JP4797027B2 - Substrate body sticking apparatus and substrate body handling method - Google Patents

Description

  The present invention relates to a substrate body sticking apparatus that handles a substrate made of a semiconductor wafer or the like and a substrate holder, and a substrate body handling method.

  Conventionally, when various types of processing are performed, handled, or transported on a semiconductor wafer in the semiconductor manufacturing process, the semiconductor wafer is mounted and supported on a fixed carrier (not shown) to damage the thin, brittle and easily broken semiconductor wafer. The method of preventing and suppressing is adopted.

Specific methods for mounting and supporting a semiconductor wafer on a fixed carrier include (1) a method of laminating and adhering a semiconductor wafer to a flexible fixed carrier while excluding air with a pressure roller or the like, and (2) a large vacuum chamber. In this method, the semiconductor wafer and the fixed carrier are arranged to face each other, and the fixed carrier is vacuum-adhered to the semiconductor wafer located below from above in a vacuum atmosphere (see Patent Documents 1 and 2).
JP 2005-333100 A JP 2003-255311 A

  However, in the case of the method (1), since a flexible fixed carrier that easily warps must be used, a great problem arises that rigidity cannot be imparted to the semiconductor wafer. In the case of the method (2), a large-scale facility is newly installed in the conventional line, a large vacuum chamber is prepared, or an electrostatic chuck apparatus having a complicated configuration for chucking a semiconductor wafer is evacuated. There is a problem that it must be installed indoors.

  The present invention has been made in view of the above, and can provide a substrate body sticking apparatus and a substrate body handling method that can ensure the rigidity of the substrate body and that does not require installation of large-scale equipment or the like. It is aimed.

In the present invention, in order to solve the above problems, the substrate body is handled by a handling mechanism between the supply stage and the sticking stage,
The supply stage includes a stage on which a substrate body is detachably mounted, a suction unit that is provided on the stage, communicates with the surface, and sucks the substrate body mounted on the surface by exhausting gas, and a stage. An ejection part that is provided and communicates with the surface and ejects gas from the surface;
The sticking stage includes a stage on which a substrate body is detachably mounted, a suction portion that is provided on the stage, communicates with the surface, and sucks the substrate body mounted on the surface by exhausting gas, and a stage An exhaust part provided on the surface and communicating with the surface,
The substrate body includes a substrate, and a substrate holder that removably holds the substrate on a deformable holding layer that covers a plurality of protrusions arranged in the recessed holes on the surface of the base material ,
The handling mechanism moves between the supply stage and the sticking stage, selectively touches and separates from these, and touches the stage surface of the sticking stage to form a sealed space therebetween. Provided on the surface and adsorbing the substrate body adsorbed on the surface by exhausting the gas, an exhaust portion provided on the hand and communicating with the surface, and provided on the hand and communicating with the surface A holding frame for forming a space between the hand and the stage surface of the sticking stage, and a substrate fitted into the holding frame in an airtight state. It consists of a slidable hand main body that comes into contact with the body, and this hand main body is provided with an adsorption part, an exhaust part and an ejection part, and the hand main body is separated from the sticking stage by a spring member. So as to bias in the direction of,
The substrate holder of the substrate body is provided with an exhaust hole communicating with the recessed hole of the base material, and the exhaust hole can communicate with the exhaust part of the handling mechanism.

In addition, the positioning material which surrounds the board | substrate body mounted can be provided in a supply stage.
Moreover, the sealing member for sealing can be attached to the surface of any one of the sticking stage and the hand of the handling mechanism.

Moreover, it is also possible to provide a plurality of holes serving as ejection portions at least at the peripheral edge of the surface of the hand body.

Moreover, in order to solve the said subject in this invention, it handles the board | substrate body using the board | substrate body sticking apparatus in any one of Claim 1 thru | or 4. It is characterized by the above-mentioned.

  Here, the supply stage, the sticking stage, and the handling mechanism in the claims can be provided or housed in the same casing, frame, or portable case. The supply stage and the sticking stage have a good relationship in which a single sticking stage is arranged on either the front, back, left or right of the supply stage, or a plurality of sticking stages are arranged side by side on the front, rear, left or right of the supply stage. The positioning material for the supply stage may or may not be an endless type peripheral wall or the like.

  The substrate of the substrate body includes at least various types of semiconductor wafers (diameters 200 mm, 300 mm, 450 mm), MEMS wafers, liquid crystal substrates, quartz glass substrates, and the like. The gas is mainly air, but may be nitrogen gas or the like. Further, the handling mechanism may be a type that operates in the XZ direction, a type that operates in the YZ direction, a type that operates in the XYZ direction, a multi-joint robot type, or the like.

  According to the present invention, by selectively handling the substrate forming the substrate body between the supply stage and the sticking stage, the substrate holder, or the substrate holder holding the substrate with the hand of the handling mechanism, A board | substrate can be conveyed to an adhesion | attachment stage, and a board | substrate and a board | substrate holder can be bonded together. Further, the substrate and the substrate holder can be dispensed from the apparatus.

According to the present invention, the rigidity of the substrate body can be ensured, and there is an effect that it is not necessary to install a large facility or the like. In addition, the handling mechanism moves between the supply stage and the sticking stage, selectively touches and separates from these, and contacts the stage surface of the sticking stage to form a sealed space therebetween, An adsorbing part that is provided in the hand and communicates with the surface and adsorbs the substrate body adsorbed on the surface by exhausting gas, an exhaust part that is provided on the hand and communicates with the surface, and an exhaust part provided on the hand A holding frame that is in contact with the stage surface of the sticking stage and forms a space therebetween, and is fitted in an airtight state on the holding frame. And a slidable hand main body that comes into contact with the substrate body. The hand main body is provided with a suction portion, an exhaust portion, and a jetting portion, and the hand main body is attached by a spring member. Energized in the direction away from the board, the board and board holder can be attached automatically, peeled off, peeled off and dispensed instead of manually, making the work smoother and more efficient , Speeding up can be achieved.
In addition, if a positioning member that surrounds the substrate body to be mounted is provided on the supply stage, the positioning member positions the substrate body, so that backlash and positional deviation in the front-rear and left-right directions of the substrate body can be suppressed.

  Moreover, if a sealing member for sealing is attached to either surface of the sticking stage or the hand of the handling mechanism, it can suppress the leakage of gas from between the sticking stage and the hand of the handling mechanism. In addition, the space between the sticking stage and the hand of the handling mechanism can be sealed, and the space between them can be easily reduced in pressure by the exhaust action of the exhaust part of the sticking stage.

  Furthermore, if a plurality of holes serving as ejection portions are provided at least at the peripheral edge of the surface of the hand body, gas is supplied to the substrate body to correct warpage of the substrate body, or the adsorption state between the hand body and the substrate body Can be released.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a substrate body sticking apparatus according to the present invention will be described with reference to the drawings. The substrate body sticking apparatus in this embodiment is portable as shown in FIGS. A supply stage 1, a bonding stage 10, and a handling mechanism 30 are built in a case, and a semiconductor wafer 21, a substrate holder 22, or a semiconductor wafer 21 that forms a substrate body 20 between the supply stage 1 and the bonding stage 10 The held substrate holder 22 is selectively handled by the hand 32 of the handling mechanism 30.

  As shown in FIGS. 1, 2, 4, and 5, the supply stage 1 and the sticking stage 10 are arranged in a line in the left and right lateral directions at intervals, and are aligned at substantially the same height. A handling mechanism 30 is installed behind. The supply stage 1 and the sticking stage 10 are both formed in a disk shape in plan view, and the supply stage 1 is formed with a smaller diameter than the sticking stage 10. In addition, the handling mechanism 30 is installed through a step portion so as to be positioned higher than the supply stage 1 and the sticking stage 10 and slides to the left and right and to the lower feed stage 1 or the sticking stage 10. Function to move up and down.

  As shown in FIGS. 1, 4 to 7, the supply stage 1 includes a stage 2 on which the substrate body 20 is mounted, and the substrate body 20 is placed on a flat surface in a concave portion recessed in a plane circle on the surface of the stage 2. A disc-shaped plate 3 is slidably mounted thereon, and a plurality of suction grooves 5 and ejection holes 6 are disposed on the plate 3. A plurality of frustoconical (three in this embodiment) positioning pins 4 that surround and position the substrate body 20 to be mounted are provided at predetermined intervals in the circumferential direction of the periphery of the stage 2 surface.

  The plurality of adsorption grooves 5 include a plurality of large and small ring grooves drawn in a plane circle around the center of the plate 3 surface, and a plurality of linear grooves extending radially outward from the center of the plate 3 surface. A plurality of recessed ring grooves and linear grooves are connected to a vacuum pump (not shown) through the flow passage of the stage 2, and the substrate body 20 mounted on the surface of the plate 3 by exhausting air accompanying the driving of the vacuum pump. It functions to adsorb vacuum.

  As shown in FIG. 6, the plurality of ejection holes 6 are composed of a large number of holes formed in the plate 3, and are connected to the blower 7 through the flow path of the stage 2. It functions to destroy and release the adsorption state of the substrate body 20 mounted on the surface of the plate 3 by pumping and jetting.

  As shown in FIGS. 4, 5, 8, and 9, the sticking stage 10 includes a stage 11 on which the substrate body 20 is mounted. A disc-shaped plate 12 on which the substrate body 20 is detachably mounted is fitted, and a plurality of suction grooves 15 are arranged on the surface of the plate 12.

  A plurality of exhaust ports 13 connected to a vacuum pump (not shown) via a switching valve are perforated in the stage 11 at predetermined intervals so as to be located outside the plate 12. A sealing O-ring 14 pressed against the hand 32 of the mechanism 30 is fitted through a fitting groove, and the O-ring 14 is positioned outside each exhaust port 13. Each exhaust port 13 is covered with the hand 32 when contacting the sticking stage 10 and the hand 32 of the handling mechanism 30 and functions to exhaust the air in the sealed space 33 partitioned by the hand 32 to the outside.

  The plurality of suction grooves 15 include a plurality of large and small ring grooves drawn in a plane circle around the center of the surface of the plate 12 and a plurality of linear grooves extending radially outward from the center of the surface of the plate 12. A plurality of recessed ring grooves and linear grooves are connected to a vacuum pump (not shown) through a flow passage of the stage 11 together with a switching valve, and are mounted on the surface of the plate 12 by exhausting air accompanying the driving of the vacuum pump. The substrate body 20 is vacuum-sucked.

  As shown in FIG. 3, the substrate body 20 has a deformable holding layer 26 that covers a thin and brittle semiconductor wafer 21 having a diameter of 200 mm or 300 mm and a plurality of protrusions 25 arranged in the recessed holes 24 on the surface of the base material 23. And a substrate holder 22 for detachably holding the semiconductor wafer 21. The semiconductor wafer 21 is of a silicon wafer type, and is diced by grooving the surface with a predetermined thickness from the viewpoint of thin processing.

  As shown in FIG. 3, the substrate holder 22 includes a thin base 23, and a flat circular recess 24 is formed in the flat surface of the base 23, and a plurality of protrusions 25 are formed therein. An elastically deformable holding layer 26 that covers the recessed holes 24 and the plurality of protrusions 25 is bonded to the peripheral edge of the surface of the base material 23. The base material 23 of the substrate holder 22 is formed in a flat circular shape using PC, PP, PE, aluminum alloy, magnesium alloy, glass, etc. having excellent rigidity, and the exhaust hole 27 communicating with the recess hole 24 is in the thickness direction. A vacuum pump is detachably connected to the exhaust hole 27 via a switching valve.

  The plurality of protrusions 25 are arranged in parallel at intervals, and each protrusion 25 is formed in a columnar shape or a truncated cone shape. A holding layer 26 is bonded to the flat upper surface of the protrusion 25. The holding layer 26 is formed into a flat circular shape using a predetermined thin elastomer (for example, a silicone-based, urethane-based, olefin-based, or fluorine-based elastomer), and is in close contact with the semiconductor wafer 21 in a flat state. Based on the driving of the pump, the protrusions 25 are deformed according to the plurality of protrusions 25 to release the contact state with the semiconductor wafer 21.

  As shown in FIGS. 1, 2, 10, and 11, the handling mechanism 30 slides horizontally between the supply stage 1 and the sticking stage 10 via an actuator 31, and the supply stage 1 or the sticking stage. 10 is provided, and the hand 32 contacts the surface of the stage 11 of the sticking stage 10 to form a sealed space 33 therebetween.

  The hand 32 is fitted into the holding frame 34 in an airtight state, and a hollow dish-shaped holding frame 34 that forms a sealed space 33 while contacting the O-ring 14 of the sticking stage 10 and including the exhaust port 13. The slidable flat circular hand main body 35 is in contact with the substrate body 20. The hand main body 35 is provided with an adsorption groove 39, an exhaust groove 40, and an ejection hole 41. A sealing O-ring 36 is press-fitted and fitted between the holding frame 34 and the hand main body 35.

  A plurality of coil springs 37 that support the hand main body 35 are attached to the holding frame 34, and the plurality of coil springs 37 elastically bias the direction in which the hand main body 35 is separated from the sticking stage 10, in other words, upward. . Further, the hand main body 35 is supported by the holding frame 34 in such a size and height that it does not come into contact with the sticking stage 10 when the O-ring 14 of the sticking stage 10 and the peripheral portion of the holding frame 34 are in contact. A flat circular recess is formed on the surface of the hand main body 35, and a disc-shaped plate 38 that detachably holds the substrate body 20 is fitted on the flat surface. A plurality of suction grooves 39 are disposed on the surface of 38.

  As shown in FIG. 11, the suction groove 39 includes a plurality of large and small ring grooves drawn in a plane circle around the center of the plate 38 surface, and a plurality of linear grooves extending radially outward from the center of the plate 38 surface. A plurality of these recessed ring grooves and linear grooves are connected to a vacuum pump (not shown) through a flow passage together with a switching valve, and a substrate is formed on the surface of the plate 38 by exhausting air when the vacuum pump is driven. The body 20 is vacuum-adsorbed.

  The exhaust groove 40 is drawn in a circular plane around the center of the surface of the plate 38, and is connected to a vacuum pump (not shown) together with a switching valve via a flow path, and is connected to the exhaust hole 27 of the base material 23 of the substrate holder 22. Communicate. Such an exhaust groove 40 communicates with the exhaust hole 27 of the substrate holder 22, and then deforms the holding layer 26 of the substrate holder 22 into irregularities by exhausting air accompanying the driving of the vacuum pump. It functions to release the close contact with the holder 22.

  A plurality of ejection holes 41 are perforated in the circumferential direction of the peripheral edge of the surface of the plate 38 and connected to the blower 7 through the flow passage of the hand main body 35. Air is pumped and ejected as the blower 7 is driven. Thus, the warp of the semiconductor wafer 21 on the supply stage 1 is corrected to prevent inappropriate collision, and the function of destroying / releasing the suction state of the substrate holder 22 held by the hand body 35 is functioned.

  In the above, when the semiconductor wafer 21 mounted on the supply stage 1 is transported to the adhering stage 10, first, the handling mechanism 30 waiting on the adhering stage 10 slides horizontally on the supply stage 1. Then, the hand 32 of the handling mechanism 30 is lowered onto the semiconductor wafer 21 on the supply stage 1 (see FIG. 14).

  At this time, air is exhausted from the suction groove 5 covered with the semiconductor wafer 21 on the supply stage 1, and the semiconductor wafer 21 is vacuum-sucked on the supply stage 1 so as not to be displaced. At the same time, when air blows out from the ejection hole 41 of the hand 32 toward the peripheral edge of the semiconductor wafer 21 facing, the warpage of the semiconductor wafer 21 due to the ejection of this air is corrected and flattened. The

  Next, the hand 32 of the handling mechanism 30 descends and comes into contact with the semiconductor wafer 21 of the supply stage 1, and air is ejected from the ejection holes 6 of the plate 3 to destroy and release the adsorbed state of the semiconductor wafer 21. Air is exhausted from the suction groove 39 covered with the wafer 21, and the semiconductor wafer 21 is vacuum-sucked to the hand 32 so as not to be displaced (see FIG. 15).

  When the semiconductor wafer 21 is vacuum-sucked by the hand 32 in this manner, the handling mechanism 30 rises from the supply stage 1 and slides to the sticking stage 10 while maintaining this vacuum sucking state. The hand 32 is lowered (see FIG. 16).

  Next, air is exhausted from the suction groove 15 covered with the semiconductor wafer 21 of the sticking stage 10, so that the semiconductor wafer 21 is vacuum-sucked on the sticking stage 10 so that the semiconductor wafer 21 is not displaced. Air is ejected toward the semiconductor wafer 21, and the suction state of the hand 32 and the semiconductor wafer 21 is broken and released by the ejection of this air (see FIG. 17). Thereafter, the hand 32 of the handling mechanism 30 is lifted from the sticking stage 10, whereby the semiconductor wafer 21 is transferred from the supply stage 1 to the sticking stage 10 (see FIG. 18).

  Next, when holding the semiconductor wafer 21 on the substrate holder 22, first, the substrate holder 22 is set on the supply stage 1, the holding layer 26 is opposed to the plate 3, and the substrate stage 22 is placed on the bonding stage 10. A semiconductor wafer 21 is mounted. At this time, air is ejected from the ejection holes 6 of the plate 3 to slightly lift the substrate holder 22, and the adhesion between the plate 3 and the holding layer 26 of the substrate holder 22 is avoided. At the same time, air is exhausted from the suction groove 15 covered with the semiconductor wafer 21 of the bonding stage 10, and vacuum suction is performed on the bonding stage 10 so that the semiconductor wafer 21 is not displaced (see FIG. 19).

  Next, the handling mechanism 30 waiting on the sticking stage 10 slides horizontally on the supply stage 1, and the hand 32 of the handling mechanism 30 descends to the substrate holder 22 on the supply stage 1 (see FIG. 20). . When the hand 32 is lowered to the substrate holder 22 in this way, the hand 32 comes into contact with the base material 23 of the substrate holder 22, air is exhausted from the suction groove 39 covered with the base material 23 of the hand 32, and the substrate is transferred to the hand 32. The holder 22 is vacuum-sucked so as not to be displaced (see FIG. 21).

  Next, the handling mechanism 30 rises from the supply stage 1 while maintaining the vacuum suction state and slides to the sticking stage 10 (see FIG. 22), and the hand 32 of the handling mechanism 30 moves down to the sticking stage 10, and the semiconductor wafer. The hand 32 stops descending with a gap between the substrate 21 and the substrate holder 22, and the air in the sealed space 33 in which the exhaust port 13 of the sticking stage 10 is partitioned at the peripheral edge of the hand 32 is exposed to the outside. It exhausts (refer FIG. 23).

  When the exhaust port 13 of the sticking stage 10 exhausts air to the outside, the hand main body 35 descends while maintaining an airtight state from the holding frame 34 that is in contact with the sticking stage 10 due to the negative pressure due to the exhaust, and exhausts. Due to the balance between the suction force of the vacuum pump and the spring force of the coil spring 37, the semiconductor wafer 21 and the flat holding layer 26 of the substrate holder 22 are in close contact with each other (see FIG. 24).

  Next, the hand 32 of the handling mechanism 30 ascends from the sticking stage 10 and slides toward the supply stage 1 (see FIG. 25), and the hand 32 descends to the supply stage 1 and is held by the substrate holder 22. 21 is arranged, air is exhausted from the suction groove 5 covered with the semiconductor wafer 21 of the supply stage 1, and vacuum suction is performed on the supply stage 1 so that the semiconductor wafer 21 is not displaced (see FIG. 26). At the same time, air is ejected from the ejection hole 41 of the hand 32 toward the peripheral edge of the back surface of the substrate holder 22, and the ejection state of the hand 32 and the substrate holder 22 is destroyed and released by the ejection of this air (FIG. 26). reference).

  After that, the hand 32 of the handling mechanism 30 ascends from the supply stage 1 and slides in the direction of the sticking stage 10, so that the semiconductor wafer 21 is held by the substrate holder 22, and these 21 and 22 are placed on the supply stage 1. It can be mounted (see FIG. 27).

  Next, when paying out the substrate holder 22, first, the substrate holder 22 holding the semiconductor wafer 21 is set on the supply stage 1 (see FIG. 28), and is waiting on the bonding stage 10. The handling mechanism 30 slides horizontally on the supply stage 1, and the hand 32 of the handling mechanism 30 descends to the substrate holder 22 on the supply stage 1 (see FIG. 29).

  When the hand 32 descends to the substrate holder 22, the hand 32 comes into contact with the base material 23 of the substrate holder 22, and air is ejected from the ejection holes 6 of the plate 3 to release the suction state of the semiconductor wafer 21. At the same time, air is exhausted from the suction groove 39 covered with the base material 23 of the hand 32, and the substrate holder 22 is vacuum-sucked to the hand 32.

  Next, the handling mechanism 30 rises from the supply stage 1 while sliding in the vacuum suction state and slides to the sticking stage 10 (see FIG. 30), and the hand 32 of the handling mechanism 30 moves down to the sticking stage 10 and the semiconductor wafer. 21 and the air is exhausted from the exhaust groove 40 of the hand 32 to deform the holding layer 26 of the substrate holder 22 into irregularities, thereby releasing the contact state between the semiconductor wafer 21 and the holding layer 26 (FIG. 31). At the same time, air is exhausted from the suction groove 15 covered with the semiconductor wafer 21 of the sticking stage 10, and the semiconductor wafer 21 is vacuum sucked onto the sticking stage 10.

  Next, the hand 32 of the handling mechanism 30 that vacuum-adsorbs the substrate holder 22 from the sticking stage 10 is raised and slides toward the supply stage 1 (see FIG. 32), and the hand 32 is lowered to the supply stage 1 and the plate 3 A state is formed in which air is ejected from the ejection holes 6 to slightly float the substrate holder 22 (see FIG. 33).

  At the same time, air is ejected from the ejection hole 41 of the hand 32 toward the substrate holder 22, and the suction state of the hand 32 and the substrate holder 22 is released by this ejection of air, and the substrate holder 22 is set on the supply stage 1. Thereafter, the substrate holder 22 is manually removed from the supply stage 1. Then, the hand 32 ascends from the supply stage 1 and slides in the direction of the sticking stage 10 to complete the dispensing of the substrate holder 22 (see FIG. 34).

  Next, when paying out the semiconductor wafer 21, the semiconductor wafer 21 is mounted on the sticking stage 10, the hand 32 of the handling mechanism 30 is lowered onto the sticking stage 10 (see FIG. 35), and the sticking stage 10. The air exhaust port 13 exhausts the air in the sealed space 33 defined by the hand 32 to the outside. When the exhaust port 13 exhausts the air to the outside, the suction force of the vacuum pump that exhausts the hand main body 35 while maintaining the airtight state from the holding frame 34 that is in contact with the adhering stage 10 with the negative pressure due to the exhaust. The semiconductor wafer 21 and the hand 32 come into close contact with each other due to the balance between the spring force of the coil spring 37 and the coil spring 37.

  Next, the hand 32 of the handling mechanism 30 ascends from the sticking stage 10 and slides toward the supply stage 1, the hand 32 descends to the supply stage 1, and the semiconductor wafer 21 is arranged on the supply stage 1. Air is exhausted from the covered suction groove 5, and the semiconductor wafer 21 is vacuum-sucked to the supply stage 1. At the same time, air is ejected from the ejection hole 41 of the hand 32 toward the peripheral edge of the semiconductor wafer 21, and the suction state of the hand 32 and the semiconductor wafer 21 is released by this ejection of air.

  Then, the hand 32 of the handling mechanism 30 rises from the supply stage 1 and slides in the direction of the sticking stage 10, whereby the semiconductor wafer 21 is mounted on the supply stage 1 and the semiconductor wafer 21 can be dispensed. .

  According to the above configuration, since the rigid substrate holder 22 is used, it is not necessary to use any flexible fixed carrier that easily warps, and the semiconductor wafer 21 can be easily given rigidity to perform various processing. Can be handled, transported, etc. In addition, it is not necessary to newly install large-scale equipment in the conventional line, to prepare a large vacuum chamber, or to install an electrostatic chuck device having a complicated configuration for chucking the semiconductor wafer 21 in the vacuum chamber. The configuration can be simplified.

  In addition, since the semiconductor wafer 21 and the substrate holder 22 can be automatically bonded, peeled off or peeled off instead of manually, the work can be performed smoothly, efficiently, and quickly. It becomes possible. Further, since air is ejected from the ejection holes 6 of the plate 3 and the substrate holder 22 is floated substantially horizontally, it is possible to effectively suppress and prevent interruption of work due to the close contact between the plate 3 and the substrate holder 22. become.

  In addition, the supply stage 1 of the said embodiment, the sticking stage 10, and the vacuum pump of the handling mechanism 30 may be the same, and a separate separate body may be sufficient as it. Further, the supply stage 1 and the blower 7 of the handling mechanism 30 may be the same or may be separate dedicated bodies. If the same effect can be expected, the plate 3 and the plates 12 and 38 may be formed using porous ceramic, aluminum, or the like.

It is a plane explanatory view showing typically an embodiment of a pasting device of a substrate body concerning the present invention. It is front explanatory drawing which shows typically embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is explanatory drawing which shows typically the semiconductor wafer and board | substrate holder in embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is explanatory drawing which shows typically the supply stage, sticking stage, and handling mechanism in embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is a plane explanatory view showing typically the supply stage in the embodiment of the pasting device of the substrate object concerning the present invention, the pasting stage, and the handling mechanism. It is a plane explanatory view showing typically the supply stage in the embodiment of the pasting device of the substrate object concerning the present invention. It is front explanatory drawing which shows typically the supply stage in embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is a plane explanatory view showing typically the sticking stage in the embodiment of the sticking device of the substrate object concerning the present invention. It is front explanatory drawing which shows typically the sticking stage in embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is front explanatory drawing which shows typically the handling mechanism in embodiment of the sticking apparatus of the board | substrate body which concerns on this invention. It is a plane explanatory view showing typically the handling mechanism in the embodiment of the pasting device of the substrate object concerning the present invention. It is explanatory drawing which shows typically the state in which the handling mechanism is waiting on the sticking stage in embodiment of the handling method of the board | substrate body which concerns on this invention. It is explanatory drawing which shows typically the state which the handling mechanism of FIG. 12 slides on a supply stage. It is explanatory drawing which shows typically the state which the hand of a handling mechanism descends to the semiconductor wafer on the supply stage of FIG. It is explanatory drawing which shows typically the state by which a semiconductor wafer is adsorb | sucked to the hand of the handling mechanism of FIG. It is explanatory drawing which shows typically the state which the handling mechanism of FIG. 15 raises from a supply stage, and slides to a sticking stage. It is explanatory drawing which shows typically the state which the hand of a handling mechanism descends to the sticking stage of FIG. It is explanatory drawing which shows typically the state which the hand of a handling mechanism raises from the sticking stage of FIG. It is explanatory drawing which shows typically the initial state which makes a substrate holder hold | maintain the semiconductor wafer in embodiment of the handling method of the board | substrate body concerning this invention. It is explanatory drawing which shows typically the state which the hand of a handling mechanism descends to the board | substrate holder on the supply stage of FIG. It is explanatory drawing which shows typically the state by which a board | substrate holder is adsorb | sucked to the hand of FIG. It is explanatory drawing which shows typically the state which the handling mechanism of FIG. 21 raises from a supply stage, and slides to a sticking stage. It is explanatory drawing which shows typically the state which exhausts the air of the sealed space where the exhaust port of the sticking stage of FIG. 22 is divided by the hand outside. It is explanatory drawing which shows typically the state which the semiconductor wafer of FIG. 23 and the holding layer of a substrate holder contact | adhere. It is explanatory drawing which shows typically the state which the hand of a handling mechanism raises from the sticking stage of FIG. 24, and slides in a supply stage direction. It is explanatory drawing which shows typically the state by which a semiconductor wafer is adsorbed | sucked to the supply stage of FIG. It is explanatory drawing which shows typically the state which mounted the semiconductor wafer and substrate holder of FIG. 26 on the supply stage. It is explanatory drawing which shows typically the state which set the board | substrate holder holding the semiconductor wafer on the supply stage in embodiment of the handling method of the board | substrate body concerning this invention. It is explanatory drawing which shows typically the state which the hand of a handling mechanism descends to the board | substrate holder on the supply stage of FIG. It is explanatory drawing which shows typically the state which the handling mechanism of FIG. 29 raises from a supply stage, and slides to a sticking stage. FIG. 31 is an explanatory view schematically showing a state in which the close contact state between the semiconductor wafer of FIG. 30 and the holding layer of the substrate holder is released. It is explanatory drawing which shows typically the state which the hand of the handling mechanism which adsorb | sucked the board | substrate holder from the sticking stage of FIG. 31 raises, and slides in a supply stage direction. It is explanatory drawing which shows typically the state which air ejects from the ejection hole of the plate of FIG. 32, and raises a board | substrate holder. It is explanatory drawing which shows typically the discharge completion state of the board | substrate holder in embodiment of the handling method of the board | substrate body concerning this invention. It is explanatory drawing which shows typically the discharge | payout start state of the semiconductor wafer in embodiment of the handling method of the board | substrate body concerning this invention.

Explanation of symbols

1 Supply stage 2 Stage 3 Plate 4 Positioning pin (Positioning material)
5 Suction groove (Suction part)
6 Ejection hole (Ejection part)
7 Blower 10 Adhesion stage 11 Stage 12 Plate 13 Exhaust port 14 O-ring (seal member)
15 Suction groove (Suction part)
20 Substrate body 21 Semiconductor wafer (substrate)
22 Substrate holder 23 Base material 24 Recess hole 25 Protrusion 26 Retention layer 27 Exhaust hole 30 Handling mechanism 32 Hand 33 Sealing space 34 Holding frame 35 Hand body 36 O-ring 37 Coil spring (spring member)
38 Plate 39 Suction groove (Suction part)
40 Exhaust groove (exhaust section)
41 Spout hole (spout part)

Claims (5)

A substrate body sticking device that handles a substrate body between a supply stage and a pasting stage by a handling mechanism,
The supply stage includes a stage on which a substrate body is detachably mounted, a suction unit that is provided on the stage, communicates with the surface, and sucks the substrate body mounted on the surface by exhausting gas, and a stage. An ejection part that is provided and communicates with the surface and ejects gas from the surface;
The sticking stage includes a stage on which a substrate body is detachably mounted, a suction portion that is provided on the stage, communicates with the surface, and sucks the substrate body mounted on the surface by exhausting gas, and a stage An exhaust part provided on the surface and communicating with the surface,
The substrate body includes a substrate, and a substrate holder that removably holds the substrate on a deformable holding layer that covers a plurality of protrusions arranged in the recessed holes on the surface of the base material ,
The handling mechanism moves between the supply stage and the sticking stage, selectively touches and separates from these, and touches the stage surface of the sticking stage to form a sealed space therebetween. Provided on the surface and adsorbing the substrate body adsorbed on the surface by exhausting the gas, an exhaust portion provided on the hand and communicating with the surface, and provided on the hand and communicating with the surface A holding frame for forming a space between the hand and the stage surface of the sticking stage, and a substrate fitted into the holding frame in an airtight state. It consists of a slidable hand main body that comes into contact with the body, and this hand main body is provided with an adsorption part, an exhaust part and an ejection part, and the hand main body is separated from the sticking stage by a spring member. So as to bias in the direction of,
An apparatus for adhering a substrate body, wherein an exhaust hole communicating with a recessed hole of a base material is provided in a substrate holder of the substrate body, and the exhaust hole can communicate with an exhaust portion of a handling mechanism.   The substrate body sticking apparatus according to claim 1, wherein a positioning member surrounding the substrate body to be mounted is provided on the supply stage.   The apparatus for adhering a substrate body according to claim 1 or 2, wherein a sealing member for sealing is attached to one surface of either the adhering stage or the hand of the handling mechanism. The substrate body sticking apparatus according to claim 1, wherein a plurality of holes serving as ejection portions are provided at least at a peripheral edge of the surface of the hand body. 5. A substrate body handling method, wherein the substrate body is handled using the substrate body sticking apparatus according to claim 1 .

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