JP4794599B2 - Plating equipment - Google Patents

Description

  The present invention relates to a plating apparatus. More specifically, the present invention relates to a plating apparatus capable of obtaining a uniform plating thickness during electrolytic plating.

  Electrolytic plating is used not only for metallic decorations and surface protection, but also in various fields such as circuit formation of electronic components, printed circuit boards, and semiconductor elements.

  In electroplating, an object to be plated is put into a plating solution, and the object to be plated is used as a cathode, and a metal to be electrodeposition is used as an anode to supply electricity. Then, a desired metal ion is deposited on the surface of the object to be plated to form a plating film. If the object to be plated has conductivity, it is possible to plate the object to be plated directly as a cathode. However, if the object to be plated is made of an insulating material such as a circuit board, electrolytic plating is performed on the insulating material through electroless chemical plating. A plating layer is formed by forming a seed layer to be an electrode and performing electrolytic plating using the seed layer as an electrode.

  FIG. 5 is a plan view showing a plating apparatus according to the prior art, and FIG. 6 is a use state diagram of the plating apparatus according to the prior art. Referring to FIGS. 5 and 6, when plating is performed on a plurality of substrates 108 in which one side of each substrate 108 is linearly arranged and inserted, a jig 106 (jig) for fixing the plurality of substrates 108 arranged linearly is used. The substrate 108 is plated by arranging the anode 104 linearly so as to face each of both surfaces of the substrate 108 arranged in the center of the plating tank 102. In this case, the metal to be electrodeposited on the plated surface of the substrate 108 becomes the anode 104, and the substrate 108 becomes the cathode. When the substrate 108 is made of a conductive metal, it can be used directly as a cathode. However, when the substrate 108 is an insulating substrate 108, a conductive seed layer that becomes an electrode for electrolytic plating is previously formed on the plating surface of the substrate 108. Once formed, this is used as the cathode.

  However, in the plating apparatus according to the prior art, as shown in FIG. 6, when a large number of substrates 108 are simultaneously plated by simultaneously putting a plurality of linearly arranged substrates 108 into the plating tank 102, the anode 104 is also a substrate. Since the metal ions 110 released from the anode 104 influence the substrate 108 facing the anode 104 adjacent to the anode, the plating thickness at the time of designing the substrate is arranged. Therefore, there is a problem that a plating deviation occurs.

  In particular, since the plating current tends to be concentrated on the end portion of the substrate 108, the metal ions 110 released from the anode 104 are concentrated on the end portion of the substrate 108 facing the anode 104 adjacent to the anode. As a result, there is a problem that a large plating deviation occurs and a uniform plating thickness cannot be obtained.

  Such plating deviations cause chronic defects such as deterioration of circuit board electrical characteristics and separation of solder balls, etc. Recently, electronic components have recently become smaller and highly integrated. As the circuit board becomes finer, a fine circuit is required in the circuit board. However, there is a problem that it is difficult to manufacture a precise circuit board due to such a plating deviation.

  In view of the problems of the prior art, when the present invention is to collectively plate a plurality of substrates, the metal ions released from the anode are made to be plated in an independent plating region. It is an object of the present invention to provide a plating apparatus that can prevent reaching a substrate facing the anode adjacent to the anode and obtain a uniform plating thickness.

  According to an embodiment of the present invention, in an apparatus for collectively plating a plurality of substrates, a plating tank into which the plurality of substrates are placed, an anode coupled to face each of the plating surfaces of the plurality of substrates, There is provided a plating apparatus including a separation partition that partitions a plating tank so that a plurality of substrates are isolated from each other.

  Meanwhile, it may further include a magnet coupled adjacent to both sides of the anode. In addition, it may further include a shielding plate interposed between the anode and the substrate facing the anode and having an opening formed on the facing surface of the substrate. In the case where the plurality of substrates are placed in parallel so that the surfaces of the substrates face each other, the separation partition walls can be positioned between adjacent substrates. Further, the separation partition wall may be made of an insulating material.

  The anode can include an anode basket into which the plating metal is charged. In this case, the plating metal can include at least one selected from the group consisting of copper, nickel, tin, silver, platinum, gold, and zinc. In addition, the anode can be positioned so as to face both surfaces of the substrate.

  By plating a plurality of substrates in independent plating regions, metal ions released from the anode can be prevented from reaching the substrate facing the anode adjacent to the anode. Thus, a uniform plating thickness is obtained, the reliability of plating is improved, and a high-quality plated product can be produced.

  Since the present invention can be modified in various ways and have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not to be construed as limiting the invention to the specific embodiments, but is to be understood as including all transformations, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the present invention, when it is determined that the specific description of the known technology is not clear, the detailed description thereof will be omitted.

  The terms used in the present application are merely used to describe particular embodiments, and are not intended to limit the present invention. A singular expression includes the plural expression unless it is explicitly expressed in a sentence. In this application, terms such as “comprising” or “having” specify the presence of a feature, number, step, action, component, part, or combination thereof as described in the specification, It should be understood that this does not pre-exclude the existence or additionality of one or more other features or numbers, steps, actions, components, parts, or combinations thereof.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same and corresponding components are denoted by the same reference numerals. The duplicate explanation for is omitted.

  1 is a perspective view illustrating a plating apparatus according to an embodiment of the present invention, FIG. 2 is a plan view illustrating a plating apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is a use condition figure of the plating apparatus by. 1-3, the plating tank 12, the anode basket 14, the plating metal 16, the anode 18, the metal ion 19, the separation partition 20, the opening part 22, the shielding plate 24, the jig 26, and the board | substrate 28 are shown. .

  The plating apparatus according to this embodiment is an apparatus for collectively plating a plurality of substrates 28, and is coupled so that the plating tank 12 into which the plurality of substrates 28 are placed and the plating surfaces of the plurality of substrates 28 face each other. And a separation partition wall 20 that partitions the plating tank 12 so that the plurality of substrates 28 are isolated from each other so that each of the plurality of substrates 28 is plated in an independent plating region. By doing so, it becomes possible to prevent the metal ions 19 released from the anode 18 from reaching the substrate 28 facing the anode 18 adjacent to the anode 18, and a uniform plating thickness can be obtained. The reliability of plating is improved, and high quality plating products can be produced.

  The plating tank 12 contains a plating solution necessary for plating, and has a size that allows a plurality of substrates 28 to be put together. Here, the board | substrate 28 means not only the insulator in which a circuit is formed but the to-be-plated body of plate forms, such as the steel plate by which galvanization is performed, and a silicone wafer.

  The plating tank 12 can include a nozzle (not shown) for injecting a plating solution, and the plating solution can be prevented from being stagnated by the plating solution being injected from the nozzle. Further, the plating solution can be recirculated by overflowing from the plating tank 12 or flowing out by suction.

  The anode 18 is coupled to face each of the plurality of substrates 28 so that the metal ions 19 released from the plating metal 16 of the anode 18 can be easily electrodeposited onto the cathode substrate 28. The anode 18 may be composed of an anode basket 14 and a plated metal 16 that is put into the anode basket 14. The anode basket 14 is in the form of a porous mesh that allows the metal ions 19 released from the plated metal 16 to easily flow out. The plated metal 16 can be made in the form of a ball and loaded into the anode basket 14. The plated metal 16 is a metal to be electrodeposited on the substrate 28, and the plated metal 16 can be an alloy as well as a pure metal. The plated metal 16 can include at least one selected from the group consisting of copper, nickel, tin, silver, platinum, gold, and zinc. Each of copper, nickel, tin, silver, platinum, gold, and zinc can be plated as the plating metal 16, and these alloys can be used as the plating metal 16. For example, when a circuit is to be formed using copper (Cu) for the substrate 28, a copper ball can be used as the plated metal 16. In addition, when zinc is to be plated on a steel plate, zinc can be used as the plating metal 16. Further, brass which is an alloy of copper and zinc can be used as the plating metal 16.

  On the other hand, when both surfaces of the substrate 28 are to be plated simultaneously in one plating tank 12, the anode 18 can be positioned opposite to both surfaces of the substrate 28 as shown in FIG.

  When electricity is applied by connecting the anode 18 and the cathode to a rectifier, the plating metal 16 is electrolyzed, the metal ions 19 of the plating metal 16 of the anode 18 are released into the plating solution, and the electrons are passed through the rectifier to the cathode. Move to. The metal ions 19 liberated by the plating solution are combined with the transferred electrons and the surface of the cathode substrate 28 to be plated.

  The separation partition 20 partitions the plating tank 12 so that the plurality of substrates 28 are isolated from each other. Each substrate 28 is provided with a corresponding anode 18, and metal ions 19 for plating the substrate 28 opposed thereto are released from the anode 18. However, when each anode 18 and each substrate 28 are adjacent to each other as in the prior art, the metal ions 19 released from the anode 18 are transferred to the substrate 28 facing the anode 18 adjacent to the anode 18. There is a risk of causing plating deviations. In particular, since the plating current tends to concentrate at the end of the substrate 28, the metal ions 19 released from the anode 18 are concentrated on the end of the substrate 28 facing the anode 18 adjacent to the anode. Electrodeposition causes a large plating deviation, and a uniform plating thickness cannot be obtained.

  Therefore, according to the present embodiment, each of the plurality of substrates 28 is isolated so that each substrate 28 is plated in an independent plating region, and from the anode 18 that exists for plating of the other substrate 28. By preventing the liberated metal ions 19 from reaching, the substrate 28 has a uniform plating thickness. That is, each of the plurality of substrates 28 corresponds to the anode 18 facing it, and the metal ions 19 released from the anode 18 corresponding to each substrate 28 are electrodeposited on the facing substrate 28. Therefore, a uniform plating thickness at the time of design can be obtained.

  As shown in FIG. 2, when a plurality of substrates 28 are input in parallel so that one surface faces each other, the separation partition wall 20 can be positioned between adjacent substrates 28.

  Further, the separation partition wall 20 is isolated so that each substrate 28 is plated independently in the plating processing region, or as shown in FIG. 2, a plating solution is provided between the plating processing regions of the substrate 28 in the plating tank 12. Can be moved away from both wall surfaces of the plating tank 12 by a certain distance.

  That is, isolating each of the plurality of substrates 28 means that each substrate 28 is completely isolated independently so that the plating solution is not moved, or the plating solution can flow in the plating tank 12. This means that the plating region of each substrate 28 is partitioned in isolation.

  On the other hand, as shown in FIG. 2, the separation partition 20 is installed so that the plating solution flows in the plating tank 12, so that there is no movement of the metal ions 19 between the plating regions of each substrate 28. It does not mean that. The metal ions 19 are liberated by the plating solution unless plating is performed so that the plating solution cannot move by separating the substrates 28 completely and independently by the separating partition 20 between the plating regions of each substrate 28. Therefore, the arrival of the metal ions 19 cannot be completely eliminated.

  Accordingly, the plating region minimizes the movement of the metal ions 19 released from the anode 18 in one plating region to another plating region, and the plating thickness of the substrate 28 in the other plating region. This means a region plated to such an extent that no deviation occurs.

  In the present embodiment, the separation partition wall 20 is installed at a certain distance from both wall surfaces of the plating tank 12 so that the plating solution can flow in the plating tank 12.

  FIG. 3 shows that the metal ions 19 released from the anode 18 are electrodeposited on the substrate 28 when the separation partition 20 is installed. Referring to FIG. 3, most of the metal ions 19 released from the anodes 18 in the respective plating regions do not reach the substrate 28 in the adjacent plating region because of the separating partition 20, and face each anode 18. It can be seen that the substrate 28 is effectively reached and the plating thickness of the substrate 28 is formed uniformly.

  The separation barrier 20 may be made of an insulating material. When the separation partition 20 is made of a conductive metal material, there is a possibility that the plating may be affected by energization. Therefore, the separation partition 20 is preferably made of an insulating material having no electrical conductivity.

  The shielding plate 24 is interposed between the anode 18 and the substrate 28 facing the anode 18, and an opening 22 is formed on the surface facing the substrate 28. As described above, the concentration of the plating current is likely to occur at the end portion of the substrate 28. Therefore, the metal ions 19 released from the anode 18 are intensively electrodeposited on the end portion of the substrate 28, and the uniform plating thickness is obtained. You will not be able to get. Therefore, the shielding plate 24 in which the opening 22 is formed is installed between the anode 18 and the substrate 28 facing it, so that the metal ions 19 released from the anode 18 are concentrated on the end of the substrate 28. By relaxing, the plating thickness can be made uniform. That is, since the metal ions 19 released from the anode 18 reach the substrate 28 which is a cathode through the opening 22, the size of the opening 22 is adjusted to concentrate the metal ions 19 on the end of the substrate 28. By preventing the arrival, a uniform plating thickness can be obtained.

  In consideration of convenience of transportation of the substrate 28, the jig 26 (jig) is mounted so that the plurality of substrates 28 can be easily transported. If the jig 26 is made of a conductive material and is electrically connected to the substrate 28, a cathode can be connected to the jig 26 to make it a cathode.

  FIG. 4 is a plan view showing a plating apparatus according to another embodiment of the present invention. Referring to FIG. 4, the plating tank 12, the anode 18, the separation partition 20, the opening 22, the shielding plate 24, the substrate 28, and the magnet 30 are shown.

  In this embodiment, the metal ions 19 released from the anode 18 in each plating region are prevented from being moved to other plating regions, and the metal ions 19 released from the anode 18 are opposed to each other. By being guided to the substrate 28, the plating thickness is made uniform.

  Here, the description of the same components as those of the above-described embodiment will be omitted, and components different from those of the embodiment will be mainly described.

  In the present embodiment, the magnet 30 is coupled adjacent to both sides of the anode 18 to prevent the metal ions 19 released from the anode 18 from being diffused by the magnetic field of the magnet 30, and opposite thereto. By inducing the metal ions 19 in the substrate 28 and maintaining the concentration of the metal ions 19 around the substrate 28 as a cathode constant, the plating thickness can be made uniform.

  The metal ions 19 released from the anode 18 move to the substrate 28 facing the anode 18 in order to combine with electrons that have moved to the cathode through the rectifier. As a result, the concentration of the metal ions 19 is reduced around the substrate 28, so that the plating rate is reduced. Therefore, a uniform plating thickness cannot be obtained unless the concentration of the metal ions 19 around the substrate 28 serving as the cathode is maintained at a constant level. In this embodiment, in order to maintain the concentration of the metal ions 19 around the substrate 28 at a constant level, the magnets 30 are coupled to both sides of the anode 18 and the metal ions discharged from the anode 18 using the magnetic field of the magnet 30. 19 is prevented from being diffused, and the concentration of metal ions 19 around the substrate 28 serving as the cathode is maintained.

  In this embodiment, permanent magnets are coupled adjacent to both sides of the anode 18, but it is needless to say that electromagnets capable of forming a magnetic field can also be used.

  The foregoing has been described with reference to the preferred embodiments of the present invention. However, those skilled in the art will appreciate that the present invention is within the scope and spirit of the present invention described in the claims. It will be understood that the invention can be modified and changed in various ways.

It is a perspective view which shows the plating apparatus by one Embodiment of this invention. It is a top view which shows the plating apparatus by one Embodiment of this invention. It is a use state figure of the plating apparatus by one Embodiment of this invention. It is a top view which shows the plating apparatus by other embodiment of this invention. It is a top view which shows the plating apparatus by a prior art. It is a use state figure of the plating apparatus by a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 Plating tank 14 Anode basket 16 Plating metal 18 Anode 19 Metal ion 20 Separation partition 22 Opening 24 Shielding plate 26 Jig 28 Substrate 30 Magnet

Claims (7)

In an apparatus for plating multiple substrates at once,
A plating tank into which the plurality of substrates are placed;
An anode coupled to face each of the plating surfaces of the plurality of substrates;
A separating partition that partitions the plating tank so that the plurality of substrates are isolated from each other;
A magnet coupled adjacent to both sides of the anode;
The plating apparatus characterized by including.   The plating apparatus according to claim 1, further comprising a shielding plate interposed between the anode and the substrate facing the anode, and having an opening formed on a surface facing the substrate. 3. The plating apparatus according to claim 1, wherein the plurality of substrates are put in parallel so that one surface thereof is opposed, and the separation partition wall is located between adjacent substrates. The plating apparatus according to claim 1, wherein the separation partition is made of an insulating material. The plating apparatus according to any one of claims 1 to 4 , wherein the anode includes an anode basket into which a plating metal is charged . The plating apparatus according to claim 5 , wherein the plating metal includes at least one selected from the group consisting of copper, nickel, tin, silver, platinum, gold, and zinc. The plating apparatus according to claim 1 , wherein the anode is positioned so as to face both surfaces of the substrate.

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