air that enters and exits through the opening 283, and the temperature change of the substrate 8 to be inspected is reduced.

  In this way, when the substrate inspection of the inspected substrate 8 adsorbed to the placement unit 222a is completed, the cooling holding unit 22 is moved to the guide rail 41 by the transport driving unit 40 in accordance with a control signal from the control unit 60. Then, only one mounting portion is transferred, and thereafter, the substrate inspection by the inspection control means 50 and the transfer operation of the cooling holding portion 22 for one mounting portion by the transport driving unit 40 are repeated, and the mounting portion 222b. Substrate inspection is performed on each of the inspected substrates 8 adsorbed to ˜222e (step S9).

  In this case, the five mounting parts 222a to 222e are provided on the cooling plate 221, and the five substrates to be inspected 8 can be cooled at the same time, so that the substrates to be inspected 8 are cooled one by one. The cooling time can be shortened. The five substrates 8 to be inspected are transported in the X-axis direction along the guide rails 43 by the transport unit 32 and placed on the cooling plate 221, and the Y-axis where the cooling plate 221 intersects the transport direction by the transport unit 32. After being transported in the direction, the inspection of the inspected substrate 8 by the movable probes 37 and 38 is performed, so that the substrate 8 is movable out of the moving range of the transport unit 32 that moves along the guide rail 43 in the X-axis direction. Driving mechanisms for the mobile probes such as the probes 37, 38 and guide rails 44, 45, 46 for driving them, elevating mechanisms 47, 48, and a probe driving unit 49 are arranged to drive the transport unit 32 and the mobile probe. It is easy to avoid interference with the mechanism.

  When the substrate inspection is completed for all of the inspected substrates 8 adsorbed on the placement units 222a to 222e, the cooling drive unit 22 is guided by the transport driving unit 40 according to the control signal from the control unit 60. 2, the lid body 26 is opened, and the vacuum head 321 in the transport section 32 can transport each substrate 8 to be inspected in the mounting sections 222a to 222e. Positioned to a position (first transport position).

  Next, in response to a control signal from the control means 60, the five test substrates 8 placed on the placement units 222 a to 222 e in the cooling holding unit 22 are placed on the placement unit in the preheating holding unit 23 by the transport unit 32. The lid body 30 is slid to the upper part of the preheating holding unit 23 by the conveyance driving unit 40, and the opening portion including the side wall portion 233 and the upper end portion of the partition plate 234 in the placement units 232a to 232e is a lid. The lid is closed by the body 30 (step S10).

  As a result, in the mounting portion 232a shown in FIG. 9, the inspected substrate 8 is inserted into the recess 247 so that the surface of the die 82 is in close contact with the sheet member 251. The portion is in close contact with the sheet member 249. In this case, since the sheet members 249 and 251 have elasticity, the degree of adhesion with the inspected substrate 8 is improved.

  In the same manner as in the case where the inspected substrate 8 is adsorbed by the placement units 222a to 222e in the cooling holding unit 22 in step S5 described above, the inspected substrate 8 is adsorbed by the placement units 232a to 232e in the preheating holding unit 23. Then, the inspected substrate 8 and the sheet members 249 and 251 are brought into close contact with each other. Accordingly, the inspected substrate 8 is heated by the preheating plate 231 that has been set to a predetermined set temperature in advance, for example, 100 ° C., through the sheet members 249 and 251 that are heat conductive sheets. The heating rate of the inspected substrate 8 can be improved as compared with the case where the preheating plate 231 is heated after the inspected substrate 8 is placed on the 232a to 232e.

  Further, since the inspected substrate 8 is adsorbed to the elastic sheet members 249 and 251 by the suction pump 39 and the adhesion is improved, the thermal conductivity between the inspected substrate 8 and the preheating plate 231 is increased, The heating rate of the inspected substrate 8 by the preheating plate 231 is increased. Since the sheet members 249 and 251 are in close contact with the entire surface of the substrate 8 to be inspected, the sheet members 249 and 251 are uniformly heated over the entire substrate 8 to be inspected, and the temperature of each part of the substrate 8 to be inspected can be made uniform. it can.

Further, the substrate 8 to be inspected is covered with the side wall portion 233, the partition plate 234, and the lid body 30, and heat radiation to the outside and turbulence of airflow around the substrate to be inspected 8 are reduced. The temperature uniformity can be improved.
In this way, the inspected substrate 8 is heated by the preheating holding unit 23 (step S11).
On the other hand, since the inspected substrate 8 is not placed on the input work holder 21 while the processes of steps S6 to S10 are being performed, the user pulls out the input work holder 21 from the housing 2 and creates a new object. The five inspection substrates 8 can be placed on the substrate inspection apparatus 1 by placing them on the input work holder 21 and pushing the input work holder 21 (step S12).

  As a result, a new substrate to be inspected 8 can be input to the substrate inspection apparatus 1 in parallel with the processing of steps S6 to S10. Therefore, it is apparent that a new substrate to be inspected 8 is input to the substrate inspection apparatus 1. The work time required for the inspection can be made zero, and the inspection time of the inspected substrate 8 can be shortened.

  As in steps S5 and S6, in parallel with the heating of the substrate 8 to be inspected in step S11, five new substrates to be inspected 8 placed on the input work holder 21 by the transport unit 32 are in the cooling holding unit 22. It is conveyed to the mounting parts 222a to 222e (step S13), and the new five substrates to be inspected 8 are cooled to a set temperature, for example, 0 ° C. by the cooling holding part 22 (step S14).

  Thereby, the heating of the inspected substrate 8 and the conveyance and cooling of the new inspected substrate 8 to the cooling holding unit 22 are performed in parallel. Processing time can be shortened.

  Then, when a predetermined time, for example, 30 seconds elapses from the start of heating of the substrate 8 to be inspected (step S11) by the preheating holding unit 23, the conveyance driving unit 40 responds to a control signal from the control means 60. The lid 30 is slid and opened, and the vacuum head 321 in the transport unit 32 is positioned at a transport position where each of the substrates to be inspected 8 in the placement units 232a to 232e can be sucked.

  Next, during the cooling of the new substrate 8 to be inspected in step S14, the five parts placed on the placement parts 232a to 232e in the preheating holding part 23 by the transport part 32 according to the control signal from the control means 60. One substrate 8 to be inspected is transported to the placement units 242a to 242e in the heating and holding unit 24, the lid 27 is slid to the upper part of the preheating holding unit 23 by the transport drive unit 40, and the side walls of the placement units 242a to 242e The opening part which consists of 243 and the upper end part of the partition plate 244 is closed by the cover body 27 (step S15).

  As a result, in the mounting portion 242a shown in FIG. 9, the substrate to be inspected 8 has the die 82 fitted into the recess 247 so that the surface of the die 82 is in close contact with the sheet member 251, and the substrate around the die 82 in the substrate 8 to be inspected. The portion is in close contact with the sheet member 249. In this case, since the sheet members 249 and 251 have elasticity, the degree of adhesion with the inspected substrate 8 is improved.

  In the same manner as in the case where the inspected substrate 8 is adsorbed by the mounting portions 222a to 222e in the cooling holding unit 22 in the above-described step S5, the inspected substrate 8 is adsorbed by the mounting portions 242a to 242e in the heating holding unit 24. Then, the inspected substrate 8 and the sheet members 249 and 251 are brought into close contact with each other. As a result, the inspected substrate 8 is heated by the heating plate 241 that has been previously set to a predetermined set temperature, for example, 100 ° C., through the sheet members 249 and 251 that are thermally conductive sheets. The heating rate of the inspected substrate 8 can be improved as compared with the case where the heating plate 241 is heated after the inspected substrate 8 is placed on 242a to 242e.

  Further, the inspected substrate 8 is attracted to the elastic sheet members 249 and 251 by the suction pump 39 and the adhesion is improved, so that the thermal conductivity between the inspected substrate 8 and the heating plate 241 is increased, The heating rate of the inspected substrate 8 by the heating plate 241 is increased. Since the sheet members 249 and 251 are in close contact with the entire surface of the substrate 8 to be inspected, the sheet members 249 and 251 are uniformly heated over the entire substrate 8 to be inspected, and the temperature of each part of the substrate 8 to be inspected can be made uniform. it can.

  Further, the inspected substrate 8 is covered with the side wall portion 243, the partition plate 244, and the lid 27, and heat radiation to the outside and turbulence of airflow around the inspected substrate 8 are reduced. The temperature uniformity can be improved.

  In this way, the inspected substrate 8 is heated by the heating holding unit 24 (step S16). Then, when a predetermined time, for example, 30 seconds elapses from the start of cooling of the new substrate 8 to be inspected by the cooling holding unit 22 in step S14, in response to the control signal from the control means 60 as in steps S7 and S8. Then, the cooling holding unit 22 is transferred along the guide rail 41 by the transport driving unit 40, and the alignment processing (step S17) and the temperature measurement (step S18) are performed on the five inspected substrates 8 placed on the cooling plate 221. Then, the substrate inspection using the movable probes 37 and 38 is performed in the same manner as in step S9 (step S19).

  In step S19, when the substrate inspection is completed for all of the inspected substrates 8 adsorbed to the placement units 222a to 222e, the cooling and holding unit is operated by the conveyance driving unit 40 in accordance with a control signal from the control unit 60. 2 is transferred along the guide rail 41 to the front side in FIG. 2, the lid body 26 is opened, and the vacuum head 321 in the transport unit 32 is attracted to the placement units 222a to 222e. Is positioned at a conveyance position where the suction can be sucked.

  In addition, while the new board | substrate 8 to be inspected in step S14 was cooled, the example in which the conveyance operation | movement of the to-be-inspected board | substrate 8 in step S15 was performed in parallel was shown, but the conveyance operation in step S15 is step S17- It may be executed in parallel during the process of S19.

  Next, during the heating of the substrate 8 to be inspected in step S <b> 16, the five objects placed on the placement parts 222 a to 222 e in the cooling holding part 22 by the transport part 32 according to the control signal from the control means 60. The inspection substrate 8 is conveyed to the placement units 232a to 232e in the preheating holding unit 23, the lid 30 is slid to the upper part of the preheating holding unit 23 by the conveyance driving unit 40, and the side wall portions 233 and 233 in the placement units 232a to 232e The opening part which consists of the upper end part of the partition plate 234 is closed by the cover body 30 (step S20), and preheating of the board | substrate 8 to be inspected by the preheating holding | maintenance part 23 is performed similarly to step S11 (step S21).

  On the other hand, since the inspected substrate 8 is not placed on the input work holder 21 while the processing of steps S14 to S21 is being performed, the user pulls out the input work holder 21 from the housing 2 and adds a new one. Five substrates to be inspected 8 can be loaded on the substrate inspection apparatus 1 by placing them on the loading work holder 21 and pushing the loading work holder 21 (step S22).

  As in steps S5 and S6, in parallel with the heating of the substrate 8 to be inspected in step S16, five new substrates to be inspected 8 placed on the input work holder 21 by the transport unit 32 are cooled and held by the holding unit 22. Are transferred to the mounting portions 222a to 222e (step S23), and the cooling holding unit 22 cools the new five substrates to be inspected 8 to a set temperature, for example, 0 ° C. (step S24).

  In this case, the alignment processing (step S17), temperature measurement (step S18), substrate inspection (step S19), and the heating holding unit 24 to the preheating holding unit 23 are performed on the new inspected substrate 8 being cooled by the cooling holding unit 22. Transport of the substrate 8 to be inspected (step S20), part of the pre-heat treatment (step S21) of the substrate 8 to be inspected, processing for loading the substrate to be inspected 8 (step S22), and from the input work holder 21 to the cooling holding unit 22 Since the transport of the inspected substrate 8 (step S23) is performed in parallel with the heating process (step S16) of the inspected substrate 8 in the heating and holding unit 24, apparently the alignment of the inspected substrate 8, the temperature measurement, the substrate For inspection, conveyance from the heating and holding unit 24 to the preheating holding unit 23, preheating, substrate loading, and conveyance from the loading work holder 21 to the cooling holding unit 22 It is possible to reduce the management time.

  In step S16, when the inspected substrate 8 on the heating plate 241 is heated with the lid 27 closed as shown in FIG. 17, and a predetermined time, for example, 30 seconds elapses, the control means In response to a control signal from 60, the heating and holding unit 24 is moved along the guide rail 42 by the transport driving unit 40, and the inspected substrate 8 adsorbed to the mounting unit 242a is long as shown in FIG. It is positioned at a position facing the hole 263.

Then, the image of the inspected substrate 8 adsorbed to the mounting portion 242a through the long hole 263 is transmitted to the control unit 60 by the imaging unit 34, and the inspection position is determined from the image of the inspected substrate 8 by the control unit 60. Alignment information is acquired and transmitted to the inspection control means 50, and the inspection control means 50 corrects the position information for inspecting the inspected substrate 8 based on the alignment information from the control means 60 (step S25). ).
At this time, since the first position information acquired by the imaging unit is sent to the inspection unit, the correction is performed using the corrected position information.
Further, the non-contact thermometer 36 measures the temperature of the inspected substrate 8 adsorbed to the mounting portion 242a through the long hole 263, and transmits temperature data indicating the measured temperature to the control means 60 for control. The means 60 confirms whether or not the temperature of the inspected substrate 8 is within a preset temperature range, for example, 100 ° C. ± 3 ° C. (step S26). In this case, since the long hole 263 has a minimum size necessary for alignment and temperature measurement, the entry and exit of air through the long hole 263 is reduced, and the temperature change of the inspected substrate 8 is reduced. Is done.

  If the temperature of the substrate 8 to be inspected is not in the range of 100 ° C. ± 3 ° C., for example, the temperature of the substrate 8 to be inspected is waited until the temperature is in the temperature range. If the temperature is in the range of ° C., the conveyance driving unit 40 moves the heating holding unit 24 along the guide rail 42 by one transfer unit according to a control signal from the control unit 60, and the mounting unit 242b is long. Positioning is made at a position facing the hole 263, and the operations of steps S25 and S26 are repeated. In this case, since the placing portions 242a to 242e are partitioned by the partition plate 244, the inspected substrates 8 other than the inspected substrate 8 during the alignment process and during the temperature measurement enter and exit through the long holes 263. Without being exposed to air, the temperature change of the inspected substrate 8 is reduced.

  Thus, after the alignment process (step S25) and the temperature measurement (step S26) are repeated for the five substrates to be inspected 8 adsorbed to the placement units 242a to 242e, the control from the control means 60 is performed. In response to the signal, the heating and driving unit 24 is transferred along the guide rail 42 by the transport driving unit 40, and the substrate 8 to be inspected attracted to the mounting unit 242a faces the opening 283 as shown in FIG. It is positioned at the position to do.

  Then, the substrate inspection is performed by the inspection control unit 50 in accordance with the control signal from the control unit 60 (step S27). Specifically, first, a position where the movable probes 37 and 38 are opposed to the opening 283 in the fixed lid 28 by the probe driving unit 49 (inspection transfer unit) according to a control signal from the inspection control means 50, That is, it is placed at the position facing the opening 283 in the fixed lid 29 from the inspection position (first inspection position) for inspecting the inspected substrate 8 placed on the cooling holding unit 22, that is, placed on the heating holding unit 24. The test substrate 8 is transferred along the guide rail 44 to an inspection position (second inspection position) for inspecting the inspected substrate 8.

  Accordingly, the movable probes 37 and 38 can be used in common for the substrate inspection of the substrate 8 to be inspected in the cooled state and the substrate inspection of the substrate 8 to be inspected in the heated state. It is not necessary to provide two each, and the number of the movable probes 37 and 38 can be reduced, and the cost of the board | substrate inspection apparatus 1 can be reduced.

  In addition, although the example which uses the movable probes 37 and 38 for both the board | substrate inspection of the to-be-inspected board | substrate 8 in a cooling state and the board | substrate inspection of the to-be-inspected board | substrate 8 in a heating state was shown, opening in the fixed cover body 28 is shown. A movable probe (first inspection unit) for inspecting the substrate 8 to be inspected in the cooled state is provided at a position facing the part 283, and in a heated state at a position facing the opening 283 in the fixed lid 29. A movable probe (second inspection unit) for inspecting the substrate 8 to be inspected may be additionally provided.

  Note that after the inspection in step S19 is completed, the control means 60 causes the probe driving unit 49 to position the movable probes 37 and 38 opposite the opening 283 in the fixed lid 28 during the processing in steps S16, S25, and S26 (first position). It may be transferred from the first inspection position) to a position (second inspection position) facing the opening 283 in the fixed lid 29. Thereby, the transfer time of the movable probes 37 and 38 in step S27 is shortened.

  Further, the distal end portions 373 of the probes 371 in the movable probes 37 and 38 are respectively pressed into two inspection points on the substrate 8 to be inspected through the openings 283 in the fixed lid 29, and the inspection control means 50 performs the second inspection. The resistance value between the inspection points is measured by the four-terminal measurement method.

  Then, if the resistance value is equal to or less than a preset threshold value between all the inspection points set in advance in the inspection substrate 8 attracted to the mounting portion 242a by the inspection control means 50, the inspection substrate 8 is determined to be a non-defective product, and a signal indicating the determination result is output to the control means 60, while a resistance value is set in advance between any inspection points set in advance on the substrate 8 to be inspected. If it exceeds, it is determined that the inspected substrate 8 has a continuity failure, and a signal indicating the determination result is output to the control means 60, whereby the substrate inspection is performed.

  In this case, the opening 283 in the fixed lid 29 has a size corresponding to one placement portion, and the placement portions 242a to 242e are each partitioned by the partition plate 244. The inspected substrates 8 other than the inspected substrate 8 during the substrate inspection process are not exposed to the air entering and exiting through the opening 283 in the fixed lid 29, and the temperature change of the inspected substrate 8 is reduced.

  In this way, when the substrate inspection of the substrate 8 to be inspected adsorbed on the placing portion 242a is completed, the heating holding portion 24 is moved to the guide rail 41 by the transport driving portion 40 in accordance with a control signal from the control means 60. Then, only one placement part is transferred, and thereafter, the substrate inspection by the inspection control means 50 and the transfer operation of the heating holding part 24 for one placement part by the transport drive part 40 are repeated, and the placement part 242b. Substrate inspection is performed for each of the inspected substrates 8 adsorbed to ˜242e (step S27).

  In this case, the heating plate 241 is provided with five mounting portions 242a to 242e, and the five substrates to be inspected 8 can be heated at the same time, so that the substrates to be inspected 8 are heated one by one. Heating time can be shortened. The inspected substrate 8 is transported in the X-axis direction along the guide rail 43 by the transport unit 32 and placed on the heating plate 241, and the heating plate 241 crosses the transport direction by the transport unit 32 in the Y-axis direction. Since the substrate 8 to be inspected can be inspected by the mobile probes 37 and 38 after being transported, the mobile probe is moved out of the moving range of the transport unit 32 that moves along the guide rail 43 in the X-axis direction. By providing a drive mechanism, it becomes easy to avoid interference between the transport unit 32 and the drive mechanism of the movable probe.

  In addition, while the substrate 8 to be inspected in step S16 is heated, an example in which a new operation of transporting the substrate 8 to be inspected in step S20 and a new operation of transporting the substrate to be inspected 8 in step S23 are shown. The transport operations in S20 and S23 may be performed in parallel during the processing of steps S25 to S27, for example.

  When the substrate inspection is completed for all of the inspected substrates 8 adsorbed to the placement units 242a to 242e, the conveyance driving unit 40 causes the heating holding unit 24 to guide the guide rail in accordance with a control signal from the control unit 60. 2, the lid 27 is opened, and the vacuum head 321 in the transport unit 32 can suck each substrate 8 to be inspected that is sucked by the placement units 242a to 242e. It is positioned at the transfer position (second transfer position).

  Next, during the pre-heat treatment of the new substrate 8 to be inspected in step S21 and in the cooling process of the new substrate to be inspected 8 in step S24, the transfer unit is set according to the control signal from the control means 60. 32, the five to-be-inspected substrates 8 placed on the placement units 242a to 242e in the heating and holding unit 24 are transported and placed on the upper surface of the storage work holder 25 (step S28).

  In this case, pre-heat treatment (step S21) of the new substrate 8 to be inspected in the preheating holding unit 23, alignment processing (step S25) in the heating holding unit 24, temperature measurement (step S26), substrate inspection (step S27), and Since the transporting process of the inspected substrate 8 (step S28) and the new cooling process of the inspected substrate 8 in the cooling holding unit 22 (step S24) are performed in parallel, the apparent processing time is shortened. Thus, the inspection quantity of the substrate 8 to be inspected per unit time can be increased.

  Further, for the substrate 8 to be inspected transferred from the heating holding unit 24 to the storage work holder 25, the substrate inspection in the low temperature state in step S9 and the substrate inspection in the high temperature state in step S27 are completed. The control means 60 transmits a signal indicating the inspection result of the five substrates to be inspected 8 placed on the storage work holder 25 to the operation display unit 12, and the operation display unit 12 displays the inspection result.

  The ten nozzles 31 blow dry air at room temperature onto the substrate 8 to be inspected placed on the storage work holder 25 (step S29). Thereby, the time for cooling the temperature of the inspected substrate 8 to a temperature of about 40 ° C. is shortened.

  On the other hand, when a predetermined time, for example, 30 seconds elapses from the start of heating of the new substrate to be inspected 8 by the preheating holding unit 23 (step S21), for example, the transport driving unit 40 according to a control signal from the control means 60. Thus, the lid body 30 is slid and opened, and the vacuum head 321 in the transport section 32 is positioned at a transport position where each of the inspected substrates 8 sucked by the placement sections 232a to 232e can be sucked.

  Similarly to step S15, during the cooling of the inspected substrate 8 in step S29, a new inspected substrate 8 placed on the placement portions 232a to 232e in the preheating holding portion 23 is heated and held by the transport unit 32. The substrate 24 is transported to the placement units 242a to 242e in the unit 24 (step S30), and a new substrate 8 to be inspected is heated by the heating holding unit 24 (step S31) as in step S16.

  On the other hand, when a predetermined time, for example, 30 seconds elapses from the start of further cooling of the inspected substrate 8 by the cooling holding unit 22 in step S24, a control signal from the control means 60 is sent as in steps S7 and S8. Accordingly, the cooling holding unit 22 is transferred along the guide rail 41 by the transport driving unit 40, and the alignment processing (step S32) and the temperature measurement (step S33) are performed on the five inspected substrates 8 placed on the cooling plate 221. ), The mobile probes 37 and 38 inspect the overheated inspected substrate 8 in step S27 by the probe driving unit 49 (inspection transfer unit) according to the control signal from the inspection control means 50. From the second inspection position to the position facing the opening 283 in the fixed lid 28 (first inspection position), the guide rail 4 It is transported along a, similarly to step S9, the substrate inspection using the mobile probe 37 is performed (step S34).

  It should be noted that after the inspection in step S27 is completed, the control means 60 causes the probe probes 49 and 38 to move the movable probes 37 and 38 to the opening 283 in the fixed lid 28 during the processing in steps S28 to S33 (first position). May be transferred to the inspection position). Thereby, the transfer time of the movable probes 37 and 38 in step S34 is shortened.

  On the other hand, after the substrate 8 to be inspected on the storage work holder 25 in step S29 is cooled by the air blown by the ten nozzles 31 for a predetermined time, the user pulls the handle 252 of the storage work holder 25. Then, the inspected board 8 to be inspected, which is pulled out of the housing 2 and placed on the storage work holder 25, is taken out (step S35), and the inspected is put into the board inspection apparatus 1 in step S4. The inspection of the substrate 8 is finished.

  In this case, the cooling process of the inspected substrate 8 in the storage work holder 25 (step S29), the removal of the inspected substrate 8 (step S35), and the new inspected substrate 8 from the preheating holding unit 23 to the heating holding unit 24. Transport (step S30), heating process in the heating and holding unit 24 (step S31), further cooling process of the inspected substrate 8 in the cooling and holding unit 22 (step S24), alignment process (step S32), temperature measurement ( Since step S33) and substrate inspection (step S34) are executed in parallel, the apparent processing time can be shortened and the inspection quantity of the inspected substrate 8 per unit time can be increased.

  In addition, while the cooling operation of the new substrate to be inspected 8 in step S24 has been described, the transfer operation of the substrate 8 to be inspected in step S28 is performed in parallel. However, the transfer operation in step S28 is, for example, step S32. It may be executed in parallel during the processing of .about.S34.

  Then, for the new substrate 8 to be inspected, the same processing as in steps S25 to S29 and S35 is repeated in steps S41 to S45 and S51. In step S51, the inspected new substrate 8 to be inspected is taken out and inspected. finish. In this case, the time from the completion of the substrate inspection of the inspected substrate 8 in step S35 to the completion of the substrate inspection of the new inspected substrate 8 in step S51, that is, the tact time T is five new inspections. This is an apparent processing time for the substrate 8. The tact time T is a time obtained by combining a part of the heating time of the inspected substrate 8 in step S31 and the processing times of steps S41 to S45 and S51.

  On the other hand, when the parallel processing by the above-mentioned input work holder 21, the cooling holding unit 22, the preheating holding unit 23, the heating holding unit 24, and the storage work holder 25 is not performed, the inspection of the new substrate 8 to be inspected is step S12. While the processing time in S14, S17 to S21, S30, S31, S41 to S45, and S51 is required, the substrate inspection apparatus 1 includes the input work holder 21, the cooling holding unit 22, the preheating holding unit 23, and the heating holding. The processing time in steps S12 to S14, S17 to S21, and S30 and a part of the processing time in step S31 are apparently shortened by performing parallel processing by so-called pipeline operation by the unit 24 and the storage work holder 25. A new inspection of the inspected substrate 8 can be executed at the tact time T.

  Thereafter, the substrate inspection apparatus 1 repeats the inspection of five new substrates to be inspected every tact time T, so that the inspection of the substrate to be inspected 8 per unit time is performed when the above parallel processing is not performed. The quantity can be increased.

  The cooling holding unit 22, the preheating holding unit 23, and the heating holding unit 24 are provided. First, the inspected substrate 8 is inspected in the cooled state by the cooling holding unit 22, and then the inspected substrate 8 is preheated by the preheating holding unit 23. Although the configuration in which the inspection is performed while being heated by the heating and holding unit 24 is shown, a pre-cooling unit having substantially the same configuration as that of the cooling and holding unit 22 is provided instead of the preheating holding unit 23. After inspecting the substrate 8 in a heated state, the substrate 8 to be inspected may be pre-cooled by the pre-cooling unit and inspected in the state cooled by the cooling holding unit 22.

  As described in this explanation, a board inspection device that applies temperature stress to the substrate, such as a cooling unit and a heating unit, is provided at a position where the imaging unit that acquires the positional information of the substrate and the inspection unit that is actually inspected are different. In this case, the position information of the substrate can be obtained with high accuracy by using this alignment method.

It is an appearance perspective view showing an example of composition of a substrate inspection device using a substrate inspection method concerning one embodiment of the present invention. It is a schematic block diagram which shows an example of the structure inside the housing | casing in the board | substrate inspection apparatus shown in FIG. It is a top view which shows schematic structure which looked at the inside of the housing | casing of the board | substrate inspection apparatus shown in FIG. It is a perspective view which shows an example of the detail of the input workpiece holder shown in FIG. It is a figure which shows an example of the front and back of a to-be-inspected board | substrate. It is an external appearance perspective view which shows an example of a structure of the cooling part shown in FIG. It is the elements on larger scale which show the side wall part and partition plate which surround the mounting part of the cooling part shown in FIG. 6, and a mounting part. It is an external appearance perspective view which shows an example of a structure of the preheating part and heating part which are shown in FIG. It is the elements on larger scale which show the side wall part and partition plate which surround the mounting part and mounting part in the preheating part and heating part which are shown in FIG. It is explanatory drawing which shows an example of a structure of the cover body shown in FIG. It is explanatory drawing which shows an example of a structure of the cover body shown in FIG. It is explanatory drawing which shows an example of a structure of the fixed cover body shown in FIG. It is an external view which shows the detail of the movable probe shown in FIG. It is a block diagram which shows an example of an electrical configuration of the board | substrate inspection apparatus shown in FIG. (A) is a top view which shows one Embodiment of a reference | standard board | substrate, (b) is a conceptual diagram in the case of detecting the difference in the positional information on the board | substrate which an imaging means and an inspection means acquire. 3 is a flowchart of a substrate alignment method according to the present invention. FIG. 17 is an explanatory diagram for explaining the alignment, temperature measurement, and substrate inspection operations illustrated in FIGS. 15 and 16. FIG. 17 is an explanatory diagram for explaining the alignment, temperature measurement, and substrate inspection operations illustrated in FIGS. 15 and 16. FIG. 17 is an explanatory diagram for explaining the alignment, temperature measurement, and substrate inspection operations illustrated in FIGS. 15 and 16. It is explanatory drawing for demonstrating operation | movement of the board | substrate inspection apparatus shown in FIG. It is explanatory drawing for demonstrating operation | movement of the board | substrate inspection apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Housing | casing 3,6 Air dryer 4 Air cooler 8 Board | substrate to be inspected 11,12 Operation display part 13 Inlet 14 Outlet 21 Input work holder 22 Cooling part 23 Preheating part 24 Heating part 25 Storage work holder 26, 27, 30 Lid 28, 29 Fixed lid 31 Nozzle 32 Transport unit 33, 34 Camera 35, 36 Non-contact thermometer 37, 38 Mobile probe 39 Suction pump 40 Transport drive unit 41, 42, 43, 44, 45 Guide rail 47, 48 Elevating mechanism 49 Probe drive unit 50 Inspection control unit 51 Dry air outlet 52 Dry air discharge port 60 Control means 61, 62, 63 Temperature controller 81 Pad 82 Die 211 Recess 212, 252 Handle 220 Cooler 221 Cooling Plates 222a to 222e, 232a to 232e, 242a to 242 Placement part 223 Side wall part 224 Partition plate 225 Cooling fan 226, 228, 247, 248 Hole 227 Recess 229, 249, 251, 272 Sheet member 231 Preheating plate 233 Side wall part 234, 244 Partition plate 235 Preheating heater 241 Heating plate 243 Side wall 245 Heater 250, 271 Groove 261, 281, 301 Sheet 262, 282, 302 Spacer 263 Long hole 283 Opening 321 Vacuum head 371 Probe 373 Pair of contacts

Claims (6)

A substrate alignment method in a substrate inspection apparatus for mounting a substrate on which a plurality of wiring patterns are formed at a predetermined inspection position and judging whether the wiring pattern is good or defective,
Placing the reference substrate on the mounting table on which the substrate is mounted , moving the mounting table to the imaging position where the imaging means is disposed,
In the imaging position, the first position information of the reference substrate is acquired by the imaging means,
Move the mounting table from the imaging position to the inspection position where the substrate is inspected,
In the inspection position, the second position information of the reference substrate is acquired by an inspection means having a pair of conductive contacts ,
By comparing the first position information and the second position information, the correction position information of the imaging position and the inspection position is obtained ,
The second position information acquired by the inspection means is acquired by bringing the pair of contacts into contact with the substrate and detecting conduction of the pair of contacts . Alignment method.   2. The alignment method for a substrate inspection apparatus according to claim 1, wherein the mounting table is moved from a temperature adjustment position for heating or cooling a substrate mounted on the mounting table to the imaging position. The first position information acquired by the imaging means includes at least the center position information of the center of the substrate and the rotation position information of the substrate,
2. The alignment method for a substrate inspection apparatus according to claim 1, wherein the second position information acquired by the inspection means includes at least central position information of the center of the substrate and rotation position information of the substrate. A substrate inspection apparatus for placing a substrate on which a plurality of wiring patterns are formed at a predetermined inspection position and judging whether the wiring pattern is good or bad,
In an imaging unit for imaging the substrate, an imaging unit that images a reference substrate placed on a mounting table and creates first position information of the reference substrate;
In the inspection unit for inspecting the substrate, inspection means for creating second position information of the reference substrate by electrical contact with the reference substrate placed on a mounting table;
Moving means for moving the mounting table from the imaging unit to the inspection unit;
Control means for receiving the first position information and the second position information, and calculating a displacement of the position information of the substrate to be inspected ;
The inspection means has a pair of conductive contacts, contacts the pair of contacts with the reference substrate, and acquires the second position information by detecting conduction of the pair of contacts. A substrate inspection apparatus. 5. The substrate inspection apparatus according to claim 4 , wherein the moving unit moves the temperature of the mounting table from the temperature adjustment unit for heating or cooling to the imaging unit. The first position information acquired by the imaging means includes at least the center position information of the center of the substrate and the rotation position information of the substrate,
5. The substrate inspection apparatus according to claim 4 , wherein the second position information acquired by the inspection means includes at least central position information of the center of the substrate and rotation position information of the substrate.

Images