JP4548684B2 - Method for manufacturing ink jet recording head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to an ink jet recording head used in a recording apparatus that performs a recording operation by ejecting a recording liquid such as ink from an ejection port to form droplets.ofMore specifically, the present invention relates to a recording element substrate used in the ink jet recording head, a wiring substrate for connecting the recording element substrate and a power source, and the like. The ink jet recording head of the present invention is not only a general printing apparatus, but also a copying machine, a facsimile having a communication system, a word processor having a printing unit, and an industry combined with various processing apparatuses. The present invention can be applied to a recording device.
[0002]
[Prior art]
The ink jet recording apparatus is a so-called non-impact recording type recording apparatus, and is characterized by being capable of recording on various recording media at high speed and hardly causing noise in recording. For this reason, the ink jet recording apparatus is widely adopted as an apparatus that bears a recording mechanism such as a printer, a copier, a facsimile, a word processor, or the like.
[0003]
A typical ink ejection method for a recording head mounted on such an ink jet recording apparatus is one that uses an electromechanical transducer such as a piezo element, or generates heat by irradiating an electromagnetic wave such as a laser. And the like that discharge ink droplets, or those that heat ink by an electrothermal conversion element having a heating resistor and discharge ink droplets by the action of film boiling, are known. An ink jet recording head using an electrothermal conversion element is provided with an electrothermal conversion element in a recording liquid chamber, and an electric pulse serving as a recording signal is supplied thereto to generate heat, thereby giving thermal energy to the ink. Recording is performed on a recording medium by ejecting minute ink droplets from minute ejection ports using bubble pressure at the time of foaming (boiling) of the recording liquid caused by the liquid phase change. An ink jet recording nozzle for discharging ink droplets and a supply system for supplying ink to the nozzle are provided.
[0004]
Conventionally, as disclosed in JP-A-10-776, a copper foil having a thickness of 50 microns is bonded to a polyimide film and patterned, and a TAB (Tape Automated Bonding) tape gold-plated electrode lead (inner lead) In addition, a method is known in which a bump on an electrode pad of a recording element is electrically bonded by a thermal ultrasonic pressure bonding method, the bonded portion is sealed, and then bonded to a support. Japanese Patent Laid-Open No. 9-300624 proposes processing of electrodes after bump formation. Further, as disclosed in Japanese Patent Application Laid-Open No. 11-138814, there is known a technique in which a plurality of recording elements are bonded to a support after being connected to independent TAB tapes. In the configuration of Japanese Patent Laid-Open No. 11-138814, a plurality of recording elements are provided for color printing, but there is also a recording head having a configuration in which the inside is divided so that color printing can be performed on a single substrate.
[0005]
In recent years, the price of an ink jet recording apparatus has been remarkably reduced, and it has become a problem how to make an ink jet recording head cheaply. For this purpose, it is most effective to reduce the material cost of components, particularly the integration of the recording element substrate. For example, a method of integrating the recording element substrates that handle inks of three colors of yellow, magenta, and cyan for color is used. Many have been adopted. In addition, a recording element substrate for black ink that is frequently used for printing characters and the like is integrated with the above-described recording element substrate for color, or the recording element substrate for color and the recording element substrate for black are integrated in the same head. Many methods are also adopted. Japanese Patent Registration No. 2839686 discloses an example in which a method of mounting a plurality of different recording element substrates on a single TAB tape is employed as a semiconductor element for driving or the like. In this mounting method, one circuit is configured by connecting the plurality of recording element substrates to each other.
[0006]
[Problems to be solved by the invention]
However, as shown in Japanese Patent Laid-Open No. 11-138814, in the configuration in which a plurality of recording elements are bonded to a support after being connected to independent TAB tapes, the positions of the TAB tape and the support are aligned during bonding. In addition, there is a problem that the recording device becomes large because each recording element cannot be brought close to each other, and also when capping to prevent evaporation during non-recording, each recording element It was necessary to make the capping mechanism independent. Furthermore, since the component in a state where the TAB tape and the recording element are combined has to be bonded to the support, it is difficult to fix the recording element to the support with high accuracy. When there are a plurality of recording elements, it is more difficult to bond each recording element with relatively high accuracy. In addition, since the process of sealing the electrode lead (inner lead) with resin is performed in the air, the sealant used in the general TAB technology rotates to the discharge port for discharging the recording liquid. If the amount of the sealant is reduced so that the discharge port is clogged or the discharge port is not clogged, the inner lead is exposed. Furthermore, the resin that seals the inner lead may wrap around the back surface of the recording element, resulting in a recording element that cannot be bonded and fixed.
[0007]
Further, when the black ink recording element substrate and the color ink recording element substrate are incorporated in the same head (same TAB), it is necessary to match the relative positional relationship between the recording liquid ejection ports. However, it is a general TAB technology, an inner lead bonding process for bonding an inner lead (electrode lead) protruding from a device hole (opening) provided in a film carrier tape and an electrode of a semiconductor chip, or an inner lead is made of resin. If the sealing process is performed first, and then each recording element substrate is incorporated into the head, the accuracy of the relative positional relationship of the ejection ports will deteriorate, and black ink and color ink may be significantly blurred during ink jet recording. The color shift sometimes occurred.
[0008]
The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor chip (recording element substrate) as a support in an inkjet recording head having a structure in which a plurality of recording element substrates are bonded to the same support. After bonding, the inner lead bonding process (the process of bonding the inner lead (electrode lead) protruding from the device hole provided on the film carrier tape and the electrode of the semiconductor chip), which is a conventional TAB technique, and the inner lead The step of sealing with resin is to improve the reliability of inner lead bonding and to realize reliable electrical connection.
[0009]
Another object of the present invention is to provide an inkjet recording head capable of performing inexpensive and high-quality inkjet recording.
[0011]
[Means for Solving the Problems]
  Of the present inventionThe feature is that a recording element that generates energy used for ejecting ink and an electrode portion connected to the recording element include:RespectivelyProvidedpluralRecording element substrateWhen,
  A wiring board having electrode terminals electrically connected to the electrode portions of the plurality of recording element substrates and transmitting an electric pulse for ejecting ink to the recording elements;
  An element substrate support member for supporting a plurality of recording element substrates;
  A wiring board supporting member that supports the wiring board and is fixed on the element substrate supporting member;
  A method of manufacturing an ink jet recording head having
  Fixing a plurality of recording element substrates and wiring board support members on the element substrate support members;
  Aligning the electrode terminals of the wiring board with respect to the electrode portions of the plurality of recording element boards, and fixing the wiring board on the wiring board support member;
  A step of inter-metal bonding the electrode portions of the plurality of recording element substrates and the electrode terminals of the wiring substrate;
  Are in this order.
[0012]
According to these methods, the electrode unit and the electrode terminal are bonded to each other after fixing the recording element substrate and the wiring substrate to the element substrate support member by performing intermetallic bonding such as thermosonic bonding to the electrode unit and the electrode terminal. Even so, the reliability of the connection can be ensured. In addition, since a versatile standard apparatus and technology can be used, an ink jet recording head can be provided at low cost.
Further, by attaching the wiring board support member to the element substrate support member so that the distance between the upper surface of the wiring board support member and the upper surfaces of the electrode portions on the plurality of recording element substrates is constant, the reliability can be reduced. A priced inkjet recording head can be provided. At this time, it is possible to provide a more reliable and inexpensive ink jet recording head by correcting and smoothing the variation in height dimension of the upper surfaces of the electrode portions on the plurality of recording element substrates.
[0013]
Then, the step of fixing the plurality of recording element substrates and the wiring board support member on the element substrate support member is performed using an adhesive, and the electrode portions of the plurality of recording element substrates and the electrode terminals of the wiring substrate are bonded between the metals. After the step, it is preferable to further include a step of sealing the joint portion between the electrode portion and the electrode terminal with a resin.
By sealing the joint between the electrode part on the recording element substrate and the electrode terminal of the wiring board with resin after fixing the wiring board to the wiring board supporting member, stable resin sealing can be performed, and the cost can be reduced. An ink jet recording head can be provided.
[0014]
In the step of fixing the plurality of recording element substrates on the wiring substrate support member, it is preferable that the electrode portions of the plurality of recording element substrates on the wiring substrate support member are arranged so as not to have the same height.
Further, in the step of fixing the wiring board on the wiring board support member, positioning is performed so that the gap between the electrode portions of the plurality of recording element boards and the electrode terminals of the wiring board is 100 μm or less, and then the two are metal-to-metal bonded. It is preferable.
[0015]
The step of fixing the plurality of recording element substrates and the wiring board support member on the element substrate support member includes the step of fixing the plurality of recording element substrates on the element substrate support member by the first adhesive layer, Including a step of fixing on the element substrate support member with the second adhesive layer, and the thickness of the plurality of recording element substrates and the thickness of the first adhesive layer is equal to the thickness of the wiring substrate support member It is preferable to be thinner than the total thickness of the second adhesive layer.
[0016]
The electrode portions of the plurality of recording element substrates may include bumps bonded between metals. The bump may be formed on the electrode part by either a stud bump by a thermosonic bonding method or a plating bump by plating.
[0017]
The wiring board may include a plurality of openings into which a plurality of recording element substrates are respectively incorporated, and may further include a step of sealing the periphery of the recording element substrate with a resin in the openings.
It is preferable that at least one of the sizes or shapes of the plurality of recording element substrates is different from each other. The wiring board is preferably provided with a plurality of openings into which a plurality of recording element substrates are respectively incorporated, and at least one of the size or shape of the openings is preferably different from each other.
[0018]
The metal-to-metal bonding may be performed by a thermosonic bonding method. Alternatively, the metal-to-metal bond may be made by wire bonding.
[0019]
Still another feature of the present invention is that a plurality of recording element substrates provided with a recording element that generates energy used for ejecting ink and an electrode portion connected to the recording element,
A wiring board having electrode terminals electrically connected to the electrode portions of the plurality of recording element substrates and transmitting an electric pulse for ejecting ink to the recording elements;
An element substrate support member for supporting a plurality of recording element substrates;
An ink jet recording head comprising:
The electrode portions of the plurality of recording element substrates are not arranged at the same height on the element substrate support member, and the electrode portions of the plurality of recording element substrates and the electrode terminals of the wiring substrate are bonded to each other between the metals. is there.
[0020]
It is preferable that at least one of the sizes or shapes of the plurality of recording element substrates is different from each other.
The wiring board is preferably provided with a plurality of openings into which a plurality of recording element substrates are respectively incorporated, and at least one of the sizes or shapes of the plurality of openings is preferably different from each other.
A first adhesive layer that supports the wiring substrate and is fixed to the element substrate supporting member; a first adhesive layer that bonds the plurality of recording element substrates and the element substrate supporting member; and the element substrate supporting member and the wiring substrate. A thickness of the plurality of recording element substrates and the thickness of the first adhesive layer is equal to the thickness of the wiring board support member and the second adhesion layer. It is preferable to be thinner than the total thickness of the layers.
[0021]
The recording element may be an electrothermal conversion element that generates thermal energy as energy.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0023]
1 to 6 are diagrams for explaining the respective configurations and relationships of a suitable head cartridge, recording head, and ink tank in which the present invention is implemented or applied. Hereinafter, each component will be described with reference to these drawings.
[0024]
The recording head (inkjet recording head) H1001 of the present embodiment is one constituent element of the recording head cartridge H1000, as can be seen from the perspective views of FIGS. 1A and 1B, and the recording head cartridge H1000. Is composed of a recording head H1001 and an ink tank H1900 (H1901, H1902, H1903, H1904) that is detachably attached to the recording head H1001. The recording head H1001 discharges ink (recording liquid) supplied from the ink tank H1900 from the discharge port according to the recording information.
[0025]
The recording head cartridge H1000 is fixedly supported by positioning means and electrical contacts of a carriage (not shown) mounted on the ink jet recording apparatus main body, and is detachable from the carriage. The ink tank H1901 is for black ink, the ink tank H1902 is for cyan ink, the ink tank H1903 is for magenta ink, and the ink tank H1904 is for yellow ink. In this way, each of the ink tanks H1901, H1902, H1903, and H1904 is detachable from the recording head H1001 on the seal rubber H1800 side, and each ink tank can be replaced, so that printing in the inkjet recording apparatus can be performed. Running costs are reduced.
[0026]
Next, each component constituting the recording head H1001 will be described in further detail in order.
[0027]
(1) Recording head
The recording head H1001 is a bubble jet side shooter type recording head that performs recording using an electrothermal transducer (recording element) that generates thermal energy for causing film boiling to the ink in response to an electrical signal. It is.
[0028]
As shown in the exploded perspective view of FIG. 2, the recording head H1001 includes a recording element unit H1002, an ink supply unit H1003, and a tank holder H2000.
[0029]
Further, as shown in the exploded perspective view of FIG. 3, the recording element unit H1002 includes a first recording element substrate H1100, a second recording element substrate H1101, and a first plate.(Element substrate support member)H1200, electrical wiring tape (flexible wiring board) H1300, electrical contact substrate H2200, second plate(Wiring board support member)The ink supply unit H1003 includes an ink supply member H1500, a flow path forming member H1600, a joint seal member H2300, a filter H1700, and a seal rubber H1800.
[0030]
(1-1) Recording element unit
FIG. 4 is a partially exploded perspective view for explaining the configuration of the first recording element substrate H1100. The first recording element substrate H1100 includes a plurality of recording elements (electrothermal conversion elements) H1103 for ejecting ink on one surface of a Si substrate H1110 having a thickness of 0.5 to 1 mm, and each electrothermal conversion element H1103. An electric wiring such as Al for supplying electric power is formed by a film forming technique. A plurality of ink flow paths and a plurality of ejection openings H1107 corresponding to the electrothermal conversion element H1103 are formed by photolithography technology, and an ink supply opening H1102 for supplying ink to the plurality of ink flow paths is provided. It is formed so as to open on the opposite surface (back surface). The recording element substrate H1100 is bonded and fixed to the first plate H1200, and an ink supply port H1102 is formed here. Further, a second plate H1400 having an opening is bonded and fixed to the first plate H1200, and the electric wiring tape H1300 is electrically connected to the recording element substrate H1100 via the second plate H1400. To be connected to each other. The electrical wiring tape H1300 applies an electrical signal for ejecting ink to the recording element substrate H1100. The electrical wiring tape H1300 is located on the electrical wiring portion and is electrically connected to the recording element substrate H1100. The external signal input terminal H1301 for receiving signals is positioned and fixed on the back side of the ink supply member H1500.
[0031]
The ink supply port H1102 is formed by a method such as anisotropic etching or sandblasting using the crystal orientation of Si. That is, when the Si substrate H1110 has a crystal orientation of <100> in the wafer surface direction and <111> in the thickness direction, it is approximately 54.7 by anisotropic etching with an alkali system (KOH, TMAH, hydrazine, etc.). Etching can proceed at an angle of degrees. Thus, etching is performed to a desired depth to form an ink supply port H1102 composed of a long groove-like through-hole. The electrothermal conversion elements H1103 are arranged in a staggered pattern in one row on both sides of the ink supply port H1102. The electrothermal conversion element H1103 and the electric wiring such as Al for supplying electric power to the electrothermal conversion element H1103 are formed by a film forming technique. Furthermore, an electrode for supplying power to the electrical wiring(Electrode part)H1104 is arranged on both outer sides of the electrothermal transducer H1103, and a bump H1105 such as Au is formed on the electrode H1104 by a thermosonic bonding method. On the Si substrate H1110, an ink flow path wall H1106 and a discharge port H1107 for forming an ink flow path corresponding to the electrothermal conversion element H1103 are formed of a resin material by a photolithography technique, and a discharge port group H1108. Is formed. Since the ejection port H1107 is provided so as to face the electrothermal conversion element H1103, the ink supplied from the ink supply port H1102 is ejected from the ejection port H1107 by bubbles generated by the heat generation action of the electrothermal conversion element H1103.
[0032]
FIG. 5 is a partially exploded perspective view for explaining the configuration of the second recording element substrate H1101. The second recording element substrate H1101 is a recording element substrate for ejecting three colors of ink, and has three ink supply ports H1102 formed in parallel, on both sides of each ink supply port H1102. An electrothermal conversion element H1103 and an ink discharge port H1107 are formed. As with the first recording element substrate H1100, the ink supply port H1102, the electrothermal conversion element H1103, the electrical wiring, and the electrode are formed on the Si substrate H1110.(Electrode part)H1104 and the like are formed, and an ink flow path and an ink discharge port H1107 are formed on the resin material by a photolithography technique. Similarly to the first recording element substrate H1100, bumps H1105 such as Au are formed on the electrodes H1104 for supplying power to the electric wiring..
Next, the first plate H1200 is made of, for example, alumina (Al₂O_Three) Made of material. The material of the first plate H1200 is not limited to alumina, and has a linear expansion coefficient equivalent to that of the recording element substrate H1100, and the thermal conductivity of the recording element substrate H1100 material. It may be made of a material having a thermal conductivity equivalent or equal to or higher. The material of the first plate H1200 is, for example, silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si_ThreeN_Four), Silicon carbide (SiC), molybdenum (Mo), or tungsten (W). The first plate H1200 is provided with an ink communication port H1201 for supplying black ink to the first recording element substrate H1100, and for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101. An ink communication port H1201 is formed, the ink supply port H1102 of the recording element substrate corresponds to the ink communication port H1201 of the first plate H1200, and the first recording element substrate H1100 and the second recording element substrate. Each of H1101 is bonded and fixed to the first plate H1200 with high positional accuracy. The first adhesive used for bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. The first adhesive is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the first adhesive layer H1202 shown in FIG. 10 is desirably 50 μm or less.
[0033]
The electrical wiring tape H1300 applies an electrical signal for ejecting ink to the first recording element substrate H1100 and the second recording element substrate H1101. This electrical wiring tape H1300 includes a plurality of device holes (openings) H1 and H2 for incorporating the respective recording element substrates H1100 and H1101, and electrodes of the respective recording element substrates H1100 and H1101.(Electrode part)Electrode terminal corresponding to H1104(Electrode lead)H1302 and an electrode terminal portion for making an electrical connection with an electrical contact substrate H2200 which is located at an end portion of the electrical wiring tape H1300 and has an external signal input terminal H1301 for receiving an electrical signal from the printer main unit. The electrode terminal portion and the electrode lead H1302 are connected by a continuous copper foil wiring pattern. The electrical wiring tape H1300 is made of, for example, a flexible wiring board in which the wiring has a two-layer structure and the surface layer is covered with a resist film. In this case, a reinforcing plate is bonded to the back surface side (outer surface side) of the external signal input terminal H1301 to improve the flatness. As the reinforcing plate, for example, a material having heat resistance such as 0.5 to 2 mm of glass epoxy or aluminum is used.
[0034]
The electrical wiring tape H1300, the first recording element substrate H1100, and the second recording element substrate H1101 are electrically connected to each other, and the connection method is, for example, a bump H1105 on the electrode H1104 of the recording element substrate, The electrode lead H1302 of the wiring tape H1300 is electrically bonded by a thermal ultrasonic pressure bonding method.
[0035]
The second plate H1400 is a single plate-like member having a thickness of 0.5 to 1 mm, for example, alumina (Al₂O_Three) And other metal materials such as Al and SUS. However, the material of the second plate H1400 is not limited thereto, and has a linear expansion coefficient equivalent to that of the recording element substrates H1100 and H1101 and the first plate H1200, and their thermal conductivity. A material having an equivalent or higher thermal conductivity may be used.
[0036]
The second plate H1400 has a shape having openings larger than the outer dimensions of the first recording element substrate H1100 and the second recording element substrate H1101 that are bonded and fixed to the first plate H1200. In addition, the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are bonded to the first plate H1200 by the second adhesive layer H1203 so as to be electrically connected in a plane. The back surface of the electrical wiring tape H1300 is bonded and fixed by the third adhesive layer H1306.
[0037]
Electrical connection portions of the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 are sealed with a first sealant (not shown) and a second sealant to be electrically connected. The parts are protected from ink corrosion and external impact. The first sealant mainly seals the back side of the connection portion between the electrode terminal H1302 of the electric wiring tape and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealant is The front side of the connecting portion is sealed.
[0038]
Further, an electrical contact substrate H2200 having an external signal input terminal H1301 for receiving an electrical signal from the printer main body device at the end of the electrical wiring tape H1300 is thermocompression-bonded and electrically connected using an anisotropic conductive film or the like. ing.
[0039]
The electric wiring tape H1300 is bonded to the second plate H1400, and at the same time, is bent along one side surface of the first plate H1200 and the second plate H1400, and the third plate is attached to the side surface of the first plate H1200. Bonded by the adhesive layer H1306. The second adhesive preferably has a low viscosity, can form a thin second adhesive layer H1203 on the contact surface, and has ink resistance. The third adhesive layer H1306 is, for example, a thermosetting adhesive layer having an epoxy resin as a main component and a thickness of 100 μm or less.
[0040]
(1-2) Ink supply unit
The ink supply member H1500 is formed by, for example, resin molding. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity.
[0041]
As shown in FIGS. 3 and 6, the ink supply member H1500 that detachably holds the ink tank H1900 is a component of the ink supply unit H1003 for guiding ink from the ink tank H1900 to the recording element unit H1002. The flow path forming member H1600 is ultrasonically welded to form an ink flow path H1501 from the ink tank H1900 to the first plate H1200. Further, a filter H1700 for preventing entry of dust from the outside is joined to the joint portion H1520 engaged with the ink tank H1900 by welding, and further, in order to prevent ink from evaporating from the joint portion H1520. A seal rubber H1800 is attached.
[0042]
The ink supply member H1500 also has a function of holding a detachable ink tank H1900, and has a first hole H1503 for engaging the second claw H1910 of the ink tank H1900.
[0043]
Also, a mounting guide H1601 for guiding the recording head cartridge H1000 to the mounting position on the carriage of the ink jet recording apparatus main body, an engaging portion for mounting and fixing the recording head cartridge to the carriage by the head set lever, and a predetermined mounting position of the carriage Are provided with an abutting portion H1509 in the X direction (carriage scan direction), an abutting portion H1510 in the Y direction (recording medium conveyance direction), and an abutting portion H1511 in the Z direction (ink ejection direction). In addition, a terminal fixing portion H1512 for positioning and fixing the electrical contact substrate H2200 of the recording element unit H1002 is provided, and a plurality of ribs are provided around the terminal fixing portion H1512 to increase the rigidity of the surface having the terminal fixing portion H1512. ing.
[0044]
(1-3) Connection of recording head unit and ink supply unit
As shown in FIG. 2 described above, the recording head H1001 is completed by connecting the recording element unit H1002 to the ink supply unit H1003 and further to the tank holder H2000. The coupling is performed as follows.
[0045]
Ink does not leak from the ink communication port (ink communication port H1201 of the first plate H1200) of the recording element unit H1002 and the ink communication port (ink communication port H1602 of the flow path forming member H1600) of the ink supply unit H1003. In order to communicate, each member is fixed with screws H2400 so as to be pressure-bonded via a joint seal member H2300. At the same time, the recording element unit H1002 is accurately positioned and fixed with respect to the reference positions in the X, Y, and Z directions of the ink supply unit.
[0046]
The electrical contact substrate H2200 of the recording element unit H1002 is positioned and fixed to one side surface of the ink supply member H1500 by terminal positioning pins H1515 (2 places) and terminal positioning holes H1309 (2 places). As a fixing method, for example, the terminal positioning pin H1515 provided in the ink supply member H1500 is fixed, but it may be fixed using other fixing means. The completed drawing is shown in FIG.
[0047]
Further, the recording head H1001 is completed by fitting and coupling the coupling hole and coupling portion of the ink supply member H1500 with the tank holder to the tank holder H2000. That is, from the tank holder portion composed of the ink supply member H1500, the flow path forming member H1600, the filter H1700, and the seal rubber H1800, the recording element substrates H1100 and H1101, the first plate H1200, the wiring substrate H1300, and the second plate H1400. The recording head is configured by bonding the configured recording element unit by bonding or the like. The completed drawing is shown in FIG.
[0048]
(2) Description of recording head cartridge
FIGS. 1A and 1B are diagrams for explaining mounting of the recording head H1001 and the ink tanks H1901, H1902, H1903, and H1904 constituting the recording head cartridge H1000, and the ink tanks H1901, H1902, H1903, Corresponding color ink is stored inside the H1904. Further, as shown in FIG. 6, each ink tank is formed with an ink communication port H1907 for supplying ink in the ink tank to the recording head H1001. For example, when the ink tank 1901H is attached to the recording head H1001, the ink communication port H1907 of the ink tank H1901 is brought into pressure contact with the filter H1700 provided in the joint portion H1520 of the recording head H1001, and the black ink in the ink tank H1901 communicates with the ink. The ink is supplied from the port H1907 to the first recording element substrate H1100 through the first plate H1200 through the ink flow path H1501 of the recording head H1001.
[0049]
Then, ink is supplied to the foaming chamber having the electrothermal conversion element H1103 and the discharge port H1107, and is ejected toward a recording sheet as a recording medium by the thermal energy given to the electrothermal conversion element H1103.
[0050]
[Conventional example]
Here, for comparison with the configuration of the present invention, first, a conventional recording element unit will be described with reference to FIGS.
[0051]
24 and 25 show a conventional TAB mounting method, in which bumps on the electrodes of the recording element are electrically bonded to the electrode leads of the electric wiring tape in advance by a thermal ultrasonic pressure bonding method, further sealed, and then bonded to the support member. Shows how to do.
[0052]
In the conventional configuration shown in FIGS. 24 and 25, the electrical wiring tape H300 has a three-layer structure around the bonding portion, a polyimide base film H300a on the front side, a copper foil H300b in the middle, and a solder resist H300c on the back side. It is a configuration. The electrical wiring tape H300 is provided with a device hole (opening) H11 into which the recording element substrate H100 is inserted, and a device hole H12 into which the recording element substrate H101 is inserted, and a bump H5 of the recording element substrates H100 and H101 and An electrode lead (inner lead) H302 to be connected is exposed by gold plating.
[0053]
In the device hole H11 of the first recording element substrate H100 and the electric wiring tape H300, the electrode lead H302 of the electric wiring tape (TAB tape) H300 and the bump H5 on the electrode of the recording element H100 are previously positioned by the conventional TAB mounting method. After being combined, the TAB unit H300U1 is electrically bonded by a thermosonic bonding method and further sealed with a sealing agent H308. Further, the electrode lead H302 of the electric wiring tape H300 and the bump H5 on the electrode of the recording element H100 are electrically bonded to the second recording element substrate H101 and the device hole H12 of the electric wiring tape H300 by a thermal ultrasonic pressure bonding method. Further, what is sealed with a sealant H308 is a TAB unit H300U2. Here, the TAB unit is divided in the conventional TAB mounting method in which the positional accuracy of the chip (recording element substrate) after sealing with respect to the TAB is used for an ink jet recording apparatus (particularly in the case of a color recording apparatus). This is because sufficient accuracy cannot be secured.
[0054]
Next, the second plate H400 is bonded to the first plate H200 by the second adhesive layer H203. The thickness of the second adhesive layer H203 is suppressed to 0.06 mm or less so that the first recording element substrate H100 and the second recording element substrate H101 and the electric wiring tape H300 can be electrically connected in a plane. ing.
[0055]
Next, the first adhesive layer H202 for bonding the first recording element substrate H100 and the second recording element substrate H101 is bonded to the first plate H200, and the electric wiring tape H300 is bonded to the second plate H400. After applying and forming the third adhesive layer H306, the TAB unit H300U1 and the TAB unit H300U2 are pressed in accordance with the relative positional relationship in the wiring surface direction of the plurality of recording elements H103 that discharge the recording liquid or the respective discharge ports H107. Fix it. At this time, the sealant H308 is also attached to the upper portion (ink ejection surface side) of the first recording element substrate H100 and the second recording element substrate H101. In order to avoid this attachment portion, the suction tube V110 is connected. The contact areas of the pressing heads H100H and H101H with respect to the recording element substrates H100 and H101 are regulated. Note that the sealant H308 usually stops at the ridge line of the recording element substrate and is difficult to adhere to the adhesive surface. However, the sealant H308 sometimes adheres due to variations in the viscosity of the sealant. The first recording element substrate H100 and the second recording element substrate H101 are lifted by the thickness, and the ejection direction may be inclined or ink may leak.
[0056]
Thereafter, in order to securely bond the electric wiring tape H300 to the second plate H400, the electric wiring tape H300 is pressed and fixed to the second plate H400 by the tape pressing head T300. It is preferable that the electrical wiring tape H300 and the third adhesive layer H306 are not in contact with each other when the first recording element substrate H100 and the second recording element substrate H101 are pressed and fixed for bonding. If the pressure is insufficient, the first recording element substrate H100 and the second recording element substrate H101 are floated, and the ejection direction may be inclined or ink may leak.
[0057]
[Example 1]
In contrast to the conventional example shown in FIGS. 24 and 25, Example 1 of the present invention will be described with reference to FIGS.
[0058]
9 is an exploded schematic cross-sectional view of the main part of the printing element unit H1002, and FIG. 10 is a schematic cross-sectional view of the main part.
[0059]
As shown in FIG. 9, the electrical wiring tape H1300 has a three-layer structure around the bonding portion, and has a structure of a polyimide base film H1300a on the front side, a copper foil H1300b on the middle, and a solder resist H1300c on the back side. The electrical wiring tape H1300 is provided with a device hole (opening) H1 into which the first recording element substrate H1100 is inserted and a device hole H2 into which the second recording element substrate H1101 is inserted, and the recording element substrate H1100. , H1101 and inner leads (electrode leads) H1302 connected to the bumps H1005 are gold-plated and exposed.
[0060]
Hereinafter, the manufacturing method of the recording element unit according to the manufacturing method of the ink jet recording head of the present invention will be described in detail with reference to FIG. 9 and FIG.
[0061]
First, the second plate H1400 is bonded to the first plate H1200 with the second adhesive layer H1203. The thickness of the second adhesive layer H1203 is set to 0.06 mm or less as in the prior art so that the first recording element substrate H1100 and the second recording element substrate H1101 and the electric wiring tape H1300 can be electrically connected in a plane. It is suppressed. In this embodiment, the second plate H1400 may be bonded to the first plate H1200 before or after the recording element substrates H1100 and H1101 are bonded.
[0062]
Next, a first adhesive layer H1202 for bonding the first recording element substrate H1100 and the second recording element substrate H1101 is applied and formed on the first plate H1200, and then the recording element substrates H1100 and H1101 are coated with a recording liquid. The plurality of electrothermal conversion elements H1103 to be discharged or the respective discharge ports H1107 are pressed and fixed in accordance with the relative positional relationship in the wiring surface direction. At this time, unlike the above-described conventional example, there is no interference such as a reduction in the contact area of the pressing head and contact with the adhesive of the electric wiring tape, so stable and highly accurate adhesive fixing is possible.
[0063]
Thereafter, a third adhesive layer H1306 for bonding and fixing the back surface of the electrical wiring tape H1300 is applied to the second plate H1400, and then the electrodes H1104 of the first recording element substrate H1100 and the second recording element substrate H1101. And the electrode lead H1302 of the electric wiring tape H1300 are aligned and then pressed and fixed. Thereafter, the bump H1105 on the electrode 1104 of the recording element substrate and the electrode lead H1302 of the electric wiring tape H1300 are electrically joined one by one by a thermosonic bonding method. Electrical bonding by the thermosonic bonding method is frequently used in wire bonding, and since it is a metal-to-metal bond, the reliability of the bonded portion is high and the productivity is also very high.
Further, regarding the positional relationship in the height direction between the bump H1105 on the electrode portion H1104 of the recording element substrate and the electrode lead H1302 of the electric wiring tape H1300, the electrode lead H1302 of the electric wiring tape H1300 can absorb variations, so An ink jet recording head with high performance can be provided.
[0064]
Further, the joint between the bump H1105 on the electrode H1104 of the recording element substrate H1100 and the electrode lead H1302 of the electric wiring tape H1300 is sealed with resin so as not to be short-circuited with ink or the like.
[0065]
The thermosonic bonding method employed in this embodiment is bonding at one place, but the number of wires of the ink jet recording head is about 20 to 100 per recording element substrate, and 0.1 per area. Since it can be joined in about 0.2 seconds, production in a short time is possible.
[0066]
FIG. 11 shows an enlarged exploded view and a sectional view of the first and second plates H1200 and H1400, the first and second recording element substrates H1100 and H1101, and the electric wiring tape H1300 shown in FIG. . The configuration of the present embodiment will be described in more detail with reference to FIGS.
[0067]
In the present embodiment, the first plate H1200 is made of alumina and has a thickness of 4 ± 0.03 mm, and the second plate H1400 is also made of alumina and has a thickness of 0.67 ± 0.05 mm. The element substrates H1100 and H1101 have a thickness of 0.625 ± 0.025 mm. As described above, the electric wiring tape (flexible printed circuit board) H1300 has a three-layer structure of a base film, a copper foil wiring, and a solder resist. Device holes H1 and H2 are provided, and gold-plated electrode leads H1302 are exposed. Yes.
[0068]
The second plate H1400 of this embodiment is a single plate-like member, and is provided with two holes for inserting the recording element substrates H1100 and H1101, and is bonded to the first plate H1200. Is fixed. In addition, the entire surface of the electric wiring tape H1300 except for the device holes H1 and H2 formed to expose the recording element substrates H1100 and H1101 is bonded to the second plate H1400 by the third adhesive layer H1306. Yes.
[0069]
FIG. 10 is a cross-sectional view of a state in which the first plate H1200, the first (or second) recording element substrate H1100 (H1101), the second plate H1400, and the electric wiring tape H1300 are stacked and fixed. In this embodiment, the thickness of the first adhesive layer H1202 is 0.005 ± 0.004 mm, the thickness of the second adhesive layer H1203 is 0.02 ± 0.005 mm, and the thickness of the third adhesive layer H1306. Is 0.03 ± 0.003 mm, and each member is bonded by these adhesive layers. Further, the thickness of the solder resist of the electric wiring tape H1300 is 0.017 ± 0.0125 mm, and the height of the bump H1105 is 0.0325 ± 0.0075 mm. That is, the gap h between the upper surface of the bump H1105 and the electrode lead H1302 shown in FIG. 10 is 0.075 mm, and taking into account various tolerances, the tolerance range is ± 0.058 mm, which is generally effective in the thermosonic bonding method. It is in the range of the gap. Therefore, the bump H1105 and the electrode lead H1302 can be easily joined by the thermal ultrasonic pressure bonding method (inner lead bonding).
[0070]
By using the support member (plate), recording element substrate, and electrical wiring tape (flexible printed circuit board) having the above-described configuration, the reliability of the inner lead bonding can be improved and electrical connection can be realized with certainty.
[0071]
[Electrical connection]
With reference to FIG. 12, the sealing method around the electrical connection portion will be described.
[0072]
As described above, the periphery of the electrode portion 1104 of the recording element substrate and the electrode lead H1302 of the electric wiring tape H1300 is exposed in the state of being electrically bonded by the thermal ultrasonic pressure bonding method. Therefore, the gaps H1319A and H1319B and the upper portions H1320A and H1320B below the electrode lead H1302 are sealed with a sealant and sealed. At this time, since the electrode lead H1302 of the electric wiring tape H1300 is comb-shaped and has a gap, air is easily released, so that the reliability of the sealing process can be ensured.
[0073]
As shown in FIG. 25, the bump on the electrode pad of the recording element is electrically bonded to the lead (electrode terminal) of the electric wiring tape in advance by the conventional ultrasonic TAB mounting method, further sealed, and then supported. In the method of adhering to the body, even when the TAB unit H300U1 and the TAB unit H300U2 are assembled, the gaps H309A and H309B remain in the lower portion of the sealant H308. Further, it is necessary to pour a sealant (not shown). This part is already sealed at the top, so it is difficult for air to escape and air remains, and when using an epoxy-based thermosetting sealant, the air expands and opens holes, etc. Defects sometimes occurred.
[0074]
On the other hand, in this example, since the members present in the sealed portion are aligned and bonded, and finally sealed together, stable production without excess or deficiency of the sealing agent Is possible.
[0075]
It should be noted that the electrical junction and the sealant around the recording element substrate need not be the same.
For example, since the upper portions H1320A and H1320B of the electrode leads H1302 of the electric wiring tape H1300 may be scraped by a wiper member that wipes off ink, an epoxy hard sealant is preferable.
[0076]
Further, the periphery of the openings (device holes) H1 and H2 of the electric wiring tape H1300 is a capping region for performing capping for preventing ink evaporation in the nozzle, but the recording element substrates H1100 and H1101 and the electric wiring tape. After the H1300 is aligned, the third adhesive layer H1306 is adhered to the second plate H1400, so that a stable capping region can be ensured.
[0077]
In the ink jet recording apparatus of this embodiment, since both the black head and the color head are assembled and integrated on the same wiring board, it is not necessary to correct the ink landing positions of the heads.
[0078]
When different elements are mounted on a single TAB tape as in the above-described conventional example, the positional accuracy of each of them varies by 0.1 mm due to bonding accuracy to the TAB tape and subsequent deformation during sealing. The ink jet recording apparatus was not useful. On the other hand, according to the present embodiment, mutual positional accuracy can be ensured. Further, the color head of this embodiment has nozzles for three colors, so the outer dimensions of the color head are different from those of the black head. However, a plurality of recording element substrates having different dimensions are combined into a single flexible wiring board. As a result, the capping means of the recording apparatus can be reduced in size and the recording apparatus can be made smaller, and a single flexible wiring board can be used as the capping surface. The reliability of removing the extra ink adhering can be ensured, and a long-life inkjet recording head can be provided.
[0079]
[Example 2]
The present embodiment has almost the same configuration as the first embodiment, but the position of the upper surface of the second plate H1400 is 0.72 ± 0.05 mm, and the gap h1 between the bump H1005 and the electrode lead H1302 is 0. 105 ± 0.112 mm. This variation is ± 0.058 mm in the sum of squares. For example, as shown in FIG. 13, the gap h1 between the bump H1005 on the recording element substrate H1100 and the electrode lead H1302, and the bump H1005 on the recording element substrate H1101 Even if there is a difference between the gap h2 and the electrode lead H1302, it is within the gap range (150 μm or less) that is generally effective in the thermosonic bonding method, and reliable metal-to-metal bonding is possible.
[0080]
As described above, a plurality of recording element substrates are bonded and fixed to a single support member, and then a TAB tape is bonded by thermosonic bonding (inner lead bonding) to provide a reliable and inexpensive inkjet recording head. Can be manufactured.
[0081]
In the present embodiment, as shown in FIG. 14, an electric wiring tape H1300 and the second plate H1400 are bonded by thermocompression bonding using an adhesive sheet made of a thermosetting resin as the third adhesive layer H1306. However, as in the first embodiment, a configuration in which an adhesive that is not in the form of a sheet is applied and adhered may be used.
[0082]
[Example 3]
In this embodiment, as shown in FIGS. 15 and 16, the position of the joint surface of the second plate H1400 with the electric wiring tape H1300 is set to an error ± 0. 0 using the jig J01 with the apex of the bump H1105 as a reference. It is positioned at about 05 mm and bonded with an adhesive. According to this, the gap h3 between the bump H1005 and the electrode lead H1302 was 0.105 ± 0.0625 mm (± 0.052 mm in the sum of squares), and the variation was greatly reduced. Therefore, not only reliable metal bonding can be performed, but also variation in the required filling amount of the sealing agent due to variations in the height of the electrode lead H1302 and the thickness of the second plate H1400 in the resin sealing process can be suppressed. (For example, the difference between the gaps h3 and h4 is reduced). In addition, the distance between the ejection port H1107 and the recording medium can be reduced.
[0083]
Furthermore, the load for pressing the jig J01 against the bump H1005 is 1.2N per bump (12N when there are 100 bumps), and the variation in the upper surface of the bump H1005 is suppressed to ± 0.002 mm, thereby improving the flatness. You can also In that case, the gap h3 between the bump H1005 and the electrode lead H1302 was 0.105 ± 0.0425 mm (± 0.033 mm in the sum of squares), and the variation was further reduced.
[0084]
Further, as shown in FIG. 17, suction holes H3 and H4 are opened in the jig J02, and the position of the joint surface of the second plate H1400 with the electric wiring tape H1300 is determined with reference to the apex of the bump H1105. Positioning with an error of ± 0.01 mm while adsorbing via J02, a silicon-based sealant adhesive is injected into the gap between the first plate H1200 and the second plate H1400 and bonded. According to this, the gap h3 between the bump H1005 and the electrode lead H1302 was 0.105 ± 0.0225 mm (± 0.016 mm in the sum of squares), and the variation was further greatly reduced.
[0085]
According to this, since the center value of the dimension setting of the gap h3 between the bump H1005 and the electrode lead H1302 can be reduced from about 0.105 mm to about 0.03 mm, the distance between the ejection port and the recording medium can be further reduced.
[0086]
In this embodiment, a double-sided wiring type wiring board is used and a contact portion with the printer main body is provided on the opposite side of the recording element board. However, even if a single-sided wiring type is used, Japanese Patent Laid-Open No. 11-138814. As in the configuration of the publication, the recording head can be manufactured using another double-sided wiring board.
[0087]
[Example 4]
In the first embodiment, bumps H1105 such as Au are formed on the electrodes H1104 of the first recording element substrate H1100 and the second recording element substrate H1101 by a thermosonic bonding method, but the metal-to-metal bonding is limited to this. However, it is possible to increase the volume of the electrode part by plating using heat or the like to perform stable bonding. In Example 1, a TAB tape having electrode leads H1302 was used as the electric wiring tape H1300. However, an electric wiring tape having electrode terminals at a position several hundred μm apart from the electrode H1104 of the recording element substrate H1101 was used. After positioning and bonding, it is also possible to bond between metals by a thermosonic bonding method using a wire bonding method using Au wire or the like.
[0088]
FIG. 18 shows an embodiment of the wire bonding method, and the electrical wiring tape H1300W has a three-layer structure in which the periphery of the bonding portion is a base film H1300a, a copper foil H1300b, and a solder resist H1300c on the back side, as in the first embodiment. The electrode portion H1300d of the copper foil H1300b is gold-plated and exposed. The bonding process of each member is the same as in the first embodiment, but the electrode portion H1300d of the copper foil H1300b of the electric wiring tape H1300W is not located above the electrode H1104 of the recording element substrate H1101 as in the first embodiment. It is adhesively fixed on the second plate H1400 at a distance of several hundred μm.
[0089]
In this embodiment, the electrodes H1104 of the first recording element substrate H1100 and the second recording element substrate H1101 and the electrode portion H1300d of the copper foil H1300b of the electric wiring tape H1300W are used using a bonding wire W1100 such as an Au wire. Then, after wire bonding, sealing is performed with resin in the same manner as in Example 1.
[0090]
In general wire bonding equipment, the position of the electrical wiring tape does not have to be very accurate because thermosonic bonding is performed after recognizing each electrode and correcting the position. If the height of the bonding wire is not lowered, the ink landing position will shift. Usually, the height of the bonding wire is high at the first bonding, and the height varies as the bonding distance varies. Therefore, in this embodiment, as in the first embodiment, the alignment of the electric wiring tape H1300W is accurately performed with reference to the electrodes H1104 of the first recording element substrate H1100 and the second recording element substrate H1101, and bonding wires are used. The loop height of W1100 is stabilized, and the thickness of the second plate H1400 for bonding and fixing the electric wiring tape H1300W is made thinner than that of the first embodiment, and then the first recording is performed from the electrode portion H1300d of the electric wiring tape H1300W. Wire bonding is performed to the electrode portion H1104 of the element substrate H1100 and the second recording element substrate H1101.
[0091]
According to this embodiment, it is not necessary to form the bump H1105 such as Au on the electrode portion H1104 by the thermal ultrasonic pressure bonding method, and it is possible to manufacture a high-quality ink jet recording head that is inexpensive and has an accurate ink landing position.
[0092]
[Example 5]
In the example shown in FIGS. 19 and 20, the second recording element substrate H1101 of Example 1 described above is provided on a single recording element substrate by integrating the mechanisms for three colors of cyan, magenta, and yellow. In contrast, three independent recording element substrates, that is, a second recording element substrate H1101A (cyan), a third recording element substrate H1101B (magenta), and a fourth recording element substrate H1101C (yellow). have. The second to fourth recording element substrates H1101A to C1101C have the same outer size as the first recording element substrate H1100, and the size of the ejection port H1107 and the electrothermal transducer H1103 is larger than that of the first recording element substrate H1100. small.
[0093]
In the recording head having such a configuration, the pasting accuracy of the second recording element substrate H1101A, the third recording element substrate H1101B, and the fourth recording element substrate H1101C for color (three colors) is within ± 0.01 mm. However, it is necessary to accurately arrange these recording element substrates on the first plate H1200 in advance by image recognition, and adhere them using the second adhesive layer H1203, so that the required pasting accuracy can be achieved. It can be secured.
[0094]
After that, as described above, the bump H1105 on the electrode H1104 of the recording element substrate and the electrode lead H1302 of the electric wiring tape H1300 are joined one by one by the thermal ultrasonic pressure bonding method, which is electrically reliable. An ink jet recording head can be provided.
Thus, even in an ink jet recording head that uses recording element substrates having substantially the same outer dimensions, the use of a single flexible wiring substrate having openings of different sizes provides high reliability. A long-life inkjet recording head can be provided.
[0095]
Also in the present embodiment, as in the first embodiment, sealing around the electrical connection portion is performed. Among the three color recording element substrates, the sealing of the electrode portion of the third recording element substrate H1101B at the center is performed on the TAB tape as in the conventional TAB mounting method. However, in this embodiment, it is possible to reduce the yield by sealing the recording element substrate after pasting the recording element substrate to another member. A high-priced inkjet recording head can be provided.
[0096]
[Example 6]
In the embodiment shown in FIG. 21, the second plate is an independent frame H1400A or H1400B having a shape surrounding each of the two recording element substrates. Except for the difference in the shape of the second plate, the members used, the adhesives used, etc. are exactly the same as in Example 1. FIG. 22 shows a state in which the first plate H1200, the first (or second) recording element substrate H1100 (H1101), the second plates H1400A and H1400B, and the electric wiring tape (flexible printed circuit board) H1300 are stacked and fixed. It is sectional drawing. In the case of the present embodiment, since the second plate is a frame body that surrounds the recording element substrate, the electric wiring tape H1300 is only near the H bump 1105 of the recording element substrate H1100 (H1101) and around the recording element substrate. It is located one step higher than other places. Also in this example, as in Example 1, the bump H1105 and the electrode lead H1302 could be easily joined by the thermal ultrasonic pressure bonding method (inner lead bonding).
[0097]
[Example 7]
In the embodiment shown in FIG. 23, the second plate H1400C is positioned only in the vicinity of the bumps H1105 of the two recording element substrates. Except for the difference in the shape of the second plate, the members used, the adhesives used, etc. are exactly the same as in Example 1. In this embodiment, since the second plate H1400C is located only in the vicinity of the bump H1105 of the recording element substrate H1100 (H1101), the electrode lead H1302 of the electric wiring tape H1300 is the same as that of the recording element substrate H1100 (H1101). Only the vicinity of the bump H1105 is positioned one step higher than the other portions.
[0098]
Also in this example, as in Example 1, the bump H1105 and the electrode lead H1302 could be easily joined by the thermal ultrasonic pressure bonding method (inner lead bonding).
[0099]
【The invention's effect】
As described above, according to the present invention, a plurality ofRecording element on wiring boardIn the inkjet recording head configured to be bonded,Element substrate support memberA plurality of semiconductor chips (recording element substrates) are bonded to each other, and then a wiring substrate is laminated to form a recording element substrate.Electrode partAnd the wiring boardElectrode terminalIn contrast, in the manufacturing method in which the inner lead bonding step and the inner lead sealing step are performed, the reliability of the inner lead bonding can be improved and the electrical connection can be reliably realized.
[0100]
In particular, a plurality of recording element substratesWiring board support memberWas pasted with adhesiveElement substrate support memberFixed with adhesive,Electrode section of recording element substrateAnd the wiring boardWith electrode terminalsAfter aligning the wiring boardWiring board support memberFixed with adhesive,Electrode section of recording element board and electrode terminal of wiring boardAndThe jointBy sealing the resin with resin, it is possible to provide an ink jet recording head with good print quality, high reliability, and low cost.
[0101]
Electrode section of recording element substrate and electrode terminal of wiring substrateCan be provided with a more productive ink cartridge.
[0102]
further,Wiring board support memberThe top surface ofElectrode partBy making the distance from the upper surface constant, the metal-to-metal bonding and the sealing of the joint are performed, whereby a high-quality, high-reliability, and low-cost inkjet recording head can be provided.
[Brief description of the drawings]
1A is a perspective view of a recording head cartridge according to Embodiment 1 of the present invention, and FIG. 1B is an exploded perspective view thereof.
FIG. 2 is an exploded perspective view showing the configuration of the recording head shown in FIG.
3 is an exploded perspective view in which the recording head shown in FIG. 2 is further finely disassembled. FIG.
FIG. 4 is a partially cut-out explanatory perspective view showing a configuration of a recording element substrate in Embodiment 1 of the present invention.
FIG. 5 is a partially cut-away explanatory perspective view showing a configuration of another recording element substrate in Embodiment 1 of the present invention.
FIG. 6 is a cross-sectional view of a main part of the recording head cartridge in Embodiment 1 of the present invention.
FIG. 7 is a perspective view showing an assembly of a recording element unit and an ink supply unit in Embodiment 1 of the present invention.
FIG. 8 is a perspective view showing the bottom side of the recording head in Embodiment 1 of the present invention.
FIG. 9 is an exploded schematic cross-sectional view of a main part of a recording element unit according to Embodiment 1 of the present invention.
FIG. 10 is an enlarged cross-sectional view of a main part of the recording element unit in Embodiment 1 of the present invention.
FIG. 11 is an enlarged exploded perspective view of a main part of the recording element unit according to the first embodiment of the invention.
FIG. 12 is a cross-sectional view of the recording element unit in Embodiment 1 of the present invention.
FIG. 13 is a cross-sectional view of a recording element unit in Embodiment 2 of the present invention.
FIG. 14 is an exploded cross-sectional view of a recording element unit in Embodiment 2 of the present invention.
FIG. 15 is a cross-sectional view showing a recording element unit manufacturing process in Embodiment 3 of the present invention.
FIG. 16 is a cross-sectional view of a recording element unit in Embodiment 3 of the present invention.
FIG. 17 is a cross-sectional view showing a recording element unit manufacturing process in a modification of Embodiment 3 of the present invention.
FIG. 18 is a cross-sectional view of a recording element unit in Embodiment 4 of the present invention.
FIG. 19 is a perspective view of a recording head cartridge according to Embodiment 5 of the present invention.
20 is an exploded perspective view showing the configuration of the recording head shown in FIG.
FIG. 21 is an enlarged exploded perspective view of a main part of a recording element unit according to Embodiment 6 of the present invention.
FIG. 22 is an enlarged cross-sectional view of a main part of a recording element unit according to Embodiment 6 of the present invention.
FIG. 23 is an enlarged exploded perspective view of a main part of a recording element unit according to Embodiment 7 of the present invention.
FIG. 24 is an exploded schematic cross-sectional view of a main part of a conventional recording element unit.
FIG. 25 is a schematic cross-sectional view of a main part of a conventional recording element unit.
[Explanation of symbols]
H1000 recording head cartridge
H1001 recording head (inkjet recording head)
H1002 Recording element unit
H1003 Ink supply unit
H1100 First recording element substrate
H1101 Second recording element substrate
H1102 Ink supply port (supply port)
H1103 Electrothermal conversion element (recording element)
H1104 electrode(Electrode part)
H1105 Bump
H1106 Ink channel wall
H1107 Discharge port
H1108 Discharge port group
H1110 Si substrate
H1200 first plate(Element substrate support member)
H1201 Ink communication port
H1202 first adhesive layer
H1203 Second adhesive layer
H1300, H1300W Electrical wiring tape(Wiring board)
H1301 External signal input terminal
H1302 Electrode lead(Electrode terminal)
H1306 Third adhesive layer
H1309 Terminal positioning hole
H1400, H1400A, H1400B, H1400C Second plate(Wiring board support member)
H1500 ink supply member
H1501 ink flow path
H1503 1st hole
H1509 X butting part
H1510 Y butting part
H1511 Z butting part
H1512 terminal fixing part
H1515 Terminal positioning pin
H1520 joint
H1600 flow path forming member
H1601 wearing guide
H1602 Ink communication port
H1700 filter
H1800 seal rubber
H1900 ink tank
H1901 Black ink tank
H1902 cyan ink tank
H1903 Magenta ink tank
H1904 Yellow ink tank
H1907 Ink communication port
H1910 2nd nail
H2000 tank holder
H2300 Joint seal member
H2400 screw
H1, H2 device hole

Claims (10)

A recording element for generating energy utilized for discharging ink, and the electrode portion is connected to the recording element, but a plurality of recording element substrates respectively provided,
A wiring board having an electrode terminal electrically connected to the electrode portion of the plurality of recording element substrates, and transmitting an electric pulse for ejecting ink to the recording element;
An element substrate supporting member for supporting the plurality of recording element substrates;
A wiring board supporting member that supports the wiring board and is fixed on the element substrate supporting member;
A method of manufacturing an ink jet recording head having
Fixing the plurality of recording element substrates and the wiring board support member on the element substrate support member;
Aligning the electrode terminals of the wiring board with respect to the electrode portions of the plurality of recording element boards, and fixing the wiring board on the wiring board support member;
A step of inter-metal coupling the electrode portions of the plurality of recording element substrates and the electrode terminals of the wiring substrate;
In this order, the manufacturing method of the inkjet recording head characterized by the above-mentioned. The step of fixing the plurality of recording element substrates and the wiring board support member on the element substrate support member is performed using an adhesive.
The method further includes a step of sealing the connecting portion between the electrode portion and the electrode terminal with a resin after the step of inter-metal bonding the electrode portion of the plurality of recording element substrates and the electrode terminal of the wiring substrate. Item 10. A method for manufacturing an ink jet recording head according to Item 1 . In the step of fixing the wiring board on the wiring board support member, the gap between the electrode portions of the plurality of recording element boards and the electrode terminals of the wiring board is positioned so as to be 100 μm or less, and then both are positioned. a method for producing an ink jet recording head according to claim 1 or 2, bonds the metal. The step of fixing the plurality of recording element substrates and the wiring board support member on the element substrate support member includes fixing the plurality of recording element substrates on the element substrate support member by a first adhesive layer; Fixing the wiring board support member on the element substrate support member with a second adhesive layer,
The thickness of the plurality of recording element substrates plus the thickness of the first adhesive layer is thinner than the sum of the thickness of the wiring board support member and the thickness of the second adhesive layer. The manufacturing method of the inkjet recording head of any one of 1-3 . The electrode portions A method for producing an ink jet recording head according to any one of claims 1 to 4 including the bumps coupled between the metal of the plurality of recording element substrates. The wiring board plurality of openings wherein the plurality of recording element substrates are incorporated respectively is provided in any of the claims 1-5, further comprising the step of sealing with resin the periphery of the recording element substrate in the opening portion A method for producing an ink jet recording head according to claim 1. A method for producing an ink jet recording head according to any one of the plurality of recording element substrates at least one of different claims size or shape 1-6. Wherein the plurality of openings of the plurality of recording element substrates are incorporated respectively provided on the wiring board, according to any one of the opening size or at least one of different claims shapes 1-7 A method for manufacturing an inkjet recording head. A method for producing an ink jet recording head according to any one of claims 1-8 wherein the intermetallic bond is made by thermal ultrasonic pressing method. A method for producing an ink jet recording head according to any one of claims 1-8 wherein the intermetallic bond is made by wire bonding.

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