JP4510419B2 - Stage apparatus, exposure apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to a stage apparatus suitable for use in a highly accurate processing process such as a semiconductor lithography process, and a device manufacturing method using the stage apparatus.

  Conventionally, as an exposure apparatus used for manufacturing a semiconductor device or the like, a substrate such as a wafer or a glass substrate is moved stepwise, and an original pattern such as a reticle or mask is projected on a plurality of exposure areas on the substrate, and a projection optical system is used. A step-and-repeat type exposure apparatus (sometimes referred to as a stepper) that sequentially exposes the light, and a step-and-repeat that repeats exposure transfer to a plurality of regions on the substrate by repeating step movement and scanning exposure. A scanning type exposure apparatus (sometimes referred to as a scanner) is typical. In particular, the step-and-scan type uses only the portion of the projection optical system that is relatively close to the optical axis, limited by the slit, so that it is possible to expose a fine pattern with higher accuracy and wider field of view. It has become.

  These exposure apparatuses have a stage device such as a wafer stage or a reticle stage that moves and positions a wafer or a reticle at high speed, but the wafer stage top plate that holds the wafer and the reticle stage top plate that holds the reticle. The temperature fluctuation causes deterioration of the overlay accuracy of the fine pattern. Factors that cause temperature fluctuations due to heat include thermal expansion of the wafer and reticle itself, thermal expansion between the position measurement mirror and the wafer chuck or reticle chuck, position fluctuation due to the heat of the reference mark on the top plate and the reference plate, etc. Applicable. Also, if the heat transmitted to the top plate is classified from the viewpoint of the path, the heat transmitted through the static pressure guide, the heat transmitted through the linear motor mover, the heat transmitted from the atmosphere space, and the heat from the exposure light Can be classified.

  In order to solve this heat problem, to minimize the influence of heat, use a low thermal expansion material for the components of the stage top, control the ambient temperature of the stage space, and drive the stage. It is common to control the temperature by cooling the heat source itself such as an actuator. As a more effective means, a method of directly providing a cooling means on the chuck on the stage top plate has been proposed (see, for example, Patent Document 1).

On the other hand, as another problem due to heat, there is a problem in that the deflection and fluctuation of each part of the stage apparatus deteriorate the running accuracy of the stage apparatus. For this, the stage surface plate is provided with a heater and cooling means, and the temperature distribution of the stage surface plate is controlled to generate thermal strain on the stage surface plate, thereby canceling the deflection that causes deterioration in running accuracy. (For example, refer to Patent Document 2). In this case, since the heater and the cooling means only cause thermal distortion on the stage surface plate, it is necessary to take the above-mentioned measures separately in order to prevent the temperature rise due to the heat of the stage top plate. is there.
JP-A-57-68835 JP-A-5-203773

  However, in order to prevent the temperature rise due to the heat of the stage top plate, if the above-described method for directly cooling the top plate is used, it is necessary to provide a path or piping for passing a refrigerant or the like through the stage top plate. In addition to complicating the configuration of the stage top plate made of a low thermal expansion ceramic material, such paths and piping have problems such as the piping transmitting vibrations from the outside and the piping itself vibrating. This causes an increase in the cost of the apparatus and a deterioration in accuracy.

  An object of the present invention is to provide a stage apparatus that can effectively prevent a temperature rise of a stage top plate with an economical configuration or without causing deterioration in accuracy in view of the problems of the conventional technology. There is.

In order to achieve the above object, a stage apparatus of the present invention supports a structure, a top plate that holds and moves an object , a mover including a magnet fixed to the top plate, a coil, and the coil. Drive means for driving the top plate with a stator provided on the structure including a member, and a guide surface provided on the structure separately from the stator for guiding the top plate in the movement direction a guide unit including a chromatic and material containing iron, and bearing means for supporting said top plate in a non-contact with the guide surface provided on the top plate, the top is provided on the top plate A magnet for generating an attractive force between a plate and the guide part, a temperature sensor for detecting the temperature of the guide part provided in the guide part, and a cooling path for flowing a coolant for cooling the guide part In the detection result of the temperature sensor Zui and characterized by comprising a temperature adjusting means for reducing the temperature fluctuations of the top plate by adjusting the temperature of the guide portion constant by controlling the temperature of the refrigerant.

Here, examples of the stage apparatus include a reticle scan stage in a step-and-scan type exposure apparatus and a wafer stage in a step-and-repeat type exposure apparatus. As the object, for example, a substrate such as a wafer or a glass substrate, or an original plate such as a reticle or a mask is applicable. As the stage device, for example, a device for positioning a substrate or an original plate in a semiconductor exposure apparatus is applicable. Examples of the movable portion include a stage top plate on which an original plate and a substrate are mounted, a reticle stage on which a reticle is mounted, and a wafer stage on which a wafer is mounted. The term “stage” may mean a stage device, or may mean a top plate portion or a movable portion of the stage device. As the bearing means, for example, a hydrostatic bearing such as an air bearing or an electromagnetic guide using an electromagnetic force such as a magnetic bearing is applicable.

The temperature adjusting means, for example, and performs temperature adjustment by cooling the guide portion, the flow path and the temperature sensor through the refrigerant provided in the guide section, and controls the temperature of the refrigerant on the basis of a detection signal from the temperature sensor A temperature control unit that controls the temperature of the refrigerant based on the output of the heat pipe and the temperature sensor provided in the guide unit , the flow path for passing the refrigerant connected to the heat pipe, and the temperature sensor goods and, and intended to separate temperature adjusting a plurality of different portions of the guide section, which separately temperature adjusted each portion of different guide portion in accordance with the driving pattern of the moving part and the temperature sensor provided in the movable portion And a device that adjusts the temperature based on the detection signal. An example of the guide portion is a surface plate .

Further, the exposure apparatus of the present invention comprises a linear motor for moving the movable portion of the linear motor stator on the structure supporting the guide portion, or provided on the guide portion, of the original or a substrate in an exposure apparatus The stage apparatus used for positioning is included .

In this configuration, the positioning accuracy and processing accuracy of the target object deteriorate due to the influence of heat transmitted from various heat sources to the movable part and the target object during the positioning operation of the target object by the stage device and the processing such as exposure. There is a fear. Therefore, we are necessary to control the temperature of the movable part, conventionally, because it was provided with a cooling means to the movable part, or transmitted as well as complicating the configuration of the movable portion, piping for refrigerant with or Vibration As a result, there is a problem that the positioning accuracy and processing accuracy are deteriorated. In contrast, according to the present invention, since the provided temperature adjusting means for adjusting the temperature of the guide portion to control the temperature of the movable part, there is no need to provide the temperature adjusting means to the movable part, conventional problems Will be resolved.

As heat transmitted to the movable part , there are heat transmitted from the guide part to the movable part via the bearing means and heat transmitted to the movable part via other paths. By adjusting the temperature of the movable portion, the heat to be transmitted to the movable part via a bearing means are eliminated in advance in the guide portion, the heat transmitted to the movable portion from the other path, through the bearing means guide It is absorbed into the department side. In other words, by adjusting the temperature of the surface plate , the flow of heat through the air gap of the air bearing and the gap of the magnetic bearing is controlled, and thereby the temperature of the movable part is controlled.

The device manufacturing method of the present invention includes a step of exposing a pattern to a substrate using the exposure apparatus, and a step of developing the exposed substrate .
Therefore, a device can be manufactured with a simple configuration and high processing accuracy and throughput.

According to the stage apparatus of the present invention , since the temperature adjusting means for adjusting the temperature of the guide portion is provided in order to control the temperature of the movable portion , the object can be moved with high accuracy and high throughput with a simple configuration. Or it can position and can process a target object.
Furthermore, when this stage apparatus is applied to an exposure apparatus, the overlay accuracy and line width accuracy can be improved with a simple configuration, and the exposure process can be speeded up.

  1 and 2 are a plan view and a front view showing a configuration of a reticle scan stage according to the first embodiment of the present invention. This reticle scan stage has three axes of freedom of X, Y, and θ. The reticle scanning stage includes a top plate 5 that holds and moves the reticle 23, an air bearing 24 provided on the top plate 5, a stage guide 25 having a guide surface that guides the top plate 5 in cooperation with the air bearing 24, A temperature adjusting means for adjusting the temperature of the stage guide 25 to control the temperature of the top plate 5, a reference structure 4 that supports the stage guide 25, and an electromagnetic actuator for moving and positioning the top plate 5 are provided. .

  A flat guide surface 6 serving as a reference is provided on the reference structure 4, and the stage guide 25 is provided on the flat guide surface 6. The top plate 5 is supported in a non-contact manner by the air bearing 24 with respect to the stage guide 25 and is movable in the XYθ direction. The air bearing 24 forms a highly rigid guide by generating an attractive force between the top plate 5 and the stage guide 25 by a preload magnet (not shown) and generating a repulsive force by a static pressure pad (not shown). Yes.

  The electromagnetic actuator is provided on both sides of the top plate 5 and drives the movers 2a and 2b and the movers 2a and 2b fixed to the left and right of the top plate 5 with a long stroke in the Y direction and a short stroke in the X direction. Therefore, it has the stators 1a and 1b separated and independent from each other on the left and right. The stators 1a and 1b are supported in a non-contact manner by a hydrostatic bearing with respect to the planar guide surface 6, and are movable in the XYθ direction (planar direction). The stators 1a and 1b have a predetermined weight and have a function of a reaction force counter described later. A movable part Y magnet 10 and a movable part X magnet 11 are attached to the movers 2a and 2b, respectively. Inside the stators 1a and 1b, an X-axis linear motor single-phase coil 12 and a Y-axis linear motor multi-phase coil 13 in which a plurality of coils are arranged in the Y direction are arranged. The top plate 5 can be moved in the X-axis direction and the Y-axis direction.

  The position of the top plate 5 in the XYθ direction is measured by a length measuring device using a laser interferometer using the laser head 16 as a light source. This length measuring device includes two left and right Y-axis measuring interferometers 19a and 19b, two front and rear X-axis measuring interferometers 20a and 20b, and X which are fixed in position relative to the reference structure 4. An axis measuring bar mirror 18 is provided. Further, two Y-axis measuring mirrors 17a and 17b fixed to the top plate 5 and two optical elements 22a and 22b are provided.

  The X-axis direction position of the top plate 5 is such that the Y-direction measurement light from the X-axis measurement interferometers 20a and 20b is reflected or deflected in the X direction by the optical elements 22a and 22b, and further, the X-axis measurement bar mirror 18 It is reflected and measured by returning to the X-axis measuring interferometers 20a and 20b through the reverse path. The Y axis positions of the stators 1a and 1b are measured by two stator Y axis measuring interferometers 21a and 21b.

  The reticle scan stage of this embodiment configured as such an XY stage can also be used as a wafer stage of an exposure apparatus. In that case, a wafer is placed on the top plate 5.

  The top plate 5 on which the reticle 23 is placed is moved in the XYθ direction by an electromagnetic actuator. At that time, the stators 1 a and 1 b receive a driving reaction force as a reaction of the driving force acting on the entire top plate 5. Due to this driving reaction force, the stators 1 a and 1 b move on the planar guide surface 6. Thereby, the stators 1a and 1b serve as a reaction force counter. For example, when the top 5 moves in the + Y direction, the stators 1a and 1b receive the driving reaction force in the -Y direction and move in the -Y direction.

  Note that two left and right Y axis position control linear motors 14a and 14b are provided on the reference structure 4 in order to push back the stators 1a and 1b that have moved in the Y axis direction by a predetermined distance or more. Further, four X-axis position control linear motors 15 are arranged on the reference structure 4 in order to push back the stators 1a and 1b that have moved in the X-axis direction by a predetermined distance or more. As a result, when the top plate 5 moves more than a predetermined amount, the stators 1a and 1b also move together with the predetermined amount, but the Y-axis position control linear motors 14a and 14b and the X-axis position control linear move. The motor 15 can be controlled to return the stators 1a and 1b to a predetermined position. Further, even if the positions of the stators 1a and 1b are shifted due to the influence of resistance, friction, etc., the Y-axis position control linear motors 14a and 14b and the X-axis position control are not dependent on the driving of the electromagnetic actuator described above. The positions of the stators 1a and 1b can be corrected by the linear motor 15.

  The temperature adjusting means for adjusting the temperature of the stage guide 25 includes a cooling path 27 and a temperature sensor 28 a attached to the stage guide 25, and a temperature sensor 28 b attached on the top plate 5. Even if only one of the temperature sensors 28a and 28b is provided, the temperature adjustment function can be achieved. The stage guide 25 is fixed on the reference structure 4 by a support spacer 26.

  In the exposure apparatus to which this reticle scan stage is applied, factors of thermal disturbance affecting the stage top plate 5 and the reticle 23 during exposure and alignment and the transmission path are as follows: (1) Heat generated from the linear motor coils 12 and 13 Is transmitted to the stator (stator) 1a and 1b, is transmitted to the top plate 5 through the reference structure 4, the support spacer 26, and the stage guide (stage surface plate) 25, and further through the gap of the air bearing 24. When the heat generated from the linear motor coils 12 and 13 is transmitted to the stators 1a and 1b and further transmitted to the top plate 5 via air, X and Y magnets 10 and 11, (2) When the reticle is scanned at high speed The magnetic flux of the air bearing preload magnet or electromagnetic guide changes in the stage guide 25 made of ferrous material. When the eddy current is generated to raise the temperature of the stage guide 25 and the heat is transmitted to the top plate 5 via the air bearing 24, (3) temperature fluctuation of the atmosphere around the stage top plate 5 It is conceivable that heat is transferred to the top plate 5 due to the above, and (4) the exposure light applied to the reticle 23 gives heat to the reticle 23 and the reticle 23 itself thermally expands.

  Therefore, at the time of exposure or alignment, the temperature of the stage guide 25 is controlled by circulating the refrigerant through the cooling path 27 provided in the stage guide 25 and controlling the temperature of the refrigerant so that the temperature detected by the temperature sensor 28a is constant. To be constant. As a result, the temperature variation of the stage guide 25 due to the heat transmitted through the support spacer 26 and the heat generation due to the eddy current can be suppressed. Thus, by controlling the temperature of the stage guide 25 to be constant, if a temperature difference occurs between the stage guide 25 and the top plate 5, the heat of the top plate 5 is transferred to the stage via the air gap of the air bearing 24. Since the signal is transmitted to the guide 25, the temperature of the top plate 5 and the reticle 23 can be controlled.

  At this time, the temperature of the top plate 5 is directly measured by using the temperature sensor 28b on the top plate 5 and the temperature of the refrigerant is controlled. The temperature control performance of the top plate 5 and the reticle 23 can be further improved. Further, even in the case of using an electromagnetic guide using electromagnetic force instead of the air bearing 24, it goes without saying that the same effect can be obtained by the same action when used in the atmosphere. Even when the electromagnetic guide is used in a vacuum, heat cannot be transmitted through the air layer, but the heat of the stage top 5 can be released to the stage guide 25 by radiation, and the same effect is obtained. be able to.

  In this embodiment, the reticle scanning stage performs exposure while synchronously scanning both the reticle and the wafer, performs exposure transfer of the reticle pattern to one shot area of the wafer, and moves the wafer in steps to pattern the plurality of shot areas. It is preferably used in a so-called step-and-scan type scanning exposure apparatus that transfers the images side by side. However, the stage apparatus of the present invention is not limited to application to a step-and-scan type exposure apparatus, and is not limited to application to a reticle stage. It is also effective as a wafer stage in a step-and-repeat type exposure apparatus in which the wafer stage moves at high speed.

  According to this embodiment, when the reticle scan stage is applied to the exposure apparatus, the temperature fluctuation of the top 5 due to the thermal disturbance during exposure and alignment can be reduced as described above, so that the overlay accuracy is improved. Can be achieved. In addition, since a refrigerant pipe or the like to the stage top 5 is not required, vibration disturbances acting on the stage top 5 due to the pipes during exposure processing, for example, cogging and mounting disturbance generated when switching the multiphase linear motor, etc. Can be minimized and accuracy degradation due to vibration can be suppressed. Therefore, it is possible to improve the overlay accuracy, the line width accuracy, and the like. Further, the speed and acceleration of the stage top 5 can be increased to improve the throughput.

  FIG. 3 shows the back surface of the stage guide in the reticle scan stage according to the second embodiment. An opening 36 through which exposure light for irradiating the reticle passes is provided in the center of the stage guide 25. Further, cooling paths 37-1 to 37-4 and temperature sensors 38-1 to 38-4 are provided along both sides in the longitudinal direction. Refrigerants are separately circulated through the cooling paths 37-1 to 37-4, and the temperatures of the respective refrigerants are independently controlled by temperature control units (not shown) based on detection signals from the temperature sensors 38-1 to 38-4. Can be controlled. Other configurations are the same as those in the first embodiment.

  In this configuration, during exposure and alignment in an exposure apparatus to which the reticle scan stage is applied, the temperature of each temperature control portion of the stage guide 35 provided with the cooling paths 37-1 to 37-4 is a corresponding temperature sensor. Based on the detection signals from 38-1 to 38-4, the temperature control unit controls the detection signals separately. Therefore, when a local temperature distribution occurs in the stage guide 35, independent temperature control is performed for each temperature adjustment portion according to the temperature distribution.

  In this example, four cooling paths and temperature sensors are provided, but by providing more units, more local temperature control is possible. In addition, the temperature distribution of the stage guide 35 corresponding to the stage drive duty is obtained in advance, and the temperature of each temperature control part is individually controlled in a feed-forward manner, thereby enabling quick temperature control with a short time constant. It becomes.

  FIG. 4 shows the back surface of the stage guide in the reticle scan stage according to the third embodiment. A plurality of heat pipes 30-1 to 30-8 and temperature sensors 31-1 to 31-8 are provided on the back surface of the stage guide 25. Cooling manifolds 32-1 to 32-8 are provided outside the stage guide 25, and are connected to the heat pipes 30-1 to 30-8, respectively. A cooling path (not shown) is connected to each of the cooling manifolds 32-1 to 32-8, and the cooling manifolds 32-1 to 32-8 can be exhausted to the outside of the apparatus through the cooling paths. Has been. The temperature of the refrigerant circulating in each cooling path is controlled by a temperature control unit (not shown) based on detection signals from the temperature sensors 31-1 to 31-8.

  At the time of exposure and alignment, the heat of the stage guide 25 is discharged to the outside of the stage guide 25 by the heat pipes 30-1 to 30-8, and further passes through the cooling passages through the cooling manifolds 32-1 to 32-8. It is discharged out of the device. Thereby, the temperature rise of the stage guide 25 is prevented. At that time, the cooling efficiency of the heat pipes 30-1 to 30-8 is individually controlled by individually controlling the temperature of the refrigerant flowing through the cooling manifolds 32-1 to 32-8. It is also possible to eliminate a significant temperature distribution.

  FIG. 5 is a side view of an exposure apparatus according to the fourth embodiment. This exposure apparatus is a scanning exposure apparatus in which a stage apparatus similar to the reticle scan stage according to any of the above-described embodiments is mounted as a wafer stage. This exposure apparatus includes a reticle stage surface plate 42 and a reticle stage top plate 43 constituting a reticle stage, a wafer stage surface plate 46 and a wafer stage top plate 44 constituting a wafer stage, and a floor or substrate 40 via a damper 41. A supported column base plate 39, a projection optical system 45 positioned between the reticle stage and the wafer stage, and an illumination optical system 47 for irradiating exposure light are provided. The reticle surface plate 42 and the projection optical system 45 are supported by the lens barrel surface plate 39. The wafer stage surface plate 46 is supported on the floor or base 40.

  The wafer stage positions the wafer placed on it. The reticle stage is movable with a reticle having a circuit pattern formed thereon. The exposure light emitted from the illumination optical system 47 exposes the wafer on the wafer stage by a reticle pattern mounted on the reticle stage.

  During such exposure processing, the wafer stage top plate 44 is scanned and moved in synchronization with the reticle stage top plate 43 so that the reticle and wafer are scanned in synchronization with the exposure light. During the scanning movement of the reticle stage top plate 43 and the wafer stage top plate 44, the positions of both are continuously detected by the interferometers and fed back to the drive units of the reticle stage top plate 43 and the wafer stage top plate 44, respectively. This makes it possible to accurately synchronize the start positions of both scanning movements and to control the scanning speed in the constant speed scanning region with high accuracy. While both are scanning and moving with respect to the projection optical system 47, the reticle pattern is exposed on the wafer, and the circuit pattern is transferred. As the exposure light, ultraviolet light such as a fluorine excimer laser, an ArF excimer laser, a KrF excimer laser or the like is used.

  According to the present embodiment, the temperature of the wafer stage top plate 44 can be controlled as in the case of each of the above-described embodiments, so that an error factor of misalignment during exposure or alignment can be reduced. Can do. Therefore, the overlay accuracy of the pattern of each layer formed on the wafer can be improved.

  Next, a semiconductor device manufacturing process using an exposure apparatus to which the stage apparatus described above is applied will be described. FIG. 6 shows the flow of the entire manufacturing process of the semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask production), a mask on which the designed circuit pattern is formed is produced. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7). The pre-process and post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by a remote maintenance system. In addition, information for production management and apparatus maintenance is communicated between the pre-process factory and the post-process factory via the Internet or a dedicated network.

  FIG. 7 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed onto the wafer by exposure using the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by a remote maintenance system, troubles can be prevented in advance and quick recovery is possible even if troubles occur, making semiconductor device productivity higher than before. Can be improved.

1 is a plan view of a reticle scan stage according to a first embodiment of the present invention. FIG. 2 is a front view of the reticle scan stage of FIG. 1. It is a figure which shows the back surface of the stage guide in the reticle scanning stage which concerns on the 2nd Embodiment of this invention. It is a figure which shows the back surface of the stage guide in the reticle scanning stage which concerns on the 3rd Embodiment of this invention. It is a side view of the exposure apparatus which concerns on the 4th Embodiment of this invention. It is a flowchart of the manufacturing process of a device. It is a flowchart of the wafer process in FIG.

Explanation of symbols

  1a, 1b: stator, 2a, 2b: mover, 4: reference structure, 5: top plate, 6: plane guide surface, 10: movable part Y magnet, 11: movable part X magnet, 12: X axis linear Motor single phase coil, 13: Y axis linear motor multiphase coil, 14a, 4b: Y axis position control linear motor, 15: X axis position control linear motor, 16: Laser head, 17a, 17b: Y axis measurement Mirror, 18: Bar mirror for X axis measurement, 19a, 19b: Interferometer for Y axis measurement, 20a, 20b: Interferometer for X axis measurement, 21a, 21b: Interferometer for stator Y axis measurement, 22a, 22b: Optical Element: 23: Reticle, 24: Air bearing, 25: Stage guide, 26: Support spacer, 27: Cooling path, 28a, 28b: Temperature sensor, 30-1 to 30-8: Heat pipe, 31-1 to 31 8: Temperature sensor, 32-1 to 32-8: Cooling manifold, 36: Opening for passage of exposure light, 39: Lens barrel surface plate, 40: Floor / base, 41: Damper, 42: Reticle stage surface plate, 43: Reticle stage top plate, 44: wafer stage top plate, 45: projection optical system, 46: stage surface plate, 47: illumination optical system.

Claims (8)

And the structure, a top plate that holds and moves an object, a stator provided on the movable member and the coil and includes a member for supporting said coil on said structure comprising a magnet fixed to the top plate said drive means for driving the top board, the stator and the guide portion made of a material containing organic and iron guide surface for guiding the top plate in the movement direction is provided on the separately the structure by the A bearing means provided on the top plate for supporting the top plate in a non-contact manner with respect to the guide surface; and a suction force is generated between the top plate and the guide portion provided on the top plate. And a temperature sensor for detecting the temperature of the guide part provided in the guide part, and a cooling pipe for flowing a refrigerant for cooling the guide part, based on the detection result of the temperature sensor. the Guy by controlling the temperature Stage apparatus characterized by the temperature of the part by adjusting the constant to and a temperature adjusting means for reducing the temperature fluctuations of the top plate.   The stage apparatus according to claim 1, wherein the temperature adjusting unit separately adjusts the temperature of a plurality of different portions of the guide portion. The stage apparatus according to claim 2 , wherein the temperature adjusting unit separately adjusts the temperature of each of the different portions of the guide portion according to a driving pattern of the top plate. The said temperature adjustment means is provided with the temperature sensor provided in the said top plate, and adjusts the said temperature based on the detection signal, The any one of Claims 1-3 characterized by the above-mentioned. Stage device. The guide portion, the stage apparatus according to any one of claims 1 to 4, characterized in that it is supported via a spacer to the structure. 6. The stage device according to claim 1, wherein two of the stators are provided across the guide in a direction orthogonal to a moving direction of the top plate. An exposure apparatus for positioning an original plate or a substrate using the stage apparatus according to any one of claims 1 to 6 . A device manufacturing method, comprising: manufacturing a device using the exposure apparatus according to claim 7 .

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