JP4760082B2 - 発光装置、発光素子用蛍光体及びその製造方法 - Google Patents
発光装置、発光素子用蛍光体及びその製造方法 Download PDFInfo
- Publication number
- JP4760082B2 JP4760082B2 JP2005088908A JP2005088908A JP4760082B2 JP 4760082 B2 JP4760082 B2 JP 4760082B2 JP 2005088908 A JP2005088908 A JP 2005088908A JP 2005088908 A JP2005088908 A JP 2005088908A JP 4760082 B2 JP4760082 B2 JP 4760082B2
- Authority
- JP
- Japan
- Prior art keywords
- phosphor
- light
- emitting element
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 282
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title description 10
- 150000004767 nitrides Chemical class 0.000 claims description 59
- 229910052712 strontium Inorganic materials 0.000 claims description 46
- 229910052791 calcium Inorganic materials 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 15
- 229910052757 nitrogen Inorganic materials 0.000 claims description 14
- 229910052749 magnesium Inorganic materials 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 239000012298 atmosphere Substances 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052788 barium Inorganic materials 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910019142 PO4 Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 239000010452 phosphate Substances 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 6
- LQFNMFDUAPEJRY-UHFFFAOYSA-K lanthanum(3+);phosphate Chemical compound [La+3].[O-]P([O-])([O-])=O LQFNMFDUAPEJRY-UHFFFAOYSA-K 0.000 claims description 6
- 229910000164 yttrium(III) phosphate Inorganic materials 0.000 claims description 6
- UXBZSSBXGPYSIL-UHFFFAOYSA-K yttrium(iii) phosphate Chemical compound [Y+3].[O-]P([O-])([O-])=O UXBZSSBXGPYSIL-UHFFFAOYSA-K 0.000 claims description 6
- 229910052706 scandium Inorganic materials 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 description 99
- 239000011575 calcium Substances 0.000 description 74
- 239000004065 semiconductor Substances 0.000 description 38
- 238000010438 heat treatment Methods 0.000 description 35
- 239000000243 solution Substances 0.000 description 33
- 239000002245 particle Substances 0.000 description 30
- 229910052693 Europium Inorganic materials 0.000 description 18
- 229910052698 phosphorus Inorganic materials 0.000 description 15
- 239000011574 phosphorus Substances 0.000 description 15
- 229910052684 Cerium Inorganic materials 0.000 description 14
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 239000011777 magnesium Substances 0.000 description 14
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 230000006866 deterioration Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 239000001488 sodium phosphate Substances 0.000 description 13
- 229910000162 sodium phosphate Inorganic materials 0.000 description 13
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 13
- 239000011701 zinc Substances 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 239000011572 manganese Substances 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- -1 phosphor compound Chemical class 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229910052727 yttrium Inorganic materials 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 235000021317 phosphate Nutrition 0.000 description 7
- 238000009877 rendering Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000010298 pulverizing process Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910016066 BaSi Inorganic materials 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 4
- 229910052777 Praseodymium Inorganic materials 0.000 description 4
- 229910052771 Terbium Inorganic materials 0.000 description 4
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- 229910004706 CaSi2 Inorganic materials 0.000 description 3
- 229910052688 Gadolinium Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910004122 SrSi Inorganic materials 0.000 description 3
- 229910052769 Ytterbium Inorganic materials 0.000 description 3
- WAAQUBJIWXTCPY-UHFFFAOYSA-N [O-2].[Al+3].P.[Y+3] Chemical compound [O-2].[Al+3].P.[Y+3] WAAQUBJIWXTCPY-UHFFFAOYSA-N 0.000 description 3
- UHAQRCJYQAKQEE-UHFFFAOYSA-M [O-2].[OH-].O.[Al+3].P Chemical compound [O-2].[OH-].O.[Al+3].P UHAQRCJYQAKQEE-UHFFFAOYSA-M 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 102100032047 Alsin Human genes 0.000 description 2
- 101710187109 Alsin Proteins 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229940043430 calcium compound Drugs 0.000 description 2
- 150000001674 calcium compounds Chemical class 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 150000002681 magnesium compounds Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- NGDQQLAVJWUYSF-UHFFFAOYSA-N 4-methyl-2-phenyl-1,3-thiazole-5-sulfonyl chloride Chemical compound S1C(S(Cl)(=O)=O)=C(C)N=C1C1=CC=CC=C1 NGDQQLAVJWUYSF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000005457 Black-body radiation Effects 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- 229910017639 MgSi Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006360 Si—O—N Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- PSBUJOCDKOWAGJ-UHFFFAOYSA-N azanylidyneeuropium Chemical compound [Eu]#N PSBUJOCDKOWAGJ-UHFFFAOYSA-N 0.000 description 1
- 150000001553 barium compounds Chemical class 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 150000002259 gallium compounds Chemical class 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical class [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002604 lanthanum compounds Chemical class 0.000 description 1
- FYDKNKUEBJQCCN-UHFFFAOYSA-N lanthanum(3+);trinitrate Chemical compound [La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O FYDKNKUEBJQCCN-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003326 scandium compounds Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 150000003438 strontium compounds Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000000904 thermoluminescence Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 150000003748 yttrium compounds Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
(発光装置)
(発光素子)
本明細書において発光素子とは、LED、LD等の半導体発光素子の他、真空放電による発光、熱発光からの発光を得るための素子も含む。例えば真空放電による紫外線等も発光素子として使用できる。本発明の第1の実施の形態においては、発光素子として波長が550nm以下、好ましくは460nm以下、更に好ましくは410nm以下の発光素子を利用する。例えば紫外光として250nm〜365nmの波長の光を発する紫外光LEDや、波長253.7nmの高圧水銀灯を利用できる。特に、後述するように本発明の第1の実施の形態では蛍光体の耐久性が向上されるため、出力の高いパワー系発光素子にも利用できるという利点がある。
(フェイスダウン実装)
(蛍光体)
上記の実施の形態で使用される蛍光体は、発光素子から放出された可視光や紫外光を他の発光波長に変換する。吸収光の波長より長波長の光を放出する波長変換材料として蛍光体を使用し、発光素子の発光と蛍光体の変換光の混色により所望の光を外部に放出させることができる。蛍光体は透光性を備えており、例えばLEDの半導体発光層から発光された光で励起されて発光する。好ましい蛍光体としては、ユーロピウムが附括されたYAG系、銀とアルミニウムによって共附括された硫化亜鉛、アルカリ土類窒化珪素蛍光体等のナイトライド系、アルカリ土類酸化窒化珪素蛍光体等のオキシナイトライド系の蛍光体が利用できる。また紫外光により励起されて所定の色の光を発生する蛍光体を用いてもよい。
(蛍光含有樹脂)
(拡散剤)
(フィラー)
(リン酸処理)
(窒化物系蛍光体の製造方法)
(実施例)
[参考例1]
[参考例2]
[参考例3]
[参考例4]
[参考例5]
[参考例6]
[参考例7]
[参考例8]
[参考例9]
[実施例10]
[参考例10]
[実施例12]
[実施例13]
[実施例15]
[実施例16]
[実施例17]
(実施例18〜21)
[実施例18]
[実施例19]
[実施例20]
[実施例21]
2、2B、2C…半導体発光素子
3、3B、3C…蛍光体層
4、4B…ワイヤ
10…発光素子
11…蛍光部材
13…リードフレーム
13a…マウントリード
13b…インナーリード
14…導電性ワイヤ
15…モールド部材
Claims (8)
- 発光素子と、
前記発光素子の発する光の少なくとも一部を吸収し異なる波長に変換するよう、前記発光素子の周囲に配置された蛍光体とを備える発光装置であって、
前記蛍光体が窒素を含有する窒化物系蛍光材料または酸窒化物系蛍光材料よりなり、かつ
前記蛍光体の表面をリン酸アルミニウム、リン酸イットリウム、リン酸ランタンから選択されるいずれかのリン酸塩で処理してなり、
前記蛍光体は、300℃の空気中で65時間加熱した際の輝度の低下が40%以内であることを特徴とする発光装置。 - 請求項1に記載の発光装置であって、
前記蛍光体が透光性樹脂に含有されて前記発光素子の周囲に配置されてなることを特徴とする発光装置。 - 発光素子の発する光の少なくとも一部を吸収し異なる波長に変換するための発光素子用蛍光体であって、
前記蛍光体が窒素を含有する窒化物系蛍光材料または酸窒化物系蛍光材料よりなり、かつ
前記蛍光体の表面をリン酸アルミニウム、リン酸イットリウム、リン酸ランタンから選択されるいずれかのリン酸塩で処理してなり、
300℃の空気中で65時間加熱した際の輝度の低下が40%以内であることを特徴とする発光素子用蛍光体。 - 請求項3に記載の発光素子用蛍光体であって、
前記蛍光体が、L−M−N:R、L−J−M−N:R、またはL−M−O−N:R(LはBe、Mg、Ca、Sr、Ba、Znからなる群より選ばれる1種以上を含有し、MはC、Si、Ge、Sn、Ti、Zr、Hfからなる群より選ばれる1種以上を含有し、JはB、Al、Ga、In、Scからなる群より選ばれる1種類以上を含有し、Nは窒素、Oは酸素、Rは希土類元素である。)で表される窒化物系または酸窒化物系蛍光体であることを特徴とする発光素子用蛍光体。 - 請求項3又は4に記載の発光素子用蛍光体であって、
前記蛍光体が、LxMyN{(2/3)x+(4/3)y}:R、LxJwMyN{(2/3)x+w+(4/3)y}:R、またはLxMyOzN{(2/3)x+(4/3)y-(2/3)z}:R(0.5≦x≦3、0.5≦y≦9、0.5≦w≦5、0<z≦3;LはBe、Mg、Ca、Sr、Ba、Znからなる群より選ばれる1種以上を含有し、MはC、Si、Ge、Sn、Ti、Zr、Hfからなる群より選ばれる1種以上を含有し、JはB、Al、Ga、In、Scからなる群より選ばれる1種類以上を含有し、Nは窒素、Oは酸素、Rは希土類元素である。)で表され、かつ結晶構造を有することを特徴とする発光素子用蛍光体。 - 請求項3から5のいずれかに記載の発光素子用蛍光体であって、
前記蛍光体の結晶構造が単斜晶または斜方晶であることを特徴とする発光素子用蛍光体。 - 発光素子の発する光の少なくとも一部を吸収し異なる波長に変換するための発光素子用蛍光体の製造方法であって、
リン酸塩を含有する溶液を、窒素を含有する窒化物系蛍光材料または酸窒化物系蛍光材料よりなる蛍光体の表面に接触させる工程と、
処理された蛍光体を、酸素を含まない雰囲気中で100℃以上500℃以下にて熱処理する工程と、
を有しており、
前記リン酸塩は、リン酸アルミニウム、リン酸イットリウム、リン酸ランタンから選択されるいずれかとすることを特徴とする発光素子用蛍光体の製造方法。 - 請求項1に記載の発光装置であって、
前記蛍光体が、請求項4から6のいずれか一に記載の発光素子用蛍光体であることを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005088908A JP4760082B2 (ja) | 2005-03-25 | 2005-03-25 | 発光装置、発光素子用蛍光体及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005088908A JP4760082B2 (ja) | 2005-03-25 | 2005-03-25 | 発光装置、発光素子用蛍光体及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010229653A Division JP5234080B2 (ja) | 2010-10-12 | 2010-10-12 | 発光装置、発光素子用蛍光体及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269938A JP2006269938A (ja) | 2006-10-05 |
JP4760082B2 true JP4760082B2 (ja) | 2011-08-31 |
Family
ID=37205539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005088908A Expired - Lifetime JP4760082B2 (ja) | 2005-03-25 | 2005-03-25 | 発光装置、発光素子用蛍光体及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4760082B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4971630B2 (ja) * | 2005-12-21 | 2012-07-11 | Dowaホールディングス株式会社 | 蛍光体およびその製造方法、並びに発光装置 |
US8153025B2 (en) * | 2007-02-06 | 2012-04-10 | Koninklijke Philips Electronics N.V. | Red emitting luminescent materials |
JP5353192B2 (ja) * | 2007-11-09 | 2013-11-27 | 三菱化学株式会社 | 蛍光体、及びその製造方法 |
JP2010275426A (ja) * | 2009-05-28 | 2010-12-09 | Sumitomo Chemical Co Ltd | 表面処理蛍光体粒子の製造方法及び表面処理蛍光体粒子 |
DE102009032711A1 (de) * | 2009-07-11 | 2011-01-20 | Merck Patent Gmbh | Co-dotierte Silicooxynitride |
JP5744615B2 (ja) * | 2011-04-28 | 2015-07-08 | シャープ株式会社 | 窒化物半導体発光ダイオード素子 |
JP6175060B2 (ja) * | 2012-06-08 | 2017-08-02 | デンカ株式会社 | 蛍光体の表面処理方法、蛍光体、発光装置及び照明装置 |
DE102013108782B4 (de) * | 2012-11-21 | 2024-05-08 | Epistar Corp. | Lichtemittierende Vorrichtung mit mehreren lichtemittierenden Stapelschichten |
WO2014156201A1 (ja) * | 2013-03-29 | 2014-10-02 | 株式会社 東芝 | 蛍光体及びその製造方法並びにそれを用いた発光装置 |
US20170002264A1 (en) * | 2013-12-06 | 2017-01-05 | Sakai Chemical Industry Co., Ltd. | Mecanoluminescent material, method for manufacturing mecanoluminescent material, mecanoluminescent paint composition, resin composition, and mecanoluminescent article |
JP7280866B2 (ja) * | 2018-03-29 | 2023-05-24 | デンカ株式会社 | α型サイアロン蛍光体及び発光装置 |
WO2019188632A1 (ja) * | 2018-03-29 | 2019-10-03 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
US12012536B2 (en) | 2018-03-29 | 2024-06-18 | Denka Company Limited | β-SiAlON phosphor and light-emitting apparatus |
JP6785333B2 (ja) * | 2019-03-29 | 2020-11-18 | デンカ株式会社 | 蛍光体粉末、複合体および発光装置 |
JP7121312B2 (ja) * | 2020-03-26 | 2022-08-18 | 日亜化学工業株式会社 | 発光装置 |
JP2023109480A (ja) | 2022-01-27 | 2023-08-08 | 日亜化学工業株式会社 | 蛍光体及びその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01315485A (ja) * | 1988-03-17 | 1989-12-20 | Sumitomo Chem Co Ltd | El発光体用リン酸塩被覆螢光体及びその製造方法 |
DE10051242A1 (de) * | 2000-10-17 | 2002-04-25 | Philips Corp Intellectual Pty | Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff |
JP2002309247A (ja) * | 2001-04-16 | 2002-10-23 | Nichia Chem Ind Ltd | 窒化ガリウム蛍光体及びその製造方法 |
JP4529349B2 (ja) * | 2002-11-08 | 2010-08-25 | 日亜化学工業株式会社 | 窒化物系蛍光体および発光装置 |
-
2005
- 2005-03-25 JP JP2005088908A patent/JP4760082B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2006269938A (ja) | 2006-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101065522B1 (ko) | 발광 장치 | |
JP4667803B2 (ja) | 発光装置 | |
JP3956972B2 (ja) | 蛍光物質を用いた発光装置 | |
JP5138145B2 (ja) | 蛍光体積層構造及びそれを用いる光源 | |
JP3809760B2 (ja) | 発光ダイオード | |
JP4529349B2 (ja) | 窒化物系蛍光体および発光装置 | |
JP4222017B2 (ja) | 発光装置 | |
JP4725008B2 (ja) | 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法 | |
WO2006077740A1 (ja) | 窒化物蛍光体及びその製造方法並びに窒化物蛍光体を用いた発光装置 | |
JP2003321675A (ja) | 窒化物蛍光体及びその製造方法 | |
JP2004071726A (ja) | 発光装置 | |
WO2004042834A1 (ja) | 発光装置、蛍光体および蛍光体の製造方法 | |
JP4760082B2 (ja) | 発光装置、発光素子用蛍光体及びその製造方法 | |
JP5421205B2 (ja) | 発光装置 | |
JP5592764B2 (ja) | 発光装置 | |
JP5326182B2 (ja) | 発光装置、発光素子用蛍光体及びその製造方法 | |
WO2006117984A1 (ja) | 窒化物蛍光体及びそれを用いた発光装置 | |
JP4187033B2 (ja) | 発光装置 | |
JP5066786B2 (ja) | 窒化物蛍光体及びそれを用いた発光装置 | |
JP4892861B2 (ja) | 窒化物蛍光体及びそれを用いた発光装置 | |
JP4221950B2 (ja) | 蛍光体 | |
JP4009868B2 (ja) | 窒化物蛍光体及びそれを用いた発光装置 | |
JP4613546B2 (ja) | 発光装置 | |
JP5234080B2 (ja) | 発光装置、発光素子用蛍光体及びその製造方法 | |
JP4492189B2 (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080109 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100803 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100810 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101012 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20101221 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20110318 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110318 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20110408 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110510 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110523 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140617 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4760082 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140617 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |