JP4661808B2 - Component mounting apparatus and board conveying method - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting components such as an IC chip, various semiconductor devices, and a flexible printed board on a substrate such as a glass substrate for a liquid crystal display or a plasma display, and a substrate for carrying such a substrate. It relates to a transport method.

  Conventionally, as shown in FIG. 6, when a component 2 is mounted on a side end of a substrate 1 such as a glass substrate for display, the substrate is placed on a mounting line 3 as shown in FIGS. 7 (a) and 7 (b). Implementation is performed by supplying 1. The mounting line 3 includes an anisotropic conductive film (hereinafter referred to as “ACF”) sticking device 4, a temporary crimping device 5, and main crimping devices 6 and 7. The ACF sticking device 4 mounts the component 2 of the substrate 1. ACF pasting step of pasting the ACF on the side end portion to be performed is performed, and the provisional crimping device 5 performs the temporary crimping step of supplying and temporarily crimping the component 2 onto the side end portion of the substrate 1. 7, main compression bonding is performed in which pressure and heat are applied to the component 2 that is temporarily bonded to the side edges of the long side and the short side of the substrate 1, so that the component 2 is finally bonded to the side edge of the substrate 1. By performing the process, the component 2 is mounted on the substrate 1.

  A specific configuration example will be described with reference to FIGS. 8 and 7B. The ACF sticking device 4 receives the substrate 1 carried into the substrate carry-in position and receives the substrate 1 at the substrate delivery position, and the substrate carrying device 11 that carries the substrate 1 to the substrate delivery position set at an appropriate position of the ACF sticking device 4. The mounting work device 12a performs the work of attaching the ACF to the side edge of the substrate. The substrate transport device 11 is configured to support the substrate 1 by a pair of substrate platforms 15 and to convey the substrate 1 by suction and holding it by suction means (not shown). The mounting work device 12a receives the substrate 1 from the substrate mounting portion 15 at the substrate delivery position and the mounting operation device 13a that performs the operation of supplying and pasting the ACF onto the side end portion of the substrate 1, and the side end of the substrate 1 And a transfer device 14 for transferring and positioning the substrate 1 to a work position located on a backup unit 19 disposed immediately below the head unit 18 of the mounting operation device 13a.

  The transfer device 14 supports a substantially central portion of the substrate 1 from below and adsorbs the substrate holding portion 16 (see FIG. 9) by adsorption means (not shown), and the substrate holding portion 16 as a pair of substrate placements. Transfer means for moving between the parts 15 and 15 from the lower side to the upper side and receiving the substrate 1 on the substrate holding unit 16 and then transferring and positioning the side end of the substrate 1 to the working position located on the backup unit 19 17. The transfer means 17 includes an X-axis table that performs transfer positioning in the X direction along the transfer direction of the substrate transfer device 11, and a Y-direction that is orthogonal to the X direction and that is a perspective direction with respect to the backup unit 19 of the mounting operation device 13 a. A Y-axis table that performs transfer positioning, a Z-axis table that performs vertical movement and vertical positioning, and a θ-axis table that performs rotation and positioning around a vertical axis that passes through the center of the substrate holding unit 16, and holds the substrate The substrate 1 on the portion 16 is configured to be able to arbitrarily move and position around the X axis, Y axis, Z axis direction, and θ axis.

  The substrate 1 to which the ACF is attached by the mounting operation device 13a is returned to the substrate delivery position of the ACF attaching device 4 by the transfer device 14, and the substrate 1 is transported between the ACF attaching device 4 and the provisional pressure bonding device 5. Then, the substrate is transported to the substrate delivery position of the next temporary press-bonding device 5 by the substrate transport device 11 arranged as described above.

  The temporary crimping apparatus 5 includes a mounting operation device 13b that supplies the components 2 to predetermined locations on the side end portions of the substrate 1 and temporarily crimps them, and a mounting operation device 12b that includes the transfer device 14, and the transfer device 14 is provided. Then, the board 1 is transferred from the board delivery position to the mounting operation device 13b, the component 2 is temporarily crimped, and the board 1 on which the component 2 is temporarily crimped is returned to the board delivery position. Subsequently, the substrate 1 on which the component 2 has been temporarily crimped is transferred to the next final crimping device 6 by a substrate transport device 11 disposed so as to transport the substrate 1 between the temporary crimping device 5 and the final crimping device 6. It is transported to the board delivery position.

  The main crimping device 6 includes a mounting operation device 13c that performs final press-bonding of the component 2 temporarily crimped to the long side of the substrate 1 and a mounting operation device 12c including a transfer device 14. The board 1 is transferred from the delivery position to the mounting operation device 13c, the long-side component 2 is finally crimped, and the long-side component 2 is finally crimped, and the board 1 is returned to the board delivery position. Subsequently, the substrate 1 on which the long-side component 2 is finally crimped is transferred to a next crimping device 7 by a substrate transport device 11 arranged to transport the substrate 1 between the crimping devices 6 and 7. To the board delivery position.

  The main crimping device 7 includes a mounting operation device 13 d that includes a mounting operation device 13 d that performs final pressure bonding of the component 2 that is temporarily crimped to the short side of the substrate 1 and a transfer device 14. The substrate 1 is transferred from the delivery position to the mounting operation device 13d, the short-side component 2 is finally crimped, and the short-side component 2 is finally crimped, and the substrate 1 is returned to the substrate delivery position. Subsequently, the substrate 1 on which the short-side component 2 is finally crimped is unloaded by a substrate transfer device 11 arranged to transfer the substrate 1 between the final bonding device 7 and the unloading position of the mounting line 3. It is transported to a position, and is transported to the next process by a transport device as appropriate from its unloading position.

  The main object of the present invention is not related to the work contents of the mounting work devices 12a to 12d and the mounting operation devices 13a to 13d, but the board transfer device 11 and the transfer device 14 of the mounting work devices 12a to 12d. In the following description, the mounting work devices 12a to 12d are the mounting work device 12, the mounting operation devices 13a to 13d are the mounting operation device 13, the ACF sticking device 4 and the provisional operation. The crimping device 5 and the main crimping devices 6 and 7 are collectively referred to as a component mounting device 10.

  By the way, the transfer operation | movement of the board | substrate 1 between the conventional board | substrate mounting part 15 and the board | substrate holding | maintenance part 16 was performed as shown in FIG. The suction means (not shown) of the substrate platform 15 is connected to the vacuum pump 20 via the suction detection means 15a and the atmosphere release valve 15b, and the suction means (not shown) of the substrate holder 16 is also detected by suction. The vacuum pump 20 is connected via the means 16a and the atmosphere release valve 16b. Further, the suction detection means 15a and 16a detect the vacuum pressure of the vacuum path communicating with the suction means (not shown), and are properly sucked when the predetermined vacuum pressure is not reached. First, when the pressure reaches a predetermined vacuum pressure or higher, it is determined that the material is properly adsorbed.

  In FIG. 9, first, in step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is positioned below the substrate platforms 15 and 15. The substrate holding part 16 starts to rise from the state of being located at the position. Next, in step (b), the substrate holding unit 16 is stopped at the substrate delivery position, and suction by the substrate holding unit 16 is started in this state, and the suction detection means 16a indicates that the suction pressure has reached a predetermined pressure. After the detection, the atmosphere release valve 15b is then opened to release the adsorption of the substrate platforms 15 and 15, and then the adsorption detection means 15a causes the adsorption pressure of the substrate platforms 15 and 15 to be at or near atmospheric pressure. Depressurize and confirm that adsorption is completely released. After the delivery of the substrate 1 is completed in this way, next, in step (c), the substrate holding part 16 is raised to a predetermined transfer height and transferred toward the mounting operation device 13. At the time of adsorption release, high-pressure air that is equal to or higher than atmospheric pressure (atmospheric pressure + α) is blown into the vacuum path, and the substrate 1 is separated from the substrate platform 15 so that the vacuum path can be set to atmospheric pressure in a short time. .

  In the transfer operation between the conventional substrate placement unit 15 and the substrate holding unit 16, the suction at the substrate holding unit 16 is started while the substrate holding unit 16 is stopped at the substrate transfer position, and the suction is confirmed. After that, the suction on the substrate platform 15 is released, and after confirming the suction release, the substrate holding unit 16 is moved. Therefore, it takes time to transfer the substrate, and the transfer time of the substrate There is a problem that the mounting work efficiency cannot be improved by shortening. In recent years, the substrate 1 has been reduced in thickness to increase the size and / or reduce the weight, so that the substrate 1 is attracted simultaneously by both the substrate holding unit 16 and the substrate mounting unit 15. Then, the substrate 1 is distorted and remains as a residual strain, which causes display unevenness in the case of a display panel substrate.

  Therefore, the present applicant has previously proposed the transfer operation of the substrate 1 as shown in FIG. In FIG. 10, in step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is positioned below the substrate platforms 15 and 15. In this state, the substrate holding unit 16 starts to rise, and the atmosphere release valve 15b is opened to release the adsorption to the atmosphere, or to lower the vacuum and release the adsorption on the substrate placement units 15 and 15. Next, in the step (b), the substrate holding unit 16 is preferably decelerated and moved up as it is without stopping at the substrate delivery position, and the substrate 1 is received. At the time of receiving the substrate 1 or during the operation before and after that, the substrate holding unit 16 adsorbs the substrate 1, raises the substrate holding unit 16 to the transfer position, and adsorbs the substrate 1 by the adsorption detection means 16a at the transfer position. After confirming, move to transfer operation. According to this transfer operation, the transfer time of the substrate 1 is shortened to improve the mounting work efficiency, and the state in which the substrate 1 is simultaneously adsorbed by both the substrate holding unit 16 and the substrate mounting unit 15 is eliminated. Generation of distortion can be eliminated (see Japanese Patent Application No. 2006-320393).

  By the way, as shown in FIG. 11, the substrate 1 is not only one that maintains a flat state with high accuracy as shown in FIG. 11A, but also one that is warped upward as shown in FIG. ) And (d), it is unavoidable that there are warped items such as those that warp upward in any one axial direction.

  When the transfer operation as shown in FIG. 9 is performed between the substrate mounting portion 15 and the substrate holding portion 16 for the substrate 1 as shown in FIGS. As shown, in the step (a), the substrate holding unit 16 starts to rise from the state where the substrate holding unit 16 is positioned below the substrate placement units 15 and 15, and then the step ( In b), when the substrate holding part 16 is stopped at the substrate delivery position and the substrate 1 is adsorbed by the substrate holding part 16 in this state, the adsorbing pressure is reduced because the substrate 1 is warped. Insufficient adsorption may occur and the adsorption of the substrate placement units 15 and 15 is stopped as it is, and then the substrate holding unit 16 is raised to a predetermined transfer height in step (c). Then, when shifting to the transfer operation, the substrate 1 is displaced on the substrate holding part 16 and a transfer failure occurs. There is a problem that.

  For such problems, the substrate delivery position for delivering the substrate when delivering the substrate from the substrate placement arm (corresponding to the substrate placement unit) of the substrate transport apparatus to the substrate stage (corresponding to the substrate holding unit) After the substrate stage is positioned, the suction holding of the substrate by the substrate stage is started, and then the holding force of the suction holding is detected. If the holding force is less than a predetermined threshold, the substrate is placed on the substrate stage by the warp correction device. It is known that the substrate is corrected by correcting the warpage of the substrate by pressing the substrate to ensure that the substrate is attracted and held on the substrate stage (for example, see Patent Document 1).

Further, in order to correct the substrate having an upward warp, the substrate is sucked with a suction pad, the support pin is brought into contact with the substrate while being sucked with the suction pad, and then the suction pad is free from warping of the substrate. There is also known one that corrects and holds the warp of the substrate by moving it to a position (see, for example, Patent Document 2).
JP 2006-219261 A JP 63-169242 A

  Therefore, it is conceivable to apply a warp correction means to the delivery operation shown in FIGS. 9 and 12 as described in Patent Document 1 and Patent Document 2. That is, as shown in FIG. 13, first, in the step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is moved to the substrate platforms 15 and 15. The substrate holding unit 16 starts to rise from a state where the substrate holding unit 16 is positioned below. Next, in the step (b), the substrate holding unit 16 is stopped at the substrate delivery position, and the suction by the substrate holding unit 16 is started in this state, and the suction pressure is detected by the suction detection means 16a. Here, when the substrate 1 is warped and the adsorption pressure does not reach a predetermined pressure, in step (c), the warp correction means 21 is operated, the substrate 1 is pressed against the substrate holding portion 16, and the substrate 1 is moved. Adsorption is held securely, and then the atmosphere release valve 15b is opened to release the adsorption of the substrate platforms 15 and 15. Next, in the step (d), it is considered that the possibility of occurrence of the position shift 1 during the transfer can be eliminated by raising the substrate holding unit 16 to a predetermined transfer height and shifting to the transfer operation.

  However, in the configuration of FIG. 13, when the substrate 1 is large, for example, 42 to 50 inches or more, as shown in FIG. 14, in step (c), the warp correction means 21 is operated to place the substrate 1 on the substrate. When the substrate 1 is pressed against the holding portion 16, the strength of the substrate 1 is reduced due to an increase in size and / or thickness, and the stress is locally concentrated on the portion pressed by the warp correction means 21. As shown in the lower part, even when the substrate pressing portion 22 of the warp correction means 21 is enlarged, the substrate 1 is attracted and held by the substrate mounting portions 15 and 15, so that the periphery of the substrate pressing portion 22 is Then, in step (d), the substrate 1 is held by the local stress concentration of the substrate 1 when the substrate holder 16 is raised to a predetermined transfer height and shifts to the transfer operation. Secure on the entire surface of the part 16 There is a problem that a suction failure occurs during transfer due to the fact that the peripheral portion of the substrate 1 is bent due to the fact that it is difficult to be absorbed and the weight of the substrate 1 itself, and the cause of the failure of the substrate 1 due to the stress concentration. There is a problem of becoming.

  Further, as described above, the substrate holding unit 16 is stopped at the substrate delivery position, and the suction of the substrate 1 by the substrate holding unit 16 and the suction release by the substrate mounting unit 15 are performed. There is also a problem that it takes time. For this problem, it is conceivable to adopt the configuration shown in FIG. 10 as described above. However, when the substrate 1 is warped, it is more difficult to absorb than the configuration shown in FIG. There is a problem that is likely to occur. Accordingly, the warp correction means 21 is applied in the same manner as shown in FIG. 13, and when the suction failure is detected when the substrate holding unit 16 receives the substrate 1 and rises to the transfer height, the warp correction means 21 detects the substrate 1. It is conceivable that the adsorption failure is eliminated by pressing the substrate against the substrate holding unit 16, but the same problem as in the case described with reference to FIG. 14 occurs.

  In view of the above-described conventional problems, the present invention can prevent the occurrence of misalignment due to a substrate adsorption failure while speeding up the substrate transfer operation, and can improve the component mounting productivity on the substrate. An object is to provide an apparatus and a substrate transfer method.

  The component mounting apparatus according to the present invention performs a component mounting operation on a substrate transporting device that sucks and holds a substrate in a both-side supported state by the substrate mounting unit and transports the substrate to the substrate delivery position, and the substrate received at the substrate delivery position. A component mounting apparatus including a mounting work device and a control device for controlling the operation of the board transport device and the mounting work device, the mounting work device receiving a board at a board delivery position and transferring it to a predetermined work position. A transfer device for positioning, and a mounting operation device for performing a component mounting operation on the substrate positioned at the work position. The transfer device supports a substantially central portion of the substrate from below and is suctioned by suction means. The substrate holding unit, the suction detection means for detecting the suction state of the substrate by the substrate holding unit, and the substrate holding unit after moving the substrate holding unit from the lower side to the upper side and receiving the substrate on the substrate holding unit To the working position And a warping correction means for correcting the warpage of the substrate above the substrate delivery position. When the substrate is corrected, the central portion of the substrate is brought into contact with the substrate holding portion and the peripheral portion is lifted to flatten the substrate, and the control device releases the suction of the substrate placement portion of the substrate transfer device and then transfers the transfer device. The substrate holding unit receives the substrate and performs the adsorption operation by the adsorption unit of the substrate holding unit at the time of receiving or before and after receiving the substrate, and then the adsorbing detection unit determines the adequacy of the adsorption holding state, and the adsorption holding If the state is appropriate, continue the operation of the transfer means. If the suction holding state is not correct, correct the substrate warp by the warp correction means, and after confirming the proper suction holding state, continue the operation of the transfer means. Like It is Gosuru thing.

  According to this configuration, when the substrate is received from the substrate platform to the substrate holder, the adsorption of the substrate at the substrate platform is released before that, so the substrate holder that moves from the lower side to the upper side When a substrate can be received without difficulty in a short time, and after stopping the substrate holding part at the time of receiving as in the past, when holding the suction by the substrate holding part in the stopped state and releasing the suction at the substrate mounting part Compared to this, the time required for the board transfer operation can be greatly shortened, thereby improving the productivity of component mounting, and the board mounting part and the board holding part both attract and hold the board. Therefore, it is possible to prevent the substrate from being distorted in the delivery process. In addition, when the substrate is warped and a suction failure occurs when the substrate is received by the substrate holder, the warp correction means causes the center portion of the substrate to abut against the substrate holder and the peripheral portion is lifted. By correcting the substrate to a flat surface, it is possible to ensure an appropriate suction holding state, to prevent occurrence of positional displacement of the substrate during transfer, and to improve the productivity of component mounting on the substrate.

  In addition, when the control device controls to release the substrate adsorption by the substrate holding unit when correcting the substrate by the warp correction means and to adsorb again with the warp corrected, without generating local stress on the substrate. It is possible to correct the warp and ensure an appropriate suction holding state.

  Further, the warp correction means includes a pressing drive unit that operates the pressing unit, a lifting drive unit that operates the holding unit, and a position detection sensor that detects the respective height positions of the central portion and the peripheral portion of the substrate. With this configuration, the substrate can be accurately corrected to a flat surface by operating the push-down drive unit and the lifting drive unit according to the detection results of the height position of the central part and the peripheral part of the substrate by the position detection sensor. And an appropriate suction holding state can be secured.

  Further, the warp correction means includes a pressing drive unit that operates the pressing unit, an interlocking mechanism that operates the holding unit in conjunction with the operation of the pressing unit, and a position detection sensor that detects the height position of the central portion of the substrate. Since the ratio of the amount of protrusion at the center and the amount of drooping at the periphery when the substrate is warped is almost constant, the position detection sensor detects the height position of the center of the substrate. In response, the pressing drive unit is operated to move the pressing unit by the required amount, and the interlocking mechanism moves the holding unit in conjunction with it, so that the substrate can be corrected to a flat shape with a simple control configuration. An adsorption holding state can be ensured.

Further, the substrate transport method of the present invention includes a step of sucking and holding a substrate in a both-supported state in the substrate placement unit of the substrate transport apparatus and transporting the substrate to the substrate delivery position, and a substrate placement unit at the substrate delivery position. A suction release step for releasing the suction of the substrate, a substrate receiving step for receiving the substrate released from the suction by moving the substrate holding portion of the transfer device from the lower side to the upper side of the substrate delivery position, and a substrate receiving step in the substrate receiving step. An adsorption process in which an adsorption operation is performed by the adsorption means of the substrate holding unit and the substrate is adsorbed from below by the substrate holding unit, and a substrate held by the substrate holding unit in the adsorption process. If the substrate holding unit detects whether or not the suction holding state of the substrate is appropriate, and if the detected suction holding state of the substrate is inappropriate, the suction by the substrate holding unit is released and the central part of the substrate is moved to the substrate holding unit. Lift up the periphery The substrate is flattened to correct the warp of the substrate, and the substrate holding unit again adsorbs the substrate, and the substrate holding unit appropriately adsorbing and holding the substrate has the transfer step of moving the substrate holding unit. .

  According to this configuration, the time required for the substrate transfer operation can be significantly shortened, the occurrence of distortion of the substrate in the transfer process can be prevented, and even when the substrate is warped, the warp is corrected. By making the center part of the substrate abut the substrate holding part and lifting the peripheral part to correct the substrate to a flat shape, it is possible to secure an appropriate suction holding state and to prevent the substrate from being displaced during transfer. The effect that it can prevent is acquired.

  According to the component mounting apparatus and the board conveying method of the present invention, when the board is received from the board mounting part at the board delivery position to the board holding part, the suction of the board mounting part is released and the board holding part is moved upward from below. Therefore, the time required for the substrate transfer operation can be greatly shortened, and the substrate is not attracted by both the substrate mounting portion and the substrate holding portion. When the substrate is warped without any occurrence and a suction failure occurs when the substrate is received by the substrate holder, the center of the substrate is brought into contact with the substrate holder by the warp correction means. In addition, by lifting the peripheral part and correcting the board to a flat shape, it is possible to secure an appropriate suction holding state, prevent occurrence of positional deviation of the board during transfer, and improve the productivity of component mounting on the board it can.

  Hereinafter, each embodiment of the component mounting apparatus of this invention is described with reference to FIGS. In addition, the component mounting apparatus of each embodiment mounts the component 2 on the board | substrate 1 as shown in FIG. 6, The whole structure is the component mounting apparatus 10 demonstrated with reference to FIG. 7, FIG. The description in the conventional example is cited.

(First embodiment)
First, the board | substrate 1 between the board | substrate mounting part 15 of the board | substrate conveyance apparatus 11 and the board | substrate holding part 16 of the transfer apparatus 14 which are the principal parts of this invention in the component mounting apparatus 10 of the 1st Embodiment of this invention. The transfer operation will be described with reference to FIGS.

  In FIG. 1, the suction means (not shown) of the substrate platform 15 is connected to the vacuum pump 20 via the suction detection means 15a and the atmospheric release valve 15b, and the suction means (not shown) of the substrate holder 16 is also included. It is connected to the vacuum pump 20 via the adsorption detection means 16a and the atmosphere release valve 16b. The suction means (not shown) includes a plurality of suction holes arranged at appropriate intervals on the upper surface of the substrate mounting part 15 and the substrate holding part 16, or preferably a plurality of suctions with a cushioning property. Consists of pads. Further, the suction detection means 15a and 16a detect the vacuum pressure of the vacuum path communicating with the suction means (not shown), and are properly sucked when the predetermined vacuum pressure is not reached. First, when the pressure reaches a predetermined vacuum pressure or higher, it is determined that the material is properly adsorbed.

  In FIG. 1, first, in the step (a), after the substrate 1 is sucked and held in the both-side supported state by the substrate mounting portion 15 of the substrate transport apparatus 11 and positioned at the substrate delivery position, The air release valve 15a is opened, the suction means is brought to atmospheric pressure or low vacuum, and the suction of the substrate 1 on the substrate platform 15 is released. At this time, the substrate holding part 16 is located below the substrate mounting parts 15 and 15, and the substrate holding part 16 starts moving from the lower side to the upper side from the substrate delivery position.

  Next, in step (b), the substrate holding unit 16 is not stopped at the substrate delivery position, and is preferably decelerated at the substrate delivery position so that the substrate 1 is not subjected to an impact during delivery. The substrate holding part 16 receives the substrate 1 by moving from the side to the upper side, and the substrate holding part 16 operates the suction means of the substrate holding part 16 when receiving the substrate 1 or during the operation before and after that. To adsorb. Here, whether or not the suction holding state of the substrate 1 by the substrate holding unit 16 is appropriate is detected by the suction detection means 16a. If the suction holding state is appropriate, the process proceeds to step (d) described later, and the substrate 1 is transferred by the substrate holding unit 16 as it is. On the other hand, when it is detected that the suction holding state is inappropriate because the substrate 1 is warped, the process proceeds to the next step (c).

  Next, in the step (c), the atmosphere release valve 16b is opened to release the adsorption of the substrate 1 by the substrate holding unit 16, and the warp correction means 21 causes the central portion of the substrate 1 to contact the substrate holding unit 16. The peripheral portion of the substrate 1 is lifted to correct the substrate 1 into a flat shape. That is, the central portion of the substrate is pushed down by the pressing portion 22 of the warp correction means 21 to be brought into contact with the substrate holding portion 16, and at the same time, the peripheral portion of the substrate 1 is lifted by the holding portion 23. Correct to flat. Thus, with the substrate 1 corrected to a flat surface, the atmosphere release valve 16b is closed and the suction means of the substrate holding part 16 is operated again, so that the substrate 1 is appropriately sucked by the substrate holding part 16.

  Next, in step (d), the warp correction means 21 is retracted, and the suction detection means 16a detects that the suction pressure by the substrate holding part 16 has become a predetermined pressure. Transfer toward the mounting operation device 13.

  The transfer operation of the substrate 1 between the substrate platform 15 and the substrate holder 16 includes the substrate transfer device 11 having the substrate platform 15 and the transfer device 14 having the substrate holder 16. It is controlled by a control device (not shown) that controls the operation of the entire component mounting apparatus 10.

  Next, a specific configuration of the warp correction means 21 will be described with reference to FIG. At the center of the support frame 21 a of the warp correction means 21, a push-down drive unit 24 made of a cylinder device is arranged, and at the four corners of the support frame 21 a, a lift drive unit 25 made of a cylinder device is arranged. The push-down unit 22 is moved up and down through the swingable connecting unit 22a, and the lifting unit 23 is moved up and down through the connecting unit 23a that can be swung and displaced in the horizontal direction by the lifting drive unit 25. Has been. These connecting portions 22a and 23a absorb deformation and displacement during the correction operation and prevent the substrate 1 from generating stress. A plurality of pressing portions 22 b are arranged in the pressing portion 22 so as to substantially correspond to the planar area of the substrate holding portion 16. The holding part 23 is provided with a suction part 23b connected to suction means (not shown) so as to suck the substrate 1.

  In addition, position detection sensors 26 for detecting the height positions of the central portion and the four corner portions of the substrate 1 are disposed at the central portion and the four corner portions of the support frame 21a, respectively. The position detection sensor 26 detects the height positions of the pressing portion 22 and the holding portions 23 in place of directly detecting the height positions of the central portion and the four corner portions of the substrate 1 and indirectly detects each of the substrate 1. Alternatively, the height position may be detected.

  In the warp correction means 21, as shown in FIG. 2A, the position detection sensor 26 is in a state where the substrate 1 is lifted up to the transfer position by the substrate holding portion 16 and the suction failure is caused by the upper warp of the substrate 1. Then, the height position of each part of the substrate 1 is detected, and the pressing drive unit 24 and the lifting drive unit 25 are operated based on the detection result so that the pressing unit 22 and the holding unit 23 are placed at the center and the four corners of the substrate 1. The four corners of the substrate 1 are adsorbed by the holding portion 23. In this operation, the position detection sensor 26 does not detect the height position of each part, and the push-down drive unit 24 and the lift-up drive unit 25 are stopped when any load is applied, so that the push-down unit 22 and the lift-up unit are stopped. 23 may be moved downward and stopped in contact with the center and the four corners of the substrate 1, respectively, and the four corners of the substrate 1 may be adsorbed by the holding portion 23.

  Next, as shown in FIG. 2B, while the position detection sensor 26 detects the height positions of the central portion and the four corners of the substrate 1, the pressing drive unit 24 and the lifting drive unit 25 are operated to operate the substrate. 1 is in a planar shape in contact with the entire upper surface of the substrate holding portion 16. As a result, as shown in FIG. 3A, with respect to the transfer height position H of the substrate 1, the central portion of the substrate 1 protrudes upward by a distance a, and the peripheral portions downward by distances b, c,. From the state of hanging, by operating the pressing drive unit 24 and the lifting drive unit 25 according to the ratio of the distances a, b, c,... As shown in FIG. 3B, the substrate 1 is corrected without causing local stress without difficulty, and the substrate 1 is flattened along the transfer height position H as shown in FIG. 3B. By adsorbing the substrate 1 by the holding unit 16, the substrate 1 can be adsorbed appropriately, and it is possible to eliminate the possibility of occurrence of an improper adsorption during transfer and a positional shift.

  According to the above configuration, when the substrate 1 is received from the substrate platform 15 to the substrate holder 16, the adsorption of the substrate 1 at the substrate platform 15 is released before that, so that the substrate 1 moves from the lower side to the upper side. The board holding unit 16 can easily receive the board 1 in a short time, and the time required for the delivery operation of the board 1 can be greatly reduced as compared with the conventional example, thereby producing component mounting. Can be improved. In addition, since the state in which the substrate 1 is attracted by both the substrate mounting portion 15 and the substrate holding portion 16 does not occur, it is possible to prevent the substrate 1 from being distorted in the delivery process, and the substrate 1 is a glass of the display panel. In the case of a substrate, the occurrence of display unevenness can be prevented.

  Further, while the delivery operation time is greatly shortened and the productivity of component mounting is improved as described above, the substrate 1 is warped, and the suction failure occurs when the substrate holder 16 receives the substrate 1. Sometimes, the warp correction means 21 causes the central portion of the substrate 1 to contact the substrate holding portion 16 and the peripheral portion is lifted to correct the substrate 1 into a flat shape. It is possible to reliably prevent the occurrence of displacement of the substrate 1 during transfer thereafter, and to improve the productivity of component mounting on the substrate 1.

  Further, when the substrate 1 is corrected by the warp correction means 21, the adsorption of the substrate 1 by the substrate holding unit 16 is released and the substrate 1 is adsorbed again in a state where the warp is corrected, so that the entire surface of the substrate 1 is planar. In combination with the correction, the warpage can be corrected without generating local stress on the substrate 1, and a more appropriate suction holding state can be secured.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. The present embodiment is different from the first embodiment only in the configuration of the warp correction means 21, and the other components are the same. The same components are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 4 shows a state in which the warp correction device 21 of the present embodiment is disposed above the board delivery position of the component mounting apparatus 10, specifically, the ACF sticking apparatus 4. In the warp correction means 21 of the first embodiment, the pressing portion 22 and the holding portion 23 are moved up and down by the pressing drive portion 24 and the lifting drive portion 25, respectively, but the warp correction means 21 of the present embodiment. Then, as shown in FIG. 5, a pressing drive unit 24 that operates the pressing unit 22 and an interlocking mechanism 27 that operates the holding portion 23 in conjunction with the operation of the pressing unit 22 are provided, and the height of the central portion of the substrate 1 is increased. A position detection sensor 26 for detecting the position is provided. The interlocking mechanism 27 can be realized by employing an appropriate link mechanism.

  In such a configuration, as shown in FIG. 5A, the position detection sensor 26 is in a state where the pressing portion 22 is brought into contact with the central portion of the substrate 1 and the four corners of the substrate 1 are adsorbed by the holding portion 23. When the push-down drive unit 24 is operated according to the detection result of the height position of the center portion of the substrate 1 and the push-down unit 22 is moved down by a predetermined amount, the interlocking mechanism 27 causes the holding portion 23 to move at a predetermined moving distance ratio. By being lifted, the substrate 1 can be corrected to a flat shape as shown in FIG. This is because the ratio of the protruding amount of the central portion and the drooping amount of the peripheral portion in the upper warped state of the substrate 1 is generally constant, and a predetermined moving distance ratio is obtained in advance for each model of the substrate 1. The interlocking mechanism 27 is adjusted and set so as to have a moving distance ratio.

  Thus, according to this embodiment, it is possible to obtain the same effect as that of the first embodiment in which the substrate 1 can be corrected to a flat shape and an appropriate suction holding state by the substrate holding portion 16 can be secured. In addition, there is an effect that a stable operation can be realized with a simple control configuration by a mechanical interlocking mechanism.

  According to the component mounting apparatus and the substrate transport method of the present invention, the time required for the substrate transfer operation when receiving the substrate from the substrate mounting unit to the substrate holding unit can be greatly shortened, and the substrate mounting unit and the substrate can be reduced. Since the substrate is not attracted by both of the holding parts, the substrate is not distorted during the transfer process, and even when the substrate is warped and an adsorption failure occurs, the center of the substrate Since the substrate is brought into contact with the substrate holding portion and the peripheral portion is lifted to correct the substrate into a flat shape, an appropriate suction holding state can be secured and the substrate can be prevented from being displaced during transfer. Therefore, it is possible to improve the productivity of component mounting with respect to the above, and it can be suitably used for a component mounting apparatus for mounting various components on various substrates.

Process explanatory drawing of the delivery operation | movement of the board | substrate to the board | substrate holding part from the board | substrate mounting part in the 1st Embodiment of this invention. The structure and operation | movement of the curvature correction means in the embodiment are shown, (a) is a front view which shows the operation state in correction, (b) is a front view which shows the correction completion state. It is explanatory drawing of the state of the board | substrate at the time of correction | amendment operation | movement, (a) is explanatory drawing before correction | amendment, (b) is explanatory drawing of a correction completion state. The perspective view of the component mounting apparatus in the 2nd Embodiment of this invention. The structure and operation | movement of the curvature correction means in the embodiment are shown, (a) is a front view which shows the operation state in correction, (b) is a front view which shows the correction completion state. The perspective view of the board | substrate which mounted the component of this invention object. The component mounting line of a prior art example is shown, (a) is a top view which shows the arrangement configuration of each component mounting apparatus, (b) is explanatory drawing of the mounting operation process in each component mounting apparatus. The perspective view which shows the whole schematic structure of the component mounting line of the prior art example. Process explanatory drawing of the delivery operation | movement of the board | substrate from the board | substrate mounting part in the same prior art example to a board | substrate holding part. Process explanatory drawing of the delivery operation | movement of the board | substrate from the board | substrate mounting part proposed prior to this invention to the board | substrate holding part. The perspective view which shows the curvature generation | occurrence | production state in a board | substrate. Operation process explanatory drawing which shows the problem in the delivery operation | movement of the board | substrate of a prior art example. Process explanatory drawing of the delivery operation | movement of a board | substrate at the time of solving a trouble by applying a prior art. FIG. 14 is an operation process explanatory diagram illustrating problems in the substrate transfer operation of FIG. 13.

Explanation of symbols

1 substrate 2 component 4 ACF sticking device (component mounting device)
5 Temporary crimping equipment (component mounting equipment)
6, 7 Crimping device (component mounting device)
DESCRIPTION OF SYMBOLS 10 Component mounting apparatus 11 Board | substrate conveyance apparatus 12 (12a-12d) Mounting operation apparatus 13 (13a-13d) Mounting operation apparatus 14 Transfer apparatus 15 Board | substrate mounting part 15a Adsorption | suction detection means 15b Atmospheric release valve 16 Substrate holding | maintenance part 16a Adsorption detection Means 16b Air release valve 17 Transfer means 21 Warp correction means 22 Press part 23 Lifting part 24 Press drive part 25 Lifting drive part 26 Position detection sensor 27 Interlocking mechanism

Claims (5)

A substrate transport device that sucks and holds a substrate in a both-side supported state by the substrate placement unit and transports the substrate to a substrate delivery position, a mounting work device that performs a component mounting operation on the substrate received at the substrate delivery position, and a substrate transport device And a component mounting device comprising a control device for controlling the operation of the mounting work device,
The mounting work apparatus includes a transfer device that receives a substrate at a substrate delivery position, transfers the substrate to a predetermined work position, and a mounting operation device that performs a component mounting operation on the substrate positioned at the work position.
The transfer device includes a substrate holding unit that supports a substantially central portion of the substrate from below and is adsorbed by an adsorption unit, an adsorption detection unit that detects an adsorption state of the substrate by the substrate holding unit, and a substrate holding unit. A transfer means for moving the substrate from the lower side to the upper side and receiving the substrate on the substrate holding portion and then transferring the substrate to the working position, and a warp correction means for correcting the warp of the substrate above the substrate delivery position; With
The warp correction means includes a pressing part that pushes down the central part of the substrate and a holding part that lifts the peripheral part of the substrate. During correction, the central part of the substrate is brought into contact with the substrate holding part and the peripheral part is lifted to make the substrate planar. West,
The control device releases the suction of the substrate mounting portion of the substrate transfer device, receives the substrate at the substrate holding portion of the transfer device, and uses the suction means of the substrate holding portion at the time of receiving the substrate or during the operation before and after that. Adsorption operation is performed, and then the adsorbing detection means determines the adequacy of the adsorbing and holding state. If the adsorbing and holding state is appropriate, the operation of the transfer means is continued. If the adsorbing and holding state is inappropriate, the warp correction means is used. A component mounting apparatus characterized in that control is performed so as to continue the operation of the transfer means after correcting the warp of the substrate and confirming an appropriate suction holding state.   2. The component mounting according to claim 1, wherein the control device controls to release the substrate suction by the substrate holding portion when the substrate is corrected by the warp correction means, and to absorb again in a state where the warp is corrected. apparatus.   The warp correction means includes a pressing drive unit that operates the pressing unit, a lifting drive unit that operates the holding unit, and a position detection sensor that detects the height positions of the central portion and the peripheral portion of the substrate. The component mounting apparatus according to claim 1.   The warp correction means includes a pressing drive unit that operates the pressing unit, an interlocking mechanism that operates the holding unit in conjunction with the operation of the pressing unit, and a position detection sensor that detects the height position of the central portion of the substrate. The component mounting apparatus according to claim 1, wherein: A step of adsorbing and holding the substrate in a both-side supported state at the substrate mounting portion of the substrate transfer device and transferring the substrate to a substrate delivery position;
A suction release process for releasing the suction of the substrate at the substrate placement portion at the substrate delivery position;
A substrate receiving step of receiving the substrate released from suction by moving the substrate holding portion of the transfer device from the lower side to the upper side of the substrate delivery position;
An adsorption step of performing adsorption operation by the adsorption means of the substrate holding unit and adsorbing the substrate from below by the substrate holding unit during operation before or after receiving the substrate in the substrate receiving process ,
Detecting whether or not the substrate holding unit is holding and holding the substrate held by the substrate holding unit in the suction step;
If the detected suction holding state of the substrate is inappropriate, the suction by the substrate holding part is released, the center part of the substrate is brought into contact with the substrate holding part, and the peripheral part is lifted to make the board flat and to warp the substrate. A warp correction process of correcting and adsorbing the substrate again at the substrate holding part;
And a transfer step of moving a substrate holding portion that appropriately holds and holds the substrate.

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