JP4522024B2 - Mercury lamp, illumination device and exposure device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mercury lamp, an illumination device including the mercury lamp and used in a semiconductor exposure apparatus, and an exposure apparatus that can use the illumination apparatus.
[0002]
[Prior art]
Conventionally, when a mercury lamp is attached, it is attached regardless of the direction of the conducting wire. For this reason, there has been a concern that the lamp may be damaged by applying a pulling force to the lamp.
[0003]
[Problems to be solved by the invention]
In the above conventional example, the conducting wire may apply a pulling force to the mercury lamp and the mercury lamp may be damaged. In addition, the pressure in the bulb of the conventional mercury lamp is almost the same as the atmospheric pressure, and even if the mercury lamp is damaged by applying force, the fragments do not scatter far away and have a relatively low probability of affecting the apparatus. However, in recent years, the pressure in the bulb of the mercury lamp has become higher than atmospheric pressure due to the increase in illuminance, and there is a high probability that the mercury lamp will be seriously affected when it is damaged.
[0004]
An object of the present invention is to provide an illumination device that does not apply unnecessary force to a mercury lamp, thereby restraining the mounting direction of the lamp so that the wire does not apply unnecessary force to the lamp, and during lamp replacement and In order to prevent damage to the lamp during lighting, the mercury lamp can be installed safely and the apparatus can be operated stably.
[0005]
[Means for Solving the Problems]
To achieve the above object, according to the present invention. Lighting device Is One end Base Part With a wire for conduction When a mercury lamp having a convex portion and a positioning pin is attached to the base portion at the other end, the conduction is made by the hole into which the convex portion is fitted and the groove into which the positioning pin is fitted. Wire orientation The Decision And turning the mercury lamp with a screw that reduces the diameter of the hole and the width of the groove by turning. Fix This And features.
[0007]
The direction fixing means for fixing the mercury lamp so that the mounting direction of the mercury lamp is fixed in the above configuration prevents the lamp from being inadvertently damaged by preventing unnecessary external force from being applied to the mercury lamp.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
FIG. 1 is a schematic perspective view of a main part of a lighting device according to the first embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a high-luminance light emitting portion. Reference numeral 2 denotes a positioning pin configured on the base portion 16 of the mercury lamp 1, 3 denotes a lamp mounting hand as a mounting member for fixing the mercury lamp 1, and 4 denotes a lamp mounting screw that is screwed into a screw hole provided in the lamp mounting hand 3. It is.
[0013]
The mercury lamp 1 has a substantially spherical light-emitting portion 15 and base portions 16 and 17 attached to both ends on a common axis, and includes a conducting wire 20 extending from one base portion 16. A concentric convex portion 18 having a circular cross section is projected from the tip of the other base portion 17. On the other cap part 17, a positioning pin 2 protruding in the same direction as the concentric convex part 18 and protruding in an eccentric position is provided.
[0014]
The lamp mounting hand 3 has, as receiving parts, a circular receiving hole 22 into which the concentric convex part 18 of the mercury lamp 1 is inserted, and a receiving groove part 23 following the receiving hole 22. The receiving hole 22 is located near the tip at the center in the width direction of the lamp mounting hand 3. The receiving groove 23 continues straight up to the tip of the lamp mounting hand 3, and the positioning pin 2 of the base part 17 is inserted.
[0015]
When the mercury lamp 1 is fixed to the lamp mounting hand 3, the concentric projection 18 is not attached unless it is fitted into the receiving hole 22 and the positioning pin 2 is fitted into the receiving groove 23 of the lamp mounting hand 3. For this reason, when the mercury lamp 1 is mounted on the lamp mounting hand 3, the direction of the lamp 1 is automatically determined in a fixed direction. Thus, in the state where the direction of the lamp 1 is fixed, the mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 to reduce the diameter of the receiving hole 22 and the width of the receiving groove 23. To do.
[0016]
(Second Embodiment)
FIG. 2 is a schematic perspective view of a main part of a lighting device according to the second embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a light emitting portion 15 with high luminance. 5 is a notch portion having a flat surface provided on the side surface of the cap portion 17 of the mercury lamp 1, 6 is a lamp mounting hand as a mounting member for fixing the mercury lamp 1, and 7 is a concentric convex portion 18 of the cap portion 17. It is a nut as a lamp mounting screw that is screwed into a male screw provided on the head.
[0017]
When the mercury lamp 1 is fixed to the lamp mounting hand 6, the flat surface of the notch portion 5 of the base portion 17 is aligned with the guide portion 26 having a flat lateral surface of the lamp mounting hand 6 so as to be substantially parallel to each other. It is a mechanism that cannot be attached without it. Therefore, in this embodiment, when the mercury lamp 1 is attached to the lamp attachment hand 6, the direction of the lamp is automatically determined in a certain direction. Thus, in a state where the direction of the lamp 1 is determined in a certain direction, the mercury lamp 1 is fixed to the lamp mounting hand 3 by turning and tightening the lamp mounting screw 7 screwed into the male screw of the concentric convex portion 18.
[0018]
(Third embodiment)
FIG. 3 is a schematic perspective view of a main part of a lighting apparatus according to the third embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a light emitting portion 15 with high luminance. 8 is a key provided on the convex portion 18 of the cap portion 17 of the mercury lamp 1, 9 is a key groove constituting a receiving portion provided in a lamp mounting hand 3 as an attachment member for fixing the mercury lamp 1, and 4 is a lamp It is a mounting screw.
[0019]
When the mercury lamp 1 is fixed to the lamp mounting hand 3, the key 8 of the base 17 is not attached unless it is aligned with the key groove 9 of the lamp mounting hand 3. For this reason, when the mercury lamp 1 is mounted on the lamp mounting hand 3, the direction of the lamp is automatically determined in a fixed direction. The mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 as in the first embodiment.
[0020]
(Fourth embodiment)
FIG. 4 is a schematic perspective view of a main part of a lighting device according to the fourth embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a light emitting portion 15 with high luminance. Reference numeral 10 denotes a cutout portion as a receiving portion provided in a groove shape by cutting out the base portion 17 of the mercury lamp 1 over its end face and side face. Reference numeral 11 denotes a pin provided protruding from a lamp mounting hand 3 as a mounting member for fixing the mercury lamp 1, and reference numeral 4 denotes a lamp mounting screw.
[0021]
When the mercury lamp 1 is fixed to the lamp mounting hand 3, the notch portion 10 of the base portion 17 cannot be attached unless it is aligned with the pin 11 of the lamp mounting hand 3. For this reason, when the mercury lamp 1 is mounted on the lamp mounting hand 3, the direction of the lamp 1 is automatically determined in a fixed direction. The mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 as in the first embodiment.
[0022]
(Fifth embodiment)
FIG. 5 is a schematic perspective view of an essential part of a lighting apparatus according to the fifth embodiment of the present invention. In the figure, reference numeral 1 denotes a mercury lamp having a light emitting portion 15 with high luminance. Reference numeral 12 denotes an alignment mark (for example, a marking line) provided on the base portion 17 of the mercury lamp 1, 13 denotes an alignment mark provided to the lamp mounting hand 3 for fixing the mercury lamp 1, and 4 denotes a lamp mounting screw. .
[0023]
When the mercury lamp 1 is fixed to the lamp mounting hand 3, the alignment mark 12 of the base portion 17 is aligned with the alignment mark 13 provided on the mounting hand 3. When the alignment marks 12 and 13 are matched, the direction of the lamp 1 is determined in an optimum direction. The mercury lamp 1 is fixed to the lamp mounting hand 3 by turning the lamp mounting screw 4 as in the first embodiment.
[0024]
(Sixth embodiment)
FIG. 6 is an elevation view showing the entire configuration of a semiconductor exposure apparatus according to the sixth embodiment of the present invention. This semiconductor exposure apparatus is a projection exposure apparatus that projects and exposes a pattern on a reticle 31 as an original onto a wafer 32 as a photosensitive substrate via optical means such as a lens.
[0025]
In the figure, 1 is a mercury lamp as a light source, 31 is a reticle which is a first object having a circuit pattern to be exposed and transferred to form a semiconductor element, and 32 is a second object to which the circuit pattern of the reticle 31 is exposed and transferred. , A projection lens that projects the pattern of the reticle 31 onto the wafer 32 at a predetermined reduction magnification, and an illumination optical system that converts light from the mercury lamp 1 into a luminous flux having a uniform illuminance and a predetermined size, 36 is a wafer stage for positioning the wafer 32 with high accuracy, 37 is a reticle library for storing several types of reticles 31, and 38 is a reticle for holding and positioning the reticle 31 when the pattern of the reticle 31 is exposed and transferred to the wafer 32. The stage 39 is taken out from a desired reticle library 37 and supplied onto a reticle stage 38. A reticle transport system for storing a reticle library 37 which has become unnecessary on the stage 38. 40 is a wafer cassette for storing a plurality of wafers 32, 41 is an unexposed wafer 32 taken out from the wafer cassette 40 and supplied onto the wafer stage 36, and conversely, the exposed wafer 32 is recovered from the wafer stage 36. This is a wafer transfer system for storing in the wafer cassette 40. Reference numeral 42 denotes an alignment scope for measuring a positional deviation between the reticle 31 and the wafer 32, 43 denotes a vibration isolator, 44 denotes an earthquake accelerometer, 45 denotes a control operation unit for operating and controlling the exposure apparatus, and 46 denotes a control operation unit 45. It is the display for display which comprises a part of.
[0026]
Next, in this configuration, when an earthquake with a relatively large seismic intensity of 2 to 4 occurs during operation of the exposure apparatus, (1) the exposure apparatus does not make a defective product, and (2) the apparatus itself The function of preventing the damage of the apparatus and (3) restarting the apparatus at an early stage will be described in order.
[0027]
First, prevention of defective products will be described. It is the positional relationship between the main body and a separate part that constitutes a part of the main body but is separately placed on the floor, which is most likely to be affected by the vibration caused by the earthquake. In the case of this embodiment, the main body means the entire portion that is placed on and supported by the mount (vibration isolation device) 43. On the other hand, the separate placement units here are the lamp house 51, the wafer cassette 40, and the wafer transfer system 41. That is, it is a part that is not placed on the mount 43 and is placed on the floor alone. Since the vibration due to the earthquake is absorbed by the anti-vibration mechanism of the mount 43, the main body is less likely to be damaged or broken due to a positional shift or impact against the external vibration due to the earthquake. Furthermore, since the mass of the device itself is as large as 2 to 3 tons, the displacement due to the shaking of the earthquake is slight.
[0028]
However, the separate unit does not cause a position shift with the main unit in the normal use state, that is, the floor vibration state indicated in the installation standard of the device, but the vibration isolation mechanism is not always sufficient as the main unit. If the vibration exceeding the normal use state is applied by a moderate-scale earthquake due to the fact that the mass is light, the positional relationship between the main body part and the separate part is not necessarily guaranteed. In the installation standard, for example, about 1 gal is guaranteed at 2 Hz, but an acceleration of about 80 gal may be applied in an earthquake with a seismic intensity of 4. In this embodiment, the lamp house 51, the wafer cassette 40, and the wafer transfer system 41, which are separately placed, are not necessarily placed separately from the main body in other cases. However, for example, the lamp house 51 is used in order to effectively use the space of a room (clean room) that requires a large amount of maintenance cost in order to consider safety and to create a temperature-free environment and a dust-free environment. Increasing cases are installed separately from the main unit. Nevertheless, in order to meet the recent demand for circuit pattern miniaturization, it is required to strictly manage the positional relationship between the lamp house 51 and the illumination optical system 35 on the main body. For example, the illumination by the light emitted from the illumination optical system 35 is required to have an illuminance difference of ± 1 to 2% at each position in its effective range. The positional deviation of the part is about 0.5 mm or less.
[0029]
However, it is not appropriate to provide a dedicated anti-vibration mechanism only for earthquakes that occur rarely, or to increase the rigidity by increasing the size, resulting in increased costs. Therefore, an accelerometer 44 that detects an earthquake is provided in the main body of the apparatus or a separate unit, and the operation of the apparatus is temporarily stopped when an acceleration exceeding a value determined with reference to the installation environment of the separate unit is detected. The process is stopped to prevent the exposure apparatus from producing abnormal chips and reducing productivity. Then, the operation of the apparatus is not resumed until the check of each check item, that is, the check of the displacement between the lamp house 51 and the main body is completed here. Again, it is ideal to use a device that does not cause the positional relationship between the main unit and the separate unit to be distorted regardless of how large an earthquake is. If the device structure can cope with this situation, the size and cost of the device will increase. Therefore, in the present invention, for earthquakes with large shaking that cannot be ignored but not frequent, it is temporarily stopped to prevent the production of defective products, but it is inexpensive by shortening the time until recovery (described later). It enables earthquake countermeasures in a simple way.
[0030]
Conventionally, the lamp house 51, which is a place for storing the lamp, is integrated with the illumination optical system 35 and is not separately provided. However, as the performance of the exposure apparatus is demanded, the influence of the heat from the lamp house 51 emitted from the mercury lamp 1 on the temperature environment of the exposure apparatus cannot be ignored, and the lamp house 51 is placed separately as in this embodiment. A case is coming out.
[0031]
FIG. 6 shows a wafer cassette 40 and a wafer transfer system 41 as an example of a separate unit other than the light source. Also in this case, the wafer transfer system 41 or the like is not necessarily placed separately. However, if the structure is set separately, there is a possibility that the wafer transfer is stopped due to the positional deviation of the wafer transfer system 41. Although this does not lead to the production of defective chips, it is a serious problem directly related to the productivity of the apparatus. Therefore, if there is an earthquake, it is desirable to check whether there is a problem each time as well as a performance problem. Even when the wafer cassette 40 is configured in the main body, the automatic transfer robot often carries the wafer carrier along with the recent automation of the production line. The same applies to the positional relationship.
[0032]
Another cause of the possibility of manufacturing another defective product is a deterioration in alignment accuracy between the reticle 31 and the wafer 32. In the apparatus of FIG. 6, the positioning of the wafer 32 is performed by confirming the position of the wafer 32 with the alignment scope 42 and sending it to a predetermined position with the wafer stage 36. On the other hand, the reticle 31 is similarly performed by a reticle stage 38 and an alignment scope (not shown). By the way, with recent miniaturization of semiconductor elements, positioning at a level of 0.1 μm is required. On the other hand, according to the mount 43 which is an anti-vibration device, a shake of about 4 mm may remain on the main body in an earthquake with a seismic intensity of about 4 or 2 Hz. These are obviously numerical values that cannot be ignored. Therefore, when an earthquake is detected, positioning and exposure are immediately stopped and a standby state is entered.
[0033]
In addition, the place where the accelerometer 44 is attached is preferably under the mount 43 of the main body where the vibration of the floor is directly transmitted, or a separate part.
[0034]
Next, a method for preventing damage to the apparatus itself will be described. The most probable possibility that a shake caused by an earthquake will damage the device itself is that the transported object falls and the device is damaged by the fragments. In the case of the apparatus of FIG. 6, at the time of exposure, the wafer 32 is taken out of the wafer cassette 40 containing the wafer 32 before being exposed by the exposure apparatus by the hand of the wafer transfer system 41, and is roughly positioned by a positioning mechanism (not shown). Then, the wafer 32 is transferred to the wafer stage 36 for positioning with high accuracy. The position of the wafer 32 transferred onto the wafer stage 36 is confirmed by the alignment scope 42, and then is carried to a predetermined position for exposure. Thereafter, the wafer is again stored in the wafer cassette 40 by the wafer transfer system 41.
[0035]
Here, the wafer 32 is normally sucked by the vacuum suction method through the vacuum suction groove and held by the hand. When the wafer 32 is transferred from the hand to the wafer stage 36, or when the wafer 32 is transferred from hand to hand such that the wafer 32 is transferred from hand to hand, the hand of the hand on the passing side is confirmed after the vacuum suction in the receiving hand is confirmed. Release vacuum suction. As long as this vacuum suction works normally, the hand does not drop the wafer 32. However, performing such delivery in the presence of an earthquake shake clearly increases the risk of the wafer 32 falling. Although the possibility of the wafer 32 falling under such conditions is certainly low, considering the labor and cost required for repair when the wafer 32 is dropped on the high precision wafer stage 36 or the like, Fall is an item that must be avoided. Therefore, when the acceleration detecting accelerometer 44 detects an acceleration equal to or greater than the set amount, the delivery of the wafer 32 is immediately stopped and the process waits until the holding of the wafer 32 becomes more reliable.
[0036]
The same can be said for the reticle 31. The movement of the reticle 31 is almost the same as that of the wafer 32, and the reticle transport system 39 takes out a predetermined reticle 31 from the reticle library 37 containing a plurality of reticles, and places the reticle 31 on the reticle stage 38 that holds and positions the reticle 31. Supply. The reticle 31 supplied to the reticle stage 38 is exposed by the illumination optical system 35 after being positioned. After the exposure is completed, the reticle 31 on the reticle stage 38 is again stored in the reticle library 37 by the reticle transport system 39. The holding method of the reticle 31 is performed by sucking the back surface of the reticle 31 by the hand of the reticle transport system 39 in the same manner as in the case of the wafer 32. However, when stored in the reticle library 37, in order to prevent dust from adhering to the reticle 31, the reticle 31 is stored in a case capable of storing the entire reticle (not shown). Like the case of the wafer 32, the risk of dropping during the transfer of the reticle 31 is high when hand-to-hand or hand-to-reticle stage 38 is delivered. Although the possibility of dropping the reticle is not as high as in the case of the wafer 32, the damage to the reticle stage 38 and the like due to the dropping of the reticle is still as great as in the case of the wafer 32. Therefore, there is a possibility that the reticle will drop due to an earthquake. If there is even a slight amount, the conveyance and delivery of the reticle are immediately stopped and a safe state is awaited.
[0037]
As described above, when the accelerometer 44 detects an earthquake in order to minimize the damage to the high precision product such as the wafer stage 36 and the reticle stage 38 due to the fall damage of the conveyed object such as the reticle 31 and the wafer 32, it is immediately dangerous. The delivery and transfer of a transported object is stopped and the machine is in a standby state.
[0038]
Next, prevention of breakage of the movable part will be described. The case of the wafer stage 36, which requires the highest accuracy among the movable parts, will be described. The wafer stage 36 is basically a high-precision stage having an XYZ triaxial structure, and its position in the XY direction is controlled with high accuracy by a laser interferometer. The control by the laser interferometer is capable of following a vibration of about 10 Hz. Considering that a general earthquake is about 2 Hz, the wafer stage 36 stops as soon as the earthquake is detected, and the position control is activated. It is better to stay on the spot. By doing so, it is possible to prevent the wafer stage 36 from being struck and moved by an excitation force due to an earthquake, and the end portion from colliding and being damaged. If the wafer stage 36 is a high-precision air levitation stage and the position cannot be controlled by the laser interferometer, it is preferable to stand by with the air intact. This is because air acts as a buffer. As for the Z direction, the drive mechanism often uses a piezo (piezoelectric element) or a gear train, has a structure that is relatively strong against external vibration, and has a small stroke in the Z direction. It is not necessary to apply.
[0039]
Finally, the operation for resuming early operation will be described. As mentioned above, how to quickly resume operation when an earthquake occurs to stop the equipment until the end of the check of the predetermined inspection items to stop the equipment to prevent the production of defective products Is an important point. Whether or not the time can be shortened depends on how quickly each confirmation item can be checked. In this embodiment, since it is assumed that each check item is not performed automatically but by the user of the apparatus, the control operation unit 45 is provided so that the user of the apparatus can easily understand what to check and what to do. Each check item is displayed in turn on the display 46. This is because the state of equipment shutdown due to an earthquake is rare, and unlike the operations that users perform on a daily basis, it is an operation that is infrequently used, so what should be done for the user to resume operation of the equipment? It is because it is thought that it is not immediately known whether it is good. Even if it is written in the instruction manual, it is easy to forget its existence if you have never experienced it. In other words, the earthquake countermeasures here are considered to be rare cases. Therefore, on the display 46, it is displayed and informed that the apparatus is on standby (you may make a sound), and the work necessary for restarting the operation is instructed in an easy-to-understand manner. The display 46 may of course be the same as the display used for normal device operation, and it is not necessary to provide a new one. For example, “Check the axis misalignment with the light source. The method is as follows. When finished, press the confirm button. “Next, check the position of the wafer transfer system. The method is as follows. When finished, press the confirm button. ”And so on.
[0040]
In each confirmation and adjustment, a mechanism used at the time of installation of the apparatus or at the time of factory adjustment may be used as it is, and no new one is required.
[0041]
Further, as a function for resuming the operation, the state of the wafer 32 and the reticle 31 at the start of standby is stored in the memory in the control operation unit 45, and the operation resumption is performed from the state when the operation was interrupted. Therefore, it is not necessary to replace the useless reticle 31, and the wafer 32 is not wasted. However, since the wafer 32 and the reticle 31 are immediately after being shaken by the earthquake, the operation is resumed after the alignment is performed again.
[0042]
Further, the earthquake countermeasure function of the present embodiment can be stopped by a command input from the control operation unit 45. Further, the accelerometer 44 is not provided with a dedicated one, but another target accelerometer in the apparatus may be shared. However, in that case, it is necessary to obtain in advance the relationship between the vibration of the floor and the acceleration detected by the accelerometer as a shared sensor. Furthermore, in the above description, the user of the device himself checks each item. For example, the device itself is equipped with a mechanism for automatically aligning the main body portion and the separately placed portion. It may be possible to confirm all or part of the image and further perform correction.
[0043]
In the semiconductor exposure apparatus according to this embodiment, an accelerometer is provided as an earthquake detection sensor for controlling the operation of the apparatus. Therefore, when the sensor detects an earthquake, the operation is temporarily stopped and a safe state is waited. Even if a moderate earthquake with an intensity of about 2 to 4 occurs, production of defective products can be prevented and the safety of the apparatus itself can be protected. For this reason, it is not necessary to take a large-scale anti-vibration measure.
[0044]
(Embodiment of semiconductor production system)
Next, an example of a production system of a semiconductor device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.) using an illumination apparatus or an exposure apparatus including the mercury lamp according to the present invention will be described. . In this method, maintenance services such as troubleshooting, periodic maintenance, and software provision for manufacturing apparatuses installed in a semiconductor manufacturing factory are performed using a computer network outside the manufacturing factory.
[0045]
FIG. 7 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business office of a vendor (apparatus supply manufacturer) that provides a semiconductor device manufacturing apparatus. Examples of manufacturing apparatuses include semiconductor manufacturing apparatuses for various processes used in semiconductor manufacturing plants, such as pre-process equipment (lithographic apparatuses such as exposure apparatuses, resist processing apparatuses, etching apparatuses, heat treatment apparatuses, film forming apparatuses, and flattening apparatuses. As well as post-processing equipment (assembly equipment, inspection equipment, etc.). The office 101 includes a host management system 108 that provides a maintenance database for manufacturing apparatuses, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. The host management system 108 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.
[0046]
On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers as users of manufacturing apparatuses. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers, or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them together to construct an intranet, etc., and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 A management system 107 is provided. The host management system 107 provided in each factory 102 to 104 includes a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, the host management system 108 on the vendor's office 101 side can be accessed from the LAN 111 of each factory via the Internet 105, and access is permitted only to limited users due to the security function of the host management system 108. . Specifically, status information (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) indicating the operating status of each manufacturing apparatus 106 is notified from the factory side to the vendor side via the Internet 105, and the notification is also handled. It is possible to receive response information (for example, information for instructing a coping method for trouble, coping software or data), maintenance information such as the latest software and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each factory 102 to 104 and the vendor office 101 and data communication on the LAN 111 in each factory. . Instead of using the Internet as an external network outside the factory, it is also possible to use a high-security dedicated line network (such as ISDN) without being accessible from a third party. Further, the host management system is not limited to the one provided by the vendor, and the user may construct a database and place it on the external network, and allow access to the database from a plurality of factories of the user.
[0047]
FIG. 8 is a conceptual diagram showing the overall system of this embodiment cut out from an angle different from that in FIG. In the previous example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected via an external network, and production management of each factory or at least one unit is performed via the external network. Data communication of manufacturing equipment was performed. On the other hand, in this example, a factory equipped with a plurality of vendors' manufacturing devices and a management system of each vendor of the plurality of manufacturing devices are connected by an external network outside the factory, and maintenance information of each manufacturing device is obtained. Data communication. In the figure, reference numeral 201 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing apparatus that performs various processes on the manufacturing line of the factory, in this case, an exposure apparatus 202, a resist processing apparatus 203, and a film forming processing apparatus. 204 has been introduced. In FIG. 8, only one manufacturing factory 201 is depicted, but actually, a plurality of factories are similarly networked. Each device in the factory is connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the production line.
[0048]
On the other hand, each business office of a vendor (apparatus supply manufacturer) such as the exposure apparatus manufacturer 210, the resist processing apparatus manufacturer 220, and the film formation apparatus manufacturer 230 has host management systems 211, 221 for performing remote maintenance of the supplied devices. 231 and these comprise a maintenance database and an external network gateway as described above. The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected by the external network 200, which is the Internet or a dedicated line network. In this system, if a trouble occurs in any of a series of production equipment on the production line, the operation of the production line is suspended, but remote maintenance via the Internet 200 is received from the vendor of the troubled equipment. Therefore, it is possible to respond quickly and to minimize downtime of the production line.
[0049]
Each manufacturing apparatus installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software stored in a storage device and software for operating the apparatus. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 9 on the display. The operator who manages the manufacturing apparatus in each factory refers to the screen, and the manufacturing apparatus model 401, serial number 402, trouble subject 403, occurrence date 404, urgency 405, symptom 406, countermeasure 407, progress 408, etc. Enter the information in the input field on the screen. The input information is transmitted to the maintenance database via the Internet, and appropriate maintenance information as a result is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser further realizes hyperlink functions 410 to 412 as shown in the figure, and the operator can access more detailed information on each item, or the latest software used for the manufacturing apparatus from the software library provided by the vendor. Version software can be pulled out, and operation guides (help information) for use by factory operators can be pulled out. Here, the maintenance information provided by the maintenance database includes the information related to the present invention described above, and the software library also provides the latest software for realizing the present invention.
[0050]
Next, a semiconductor device manufacturing process using the production system described above will be described. FIG. 10 shows the flow of the entire manufacturing process of the semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask production), a mask on which the designed circuit pattern is formed is produced. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7). The pre-process and post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. In addition, information for production management and apparatus maintenance is communicated between the pre-process factory and the post-process factory via the Internet or a dedicated network.
[0051]
FIG. 11 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed onto the wafer by exposure using the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, it is possible to prevent troubles in advance and to recover quickly even if troubles occur. Productivity can be improved.
[0052]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent a useless external force from being applied to the lamp, so that there is an effect of preventing inadvertent damage to the lamp. Therefore, it is possible to safely perform the lamp replacement operation, and it is possible to perform stable apparatus operation by reducing the lamp breakage accident during operation of the apparatus.
[Brief description of the drawings]
FIG. 1 is a perspective view for explaining an example of a lighting device according to a first embodiment of the present invention.
FIG. 2 is a perspective view for explaining an example of a lighting device according to a second embodiment of the present invention.
FIG. 3 is a perspective view for explaining an example of a lighting device according to a third embodiment of the present invention.
FIG. 4 is a perspective view for explaining an example of a lighting device according to a fourth embodiment of the present invention.
FIG. 5 is a perspective view for explaining an example of a lighting device according to a fifth embodiment of the present invention.
FIG. 6 is an overall configuration diagram showing an example of a semiconductor exposure apparatus according to an embodiment of the present invention.
FIG. 7 is a conceptual view of a semiconductor device production system using an apparatus according to the present invention as seen from a certain angle.
FIG. 8 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention as seen from another angle.
FIG. 9 is a specific example of a user interface.
FIG. 10 is a diagram illustrating a flow of a device manufacturing process.
FIG. 11 is a diagram illustrating a wafer process.
[Explanation of symbols]
1: mercury lamp, 2: positioning pin, 3: lamp mounting hand, 4: lamp mounting screw, 5: notch, 6: lamp mounting hand (mounting member), 7: lamp mounting screw, 8: key, 9: Keyway, 10: Notch, 11: Pin, 12: Positioning mark, 13: Positioning mark, 15: Light emitting part, 16, 17: Base part, 18: Concentric convex part, 20: Conducting wire, 22 : Receiving hole, 23: receiving groove part, 26: guide part, 31: reticle, 32: wafer, 33: projection lens, 35: illumination optical system, 36: wafer stage, 37: reticle library, 38: reticle stage, 39: Reticle transfer system, 40: wafer cassette, 41: wafer transfer system, 42: alignment scope, 43: mount, 44: accelerometer, 45: control operation 46: Display, 51: Lamp house, 101: Vendor's office, 102, 103, 104: Manufacturing factory, 105: Internet, 106: Manufacturing equipment, 107: Factory host management system, 108: Vendor side host management System: 109: Vendor side local area network (LAN), 110: Operation terminal computer, 111: Factory local area network (LAN), 200: External network, 201: Manufacturing apparatus user manufacturing factory, 202: Exposure apparatus, 203: resist processing apparatus, 204: film formation processing apparatus, 205: factory host management system, 206: factory local area network (LAN), 210: exposure apparatus manufacturer, 211: host management system at the office of the exposure apparatus manufacturer 220: Resist processing apparatus 221: Host management system of the establishment of the resist processing apparatus manufacturer, 230: Deposition apparatus manufacturer, 231: Host management system of the establishment of the deposition apparatus manufacturer, 401: Model of the production apparatus, 402: Serial number, 403: Trouble subject, 404: Date of occurrence, 405: Urgency, 406: Symptom, 407: Countermeasure, 408: Progress, 410, 411, 412: Hyperlink function.

Claims (3)

When mounting the mercury lamps with projections and the positioning pin to the cap portion at the other end provided with a conducting wire in the base part of the one end, the groove hole and the positioning pin wherein the convex portion is fitted is fitted in the conducting wire with orienting the illumination device characterized that you fixing the mercury lamp by a screw to reduce the width of the diameter and the groove of the hole by turns. An exposure apparatus that exposes a predetermined pattern on a substrate by the illumination device according to claim 1 . A manufacturing apparatus group for various processes including the exposure apparatus according to claim 2 is installed in a semiconductor manufacturing factory, and a semiconductor device is manufactured by a plurality of processes using the manufacturing apparatus group. A semiconductor device method.

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