JP4662326B2 - Electronics - Google Patents
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- JP4662326B2 JP4662326B2 JP2003320283A JP2003320283A JP4662326B2 JP 4662326 B2 JP4662326 B2 JP 4662326B2 JP 2003320283 A JP2003320283 A JP 2003320283A JP 2003320283 A JP2003320283 A JP 2003320283A JP 4662326 B2 JP4662326 B2 JP 4662326B2
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本発明は、コネクタが実装された基板を有する電子機器に関する。 The present invention relates to an electronic apparatus having a board on which a connector is mounted.
近年、デジタルカメラや携帯電話等の電子機器の発展はめざましく、これらの電子機器内で扱う情報量も年々増加している。また、情報を電子機器内に保存したり、機器外部に取り出したりするために、半導体で構成されたメモリカードを使用する電子機器が増えている。これらの電子機器においては、メモリカードと電気的に接続されるカードコネクタを備えており、このカードコネクタにメモリカードを接続することによって電子機器本体およびメモリカード間でデータのやり取りを行うことができる（例えば、特許文献１参照）。 In recent years, the development of electronic devices such as digital cameras and mobile phones has been remarkable, and the amount of information handled in these electronic devices has been increasing year by year. In addition, in order to save information in an electronic device or take it out of the device, an increasing number of electronic devices use memory cards made of semiconductors. These electronic devices include a card connector that is electrically connected to the memory card, and data can be exchanged between the electronic device main body and the memory card by connecting the memory card to the card connector. (For example, refer to Patent Document 1).
図３は、従来のカードコネクタが実装された配線基板を示す概略図であり、図４は上記の配線基板を備えた従来の電子機器の概略図である。 FIG. 3 is a schematic view showing a wiring board on which a conventional card connector is mounted, and FIG. 4 is a schematic view of a conventional electronic device including the wiring board described above.
これらの図において、配線基板１０３には、カードコネクタ１０１や他の複数の電子部品１０２が実装されているとともに、配線基板１０３の表面にはカードコネクタ１０１や電子部品１０２を電気的に接続する導体パターン１０４が形成されている。カードコネクタ１０１には端子部１０１ａが設けられており、この端子部１０１ａは配線基板１０３に形成された導体パターン１０４に電気的に接続されている。 In these drawings, a card connector 101 and a plurality of other electronic components 102 are mounted on the wiring board 103, and a conductor for electrically connecting the card connector 101 and the electronic components 102 to the surface of the wiring board 103. A pattern 104 is formed. The card connector 101 is provided with a terminal portion 101 a, and this terminal portion 101 a is electrically connected to a conductor pattern 104 formed on the wiring board 103.
上述した配線基板１０３は、図４に示すように、電子機器の筐体１１０内に配置されており、この筐体１１０の一部には、メモリカードを挿入するための開口部１１０ａが形成されている。この開口部１１０ａは、蓋部材１１１により開閉可能となっている。 As shown in FIG. 4, the above-described wiring board 103 is arranged in a housing 110 of an electronic device, and an opening 110 a for inserting a memory card is formed in a part of the housing 110. ing. The opening 110 a can be opened and closed by a lid member 111.
上記の電子機器の構成において、蓋部材１１１を開いてメモリカードをカードコネクタ１０１のカード挿入口１０１ｂから挿入させることで、メモリカードをカードコネクタ１０１に電気的に接続させることができる。
上述した従来の電子機器では、蓋部材１１１を開いた状態で、メモリカードをカードコネクタ１０１に挿入したり、カードコネクタ１０１から引き抜いたりすることになるが、この場合、蓋部材１１１を開けたときに筐体１１０の開口部１１０ａから配線基板１０３の表面に形成された導体パターン１０４が見えてしまうために見栄えが悪いといった問題がある。 In the above-described conventional electronic device, the memory card is inserted into or removed from the card connector 101 with the lid member 111 opened. In this case, when the lid member 111 is opened. In addition, since the conductor pattern 104 formed on the surface of the wiring substrate 103 is visible from the opening 110a of the housing 110, there is a problem that the appearance is poor.
また、蓋部材１１１を開けた際に、筐体１１０内にほこり等の異物が侵入し、配線基板１０３上の導体パターン１０４が異物によって断線したり、電気的なショートを起こしたりするおそれもある。 Further, when the lid member 111 is opened, foreign matter such as dust may enter the housing 110, and the conductor pattern 104 on the wiring board 103 may be disconnected by the foreign matter or cause an electrical short circuit. .
ここで、異物の侵入を防止する対策として、配線基板上に化粧用のテープを貼ることも考えられるが、テープを用いることによるコストアップ、テープを貼り付けることによる基板の製造工程数の増加、テープのはがれ等による電気的接続の不良といった問題がある。 Here, as a measure to prevent the intrusion of foreign matter, it may be possible to apply a cosmetic tape on the wiring board, but the cost increase by using the tape, the increase in the number of manufacturing processes of the substrate by applying the tape, There is a problem of poor electrical connection due to tape peeling.
そこで、本発明の目的は、従来の問題点に鑑み、基板表面の見映えを改善するとともに、基板表面を保護することができる電子機器を提供することにある。 In view of the conventional problems, an object of the present invention is to provide an electronic device that can improve the appearance of the substrate surface and protect the substrate surface.
本発明の電子機器は、記録媒体と電気的に接続されるカードコネクタおよび電子部品が実装される基板と、前記基板を収納し、前記記録媒体を前記カードコネクタに接続させるための開口部を有する外装部材とを備え、前記基板は、その表面に配線パターンが形成され、前記配線パターンを覆うように絶縁材料からなるソルダーレジストが塗布されることで形成され、前記基板の前記ソルダーレジストが塗布された面に前記電子部品の実装位置を示すマーキングをシルク印刷によって形成し、前記基板の前記ソルダーレジストが塗布された面のうち、前記電子部品の実装位置以外であって、少なくとも前記カードコネクタの内側に位置して、前記開口部から見える領域に、前記ソルダーレジストの表面を覆い隠すものであって、前記ソルダーレジストとは異なる膜をシルク印刷によって形成し、前記マーキングの形成および前記膜の形成を同一のシルク印刷工程で行うことを特徴とする。
Electronic device of the present invention includes a substrate card connector and the electronic components are electrically connected to the recording medium is Ru are implemented, and accommodating the substrate, an opening for connecting said recording medium to said card connector and a package member, the substrate, the wiring pattern is formed on the surface, a solder resist made of an insulating material so as to cover the wiring pattern is formed by being coated, the solder resist of the substrate is coated A marking indicating the mounting position of the electronic component is formed on the surface by silk printing, and the surface of the substrate coated with the solder resist is other than the mounting position of the electronic component, and at least the inside of the card connector located in a region visible through the opening, there is mask the surface of the solder resist, the solder Resist formed by silk printing the film different from the, and performing the formation and formation of the film of the marking in the same silk-screen printing process.
本発明によれば、基板表面のうち少なくともコネクタの内側に位置する領域に、配線パターンを覆い隠す膜を形成することにより、電子機器の外部から開口部を通して見える配線基板の表面を見栄えの良いものとすることができる。しかも、膜によって基板表面を保護することで、異物等による配線パターンの断線や電気的なショートを防止することができる。 According to the present invention, by forming a film that covers the wiring pattern in at least an area located on the inner side of the connector on the surface of the board, the surface of the wiring board that can be seen through the opening from the outside of the electronic device has a good appearance It can be. In addition, by protecting the substrate surface with a film, it is possible to prevent disconnection of the wiring pattern and electrical short-circuit due to foreign matter or the like.
また、基板の表面には、特定のマークをシルク印刷によって形成することがあり、上記の膜をシルク印刷によって形成することで、基板の製造工程を増やすことなく基板を作成することができ、従来の製造工程と同様の工程で基板を製造することができる。しかも、基板の表面に膜を印刷するため、基板表面にテープを貼る場合に比べてテープがはがれるといったこともなくなる。
The surface of the substrate, may be formed by silk printing the specific mark, the above film by forming by silk printing, it is possible to create a substrate without increasing the substrate manufacturing process, the prior art The substrate can be manufactured in the same process as the manufacturing process. Moreover, since the film is printed on the surface of the substrate, the tape is not peeled off as compared with the case where the tape is applied to the surface of the substrate.
以下に本発明の一実施例について説明する。 An embodiment of the present invention will be described below.
本発明の実施例１である電子機器について図面を用いて説明する。図１は、カードコネクタが実装された配線基板の概略図である。また、図２は図１に示す配線基板を備えた電子機器の概略図であり、電子機器に設けられた蓋部材を開けた状態を示している。 An electronic apparatus that is Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a wiring board on which a card connector is mounted. FIG. 2 is a schematic view of an electronic device provided with the wiring board shown in FIG. 1, and shows a state where a lid member provided in the electronic device is opened.
図１において、カードコネクタ１は、他の複数の電子部品２とともに配線基板３の表面に実装されている。カードコネクタ１には端子部１ａが形成されており、配線基板３の表面に形成された導体パターン４を介して電子部品２と電気的に接続されている。 In FIG. 1, a card connector 1 is mounted on the surface of a wiring board 3 together with other electronic components 2. A terminal portion 1 a is formed on the card connector 1 and is electrically connected to the electronic component 2 through a conductor pattern 4 formed on the surface of the wiring board 3.
配線基板３は、ガラスエポキシ樹脂等の絶縁基板の表面に導体パターン４を形成し、絶縁基板の表面に対して導体パターン４を覆うように、絶縁材料からなるソルダーレジストを塗布することにより形成される。 The wiring substrate 3 is formed by forming a conductor pattern 4 on the surface of an insulating substrate such as glass epoxy resin and applying a solder resist made of an insulating material so as to cover the conductor pattern 4 on the surface of the insulating substrate. The
ここで、導体パターン４の材質は、配線抵抗や製造上の理由から一般的に銅が使用されている。また、ソルダーレジストが塗布された配線基板３上には、組立て工程において作業者が電子部品の実装位置を確認しやすいように電子部品の略外形を現すマーキングや配線基板の名称等が、シルク印刷方法によって形成されている。
Here, copper is generally used as the material of the conductor pattern 4 for wiring resistance and manufacturing reasons. In addition, on the wiring board 3 coated with solder resist , markings showing the outline of the electronic component and the name of the wiring board are printed on the silk print so that the operator can easily confirm the mounting position of the electronic component in the assembly process. Formed by the method.
上記のマーキングや配線基板の名称は、ソルダーレジストが塗布された配線基板３の表面の色とは異なる色で形成されており、作業者が確認し易いようになっている。
The markings and the names of the wiring boards are formed in a color different from the color of the surface of the wiring board 3 to which the solder resist is applied, so that the operator can easily confirm.
また、本実施例の配線基板３では、この表面（ソルダーレジストが塗布された面）のうちカードコネクタ１が実装される領域を含む周辺領域において、シルク印刷によって膜５が形成されている。
Further, in the wiring board 3 of the present embodiment, the film 5 is formed by silk printing in a peripheral region including a region where the card connector 1 is mounted on this surface (surface coated with the solder resist) .
ここで、電子部品２が実装される領域においては、当該部品の実装位置を確認しやすいように、膜５を形成しないようにすることができる。
Here, in the region where the electronic component 2 is mounted, the film 5 can be prevented from being formed so that the mounting position of the component can be easily confirmed.
なお、配線基板３の表面には、図３に示す配線基板１０３の表面に形成された導体パターン１０４と同形状の導体パターンが形成されている。
A conductive pattern having the same shape as the conductive pattern 104 formed on the surface of the wiring substrate 103 shown in FIG. 3 is formed on the surface of the wiring substrate 3.
上記の構成の配線基板３は、図２に示すように電子機器の筐体６内に配置される。筐体６には開口部６ａが形成されており、この開口部６ａは、筐体６に回転可能に取り付けられた蓋部材７によって開閉可能となっている。 The wiring board 3 having the above-described configuration is arranged in a housing 6 of an electronic device as shown in FIG. An opening 6 a is formed in the housing 6, and the opening 6 a can be opened and closed by a lid member 7 that is rotatably attached to the housing 6.
上記の電子機器の構成において、蓋部材７を回転させて開口部６ａを開くことによって、メモリカード２０をカードコネクタ１のカード挿入口１ｂに挿入することができる。これにより、メモリカード２０に形成された端子部と、カードコネクタ１に形成された端子部１ａと電気的に接続させることができ、メモリカード２０内に記憶されたデータを電子機器側に送信することができるとともに、電子機器内のデータをメモリカード２０内に記憶させることができる。
In the above configuration of the electronic device, by opening the opening portion 6a by rotating the lid member 7, can it to insert the memory card 20 into the card insertion slot 1b of the card connector 1. Thereby, the terminal part formed in the memory card 20 and the terminal part 1a formed in the card connector 1 can be electrically connected, and the data stored in the memory card 20 is transmitted to the electronic device side. In addition, the data in the electronic device can be stored in the memory card 20.
ここで、筐体６内にメモリカードを挿入するために、蓋部材７を操作して開口部６ａを開けると、図２に示すように、カードコネクタ１のカード挿入口１ｂが見えるとともに、カードコネクタ１が実装された配線基板３の表面が見える。 Here, in order to insert the memory card into the housing 6, when the lid member 7 is operated to open the opening 6a, the card insertion slot 1b of the card connector 1 can be seen as shown in FIG. The surface of the wiring board 3 on which the connector 1 is mounted can be seen.
本実施例では、カード挿入口１ｂから見える配線基板３の表面を覆い隠す均一な膜５を形成しているため、蓋部材７を開けた際の電子機器内部の見栄えを良くすることができる。しかも、膜５を形成することにより、ソルダーレジストによる基板表面の保護に加えて、配線基板３の表面における保護をより一層強化することができる。
In this embodiment, since the formation of a uniform film 5 covers the front surface of the wiring board 3 which is visible from the card insertion port 1b, it is possible to improve the appearance of the internal electronic device when opening the lid member 7 . In addition to the protection of the substrate surface by the solder resist, the protection on the surface of the wiring substrate 3 can be further strengthened by forming the film 5.
すなわち、配線基板３の表面に膜５を形成することによって、筐体６内に誤って混入した異物等が配線基板３の表面に落ちて、メモリカードの出し入れ時や電子機器の振動等により配線基板３の表面が傷付くのを防止することができる。これにより、配線基板３上の導体パターン４の断線や、電気的なショートを防ぐことができる。 That is, by forming the film 5 on the surface of the wiring board 3, foreign matter or the like mistakenly mixed in the housing 6 falls on the surface of the wiring board 3, and wiring is performed by inserting / removing a memory card or vibration of an electronic device. It is possible to prevent the surface of the substrate 3 from being damaged. Thereby, disconnection of the conductor pattern 4 on the wiring board 3 and an electrical short circuit can be prevented.
さらに、シルク印刷方法によって配線基板３の表面に膜５を形成することで、上述したようなマーキングや配線基板の名称をシルク印刷方法によって印刷する際に、膜５も形成することができるため、配線基板３の製造工程を増やすことなく行うことができる。これにより、配線基板３の表面に、テープ等を貼る場合のように従来と異なる工程を経ることがなく、従来の製造ラインを用いて配線基板３の製造を行うことができる。 Furthermore, since the film 5 is formed on the surface of the wiring board 3 by the silk printing method, the film 5 can also be formed when the marking or the name of the wiring board as described above is printed by the silk printing method. This can be done without increasing the number of manufacturing steps of the wiring board 3. As a result, the wiring substrate 3 can be manufactured using a conventional manufacturing line without passing through a process different from the conventional process as in the case of attaching a tape or the like to the surface of the wiring substrate 3.
なお、本実施例では、筐体６に蓋部材７を設けた構成の電子機器について説明したが、蓋部材７が設けられていない構成の電子機器についても本発明を適用することができる。 In the present embodiment, the electronic apparatus having the configuration in which the lid member 7 is provided in the housing 6 has been described. However, the present invention can also be applied to an electronic apparatus having a configuration in which the lid member 7 is not provided.
また、本実施例における電子機器としては、携帯電話機、電話機、ＰＤＡ（personal digital assistance）、携帯型オーディオ、カメラや、情報端末機器等が上げられる。また、メモリカードとしては、ＣＰＵやメモリ用のＩＣチップと呼ばれるＩＣ部品が組込まれたＩＣカードやＰＣカード、ＳＤカード、コンパクトフラッシュ(登録商標)カード等といった各種の記録媒体を用いることができる。 Also, examples of the electronic device in this embodiment include a mobile phone, a telephone, a PDA (personal digital assistance), a portable audio, a camera, an information terminal device, and the like. In addition, as the memory card, various recording media such as an IC card, a PC card, an SD card, a compact flash (registered trademark) card, or the like in which an IC component called a CPU or memory IC chip is incorporated can be used.
１ カードコネクタ
１ａ カードコネクタの端子部
１ｂ カードコネクタのカード挿入口
２ 電子部品
３ 配線基板
４ 導体パターン
５ 膜
６ 筐体
７ 蓋部材
DESCRIPTION OF SYMBOLS 1 Card connector 1a Card connector terminal part 1b Card connector card insertion slot 2 Electronic component 3 Wiring board 4 Conductive pattern 5 Film 6 Case 7 Lid member
Claims (1)
前記基板を収納し、前記記録媒体を前記カードコネクタに接続させるための開口部を有する外装部材とを備え、
前記基板は、その表面に配線パターンが形成され、前記配線パターンを覆うように絶縁材料からなるソルダーレジストが塗布されることで形成され、
前記基板の前記ソルダーレジストが塗布された面に前記電子部品の実装位置を示すマーキングをシルク印刷によって形成し、
前記基板の前記ソルダーレジストが塗布された面のうち、前記電子部品の実装位置以外であって、少なくとも前記カードコネクタの内側に位置して、前記開口部から見える領域に、前記ソルダーレジストの表面を覆い隠すものであって、前記ソルダーレジストとは異なる膜をシルク印刷によって形成し、
前記マーキングの形成および前記膜の形成を同一のシルク印刷工程で行うことを特徴とする電子機器。 A substrate card connector and the electronic components are recorded medium and electrical connection Ru is mounted,
An exterior member that houses the substrate and has an opening for connecting the recording medium to the card connector;
The substrate is formed by forming a wiring pattern on its surface and applying a solder resist made of an insulating material so as to cover the wiring pattern,
Marking indicating the mounting position of the electronic component on the surface on which the solder resist is applied to the substrate formed by silk printing,
Of the surface of the substrate coated with the solder resist, other than the mounting position of the electronic component, at least inside the card connector, in a region visible from the opening , the surface of the solder resist Covering, forming a film different from the solder resist by silk printing ,
An electronic apparatus, wherein the marking and the film are formed in the same silk printing process .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003320283A JP4662326B2 (en) | 2003-09-11 | 2003-09-11 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003320283A JP4662326B2 (en) | 2003-09-11 | 2003-09-11 | Electronics |
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| JP2005086189A JP2005086189A (en) | 2005-03-31 |
| JP2005086189A5 JP2005086189A5 (en) | 2006-10-26 |
| JP4662326B2 true JP4662326B2 (en) | 2011-03-30 |
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| JP2003320283A Expired - Lifetime JP4662326B2 (en) | 2003-09-11 | 2003-09-11 | Electronics |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61190677U (en) * | 1985-05-20 | 1986-11-27 | ||
| JPH0644177U (en) * | 1992-11-18 | 1994-06-10 | パロマ工業株式会社 | Printed wiring board |
| JP2000215952A (en) * | 1999-01-25 | 2000-08-04 | Yamaichi Electronics Co Ltd | Mounting structure of card connector |
| JP2002076541A (en) * | 2000-08-25 | 2002-03-15 | Sony Corp | Bga mounting printed circuit board |
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2003
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| JP2005086189A (en) | 2005-03-31 |
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