JP4610806B2 - Manufacturing method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a suitable semiconductor equipment to configure the like 8 segment or seven-segment type display device.
[0002]
[Prior art]
As a specific example of a conventional semiconductor device, for example, as shown in FIG. 13A, there is an 8-segment type display device B1 capable of displaying a single-digit number and a single dot. In addition, as shown in FIG. 2B, there is also a display device B2 that can display a two-digit number and two dots, and this display device B2 has a basic configuration of the display device B1 as one module. In some cases, a configuration corresponding to two modules is provided. Each of these display devices B1 and B2 has a plurality of LED chips (not shown in the figure) accommodated in cases 90a and 90b, and a plurality of surface mounting devices are provided outside cases 90a and 90b. A plurality of leads 91 in which the terminal portions 92 are formed protrude. However, the number of leads 91 and LED chips in the display device B2 is twice that of the display device B1.
[0003]
Conventionally, the display devices B1 and B2 are manufactured as follows. That is, when manufacturing the display device B1, for example, as shown in FIG. 14, a manufacturing frame F1 is used which is formed by dividing a plurality of leads 91 into a plurality of sets each grouped by a fixed number. The number of leads 91 in one set is the number of leads to be provided in one display device B1, and a cross member 98 for reinforcing the manufacturing frame F1 is appropriately provided between the sets of leads 91. ing. In the manufacturing frame F1, after bonding the LED chip 94 (see FIG. 4B) and necessary wire connection, a part of each lead 91 for one set is accommodated in the case 90a. . A liquid resin 93 is filled in the case 90a in advance. The resin 93 is then cured. Thereby, each lead 91 and the predetermined LED chip 94 corresponding to this can be resin-sealed and fixed to the case 90a. Thereafter, a forming process or a cutting process is performed on a portion of each lead 91 protruding from the resin 93. According to such a method, for example, the manufacturing operation can be facilitated as compared with the case where the semiconductor element is resin-packaged by resin molding means using a mold.
[0004]
The basic process for manufacturing the display device B2 is the same as described above. However, as shown in FIG. 15, in the manufacturing frame F2 used for manufacturing the display device B2, the number of leads 91 made as one set is about twice the number of leads set in the manufacturing frame F1. It is a thing. In the case 90b filled with the resin 93, a part of each pair of leads 91 of the manufacturing frame F2 is accommodated.
[0005]
[Problems to be solved by the invention]
In the conventional means described above, although the display devices B1 and B2 have a common configuration, separate manufacturing frames F1 and F2 having different structures are used in the manufacture thereof. Therefore, the cost for manufacturing and preparing these manufacturing frames F1 and F2 increases, and the manufacturing cost of the display devices B1 and B2 increases.
[0006]
The present invention has been conceived under such circumstances, and an object thereof is to reduce the manufacturing cost of the display device.
[0007]
DISCLOSURE OF THE INVENTION
In order to solve the above problems, the present invention takes the following technical means.
[0008]
The method of manufacturing a semiconductor device which is herein onset Ming Thus provided, a semiconductor element is mounted for manufacturing frames a plurality of leads are provided side by side in a predetermined direction is divided into a plurality of sets of each fixed number, and this A first step of electrically connecting the semiconductor element and the plurality of leads; a second step of housing and fixing each part of the semiconductor element and the plurality of leads conducting to the semiconductor element; and the manufacturing A third step of separating a plurality of leads partially contained in the case from other portions of the manufacturing frame by cutting the frame for use in a semiconductor device. As the case, when preparing the first and second cases having different sizes and manufacturing a semiconductor device corresponding to one module, the above-mentioned case is performed in the second step. While one set of the plurality of leads is accommodated in one case, when manufacturing a semiconductor device corresponding to a plurality of modules, the plurality of leads are divided into a plurality of sets in the second case in the second step. It is characterized by being accommodated in a lump.
[0010]
According to the present invention, in order to manufacture a semiconductor device corresponding to a plurality of modules by using a manufacturing frame used to manufacture a semiconductor device corresponding to one module, the semiconductor frame can be shared. The manufacturing cost of the apparatus can be reduced.
[0011]
In a preferred embodiment of the present invention, a cross member for connecting a pair of side frames of the manufacturing frame is provided between each pair of the plurality of leads of the manufacturing frame, and the cross member is Forming a dummy electrode protruding from the inside of the case to the outside. According to such a structure, the semiconductor device provided by the 3rd side surface of this invention described below can be manufactured suitably.
[0015]
Other features and advantages of the present invention will become more apparent from the following description of embodiments of the invention.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be specifically described with reference to the drawings.
[0017]
The method for manufacturing a semiconductor device according to the present embodiment is a method capable of selectively manufacturing two types of display devices as semiconductor devices, and a specific configuration of these two types of display devices will be described first.
[0018]
1 to 4 show an example of a display device. The display device A1 shown in these drawings is an 8-segment type display device for displaying a single digit and a dot, and includes a case 1A, a sealing resin 2, and a plurality (8 in total). ) LED chip 3 and a plurality of leads 4.
[0019]
The case 1A is resin-molded using, for example, a mold, and a plurality of openings 10a and 10b representing a figure 8 and one dot are provided on the front wall (upper wall). . The pair of side walls 11 of the case 1A is configured such that a part thereof extends downward. In this way, when the display device A1 is mounted on a desired portion, the display device A1 can be stabilized by bringing each side wall 11 into contact with the mounting portion.
[0020]
The resin 2 has translucency and is filled in the case 1A. The resin 2 is also distributed in the openings 10a and 10b of the case 1A. As this resin 2, for example, an epoxy resin is used. As will be described later, the resin 2 is filled in the case 1A in a liquid state and then thermally cured. However, the invention of the present application is not limited to this, and a resin of a type that is cured by natural standing can be used.
[0021]
The plurality of leads 4 are formed from a metal manufacturing frame F called a lead frame, as will be described later. The plurality of leads 4 are electrically connected to the plurality of LED chips 3. More specifically, as clearly shown in FIG. 4, as the plurality of leads 4, one lead 4 (4A) for ground connection and eight leads 4 (4B to 4B for positive voltage application) 4I), the plurality of LED chips 3 are bonded onto the eight leads 4 (4B to 4I), and the anode on one side (lower surface) is electrically connected to the leads 4 (4B to 4I). is doing. The cathode on the opposite surface of each LED chip 3 is electrically connected to the lead 4 (4A) via the wire W. Each LED chip 3 corresponds to an example of a semiconductor element in the present invention, and is arranged in the openings 10a and 10b of the case 1A. Each LED chip 3 and each wire W are sealed with resin 2.
[0022]
As best shown in FIGS. 2 and 3, a part of each of the plurality of leads 4 is buried in the resin 2. Out of the leads 4, the protrusions 4 b that protrude to the outside of the resin 2 are distributed to a total of five on both sides of the case 1A. As clearly shown in FIG. 4, each of the leads 4 (4B to 4I) has one protrusion 4b, whereas the lead 4 (4A) is distributed to both sides of the case 1A. There are two protrusions 4b (4b '). According to such a configuration, since the plurality of protrusions 4b can be arranged symmetrically by five, when a plurality of terminal portions for conducting connection are provided on the member to be mounted on the display device A1, Therefore, these terminal portions may be arranged symmetrically. In addition, since the lead 4 (4A) is supported at both ends by the two protrusions 4b, the mechanical strength can be increased.
[0023]
As clearly shown in FIG. 2, the protrusions 4b of the plurality of leads 4 are appropriately bent, and are mounted on the front ends thereof so that the bottoms are aligned with each other on the same plane. A terminal portion 40 is formed. As shown well in FIG. 3, a widened portion 42 having a width wa larger than the width wb of the other portion is provided at a portion closer to the base end than each terminal portion 40 of each protrusion 4b. It has been. As will be described later, the widened portion 42 serves to suppress the resin 2 from unduly covering the protruding portions 4b of the leads 4 during the manufacturing process of the display device A1.
[0024]
5 to 7 show other examples of the display device. In these drawings, the same or similar elements as those of the display device A1 described above are denoted by the same reference numerals.
[0025]
The display device A2 shown in FIGS. 5 to 7 is for displaying a two-digit number and two dots, and includes a case 1B, a sealing resin 2, a plurality of LED chips 3, a plurality of A lead 4 and a dummy electrode 5 are provided.
[0026]
The case 1B is different from the case 1A in that the case 1B is larger than the case 1A, and two sets of openings 10a and 10b for displaying numbers and dots are provided side by side. As shown in FIGS. 6 and 7, the LED chip 3 and the plurality of leads 4 are formed by combining the LED chip 3 and the plurality of leads 4 of the display device A1 into one module. The configuration is equivalent to arranging two in a predetermined direction. The structure of the II′-II ′ cross section of FIG. 5 is the same as the cross sectional structure of the display device A1 shown in FIG. Therefore, the total number of each of the lead 4 and the LED chip 3 is twice the total number in the display device A1.
[0027]
As will be described later, the dummy electrode 5 is formed from a cross member 48 of the manufacturing frame F, and the material thereof is the same as that of each lead 4. Each of the dummy electrodes 5 is positioned between a predetermined number of leads 4 each constituting a module, and a part of the dummy electrode 5 is buried in the resin 2. As a result, the dummy electrode 5 is fixed to the case 1B. Two locations near both ends of the dummy electrode 5 in the longitudinal direction are projecting portions 5 a projecting outside the resin 2, and the projecting portions 5 a are bent into the same shape as the projecting portions 4 b of the leads 4. Yes. The protruding portion 5a is also formed with a widened portion 50 in which the width wc of one part is wider than the width wd of the other part, as with each lead 4.
[0028]
Next, a method for manufacturing the display devices A1 and A2 will be described.
[0029]
First, the manufacturing method of the display device A1 will be described. In manufacturing the display device A1, a manufacturing frame F as shown in FIG. 8 is used. The manufacturing frame F is obtained by finishing a metal plate having an appropriate thickness into a predetermined shape by, for example, an etching process. In the manufacturing frame F, a plurality of leads 4 are arranged at appropriate intervals between a pair of belt-like side frames 49 extending in the left-right direction in the figure and are integrally connected to the side frames 49. It has a configuration. However, the plurality of leads 4 are divided into a plurality of sets G1, G2, G3... So that nine leads 4 corresponding to one module are one set, and the plurality of sets are appropriate in a certain direction. It becomes the structure arranged at intervals. A cross member 48 that connects the pair of side frames 49 is provided between each pair of the plurality of leads 4. The cross member 48 increases the mechanical strength of the manufacturing frame F and helps to stabilize the form of the manufacturing frame F. Wide portions 43 and 50 are formed in each lead 4 and each cross member 48.
[0030]
As shown in FIG. 9, the manufacturing frame F is used in a state in which each lead 4 and each cross member 48 are bent into a substantially U-shaped cross section. These bending positions are, for example, locations indicated by imaginary lines L1 in FIG. A bonding operation of a plurality of LED chips 3 and a plurality of wires W is performed at predetermined positions on each lead 4.
[0031]
Next, as shown in FIG. 10, the case 1 </ b> A is placed upside down with respect to the posture shown in FIGS. 1 to 3, and the liquid resin 2 is filled in the case 1 </ b> A. A part of each of the predetermined number of leads 4 collected as a predetermined set and a predetermined number of LED chips 3 corresponding thereto are immersed. At that time, by closing the openings 10a and 10b of the case 1A, the resin 2 is prevented from flowing out from this portion. When a part of each lead 4 is immersed in the resin 2, as indicated by an arrow N 1, a part of the resin 2 may rise up the protruding portion 4 b of each lead 4 toward the tip. When the manufacturing frame F is formed by etching, the side surface of each lead 4 becomes an etching surface, and this side surface may be formed in a concave groove shape. In such a case, due to capillary action A part of the resin 2 rises along the side surface of each lead 4. On the other hand, since the wide portion 42 is provided in the protruding portion 4 b of each lead 4, the rise of the resin 2 described above is appropriately stopped by the wide portion 42. Therefore, it can prevent appropriately that the protrusion part 4b is covered with resin over a large area. This helps to prevent the surface mounting terminal portions 40 of the display device A1 from being unduly covered with the resin 2 and to improve the adhesion of the solder to the portions.
[0032]
Thereafter, the resin 2 is heated and cured, and then, for example, a cutting operation for cutting each lead 4 at a position indicated by a virtual line L2 in FIG. 10 and each lead 4 are arranged in the shape shown in FIGS. Forming is performed. Thereby, the display device A1 having the above-described configuration is obtained. Since the manufacturing frame F has a plurality of sets of leads each having a predetermined number, the above-described series of operations are continuously performed by transporting the manufacturing frame F in the longitudinal direction, and a plurality of display devices A1 can be produced efficiently.
[0033]
Next, a method for manufacturing the display device A2 will be described. Even in this case, the manufacturing frame F described above is used. As shown in FIG. 9, the manufacturing frame F is bent into a U-shaped cross section, and the bonding operation of the plurality of LED chips 3 and the plurality of wires W is performed at predetermined positions on each lead 4. This is the same as the case of manufacturing the display device A1.
[0034]
However, as shown in FIG. 11, case 1B is used as the case. Further, when the plurality of leads 4 of the manufacturing frame F are immersed in the resin 2 filled in the case 1B, a part of each of the two pairs of leads 4 is immersed. At that time, a predetermined number of LED chips 3 corresponding to the leads 4 and a part of the cross member 48 between the two sets of leads 4 are also immersed in the resin 2. Similarly to the widened portion 42 of each lead 4, the widened portion 50 of the cross member 48 also serves to prevent a part of the resin 2 from rising. Therefore, it is also possible to appropriately avoid that a wide range of the cross member 48 protruding from the resin 2 is covered with the resin. After housing the leads 4 in the case 1B, the resin 2 is cured, and the leads 4 and the cross member 48 are cut and formed. Thereby, the display device A2 can be manufactured. The cross member 48 is made into the dummy electrode 5 by the said cutting | disconnection and forming process.
[0035]
In the manufacturing method described above, the manufacturing frame F having the same configuration is used for both the display devices A1 and A2. Therefore, for example, as compared with the case where the display devices A1 and A2 are manufactured using manufacturing frames having different configurations, the manufacturing cost of the display devices can be reduced.
[0036]
Each of the display devices A1 and A2 can be surface-mounted at a desired location using a solder reflow technique, and power is supplied to the plurality of LED chips 3 via the terminal portions 40 of the plurality of leads 4. By selectively performing, it is possible to selectively display numbers from 0 to 9 and to display on / off of the accompanying dots. When the LED chip 3 is caused to emit light, a part of the light emitted from the LED chip 3 is reflected toward the front surface of the display device A1 with a high reflectance by the peripheral wall surfaces of the windows 10a and 10b of the case 1A. It is possible to make the display brighter.
[0037]
In the display device A2, when the display device A2 is surface-mounted at a desired location, the dummy electrode 5 can be soldered to the desired location in the same manner as the surface mounting terminal portion 40. In this way, it is possible to increase the soldering area and increase the mounting strength of the display device A2. The dummy electrode 5 can also have a function as a heat radiating plate that releases heat generated by the plurality of LED chips 3 to the outside.
[0038]
The present invention is not limited to the embodiment described above. The specific configuration of each work process in the method for manufacturing a semiconductor device according to the present invention can be variously changed. Similarly, the specific configuration of each part of the semiconductor device according to the present invention can be modified in various ways.
[0039]
For example, as shown in FIG. 12, the case 1 </ b> C constituting the display device A <b> 3 for displaying a two-digit number is provided with two partition walls 11 a at the center in the width direction. And a pair of side walls 11 of the case 1 </ b> C provided with two housing spaces 19 may be used. Each of these two accommodation spaces 19 can be configured such that a plurality of leads 4 and LED chips 3 for displaying one number and a dot are individually accommodated. According to such a configuration, it is not always necessary to fill the resin 2 between the pair of partition walls 11a, and the amount of the resin 2 used can be reduced.
[0040]
It is not always necessary to provide the widened portion in the manufacturing frame. In addition, the dummy electrode may be provided as necessary, and the dummy electrode may be omitted. The present invention can be applied not only to a display device that can display two-digit numbers, but also to a display device that can display, for example, three-digit numbers or more digits, and a method for manufacturing the same.
[0041]
The semiconductor device according to the present invention is not limited to an 8-segment type or 7-segment type display device. For example, it may be configured as a light emitting device configured to illuminate a predetermined portion by emitting light emitted from an LED to the outside of the case, or may be configured as a semiconductor device of a different type from a display device or a light emitting device. You can also. Therefore, the specific type and number of semiconductor elements referred to in the present invention are not limited, and the specific number of leads and the specific shape of the case are not limited.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating an example of a semiconductor device configured as a display device.
2 is a cross-sectional view taken along the line II-II in FIG.
3 is a cross-sectional view taken along the line III-III in FIG.
4 is a plan sectional view of the semiconductor device shown in FIG. 1. FIG.
FIG. 5 is a perspective view showing another example of a semiconductor device configured as a display device.
6 is a cross-sectional view taken along line VI-VI in FIG.
7 is a plan sectional view of the semiconductor device shown in FIG. 5;
FIG. 8 is a main part front view showing an example of a manufacturing frame used for manufacturing a semiconductor device;
9A is a principal part front view showing one step of a method of manufacturing a semiconductor device, and FIG. 9B is a sectional view taken along line IX-IX in FIG. 9A;
10 is a cross-sectional view showing a step of the method of manufacturing the semiconductor device shown in FIG.
11 is a cross-sectional view showing a step of the method of manufacturing the semiconductor device shown in FIG.
FIG. 12 is a cross-sectional view showing another example of a semiconductor device according to the present invention.
FIGS. 13A and 13B are perspective views showing a specific example of a conventional semiconductor device. FIGS.
14A is a side view showing an example of a conventional method for manufacturing a semiconductor device, and FIG. 14B is a sectional view taken along line XIV-XIV in FIG. 14A;
FIG. 15 is a side view showing another example of a conventional method for manufacturing a semiconductor device.
[Explanation of symbols]
A1, A2 display device (semiconductor device)
F Manufacturing frame 1A, 1B Case 2 Resin 3 LED chip (semiconductor element)
4 Lead 5 Dummy electrode 48 Cross member 49 Side member

Claims (4)

A semiconductor element is mounted on a manufacturing frame in which a plurality of leads are divided into a plurality of groups each having a predetermined number and arranged in a certain direction, and the semiconductor element and the plurality of leads are electrically connected. 1 process,
A second step of housing and fixing each part of the semiconductor element and a plurality of leads electrically connected to the semiconductor element;
A third step of separating a plurality of leads partially contained in the case from other parts of the manufacturing frame by cutting the manufacturing frame;
A method for manufacturing a semiconductor device, comprising:
As the above case, first and second cases having different sizes are prepared, and
When manufacturing a semiconductor device corresponding to one module, the plurality of leads are accommodated in one set in the first case in the second step,
When manufacturing a semiconductor device corresponding to a plurality of modules, a plurality of sets of the plurality of leads are collectively accommodated in the second case in the second step.   A cross member for connecting the pair of side frames of the manufacturing frame is provided between each pair of the plurality of leads of the manufacturing frame, and the cross member protrudes from the inside of the case to the outside. The manufacturing method of the semiconductor device of Claim 1 which has the process formed as an electrode. The method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor element is a light emitting element. 4. The method of manufacturing a semiconductor device according to any one of claims 1 to 3, wherein the second case is one having a partition wall for partitioning into a plurality of housing spaces.

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