JP4760752B2 - Component mounting device and mounting position accuracy measuring method in component mounting device - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting components on a substrate and a mounting position accuracy measuring method for measuring mounting position accuracy by a mounting head in the component mounting apparatus.

  In a component mounting apparatus that mounts an electronic component on a substrate, a component mounting operation in which the component is taken out from the component supply unit by the mounting head and transferred to the substrate is repeatedly performed. In this component mounting operation, even if the component mounting operation is performed according to the control data indicating the correct mounting position due to mechanical errors such as an XY orthogonal drive mechanism that moves the mounting head, the actual mounting position and the correct mounting position are It does not necessarily match and an error occurs.

  As a measure for correcting the misalignment error at the time of component mounting, the misalignment error that occurs in association with the component mounting operation is measured in advance by an optical method such as position recognition by a camera, and obtained as offset data. The control data is corrected by this offset during the actual component mounting operation. Various methods have been proposed in the past as methods for measuring misalignment errors for obtaining the offset data (see, for example, Patent Document 1).

In the example shown in this patent document, a glass jig work provided with a work side reference mark is mounted as a dummy part on a glass jig board provided with a substrate side reference mark serving as a reference for position measurement. With the side reference mark and the substrate side reference mark positioned in the same imaging field of view, the substrate side reference mark is simultaneously imaged by the camera together with the workpiece side reference mark through the transparent jig workpiece. The relative displacement of the jig parts is measured. As a result, when the jig substrate and the jig workpiece are individually imaged, there is an advantage that the position can be measured with high accuracy without degrading the measurement accuracy caused by the error of the moving mechanism that moves the camera. have.
JP-A-2005-317806

  By the way, in order to enable highly accurate position measurement in the method of measuring the mounting position accuracy by simultaneously imaging these jig workpieces as dummy parts mounted on the jig substrate as described above, It is an essential requirement that the relative position after mounting of the jig work with respect to is completely fixed and no positional deviation occurs. In the above-described prior art examples, a double-sided tape is previously applied to either the jig substrate or the jig workpiece, or an adhesive is applied to prevent the positional deviation after mounting.

  For this reason, if the jig substrate or jig work is to be repeatedly reused, the adhesive work remaining on the surface is removed after the jig work adhered on the jig substrate is peeled off one by one. If this process is not performed properly, the measurement accuracy may be adversely affected by the residual adhesive. As described above, in the measurement of the mounting position accuracy in the conventional component mounting apparatus, there is a problem that it may be difficult to repeatedly perform a highly accurate measurement operation by a simple method.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a mounting position accuracy measurement method in the component mounting apparatus that can repeatedly measure a component mounting position with high accuracy by a simple method.

The component mounting apparatus according to the present invention is a component mounting apparatus that mounts a component taken out from the component supply unit on a substrate positioned in the substrate positioning unit, and takes out the component from the component supply unit by a mounting head onto the substrate. A component mounting means to be transported and mounted; an imaging means capable of capturing an image of a plane that is moved by the imaging moving means and is a target of a mounting operation by the mounting head; and a recognition processing unit that recognizes an imaging result of the imaging means, A jig on which a substrate reference mark for measuring the mounting position accuracy by the mounting head is formed and a transparent jig part on which the component reference mark for measuring the mounting position accuracy is formed is mounted on the substrate positioning portion. jig substrate holder for holding a substrate is provided with the jig substrate holding portion includes a first suction groove for sucking the jig substrate, the first A first vacuum suction unit for vacuum adsorption grooves, by vacuum suction from the suction holes provided in said jig substrate, said jig component mounted over the suction hole to the jig substrate jig substrate A second suction groove for sucking on the upper surface; and a second vacuum suction part for vacuum suctioning the second suction groove ; and further, the component mounting means, vacuum suction means, imaging moving means, imaging means, and recognition By controlling the processing unit, the jig substrate holding unit holds the jig substrate, and a plurality of jig parts are taken out from the jig component supply unit by the mounting head, and set in advance on the jig substrate as mounting position accuracy measurement points. mounted in a plurality of positions which are, mounted on said jig parts and the fixed by the second vacuum suction portions on the jig substrate, As a plurality of positions of said jig substrate by moving the imaging means In each case, the component reference mark and the substrate reference mark are positioned in the same imaging field of view, and the component reference mark and the substrate reference mark are simultaneously imaged by the imaging means, and the imaging result is recognized by the recognition processing unit. Thus, a control means for executing a process of acquiring position accuracy measurement data at the mounting position accuracy measurement point is provided.

The component mounting apparatus of the present invention is a component mounting apparatus that mounts a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit, wherein the component is taken out from the component supply unit by a mounting head. Component mounting means for transporting and mounting, and a substrate reference mark provided within a moving range of the mounting head for measuring mounting position accuracy by the mounting head, and a component reference mark for measuring the mounting position accuracy A jig substrate holding part for holding a jig substrate on which the formed transparent jig part is mounted, and a plane range that is a target of a mounting operation by the mounting head including the jig substrate holding part that is moved by an imaging moving means can be imaged. an imaging means, and a recognition processing unit that performs recognition processing an imaging result by the imaging means, the jig substrate holding portion intake the jig substrate A first suction groove to a first vacuum suction unit for sucking the first vacuum adsorption grooves, by vacuum suction from the suction holes provided in said jig substrate, said suction hole to the jig substrate A second suction groove for sucking the jig part mounted and covered on the upper surface of the jig substrate; and a second vacuum suction part for vacuum-sucking the second suction groove ; By controlling the vacuum suction means, the imaging moving means, the imaging means and the recognition processing unit, the jig part is taken out from the jig part supply unit by the mounting head, and the jig part is mounted on the jig substrate by the mounting head, the onboard the jig parts are fixed to the jig substrate by the second vacuum suction unit, the component reference mark and the substrate reference mark in said jig substrate by moving the imaging means the The component reference mark and the substrate reference mark are simultaneously imaged by the imaging means, and the processing for acquiring the mounting position accuracy measurement data is performed by recognizing the imaging result by the recognition processing unit. The control means to make was provided.

The mounting position accuracy measuring method in the component mounting apparatus of the present invention is a mounting position accuracy in which a mounting position accuracy is measured by a mounting head in a component mounting apparatus that mounts a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit. A transparent jig in which a substrate reference mark for measuring the mounting position accuracy by the mounting head is formed in the substrate positioning portion, and a component reference mark for measuring the mounting position accuracy is formed in the substrate positioning portion A jig substrate holding unit for holding a jig substrate on which a component is mounted is provided. The jig substrate holding unit vacuum-sucks the first suction groove for sucking the jig substrate and the first suction groove. a first vacuum suction unit, by vacuum suction from the suction holes provided in said jig substrate, said jig portion which the mounted over the suction holes to the jig substrate A second suction groove for sucking the upper surface of the jig substrate, and a second vacuum suction unit for vacuum suction of the second suction groove, said the jig substrate holding portion provided on the substrate positioning portion A jig substrate holding step for holding the jig substrate, and a jig part that takes out the plurality of jig parts from the component supply unit by the mounting head and mounts them at a plurality of positions set in advance on the jig board as mounting position accuracy measurement points. A mounting step, a jig component fixing step of fixing the mounted jig component to the jig substrate by the second vacuum suction unit , and moving the imaging means to each of the plurality of positions of the jig substrate. Imaging in which the component reference mark and the substrate reference mark are positioned in the same imaging field, and the component reference mark and the substrate reference mark are simultaneously imaged by the imaging means Degree includes, a recognition processing step of obtaining the mounting position accuracy measurement data in the mounting position accuracy measurement point by recognizing process these imaging results.

Further, the mounting position accuracy measuring method in the component mounting apparatus of the present invention is a mounting position for measuring the mounting position accuracy by a mounting head in a component mounting apparatus that mounts a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit. In the accuracy measurement method, a substrate reference mark for measuring the mounting position accuracy by the mounting head is formed in the movement range of the mounting head, and a component reference mark for measuring the mounting position accuracy is formed. A jig substrate on which a transparent jig component is mounted is held by a jig substrate holding portion, and the jig substrate holding portion vacuums the first suction groove for sucking the jig substrate and the first suction groove. a first vacuum suction unit for sucking the by vacuum suction from the suction holes provided in the jig substrate, wherein said mounted over the suction holes to the jig substrate冶A second suction groove for sucking the component on the upper surface of the jig substrate, the second suction groove and a second vacuum suction unit for vacuum suction, the jig parts from the jig component supply unit by the mounting head A jig component mounting step of taking out and mounting the jig component on the jig substrate; a jig component fixing step of fixing the mounted jig component to the jig substrate by the second vacuum suction unit ; and moving the imaging means to move the jig substrate. In the imaging step, the component reference mark and the substrate reference mark are positioned in the same imaging field of view, and the imaging unit simultaneously images the component reference mark and the substrate reference mark, and the imaging result is recognized and processed. A recognition processing step for acquiring position accuracy measurement data.

According to the present invention, in the measurement of the mounting position accuracy performed by imaging the jig substrate on which the jig component is mounted, by adopting a method of fixing the mounted jig component to the jig substrate by the vacuum suction unit , The jig component can be fixed without using a double-sided tape or an adhesive, and the measurement of the component mounting position with high accuracy can be repeatedly performed by a simple method.

(Embodiment 1)
1 is a plan view of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a diagram showing a configuration of a mounting head in the component mounting apparatus according to the first embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is an explanatory diagram of the jig substrate in the component mounting apparatus of the first embodiment of the present invention, and FIGS. 5 and 6 are diagrams of the first embodiment of the present invention. FIG. 7 is an explanatory view of a jig component fixing method in the component mounting accuracy measuring method, FIG. 7 is a diagram showing imaging and position recognition of the component reference mark and the substrate reference mark in the component mounting accuracy measuring method according to the first embodiment of the present invention. FIG. 9 is a block diagram showing the configuration of the control system of the component mounting apparatus according to the first embodiment of the present invention, and FIG. 9 is a process flow diagram of the component mounting accuracy measuring method according to the first embodiment of the present invention.

  First, the structure of the component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in the center of the base 1 in the X direction. The transport path 2 transports the substrate 3 delivered from the upstream device, and positions and holds the substrate 3 at the mounting position by the substrate positioning unit 20 (see FIG. 3) provided in the transport path. On both sides of the conveyance path 2, component supply units 4 are arranged, and component trays 5 </ b> A and 5 </ b> B are arranged in the component supply unit 4. The component trays 5A and 5B store rectangular components such as BGA in a lattice arrangement with a predetermined interval. Note that, as will be described later, jig parts used for measuring the mounting position accuracy by the mounting head are stored in the component tray 5A as necessary.

  A Y-axis table 8A and a guide table 8B are disposed on both ends of the upper surface of the base 1, and an X-axis table 9 is installed on the Y-axis table 8A and the guide table 8B. Mounted on the X-axis table 9 are a mounting head 10 and a substrate recognition camera 12 that moves integrally with the mounting head 10. By driving the X-axis table 9 and the Y-axis table 8A, the mounting head 10 and the board recognition camera 12 move horizontally in the X direction and the Y direction, and components are picked up from the component supply unit 4 by the suction nozzle 11a (see FIG. 2). The substrate is taken out and mounted on the substrate 3 positioned in the substrate positioning portion 20 of the transport path 2. Therefore, the X-axis table 8A, the Y-axis table 9 and the mounting head 10 constitute a component mounting means for taking out components from the component supply unit 4 by the mounting head 10 and transferring and mounting them on the substrate 3.

  The substrate recognition camera 12 that moves together with the mounting head 10 captures and recognizes a plane that is the target of the mounting operation by the mounting head 10. That is, by moving the mounting head 10 onto the substrate 3, the substrate recognition camera 12 images a position detection recognition mark provided on the substrate 3. Furthermore, the board recognition camera 12 is also used for imaging a jig part on a jig board held by the board positioning unit 20 in a mounting position accuracy measurement process to be described later. The X-axis table 8A and the Y-axis table 9 constitute imaging moving means for moving the board recognition camera 12, and in this embodiment, the component mounting means is also used as the imaging moving means. Of course, the substrate recognition camera 12 may be moved by a dedicated moving mechanism provided separately.

  A component recognition camera 13 is disposed on the route from the component supply unit 4 to the conveyance path 2. When the mounting head 10 holding the component to be mounted on each suction nozzle 11a moves above the component recognition camera 13, the component recognition camera 13 images the component held by the suction nozzle 11a from below. The imaging results of the board recognition camera 12 and the part recognition camera 13 are recognized by the recognition processing unit 43, whereby the position of the component mounting point on the board 3 and the position of the component in the state held by the mounting head 10 are recognized. In the component mounting operation of the component on the board 3 by the above-described component mounting means, position correction at the time of component mounting is performed based on these position recognition results.

  Next, the mounting head 10 will be described with reference to FIG. As shown in FIG. 2, the mounting head 10 is multi-type and includes a plurality of (8 here) unit mounting heads 11 that can hold one component. Each of these unit mounting heads 11 is provided with a suction nozzle 11a that sucks and holds a component at the lower end, and can be moved up and down individually by a lifting mechanism (not shown) provided in each unit mounting head 11. . The mounting head 10 includes a θ-axis motor 14 common to the unit transfer heads, and the θ-axis motor 14 rotationally drives a θ rotation mechanism that rotates each suction nozzle 11a in the θ direction. In the mounting operation of mounting the component by the mounting head 10, the suction nozzle 11a is rotated in the θ direction around the nozzle axis, thereby aligning the component held in the suction nozzle 11a in the θ direction. .

  Next, with reference to FIG. 3, the structure of the jig substrate holding part provided in the board | substrate positioning part 20 of the conveyance path 2 is demonstrated. The substrate positioning unit 20 has a function of receiving and holding the conveyed substrate 3 from the lower surface side by a lower receiving member, and the lower receiving member is replaced according to the type of the target substrate. The jig substrate holding part 21 shown in FIG. 3 is mounted on the substrate positioning part 20 as a receiving member in the mounting position accuracy measurement described later, and is a jig substrate 30 (specially manufactured for the purpose of mounting position accuracy measurement. 3) and a function of fixing the jig part 35 (see FIG. 4) as a dummy part mounted on the jig board to the jig board without using means such as a double-sided tape or an adhesive. It is what you have.

The jig substrate holding portion 21 is a rectangular block member having a substrate suction surface 21a on the upper surface, and has a size corresponding to the size of the substrate to be worked by the component mounting apparatus. As shown in FIG. 3A, the substrate suction surface 21a is provided with a first suction groove 22 for sucking the target jig substrate 30. As shown in FIG. A plurality of component suction portions 23 are provided on the substrate suction surface 21a in a lattice arrangement with a predetermined interval. The component suction unit 23 corresponds to a position where the jig component 35 is mounted on the jig substrate 30, and the density of the arrangement interval is determined according to a predetermined required mounting position accuracy. In other words, the higher the mounting position accuracy is required, the more the mounting target plane needs to be divided more finely to set more mounting position measurement target points.

Each component suction part 23 is provided with a second suction groove 24 in a cross shape for sucking the jig part 35, and a suction hole 21 c for vacuum suction is opened at the center of the suction groove 24. There is a hole. As shown in FIG. 3B, the suction grooves 22 and 24 communicate with the first suction hole 21b and the second suction hole 21c provided in the jig substrate holding portion 21, respectively . The suction hole 21b and the second suction hole 21c are connected to the first vacuum suction part 25 and the second vacuum suction part 26, respectively. By driving the first vacuum suction section 25 and the second vacuum suction section 26, vacuum suction is performed from the suction grooves 22 and 24 through the suction holes 21b and 21c, and a jig substrate 30 and a jig component 35 described below are obtained. Can be fixed by vacuum suction.

  Next, the jig substrate 30 used for measuring the mounting position accuracy by the mounting head 10 and the jig component 35 mounted as a dummy component on the jig substrate 30 will be described with reference to FIG. As shown in FIG. 4A, on the upper surface of the jig substrate 30, a plurality of mounting position accuracy measurement points 31 are provided in a grid arrangement at positions corresponding to the arrangement of the component suction sections 23 in the jig substrate holding section 21. ing. Each mounting position accuracy measurement point 31 is provided with a plurality of suction holes 32 penetrating the jig substrate 30 in a cross arrangement, and further at each corner position of a rectangular frame surrounding the range where the suction holes 32 are formed. A substrate reference mark 33 for measuring the mounting position accuracy by the mounting head 10 is formed.

The jig component 35 shown in FIG. 4B is manufactured by forming a transparent plate member that transmits light such as glass or transparent resin into a rectangle (here, a square). A dummy portion 35 a having a size corresponding to a real part is set at the center of the jig part 35. The dummy portion 35a may be a shape imitating the shape of the part or may simply be a frame indicating the size. At each corner position of the jig component 35, a component reference mark 36 for measuring the mounting position accuracy is formed on the lower surface side of the jig substrate 30. By forming the component reference mark 36 on the lower surface side of the jig substrate 30, the component reference mark 36 can be positioned on the same plane as the substrate reference mark 33 on the upper surface of the jig substrate 30. It is possible to acquire a more accurate image.

  Here, the arrangement of the suction holes 32 and the substrate reference marks 33 in the jig substrate 30 is such that the jig parts 35 are sucked by the suction holes 32 in a state where the jig parts 35 are mounted in alignment with the respective mounting position accuracy measurement points 31. The suction holes 32 are arranged so as to be within the outer range of the jig part 35 so as to be able to. The substrate reference mark 33 is arranged so as to be located outside the dummy portion 35a so as not to be covered by the dummy portion 35a.

  When measuring the mounting position accuracy, as shown in FIG. 5A, first, the jig substrate 30 is placed on the jig substrate holding portion 21, and then the first vacuum suction portion 25 is driven to perform vacuum suction from the suction groove 22. By doing so, the jig substrate 30 is sucked and held by the jig substrate holding portion 21. At this time, each mounting position accuracy measurement point 31 of the jig substrate 30 coincides with the position of the component suction unit 23 of the jig substrate holding unit 21. FIG. 5B shows details of each component suction portion 23 and the mounting position accuracy measurement point 31. When the jig substrate 30 is correctly aligned with the jig substrate holding portion 21, each suction hole 32 is sucked. It is in a position where it can communicate with the groove 24.

  When the jig substrate 30 is sucked and held on the suction holding surface 21a of the jig substrate holding portion 21 and the jig parts 35 are mounted on the mounting position accuracy measurement points 31 of the jig substrate 30, as shown in FIG. In addition, each suction hole 32 communicates with the suction groove 24 in an overlapping manner. In this state, the second vacuum suction section 26 is driven and vacuum suction is performed from the suction holes 21c as shown in FIG. 6B, so that the jig component 35 is attached to the jig substrate 30 via the suction holes 32. Fixed to the upper surface by vacuum suction. Therefore, the suction hole 21c and the suction groove 24 provided in the second vacuum suction part 26 and the jig substrate holding part 21 are sucked into the jig substrate 30 by vacuum suction from the suction hole 32 provided in the jig substrate 35. The vacuum suction means fixes and holds the jig part 35 mounted so as to cover the hole 32 on the upper surface of the jig substrate 30.

  At this time, the dummy part 35a of the jig part 35 is located at the center of the mounting position accuracy measurement point 31, and the board reference mark 33 is located between the dummy part 35a and the part reference mark 36. Thus, the substrate reference mark 33 can be imaged from above through the transparent jig part 35. In this imaging, since the jig substrate 30 is sucked and held by the jig substrate holding portion 21 and the jig component 35 is sucked by the jig substrate 30, the jig substrate 30 and the jig component 35 are displaced from each other. It does not occur.

  In this manner, the substrate reference mark 33 and the component reference mark 36 are imaged by the substrate recognition camera 12 in a state where the jig component 35 is mounted on the jig substrate 30. That is, as shown in FIG. 7A, the imaging visual field 12a of the board recognition camera 12 is moved to the diagonal position of the jig part 35, so that the board reference mark 33 and the component reference mark 36 are within the same imaging visual field 12a. In the positioned state, the board reference mark 33 and the component reference mark 36 are imaged simultaneously. At this time, since the jig component 35 is fixed to the jig substrate 30 by vacuum suction as described above, the substrate recognition camera 12 causes the component reference mark 36 to be recognized and the substrate reference mark 33 to have no positional displacement. It is possible to image in a state. When measuring the mounting position accuracy, the board reference mark 33 and the component reference mark 36 are imaged at two opposite diagonal positions of the jig component 35 to detect a mounting position shift at the mounting position accuracy measurement point. To do.

  Here, detection of the mounting position deviation will be described. In the component mounting operation by the component mounting means, as described above, alignment of the component with respect to the substrate is performed based on the component position recognition result and the substrate position recognition result. Similarly, in mounting the jig part 35 for measuring the mounting position accuracy, the jig part 35 is imaged by the part recognition camera 13 and the position of the dummy part 35a or the part reference mark 36 is recognized, and then the jig board 30 is mounted. Mount. Further, in the mounting operation, the board recognition camera 12 images the board reference mark 33 for each mounting position measurement point 31 to recognize the position of each mounting position measurement point 31, and the position recognition of the dummy part 35a or the component reference mark 36 is performed. Based on the result and the position recognition result of each mounting position measurement point 31, the jig component 35 is positioned and mounted on the jig substrate 30.

When this alignment is performed completely correctly, the two corresponding component reference marks 36 have a predetermined positional relationship with respect to the two opposing substrate reference marks 33, that is, the two substrate reference marks 33 The jig component 35 is mounted in such a positional relationship that the midpoint coincides with the midpoint of the two component reference marks 36. Therefore, in imaging for mounting position accuracy measurement, as shown in FIG. 7B, the position recognition of the pair of board reference marks 33 and component reference marks 36 that are respectively located on the opposite sides may be performed.

In the present embodiment, the above-described position recognition is performed for each diagonal position by simultaneously imaging the substrate reference mark 33 and the component reference mark 36 in the same imaging field at each diagonal position. ing. Next, the midpoints M1 and M2 of the board reference mark 33 and the component reference mark 36 are obtained from these position recognition results, and the deviations (Δx, Δy) of these midpoints M1 and M2 are determined as the mounting position accuracy measurement points. It is obtained as mounting position accuracy measurement data. Then, by acquiring this mounting position accuracy measurement data for the entire range of the jig substrate 30 for each mounting position accuracy measurement point, offset data for correcting mounting position deviation by the mounting head 10 is used as the target component mounting point. So-called surface correction data that can be corrected in association with the plane position can be acquired.

  That is, in the configuration of the component mounting apparatus shown in the present embodiment, the substrate positioning unit 20 is provided with the jig substrate holding unit 21, and the jig substrate holding unit 21 measures the mounting position accuracy by the mounting head 10. The substrate reference mark 33 is formed and the jig substrate 30 on which the transparent jig component 35 on which the component reference mark 36 for measuring the mounting position accuracy is formed is held. The jig substrate holding unit 21 sucks and holds the jig part 35 mounted on the jig substrate 30 so as to cover the adsorption hole 32 on the upper surface of the jig substrate 30 by vacuum suction from the suction holes 32 provided in the jig substrate 30. Thus, the second vacuum suction part 26, the suction hole 21c, and the suction groove 24 as vacuum suction means for fixing are provided.

  The jig substrate 30 used in the mounting position accuracy measurement includes a board reference mark 33 that is located in the same imaging field of view as the component reference mark 36 and is simultaneously imaged in a state in which the jig part 35 is mounted, and the jig part 35. The jig substrate 30 is provided through the jig substrate 30 at a position covered by the jig component 35 in a mounted state and deviated from the substrate reference mark 33, and the jig component 35 is sucked and held on the jig substrate 30. It is the structure provided with the suction hole 32 for fixing.

  Note that by using a transparent material such as a glass plate as the jig substrate 30, it is possible to employ transmission recognition for recognizing the substrate reference mark 33 and the component reference mark 36 with transmitted illumination light. That is, by forming a film having a characteristic of emitting unique excitation light by receiving light on the upper surface of the jig substrate holding portion 21 in advance, the illumination light irradiated from above at the time of image pickup by the board recognition camera 12 is applied to the jig. The light passes through the component 35 and the jig substrate 30 and enters the board recognition camera 12, and the upper surface of the jig board holding unit 21 is caused to emit light. The light passes through the jig substrate 30 and the jig part 35 and is received by the board recognition camera 12, whereby the board reference mark 33 and the component reference mark 36 can be recognized by the transmitted illumination light.

  Next, the configuration of the control system of the component mounting apparatus will be described with reference to FIG. In FIG. 7, a control unit 40 is a CPU, and controls each unit described below in an integrated manner. The storage unit 41 includes an operation program for executing the component mounting operation for the actual production board 3 and programs and data necessary for actual production such as mounting data for each board type, and in operation of the component mounting apparatus. A program and data necessary for the mounting position accuracy measurement process executed at a predetermined interval are stored.

  The mechanism control unit 42 controls operations of the substrate positioning unit 20 provided with the jig substrate holding unit 21, the X-axis table 9, which is a component mounting unit, the Y-axis table 8A, the mounting head 10, and the like. The substrate positioning unit 20 includes vacuum suction means for attracting and holding the jig component 35 to the jig substrate 30. The recognition processing unit 43 recognizes the imaging results of the substrate recognition camera 12 and the component recognition camera 13, thereby recognizing the position of the substrate 3 positioned by the substrate positioning unit 20 and the component held by the mounting head 10. In addition to the position detection, a process for position recognition of the component reference mark 36 and the board reference mark 33 in the mounting position accuracy measurement process is performed. Based on the position recognition result acquired by the recognition processing unit 43, the mounting position calibration processing unit 44 calculates a positional deviation amount at a mounting position accuracy measurement point set in a plane in which the mounting operation by the mounting head is executed. Then, an operation for obtaining offset data for correcting the positional deviation is performed.

  In the above configuration, the control unit 40 controls the component mounting unit, the vacuum suction unit, the imaging moving unit (X-axis table 9, Y-axis table 8A), the imaging unit (board recognition camera 12), and the recognition processing unit 43, The jig substrate 30 is held by the jig substrate holding unit 21, the jig part 35 is taken out from the component supply unit 4 A which also serves as the jig part supply unit by the mounting head 10, and the jig part 35 is mounted on the jig substrate 30 by the mounting head 10. The mounted jig component 35 is fixed to the jig substrate 30 by vacuum suction means, the substrate recognition camera 12 is moved, and the component reference mark 33 and the substrate reference mark 36 are positioned in the same imaging field 12a on the jig substrate 30; The board recognition camera 12 images the component reference mark 33 and the board reference mark 36 at the same time, and the imaging result is recognized. A series of mounting positional accuracy measurement process including a calculation process of acquiring the mounting position accuracy measurement data by recognition processing by the Department 43 is executed. Therefore, the control unit 40 is a control unit that executes the above-described mounting position accuracy measurement process by controlling the component mounting unit, the vacuum suction unit, the imaging moving unit, the imaging unit, and the recognition processing unit.

  Next, a mounting position accuracy measurement processing flow executed in the component mounting apparatus will be described with reference to FIG. First, the jig substrate 30 is held by the jig substrate holding portion 21 provided in the substrate positioning portion 20 (jig substrate holding step) (ST1). At this time, the jig substrate 30 may be conveyed by the conveyance path 2 in the same manner as the normal substrate 3 and held by the jig substrate holding unit 21, or the jig substrate 30 may be directly placed on the jig substrate holding unit 21 by an operator's manual operation. You may make it mount. Next, a plurality of jig components 35 are taken out from the component tray 5A of the component supply unit 4 by the mounting head 10 and mounted at a plurality of positions set in advance on the jig substrate 30 as mounting position accuracy measurement points 31 (a jig component mounting step). (ST2).

  In this jig component mounting step, the mounting head 10 holding the jig component 35 is moved onto the component recognition camera 13, and the jig component 35 as a dummy component is imaged by the component recognition camera 13, and the dummy portion 35a or the component reference mark is captured. After performing the 36 position recognition, the mounting operation by the mounting head 10 is executed. Further, when the jig part 35 held by the mounting head 10 is mounted on the jig substrate 30, the board reference mark 33 is imaged by the board recognition camera 12, and the position of the board reference mark 33 is recognized by the recognition processing unit 43. In consideration of the position recognition result of the board reference mark 33 and the position recognition result of the dummy part 35a or the part reference mark 36 described above, the misalignment is corrected. Mounted at the accuracy measurement point 31. That is, the component mounting means is caused to execute the component mounting operation after correcting the positional shift between the jig substrate 30 as the substrate and the jig component 35 as the component by the positional shift correction function provided in the component mounting apparatus.

  Next, the second vacuum suction unit 26 is driven to perform vacuum suction from the suction hole 32, whereby the mounted jig component 35 is fixed to the jig substrate 30 by vacuum suction means (jig component fixing step) (ST3). Next, the substrate recognition camera 12 is moved so that the component reference mark 36 and the substrate reference mark 33 are positioned in the same imaging field 12a at each of the plurality of mounting position accuracy measurement points 131 of the jig substrate 35 (ST4), and FIG. As shown to (a), the component reference mark 36 and the board | substrate reference mark 33 are imaged simultaneously with the board | substrate recognition camera 12 (imaging process) (ST5).

  By performing recognition processing of these imaging results by the recognition processing unit 43, as shown in FIG. 7B, mounting position accuracy measurement data at the mounting position accuracy measurement point 31 is acquired (recognition processing step) (ST6). . Then, by executing the above-described mounting position accuracy measurement processing for all the mounting position accuracy measurement points 31 set on the jig substrate 30, the mounting position deviation amount within the plane range that is the operation target of the mounting head 10 is predetermined. It is possible to obtain surface correction calibration data that is obtained for each grid point of the interval and associates offset data for correcting these mounting position deviations with the planar position of the component mounting point.

  Such mounting position accuracy measurement must be performed not only when the component mounting apparatus is started up but also when the operation is continued. In such a case, in the prior art, in order to prevent relative displacement between the jig substrate and the jig component in order to perform high-precision measurement, a double-sided tape is applied in advance to either the jig substrate or the jig component. Alternatively, a treatment such as applying an adhesive was required. For this reason, if the jig substrate and jig parts are repeatedly used, the adhesive components remaining on the surface are removed after the jig parts attached on the jig board are peeled off one by one. Was needed.

  On the other hand, in the component mounting apparatus shown in the present embodiment, since the jig component is fixed to the jig substrate by vacuum suction, it is necessary to perform treatment such as peeling of the jig component or removal of the adhesive component. Absent. Therefore, it is possible to repeatedly perform high-precision measurement work in mounting position accuracy measurement by a simple method.

(Embodiment 2)
FIG. 10 is a plan view of the component mounting apparatus according to the second embodiment of the present invention, FIG. 11 is an explanatory view of the structure of the jig substrate holding portion in the component mounting apparatus according to the second embodiment of the present invention, and FIG. FIG. 13 is an explanatory diagram of a jig substrate fixing method in the component mounting accuracy measuring method according to the second embodiment of the present invention, and FIG. 14 is an explanatory diagram of the jig substrate in the component mounting apparatus according to the second embodiment. It is a processing flowchart of a component mounting precision measuring method.

  In the first embodiment, the configuration in which the jig substrate 30 having the same shape as that of the substrate 3 is held in the substrate positioning portion that positions and holds the actual production substrate 3, but in the second embodiment, A jig substrate having a size smaller than that of the substrate 3 is always placed on a dedicated jig substrate holding unit provided in addition to the substrate positioning unit.

  In addition to the configuration of the component mounting apparatus shown in FIG. 1, the component mounting apparatus shown in FIG. 10 includes a jig substrate holding part 121 having the same purpose as the jig board holding part 21 shown in Embodiment 1 in the vicinity of the conveyance path 2. However, the configuration is provided within the movement range of the mounting head 10 and the substrate recognition camera 12, and the other parts are the same as those in FIG. On the jig substrate held by the jig substrate holding unit 121, the jig substrate 35 is stored and placed in advance. That is, in the component mounting apparatus shown in the second embodiment, the jig substrate holding unit 121 serves as the jig component supply unit.

  The jig substrate holding part 121 will be described with reference to FIG. The jig substrate holding part 121 is used for mounting position accuracy measurement similarly to the jig substrate holding part 21 in the first embodiment. The jig substrate holding portion 121 is an elongated rectangular member having a substrate suction surface 121a provided on the upper surface, and as shown in FIG. 11A, the upper surface of the jig substrate holding portion 121 is the target jig substrate 130 (FIG. An adsorption groove 122 for adsorbing 12) is provided. On the upper surface of the jig substrate holding part 121, a plurality of component suction parts 123 similar to the component suction part 23 in the jig board holding part 21 are arranged in a row at a predetermined pitch equal to the arrangement pitch of the unit mounting heads 12 in the mounting head 10. Is provided. Each component suction portion 123 is provided with a suction groove 124 for sucking the jig component 130 in a cross shape, and a suction hole 121c for vacuum suction is opened at the center of the suction groove 124. Yes.

As shown in FIG. 11B, the suction grooves 122 and 124 communicate with suction holes 121b and 121c provided in the jig substrate holding part 121, respectively, and the suction holes 121b and 121c are respectively in the first vacuum. The suction unit 125 and the second vacuum suction unit 126 are connected. By driving the first vacuum suction unit 125 and the second vacuum suction unit 126, vacuum suction is performed from the suction grooves 122 and 124 through the suction holes 121b and 121c, and a jig substrate 130 described below,
The jig part 35 can be fixed by vacuum suction.

  A jig substrate 130 shown in FIG. 12 is held by the jig substrate holding unit 121. In FIG. 12, a plurality of mounting position accuracy measurement points 131 are provided in a row on the upper surface of the jig substrate 130 at positions corresponding to the arrangement of the component suction units 123 in the jig substrate holding unit 121. As with the mounting position accuracy measurement point 31 in the first embodiment, each mounting position accuracy measurement point 131 is provided with a plurality of suction holes 132 penetrating the jig substrate 130 and arranged in a cross pattern. Reference corner marks 133 for measuring the mounting position accuracy by the mounting head 10 are formed at each corner position of the rectangle surrounding the range where is formed.

  In the mounting position accuracy measurement, as shown in FIG. 13, first, the jig substrate 130 is placed on the jig substrate holding portion 121, and then the first vacuum suction portion 125 is driven to perform vacuum suction from the suction groove 122. The jig substrate 130 is sucked and held on the jig substrate holding portion 121. In a state where the jig part 35 is mounted on each mounting position accuracy measurement point 131 of the jig substrate 130, each suction hole 132 communicates with the suction groove 124 and is vacuum-sucked from the suction hole 121c, as in the first embodiment. The jig component 35 is fixed to the upper surface of the jig substrate 130 through the suction holes 132 by vacuum suction. As in the first embodiment, in the state where the jig component 35 is mounted on the jig substrate 30, the board reference mark 33 and the component reference mark 36 are imaged by the board recognition camera 12, and at the mounting position accuracy measurement point. Detect mounting position shift.

  Next, with reference to FIG. 14, a mounting position accuracy measurement processing flow executed in the component mounting apparatus shown in the second embodiment will be described. First, the jig substrate 130 is held by the jig substrate holding portion 121 (jig substrate holding step) (ST11), and then the jig part 35 is placed and stored in advance on the jig substrate 130 (ST12). If this operation is performed at the time of starting the apparatus or switching the product type, it is not necessary to perform this operation every time the mounting position accuracy measurement is executed. Then, the following work process is executed when the mounting position accuracy is measured.

  First, the jig part 35 on the jig substrate 131 is taken out by the mounting head 10 (ST13). Next, the mounting head 10 holding the extracted jig part 35 is moved onto the part recognition camera 13, and the jig part 35 as a dummy part is imaged by the part recognition camera 13 to recognize the position of the dummy part 35 a or the part reference mark 36. Do. Thereafter, the jig component is mounted again on the jig substrate 130 held by the jig substrate holding unit 121 (jig component mounting step) (ST14).

  In this jig component mounting process, the board reference mark 133 of the jig board 130 is imaged by the board recognition camera 12, the position of the board reference mark 133 is recognized by the recognition processing unit 43, and the position recognition result of the board reference mark 133 is obtained. The jig component 35 is mounted on the mounting position accuracy measurement point 131 of the jig substrate 130 in consideration of the position recognition result of the dummy portion 35a or the component reference mark 36 described above. At this time, (ST13) and (ST14) may be executed by simultaneously targeting a plurality of jig parts 35 by the plurality of unit mounting heads 11 of the mounting head 10.

Next, the second vacuum suction part 126 is driven to perform vacuum suction from the suction hole 132, thereby fixing the mounted jig component 35 to the jig substrate 130 by the vacuum suction means (jig component fixing step) (ST15). Next, the substrate recognition camera 12 is moved so that the component reference mark 36 and the substrate reference mark 33 are positioned in the same imaging field 12a at each of the plurality of mounting position accuracy measurement points 131 of the jig substrate 130 (ST16), and FIG. Similarly to the example shown in (a), the component reference mark 36 and the substrate reference mark 133 are simultaneously imaged by the substrate recognition camera 12 (imaging process) (ST17). Then, by performing recognition processing on these imaging results, the mounting position accuracy measurement data is acquired (recognition processing step) (S) as in the example shown in FIG. 7B.
T18).

  That is, in the second embodiment, the jig component 35 is placed and stored in advance on the jig substrate 130 held by the jig substrate holding unit 121, and the jig component placed and stored in advance is measured when mounting position accuracy is measured. 35 is taken out by the mounting head 10 and mounted again on the jig substrate 35 held by the jig substrate holding part 121. By adopting such a configuration, it is possible to measure the mounting position accuracy as needed without the need for operations and preparations such as mounting of jig substrates and supply of jig parts during the operation of the component mounting device. It can be executed repeatedly. At this time, as in the first embodiment, the mounted jig part 35 is fixed to the jig substrate 130 by vacuum suction, so that processing such as peeling of the jig part and removal of the adhesive component is not required. Accurate measurement of the component mounting position can be repeatedly performed by a simple method.

  Note that the mounting position accuracy measurement shown in the first and second embodiments can be applied to a mounting position accuracy correction method as described below. That is, the offset data for position correction in the component mounting operation by the mounting head 10 is updated using the measurement result obtained by the mounting position accuracy measuring method described above. According to the mounting position accuracy measurement shown in the first embodiment, offset data associated with the planar position of each target component mounting point within the component mounting range is acquired as so-called surface correction data, and the mounting shown in the second embodiment is performed. According to the position accuracy measurement, standard offset data in the component mounting range is acquired.

  In any case, the correction of the offset data allows the mounting position accuracy by the mounting head 10 to be maintained at a desired accuracy level even when the mounting position accuracy fluctuates due to a change with time of the component mounting mechanism. The mounting position accuracy measurement for the purpose of correcting the offset data is automatically executed at a predetermined measurement interval, and the offset data is updated at each measurement interval. In the mounting position accuracy measurement at each measurement interval, the mounting position accuracy measurement may be repeatedly executed until the positional deviation amount obtained from the measurement result converges within a predetermined specified allowable range. . Thereby, the component mounting operation can be executed in a state where the variation of the mounting position accuracy has converged, and stable component mounting position accuracy is ensured.

  The component mounting apparatus of the present invention has an effect that measurement of a highly accurate component mounting position can be repeatedly performed by a simple method, and a component taken out from a component supply unit is transferred and mounted on a substrate by a mounting head. Available in the field.

1 is a plan view of a component mounting apparatus according to a first embodiment of the present invention. The figure which shows the structure of the mounting head in the component mounting apparatus of Embodiment 1 of this invention. Structure explanatory drawing of the jig substrate holding | maintenance part in the component mounting apparatus of Embodiment 1 of this invention Explanatory drawing of the jig board | substrate in the component mounting apparatus of Embodiment 1 of this invention Explanatory drawing of the fixing method of the jig components in the component mounting accuracy measuring method of Embodiment 1 of the present invention. Explanatory drawing of the fixing method of the jig components in the component mounting accuracy measuring method of Embodiment 1 of the present invention. The figure which shows the imaging and position recognition of a component reference mark and a board | substrate reference mark in the component mounting precision measuring method of Embodiment 1 of this invention. The block diagram which shows the structure of the control system of the component mounting apparatus of Embodiment 1 of this invention Process flow diagram of component mounting accuracy measurement method of embodiment 1 of the present invention Plan view of the component mounting apparatus according to the second embodiment of the present invention. Structure explanatory drawing of the jig substrate holding | maintenance part in the component mounting apparatus of Embodiment 2 of this invention Explanatory drawing of the jig board | substrate in the component mounting apparatus of Embodiment 2 of this invention Explanatory drawing of the fixing method of the jig components in the component mounting accuracy measuring method of Embodiment 2 of the present invention. Process flow diagram of component mounting accuracy measurement method of embodiment 2 of the present invention

Explanation of symbols

3 Substrate 4 Component supply unit 7A, 7B Component 8A Y-axis table (component mounting means) (imaging moving means)
9 X-axis table (component mounting means) (imaging moving means)
10 Mounting head (component mounting means)
12 Substrate recognition camera (imaging means)
20 Substrate positioning part 21, 121 Jig substrate holding part 23, 123 Component suction part 24, 124 Suction groove 26, 126 Second vacuum suction part (vacuum suction means)
30, 130 Jig substrate 31, 131 Mounting position accuracy measurement point 32, 132 Suction hole 33, 133 Substrate reference mark 35 Jig component 36 Component reference mark

Claims (6)

A component mounting apparatus for mounting a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit,
A component mounting unit that takes out the component from the component supply unit by a mounting head, and transfers and mounts the component on the substrate; an imaging unit that is moved by an imaging moving unit and that can image a plane that is a target of a mounting operation by the mounting head; A recognition processing unit for recognizing the imaging result of the imaging means,
A jig on which a substrate reference mark for measuring the mounting position accuracy by the mounting head is formed and a transparent jig part on which the component reference mark for measuring the mounting position accuracy is formed is mounted on the substrate positioning portion. A jig substrate holding part for holding the substrate is provided,
The jig substrate holding unit is configured to perform vacuum suction from a first suction groove that sucks the jig substrate, a first vacuum suction unit that vacuum-sucks the first suction groove, and a suction hole provided in the jig substrate. By doing so, a second suction groove for sucking the jig part mounted on the jig substrate so as to cover the suction hole to the upper surface of the jig substrate, and a second vacuum suction for vacuum sucking the second suction groove And
Furthermore, by controlling the component mounting means, vacuum suction means, imaging movement means, imaging means and recognition processing unit,
The jig substrate holding unit holds the jig substrate, the plurality of jig parts are taken out from the jig component supply unit by the mounting head, and are mounted at a plurality of positions set in advance on the jig substrate as mounting position accuracy measurement points. The mounted jig component is fixed to the jig substrate by the second vacuum suction unit , and the imaging means is moved so that the component reference mark and the substrate reference mark are placed at each of the plurality of positions of the jig substrate. Positioning in the same imaging field of view, imaging the component reference mark and the board reference mark simultaneously by the imaging means, and performing recognition processing of the imaging result by the recognition processing unit, thereby measuring position accuracy at the mounting position accuracy measurement point A component mounting apparatus comprising control means for executing processing for acquiring data. A component mounting apparatus for mounting a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit,
Component mounting means for picking up the component from the component supply unit by the mounting head, transporting and mounting the component on the substrate, and a substrate reference mark provided within the movement range of the mounting head for measuring mounting position accuracy by the mounting head A jig substrate holding portion for holding a jig substrate on which a transparent jig component formed with a component reference mark for measuring the mounting position accuracy is formed; and the jig substrate holding portion which is moved by an imaging moving means. An imaging unit capable of imaging a plane range to be mounted by the mounting head; and a recognition processing unit that recognizes an imaging result of the imaging unit,
The jig substrate holding unit is configured to perform vacuum suction from a first suction groove that sucks the jig substrate, a first vacuum suction unit that vacuum-sucks the first suction groove, and a suction hole provided in the jig substrate. By doing so, a second suction groove for sucking the jig part mounted on the jig substrate so as to cover the suction hole to the upper surface of the jig substrate, and a second vacuum suction for vacuum sucking the second suction groove And
Furthermore, by controlling the component mounting means, vacuum suction means, imaging movement means, imaging means and recognition processing unit,
The jig part is removed from the jig part supply unit by the mounting head, the jig part is mounted on the jig substrate by the mounting head, and the mounted jig part is fixed to the jig substrate by the second vacuum suction unit . The imaging unit is moved to position the component reference mark and the substrate reference mark in the same imaging field on the jig substrate, and the imaging unit simultaneously images the component reference mark and the substrate reference mark. A component mounting apparatus comprising control means for executing processing for acquiring mounting position accuracy measurement data by performing recognition processing of an imaging result by the recognition processing unit.   The jig substrate holding unit also serves as the jig component supply unit, and the jig component previously placed and stored on the jig substrate held by the jig substrate holding unit is taken out by a mounting head, and the jig substrate holding unit is held again. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is mounted on the jig substrate held by a part. In a component mounting apparatus for mounting a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit, a mounting position accuracy measuring method for measuring mounting position accuracy by a mounting head,
A jig on which a substrate reference mark for measuring the mounting position accuracy by the mounting head is formed and a transparent jig part on which the component reference mark for measuring the mounting position accuracy is formed is mounted on the substrate positioning portion. A jig substrate holding part for holding the substrate is provided,
The jig substrate holding unit is configured to perform vacuum suction from a first suction groove that sucks the jig substrate, a first vacuum suction unit that vacuum-sucks the first suction groove, and a suction hole provided in the jig substrate. By doing so, a second suction groove for sucking the jig part mounted on the jig substrate so as to cover the suction hole to the upper surface of the jig substrate, and a second vacuum suction for vacuum sucking the second suction groove And
A jig substrate holding step for holding the jig substrate on a jig substrate holding portion provided in the substrate positioning portion, and a plurality of the jig components are taken out from the component supply portion by the mounting head, and the mounting position accuracy measurement points are used as the measurement points. A jig component mounting step for mounting at a plurality of positions set on the jig substrate, a jig component fixing step for fixing the mounted jig component to the jig substrate by the second vacuum suction unit , and moving the imaging means An imaging step in which the component reference mark and the substrate reference mark are positioned in the same imaging field at each of the plurality of positions of the jig substrate, and the component reference mark and the substrate reference mark are simultaneously imaged by the imaging unit. And mounting position accuracy measurement data at the mounting position accuracy measurement point by recognizing these imaging results. Mounting position accuracy measurement method in the component mounting apparatus which comprises a recognition processing step of obtaining. In a component mounting apparatus for mounting a component taken out from a component supply unit on a substrate positioned in a substrate positioning unit, a mounting position accuracy measuring method for measuring mounting position accuracy by a mounting head,
A transparent jig part having a substrate reference mark for measuring the mounting position accuracy by the mounting head and a component reference mark for measuring the mounting position accuracy is mounted within the movement range of the mounting head. The jig substrate to be held is held in the jig substrate holding part,
The jig substrate holding unit is configured to perform vacuum suction from a first suction groove that sucks the jig substrate, a first vacuum suction unit that vacuum-sucks the first suction groove, and a suction hole provided in the jig substrate. By doing so, a second suction groove for sucking the jig part mounted on the jig substrate so as to cover the suction hole to the upper surface of the jig substrate, and a second vacuum suction for vacuum sucking the second suction groove And
A jig component mounting step of taking out the jig component from the jig component supply unit by the mounting head and mounting the jig component on the jig substrate, and fixing the jig component mounted on the jig substrate by the second vacuum suction unit . And imaging, wherein the imaging unit is moved to position the component reference mark and the substrate reference mark in the same imaging field on the jig substrate, and the imaging unit simultaneously images the component reference mark and the substrate reference mark. A mounting position accuracy measuring method in a component mounting apparatus, comprising: a step and a recognition processing step of acquiring mounting position accuracy measurement data by performing recognition processing of the imaging result. The jig substrate holding unit also serves as the jig component supply unit, and the jig component previously placed and stored on the jig substrate held by the jig substrate holding unit is taken out by a mounting head, and the jig substrate holding unit is held again. The mounting position accuracy measuring method in the component mounting apparatus according to claim 5, wherein the mounting position accuracy is mounted on the jig substrate held by a part.

Images