JP4736535B2 - Resin composition for light diffusing member and light diffusing member using the same - Google Patents
Resin composition for light diffusing member and light diffusing member using the same Download PDFInfo
- Publication number
- JP4736535B2 JP4736535B2 JP2005148073A JP2005148073A JP4736535B2 JP 4736535 B2 JP4736535 B2 JP 4736535B2 JP 2005148073 A JP2005148073 A JP 2005148073A JP 2005148073 A JP2005148073 A JP 2005148073A JP 4736535 B2 JP4736535 B2 JP 4736535B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin composition
- antistatic agent
- weight
- light diffusing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 20
- 239000002216 antistatic agent Substances 0.000 claims description 39
- 239000010419 fine particle Substances 0.000 claims description 34
- 229920005668 polycarbonate resin Polymers 0.000 claims description 27
- 239000004431 polycarbonate resin Substances 0.000 claims description 27
- -1 organic anion compound Chemical class 0.000 claims description 25
- 238000009792 diffusion process Methods 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000000129 anionic group Chemical group 0.000 claims description 4
- 125000002252 acyl group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 239000000203 mixture Substances 0.000 description 21
- 238000002834 transmittance Methods 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000012760 heat stabilizer Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 239000007850 fluorescent dye Substances 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 229920001515 polyalkylene glycol Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000006081 fluorescent whitening agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 150000002605 large molecules Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- JWCYRADIWYQGTO-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol phosphorous acid Chemical compound P(O)(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C JWCYRADIWYQGTO-UHFFFAOYSA-N 0.000 description 2
- KBZQKRFMZFQXHE-UHFFFAOYSA-N 1,1-bis(2,6-ditert-butyl-4-methylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol phosphorous acid Chemical compound P(O)(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)C)C(C)(C)C KBZQKRFMZFQXHE-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 235000005811 Viola adunca Nutrition 0.000 description 2
- 240000009038 Viola odorata Species 0.000 description 2
- 235000013487 Viola odorata Nutrition 0.000 description 2
- 235000002254 Viola papilionacea Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 238000012661 block copolymerization Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- NZADFKWJIQWGNZ-UHFFFAOYSA-N (2-ethylphenyl) diphenyl phosphate Chemical compound CCC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 NZADFKWJIQWGNZ-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- AOMQPPIAFGXCAY-UHFFFAOYSA-N 1,3-benzoxazole;stilbene Chemical compound C1=CC=C2OC=NC2=C1.C=1C=CC=CC=1C=CC1=CC=CC=C1 AOMQPPIAFGXCAY-UHFFFAOYSA-N 0.000 description 1
- ZMLPKJYZRQZLDA-UHFFFAOYSA-N 1-(2-phenylethenyl)-4-[4-(2-phenylethenyl)phenyl]benzene Chemical group C=1C=CC=CC=1C=CC(C=C1)=CC=C1C(C=C1)=CC=C1C=CC1=CC=CC=C1 ZMLPKJYZRQZLDA-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- DMAXMXPDVWTIRV-UHFFFAOYSA-N 2-(2-phenylethyl)phenol Chemical compound OC1=CC=CC=C1CCC1=CC=CC=C1 DMAXMXPDVWTIRV-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- RGMDGTAYZZQRBC-UHFFFAOYSA-N 2-[4-(4-oxo-1,3-benzoxazin-2-yl)phenyl]-1,3-benzoxazin-4-one Chemical compound C1=CC=C2OC(C3=CC=C(C=C3)C3=NC(C4=CC=CC=C4O3)=O)=NC(=O)C2=C1 RGMDGTAYZZQRBC-UHFFFAOYSA-N 0.000 description 1
- BBITXNWQALLODC-UHFFFAOYSA-N 2-[4-(4-oxo-3,1-benzoxazin-2-yl)phenyl]-3,1-benzoxazin-4-one Chemical compound C1=CC=C2C(=O)OC(C3=CC=C(C=C3)C=3OC(C4=CC=CC=C4N=3)=O)=NC2=C1 BBITXNWQALLODC-UHFFFAOYSA-N 0.000 description 1
- CDMGNVWZXRKJNS-UHFFFAOYSA-N 2-benzylphenol Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1 CDMGNVWZXRKJNS-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MPWGZBWDLMDIHO-UHFFFAOYSA-N 3-propylphenol Chemical compound CCCC1=CC=CC(O)=C1 MPWGZBWDLMDIHO-UHFFFAOYSA-N 0.000 description 1
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- CIEGINNQDIULCT-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylheptan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C)(C=1C=CC(O)=CC=1)CC(C)(C)C1=CC=C(O)C=C1 CIEGINNQDIULCT-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- SLHDHTKGGYUTPG-UHFFFAOYSA-N 5,7-dichloro-1h-indole-2,3-dione;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.ClC1=CC(Cl)=CC2=C1NC(=O)C2=O SLHDHTKGGYUTPG-UHFFFAOYSA-N 0.000 description 1
- PAJCMEMWFLCNLL-UHFFFAOYSA-N 5-bromo-1h-indole-2,3-dione;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.BrC1=CC=C2NC(=O)C(=O)C2=C1 PAJCMEMWFLCNLL-UHFFFAOYSA-N 0.000 description 1
- GTRAJYAKFCHEKL-UHFFFAOYSA-N 5-chloro-1h-indole-2,3-dione;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.ClC1=CC=C2NC(=O)C(=O)C2=C1 GTRAJYAKFCHEKL-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- LQYZKSSUQDTYTR-UHFFFAOYSA-N 7-(4-methoxyphenyl)-1,5-dioxocane-2,4-dione Chemical compound C1=CC(OC)=CC=C1C1COC(=O)CC(=O)OC1 LQYZKSSUQDTYTR-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IYXGSMUGOJNHAZ-UHFFFAOYSA-N Ethyl malonate Chemical compound CCOC(=O)CC(=O)OCC IYXGSMUGOJNHAZ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- PCKPVGOLPKLUHR-UHFFFAOYSA-N OH-Indolxyl Natural products C1=CC=C2C(O)=CNC2=C1 PCKPVGOLPKLUHR-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- VMNKHSPZIGIPLL-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] dihydrogen phosphite Chemical compound OCC(CO)(CO)COP(O)O VMNKHSPZIGIPLL-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 description 1
- 125000005599 alkyl carboxylate group Chemical group 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001449 anionic compounds Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- ZWRWUGGYDBHANL-UHFFFAOYSA-N butyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCC)OC1=CC=CC=C1 ZWRWUGGYDBHANL-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004650 carbonic acid diesters Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- JYGFTBXVXVMTGB-UHFFFAOYSA-N indolin-2-one Chemical compound C1=CC=C2NC(=O)CC2=C1 JYGFTBXVXVMTGB-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 125000000400 lauroyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- HAMGRBXTJNITHG-UHFFFAOYSA-N methyl isocyanate Chemical compound CN=C=O HAMGRBXTJNITHG-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- KCRLWVVFAVLSAP-UHFFFAOYSA-N octyl dihydrogen phosphite Chemical compound CCCCCCCCOP(O)O KCRLWVVFAVLSAP-UHFFFAOYSA-N 0.000 description 1
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- SJDACOMXKWHBOW-UHFFFAOYSA-N oxyphenisatine Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2NC1=O SJDACOMXKWHBOW-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000005080 phosphorescent agent Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 125000000612 phthaloyl group Chemical group C(C=1C(C(=O)*)=CC=CC1)(=O)* 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- AIMUHNZKNFEZSN-UHFFFAOYSA-M sodium;decane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCS([O-])(=O)=O AIMUHNZKNFEZSN-UHFFFAOYSA-M 0.000 description 1
- KBAFDSIZQYCDPK-UHFFFAOYSA-M sodium;octadecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCS([O-])(=O)=O KBAFDSIZQYCDPK-UHFFFAOYSA-M 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- FICPQAZLPKLOLH-UHFFFAOYSA-N tricyclohexyl phosphite Chemical compound C1CCCCC1OP(OC1CCCCC1)OC1CCCCC1 FICPQAZLPKLOLH-UHFFFAOYSA-N 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- QUTZUATVZPXUJR-UHFFFAOYSA-N trinonyl phosphite Chemical compound CCCCCCCCCOP(OCCCCCCCCC)OCCCCCCCCC QUTZUATVZPXUJR-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- OOZBTDPWFHJVEK-UHFFFAOYSA-N tris(2-nonylphenyl) phosphate Chemical compound CCCCCCCCCC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC OOZBTDPWFHJVEK-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Elements Other Than Lenses (AREA)
Description
本発明は、光拡散性部材用樹脂組成物および光拡散性部材に関し、詳しくは、ポリカーボネート樹脂の有する優れた透明性、機械的性質、熱的性質と共に、速効性と持続性に優れた帯電防止性を有し、優れた光拡散性を有し、且つ光線透過率と拡散率のバランスが良く、照明カバー、照明看板、透過形のスクリーン、各種ディスプレイ、液晶表示装置の光拡散板、光拡散フィルム等の光拡散性部材の材料として有用な樹脂組成物、およびそれから得られる光拡散性部材に関する。 TECHNICAL FIELD The present invention relates to a resin composition for a light diffusing member and a light diffusing member. , Excellent light diffusibility, good balance between light transmittance and diffusivity, lighting cover, lighting signage, transmissive screen, various displays, light diffusion plate for liquid crystal display, light diffusion The present invention relates to a resin composition useful as a material for a light diffusing member such as a film, and a light diffusing member obtained therefrom.
ポリカーボネート樹脂は、耐衝撃性、耐熱性、透明性に優れた熱可塑性樹脂として幅広い用途があり、さらに、無機ガラスに比較して軽量で、生産性にも優れているので、光拡散性を付与することにより、照明カバー、照明看板、透過型のスクリーン、各種ディスプレイ、液晶表示装置の光拡散板、光拡散フィルム等、光拡散性の要求される用途に好適に使用できる。しかし、射出成形やシート加工時の剥離帯電、使用時の摩擦帯電、保護シート剥離時の剥離帯電により、埃や塵の付着による外観不良、電子製品等の精密機器回路誤動作を惹起する可能性があった。 Polycarbonate resin has a wide range of uses as a thermoplastic resin with excellent impact resistance, heat resistance, and transparency, and is lighter and more productive than inorganic glass, providing light diffusibility. By doing so, it can be suitably used for applications requiring light diffusibility, such as lighting covers, lighting signs, transmissive screens, various displays, light diffusion plates of liquid crystal display devices, and light diffusion films. However, due to peeling electrification during injection molding and sheet processing, frictional charging during use, and peeling electrification when the protective sheet is peeled off, there is a possibility of causing poor appearance due to adhesion of dust or dust, and malfunction of precision equipment circuits such as electronic products there were.
ポリカーボネート樹脂に光拡散性を付与するためには、硫酸バリウム、炭酸カルシウム、ガラス、シリカ等の無機化合物やアクリル系、シリコーン系の樹脂の透明微粒子からなる拡散微粒子を配合することが知られている。例えば、特許文献1には、炭酸カルシウムや硫化亜鉛を添加したポリカーボネート樹脂組成物が透明性、光拡散性等と共に熱安定性、耐スチーム性が改善され浴室用途に好適であることが記載され、更に、拡散微粒子と共に、他の樹脂添加剤を配合しても良いことが記載されており、配合可能な樹脂添加剤として帯電防止剤が挙げられている。また、特許文献2には、ポリカーボネート樹脂100重量部に対して、粒径0.1〜10μmのポリシルセスキオキサンを0.001〜10重量部添加した光拡散性ポリカーボネート組成物が開示され、他に配合可能な樹脂添加剤として帯電防止剤が挙げられている。しかしながら、これらの特許文献は何れも、実際に帯電防止剤を配合した光拡散性組成物を具体的に示すものではなく、どのような帯電防止剤をどの程度の量使用するかの開示もない。また、本発明者の実験に拠れば、ポリカーボネート樹脂に光拡散性微粒子と共に帯電防止剤を配合しても、拡散特性および、又は全光線透過率を満足する組成物を得ることは出来なかった。 In order to impart light diffusibility to the polycarbonate resin, it is known to mix diffusing fine particles composed of transparent fine particles of inorganic compounds such as barium sulfate, calcium carbonate, glass and silica, and acrylic and silicone resins. . For example, Patent Document 1 describes that a polycarbonate resin composition to which calcium carbonate or zinc sulfide has been added is improved in heat stability, steam resistance, and the like, as well as transparency and light diffusibility, and is suitable for bathroom use. Further, it is described that other resin additives may be blended together with the diffusing fine particles, and antistatic agents are mentioned as resin additives that can be blended. Patent Document 2 discloses a light-diffusing polycarbonate composition in which 0.001 to 10 parts by weight of a polysilsesquioxane having a particle size of 0.1 to 10 μm is added to 100 parts by weight of a polycarbonate resin. Antistatic agents are listed as other resin additives that can be blended. However, none of these patent documents specifically show a light diffusing composition containing an antistatic agent, nor does it disclose what amount of antistatic agent is used. . Further, according to the experiments of the present inventors, even when an antistatic agent was blended with the light diffusing fine particles in the polycarbonate resin, a composition satisfying the diffusion characteristics and / or the total light transmittance could not be obtained.
一方、樹脂に帯電性を付与するための帯電防止剤についても種々知られており、例えば、特許文献3にはポリアルキレングリコールモノフェノールエーテル誘導体が提案されている。また、特許文献4には、特許文献3の帯電防止剤と有機アニオンを組み合わせた組成物が提案され、特許文献3の帯電防止剤の欠点を改良して速効性と持続性に優れた効果を奏する帯電防止剤であるとされている。しかしてこれらの特許文献には、光拡散性に関する記載はなく、勿論、光拡散性部材への使用を示唆する記載もない。なお、特許文献4には、帯電防止剤を樹脂に添加する方法の1つとして、担体に含浸させてから樹脂に添加する方法が挙げられている。担体としては、樹脂のフィラーや充填剤として知られているものが使用できるとして、ケイ酸カルシウム、シリカ、タルク、アルミナ、酸化チタン等の粉が挙げられているが、粒径等は不明である。 On the other hand, various antistatic agents for imparting chargeability to the resin are also known. For example, Patent Document 3 proposes a polyalkylene glycol monophenol ether derivative. Further, Patent Document 4 proposes a composition combining the antistatic agent of Patent Document 3 and an organic anion, improving the drawbacks of the antistatic agent of Patent Document 3 and providing an excellent effect in rapid action and sustainability. It is said to be an antistatic agent. In these patent documents, there is no description regarding light diffusibility, and of course, there is no description suggesting use for a light diffusive member. Patent Document 4 discloses a method of adding an antistatic agent to a resin after impregnating the carrier with the resin. As the carrier, what is known as a filler or filler of a resin can be used, and powders such as calcium silicate, silica, talc, alumina, titanium oxide, etc. are mentioned, but the particle size etc. are unknown .
本発明は、前記従来技術の問題点を解決し、速効性と持続性に優れた帯電防止性を有し、且つ、優れた光拡散性と高い全光線透過率を有することが出来る光拡散性部材用樹脂組成物、及びそれを用いた光拡散性部材を提供することにある。 The present invention solves the above-mentioned problems of the prior art, has antistatic properties with excellent rapidity and sustainability, and has excellent light diffusibility and high total light transmittance. The object is to provide a resin composition for a member and a light diffusing member using the same.
本発明者は、鋭意検討を行った結果、帯電防止剤を含浸させた微粒子を拡散微粒子として特定量添加することにより、樹脂本来の性質を損なうことなく、速効性と持続性に優れた帯電防止性能を保有し、高い光拡散性および高い全光線透過率を同時に満足させることを見出だし、本発明を完成させた。すなわち、本発明の要旨は、芳香族ポリカーボネート樹脂(A)及び帯電防止剤を含浸させた、重量平均粒径が0.7〜30μm、ポリカーボネート樹脂との屈折率差(Δn)が0.01以上、且つ、ポリカーボネート樹脂と非相溶性の拡散微粒子(B)を含有してなり、拡散微粒子(B)の含有量が、芳香族ポリカーボネート樹脂(A)100重量部に対し、1〜10重量部である光拡散性部材用樹脂組成物及びそれからなる光拡散性樹脂部材に存する。 As a result of diligent investigation, the present inventor has added a specific amount of fine particles impregnated with an antistatic agent as diffusion fine particles, so that the original properties of the resin are not impaired, and the antistatic property is excellent in quick action and sustainability. It has been found that it possesses performance and satisfies both high light diffusivity and high total light transmittance at the same time, and has completed the present invention. That is, the gist of the present invention is that the weight average particle diameter impregnated with the aromatic polycarbonate resin (A) and the antistatic agent is 0.7 to 30 μm, and the refractive index difference (Δn) with respect to the polycarbonate resin is 0.01 or more. and, Ri name contains polycarbonate resin and incompatible diffusion particles (B), with respect to content, the aromatic polycarbonate resin (a) 100 parts by weight of the diffusion particles (B), 1 to 10 parts by weight der Ru light diffusing member for resin composition and consists in a light diffusing resin member made therefrom.
本発明の樹脂組成物は、芳香族ポリカーボネート樹脂本来の特性を損なうことなく、更に、速効性及び持続性に優れた帯電防止性、高い光拡散性および高い全光線透過率を同時に有するため、照明カバー、照明看板、透過形のスクリーン、各種ディスプレイ、液晶表示装置の光拡散板や光拡散フィルム等、光拡散性の必要な用途に幅広く使用できる。 The resin composition of the present invention does not impair the original characteristics of the aromatic polycarbonate resin, and further has an antistatic property excellent in rapidity and sustainability, high light diffusibility, and high total light transmittance. It can be widely used for applications that require light diffusibility, such as covers, lighting signs, transmissive screens, various displays, and light diffusion plates and light diffusion films for liquid crystal display devices.
以下、本発明を詳細に説明する。
本発明に使用されるポリカーボネート樹脂は、芳香族ジヒドロキシ化合物又はこれと少量のポリヒドロキシ化合物と、ホスゲンとの界面重合法により得られるか、または、上記の芳香族ジヒドロキシ化合物又はこれと少量のポリヒドロキシ化合物と、炭酸ジエステルとのエステル交換反応により得られる、分岐していてもよい芳香族ポリカーボネート重合体である。
Hereinafter, the present invention will be described in detail.
The polycarbonate resin used in the present invention can be obtained by an interfacial polymerization method of an aromatic dihydroxy compound or a small amount thereof and phosgene, or the above aromatic dihydroxy compound or a small amount of polyhydroxy compound. An aromatic polycarbonate polymer which may be branched and is obtained by a transesterification reaction between a compound and a carbonic acid diester.
原料の芳香族ジヒドロキシ化合物としては、2,2−ビス(4−ヒドロキシフェニル)プロパン(=ビスフェノールA)、2,2−ビス(4−ヒドロキシ−3,5−ジメチルフェニル)プロパン(=テトラメチルビスフェノールA)等のビス(4−ヒドロキシフェニル)アルカン類;2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン(=テトラブロムビスフェノールA)、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパン(=テトラクロロビスフェノールA)等のハロゲンを含むビス(4−ヒドロキシフェニル)アルカン類;1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、ハイドロキノン、レゾルシノール、4,4−ジヒドロキシジフェニル等が挙げられ、好ましくはハロゲンを含んでいても良いビス(4−ヒドロキシフェニル)アルカン類が挙げられ、特に好ましくは、ビスフェノールAである。これらの芳香族ジヒドロキシ化合物は1種でも良いが、複数用いても良い。 As the aromatic dihydroxy compound as a raw material, 2,2-bis (4-hydroxyphenyl) propane (= bisphenol A), 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane (= tetramethylbisphenol) Bis (4-hydroxyphenyl) alkanes such as A); 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane (= tetrabromobisphenol A), 2,2-bis (4-hydroxy-) Bis (4-hydroxyphenyl) alkanes containing halogen such as 3,5-dichlorophenyl) propane (= tetrachlorobisphenol A); 1,1-bis (4-hydroxyphenyl) cyclohexane, hydroquinone, resorcinol, 4,4- Dihydroxydiphenyl and the like, preferably containing halogen Some good bis (4-hydroxyphenyl) alkanes. Particularly preferred is bisphenol A. These aromatic dihydroxy compounds may be used alone or in combination.
分岐したポリカーボネートを得るには、フロログルシン、4,6−ジメチル−2,4,6−トリス(4−ヒドロキシフェニル)ヘプテン−2、4,6−ジメチル−2,4,6−トリス(4−ヒドロキシフェニル)ヘプタン、2,6−ジメチル−2,4,6−トリス(4−ヒドロキシフェニルヘプテン−3、1,3,5−トリス(4−ヒドロキシフェニル)ベンゼン、1,1,1−トリス(4−ヒドロキシフェニル)エタン等で示されるポリヒドロキシ化合物、及び3,3−ビス(4−ヒドロキシアリール)オキシインドール(=イサチンビスフェノール)、5−クロルイサチンビスフェノール、5,7−ジクロルイサチンビスフェノール、5−ブロムイサチンビスフェノール等の3価以上のポリヒドロキシ化合物を、前記ジヒドロキシ化合物の一部として使用すれば良い。ポリヒドロキシ化合物を使用する場合の使用量は、例えば、前記ジヒドロキシ化合物の0.1〜2モル%程度である。 To obtain branched polycarbonate, phloroglucin, 4,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) heptene-2, 4,6-dimethyl-2,4,6-tris (4-hydroxy Phenyl) heptane, 2,6-dimethyl-2,4,6-tris (4-hydroxyphenylheptene-3,1,3,5-tris (4-hydroxyphenyl) benzene, 1,1,1-tris ( Polyhydroxy compounds represented by 4-hydroxyphenyl) ethane and the like, and 3,3-bis (4-hydroxyaryl) oxindole (= isatin bisphenol), 5-chlorisatin bisphenol, 5,7-dichloroisatin bisphenol , Trihydroxy or higher polyhydroxy compounds such as 5-bromoisatin bisphenol, the dihydroxy compound The amount of using may be used as part. Polyhydroxy compounds, for example, about 0.1 to 2 mole% of the dihydroxy compound.
さらに、分子量調節剤として、一価の芳香族ヒドロキシ化合物等を使用することができる。分子量調整剤としては、例えば、m−及びp−メチルフェノール、m−及びp−プロピルフェノール、p−ブロムフェノール、p−tert−ブチルフェノール及びp−長鎖アルキル置換フェノール等が挙げられる。 Furthermore, a monovalent aromatic hydroxy compound or the like can be used as a molecular weight regulator. Examples of the molecular weight modifier include m- and p-methylphenol, m- and p-propylphenol, p-bromophenol, p-tert-butylphenol and p-long chain alkyl-substituted phenol.
本発明で使用するポリカーボネート樹脂の分子量は、メチレンクロライドを溶媒として25℃で測定した粘度より求めた粘度平均分子量が、16,000〜38,000であることが好ましく、より好ましくは18,000〜35,000である。
また、本発明で使用するポリカーボネート樹脂は2種以上の混合物であってもよい。
As for the molecular weight of the polycarbonate resin used in the present invention, the viscosity average molecular weight determined from the viscosity measured at 25 ° C. using methylene chloride as a solvent is preferably 16,000 to 38,000, more preferably 18,000 to 35,000.
The polycarbonate resin used in the present invention may be a mixture of two or more.
本発明で使用される、拡散微粒子(B)は、帯電防止剤を含浸させた重量平均粒径が、0.7〜30μm、且つ、ポリカーボネート樹脂との屈折率差(Δn)が0.01以上で、ポリカーボネート樹脂と非相溶性の微粒子である。かかる微粒子の材質は、帯電防止剤を含浸できるもので、ポリカーボネート樹脂との相溶性、屈折率差が上記要件を満たすものであれば、特に限定されるものではなく、一般に光拡散剤として知られている種々の微粒子を使用することができる。例えば、無機系の拡散微粒子としては、硫酸バリウム、タルク、炭酸カルシウム、シリカ、ガラス等が、また、有機系では、シリコーン系樹脂、アクリル系樹脂、ベンゾグアナミン系樹脂、スチレン系樹脂、ブタジエン系樹脂、或いはこれらの共重合体やコアシェルタイプの重合体からなる微粒子を使用することができる。帯電防止剤を含浸しやすくするため、多孔質であるものが好ましい。また、有機系では架橋構造を有するものが好ましい。かかる微粒子の中、無機系ではシリカが、また有機系ではアクリル系やシリコーン系の架橋重合体粒子が好ましく、特にシリカが好ましい。 The diffusion fine particles (B) used in the present invention have a weight average particle size impregnated with an antistatic agent of 0.7 to 30 μm and a refractive index difference (Δn) of 0.01 or more with the polycarbonate resin. Thus, the particles are incompatible with the polycarbonate resin. The material of such fine particles can be impregnated with an antistatic agent and is not particularly limited as long as the compatibility with the polycarbonate resin and the difference in refractive index satisfy the above-mentioned requirements. Generally, it is known as a light diffusing agent. Various fine particles can be used. For example, as the inorganic diffusion fine particles, barium sulfate, talc, calcium carbonate, silica, glass, etc., and in the organic system, silicone resin, acrylic resin, benzoguanamine resin, styrene resin, butadiene resin, Alternatively, fine particles comprising these copolymers or core-shell type polymers can be used. In order to facilitate impregnation with the antistatic agent, a porous material is preferable. Moreover, what has a crosslinked structure in an organic type is preferable. Among these fine particles, silica is preferable for inorganic materials, and acrylic or silicone-based crosslinked polymer particles are preferable for organic materials, and silica is particularly preferable.
拡散微粒子(B)の重量平均径の測定は、例えば、コールター法(Coulter Multisizer)やレ−ザ−回折式粒度分布測定装置を用いて行う。粒子径が0.7μm未満の拡散微粒子を配合すると、得られた樹脂組成物の光拡散性が劣り、光源が透けて見えたり、視認性に劣ったりする。逆に、粒子径が30μmを越える拡散微粒子は、添加量に対する拡散効果が低くなり、効果を上げるために多量に添加すると光線透過率や機械的特性が低下する。拡散微粒子(B)の重量平均径としては、好ましくは1〜20μmの範囲である。 The weight average diameter of the diffusing fine particles (B) is measured using, for example, a Coulter Multisizer or a laser diffraction type particle size distribution measuring apparatus. When diffusing fine particles having a particle diameter of less than 0.7 μm are blended, the resulting resin composition is inferior in light diffusibility, and the light source can be seen through, or the visibility is inferior. On the other hand, the diffusion fine particles having a particle diameter exceeding 30 μm have a low diffusion effect with respect to the addition amount, and when added in a large amount to increase the effect, the light transmittance and mechanical properties are lowered. The weight average diameter of the diffusion fine particles (B) is preferably in the range of 1 to 20 μm.
また、屈折率とは、温度25℃における、d線(587.562nm,He)の光に対する値で、実際の測定は、ポリカーボネートの屈折率(npc)は、Vブロック法(カルニュー光学製、形式KPR)により、拡散微粒子の屈折率(nld)は、ベッケ法(標準溶液と比較する方法)により行う。本発明において好ましく使用されるビスフェノールAを原料とするポリカーボネート樹脂の屈折率は約1.58であるので、これとの差を考慮して、最適な屈折率を有する拡散微粒子を選択するのが良い。ポリカーボネート樹脂と光拡散微粒子との屈折率差(Δn=npc−nld)が0.01以上であっても、光拡散性が不十分で光源が透けて見えて、視認性に劣る場合があるので、屈折率差は好ましくは0.05以上、特に好ましくは0.07以上である。 The refractive index is a value with respect to the light of d-line (587.562 nm, He) at a temperature of 25 ° C. The actual measurement shows that the refractive index (n pc ) of polycarbonate is V-block method (manufactured by Karnew Optical, According to the format KPR, the refractive index (n ld ) of the diffusing fine particles is determined by the Becke method (method compared with the standard solution). Since the refractive index of the polycarbonate resin made from bisphenol A preferably used in the present invention is about 1.58, it is preferable to select the diffusing fine particles having the optimum refractive index in consideration of the difference with this. . Even if the difference in refractive index between the polycarbonate resin and the light diffusing fine particles (Δn = n pc −n ld ) is 0.01 or more, the light diffusibility is insufficient, the light source can be seen through, and the visibility may be inferior. Therefore, the difference in refractive index is preferably 0.05 or more, particularly preferably 0.07 or more.
本発明の拡散微粒子に含浸させる帯電防止剤は、微粒子に含浸させることが出来、速効性と持続性に優れた樹脂用の種々の帯電防止剤から選ばれる。例えば、速効性および持続性の優れた帯電防止剤としては、ポリエーテルブロックアミド系、ポリエーテルエステルアミド系化合物、ポリエーテルエステルとイオン性界面活性剤との組成物、特許文献3記載のポリアルキレングリコールモノフェノールエーテル構造を有する高分子量化合物、特許文献4記載のポリアルキレングリコールモノフェノールエーテル構造を有する高分子量の化合物と有機アニオン化合物の組成物等からなる帯電防止剤を使用することができる。中でも、ポリアルキレングリコールモノフェノールエーテル構造を有する高分子量の化合物と有機アニオン化合物を組み合わせた帯電防止剤が速効性及び持続性に優れており好適である。
特に特許文献4記載の下記一般式(1)で示されるポリアルキレングリコールモノフェノールエーテル構造を有する単量体ユニットを含有する重合体と、有機アニオン化合物を組み合わせた帯電防止剤が好ましい。
The antistatic agent to be impregnated into the diffusing fine particles of the present invention is selected from various antistatic agents for resins that can be impregnated into fine particles and are excellent in rapid action and sustainability. For example, as an antistatic agent excellent in rapid action and durability, a polyether block amide type, a polyether ester amide type compound, a composition of a polyether ester and an ionic surfactant, a polyalkylene described in Patent Document 3 An antistatic agent comprising a high molecular weight compound having a glycol monophenol ether structure, a composition of a high molecular weight compound having a polyalkylene glycol monophenol ether structure described in Patent Document 4 and an organic anion compound, or the like can be used. Among them, an antistatic agent obtained by combining a high molecular weight compound having a polyalkylene glycol monophenol ether structure and an organic anion compound is excellent in rapid action and sustainability, and is preferable.
In particular, an antistatic agent in which a polymer containing a monomer unit having a polyalkylene glycol monophenol ether structure represented by the following general formula (1) described in Patent Document 4 and an organic anion compound is combined is preferable.
(式中、R1はアルキレン基を表わし、R2は水素原子、ハロゲン原子又は炭化水素基を表わし、Xは水素原子、炭化水素基、イソシアネート残基もしくはアシル基、又はアニオン性親水基を表わす。mは1以上の数を表わす。)。 (Wherein R 1 represents an alkylene group, R 2 represents a hydrogen atom, a halogen atom or a hydrocarbon group, X represents a hydrogen atom, a hydrocarbon group, an isocyanate residue or an acyl group, or an anionic hydrophilic group) M represents a number of 1 or more).
一般式(1)において、R1はエチレン、プロピレン、ブチレン等のアルキレン基であり、R2は水素原子、クロル、ブロム等のハロゲン原子、アルキル、アルケニル、シクロアルキル、アリール、アラルキル基等の炭化水素基を示す。Xは、水素原子;アルキル基、アルケニル基、アリール基、シクロアルキル基、シクロアルケニル基等の炭化水素基;メチルイソシアナト、エチルイソシアナト、フェニルイソシアナト、オレイルイソシアナト等のモノイソシアネート残基;アセチル、プロピオニル、ラウロイル、ステアロイル、クロトノイル、ベンゾイル、フタロイル基等のアシル基;あるいは、アルキルスルホン酸基、サルフェート基、ホスフェート基、アルキルカルボキシレート基等のアニオン性基を示す。mは1以上、好ましくは1〜300、より好ましくは1〜200、特に好ましくは5〜100の数である。 In the general formula (1), R 1 is an alkylene group such as ethylene, propylene and butylene, R 2 is a carbon atom such as a hydrogen atom, a halogen atom such as chloro or bromo, an alkyl, alkenyl, cycloalkyl, aryl or aralkyl group. Indicates a hydrogen group. X represents a hydrogen atom; a hydrocarbon group such as an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, or a cycloalkenyl group; a monoisocyanate residue such as methyl isocyanate, ethyl isocyanate, phenyl isocyanato, or oleyl isocyanato; Acyl groups such as acetyl, propionyl, lauroyl, stearoyl, crotonoyl, benzoyl and phthaloyl groups; or anionic groups such as alkylsulfonic acid groups, sulfate groups, phosphate groups and alkylcarboxylate groups. m is 1 or more, preferably 1 to 300, more preferably 1 to 200, and particularly preferably 5 to 100.
一般式(1)で示される単量体ユニットを含有する重合体は、具体的にはフェノールまたはクロルフェノール、クレゾール、ブチルフェノール、ノニルフェノール、シクロヘキシルフェノール、ベンジルフェノール、フェネチルフェノール等の置換基を有するフェノール類とホルムアルデヒドとの脱水縮合物のアルキレンオキサイド付加物、及びかかる付加物のアルキレンオキサイド鎖の末端を炭化水素基でエーテル化するか、イソシアナト基またはカルボニル基を有する炭化水素基を導入してウレタン結合またはエステル結合を導入するか、或いは前記付加物のアルキレンオキサイド鎖の末端に、アニオン性親水基またはそのアニオン性水素原子をアルカリまたはアルカリ土類金属イオンもしくはアンモニウムイオンで中和した基を導入した化合物を単量体ユニットとして含む重合体である。 The polymer containing the monomer unit represented by the general formula (1) specifically includes phenols having substituents such as phenol or chlorophenol, cresol, butylphenol, nonylphenol, cyclohexylphenol, benzylphenol, and phenethylphenol. An alkylene oxide adduct of a dehydration condensate of aldehyde and formaldehyde, and the end of the alkylene oxide chain of such an adduct is etherified with a hydrocarbon group, or a hydrocarbon group having an isocyanato group or a carbonyl group is introduced to form a urethane bond or An ester bond is introduced, or an anionic hydrophilic group or a group obtained by neutralizing an anionic hydrogen atom with an alkali or alkaline earth metal ion or ammonium ion is introduced at the end of the alkylene oxide chain of the adduct. The compound is a polymer containing as a monomer unit.
一般式(1)において、(R1−O)mの部分は、(置換)フェノールにエチレンオキサイド、プロピレンオキサイド、長鎖α−オレフィンオキサイド、テトラヒドロフラン等のアルキレンオキサイドの1種または2種以上を付加重合させることにより得られる。好ましくはエチレンオキサイド及びまたはプロピレンオキサイドであり、付加重合法は、ランダム重合、ブロック共重合、ランダム/ブロック共重合のいずれでもよい。 In the general formula (1), the (R 1 -O) m portion is a (substituted) phenol added with one or more alkylene oxides such as ethylene oxide, propylene oxide, long chain α-olefin oxide, and tetrahydrofuran. It is obtained by polymerizing. Ethylene oxide and / or propylene oxide are preferable, and the addition polymerization method may be random polymerization, block copolymerization, or random / block copolymerization.
一般式(1)で表される単量体ユニットを含有する重合体は、一般式(1)の単量体ユニットを2個以上、好ましくは3〜30個含有し、且つ重合体中における一般式(1)の単量体ユニットの割合が10重量%以上、好ましくは30重量%以上である重合体である。一般式(1)の単量体ユニットを含有する重合体と組み合わせて使用する低分子量有機アニオン化合物は、平均分子量が100〜500、好ましくは100〜400の酸性基を有する有機化合物またはその中和物である。具体的には、脂肪酸、アルケニルコハク酸、置換されていても良い安息香酸、サリチル酸、アクリル酸、アミノ酸等の有機カルボン酸;置換されていても良いベンゼンスルホン酸、α−オレフィンスルホン酸等の有機スルホン酸;アルキル硫酸エステル、アルケニル硫酸エステル等の有機硫酸エステル;酸性アルキルリン酸エステル、酸性アルキル亜リン酸エステル、酸性ポリオキシアルキレンアルキルリン酸エステル、アルキルホスホン酸等の有機リン酸、或いはそれらの中和物等が挙げられ、好ましくは有機スルホン酸、そのアルカリ金属塩、アルカリ土類金属塩、アンモニウム塩である。特に好ましいアニオン性化合物としては、デシルスルホン酸ソーダ、C9〜C13アルキルスルホン酸ソーダ、オクタデシルスルホン酸ソーダ、p−トルエンスルホン酸ソーダ、ドデシルベンゼンスルホン酸ソーダ、或いは対応するカリウム塩、リチウム塩等が挙げられる。 The polymer containing the monomer unit represented by the general formula (1) contains 2 or more, preferably 3 to 30 monomer units of the general formula (1), It is a polymer in which the proportion of the monomer unit of the formula (1) is 10% by weight or more, preferably 30% by weight or more. The low molecular weight organic anion compound used in combination with the polymer containing the monomer unit of the general formula (1) is an organic compound having an average molecular weight of 100 to 500, preferably 100 to 400, or neutralization thereof. It is a thing. Specifically, fatty acid, alkenyl succinic acid, organic carboxylic acid such as benzoic acid, salicylic acid, acrylic acid and amino acid which may be substituted; organic such as benzenesulfonic acid and α-olefin sulfonic acid which may be substituted Sulfonic acid; Organic sulfuric acid ester such as alkyl sulfuric acid ester and alkenyl sulfuric acid ester; Organic phosphoric acid such as acidic alkyl phosphoric acid ester, acidic alkyl phosphorous acid ester, acidic polyoxyalkylene alkyl phosphoric acid ester and alkylphosphonic acid, or their Examples thereof include neutralized products, and organic sulfonic acids, alkali metal salts, alkaline earth metal salts, and ammonium salts thereof are preferable. Particularly preferable anionic compounds include sodium decyl sulfonate, sodium C9-C13 alkyl sulfonate, sodium octadecyl sulfonate, sodium p-toluene sulfonate, sodium dodecyl benzene sulfonate, or the corresponding potassium salt, lithium salt, and the like. It is done.
帯電防止剤組成物中の一般式(1)のユニットを有する重合体/有機アニオン化合物の割合は重量比で、10/90〜99.5/0.5、好ましくは15/85〜99/1である。 The ratio of the polymer / organic anion compound having the unit of the general formula (1) in the antistatic agent composition is 10/90 to 99.5 / 0.5, preferably 15/85 to 99/1 in weight ratio. It is.
帯電防止剤の使用量は、帯電防止剤の種類や要求される帯電防止性能(表面固有抵抗等)等により異なる。例えば、上記一般式(1)のユニットを有する重合体と有機アニオン化合物からなる帯電防止剤を使用する場合、通常、ポリカーボネート樹脂100重量部に対し、0.05〜5重量部である。また、微粒子に含浸させる帯電防止剤の量も、特に規定されるものではなく。本発明樹脂組成物に要求される帯電性能を満たす帯電防止剤の量及び、本発明樹脂組成物に要求される光線透過率、光拡散性等の光学的性能を満たす拡散微粒子の量を勘案して、微粒子に含浸させる帯電防止剤の量を決定すればよい。なお、一般式(1)で示される単量体ユニットを含有する重合体と有機アニオン化合物を組み合わせた帯電防止剤をシリカ微粒子に含浸させたものは旭電化工業社より、「アデカノールAS−113」として市販されている。 The amount of antistatic agent used varies depending on the type of antistatic agent and the required antistatic performance (surface specific resistance, etc.). For example, when using the antistatic agent which consists of a polymer which has a unit of the above-mentioned general formula (1), and an organic anion compound, it is 0.05-5 weight part normally with respect to 100 weight part of polycarbonate resin. Further, the amount of the antistatic agent impregnated into the fine particles is not particularly specified. Considering the amount of antistatic agent that satisfies the charging performance required for the resin composition of the present invention and the amount of diffusing fine particles that satisfy optical performance such as light transmittance and light diffusivity required for the resin composition of the present invention. Thus, the amount of the antistatic agent impregnated in the fine particles may be determined. In addition, what impregnated the silica particle with the antistatic agent which combined the polymer containing the monomer unit shown by General formula (1), and an organic anion compound is "Adecanol AS-113" from Asahi Denka Kogyo Co., Ltd. Is commercially available.
帯電防止剤を微粒子に含浸させる方法も特に規定されるものではなく、公知の方法が採用される。例えば、液状の帯電防止剤或いは溶媒に溶解させて液状とした帯電防止剤に微粒子を添加、混合し、必要あれば加熱し、溶媒を除去する。 The method for impregnating the fine particles with the antistatic agent is not particularly defined, and a known method is employed. For example, fine particles are added to and mixed with a liquid antistatic agent or a liquid antistatic agent dissolved in a solvent, and if necessary, heated to remove the solvent.
本発明樹脂組成物中の拡散微粒子(B)の量は、芳香族ポリカーボネート樹脂100重量部に対し、1〜10重量部、好ましくは2〜6重量部である。拡散微粒子(B)の量が1重量部未満では光拡散性、光線透過率が不十分で、樹脂組成物の色相も悪い。また、拡散微粒子(B)の量が多すぎると、光線透過率が小さくなり、且つ機械的物性が大幅に低下する。 The amount of the diffusing fine particles (B) in the resin composition of the present invention is 1 to 10 parts by weight, preferably 2 to 6 parts by weight with respect to 100 parts by weight of the aromatic polycarbonate resin. When the amount of the diffusing fine particles (B) is less than 1 part by weight, the light diffusibility and the light transmittance are insufficient, and the hue of the resin composition is also poor. Moreover, when there is too much quantity of a diffusion fine particle (B), light transmittance will become small and a mechanical physical property will fall significantly.
本発明の樹脂組成物は芳香族ポリカーボネート樹脂(A)及び拡散微粒子(B)を必須成分として含有するが、その他に、必要に応じて、本発明の効果を損なわない範囲で、帯電防止剤を含浸しない無機系、有機系の球状や繊維状の光拡散剤、酸化防止剤、熱安定剤、光安定剤、紫外線吸収剤、滑剤或いは離型剤、流動改質剤、染料、蛍光染料、有機発光体、蓄光剤、その他の添加剤を配合しても良く、また、ポリカーボネートの透明性を損なわないその他の樹脂を配合することができる。中でも、紫外線吸収剤、酸化防止剤、白色系あるいは青色系の蛍光染料、熱安定剤、難燃剤から少なくとも一種を添加するのが良い。 The resin composition of the present invention contains the aromatic polycarbonate resin (A) and the diffusing fine particles (B) as essential components. In addition, if necessary, an antistatic agent is added as long as the effects of the present invention are not impaired. Non-impregnated inorganic or organic spherical or fibrous light diffusing agent, antioxidant, heat stabilizer, light stabilizer, ultraviolet absorber, lubricant or mold release agent, flow modifier, dye, fluorescent dye, organic A phosphor, a phosphorescent agent, and other additives may be blended, and other resins that do not impair the transparency of the polycarbonate can be blended. Among these, it is preferable to add at least one of an ultraviolet absorber, an antioxidant, a white or blue fluorescent dye, a heat stabilizer, and a flame retardant.
本発明組成物に添加される蛍光染料としては、白色系もしくは青色系の蛍光染料、特に熱可塑性樹脂用の蛍光増白剤が好ましい。蛍光増白剤は、成形品を明るく見せるため、成形品に配合される白色系もしくは青色系の蛍光染料であり、成形品の黄色味を消し、明るさを強める機能がある。成形品の黄色味を消すという点では、機能がブルーイング剤と類似しているが、ブルーイング剤は単に成形品の黄色光を除去するのに対して、蛍光増白剤は波長400nm未満の紫外線を吸収し、そのエネルギーを波長400nm以上の可視光線、とくに青紫色の光線に変えて放射する点で異なっている。熱可塑性樹脂用として公知の蛍光増白剤の中でも耐熱性の観点から高分子量のものが好ましく、例えば、スチルベンベンゾオキサゾール系、フェニルアリルトリアゾリルクマリン系の蛍光増白剤が挙げられる。また有機EL用として公知の白色有機発光体や青色有機発光体も使用可能であり、例えば、ジスチリルビフェニル系青色発光材、アリールエチニルベンゼン系青色蛍光発光材、キンキピリジン系発光材、セキシフェニル系青色発光材、ジメシチルボリルアントラセン系発光材、キナクリドン系発光材等が挙げられる。 As the fluorescent dye added to the composition of the present invention, a white or blue fluorescent dye, particularly a fluorescent whitening agent for a thermoplastic resin is preferable. The fluorescent whitening agent is a white or blue fluorescent dye blended in a molded product in order to make the molded product appear brighter, and has a function of eliminating the yellowness of the molded product and increasing the brightness. The function is similar to the bluing agent in terms of eliminating the yellowness of the molded product, but the bluing agent simply removes the yellow light of the molded product, whereas the fluorescent whitening agent has a wavelength of less than 400 nm. It differs in that it absorbs ultraviolet rays and changes its energy into visible light having a wavelength of 400 nm or more, particularly blue-violet light. Among the known fluorescent brighteners for thermoplastic resins, those having a high molecular weight are preferable from the viewpoint of heat resistance, and examples thereof include stilbene benzoxazole-based and phenylallyltriazolylcoumarin-based fluorescent brighteners. Also known white organic light emitters and blue organic light emitters can be used for organic EL. For example, distyryl biphenyl blue light emitting material, arylethynylbenzene blue fluorescent light emitting material, quinkipyridine light emitting material, sexiphenyl blue light emitting material. Examples thereof include luminescent materials, dimesitylboryl anthracene-based luminescent materials, and quinacridone-based luminescent materials.
本発明組成物中の蛍光染料の含有率は、芳香族ポリカーボネート樹脂組成物中0.00001〜1重量%の範囲が好ましい。蛍光染料の含有率が0.00001重量%未満では、成形品の黄色味を消し、明るさを強めるという機能、および紫外線を吸収し可視部の青紫色に放射する機能が十分に発揮されず、0.1重量%を超えてもそれ以上の添加効果は見られない。蛍光染料は、拡散微粒子に分散させて用いると、耐熱安定性が向上して好ましい。 The content of the fluorescent dye in the composition of the present invention is preferably in the range of 0.00001 to 1% by weight in the aromatic polycarbonate resin composition. If the content of the fluorescent dye is less than 0.00001% by weight, the function of erasing the yellowishness of the molded product and enhancing the brightness, and the function of absorbing ultraviolet rays and emitting to the blue-violet of the visible part are not sufficiently exhibited, Even if it exceeds 0.1% by weight, no additional effect is observed. When the fluorescent dye is used by being dispersed in the diffusing fine particles, the heat resistance stability is preferably improved.
本発明組成物には、光線透過率と色相の向上のため、リン系熱安定剤を配合するのが好ましい。リン系熱安定剤としては、亜リン酸エステル類、リン酸エステル類が好ましい。亜リン酸エステル類としては、例えば、トリフェニルホスファイト、トリスノニルフェニルホスファイト、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト、トリノニルホスファイト、トリデシルホスファイト、トリオクチルホスファイト、トリオクタデシルホスファイト、ジステアリルペンタエリスリトールジホスファイト、トリシクロヘキシルホスファイト、モノブチルジフエニルホスファイト、モノオクチルジフエニルホスファイト、ジステアリルペンタエリスリトールジホスファイト、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールホスファイト、ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールホスファイト、2,2−メチレンビス(4,6−ジ−tert−ブチルフェニル)オクチルホスファイト等の亜リン酸のトリエステル、ジエステル、モノエステル等が挙げられる。 In order to improve the light transmittance and the hue, it is preferable to add a phosphorus heat stabilizer to the composition of the present invention. As the phosphorus heat stabilizer, phosphites and phosphates are preferable. Examples of phosphites include triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, trinonyl phosphite, tridecyl phosphite, trioctyl phosphite. Phyto, trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tricyclohexyl phosphite, monobutyl diphenyl phosphite, monooctyl diphenyl phosphite, distearyl pentaerythritol diphosphite, bis (2,4-di- tert-butylphenyl) pentaerythritol phosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, 2,2-methylenebis (4,6-di-ter - butylphenyl) triesters of phosphorous acid such as octyl phosphite, diesters, monoesters, and the like.
リン酸エステル類としては、トリメチルホスフェート、トリエチルホスフェート、トリブチルホスフェート、トリオクチルホスフェート、トリフェニルホスフェート、トリクレジルホスフェート、トリス(ノニルフェニル)ホスフェート、2−エチルフェニルジフェニルホスフェート、テトラキス(2,4−ジ−tert−ブチルフェニル)−4,4−ジフエニレンホスフォナイト等が挙げられる。 Phosphate esters include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyldiphenyl phosphate, tetrakis (2,4-di -Tert-butylphenyl) -4,4-diphenylene phosphonite.
これらのリン系熱安定剤の中では、ジステアリルペンタエリスリトールジホスファイト、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールホスファイト、ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールホスファイト、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイトが好ましく、中でもビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールホスファイトやトリス(2,4−ジ−t−ブチルフェニル)ホスファイトが特に好ましい。なお、リン系熱安定剤は、単独で使用してもよく、2種以上を組み合わせて使用してもよい。 Among these phosphorus heat stabilizers, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol phosphite, bis (2,6-di-tert-butyl-4) -Methylphenyl) pentaerythritol phosphite and tris (2,4-di-tert-butylphenyl) phosphite are preferred. Among them, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite and Tris (2,4-di-t-butylphenyl) phosphite is particularly preferred. In addition, a phosphorus heat stabilizer may be used independently and may be used in combination of 2 or more type.
本発明組成物中のリン系熱安定剤の含有量は、芳香族ポリカーボネート樹脂100重量部に対し、通常0.005〜0.2重量部、好ましくは0.01〜0.1重量部である。リン系熱安定剤の含有率が0.005重量部未満では、熱安定剤としての効果が小さく、0.2重量部を超えてもそれ以上の添加効果は見られず、加水分解が発生し易くなる。 The content of the phosphorus-based heat stabilizer in the composition of the present invention is usually 0.005 to 0.2 parts by weight, preferably 0.01 to 0.1 parts by weight with respect to 100 parts by weight of the aromatic polycarbonate resin. . If the content of the phosphorus-based heat stabilizer is less than 0.005 parts by weight, the effect as a heat stabilizer is small, and if it exceeds 0.2 parts by weight, no additional effect is seen and hydrolysis occurs. It becomes easy.
酸化防止剤の例としては、熱可塑性樹脂用として公知のものを目的に応じて選択すれば良いが、リン系、フェノール系等が好ましく、これらを併用しても良い。酸化防止剤の使用量は樹脂組成物中、0.01〜2重量%の範囲が好ましい。なお、白色度や耐光性を高めるために、更に酸化チタン等の白色顔料を添加してもよい。 As an example of the antioxidant, those known for thermoplastic resins may be selected according to the purpose, but phosphorus-based, phenol-based and the like are preferable, and these may be used in combination. The amount of the antioxidant used is preferably in the range of 0.01 to 2% by weight in the resin composition. In order to increase whiteness and light resistance, a white pigment such as titanium oxide may be further added.
紫外線吸収剤の例としては、ベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤、トリアジン系紫外線吸収剤、オギザニリド系紫外線吸収剤、マロン酸エステル系紫外線吸収剤、ヒンダードアミン系紫外線吸収剤、シアノアクリレート系紫外線吸収剤等が挙げられる。具体例としては、例えば、2−(2−ヒドロキシ−5−tert−オクチルフェニル)ベンゾトリアゾール、2−(3−tert−ブチル−5−メチル−2−ヒドロキシフェニル)−5−クロロベンゾトリアゾール、2−(5−メチル−2−ヒドロキシフェニル)ベンゾトリアゾール、2−[2−ヒドロキシ−3,5−ビス(α,α−ジメチルベンジル)フェニル]−2H−ベンゾトリアゾール、2,2’−メチレンビス(4−クミル−6−ベンゾトリアゾールフェニル)、2,2’−p−フェニレンビス(3,1−ベンゾオキサジン−4−オン)、p−フェニレンビス(1,3−ベンゾオキサジン−4−オン)、プロパネヂオイックアシッド[(4−メトキシフェニル)−メチレン]−ジメチルエステル、1,3−ビス−[2’−シアノ−(3’,3−ジフェニルアクリロイル)オキシ]−2,2−ビス−{[2−シアノ−(3’,3’−ジフェニルアクリロイル)オキシ]メチル}プロパン等が挙げられる。 Examples of UV absorbers include benzotriazole UV absorbers, benzophenone UV absorbers, triazine UV absorbers, oxanilide UV absorbers, malonic ester UV absorbers, hindered amine UV absorbers, and cyanoacrylates. An ultraviolet absorber etc. are mentioned. Specific examples include 2- (2-hydroxy-5-tert-octylphenyl) benzotriazole, 2- (3-tert-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2 -(5-methyl-2-hydroxyphenyl) benzotriazole, 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2′-methylenebis (4 -Cumyl-6-benzotriazolphenyl), 2,2'-p-phenylenebis (3,1-benzoxazin-4-one), p-phenylenebis (1,3-benzoxazin-4-one), propa Nedioic acid [(4-methoxyphenyl) -methylene] -dimethyl ester, 1,3-bis- [2′-cyano- ( 3 ', 3-diphenylacryloyl) oxy] -2,2-bis-{[2-cyano- (3', 3'-diphenylacryloyl) oxy] methyl} propane and the like.
本発明に係わる光拡散性部材用樹脂組成物の製法は、特に限定されるものではなく、芳香族ポリカーボネート(A)、拡散微粒子(B)及び必要に応じて、熱安定剤その他の添加剤を所定量混合、混練することにより製造される。混合及び混練は、通常の熱可塑性樹脂に適用される方法で行えばよく、例えばリボンブレンダー、ヘンシェルミキサー、バンバリーミキサー、ドラムタンブラー、単軸スクリュー押出機、2軸スクリユー押出機、多軸スクリュー押出機等により行うことができる。混練の温度条件は通常、260〜300℃が適当である。 The method for producing the resin composition for a light diffusing member according to the present invention is not particularly limited, and an aromatic polycarbonate (A), diffusing fine particles (B) and, if necessary, a heat stabilizer and other additives. It is manufactured by mixing and kneading a predetermined amount. Mixing and kneading may be performed by a method applied to a normal thermoplastic resin. For example, a ribbon blender, a Henschel mixer, a Banbury mixer, a drum tumbler, a single-screw extruder, a twin-screw extruder, a multi-screw extruder Etc. The temperature condition for kneading is usually 260 to 300 ° C.
本発明の光拡散性部材用樹脂組成物は、一般的な熱可塑性樹脂の成形方法により本発明の光拡散性部材に成形される。例えば生産性の点からペレット状樹脂組成物からの射出成形、射出圧縮成形、押出成形が可能で、さらに押出成形されたシート状成形品からの真空成形、圧空成形等を採用することができる。 The resin composition for a light diffusing member of the present invention is molded into the light diffusing member of the present invention by a general thermoplastic resin molding method. For example, injection molding, injection compression molding, and extrusion molding from a pellet-shaped resin composition are possible from the viewpoint of productivity, and vacuum molding, pressure molding, and the like from an extruded sheet-like molded product can be employed.
本発明の光拡散性部材としては、照明カバー、照明看板、透過形のスクリーン、各種ディスプレイ、液晶表示装置の光拡散板や光拡散フィルム等が挙げられ、中でも液晶表示装置用の光拡散板や光拡散フィルムとして、特には、大型液晶テレビ用拡散板として、好適に用いることができる。
また、本発明の光拡散性部材には、光拡散性を上げるために、公知の方法でエンボス加工、V溝加工、畝状加工等の凹凸加工を表面に施しても良い。これらの加工を施すことにより、光拡散性を保持したまま、光拡散微粒子の添加量を減らすことができる。
Examples of the light diffusing member of the present invention include lighting covers, lighting signs, transmissive screens, various displays, light diffusing plates and light diffusing films for liquid crystal display devices, among others, light diffusing plates for liquid crystal display devices, As a light-diffusion film, it can be used suitably especially as a diffusion plate for large sized liquid crystal televisions.
In addition, the light diffusing member of the present invention may be subjected to uneven processing such as embossing, V-groove processing, and saddle-like processing on the surface by a known method in order to increase light diffusibility. By applying these processes, it is possible to reduce the addition amount of the light diffusing fine particles while maintaining the light diffusibility.
以下、本発明を実施例により更に詳細に説明するが、本発明は、その要旨を超えない限り、以下の実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited to a following example, unless the summary is exceeded.
以下の諸例では表1に示した原材料を使用した。 In the following examples, the raw materials shown in Table 1 were used.
物性の測定及び試験方法は次の通りである。
(1)粘度平均分子量:
ウベローデ粘度計を用いて塩化メチレン中20℃で極限粘度[η]を測定し、以下の式より求めた。
The physical properties are measured and tested as follows.
(1) Viscosity average molecular weight:
The intrinsic viscosity [η] was measured at 20 ° C. in methylene chloride using an Ubbelohde viscometer, and determined from the following formula.
[η]=1.23×10−4×(Mv)0.83
(2)色相(YI)及び全光線透過率、ヘイズ:
実施例または比較例の組成物から成形された2mm厚の試験片を用い、分光式色彩計(日本電色工業社製「SE−2000型」)によりYIを測定した。また、濁度計(日本電色工業社製「NDH−2000型」)を使用して全光線透過率、およびヘイズを測定した。
[Η] = 1.23 × 10 −4 × (Mv) 0.83
(2) Hue (YI) and total light transmittance, haze:
Using a 2 mm-thick test piece molded from the composition of Example or Comparative Example, YI was measured with a spectroscopic colorimeter (“SE-2000 type” manufactured by Nippon Denshoku Industries Co., Ltd.). Moreover, the total light transmittance and the haze were measured using a turbidimeter (“NDH-2000 type” manufactured by Nippon Denshoku Industries Co., Ltd.).
(3)拡散率:
実施例または比較例の組成物から成形された2mm厚の試験片を用いて測定した輝度値を用い、下式により求めた。輝度値の測定はMURAKAMI COLOR RESEARCH LABORATORY社製のGP−5 GONIOPHOTOMETERを使用した。測定条件は、入射光0°、あおり角0°、受光範囲0°〜90°、光束絞り2.0、受光絞り3.0で行った。
(3) Diffusion rate:
Using the luminance value measured using a 2 mm-thick test piece molded from the composition of the example or comparative example, it was obtained by the following equation. For the measurement of the luminance value, GP-5 GONIOPHOTOMETER manufactured by MURAKAMI COLOR RESEARCH LABORATORY was used. The measurement conditions were as follows: incident light 0 °, tilt angle 0 °, light receiving range 0 ° to 90 °, light beam stop 2.0, and light receiving stop 3.0.
拡散率(%)={(20°の輝度値+70°の輝度値)/(5°の輝度値×2)}×100 Diffusion rate (%) = {(20 ° luminance value + 70 ° luminance value) / (5 ° luminance value × 2)} × 100
(4)表面抵抗:
実施例または比較例の組成物を用い、射出成形機(名機社製「M150」)により、300℃の温度で成形したプレート(φ100mm×3.2mm厚)を試験片とし、23℃、50%RHにて1週間調湿した後、および、水洗した直後に、それぞれ、試験片の表面抵抗をADVANTEST社製デジタル超高抵抗/微少電流計R8340を用いて測定した。
(4) Surface resistance:
A plate (φ100 mm × 3.2 mm thickness) molded at 300 ° C. with an injection molding machine (“M150” manufactured by Meiki Co., Ltd.) using the composition of Example or Comparative Example as a test piece, 23 ° C., 50 The surface resistance of the test piece was measured using a digital ultrahigh resistance / microammeter R8340 manufactured by ADVANTEST, respectively, after conditioning for 1 week at% RH and immediately after washing with water.
(5)アイゾット衝撃強度:
ASTM D256に準じて、実施例または比較例の組成物から成形した3.2mm厚、ノッチ付きの試験片を用い、東洋精機製作所社製測定装置を使用して測定した。
(5) Izod impact strength:
According to ASTM D256, a 3.2 mm thick, notched test piece molded from the composition of Example or Comparative Example was used and measured using a measuring device manufactured by Toyo Seiki Seisakusho.
[実施例1,2及び比較例1〜6]
表2に示す割合で各原料をブレンドした後、スクリュー径40mmのベント付単軸押出機(田辺プラスチックス機械社製「VS−40」)により、シリンダー温度250℃で溶融混練し、ストランドカットによりペレットを得た。得られたペレットを120℃で5〜7時間、熱風循環式乾燥機により乾燥した後、射出成形機(日本製鋼所社製「J50」)により、300℃の温度で90mm×50mm×2mm厚のプレートを成形し、上記の評価を行なった。その結果を表2に示した。
[Examples 1 and 2 and Comparative Examples 1 to 6]
After blending each raw material in the ratio shown in Table 2, it was melt-kneaded at a cylinder temperature of 250 ° C. by a single screw extruder with a screw diameter of 40 mm (“VS-40” manufactured by Tanabe Plastics Machinery Co., Ltd.), and strand cutting. Pellets were obtained. The obtained pellets were dried with a hot air circulation dryer at 120 ° C. for 5 to 7 hours, and then with an injection molding machine (“J50” manufactured by Nippon Steel Co., Ltd.) at a temperature of 300 ° C. of 90 mm × 50 mm × 2 mm thickness. Plates were molded and evaluated as described above. The results are shown in Table 2.
実施例1と比較例1、実施例2と比較例2を対比すれば明らかな様に、予め帯電防止剤を含浸させたシリカ粒子を用いた実施例の組成物は、同種のシリカと帯電防止剤の同量をそれぞれ別個に用いた比較例の組成物に比し、透過率及びYIが向上している。
比較例3〜6はシリカの粒径、帯電防止剤の種類や量を変更したが、何れもシリカと帯電防止剤を別個に用いた場合は、透過率と拡散率の関係、或いは、透過率、YI値、抵抗値、アイゾット衝撃値等が、実施例組成物に及ばない。
As is clear from the comparison between Example 1 and Comparative Example 1, and Example 2 and Comparative Example 2, the composition of the Example using silica particles impregnated with an antistatic agent in advance was the same type of silica and antistatic. The transmittance and YI are improved as compared with the composition of the comparative example in which the same amount of the agent is used separately.
In Comparative Examples 3 to 6, the silica particle size and the type and amount of the antistatic agent were changed. However, when silica and the antistatic agent were used separately, the relationship between the transmittance and the diffusivity, or the transmittance , YI value, resistance value, Izod impact value, etc. do not reach the compositions of the examples.
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JPH0333162A (en) * | 1989-06-30 | 1991-02-13 | Mizusawa Ind Chem Ltd | Resin compounding ingredient composition |
JPH09227785A (en) * | 1995-12-20 | 1997-09-02 | Asahi Chem Ind Co Ltd | Resin composition and formed material therefrom |
JP2002060734A (en) * | 2000-06-09 | 2002-02-26 | Asahi Denka Kogyo Kk | Antistatic composition |
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JPH0333162A (en) * | 1989-06-30 | 1991-02-13 | Mizusawa Ind Chem Ltd | Resin compounding ingredient composition |
JPH09227785A (en) * | 1995-12-20 | 1997-09-02 | Asahi Chem Ind Co Ltd | Resin composition and formed material therefrom |
JP2002060734A (en) * | 2000-06-09 | 2002-02-26 | Asahi Denka Kogyo Kk | Antistatic composition |
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