JP4546232B2 - Electroforming mold and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electroforming mold used in an electroforming method and a manufacturing method thereof, and more particularly, to a die used for manufacturing a part having a high aspect ratio and a minute shape and a manufacturing method thereof.

  The electroforming method is suitable for mass production and is used for manufacturing various parts. For example, a watch is manufactured by depositing a conductive film on the resin surface to which the original shape is transferred (see, for example, Patent Document 1).

  A heat press molding method is known as a transfer method to the original resin (see Non-Patent Document 1). The hot press molding method is a method in which the resin is heated to a temperature equal to or higher than the glass transition point and softened, and the original shape is transferred to the resin by pressing the original. In the hot press molding method, the original shape can be transferred to a resin with dimensional accuracy on the order of nanometers.

  In recent years, a mold using a silicon process has been used as a mold for manufacturing a component or mold having a minute shape. The LIGA method (Lithographie Galvanoformung Abformung) is well known as a method for producing an electroforming mold using a silicon process. In the LIGA method, PMMA (polymethyl methacrylate), which is a resist material, is applied on an electrode, and the resist material is exposed to synchrotron radiation within a desired shape range, developed, and then developed. This is a method of producing a microstructure having a desired fine shape by casting (see, for example, Non-Patent Document 2).

  An example of forming a multistage structure such as a transmission gear by repeating the LIGA method a plurality of times is known (see, for example, Patent Document 2).

  Further, instead of the expensive synchrotron radiation used in the LIGA method, a UV-LIGA method for forming a resist pattern with ultraviolet light used in a general semiconductor exposure apparatus is also used. The electroforming mold produced by the LIGA method or the UV-LIGA method has no electrode on the side wall of the mold, and the electroformed product is deposited from the bottom surface of the mold. Therefore, a high aspect ratio structure is produced by the electroforming method. However, it is possible to form a good part free from bubbles and defects inside the electroformed product. Similarly to Patent Document 2, a multi-stage shape can be produced by repeatedly performing the UV-LIGA method a plurality of times.

In addition, there is a method in which a replica mold is formed and an electroformed product is formed using a shape manufactured by the LIGA method or the UV-LIGA method as a prototype. For example, a method of forming a replica mold by embedding a silicon resin in an original mold patterned with a photosensitive resin on a glass substrate is known (see, for example, Patent Document 3).
JP-A-52-60241 Japanese Patent Laid-Open No. 11-15126 JP-A-10-168591 Present state of nanoimprint Journal of the Japan Society for Abrasive Technology 46 vol.6 p282 W. Ehrfeld,: IEEE, Micro Electro Mechanical System Proceedings PP86,1994

  Conventionally, however, an electrode is obtained by forming electrodes on all surfaces (hereinafter, electroformed surfaces) on which electroforming of a resin whose shape has been transferred (hereinafter, transfer resin mold) is performed. Therefore, when electroforming is performed, the electroformed product is deposited on the entire surface on which the electrode of the electroforming mold is formed. Therefore, in order to take out the timepiece hand, it is necessary to remove unnecessary portions. In addition, when producing electroformed parts with a high aspect ratio, if electroforming is performed simultaneously from the mold side and the mold bottom, the electric field concentrates on the opposite side of the mold side to the mold bottom, that is, the mold top surface. It is easy to increase the electroforming speed on the mold upper surface side of the mold side surface. Therefore, the electroformed product deposited from the side surface of the die is connected to the upper surface portion of the die, and a gap is formed inside the electroformed product. Therefore, there is a problem that the strength and mold transferability of the electroformed part are lowered.

  Conventionally, an electrode is obtained by forming an electrode only on the bottom surface of the recessed portion of the transfer resin mold using a mask when forming the electrode. Therefore, it is necessary to align the mask shape with the shape of the transfer resin mold, and it takes time for the alignment, and a desired electrode pattern cannot be formed due to the positional deviation between the mask shape and the shape of the transfer resin mold. There were problems such as. The finer the shape of the transfer resin mold is, the more difficult it is to form an electrode pattern only on the bottom surface of the mold.

  Further, conventionally, it is necessary to deposit, expose, and develop a resist material in order to produce an electroforming mold, and there is a problem that many steps must be performed before obtaining the electroforming mold. Furthermore, it is necessary to deposit, expose, and develop a resist material after the first stage of electroforming, and there is a problem that the manufacturing cost increases as the number of stages increases. FIG. 9 is a diagram for explaining a state in which a multi-stage resist mold 204 is formed on the electrode 202 and electroforming is performed. When electroforming is performed to the thickness of the first stage 204a on the electrode 202, and further electroforming is performed, since there is no electrode on the upper surface C of the first stage 204, the direction indicated by the arrow B, that is, parallel to the electrode surface In the direction, the electroformed product 2100 is difficult to grow. Therefore, even if the electroformed product 2100 is grown to the height of the second stage 204b, the inside of the cavity 2103 cannot be filled with the electroformed product 2100. In order to completely fill the cavity 2103 with the electroformed product 2100, it was necessary to increase the thickness of the electroformed product 2100. Therefore, there is a problem that the electroforming time becomes long and the polishing time for making the electroformed product 2100 to a desired thickness becomes long. In order to solve this problem, a method of depositing metal on the resist mold 204 having a multi-stage structure and patterning can be considered. However, as the number of steps increases, the pattern accuracy varies depending on the difference in the height of the resin, and a desired pattern is obtained. There was a problem that it was difficult to obtain an electrode pattern.

  Conventionally, a transfer resin mold is produced using a hot press molding method, and the original shape can be easily transferred in a short time. However, in the hot press molding method, a residual film is formed, so that even if a conductive material is used for the substrate, conduction between the substrate and the electroformed surface cannot be obtained, so an electroforming mold having electrodes only on the bottom surface is obtained. It was difficult. In addition, it is considered that an electroforming mold having an electrode only on the bottom surface can be obtained by removing the residual film by etching using oxygen plasma. However, etching using oxygen plasma is isotropic etching, so There was a problem that the dimensional accuracy of the mold deteriorated.

  The present invention has been made in view of the above problems, and an object thereof is to provide an electroforming mold having an electrode on each bottom surface of a multistage structure and a method for producing the same, which can be easily manufactured by a hot press molding method. To do.

  Therefore, the present invention has a conductive layer formed on the substrate, a first metal layer formed on a part of the back surface of the conductive layer facing the substrate, and a first metal layer on the back surface of the conductive layer. The structure includes a resin layer having a stepped portion formed in a region not to be removed, and a second metal layer provided on the surface of the stepped portion so as to be separated from the first metal layer.

  Also, in an electroforming mold used in electroforming, a conductive conductor, a resin formed on the conductor and having a part shape transferred thereon, particles dispersed in the resin and having conductivity at least on the surface And an electric mold characterized in that one or more of the particles are in contact with a conductor and in contact with at least a part of the metal layer. In addition, the electroforming mold is characterized in that the resin is a multistage structure having two or more layers, and the insulated metal layers are formed in each layer. Moreover, only the metal layer formed in the layer closest to the conductor among the metal layers was electrically connected to the conductor and the particles, thereby forming an electroforming mold. Further, an electroforming mold characterized in that particles are dispersed throughout the resin. In addition, an electroforming mold is characterized in that the resin includes an anisotropic conductive layer in which particles are dispersed and a non-particle-containing resin layer that does not contain particles. Further, the electroforming mold is characterized in that the particles are composed of a spherical core portion and a conductor layer formed so as to cover the core portion. Further, the material of the core part is a resin, and the glass transition point of the resin of the core part is higher than the glass transition point of the resin layer or the anisotropic conductive layer and the non-particle-containing resin layer. A mold was used. Further, the electroforming mold is characterized in that the material of the core portion is a metal. Further, the electroforming mold is characterized in that the core part and the conductor layer are made of the same material. In addition, an electroforming mold characterized in that a plurality of component shapes are transferred.

  A step of forming a conductive conductor on the substrate; a resin forming step of forming a resin layer on the conductor; a metal layer forming step of forming a metal layer on the resin; and a hot press molding method. Using a shape transfer step of transferring the original shape to the resin, wherein the resin contains at least one conductive particle on the surface, and the metal layer is separated and cut in the shape transfer step. It was set as the manufacturing method of the characteristic electroforming mold.

  Further, the prototype is a multi-stage structure having a stepped shape, and in the shape transfer step, the metal layer is separated and cut into one or more, and the separated and cut metal layer is formed into a height of each layer in the stepped shape on the resin. The electroforming mold manufacturing method is characterized in that it is formed at a position corresponding to the thickness. Further, in the resin forming step, a method of manufacturing an electroforming mold is characterized in that a resin in which particles are dispersed throughout the resin is formed. In addition, the resin forming step includes a step of forming an anisotropic conductive layer in which particles are dispersed and a step of forming a non-particle-containing resin layer that does not contain particles. It was a method. Further, the electroforming method is characterized in that the particles comprise a spherical core portion and a conductor layer formed so as to cover the core portion. Further, the material of the core part is a resin, and the glass transition point of the resin of the core part is higher than the glass transition point of the resin layer or the anisotropic conductive layer and the non-particle-containing resin layer. A mold manufacturing method was adopted. Further, the electroforming mold manufacturing method is characterized in that the material of the core portion is a metal. Further, the electroforming method is characterized in that the core part and the conductor layer are made of the same metal material. In the shape transfer step, the shape of a plurality of the parts is transferred.

  In addition, the conductive layer formed on the substrate, the first metal layer formed on a part of the back surface of the conductive layer facing the substrate, and the first metal layer on the back surface of the conductive layer without the first metal layer. A step of immersing an electroforming mold formed in the electroforming liquid having a resin layer having a stepped portion and a second metal layer provided on the surface of the stepped portion apart from the first metal layer; A step of applying a voltage to supply electrons to the first metal layer, a step of depositing metal on the exposed surface of the first metal layer, and a part of the deposited metal contacting the second metal layer And a step of supplying electrons to the second metal layer, and a step of depositing metal on the exposed surface of the metal layer and the exposed surface of the second metal layer.

  Therefore, the shape of the original shape can be transferred to the resin by the heat press molding process, the metal layer subjected to the shear stress is cut and separated to be formed as an electrode on the bottom surface of the resin, and the particles are crushed by the original shape, The electrical connection between the conductive layer and the metal layer can be established via 5. Further, when the prototype has a multi-stage structure, a metal layer can be formed on the bottom surface portion of each layer of resin. Further, when the particle core material is a resin and has a glass transition point at a temperature higher than the glass transition point of the resin, since the hardness of the particles is large, the anisotropic conductive particles 5 are different from those of the resin 4 and the resin. It becomes easy to break through the remaining film of the anisotropic conductive layer 3. Further, when the particles are dispersed throughout the resin, the resin forming step can be omitted by one step. Moreover, a plurality of electroformed parts can be obtained by a single electroforming by transferring a plurality of part shapes. At this time, since the component shapes are independent of each other, each electroformed component can be taken out independently.

  Therefore, according to the present invention, it is possible to provide an electroforming mold having an electrode on each bottom surface of a multistage structure and a manufacturing method thereof, which can be easily manufactured by a hot press molding method.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram for explaining a method of manufacturing an electroforming mold 101 according to Embodiment 1 of the present invention. First, as shown in FIG. 1A, a transfer resin mold precursor 102 and a master 6 are prepared. The transfer resin type precursor 102 includes a conductive layer 2 formed on the substrate 1, an anisotropic conductive layer 3 formed on the conductive layer 2, and a resin formed on the anisotropic conductive layer 3. 4 and a metal layer 7 formed on the resin 4. In the anisotropic conductive layer 3, anisotropic conductive particles 5 are dispersed. As shown in FIG. 3, the anisotropic conductive particles 5 are obtained by forming a conductive film 52 on the surface of a resin ball 51. The prototype 6 is made of a machining method such as machining, electric discharge machining, LIGA method, UV-LIGA method, RIE (Reactive Ion Etching) method, DRIE (Deep Reactive Ion Etching) method or the like. In FIG. 1, the mold 6 has a two-stage structure including two layers having different heights, but may have a one-stage structure or a multistage structure of three or more stages. The thickness of the substrate 1 is several tens of μm to several mm, and may be any thickness that can maintain the strength of the electroforming mold 101 in the electroforming process described later. The thickness of the conductive layer 2 is from several tens of nm to several μm, and may be any thickness as long as conduction can be obtained in an electroforming process described later. The thickness T3 of the anisotropic conductive layer 3 is several μm to several hundred μm, and may be larger than the diameter D5 of the anisotropic conductive particle 5. The average diameter D5 of the anisotropic conductive particles 5 is several μm to several tens of μm. The thickness T4 of the resin 4 may be approximately the same as the thickness of the electroformed part to be produced, and is several μm to several mm. The height H6 of the prototype 6 may be equal to or greater than the thickness of the electroformed part to be produced, and is several μm to several mm. In addition, the thickness D7 of the metal layer 7 is several tens of nm to several hundreds of μm, and may be any thickness that allows electrical connection after the hot press molding process described later. However, in order to sufficiently crush the anisotropic conductive particles 5 in the hot press molding process described later,
H6> T4 + T3 + D7−D5 (Formula 1)
It is desirable that

  The material of the substrate 1 is a material generally used in a silicon process such as glass or silicon, or a metal material such as stainless steel or aluminum. The material of the conductive layer 2 is gold (Au), silver (Ag), nickel (Ni), etc., and an anchor metal (for enhancing the adhesion of the conductive layer 2 between the conductive layer 2 and the substrate 1) Chrome (Cr), titanium (Ti), or the like may be formed as not shown. In addition, when the material of the board | substrate 1 is a metal, the conductive layer 2 is not necessarily required. The resin 4 and the anisotropic conductive layer 3 are made of thermoplastic resin such as vinyl chloride (PVC), polymethyl methacrylate (PMMA), polystyrene (PS), polycarbonate (PC), polyethylene terephthalate (PET), etc. A thermosetting resin such as epoxy is used. The material of the resin 4 and the anisotropic conductive layer 3 may be the same material or different materials. The material of the ball 51 is a thermoplastic resin such as PMMA, PVC, PS, PC, or PET, a thermosetting resin such as epoxy, a material used in a silicon process such as glass or silicon, or a metal such as gold or aluminum. Use. The conductive film 52 is made of a metal such as gold or silver. Alternatively, a layer in which chromium, titanium, or the like is deposited as an adhesion reinforcing layer (not shown) between the ball 51 and the conductive film 52 may be used. Further, the ball 51 may be made of the same metal material as that of the conductive film 52. The material of the prototype 6 is a material used in a silicon process such as Ni, an alloy of Ni and cobalt (Co) (Ni—Co alloy), a metal such as stainless steel (SUS), or glass or silicon. The formation method of the conductive layer 2 is a sputtering method, a vacuum evaporation method, or the like. Moreover, the formation method of the anisotropic conductive layer 3 is methods, such as a spin coat and a roll coat, using an anisotropic conductive paste (ACP: Anisotropic Conductive Paste). In addition, the anisotropic conductive layer 3 may be formed by attaching a film-like anisotropic conductive film (ACF: Anisotropic Conductive Film). The resin 4 may be formed by spin coating a liquid resin, adhering a plate-like resin, or simply placing the resin 4 on the anisotropic conductive layer 3. The material of the metal layer 7 is a metal such as nickel, gold, platinum, or silver. The formation method of the metal layer 7 is a physical thin film formation method such as a vacuum deposition method or a sputtering method, a plating method, or an electroforming method. Further, the metal layer 7 may be formed by adhering a sheet-like metal plate on the resin 4, or simply placing the metal plate on the resin 4.

  Next, FIG. 1B is a diagram showing a state in which the mold 6 is pressed against the transfer resin mold precursor 102 by the heat press molding process. FIG. 5 is a diagram for explaining the hot press molding process. The hot press molding apparatus includes a resin side heater 34, a mold side heater 32, a movable stage 33, a resin side heater temperature control unit 35, a mold side heater temperature control unit 36, and a movable stage controller 37. 6 is fixed, and the transfer resin mold precursor 102 is fixed to the resin side heater 34. The method of fixing the mold 6 to the mold side heater is performed using a method such as mechanically fixing with a screw or a pin, fixing with an adhesive, welding or joining. The temperatures of the mold side heater 32 and the resin side heater 34 are controlled by temperature control units 35 and 36. The movable stage 33 is controlled by a movable stage controller 37 and can change the relative distance between the mold 101 and the resin 31. The heaters 32 and 34 are heated by the temperature control units 35 and 36 above the higher glass transition point of the glass transition point of the resin 4 and the anisotropic conductive layer 3 constituting the transfer resin type precursor 102 to be movable. The stage 33 is moved and the mold 6 is pressed against the transfer resin mold precursor 102. Since the resin of the transfer resin mold precursor 102 having a glass transition point or higher has fluidity, the shape of the mold 6 can be accurately transferred. The mold 6, the transfer resin mold precursor 102, the heater 32, the heater 34, and the stage 33 are placed in a vacuum chamber (not shown), and the vacuum chamber is placed in a reduced pressure atmosphere by a vacuum exhaust unit (not shown). The transfer accuracy of the resin mold precursor 102 to the mold 6 can be improved. At this time, as shown in FIG. 1B, the anisotropic conductive particles 5 are crushed into anisotropic conductive particles 5a. The portion where the anisotropic conductive particles 5a are formed is a portion where the space between the mold 6 and the conductive layer 2 is equal to or less than the diameter D5 of the anisotropic conductive particles 5. The metal layer 7 is subjected to shear stress by the mold 6 and is cut into a shape corresponding to a portion parallel to the surface of the metal layer 7 of the mold 6 to form metal layers 7a, 7b, and 7c. In addition, in order to facilitate separation of the mold 6 and the transfer resin mold precursor 102 in a mold release process to be described later, before the heat press molding process, a fluorocarbon resin or a silicone resin is used as a mold release agent in the mold 6. It may be applied. In addition, when the material of the ball 51 of the anisotropic conductive particle 5 is a resin, the material of the ball 51 is, in order for the anisotropic conductive particle 5 to easily break through the remaining film of the resin 4 and the anisotropic conductive layer 3. It is desirable to use a material having a glass transition point higher than that of the material of the resin 4 and the anisotropic conductive layer 3.

Next, after the heat press molding step, the resin 4 and the anisotropic conductive particles 5 are heated or cooled until they are cured, and the mold 6 is separated from the resin as shown in FIG. An electroforming mold 101 is obtained. 2, in FIG. 1 (d), the is an enlarged view of a portion indicated by a broken line A. Since the contact area between the spherical anisotropic conductive particles 5 and the conductive layer 2 and the mold 6 becomes very small, no conduction film is formed between the anisotropic conductive particles 5 a and the conductive layer 2. And the surface of the anisotropic conductive particle 5a comes into contact with the metal layer 7a. That is, it is possible to form a transfer resin mold necessary for forming the electroforming mold 101 and to form electrodes only on the bottom surface of the electroforming mold 101 by a single hot press molding process. At the same time, metal layers 7 b and 7 c corresponding to a portion parallel to the substrate 1 in the stepped shape of the mold 6 can be formed.

  Next, as shown in FIG. 1D, the metal layer 7 c is removed by a method such as polishing or a peeling method using an adhesive tape to obtain the electroforming mold 101. In addition, you may use as the electroforming mold 101, without removing the metal layer 7c.

  FIG. 6 is a diagram for explaining an electroforming process using the electroforming mold 101. The electrocasting iron 21 is filled with the electroforming liquid 22, and the electroforming mold 101 and the electrode 23 are immersed in the electroforming liquid 22. The electroforming liquid 22 varies depending on the metal to be deposited. For example, when nickel is deposited, an aqueous solution containing nickel sulfamate hydrate is used. The material of the electrode 23 is substantially the same material as the metal to be deposited. When nickel is deposited, nickel is used, and a nickel plate or a nickel basket with a nickel ball is used as the electrode 23. The material deposited by the production method of the present invention is not limited to nickel. The present invention is applicable to all materials that can be electroformed, such as copper (Cu), cobalt (Co), and tin (Sn). The conductive layer 2 of the electroforming mold 101 is connected to the power source V. By supplying electrons from the metal layer 7a through the conductive layer 2 and the anisotropic conductive particles 5 by the voltage of the power source V, the metal is gradually deposited from the metal layer 7a. The deposited metal grows in the thickness direction of the substrate 1.

  FIG. 4 is a diagram for explaining a process for producing the electroformed component 100 using the electroforming mold 101. By the electroforming process described with reference to FIG. 6, the electroformed product 100a is deposited from the metal layer 7a as shown in FIG. At this time, since no current flows through the metal layer 7b, the electroformed product 100a is not deposited on the metal layer 7b.

  Next, as shown in FIG.4 (b), electroforming is performed so that it may become more than desired thickness. At this time, when the electroformed product 100a deposited from the metal layer 7a comes into contact with the metal layer 7b, electrons are also supplied from the metal layer 7b, so that the electroformed product 100a is also deposited on the metal layer 7b. Note that the voltage or current of the power source may be changed so that the current density becomes constant at the moment when the electroformed product 100a contacts the metal layer 7b.

  Next, the thickness of the electroformed product 100a is made uniform by a polishing process. In the electroforming process, when the thickness of the electroformed product 100a can be controlled, the polishing process may not be performed.

  Next, as shown in FIG. 4C, the electroformed product 100 a is taken out from the electroforming mold 101 to obtain the electroformed component 100. For example, the electroformed product 100a can be taken out by dissolving the resin 4 and the anisotropic conductive layer 3 with an organic solvent, or heating and softening the resin 4 and the anisotropic conductive layer 3 with the electroformed product 101a. This is done by applying a force to separate Further, the metal layers 7a and 7b are removed using a method such as wet etching or polishing. If there is no problem even if the metal layers 7a and 7b are attached in terms of the function of the component, the metal layers 7a and 7b may not be removed. Further, when the metal layers 7a and 7b are necessary for the function of the component, the metal layers 7a and 7b are not removed.

As described above, according to the first embodiment of the present invention, the shape of the prototype 6 can be transferred to the resin 4 and the anisotropic conductive layer 3 by the hot press molding process, and parallel to the substrate 1 of the prototype 6. The metal layers 7a and 7b can be formed corresponding to the portions. At the same time, the anisotropic conductive particles 5 dispersed in the anisotropic conductive layer 3 are crushed by the prototype 6, and the conductive layer 2 and the metal layer 7a are electrically connected via the anisotropic conductive particles 5. it can. Therefore, it is possible to provide an electroforming mold that can be easily manufactured by a hot press molding method, in which an electroformed product is deposited only from the bottom surface of the mold, and when the electroformed product grows, the electroformed product also grows from the bottom surface of the second stage. be able to. Further, by making the relationship among the height T3 of the anisotropic conductive layer 3, the thickness T4 of the resin 4, the average diameter D5 of the anisotropic conductive particles, and the height H6 of the mold 6 as shown in Equation 1, Since the mold 6 and the resin 4 do not contact each other, the anisotropic conductive particles 5 can be reliably crushed. Therefore, the electroforming mold 101 with good conductivity can be obtained. Further, when the material of the balls 51 of the anisotropic conductive particles 5 is a resin and has a glass transition point higher than the glass transition points of the resin 4 and the anisotropic conductive layer 3, the anisotropic conductive particles 5 Since the particle 5 has a high hardness, the anisotropic conductive particle 5 easily breaks through the remaining film of the resin 4 and the anisotropic conductive layer 3, and the electroforming mold 101 having stable conductivity can be manufactured.

  Note that, as shown in FIG. 7, even if the resin transfer type precursor 103 in which the resin layer is formed only by the anisotropic conductive layer 3 instead of the resin 4 is used, the electroforming process is performed in the same manner as the resin transfer type precursor 102. Can be obtained. The sum of the thickness T3b of the anisotropic conductive layer 3 of the resin transfer type precursor 103 and the thickness of the metal layer 7 may be equal to or greater than the thickness of the electroformed component 100 to be produced. In this case, since the resin forming step can be omitted, the electroforming mold 101 can be obtained in a short time.

  In the above description, the method for producing one electroformed component 100 from the electroforming mold 101 has been described. However, by forming the shape of the plurality of electroformed components 100 on the master 6, a plurality of electroformed components 100 as shown in FIG. Can be formed, and a plurality of electroformed parts 100 can be obtained by one electroforming. At this time, since the cavities 103 are separated from each other, each electroformed component 100 can be taken out independently. Therefore, the process of separating parts can be omitted.

It is a figure explaining the manufacturing method of the electroforming mold concerning Embodiment 1 of the present invention. It is an enlarged view of the electroforming mold concerning Embodiment 1 of the present invention. It is a figure which shows the structure of an anisotropic conductive particle. It is a figure explaining the manufacturing method of the electroformed component using the electroforming mold which concerns on Embodiment 1 of this invention. It is a figure explaining the hot press molding method for producing the electroforming mold concerning Embodiment 1 of this invention. It is a figure explaining the electroforming method using the electroforming mold concerning Embodiment 1 of this invention. It is a figure explaining the resin transfer type precursor which concerns on Embodiment 1 of this invention. It is a figure showing the electroforming mold which has a plurality of cavities. It is a figure explaining the growth state of the electroformed product using the conventional electroforming mold.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Conductive layer 3 Anisotropic conductive layer 4 Resin 5, 5a Anisotropic conductive particle 6 Prototype 7, 7a, 7b Metal layer 100 Electroformed component 101 Electroforming mold

Claims (20)

A conductive layer formed on the substrate;
An anisotropic conductive layer made of a resin in which anisotropic conductive particles formed on the conductive layer are dispersed;
A metal layer formed on the anisotropic conductive layer and a resin layer having a multistage structure;
A metal layer formed on each layer of the resin layer, insulated from the anisotropic conductive layer, and insulated from each layer;
An electroforming mold. The electroforming mold according to claim 1, wherein a back surface of a surface facing the anisotropic conductive layer of the uppermost layer of the resin layer having a multistage structure is exposed. The electroforming mold according to claim 1, wherein the resin layer is composed of two layers . The electroforming mold according to any one of claims 1 to 3 , wherein the anisotropic conductive particles are dispersed throughout the resin. The electroforming mold according to any one of claims 1 to 4 , wherein the anisotropic conductive particle includes a spherical core portion and a conductive film formed so as to cover the core portion. The electroforming mold according to claim 5 , wherein a material of the core part is a resin, and a glass transition point of the resin of the core part is higher than a glass transition point of the resin layer and the anisotropic conductive layer. The electroforming mold according to claim 5 , wherein a material of the core portion is a metal. The electroforming mold according to claim 7 , wherein the core part and the conductive film are made of the same material. The electroforming mold according to any one of claims 1 to 8, wherein a plurality of component shapes are transferred. The electroforming mold according to any one of 1 to 9, wherein the resin layer is formed of the anisotropic conductive layer. Forming a conductive layer having conductivity on a substrate;
A step of anisotropic conductive particles form an anisotropic conductive layer made of a resin that is dispersed in the conductive layer,
A resin forming step of forming a resin layer on the anisotropic conductive layer;
A metal layer forming step of forming a metal layer on the resin;
A shape transfer step of transferring the original shape to the resin using a hot press molding method, and separating and cutting the metal layer according to the original shape;
The manufacturing method of the electroforming mold which has. The prototype is a multi-stage structure having a staircase shape, and in the shape transfer step, the metal layer is separated and cut into one or more, and the separated and cut metal layers are each layer in the staircase shape on the resin layer. It forms in the position corresponding to the height of this, The manufacturing method of the electroforming mold of Claim 11 characterized by the above-mentioned . The method for producing an electroforming mold according to claim 12, wherein the prototype is a two-stage structure. The method for producing an electroforming mold according to any one of claims 11 to 13 , wherein the anisotropic conductive particles include a spherical core portion and a conductive film formed so as to cover the core portion. The material of the said core part is resin, The glass transition point of resin of the said core part is a manufacturing method of the electroforming mold of Claim 14 higher than the glass transition point of the said resin layer and the said anisotropic conductive layer. The method for manufacturing an electroforming mold according to claim 15 , wherein a material of the core portion is a metal. The method for manufacturing an electroforming mold according to claim 16 , wherein the core part and the conductive film are made of the same metal material. The method of manufacturing an electroforming mold according to any one of claims 11 to 17 , wherein, in the shape transfer step, a plurality of shapes of the prototype are transferred. The method for producing an electroforming mold according to any one of claims 11 to 18, wherein the resin layer includes the anisotropic conductive layer. A conductive layer formed on a substrate, an anisotropic conductive layer made of a resin in which anisotropic conductive particles formed on the conductive layer are dispersed, and a metal formed on the anisotropic conductive layer And a resin layer having a two-stage structure, and a metal layer formed on the back surface of the first-stage resin layer facing the anisotropic conductive layer and insulated from the anisotropic conductive layer. Soaking the electroforming mold in the electroforming solution;
Applying a voltage to the conductive layer and supplying electrons to a metal layer formed on the anisotropic conductive layer;
Depositing metal on the exposed surface of the metal layer formed on the anisotropic conductive layer;
Contacting a part of the deposited metal with a metal layer insulated from the anisotropic conductive layer, and supplying electrons to the metal layer insulated from the anisotropic conductive layer ;
Depositing the metal on the exposed surface of the metal layer formed on the anisotropic conductive layer and on the exposed surface of the metal layer insulated from the anisotropic conductive layer ;
A method of manufacturing a part having

Images