JP4798803B2 - Reactive adhesive composition for fixing electronic parts and adhesive sheet thereof - Google Patents

Description

  The present invention relates to a reactive adhesive composition for fixing electronic components and a reactive adhesive sheet for fixing electronic components. The reactive adhesive composition for fixing an electronic component of the present invention can form an adhesive layer that exhibits excellent adhesion with relatively short curing time and has heat resistance. The adhesive sheet having the adhesive layer is advantageously used for fixing electronic components, particularly for bonding metal reinforcing materials used in electronic components such as IC packages and heat-resistant films such as polyimide films and fixing IC chips. can do.

  Various adhesives are used for the purpose of improving reliability in fixing applications such as electronic parts. In particular, structural bonding applications such as fixing flexible printed wiring boards and reinforcing materials, fixing circuit boards and reinforcing plates or heat sinks used in semiconductor devices such as ball grid arrays, and manufacturing processes such as temporary fixing during parts transportation Adhesives are increasingly used in the above adhesive applications.

  In such applications, polyimide films are used for flexible circuit boards, and metal materials and glass epoxy plates are used as reinforcing materials. Therefore, adhesives used in such applications are good for these materials. Adhesiveness is required. Also, in such applications, it has high heat resistance that can withstand the high temperature of 200 ° C or higher, which is the condition for solder reflow during component mounting, and can be bonded at low pressure, low temperature, and short time for the purpose of improving productivity. Is required.

  Conventionally, for example, epoxy adhesives and polyimide adhesives have been studied as adhesives used for bonding such electronic parts. In recent years, adhesive sheets having low elasticity and low water absorption have been demanded due to demands such as thermal stability in a pressure cooker test imposed on a semiconductor device and good stress relaxation in a temperature cycle test.

  As an adhesive for adhesive sheets that can satisfy both low elasticity and high heat resistance requirements, a compound having an epoxy group introduced into the main chain is blended with a compound having reactivity therewith, and a crosslinking / curing reaction is performed. What was made known is known. As the polymer into which the epoxy group is introduced, an ethylene copolymer having an epoxy group in the molecule is particularly preferable in terms of adhesion and low water absorption. A conventionally known reaction can be used for crosslinking / curing the ethylene-based copolymer. Examples of compounds that can be used for the reaction include, for example, page 5 of Bond First Technical Document (Sumitomo Chemical Co., Ltd., issued in May 1996). It is described in. Of these, at least one selected from epoxy resins, phenol resins, acid anhydrides, and carboxylic acids is preferably used from the viewpoint of reactivity.

  However, even when the compound is applied as a curing agent to the ethylene copolymer, the heat resistance is not sufficient.

  The present invention solves the above-mentioned problems of a reactive adhesive composition and a reactive adhesive sheet using a conventional ethylene copolymer, and has excellent heat resistance and adhesion. It is an object of the present invention to provide a reactive adhesive composition for fixing an electronic component and a reactive adhesive sheet for fixing an electronic component, which have good properties and stress relaxation properties.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the following reactive adhesive composition for fixing electronic components, and have completed the present invention.

  That is, the present invention includes an olefin-based copolymer (a) having an epoxy group in the molecule and an olefin-based copolymer (b) having a carboxyl group in the molecule. Adhesive composition.

  The above-mentioned reactive adhesive composition for fixing an electronic component according to the present invention comprises blending an olefin copolymer (a) and a olefin copolymer (b) containing functional groups having reactivity in the molecule. Thus, the olefin copolymers form a crosslinked structure during heat curing. As a result, excellent heat resistance can be obtained without impairing adhesion. Conventionally, most of the compounds used for the curing agent of the olefin copolymer (a) have an aromatic ring in the structure thereof, so that the compatibility is poor, and phase separation or segregation over time, etc. However, the olefin copolymer (b) is a polymer material having a polarity close to that of the olefin copolymer (a), and is excellent in storage stability.

  In the reactive adhesive composition, the amount of the olefin copolymer (b) used is preferably 5 to 150 parts by weight, more preferably 10 to 100 parts by weight of the olefin copolymer (a). 100 parts by weight, more preferably 10 to 50 parts by weight. If it is less than 5 parts by weight, it is difficult to sufficiently improve the heat resistance, and if it exceeds 150 parts by weight, it is not preferable in terms of adhesion.

  The reactive adhesive composition may contain a block copolymer (c) having an aromatic vinyl compound polymer block (c1) and a conjugated diene compound polymer block (c2). Flexibility can be imparted by the block copolymer (c).

  The weight ratio of the aromatic vinyl compound polymer block (c1) to the conjugated diene compound polymer block (c2) in the block copolymer (c) is (c1) / (c2) = 10/90 to 40/60. Preferably there is.

  If the ratio of the aromatic vinyl compound polymer block (c1) is decreased, the fluidity of the adhesive composition may be lowered and adhesion in a short time may be difficult. Therefore, the aromatic vinyl compound polymer block (c1) The proportion is preferably 10% by weight or more, more preferably 15% by weight or more. On the other hand, if the ratio of the aromatic vinyl compound polymer block (c1) increases, the compatibility with the olefin copolymers (a) and (b) tends to deteriorate, and therefore the aromatic vinyl compound polymer block (c1). ) Is 40% by weight or less, more preferably 30% by weight or less.

  The amount of the block copolymer (c) used is preferably 100 parts by weight or less, preferably 5 to 100 parts by weight with respect to 100 parts by weight of the total amount of the olefin copolymer (a) and the olefin copolymer (b). Furthermore, 10 to 50 parts by weight, particularly 15 to 30 parts by weight is preferable. The effect of imparting flexibility is improved at 5 parts by weight or more. If it exceeds 100 parts by weight, the adhesion and heat resistance tend to decrease.

  The reactive adhesive composition may contain an epoxy resin and its curing agent. The heat resistance can be further improved by the epoxy resin. The reactive adhesive composition for fixing an electronic component of the present invention blended with the olefin copolymer (a) and the olefin copolymer (b) is obtained by adding an epoxy resin and its curing agent to a certain range. However, it is excellent in storage stability without causing phase separation or segregation.

  The total amount of the epoxy resin and its curing agent is preferably 200 parts by weight or less, preferably 10 to 200 parts by weight, 20 parts per 100 parts by weight of the total amount of the olefin copolymer (a) and the olefin copolymer (b). -100 parts by weight, and more preferably 30-60 parts by weight. If it exceeds 200 parts by weight, the adhesiveness tends to decrease. Moreover, it is preferable to set it as 10 weight part or more in order to improve heat resistance.

  The reactive adhesive composition for fixing an electronic component of the present invention may further contain an epoxy group curing accelerator. By adding a curing accelerator, the curing start temperature can be arbitrarily set, and it can be used for a wide range of materials from materials having a relatively low heat resistance temperature such as polyester to adhesion of high heat resistance materials such as polyimide.

  The present invention also relates to a reactive adhesive sheet for fixing an electronic component, characterized by having an adhesive layer formed from the reactive adhesive composition on one or both sides of a substrate. The reactive adhesive sheet for fixing an electronic component using the reactive adhesive composition for fixing an electronic component of the present invention as an adhesive layer has good storage stability and excellent heat resistance, adhesiveness, and stress relaxation property. The present invention also relates to an electronic component assembled by using an adhesive layer formed on the reactive adhesive sheet.

  The olefin copolymer (a) containing an epoxy group in the molecule used in the reactive adhesive composition for fixing electronic parts of the present invention is, for example, a polymer or copolymer of ethylene or propylene, ethylene- Examples thereof include a polymer obtained by copolymerization or graft polymerization of a monomer having an epoxy group such as glycidyl (meth) acrylate in a vinyl acetate copolymer or an ethylene- (meth) acrylate copolymer. One olefin copolymer (a) is used alone, or two or more olefin copolymers are used in combination.

  In the olefin copolymer (a), the monomer unit content of ethylene or propylene is at least 50% by weight, the monomer unit content of the monomer having an epoxy group is 2 to 30% by weight, and further 5 to 15% by weight. % Is preferred. If it is less than 2% by weight, the adhesiveness tends to be poor, and furthermore, the crosslinking starting point is small and the heat resistance after curing tends to be poor. On the other hand, if it exceeds 30% by weight, the elastic modulus after curing tends to decrease and the stress relaxation property tends to decrease, and the hygroscopicity of the epoxy group also increases the hygroscopicity of the adhesive layer, so that the moisture absorption during solder reflow is increased. There is a problem in that peeling occurs due to vapor pressure due to vaporization of the moisture.

  As the olefin copolymer (a), an ethylene copolymer is preferable. Specific examples thereof include an ethylene-glycidyl methacrylate copolymer, an ethylene-glycidyl methacrylate-vinyl acetate copolymer, and an ethylene-glycidyl methacrylate-vinyl acetate copolymer. Such an olefin copolymer (a) can be obtained from, for example, a product group called “Pound First” manufactured by Sumitomo Chemical Co., Ltd.

  Examples of the olefin copolymer (b) containing a carboxyl group in the molecule include, for example, ethylene or propylene polymer or copolymer, ethylene-vinyl acetate copolymer, maleic acid, fumaric acid, acrylic acid. And a polymer obtained by copolymerization or graft polymerization of a functional monomer having a carboxyl group such as methacrylic acid. These olefin copolymers (b) are used alone or in combination of two or more.

  The olefin copolymer (b) has an ethylene or propylene monomer unit content of at least 50% by weight, and the monomer unit content of a monomer having a carboxyl group is 4 to 30% by weight, more preferably 10 to 15% by weight. % Is preferred. If it is less than 4% by weight, the adhesiveness tends to be poor, and further, there are few crosslinking starting points and the heat resistance after curing tends to be poor. On the other hand, if it exceeds 30% by weight, the elastic modulus after curing tends to decrease and the stress relaxation property tends to decrease. Also, due to the hygroscopicity of the carboxyl group, the hygroscopicity of the adhesive layer also increases, and the hygroscopicity during solder reflow increases. There is a problem in that peeling occurs due to vapor pressure due to vaporization of the moisture.

  Such olefin copolymers (b) are commercially available as EAA, EMAA, etc., for example Novatec EAA from Nippon Polychem Co., Ltd., Primacor from Dow Chemical Japan Co., Ltd., Mitsui DuPont Polychemical Co., Ltd. It can be obtained from the company under the trade name Nukurel

  The reactive adhesive composition for fixing an electronic component of the present invention usually comprises the olefin copolymer (a) and the olefin copolymer (b) in the above proportions, and further contains an aromatic vinyl. A block copolymer (c) having a compound polymer block (c1) and a conjugated diene compound polymer block (c2) can be contained.

  Examples of the aromatic vinyl compound polymer block (c1) of the block copolymer (c) include styrene polymer blocks, and examples of the conjugated diene compound polymer block (c2) include butadiene polymer blocks or isoprene polymer blocks. Can be given. As the block copolymer (c), block copolymers of SIS type, SBS type, SIBS type and the like can be used without particular limitation.

  As the block copolymer (c), it is preferable to use a hydride of the block copolymer (c) because of its good thermal stability. In addition, hydrogenation of a block copolymer (c) is performed to the extent which saturates an olefinically unsaturated double bond. A hydrogenated butadiene-styrene block copolymer is commercially available as SEBS, and a hydrogenated imprene-styrene block copolymer is commercially available as SEPS. The block copolymer (c) of the present invention may be carboxylic acid-modified with maleic acid, acrylic acid or its anhydride. The carboxylic acid-modified block copolymer (c) has reactivity with the olefin copolymer (a) and is preferable from the viewpoint of heat resistance. In particular, the block copolymer (b) of the present invention is preferably a hydride of the block copolymer (b) modified with a carboxylic acid. Examples of such commercially available block copolymer (b) include Tuftec M series (manufactured by Asahi Kasei Kogyo Co., Ltd.), Clayton FG1901X (manufactured by Shell Japan Co., Ltd.), and the like.

  Moreover, an epoxy resin and its hardening | curing agent can be mix | blended with the reactive adhesive composition for electronic component fixation of this invention. Examples of the epoxy resin include glycidyl amine type epoxy resin, bisphenol F type epoxy resin, bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, aliphatic epoxy. Examples thereof include resins, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, and halogenated epoxy resins.

  Epoxy resin curing agents include phenolic novolac resins, cresol novolac resins, xylene resins and other phenolic resins; maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, succinic anhydride and other acid anhydrides; pyromellitic acid, tri Examples thereof include carboxylic acids such as merit acid and block carboxylic acids added with vinyl ether.

  Furthermore, the reactive adhesive composition for fixing an electronic component of the present invention may contain an epoxy resin curing accelerator. As the curing accelerator, various imidazole compounds and derivatives thereof, amine catalysts, phosphorus catalysts, dicyandiamide, hydrazine compounds, and microcapsules thereof can be used. Although the compounding quantity of such a hardening accelerator can be suitably selected from the desired hardening rate, it is 10 weight part or less normally with respect to 100 weight part of solid content of adhesive composition. Preferably it is about 0.01-10 weight part, More preferably, it is 0.1-5 weight part, More preferably, it is 0.5-3 weight part.

  Furthermore, the reactive adhesive composition for fixing electronic components of the present invention can contain an inorganic filler. By containing an inorganic filler, there are effects such as control of linear expansion coefficient, imparting heat resistance, imparting conductivity and thermal conductivity, and the like, which is preferable. Examples of the inorganic filler include silica, alumina, aluminum hydroxide, magnesium hydroxide, boron nitride, aluminum nitride, boron carbide, and other metal powders. In particular, the inorganic filler is preferably surface-treated with a silane coupling agent from the viewpoint of compatibility with the resin and improved adhesion.

  Furthermore, the reactive adhesive composition for fixing electronic parts of the present invention includes known organic fillers, pigments, anti-aging agents, silane coupling agents, tackifiers and the like as long as the properties of the adhesive sheet are not deteriorated. These various additives can be added as necessary.

  The reactive adhesive sheet for fixing an electronic component of the present invention is produced by forming an adhesive layer made of the adhesive composition on a substrate. The adhesive layer is formed by mixing and stirring the adhesive composition in the absence of a solvent, and extruding it into a release treatment film. And a method in which the adhesive composition is stirred at high speed in water or in a solvent to form a water dispersion, which is applied to a release treatment film, and moisture is dried. Among these, a production method using a solvent is preferable because an adhesive sheet can be produced at a low temperature.

  The solvent is not particularly limited, but aromatic solvents such as toluene and xylene are preferably used because of their good solubility. Examples of the release treatment film include plastic liner films such as polyester, polyolefin, polyamide, and polyimide, and release liners obtained by performing release treatment such as silicone and fluorine on glassine paper, high-quality paper laminated with polyethylene, and the like.

  As the substrate, plastic film substrate such as polyimide, polyamide, polyetherimide, polyamideimide, polyester, polyphenylene sulfide, polycarbonate, polytetrafluoroethylene, polyether ether ketone and its porous substrate, cellulose, polyamide, polyester, Nonwoven substrates such as aramid, metal film substrates such as aluminum foil and SUS foil, steel wool substrates, metal mesh substrates and the like are included. When a peelable film is used as the substrate, the adhesive layer formed on the peelable film can be transferred onto the substrate.

  The reactive adhesive sheet for fixing electronic components can be provided with an adhesive layer on one or both sides of the substrate. Moreover, the obtained adhesive film can be used as a sheet form or a tape form. The thickness of the adhesive layer of the adhesive film is preferably about 10 to 200 μm.

  The thus obtained reactive adhesive sheet for fixing electronic parts of the present invention has an adhesive layer excellent in heat resistance and adhesiveness when used for fixing electronic parts, and also has phase separation, segregation of resin, etc. Less storage stability over time.

  Hereinafter, the present invention will be described in more detail with reference to examples of the present invention. In the following, “parts” means parts by weight.

Example 1
Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bond First 7M), ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., Nucrel N1560) and imidazole series A curing accelerator (Shikoku Kasei Kogyo Co., Ltd., C ₁₁ Z) was blended so as to have the composition ratio shown in Table 1, and dissolved in a toluene solvent at 60 ° C. to a concentration of 20% by weight to fix electronic components. A solution of the reactive adhesive composition for use was prepared.

  This adhesive composition solution was applied as a release liner on a release treatment film made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment in a 60 ° C. atmosphere, and then dried at 120 ° C. for 3 minutes. Thus, a thermosetting adhesive layer having a thickness of 50 μm was formed, and a reactive adhesive sheet for fixing electronic components was prepared.

Example 2
Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bondfast 7M), ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., Nucrel N1560), maleic acid The modified block copolymer hydride (Asahi Kasei Kogyo Co., Ltd., Tuftec M1943) was blended so as to have the composition ratio shown in Table 1, and dissolved in a toluene solvent at 80 ° C. to a concentration of 20% by weight. The mixture was cooled to room temperature while stirring with a disperser having a rotational speed of 3000 rpm to obtain a dispersion solution. Next, an imidazole curing accelerator (manufactured by Shikoku Kasei Kogyo Co., Ltd., C ₁₁ Z) was blended so as to have the composition ratio shown in Table 1 to prepare a solution of a reactive adhesive composition for fixing electronic components.

  This adhesive composition solution was applied at room temperature onto a release film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment as a release liner, and then dried at 120 ° C. for 3 minutes to obtain a thickness. A 50 μm thick thermosetting adhesive layer was formed to produce a reactive adhesive sheet for fixing electronic components.

Example 3
Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bondfast 7M), ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., Nucrel N1560), maleic acid The modified block copolymer hydride (Asahi Kasei Kogyo Co., Ltd., Tuftec M1943) was blended so as to have the composition ratio shown in Table 1, and dissolved in a toluene solvent at 80 ° C. to a concentration of 20% by weight. The mixture was cooled to room temperature while stirring with a disperser having a rotational speed of 3000 rpm to obtain a dispersion solution. Next, epoxy resin (Japan Epoxy Resin Co., Ltd., Epicoat 828), phenol resin (Showa High Polymer Co., Ltd., Shonor BRG-555) and imidazole curing accelerator (Shikoku Kasei Kogyo Co., Ltd., C ₁₁ Z) was blended so as to have the composition ratio shown in Table 1 to prepare a solution of a reactive adhesive composition for fixing electronic components.

  This adhesive composition solution was applied at room temperature onto a release film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment as a release liner, and then dried at 120 ° C. for 3 minutes to obtain a thickness. A 50 μm thick thermosetting adhesive layer was formed to produce a reactive adhesive sheet for fixing electronic components.

Comparative Example 1
Ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., Nucrel N1560), epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., Epicoat 828), and imidazole curing accelerator (manufactured by Shikoku Kasei Kogyo Co., Ltd.) , C ₁₁ Z) were blended so as to have the composition ratios shown in Table 1, respectively, and dissolved in a toluene solvent at 60 ° C. to a concentration of 20% by weight to prepare a solution of the adhesive composition.

  This adhesive composition solution was applied as a release liner on a release treatment film made of a polyethylene terephthalate film having a thickness of 50 μm subjected to silicone release treatment in a 60 ° C. atmosphere, and then dried at 120 ° C. for 3 minutes. Thus, a layer of a thermosetting adhesive having a thickness of 50 μm was formed to prepare a reactive adhesive sheet.

Comparative Example 2
Ethylene-glycidyl methacrylate-methyl acrylate terpolymer (Sumitomo Chemical Co., Ltd., Bond First 7M), phenolic resin (Showa High Polymer Co., Ltd., Shonor BRG-555) and imidazole curing accelerator ( Shikoku Kasei Kogyo Co., Ltd., C ₁₁ Z) is blended so as to have the composition ratios shown in Table 1, and dissolved in a toluene solvent at room temperature so as to have a concentration of 20% by weight to prepare an adhesive composition solution. did.

  This adhesive composition solution was applied at room temperature onto a release film made of a polyethylene terephthalate film having a thickness of 50 μm and subjected to a silicone release treatment as a release liner, and then dried at 120 ° C. for 3 minutes to obtain a thickness. A reactive adhesive sheet was prepared by forming a thermosetting adhesive layer having a thickness of 50 μm.

  About the reactive adhesive sheet of said Examples 1-3 and Comparative Examples 1-2, the adhesive force test and the solder heat resistance test were done with the following method. These results are shown in Table 1.

<90 ° peel adhesive strength>
An adhesive sheet having a width of 10 mm and a length of 50 mm was adhered to a polyimide film having a thickness of 75 μm, and this was adhered to SUS (BA304). This sample was pressure-bonded under press conditions of 200 ° C. × 1 MPa × 1 second, cured for 2 hours by heat treatment in a hot air oven at 150 ° C., and then left for 30 minutes under atmospheric conditions of temperature 23 ° C. and humidity 65% RH. Under the atmospheric condition of 23 ° C., the film was pulled in the 90 ° direction at a pulling speed of 50 mm / min, and the center value was defined as 90 ° peel adhesive strength (N / cm).

<Solder heat resistance>
With the adhesive layer of the adhesive sheet, SUS (BA304) and a polyimide film (75 μm) were bonded together so that no air bubbles entered between them. A sample cut into 30 mm square is pressure-bonded under press conditions of 200 ° C. × 1 MPa × 1 second, cured by heat treatment at 150 ° C. for 2 hours, and then left in a humidified condition of 35 ° C./80% RH for 168 hours. Then, SUS (BA304) was turned up, and the treatment was performed for 60 seconds in a state where the solder bath melted at 260 ° C. was floated. Visually observe the bonded state of the sheet after processing, determine the presence of adhesive foaming and adhesion abnormality (floating, wrinkle, peeling, misalignment), ○: No change / abnormality, X: Change / abnormality, It was evaluated.

<Storage stability>
The adhesive sheet was stored in an atmosphere of −30 ° C. for 500 hours, and the segregation of the resin on the release liner surface and the layer separation state were visually observed. O: No change / abnormality, X: Evaluation of peeling liner with heavy peeling / segregation.

表１中、エチレン系共重合体（ａ）：エチレン−グリシジルメタクリレート−メチルアクリレート３元共重合体（住友化学工業（株）製，ボンドファースト７Ｍ，グリシジルメタクリレート含有量６重量％，メチルアクリレート３０重量％）であり、エチレン系共重合体（ｂ）：エチレン−メタクリル酸共重合体（三井・デュポンポリケミカル（株）製，ニュクレルＮ１５６０，メタクリル酸のモノマーユニット１５重量％含有）であり、ブロック共重合体（ｃ）：マレイン酸変性ブロック共重合体の水素化物（旭化成工業（株）製、タフテックＭ１９４３，芳香族ビニル化合物重合体ブロック（ｃ１）と共役ジエン系化合物重合体ブロック（ｃ２）の重量比が（ｃ１）／（ｃ２）＝２０／８０）であり、エポキシ樹脂（ジャパンエポキシレジン（株）製，エピコート８２８）であり、フェノール樹脂（昭和高分子（株）製，ショーノールＢＲＧ−５５５）であり、硬化促進剤：イミダゾール系硬化促進剤（四国化成工業（株）製、Ｃ₁₁Ｚ）である。

In Table 1, ethylene copolymer (a): ethylene-glycidyl methacrylate-methyl acrylate terpolymer (manufactured by Sumitomo Chemical Co., Ltd., Bond Fast 7M, glycidyl methacrylate content 6% by weight, methyl acrylate 30% by weight) Ethylene copolymer (b): an ethylene-methacrylic acid copolymer (Mitsui / Dupont Polychemical Co., Ltd., Nucrel N1560, containing 15% by weight of methacrylic acid monomer unit), and a block copolymer Polymer (c): hydride of maleic acid-modified block copolymer (Asahi Kasei Kogyo Co., Ltd., Tuftec M1943, aromatic vinyl compound polymer block (c1) and conjugated diene compound polymer block (c2) weight The ratio is (c1) / (c2) = 20/80) and epoxy resin (Japan Epoxy Res.) Co., Ltd., Epicoat 828), phenol resin (Showa High Polymer Co., Ltd., Shonor BRG-555), curing accelerator: imidazole-based curing accelerator (Shikoku Kasei Kogyo Co., Ltd.) C ₁₁ Z).

  As apparent from Table 1 above, each of the reactive adhesive sheets for fixing electronic components of Examples 1 to 3 of the present invention is excellent in adhesiveness and heat resistance. It is also excellent in storage stability. On the other hand, the adhesive sheet shown in the comparative example has insufficient heat resistance.

Claims (6)

An olefin copolymer having an epoxy group in the molecule (a), an olefin copolymer having a carboxyl group in the molecule (b) ,
The amount of the olefin copolymer (b) is, the olefin-based copolymer (a) with respect to 100 parts by weight, the electronic component fixing reactive adhesive, wherein 5 to 150 parts by weight of Der Rukoto Agent composition. Furthermore, it contains a block copolymer (c) having an aromatic vinyl compound polymer block (c1) and a conjugated diene compound polymer block (c2) ,
The weight ratio of the aromatic vinyl compound polymer block (c1) to the conjugated diene compound polymer block (c2) in the block copolymer (c) is (c1) / (c2) = 10/90 to 40/60. claim 1 Symbol mounting electronic component fixing reactive adhesive composition, characterized in der Rukoto. The amount of the block copolymer (c) used is 100 parts by weight or less based on 100 parts by weight of the total amount of the olefin copolymer (a) and the olefin copolymer (b). Item 3. A reactive adhesive composition for fixing an electronic component according to Item 2 . Furthermore, it contains an epoxy resin and its curing agent, and the total amount thereof is 200 parts by weight or less with respect to 100 parts by weight of the total amount of the olefin copolymer (a) and the olefin copolymer (b). The reactive adhesive composition for electronic component fixation in any one of Claims 1-3 . Electronic component fixing reactive adhesive composition according to any one of claims 1 to 4, characterized in that it further comprises a curing accelerator of an epoxy resin. A reactive adhesive sheet for fixing an electronic component, comprising an adhesive layer formed from the reactive adhesive composition for fixing an electronic component according to any one of claims 1 to 5 on one side or both sides of a substrate. .