JP4585035B2 - 流量比率制御装置 - Google Patents
流量比率制御装置 Download PDFInfo
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- JP4585035B2 JP4585035B2 JP2009547988A JP2009547988A JP4585035B2 JP 4585035 B2 JP4585035 B2 JP 4585035B2 JP 2009547988 A JP2009547988 A JP 2009547988A JP 2009547988 A JP2009547988 A JP 2009547988A JP 4585035 B2 JP4585035 B2 JP 4585035B2
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- Prior art keywords
- flow rate
- flow
- control device
- pressure sensor
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Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2496—Self-proportioning or correlating systems
- Y10T137/2514—Self-proportioning flow systems
- Y10T137/2521—Flow comparison or differential response
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2496—Self-proportioning or correlating systems
- Y10T137/2514—Self-proportioning flow systems
- Y10T137/2521—Flow comparison or differential response
- Y10T137/2524—Flow dividers [e.g., reversely acting controls]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2496—Self-proportioning or correlating systems
- Y10T137/2514—Self-proportioning flow systems
- Y10T137/2521—Flow comparison or differential response
- Y10T137/2529—With electrical controller
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7762—Fluid pressure type
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Flow Control (AREA)
Description
すなわち、本発明の流量比率制御装置は、流体が流通する内部流路上に、当該内部流路を流れる流体流量を制御する流量制御バルブ、第1圧力センサ、流体抵抗及び第2圧力センサをこの順で直列に配設してなり、各圧力センサで検知された検知圧力に基づいて前記流体流量を測定可能に構成した差圧式流量制御装置と、前記流量制御装置に指令を与えてこれを制御する制御処理機構と、を具備したものであって、メイン流路の終端から分岐させた複数の分岐流路上に前記流量制御装置をそれぞれ設けておき、一の分岐流路上に設けた流量制御装置については、第2圧力センサが上流側になるように配置するとともに、その第2圧力センサで検知された検知圧力が予め定めた目標圧力となるように該流量制御装置を動作させる一方、他の分岐流路上に設けた流量制御装置については、流量制御バルブが上流側になるように配置するとともに、全ての流量制御装置から出力される測定流量の総量と予め設定した流量比率とから、他の分岐流路上に設けた流量制御装置に流すべき目標流量を前記制御処理機構に算出させ、その目標流量となるように該流量制御装置を動作させることを特徴とする。
また、差圧式の流量制御装置のみを用いているので、この流量比率制御装置に流出入する流体の圧力変化が大きい場合にも、サーマル式の質量流量計を用いた場合に比べて、各分岐流路を流れる流体の質量流量比率を常に高い精度で制御できる。また差圧式の流量制御装置のみを用いていることから、入口側及び出口側が負圧の場合でも質量流量比率をやはり高い精度で制御できる。
L1、L2・・・内部流路
V1、V2・・・流量制御バルブ
P11、P12・・・第1圧力センサ
R1、R2・・・流体抵抗
P21、P22・・・第2圧力センサ
MFC1、MFC2・・・流量制御装置
C・・・制御処理機構
ML・・・メイン流路
BL1、BL2・・・分岐流路
P01、P02・・・初段圧力センサ
例えば、本実施形態では、分岐流路の数は2つであったが、さらに複数の分岐流路が設けられていても構わない。この場合、各分岐流路に設けてある流量制御装置たるマスフローコントローラのうち、1つが圧力を基準として制御するものであればよい。
Claims (2)
- 流体が流通する内部流路上に、当該内部流路を流れる流体流量を制御する流量制御バルブ、第1圧力センサ、流体抵抗及び第2圧力センサをこの順で直列に配設してなり、各圧力センサで検知された検知圧力に基づいて前記流体流量を測定可能に構成した差圧式流量制御装置と、前記流量制御装置に指令を与えてこれを制御する制御処理機構と、を具備したものであって、
メイン流路の終端から分岐させた複数の分岐流路上に前記流量制御装置をそれぞれ設けておき、
一の分岐流路上に設けた流量制御装置については、第2圧力センサが、流量制御バルブ、第1圧力センサ及び流体抵抗よりも上流側になるように配置するとともに、その第2圧力センサで検知された検知圧力が予め定めた目標圧力となるように該流量制御装置を動作させる一方、
他の分岐流路上に設けた流量制御装置については、流量制御バルブが第1圧力センサ、流体抵抗及び第2圧力センサよりも上流側になるように配置するとともに、全ての流量制御装置から出力される測定流量の総量と予め設定した流量比率とから、他の分岐流路上に設けた流量制御装置に流すべき目標流量を前記制御処理機構に算出させ、その目標流量となるように該流量制御装置を動作させるようにしたことを特徴とする流量比率制御装置。 - 流体が流通する内部流路上に、初段圧力センサ、当該内部流路を流れる流体流量を制御する流量制御バルブ、第1圧力センサ、流体抵抗及び第2圧力センサをこの順で直列に配設してなり、前記第1、第2圧力センサで検知された検知圧力に基づいて流体流量を測定可能に構成した差圧式流量制御装置と、前記流量制御装置に指令を与えてこれを制御する制御処理機構と、を具備したものであって、
メイン流路の終端から分岐させた複数の分岐流路上に前記流量制御装置をそれぞれ設けておき、
一の分岐流路上に設けた流量制御装置については、初段圧力センサで検知された検知圧力が予め定めた目標圧力となるように該流量制御装置を動作させる一方、
他の分岐流路上に設けた流量制御装置については、全ての流量制御装置から出力される測定流量の総量と予め設定した流量比率とから、他の分岐流路上に設けた流量制御装置に流すべき目標流量を前記制御処理機構に算出させ、その目標流量となるように該流量制御装置を動作させるようにしたことを特徴とする流量比率制御装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007338257 | 2007-12-27 | ||
JP2007338257 | 2007-12-27 | ||
PCT/JP2008/072828 WO2009084422A1 (ja) | 2007-12-27 | 2008-12-16 | 流量比率制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4585035B2 true JP4585035B2 (ja) | 2010-11-24 |
JPWO2009084422A1 JPWO2009084422A1 (ja) | 2011-05-19 |
Family
ID=40824143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009547988A Expired - Fee Related JP4585035B2 (ja) | 2007-12-27 | 2008-12-16 | 流量比率制御装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100269924A1 (ja) |
JP (1) | JP4585035B2 (ja) |
KR (1) | KR101028213B1 (ja) |
CN (1) | CN101903840B (ja) |
TW (1) | TWI463287B (ja) |
WO (1) | WO2009084422A1 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8397739B2 (en) * | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
JP5562712B2 (ja) * | 2010-04-30 | 2014-07-30 | 東京エレクトロン株式会社 | 半導体製造装置用のガス供給装置 |
US9188989B1 (en) | 2011-08-20 | 2015-11-17 | Daniel T. Mudd | Flow node to deliver process gas using a remote pressure measurement device |
US9958302B2 (en) | 2011-08-20 | 2018-05-01 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
US8920574B2 (en) | 2011-10-21 | 2014-12-30 | Ethicon, Inc. | Instrument reprocessor and instrument reprocessing methods |
US20130255784A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Gas delivery systems and methods of use thereof |
CN103809620B (zh) * | 2012-11-13 | 2017-10-10 | 深圳迈瑞生物医疗电子股份有限公司 | 电子流量控制方法和系统 |
WO2015006777A2 (en) | 2013-07-12 | 2015-01-15 | Karamanos John C | Fluid control measuring device |
US11815923B2 (en) | 2013-07-12 | 2023-11-14 | Best Technologies, Inc. | Fluid flow device with discrete point calibration flow rate-based remote calibration system and method |
JP6193679B2 (ja) * | 2013-08-30 | 2017-09-06 | 株式会社フジキン | ガス分流供給装置及びガス分流供給方法 |
JP6289997B2 (ja) * | 2014-05-14 | 2018-03-07 | 株式会社堀場エステック | 流量センサの検査方法、検査システム、及び、検査システム用プログラム |
CN105576268B (zh) * | 2014-10-08 | 2019-02-15 | 通用电气公司 | 用于控制流量比的系统和方法 |
US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
KR101652469B1 (ko) * | 2015-02-27 | 2016-08-30 | 주식회사 유진테크 | 다중 가스 제공 방법 및 다중 가스 제공 장치 |
US10957561B2 (en) * | 2015-07-30 | 2021-03-23 | Lam Research Corporation | Gas delivery system |
US10883866B2 (en) * | 2015-09-24 | 2021-01-05 | Fujikin Incorporated | Pressure-based flow rate control device and malfunction detection method therefor |
US10192751B2 (en) | 2015-10-15 | 2019-01-29 | Lam Research Corporation | Systems and methods for ultrahigh selective nitride etch |
AT517685B1 (de) * | 2015-11-17 | 2017-04-15 | Avl List Gmbh | Messverfahren und Messvorrichtung zur Ermittlung der Rezirkulationsrate |
CN105443906B (zh) * | 2015-12-29 | 2017-05-24 | 四川港通医疗设备集团股份有限公司 | 一种医用气体终端及医用气路中气体流量的计量方法 |
US10825659B2 (en) | 2016-01-07 | 2020-11-03 | Lam Research Corporation | Substrate processing chamber including multiple gas injection points and dual injector |
US10147588B2 (en) | 2016-02-12 | 2018-12-04 | Lam Research Corporation | System and method for increasing electron density levels in a plasma of a substrate processing system |
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US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US10438833B2 (en) | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US10303189B2 (en) | 2016-06-30 | 2019-05-28 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
US11144075B2 (en) | 2016-06-30 | 2021-10-12 | Ichor Systems, Inc. | Flow control system, method, and apparatus |
US10838437B2 (en) | 2018-02-22 | 2020-11-17 | Ichor Systems, Inc. | Apparatus for splitting flow of process gas and method of operating same |
US10679880B2 (en) | 2016-09-27 | 2020-06-09 | Ichor Systems, Inc. | Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same |
US20180046206A1 (en) * | 2016-08-13 | 2018-02-15 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a process chamber |
US10410832B2 (en) | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
WO2018047644A1 (ja) * | 2016-09-12 | 2018-03-15 | 株式会社堀場エステック | 流量比率制御装置、流量比率制御装置用プログラム、及び、流量比率制御方法 |
US11226641B2 (en) | 2016-10-14 | 2022-01-18 | Fujikin Incorporated | Fluid control device |
US10663337B2 (en) | 2016-12-30 | 2020-05-26 | Ichor Systems, Inc. | Apparatus for controlling flow and method of calibrating same |
JP6884034B2 (ja) * | 2017-05-18 | 2021-06-09 | 東京エレクトロン株式会社 | オゾン用マスフローコントローラの出力検査方法 |
CN118380373A (zh) | 2017-11-21 | 2024-07-23 | 朗姆研究公司 | 底部边缘环和中部边缘环 |
WO2020175959A1 (ko) | 2019-02-28 | 2020-09-03 | 엘지전자 주식회사 | 의류 처리장치 및 그 제어 방법 |
KR102771309B1 (ko) * | 2019-04-25 | 2025-02-24 | 가부시키가이샤 후지킨 | 유량 제어 장치 |
WO2022025017A1 (ja) * | 2020-07-30 | 2022-02-03 | ファナック株式会社 | 加圧流体供給システム |
KR20230150309A (ko) | 2021-03-03 | 2023-10-30 | 아이커 시스템즈, 인크. | 매니폴드 조립체를 포함하는 유체 유동 제어 시스템 |
CN114034472A (zh) * | 2021-06-09 | 2022-02-11 | 上海智能新能源汽车科创功能平台有限公司 | 一种空压机类设备测试流道的构建方法 |
JP2023080611A (ja) * | 2021-11-30 | 2023-06-09 | 株式会社堀場エステック | 流量制御装置、流量制御方法、及び、流量制御装置用プログラム |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003323217A (ja) * | 2002-05-01 | 2003-11-14 | Stec Inc | 流量制御システム |
JP2005038239A (ja) * | 2003-07-16 | 2005-02-10 | Horiba Stec Co Ltd | 流量比率制御装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897818A (en) * | 1994-01-14 | 1999-04-27 | Compsys, Inc. | Method for continuously manufacturing a composite preform |
JP3291161B2 (ja) * | 1995-06-12 | 2002-06-10 | 株式会社フジキン | 圧力式流量制御装置 |
JP3586075B2 (ja) * | 1997-08-15 | 2004-11-10 | 忠弘 大見 | 圧力式流量制御装置 |
US6578435B2 (en) * | 1999-11-23 | 2003-06-17 | Nt International, Inc. | Chemically inert flow control with non-contaminating body |
JP2002110570A (ja) * | 2000-10-04 | 2002-04-12 | Asm Japan Kk | 半導体製造装置用ガスラインシステム |
US6564824B2 (en) * | 2001-04-13 | 2003-05-20 | Flowmatrix, Inc. | Mass flow meter systems and methods |
JP4209688B2 (ja) * | 2001-05-24 | 2009-01-14 | セレリティ・インコーポレーテッド | 決定された比率のプロセス流体を供給する方法および装置 |
US6591850B2 (en) * | 2001-06-29 | 2003-07-15 | Applied Materials, Inc. | Method and apparatus for fluid flow control |
US6766260B2 (en) * | 2002-01-04 | 2004-07-20 | Mks Instruments, Inc. | Mass flow ratio system and method |
CA2474021A1 (en) * | 2002-01-29 | 2003-08-07 | Sit La Precisa S.P.A. | A valve unit for modulating the delivery pressure of a gas |
EP1523701A2 (en) * | 2002-07-19 | 2005-04-20 | Celerity Group, Inc. | Methods and apparatus for pressure compensation in a mass flow controller |
JP4204400B2 (ja) * | 2003-07-03 | 2009-01-07 | 忠弘 大見 | 差圧式流量計及び差圧式流量制御装置 |
JP4421393B2 (ja) * | 2004-06-22 | 2010-02-24 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2008506116A (ja) * | 2004-07-09 | 2008-02-28 | セレリティ・インコーポレイテッド | フロー測定およびマスフロー調整器の検証のための方法およびシステム |
CN201161168Y (zh) * | 2007-11-07 | 2008-12-10 | 天津市奥利达设备工程技术有限公司 | 随动流量混气机 |
-
2008
- 2008-12-16 JP JP2009547988A patent/JP4585035B2/ja not_active Expired - Fee Related
- 2008-12-16 KR KR1020107014984A patent/KR101028213B1/ko active IP Right Grant
- 2008-12-16 US US12/809,836 patent/US20100269924A1/en not_active Abandoned
- 2008-12-16 CN CN2008801217244A patent/CN101903840B/zh not_active Expired - Fee Related
- 2008-12-16 WO PCT/JP2008/072828 patent/WO2009084422A1/ja active Application Filing
- 2008-12-19 TW TW97149698A patent/TWI463287B/zh not_active IP Right Cessation
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2012
- 2012-01-12 US US13/348,745 patent/US20120174990A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003323217A (ja) * | 2002-05-01 | 2003-11-14 | Stec Inc | 流量制御システム |
JP2005038239A (ja) * | 2003-07-16 | 2005-02-10 | Horiba Stec Co Ltd | 流量比率制御装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101028213B1 (ko) | 2011-04-11 |
JPWO2009084422A1 (ja) | 2011-05-19 |
US20100269924A1 (en) | 2010-10-28 |
KR20100098431A (ko) | 2010-09-06 |
WO2009084422A1 (ja) | 2009-07-09 |
CN101903840A (zh) | 2010-12-01 |
TWI463287B (zh) | 2014-12-01 |
CN101903840B (zh) | 2012-09-05 |
TW200938979A (en) | 2009-09-16 |
US20120174990A1 (en) | 2012-07-12 |
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