JP4509669B2 - 載置機構及び被処理体の搬出方法 - Google Patents
載置機構及び被処理体の搬出方法 Download PDFInfo
- Publication number
- JP4509669B2 JP4509669B2 JP2004191402A JP2004191402A JP4509669B2 JP 4509669 B2 JP4509669 B2 JP 4509669B2 JP 2004191402 A JP2004191402 A JP 2004191402A JP 2004191402 A JP2004191402 A JP 2004191402A JP 4509669 B2 JP4509669 B2 JP 4509669B2
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- Prior art keywords
- carrier
- processed
- mounting
- dicing frame
- grooves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また、本発明の請求項4に記載の載置機構は、請求項1〜請求項3のいずれか1項に記載の発明において、上記出没部材を複数有し、上記駆動機構は、上記複数の出没部材を連結する無端状ベルトと、無端状ベルトに連結されたシリンダ機構と、を有することを特徴とするものである。
また、本発明の請求項6に記載の被処理体の搬出方法は、被処理体を左右両側から支持するように上下方向に所定間隔を空けて形成された複数対の溝と、最下段の上記左右一対の溝よりも下方に配置された案内棒と、を有し、上記最下段の溝と上記案内棒との間隔が上下で隣り合う溝の間隔よりも狭くなっているキャリア内に収納された上記被処理体を上記キャリアから搬出する方法であって、上記キャリアにおける最下段の溝で支持された上記被処理体を持ち上げる工程と、持ち上げられた上記被処理体の下面と上記キャリアの案内棒との間に搬送アームを挿入する工程と、上記被処理体を降下させて上記搬送アームに載せる工程と、上記搬送アームによって上記被処理体を上記キャリアから搬出する工程と、を備えたことを特徴とするものである。
D ダイシングフレーム
10 載置機構
11 載置台
11B 開口部
12 出没部材
12A 長孔(孔)
13 駆動機構
13B 無端状ベルト
13C シリンダ機構
Claims (6)
- 上下方向で所定間隔を空けて被処理体を収納するキャリアを載置する機構であって、上記キャリアは、上記被処理体を左右両側から支持するように上下方向に所定間隔を空けて形成された複数対の溝と、最下段の上記左右一対の溝よりも下方に配置された案内棒と、を有し、上記最下段の溝と上記案内棒との間隔が上下で隣り合う溝の間隔よりも狭くなっており、上記キャリアを載置する機構は、上記キャリアを載置する載置台と、この載置台に対して出没可能に設けられ且つ上記キャリアの最下段の溝に収納された被処理体を昇降させる出没部材と、これらの出没部材を駆動させる駆動機構とを有することを特徴とする載置機構。
- 上記載置台は、上面に上記出没部材が出没する開口部を有することを特徴とする請求項1に記載の載置機構。
- 上記出没部材は、上記開口部に固定された軸に遊嵌する孔を有することを特徴とする請求項1または請求項2に記載の載置機構。
- 上記出没部材を複数有し、上記駆動機構は、上記複数の出没部材を連結する無端状ベルトと、無端状ベルトに連結されたシリンダ機構と、を有することを特徴とする請求項1〜請求項3のいずれか1項に記載の載置機構。
- 上記被処理体は、ウエハと、このウエハが貼り付けられたフィルムと、上記ウエハの周囲で上記フィルムを支持するダイシングフレームとを有することを特徴とする請求項1〜請求項4のいずれか1項に記載の載置機構。
- 被処理体を左右両側から支持するように上下方向に所定間隔を空けて形成された複数対の溝と、最下段の上記左右一対の溝よりも下方に配置された案内棒と、を有し、上記最下段の溝と上記案内棒との間隔が上下で隣り合う溝の間隔よりも狭くなっているキャリア内に収納された上記被処理体を上記キャリアから搬出する方法であって、
上記キャリアにおける最下段の溝で支持された上記被処理体を持ち上げる工程と、
持ち上げられた上記被処理体の下面と上記キャリアの案内棒との間に搬送アームを挿入する工程と、
上記被処理体を降下させて上記搬送アームに載せる工程と、
上記搬送アームによって上記被処理体を上記キャリアから搬出する工程と、を備えた
ことを特徴とする被処理体の搬出方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191402A JP4509669B2 (ja) | 2004-06-29 | 2004-06-29 | 載置機構及び被処理体の搬出方法 |
KR1020077002126A KR100874287B1 (ko) | 2004-06-29 | 2005-06-20 | 캐리어 지지 장치 및 피처리체 반출 방법 |
US11/628,843 US8678739B2 (en) | 2004-06-29 | 2005-06-20 | Carrier supporting apparatus |
PCT/JP2005/011255 WO2006001246A1 (ja) | 2004-06-29 | 2005-06-20 | キャリア支持装置 |
CNB2005800220458A CN100452343C (zh) | 2004-06-29 | 2005-06-20 | 托架支承装置 |
TW094121663A TW200603325A (en) | 2004-06-29 | 2005-06-28 | Carrier support device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191402A JP4509669B2 (ja) | 2004-06-29 | 2004-06-29 | 載置機構及び被処理体の搬出方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006013320A JP2006013320A (ja) | 2006-01-12 |
JP2006013320A5 JP2006013320A5 (ja) | 2007-08-16 |
JP4509669B2 true JP4509669B2 (ja) | 2010-07-21 |
Family
ID=35780168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004191402A Expired - Fee Related JP4509669B2 (ja) | 2004-06-29 | 2004-06-29 | 載置機構及び被処理体の搬出方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8678739B2 (ja) |
JP (1) | JP4509669B2 (ja) |
KR (1) | KR100874287B1 (ja) |
CN (1) | CN100452343C (ja) |
TW (1) | TW200603325A (ja) |
WO (1) | WO2006001246A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10504762B2 (en) * | 2018-02-06 | 2019-12-10 | Applied Materials, Inc. | Bridging front opening unified pod (FOUP) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233998A (ja) * | 1998-02-09 | 1999-08-27 | Sony Corp | 基板位置決め装置 |
JP2001284838A (ja) * | 2000-04-03 | 2001-10-12 | Alpine Electronics Inc | 電子機器 |
JP2002261145A (ja) * | 2001-03-02 | 2002-09-13 | Kanayama Seiki Co Ltd | ウェーハ取出・収納装置 |
JP2003309165A (ja) * | 2002-04-18 | 2003-10-31 | Matsushita Electric Ind Co Ltd | ウェハの供給装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US3902615A (en) * | 1973-03-12 | 1975-09-02 | Computervision Corp | Automatic wafer loading and pre-alignment system |
FR2656599B1 (fr) * | 1989-12-29 | 1992-03-27 | Commissariat Energie Atomique | Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires. |
US5275521A (en) * | 1991-07-03 | 1994-01-04 | Tokyo Electron Sagami Limited | Wafer transfer device |
JP2913439B2 (ja) * | 1993-03-18 | 1999-06-28 | 東京エレクトロン株式会社 | 移載装置及び移載方法 |
US5697748A (en) * | 1993-07-15 | 1997-12-16 | Applied Materials, Inc. | Wafer tray and ceramic blade for semiconductor processing apparatus |
US6447232B1 (en) * | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
US5765982A (en) * | 1995-07-10 | 1998-06-16 | Amtech Systems, Inc. | Automatic wafer boat loading system and method |
TW318258B (ja) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
DE19813684C2 (de) * | 1998-03-27 | 2001-08-16 | Brooks Automation Gmbh | Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation |
JP3560888B2 (ja) * | 1999-02-09 | 2004-09-02 | シャープ株式会社 | 半導体装置の製造方法 |
US20020044859A1 (en) * | 2000-08-28 | 2002-04-18 | Shinsung Eng Corporation | FOUP loading apparatus for FOUP opener |
US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
TWI241674B (en) * | 2001-11-30 | 2005-10-11 | Disco Corp | Manufacturing method of semiconductor chip |
JP4274736B2 (ja) * | 2002-03-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US7033126B2 (en) * | 2003-04-02 | 2006-04-25 | Asm International N.V. | Method and apparatus for loading a batch of wafers into a wafer boat |
-
2004
- 2004-06-29 JP JP2004191402A patent/JP4509669B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-20 US US11/628,843 patent/US8678739B2/en active Active
- 2005-06-20 KR KR1020077002126A patent/KR100874287B1/ko active IP Right Grant
- 2005-06-20 WO PCT/JP2005/011255 patent/WO2006001246A1/ja active Application Filing
- 2005-06-20 CN CNB2005800220458A patent/CN100452343C/zh active Active
- 2005-06-28 TW TW094121663A patent/TW200603325A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233998A (ja) * | 1998-02-09 | 1999-08-27 | Sony Corp | 基板位置決め装置 |
JP2001284838A (ja) * | 2000-04-03 | 2001-10-12 | Alpine Electronics Inc | 電子機器 |
JP2002261145A (ja) * | 2001-03-02 | 2002-09-13 | Kanayama Seiki Co Ltd | ウェーハ取出・収納装置 |
JP2003309165A (ja) * | 2002-04-18 | 2003-10-31 | Matsushita Electric Ind Co Ltd | ウェハの供給装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200603325A (en) | 2006-01-16 |
JP2006013320A (ja) | 2006-01-12 |
KR20070038530A (ko) | 2007-04-10 |
US20090245979A1 (en) | 2009-10-01 |
CN100452343C (zh) | 2009-01-14 |
KR100874287B1 (ko) | 2008-12-18 |
WO2006001246A1 (ja) | 2006-01-05 |
US8678739B2 (en) | 2014-03-25 |
CN1977372A (zh) | 2007-06-06 |
TWI371071B (ja) | 2012-08-21 |
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