JP4580636B2 - Film forming apparatus and film forming method - Google Patents

Description

  The present invention relates to a film forming apparatus and a film forming method, and more particularly, to a film forming apparatus that uses both vacuum film forming and coating film forming, and a film forming method for forming a functional film that exhibits a desired function.

Conventionally, as a functional film having high industrial utility value, a colored film, a light shielding film, a transparent film, a translucent film, a high reflection film, an antireflection film, an optical interference film, a high brightness film, a conductive film, an insulating film, and a passivation film Membranes, gas barrier membranes, gas permselective membranes, protective membranes, hard membranes, high-density membranes, release membranes, averaging membranes, roughened membranes, etc. have been used, and functional membranes that have multiple functions are also used Has been. Such a functional film is formed by a coating method (hereinafter referred to as “coating method”) in which a film is formed by material coating in the air, or a vacuum film forming method (hereinafter referred to as “vacuum film forming”) in which a film is formed in a vacuum. Law).
In recent years, due to the need for higher functionality, it has become necessary to form functional films using these coating methods and vacuum film-forming methods in combination. For example, a resin layer having an alicyclic hydrocarbon skeleton bis (meth) acrylate, a mercapto compound, and a monofunctional (meth) acrylate is formed by a coating method, and heat resistance, mechanical strength, particularly impact resistance is used as a base material. A manufacturing method is known in which a gas barrier property is enhanced by applying an inorganic vapor deposition film made of SiO ₂ and then applying the film (Patent Document 1).

Moreover, in order to improve the film-forming quality by the coating method, the spray coating apparatus (patent documents 2-3) which atomizes the coating material, and the rotary spray coating apparatus (patent documents 4-6) It has been known.
JP-A-11-222508 U.S. Pat. No. 4,776,520 U.S. Pat. No. 4,899,936 U.S. Pat. No. 4,405,086 U.S. Pat. No. 4,550,058 JP-A-6-91205

However, in the manufacturing method disclosed in Patent Document 1, since the two types of film forming environments are greatly different, the film forming process by the vacuum film forming method and the film forming process by the coating method are performed separately. For this reason, particles and foreign substances adhere to the film formation surface, the film formation material reacts with oxygen in the atmosphere and is oxidized, or adsorbs moisture, resulting in deterioration in film quality and production efficiency. There was a problem.
Moreover, in the apparatus which atomizes the coating material currently disclosed by patent documents 2-6, the atomized coating material is easy to be influenced by an air current, for example, when coating to a large area When the air flow distribution is poor, there is a problem that the supply amount of the coating material is not uniform, and a uniform film thickness and film quality cannot be obtained.
The present invention has been made in view of the above circumstances, and a film forming apparatus capable of uniform film formation by combining vacuum film formation and coating film formation under reduced pressure, and a desired one. An object of the present invention is to provide a film forming method for stably forming the functional film.

In order to achieve such an object, the present invention provides a film forming apparatus for forming multi-layers on individual plate-shaped deposition target bodies, and includes at least one vacuum film forming chamber and the vacuum film forming chamber. An exhaust pump for depressurization, at least one coating film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the vacuum film forming chamber and the coating film forming chamber. And a transport mechanism capable of transporting the film formation body under reduced pressure , the coating film formation chamber includes a stage for placing the film formation body, and spray coating as a coating apparatus. And at least one of a coating apparatus and a rotary spray coating apparatus, and an exhaust port positioned in a direction parallel to the film formation surface of the film formation body, or opposite to the film formation surface of the film formation object It was so that the configuration includes an exhaust port located on the side.
The present invention relates to a film forming apparatus for forming multiple layers on individual three-dimensionally shaped film-forming bodies, at least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, and at least one One film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the object to be formed can be transferred between the vacuum film forming chamber and the coating film forming chamber under a reduced pressure condition. A transfer mechanism, and the coating film forming chamber includes a stage for placing the film formation target, and at least of a spray coating device and a rotary spray coating device as a coating device. 1 type is provided, and the exhaust port located on the opposite side of the coating head of the coating apparatus through the film-forming body, or the opposite surface side of the stage on which the film-forming body is placed It was set as the structure provided with the exhaust port located.
As a preferred embodiment of the present invention, the vacuum film forming chamber and the coating film forming chamber are configured as independent film forming chambers connected in series through means for maintaining a pressure difference between the two chambers. did.
As a preferred embodiment of the present invention, the vacuum film forming chamber and / or the coating film forming chamber is provided with a processing chamber equipped with at least one of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device. The configuration is as shown.

Further, as a preferred aspect of the present invention, the processing chamber is isolated by the vacuum film forming chamber, the coating film forming chamber and a partition plate, and is configured to include an exhaust pump for decompressing the processing chamber. .
Moreover, as a preferable aspect of the present invention, the transport mechanism includes at least one of a conveyor, a lift, and a hand for transporting individual film formation objects.
The present invention relates to a film forming apparatus for forming a multi-layer film on a long film-forming body, at least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, and at least one vacuum film forming chamber. The film forming body can be transported between the coating film forming chamber, the exhaust pump for depressurizing the coating film forming chamber, and the vacuum film forming chamber and the coating film forming chamber under reduced pressure conditions. A transport mechanism, wherein the transport mechanism has a plurality of rolls for transporting the film formation target, and the vacuum film formation chamber and the coating film formation chamber are transport paths for the film formation target. The coating film forming chamber includes at least one of a spray coating device and a rotary spray coating device as a coating device, and is provided downstream in the transport direction of the film-forming body or It was set as the structure provided with the exhaust port located in an upstream.
The present invention relates to a film forming apparatus for forming a multi-layer film on a long film-forming body, at least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, and at least one vacuum film forming chamber. The film forming body can be transported between the coating film forming chamber, the exhaust pump for depressurizing the coating film forming chamber, and the vacuum film forming chamber and the coating film forming chamber under reduced pressure conditions. A transport mechanism, wherein the transport mechanism has a plurality of rolls for transporting the film formation target, and the vacuum film formation chamber and the coating film formation chamber are transport paths for the film formation target. The coating film forming chamber includes at least one of a spray coating apparatus and a rotary spray coating apparatus as a coating apparatus, and is provided on the film forming surface side of the film forming body. An exhaust port positioned, and a current plate between the exhaust port and the coating head of the coating apparatus It was such as provided configuration.
Further, as a preferred embodiment of the present invention, a heat source, an ultraviolet irradiation device, an electron beam irradiation device, a plasma irradiation device is provided downstream of the vacuum film formation chamber and / or the coating film formation chamber in the transport direction of the film formation target. It was set as the structure where the process chamber provided with at least 1 type of is arrange | positioned.

Further, as a preferred aspect of the present invention, the processing chamber is isolated by the vacuum film forming chamber, the coating film forming chamber and a partition plate, and is configured to include an exhaust pump for decompressing the processing chamber. .
Moreover, as a preferable aspect of the present invention, the vacuum film forming chamber, the coating film forming chamber, and the processing chamber are arranged in this order along the transport path of the film formation target.
As a preferred aspect of the present invention, the vacuum film forming chamber includes a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam film forming apparatus, and a plasma CVD film forming apparatus. The plasma polymerization film forming apparatus, the thermal CVD film forming apparatus, and the catalytic reaction type CVD film forming apparatus are provided.

The present invention relates to a film forming method for forming a functional film that exhibits a desired function, in which a film is formed by a vacuum film forming method and a coating film forming method under a reduced pressure condition on an object to be formed. perform layer deposition comprising a film, and the film formation target object from the start to the completion of the deposition-out location to the reduced pressure condition, the film formation by the coating film-forming method, a spray coating method or rotating spray coating The construction method is such that the residence time and the residence amount of the coating material are controlled by utilizing the air flow generated in the coating film forming chamber by the operation of the exhaust pump for reducing the pressure .
As a preferred embodiment of the present invention, the deposited material is cured using at least one of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device, or a solvent or water is removed from the deposited material. A configuration is adopted in which the properties of the formed film are modified or removed.
Further, as a preferred embodiment of the present invention, the film formation by the vacuum film formation method includes vapor deposition method, sputtering method, ion plating method, ion beam assist method, cluster ion beam method, plasma CVD method, plasma polymerization method, thermal CVD. Or a catalytic reaction type CVD method.

As a preferred embodiment of the present invention, a film is formed by a vacuum film forming method, then a film is formed by a coating film forming method under reduced pressure conditions, and then a film is cured.
As a preferred embodiment of the present invention, the functional film to be formed is a colored film, a light shielding film, a transparent film, a semitransparent film, a high reflection film, an antireflection film, an optical interference film, a high luminance film, a conductive film, or an insulating film. And a functional film having at least one function of a passivation film, a gas barrier film, a gas selective permeable film, a protective film, a hard film, a high-density film, a release film, an averaged film, and a roughened film. .

According to the present invention, the film formation is performed while the deposition target is left under a reduced pressure condition. Therefore, the multilayer film formation includes the film formation by the vacuum film formation method and the film formation by the coating film formation method under the reduced pressure condition. During this process, particles and foreign matter are prevented from adhering to the film formation surface, and the film formation material is prevented from reacting with oxygen in the atmosphere to oxidize the surface and adsorbing moisture, resulting in a high-quality functional film. In addition, it is not necessary to release the pressure to the atmosphere or reduce the pressure again, so that the film can be continuously formed, and the effect of high productivity of the functional film is achieved.
In addition, when spray coating or rotary spray coating is used in coating film formation, film formation is performed using the airflow generated in the coating film formation chamber by the operation of an exhaust pump for depressurizing the coating film formation chamber. The residence time and the residence amount of the material can be controlled, and more uniform and high-quality film formation is possible.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Film deposition system]
FIG. 1 is a schematic configuration diagram showing an embodiment of a film forming apparatus of the present invention. In FIG. 1, the film forming apparatus 1 includes a deposition target stock chamber 3, a vacuum film forming chamber 4, a coating film forming chamber 6, and a processing chamber 7. The film forming material stock chamber 3 and the vacuum film forming chamber 4 are connected through a gate valve 8, and the vacuum film forming chamber 4 and the coating film forming chamber 6 are connected through a gate valve 9.

  An exhaust pump 12 for depressurizing the inside is connected to the deposition target material stock chamber 3 via a pressure adjusting valve 13. In addition, a means (not shown) for stocking a plurality of plate-like film-forming bodies S is provided inside the film-forming body stock chamber 3. Such means is not particularly limited as long as it does not damage the film formation surface of the film formation target S. For example, a plurality of shelves for holding the film formation target S on the lower surface A plurality of claw members for holding the film-forming body S between the side surfaces, a screw-type engagement mechanism disposed between the film-forming body S and the film-forming body stock chamber 3, and a hook A hook mechanism using a vacuum, a vacuum (vacuum) adsorption mechanism, or the like can be used.

An exhaust pump 14 for depressurizing the inside is connected to the vacuum film formation chamber 4 via a pressure adjusting valve 15, and the film formation target S is placed inside the vacuum film formation chamber 4. The stage 21 is disposed. An external film-forming power source 22 is connected to a film-forming target 24 in the vacuum film-forming chamber 4, and a process gas supply port 25 is provided in the vacuum film-forming chamber 4.
An exhaust pump 16 for depressurizing the inside is connected to the coating film forming chamber 6 via a pressure regulating valve 17, and the film formation target S is placed inside the coating film forming chamber 6. A stage 31 is provided for this purpose. An external coating material supply device 32 is connected to the coating head 33 in the coating film forming chamber 6. The coating film forming chamber 6 is provided with a processing chamber 7 via a partition plate 45, and a stage 41 for mounting the film-forming body S inside the processing chamber 7 and a processing apparatus. 42 is disposed.

In the film forming apparatus 1, the individual film forming bodies S are placed under reduced pressure between the film forming body stock chamber 3, the vacuum film forming chamber 4, the coating film forming chamber 6, and the processing chamber 7. A transport mechanism is provided for transport by The transport mechanism includes a conveyor for placing and transporting the deposition target S, a lift for holding and transporting the lower surface of the deposition target S, a hand for gripping and transporting a part of the deposition target S, and a transport target. A screw-type engagement mechanism disposed between the film-deposited body S and the transfer device, a hook mechanism using a hook hook, an arm mechanism having a reduced pressure (vacuum) adsorption mechanism, and the like can be used. Also good.
For example, the deposition target S is transported from the deposition target stock chamber 3 to the vacuum deposition chamber 4 via the gate valve 8, and the coating deposition chamber is transferred from the vacuum deposition chamber 4 via the gate valve 9. The deposition target S is transported to the hand 6 by hand, and the deposition target S in the vacuum deposition chamber 4, the coating deposition chamber 6 and the processing chamber 7 is transported by a conveyor. it can. In this case, in the illustrated example, the stages 21 and 31 (41) can be used as a conveyor.

Further, the deposition target S may be transported by being mounted on a transport carrier (jig) that can be transported without damaging the deposition surface. In this case, the mounting surface side of the film formation target S may be transported while being held by a transport carrier. For example, the film formation target S may correspond to the groove of the transport carrier (corresponding to the shape of the film formation target S). Or can be held on the carrier for transportation by adhesion or adsorption.
In the film forming apparatus 1, the vacuum film forming chamber 4 includes a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam film forming apparatus, a plasma CVD film forming apparatus, It is provided with at least one of a plasma polymerization film forming apparatus, a thermal CVD film forming apparatus, and a catalytic reaction type CVD film forming apparatus, and is not limited to the illustrated example.

  Moreover, in the film-forming apparatus 1, although there is no restriction | limiting in particular in the coating apparatus containing the coating head 33 provided in the coating film-forming chamber 6, It has either a spray coating apparatus or a rotary spray coating apparatus. Is preferred. In the present invention, when the inside of the coating film forming chamber 6 is depressurized by the exhaust pump 16, by adjusting the exhaust capacity with the pressure adjusting valve 17 or appropriately setting the position and size of the exhaust port, spray coating or rotation The airflow generated in the coating film-forming chamber 6 can be controlled so that the retention time and amount of the film-forming material optimal for spray coating can be obtained. Therefore, uniform coating can be performed on the entire surface of the film formation target S using a spray coating device or a rotary spray coating device. The exhaust port is, for example, arranged in a substantially horizontal direction (for example, arranged in each of four directions) with the film formation surface of the film formation target S, or disposed on the opposite side of the film formation surface of the film formation target S. can do.

  A conventionally known rotary spray coating apparatus can be used as the rotary spray coating apparatus. In general, a rotary spray coating apparatus is provided with a disk or bell-shaped rotary cup mechanism at the tip, and supplies a coating material to an internal liquid reservoir of a rotary cup rotating at a high speed of about 10,000 to 40,000 rpm. The coating material supplied to the rotating cup rotating at high speed is supplied to the peripheral part of the rotating cup by centrifugal force, and sprayed (atomized) when the coating material leaves the peripheral part, and changes to spray particles. The sprayed coating material is scattered by a centrifugal force in a direction perpendicular to the rotation axis of the rotating cup. Usually, the scattering direction of the coating material is changed to the film formation direction. As this direction changing method, for example, an exhaust pump 16 installed in the coating film forming chamber 6 is evacuated while being controlled by a pressure adjusting valve 17, and further, gas is supplied from the rear of the rotary spray coating apparatus. Thus, there is a method for creating a flow in the direction of the film formation target.

The processing chamber 7 of the film forming apparatus 1 hardens the material formed on the film formation target S, removes the solvent or water from the formed material, and modifies film characteristics such as wettability. It is for the purpose. The processing apparatus 42 disposed in the processing chamber 7 can be, for example, one type or a combination of a heat source, an ultraviolet irradiation apparatus, an electron beam irradiation apparatus, and a plasma irradiation apparatus.
Further, the partition plate 45 that separates the coating film forming chamber 6 and the processing chamber 7 prevents the coating material from diffusing from the coating film forming chamber 6 to the processing chamber 7 and contaminating the processing chamber 7. It is intended to prevent unnecessary heat and electromagnetic waves from being supplied and irradiated to the coating film forming chamber 6. In addition, when the process pressure (reduced pressure state) in the coating film forming chamber 6 and the processing chamber 7 is different, the partition plate 45 can have a structure capable of applying a pressure difference between the two chambers. In particular, when it is necessary to increase the pressure difference between the coating film forming chamber 6 and the processing chamber 7, a differential exhaust mechanism is provided in the partition plate 45, or both chambers are completely separated via a gate valve. However, it is possible to provide an exhaust pump and a pressure adjusting valve for reducing the pressure in the processing chamber 7 independently.

  The gate valves 8 and 9 constituting the coating apparatus 1 maintain the pressure difference between the two chambers connected via the gate valve, and are opened when the pressure difference is almost eliminated. For example, a square gate valve or a gate valve (for high vacuum or ultra-high vacuum) manufactured by SK Kaybakyu Engineering Co., Ltd. can be used. Further, in the present invention, the means for maintaining the pressure difference between the two chambers provided continuously is not limited to the gate valve as described above, and other means can be used. For example, as shown in FIG. 2, a forcible chamber C that can be evacuated by a pump P different from the two chambers is disposed so as to face each other so as to provide a passage T for allowing the film formation target S to pass therethrough. As shown in FIG. 3, it is also possible to use a means based on an exhaust system, or a means based on a conductance system in which a film-to-be-film-formed body S can pass between both chambers as long as possible and has a long passage T. . The same applies to later-described embodiments.

The stages 21, 31, and 41 may be capable of heating or cooling the placed film formation target S to obtain an optimum temperature for film formation or processing. In this case, the stage is provided with a mechanism for supplying and circulating a heat medium, a refrigerant, etc. inside the stage, provided with a heater wire for heating, a window provided with a quartz plate at the lower part of the stage, and an infrared ray inside the stage. These stages can be equipped with heaters, and these stages can be heated or cooled. In order to increase the temperature adjustment accuracy of the stage, a thermocouple may be provided on the stage, and heating and cooling may be performed while controlling the temperature based on the temperature information.
The film formation in the vacuum film formation chamber 4 and the coating film formation chamber 6 and the process in the processing chamber 7 may be performed in a state where the deposition target S is stopped or in a transport state. .

In such a film forming apparatus 1 of the present invention, the film-forming body S is transferred from the film-forming body stock chamber 3 to the vacuum film-forming chamber 4 to perform vacuum film formation, and thereafter, is applied to the coating film-forming chamber 6. The coating film is formed under reduced pressure, and then a desired process is performed on the film under reduced pressure in the processing chamber 7, and then the deposition target S is transported to the deposition target stock chamber 3. And then return. Therefore, in the film forming apparatus 1 of the present invention, it is possible to perform the film formation from the start to the completion while keeping the film formation target S under the reduced pressure condition. The order of vacuum film formation in the vacuum film formation chamber 4 and coating film formation in the coating film formation chamber 6 may be reversed, or two or more film formations may be performed using the same film formation means. You may go.
In addition, the arrangement order of the vacuum film formation chamber 4, the coating film formation chamber 6, and the processing chamber 7 in the film formation apparatus 1 of the present invention is an example, and these chambers can be arranged in an arbitrary order. Further, the film formation target S that can be formed by the film forming apparatus 1 of the present invention may be a film, a plate-like body, or various molded products made of an inorganic material, an organic material, an inorganic-organic composite material, or the like. There is no particular limitation.

FIG. 4 is a schematic configuration diagram showing another embodiment of the film forming apparatus of the present invention. In FIG. 4, a film forming apparatus 51 includes a film forming body winding chamber 53, a vacuum film forming chamber 54, a processing chamber 55, a coating film forming chamber 56, and a processing chamber 57 in a chamber 52. Further, the long film-forming body S is unwound from the unwinding part 53 a of the film-forming body winding chamber 53, and the vacuum film-forming chamber 54, the processing chamber 55, the coating film-forming chamber 56 and the processing chamber 57 are arranged. A transport mechanism 65 for winding the film formation target S that has passed through the winding unit 53b is provided.
The transport mechanism 65 includes an unwinding roller 66, a plurality of guide rollers 67, a drum 68, and a winding roller 69. The vacuum film forming chamber 54, the processing chamber 55, the coating film forming chamber 56, and the processing chamber 57 are arranged along the transport path of the film formation target S transported on the rotating drum 68.

In the film forming body winding chamber 53, an exhaust pump 61a is connected to the unwinding portion 53a side via a pressure adjustment valve 62a, and an exhaust pump 61b is connected to the winding portion 53b side via a pressure adjustment valve 62b. ing. In addition, an unwinding roller 66, a plurality of guide rollers 67, and a winding roller 69 that constitute the transport mechanism 65 are disposed inside the film formation body winding chamber 53.
The vacuum film formation chamber 54 is separated from the film formation body winding chamber 53 by the partition plate 71, and in the transport path of the film formation body S transported on the drum 68, the film formation body winding chamber 53. It arrange | positions in the downstream of the unwinding part 53a. An exhaust pump 72 for reducing the pressure inside the vacuum film forming chamber 54 is connected via a pressure adjusting valve 73. An external film-forming power source 74 is connected to a film-forming target 75 in the vacuum film-forming chamber 54, and a process gas supply port 76 is provided in the vacuum film-forming chamber 54. It is possible to perform vacuum film formation on the film formation target S conveyed on the surface 68.

The processing chamber 55 is separated from the vacuum film formation chamber 54 by the partition plate 81 and is disposed on the downstream side of the vacuum film formation chamber 54 in the transfer path of the film formation target S transferred on the drum 68. . An exhaust pump 82 for decompressing the inside is connected to the processing chamber 55 via a pressure adjusting valve 83, and the film of the film formation target S transported on the drum 68 is inside the processing chamber 55. A processing device 84 is provided for processing the surface.
The coating film forming chamber 56 is separated from the processing chamber 55 by the partition plate 91 and is disposed on the downstream side of the processing chamber 55 in the transport path of the film formation target S transported on the drum 68. An exhaust pump 92 for reducing the pressure inside the coating film forming chamber 56 is connected via a pressure adjusting valve 93. In addition, an external coating material supply device 94 is connected to the coating head 95 in the coating film forming chamber 56, and coating film formation on the film formation target S conveyed on the drum 68 is possible. It is said that.

The processing chamber 57 is separated from the coating film forming chamber 56 by the partition plate 85, is isolated from the film forming member winding chamber 53 by the partition plate 89, and is transported on the drum 68. In the transport path of S, it is arranged on the downstream side of the coating film forming chamber 56. An exhaust pump 86 for depressurizing the inside is connected to the processing chamber 57 via a pressure adjusting valve 87, and the film of the deposition target S transported on the drum 68 is inside the processing chamber 57. A processing device 88 is provided for processing the surface.
In the film forming apparatus 51, the vacuum film forming chamber 54 includes a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam film forming apparatus, a plasma CVD film forming apparatus, It is provided with at least one of a plasma polymerization film forming apparatus, a thermal CVD film forming apparatus, and a catalytic reaction type CVD film forming apparatus, and is not limited to the illustrated example.

  Moreover, in the film-forming apparatus 51, although there is no restriction | limiting in particular in the coating apparatus containing the head 95 for coating provided in the coating film-forming chamber 56, It has either a spray coating apparatus or a rotary spray coating apparatus. Is preferred. In the present invention, when the inside of the coating film forming chamber 56 is depressurized by the exhaust pump 92, by adjusting the exhaust capacity by the pressure adjusting valve 93 or by appropriately setting the position and size of the exhaust port, spray coating or rotation The air flow generated in the coating film forming chamber 56 can be controlled so that the retention time and amount of the film forming material optimal for spray coating can be obtained. Therefore, uniform coating can be performed on the entire surface of the film formation target S using a spray coating device or a rotary spray coating device. The position of the exhaust port can be on the downstream side or the upstream side in the transport direction of the film formation target S so that the coating liquid is uniformly supplied to the surface of the film formation target S. Further, as shown in FIG. 5, a rectifying plate 97 may be disposed between the coating head 95 and the exhaust port 96. Note that one or a plurality of coating heads 95 may be provided, and one coating head may be reciprocated in the width direction of the drum 68.

  The processing chamber 55 of the film forming apparatus 51 is intended to modify film characteristics such as wettability of the material deposited on the deposition target S in the vacuum film forming chamber 54. The processing device 84 disposed in 55 can be, for example, a heat source, an ultraviolet irradiation device, an electron beam irradiation device, a plasma irradiation device, or a combination thereof. Further, the processing chamber 57 of the film forming apparatus 51 cures the material formed on the film formation target S in the coating film forming chamber 56, removes the solvent or water from the formed material, The purpose is to modify film properties such as property. The processing device 88 disposed in the processing chamber 57 can be, for example, one type or a combination of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device.

Further, the partition plates 71, 81, 85, 89, 91 for isolating each chamber of the film forming body winding chamber 53, the vacuum film forming chamber 54, the processing chamber 55, the coating film forming chamber 56, and the processing chamber 57 are: This prevents the coating material from being diffused and contaminated between adjacent chambers, or supplying and irradiating unnecessary heat and electromagnetic waves. In addition, the partition plate can have a structure capable of applying a pressure difference between the two chambers. In particular, when the pressure difference needs to be increased, a differential exhaust mechanism is provided on the partition plate. Can do.
The drum 68 constituting the transport mechanism 65 of the film forming apparatus 51 may be capable of heating or cooling the film formation target S transported on the drum 68. The film formation in the vacuum film formation chamber 54 and the coating film formation chamber 56 and the processing in the processing chambers 55 and 57 are performed in a state where the drum 68 is stopped and the film formation target S is stopped, or in a transport state. Any of these may be performed.

In such a film forming apparatus 51 of the present invention, the long film-formed body S unwound from the unwinding portion 53a of the film-forming body winding chamber 53 is transported on the drum 68 and vacuum-formed. A vacuum film formation is performed in the film chamber 54, a desired process is performed in the processing chamber 55 under a reduced pressure, and then a coating film formation is performed in the coating film forming chamber 56 under a reduced pressure. A desired process is performed under reduced pressure at 57 to complete the film formation, and then the film formation target S can be wound up by the winding unit 53b. Therefore, in the film forming apparatus 51 of the present invention, it is possible to perform the film formation from the start to the completion while keeping the film formation target S under reduced pressure. Note that one processing of the processing chamber 55 and the processing chamber 57 may be omitted.
The arrangement order of the vacuum film forming chamber 54, the processing chamber 55, the coating film forming chamber 56, and the processing chamber 57 in the film forming apparatus 51 of the present invention is an example, and these chambers may be arranged in an arbitrary order. it can.

FIG. 6 is a schematic configuration diagram showing another embodiment of the film forming apparatus of the present invention. In FIG. 6, a film forming apparatus 101 includes a film forming body winding chamber 103, a vacuum film forming chamber 104, a processing chamber 105, a coating film forming chamber 106, and a processing chamber 107 in a chamber 102. Further, the long film-forming body S is unwound from the unwinding portion 103a of the film-forming body winding chamber 103, and the vacuum film-forming chamber 104, the processing chamber 105, the coating film-forming chamber 106, and the processing chamber 107 are arranged. A transport mechanism 115 for winding the film formation target S that has passed through the winding unit 103b is provided.
The transport mechanism 115 includes an unwinding roller 116, a plurality of guide rollers 117, a plurality of drums 118A, 118B, 118C, 118D, and a winding roller 119. The film formation target S unwound from the unwinding roller 116 is sequentially transported on the drums 118A, 118B, 118C, and 118D via the guide roller 117, and is wound on the winding roller 119, and is formed in a vacuum film forming chamber. 104, the processing chamber 105, the coating film forming chamber 106, and the processing chamber 107 are arranged along the transport path of the film formation target S.

An exhaust pump 111 is connected to the film formation body winding chamber 103 via a pressure adjustment valve 112. In addition, an unwinding roller 116, a plurality of guide rollers 117, and a winding roller 119 that constitute the transport mechanism 115 are disposed inside the film formation body winding chamber 103.
The vacuum film formation chamber 104 is separated from the film formation body winding chamber 103 by the partition plate 121, and is formed on the film formation body winding chamber 103 in the transport path of the film formation body S that is transported on the drum 118A. It arrange | positions in the downstream of the unwinding part 103a. An exhaust pump 122 for reducing the pressure inside the vacuum film forming chamber 104 is connected via a pressure adjusting valve 123. An external film-forming power source 124 is connected to a film-forming target 125 in the vacuum film-forming chamber 104, and a process gas supply port 126 is provided in the vacuum film-forming chamber 104. Vacuum deposition can be performed on the deposition target S conveyed on 118A.

The processing chamber 105 is separated from the vacuum film formation chamber 104 by the partition plate 131 and is disposed on the downstream side of the vacuum film formation chamber 104 in the transfer path of the film formation target S that is transferred on the drum 118B. . An exhaust pump 132 for depressurizing the inside is connected to the processing chamber 105 via a pressure adjusting valve 133. Inside the processing chamber 105, a film of the deposition target S transported on the drum 118B. A processing device 134 is provided for processing the surface.
The coating film forming chamber 106 is separated from the processing chamber 105 by the partition plate 141, and is disposed on the downstream side of the processing chamber 105 in the transport path of the film formation target S transported on the drum 118 </ b> C. An exhaust pump 142 for reducing the pressure inside the coating film forming chamber 106 is connected via a pressure adjusting valve 143. In addition, an external coating material supply device 144 is connected to the coating head 145 in the coating film forming chamber 106, and coating film formation can be performed on the deposition target S conveyed on the drum 118C. It is said that.

The processing chamber 107 is separated from the coating film forming chamber 106 by the partition plate 135, is isolated from the film forming material winding chamber 103 by the partition plate 139, and is transported on the drum 118 </ b> D. In the transport path of S, it is arranged on the downstream side of the coating film forming chamber 106. An exhaust pump 136 for reducing the pressure inside is connected to the processing chamber 107 via a pressure adjusting valve 137, and a film of the film formation target S conveyed on the drum 118D is inside the processing chamber 107. A processing device 138 is provided for processing the surface.
In the film forming apparatus 101, the vacuum film forming chamber 104 includes a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam film forming apparatus, a plasma CVD film forming apparatus, It is provided with at least one of a plasma polymerization film forming apparatus, a thermal CVD film forming apparatus, and a catalytic reaction type CVD film forming apparatus, and is not limited to the illustrated example.

  In the film forming apparatus 101, the coating apparatus including the coating head 145 provided in the coating film forming chamber 106 is not particularly limited, but includes either a spray coating apparatus or a rotary spray coating apparatus. Is preferred. In the present invention, when the inside of the coating film forming chamber 106 is depressurized by the exhaust pump 142, by adjusting the exhaust capacity by the pressure adjusting valve 143 or by appropriately setting the position and size of the exhaust port, spray coating or rotation The air flow generated in the coating film forming chamber 106 can be controlled so that the retention time and amount of the film forming material optimal for spray coating can be obtained. Therefore, uniform coating can be performed on the entire surface of the film formation target S using a spray coating device or a rotary spray coating device. The position of the exhaust port can be on the downstream side or the upstream side in the transport direction of the film formation target S so that the coating liquid is uniformly supplied to the surface of the film formation target S. Further, a current plate as shown in FIG. 5 may be disposed between the coating head 145 and the exhaust port. One or a plurality of coating heads 145 may be provided, and one coating head may be reciprocated in the width direction of the drum 118C.

  The processing chamber 105 of the film forming apparatus 101 is intended to modify film characteristics such as wettability of the material formed on the film formation target S in the vacuum film forming chamber 104. The processing apparatus 134 provided in 105 can be, for example, a heat source, an ultraviolet irradiation apparatus, an electron beam irradiation apparatus, a plasma irradiation apparatus, or a combination thereof. In addition, the processing chamber 107 of the film formation apparatus 101 cures the material formed on the film formation target S in the coating film formation chamber 106, removes the solvent or water from the formed material, The purpose is to modify film properties such as property. The processing apparatus 138 disposed in the processing chamber 107 can be, for example, one type of a heat source, an ultraviolet irradiation apparatus, an electron beam irradiation apparatus, a plasma irradiation apparatus, or a plurality of combinations.

Further, the partition plates 121, 131, 135, 139, 141 for isolating the respective chambers of the film formation body winding chamber 103, the vacuum film forming chamber 104, the processing chamber 105, the coating film forming chamber 106, and the processing chamber 107 are: This prevents the coating material from being diffused and contaminated between adjacent chambers, or supplying and irradiating unnecessary heat and electromagnetic waves. In addition, the partition plate can have a structure capable of applying a pressure difference between the two chambers. In particular, when the pressure difference needs to be increased, a differential exhaust mechanism is provided on the partition plate. Can do.
Further, each of the drums 118A, 118B, 118C, and 118D constituting the transport mechanism 115 of the film forming apparatus 101 can be heated or cooled with respect to the film formation target S that is transported on the rotating drum. Also good. In addition, in the film formation in the vacuum film formation chamber 104 and the coating film formation chamber 106, and the processing in the processing chambers 105 and 107, the drums 118A, 118B, 118C, and 118D are simultaneously stopped to stop the film formation target S. You may make it carry out in any state carried out or a conveyance state.

In such a film forming apparatus 101 of the present invention, the long film-formed body S that has been unwound from the unwinding portion 103a of the film-forming body winding chamber 103 is transported on the drum 118A and vacuumed. Vacuum film formation is performed in the film formation chamber 104, and then the film is transported on the drum 118 </ b> B, subjected to a desired process under reduced pressure in the processing chamber 105, and then transported onto the drum 118 </ b> C. The coating film formation is performed under reduced pressure at 106, and then the film is transferred onto the drum 118D, and a desired process is performed under reduced pressure in the processing chamber 107 to complete the film formation. Can be wound up by the winding portion 103b. Therefore, in the film forming apparatus 101 of the present invention, the film formation can be performed from the start to the completion while the film formation target S is kept under reduced pressure. Note that the processing in one of the processing chambers 105 and 107 may be omitted.
The arrangement order of the vacuum film forming chamber 104, the processing chamber 105, the coating film forming chamber 106, and the processing chamber 107 in the film forming apparatus 101 of the present invention is an example, and these chambers can be arranged in an arbitrary order. it can.

  FIG. 7 is a schematic configuration diagram showing another embodiment of the film forming apparatus of the present invention. In FIG. 7, the film forming apparatus 201 includes a deposition target stock chamber 203, a first vacuum film forming chamber 204, a first coating film forming chamber 205, a first processing chamber 206, a second vacuum film forming chamber 207, A two coating film forming chamber 208 and a second processing chamber 209 are provided. The deposition target stock chamber 3 and the first vacuum film formation chamber 204 are connected via the gate valve 210A, and the first vacuum film formation chamber 204 and the first coating film formation chamber 205 are connected via the gate valve 210B to perform the first process. The chamber 206 and the second vacuum film formation chamber 207 are connected via a gate valve 210C, the second vacuum film formation chamber 207 and the second coating film formation chamber 208 are connected via a gate valve 210D, and the second processing chamber 209 is formed. The film body stock chambers 203 are connected to each other via a gate valve 210E.

  An exhaust pump 212 for depressurizing the inside is connected to the deposition target material stock chamber 203 via a pressure adjustment valve 213. In addition, a means (not shown) for stocking a three-dimensional film-forming body S such as a molded product is provided inside the film-forming body stock chamber 203. Such a means is not particularly limited as long as it does not damage the film formation surface of the film formation target S. For example, a plurality of shelves for mounting the film formation target S, Utilizing an arm or a plurality of claw members for sandwiching the film-forming body S, a screw-type engagement mechanism disposed between the film-forming body S and the film-forming body stock chamber 3, and a hook A hook mechanism, a reduced pressure (vacuum) adsorption mechanism, or the like can be used.

An exhaust pump 214 for depressurizing the inside is connected to the first vacuum film formation chamber 204 via a pressure adjustment valve 215, and the film formation target S is placed inside the first vacuum film formation chamber 204. A stage 231 for placement is provided. An external film-forming power source 232 is connected to a film-forming target 234 in the first vacuum film-forming chamber 204, and a process gas supply port 235 is provided in the first vacuum film-forming chamber 204. Has been.
An exhaust pump 216 for depressurizing the inside is connected to the first coating film forming chamber 205 via a pressure adjusting valve 217, and a film formation target is placed inside the first coating film forming chamber 205. A stage 241 for placing S is provided. An external coating material supply device 242 is connected to the coating head 243 in the first coating film forming chamber 205.
The first processing chamber 206 is provided adjacent to the first coating film forming chamber 205 via a partition plate 255, and a stage 251 for placing the film formation target S inside the first processing chamber 206, And the processing apparatus 252 is arrange | positioned.

An exhaust pump 218 for depressurizing the inside is connected to the second vacuum film formation chamber 207 via a pressure adjustment valve 219, and the film formation target S is placed inside the second vacuum film formation chamber 207. A stage 261 for placement is provided. An external film-forming power source 262 is connected to a film-forming target 264 in the second vacuum film-forming chamber 207, and a process gas supply port 265 is provided in the second vacuum film-forming chamber 207. Has been. The deposition positions of the film formation target 264 and the process gas supply port 265 are arranged in the first vacuum film formation chamber so that a film can be uniformly formed on a desired film formation surface of the film formation target S that is a three-dimensional object. It can be set in consideration of the relationship between the deposition target 234 and the process gas supply port 235 at 204.
An exhaust pump 220 for depressurizing the inside is connected to the second coating film forming chamber 208 via a pressure regulating valve 221, and the film forming target is inside the second coating film forming chamber 208. A stage 271 for placing S is provided. An external coating material supply device 272 is connected to the coating head 273 in the second coating film forming chamber 208. The coating head 273 is disposed at a position where the coating head 273 is provided in the first coating film forming chamber 205 so that a uniform film can be formed on a desired film forming surface of the film forming target S, which is a three-dimensional object. It can be set as appropriate in consideration of the relationship with the arrangement position of H.243.

The second processing chamber 209 is provided in the second coating film forming chamber 208 via a partition plate 285, and a stage 281 for placing the film formation target S inside the second processing chamber 209, And the processing apparatus 282 is arrange | positioned.
The film forming apparatus 201 includes a deposition target stock chamber 203, a first vacuum film forming chamber 204, a first coating film forming chamber 205, a first processing chamber 206, a second vacuum film forming chamber 207, and a second vacuum film forming chamber 207. Between the coating film forming chamber 208, the second processing chamber 209, and the film forming material stock chamber 203, a transport mechanism is provided for transporting individual film forming materials S under reduced pressure conditions. The transport mechanism includes a conveyor for placing and transporting the deposition target S, a lift for holding and transporting the lower surface of the deposition target S, a hand for gripping and transporting a part of the deposition target S, and a transport target. A screw-type engagement mechanism disposed between the film-deposited body S and the transfer device, a hook mechanism using a hook hook, an arm mechanism having a reduced pressure (vacuum) adsorption mechanism, and the like can be used. Also good.

For example, when transporting between adjacent chambers through the gate valves 210A, 210B, 210C, 210D, and 210E, a hand is used, and the deposition target S in each chamber can be transported by a conveyor. it can. In this case, in the illustrated example, the stages 231, 241 (251), 261, 271 (281) can be used as conveyors.
Further, the deposition target S may be transported by being mounted on a transport carrier (jig) that can be transported without damaging the deposition surface. In this case, the mounting surface side of the film formation target S may be transported while being held by a transport carrier. For example, the film formation target S may correspond to the groove of the transport carrier (corresponding to the shape of the film formation target S). Or can be held on the carrier for transportation by adhesion or adsorption.

  In the film forming apparatus 201, the first vacuum film forming chamber 204 and the second vacuum film forming apparatus 207 are a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam. At least one of a film forming apparatus, a plasma CVD film forming apparatus, a plasma polymerization film forming apparatus, a thermal CVD film forming apparatus, and a catalytic reaction type CVD film forming apparatus is provided, and different film forming apparatuses may be provided in both chambers. Well, it is not limited to the illustrated example. Further, different types of film formation may be performed by making the film formation target 234 in the first vacuum film formation chamber 204 different from the film formation target 264 in the second vacuum film formation chamber 207.

  In the film forming apparatus 201, the coating apparatus including the coating heads 243 and 273 provided in the first coating film forming chamber 205 and the second coating film forming chamber 208 is not particularly limited. It is preferable to include any one of the rotary spray coating apparatuses. In the present invention, when the inside of the first coating film forming chamber 205 is depressurized by the exhaust pump 216 and when the inside of the second coating film forming chamber 208 is depressurized by the exhaust pump 220, the pressure adjusting valves 217 and 221 are evacuated. By adjusting the capacity and appropriately setting the position and size of the exhaust port, the first coating can be performed so that the optimum residence time and amount of film forming material can be obtained for spray coating and rotary spray coating. The airflow generated in the film chamber 205 and the second coating film forming chamber 208 can be controlled. Therefore, uniform coating can be performed on the entire surface of the film formation target S using a spray coating device or a rotary spray coating device. The exhaust port allows the coating liquid to be uniformly supplied to the surface of the film formation target S, the other side of the coating heads 243 and 273 through the film formation target S, and the film formation target S. It can arrange | position on the opposite surface side etc. of the stage 241,271 to mount. Further, a current plate may be disposed between the coating heads 243 and 273 and the exhaust port. One or a plurality of coating heads 243 and 273 may be provided, and one coating head may be reciprocally scanned with the deposition target S so as to maintain a predetermined distance. The coating material used in the first coating film forming chamber 205 and the coating material used in the second coating film forming chamber 208 may be the same type or different types.

The first processing chamber 206 and the second processing chamber 209 of the film forming apparatus 201 cure the material formed on the film formation target S, remove the solvent or water from the formed material, and wettability. The purpose is to modify the film characteristics such as. The processing apparatus 252 disposed in the first processing chamber 207 and the processing apparatus 282 disposed in the second processing chamber 209 are, for example, one of a heat source, an ultraviolet irradiation apparatus, an electron beam irradiation apparatus, and a plasma irradiation apparatus, or A plurality of combinations.
Further, the partition plate 255 that separates the first coating film forming chamber 205 and the first processing chamber 206 and the partition plate 285 that separates the second coating film forming chamber 208 and the second processing chamber 209 are provided in the coating. Prevents coating material from diffusing and contaminating from the coating film forming chamber to the processing chamber, and preventing unnecessary heat and electromagnetic waves from being supplied and irradiated from the processing chamber to the coating film forming chamber It is.

  In addition, when the process pressure (reduced pressure state) of the 1st coating film-forming chamber 205 and the 1st process chamber 206 differs, the partition plate 255 shall be the structure which can give a pressure difference between both chambers. it can. In particular, when it is necessary to increase the pressure difference between the first coating film forming chamber 205 and the first processing chamber 206, a differential exhaust mechanism is provided on the partition plate 255, or both chambers are completely connected via a gate valve. It is possible to provide an exhaust pump and a pressure adjusting valve for reducing the pressure inside the processing chamber 7. The partition plate 285 for isolating the second coating film forming chamber 208 and the second processing chamber 209 can be dealt with in the same manner as described above.

  The gate valves 210A, 210B, 210C, 210D, and 210E constituting the coating apparatus 201 maintain the pressure difference between the two chambers connected via the gate valve, and the two chambers connected continuously. When the pressure difference almost disappears, the film formation target S is opened. Such a gate valve can be the same as the gate valves 8 and 9 of the film forming apparatus 1 described above. Further, in the present invention, the means for maintaining the pressure difference between the two chambers provided in a continuous manner is not limited to the gate valve as described above, but means based on the forced exhaust system as shown in FIG. Alternatively, a conductance method as shown in FIG. 3 may be used.

The stages 231, 241, 251, 261, 271, and 281 can heat or cool the placed film formation target S so as to obtain an optimum temperature for film formation or processing. In this case, the stage may be the same as the stages 21, 31, and 41 of the film forming apparatus 1 described above.
The first vacuum film formation chamber 204, the first coating film formation chamber 205, the second vacuum film formation chamber 207, the film formation in the second coating film formation chamber 208, the first processing chamber 206 and the second processing chamber. The process in 209 may be performed in a state where the deposition target S is stopped or in a transport state.

  In such a film forming apparatus 201 of the present invention, the film-forming body S is transferred from the film-forming body stock chamber 203 to the first vacuum film-forming chamber 204 to perform vacuum film formation, and then the first coating process is performed. The film is transferred to the film chamber 205, and coating film formation is performed under reduced pressure. Then, a desired process is performed on the film under reduced pressure in the first processing chamber 206, and the film formation target S is further subjected to the second vacuum. The film is transferred to the film forming chamber 207 to perform vacuum film formation, and then transferred to the second coating film forming chamber 208 to perform coating film formation under reduced pressure, and then the second processing chamber 209 under reduced pressure. Desired processing can be performed on the film, and the film formation target S can be transferred to the film formation target stock chamber 203. Therefore, in the film forming apparatus 201 of the present invention, the film formation can be performed from the start to the completion while the film formation target S is kept under reduced pressure. The order of vacuum film formation and coating film formation under reduced pressure may be reversed, or two or more film formations may be performed using the same film formation means.

  The first vacuum film-forming chamber 204, the first coating film-forming chamber 205, the first processing chamber 206, the second vacuum film-forming chamber 207, and the second coating film-forming in the film forming apparatus 201 of the present invention shown in the illustrated example. The arrangement order of the chamber 208 and the second processing chamber 209 is an example, and these chambers can be arranged in an arbitrary order. The deposition target S that can be deposited by the deposition apparatus 201 of the present invention may be a three-dimensional object such as a molded product made of an inorganic material, an organic material, an inorganic-organic composite material, or a plate-like body. There is no particular limitation.

[Film formation method]
Next, the film forming method of the present invention will be described.
The film forming method of the present invention performs a multilayer film formation including a film formation by a vacuum film formation method and a film formation by a coating film formation method under a reduced pressure condition on an object to be formed. A functional film that expresses a desired function is formed by placing the film formation target under reduced pressure conditions from the start to the completion.
The film-forming body of the film-forming method of the present invention is not particularly limited. For example, a plate-like body such as a glass plate or a metal plate, a film such as a plastic film, a plastic long body, a glass bottle, a plastic bottle, or the like 3D molded products.

As a method for forming a film on a deposition target by vacuum film formation, vapor deposition, sputtering, ion plating, ion beam assist, cluster ion beam, plasma CVD, plasma polymerization, thermal CVD are used. And catalytic reaction type CVD method. During this vacuum film formation, the film formation target may be in a stationary state or in a transported state. Further, two or more types of vacuum film forming methods may be used to stack different types of films.
The thickness formed by the vacuum film formation can be appropriately set depending on the use of the functional film, but can be about 1 nm to 10 μm, preferably about 1 nm to 1 μm. If the vacuum film thickness is less than 1 nm, it is difficult to form a uniform film on the entire surface of the film formation target, and if it exceeds 10 μm, the time required for film formation is undesirably increased.

There is no particular limitation on the film forming method under reduced pressure on the deposition target by the coating film forming method, but the spray coating method or the rotary spray coating method is desirable. In the present invention, since coating film formation is performed under reduced pressure, it is possible to suppress the influence of airflow on the sprayed coating material, which has been a problem in the conventional spray coating method or rotary spray coating method. it can. In other words, the residence time and amount of the coating material can be controlled by using the air flow generated in the coating film formation chamber by the operation of the exhaust pump for depressurization, enabling more uniform and high quality film formation. It is.
During the coating film formation, the film formation target may be in a stationary state or in a transported state. The reduced pressure state at the time of coating film formation is a pressure state lower than the atmospheric pressure, and can be arbitrarily set within a range of, for example, about 1.00 × 10 ⁻⁴ Pa to 1.00 × 10 ⁺⁵ Pa. . Furthermore, you may laminate | stack another kind of film | membrane using 2 or more types of coating materials. Although the thickness formed by the coating film formation can be appropriately set depending on the use of the functional film, it can be set to about 0.1 μm to 5 mm, preferably about 0.1 μm to 1 mm. If the coating film thickness is less than 0.1 μm, it is difficult to form a uniform coating film on the entire surface of the film formation target, and if it exceeds 5 mm, there is a disadvantage in terms of cost.

In the present invention, for example, after film formation by a vacuum film formation method, film formation by a coating film formation method under reduced pressure conditions can be performed, and then a film curing treatment or the like can be performed. There are no particular restrictions on the order of vacuum film formation and coating film formation, and the number of layers in the film.
The treatment after the film formation is, for example, for the purpose of modifying film characteristics such as wettability of the film formed by vacuum film formation, or curing the film formed by coating film formation. The object is to remove the solvent or water from the deposited material. For such treatment, for example, one type or a combination of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device can be used.

The functional film that can be formed by the film forming method of the present invention includes a colored film, a light-shielding film, a transparent film, a semi-transparent film, a high reflection film, an antireflection film, an optical interference film, a high luminance film, a conductive film, and an insulating film. And a functional film having at least one function of a passivation film, a gas barrier film, a gas permselective film, a protective film, a hard film, a high-density film, a release film, an averaged film, and a roughened film.
In such a film forming method of the present invention, the film formation is performed while the object to be deposited is placed under a reduced pressure condition. Therefore, the film formation by the vacuum film forming method and the film forming method by the coating film forming method under the reduced pressure condition are performed. During the multi-layer film formation consisting of the above, particles and foreign substances are prevented from adhering to the film formation surface, and the film formation material reacts with oxygen in the atmosphere and is oxidized and adsorbs moisture. Therefore, a high-quality functional film can be obtained, and the film can be continuously formed without the need to release the pressure to the atmosphere or to reduce the pressure again, so that the productivity of the functional film is high. Such a film forming method of the present invention can be easily carried out by using the above-described film forming apparatus of the present invention.

Next, the present invention will be described in more detail with specific examples.
[Example 1]
A soda lime glass plate (thickness 0.7 mm, 370 mm × 470 mm) was prepared as a film formation target. This soda lime glass plate was placed so as to be fitted into the groove (size 390 mm × 490 mm) of the carrier for glass conveyance.
Next, the deposition object stock chamber, the vacuum deposition chamber, the coating deposition chamber, and the processing chamber were decompressed to 1.00 × 10 ⁻⁴ Pa by each vacuum pump.

Next, the gate valve between the film forming material stock chamber and the vacuum film forming chamber, and the gate valve between the vacuum film forming chamber and the coating film forming chamber are opened, and the soda lime glass plate is attached to the film forming material. It was transferred from the stock chamber onto the stage in the coating film forming chamber. This transport was integrated with the glass transport carrier and was arm transport.
Next, a flattening material (UV curable resin IP-MP402 manufactured by The Inktec Co., Ltd.) was applied on a soda lime glass plate under reduced pressure using a rotary spray coating apparatus. The coating conditions were set so that the film thickness after treatment described later was 1 μm. The temperature of the soda lime glass plate was 25 ° C.

  Next, the soda lime glass plate was transported to the processing chamber and placed on the stage. This conveyance was integrated with the glass conveyance carrier and was carried by an arm. After that, the stage was heated to raise the temperature of the soda lime glass plate to 200 ° C. and held for 1 hour to perform a curing treatment. Further, a flattening film was formed by irradiating 150 mJ of ultraviolet rays with an ultraviolet irradiation device.

Next, the soda lime glass plate on which the flattened film was formed was transported to the vacuum film forming chamber and placed on the stage. This conveyance was integrated with the glass conveyance carrier and was carried by an arm. Thereafter, the stage was heated to raise the temperature of the soda lime glass plate to 140 ° C., and an indium tin oxide (ITO) film (thickness 150 nm) was formed on the planarizing film using a magnetron sputtering apparatus. In this vacuum film formation, the film formation pressure was 0.1 Pa, oxygen and argon gas were used, the oxygen partial pressure was 2%, and the input power was 3 kW.
As described above, a functional film was formed by forming a flattening film and an ITO film on the soda lime glass plate.

<Functional film evaluation 1>
Measurement points were set at a pitch of 50 mm (measurement points were 8 points × 10 points = 80 points) on a 350 mm × 450 mm region excluding a 10 mm wide region from each end face of the soda lime glass plate. At these measurement points, the following surface smoothness measurement, sheet resistance measurement, and total light transmittance measurement were performed, and the results are shown in Table 1 below.

(Surface smoothness measurement)
Using an atomic force microscope manufactured by Digital Instruments, measure the surface smoothness in a 100 μm square area by tapping mode, and determine the average roughness Ra and the difference between the maximum and minimum roughness values (P−V). It was. This surface smoothness measurement was performed on both the flattened film alone and the laminated state of the flattened film and the ITO film. Moreover, the measurement result was shown by the average and dispersion | distribution (3 (sigma)) of the measured value (80 points). For the surface smoothness, the average of Ra is 1 nm or less and the average of PV is 10 nm or less.

(Sheet resistance measurement)
The sheet resistance was measured by the 4-terminal method using a Loresta manufactured by Mitsubishi Yuka Co., Ltd. as a measuring device. This measurement was performed in a state where the flattening film and the ITO film were laminated, and the measurement results were shown as an average of measured values (80 points) and dispersion (3σ). The sheet resistance is set to a practical level with an average of 30Ω / □ or less.

(Total light transmittance measurement)
The total light transmittance measurement was measured using a total light transmittance measuring device (S & M COLOR COMPUTER manufactured by Suga Test Instruments Co., Ltd.). This measurement was performed in a laminated state of a flattening film and an ITO film, and the measurement result was shown as an average of measured values (80 points). The total light transmittance is 90% or more on average, which is a practical level.

[Comparative Example 1]
A functional film was formed by stacking a flattening film and an ITO film on a soda lime glass plate in the same manner as in Example 1 except that the flattening film was formed under atmospheric pressure.
The formed functional film was subjected to surface smoothness measurement, sheet resistance measurement, and total light transmittance measurement in the same manner as in Example 1, and the results are shown in Table 1 below.

[Comparative Example 2]
Example: After flattening film formation under reduced pressure (after coating, curing, and ultraviolet irradiation treatment), the atmosphere was once released into the atmosphere, and then the film was vacuumed again under reduced pressure. In the same manner as in No. 1, a functional film was formed by depositing a flattening film and an ITO film on a soda lime glass substrate.
The formed functional film was subjected to surface smoothness measurement, sheet resistance measurement, and total light transmittance measurement in the same manner as in Example 1, and the results are shown in Table 1 below.

As shown in Table 1, the functional film (Example 1) formed according to the present invention had practically all the surface smoothness, sheet resistance, and total light transmittance.
However, the functional film (Comparative Example 1) formed by performing coating film formation under atmospheric pressure has a surface smoothness, a sheet resistance, and a total light transmittance that are less than practical levels. It was.
Furthermore, the functional film (Comparative Example 2) formed by once releasing the atmosphere after coating film formation under reduced pressure had good surface smoothness of only the flattening film, but the surface smoothness of the functional film. Properties, sheet resistance, and total light transmittance were all less than practical levels.

[Example 2]
A long-winding polyethylene terephthalate (PET) film (A4100 manufactured by Toyobo Co., Ltd., thickness 100 μm, width 1000 mm) was prepared as a film formation target. This PET film was mounted on the transport mechanism of the film-forming body take-up chamber of the coating apparatus of the present invention shown in FIG. 6 so that the surface opposite to the easy adhesion surface becomes the film-forming surface.
Next, the film forming body winding chamber, the vacuum film forming chamber, the coating film forming chamber, and the processing chamber were depressurized to 1 × 10 ⁻³ Pa by each vacuum pump.

  Next, as a vacuum film forming material, hexamethyldisiloxane (HMDSO) gas (SH200-0.65 cSt manufactured by Toray Dow Corning Silicone Co., Ltd.) and oxygen gas (manufactured by Taiyo Toyo Oxygen Co., Ltd., purity 99.9999% or more) ), Helium gas (purity 99.999% or more manufactured by Taiyo Toyo Oxygen Co., Ltd.) was prepared. Next, power having a frequency of 40 kHz (applied power of 15 kW) is applied to the electrode in the vacuum film formation chamber, and HMDSO 1.2 slm, oxygen 2 slm, and helium 2 slm are supplied from the process gas supply port provided in the vicinity of the electrode to the vacuum film formation chamber. The pressure in the vacuum film formation chamber was kept at 10 Pa by controlling the degree of opening and closing of the pressure adjustment valve. Then, a silicon oxide film (thickness 150 nm) was formed on a PET film conveyed on the drum at a speed of 0.5 m / sec.

Next, the PET film on which the silicon oxide film is formed in the vacuum film forming chamber is transported to the coating film forming chamber, and the rotary spray coating is applied to the PET film transported on the drum at a speed of 0.5 m / sec. A flattening material (UV curable resin IP-MP402 manufactured by The Inktec Co., Ltd.) was applied under reduced pressure using an apparatus. The coating conditions were set so that the film thickness after treatment described later was 1 μm.
Next, the PET film is transported to the processing chamber, and the PET film transported at a speed of 0.5 m / sec on the drum (drum temperature 200 ° C.) is irradiated with 200 mJ of ultraviolet rays by an ultraviolet irradiation device, and a planarized film Formed.
As described above, a silicon oxide film as a barrier film and a planarizing film were formed on the PET film to form a functional film over a length of about 20 m.

<Functional film evaluation 2>
A total of 110 measurement points were set, 10 points at a pitch of 100 mm and 11 points at a pitch of 1 m in the length direction with respect to an effective 900 mm width excluding a region having a width of 50 mm from each end face in the width direction of the PET film. At these measurement points, the following surface smoothness measurement, gas barrier property measurement, and total light transmittance measurement were performed, and the results are shown in Table 2 below.

(Surface smoothness measurement)
Using an atomic force microscope manufactured by Digital Instruments, measure the surface smoothness in a 100 μm square area by tapping mode, and determine the average roughness Ra and the difference between the maximum and minimum roughness values (P−V). It was. The measurement results are shown by the average of measured values (110 points) and variance (3σ). For the surface smoothness, the average of Ra is 1 nm or less and the average of PV is 10 nm or less.

(Gas barrier property measurement)
It measured on the measurement conditions of 40 degreeC and 90% RH using the water-vapor-permeation rate measuring apparatus (Permatran W3 / 31 by a Mocon company). The measurement results are shown by the average of measured values (110 points) and variance (3σ). The gas barrier property is set to a practical level of 0.1 (g / m ² / day) or less.

(Total light transmittance measurement)
The total light transmittance measurement was measured using a total light transmittance measuring device (S & M COLOR COMPUTER manufactured by Suga Test Instruments Co., Ltd.). The measurement results are shown as the average of the measured values (110 points). The total light transmittance is 90% or more on average, which is a practical level.

[Comparative Example 3]
A functional film is formed by depositing a silicon oxide film as a barrier film and a planarizing film on the PET film in the same manner as in Example 2 except that the planarizing film is formed under atmospheric pressure. did.
The formed functional film was subjected to surface smoothness measurement, gas barrier property measurement, and total light transmittance measurement in the same manner as in Example 2, and the results are shown in Table 2 below.

[Comparative Example 4]
A sheet-like polyethylene terephthalate (PET) film (A4100 manufactured by Toyobo Co., Ltd., thickness: 100 μm, 370 mm × 470 mm) was prepared as a film formation target. This PET film was placed in the deposition target stock chamber of the coating apparatus of the present invention shown in FIG.
Next, the deposition target stock chamber, the vacuum deposition chamber, the coating deposition chamber, and the processing chamber were decompressed to 1 × 10 ⁻⁴ Pa by each vacuum pump.

Next, the gate valve between the deposition target stock chamber and the vacuum deposition chamber and the gate valve between the vacuum deposition chamber and the coating deposition chamber are opened, and the PET film is removed from the deposition target stock chamber. It was transferred onto a stage in the coating film forming chamber. This conveyance was carried out by carrying the PET film on a carrier capable of carrying the film in a state where the PET film was tensioned, and carrying the PET film and the carrier integrally by arm conveyance.
Next, a planarizing material (UV curable resin IP-MP402 manufactured by The Inktec Co., Ltd.) was applied on the PET film under reduced pressure using a rotary spray coating apparatus. The coating conditions were set so that the film thickness after treatment described later was 1 μm. The temperature of the PET film was 25 ° C.

Next, the PET film on which the planarizing film was formed was transported to a vacuum film forming chamber and placed on the stage. This conveyance was performed by arm conveyance of the PET film and the carrier integrally. Thereafter, the stage was heated to raise the temperature of the PET film to 140 ° C., and a silicon oxide film (thickness 150 nm) was formed on the planarizing film using a magnetron sputtering apparatus. In this film formation, the film formation pressure was 0.25 Pa, argon gas and oxygen gas were used, the oxygen partial pressure was 10%, and the input power was 2 kW.
As described above, a planarizing film and a silicon oxide film were stacked on the PET film to form a functional film.
For the formed functional film, 80 measurement points were set in the same manner as in the evaluation 1 of the functional film in Example 1, and the surface smoothness measurement, gas barrier property measurement, total light beam were measured for these measurement points in the same manner as in Example 2. The transmittance was measured and the results are shown in Table 2 below.

Next, the PET film on which the planarizing film was formed was transported to a vacuum film forming chamber and placed on the stage. This conveyance was performed by arm conveyance of the PET film and the carrier integrally. Thereafter, the stage was heated to raise the temperature of the PET film to 140 ° C., and a silicon oxide film (thickness 150 nm) was formed on the planarizing film using a magnetron sputtering apparatus. In this film formation, the film formation pressure was 0.25 Pa, argon gas and oxygen gas were used, the oxygen partial pressure was 10%, and the input power was 2 kW.
As described above, a functional film was formed by stacking a planarizing film and an ITO film on a PET film.
For the formed functional film, 80 measurement points were set in the same manner as in the evaluation 1 of the functional film in Example 1, and the surface smoothness measurement, gas barrier property measurement, total light beam were measured for these measurement points in the same manner as in Example 2. The transmittance was measured and the results are shown in Table 2 below.

As shown in Table 2, the functional film (Example 2) formed according to the present invention had practically all the surface smoothness, gas barrier property, and total light transmittance.
However, the functional film (Comparative Example 3) formed by performing the coating film formation under atmospheric pressure has a surface smoothness, a gas barrier property, and a total light transmittance that are less than the practical level. It was.
In addition, the functional film (Comparative Example 4) formed by once releasing the atmosphere after coating film formation under reduced pressure has all the surface smoothness, gas barrier property, and total light transmittance at practical levels. It was less than that.

  It can be used for the production of functional films for various uses.

It is a schematic block diagram which shows one Embodiment of the film-forming apparatus of this invention. It is a schematic block diagram which shows an example of the means for maintaining the pressure difference of the both chambers provided in series. It is a schematic block diagram which shows the other example of the means for maintaining the pressure difference of the both chambers provided continuously. It is a schematic block diagram which shows other embodiment of the film-forming apparatus of this invention. It is a schematic block diagram which shows other embodiment of the film-forming apparatus of this invention. It is a schematic block diagram which shows other embodiment of the film-forming apparatus of this invention. It is a schematic block diagram which shows other embodiment of the film-forming apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,51,101,201 ... Film-forming apparatus 4,54,104,204,207 ... Vacuum film-forming chamber 6,56,106,205,208 ... Coating film-forming chamber 7,55,57,105,107, 206, 209 ... processing chamber 8, 9, 210A, 210B, 210C, 210D, 210E ... gate valve 12, 14, 16, 111, 122, 132, 142, 136, 212, 214, 216, 218, 220 ... exhaust pump 42,84,88,134,138,252,282 ... Processing devices 45,71,81,85,89,91,121,131,135,139,141,255,285 ... Partition plates 65,115 ... Conveying mechanism S: Film formation target

Claims (17)

In a film forming apparatus for forming a multi-layer film on individual plate-shaped deposition target bodies,
At least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, at least one coating film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the vacuum A transport mechanism capable of transporting the film-forming body between the film-forming chamber and the coating film-forming chamber under a reduced pressure condition, and the coating film-forming chamber mounts the film-forming body An exhaust port that is provided in a direction parallel to the film formation surface of the film formation body, and includes at least one of a spray coating apparatus and a rotary spray coating apparatus as a coating apparatus. or film forming apparatus according to claim Rukoto an exhaust port located on the side opposite to the deposition surface of the film formation target object. In a film forming apparatus for forming a multi-layer film on an individual three-dimensionally shaped film formation target,
At least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, at least one coating film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the vacuum A transport mechanism capable of transporting the film-forming body between the film-forming chamber and the coating film-forming chamber under a reduced pressure condition, and the coating film-forming chamber mounts the film-forming body And at least one of a spray coating device and a rotary spray coating device as a coating device, and opposite to the coating head of the coating device via the film-forming body A film forming apparatus comprising: an exhaust port located on a side of the substrate, or an exhaust port located on the opposite side of the stage on which the film formation target is placed. It said vacuum deposition chamber and the coating deposition chamber, according to claim 1 or claim characterized in that it is a film forming chamber of independent, which is continuously provided through the means for maintaining the pressure difference between the two chambers 2. The film forming apparatus according to 2 . Wherein the vacuum deposition chamber and / or said coating deposition chamber, a heat source, an ultraviolet irradiation apparatus, an electron beam irradiation apparatus, wherein, wherein the processing chamber comprises at least one plasma irradiation device is juxtaposed Item 4. The film forming apparatus according to Item 3 . 5. The film forming apparatus according to claim 4 , wherein the processing chamber is separated from the vacuum film forming chamber and the coating film forming chamber by a partition plate, and includes an exhaust pump for decompressing the processing chamber. . The transport mechanism, conveyor for conveying the individual deposition target object, a lift, film forming apparatus according to any one of claims 3 to 5 characterized in that it has at least one hand. In a film forming apparatus for forming a multi-layer film on a long film-formed body,
At least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, at least one coating film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the vacuum A transport mechanism capable of transporting the film-forming body between the film-forming chamber and the coating film-forming chamber under reduced pressure, and the transport mechanism includes a plurality of transport mechanisms for transporting the film-forming body. The vacuum film forming chamber and the coating film forming chamber are disposed along a transport path of the film formation target, and the coating film forming chamber is a spray coating apparatus as a coating apparatus. And a rotary spray coating apparatus, and an exhaust port located on the downstream side or the upstream side in the transport direction of the deposition target. In a film forming apparatus for forming a multi-layer film on a long film-formed body,
At least one vacuum film forming chamber, an exhaust pump for depressurizing the vacuum film forming chamber, at least one coating film forming chamber, an exhaust pump for depressurizing the coating film forming chamber, and the vacuum A transport mechanism capable of transporting the film-forming body between the film-forming chamber and the coating film-forming chamber under reduced pressure, and the transport mechanism includes a plurality of transport mechanisms for transporting the film-forming body. The vacuum film forming chamber and the coating film forming chamber are disposed along a transport path of the film formation target, and the coating film forming chamber is a spray coating apparatus as a coating apparatus. And an at least one type of rotary spray coating apparatus, an exhaust port positioned on the film forming surface side of the film forming body, and an exhaust port and a coating head of the coating apparatus A film forming apparatus comprising a current plate in between. A processing chamber provided with at least one of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device is provided downstream of the vacuum film formation chamber and / or the coating film formation chamber in the transport direction of the film formation target. The film forming apparatus according to claim 7 , wherein the film forming apparatus is disposed. The film forming apparatus according to claim 9 , wherein the processing chamber is separated from the vacuum film forming chamber, the coating film forming chamber, and a partition plate, and includes an exhaust pump for decompressing the processing chamber. . Vacuum deposition chamber along a conveying path of the deposition material, the coating deposition chamber, claims 3 to 6, characterized in that it is arranged in the order of the processing chamber, according to claim 9 and claim 10 The film-forming apparatus in any one. The vacuum film forming chamber includes a vapor deposition film forming apparatus, a sputtering film forming apparatus, an ion plating film forming apparatus, an ion beam assist film forming apparatus, a cluster ion beam film forming apparatus, a plasma CVD film forming apparatus, a plasma polymerization film forming apparatus, thermal CVD film-forming apparatus, film formation apparatus according to any one of claims 1 to 11, characterized in that it comprises at least one catalytic reaction type CVD system. In a film forming method for forming a functional film that expresses a desired function,
A multi-layer film is formed on the object to be formed by vacuum film formation and film formation by coating film formation under reduced pressure, and the film is formed from the start to the end of film formation. Place the body under reduced pressure,
The film formation by the coating film forming method is a spray coating method or a rotary spray coating method, and the retention of the coating material by using the air flow generated in the coating film forming chamber by the operation of the exhaust pump for reducing the pressure. A film forming method characterized by controlling time and a residence amount . Using at least one of a heat source, an ultraviolet irradiation device, an electron beam irradiation device, and a plasma irradiation device, the formed material is cured, or the solvent or water is removed from the formed material, or the film is formed. The film forming method according to claim 13 , wherein the characteristics of the formed film are modified. Film formation by the vacuum film formation method is any of vapor deposition method, sputtering method, ion plating method, ion beam assist method, cluster ion beam method, plasma CVD method, plasma polymerization method, thermal CVD method, catalytic reaction type CVD method. 15. The film forming method according to claim 13 or 14 , wherein 16. The film formation according to any one of claims 13 to 15, characterized in that after film formation by a vacuum film formation method, film formation by a coating film formation method under reduced pressure conditions is performed, and then film hardening is performed. The film-forming method of description. Functional films to be formed are colored film, light shielding film, transparent film, translucent film, highly reflective film, antireflection film, optical interference film, high brightness film, conductive film, insulating film, passivation film, gas barrier film, gas selection any transmission film, protective film, a hard film, a high density film, release layer, averaging film of claim 13 to claim 16, characterized in that a functional film having at least one function of the roughened film A film forming method according to claim 1.

Images