JP4534137B2 - Liquid discharge head and manufacturing method thereof - Google Patents

Description

  The present invention relates to a liquid discharge head and a manufacturing method thereof, and more particularly, to a liquid discharge head having high processing accuracy, high durability and high reliability, and a manufacturing method thereof.

  Patent Document 1 describes a basic concept of an aerosol deposition method (hereinafter referred to as “AD method”). The AD method is a method in which an aerosol is generated from a raw material powder, the aerosol is sprayed onto a substrate, and a film is formed by depositing the powder by collision energy at that time. It is also called the position method. Japanese Patent Application Laid-Open No. H10-228867 describes that an inkjet head is formed by forming a piezoelectric actuator on silicon (Si) wear using the AD method.

  However, these Patent Documents 1 and 2 have no description about forming the diaphragm of the ink jet head by the AD method and forming the etching stopper layer by the AD method.

On the other hand, in Patent Document 3, an SOI (Silicon on Insulator) structure material is used, an insulator of the SOI structure material is used as an etching stopper, and the thickness of the insulator is set to the thickness of the diaphragm, whereby the insulator and the diaphragm are used. Ink jet heads have been proposed. However, SIO wafers are significantly more expensive than ordinary wafers and require advanced manufacturing techniques. In addition, an insulator such as SiO ₂ is used as an etching stopper layer when forming the ink chamber, but there is a problem that depending on the etching solution, the selectivity is poor and overetching occurs.

In Patent Document 4, a metal such as ZrO ₂ , Al ₂ O ₃ , MgO, TiO ₂ , Ta ₂ O ₅ or Nb ₂ O _{5 is formed} on a corrosion-resistant metal material such as SUS, Ni alloy, or Cu alloy by AD method. An oxide is formed, and a piezoelectric film is formed on the metal oxide by an AD method or a sol-gel method. Thereafter, the corrosion-resistant metal material is etched to form a pressure chamber partition made of the corrosion-resistant metal material. There is a description that a liquid ejection head is manufactured by forming a diaphragm made of the metal oxide on a pressure chamber partition wall.
Japanese Patent Publication No. 3-14512 JP 2000-328223 A JP-A-10-44406 JP 2003-136714 A

  By the way, in order to improve the characteristics of the piezoelectric film (PZT piezoelectric film) formed by the AD method, it is necessary to anneal at 600 ° C. or higher after forming the PZT piezoelectric film. When a metal having low heat resistance is used for the material to be formed, there is a problem that deformation, alteration or composition change is caused by annealing, and impurities are diffused into the PZT piezoelectric film to deteriorate the characteristics. Furthermore, if a metal material having a large thermal expansion coefficient is used as the material for the pressure chamber partition and the diaphragm, peeling occurs at the interface between the PZT piezoelectric film and the diaphragm and the interface between the diaphragm and the pressure chamber partition. There is a problem that cracks occur in the PZT piezoelectric film.

  In Patent Document 4, there is no description in consideration of heat resistance and thermal expansion coefficient when selecting a corrosion-resistant metal material to be a pressure chamber partition or a metal oxide to be a diaphragm.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an inexpensive liquid discharge head with high processing accuracy, high heat resistance, durability, and reliability, and a method for manufacturing the same.

In order to achieve the above object, a liquid discharge head according to claim 1 is a pressure chamber made of a heat-resistant and corrosion-resistant material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or lower and 2 × 10 ⁻⁶ / ° C. or higher. A diaphragm comprising a partition wall and a heat-resistant and corrosion-resistant material formed on the pressure chamber partition wall by an aerosol deposition method and having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or lower and 2 × 10 ⁻⁶ / ° C. or higher. When, and a PZT piezoelectric film formed by a film method for directly casting onto the vibration plate, the interface between the PZT piezoelectric film and the vibrating plate during annealing after the film formation, the diaphragm and the pressure chamber bulkhead And the PZT piezoelectric film are prevented from being peeled off .

Since the pressure chamber partition and the diaphragm are each made of a heat-resistant material, even if annealing is performed to improve the characteristics of the PZT piezoelectric film, no deformation, alteration, or composition change occurs. In addition, since the thermal expansion coefficient of the pressure chamber partition and the diaphragm is 13 × 10 ⁻⁶ / ° C. or lower and 2 × 10 ⁻⁶ / ° C. or higher , the PZT piezoelectric film is peeled or cracked during annealing. there is no problem. Furthermore, since the pressure chamber partition and the diaphragm are made of a corrosion-resistant material, even if the liquid used in the liquid discharge head is corrosive, it will not be dissolved or altered. In addition, since the pressure chamber partition, the diaphragm, and the PZT piezoelectric film are directly joined without using an adhesive or the like, a liquid discharge head having high durability and reliability can be provided.

  According to a second aspect of the present invention, in the liquid discharge head according to the first aspect, the material of the pressure chamber partition is a heat-resistant metal material, silicon, or silicon oxide.

  According to a third aspect of the present invention, in the liquid discharge head according to the first or second aspect, the material of the diaphragm is a metal material oxide or nitride.

4. The liquid discharge head according to claim 1, wherein the PZT piezoelectric film is formed on the diaphragm by an aerosol deposition method or a sol-gel method. Yes.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a liquid discharge head, wherein a thermal expansion coefficient is 13 × 10 ⁻⁶ / ° C. or lower and a thermal expansion coefficient on a substrate made of a heat and corrosion resistant material having 2 × 10 ⁻⁶ / ° C. or higher. Forming a diaphragm having heat resistance and corrosion resistance of 13 × 10 ⁻⁶ / ° C. or less and 2 × 10 ⁻⁶ / ° C. or more by an aerosol deposition method, and forming a film directly on the diaphragm Forming a PZT piezoelectric film by a film method; removing a part of the substrate by etching to form a pressure chamber and a pressure chamber partition; and annealing the PZT piezoelectric film. It is said.

Since the pressure chamber partition and the diaphragm are made of a heat-resistant material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or less and 2 × 10 ⁻⁶ / ° C. or more, deformation or alteration during the annealing is performed. The composition does not change, and there is no problem of peeling or cracking of the PZT piezoelectric film due to thermal expansion. In addition, since the pressure chamber partition, the diaphragm, and the PZT piezoelectric film are directly joined without using an adhesive or the like, a liquid discharge head with high durability and reliability can be provided.
In addition, an inexpensive liquid discharge head can be manufactured by using the vibration plate formed on the substrate as an etching stopper without using an expensive SOI substrate as the substrate. In addition, it is possible to perform etching with high accuracy by selecting a material having an appropriate etching selectivity as a material of the substrate and the vibration plate which will be the pressure chamber partition. Furthermore, since the pressure chamber partition and the diaphragm are made of a corrosion-resistant material, even if the liquid used in the liquid discharge head is corrosive, it will not be dissolved or altered.

According to a sixth aspect of the present invention, in the method of manufacturing a liquid ejection head according to the fifth aspect , the step of forming the diaphragm is formed to have a thickness in the range of 1 to 30 μm by an aerosol deposition method. .

According to a seventh aspect of the present invention, in the method of manufacturing a liquid discharge head according to the fifth or sixth aspect , the PZT piezoelectric film forming method is an aerosol deposition method or a sol-gel method.

According to the present invention, the pressure chamber partition and the diaphragm are each composed of a heat-resistant and corrosion-resistant material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or lower and 2 × 10 ⁻⁶ / ° C. or higher . No deformation, alteration, or composition change occurs during heat treatment in the manufacturing process, and even if the liquid used in the liquid discharge head is corrosive, it does not dissolve or alter, and the PZT piezoelectric film is peeled off due to thermal expansion. There are no problems such as cracks and cracks, and this makes it possible to obtain an inexpensive liquid discharge head with good processing accuracy, high heat resistance, durability, and reliability.

  Hereinafter, preferred embodiments of a liquid discharge head and a manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

[Outline of inkjet recording apparatus]
First, an outline of an ink jet recording apparatus to which a liquid discharge head according to the present invention is applied will be described.

  FIG. 1 is an overall configuration diagram of an ink jet recording apparatus. As shown in the figure, the inkjet recording apparatus 10 includes a printing unit 12 having a plurality of liquid ejection heads (hereinafter simply referred to as “heads”) 12K, 12C, 12M, and 12Y provided for each color of ink. An ink storage / loading unit 14 that stores ink to be supplied to each of the heads 12K, 12C, 12M, and 12Y, a paper feeding unit 18 that supplies the recording paper 16, and a decurling unit 20 that removes curl from the recording paper 16. A suction belt conveyance unit 22 that is disposed opposite to the nozzle surface (ink ejection surface) of the printing unit 12 and conveys the recording paper 16 while maintaining the flatness of the recording paper 16, and a printing result by the printing unit 12 And a paper discharge unit 26 that discharges printed recording paper (printed matter) to the outside.

  The recording paper 16 delivered from the paper supply unit 18 retains curl due to having been loaded in the magazine. In order to remove this curl, heat is applied to the recording paper 16 by the heating drum 30 in the direction opposite to the curl direction of the magazine in the decurling unit 20.

  In the case of an apparatus configuration that uses roll paper, a cutter (first cutter) 28 is provided as shown in FIG. 1, and the roll paper is cut into a desired size by the cutter 28. The cutter 28 includes a fixed blade 28A having a length equal to or greater than the conveyance path width of the recording paper 16, and a round blade 28B that moves along the fixed blade 28A. The fixed blade 28A is provided on the back side of the print. The round blade 28B is disposed on the printing surface side with the conveyance path interposed therebetween. Note that the cutter 28 is not necessary when cut paper is used.

  After the decurling process, the cut recording paper 16 is sent to the suction belt conveyance unit 22. The suction belt conveyance unit 22 has a structure in which an endless belt 33 is wound between rollers 31 and 32, and at least portions facing the nozzle surface of the printing unit 12 and the sensor surface of the printing detection unit 24 are horizontal ( Flat surface).

  The belt 33 has a width that is greater than the width of the recording paper 16, and a plurality of suction holes (not shown) are formed on the belt surface. As shown in FIG. 1, a suction chamber 34 is provided at a position facing the nozzle surface of the print unit 12 and the sensor surface of the print detection unit 24 inside the belt 33 spanned between the rollers 31 and 32. Then, the suction chamber 34 is sucked by the fan 35 to be a negative pressure, whereby the recording paper 16 on the belt 33 is sucked and held.

  The power of a motor (not shown) is transmitted to at least one of the rollers 31 and 32 around which the belt 33 is wound, so that the belt 33 is driven in the clockwise direction in FIG. The recording paper 16 is conveyed from left to right in FIG.

  Since ink adheres to the belt 33 when a borderless print or the like is printed, the belt cleaning unit 36 is provided at a predetermined position outside the belt 33 (an appropriate position other than the print area).

  A heating fan 40 is provided on the upstream side of the printing unit 12 on the paper conveyance path formed by the suction belt conveyance unit 22. The heating fan 40 heats the recording paper 16 by blowing heated air onto the recording paper 16 before printing. Heating the recording paper 16 immediately before printing makes it easier for the ink to dry after landing.

  The printing unit 12 is a so-called full line type head in which line type heads having a length corresponding to the maximum paper width are arranged in a direction (main scanning direction) orthogonal to the paper feed direction (see FIG. 2). As shown in FIG. 2, each of the print heads 12K, 12C, 12M, and 12Y has an ink discharge port (nozzle) over a length that exceeds at least one side of the maximum size recording paper 16 targeted by the inkjet recording apparatus 10. It is composed of a plurality of line type heads.

  Heads 12K, 12C, 12M, and 12Y corresponding to the respective color inks are arranged in the order of black (K), cyan (C), magenta (M), and yellow (Y) from the upstream side along the feeding direction of the recording paper 16. Yes. A color image can be formed on the recording paper 16 by ejecting the color inks from the heads 12K, 12C, 12M, and 12Y while conveying the recording paper 16, respectively.

  The print detection unit 24 includes a line sensor for imaging the droplet ejection result of the print unit 12, and functions as a means for checking nozzle clogging and other ejection defects from the droplet ejection image read by the line sensor.

  A post-drying unit 42 is provided following the print detection unit 24. The post-drying unit 42 is means for drying the printed image surface, and for example, a heating fan is used. Since it is preferable to avoid contact with the printing surface until the ink after printing is dried, a method of blowing hot air is preferred.

  A heating / pressurizing unit 44 is provided following the post-drying unit 42. The heating / pressurizing unit 44 is a means for controlling the glossiness of the image surface, and pressurizes with a pressure roller 45 having a predetermined surface uneven shape while heating the image surface to transfer the uneven shape to the image surface. To do.

  The printed matter generated in this manner is cut into a predetermined size by the cutter 28 and then discharged from the paper discharge unit 26. It is preferable that the original image to be printed (printed target image) and the test print are discharged separately. The ink jet recording apparatus 10 is provided with a sorting means (not shown) that switches the paper discharge path so as to select the print product of the main image and the print product of the test print and send them to the discharge units 26A and 26B. Yes. When the main image and the test print are simultaneously formed in parallel on a large sheet, the test print portion is cut off by the cutter (second cutter) 48.

[Film formation method by aerosol deposition method (hereinafter referred to as “AD method”)]
Next, a film forming method by the AD method used for manufacturing the liquid discharge head according to the present invention will be described.

  FIG. 3 is a schematic diagram showing a film forming apparatus using the AD method. This film forming apparatus has an aerosol generation container 52 in which raw material powder 51 is arranged. Here, the aerosol refers to solid or liquid fine particles suspended in a gas.

The aerosol generation container 52 is provided with a carrier gas introduction part 53, an aerosol lead-out part 54, and a vibration part 55. By introducing a gas such as nitrogen gas (N ₂ ) from the carrier gas introduction part 53, the raw material powder disposed in the aerosol generation container 52 is blown up to generate an aerosol. At that time, vibration is applied to the aerosol generation container 52 by the vibration unit 55, whereby the raw material powder is stirred and the aerosol is efficiently generated. The generated aerosol is guided to the film forming chamber 56 through the aerosol outlet 54.

  The film forming chamber 56 is provided with an exhaust pipe 57, a nozzle 58, and a movable stage 59. The exhaust pipe 57 is connected to a vacuum pump and exhausts the film forming chamber 56. The aerosol generated in the aerosol generation container 52 and guided to the film forming chamber 56 through the aerosol outlet 54 is jetted from the nozzle 58 toward the support substrate 50. Thereby, the raw material powder collides and accumulates on the support substrate 50. The support substrate 50 is placed on a movable stage 59 that can move in three dimensions. By controlling the movable stage 59, the relative position between the support substrate 50 and the nozzle 58 is adjusted.

[Liquid discharge head manufacturing method]
FIG. 4 is a manufacturing process diagram showing an embodiment of a method for manufacturing a liquid discharge head according to the present invention.

As shown in FIG. 4A, a substrate constituting a pressure chamber partition of a pressure chamber filled with ink is formed on a substrate 61 made of a silicon (Si) wafer having a thickness of 200 μm and 6 inches φ with alumina (Al ₂ A diaphragm 62 made of O ₃ ) is formed. The diaphragm 62 formed on the substrate 61 is formed by AD method so as to have a thickness of about 10 μm, and then the surface of the film is polished so that the surface roughness (Ra) is 50 nm or less. .

  The substrate and the diaphragm constituting the pressure chamber partition are made of materials having heat resistance and corrosion resistance, respectively.

Here, the heat-resistant material refers to a material that does not undergo deformation, alteration or composition change in the baking process at 600 ° C., preferably 700 ° C., more preferably 800 ° C. This means that no composition change occurs. For example, silicon, silicon dioxide, alumina, zirconia (ZrO _2), SiC, mullite, magnesia, aluminum nitride, silicon nitride, _{sialon, Cr 2 N, ZrN, TaN} , TaC, etc. _{TaSi 2, ZrSi 2, ZrB 2} , SUS430 It is.

  In addition, the material having corrosion resistance refers to a material that does not melt or change even if the liquid (ink) used for the liquid discharge head is corrosive. The above-listed materials are not particularly corrosive and have no pressure chamber partition and diaphragm. It can be used as a material.

Further, the substrate and the diaphragm constituting the pressure chamber partition are made of a material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or less, preferably 11 × 10 ⁻⁶ / ° C. or less. The lower limit of the coefficient of thermal expansion of the material for the substrate and the diaphragm is 2 × 10 ⁻⁶ / ° C. Incidentally, the thermal expansion coefficient of the substrate 61 (silicon) of this embodiment is 4 × 10 ⁻⁶ / ° C., and the thermal expansion coefficient of the diaphragm 62 (alumina) is 7.2 × 10 ⁻⁶ / ° C. .

  Next, as shown in FIG. 4B, Pt (200 nm) / Ti (50 nm) is formed as a lower electrode 63 on the diaphragm 62 by sputtering.

  Subsequently, as shown in FIG. 4C, a lead zirconate titanate (PZT) piezoelectric film 64 is formed on the lower electrode 63 by an AD method so as to have a thickness of 10 μm at room temperature. Heat treatment (annealing) was performed at C for 3 hours. The characteristics of the PZT piezoelectric film 64 are improved by annealing, and the residual stress is removed.

During this annealing, the thermal expansion coefficient of the substrate 61 and the diaphragm 62 is small and the difference from the thermal expansion coefficient of PZT (7 to 9.5 × 10 ⁻⁶ / ° C.) is small, so that a large thermal stress does not act on the interface. No problems such as peeling or cracking of the PZT piezoelectric film 64 occurred. In the case of a material having a thermal expansion coefficient of 14 × 10 ⁻⁶ / ° C. as a material for the substrate or the diaphragm, a problem such as peeling of the PZT piezoelectric film occurs, and the thermal expansion coefficient is 13 × 10 ⁻⁶ / The above problem did not occur in the case of a material of ° C or lower.

  Next, as shown in FIG. 4D, as the upper electrode 65, Pt having a thickness of 200 nm is formed on the PZT piezoelectric film 64 by lift-off.

  Subsequently, as shown in FIG. 4E, the back surface of the substrate 61 is patterned, and etching is performed by reactive ion etching (RIE) using Freon (CF 4) gas with Cr as a mask. This etching was stopped at the lower surface of the alumina diaphragm 62, and a flat etching surface could be obtained. That is, the etching selectivity ratio of CF4 gas between the material of the substrate 61 (silicon) and the material of the diaphragm 62 (alumina) as an etching stopper is 10: 1 or more, and the etching selectivity is high, so the accuracy is high. Etching could be performed. Note that the portion of the substrate 61 perforated by etching becomes the pressure chamber 66, and the remaining portion of the substrate 61 becomes the pressure chamber partition wall 61 '.

  As the etching for forming the pressure chamber 66 and the pressure chamber partition wall 61 ', RIE dry etching is used. However, the etching is not limited to this, and wet etching may be used. In the case of dry etching, it is preferable to select the material of the substrate and the diaphragm and the etching gas so that the etching selection ratio is 2: 1 (preferably 5: 1). In the case of wet etching, It is preferable to select the material of the substrate and the diaphragm and the etching solution so that the etching selectivity is 5: 1 (preferably 10: 1).

  Finally, as shown in FIG. 4F, a nozzle plate having a nozzle 67A is attached to the lower surface of the pressure chamber partition wall 61 'with an adhesive to produce the liquid discharge head 60.

When the performance of the PZT piezoelectric film 64 of the liquid discharge head 60 manufactured in this way was examined, the piezoelectric constant d ₃₁ was about 150 pm / V, indicating a good piezoelectric constant. Further, there was no warping of the diaphragm 62. Further, as a durability test, when the liquid ejection head 60 was subjected to a continuous driving test of 10 ¹¹ dots at a driving voltage of 40 V and 40 kHz, the displacement characteristics did not change and the durability was good.

[Comparative example]
As a substrate constituting the pressure chamber partition wall, SUS304 (thermal expansion coefficient: 17.3 × 10 ⁻⁶ / ° C.) was used, and zirconia (ZrO ₂ ) (thermal expansion coefficient: 9.5 ×) partially stabilized with yttria on one side of this substrate. 10 ⁻⁶ / ° C.) was used to form a diaphragm having a thickness of about 10 μm by the AD method. Thereafter, the film surface was polished so that Ra was 50 nm or less.

  Next, Pt (200 nm) / Ti (50 nm) is formed on the diaphragm as a lower electrode by a sputtering method, and a PZT piezoelectric film is manufactured on the lower electrode so as to have a thickness of 10 μm at room temperature by an AD method. After film formation, annealing was performed at 700 ° C. for 3 hours. Furthermore, Pt having a thickness of 200 nm was formed as an upper electrode on the PZT piezoelectric film.

  Subsequently, the back surface of the SUS304 substrate was patterned, and a pressure chamber was formed with a ferric chloride etchant using an emulsion mask.

The PZT piezoelectric film formed as described above had a high frequency of peeling and cracking. Further, when the performance of the PZT piezoelectric film having no peeling or cracking was examined, the piezoelectric constant d ₃₁ was about 150 pm / V, indicating a good piezoelectric constant. However, the diaphragm is warped and cannot be used as a device. Further, as a durability test, when the liquid ejection head was subjected to a continuous driving test of 10 ¹¹ dots at a driving voltage of 40 V and 40 kHz, the displacement characteristics decreased and the durability was poor.

  In the present embodiment, the thickness of the diaphragm 62 formed by the AD method is 10 μm. However, the thickness of the diaphragm is not limited to this and may be in the range of 1 to 30 μm. That is, in order to realize a high-definition liquid discharge head, the piezoelectric film size is 300 μm square and the vibration plate size is 500 μm square, and the vibration plate satisfying both the target droplet size and the target pressure of the liquid discharge head at this time The optimum value of the thickness was 15 μm, but the above range of 1 to 30 μm is an acceptable thickness.

In the present embodiment, silicon is used as the material of the substrate serving as the pressure chamber partition wall. However, the present invention is not limited thereto, and any material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or less can be used. Well, refractory metal materials and silicon oxides can be used.

Furthermore, in this embodiment, alumina is used as the material of the diaphragm. However, the present invention is not limited to this, and any heat-resistant and corrosion-resistant material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or less may be used. Oxides and nitrides can be used.

  In this embodiment, the PZT piezoelectric film is formed by the AD method. However, the present invention is not limited to this, and any film forming method may be used as long as the film is formed directly. Alternatively, the film may be formed by a sol-gel method. The PZT piezoelectric film by the sol-gel method is prepared by preparing a sol-gel solution having a PZT composition, applying it on the electrode of the diaphragm by spin coating, then controlling the film thickness by repeating the drying and desolvation steps, and finally firing. To form.

  Furthermore, the liquid ejection head according to the present invention has been described as being used as a line-type inkjet head that ejects ink onto recording paper. It can also be applied to shuttle-type heads that reciprocate. The liquid discharge head according to the present invention is a liquid for forming an image recording medium as an image forming head by ejecting a treatment liquid or water onto a recording medium, or by ejecting a coating liquid onto a substrate. It may be used as a discharge head.

FIG. 1 is an overall configuration diagram of an ink jet recording apparatus according to the present invention. FIG. 2 is a plan view of the main part around the printing unit of the ink jet recording apparatus shown in FIG. FIG. 3 is a schematic diagram showing a film forming apparatus using the AD method. FIG. 4 is a manufacturing process diagram showing an embodiment of a method for manufacturing a liquid discharge head according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Inkjet recording device, 12 ... Printing part, 12K, 12C, 12M, 12Y ... Head, 60 ... Liquid discharge head, 61 ... Substrate, 61 '... Pressure chamber partition, 62 ... Vibration plate, 63 ... Lower electrode, 64 ... PZT piezoelectric film, 65 ... upper electrode, 66 ... pressure chamber, 67 ... nozzle plate, 67A ... nozzle

Claims (7)

A pressure chamber partition wall made of a heat-resistant and corrosion-resistant material having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or lower , and 2 × 10 ⁻⁶ / ° C. or higher ;
A diaphragm formed on the pressure chamber partition wall by an aerosol deposition method and having a thermal expansion coefficient of 13 × 10 ⁻⁶ / ° C. or less and 2 × 10 ⁻⁶ / ° C. or more ;
And a PZT piezoelectric film formed by a film method for directly casting onto the vibration plate,
Liquid discharge characterized by preventing peeling of the interface between the PZT piezoelectric film and the diaphragm, the interface between the diaphragm and the pressure chamber partition, and cracking of the PZT piezoelectric film during annealing after the film formation. head.   The liquid discharge head according to claim 1, wherein a material of the pressure chamber partition is a heat resistant metal material, silicon, or silicon oxide.   The liquid ejection head according to claim 1, wherein a material of the diaphragm is a metal material oxide or nitride. 4. The liquid ejection head according to claim 1, wherein the PZT piezoelectric film is formed on the diaphragm by an aerosol deposition method or a sol-gel method. 5. Thermal expansion coefficient is 13 × 10 ⁻⁶ / ° C or less , 2 × 10 ⁻⁶ / ° C or more on a substrate made of a heat-resistant and corrosion-resistant material, and the thermal expansion coefficient is 13 × 10 ⁻⁶ / ° C or less , 2 × Forming a diaphragm having a heat resistance and corrosion resistance of 10 ⁻⁶ / ° C. or higher by an aerosol deposition method ;
Forming a PZT piezoelectric film by a film forming method for forming a film directly on the diaphragm;
Removing a part of the substrate by etching to form a pressure chamber and a pressure chamber partition;
Annealing the PZT piezoelectric film;
A method for manufacturing a liquid discharge head, comprising: 6. The method of manufacturing a liquid ejection head according to claim 5 , wherein the step of forming the diaphragm is formed by an aerosol deposition method to a thickness in the range of 1 to 30 [mu] m. 7. The method of manufacturing a liquid discharge head according to claim 5, wherein the method for forming the PZT piezoelectric film is an aerosol deposition method or a sol-gel method.

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