JP4546335B2 - Package cooling device - Google Patents

Description

The present invention relates to a package cold 却装 location to perform package cooled by blowing gas into the package.

  Since a semiconductor chip such as an LSI generates heat during driving, the temperature of the package in which the chip is incorporated also rises. Therefore, when performing a package performance test at various temperatures, a cooling device for maintaining the package at a plurality of set temperatures is required.

In the case of a package with a small calorific value, the package temperature can be brought close to the set temperature by setting the package to be tested in the thermostatic chamber and adjusting the temperature in the thermostatic chamber. However, in the case of a package with a large amount of heat generation, it is necessary to combine a cooling fan with a cooling device for a package with a small amount of heat generation, or a heat sink or a heat pipe (refrigerant circuit) (for example, see Patent Document 1). .
Japanese Unexamined Patent Publication No. 08-032263 (FIGS. 1 and 6)

  In the cooling device for a package having a large amount of heat generation, it is necessary that the forced air cooling of the heat sink by the cooling fan be performed satisfactorily. In other words, there is a problem that a package with a large amount of heat cannot be efficiently cooled.

The present invention is intended to realize the problems which has been made to solve the package cold 却装 location that can be cooled even efficiently a large package calorific value.

The invention according to claim 1 , which solves the above-described problem , includes a heat sink attached to the front surface side of the package, and a cooling gas from a direction crossing the surface of the package toward the heat generating portion of the package on the rear side of the heat sink. It is a package cooling apparatus provided with the nozzle to inject and the cooling fan which produces the flow of the gas along the surface of a package.

  In this invention, the cooling gas injected from the nozzle toward the heat generating part of the package locally generates a turbulent flow due to the collision in the vicinity of the heat generating part of the package, and this turbulent flow is generated from the vicinity of the heat generating part of the package. Take heat intensively. After that, the turbulent flow appropriately disturbs the gas flow by the cooling fan, and then is absorbed by the flow and leaves the surface of the package. Therefore, not only the flow of the gas by the cooling fan takes heat from the surroundings, but also the turbulent flow of the cooling gas sprayed from the nozzle takes heat from the vicinity of the heat generating portion of the package.

The invention according to claim 1 is the above-described package cooling device, wherein the heat sink is formed with an opening that exposes the surface of the package in a portion that receives the jet of cooling gas from the nozzle. A flow path through which a part of the cooling gas that collides with the surface of the package flows is formed in the side wall in the opening, and the heat sink fins of the heat sink follow the surface of the package by the cooling fan. It is characterized in that it is formed so as to generate a gas flow.

  In the present invention, the surface of the heat generating portion of the package is exposed due to the presence of the opening of the heat sink. Therefore, the cooling gas directly collides with the exposed portion, and the turbulent flow generated thereby directly removes heat from the heat generating portion of the package.

The invention according to claim 2 is the package cooling device according to claim 1, a temperature detection means for detecting the temperature of the package, so that the detection temperature of the temperature detection means reaches the set temperature, the injection of the cooling gas And a control means for adjusting the amount and the flow rate of the gas along the surface of the package.

In the present invention, the control means adjusts the injection amount of the cooling gas and the gas flow rate along the surface of the package so that the temperature detected by the temperature detection means becomes the set temperature.
The invention according to claim 3 is the package cooling device according to claim 1 or 2 , wherein the package cooling device cools a package mounted on a test socket, and the test socket is connected via a probe pin. A heat dissipating member for transferring the heat transferred into the test socket to the outside of the test socket, and the cooling fan also blows air to the heat dissipating member of the test socket located on the back side of the package. It is configured to be able to dissipate heat from the member.

  In the present invention, air is also blown from the cooling fan to the heat radiating member of the test socket located on the back side of the package, and the heat is also radiated from the heat radiating member.

According to the first aspect of the present invention, not only the flow of the gas by the cooling fan takes heat from the surroundings, but also the turbulent flow of the cooling gas injected from the nozzle locally takes heat from the vicinity of the heat generating portion of the package. Therefore, it is possible to realize a package cooling device that can efficiently cool a package even if the package generates a large amount of heat.

Further , according to the invention of claim 1 , the cooling gas directly collides with the exposed portion, and the turbulent flow generated thereby takes heat directly from the heat generating portion of the package, so that the package can be cooled more efficiently. A cooling device can be realized.

According to the invention which concerns on Claim 2 , the package cooling device which can make the temperature of a package into preset temperature is realizable.
According to the invention of claim 3 , since heat can be radiated from the heat radiating member of the test socket located on the back side of the package, a package cooling device that can cool the package more efficiently can be realized.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
This embodiment is intended for use in the performance test Pakeji at various temperatures, an embodiment relates to a cold 却装 location that can be adjusted package to the desired set temperature. For this reason, the package is configured to be attached to the test socket.

  FIGS. 1 and 2 show this embodiment. In both figures, a package 1 which is a test object includes a semiconductor chip 2 such as an LSI. Since the chip 2 generates heat during driving, the package 1 also rises in temperature with the chip 2 portion as a heat generating portion. Although not shown, the surface side of the package 1 is formed of a metal lid. A large number of terminals 3 are provided on the back side of the package 1 to exchange signals with the outside.

  A heat sink 5 is attached to the front surface side of the package 1 by affixing or pressing through a heat conductive sheet (not shown). The heat sink 5 of the present embodiment is one in which a large number of flat plate-like heat radiation fins 7 are arranged in parallel on a bottom plate 6.

  Cooling fans 11 and 12 are provided on the left and right sides of FIGS. 1 and 2 of the heat sink 5 so as to sandwich the heat sink 5, and gas (generally, air) in the right direction (thick arrow direction shown in FIG. 1). ) Is generated. The left cooling fan 11 includes upper and lower cooling fans 13 and 14, and the upper cooling fan 13 faces the heat sink 5. Similarly, the right cooling fan 12 includes upper and lower cooling fans 15 and 16, and the upper cooling fan 15 faces the heat sink 5. The radiating fins 7 of the heat sink 5 are arranged at regular intervals in the front-rear direction so that a gas flow along the surface of the package 1 is generated by the upper cooling fans 13 and 15.

  The nozzle 17 supplies a cooling gas (generally air) from the direction crossing the surface of the package 1 toward the chip 2 (heat generating portion) of the package 1 on the rear side (lower side in FIG. 1) of the heat sink 5. It is to be jetted. An opening 20 is formed in the bottom plate 6 of the heat sink 5 where the cooling gas is injected by the nozzle 17 (opposite the chip 2) so that the surface of the package 1 is exposed. Channels 21 to 24 through which a part of the cooling gas colliding with the surface of the package 1 flows to the surroundings (four sides) are formed in a groove shape on the front and rear and left and right side walls in the part 20.

  A test socket 30 to which the package 1 is mounted is provided with a large number of probe pins 31 that can contact one end of the terminal 3 of the package 1 in a pressed state. The other end of the probe pin 31 is in contact with a terminal on the signal extraction board 32. Signals are exchanged between the outside and the package 1 through the signal extraction board 32. When testing the package 1, the heat sink 5, the package 1, and the test socket 30 are elastically pressed and overlapped vertically.

  Since heat is transmitted to the test socket 30 from the package 1 through the probe pin 31, in this embodiment, the lower cooling fans 14 and 16 are opposed to the test socket 30 to radiate heat.

  The cooling fans 11 and 12 are driven by the drive circuit 41, and the ejection flow rate from the nozzle 17 is determined by the drive circuit 51 that determines the opening degree of the control valve 52. The temperature detection means 61 detects the temperature of the package 1 and is composed of a monitor resistor incorporated in the package 1 or a temperature sensor disposed close to the package 1. The control means 62 adjusts the injection amount of the cooling gas and the gas flow rate along the surface of the package 1 so that the temperature detected by the temperature detection means 61 becomes the set temperature.

  In the present embodiment, the cooling gas sprayed from the nozzle 17 toward the chip 2 which is the heat generating part of the package 1 locally generates a turbulent flow due to the collision in the vicinity of the heat generating part of the package 1. The flow concentrates heat away from the vicinity of the heat generating part 1 of the package. Thereafter, the turbulent flow appropriately disturbs the gas flow by the cooling fans 11 and 12, and then is absorbed by the flow and leaves the surface of the package 1. Therefore, not only the gas flow by the cooling fans 11 and 12 takes heat from the surroundings, but also the turbulent flow of the cooling gas injected from the nozzle 17 takes heat from the vicinity of the heat generating portion of the package 1. Therefore, even if the package 1 generates a large amount of heat, the package 1 can be efficiently cooled.

  In particular, in the present embodiment, the opening 20 is formed so that the surface of the package 1 is exposed at the portion of the heat sink 5 that receives the injection of the cooling gas from the nozzle 17. For this reason, the cooling gas directly collides with the exposed portion, and the turbulent flow generated thereby directly removes heat from the heat generating portion of the package 1. In addition, since the channels 21 to 24 through which a part of the cooling gas that collides with the surface of the package 1 flows out are formed in the opening 20, a strong collision can be expected. Therefore, the package 1 can be cooled more efficiently.

  Further, the control means 62 sets the injection amount of the cooling gas by the nozzle 17 and the gas flow rate along the surface of the package by the cooling fans 11 and 12 so that the temperature detected by the temperature detection means 61 becomes the set temperature. In order to adjust, temperature control is made favorable. At this time, adjustment of the injection amount of the cooling gas by the nozzle 17 is mainly used for fine adjustment of the temperature, and adjustment of the gas flow rate along the surface of the package by the cooling fans 11 and 12 is mainly for rough adjustment of the temperature. However, it is desirable to use both in a region where the deviation is large.

Furthermore, in the present embodiment, the lower cooling fans 14 and 16 also blow air to the test socket 30 located on the back side of the package 1 to dissipate heat from the test socket 30 to increase the cooling effect.
(Second Embodiment)
A second embodiment will be described with reference to FIG. The present embodiment is different from the first embodiment in the structure of the test socket. Therefore, only the test socket portion will be described, and the other portions will be denoted by the same reference numerals as those in FIGS. 1 and 2 in FIG.

  In this embodiment, the test socket 30 is also cooled, and the test socket 30 dissipates heat that is transferred to the outside of the test socket 30 through the probe pins 31. It has a member and receives heat from the lower cooling fans 14 and 16 by this heat radiating member so that heat can be effectively radiated from the heat radiating member.

  The center portion of the test socket 30 has a four-layer structure, and a resin plate 33 with holes for aligning the probe pins 31 is sandwiched between the three layers among the three layers. The metal heat conduction plates 34 and 35 are sandwiched between the upper and lower layers with the left and right ends exposed to the outside. Further, resin plates 36 and 37 for preventing the probe from falling off are attached to the top and bottom of the four-layer structure.

  Conductive plates 38 and 39 are laminated on the lower surface of the signal extraction board 32 via an insulating sheet (not shown). The conductive plates (made of metal) 38 and 39 supply power to the package 1. For example, the conductive plate 38 that contacts the intermediate probe pin 31a is kept at the ground potential and contacts the longest probe pin 31b. The conductive plate 39 is kept at the power supply voltage. The left and right ends of these conductive plates 38 and 39 protrude outward.

In particular, the heat conductive plates 3 4 and 35 and the conductive plates 38 and 39 are formed of a metal such as a copper plate, and a part of the heat conductive plates 3 4 and 35 and the conductive plates 38 and 39 are exposed to the outside of the test socket 30. It is exposed to the wind that is sent. For this reason, the heat transmitted into the test socket 30 through the probe pin 31 is radiated through the plates 3 4 , 3 5 , 38, 39 that function as a heat radiating member. Therefore, the package 1 is radiated on both the front surface side and the back surface side, and the cooling effect of the package 1 is greatly improved.

  In the above embodiment, there is one chip 2 which is a heat generating part in the package 1. However, when there are a plurality of heat generating parts that need to be radiated, the number of openings 20 in the heat sink 5 is the same. The nozzles 17 may be provided corresponding to the number of openings 20. Further, the number of flow paths provided on the side wall of the opening 20 is not limited to four, and may be 1 to 3, or 5 or more. Of course, when the package 1 is simply cooled and it is not necessary to maintain the predetermined temperature, the temperature detecting means 61 and the control means 62 are unnecessary.

It is a perspective view which shows the 1st example of an embodiment of the present invention (a part is expressing the AA section of Drawing 2). It is a top view which shows the 1st example of an embodiment of this invention. It is sectional drawing which shows the principal part of the 2nd Embodiment of this invention.

Explanation of symbols

1: Package 2: Chip 3: Terminal 5: Heat sink 6: Bottom plate 7: Radiation fins 11 and 12: Cooling fan 17: Nozzle 20: Openings 21 to 24: Channel 30: Test socket 31: Probe pin 32: Signal extraction Substrate 34, 35: Thermal conduction plate 38, 39: Conductive plate 41, 51: Drive circuit 52: Control valve 61: Temperature detection means 62: Control means

Claims (3)

A heat sink attached to the surface side of the package, a nozzle for injecting a cooling gas from the direction crossing the surface of the package toward the heat generating part of the package on the rear side of the heat sink, and a gas flow along the surface of the package A package cooling device comprising a cooling fan for generating a flow,
In the heat sink, an opening that exposes the surface of the package is formed in a portion that receives the injection of the cooling gas from the nozzle, and the side wall in the opening collides with the surface of the package. A package cooling device in which a flow path through which a part of the cooling gas flows is formed, and the heat sink fin of the heat sink is formed so that the gas flows along the surface of the package by the cooling fan. . Temperature detecting means for detecting the temperature of the package ;
Control means for adjusting the injection amount of the cooling gas and the flow rate of the gas along the surface of the package so that the temperature detected by the temperature detection means becomes a set temperature;
The package cooling apparatus according to claim 1, further comprising: The package cooling device cools a package mounted on a test socket, and the test socket is configured to transmit heat transferred into the test socket via a probe pin to the outside of the test socket. 3. A heat radiating member is provided, and the cooling fan is configured to blow air to the heat radiating member of the test socket located on the back side of the package, and to radiate heat from the heat radiating member. Package cooling device as described.

Images