JP4857938B2 - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus which is excellent in heat radiation performance and hardly causes deformation or damage due to an external force in manufacturing processes or when it is mounted on a circuit board. <P>SOLUTION: The apparatus has a package provided with a recess having an internal wall and a bottom surface, and a lead terminal exposed on the bottom surface of the recess and protruding from the side surface of the package. The lead terminal has a first lead terminal receiving a semiconductor light-emitting device to be arranged, and having a thick film region exposed also from the rear surface of the package; and a second lead terminal to be conducted to the semiconductor light-emitting device. The internal wall has a first inside protrusion protruding to the inside of the recess in a region contacting only the first lead terminal. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a light-emitting device that can be used for a lighting source, a display, a backlight light source of a liquid crystal display, and the like.

  As a light emitting device using a semiconductor light emitting element, a light emitting device mounted on a resin package or a ceramic package is known. These packages include a conductive member that can be electrically connected to the outside, and these are electrically connected to the electrodes of the semiconductor light emitting element. Furthermore, the light emitting device is electrically connected to the mounting substrate electrically and mechanically by being soldered to the conductor wiring provided on the mounting substrate.

  In recent years, there has been a demand for higher output of the light emitting device, and a light emitting device having a structure capable of withstanding the heat generated at the time of high output has been studied. In particular, a ceramic package is suitable for a high-power light-emitting device because the material itself is superior in heat resistance compared to a resin package. However, there are problems such as a low degree of freedom in molding and weakness to impact, and it is necessary to solve them. On the other hand, the resin package has a problem in heat resistance as compared with the ceramic package, but has good moldability and excellent mass productivity. Furthermore, the material itself is cheaper than a ceramic package, and the yield is high, so that productivity is excellent.

In order to solve the above problems, a light emitting device having improved heat resistance using a member having high heat dissipation for a resin package has been studied (for example, Patent Document 1). Specifically, it has a structure in which a conductive frame (lead terminal) is provided as a conductive member, and a thermally connected portion (heat radiating member) manufactured separately is inserted and coupled to a support portion (package). It has been. With such a structure, the support portion only needs to hold the conductor frame and the thermal connection portion, and heat is released to the outside by the connection portion. In this way, by separating the conductor frame and the thermal connection part, the absorption and release of a larger amount of heat loss can be optimized significantly better than the integrated conductor frame.
JP 2004-521506 A.

  However, in the above package, since the conductor frame (lead terminal) and the thermal connection portion (heat radiating member) are configured as separate members, the support component (package) tends to be large. For this reason, the light emitting device itself tends to be large, and it is difficult to cope with downsizing. Further, since the support component is inserted from the back side after molding, a gap is easily generated between the support component and the thermal connection portion, and stability is lacking. In addition, the support component is deformed or damaged by the load applied at the time of insertion, and the yield tends to decrease. In addition, the positional relationship between the concave portion of the support member serving as the reflector and the thermal connection portion on which the light emitting element is placed has a great influence on the light distribution characteristics of the light emitting device. When inserting a connection portion, the accuracy of the height adjustment is low, so that the optical characteristics are not stable and the quality tends to vary.

In order to achieve the above object, a light emitting device according to the present invention includes a package having a recess having an inner wall and a bottom surface, and a lead terminal exposed from the bottom surface of the recess and protruding from the side surface of the package. The terminal includes a first lead terminal having a thick film region on which the semiconductor light emitting element is mounted and exposed also from the back surface of the package, and a second lead terminal electrically connected to the semiconductor light emitting element. The inner wall has a first inner protrusion that protrudes inside the recess in a region that contacts only the first lead terminal, and the inner wall protrudes first inward in a region that contacts only the second lead terminal. are arranged symmetrically with respect to mounting area of parts and the semiconductor light - emitting element, spaced apart from the first inner protrusion on the inner side of the recess in the first same angle and width and the inner protrusion Protruding second Characterized in that it has a side protrusion. As a result, the lead terminal for supplying power from the outside can also be used for the function of releasing heat from the semiconductor light emitting element to the outside, so the number of components can be reduced and the light emitting device can be downsized. It becomes possible. Furthermore, it is possible to reduce the displacement of each component. In particular, since the first inner protrusion is formed on the inner wall of the recess, the package having the reflector function can stably hold the first lead terminal, which is the mounting region of the semiconductor light emitting element. . Therefore, the light-emitting device can be made less susceptible to the influence of external force during the manufacturing process or when the light-emitting device is mounted on a circuit board or the like, and the light-emitting device has stable optical characteristics and excellent reliability. Further, not only the first lead terminal but also the second lead terminal can be stably held in the package. Therefore, disconnection of the conductive wire is difficult to occur, and a light-emitting device with excellent reliability can be obtained.

  The light emitting device according to claim 2 of the present invention is characterized in that the first inner projecting portion is provided in a region facing the side surface of the package from which the first lead terminal projects. Thereby, the first lead terminal can be held more stably. In addition, since the thickness of the package side surface (outer wall) where the first lead terminal protrudes can be increased, even when a gap is generated between the first lead terminal and the package, the first lead terminal enters from the outside. Moisture or the like can hardly reach the semiconductor light emitting element.

  The light emitting device according to claim 3 of the present invention is characterized in that the first inner protrusion has an upper surface of the inner protrusion at a position between the upper surface of the package and the bottom surface of the recess. Thereby, since the surface area of the inner wall of a recessed part can be enlarged further, adhesiveness with the sealing member with which a recessed part is filled improves. In addition, since the upper surface of the first inner protruding portion is separated from the upper surface of the package, the inner protruding portion is formed even when a gap is generated between the sealing member and the package on the upper surface of the package and moisture enters the package. Since it is possible to make it difficult for moisture to reach the bottom of the concave portion where the semiconductor light emitting element is placed, that is, a light emitting device with higher reliability can be obtained. .

  In the light emitting device according to claim 4 of the present invention, the first lead terminal has an opening through which the package is exposed between the first inner protrusion and the region where the semiconductor light emitting element is placed. It is characterized by having. This improves the adhesion between the package and the first lead terminal, particularly the adhesion between the first lead terminal and the package in the exposed area of the lead terminal exposed at the bottom of the recess. The mounting accuracy is stable, and unevenness in optical characteristics can be prevented. Furthermore, since the contact area between the sealing member filled in the recess and the package is increased, the adhesion can be improved and the sealing member can be made difficult to peel off. It is possible to make it difficult to cause problems such as light scattering due to gaps caused by peeling of the light and disturbing light distribution characteristics.

Further, in the light emitting device according to claim 5 of the present invention, the inner wall has a third inner protrusion that protrudes inside the recess in a region in contact with the first lead terminal and the second lead terminal. Features. As a result, both the first lead terminal and the second lead terminal can be stably held on the same surface at the bottom surface of the recess, so that the mounting accuracy of the semiconductor light emitting element and the conductive wire bonding accuracy are stable and the quality is improved. Thus, a light emitting device with no variation can be obtained.
In the light emitting device according to claim 6 of the present invention, one third inner protrusion is provided in each of two regions sandwiched between the first inner protrusion and the second inner protrusion. The first inner projecting portion, the second inner projecting portion, and the third inner projecting portion have substantially the same shape and are arranged at substantially equal intervals.

  According to the present invention, a light-emitting device that has excellent heat dissipation and can be miniaturized can be obtained. In addition, since the inner protrusion is formed in the recess, the package having the reflector function can stably hold the first lead terminal, which is the mounting region of the semiconductor light emitting element. Therefore, when the light emitting device is mounted in a manufacturing process or on a circuit board or the like, the light emitting device having a desired shape can be obtained with high yield without causing deformation or damage due to external force.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the following.

  Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  FIG. 1A is a perspective view illustrating a light emitting device 100 of the present invention. Moreover, FIG. 1B is sectional drawing in the XX 'cross section of FIG. 1A, FIG. 1C is the perspective view which looked at FIG. 1A from the back surface side. 2 and 3A are perspective views illustrating a light-emitting device having a plurality of protrusions on the inner wall, among the light-emitting devices of the present invention. 3B is a cross-sectional view taken along the line Y-Y ′ of FIG. 3A, and FIG. 3C is a perspective view of FIG. 3A viewed from the back side. 4 and 5 are plan views for explaining modifications of the light emitting device.

  Referring to FIG. 1A, a package 101 includes a first lead terminal 102 and a second lead terminal 103 that have a concave portion 106 having an inner wall and a bottom surface on the top surface, and a part of which is included in the package. ing. These lead terminals have the bottom exposed regions 102 a and 103 a of the recess exposed at the bottom of the recess 106, and protruding regions 102 b and 103 b that protrude from the side surface of the package 101. A plurality of semiconductor light emitting elements 104 are mounted on the recessed bottom exposed region 102 a of the first lead terminal 102, and a conductive wire 105 is bonded to each semiconductor light emitting element 104. The other end of the conductive wire 105 is connected to the second lead terminal, whereby conduction between the semiconductor light emitting element 104 and the second lead terminal is achieved. A protective element 109 is placed on the bottom surface exposed area 103a of the second lead terminal, and is electrically connected to the first lead terminal by a conductive wire. Further, a sealing member 110 is filled in the recess so as to cover the semiconductor light emitting element 104 and the conductive wire 105. Further, as shown in FIG. 1B, the first lead terminal 102 has a thick film region 102c so that a part of the first lead terminal 102 is also exposed from the back surface of the package 101. The back surface of the thick film region 102c is adjusted so as to be positioned substantially on the same plane as the back surfaces of the protruding regions 102b and 103b of the first and second lead terminals.

  And in this invention, it has the 1st inner side protrusion part 107A which protrudes inside a recessed part in the area | region which contacts only a 1st lead terminal among the inner walls of the recessed part 106 of the package 101, It is characterized by the above-mentioned. Since the thick film region 102c is provided in a part of the first lead terminal 102 for supplying power from the outside, the function of directly releasing the heat from the semiconductor light emitting element 104 to the outside can also be used. Therefore, the number of parts can be reduced and the light emitting device can be downsized. Moreover, the positional shift of each component can be reduced. In particular, since the first inner protrusion 107A is formed on the inner wall of the recess 106, the package having the reflector function and the first lead terminal, which is the mounting region of the semiconductor light emitting element 104, can be stably connected to each other. Can be held. Therefore, the light-emitting device can be made less susceptible to the influence of external force during the manufacturing process or when the light-emitting device is mounted on a circuit board or the like, and the light-emitting device has stable optical characteristics and excellent reliability. Hereinafter, the present invention will be described in detail with reference to the drawings.

(package)
In the present invention, the package is used to protect the semiconductor light emitting element and to integrally form the first and second lead terminals. The shape of the package is preferably a quadrangle or a shape close to this, but is not particularly limited to this, and may be a triangle, a quadrangle, a polygon, or a shape close to these in plan view. For example, as shown in FIG. 1A, the planar view may be a substantially square shape, and the corners may be rounded and chamfered. The upper surface of the package is preferably a substantially flat surface. However, as shown in FIG. 1A, a stepped portion 101a that is lowered by one step can also be provided at a corner portion that is separated from the opening of the recessed portion. The stepped portion 101a can be used as a pin pushing area when taking out from the mold during package molding, and also used as a cathode mark indicating the polarity of the lead terminal by making the shape of each corner different. be able to. Such stepped portions can be provided at all four corners of a substantially rectangular package as shown in FIG. 1A, or, for example, a stepped portion 501a can be provided at only one corner of the package 501 as shown in FIG. . Furthermore, it can also be provided in an arbitrary portion such as a region other than the corner portion depending on the shape and size of the package. When a lens or the like is provided, a portion that functions as a fitting portion such as a hole, a groove, or a protrusion can be provided.

  As shown in FIG. 1B, the side surface of the package 101 is preferably formed in a substantially vertical plane from the upper surface to the lower surface. However, the present invention is not limited to this and may be slightly inclined or provided with a stepped portion 101a. May be. In addition, the connecting portions (portions corresponding to substantially square corners) of each side surface of the package are formed so as to be rounded as shown in FIG. 1A, so that they can be easily taken out from the mold during molding. However, the present invention is not limited to this, and it is also possible to have a shape that is cut out on a plane.

  As shown in FIGS. 1B and 1C, the back surface of the package is flush with the back surfaces of the first lead terminal protruding region 102b and the second lead terminal protruding region 103b protruding from the side surface of the package. Is formed. Furthermore, the back surface of the thick film region 102c of the first lead terminal is formed so as to be on the same surface. In this manner, the light emitting device can be stably mounted on a circuit board or the like by forming the shape so that almost the entire back surface of the package is in contact with the mounting surface.

  Further, as shown in FIGS. 3B and 3C, the back surface of the package may have a second back surface 301 b that is recessed from the back surface of the thick film region 302 c of the first lead terminal. In this way, since a joining member such as solder can be wound around the thick film region 302c of the first lead terminal, the adhesive strength can be improved and it can be placed more stably. In addition, heat dissipation can be improved.

  As a specific material of the package, an insulating member is preferable, and a member that does not easily transmit light from the semiconductor light emitting element or external light is preferable. Further, it has a certain degree of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, a glass epoxy resin, a BT resin, PPA, or the like can be given.

(Concave)
The recess formed in the package is formed so as to have an opening on the upper surface of the package, and an electronic component such as a semiconductor light emitting element or a protection element is accommodated in the recess. And the opening part of this recessed part becomes the light emission part (light emission window) in a light-emitting device.

  As described above, the concave portion in which various electronic components are housed needs to be a bottom surface having an area necessary for placing them, and the lead terminals exposed on the bottom surface of the concave portion, and these It is necessary to have a size and shape that can secure a bonding region such as a conductive wire that conducts electrical components. Further, the depth of the concave portion needs to be a depth at which the electronic component can be sealed by a sealing member filled later. However, the case where a sealing member is not required, such as when a lens is provided in a later process, is not limited thereto.

  Further, the shape of the opening of the recess is preferably a substantially circular shape as shown in FIG. 1A, but is not particularly limited to this, and depending on the shape of the package, particularly the shape of the upper surface of the package, The light distribution characteristics can be selected as appropriate. In FIG. 1A, since the upper surface of the package 100 is substantially square, it is preferable that the recess 106 has a substantially circular opening shape. However, if the light emitting area is to be further increased, it is substantially rectangular as in the case of the package upper surface. It is also possible to provide two or more recesses instead of one large recess.

  The first lead terminal and the second lead terminal are exposed on the bottom surface of the recess, and in the present invention, the semiconductor light emitting element is placed on at least the exposed first lead terminal. The first lead terminal and the second lead terminal are preferably exposed so as to be substantially flush with the bottom surface of the recess, but may be exposed so as to be on different surfaces such as by providing a step. In addition, an insulating member (resin or the like) constituting the package is exposed from the bottom of the recess so as to insulate the first lead terminal from the second lead terminal. It is preferable that all the members constituting the bottom surface are on the same surface, but a step may be provided if desired.

  The inner wall of the recess is preferably provided so that the inner wall of the recess is inclined toward the opening so that the light from the semiconductor light emitting element is reflected and efficiently emitted from the opening. In that case, the angle can be selected as desired, and the inner wall can be partially inclined without being inclined. And in this invention, it has an inner side protrusion part in the inner wall of this recessed part, It is characterized by the above-mentioned. Specifically, as shown in FIG. 1A, a first inner protrusion 107A protruding inward is formed on the inner wall of the recess 106, and the first inner protrusion 107A is a first lead. It is provided so as to contact only the terminal 102.

  In the present invention, as shown in FIG. 1B, the first lead terminal 102 is not formed of a metal member having a uniform film thickness, but is configured to have a thick film region 102c in a part thereof. Yes. This thick film region 102 c is exposed from both the bottom surface of the recess 106 and the back surface of the package 101. And in the area | region where such a 1st lead terminal is exposed by the bottom face of a recessed part, by providing the 1st inner side protrusion part 107A which protrudes inside a recessed part, a 1st lead terminal is stabilized to a package. Can be retained.

  In the present invention, since the first lead terminal has a thick film region, as shown in FIG. 1B, the lead terminal included in the resin of the package is bent to form the exposed region 102a on the bottom surface of the recess. The protruding region 102b protruding from the package can be a surface substantially parallel to the light-emitting device mounting surface such as a circuit board. Metal and resin are inherently poor in adhesion, but by forming the lead terminal in such a complicated shape and then integrally forming it, the lead terminal and the package are completely separated, such as falling off. In addition, it can be held relatively stably by having a bent portion or the like. However, a gap often occurs at the interface. In particular, a gap is likely to occur at the interface between the lead terminal exposed to the outside and the package. In addition, the first lead terminal of the present invention has a large proportion of the lower surface in contact with the package 101, whereas the upper portion is exposed at the bottom surface of the recess, that is, the proportion in contact with the package 101 is small. Yes. Thus, by providing the inner protrusion 107A on the inner wall of the recess as in the present invention, the contact area between the package 101 and the upper surface of the first lead terminal can be increased, thereby stabilizing the first lead terminal. It is possible to improve the property and make it difficult to form a gap.

  As long as the first inner protruding portion is an area in contact with only the first lead terminal, the first inner protruding portion is effective for the above-described problem even if it is formed at any position. In particular, as shown in FIG. 1A The first inner protruding portion 107A is preferably provided on the inner wall of the recess facing the protruding region 102b where the first lead terminal 102 protrudes from the side surface of the package 101. Thereby, the distance from the exposed region 102a of the lead terminal on the bottom surface of the recess to the side surface of the package can be increased, and moisture or the like entering from the gap can hardly reach the inside of the recess.

  In this way, by projecting a part of the inner wall of the recess, rather than projecting the entire inner wall, the strength of the package can be improved without reducing the area of the light emitting unit. It is possible to suppress a decrease in the holding force between the first lead terminal having the package and the package. As shown in FIG. 1A, only one first inner protrusion may be provided, or two or more first inner protrusions may be provided depending on the size and shape of the package. Moreover, when providing an inner side protrusion part in a part of inner wall in this way, it is preferable to adjust the inclination angle of an inner wall so that it may become respectively substantially equal. For example, in FIG. 1B, the angle of the first inner protrusion 107A and the angle of the inner wall where the protrusion is not formed are formed to be substantially equal.

  The first inner protrusion may be formed so as to reach the upper surface of the package, but it is preferable to have the upper surface of the inner protrusion between the upper surface of the package and the bottom surface of the recess. For example, as shown in FIG. 1B, the first inner protrusion 107A is provided, and the upper surface 107A-1 is provided at a position lower than the upper surface of the package. By doing so, the package 101 and the first lead terminal 102 can be stably held while maintaining the size of the light emitting portion. Furthermore, when the sealing member is filled in the concave portion, by adopting such a shape, the contact area between the sealing member and the package can be further increased, so that the adhesion can be improved. It is preferable that the inner wall between the inner projecting portion upper surface 107A-1 and the recess bottom surface be an inclined surface as in the other regions. Further, a slope between the inner projecting portion upper surface 107A-1 and the package upper surface may be used, or a vertical surface as shown in FIG. 1B. Further, the upper surface of the inner projecting portion may be a single surface, or may be provided with a step as shown in FIG. 1B and the like. Such an upper surface of the inner protrusion can be provided not only on the first inner protrusion but also on the second and third inner protrusions described later. And when providing in each protrusion part, it is easy to adjust a light distribution characteristic by adjusting so that the upper surfaces may become substantially the same height, and it makes it difficult to make the stress etc. concerning a sealing member become imbalanced. Can do.

  As described above, the first inner projecting portion of the inner wall of the concave portion is provided in the region in contact with only the first lead terminal, so that the first lead terminal can be stably held in the package. In addition, an inner protrusion (second inner protrusion) that contacts only the second lead terminal may be provided. For example, as shown in FIG. 2, the first protrusions are formed on the inner walls of the regions in contact with the first lead terminal 202 and the second lead terminal 203 so as to be symmetric with respect to the mounting region of the semiconductor light emitting element. 207A and a second inner protrusion 207B can be provided. The angles and widths of the inner walls of the protrusions are the same. By doing so, unevenness in the light distribution characteristics can be prevented and the holding force between the second lead terminal and the package can be improved.

  Furthermore, as the inner protrusion of the inner wall of the recess, a third inner protrusion that protrudes inside the recess can be provided in a region in contact with both the first lead terminal and the second lead terminal. Thus, the height of both lead terminals on the bottom surface of the recess can be made flush, and a light emitting device with less mounting deviation of the semiconductor light emitting element can be obtained. For example, as shown in FIG. 3A, two third inner protrusions 307C are provided in each of the first inner protrusion 307A and the second inner protrusion 307B, and the region between them. Can do. These four inner protrusions are preferably provided in substantially the same shape, and the distance between them is preferably substantially equal. By doing in this way, the stress etc. in a recessed part become easy to become uniform, and it is easy to adjust a light distribution characteristic.

(First lead terminal)
The lead terminal is a conductive member for supplying an electric current from the outside to electronic components such as a semiconductor light emitting element and a protective element placed in the recess of the package, and a metal member having excellent conductivity is suitable. is there. In the present invention, the first lead terminal is exposed at the bottom surface of the concave portion of the package and is also provided so as to protrude from the side surface of the package, and further has a thick film region exposed from the back surface of the package. It has a simple structure. That is, as shown in FIG. 1B, unlike the second lead terminal which is made of a metal member having substantially the same thickness and is partially bent, the first lead terminal has a thickness that is partially different. A film region 102c is provided. The thick film region 102c is exposed from both the bottom surface of the recess and the back surface of the package. In this way, by exposing the first lead terminal from the back surface of the package, heat generated from the semiconductor light emitting element placed immediately above it can be efficiently released to the outside. In order to efficiently release heat from the thick film region 102c to the outside, the back surface of the thick film region 102c is positioned substantially on the same plane as the back surfaces of the protruding regions 102b and 103b of the first and second lead terminals during mounting. It is preferable to adjust so as to. Alternatively, in consideration of the thickness of solder or the like, the back surface of the thick film region may be adjusted slightly lower than the back surface of the protruding region. That is, if the thick film region of the lead terminal protrudes from the projecting region on the back side of the package, the stability at the time of mounting is deteriorated and the bonding property of the projecting region for conducting is deteriorated. Because there is a fear. Further, the back surface shape of the thick film region 102c of the first lead terminal is made substantially rectangular according to the back surface shape of the protruding region 102b. Thus, on the back surface of the light emitting device, the back surface shape of the first lead terminal (and the shape of the back surface of the second lead terminal) that is the same surface as the back surface of the package is substantially rectangular, and the long side is respectively By providing them in parallel, it is possible to easily reduce the shift during mounting on a circuit board or the like.

  In addition, the protruding region protruding from the package of the first lead terminal is not bent and remains protruding. This projecting region is a part that is connected to a circuit board or the like using a conductive joining member such as solder. In this way, by making the package into a shape that does not need to be bent after molding, it can be provided as a relatively thick lead terminal. In particular, in the present invention, since a part of the lead terminal has a thick film region, it is preferable to thicken other regions so as not to be bent by its own weight when integrally molded with the package. . However, if it is too thick, it becomes difficult to cut from the lead frame after the package is formed. Therefore, by providing the narrow cut portions 102d and 103d as shown in FIG. 1A, even a relatively thick lead terminal can be cut easily. Further, not only the shape as shown in FIG. 1A but also the cutting portions 402d and 403d can be provided at positions as shown in FIG. However, in the case where the lead terminal is made thin, it is also possible not to provide a particularly narrow cut portion for both the first lead terminal 502 and the second lead terminal 503 as shown in FIG.

  The material of the first lead terminal is preferably formed of a material having a relatively large thermal conductivity, whereby heat generated in the semiconductor light emitting element can be efficiently released to the outside. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, and a material that can be easily stamped or etched are preferred. Specifically, metals such as copper, aluminum, gold, silver, tungsten, iron and nickel, or alloys such as iron-nickel alloy and phosphor bronze are listed. Further, the thickness, shape, and the like can be appropriately adjusted in consideration of the size, shape, and the like of the light-emitting device to be obtained. Of these materials, those that easily absorb light preferably have a laminated structure such as a member that easily reflects light on the surface. For example, it is preferable to have a laminated structure in which silver is plated on a conductive member made of tungsten or copper.

  The thick film region of the first lead terminal is preferably provided in a region of the first lead terminal that is exposed on the bottom surface of the concave portion of the package, and is particularly provided in a region where the semiconductor light emitting element is placed. Is preferred. In this way, part of the lead terminal can function as a heat radiating portion, so that heat from the semiconductor light emitting element can be efficiently released to the outside. The shape, size, etc. of the thick film region can be appropriately adjusted in consideration of the size, shape, etc. of the light emitting device to be obtained.

(Opening of the first lead terminal)
The first lead terminal may have an opening for exposing the package between the mounting region of the semiconductor light emitting element and the first inner protrusion. For example, as shown in FIG. 1A, a plurality of semiconductor light emitting elements 104 are mounted on the exposed region 102 a of the first lead terminal 102, and the mounted region and the first inner side of the inner wall of the recess 106. An opening 108 is provided between the protrusion 107A so that the package 101 is exposed. The opening is provided in a region other than the thick film region 102c in the exposed region 102a on the bottom surface of the recess of the first lead terminal. As shown in FIG. 1B, the opening 108 is filled with resin constituting the package 101 and is flush with the exposed region of each lead terminal. By providing the opening 108 in this manner, the package 101 exposed from the opening and the sealing member 110 filled in the concave portion are in direct contact with each other, thereby further improving the adhesion of the sealing member. be able to.

  The size and shape of the opening are not particularly limited, but a region that does not hinder the bonding of the semiconductor light emitting element or the conductive wire is preferable, and the region between the lead terminals with the mounting region of the semiconductor light emitting element interposed therebetween It is preferable to provide such a shape and symmetry. For example, in FIG. 1A, the first lead terminal is located between the concave bottom surface exposed region 102a of the first lead terminal and the concave bottom surface exposed region 103a of the second lead terminal near the center of the bottom surface of the concave portion of the package. Protrudes toward the lead terminal. And since the 2nd lead terminal is dented so that it may be substantially parallel to it, the shape of the exposure area | region of a package also becomes the shape bent not according to it but linear form. The opening 108 is also bent so as to be symmetrical with the package exposed portion between the lead terminals. Thus, by exposing the package 101 so as to have symmetry with the semiconductor light-emitting element sandwiched therebetween, there is no bias in the adhesion of the sealing resin, and it is possible to reduce the load on either one and to emit light from the semiconductor. The light distribution characteristics of the light from the element can be easily controlled. When it is symmetric, it may be a single opening as shown in FIG. 1A, or may be entirely symmetric as two or more openings, and it is appropriately determined in consideration of the purpose and the relationship with other members. You can choose.

(Second lead terminal / second inner protruding area)
Similar to the first lead terminal, the second lead terminal is exposed on the bottom surface of the concave portion of the package and is also provided so as to protrude from the side surface of the package, and is placed on the first lead terminal. The semiconductor light emitting element is electrically connected to a conductive wire or the like. On the bottom surface of the recess of the package, as shown in FIG. 1A, the exposed region 103a of the second lead terminal is provided so as to be separated from the exposed region 102a of the first lead terminal 102 at a substantially constant interval. In this figure, the exposed region 103a of the second lead terminal is formed smaller than the exposed region 102a of the first lead terminal. However, the present invention is not limited to this, and can be exposed in a desired shape and area. . For example, when a protective wire is mounted as shown in FIG. 1A, it is preferable that the conductive wire is exposed so that the mounting region can be secured. In addition, a semiconductor light emitting element can also be placed on the second lead terminal, similarly to the first lead terminal. In that case, similarly to the first lead terminal, a thick film region may be provided so that the second lead terminal is also exposed from the back surface of the package.

  Further, the protruding region protruding from the side surface of the package is protruded so that the back surface of the protruding region is substantially flush with the back surface of the package, like the first lead terminal. That is, as shown in FIG. 1B, the back surface of the protruding region 102 b that is bent inside the package and protrudes from the side surface of the package is formed to be substantially flush with the back surface of the package 101.

  As the material of the second lead terminal, the same material as that of the first lead terminal can be used.

(Die bond member)
The die bond member is a bonding member for mounting a semiconductor light emitting element, a protection element, or the like on the lead terminal, and either a conductive die bond member or an insulating die bond member can be selected depending on the substrate of the element to be mounted. it can. For example, in the case of a semiconductor light emitting device in which a nitride semiconductor layer is laminated on sapphire, which is an insulating substrate, it can be used either insulating or conductive. When a conductive substrate such as a SiC substrate is used, a conductive die bond Conduction can be achieved by using a member. As the insulating die bond member, an epoxy resin, a silicone resin, or the like can be used. In the case of using these resins, a metal layer having a high reflectance such as an Al film can be provided on the back surface of the semiconductor light emitting element in consideration of deterioration due to light or heat from the semiconductor light emitting element. In this case, a method such as vapor deposition, sputtering, or bonding a thin film can be used. In addition, as the conductive die bond member, a conductive paste such as silver, gold, or palladium, solder such as Au—Sn eutectic, or a brazing material such as a low melting point metal can be used. Further, among these die bond members, in particular, when a translucent die bond member is used, a fluorescent member that absorbs light from the semiconductor light emitting element and emits light of a different wavelength can be included therein.

(Sealing member)
The sealing member is a member that protects the semiconductor light-emitting element or conductive wire placed in the recess of the package from dust, moisture, external force, etc., and is a translucent material that can transmit light from the semiconductor light-emitting element Those having the following are preferred. Specific examples of the material include silicone resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, a fluorescent member, and the like can be contained as desired. Moreover, although it is preferable to provide so that the whole recessed part may be filled, it can also be filled to the middle of a recessed part according to the objective. Further, when a mounted electronic component or the like can be protected by a member other than the sealing member, such as when a lens is provided, the sealing member can be omitted.

(Semiconductor light emitting device)
A semiconductor light emitting device having an arbitrary wavelength can be selected. For example, as blue and green light emitting elements, those using ZnSe or a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) are used. it can. As the red light emitting element, GaAs, InP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose. For example, as shown in FIG. 1A, a plurality of semiconductor light emitting elements having the same emission color can be mounted, such as mounting six semiconductor light emitting elements using a nitride semiconductor capable of emitting blue light.

In the case of a light-emitting device having a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. In addition to the semiconductor light emitting element, a light receiving element, a protective element (for example, a Zener diode or a capacitor) that protects the semiconductor element from destruction due to overvoltage, or a combination thereof can be mounted.

(Conductive wire)
The conductive wire that connects the electrode of the semiconductor light emitting element to the first lead terminal and the second lead terminal has good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the lead terminal. Desired. Preferably ^{0.01cal / (s) (cm 2} ) (℃ / cm) or higher as heat conductivity, and more preferably ^{0.5cal / (s) (cm 2} ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire is preferably Φ10 μm or more and Φ45 μm or less. Specific examples of such conductive wires include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof. Such a conductive wire can easily connect the wire bonding region formed in the conductor wiring and the electrode of the semiconductor element by a wire bonding apparatus.

(Fluorescent material)
The sealing member may contain a fluorescent material that emits light having different wavelengths by absorbing at least part of light from the semiconductor light emitting element. In particular, it is more efficient to convert light from a semiconductor light emitting element into a longer wavelength. The fluorescent member may be formed of a single type of fluorescent material or the like, or may be formed of a single layer in which two or more types of fluorescent material are mixed, or contains one type of fluorescent material, etc. Two or more single layers may be stacked, or two or more single layers each of which is mixed with two or more kinds of fluorescent substances may be stacked.

  Any fluorescent member may be used as long as it absorbs light from a semiconductor light emitting device having a nitride semiconductor as a light emitting layer and converts the light to light of a different wavelength. For example, nitride phosphors / oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid phosphors such as Eu, and alkalis mainly activated by transition metal elements such as Mn Earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride At least selected from organic and organic complexes mainly activated by lanthanoid elements such as germanate or lanthanoid elements such as Ce, rare earth aluminate, rare earth silicate or Eu Any one or more are preferable. As specific examples, the following phosphors can be used, but are not limited thereto.

A nitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is M ₂ Si ₅ N ₈ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn). There is.) In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

Nitride phosphors activated by rare earth elements such as Eu and containing Group II elements M, Si, Al, and N, absorb ultraviolet or blue light and emit light in the yellow red to red range. To do. The nitride phosphor has the general formula _{M w Al x Si y N (} (2/3) w + x + (4/3) y): shown by Eu, rare earth elements and tetravalent element to an additional element, 3 At least one element selected from valent elements. M is at least one selected from the group consisting of Mg, Ca, Sr, and Ba.

  In the above general formula, the ranges of w, x, and y are preferably 0.04 ≦ w ≦ 9, x = 1, 0.056 ≦ y ≦ 18. The range of w, x, and y may be 0.04 ≦ w ≦ 3, x = 1, 0.143 ≦ y ≦ 8.7, more preferably 0.05 ≦ w ≦ 3, x = 1, 0. 167 ≦ y ≦ 8.7.

The nitride phosphor is generally added boron B formula _{M w Al x Si y B z} N ((2/3) w + x + (4/3) y + z): can also be Eu. Also in the above, M is at least one selected from the group consisting of Mg, Ca, Sr, and Ba, and 0.04 ≦ w ≦ 9, x = 1, 0.056 ≦ y ≦ 18, 0.0005 ≦ z ≦ 0.5. When boron is added, the molar concentration z is set to 0.5 or less as described above, preferably 0.3 or less, and further set to be greater than 0.0005. More preferably, the molar concentration of boron is set to 0.001 or more and 0.2 or less.

  Further, these nitride phosphors are further at least one selected from the group of La, Ce, Pr, Gd, Tb, Dy, Ho, Er, Lu, or any one of Sc, Y, Ga, In, Alternatively, any one of Ge and Zr is contained. By containing these, luminance, quantum efficiency, or peak intensity equal to or higher than Gd, Nd, and Tm can be output.

An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) .)and so on.

Alkaline earth halogen apatite phosphors mainly activated by lanthanoid elements such as Eu and transition metal elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba, At least one selected from Mg and Zn, X is at least one selected from F, Cl, Br, and I. R is at least one selected from Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is one or more of Eu, Mn, Eu and Mn).

The alkaline earth silicate _{phosphor, (Sr 1-a-b} -x Ba a Ca b Eu x) 2 SiO 4 (0 ≦ a ≦ 1,0 ≦ b ≦ 1,0.005 ≦ x ≦ 0 .1).

Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y _{3 (Al 0.8 Ga 0.2) 5 O} 12: Ce, and the like (Y, Gd) 3 (Al , Ga) YAG -based phosphor represented by the composition formula of _{5 O 12.} Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).

  The phosphor described above contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also

The Ca—Al—Si—O—N-based oxynitride glass phosphor is expressed in terms of mol%, CaCO ₃ is converted to CaO, 20 to 50 mol%, Al ₂ O ₃ is 0 to 30 mol%, SiO 25 to 60 mol% of Al, 5 to 50 mol% of AlN, 0.1 to 20 mol% of rare earth oxide or transition metal oxide, and a base material of an oxynitride glass in which the total of five components is 100 mol% This is a phosphor. In addition, in the phosphor using oxynitride glass as a base material, the nitrogen content is preferably 15 wt% or less, and other rare earth element ions serving as a sensitizer in addition to rare earth oxide ions are used as rare earth oxides. It is preferable to contain as a co-activator in content in the range of 0.1-10 mol% in fluorescent glass.

  Moreover, it is fluorescent substance other than the said fluorescent substance, Comprising: The fluorescent substance which has the same performance, an effect | action, and an effect can also be used.

  The present invention can be used for a lighting device, a display, a backlight light source of a liquid crystal display, and the like.

FIG. 1A is a perspective view of a light emitting device of the present invention. 1B is a cross-sectional view taken along the line X-X ′ of FIG. 1A. FIG. 1C is a perspective view of the light emitting device of FIG. 1A viewed from the back side. FIG. 2 is a perspective view of the light emitting device of the present invention. FIG. 3A is a perspective view of the light emitting device of the present invention. 3B is a cross-sectional view taken along the line Y-Y ′ of FIG. 3A. FIG. 3C is a perspective view of the light emitting device of FIG. 3A viewed from the back side. FIG. 4 is a plan view of the light emitting device of the present invention. FIG. 5 is a plan view of the light emitting device of the present invention.

Explanation of symbols

100, 200, 300, 400, 500... Light emitting device 101, 301... Package 101a, 501a... Stepped portion 301b... Second back surface 102, 202, 302, 402, 502. 1 lead terminal 102a... First lead terminal recess bottom surface exposed region 102b... First lead terminal protruding region 102c, 302c... First lead terminal thick film region 102d, 402d. The first lead terminal cutting portions 103, 203, 303, 403, 503... The second lead terminal 103a... The second lead terminal recessed portion bottom surface exposed region 103b. Projection regions 103d, 403d ... cutting portion 104 of first lead terminal ... semiconductor light emitting element 105 ... conductive wire 106 ... recess 107A of package, 07A, 307A ... first inner protrusion 107A-1 ... inner protrusion upper surface 207B, 307B ··· second inner protrusion 307C ... third inner protrusion 108 ... first Opening 109 of lead terminal ... Protective element 110 ... Sealing member

Claims (6)

A package comprising a recess having an inner wall and a bottom surface;
A lead terminal that is exposed on a bottom surface of the recess and protrudes from a side surface of the package; the lead terminal is a thick film on which a semiconductor light emitting element is placed and also exposed from the back surface of the package A first lead terminal having a region, and a second lead terminal electrically connected to the semiconductor light emitting element,
The inner wall has a first inner protruding portion that protrudes inside the recess in a region in contact with only the first lead terminal,
Further, the inner wall, said in the second region in contact with only the lead terminals are arranged to be symmetrical with respect to mounting area of the first inner protrusion of the semiconductor light - emitting element, the first inner A light emitting device comprising a second inner projecting portion that is spaced apart from the projecting portion and projects to the inside of the recess at the same angle and width as the first inner projecting portion.   2. The light emitting device according to claim 1, wherein the first inner protruding portion is provided in a region facing a side surface of the package from which the first lead terminal protrudes.   The light emitting device according to claim 1, wherein the first inner protrusion has an inner protrusion upper surface at a position between the upper surface of the package and the bottom surface of the recess.   The said 1st lead terminal has an opening part which the said package exposes between the said 1st inner side protrusion part and the area | region in which the said semiconductor light-emitting device is mounted. The light emitting device according to claim 1.   The said inner wall has a 3rd inner side protrusion part which protrudes inside the said recessed part in the area | region which contact | connects the said 1st lead terminal and the said 2nd lead terminal. The light emitting device described.   In each of the two regions sandwiched between the first inner protrusion and the second inner protrusion, one third inner protrusion is provided, and the first inner protrusion, The light emitting device according to claim 5, wherein the second inner protruding portion and the third inner protruding portion have substantially the same shape and are arranged at substantially equal intervals.

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