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JP4514505B2 - Flat wiring material - Google Patents

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JP4514505B2
JP4514505B2 JP2004131090A JP2004131090A JP4514505B2 JP 4514505 B2 JP4514505 B2 JP 4514505B2 JP 2004131090 A JP2004131090 A JP 2004131090A JP 2004131090 A JP2004131090 A JP 2004131090A JP 4514505 B2 JP4514505 B2 JP 4514505B2
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wiring
wiring circuit
circuit
joint
insulating film
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JP2005317244A (en
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右文 瀬尾
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Fujikura Ltd
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Description

本発明は、自動車や電子機器に用いられる可撓性を有するフラット配線材及びその製造方法に関し、特に配線回路間でのジョイント接続が必要なフラット配線材に関する。 The present invention relates to a flexible flat wiring material used for automobiles and electronic devices and a method for manufacturing the same, and more particularly to a flat wiring material that requires joint connection between wiring circuits.

自動車などの電気配線に用いられる可撓性を有するフラット配線材は、例えば所定の回路形態に形成された丸型断面又は矩形断面を有する複数の電線(配線回路)を、絶縁フィルム等の絶縁被覆で覆った構造からなるため、配線回路間をジョイント接続する場合、2つのフラット配線材間を接合器を用いて相互に接続したり(特許文献1)、製造時に予めジョイント配線用の電線を配設したりすることによりジョイント配線処理が行われている(特許文献2)。   A flexible flat wiring material used for electric wiring of automobiles, for example, a plurality of electric wires (wiring circuits) having a round cross section or a rectangular cross section formed in a predetermined circuit form, and an insulating coating such as an insulating film When the wiring circuits are jointly connected, the two flat wiring members are connected to each other using a jointer (Patent Document 1), or joint wiring wires are arranged in advance during manufacturing. The joint wiring process is performed by installing (patent document 2).

特開2002−163937号公報(第3〜4頁、図1〜図3)JP 2002-163937 A (pages 3 to 4, FIGS. 1 to 3) 特開平6−231622号公報(第3頁、図3)JP-A-6-231622 (page 3, FIG. 3)

しかしながら、特許文献1に記載のように接合体を用いてジョイント配線処理を行う場合、配線材の他に各配線回路を接続する接合体が必要となるため、部品点数が増えてしまい製品管理が煩雑となると共に製造コストが掛かってしまうという問題がある。また、特許文献2のように配線材の製造時に予めジョイント配線用の電線を配設する場合、配設した後の銅張積層板(CCL)と絶縁被覆としてのカバーレイフィルム(CL)との貼り合わせ工程で配設した電線の周囲にボイドなどの欠陥が生じることがあり、著しく品質が低下してしまうおそれがある。更に、この場合、配線材の製造時にジョイント配線処理の有無で配線材を構成する各部品の細かな品番管理などが必要となるため、製品管理の負担が増加してしまうという問題がある。   However, when joint wiring processing is performed using a joined body as described in Patent Document 1, a joined body for connecting each wiring circuit is required in addition to the wiring material, which increases the number of parts, thereby reducing product management. There is a problem that it is complicated and the manufacturing cost is increased. Moreover, when the electric wire for joint wiring is previously arrange | positioned at the time of manufacture of a wiring material like patent document 2, the copper clad laminated board (CCL) after arrangement | positioning and the coverlay film (CL) as insulation coating Defects such as voids may occur around the wires arranged in the bonding step, and the quality may be significantly degraded. Furthermore, in this case, there is a problem that the burden of product management increases because fine product number management of each component constituting the wiring material is required depending on whether joint wiring processing is performed or not at the time of manufacturing the wiring material.

本発明は、このような問題点に鑑みてなされたもので、製品管理及びジョイント配線処理を容易にし、製造コストの削減を図ることができるフラット配線材を提供することを目的とする。 The present invention has been made in view of such problems, and an object of the present invention is to provide a flat wiring material that can facilitate product management and joint wiring processing and can reduce manufacturing costs.

本発明は、複数の配線回路を併設しその上を絶縁性フィルムで被覆してなる可撓性を有するフラット配線材において、所定の配線方向に延びる第1及び第2の配線回路とこれら第1及び第2の配線回路間に配線された第3の配線回路と、前記第1の配線回路の所定部分の前記絶縁性フィルムが除去されて前記配線回路が露出した第1の配線回路露出部と、前記第2の配線回路の所定部分の前記絶縁性フィルムが除去されて前記配線回路が露出した第2の配線回路露出部とを備え、前記第1の配線回路露出部及びこの第1の配線回路露出部に繋がる第1の配線回路の一部を含むように前記配線回路に沿って帯状に分離された部分が折り返されて前記第1の配線回路露出部と前記第2の配線回路露出部とが溶接又は半田付けにより電気的に接続されたジョイント配線部を形成し、このジョイント配線部以外の部分が主配線部を形成し、前記第1及び第2の配線回路は、前記第3の配線回路に対するシールド配線を構成するものであることを特徴とする。 The present invention relates to a first and second wiring circuit extending in a predetermined wiring direction and the first and second wiring circuits in a flexible flat wiring material in which a plurality of wiring circuits are provided and covered with an insulating film. And a third wiring circuit wired between the second wiring circuit and a first wiring circuit exposed portion where the insulating film is removed from a predetermined portion of the first wiring circuit and the wiring circuit is exposed. A second wiring circuit exposed portion from which the insulating film in a predetermined portion of the second wiring circuit is removed and the wiring circuit is exposed, and the first wiring circuit exposed portion and the first wiring A portion separated in a strip shape along the wiring circuit is folded back so as to include a part of the first wiring circuit connected to the circuit exposed portion, and the first wiring circuit exposed portion and the second wiring circuit exposed portion Are electrically connected by welding or soldering. A joint wiring portion is formed, and a portion other than the joint wiring portion forms a main wiring portion, and the first and second wiring circuits constitute a shield wiring for the third wiring circuit. It is characterized by.

本発明のフラット配線材によれば、可撓性を有するフラットな主配線部の第1の配線回路露出部と第2の配線回路露出部とをフラットな配線部材からなるジョイント配線部でレーザ加工、溶接又は半田付けにより接続したものであるから、少ない部品で配線材を構成することができ、製造コストの削減を図ることができる。しかも、本発明によれば、配線回路を絶縁フィルムで覆った上にジョイント配線材が配置された構造であるため、絶縁フィルムにおけるボイドの発生はなく、品質の低下の無い配線材を提供することができる。 According to the flat wiring material of the present invention, the first wiring circuit exposed portion and the second wiring circuit exposed portion of the flexible flat main wiring portion are laser processed by the joint wiring portion made of a flat wiring member. Since these are connected by welding or soldering, the wiring material can be formed with a small number of parts, and the manufacturing cost can be reduced. In addition, according to the present invention, since the joint wiring material is disposed on the wiring circuit covered with the insulating film, there is no generation of voids in the insulating film, and the wiring material without deterioration in quality is provided. Can do.

以下、添付の図面を参照して、本発明を説明する。
図1は、本発明の第1の参考例に係る可撓性のフラット配線材の一部のジョイント接続前の状態を示す平面図、図2は、同じくジョイント接続後の状態を示す平面図である。なお、以下に述べるフラット配線材は、例えばフレキシブルプリン基板(FPC)、フレキシブルフラットケーブル(FFC)等である。
Hereinafter, the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a plan view showing a state of a part of a flexible flat wiring material according to a first reference example of the present invention before joint connection, and FIG. 2 is a plan view showing the state after joint connection. is there. The flat wiring material described below is, for example, a flexible pudding substrate (FPC), a flexible flat cable (FFC), or the like.

図1に示すように、フラット配線材は、主配線部10とジョイント配線部20とを備え、所定の配線方向に沿って平行に形成された、銅または銅合金からなり、導体露出部に必要に応じてめっき処理を施した平面状の複数の第1の配線回路11、第2の配線回路12及び第3の配線回路13を、ポリエチレンテレフタレート(PET)やポリエチレンナフタレート(PEN)等の合成樹脂からなる絶縁フィルム16で被覆することにより構成されている。   As shown in FIG. 1, the flat wiring material includes a main wiring portion 10 and a joint wiring portion 20, and is made of copper or a copper alloy formed in parallel along a predetermined wiring direction, and is necessary for the conductor exposed portion. A plurality of planar first wiring circuit 11, second wiring circuit 12 and third wiring circuit 13 which have been plated in accordance with the above are synthesized with polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or the like. It is comprised by coat | covering with the insulating film 16 which consists of resin.

第1〜第3の配線回路11〜13は、それぞれ平行配置された複数の導体17,18,19からなる導体群を構成している。このうち、第3の配線回路13は配線方向に長く延び、第1及び第2の配線回路11,12は、第3の配線回路13の両側に配置されている。従って、第1及び第2の配線回路11,12を接続するためには、第3の配線回路13を跨ぐ形のジョイント配線が必要になる。第1の配線回路11の上端は第3の配線回路13の途中の位置にあり、第2の配線回路12の下端は第1の配線回路11の上端よりも若干下側に位置する。そして、第1の配線回路11の上端部の絶縁フィルム16が除去されて開口部14が形成され、この開口部14に露出した導体17の端末部17aが第1の配線回路露出部を構成している。一方、第2の配線回路12の下端部には、配線方向と直交し外側に向けて曲がる折曲部18bが形成されており、この折曲部18bの先端の絶縁フィルム16が除去されて開口部15が形成され、この開口部15に露出した導体18の端末部18aが第2の配線回路露出部を構成している。   The first to third wiring circuits 11 to 13 constitute a conductor group including a plurality of conductors 17, 18 and 19 arranged in parallel. Among these, the third wiring circuit 13 extends long in the wiring direction, and the first and second wiring circuits 11 and 12 are arranged on both sides of the third wiring circuit 13. Therefore, in order to connect the first and second wiring circuits 11 and 12, joint wiring having a shape straddling the third wiring circuit 13 is necessary. The upper end of the first wiring circuit 11 is in the middle of the third wiring circuit 13, and the lower end of the second wiring circuit 12 is positioned slightly below the upper end of the first wiring circuit 11. Then, the insulating film 16 at the upper end portion of the first wiring circuit 11 is removed to form the opening portion 14, and the terminal portion 17 a of the conductor 17 exposed to the opening portion 14 constitutes the first wiring circuit exposed portion. ing. On the other hand, a bent portion 18b that is bent outward and perpendicular to the wiring direction is formed at the lower end of the second wiring circuit 12, and the insulating film 16 at the tip of the bent portion 18b is removed to open the opening. A portion 15 is formed, and a terminal portion 18a of the conductor 18 exposed in the opening 15 forms a second wiring circuit exposed portion.

第1の配線回路11の端末部17a及びこれに繋がる第1の配線回路11の上端部分は、第1の配線回路11に沿った切断線9によって帯状に分離されている。この帯状に分離された部分がジョイント配線部20を構成し、残りの部分が主配線部10を構成する。図2に示すように、ジョイント配線部20は、面方向に90°折り返されて、その端末部17aが第2の配線回路12の端末部18aと重ね合わされる。そして、端末部17a,18aは、半田付け、抵抗溶接等により電気的に接続される。これにより、第1の配線回路11と第2の配線回路12とが、第3の配線回路13を跨いで相互に接続され、共通の配線回路として使用可能になる。   The terminal portion 17 a of the first wiring circuit 11 and the upper end portion of the first wiring circuit 11 connected to the terminal portion 17 a are separated in a band shape by a cutting line 9 along the first wiring circuit 11. The part separated into the strip shape constitutes the joint wiring part 20, and the remaining part constitutes the main wiring part 10. As shown in FIG. 2, the joint wiring portion 20 is turned 90 ° in the surface direction, and the terminal portion 17 a is overlapped with the terminal portion 18 a of the second wiring circuit 12. The terminal portions 17a and 18a are electrically connected by soldering, resistance welding or the like. As a result, the first wiring circuit 11 and the second wiring circuit 12 are connected to each other across the third wiring circuit 13 and can be used as a common wiring circuit.

図3は、この第1の参考例に係るフラット配線材の製造工程を示すフローチャートである。
まず、絶縁フィルム16に開口部14,15を形成し(S11)、配線回路11〜13を形成したのち(S12)、絶縁フィルム16を配線回路11〜13を挟んで互いに貼り付けることにより主配線部10とジョイント配線部20とを含んだ配線基板を形成する(S13)。次に、配線基板の一部を切断線9に沿って帯状に切断し(S14)、切断した帯状の部分(ジョイント配線部20)を折り返して端末部17a,18aを接続する(S15)。端末部17a,18aの接続は、FPCの場合、半田付け、FFCの場合、抵抗溶接(シリーズ溶接)が望ましいが、他にレーザ溶接、超音波溶接等の方法によっても良い。最後に、端末部17a,18aの接続部に図示しない絶縁部材を貼り付ける(S16)ことにより、ジョイント接続がなされたフラット配線材が完成する。
FIG. 3 is a flowchart showing manufacturing steps of the flat wiring material according to the first reference example.
First, the openings 14 and 15 are formed in the insulating film 16 (S11), the wiring circuits 11 to 13 are formed (S12), and then the insulating film 16 is bonded to each other with the wiring circuits 11 to 13 interposed therebetween. A wiring board including the portion 10 and the joint wiring portion 20 is formed (S13). Next, a part of the wiring board is cut into a strip shape along the cutting line 9 (S14), and the cut strip-shaped portion (joint wiring portion 20) is folded to connect the terminal portions 17a and 18a (S15). The terminal portions 17a and 18a are connected by soldering in the case of FPC or resistance welding (series welding) in the case of FFC, but may be by other methods such as laser welding or ultrasonic welding. Finally, an insulating member (not shown) is attached to the connecting portions of the terminal portions 17a and 18a (S16), thereby completing the flat wiring material with the joint connection.

この第1の参考例によれば、主配線部10とジョイント配線部20とが1枚の配線基板として一体に形成されたものであるため、ジョイント配線のための別部品は全く必要としない。しかも、接続箇所は、1箇所のみであり、ジョイント配線作業が極めて簡素化される。また、接続部以外は、絶縁フィルム16で覆われており、第2の配線回路12には、折曲部18bによって端末部18aの延びる方向を、ジョイント配線部20の端末部17aの折り返し後の方向とが一致するので、開口部14,15を比較的大きくとっても、不要な部分での短絡は発生しない。 According to the first reference example , the main wiring portion 10 and the joint wiring portion 20 are integrally formed as a single wiring board, and therefore no separate parts for joint wiring are required. Moreover, there is only one connection location, and the joint wiring work is greatly simplified. In addition, the portions other than the connection portion are covered with the insulating film 16, and the second wiring circuit 12 has a direction in which the terminal portion 18 a extends by the bent portion 18 b after the terminal portion 17 a of the joint wiring portion 20 is folded back. Since the directions coincide with each other, even if the openings 14 and 15 are made relatively large, no short circuit occurs in unnecessary portions.

図4は、本発明の第2の参考例に係る可撓性のフラット配線材の一部のジョイント接続前の状態を示す平面図、図5は、同じくジョイント接続後の状態を示す平面図である。
この第2の参考例は、主配線部10′の第2の配線回路12′のパターンが第1のものと異なっている。この参考例では、第2の配線回路12′が折曲部18bの先端側から再度配線方向に延びる導体18cを有し、全体がクランク状に形成されている。
この参考例の場合、第1の配線回路11と第2の配線回路12′の接続部で分岐する分岐回路を形成することができる。
FIG. 4 is a plan view showing a part of the flexible flat wiring material according to the second reference example of the present invention before joint connection, and FIG. 5 is a plan view showing the state after joint connection. is there.
In the second reference example , the pattern of the second wiring circuit 12 'of the main wiring portion 10' is different from the first one. In this reference example , the second wiring circuit 12 'has a conductor 18c extending again in the wiring direction from the front end side of the bent portion 18b, and is entirely formed in a crank shape.
In the case of this reference example , it is possible to form a branch circuit that branches at the connection portion between the first wiring circuit 11 and the second wiring circuit 12 ′.

図6及び図7は、本発明の第3の参考例に係る可撓性のフラット配線材の一部のジョイント接続前の状態をそれぞれ示す平面図、図8は、同じくジョイント接続後の状態を示す平面図である。
この参考例では、主配線部30とジョイント配線部40とを別体とし、それぞれをFPC又はFFCで構成している。主配線部30は、第1の参考例と同様、所定の配線方向に沿って平行に形成された第1の配線回路31、第2の配線回路32及び第3の配線回路33を有する。これら配線回路31〜33も、それぞれが平行配置された複数の導体37,38,39からなる導体群を構成している。第2及び第3の配線回路32,33は、第1の参考例と同様の配線パターンであるが、第1の配線回路31は、その端部が第2の配線回路32の端部と同じ配線方向位置に配置され、互いに外側に向くように折曲部37b,38bを形成し、これら折曲部37b,38bの先端部の絶縁フィルム16が除去されて開口部34,35が形成され、これら開口部34,35に露出した導体37,38の端末部37a,38aが、第1及び第2の配線回路露出部を構成している。
6 and 7 are plan views respectively showing a state before connection of some joints of the flexible flat wiring material according to the third reference example of the present invention, and FIG. 8 is a state after connection of the joints. FIG.
In this reference example , the main wiring part 30 and the joint wiring part 40 are separated from each other, and each is constituted by FPC or FFC. As in the first reference example , the main wiring section 30 includes a first wiring circuit 31, a second wiring circuit 32, and a third wiring circuit 33 that are formed in parallel along a predetermined wiring direction. These wiring circuits 31 to 33 also constitute a conductor group composed of a plurality of conductors 37, 38, and 39 arranged in parallel. The second and third wiring circuits 32 and 33 have the same wiring pattern as that of the first reference example , but the end of the first wiring circuit 31 is the same as the end of the second wiring circuit 32. The bent portions 37b and 38b are formed so as to be arranged in the wiring direction position and face each other, and the insulating film 16 at the tip of the bent portions 37b and 38b is removed to form the openings 34 and 35. The terminal portions 37a, 38a of the conductors 37, 38 exposed in the openings 34, 35 constitute first and second wiring circuit exposed portions.

一方、ジョイント配線部40は、主配線部20と同様なFPC又はFFCからなり、複数の導体41を平行配置した配線回路を絶縁フィルム16で被覆した帯状の可撓性フラット部材である。複数の導体41の両端部は、絶縁フィルム16が除去され、ここに導体41の端末部41a,41bが露出している。そして、このジョイント配線部40は、図8に示すように、その端末部41a41bが主配線部30の端末部37a,38aと重合するように配線方向と直交に配置され、端末部41a,37aと、接続部41b,38aがそれぞれ溶接、半田付け等の方法により接合されている。   On the other hand, the joint wiring portion 40 is made of the same FPC or FFC as the main wiring portion 20 and is a belt-like flexible flat member in which a wiring circuit in which a plurality of conductors 41 are arranged in parallel is covered with an insulating film 16. At both ends of the plurality of conductors 41, the insulating film 16 is removed, and the terminal portions 41a and 41b of the conductor 41 are exposed here. And as shown in FIG. 8, this joint wiring part 40 is arrange | positioned orthogonally to a wiring direction so that the terminal part 41a41b may overlap with the terminal parts 37a and 38a of the main wiring part 30, and terminal part 41a, 37a and The connecting portions 41b and 38a are joined by a method such as welding or soldering.

図9は、この第3の参考例に係るフラット配線材の製造工程を示すフローチャートである。
まず、絶縁フィルム16に開口部34,35を形成し(S21)、配線回路31〜33を形成したのち(S22)、絶縁フィルム16を配線回路31〜33を挟んで互いに貼り付けることにより主配線部30を形成する(S23)。次に、同様の工程により帯状のジョイント配線部40を形成する(S24)。そして、主配線部30の端末部37a,38aと、ジョイント配線部40の端末部41a,41bとを接続する(S25)。この場合にも、端末部37a,41aと、端末部38a,41bとの接続は、FPCの場合、半田付け、FFCの場合、抵抗溶接(シリーズ溶接)が望ましいが、他にレーザ溶接、超音波溶接等の方法によっても良い。最後に、端末部37a,41a及び端末部38a,41bの接続部に図示しない絶縁部材を貼り付ける(S26)ことにより、ジョイント接続がなされたフラット配線材が完成する。
FIG. 9 is a flowchart showing manufacturing steps of the flat wiring material according to the third reference example .
First, the openings 34 and 35 are formed in the insulating film 16 (S21), the wiring circuits 31 to 33 are formed (S22), and then the insulating film 16 is attached to each other with the wiring circuits 31 to 33 interposed therebetween. The part 30 is formed (S23). Next, the strip-shaped joint wiring part 40 is formed by the same process (S24). And the terminal parts 37a and 38a of the main wiring part 30 and the terminal parts 41a and 41b of the joint wiring part 40 are connected (S25). Also in this case, the connection between the terminal portions 37a and 41a and the terminal portions 38a and 41b is preferably soldering in the case of FPC and resistance welding (series welding) in the case of FFC, but in addition, laser welding, ultrasonic waves A method such as welding may be used. Finally, an insulating member (not shown) is attached to the connecting portions of the terminal portions 37a and 41a and the terminal portions 38a and 41b (S26), thereby completing the flat wiring material with the joint connection.

この参考例においても、追加部品はジョイント配線部40だけに抑えられ、接続箇所も2箇所であるから、作業は容易である。また、第1の参考例のように折り返し部が存在しないため、全体を薄型にできるという利点がある。 Also in this reference example, the additional parts are limited to only the joint wiring portion 40, and the number of connection locations is two, so the work is easy. In addition, since there is no folded portion as in the first reference example , there is an advantage that the whole can be made thin.

図10は、本発明の実施形態に係る可撓性のフラット配線材の一部のジョイント接続前の状態を示す平面図、図11は、同じくジョイント接続後の状態を示す平面図である。
図10に示すように、フラット配線材は、主配線部50とジョイント配線部60とを備え、所定の配線方向に沿って平行に形成された平面状の第1の配線回路51、第2の配線回路52及び第3の配線回路53を、絶縁フィルム16で被覆することにより構成されている。
FIG. 10 is a plan view showing a state of the flexible flat wiring member according to the embodiment of the present invention before a joint connection, and FIG. 11 is a plan view showing the state after the joint connection.
As shown in FIG. 10, the flat wiring member includes a main wiring portion 50 and a joint wiring portion 60, and includes a planar first wiring circuit 51 and a second wiring formed in parallel along a predetermined wiring direction. The wiring circuit 52 and the third wiring circuit 53 are configured by covering with the insulating film 16.

第1及び第2の配線回路51,52は、それぞれ1本の導体57,58により構成され、第3の配線回路53は、平行配置された複数の導体59からなる導体群を構成している。そして、第3の配線回路53を構成する導体59の端末部59aは、絶縁フィルム16が除去され、図示しない接続端子に接続されてコネクタハウジングに収容されるコネクタ部を構成する。また、第1の配線回路51の導体57の端末部57aは、絶縁フィルム16が除去されて第1の配線回路露出部を構成している。第2の配線回路52の導体58は、端末部58aが端末部57aよりも先端から奥まった位置に配置されるように他の導体57,59よりも短く形成され、端末部58aは、絶縁フィルム16が除去されて第2の配線回路露出部を構成している。   The first and second wiring circuits 51 and 52 are each composed of one conductor 57 and 58, and the third wiring circuit 53 is a conductor group composed of a plurality of conductors 59 arranged in parallel. . And the terminal part 59a of the conductor 59 which comprises the 3rd wiring circuit 53 comprises the connector part by which the insulating film 16 is removed and it connects to the connection terminal which is not shown in figure, and is accommodated in a connector housing. Further, the terminal portion 57a of the conductor 57 of the first wiring circuit 51 forms the first wiring circuit exposed portion by removing the insulating film 16. The conductor 58 of the second wiring circuit 52 is formed shorter than the other conductors 57 and 59 so that the terminal portion 58a is disposed at a position deeper from the tip than the terminal portion 57a, and the terminal portion 58a is formed of an insulating film. 16 is removed to form a second wiring circuit exposed portion.

そして、第1の配線回路51の先端側が導体57に沿って第2の配線回路52の端末部58aの位置まで切断線54によって帯状に切断され、ジョイント配線部60を構成している。このジョイント配線部60を構成する帯状部分以外の部分が主配線部50である。ジョイント配線部60は、端末部57a,58aが重なるように平面上で90°折り返され(図11参照)、端末部57a,58aは、溶接、半田付け等の方法で接続されている。   Then, the distal end side of the first wiring circuit 51 is cut into a band shape by the cutting line 54 to the position of the terminal portion 58 a of the second wiring circuit 52 along the conductor 57, thereby constituting the joint wiring portion 60. A portion other than the belt-shaped portion constituting the joint wiring portion 60 is the main wiring portion 50. The joint wiring portion 60 is folded 90 ° on a plane so that the terminal portions 57a and 58a overlap (see FIG. 11), and the terminal portions 57a and 58a are connected by a method such as welding or soldering.

このフラット配線材によれば、コネクタ部に接続される第3の配線回路53を第1の配線回路51と第2の配線回路52とで取り囲むことができるので、これらの配線回路51,52を他端側で接地電位に接続すれば、これらの配線回路51,52を第3の配線回路53のシールド線として機能させることができる。   According to this flat wiring material, the third wiring circuit 53 connected to the connector portion can be surrounded by the first wiring circuit 51 and the second wiring circuit 52. If the other end side is connected to the ground potential, these wiring circuits 51 and 52 can function as shield lines of the third wiring circuit 53.

本発明の第1の参考例に係るフラット配線材のジョイント接続前の平面図である。It is a top view before the joint connection of the flat wiring material which concerns on the 1st reference example of this invention. 同フラット配線材のジョイント接続後の平面図である。It is a top view after the joint connection of the flat wiring material. 同フラット配線材の製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of the same flat wiring material. 本発明の第2の参考例に係るフラット配線材のジョイント接続前の平面図である。It is a top view before the joint connection of the flat wiring material which concerns on the 2nd reference example of this invention. 同フラット配線材のジョイント接続後の平面図である。It is a top view after the joint connection of the flat wiring material. 本発明の第3の参考例に係るフラット配線材における主配線部のジョイント接続前の平面図である。It is a top view before the joint connection of the main wiring part in the flat wiring material which concerns on the 3rd reference example of this invention. 同フラット配線材におけるジョイント配線部のジョイント接続前の平面図である。It is a top view before the joint connection of the joint wiring part in the same flat wiring material. 同フラット配線材のジョイント接続後の平面図である。It is a top view after the joint connection of the flat wiring material. 同フラット配線材の製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of the same flat wiring material. 本発明の実施形態に係るフラット配線材のジョイント接続前の平面図である。It is a top view before the joint connection of the flat wiring material which concerns on embodiment of this invention. 同フラット配線材のジョイント接続後の平面図である。It is a top view after the joint connection of the flat wiring material.

10,30,50…主配線部、11,31,51…第1の配線回路、12,32,52…第2の配線回路、13,33,53…第3の配線回路、14,15,34,35…開口部、16…絶縁フィルム、17〜19,37〜39,41,57〜59…導体、17a,18a,37a,38a,41a,41b,57a,58a,59a…端末部、20,40,60…ジョイント配線部。
10, 30, 50... Main wiring section, 11, 31, 51... First wiring circuit, 12, 32, 52... Second wiring circuit, 13, 33, 53. 34, 35 ... opening, 16 ... insulating film, 17-19, 37-39, 41, 57-59 ... conductor, 17a, 18a, 37a, 38a, 41a, 41b, 57a, 58a, 59a ... terminal, 20 , 40, 60 ... Joint wiring part.

Claims (1)

複数の配線回路を併設しその上を絶縁性フィルムで被覆してなる可撓性を有するフラット配線材において、
所定の配線方向に延びる第1及び第2の配線回路と、
これら第1及び第2の配線回路間に配線された第3の配線回路と、
前記第1の配線回路の所定部分の前記絶縁性フィルムが除去されて前記配線回路が露出した第1の配線回路露出部と、
前記第2の配線回路の所定部分の前記絶縁性フィルムが除去されて前記配線回路が露出した第2の配線回路露出部とを備え、
前記第1の配線回路露出部及びこの第1の配線回路露出部に繋がる第1の配線回路の一部を含むように前記配線回路に沿って帯状に分離された部分が折り返されて前記第1の配線回路露出部と前記第2の配線回路露出部とが溶接又は半田付けにより電気的に接続されたジョイント配線部を形成し、
このジョイント配線部以外の部分が主配線部を形成し
前記第1及び第2の配線回路は、前記第3の配線回路に対するシールド配線を構成するものであることを特徴とするフラット配線材。
In a flexible flat wiring material in which a plurality of wiring circuits are provided and covered with an insulating film,
First and second wiring circuits extending in a predetermined wiring direction;
A third wiring circuit wired between the first and second wiring circuits;
A first wiring circuit exposed portion in which the insulating film in a predetermined portion of the first wiring circuit is removed and the wiring circuit is exposed;
A second wiring circuit exposed portion where the insulating film in a predetermined portion of the second wiring circuit is removed and the wiring circuit is exposed;
The first wiring circuit exposed portion and a portion separated in a strip shape along the wiring circuit so as to include the first wiring circuit exposed portion and a part of the first wiring circuit connected to the first wiring circuit exposed portion are folded back to the first wiring circuit. Forming a joint wiring portion in which the wiring circuit exposed portion and the second wiring circuit exposed portion are electrically connected by welding or soldering,
Parts other than this joint wiring part form the main wiring part ,
The flat wiring material, wherein the first and second wiring circuits constitute a shield wiring for the third wiring circuit.
JP2004131090A 2004-04-27 2004-04-27 Flat wiring material Expired - Fee Related JP4514505B2 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551063A (en) * 1979-01-31 1980-01-07 Sumitomo Electric Industries Method of forming flexible conductive circuit
JP2004095507A (en) * 2002-09-04 2004-03-25 Yazaki Corp Joint structure and jointing method of flat circuit body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS551063A (en) * 1979-01-31 1980-01-07 Sumitomo Electric Industries Method of forming flexible conductive circuit
JP2004095507A (en) * 2002-09-04 2004-03-25 Yazaki Corp Joint structure and jointing method of flat circuit body

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