JP4794114B2 - Curable resin composition - Google Patents
Curable resin composition Download PDFInfo
- Publication number
- JP4794114B2 JP4794114B2 JP2003024455A JP2003024455A JP4794114B2 JP 4794114 B2 JP4794114 B2 JP 4794114B2 JP 2003024455 A JP2003024455 A JP 2003024455A JP 2003024455 A JP2003024455 A JP 2003024455A JP 4794114 B2 JP4794114 B2 JP 4794114B2
- Authority
- JP
- Japan
- Prior art keywords
- compound
- acrylate
- meth
- group
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 90
- -1 polyoxyethylene Polymers 0.000 claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 35
- 229920000647 polyepoxide Polymers 0.000 claims description 35
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 33
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 24
- 125000003277 amino group Chemical group 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000004202 carbamide Substances 0.000 claims description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 58
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 229920001451 polypropylene glycol Polymers 0.000 description 14
- 125000000962 organic group Chemical group 0.000 description 13
- 239000012299 nitrogen atmosphere Substances 0.000 description 12
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 150000001412 amines Chemical class 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229920001228 polyisocyanate Polymers 0.000 description 9
- 239000005056 polyisocyanate Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 229920000620 organic polymer Polymers 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 125000005442 diisocyanate group Chemical class 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000376 reactant Substances 0.000 description 6
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 102100038750 Myc-associated zinc finger protein Human genes 0.000 description 5
- 101710146400 Myc-associated zinc finger protein Proteins 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 4
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 3
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N 4-penten-2-one Chemical compound CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 2
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 2
- JLIDVCMBCGBIEY-UHFFFAOYSA-N 1-penten-3-one Chemical compound CCC(=O)C=C JLIDVCMBCGBIEY-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- MZWXWSVCNSPBLH-UHFFFAOYSA-N 3-(3-aminopropyl-methoxy-methylsilyl)oxypropan-1-amine Chemical compound NCCC[Si](C)(OC)OCCCN MZWXWSVCNSPBLH-UHFFFAOYSA-N 0.000 description 2
- ANOPCGQVRXJHHD-UHFFFAOYSA-N 3-[3-(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]propan-1-amine Chemical compound C1OC(CCCN)OCC21COC(CCCN)OC2 ANOPCGQVRXJHHD-UHFFFAOYSA-N 0.000 description 2
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 2
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 2
- GGZBCIDSFGUWRA-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]-n-methylpropan-1-amine Chemical compound CNCCC[Si](C)(OC)OC GGZBCIDSFGUWRA-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 239000009261 D 400 Substances 0.000 description 2
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 2
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- ROPXFXOUUANXRR-YPKPFQOOSA-N bis(2-ethylhexyl) (z)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C/C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-YPKPFQOOSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 150000001728 carbonyl compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000012024 dehydrating agents Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000012973 diazabicyclooctane Substances 0.000 description 2
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- ANJPRQPHZGHVQB-UHFFFAOYSA-N hexyl isocyanate Chemical compound CCCCCCN=C=O ANJPRQPHZGHVQB-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MNEXIOKPOFUXLA-UHFFFAOYSA-N n'-(11-trimethoxysilylundecyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCCCCCCCCCNCCN MNEXIOKPOFUXLA-UHFFFAOYSA-N 0.000 description 2
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 2
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 2
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 2
- YZPARGTXKUIJLJ-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]aniline Chemical compound CO[Si](C)(OC)CCCNC1=CC=CC=C1 YZPARGTXKUIJLJ-UHFFFAOYSA-N 0.000 description 2
- SLTAOXPOORASCD-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]butan-1-amine Chemical compound CCCCNCCC[Si](C)(OC)OC SLTAOXPOORASCD-UHFFFAOYSA-N 0.000 description 2
- FRDNYWXDODPUJV-UHFFFAOYSA-N n-ethyl-2-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CCNCC(C)C[Si](OC)(OC)OC FRDNYWXDODPUJV-UHFFFAOYSA-N 0.000 description 2
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical class C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
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- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000013466 adhesive and sealant Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229960000686 benzalkonium chloride Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 1
- XMSVKICKONKVNM-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diamine Chemical compound C1CC2(N)C(N)CC1C2 XMSVKICKONKVNM-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- MAOSFLAYGYQLBB-UHFFFAOYSA-N butane-1,4-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCCCO MAOSFLAYGYQLBB-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical class [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentenylidene Natural products C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- TVWTZAGVNBPXHU-FOCLMDBBSA-N dioctyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCC TVWTZAGVNBPXHU-FOCLMDBBSA-N 0.000 description 1
- WNEDOMBPJDUQPS-BFIADXHOSA-L dioctyltin(2+);(z)-4-hydroxy-4-oxobut-2-enoate Chemical compound CCCCCCCC[Sn](OC(=O)\C=C/C(O)=O)(OC(=O)\C=C/C(O)=O)CCCCCCCC WNEDOMBPJDUQPS-BFIADXHOSA-L 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- KPYCPQVKYYJPIY-UHFFFAOYSA-N hexane;isocyanic acid Chemical compound N=C=O.CCCCCC KPYCPQVKYYJPIY-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- YDNLNVZZTACNJX-UHFFFAOYSA-N isocyanatomethylbenzene Chemical compound O=C=NCC1=CC=CC=C1 YDNLNVZZTACNJX-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- HBELKEREKFGFNM-UHFFFAOYSA-N n'-[[4-(2-trimethoxysilylethyl)phenyl]methyl]ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCC1=CC=C(CNCCN)C=C1 HBELKEREKFGFNM-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- UIEKYBOPAVTZKW-UHFFFAOYSA-L naphthalene-2-carboxylate;nickel(2+) Chemical compound [Ni+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 UIEKYBOPAVTZKW-UHFFFAOYSA-L 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 125000003544 oxime group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- DBIWHDFLQHGOCS-UHFFFAOYSA-N piperidine;trifluoroborane Chemical compound FB(F)F.C1CCNCC1 DBIWHDFLQHGOCS-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 150000003112 potassium compounds Chemical class 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、接着剤、シーリング剤、塗料、各種成形材料等に用いられるシリル化ウレタン樹脂、エポキシ樹脂、アミノ基及び加水分解性ケイ素基含有化合物を主成分としてなる硬化性樹脂組成物に関する。
【0002】
【従来の技術】
エポキン樹脂は、凝集力が大きく、溶剤を用いずに使用できることから、接着剤として広く用いられてきた。しかし、硬化した皮膜が一般的に硬くなるため、伸びを必要とする箇所の接着には適さず、また、引張りやせん断には強いものの、剥離に対して弱いという欠点を有している。
この欠点を改良するため、特許文献1には、エポキシ樹脂に変成シリコーン樹脂を組み合わせることが記載されている。
しかし、この改良技術は、前記変性シリコーン樹脂が、分子中に尿素結合を有する場合は貯蔵安定性が悪く(後述する比較例1参照)、又分子中に置換尿素結合を有しない場合には、加熱硬化(50℃×3 日)時には、伸び及び剥離接着強さの向上が見られるが、室温硬化させた場合にはエポキシ樹脂本来の特徴である優れた引張りせん断接着強さが発揮されず(後述する比較例2、3参照)、十分な改良がなされているとは言い難い。
【特許文献1】
特公平3−31726号公報
【0003】
【発明が解決しようとする課題】
本発明は、室温硬化させた場合に、優れた伸び、引張りせん断接着強さ、及び剥離接着強さを共にバランスして発揮し、且つ改善された貯蔵安定性を有する、特に接着剤、シーリング剤及び塗料に好適な硬化性樹脂組成物を提供することを目的とする。
【0004】
【課題を解決するための手段】
上記目的を達成するために、本発明者らは鋭意研究を重ねた結果、硬化性樹脂組成物に
おいて、特許文献1に記載の変成シリコーン樹脂に代えて、分子中に置換尿素結合を有する特定のシリル化ウレタン樹脂を配合することにより、室温硬化させた場合、優れた伸び、剥離接着強さ及び引張りせん断接着強さを共にバランスして発揮し、且つ改善された貯蔵安定性を有する硬化性樹脂組成物が得られることを見いだし、本発明を完成させるに至った。
即ち、本発明は、以下のとおりである。
1.主鎖がポリオキシアルキレン重合体であり、その分子末端に反応性珪素基を有し、分子中に置換尿素結合を有するシリル化ウレタン系樹脂(A)と、アミノ基及び加水分解性ケイ素基含有化合物(B)と、エポキシ樹脂(D)の硬化剤(C)とからなる混合物(I)と、
エポキシ樹脂(D)と、シリル化ウレタン系樹脂(A)の硬化剤(E)とからなる混合物(II)とを含有し、
上記混合物(I)中の(A)と上記混合物(II)中の(D)との割合が質量比で(A)/(D)=15/85〜80/20であり、
上記〔(A)+(D)〕と上記混合物(I)中の(B)との割合が質量比で〔(A)+(D)〕/(B)=100/0.1〜100/20であり、
上記(D)と上記混合物(I)中の(C)との割合が質量比で(D)/(C)=100/0.1〜100/300であり、
上記(A)と上記混合物(II)中の(E)との割合が質量比で(A)/(E)=100/0.01〜100/20である、
ことを特徴とする硬化性樹脂組成物。
2.上記シリル化ウレタン系樹脂(A)の主鎖が、ポリオキシエチレンを含むポリオキシアルキレン重合体であることを特徴とする上記1に記載の硬化性樹脂組成物。
3.上記シリル化ウレタン系樹脂(A)が分子内に少なくとも1つのアミノ基を持つことを特徴とする上記1又は2に記載の硬化性樹脂組成物。
4.上記シリル化ウレタン系樹脂(A)の重量平均分子量が5000〜50000であることを特徴とする上記1〜3のいずれか1項に記載の硬化性樹脂組成物。
【0005】
【発明の実施の形態】
以下、本発明の各成分について詳しく説明する。
(1)主鎖がポリオキシアルキレン重合体であり、その分子末端に反応性珪素基を有し、分子中に置換尿素結合を有するシリル化ウレタン系樹脂(A)(以下、単にシリル化ウレタン系樹脂(A)、又は(A)ということがある。)についてこのシリル化ウレタン系樹脂(A)は、主鎖がポリオキシアルキレン重合体であり、その分子内に下記一般式(1)で表わされる基及び下記一般式(2)で表される基を有するウレタン系樹脂である。
【化1】
【化2】
但し、R1 は下記一般式(3)、下記一般式(4)、下記一般式(5)、又は下記一般式(6)で表される基、フェニル基又は炭素数1〜20個の置換若しくは非置換の有機基を、R2 は炭素数1〜20個の置換若しくは非置換の有機基を、Xは水酸基又は加水分解性基を、nは0,1又は2を、それぞれ示す。
【0006】
【化3】
【化4】
【化5】
【化6】
但し、R3 は水素原子又は−COOR11を、R4 は水素原子又はメチル基を、R5 は−COOR12又はニトリル基を、R6 は炭素数1〜20個の置換若しくは非置換の2価の有機基を、R7 は分子量500以下の珪素原子を含んでも良い有機基を、R8 及びR9 は上記一般式(3)又は下記一般式(7)で表される基(但し、R7 は上記と同意義である。)を、R10はフェニル基、シクロヘキシル基又は炭素数1〜20の置換又は非置換の1価の有機基をそれぞれ示し、R11及びR12は分子量500以下の有機基を、それぞれ示す。
【化7】
【0007】
上記一般式(2)におけるXの加水分解性基としては、アルコキシ基、アセトキシ基、オキシム基等が挙げれるが、特にアルコキシ基が好ましい。
シリル化ウレタン系樹脂(A)は、主鎖がポリオキシアルキレン重合体であり、その分子内に水酸基、第一級アミノ基若しくは第二級アミノ基から選ばれる基を1個以上有する化合物(以下、化合物(a)ということがある。)とポリイソシアネート化合物(以下、化合物(b)ということがある。)と反応させてウレタンプレポリマーを製造し、更にウレタンプレポリマーと下記一般式(8)で表される化合物(以下、化合物(c)ということがある。)を反応させることにより製造することができる。(特許第3030020号公報に示される樹脂が含まれる。)
化合物(a)の原料となるポリオキシアルキレン重合体としては、触媒の存在下、開始剤にモノエポキシド等を反応させて製造される水酸基末端のものが好ましい。開始剤としては、1つ以上の水酸基を有するヒドロキシ化合物等が使用できる。
【0008】
モノエポキシドとしては、エチレンオキシド、プロピレンオキシド、ブチレンオキシド、ヘキシレンオキシド等やテトラヒドロフラン等が併用できる。
触媒としては、カリウム系化合物やセシウム系化合物等のアルカリ金属触媒、複合金属シアン化合物錯体触媒、金属ポリフィリン触媒が挙げられる。複合金属シアン化合物錯体触媒としては、亜鉛ヘキサシアノコバルテートを主成分とする錯体、エーテル及び/又はアルコール錯体が好ましい。エーテル及び/又はアルコール錯体の組成は本質的に特公昭46−27250号公報に記載されているものが使用できる。エーテルとしてはエチレングリコールジメチルエーテル(グライム)、ジエチレングリコールジメチルエーテル(ジグライム)等が好ましく、錯体の製造時の取り扱いの点からグライムが特に好ましい。アルコールとしては、例えば特開平4−145123号公報に記載されているものが使用できるが、特にtert−ブタノールが好ましい。
【0009】
上記原料ポリオキシアルキレン重合体としては、数平均分子量が500〜30,000、特に2,000〜20,000のものを使用するのが好ましい。
原料ポリオキシアルキレン重合体は官能基数が2以上のものが好ましく、具体的にはポリオキシエチレン、ポリオキシプロピレン、ポリオキシブチレン、ポリオキシヘキシレン、ポリオキシテトラメチレン等の共重合物が挙げられる。好ましい原料ポリオキシアルキレン重合体は、2〜6価のポリオキシプロピレンポリオール、特にオキシエチレン/オキシプロピレン共重合体、ポリオキシプロピレンジオールとポリオキシプロピレントリオールである。
化合物(a)は市販されており(例えば、P−2000,P−3000:商品名、旭電化工業社製、PML−3005,PML−3010,PML−3012,PML−4002,PML−4010,PML−5005:商品名、旭硝子社製、Sumiphen3600,Sumiphen3700,SBU−Polyol0319:商品名、住友バイエルウレタン社製等)、本発明ではそれらを用いることができる。又、末端に第1級アミノ基をもつポリオキシプロピレン(ジェファーミンD−230,D−400,D−2000:商品名、サンテクノジャパン社製)若しくは第2級アミノ基をもつポリオキシプロピレン(ジェファーミンD−230,D−400,D−2000(同上)と、α,β−不飽和カルボニル化合物、マレイン酸ジエステル及びアクリロニトリルから選ばれる1種又は2種以上とを反応させる方法によって得ることができる。)を用いることができる。
【0010】
化合物(b)としては、ジイソシアネート化合物、ジイソシアネート化合物を除くポリイソシアネート化合物、その他等が挙げられる。ジイソシアネート化合物としては、例えば脂肪族、脂環式、芳香脂肪族、芳香族ジイソシアネート化合物等が挙げられる。以下、それらの具体例を挙げる。
脂肪族ジイソシアネート化合物:トリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ペンタメチレンジイソシアネート、1,2−プロピレンジイソシアネート、1,2−ブチレンジイソシアネート、2,3−ブチレンジイソシアネート、1,3−ブチレンジイソシアネート、2,4,4−又は2,2,4−トリメチルヘキサメチレンジイソシアネート、2,6−ジイソシアネートメチルカプロエート等。
【0011】
脂環式ジイソシアネート化合物:1,3−シクロペンテンジイソシアネート、1,4−シクロヘキサンジイソシアネート、1,3−シクロヘキサンジイソシアネート、3−イソシアネートメチル−3,5,5−トリメチルシクロヘキシルイソシアネート、4,4′−メチレンビス(シクロヘキシルイソシアネート)、メチル−2,4−シクロヘキサンジイソシアネート、メチル−2,6−シクロヘキサンジイソシアネート、1,3−ビス(イソシアネートメチル)シクロヘキサン、1,4−ビス(イソシアネートメチル)シクロヘキサン、イソホロンジイソシアネート等。芳香脂肪族ジイソシアネート化合物:1,3−若しくは1,4−キシリレンジイソシアネート又はそれらの混合物、ω,ω′−ジイソシアネート−1,4−ジエチルベンゼン、1,3−若しくは1,4−ビス(1−イソシアネート−1−メチルエチル)ベンゼン又はそれらの混合物等。芳香族ジイソシアネート化合物:m−フェニレンジイソシアネート、p−フェニレンジイソシアネート、4,4′−ジフェニルジイソシアネート、1,5−ナフタレンジイソシアネート、4,4′−ジフェニルメタンジイソシアネート、2,4−又は2,6−トリレンジイソシアネート、4,4′−トルイジンジイソシアネート、4,4′−ジフェニルエーテルジイソシアネート等。
ジイソシアネート化合物を除くポリイソシアネート化合物としては、例えば脂肪族、脂環式、芳香脂肪族、芳香族ポリイソシアネート化合物等が挙げられる。
【0012】
以下、それらの具体例を挙げる。
脂肪族ポリイソシアネート化合物:リジンエステルトリイソシアネート、1,4,8−トリイソシアネートオクタン、1,6,11−トリイソシアネートウンデカン、1,8−ジイソシアネート−4−イソシアネートメチルオクタン、1,3,6−トリイソシアネートヘキサン、2,5,7−トリメチル−1,8−ジイソシアネート−5−イソシアネートメチルオクタン等。
【0013】
脂環式ポリイソシアネート化合物:1,3,5−トリイソシアネートシクロヘキサン、1,3,5−トリメチルイソシアネートシクロヘキサン、3−イソシアネート−3,3,5−トリメチルシクロヘキシルイソシアネート、2−(3−イソシアネートプロピル)−2,5−ジ(イソシアネートメチル)−ビシクロ[2,2,1]ヘプタン、2−(3−イソシアネートプロピル)−2,6−ジ(イソシアネートメチル)−ビシクロ[2,2,1]ヘプタン、5−(2−イソシアネートエチル)−2−イソシアネートメチル−3−(3−イソシアネートプロピル)−ビシクロ[2,2,1]ヘプタン、6−(2−イソシアネートエチル)−2−イソシアネートメチル−3−(3−イソシアネートプロピル)−ビシクロ[2,2,1]ヘプタン、5−(2−イソシアネートエチル)−2−イソシアネートメチル−2−(3−イソシアネートプロピル)−ビシクロ[2,2,1]ヘプタン、6−(2−イソシアネートエチル)−2−(3−イソシアネートプロピル)−ビシクロ[2,2,1]ヘプタン等。
【0014】
芳香脂肪族ポリイソシアネート化合物:1,3,5−トリイソシアネートメチルベンゼン等。
芳香族ポリイソシアネート化合物:トリフェニルメタン−4,4′,4″−トリイソシアネート、1,3,5−トリイソシアネートベンゼン、2,4,6−トリイソシアネートトルエン、4,4′−ジフェニルメタン−2,2′,5,5′−テトライソシアネート等。
その他のポリイソシアネート化合物:フェニルジイソチオシアネート等硫黄原子を含むジイソシアネート類。
【0015】
化合物(c)は、下記一般式(8)で表される化合物である。
【化8】
但し、R1 、R2 、X及びnは上記の規定と同意義であり、Yは炭素数1〜20個の置換若しくは非置換の2価の有機基、下記一般式(9)又は下記一般式(10)で表される基を、それぞれ示す。
【化9】
【化10】
但し、R3 、R4 、R5 及びR7 は上記の規定と同意義であり、R13及びR14は炭素数1〜10個の置換若しくは非置換の2価の有機基を示す。
【0016】
化合物(c)の具体例としては、N−フェニル−γ−アミノプロピルトリメトキシシラン、N−フェニル−γ−アミノプロピルメチルジメトキシシラン、N−(n−ブチル)−γ−アミノプロピルトリメトキシシラン、N−(n−ブチル)−γ−アミノプロピルメチルジメトキシシラン、N−エチルアミノイソブチルトリメトキシシラン、N−メチルアミノプロピルメチルジメトキシシラン、N−メチルアミノプロピルトリメトキシシラン、ビス(トリメトキシシリルプロピル)アミン等が挙げられる。
【0017】
《尚、上記一般式(8)で表される化合物(c)は、以下の(1)〜(7)の方法により製造することもできる。
(1)R1 が上記一般式(3)で表される基、Yが2価の有機基である化合物第一級アミノ基及び加水分解性基含有珪素基若しくは水酸基含有珪素基(好ましくは加水分解性基含有珪素基)をそれぞれ一つ持つ化合物(化合物(d))と、それと化学当量のα,β−不飽和カルボニル化合物(化合物(e))、マレイン酸ジエステル(化合物(f))及びアクリロニトリルから選ばれる1種又は2種以上とを反応させる方法
(2)R1 が上記一般式(3)で示され、Yが上記一般式(9)で示される化合物
第一級アミノ基、第二級アミノ基及び加水分解性基含有珪素基若しくは水酸基含有珪素基(好ましくは加水分解性基含有珪素基)をそれぞれ一つ持つ化合物(化合物(g))と、化合物(g)中の第一級アミノ基及び第二級アミノ基と化学当量の化合物(e)、化合物(f)及びアクリロニトリルから選ばれる1種又は2種以上とを反応させる方法
【0018】
(3)R1 が上記一般式(3)で示され、Yが上記一般式(10)で示される化合物
化合物(g)と、化合物(g)中の第一級アミノ基と化学当量の化合物(e)、化合物(f)及びアクリロニトリルから選ばれる1種又は2種以上とを反応させた後、化合物(g)中の第二級アミノ基と化学当量の式 R7 NCO(R7 は上記と同意義)で表されるモノイソシアネート化合物(化合物(h))を反応させる方法
(4)R1 が上記一般式(4)で示され、Yが2価の有機基である化合物
化合物(g)と、化合物(g)中の第一級アミノ基と化学当量の化合物(h)とを反応させる方法
【0019】
(5)R1 が上記一般式(5)で示され、かつ一般式(5)中のR8 及びR9 が上記一般式(3)で示され、Yが2価の有機基である化合物
化合物(g)と、化合物(g)中の第一級アミノ基と2化学当量の化合物(e)、化合物(f)及びアクリロニトリルから選ばれる1種又は2種以上とを反応させる方法
(6)R1 が上記一般式(5)で示され、かつ一般式(5)中のR8 が上記一般式(3)で示されR9 が上記一般式(7)で示され、Yが2価の有機基である化合物
化合物(g)と、化合物(g)中の第一級アミノ基と化学当量の化合物(e)、化合物(f)及びアクリロニトリルから選ばれる1種又は2種以上とを反応させた後、この反応により生成した第二級アミノ基と化学当量の化合物(h)を反応させる方法。
(7)R1 が上記一般式(6)で示され、Yが2価の有機基である化合物
化合物(d)と、化合物(d)中の第一級アミノ基と化学当量のマレイミド化合物(化合物(i))とを反応させる方法。
【0020】
化合物(d)としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルメチルジエトキシシラン、アミノフェニルトリメトキシシラン等が挙げられる。
【0021】
化合物(e)としては、(メタ)アクリル化合物、ビニルケトン化合物、ビニルアルデヒド化合物、その他の化合物等が挙げられる。(メタ)アクリル化合物として、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、イソプロピル(メタ)アクリレート、ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、t−ブチル(メタ)アクリレート、ペンチル(メタ)アクリレート、アミル(メタ)アクリレート、イソアミル(メタ)アクリレート、ヘキシル(メタ)アクリレート、ヘプチル(メタ)アクリレート、オクチル(メタ)アクリレート、2−エチルヘキシルアクリレート、ノニル(メタ)アクリレート、デシル(メタ)アクリレート、イソデシル(メタ)アクリレート、ウンデシル(メタ)アクリレート、ドデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、オクタデシル(メタ)アクリレート、ステアリル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、エトキシジエチレングリコール(メタ)アクリレート、ベンジル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、ポリプロピレングリコール(メタ)アクリレート、メトキシエチレングリコール(メタ)アクリレート、エトキシエチレングリコール(メタ)アクリレート、メトキシポリエチレングリコール(メタ)アクリレート、メトキシポリプロピレングリコール(メタ)アクリレート、ジシクロペンタジエニル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、トリシクロデカニル(メタ)アクリレート、ボルニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジアセトン(メタ)アクリレート、イソブトキシメチル(メタ)アクリレート、N−ビニルピロリドン、N−ビニルカプロラクタム、N−ビニルホルムアルデヒド、N,N−ジメチルアクリルアミド、t−オクチルアクリルアミド、ジメチルアミノエチル(メタ)アクリレート、ジエチルアミノエチル(メタ)アクリレート、7−アミノ−3,7−ジメチルオクチル(メタ)アクリレート、N,N−ジメチル(メタ)アクリルアミド、N,N′−ジメチルアミノプロピル(メタ)アクリルアミド、アクリロイルモルホリン等の他、東亞合成化学工業社製の商品名:アロニックスM−102,M−111,M−114,M−117、日本化薬社製の商品名:カヤハード TC110S,R629,R644、大阪有機化学社製の商品名:ビスコート3700等が挙げられる。
【0022】
更に、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトール(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、テトラエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、トリメチロールプロパントリオキシエチル(メタ)アクリレート、トリス(2−ヒドロキシエチル)イソシアヌレートトリ(メタ)アクリレート、トリス(2−ヒドロキシエチル)イソシアヌレートジ(メタ)アクリレート、トリシクロデカンジメタノールジ(メタ)アクリレート、ビスフェノールAのグルシジルエーテルに(メタ)アクリレートを付加させたエポキシ(メタ)アクリレート等の多官能性化合物及び該多官能性化合物の市販品としての、三菱化学社製の商品名:ユピマーUV,SA1002,SA2007、大阪有機化学社製の商品名:ビスコート700、日本化薬社製の商品名:カヤハード R604,DPCA−20,DPCA−30,DPCA−60,DPCA−120,HX−620,D−310,D−330、東亞合成化学工業社製の商品名:アロニックスM−210,M−215,M−315,M−325等が挙げられる。
【0023】
上記の化合物の他、アルコキシシリル基を有するγ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−メタクリロキシメチルジメトキシシラン、γ−メタクリロキシメチルジエトキシシラン、γ−アクリロキシプロピルトリメトキシシラン、γ−アクリロキシメチルジメトキシシラン等が挙げられる。
ビニルケトン化合物としては、ビニルアセトン、ビニルエチルケトン、ビニルブチルケトン等が、ビニルアルデヒド化合物としては、アクロレイン、メタクロレイン、クロトンアルデヒド等が、その他の化合物としては、無水マレイン酸、無水イタコン酸、イタコン酸、クロトン酸、N−メチロールアクリルアミド、ダイアセトンアクリルアミド、N−[3−(ジメチルアミノ)プロピル]メタクリルアミド、N,N−ジメチルアクリルアミド、N,N−ジエチルアクリルアミド、N−t−オクチルアクリルアミド、N−イソプロピルアクリルアミド等が挙げられる。
【0024】
上記化合物の他、その内部に弗素原子、硫黄原子又はリン原子を含む化合物も含まれる。弗素原子を含む化合物としては、パーフルオロオクチルエチル(メタ)アクリレート、トリフルオロエチル(メタ)アクリレート等が、リン原子を含む化合物としては、(メタ)アクリロキシエチルフェニルアシッドホスフェート等が挙げられる。
上記化合物(e)の中でも、反応のし易さ、広く市販され入手の容易さの点から、メチルアクリレート、エチルアクリレート、プロピルアクリレート、ブチルアクリレート、t−ブチルアクリレート、オクチルアクリレート、2−エチルヘキシルアクリレート、ラウリルアクリレート等が好ましい。この内、速硬化性を付与するにはメチルアクリレート、エチルアクリレートが特に好ましく、柔軟性を付与するには2−エチルヘキシルアクリレート、ラウリルアクリレートが特に好ましい。又、化合物(e)は、1種又は2種以上使用できる。
【0025】
化合物(f)(マレイン酸ジエステル)としては、マレイン酸ジメチル、マレイン酸ジエチル、マレイン酸ジブチル、マレイン酸ジ2−エチルヘキシル、マレイン酸ジオクチル等が挙げられ、これらは1種又は2種以上使用できる。これらの中でも、反応のし易さ、広く市販され入手の容易さの点から、マレイン酸ジメチル、マレイン酸ジエチル、マレイン酸ジブチル、マレイン酸ジ2−エチルヘキシルが好ましい。又、化合物(f)は、1種又は2種以上使用できる。
【0026】
化合物(g)としては、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン、N−3−[アミノ(ジプロピレンオキシ)]アミノプロピルトリメトキシシラン、(アミノエチルアミノメチル)フェネチルトリメトキシシラン、N−(6−アミノヘキシル)アミノプロピルトリメトキシシラン、N−(2−アミノエチル)−11−アミノウンデシルトリメトキシシラン、この他特殊アミノシランである信越化学工業社製、商品名:KBM6063、X−12−896、KBM576、X−12−565、X−12−580、X−12−5263、KBM6123、X−12−575、X−12−562、X−12−5202、X−12−5204、KBE9703等が挙げられる。
上記の化合物(g)の中でも、反応のし易さ、広く市販され入手の容易さの点から、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジメトキシシランが好ましい。
【0027】
化合物(h)としては、イソシアン酸エチル、イソシアン酸n−ヘキシル、イソシアン酸n−ドデシル、イソシアン酸p−トルエンスルホニル、イソシアン酸n−ヘキシル、イソシアン酸ベンジル、イソシアン酸2−メトキシフェニル等の他、信越化学工業社製商品名:KBM9007(γ−イソシアネートプロピルトリメトキシシラン)等のイソシアネートシラン等が挙げられる。
化合物(i)としては、N−フェニルマレイミド、N−シクロヘキシルマレイミド、ヒドロキシフェニルモノマレイミド、N−ラウレルマレイミド、ジエチルフェニルモノマレイミド、N−(2−クロロフェニル)マレイミド等が挙げられる。》
本発明のシリル化ウレタン系樹脂(A)は、中でも分子内に少なくとも1つのアミノ基を持つシリル化ウレタン系樹脂(A)(請求項3)が、以下の理由で好ましい。
シリル化ウレタン系樹脂(A)がアミノ基を有すると、例えば、下記式1に示されるように、シリル化ウレタン系樹脂(A)がエポキシ樹脂(D)とリンクすることにより、一層優れた引張せん断接着強さ及び剥離接着強さを発揮する硬化性樹脂組成物が提供される。
この分子内に少なくとも1つのアミノ基を持つシリル化ウレタン系樹脂(A)は、後述する合成例3〜6に示されるように、ヒドロキシ基含有第3級アミン(DABCO−T等)、[0017]又は[0019]で述べた前記(2)又は(5)の方法で合成した化合物(c)等を用いて調製することができる。
【式1】
【0028】
シリル化ウレタン系樹脂(A)の重量平均分子量は5000〜50000、好ましくは6000〜40000、より好ましくは7000〜30000である。該重量平均分子量が5000未満であると、硬化物が硬く脆くなる点で不都合であり、50000を超えると粘度が高くなる点で不都合である。
【0029】
(2)アミノ基及び加水分解性ケイ素基含有化合物(B)について
上記(B)アミノ基及び加水分解性ケイ素基含有化合物(以下、単に(B)ということがある。)としては、上記(1)シリル化ウレタン系樹脂(A)で述べた化合物(c)、化合物(d)、化合物(g)及びアミノ基含有シリケーと化合物である旭化成ワッカー社製、商品名:SLJ7502、SLJ7502/2、SLJ7503等が使用できる。
それらの代表例を列挙すると、以下の通りである。
・化合物(c)
N−フェニル−γ−アミノプロピルトリメトキシシラン、N−フェニル−γ−アミノプロピルメチルジメトキシシラン、N−(n−ブチル)−γ−アミノプロピルトリメトキシシラン、N−(n−ブチル)−γ−アミノプロピルメチルジメトキシシラン、N−エチルアミノイソブチルトリメトキシシラン、N−メチルアミノプロピルメチルジメトキシシラン、N−メチルアミノプロピルトリメトキシシラン、ビス(トリメトキシシリルプロピル)アミン
・化合物(d)
γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルメチルジエトキシシラン、アミノフェニルトリメトキシシラン
【0030】
・化合物(g)
N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリエトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジメトキシシラン、N−β(アミノエチル)−γ−アミノプロピルメチルジエトキシシラン、N−3−[アミノ(ジプロピレンオキシ)]アミノプロピルトリメトキシシラン、(アミノエチルアミノメチル)フェネチルトリメトキシシラン、N−(6−アミノヘキシル)アミノプロピルトリメトキシシラン、N−(2−アミノエチル)−11−アミノウンデシルトリメトキシシラン、この他特殊アミノシランである信越化学工業社製、商品名:KBM6063、X−12−896、KBM576、X−12−565、X−12−580、X−12−5263、KBM6123、X−12−575、X−12−562、X−12−5202、X−12−5204、KBE9703
【0031】
(3)エポキシ樹脂(D)の硬化剤(C)について
上記(C)エポキシ樹脂(D)の硬化剤(以下、単に(C)ということがある。)としてしは、一般に使用されている硬化剤であれば特に限定されないが、例えば、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ジエチルアミノプロピルアミン、ヘキサメチレンジアミン、メチルペンタメチレンジアミン、トリメチルヘキサメチレンジアミン、グアニジン、オレイルアミン、等の脂肪族アミン類;メンセンジアミン、イソホロンジアミン、ノルボルナンジアミン、ピペリジン、N,N’−ジメチルピペラジン、N−アミノエチルピペラジン、1,2−ジアミノシクロヘキサン、ビス(4−アミノ−3−メチルシクロヘキシル)メタン、ビス(4−アミノシクロヘキシル)メタン、ポリシクロヘキシルポリアミン、1,8−ジアザビシクロ[5,4,0]ウンデセン−7(DBU)等の脂環族アミン類;メタフェニレンジアミン、4、4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルスルホン等の芳香族アミン類;m−キシリレンジアミン、ベンジルジメチルアミン、2−(ジメチルアミノメチル)フェノール、2,4,6−トリス(ジメチルアミノメチル)フェノール等の脂肪芳香族アミン類;3,9−ビス(3−アミノプロピル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン(ATU)、モルホリン、N−メチルモルホリン、ポリオキシプロピレンジアミン、ポリオキシプロピレントリアミン、ポリオキシエチレンジアミン等のエーテル結合を有するアミン類;ジエタノールアミン、トリエタノールアミン等の水酸基含有アミン類;テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、ヘキサヒドロ無水フタル酸、ドデシル無水コハク酸等の酸無水物類;ダイマー酸にジエチレントリアミンやトリエチレンテトラミン等のポリアミンを反応させて得られるポリアミド、ダイマー酸以外のポリカルボン酸を使ったポリアミド等のポリアミドアミン類;2−エチル−4−メチルイミダゾール等のイミダゾール類;ジシアンジアミド;ポリオキシプロピレン系ジアミン,ポリオキシプロピレン系トリアミン等のポリオキシプロピレン系アミン類;フェノール類;上記アミン類にエポキシ化合物を反応させて得られるエポキシ変性アミン、上記アミン類にホルマリン、フェノール類を反応させて得られるマンニッヒ変性アミン、マイケル付加変性アミン、ケチミンといった変性アミン類;2,4,6−トリス(ジメチルアミノメチル)フェノールの2−エチルヘキサン酸塩等のアミン塩等の化合物が用いられ得る。
これらの硬化剤は、単独で用いてもよく2種以上併用してもよい。これらエポキシ樹脂用硬化剤の中では、硬化性や物性バランスの点から、2,4,6−トリス(ジメチルアミノメチル)フェノールやポリオキシプロピレン系ジアミンが好ましい。
【0032】
(4)エポキシ樹脂(D)について
エポキシ樹脂(D)(以下、単に(D)ということがある。)としては、従来公知のものを広く使用でき、例えばビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールAD型エポキシ樹脂、ビフェニル型エポキシ樹脂、ビスフェノールS型エポキシ樹脂やこれらを水添したエポキシ樹脂、グリシジルエステル型エポキシ樹脂、テトラグリシジルアミノジフェニルメタン等のグリシジルアミン型エポキシ樹脂、テトラフェニルグリシジルエーテルエタン等の多官能性グリシジルエーテル型エポキシ樹脂、脂環式エポキシ樹脂、ノボラック型エポキシ樹脂、ウレタン結合を有するウレタン変性エポキシ樹脂、フッ素化エポキシ樹脂、ポリブタジエンあるいはNBRを含有するゴム変性エポキシ樹脂、テトラブロモビスフェノールAのグリシジルエーテル等の難燃型エポキシ樹脂等が挙げられる。これらのエポキシ樹脂は、単独で用いてもよく2種以上併用してもよい。これらエポキシ樹脂の中では、作業性や硬化性、接着強度、被着体汎用性、耐水性、耐久性等のバランスの点から、ビスフェノールA型エポキシ樹脂及びビスフェノールF型エポキシ樹脂が好ましい。
【0033】
(5)シリル化ウレタン系樹脂(A)の硬化剤(E)について
シリル化ウレタン系樹脂(A)の硬化剤(E)(以下、単に(E)ということがある。)としては、有機錫化合物、金属錯体、塩基性化合物、有機燐化合物及び水(空気中の湿気)が使用できる。具体的には、有機錫化合物としては、ジブチル錫ジラウレート、ジオクチル錫ジマレエート、ジブチル錫フタレート、オクチル酸第一錫、ジブチル錫メトキシド、ジブチル錫ジアセチルアセテート、ジブチル錫ジバーサテート、ジブチル錫オキサイド、ジブチル錫オキサイドとフタル酸ジエステルとの反応生成物、この他、例えばU−303、U−700、U−700ES:商品名、日東化成社製等が挙げられる。
金属錯体としては、テトラブチルチタネート、テトライソプロピルチタネート、トリエタノールアミンチタネート等のチタネート化合物類、オクチル酸鉛、ナフテン酸リチウム、ナフテン酸鉛、ナフテン酸ニッケル、ナフテン酸コバルト、オクチル酸ビスマス、ビスマスバーサテート等のカルボン酸金属塩、アルミニウムアセチルアセトナート錯体、バナジウムアセチルアセトナート錯体等の金属アセチルアセトナート錯体等が挙げられる。
【0034】
塩基性化合物としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン等のアミノシラン類、テトラメチルアンモニウムクロライド、ベンザルコニウムクロライド等の第四級アンモニウム塩類、三共エアプロダクツ社製のDABCO(登録商標)シリーズ、DABCO BLシリーズ、1,8−ジアザビシクロ[5.4.0]ウンデセ−7−エン等の複数の窒素を含む直鎖或いは環状の第三級アミン及び第四級アンモニウム塩、三フッ化硼素ピペリジン錯塩等の三フッ化硼素アミン錯塩等が挙げられる。
有機燐化合物としては、モノメチル燐酸、ジ−n−ブチル燐酸、燐酸トリフェニル等が挙げられる。
【0035】
(6)上記(A)〜(E)成分の配合比について
▲1▼上記混合物(I)中の(A)と上記混合物(II)中の(D)との割合が質量比で(A)/(D)=15/85〜95/5、好ましくは20/80〜90/10、より好ましくは30/70〜80/20である。該(A)/(D)が15/85未満であると、硬く脆くなる点で不都合であり、又95/5超であると強靭性が不足することから不都合である。
▲2▼上記〔(A)+(D)〕と上記混合物(I)中の(B)との割合が質量比で〔(A)+(D)〕/(B)=100/0.1〜100/20、好ましくは100/0.2〜100/15、より好ましくは100/0.5〜100/10である。該〔(A)+(D)〕/(B)=100/20未満であると、シリル化ウレタン系樹脂の硬化が遅くなる点で不都合であり、又100/0.1超であると、プラスチック材料への密着性が低下することから不都合である。
【0036】
▲3▼上記(D)と上記混合物(I)中の(C)との割合が質量比で(D)/(C)=100/0.1〜100/300、好ましくは100/0.5〜100/150、より好ましくは100/1〜100/100である。該(D)/(C)=100/300未満であると、(C)成分がブリードして被着材料を汚染する点で不都合であり、又100/0.1超であるとエポキシ樹脂の硬化が不十分となることから不都合である。
▲4▼上記(A)と上記混合物(II)中の(E)との割合が質量比で(A)/(E)=100/0.1〜100/20、好ましくは100/0.2〜100/15、より好ましくは100/0.5〜100/10である。該(A)/(E)=100/20未満であってもシリル化ウレタン系樹脂の硬化が促進されない点で不都合であり、100/0.1超であるとシリル化ウレタン系樹脂の硬化が不十分となることから不都合である。
【0037】
本発明の硬化性樹脂組成物は、上記▲1▼〜▲4▼の配合比に基づいて、シリル化ウレタン系樹脂(A)と、アミノ基及び加水分解性ケイ素基含有化合物(B)と、エポキシ樹脂(D)の硬化剤(C)とからなる混合物(I)を主剤成分とし、又エポキシ樹脂(D)と、シリル化ウレタン系樹脂(A)の硬化剤(E)とからなる混合物(II)を硬化剤成分とし、次いで両成分(I)、(II)を混合して使用される。
本発明の硬化性樹脂組成物は、上記(A)〜(E)を有効成分とするが、これら有効成分以外に適宜充填剤、各種添加剤を含むことができる。
充填剤としては、フュームドシリカ、炭酸カルシウム、炭酸マグネシウム、クレー、タルク、シリカ、各種バルーン等が挙げられる。
各種添加剤としては、可塑剤、添加剤、溶剤、脱水剤、上記硬化剤(E)の貯蔵安定剤等を挙げることができる。上記可塑剤としては、ジオクチルフタレート、ジブチルフタレート等のフタル酸エステル類、アジピン酸ジオクチル、セバチン酸ジブチル等の脂肪族カルボン酸エステル等を用いることができる。
【0038】
上記添加剤としては、老化防止剤、チキソ性付与剤、紫外線吸収剤、顔料、各種タッキファイアー、シランカップリング剤、チタネートカップリング剤、アルミニウムカップリング剤、ビスフェノールA型やビスフェノールF型等のエポキシ樹脂等が挙げられる。シランカップリング剤としては、特にアミノシランが好ましい。
上記溶剤としては、上記硬化性樹脂組成物等と相溶性がよく水分含有量が500ppm以下であればいずれを用いても良い。
上記脱水剤としては、生石灰、オルト珪酸エステル、無水硫酸ナトリウム、ゼオライト、メチルシリケート、エチルシリケート、各種アルキルアルコキシシラン、各種ビニルアルコキシシラン等が挙げられる。
上記硬化剤(E)の貯蔵安定剤としては、オクチル酸を用いることができる。
【0039】
【実施例】
以下に本発明を実施例を以て詳細に説明するが、本発明がそれらの実施例に限定されるものでないことはいうまでもない。
〈分子末端に反応性珪素基を有し、分子中に置換尿素結合を有するシリル化ウレタン系樹脂(A)の合成〉
(合成例1)
(1)タケラックP−28(商品名:武田薬品工業社製、数平均分子量4,000のポリオキシプロピレンジオール)を1,000g、スミジュールT−80(商品名:住友バイエルウレタン社製、トリレンジイソシアネート)を87.1gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で3時間反応させてウレタンプレポリマー(PUR−1)を得た。
(2)KBM902(商品名:信越化学工業社製、γ−アミノプロピルメチルジメトキシシラン)を163.3g、2−エチルヘキシルアクリレートを184.3gの割合で混合し、23℃で7日間反応させて反応物(AS−1)を得た。
(3)ウレタンプレポリマー(PUR−1)を1,000g、反応物(AS−1)を175.9gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させて、液状のシリル化ウレタン系樹脂(SU−1)を得た。
【0040】
(合成例2)
(1)タケラックP−28を1,000g、PML−5005(商品名:旭硝子社製、数平均分子量4,000の分子末端25%ポリオキシエチレン付加型ポリオキシプロピレンジオール)を1,000g、スミジュールT−80を174.2gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で3時間反応させてウレタンプレポリマー(PUR−2)を得た。
(2)ウレタンプレポリマー(PUR−2)を1,000g、反応物(AS−1)を175.9gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させて、液状のシリル化ウレタン系樹脂(SU−2)を得た。
【0041】
(合成例3)
(1)ウレタンプレポリマー(PUR−2)を1,000g、反応物(AS−1)を139.0gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させた後、DABCO−T(商品名:三共エアプロダクツ社製、N,N,N’−トリメチルアミノエチルエタノールアミン)を22.0g添加し、90℃で1時間反応させて分子内にアミノ基を持つ液状のシリル化ウレタン系樹脂(SU−3)を得た。
(合成例4)
(1)KBM602(商品名:信越化学工業社製、N−(β−アミノエチル)γ−アミノプロピルメチルジメトキシシラン)を206.4g、ブチルアクリレートを256.3gの割合で混合し、23℃で7日間反応させて反応物(AS−2)を得た。
(2)ウレタンプレポリマー(PUR−2)を1,000g、反応物(AS−2)を215.9gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させて、液状のシリル化ウレタン系樹脂(SU−4)を得た。
【0042】
(合成例5)
(1)PML4011(商品名:旭硝子社製、数平均分子量10,000のポリオキシプロピレンジオール)を1,000g、PR−5007(商品名:旭電化工業社製、数平均分子量5,000の25%ポリオキシエチレンランダム付加型ポリオキシプロピレンジオール)を1,000g、スミジュールT−80を04.5gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で3時間反応させてウレタンプレポリマー(PUR−3)を得た。
(2)ウレタンプレポリマー(PUR−3)を1,000g、反応物(AS−2)を145.1gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させて、液状のシリル化ウレタン系樹脂(SU−5)を得た。
【0043】
(合成例6)
(1)KBM603(商品名:信越化学工業社製、N−(β−アミノエチル)γ−アミノプロピルトリメトキシシラン)を222.4g、ブチルアクリレートを256.4gの割合で混合し、23℃で7日間反応させて反応物(AS−3)を得た。
(2)ウレタンプレポリマー(PUR−3)を1,000g、反応物(AS−3)を150.2gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させて、液状のシリル化ウレタン系樹脂(SU−6)を得た。
(合成例7)
(1)反応性ケイ素基を含有するゴム系有機重合体を得る目的で、ウレタンプレポリマー(PUR−1)を1,000g、KBM902を89.8gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させたところ、ゲル化し目的とする反応性ケイ素基を含有するゴム系有機重合体は得られなかった。
【0044】
(合成例8)
(1)反応性ケイ素基を含有するゴム系有機重合体を得る目的で、ウレタンプレポリマー(PUR−1)を1,000g、KBM602を113.5gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら90℃で1時間反応させたところ、ゲル化し目的とする反応性ケイ素基を含有するゴム系有機重合体は得られなかった。
(合成例9)
(1)反応性ケイ素基を含有するゴム系有機重合体を得る目的で、ウレタンプレポリマー(PUR−1)を1,000g、KBM902を89.8gの割合で反応器に入れ、窒素雰囲気下、攪拌しながら23℃で24時間反応させたところ、反応性ケイ素基を含有するゴム系有機重合体(S−1)が得られた。
【0045】
【実施例1〜10】
、
【比較例1〜5】
〈主剤の調製〉
表1に示す割合でシリル化ウレタン樹脂、反応性ケイ素基を含有するゴム系有機重合体(通称変成シリコーン)、エポキシ樹脂硬化剤及び粉体をプラネタリーミキサーに入れ、減圧下100℃で加熱脱水した後、室温まで冷却し、アミノ基及び加水分解性ケイ素基含有化合物(KBM903、KBM603)を表1に示す割合で添加し、主剤を得た。
但し、比較例1についてはプラネタリーミキサー中で加熱脱水するとゲル化して主剤を調製することができないので、冷却しながら混合し主剤を調製したが、この主剤も貯蔵安定性が非常に悪く、50℃3日でゲル化し、常温(23℃)においても、1週間で著しく増粘し、2週間でゲル化し、実質上実用に供することは不可能であった。
【0046】
〈硬化剤の調製〉
表1に示す割合でエポキシ樹脂、シリル化ウレタン系樹脂の硬化剤、反応性ケイ素基を含有するゴム系有機重合体(通称変成シリコーン)の硬化剤及び粉体をプラネタリーミキサーに入れ、混練りし、硬化剤を得た。
表1中の上記S−1〜S−6以外の記号(商品名)の詳細は以下の通りである。
SAT200:鐘淵化学工業社製、分子末端メチルジメトキシシリル型の変成シリコーン樹脂
MA430:鐘淵化学工業社製、(メタ)アクリロイル基含有モノマー重合分子末端メチルジメトキシシリル型の変成シリコーン樹脂
アンカミンK−54:エアープロダクト社製、3級アミン
白艶華CC−R:白石工業社製、表面処理炭酸カルシウム
ホワイトンSB:白石工業社製、表面未処理炭酸カルシウム
エピコートE828:油化シェルエポキシ社製、ビスフェノールA型エポキシ樹脂
No.918:三共有機合成社製、有機錫触媒
【0047】
【表1】
【0048】
《接着強さの測定》
得られた主剤と硬化剤を2:1の割合で混合し、各種試験材料に対する引張せん断接着強さ及び剥離接着強さを測定し、表2に結果を記した。また、主剤の貯蔵安定性についても併記した。
接着条件及び養生条件、測定条件は以下の通りである。
○試験材料
・SUS:1.5mm 厚ステンレス材 SUS304( 2B) 2.5cm×10cm
・アルミ:1.6mm 厚アルミニウム材 A1050P 2.5cm ×10cm
・鋼板:1.5mm 厚SPCC( SB) 材 2.5cm ×10cm
・ABS板:3mm 厚ABS材 2.5cm ×10cm
・アクリル板:3mm 厚アクリル材 2.5cm ×10cm
・薄鋼板:0.3mm 厚SPCC( SD) 材 2.5cm ×20cm
・アルミ箔:0.1mm 厚アルミニウム材 2.5cm ×20cm
・SBRシート:2mm 厚加硫SBRシート 2.5cm ×20cm
【0049】
○接着条件・養生条件
被着材表面に塗布して薄く伸ばし、温度23℃、相対湿度50%の条件で貼りあわせた。貼りあわせ面積は、引張せん断試験体が2.5cm ×2.5cm 、剥離試験体が2.5cm ×10cmとなる様にした。
貼りあわせた試験体を温度23℃、相対湿度50%の条件で7日間放置し引張せん断試験及び剥離試験の試験体とした。
○引張せん断試験条件・剥離試験条件
JISK6850及びJISK6854に従い、引張せん断接着強さ(図1(a)参照)及び剥離接着強さ接着強さ(図1(b)参照)を測定した。
○主剤貯蔵安定性: 50℃×2週間貯蔵後増粘率1.2 倍以内→○、ゲル化→×
【0050】
【表2】
【0051】
【発明の効果】
以上述べたことから明らかなように、本発明によれば、室温硬化させた場合に、優れた伸び、引張りせん断接着強さ、及び剥離接着強さを共にバランスして発揮する、特に接着剤、シーリング剤及び塗料に好適な硬化性樹脂組成物を提供することができるので、産業界に多大の貢献をすることができる。
【図面の簡単な説明】
【図1】引張せん断接着強さ及び剥離接着強さの試験方法の概略を説明する図である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a curable resin composition containing as a main component a silylated urethane resin, an epoxy resin, an amino group, and a hydrolyzable silicon group-containing compound used for adhesives, sealing agents, paints, various molding materials and the like.
[0002]
[Prior art]
Epochin resin has been widely used as an adhesive because it has a high cohesive force and can be used without using a solvent. However, since the hardened film is generally hard, it is not suitable for adhesion at a place where elongation is required, and has a drawback that it is resistant to peeling although it is strong against tension and shear.
In order to improve this drawback, Patent Document 1 describes combining a modified silicone resin with an epoxy resin.
However, this improved technique has poor storage stability when the modified silicone resin has a urea bond in the molecule (see Comparative Example 1 described later), and when the modified silicone resin does not have a substituted urea bond in the molecule, When heated and cured (50 ° C x 3 days), the elongation and peel bond strength are improved. However, when cured at room temperature, the excellent tensile shear bond strength that is inherent to epoxy resins is not exhibited ( It is difficult to say that sufficient improvements have been made (see Comparative Examples 2 and 3 described later).
[Patent Document 1]
Japanese Patent Publication No. 3-31726
[0003]
[Problems to be solved by the invention]
The present invention provides a balance between excellent elongation, tensile shear adhesive strength, and peel adhesive strength when cured at room temperature, and has improved storage stability, particularly adhesives and sealants. Another object of the present invention is to provide a curable resin composition suitable for a paint.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present inventors have conducted intensive research, and as a result, obtained a curable resin composition.
In this case, in place of the modified silicone resin described in Patent Document 1, by blending a specific silylated urethane resin having a substituted urea bond in the molecule, when cured at room temperature, excellent elongation and peel adhesion strength are obtained. In addition, the present inventors have found that a curable resin composition that balances and exhibits both tensile shear adhesive strength and improved storage stability can be obtained, thereby completing the present invention.
That is, the present invention is as follows.
1. The main chain is a polyoxyalkylene polymer, has a reactive silicon group at its molecular end, and contains a silylated urethane resin (A) having a substituted urea bond in the molecule, an amino group and a hydrolyzable silicon group A mixture (I) comprising the compound (B) and a curing agent (C) of the epoxy resin (D);
Containing a mixture (II) composed of an epoxy resin (D) and a curing agent (E) of the silylated urethane resin (A),
The ratio of (A) in the mixture (I) to (D) in the mixture (II) is (A) / (D) = 15/85 to 80/20 by mass ratio,
The ratio of [(A) + (D)] to (B) in the mixture (I) is [(A) + (D)] / (B) = 100 / 0.1-100 / 20 and
The ratio of (D) to (C) in the mixture (I) is (D) / (C) = 100 / 0.1 to 100/300 by mass ratio,
The ratio of (A) to (E) in the mixture (II) is (A) / (E) = 100 / 0.01 to 100/20 by mass ratio.
A curable resin composition characterized by that.
2. 2. The curable resin composition as described in 1 above, wherein the main chain of the silylated urethane resin (A) is a polyoxyalkylene polymer containing polyoxyethylene.
3. 3. The curable resin composition as described in 1 or 2 above, wherein the silylated urethane resin (A) has at least one amino group in the molecule.
4). 4. The curable resin composition as described in any one of 1 to 3 above, wherein the silylated urethane resin (A) has a weight average molecular weight of 5000 to 50000.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, each component of the present invention will be described in detail.
(1)Silylated urethane resin (A) having a main chain of a polyoxyalkylene polymer, a reactive silicon group at the molecular end, and a substituted urea bond in the moleculeAbout the silylated urethane resin (A), the main chain is a polyoxyalkylene polymer in the molecule (hereinafter sometimes simply referred to as silylated urethane resin (A) or (A)). A urethane resin having a group represented by the following general formula (1) and a group represented by the following general formula (2).
[Chemical 1]
[Chemical 2]
However, R1Is a group represented by the following general formula (3), the following general formula (4), the following general formula (5), or the following general formula (6), a phenyl group, or a substituted or unsubstituted group having 1 to 20 carbon atoms. Organic group is R2Represents a substituted or unsubstituted organic group having 1 to 20 carbon atoms, X represents a hydroxyl group or a hydrolyzable group, and n represents 0, 1, or 2.
[0006]
[Chemical Formula 3]
[Formula 4]
[Chemical formula 5]
[Chemical 6]
However, R3Is a hydrogen atom or -COOR11R4Is a hydrogen atom or a methyl group, R5Is -COOR12Or a nitrile group, R6Is a substituted or unsubstituted divalent organic group having 1 to 20 carbon atoms, R7Represents an organic group which may contain a silicon atom having a molecular weight of 500 or less, R8And R9Is a group represented by the above general formula (3) or the following general formula (7) (however, R7Is as defined above. ), R10Represents a phenyl group, a cyclohexyl group, or a substituted or unsubstituted monovalent organic group having 1 to 20 carbon atoms, and R11And R12Represents an organic group having a molecular weight of 500 or less.
[Chemical 7]
[0007]
Examples of the hydrolyzable group of X in the general formula (2) include an alkoxy group, an acetoxy group, and an oxime group, and an alkoxy group is particularly preferable.
The silylated urethane-based resin (A) is a compound having a main chain of a polyoxyalkylene polymer and having one or more groups selected from a hydroxyl group, a primary amino group or a secondary amino group in its molecule (hereinafter referred to as “a”). , Compound (a)) and a polyisocyanate compound (hereinafter also referred to as compound (b)) to produce a urethane prepolymer, and further, urethane prepolymer and the following general formula (8) It can manufacture by making the compound (henceforth a compound (c)) represent. (The resin shown in Japanese Patent No. 3030020 is included.)
The polyoxyalkylene polymer used as a raw material for the compound (a) is preferably a hydroxyl-terminated polymer produced by reacting a monoepoxide or the like with an initiator in the presence of a catalyst. As the initiator, a hydroxy compound having one or more hydroxyl groups can be used.
[0008]
As the monoepoxide, ethylene oxide, propylene oxide, butylene oxide, hexylene oxide, tetrahydrofuran, or the like can be used in combination.
Examples of the catalyst include alkali metal catalysts such as potassium compounds and cesium compounds, composite metal cyanide complex catalysts, and metal porphyrin catalysts. The complex metal cyanide complex catalyst is preferably a complex mainly composed of zinc hexacyanocobaltate, an ether and / or alcohol complex. The composition of the ether and / or alcohol complex essentially described in JP-B-46-27250 can be used. As the ether, ethylene glycol dimethyl ether (glyme), diethylene glycol dimethyl ether (diglyme) and the like are preferable, and glyme is particularly preferable from the viewpoint of handling during the production of the complex. As the alcohol, for example, those described in JP-A-4-145123 can be used, and tert-butanol is particularly preferable.
[0009]
As the raw material polyoxyalkylene polymer, those having a number average molecular weight of 500 to 30,000, particularly 2,000 to 20,000 are preferably used.
The raw material polyoxyalkylene polymer preferably has 2 or more functional groups, and specific examples thereof include copolymers such as polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxyhexylene and polyoxytetramethylene. . Preferred raw material polyoxyalkylene polymers are divalent to hexavalent polyoxypropylene polyols, particularly oxyethylene / oxypropylene copolymers, polyoxypropylene diols and polyoxypropylene triols.
Compound (a) is commercially available (for example, P-2000, P-3000: trade names, manufactured by Asahi Denka Kogyo Co., Ltd., PML-3005, PML-3010, PML-3012, PML-4002, PML-4010, PML). -5005: trade name, manufactured by Asahi Glass Co., Ltd., Sumiphen 3600, Sumiphen 3700, SBU-Polyol 0319: trade name, manufactured by Sumitomo Bayer Urethane Co., Ltd.), and the like can be used in the present invention. In addition, polyoxypropylene having a primary amino group at the terminal (Jeffamine D-230, D-400, D-2000: trade name, manufactured by Sun Techno Japan) or polyoxypropylene having a secondary amino group (Jeffer) Min D-230, D-400, D-2000 (same as above) can be obtained by a method of reacting one or more selected from α, β-unsaturated carbonyl compound, maleic acid diester and acrylonitrile. .) Can be used.
[0010]
Examples of the compound (b) include diisocyanate compounds, polyisocyanate compounds excluding diisocyanate compounds, and the like. Examples of the diisocyanate compound include aliphatic, alicyclic, araliphatic, and aromatic diisocyanate compounds. Specific examples thereof will be given below.
Aliphatic diisocyanate compounds: trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, 2, 4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl caproate, and the like.
[0011]
Alicyclic diisocyanate compounds: 1,3-cyclopentene diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 4,4'-methylenebis (cyclohexyl) Isocyanate), methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanatomethyl) cyclohexane, isophorone diisocyanate and the like. Aroaliphatic diisocyanate compounds: 1,3- or 1,4-xylylene diisocyanate or mixtures thereof, ω, ω'-diisocyanate-1,4-diethylbenzene, 1,3- or 1,4-bis (1-isocyanate) -1-methylethyl) benzene or a mixture thereof. Aromatic diisocyanate compounds: m-phenylene diisocyanate, p-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4- or 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, and the like.
Examples of the polyisocyanate compound excluding the diisocyanate compound include aliphatic, alicyclic, araliphatic, and aromatic polyisocyanate compounds.
[0012]
Specific examples thereof will be given below.
Aliphatic polyisocyanate compounds: lysine ester triisocyanate, 1,4,8-triisocyanate octane, 1,6,11-triisocyanate undecane, 1,8-diisocyanate-4-isocyanate methyloctane, 1,3,6-tri Isocyanate hexane, 2,5,7-trimethyl-1,8-diisocyanate-5-isocyanate methyloctane, and the like.
[0013]
Alicyclic polyisocyanate compound: 1,3,5-triisocyanatecyclohexane, 1,3,5-trimethylisocyanatecyclohexane, 3-isocyanate-3,3,5-trimethylcyclohexylisocyanate, 2- (3-isocyanatepropyl)- 2,5-di (isocyanatomethyl) -bicyclo [2,2,1] heptane, 2- (3-isocyanatopropyl) -2,6-di (isocyanatomethyl) -bicyclo [2,2,1] heptane, 5 -(2-isocyanatoethyl) -2-isocyanatomethyl-3- (3-isocyanatopropyl) -bicyclo [2,2,1] heptane, 6- (2-isocyanatoethyl) -2-isocyanatomethyl-3- (3 -Isocyanatopropyl) -bicyclo [2,2,1] heptane, -(2-isocyanatoethyl) -2-isocyanatomethyl-2- (3-isocyanatopropyl) -bicyclo [2,2,1] heptane, 6- (2-isocyanatoethyl) -2- (3-isocyanatopropyl)- Bicyclo [2,2,1] heptane and the like.
[0014]
Aro-aliphatic polyisocyanate compound: 1,3,5-triisocyanate methylbenzene and the like.
Aromatic polyisocyanate compounds: triphenylmethane-4,4 ′, 4 ″ -triisocyanate, 1,3,5-triisocyanatebenzene, 2,4,6-triisocyanatotoluene, 4,4′-diphenylmethane-2, 2 ', 5,5'-tetraisocyanate and the like.
Other polyisocyanate compounds: diisocyanates containing a sulfur atom such as phenyl diisothiocyanate.
[0015]
The compound (c) is a compound represented by the following general formula (8).
[Chemical 8]
However, R1, R2, X and n are as defined above, and Y is a substituted or unsubstituted divalent organic group having 1 to 20 carbon atoms, represented by the following general formula (9) or the following general formula (10). Each group is shown below.
[Chemical 9]
[Chemical Formula 10]
However, R3, R4, R5And R7Is equivalent to the above definition and R13And R14Represents a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms.
[0016]
Specific examples of the compound (c) include N-phenyl-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropylmethyldimethoxysilane, N- (n-butyl) -γ-aminopropyltrimethoxysilane, N- (n-butyl) -γ-aminopropylmethyldimethoxysilane, N-ethylaminoisobutyltrimethoxysilane, N-methylaminopropylmethyldimethoxysilane, N-methylaminopropyltrimethoxysilane, bis (trimethoxysilylpropyl) An amine etc. are mentioned.
[0017]
<< In addition, the compound (c) represented by the said General formula (8) can also be manufactured by the method of the following (1)-(7).
(1) R1Is a group represented by the above general formula (3), Y is a divalent organic group, a primary amino group and a hydrolyzable group-containing silicon group or a hydroxyl group-containing silicon group (preferably hydrolyzable group-containing silicon) 1 selected from a compound (compound (d)) each having one group) and a chemical equivalent of an α, β-unsaturated carbonyl compound (compound (e)), a maleic acid diester (compound (f)) and acrylonitrile. Method of reacting species or two or more species
(2) R1Is a compound represented by the above general formula (3), and Y is a compound represented by the above general formula (9)
A compound having a primary amino group, a secondary amino group and a hydrolyzable group-containing silicon group or a hydroxyl group-containing silicon group (preferably a hydrolyzable group-containing silicon group) (compound (g)), and a compound A method of reacting the primary amino group and secondary amino group in (g) with one or more selected from chemical equivalents of compound (e), compound (f) and acrylonitrile.
[0018]
(3) R1Is represented by the above general formula (3), and Y is represented by the above general formula (10)
The compound (g) is reacted with a primary amino group in the compound (g) and one or more selected from the chemical equivalents of the compound (e), the compound (f) and acrylonitrile, and then the compound ( g) the formula of chemical equivalents with secondary amino groups in R7NCO (R7Is a method of reacting a monoisocyanate compound (compound (h)) represented by
(4) R1Is represented by the above general formula (4), and Y is a divalent organic group
Method of reacting compound (g) with primary amino group in compound (g) and chemical equivalent of compound (h)
[0019]
(5) R1Is represented by the above general formula (5) and R in the general formula (5)8And R9Is a compound represented by the above general formula (3), wherein Y is a divalent organic group
Method of reacting compound (g) with one or more selected from the primary amino group in compound (g) and two chemical equivalents of compound (e), compound (f) and acrylonitrile
(6) R1Is represented by the above general formula (5) and R in the general formula (5)8Is represented by the above general formula (3) and R9Is represented by the above general formula (7), and Y is a divalent organic group
This reaction after reacting the compound (g) with one or more selected from the compound (e), the compound (f) and acrylonitrile in a chemical equivalent with the primary amino group in the compound (g) A method of reacting the secondary amino group produced by the above and a chemical equivalent of the compound (h).
(7) R1Is a compound represented by the above general formula (6), wherein Y is a divalent organic group
A method in which compound (d) is reacted with a primary amino group in compound (d) and a chemical equivalent of a maleimide compound (compound (i)).
[0020]
Examples of the compound (d) include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, aminophenyltrimethoxysilane, and the like.
[0021]
Examples of the compound (e) include (meth) acrylic compounds, vinyl ketone compounds, vinyl aldehyde compounds, and other compounds. As (meth) acrylic compounds, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate , Pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl acrylate, nonyl (meth) acrylate, decyl ( (Meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, octadecyl (meth) acrylate Stearyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, butoxyethyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, phenoxyethyl (meth) acrylate, polyethylene glycol ( (Meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, ethoxyethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, dicyclopentadienyl (meth) ) Acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) ) Acrylate, tricyclodecanyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, diacetone (meth) acrylate, isobutoxymethyl (meth) acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, N- Vinyl formaldehyde, N, N-dimethylacrylamide, t-octylacrylamide, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 7-amino-3,7-dimethyloctyl (meth) acrylate, N, N-dimethyl In addition to (meth) acrylamide, N, N'-dimethylaminopropyl (meth) acrylamide, acryloylmorpholine, etc., trade names manufactured by Toagosei Chemical Industry Co., Ltd .: Aronix M-102, M-111, M- 114, M-117, Nippon Kayaku Co., Ltd. trade name: Kayahard TC110S, R629, R644, Osaka Organic Chemical Co., Ltd. trade name: Viscote 3700, etc.
[0022]
Further, trimethylolpropane tri (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane trioxyethyl (meth) acrylate, tris (2-hydroxy Ethyl) isocyanurate tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate , A polyfunctional compound such as epoxy (meth) acrylate obtained by adding (meth) acrylate to glycidyl ether of bisphenol A, and a commercial name of the product made by Mitsubishi Chemical Co., Ltd .: Iupimer UV, SA1002, SA2007, Osaka Organic Chemical Co., Ltd. trade name: Biscote 700, Nippon Kayaku Co., Ltd. trade name: Kayahard R604, DPCA-20, DPCA-30, DPCA-60, DPCA-120, HX-620, D-310, D-330, trade names manufactured by Toagosei Co., Ltd .: Aronix M-210, M-215, M-315, M-325, etc.
[0023]
In addition to the above compounds, γ-methacryloxypropyltrimethoxysilane having an alkoxysilyl group, γ-methacryloxypropyltriethoxysilane, γ-methacryloxymethyldimethoxysilane, γ-methacryloxymethyldiethoxysilane, γ-acryloxy Examples thereof include propyltrimethoxysilane and γ-acryloxymethyldimethoxysilane.
Examples of vinyl ketone compounds include vinyl acetone, vinyl ethyl ketone, and vinyl butyl ketone, examples of vinyl aldehyde compounds include acrolein, methacrolein, and crotonaldehyde, and examples of other compounds include maleic anhydride, itaconic anhydride, and itaconic acid. , Crotonic acid, N-methylolacrylamide, diacetone acrylamide, N- [3- (dimethylamino) propyl] methacrylamide, N, N-dimethylacrylamide, N, N-diethylacrylamide, Nt-octylacrylamide, N- Examples include isopropylacrylamide.
[0024]
In addition to the above compounds, compounds containing a fluorine atom, a sulfur atom or a phosphorus atom are also included. Examples of the compound containing a fluorine atom include perfluorooctylethyl (meth) acrylate and trifluoroethyl (meth) acrylate, and examples of the compound containing a phosphorus atom include (meth) acryloxyethyl phenyl acid phosphate.
Among the compounds (e), methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, t-butyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, from the viewpoint of easy reaction, wide commercial availability, and availability. Lauryl acrylate and the like are preferable. Of these, methyl acrylate and ethyl acrylate are particularly preferable for imparting fast curability, and 2-ethylhexyl acrylate and lauryl acrylate are particularly desirable for imparting flexibility. Moreover, 1 type (s) or 2 or more types can be used for a compound (e).
[0025]
Examples of the compound (f) (maleic acid diester) include dimethyl maleate, diethyl maleate, dibutyl maleate, di-2-ethylhexyl maleate, dioctyl maleate and the like, and these can be used alone or in combination. Among these, dimethyl maleate, diethyl maleate, dibutyl maleate, and di-2-ethylhexyl maleate are preferred from the viewpoint of easy reaction and wide commercial availability. Moreover, 1 type (s) or 2 or more types can be used for a compound (f).
[0026]
Examples of the compound (g) include N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-amino. Propylmethyldimethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N-3- [amino (dipropyleneoxy)] aminopropyltrimethoxysilane, (aminoethylaminomethyl) phenethyltrimethoxysilane N- (6-aminohexyl) aminopropyltrimethoxysilane, N- (2-aminoethyl) -11-aminoundecyltrimethoxysilane, and other special aminosilanes manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM6063, X-12-896, KBM576, X-12-565, X-12-58 0, X-12-5263, KBM6123, X-12-575, X-12-562, X-12-5202, X-12-5204, KBE9703 and the like.
Among the above compounds (g), N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl)-, from the viewpoint of easy reaction, wide commercial availability, and availability. γ-aminopropyltriethoxysilane and N-β (aminoethyl) -γ-aminopropylmethyldimethoxysilane are preferred.
[0027]
Examples of the compound (h) include ethyl isocyanate, n-hexyl isocyanate, n-dodecyl isocyanate, p-toluenesulfonyl isocyanate, n-hexyl isocyanate, benzyl isocyanate, 2-methoxyphenyl isocyanate, and the like. Brand name: Shin-Etsu Chemical Co., Ltd. brand name: Isocyanate silane such as KBM9007 (γ-isocyanatopropyltrimethoxysilane).
Examples of the compound (i) include N-phenylmaleimide, N-cyclohexylmaleimide, hydroxyphenylmonomaleimide, N-laurelmaleimide, diethylphenylmonomaleimide, N- (2-chlorophenyl) maleimide and the like. 》
Among the silylated urethane resins (A) of the present invention, silylated urethane resins (A) (Claim 3) having at least one amino group in the molecule are preferred for the following reasons.
When the silylated urethane-based resin (A) has an amino group, for example, as shown in the following formula 1, the silylated urethane-based resin (A) is linked with the epoxy resin (D), thereby further improving tensile strength. There is provided a curable resin composition that exhibits shear bond strength and peel bond strength.
The silylated urethane-based resin (A) having at least one amino group in the molecule is a hydroxyl group-containing tertiary amine (DABCO-T or the like), [0017] as shown in Synthesis Examples 3 to 6 described later. Or the compound (c) synthesized by the method (2) or (5) described in [0019].
[Formula 1]
[0028]
The weight average molecular weight of silylated urethane type resin (A) is 5000-50000, Preferably it is 6000-40000, More preferably, it is 7000-30000. If the weight average molecular weight is less than 5,000, it is disadvantageous in that the cured product becomes hard and brittle, and if it exceeds 50,000, it is disadvantageous in that the viscosity increases.
[0029]
(2)About amino group and hydrolyzable silicon group-containing compound (B)
As the above-mentioned (B) amino group and hydrolyzable silicon group-containing compound (hereinafter sometimes simply referred to as (B)), the compound (c) described in the above (1) silylated urethane resin (A), As the compound (d), compound (g), amino group-containing silicate and compound, manufactured by Asahi Kasei Wacker, trade names: SLJ7502, SLJ7502 / 2, SLJ7503 and the like can be used.
These representative examples are listed as follows.
Compound (c)
N-phenyl-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropylmethyldimethoxysilane, N- (n-butyl) -γ-aminopropyltrimethoxysilane, N- (n-butyl) -γ- Aminopropylmethyldimethoxysilane, N-ethylaminoisobutyltrimethoxysilane, N-methylaminopropylmethyldimethoxysilane, N-methylaminopropyltrimethoxysilane, bis (trimethoxysilylpropyl) amine
Compound (d)
γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, aminophenyltrimethoxysilane
[0030]
Compound (g)
N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyldimethoxysilane, N- β (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N-3- [amino (dipropyleneoxy)] aminopropyltrimethoxysilane, (aminoethylaminomethyl) phenethyltrimethoxysilane, N- (6-amino) Hexyl) aminopropyltrimethoxysilane, N- (2-aminoethyl) -11-aminoundecyltrimethoxysilane, and other special aminosilanes manufactured by Shin-Etsu Chemical Co., Ltd., trade names: KBM6063, X-12-896, KBM576 , X-12-565, X-12-580, X-12-5263 , KBM6123, X-12-575, X-12-562, X-12-5202, X-12-5204, KBE9703
[0031]
(3)About curing agent (C) of epoxy resin (D)
The (C) epoxy resin (D) curing agent (hereinafter sometimes simply referred to as (C)) is not particularly limited as long as it is a commonly used curing agent. For example, ethylenediamine, diethylenetriamine, Aliphatic amines such as triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, hexamethylenediamine, methylpentamethylenediamine, trimethylhexamethylenediamine, guanidine, oleylamine, etc .; mensendiamine, isophoronediamine, norbornanediamine, piperidine, N, N′-dimethylpiperazine, N-aminoethylpiperazine, 1,2-diaminocyclohexane, bis (4-amino-3-methylcyclohexyl) methane, bis (4-aminocyclohexyl) methane, polysic Hexylpolyamine, alicyclic amines such as 1,8-diazabicyclo [5,4,0] undecene-7 (DBU); metaphenylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, etc. Aromatic aliphatic amines such as m-xylylenediamine, benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol; Bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro [5,5] undecane (ATU), morpholine, N-methylmorpholine, polyoxypropylenediamine, polyoxypropylenetriamine, polyoxyethylenediamine, etc. Amines having an ether bond: diethanolamine, tri Hydroxyl-containing amines such as tanolamine; acid anhydrides such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, dodecyl succinic anhydride; diethylenetriamine and triethylenetetramine as dimer acids Polyamides such as polyamides obtained by reacting polyamines of the above, polyamides using polycarboxylic acids other than dimer acids; imidazoles such as 2-ethyl-4-methylimidazole; dicyandiamide; polyoxypropylene diamines, polyoxy Polyoxypropylene-based amines such as propylene-based triamines; phenols; epoxy-modified amines obtained by reacting the above amines with epoxy compounds; obtained by reacting the above amines with formalin and phenols Modified amines such as Mannich-modified amine, Michael addition-modified amine and ketimine; compounds such as amine salts such as 2-ethylhexanoate of 2,4,6-tris (dimethylaminomethyl) phenol can be used.
These curing agents may be used alone or in combination of two or more. Among these curing agents for epoxy resins, 2,4,6-tris (dimethylaminomethyl) phenol and polyoxypropylene diamine are preferable from the viewpoint of curability and physical property balance.
[0032]
(4)About epoxy resin (D)
As the epoxy resin (D) (hereinafter, simply referred to as (D)), conventionally known ones can be widely used. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, biphenyl Type epoxy resin, bisphenol S type epoxy resin or epoxy resin hydrogenated with these, glycidyl ester type epoxy resin, glycidylamine type epoxy resin such as tetraglycidylaminodiphenylmethane, and polyfunctional glycidyl ether type epoxy such as tetraphenylglycidyl ether ethane Resin, alicyclic epoxy resin, novolac epoxy resin, urethane-modified epoxy resin having urethane bond, fluorinated epoxy resin, rubber-modified epoxy resin containing polybutadiene or NBR, tetrabromo The flame retardant epoxy resins such as glycidyl ethers of scan phenol A and the like. These epoxy resins may be used alone or in combination of two or more. Among these epoxy resins, bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferable from the viewpoint of balance of workability, curability, adhesive strength, adherend versatility, water resistance, durability and the like.
[0033]
(5)About curing agent (E) of silylated urethane resin (A)
Examples of the curing agent (E) of the silylated urethane resin (A) (hereinafter sometimes simply referred to as (E)) include organic tin compounds, metal complexes, basic compounds, organic phosphorus compounds, and water (in the air Humidity) can be used. Specifically, as the organic tin compound, dibutyltin dilaurate, dioctyltin dimaleate, dibutyltin phthalate, stannous octylate, dibutyltin methoxide, dibutyltin diacetylacetate, dibutyltin diversate, dibutyltin oxide, dibutyltin oxide and In addition to the reaction product with phthalic acid diester, for example, U-303, U-700, U-700ES: trade names, manufactured by Nitto Kasei Co., Ltd. and the like can be mentioned.
Examples of metal complexes include titanate compounds such as tetrabutyl titanate, tetraisopropyl titanate, triethanolamine titanate, lead octylate, lithium naphthenate, lead naphthenate, nickel naphthenate, cobalt naphthenate, bismuth octylate, bismuth versatate. And metal acetylacetonate complexes such as carboxylic acid metal salts, aluminum acetylacetonate complexes, vanadium acetylacetonate complexes, and the like.
[0034]
Basic compounds include aminosilanes such as γ-aminopropyltrimethoxysilane and γ-aminopropyltriethoxysilane, quaternary ammonium salts such as tetramethylammonium chloride and benzalkonium chloride, DABCO manufactured by Sankyo Air Products Co., Ltd. (R) series, DABCO BL series, 1,8-diazabicyclo [5.4.0] undec-7-ene-containing linear or cyclic tertiary amines and quaternary ammonium salts containing a plurality of nitrogen, Examples thereof include boron trifluoride amine complex salts such as boron trifluoride piperidine complex salts.
Examples of the organic phosphorus compound include monomethyl phosphoric acid, di-n-butyl phosphoric acid, and triphenyl phosphate.
[0035]
(6)About compounding ratio of said (A)-(E) component
(1) The ratio of (A) in the mixture (I) to (D) in the mixture (II) is (A) / (D) = 15/85 to 95/5, preferably 20 / 80 to 90/10, more preferably 30/70 to 80/20. If (A) / (D) is less than 15/85, it is disadvantageous in that it becomes hard and brittle, and if it is more than 95/5, it is inconvenient because toughness is insufficient.
(2) The ratio of [(A) + (D)] to (B) in the mixture (I) is [(A) + (D)] / (B) = 100 / 0.1 in mass ratio. To 100/20, preferably 100 / 0.2 to 100/15, more preferably 100 / 0.5 to 100/10. When [(A) + (D)] / (B) is less than 100/20, it is inconvenient in that the curing of the silylated urethane resin is delayed, and when it is more than 100 / 0.1, This is inconvenient because the adhesion to the plastic material is reduced.
[0036]
(3) The ratio of (D) to (C) in the mixture (I) is (D) / (C) = 100 / 0.1 to 100/300, preferably 100 / 0.5 in mass ratio. To 100/150, more preferably 100/1 to 100/100. When the ratio (D) / (C) is less than 100/300, it is inconvenient in that the component (C) bleeds and contaminates the adherend, and when it exceeds 100 / 0.1, It is inconvenient because curing is insufficient.
(4) The ratio of (A) to (E) in the mixture (II) is (A) / (E) = 100 / 0.1 to 100/20, preferably 100 / 0.2. To 100/15, more preferably 100 / 0.5 to 100/10. Even if it is less than (A) / (E) = 100/20, it is inconvenient in that the curing of the silylated urethane resin is not promoted. It is inconvenient because it becomes insufficient.
[0037]
The curable resin composition of the present invention comprises a silylated urethane-based resin (A), an amino group and hydrolyzable silicon group-containing compound (B) based on the blending ratios of (1) to (4) above. A mixture (I) comprising a curing agent (C) of an epoxy resin (D) as a main component, and a mixture (E) of an epoxy resin (D) and a curing agent (E) of a silylated urethane resin (A) ( II) is used as a curing agent component, and then both components (I) and (II) are mixed and used.
The curable resin composition of the present invention contains the above (A) to (E) as active ingredients, but can contain fillers and various additives as appropriate in addition to these active ingredients.
Examples of the filler include fumed silica, calcium carbonate, magnesium carbonate, clay, talc, silica, and various balloons.
Examples of the various additives include a plasticizer, an additive, a solvent, a dehydrating agent, a storage stabilizer for the curing agent (E), and the like. Examples of the plasticizer include phthalates such as dioctyl phthalate and dibutyl phthalate, and aliphatic carboxylic acid esters such as dioctyl adipate and dibutyl sebacate.
[0038]
Examples of the additive include an antioxidant, a thixotropic agent, an ultraviolet absorber, a pigment, various tackifiers, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, and an epoxy such as bisphenol A type or bisphenol F type. Examples thereof include resins. As the silane coupling agent, aminosilane is particularly preferable.
Any solvent may be used as long as it is compatible with the curable resin composition and the like and has a moisture content of 500 ppm or less.
Examples of the dehydrating agent include quick lime, orthosilicate, anhydrous sodium sulfate, zeolite, methyl silicate, ethyl silicate, various alkylalkoxysilanes, and various vinylalkoxysilanes.
Octyl acid can be used as a storage stabilizer for the curing agent (E).
[0039]
【Example】
The present invention will be described in detail below with reference to examples, but it goes without saying that the present invention is not limited to these examples.
<Synthesis of Silylated Urethane Resin (A) Having Reactive Silicon Group at Molecular Terminal and Substituted Urea Bond in Molecule>
(Synthesis Example 1)
(1) 1,000 g of Takelac P-28 (trade name: Takeda Pharmaceutical Co., Ltd., polyoxypropylene diol having a number average molecular weight of 4,000), Sumijoule T-80 (trade name: manufactured by Sumitomo Bayer Urethane Co., Ltd.) The diisocyanate) was put in a reactor at a rate of 87.1 g and reacted at 90 ° C. for 3 hours with stirring in a nitrogen atmosphere to obtain a urethane prepolymer (PUR-1).
(2) KBM902 (trade name: γ-aminopropylmethyldimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.) was mixed at a rate of 163.3 g and 2-ethylhexyl acrylate was mixed at a rate of 184.3 g and reacted at 23 ° C. for 7 days. A product (AS-1) was obtained.
(3) 1,000 g of urethane prepolymer (PUR-1) and 175.9 g of reactant (AS-1) are put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. A liquid silylated urethane resin (SU-1) was obtained.
[0040]
(Synthesis Example 2)
(1) 1,000 g of Takelac P-28, 1,000 g of PML-5005 (trade name: manufactured by Asahi Glass Co., Ltd., molecular weight 25% polyoxyethylene addition type polyoxypropylene diol having a number average molecular weight of 4,000), Sumi Joule T-80 was charged into the reactor at a rate of 174.2 g and reacted at 90 ° C. for 3 hours under stirring in a nitrogen atmosphere to obtain a urethane prepolymer (PUR-2).
(2) 1,000 g of urethane prepolymer (PUR-2) and 175.9 g of reactant (AS-1) are put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. A liquid silylated urethane resin (SU-2) was obtained.
[0041]
(Synthesis Example 3)
(1) 1,000 g of urethane prepolymer (PUR-2) and 139.0 g of reactant (AS-1) were put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. Then, 22.0 g of DABCO-T (trade name: manufactured by Sankyo Air Products, N, N, N′-trimethylaminoethylethanolamine) is added and reacted at 90 ° C. for 1 hour to have an amino group in the molecule. A liquid silylated urethane resin (SU-3) was obtained.
(Synthesis Example 4)
(1) KBM602 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd., N- (β-aminoethyl) γ-aminopropylmethyldimethoxysilane) was mixed at a rate of 206.4 g and butyl acrylate at a rate of 256.3 g, and at 23 ° C. Reaction was performed for 7 days to obtain a reaction product (AS-2).
(2) 1,000 g of urethane prepolymer (PUR-2) and 215.9 g of reactant (AS-2) are put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. A liquid silylated urethane resin (SU-4) was obtained.
[0042]
(Synthesis Example 5)
(1) 1,000 g of PML4011 (trade name: manufactured by Asahi Glass Co., Ltd., polyoxypropylene diol having a number average molecular weight of 10,000), PR-5007 (trade name: manufactured by Asahi Denka Kogyo Co., Ltd., 25 having a number average molecular weight of 5,000) % Polyoxyethylene random addition type polyoxypropylene diol) and Sumijoule T-80 at a rate of 04.5 g in a reactor and reacted at 90 ° C. for 3 hours with stirring in a nitrogen atmosphere. A prepolymer (PUR-3) was obtained.
(2) 1,000 g of urethane prepolymer (PUR-3) and 145.1 g of reactant (AS-2) are put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. A liquid silylated urethane resin (SU-5) was obtained.
[0043]
(Synthesis Example 6)
(1) KBM603 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd., N- (β-aminoethyl) γ-aminopropyltrimethoxysilane) was mixed at a rate of 222.4 g and butyl acrylate at a rate of 256.4 g, at 23 ° C. Reaction was performed for 7 days to obtain a reaction product (AS-3).
(2) 1,000 g of urethane prepolymer (PUR-3) and 150.2 g of reactant (AS-3) are put in a reactor and reacted at 90 ° C. for 1 hour with stirring in a nitrogen atmosphere. A liquid silylated urethane resin (SU-6) was obtained.
(Synthesis Example 7)
(1) In order to obtain a rubber-based organic polymer containing a reactive silicon group, 1,000 g of urethane prepolymer (PUR-1) and 89.8 g of KBM902 were put in a reactor, and under a nitrogen atmosphere, When the reaction was carried out at 90 ° C. for 1 hour with stirring, the desired rubber-based organic polymer containing a reactive silicon group was not obtained.
[0044]
(Synthesis Example 8)
(1) In order to obtain a rubber-based organic polymer containing a reactive silicon group, 1,000 g of urethane prepolymer (PUR-1) and 113.5 g of KBM602 were placed in a reactor, and under a nitrogen atmosphere, When the reaction was carried out at 90 ° C. for 1 hour with stirring, the desired rubber-based organic polymer containing a reactive silicon group was not obtained.
(Synthesis Example 9)
(1) In order to obtain a rubber-based organic polymer containing a reactive silicon group, 1,000 g of urethane prepolymer (PUR-1) and 89.8 g of KBM902 were put in a reactor, and under a nitrogen atmosphere, When the reaction was carried out at 23 ° C. for 24 hours with stirring, a rubber-based organic polymer (S-1) containing a reactive silicon group was obtained.
[0045]
Examples 1 to 10
,
[Comparative Examples 1-5]
<Preparation of main agent>
In the proportion shown in Table 1, silylated urethane resin, rubber-based organic polymer containing reactive silicon groups (commonly modified silicone), epoxy resin curing agent and powder are put into a planetary mixer, and heated and dehydrated at 100 ° C under reduced pressure. After cooling to room temperature, amino group and hydrolyzable silicon group-containing compounds (KBM903, KBM603) were added in the proportions shown in Table 1 to obtain a main agent.
However, in Comparative Example 1, since the main agent cannot be prepared by gelation when heated and dehydrated in a planetary mixer, it was mixed with cooling to prepare the main agent. However, the main agent was also very poor in storage stability. Gelation occurred at 3 ° C. for 3 days, and even at room temperature (23 ° C.), the viscosity was remarkably increased in 1 week, gelled in 2 weeks, and practically impossible to use.
[0046]
<Preparation of curing agent>
In a proportion shown in Table 1, the curing agent for epoxy resin, silylated urethane resin, the curing agent for rubber-based organic polymer (commonly modified silicone) containing reactive silicon groups, and powder are put into a planetary mixer and kneaded. And a curing agent was obtained.
Details of symbols (trade names) other than S-1 to S-6 in Table 1 are as follows.
SAT200: Modified silicone resin of molecular end methyldimethoxysilyl type, manufactured by Kaneka Corporation
MA430: (Meth) acryloyl group-containing monomer polymerized molecule terminal methyldimethoxysilyl type modified silicone resin manufactured by Kaneka Corporation
Ancamine K-54: Tertiary amine manufactured by Air Products
White gloss flower CC-R: Shiraishi Kogyo Co., Ltd., surface treated calcium carbonate
Whiteon SB: Shiraishi Kogyo Co., Ltd., surface untreated calcium carbonate
Epicoat E828: Oiled Shell Epoxy, bisphenol A type epoxy resin
No. 918: Santinki Gosei Co., Ltd., organotin catalyst
[0047]
[Table 1]
[0048]
<Measurement of adhesive strength>
The obtained main agent and curing agent were mixed at a ratio of 2: 1, and the tensile shear adhesive strength and peel adhesive strength for various test materials were measured. The results are shown in Table 2. The storage stability of the main agent is also shown.
Adhesion conditions, curing conditions, and measurement conditions are as follows.
○ Test materials
・ SUS: 1.5mm thick stainless steel SUS304 (2B) 2.5cm × 10cm
・ Aluminum: 1.6mm thick aluminum material A1050P 2.5cm × 10cm
・ Steel: 1.5mm thickness SPCC (SB) material 2.5cm x 10cm
-ABS plate: 3mm thick ABS material 2.5cm x 10cm
・ Acrylic board: 3mm thick acrylic material 2.5cm x 10cm
-Thin steel plate: 0.3mm thickness SPCC (SD) material 2.5cm x 20cm
Aluminum foil: 0.1mm thick aluminum material 2.5cm x 20cm
・ SBR sheet: 2mm thick vulcanized SBR sheet 2.5cm x 20cm
[0049]
○ Adhesion and curing conditions
It was applied to the surface of the adherend, spread thinly, and bonded together under the conditions of a temperature of 23 ° C. and a relative humidity of 50%. The bonding area was 2.5 cm × 2.5 cm for the tensile shear test specimen and 2.5 cm × 10 cm for the peel test specimen.
The bonded specimens were left for 7 days under the conditions of a temperature of 23 ° C. and a relative humidity of 50% to obtain specimens for a tensile shear test and a peel test.
○ Tensile shear test conditions / peeling test conditions
According to JISK6850 and JISK6854, the tensile shear bond strength (see FIG. 1 (a)) and peel bond strength (see FIG. 1 (b)) were measured.
○ Main agent storage stability: 50 ° C. × within 1.2 times increase in viscosity after storage for 2 weeks → ○, gelation → ×
[0050]
[Table 2]
[0051]
【The invention's effect】
As is clear from the foregoing, according to the present invention, when cured at room temperature, it exhibits a good balance of excellent elongation, tensile shear adhesive strength, and peel adhesive strength, particularly an adhesive, Since a curable resin composition suitable for a sealing agent and a paint can be provided, it can make a great contribution to the industry.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining an outline of a test method for tensile shear adhesive strength and peel adhesive strength.
Claims (4)
エポキシ樹脂(D)と、シリル化ウレタン系樹脂(A)の硬化剤(E)とからなる混合物(II)とを含有し、
上記混合物(I)中の(A)と上記混合物(II)中の(D)との割合が質量比で(A)/(D)=15/85〜80/20であり、
上記〔(A)+(D)〕と上記混合物(I)中の(B)との割合が質量比で〔(A)+(D)〕/(B)=100/0.1〜100/20であり、
上記(D)と上記混合物(I)中の(C)との割合が質量比で(D)/(C)=100/0.1〜100/300であり、
上記(A)と上記混合物(II)中の(E)との割合が質量比で(A)/(E)=100/0.01〜100/20である、
ことを特徴とする硬化性樹脂組成物。The main chain is a polyoxyalkylene polymer, has a reactive silicon group at its molecular end, and contains a silylated urethane resin (A) having a substituted urea bond in the molecule, an amino group and a hydrolyzable silicon group A mixture (I) comprising the compound (B) and a curing agent (C) of the epoxy resin (D);
Containing a mixture (II) composed of an epoxy resin (D) and a curing agent (E) of the silylated urethane resin (A) ,
The ratio of (A) in the mixture (I) to (D) in the mixture (II) is (A) / (D) = 15/85 to 80/20 by mass ratio,
The ratio of [(A) + (D)] to (B) in the mixture (I) is [(A) + (D)] / (B) = 100 / 0.1-100 / 20 and
The ratio of (D) to (C) in the mixture (I) is (D) / (C) = 100 / 0.1 to 100/300 by mass ratio,
The ratio of (A) to (E) in the mixture (II) is (A) / (E) = 100 / 0.01 to 100/20 by mass ratio.
A curable resin composition characterized by that.
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