JP4513674B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device and an electronic apparatus. In particular, the present invention relates to an electro-optical device including a mounting defect inspection pattern and a wiring pattern formation defect inspection region, and an electronic apparatus including such an electro-optical device.

Conventionally, as one aspect of an electro-optical device, a pair of substrates each having an electrode formed thereon are arranged to face each other, and a voltage applied to a plurality of pixels that are intersecting regions of the electrodes is selectively turned on and off. A liquid crystal device that modulates light passing through a liquid crystal material in the pixel region and displays an image or an image such as a character is often used.
In such a liquid crystal device, in order to drive the liquid crystal material in each pixel region, a driver IC or a flexible circuit board is mounted on the substrate, and a drive signal output from the driver IC or the like is formed on the substrate. It is supplied to each electrode through a plurality of wiring patterns.

  Here, in the manufacturing stage of such a liquid crystal device, an inspection is performed to confirm whether or not the formed wiring patterns have a formation defect such as a short circuit or disconnection. For this inspection, for example, two probes each having a plurality of inspection pins are used, and every other probe of a different system is brought into contact with a plurality of wiring patterns so that a current flows from each probe. It is done by. That is, when a display defect such as a point defect or a line defect is found when a current is applied to each wiring pattern to light the display surface, the presence of a disconnection can be verified. In addition, when a current flows between the probes, it is possible to verify the presence of a short circuit between the wiring patterns.

  There has been proposed an electro-optical panel that can accurately and easily inspect such a wiring pattern. More specifically, as shown in FIG. 13, the first substrate on which the plurality of scanning lines 512 are formed is opposed to the first substrate at a predetermined interval, and pixels are formed to intersect the scanning lines 512. And a second substrate 550 on which a plurality of data lines 552 are formed, and an electro-optical material provided in a gap between the first substrate and the second substrate 550, and wiring elements for the data lines 552 and the scanning lines 512 540 and 541 form groups G1, G2, and G3, respectively, and are collectively arranged on one side of the substrate 550. The group G3 of the wiring elements 541 of the data line 552 and the group G1 of the wiring elements 540 of the scanning line 512 are arranged. G2 discloses an electro-optical panel that is arranged apart from each other by a distance that allows a plurality of wiring terminals to be arranged (see Patent Document 1).

On the other hand, a mounting component such as a driver IC or a flexible circuit board mounted on a substrate may cause malfunction if it is not accurately conducted to wiring on the substrate such as mounting displacement or contact failure. For this reason, there has been proposed a liquid crystal panel provided with an inspection conductor for inspecting a mounting component for mounting defects. More specifically, as shown in FIG. 14, inspection terminals 624 adjacent to the array of input terminals 614 on the substrate 610 side are arranged, and inspection leads adjacent to the array of conductors 617 on the flexible tape 616 side. A liquid crystal panel in which 627 is arranged is disclosed. According to such a liquid crystal panel, the continuity between the pads 625 and 628 is inspected after the TAB is formed, and in the case of a short circuit, it is determined that the misalignment of the conducting wire 617 due to the extension of the flexible tape 616 is large, resulting in poor connection. (See Patent Document 2).
JP 2002-202733 A (Claims, FIG. 3) Japanese Patent Laid-Open No. 9-5381 (Claims, FIG. 1)

However, although the electro-optical panel of Patent Document 1 can inspect the formation failure of the wiring pattern, it cannot detect the electrical connection failure between the wiring pattern and the mounted component. Further, since the liquid crystal panel of Patent Document 2 is provided with a predetermined inspection lead wire, although it is configured to detect an electrical connection failure between a wiring pattern and a mounted component, for example, for performing a probe inspection When the inspection lead wire is provided in the inspection region or in the vicinity thereof, an erroneous determination may occur in the probe inspection by the inspection lead wire.
That is, as shown in FIG. 14, the inspection conductor 627 described in Patent Document 2 includes a connection portion 630 that connects two conductors, and the connection portion 630 exists in the inspection region of the probe inspection. Then, probes of different systems are mounted on the inspection conductors, and currents flow between the probes of different systems via the inspection conductors, thereby causing a determination of a short circuit. As a result, in the probe inspection, the location where the short circuit occurs cannot be specified, so that the substrate to be inspected is determined as a defective product even though there is no problem with the wiring pattern for driving the liquid crystal. There was a problem that.

Accordingly, the inventors of the present invention have made diligent efforts to connect the connection part of the inspection pattern for inspecting the mounting defect, which exists around the area for inspecting the formation state of the wiring pattern, outside the inspection area for the formation state inspection. The present invention has been completed by finding out that such a problem can be solved by providing in the present invention.
That is, according to the present invention, when the formation state of the wiring pattern is inspected, an erroneous determination such as a short circuit is prevented by the inspection pattern, and the inspection of the formation failure of the wiring pattern and the connection failure of the mounted component is performed. It is an object of the present invention to provide an electro-optical device with significantly improved accuracy. Another object of the present invention is to provide an electronic apparatus including such an electro-optical device.

According to the present invention, an electro-optical device substrate having a plurality of wiring patterns, a mounting component having a plurality of display signal output terminals electrically connected to the plurality of wiring patterns, and an electro-optical device substrate An electro-optic device, and an electro-optic device,
The mounting component further includes a plurality of inspection terminals, and the substrate for the electro-optical device has a linear shape of the plurality of wiring patterns in order to inspect the formation state of the plurality of wiring patterns in or near the mounting region of the mounting component. And a test pattern for verifying a connection failure between the plurality of wiring patterns and the plurality of display signal output terminals. The test pattern includes a plurality of test terminals. Of these, two wiring portions extending along the extending direction of the linear portion of the wiring pattern, which are respectively connected to any two at least one inspection terminal, and the two wiring portions are connected A connection portion extending in a direction in which the linear portions are arranged, and the connection portion is arranged in a region that does not overlap with the direction in which the linear portions in the inspection region are arranged. Electro-optical device is provided, it is possible to solve the problems described above.
That is, the connection portion in the inspection pattern for verifying the connection failure between each wiring pattern and the display signal output terminal of the mounting component such as a semiconductor element is a linear portion used for inspection of the formation state of the wiring pattern. By providing it in a region that does not overlap with the direction in which the electrodes are arranged, it is possible to prevent an erroneous determination of a short circuit from occurring due to the inspection pattern when the formation state is inspected. Therefore, it is possible to efficiently provide an electro-optical device that can accurately inspect the formation state of the wiring pattern and inspect the connection failure of the mounted components.
The vicinity of the driver mounting area means a peripheral area of the driver mounting area.

In configuring the electro-optical device of the present invention, it is preferable that linear portions of a plurality of wiring patterns are arranged at equal intervals in the inspection region.
By configuring in this way, for example, it is possible to inspect the formation state of a plurality of wiring patterns at the same time by using a plurality of probes having a plurality of inspection pins, thereby improving the inspection efficiency.

In configuring the electro-optical device of the present invention, the two wiring portions of the inspection pattern are assumed to be linear portions when it is assumed that the linear portions of the plurality of wiring patterns are continuously arranged. It is preferable that they are arranged corresponding to the positions.
By configuring in this way, for example, when inspecting the formation state of the wiring pattern using the probe, the end of the inspection region can be inspected without tilting, and the inspection accuracy is improved. Can do.

In configuring the electro-optical device of the present invention, it is preferable that the mounting component is a semiconductor element and the connection portion is disposed in the mounting region of the semiconductor element.
With this configuration, the inspection pattern can be formed using the space in the semiconductor element mounting region, and the electro-optical device can be prevented from being enlarged.

In configuring the electro-optical device of the present invention, the formation state inspection is preferably an inspection performed using a plurality of probes each having a plurality of pins arranged at equal intervals.
With such a configuration, even when the formation state of a plurality of wiring patterns is inspected at the same time, the inspection can be efficiently performed without causing a false determination of a short circuit.

Further, when configuring the electro-optical device of the present invention, the two wiring portions of the inspection pattern are arranged at positions corresponding to the plurality of pins, respectively, of the probe of any one of the plurality of probes. It is preferable.
By configuring in this way, even when the probe is mounted on the inspection pattern, no current flows between different probes, so that an erroneous determination of a short circuit does not occur and the inspection is performed with high accuracy. It can be performed.

Further, in configuring the electro-optical device of the present invention, the two inspection terminals connected to the two wiring portions are inspected by separating one inspection terminal less than the number of probe systems in the formation state inspection. The terminal is preferably used.
By configuring in this way, since probes of different systems are not mounted on the inspection pattern, it is possible to perform the inspection with high accuracy without causing an erroneous determination of a short circuit.

Another electro-optical device of the present invention includes an electro-optical device substrate having a plurality of wiring patterns, and a mounting component having a plurality of display signal output terminals electrically connected to the plurality of wiring patterns. An electro-optical device including an electro-optical material held on the electro-optical device substrate, wherein the mounting component further includes a plurality of inspection terminals, and the electro-optical device substrate includes a mounting region of the mounting component or In order to inspect the formation state of a plurality of wiring patterns in the vicinity thereof, an inspection region in which linear portions of the plurality of wiring patterns are arranged is provided, and the connection between the plurality of wiring patterns and the plurality of display signal output terminals is provided. The wiring pattern further includes a test pattern for verifying a defect, and the test pattern is connected to any two of the plurality of test terminals separated by at least one test terminal. Including two wiring portions extending along the extending direction of the linear portion, and a connecting portion extending in the direction in which the linear portions are connected, to which the two wiring portions are connected, and The inspection pattern is an electro-optical device that is arranged in a region that does not overlap a direction in which the linear portions in the inspection region are arranged.
That is, an inspection pattern for verifying a connection failure between a wiring pattern and a terminal of a mounting component such as a semiconductor element is placed in a region that does not overlap with the direction in which the linear portions used for the inspection of the formation state of the wiring pattern are arranged. By providing, it is possible to prevent an erroneous determination of a short circuit from occurring due to the inspection pattern when the formation state is inspected. Therefore, it is possible to efficiently provide an electro-optical device that can accurately inspect the formation state of the wiring pattern and inspect the connection failure of the mounted components.

Another embodiment of the present invention is an electronic apparatus including any one of the electro-optical devices described above.
That is, since the electro-optical device capable of accurately inspecting the formation state of the wiring pattern and the connection failure of the mounted components is provided, an electronic apparatus with few occurrences of display defects can be provided.

  Hereinafter, embodiments of the electro-optical device of the present invention and an electronic apparatus including the electro-optical device will be described in detail with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
According to a first embodiment of the present invention, an electro-optical device substrate including a plurality of wiring patterns, a mounting component including a plurality of display signal output terminals electrically connected to the plurality of wiring patterns, and an electro-optical device And an electro-optical material held on the device substrate.
In such an electro-optical device, the mounting component further includes a plurality of inspection terminals, and the electro-optical device substrate has a plurality of components for inspecting the formation state of the plurality of wiring patterns in or near the mounting region of the mounting component. And a test pattern for verifying a connection failure between a plurality of wiring patterns and a plurality of display signal output terminals. Two wiring portions extending along the extending direction of the linear portion of the wiring pattern, each connected to any two of the plurality of inspection terminals separated by at least one inspection terminal; and A wiring portion extending in a direction in which the linear portions are arranged, and in which the wiring portion does not overlap with a direction in which the linear portions in the inspection region are arranged. Characterized in that it is disposed.

Hereinafter, the electro-optical device according to the first embodiment of the present invention is provided with a TFD element (Thin Film Diode) as a switching element and a driving driver IC as a mounting component with reference to FIGS. A liquid crystal device including the formed element substrate and a color filter substrate as a counter substrate will be described as an example. In the driving driver IC as a mounting component, output bumps correspond to display signal output terminals, and inspection bumps correspond to inspection terminals.
In addition, what attached | subjected the same code | symbol in each figure has shown the same member, and while abbreviate | omitting description suitably, the one part member is abbreviate | omitted suitably in each figure.

1. Basic Structure First, with reference to FIGS. 1 and 2, the basic structure of the liquid crystal device 10 according to the first embodiment of the present invention, that is, the cell structure, wiring, and the like will be described in detail. Here, FIG. 1 is a schematic perspective view of the liquid crystal device 10 according to the present embodiment, and FIG. 2 is a schematic cross-sectional view of the EE cross section in FIG. 1 and 2, the lower surface is an image display surface, and the image can be viewed from the direction of the arrow W.

The liquid crystal device 10 is a liquid crystal device 10 including an element substrate 60 having an active matrix structure using a TFD element 69 which is a two-terminal nonlinear element as a switching element, and is not shown, but is not shown in the figure. A lighting device such as a light or a case body is appropriately attached and used as necessary.
In the liquid crystal device 10, an element substrate 60 having a glass substrate or the like as a base 61 and a color filter substrate 30 having a glass substrate or the like as a base 31 are disposed opposite to each other and a sealing material 23 such as an adhesive is provided. Are pasted together. Further, after the liquid crystal material 21 is injected into the space formed by the element substrate 60 and the color filter substrate 30 through the opening 23 a into the inner portion of the sealing material 23, the sealing material 25 A sealed cell structure is provided. That is, the liquid crystal material 21 is filled between the element substrate 60 and the color filter substrate 30.

  A plurality of scanning electrodes 33 arranged in stripes are formed on the inner surface of the base 31 of the color filter substrate 30, that is, on the surface facing the element substrate 60. On the other hand, a plurality of pixel electrodes 63 arranged in a matrix are formed on the inner surface of the base 61 of the element substrate 60, that is, on the surface facing the color filter substrate 30. The pixel electrode 63 is electrically connected to the data line 65 via a TFD element 69 as a switching element, and the other scanning electrode 33 is connected via a sealing material 23 containing conductive particles. It is electrically connected to the lead wiring 66 on the element substrate 60. The pixel electrode 63 and the scanning electrode 33 configured in this way constitute a large number of pixels (hereinafter sometimes referred to as a pixel region) in which the intersecting regions of the scanning electrodes 33 are arranged in a matrix, and the array of the large number of pixels is As a whole, the display area A is configured.

The element substrate 60 has a substrate overhanging portion 60T that projects outward from the outer shape of the color filter substrate 30, and a part of the data line 65 and the routing wiring 66 are formed on the substrate overhanging portion 60T. And an external connection terminal 67 made up of a plurality of wirings formed independently. A driver IC 91 incorporating a liquid crystal driving circuit or the like is mounted at the end of the data line 65 or the routing wiring 66. Further, the driver IC 91 is electrically connected to one end of the external connection terminal 67, and the other end of the external connection terminal 67 is electrically connected to the flexible circuit board 93 and the like. Yes.
In the liquid crystal device 10 configured as described above, a driving signal from the driver IC 91 is output to the pixel electrode 33 via the data line 65 and the TFD element 69, and the scanning signal is scanned via the lead wiring 66. Output to the electrode 33. Since an electric field is generated in the liquid crystal material 21 of the pixel to which the voltage is applied, light can be passed through or not allowed to pass through the liquid crystal material 21 in the pixel. Can be displayed.

2. Color Filter Substrate Further, the color filter substrate 30 shown in FIG. 2 basically has a light shielding film 39, a colored layer 37, a transparent resin layer 40, a scanning electrode 33, a substrate 31 made of a glass substrate, and the like. Are sequentially stacked. Further, an alignment film 45 for controlling the orientation of the liquid crystal material is provided on the scan electrode 33, and a clear image display is recognized on the surface opposite to the surface on which the scan electrode 33 and the like are formed. A retardation plate (¼ wavelength plate) 47 and a polarizing plate 49 are arranged so as to be able to do so.
When the color filter substrate is a substrate used for a transflective or reflective liquid crystal device, for example, aluminum patterned in a predetermined shape under the light shielding film 39 on the color filter substrate 30. A light reflecting film made of a film or the like is formed.

  The light shielding film 39 is a film for preventing image color mixing between adjacent pixel regions and obtaining an image display with excellent contrast. As such a light shielding film 39, for example, a metal film such as chromium (Cr) or molybdenum (Mo) is used as the light shielding film 39, or R (red), G (green), and B (blue). A material in which three colorants are dispersed in a resin or other base material, or a material in which a colorant such as a black pigment or dye is dispersed in a resin or other base material can be used. Further, the light shielding film can be formed by superposing three colorants of R (red), G (green), and B (blue).

In addition, the colored layer 37 usually has a predetermined color tone by adjusting the concentration by dispersing a colorant such as a pigment or a dye in a transparent resin. An example of the color tone of the colored layer 37 is a primary color filter composed of a combination of three colors R (red), G (green), and B (blue), but is not limited to this. It can be formed in a complementary color system such as yellow), M (magenta), C (cyan), and other various color tones.
As the arrangement pattern of the colored layer 37, a stripe arrangement is often adopted. In addition to the stripe arrangement, various pattern shapes such as an oblique mosaic arrangement and a delta arrangement can be adopted.

A transparent resin layer 40 made of a photosensitive resin material such as an acrylic resin or an epoxy resin is formed on the colored layer 37, and ITO (indium tin oxide) or the like is formed on the transparent resin layer 40. A scanning electrode 33 made of a transparent conductor is formed. Such a scanning electrode is formed in a stripe shape in which a plurality of transparent electrodes are arranged in parallel for each pixel column composed of pixels arranged in one direction.
An alignment film 45 made of polyimide resin or the like is formed on the entire surface of the scan electrode 33. Such an alignment film is a member for controlling the alignment of the liquid crystal material by performing a rubbing process or the like.

3. Element Substrate (1) Basic Configuration Further, the element substrate 60 shown in FIG. 2 basically includes a base 61 made of a glass substrate or the like, a pixel electrode 63, a data line 65, a lead wiring (not shown), and the like. And a TFD element 69 as a switching element. An alignment film 75 made of polyimide resin or the like is formed on the pixel electrode 63. Further, a retardation plate (¼ wavelength plate) 77 and a polarizing plate 79 are disposed on the outer surface of the base 61. A driver IC 91 is mounted on the substrate overhanging portion 60T of the element substrate 60 so as to be electrically connected to the data line 65 and the lead wiring (not shown).

FIG. 3 shows a schematic plan view of the element substrate 60 viewed from the direction perpendicular to the substrate surface. In FIG. 3, an alignment film, a polarizing plate, and the like are omitted.
In the element substrate 60, the data line 65 is composed of a plurality of wirings arranged in a stripe pattern, and the pixel electrodes 63 are arranged in a matrix between the data lines 65. The pixel electrode 63 is electrically connected to the data line 65 via a TFD element 69 described later. The data line 65 is electrically connected at one end to the driver IC 91 mounted on the substrate overhanging portion 60T so that a driving signal from the driver IC 91 can be output to the pixel electrode 33. It is configured.
Since the data line 65 is formed simultaneously with the formation of a TFD type element described later from the viewpoint of simplifying the manufacturing process, for example, a tantalum layer, a tantalum oxide layer, and a chromium layer are sequentially formed. . The pixel electrode 63 is formed using a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide).

In addition, the TFD element 69 that electrically connects the data line 65 and the pixel electrode 63 generally includes an element first electrode made of a tantalum (Ta) alloy, an insulating film made of tantalum oxide (Ta ₂ O ₅ ), And an element second electrode made of chromium (Cr) is sequentially stacked. The active element exhibits diode switching characteristics in positive and negative directions and becomes conductive when a voltage equal to or higher than a threshold is applied between both terminals of the element first electrode and the element second electrode.
The two TFD elements are formed between the data line 65 and the pixel electrode 63, and are composed of a first TFD element and a second TFD element having opposite diode characteristics. It is preferable.
The reason for this is that with this configuration, a positive / negative symmetrical pulse waveform can be used as the voltage waveform to be applied, and deterioration of the liquid crystal material in the liquid crystal device or the like can be prevented. That is, in order to prevent deterioration of the liquid crystal material, it is desirable that the diode switching characteristics be symmetric in the positive and negative directions. By connecting two TFD elements in series in opposite directions, a positive and negative symmetric pulse waveform can be obtained. This is because it can be used.

The lead wiring 66 is formed along two sides extending in a direction perpendicular to the side where the driver mounting region 26 exists. The lead wiring 66 is electrically connected at one end side to each scanning electrode of the opposing color filter substrate via conductive particles contained in the sealing material. The other end is electrically connected to the driver IC 91 and is configured to output a scanning signal from the driver IC 91 to the scanning electrode.
The routing wiring 66 may be formed using a metal material such as a tantalum layer, a tantalum oxide layer, and a chromium layer, or a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide). it can.

(2) Substrate overhang portion (2) -1 Wiring pattern Next, an enlarged plan view of the driver mounting area in the substrate overhang portion of the element substrate is shown in FIG. 4A, and XX in FIG. A cross-sectional view of the cross section viewed in the direction of the arrow is shown in FIG.
In the substrate extension 60T, the data line 65 as the wiring pattern 18 and the lead wiring 66 that is conducted to the color filter substrate side are formed, and a display signal terminal is provided at the end of the data line 65 and the like. 14 is formed. The driver IC 91 is provided with a plurality of output bumps 16 and is electrically connected to the display signal terminals 14 on the substrate extension 60T, so that the driver IC 91 is mounted.
The display signal terminal 14 has a height of, for example, 0.3 μm, and is, for example, a metal material such as silver or aluminum, or a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide). It can consist of

(2) -2 Inspection Area In the driver mounting area 26 or in the vicinity of the driver mounting area 26, there is a formation defect such as a short circuit or disconnection of the data line 65 or the lead wiring line 66 in the manufacturing stage of the element substrate 60. An inspection region 19 used for inspection for verifying the presence or absence is provided. In the inspection area 19, the linear portions of the data lines 65 and the lead wirings 66 are arranged, and the inspection is performed while contacting the linear portions with, for example, a probe having a plurality of inspection pins.

Here, the probe inspection is, for example, as shown in FIG. 5, a plurality of data lines arranged as wiring patterns 18 in the inspection region 19 and a plurality of pitches arranged at twice the pitch interval of the linear portions of the lead wiring. Using two different types of probes 22 having inspection pins 24, each probe 22 is brought into contact with the wiring pattern 18 every other line and a current is supplied from these probes 22.
When the wiring pattern is normally formed without causing defective formation such as disconnection or short-circuit, all the pixels supplied with current are turned on, for example, white display is performed in the display area. On the other hand, when a disconnection has occurred in the wiring pattern, no current is supplied to the pixel to which the wiring having the disconnection is connected, so that it is visually recognized as a line defect or a point defect. In addition, when a short circuit has occurred in the data line or the lead wiring, a current flows between the two probes 22, and therefore the occurrence of the short circuit can be detected.

  When performing such probe inspection, there is a limit to narrowing the interval between a plurality of inspection pins due to the structure of the probe used for such inspection, and therefore, linear portions arranged at predetermined intervals in the wiring pattern It is necessary to provide a region in which is formed. Therefore, in each data line 65 and the routing wiring 66, the linear portions 11 having a length of about 0.5 to 1.0 mm are arranged at a pitch interval of about 25 μm, for example.

For example, FIG. 4A shows an example in which the inspection area 19 in which the linear portions of the wiring pattern 18 are arranged is secured between the driver mounting area 26 and the color filter substrate 30 in the vicinity of the driver mounting area 26. Show. That is, the wiring pattern 18 as a data line or a lead-out wiring extends straight from the driver mounting area 26 toward the display area side, and inclines in an oblique direction near the color filter substrate 30 so that each wiring pattern 18 It extends to the position. Therefore, in the region between the driver mounting region 26 and the color filter substrate 30, the linear portions having a predetermined length in each wiring pattern 18 are arranged at a pitch interval of about 20 μm. A probe inspection for the wiring pattern 18 can be performed.
The vicinity of the driver mounting area means a peripheral area of the driver mounting area.

FIG. 6 shows an example in which the inspection area 19 in which the linear portions of the wiring pattern 18 are arranged is provided in the driver mounting area 26. That is, the wiring pattern 18 as a data line or a lead wiring extends beyond the connection portion with the driver IC 91 and further to the lower area of the driver IC 91, and is a straight line arranged in the lower area at a predetermined pitch interval. In this example, the inspection area 19 is formed by forming a shape portion.
In general, it is sufficient that the data line and the lead wiring are connected at the connection portion with the output terminal of the driver IC, and it is not necessary to form the data line and the lead wiring down to the lower region of the driver mounting region. However, with this configuration, it is possible to secure an inspection area using the driver mounting area, and directly from the connection position with the driver IC toward the arrangement position of each pixel and the left and right sides. It can be wired. Therefore, it is possible to prevent the area of the substrate overhanging portion from increasing. In addition, wiring patterns such as data lines are arranged at a pitch interval of, for example, 20 μm or more, and the outer shape of the driver IC is 1 mm or more even on a short side. A sufficient length and pitch interval between the straight portions can be secured.

(3) Test Pattern In addition, the liquid crystal device according to the present embodiment includes a plurality of output bumps 16 of the driver IC 91 in the driver mounting area 26 or in the vicinity of the driver mounting area 26, as shown in FIGS. In addition, a test pattern 11 for verifying a connection failure with a plurality of display signal terminals 14 formed at the end of a wiring pattern 18 such as a data line is provided. The inspection pattern 11 is an extension of the linear portion of the wiring pattern 18 connected to any two of the plurality of inspection bumps 17 provided on the driver IC 91 with at least one inspection bump therebetween. This is a conductive pattern including two wiring portions 12 extending along the existing direction and a connection portion 13 extending in the direction in which the linear portions are arranged, to which the wiring portions 12 are connected. Even when the driver IC 91 is mounted with being shifted with respect to the plurality of display signal terminals 14 or when the driver IC 91 is mounted properly, the driver ICs are subject to vibration or deterioration of the terminal portion over time. When the connection failure occurs due to the floating of the IC 91, the connection failure can be detected and a signal can be generated.
The inspection pattern does not need to increase the number of processes, and can be formed with the same thickness as the wiring pattern such as a data line. Therefore, the inspection pattern may be formed of the same constituent material as the wiring pattern. preferable.

  Here, in the liquid crystal device of the present embodiment, as shown in FIG. 4 and FIG. 6, the connection portion 13 of the inspection pattern 11 has the above-described data lines and lines in the inspection area 19 for probe inspection. It is characterized in that it is arranged in a region that does not overlap with the direction in which the linear portions of the wiring pattern 18 such as rotating wirings are arranged. That is, when performing the probe inspection, when the probe rides on the inspection pattern, an erroneous determination such as a short circuit is prevented from occurring through the connection portion.

  More specifically, in general, in a liquid crystal device having a TFD element such as the liquid crystal device of the present embodiment or a passive matrix liquid crystal device not having a switching element, the liquid crystal device is formed on a substrate extension portion. In the wiring pattern other than the terminal portion connected to the mounting component such as the driver IC, the insulating film is not provided, and the wiring pattern is exposed on the substrate surface. Therefore, as shown in FIGS. 7A to 7B, the connection portion 13 ′ of the inspection pattern 11 ′ is arranged in a region overlapping the direction in which the linear portions of the wiring pattern 18 are arranged in the inspection region 19. If so, the probes 22 of different systems come into contact with the connection portions 13 of the test pattern 11, and current flows between the probes 22 via the connection portions 13. As a result, in the probe inspection, it is impossible to determine which of the wiring patterns is short-circuited. Consequently, the substrate must be determined as a defective product.

On the other hand, as shown in FIGS. 4 and 6, if the connection portion 13 of the inspection pattern 11 is arranged in a region that does not overlap the direction in which the linear portions of the wiring pattern 18 in the inspection region 19 are arranged, Since probes of different systems do not come into contact with the connection part 13 of the test pattern 11 respectively, it is possible to eliminate an erroneous determination of a short and improve the test accuracy.
However, it goes without saying that the present invention can be applied not only to an active matrix liquid crystal device and a passive matrix liquid crystal device including a TFD element, but also to a liquid crystal device including a TFT element.

For example, in the example of FIG. 4A described above, the data line 65 and the wiring pattern 18 as the lead wiring 66 are formed toward the long side of the driver IC 91, and the driver IC 91 and the color filter are formed. An inspection region 19 in which the linear portions of the wiring pattern 18 are arranged at a predetermined pitch interval is provided in a region between the substrate 30. In addition, an inspection pattern 11 is provided adjacent thereto, and the connection portion 13 in the inspection pattern 11 is arranged in a region that does not overlap with the direction in which the linear portions of the wiring pattern 18 in the inspection region 19 are arranged. ing. Therefore, when a probe inspection is performed in the inspection region 19, even when the probe is mounted on the inspection pattern 11, no current flows between probes of different systems via the inspection pattern 11.
Further, in the example of FIG. 6 described above, the wiring pattern 18 as the data line 65 and the routing wiring 66 is formed toward the long side of the driver IC 91, and the wiring pattern extends to the lower region of the driver IC 91. 18 is provided, and an inspection region 19 in which linear portions are arranged at a predetermined pitch interval is provided. In addition, an inspection pattern 11 is provided adjacent thereto, and the connection portion 13 in the inspection pattern 11 is disposed in a region that does not overlap the direction in which the linear portions of the inspection region 19 are arranged. Therefore, when a probe inspection is performed in the inspection region 19, even if the probe rides on the inspection pattern 11, no current flows between probes of different systems via the inspection pattern.

However, when the probe inspection is performed, if the probe is tilted, the inspection may not be performed accurately. Therefore, as shown in FIGS. 4A and 6, there are continuous linear portions in the inspection region 15. It is preferable that they are arranged so as to coincide with the assumed position of the wiring in the case where it is assumed.
More specifically, when the inspection pattern is not arranged in this way, when inspecting the data line and the lead wiring near the end of the inspection region in the probe inspection, FIG. As shown, there is a case where the probe 22 is tilted and the contact between a part of the inspection pins 24 and the linear portion of the wiring pattern 18 becomes insufficient, so that the probe inspection cannot be performed accurately.
On the other hand, when the test pattern is arranged at a predetermined position, as shown in FIG. 8B, the test pin 24 on the wiring portion 12 side of the test pattern 11 also comes into contact with the test pattern 11 and the probe It is possible to prevent the probe 22 from being tilted and perform the probe inspection accurately. Even in such a case, since the connection portion of the inspection pattern is at a predetermined position, a current does not flow between the plurality of inspection pins via the inspection pattern, thereby preventing erroneous determination.

Note that the two wiring portions 12 in the inspection pattern 11 shown in FIG. 4A and FIG. 6 are separated from the inspection terminal 15 at the end of the plurality of inspection terminals 15 by one inspection terminal. It is connected to the two wiring parts 12 connected to the first inspection terminal 15.
However, the inspection terminals to which the wiring portions of the inspection pattern are connected are not limited to the first and third combinations from the end. For example, when performing probe inspection, if three different systems of probes are used for data lines corresponding to RGB, as shown in FIG. 9, two wiring portions of the inspection pattern 11 are used. 12 is required to be connected to the terminal 15 for inspection at the end of the plurality of terminals 15 for inspection and the two wiring portions connected to the fourth terminal 15 for inspection separating the two terminals for inspection. is there.
In other words, in order to further reduce the area where the inspection terminal on the mounted component and the inspection pattern on the board are provided, the two inspection terminals to which the two wiring portions are connected are the number of probe systems used for the probe inspection. It is preferable that the inspection terminals have a smaller number of inspection terminals.

4). Modification Example Up to this point, an example in which a driver IC for driving is used as a mounting component has been described. However, an example in which a flexible circuit board is mounted as another mounting component will be described. In the following description, the configuration around the mounting region in the substrate overhanging portion of the element substrate will be mainly described, and the other configurations can be the same as those described above. The description of is omitted.

FIG. 10A shows an enlarged plan view of the substrate overhanging portion 60T of the element substrate constituting the liquid crystal device, and FIG. 10B shows a cross section of the XX cross section in FIG. The figure is shown.
As shown in FIGS. 10A to 10B, the data line 65 and the wiring pattern 18 as the lead wiring 66 are formed on the substrate extension 60T in the element substrate. Further, an inspection region 19 in which linear portions of the wiring pattern 18 are arranged is formed in the vicinity of the connection location of the flexible circuit board 93. Furthermore, these wiring patterns 18 are formed with wiring terminals 97A connected to the wiring patterns 97 on the flexible circuit board 93 at the end portions 18A.

Here, an inspection pattern 11 for verifying a connection failure of the flexible circuit board 93 is formed adjacent to the inspection region 19 in which the linear portions of the wiring pattern 18 are arranged. Such a test pattern 11 is connected to any two of the plurality of test wiring terminals 98A formed on the flexible circuit board 93 with at least one test wiring terminal therebetween. It is comprised from the two wiring parts 12 extended along the extension direction of a linear part, and the connection part 13 extended in the direction where the linear part is arranged by which these wiring parts 12 are connected. And this connection part 13 is arrange | positioned in the area | region which does not overlap with the direction which the linear part of the wiring pattern 18 in the test | inspection area | region 19 arranges.
That is, when inspecting the formation failure of the wiring pattern, the inspection pattern for verifying the connection failure between the display signal terminal in the wiring pattern on the substrate and the wiring terminal in the flexible circuit board as the mounting component is short-circuited. It is possible to prevent an erroneous determination. Therefore, since each inspection can be performed with high accuracy, a liquid crystal device with excellent display quality can be provided.
Note that the shape and the like of the test pattern other than those described here can be the same as those described above.

5). Manufacturing Method Hereinafter, an example of a manufacturing method of the liquid crystal device of the first embodiment will be described with reference to the drawings as appropriate.
(1) Manufacturing process of color filter substrate First, a light shielding film is formed on a glass substrate as a base material of a color filter substrate so as to correspond to each inter-pixel region. For example, when the light shielding film is formed using a metal film, a metal material such as chromium (Cr) is laminated on the glass substrate by a vapor deposition method or the like, and then etched according to a predetermined pattern. Can be formed.
Such a light-shielding film is obtained by dispersing three colorants of R (red), G (green), and B (blue) in a resin or other base material, or coloring a black pigment or dye. It can also be formed using a material in which a material is dispersed in a resin or other base material. In that case, it can form simultaneously in the formation process of the following colored layer.

Next, a colored layer of at least one of R, G, and B is formed on each pixel. Specifically, first, a coloring material obtained by mixing a pigment in a photosensitive resin material is uniformly applied on a substrate using a coating device such as a spin coater, and a resin layer containing the coloring material is formed. Form. At this time, for example, when a spin coater is used, a resin layer having a thickness of 1 to 10 μm can be formed at a rotation speed of 600 to 2,000 rpm and a coating time of 5 to 20 seconds.
Here, the type of the photosensitive resin material constituting the resin layer containing the colorant is not particularly limited. For example, acrylic resin, epoxy resin, silicone resin, phenol resin, oxetane resin Or a combination of two or more.
Next, after exposure through a photomask having a pattern of a predetermined shape, development is performed using a developer, thereby forming a colored layer patterned corresponding to a predetermined pixel.
By repeating such exposure and development processing for each color, a colored layer exhibiting R, G, and B color tones can be formed.

Next, after applying a transparent photosensitive resin material on the substrate, exposure and development are performed to form a transparent resin layer. As a resin material used for forming such a transparent resin layer, for example, a known material such as an acrylic resin or an epoxy resin can be used.
Next, after forming a transparent conductive layer made of a transparent conductive material such as ITO (indium tin oxide) on the entire surface of the transparent resin layer by, for example, a sputtering method, patterning is performed using a photolithography method, and The electrode 33 having the pattern shape is formed. For example, the color filter substrate to be manufactured is a color filter substrate used in an active matrix liquid crystal device including a TFD element (Thin Film Diode) such as the liquid crystal device of the present embodiment, or a passive matrix liquid crystal device. In some cases, a plurality of transparent electrodes are patterned in parallel stripes. When the color filter substrate to be manufactured is a color filter substrate used for an active matrix type liquid crystal device including a TFD element (Thin Film Diode) like the liquid crystal device of the present embodiment, the entire display area It becomes the planar electrode formed in.
Next, a color filter substrate can be manufactured by forming an alignment film made of polyimide resin or the like for each cell region on the substrate on which the transparent electrode 33 is formed.

(2) Element substrate manufacturing process First, an element substrate is formed with an element first electrode on a base made of a glass substrate. This element 1st electrode is comprised from the tantalum alloy, for example, and can be formed using sputtering method or an electron beam vapor deposition method. At this time, the adhesion of the element first electrode to the second glass substrate can be remarkably improved before the element first electrode is formed, and impurities can be diffused from the second glass substrate to the element first electrode. It is also preferable to form an insulating film made of tantalum oxide (Ta ₂ O ₅ ) or the like on the substrate because it can be efficiently suppressed.

Next, an oxide film is formed by oxidizing the surface of the element first electrode by an anodic oxidation method. More specifically, after immersing the substrate on which the element first electrode is formed in an electrolytic solution such as a citric acid solution, a predetermined voltage is applied between the electrolytic solution and the element first electrode, The surface of the element first electrode can be oxidized.
Next, again, a metal film such as chromium is formed on the entire surface of the substrate including the element first electrode by sputtering or the like, and is patterned by photolithography to form the element second electrode. , A TFD element.
In the step of forming the element second electrode, data lines, lead wirings, and inspection patterns are formed by patterning in accordance with a predetermined pattern at the same time. At this time, the data line and the routing are included so as to include a linear portion used as an inspection area for verifying the formation state of the formed data line and the routing wiring in an area corresponding to the driver mounting area or in the vicinity thereof. Form wiring. Further, an inspection pattern composed of a predetermined wiring portion and a connecting portion is formed so that the connecting portion is arranged in an area that does not overlap with the direction in which the data lines and the linear portions of the lead wiring are arranged.

  Next, after forming a transparent conductive layer made of a transparent conductive material such as ITO (indium tin oxide or the like) by sputtering or the like, patterning using a photolithography method is performed to electrically connect the TFD element. Connected pixel electrodes are formed.

  Next, the element substrate can be manufactured by forming an alignment film 75 made of polyimide resin or the like on the element substrate on which the pixel electrode or the like is formed.

(3) Bonding Step Next, in either one of the color filter substrate and the element substrate, a sealing material is laminated so as to surround the display region, and then the other substrate is overlapped and thermocompression bonded, whereby the color filter substrate and The element substrate is bonded to form a cell structure.

(4) Inspection Step Next, as shown in FIG. 5, the data lines and the routing in the inspection area 19 are applied to the liquid crystal panel before the driver IC is mounted after the color filter substrate and the element substrate are bonded together. The probe 22 is brought into contact with the linear portion of the wiring pattern 18 as wiring, and the formation state of the plurality of wiring patterns 18 is verified. That is, two different systems of probes 22 each having a plurality of inspection pins 24 are brought into contact with the linear portions of the wiring pattern 18 in the inspection region every other probe 22 and then a current is passed. At this time, when a formation defect such as a short circuit occurs in the formed wiring pattern 18, a current flows between the probes 22 of different systems, so that a defective product can be found and extracted. In addition, when the wiring pattern 18 is disconnected, it can be visually recognized as a display defect in the display area, so that it can be determined as a defective product.
At this time, in the manufacturing method of the liquid crystal device according to the present embodiment, the connection portion in the inspection pattern for verifying the connection failure of the mounted component is arranged by the data line in the inspection region and the linear portion of the lead wiring. Since it is arranged so as not to overlap with the direction, it is possible to prevent a short circuit caused by the inspection pattern and perform an accurate probe inspection. Therefore, it is possible to prevent erroneous determination as a defective product even though no short circuit or disconnection occurs in the data line or the lead wiring.

(5) Assembly process etc. Next, after injecting a liquid crystal material from the injection port provided in a part of sealing material in the cell of the liquid crystal panel which was not determined to be inferior goods, it seals with a sealing material etc.
Further, the output bumps of the driver IC are mounted on the terminal portions formed in the driver mounting area on the element substrate using a solder material or the like. At this time, if a mounting deviation occurs, a signal is generated via the inspection pattern, and the mounting deviation can be detected.
Thereafter, in the liquid crystal panel in which a wiring pattern formation failure and a driver IC mounting failure were not detected, a phase difference plate (1 / 4λ plate) and a polarizing plate were disposed on the outer surfaces of the color filter substrate and the element substrate, respectively. A liquid crystal device can be manufactured by incorporating it in a housing together with a backlight or the like.

[Second Embodiment]
The second embodiment is a liquid crystal device similar to the first embodiment, in which an inspection pattern composed of a predetermined wiring portion and a connection portion is linear in an inspection region for inspecting the formation state of the wiring pattern. The liquid crystal device is characterized in that the liquid crystal device is disposed in a region that does not overlap with a direction in which the portions are arranged.
The following description will focus on the differences from the first embodiment, and description of the points that can have the same configuration as the other first embodiments will be omitted.

FIG. 11 is an enlarged plan view of the substrate overhanging portion 60T of the element substrate constituting the liquid crystal device of the present embodiment.
As shown in FIG. 11, in the liquid crystal device of this embodiment, the linear portions of the plurality of wiring patterns 18 are arranged in the mounting area of the driver IC 91 or in the vicinity thereof in order to inspect the formation state of the plurality of wiring patterns 18. And an inspection pattern 11 for verifying a connection failure between the plurality of wiring patterns 18 and the plurality of output bumps 16.
The inspection pattern 11 is a linear portion of the wiring pattern 18 connected to any two of the plurality of inspection bumps 17 provided on the driver IC 91 with at least one inspection bump therebetween. The inspection pattern 11 includes two wiring portions 12 extending along the extending direction and a connection portion 13 extending in the direction in which the linear portions are connected to which the two wiring portions 12 are connected. Are arranged in a region that does not overlap the direction in which the linear portions in the inspection region 19 are arranged.

  Thus, the inspection area 19 in which the linear portions of the wiring pattern 18 as the data line 65 and the routing wiring 66 are arranged is provided in the area between the driver IC 91 and the color filter substrate 30, while On the other hand, by disposing the inspection pattern 11 in the lower region of the driver IC 91 on the opposite side of the display signal terminal 14, the connection failure of the mounted component is verified when the wiring pattern is inspected. Therefore, the inspection pattern can be accurately inspected without causing a short circuit.

[Third Embodiment]
As a third embodiment according to the present invention, an electronic apparatus including the liquid crystal device according to the first embodiment will be specifically described.

FIG. 12 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. The electronic apparatus includes a liquid crystal panel 20 provided in the liquid crystal device and a control unit 200 for controlling the liquid crystal panel 20. In FIG. 12, the liquid crystal panel 20 is conceptually divided into a panel structure 20a and a drive circuit 20b composed of a semiconductor element (IC) or the like. The control means 200 preferably includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a memory composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., a storage unit composed of a magnetic recording disk, an optical recording disk, etc., and a tuning that outputs a digital image signal in a synchronized manner. It is preferable that the display information is supplied to the display processing circuit 202 in the form of an image signal or the like of a predetermined format based on various clock signals generated by the timing generator 204.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is preferably supplied to the drive circuit 20b together with the clock signal CLK. Furthermore, the drive circuit 20b preferably includes a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
And if it is the electronic device of this embodiment, the connection part in the pattern for a test | inspection for verifying the connection defect of mounting components is a linear part of a wiring pattern in the test | inspection area | region for test | inspecting the formation state of a wiring pattern In order to provide a liquid crystal device formed in a region that does not overlap with the direction in which the electrodes are arranged, it is possible to accurately inspect the mounting component connection failure and the wiring pattern formation failure, respectively, and to make the electronic device with few display defects. Can do.

  According to the present invention, the connection part in the inspection pattern for verifying the connection failure of the mounted component is arranged in the direction in which the linear part of the wiring pattern is arranged in the inspection region for inspecting the formation state of the wiring pattern. By being formed in the non-overlapping region, it is possible to accurately inspect the mounting component connection failure and the wiring pattern formation state, and to provide an electro-optical device with few display failures. Therefore, electro-optical devices such as liquid crystal devices and electronic devices such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct view type video tape recorders, car navigation devices, pagers, electrophoretic devices, Wide range of electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, electronic devices with touch panels, devices with electron-emitting devices (FED: Field Emission Display and SCEED: Surface-Conduction Electron-Emitter Display) Can be applied.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. It is a schematic sectional drawing of the liquid crystal device of 1st Embodiment. It is a top view of the element substrate used for the liquid crystal device of a 1st embodiment. (A)-(b) is the enlarged plan view and sectional drawing of a driver mounting area | region periphery in an element substrate, respectively. It is a figure which shows an example of the test | inspection of the formation state of a wiring pattern. It is a figure which shows the state which provided the test | inspection area | region and the pattern for a test | inspection in the lower area | region of driver IC. (A)-(b) is a figure which shows the state by which the connection part of the pattern for a test | inspection is arrange | positioned in the area | region which overlaps with the direction where the linear part of the test | inspection area | region was arranged. (A)-(b) is a figure provided in order to demonstrate the arrangement position of the wiring part of the pattern for a test | inspection. It is a figure which shows the modification of the pattern for a test | inspection. (A)-(b) is the enlarged plan view and sectional drawing of the connection area | region periphery of a flexible circuit board in an element substrate, respectively. It is an enlarged plan view of the periphery of a driver mounting area in an element substrate used for the liquid crystal device of the second embodiment. It is a block diagram which shows schematic structure of the electronic device of 3rd Embodiment. It is a figure which shows the structure of the electro-optical panel which can perform the conventional electrical property test | inspection. It is a figure which shows the conducting wire for a test | inspection which test | inspects the connection defect of the conventional TAB.

Explanation of symbols

10: liquid crystal device, 11: inspection pattern, 12: wiring portion, 13: connection portion, 14: display signal terminal, 15: inspection terminal, 16: bump, 17: inspection bump, 18: wiring pattern, 19 : Inspection region, 21: Liquid crystal material, 22: Probe, 23: Seal material, 24: Inspection pin, 26: Driver mounting region, 30: Color filter substrate, 31: Glass substrate, 33: Scan electrode, 37: Colored layer, 41: Resin layer, 45: Alignment film, 60: Element substrate, 60T: Substrate overhang, 61: Glass substrate, 63: Pixel electrode, 65: Data line, 66: Lead wiring, 69: TFD element, 75: Alignment film, 91: driver IC, 93: flexible circuit board, 97A: wiring terminal, 98A: wiring terminal for inspection

Claims (7)

An electro-optical device substrate having a plurality of wiring patterns;
A mounting component comprising a semiconductor element having a plurality of display signal output terminals electrically connected to the plurality of wiring patterns;
An electro-optic material held on the electro-optic device substrate;
In an electro-optical device including:
The mounting component further includes a plurality of inspection terminals,
The electro-optical device substrate includes an inspection region in which linear portions of the plurality of wiring patterns are arranged in the mounting region of the mounting component or in the vicinity thereof in order to inspect the formation state of the plurality of wiring patterns. A test pattern for verifying connection failure between the plurality of wiring patterns and the plurality of display signal output terminals,
The inspection pattern extends along the extending direction of the linear portion of the wiring pattern, which is connected to any two of the plurality of inspection terminals with at least one inspection terminal therebetween. Including two wiring portions that are present, and a wiring portion that is connected to the two wiring portions and that extends in a direction in which the linear portions are arranged, and
The wire connection portion is disposed in a region that does not overlap with the direction in which the linear portions in the inspection region are arranged ,
The electro-optical device, wherein the connection portion is disposed in a mounting region of the semiconductor element .   The electro-optical device according to claim 1, wherein linear portions of the plurality of wiring patterns are arranged at equal intervals in the inspection region.   The two wiring portions of the inspection pattern are respectively arranged corresponding to the positions of the assumed linear portions when it is assumed that the linear portions of the plurality of wiring patterns are continuously arranged. The electro-optical device according to claim 1 or 2. Wherein the plurality of tests the state of formation of the wiring pattern, any one of the preceding claims, characterized in that the test carried out using a probe of a plurality of systems having a plurality of pins disposed at equal intervals The electro-optical device according to Item. The two wire portions of the test pattern, in the probe of any one of the lines of said plurality of channels of the probe, to claim 4, characterized in that arranged in corresponding positions to each of the plurality of pins The electro-optical device described. The two inspection terminals to which the two wiring portions are connected are inspection terminals that are separated from the number of inspection terminals by one less than the number of the probe systems in the inspection of the formation state of the plurality of wiring patterns. The electro-optical device according to claim 4 or 5 . An electronic apparatus comprising the electro-optical device according to claim 1 .

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