JP4620421B2 - Optical device, optical connector and electronic equipment - Google Patents

Description

  The present invention relates to an optical device, an optical connector using the optical device, and an electronic device, and is particularly suitable for an electronic device such as an AV (Audio Visual) device or a security device for a home network or an in-vehicle network.

  Conventionally, there is an optical device in which a light emitting element and a light receiving element are mounted on a substrate. In this optical device, the positions of the light emitting element and the light receiving element and the directions of the light emitting surface of the light emitting element and the light receiving surface of the light receiving element are determined. In optical connectors using such optical devices, even if they have exactly the same function, the shape of the optical connector differs depending on the application and specifications. Therefore, various optical devices must be designed and produced according to the optical connector specifications. However, there are problems of high cost and poor productivity.

  The present applicant proposes in the present invention that a flexible substrate is used as a means for solving such a problem. Conventionally, there is a mounting technique using the following flexible substrate.

  A conventional mounting technique using a first flexible substrate is used for a connection sensor that mounts a plurality of sensors, ICs, and the like on a flexible substrate and detects a certain width (for example, Japanese Laid-Open Patent Publication No. 4-184831). See Patent Document 1)). This sensor is mounted by mounting the sensor's electronic components on a tape-like flexible board at predetermined intervals, sharing these power lines, and molding the electronic components with soft synthetic resin to form a housing. A technology for creating sensors. In this connection sensor, the electronic component already has a function as a sensor or a light projecting device, and the mold made of a soft synthetic resin protects the electronic component from dust or the like without impairing its function.

  Further, the conventional mounting technology using the second flexible substrate is a high-density mounting technology in which a flexible substrate on which a semiconductor memory is mounted is covered with a silicon resin (for example, Japanese Patent Laid-Open No. 2002-270733 (Patent Document 2). )reference).

However, in the conventional mounting technology using the first and second flexible substrates, the optical semiconductor element (light emitting element, light receiving element) mounted on the flexible substrate is sealed, and light is efficiently emitted from the optical semiconductor element. It does not realize a technology for taking out or taking in light efficiently.
JP-A-4-184831 (FIG. 1) JP 2002-270733 A (FIGS. 1 and 2)

  SUMMARY OF THE INVENTION An object of the present invention is to provide a highly versatile optical device that has a wide degree of freedom in arrangement of light emitting elements and light receiving elements and can be used for various applications, and an optical connector and an electronic apparatus using the optical device.

In order to achieve the above object, an optical device of the present invention comprises:
A flexible substrate;
A light emitting element and a light receiving element mounted on the flexible substrate at a predetermined interval;
A first mold resin part having translucency sealing the light emitting element;
A second mold resin portion having translucency sealing the light receiving element,
The first mold resin part and the second mold resin part are spaced apart and have flexibility between the first and second mold resin parts ,
An integrated circuit for control mounted on the flexible substrate and between the light emitting element and the light receiving element;
A third mold resin portion sealing the control integrated circuit;
With
The third mold resin part is spaced apart from the first mold resin part and the second mold resin part, and has flexibility between the mold resin parts.
The flexible substrate includes a main body in which the light emitting element and the light receiving element are disposed on both sides, and the control integrated circuit is disposed between the light emitting element and the light receiving element, and the light emitting element in the main body An extending portion that extends laterally from a portion between the light receiving element and an external connection terminal is provided on the tip side .

  According to the optical device having the above configuration, the light emitting element and the light receiving element are mounted on the flexible substrate at a predetermined interval, and the light-transmitting first mold resin portion and the light receiving element are sealed. Since the sealed second mold resin portion having translucency is separated and spaced apart, and has flexibility between the first and second mold resin portions, the first mold resin portion and the second mold resin portion are separated. By utilizing the flexibility of the flexible substrate between the mold resin portion, the position of the light emitting element and the light receiving element and the direction of the light emitting surface of the light emitting element and the light receiving surface of the light receiving element can be arbitrarily set. . Therefore, the degree of freedom of arrangement of the light emitting element and the light receiving element is widened. For example, when this optical device is used for an optical connector, the interval between the light emitting element and the light receiving element can be set freely, and can be used for various applications. A highly versatile optical device can be realized.

Also , a control integrated circuit is mounted on the flexible substrate and between the light emitting element and the light receiving element, the control integrated circuit is sealed with a third mold resin part, and the third mold resin part is sealed with the first mold resin part. And separate from the second mold resin portion and spaced apart from each other, and has flexibility between the mold resin portions, the position of the light emitting element and the light receiving element and the light emitting element using the flexibility of the flexible substrate Even if the direction of the light emitting surface and the light receiving surface of the light receiving element is changed, the influence on the control integrated circuit between the light emitting element and the light receiving element is small. Further, by mounting a control integrated circuit on the flexible substrate and between the light emitting element and the light receiving element, the signal wiring can be easily routed.

In addition , an extending portion having an external connection terminal for exchanging signals with the outside extends from substantially the center of the main body of the flexible substrate, and a light emitting element and a light receiving element are disposed on both sides of the main body with a control integrated circuit interposed therebetween. Therefore, even if the position of the light emitting element and the light receiving element and the direction of the light emitting surface of the light emitting element and the light receiving surface of the light receiving element are changed using the flexibility of the flexible substrate, the influence on the extending portion is small. Further, no matter which direction the extension part is bent when the external connection terminal of the extension part of the flexible substrate is connected to the outside, the stress applied to the light emitting element and the light receiving element on the main body side is small, and the reliability can be improved.

  In one embodiment, the extending portion of the flexible substrate is bent in a direction substantially parallel to a line connecting the light emitting element and the light receiving element.

  According to the optical device of the above embodiment, since the extending portion of the flexible substrate is bent in a direction substantially parallel to a line connecting the light emitting element and the light receiving element, the flexible substrate can be made small overall and manufactured. The cost of time can be reduced.

  Moreover, the optical device of one Embodiment provided the notch between the said main-body part of the said flexible substrate, and the said extending | stretching part, It is characterized by the above-mentioned.

  According to the optical device of the above embodiment, by providing a notch between the main body portion of the flexible substrate and the extending portion, the degree of freedom of bending the extending portion when connecting the external connection terminal of the extending portion to the outside is increased. .

  Moreover, the optical device according to an embodiment is characterized in that the translucent mold resin used in the first and second mold resin portions is a thermosetting resin.

  According to the optical device of the above embodiment, the first and second mold resin portions are formed by transfer molding by using a thermosetting resin as the mold resin having translucency of the first and second mold resin portions. It can be formed, and there is little stress on the element, bonding wire, etc., and reliability can be improved, and resin curing is accelerated and productivity can be improved. The mold resin used for the third mold resin part is also preferably a thermosetting resin.

  Moreover, the optical device of one embodiment is characterized in that a lens is formed by integral molding on the first and second mold resin portions.

  According to the optical device of the above embodiment, the lens formed on the first and second mold resin portions efficiently takes out the optical signal from the light emitting element to the outside, and the optical signal received from the outside to the light receiving element. It can be taken in efficiently. In addition, by forming the lens by integral molding, a separate process for creating the lens is unnecessary, and the cost can be reduced.

  The optical device according to one embodiment is characterized in that at least one of a capacitance element, a resistance element, and a crystal resonator is mounted between the mold resin portions of the flexible substrate.

  According to the optical device of the above-described embodiment, a necessary circuit is obtained by mounting at least one of a capacitance element, a resistance element, and a crystal resonator in a region that is not sealed with a mold resin on a flexible substrate. It can be configured on a flexible substrate.

  The optical device according to an embodiment is characterized in that a semiconductor chip in which a photodiode as the light receiving element and a circuit for processing a signal of the photodiode are integrated is mounted on the flexible substrate.

  According to the optical device of the above embodiment, a photodiode and a signal of the photodiode are mounted by mounting on a flexible substrate a semiconductor chip in which a photodiode as the light receiving element and a circuit for processing the signal of the photodiode are integrated. This eliminates the need for separately mounting and signal-connecting circuits for processing, improving productivity and reliability.

  An optical connector according to the present invention is characterized by using any one of the above optical devices.

  According to the optical connector of the above embodiment, an optical device having a wide degree of freedom in arrangement of the light emitting element and the light receiving element can be applied to optical connectors of various specifications, and one type of optical device is shared by various types of optical connectors. Significant cost reduction can be achieved.

  The optical connector according to an embodiment includes a housing in which at least the main body portion of the flexible substrate of the optical device is accommodated, and the main body portion of the flexible substrate is kept in a flat state in the housing. It is arranged.

  According to the optical connector of the above-described embodiment, the main body portion of the flexible substrate of the optical device is disposed in the housing while maintaining a flat state, and the light receiving side and the light receiving side are mounted without bending the main body portion. Since the side on which the element is mounted is along the same plane, the distance between the light emitting element and the light receiving element is uniquely determined, and positioning during assembly is facilitated.

  The optical connector according to an embodiment includes a housing in which at least the main body of the flexible substrate of the optical device is accommodated, and the main body of the flexible substrate includes the side on which the light emitting element is mounted and the above Inside the housing, the side on which the light receiving element is mounted is folded back to the center side of the main body, and the light emitting surface of the light emitting element and the light receiving surface of the light receiving element face outward in the same direction. It is arranged. Here, the folding of the flexible substrate means that the flexible substrate is bent with a curvature that does not apply stress.

  According to the optical connector of the above embodiment, the side on which the light emitting element is mounted and the side on which the light receiving element is mounted are folded back to the center side of the main body, and the light emitting surface of the light emitting element and the light receiving element Since the main body portion of the flexible substrate of the optical device is disposed in the housing so that the light receiving surface of the optical device faces outward in the same direction, the light emitting element and the light receiving element are arranged according to the degree of folding of the main body portion of the flexible substrate. The interval can be set arbitrarily.

  Moreover, as for the optical connector of one Embodiment, it is desirable for the said extending | stretching part of the said flexible substrate of any one said optical device to be bend | folded at substantially right angle with respect to the said main-body part.

  According to the optical connector of the said embodiment, the mounting property of an optical connector improves because the extending part of the said flexible substrate is bend | folded at substantially right angle with respect to the main-body part.

  In addition, an electronic apparatus according to the present invention uses any one of the optical connectors described above.

  According to the electronic apparatus of the above-described embodiment, a significant cost reduction can be achieved by using an optical connector including a highly versatile optical device that can be used for various applications.

  As is clear from the above, according to the optical device of the present invention, the degree of freedom of the arrangement of the light emitting element and the light receiving element is widened, and the interval between the light emitting element and the light receiving element can be freely set, so that it can be used in various applications. A versatile optical device that can be used can be realized.

  Further, according to the optical connector of the present invention, an optical device having a wide degree of freedom in arrangement of light emitting elements and light receiving elements can be applied to optical connectors of various specifications, and one type of optical device can be shared by various types of optical connectors. Can greatly reduce costs.

  In addition, according to the electronic apparatus of the present invention, a significant cost reduction can be realized by using a highly versatile optical connector that can be used in various applications.

  The optical device, optical connector and electronic apparatus of the present invention will be described in detail below with reference to the embodiments shown in the drawings.

(First embodiment)
FIG. 1 is a plan view of an optical device according to a first embodiment of the present invention, and FIG. 2 is a side view of the optical device viewed from below in FIG. As shown in FIG. 1, the flexible substrate 1 has a rectangular main body portion 1a and an extending portion 1b extending laterally from the center of the main body portion 1a and bending in the longitudinal direction of the main body portion 1a. An external connection terminal 11 is provided at the tip of the extending portion 1 b of the flexible substrate 1. The flexible substrate 1 includes a base substrate 22 (shown in FIG. 3) having flexibility, and a first wiring pattern (electrode portions 8A and 9A in FIG. 3) is formed on one surface side of the base substrate 22. And the second wiring pattern (including the electrode portions 8B and 9B in FIG. 3) is provided on the other surface side of the base substrate 22. A part of at least one of the first and second wiring patterns of the flexible substrate 1 is connected to the external connection terminal 11 at the tip of the extending portion 1b. For example, the first wiring pattern of the flexible substrate 1 performs electrical connection with the light emitting element 2, the light receiving element 3, and the communication IC 4 on one side, and the second wiring pattern includes the light emitting element 2 and the light emitting element 2. The connection between the light receiving element 3 and the communication IC 4 and the connection between the communication IC 4 and the external connection terminal 11 at the tip of the extending portion 1b are performed on the other surface side. In addition, about a 2nd wiring pattern, you may connect between a light emitting element or a light receiving element, and an external connection terminal. Further, when the wiring is complicated, the first wiring pattern may be connected to the communication IC and the external connection terminal 11 at the tip of the extending portion 1b.

  A light emitting element 2 and a light receiving element 3 are mounted in the vicinity of both short sides (both ends in the longitudinal direction) of the main body 1a of the flexible substrate 1, respectively. A communication IC 4 as an example of an integrated circuit for control is mounted on the main body 1 a of the flexible substrate 1 and between the light emitting element 2 and the light receiving element 3. A notch 20 is provided between the main body portion 1a of the flexible substrate 1 and the bent portion of the extending portion 1b. The light receiving element 3 is a photodiode.

  Further, as shown in FIG. 2, the light emitting element 2 mounted on the main body 1a of the flexible substrate 1 is sealed with a sealing body 6a made of translucent mold resin, and the sealing body 6a. A sealing body 6 b is formed on the opposite side of the flexible substrate 1. The sealing bodies 6a and 6b are integrally formed by transfer molding, and the sealing bodies 6a and 6b constitute a first mold resin portion.

  The light receiving element 3 mounted on the main body 1a of the flexible substrate 1 is sealed with a sealing body 6c made of a light-transmitting mold resin, and the flexible substrate 1 of the sealing body 6c is sealed. A sealing body 6d is formed on the opposite side. The sealing bodies 6c and 6d are integrally formed by transfer molding, and the sealing bodies 6c and 6d constitute a second mold resin portion.

  Further, the communication IC 4 mounted on the main body 1a of the flexible substrate 1 is sealed with a sealing body 6e made of a light-transmitting mold resin, and the flexible substrate 1 of the sealing body 6e is sealed. A sealing body 6f is formed on the opposite side. The sealing bodies 6e and 6f are integrally formed by transfer molding, and the sealing bodies 6e and 6f constitute a third mold resin portion.

  As the mold resin having translucency, a translucent epoxy resin filled with a transparent filler (for example, silica glass) is used, and a desired linear expansion coefficient is obtained by adjusting the filling amount of the transparent filler. Examples of the translucent epoxy resin include a phenol-based cured epoxy resin and an acid anhydride-based cured epoxy resin.

  Further, as shown in FIG. 2, the light emitting element 2, the light receiving element 3, and the communication IC 4 are respectively sealed by independent sealing bodies 6a, 6c, and 6e by transfer molding. The sealing body 6a of the light emitting element 2 is integrally formed with a lens 7 for efficiently taking out an optical signal to the outside. The sealing body 6c of the light receiving element 3 efficiently receives an optical signal received from the outside. A lens 7 for capturing is integrally formed.

  FIG. 3 is a sectional view taken along line III-III in FIG. 1, and the section on the light receiving element 3 side has the same configuration as the section shown in FIG. The cross section on the communication IC 4 side has the same configuration as the cross section shown in FIG. 3 except for the lens.

  As shown in FIG. 3, the flexible substrate 1 has electrode portions 8 </ b> A and 9 </ b> A formed on the mounting surface side of the base substrate 22 via an adhesive layer 21. Further, electrode portions 8B and 9B are formed on the back surface side of the base substrate 22 through an adhesive layer 23. Further, a protective layer 25 is formed on the electrode portions 8B and 9B via an adhesive layer 24. The electrode portion 8A and the electrode portion 8B are electrically connected through the through hole 12, and the electrode portion 9A and the electrode portion 9B are electrically connected through the through hole 12.

  On the mounting surface side of the flexible substrate 1, the light emitting element 2 is mounted by die bonding via an adhesive layer 21 and an adhesive layer 26. The flexible substrate 1 is provided with through holes 10 on both sides of the light emitting element 2. Although two through holes 10 are shown in FIG. 3, three or more through holes 10 may be provided. In addition, the electrode portions 8A and 9A on the flexible substrate 1 and the electrodes of the light emitting element 2 are electrically connected through bonding wires 5.

  The sealing bodies 6a and 6b (sealing bodies 6c and 6d and sealing bodies 6e and 6f) are connected to each other through a through hole 10 during transfer molding. The sealing body 6a (6c, 6e) of the flexible substrate 1 is a through hole that electrically connects the light emitting element 2, the light receiving element 3, the communication IC 4, the bonding wire 5, and the wiring portions 8B, 9B on the back surface side. 12 is sealed. On the other hand, the sealing body 6b (6d, 6f) formed on the back surface of the flexible substrate 1 is formed only in the inner region where the through hole 12 is not sealed.

  In the first embodiment, the sealing bodies 6a and 6b that are the first mold resin portions, the sealing bodies 6c and 6d that are the second mold resin portions, and the sealing bodies 6e and 6f that are the third mold resin portions. Is formed at the same time by transfer molding, but the first mold resin part and the second mold resin part are simultaneously formed by using a mold resin having translucency by transfer molding, and the third mold resin part is separated from another. You may form using the mold resin which does not have translucency by transfer molding.

  According to such a structure of the flexible substrate 1, the wiring portions 8A, 9A, 8B, 9B and the through holes 12 are not arranged in the region where the mold is in direct contact when the mold is clamped by the transfer mold during transfer molding. Wiring between the electrodes of the light emitting element 2, the light receiving element 3, and the communication IC 4 and wiring between each electrode and the external connection terminal 11 are possible.

  The light-transmitting mold resin used for the sealing bodies 6a to 6f includes the light-emitting element 2, the light-receiving element 3, the communication IC 4, the bonding wire 5, the electrodes 8A and 9A, and the flexible substrate 1 to be sealed. Has the same linear expansion coefficient. For this reason, after sealing, the shrinkage after sealing and the reliability in the operating temperature environment can be improved.

  According to the above optical device, the light emitting element 2 and the light receiving element 3 are mounted on the flexible substrate 1 at a predetermined interval, and the light emitting element 2 and the light receiving element 3 have translucency. (6a, 6b, 6c, 6d), the first mold resin portion (6a, 6b) for sealing the light emitting element 2 and the second mold resin portion (6c, 6c) for sealing the light receiving element 3 are sealed. 6d), the position of the light emitting element 2 and the light receiving element 3 and the orientation of the light emitting surface of the light emitting element 2 and the light receiving surface of the light receiving element 3 can be arbitrarily set. It becomes possible. Accordingly, the degree of freedom of arrangement of the light emitting element 2 and the light receiving element 3 is widened, and when this optical device is used for an optical connector, the arrangement of the light emitting element 2 and the light receiving element 3 can be arbitrarily set. A highly versatile optical device that can be used for various purposes can be realized.

  In addition, a communication IC 4 is mounted on the flexible substrate 1 and between the light emitting element 2 and the light receiving element 3, and the communication IC 4 is sealed with a third mold resin portion (6e, 6f), whereby a flexible substrate is obtained. Even if the position of the light emitting element 2 and the light receiving element 3 and the direction of the light emitting surface of the light emitting element 2 and the direction of the light receiving surface of the light receiving element 3 are changed by using the flexibility of 1, the stress on the communication IC 4 is reduced and the stress is reduced. Reliability can be improved.

  A light emitting element 2 and a light receiving element 3 are arranged on both sides of the main body 1a of the flexible substrate 1, and an extending portion 1b having an external connection terminal 11 for exchanging signals with the outside extends from substantially the center of the main body 1a. Therefore, even if the position of the light emitting element 2 and the light receiving element 3 and the direction of the light emitting surface of the light emitting element 2 and the light receiving surface of the light receiving element 3 are changed using the flexibility of the flexible substrate 1, the influence on the extending portion 1 b is exerted. Few. Further, the stress applied to the light emitting element 2 and the light receiving element 3 on the main body 1a side is small no matter which direction the extending portion 1b is bent when the external connection terminal 11 of the extending portion 1b of the flexible substrate 1 is connected to the outside. , Can improve the reliability.

  Moreover, since the extending portion 1b of the flexible substrate 1 is bent in a direction substantially parallel to a line connecting the light emitting element 2 and the light receiving element 3, the flexible substrate 1 can be made small overall, and at the time of manufacture. Cost can be reduced.

  In addition, the notch 20 provided between the main body portion 1a and the extending portion 1b of the flexible substrate 1 allows the extending portion 1b to be bent when the external connection terminal 11 on the distal end side of the extending portion 1b is connected to the outside. The degree of spread increases, and the assemblability when the optical device is incorporated into the housing is improved. The position and shape of the notch are not limited to this, and any shape can be used as long as the degree of freedom of bending the extending portion is increased.

  Further, since the translucent mold resin used for the first and second mold resin portions (6a, 6b, 6c, 6d) is a thermosetting resin, the first and second mold resins are formed by transfer molding. The parts (6a, 6b, 6c, 6d) can be formed, there is little stress on the elements, bonding wires, etc., and the reliability can be improved, and the resin can be cured quickly and the productivity can be improved.

  In addition, the lens 7 formed on the sealing body 6a of the first mold resin portion efficiently takes out an optical signal from the light emitting element 2 to the outside, and is formed on the sealing body 6c of the second mold resin portion. An optical signal received from the outside can be efficiently taken into the light receiving element 3 by the lens 7. In addition, by forming the lens 7 by integral molding, a separate process for creating a lens is unnecessary, and the cost can be reduced.

  A semiconductor chip in which a photodiode as the light receiving element 3 and a circuit for processing a signal of the photodiode are integrated may be mounted on the flexible substrate 1. In this case, it is not necessary to separately mount or connect a photodiode and a circuit for processing a signal of the photodiode, so that productivity and reliability can be improved.

  Further, the outer peripheral edge of the sealing bodies 6a, 6c, 6e and the area in the vicinity of the outer peripheral edge have no wiring pattern on the surface of the flexible substrate 1, and the space between the surface of the flexible substrate 1 and the base substrate 22 There is no wiring pattern, the outer peripheral edge of the sealing bodies 6b, 6d, 6f and the area in the vicinity of the outer peripheral edge have no wiring pattern on the surface of the flexible substrate 1, and the surface of the flexible substrate 1 and the base substrate 22 There is no wiring pattern between them. That is, the size of the sealing bodies 6a, 6c, 6e is increased, and the size of the sealing bodies 6b, 6d, 6f is decreased. , 6c, 6e are formed in regions that are not sealed by the sealing bodies 6b, 6d, 6f, and wiring patterns (electrode portions 8A, 8B, 9A, 9B) are formed through the through holes 12 from the regions. The sealing bodies 6a, 6c and 6e are pulled out from the sealing bodies 6b, 6d and 6f. As a result, the mold clamping pressure at the time of transfer molding is not applied to the electrode portions 8A, 9A, 8B, 9B on the electrode portions 8A, 9A, 8B, 9B. Accordingly, the electronic component mounted on the flexible substrate 1 can be sealed by transfer molding without cutting or damaging the wiring pattern.

  In addition, the wiring patterns (electrode portions 8A, 9A) sealed by the sealing bodies 6a, 6c, 6e among the wiring patterns provided on one surface side of the flexible substrate 1 are replaced with the other of the flexible substrate 1. By connecting through the through hole 12 to the wiring patterns (electrode portions 8B and 9B) that are not sealed by the sealing bodies 6b, 6d, and 6f among the wiring patterns provided on the surface side, it is connected to the electronic component. The electrode portions 8A, 9A thus formed can be drawn out from the sealing bodies 6a, 6c, 6e through the through holes 12 and the electrode portions 8B, 9B.

  Further, by providing rounds 13 on the outer peripheral portions of the sealing bodies 6a to 6f, the clamping pressure applied to the flexible substrate 1 at the time of transfer molding is dispersed on the surface from the line shape, and the sealing bodies 6a to 6f. Even if the mold is clamped with a strong pressure that does not cause resin leakage on the other area of the flexible substrate 1, the stress on the flexible substrate 1 can be alleviated.

  Further, since the sealing bodies 6a to 6f are connected to each other through a mold resin filled in the through hole 10 provided in the flexible substrate 1, and the sealing bodies 6a to 6f are integrated, sealing is performed. Each of the bodies 6a and 6b, the sealing bodies 6c and 6d, and the sealing bodies 6e and 6f can sandwich the flexible substrate 1 from both sides to prevent the sealing bodies 6a to 6f from peeling off and improve reliability. it can.

  Moreover, by using an electronic device that seals an electronic component mounted on the flexible substrate 1 by transfer molding without cutting or damaging the wiring pattern, a highly reliable electronic device can be obtained with a simple configuration. it can. In particular, the optical device is suitable for electronic devices such as AV devices and security devices for home networks and in-vehicle networks. Here, “electronic component” refers to a component that needs to be electrically connected to a wiring pattern such as a light emitting element, a light receiving element, and a communication IC. Further, the present invention is not limited to this, and active elements such as capacitance elements and resistance elements, passive elements such as transistors, and components such as integrated circuits may be used.

(Second Embodiment)
FIG. 4 is a cross-sectional view of the optical device according to the second embodiment of the present invention. The optical device according to the second embodiment has the same configuration as that of the optical device according to the first embodiment except for the reinforcing material. The same components are denoted by the same reference numerals and the description thereof is omitted, and FIGS. 1 and 2 are used.

  As shown in FIG. 4, reinforcing members 14A and 14B made of hard resin (for example, polyimide film) are provided on the outer peripheral portions of the sealing bodies 6a and 6b that are in contact with the flexible substrate 1. The reinforcing materials 14A and 14B may be other hard materials such as dummy metals.

  In the optical device according to the second embodiment, the mold clamping pressure applied to the flexible substrate 1 during transfer molding has the effect of dispersing from the linear shape onto the surface, and on the flexible substrate 1 other than the sealing bodies 6a and 6b. Even if the mold is clamped so as not to cause resin leakage, the stress on the flexible substrate 1 can be reduced by the reinforcing members 14A and 14B. In addition, in the sealing bodies 6c and 6d and the sealing bodies 6e and 6f shown in FIGS. 1 and 2, the reinforcing members 14A and 14B are similarly provided on the outer peripheral portion in contact with the flexible substrate 1.

  The optical device of the second embodiment has the same effect as the optical device of the first embodiment.

(Third embodiment)
FIG. 5 is a schematic top view of an optical connector using the optical device according to the third embodiment of the present invention. The optical connector of the third embodiment uses the optical device of the first embodiment, and uses FIGS. 1 and 2.

  In the optical device of the first embodiment, as shown in FIG. 2, the light emitting element 2, the light receiving element 3, and the communication IC 4 are respectively sealed by independent sealing bodies 6 a, 6 c, 6 e by transfer molding, Resin leakage to unintended areas is suppressed. As a result, the bypass capacitor 15, the resistance element 16, the crystal oscillator 17, and the like as examples of capacitance elements necessary for the light emitting element 2, the light receiving element 3, and the communication IC 4 are soldered on the exposed area of the flexible substrate 1. It is installed.

  As shown in FIG. 5, the optical connector according to the third embodiment includes an optical device (see FIG. 5) in a housing 30 provided with receptacles 31 and 32 into which optical plugs provided at the tip of an optical fiber cable can be inserted. 1 and 2) are housed. The main body 1a of the flexible substrate 1 of the optical device is arranged in the housing 30 while maintaining a flat state. At this time, the flexible substrate 1 of the optical device is bent at a bent portion 1c (shown in FIG. 1) which is a connecting portion between the main body portion 1a and the extended portion 1b, and the main body portion 1a and the extended portion 1b become substantially perpendicular. I am doing so. The lenses 7 of the sealing bodies 6a and 6c that seal the light emitting element 2 and the light receiving element 3 are arranged at positions where they are optically coupled to the optical plugs inserted into the receptacles 31 and 32.

  The optical connector using the optical device of the third embodiment is used in an optical communication apparatus using an optical fiber cable as a medium. The optical communication device performs data communication between devices using an optical connector connected via an optical fiber cable.

  A necessary circuit can be configured on the flexible substrate 1 by mounting the bypass capacitor 15, the resistor 16, and the crystal oscillator 17 on the exposed region of the flexible substrate 1 that is not sealed with the mold resin.

  According to the above optical connector, an optical device having a wide degree of freedom in arrangement of the light emitting element 2 and the light receiving element 3 can be applied to optical connectors of various specifications, and greatly by sharing one type of optical device in various types of optical connectors. Cost reduction.

  In addition, the main body 1a of the flexible substrate 1 of the optical device is kept flat so that the side on which the light emitting element 2 is mounted and the side on which the light receiving element 3 is mounted are in the same plane. Since the distance between the light emitting element 2 and the light receiving element 3 is uniquely determined, positioning during assembly can be easily performed.

  Moreover, the extending | stretching part 1b of the said flexible substrate 1 improves the mountability of an optical connector by being bent at substantially right angle with respect to the main-body part 1a.

(Fourth embodiment)
FIG. 6 is a schematic top view of an optical connector using the optical device according to the fourth embodiment of the present invention. The optical connector of the fourth embodiment uses the optical device of the first embodiment, and uses FIGS. 1 and 2. Further, the difference from the optical connector of the third embodiment is how to bend the flexible substrate 1.

  In the optical device of the third embodiment described above, the light emitting element 2, the light receiving element 3, and the communication IC 4 are arranged in a straight line in the longitudinal direction of the main body 1a of the flexible substrate 1, as shown in FIG. On the other hand, in the optical connector shown in FIG. 6 of the fourth embodiment, both sides of the main body portion 1a of the flexible substrate 1 are curved so that the light emitting element 2 and the light receiving element 3 are different from the communication IC 4 by 180 °. Let it be bent. That is, the side of the flexible substrate 1 where the light emitting element 2 is mounted and the side where the light receiving element 3 is mounted are folded back to the center side of the main body 1a, so that the light emitting surface of the light emitting element 2 and the light receiving element The three light receiving surfaces are arranged in the housing 40 so as to face outward in the same direction.

  Thus, the lenses 7 of the sealing bodies 6a and 6c for sealing the light emitting element 2 and the light receiving element 3 are disposed at positions where they are optically coupled to the optical plugs inserted into the receptacles 41 and 42, respectively.

  The optical connector using the optical device of the fourth embodiment is used in an optical communication apparatus using an optical fiber cable as a medium.

  According to the above optical connector, an optical device having a wide degree of freedom in arrangement of the light emitting element 2 and the light receiving element 3 can be applied to optical connectors of various specifications, and greatly by sharing one type of optical device in various types of optical connectors. Cost reduction.

  Further, the side on which the light emitting element 2 is mounted and the side on which the light receiving element 3 is mounted are folded back to the center side of the main body 1a, and the light emitting surface of the light emitting element 2 and the light receiving surface of the light receiving element 3 Are disposed in the housing 40 such that the light-emitting element 2 and the light-receiving element 3 are in accordance with the degree of folding of the main-body part 1a of the flexible substrate 1. Can be set arbitrarily.

  As described above, according to the optical devices of the first to fourth embodiments, the light emitting element 2 and the light receiving element 3 are mounted on the flexible substrate 1, and the light emitting element 2 and the light receiving element are received by the mold resin having translucency. By sealing the element 3, it becomes possible to integrally mold a lens in the sealing bodies 6 a and 6 b of the light emitting element 2 and the light receiving element 3, and to suppress resin leakage onto the flexible substrate 1 other than the sealing body. be able to. Thereby, the flexibility of the area | region of the flexible substrate 1 other than the area | region in which the sealing body was formed can be ensured, for example, the mounting property to the optical connector of a product can be improved.

  Furthermore, since the resin leakage onto the area of the flexible substrate 1 other than the area where the sealing body is formed can be suppressed, the area of the flexible substrate 1 other than the area where the sealing body is formed after transfer molding. In addition, for example, an element such as a bypass capacitor can be mounted by soldering.

  In optical communication devices using optical fiber cables, even if they have exactly the same function, the shape of the optical connector varies depending on the application. It is not possible to design and produce various optical devices according to the specifications of such optical connectors. It is disadvantageous in price. On the other hand, in the optical connector using the optical device of the present invention, one type of optical connector having different pitches between the transmission unit (transmission side receptacles 31, 41) and the reception unit (reception side receptacles 32, 42) is used. Optical devices can be shared, and significant cost reduction can be realized.

  In the first to fourth embodiments, the optical device used for optical communication has been described. However, the optical device is not limited to this, and the present invention is applied to a device such as an optical sensor including a light emitting element and a light receiving element. Also good.

  Moreover, although the said 1st-4th embodiment demonstrated the optical device using the double-sided type flexible substrate, a multilayer type flexible substrate may be sufficient.

  In the optical devices of the first to fourth embodiments, the sealing bodies 6a and 6b constitute the first mold resin part, the sealing bodies 6c and 6d constitute the second mold resin part, and the sealing body Although the 3rd mold resin part was comprised by 6e, 6f, the 1st-3rd mold resin part may seal only the mounting surface side of a flexible substrate with the mold resin which has translucency.

  Furthermore, in the optical devices of the first to fourth embodiments, the extending portion 1b of the flexible substrate 1 is configured to extend from the center of the main body portion 1a. However, the present invention is not limited thereto, and the light emitting element 2 and the light receiving element 3 are not limited thereto. If the structure has flexibility between the connecting portion of the main body 1a to the extending portion 1b and the mold resins 6a and 6c for sealing the elements 2 and 3, one element It is good also as a structure extended from the position biased to the side. Also in this case, the communication IC 4 and the resin package 6e are arranged within the width at a position corresponding to the connection portion of the main body 1a.

FIG. 1 is a top view of an optical device according to a first embodiment of the present invention. FIG. 2 is a side view of the optical device. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view of an optical device according to a second embodiment of the present invention. FIG. 5 is a schematic top view of an optical connector using the optical device according to the third embodiment of the present invention. FIG. 6 is a schematic top view of an optical connector using the optical device according to the fourth embodiment of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Flexible substrate 1a ... Main-body part 1b ... Extend | stretching part 1c ... Bending part 2 ... Light emitting element 3 ... Light receiving element 4 ... Communication IC
DESCRIPTION OF SYMBOLS 5 ... Bonding wire 6a-6f ... Sealing body 7 ... Lens 8A, 8B, 9A, 9B ... Electrode part 10 ... Through hole 11 ... External connection terminal 12 ... Through hole 13 ... Earl 14A, 14B ... Reinforcement material 15 ... Bypass capacitor DESCRIPTION OF SYMBOLS 16 ... Resistance element 17 ... Crystal oscillator 20 ... Notch 22 ... Base base material 21,23,24 ... Adhesive layer 25 ... Protective layer 30,40 ... Housing 31,32,41,42 ... Receptacle

Claims (12)

A flexible substrate;
A light emitting element and a light receiving element mounted on the flexible substrate at a predetermined interval;
A first mold resin part having translucency sealing the light emitting element;
A second mold resin portion having translucency sealing the light receiving element,
The first mold resin part and the second mold resin part are spaced apart and have flexibility between the first and second mold resin parts ,
An integrated circuit for control mounted on the flexible substrate and between the light emitting element and the light receiving element;
A third mold resin portion sealing the control integrated circuit;
With
The third mold resin part is spaced apart from the first mold resin part and the second mold resin part, and has flexibility between the mold resin parts.
The flexible substrate includes a main body in which the light emitting element and the light receiving element are disposed on both sides, and the control integrated circuit is disposed between the light emitting element and the light receiving element, and the light emitting element in the main body An optical device comprising: an extending portion extending laterally from a portion between the light receiving element and an external connection terminal on a distal end side . The optical device according to claim 1 .
The optical device, wherein the extending portion of the flexible substrate is bent in a direction substantially parallel to a line connecting the light emitting element and the light receiving element. The optical device according to claim 1 or 2 ,
An optical device, wherein a notch is provided between the main body portion and the extending portion of the flexible substrate. The optical device according to any one of claims 1 to 3 ,
An optical device, wherein the translucent mold resin used in the first and second mold resin portions is a thermosetting resin. The optical device according to any one of claims 1 to 4 ,
An optical device, wherein a lens is integrally formed with the first and second mold resin portions. The optical device according to any one of claims 1 to 5 ,
An optical device, wherein at least one of a capacitance element, a resistance element, and a crystal resonator is mounted between the mold resin portions of the flexible substrate. The optical device according to any one of claims 1 to 6 ,
An optical device, wherein a semiconductor chip on which a photodiode as the light receiving element and a circuit for processing a signal of the photodiode are integrated is mounted on the flexible substrate. Optical connector comprising: the optical device according to any one of claims 1 to 7. The optical connector according to claim 8 , wherein
A housing in which at least the main body of the flexible substrate of the optical device is stored;
An optical connector, wherein the main body of the flexible substrate is disposed in the housing while maintaining a flat state. The optical connector according to claim 9 , wherein
A housing in which at least the main body of the flexible substrate of the optical device is stored;
The main body portion of the flexible substrate is configured such that the side on which the light emitting element is mounted and the side on which the light receiving element is mounted are folded back to the center side of the main body portion, and the light emitting surface of the light emitting element. An optical connector, wherein the optical connector is disposed in the housing such that a light receiving surface of the light receiving element faces outward in the same direction. In the optical connector according to claim 9 or 1 0,
The stretching of the flexible substrate of the upper Symbol light device, optical connector, characterized in that it is bent substantially at a right angle with respect to the body portion. An electronic apparatus comprising: the optical connector according to any one of claims 8 to 1 1.

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