JP4498951B2 - Wiring member and flexure manufacturing method - Google Patents

Description

  The present invention relates to a wiring member used for various applications such as a magnetic head suspension assembly and a method of manufacturing a flexure that is a member of a wireless suspension for a magnetic head suspension assembly.

In recent years, for various applications such as for magnetic head suspension assemblies, etc., a wiring with a structure in which a support base, an insulating layer, and a wiring layer made of metal layers are laminated in this order, and each layer is etched into a predetermined shape for each purpose. A member is used.
For example, in Japanese Patent Laid-Open No. 2002-25213 (Patent Document 1), a wiring substrate is formed by a subtractive method using a laminated base material in which a metal layer, an insulating layer, and a conductive layer are laminated in this order. There is a description of a wireless suspension blank (hereinafter also simply referred to as a wireless suspension) for a magnetic head suspension, which is processed by an etching method and an insulating layer is processed by wet etching.
Japanese Patent Laid-Open No. 2000-49195 (Patent Document 2) does not specifically describe a method of manufacturing a wireless suspension blank for a hard disk drive (also referred to as an HDD). A manufacturing method is disclosed.
In this manufacturing method, as a laminate, a three-layer structure composed of metal foils laminated on both sides of a polyimide film is used, and a resist pattern is formed on each of the metal foils laminated on both sides of the polyimide film. After simultaneously etching the metal foil with an etching solution, the resist pattern was peeled off, and then the polyimide film was patterned by plasma etching using one metal foil as a mask, and then used as a mask. By removing the metal foil, a member for an electronic component which is a laminate of the patterned polyimide film and the patterned metal foil is obtained, and this manufacturing method also forms a wiring portion by a subtractive method. .
On the other hand, in Japanese Patent Laid-Open No. 2002-25026 (Patent Document 3), a laminated base material in which an insulating layer is disposed on a supporting base material made of a metal layer is used, and a wiring portion is formed on the insulating layer by a semi-additive method. There is a description of a method for manufacturing a wiring member that is formed, a metal layer is processed by an etching method, and an insulating layer is processed by wet etching.
JP 2002-25213 A JP 2000-49195 A In this case, the wireless suspension is a suspension for a magnetic head suspension that is not particularly a wire (film wiring) that is used as a wiring. A wiring layer is formed on a material via an insulating layer, and the wiring layer is formed from a metal layer by etching, plating, or the like.

In the case of the method of forming the wiring portion by the above-described subtractive method, the wiring is formed by etching a conductive layer (or a thin metal layer) that has been laminated in advance, and the same material is used throughout the formed wiring. .
As the conductive layer (or thin metal), either an electrolytic copper foil or a rolled copper foil is used.
Also, in the case of the method of forming the wiring portion by the semi-additive method described above, since the entire wiring is formed by plating, the same material is used throughout the entire wiring to be formed.
In brief, the semi-additive method is a processing method in which a metal part including a wiring part to be formed is formed by plating, and etching is further performed to form a wiring from the plated metal part. The subtractive method is a processing method for forming a wiring portion by selective etching of a metal layer that has been prepared in advance.
In general, the formation of wiring by the semi-additive method is excellent in miniaturization of wiring but is inferior in productivity compared to the formation of wiring by the subtractive method.

Recently, there is a strong demand for miniaturization of HDD magnetic head suspension assemblies, and further miniaturization of wireless suspensions is also demanded.
As a result, wireless suspensions that are particularly excellent in spring characteristics have been required.
With the miniaturization of wireless suspension, when a wiring layer is formed by using a rolled copper foil as a subtractive method, the rigidity of the rolled copper foil cannot be ignored, and the support base corresponding to the spring characteristics required for the wireless suspension. There has been a problem that the simulation for determining the outer shape of the material becomes difficult.
In addition, when the wiring layer is formed by the subtractive method using electrolytic copper foil as the material, or when the wiring layer is formed by the semi-additive method, to determine the outer shape of the support substrate corresponding to the spring characteristics In this simulation, the rigidity of the wiring can be ignored, which is advantageous in the simulation, but since the electrical connection between the wireless suspension and its control circuit is made by ultrasonic bonding, There is a problem that it is inferior in terms of ultrasonic bonding.
The electrical connection between the wireless suspension and its control circuit is usually made through a relay circuit unit for connecting them, but the wireless suspension and the relay circuit unit are electrically connected by ultrasonic bonding. After that, if a problem is found in the relay circuit section between the wireless suspension and its control circuit by inspection etc., the wireless suspension may be disconnected from the relay circuit section. However, the connection portion of the wireless suspension is required to have high rigidity.

As described above, recently, there is a strong demand for miniaturization of magnetic head suspension assemblies for HDDs, and there is a demand for further miniaturization of wireless suspensions. Simulation for determining the outer shape of the support base corresponding to the spring characteristics required for the suspension can be performed easily, and the connection part when performing electrical connection with the control circuit by ultrasonic bonding is ultrasonic bonding There was a need for an excellent wireless suspension.
The present invention is compatible with this, and in particular, when further miniaturizing a recent wireless suspension, it is possible to easily perform a simulation for determining the outer shape of the supporting base material corresponding to the required spring characteristics, and to provide a control circuit. It is intended to provide a flexure that is a member of a wireless suspension with excellent ultrasonic bonding at the connection part when making electrical connection with ultrasonic bonding, and more specifically, to exhibit spring characteristics On the support substrate made of a metal layer and processed into an outer shape in a predetermined shape, a wiring composed of two types, a wiring portion made of electrolytic copper foil and a wiring portion made of rolled copper foil, is formed via an insulating layer. And the connection part of the wiring part which consists of electrolytic copper foil, and the wiring part which consists of rolled copper foil is made into the laminated structure which laminated | stacked wiring parts through the conductive connection layer, and (super An ultrasonic bonding connection portion (for electrical connection with the control circuit side by wave bonding) is formed of rolled copper foil, and the tip end side which is the tip end side of the magnetic head suspension of the wiring is electrolytic copper A flexure that is a member of a wireless suspension for a magnetic head suspension assembly formed of foil is provided.
At the same time, an object of the present invention is to provide a method of manufacturing a flexure that is a member of such a wireless suspension.

The wiring member of the present invention is a wiring member in which a wiring is formed on a supporting base material, and the wiring is composed of two or more wiring portions having different rigidity, and a connecting portion between wiring portions having different rigidity is a wiring portion. It is a laminated structure in which each other is laminated via a conductive connection layer, and the support base material is made of a metal layer that expresses spring characteristics, is externally processed into a predetermined shape, and the wiring is formed via an insulating layer. forms a, and, the wiring member is a flexure is a member of the wireless suspension for a magnetic head suspension assembly, by the wiring, but connecting the slider and the control circuit, the wiring is electrolytic copper foil A wiring portion made of rolled copper foil and a wiring portion made of rolled copper foil, and at least an ultrasonic bonding connecting portion to the control circuit side of the wiring is formed by rolled copper foil, And it is characterized in that it forms the front end portion of the slider side Pensions in electrolytic copper foil.
In the wiring member described above, the conductive connection layer is formed by plating and layering a Ni layer, an Au layer, and a Ni layer in this order.
In any one of the wiring members described above, the metal layer that exhibits the spring characteristics is made of stainless steel.

The manufacturing method of the flexure of the present invention comprises a metal layer that expresses spring characteristics, and a wiring portion made of electrolytic copper foil and a rolled copper foil on a support base material that has been externally processed into a predetermined shape with an insulating layer interposed therebetween. Forming a wiring composed of two kinds of wiring and a wiring portion composed of electrolytic copper foil and a wiring portion composed of rolled copper foil, and connecting the wiring portions to each other via a conductive connection layer. An ultrasonic bonding connection portion for making electrical connection with the control circuit side by ultrasonic bonding of the wiring is formed of rolled copper foil, and a slider of the magnetic head suspension of the wiring forming the front end portion of the side in the electrolytic copper foil, flexure for manufacturing a a member of the wireless suspension for a magnetic head suspension assembly, a manufacturing method der of flexure In order, (a) on one surface of the rolled copper foil, the wiring portion made of electrolytic copper foil is used as an etching stopper layer when the rolled copper foil is etched from the rolled copper foil side in accordance with the wiring shape to be formed. An electrolytic copper foil wiring portion forming step formed by laminating via a conductive connection layer; and (b) an insulating layer in which an insulating layer and an adhesive layer are arranged in this order on the wiring portion forming side made of the electrolytic copper foil. the section provided, have rows and extent bonding Engineering bonding the metal layer through which, in tandem, to drilling the rolled copper foil (c) via connection portion formation region, the via connection part The insulating layer part of the formation region is perforated so as to reach the metal layer side, and a conductive material is arranged in the perforated hole part to electrically connect the rolled copper foil side and the metal layer side. (D) etching from the rolled copper foil by a resist plate-making etching method. Forming a wiring shape to form a wiring portion, have rows and extent rolled copper foil wiring portion formed Engineering, further sequentially, the wiring side consisting of the wiring portion, the wiring portion made of rolled copper foil made of (e) an electrolytic copper foil A protective film forming step of exposing a predetermined region including the ultrasonic bonding connection portion and covering with a protective film; and (f) an etching method using a resist plate making the insulating layer portion as an etching stopper layer, and An outer shape processing step for performing outer shape processing, and (h) an etching removal step of etching and removing the insulating layer portion in the exposed region in a state where the wiring side is covered with an etching resistant film; (I) A plating process is performed in which plating is performed on the exposed rolled copper foil surface and the exposed electrolytic copper foil surface, which are to be ultrasonic bonding connection portions, respectively.
Then, I manufacturing method der the above flexure, the metal layer is stainless steel, the insulating layer, the adhesive layer are both and is characterized by comprising a polyimide resin.

(Function)
According to the first aspect of the present invention, the wiring member according to the first aspect of the present invention can form a rigid wiring portion suitable for the purpose in each part or each region of the wiring member, and the rigidity is different. The connection between the wiring portions is firmly and surely formed, and the connection portion between the wiring portions is easily formed in the production.
Specifically, the wiring is composed of two or more wiring portions having different rigidity, and the connection portion between the wiring portions having different rigidity is a laminated structure in which the wiring portions are stacked via a conductive connection layer, The support base is made of a metal layer that exhibits spring characteristics, is externally processed into a predetermined shape, forms the wiring via an insulating layer, and the wiring member is used for a magnetic head suspension assembly of a flexure is a member of the wireless suspension, by the wiring, but connecting the slider and the control circuit, the wiring consists of two wiring portion made of rolled copper foil and the wiring portion made of an electrolytic copper foil And forming at least the ultrasonic bonding connection portion with the control circuit side of the wiring with a rolled copper foil, and forming the tip portion side which becomes the slider side of the magnetic head suspension with the electrolytic copper foil. By that, we have achieved this.
Specifically, the wiring is in the form of two types of wiring part consisting of electrolytic copper foil and wiring part consisting of rolled copper foil. In the wiring part consisting of electrolytic copper foil, the degree of freedom of miniaturization is increased and rolled. The ultrasonic bonding property can be improved in the wiring portion made of copper foil.
Examples of the conductive connection layer include a Ni layer, an Au layer, and a Ni layer formed in this order by plating , and this layer structure allows the connection layer to be a wiring made of an electrolytic copper foil. And the wiring portion made of the rolled copper foil can be firmly and reliably laminated, and the Au layer can function as an etching stopper layer in the etching of the rolled copper foil for wiring formation.
The layer structure of the conductive connection layer is not limited to this, but the structure of the Ni layer, Au layer, and Ni layer is simple and preferable.
In particular, the support base is made of a metal layer that expresses spring characteristics, is contoured into a predetermined shape, and forms the wiring via an insulating layer, so that two or more wiring portions having different rigidity can be obtained. The influence on the spring characteristics of the wiring can be easily controlled by the way of arrangement. In particular, because of the wireless suspension for the head suspension assembly in which the wiring and the control circuit are electrically connected by wire bonding, there is a demand for finer wiring in the recent further miniaturization of the wireless suspension. It is easy to simulate to determine the outer shape of the support substrate corresponding to the required spring characteristics, and the connection part when making electrical connection with the control circuit by wire bonding is wire bonding property It is possible to provide excellent wireless suspension.
An example of the metal layer that exhibits spring characteristics is stainless steel.

The flexure manufacturing method of the present invention has the above-described structure, and in particular, in the recent further miniaturization of the wireless suspension, the support base corresponding to the required spring characteristics can be met. Manufactures flexures that are members of wireless suspensions that can be easily simulated to determine the outer shape of the material, and have excellent ultrasonic bonding properties when connecting to the control circuit using ultrasonic bonding. It is possible to provide a manufacturing method of a flexure that can be performed.
More specifically, a wiring portion made of an electrolytic copper foil and a wiring made of a rolled copper foil on a support base material made of a metal layer that expresses spring characteristics and externally processed into a predetermined shape via an insulating layer The wiring part consisting of two types of the copper part and the wiring part consisting of the electrolytic copper foil and the wiring part consisting of the rolled copper foil are electrically connected by laminating the wiring parts via a conductive connection layer. An ultrasonic bonding connection portion is formed of rolled copper foil for electrical connection with the control circuit side by ultrasonic bonding of the wiring, and the slider side of the magnetic head suspension of the wiring It is possible to provide a flexure manufacturing method for manufacturing a flexure that is a member of a wireless suspension for a magnetic head suspension assembly, the tip portion of which is made of electrolytic copper foil.

As described above, the present invention increases the degree of freedom in miniaturization of the wiring, improves the ultrasonic bonding property, and further, the support base material is made of a metal layer that exhibits spring characteristics. In this method, the spring characteristics can be controlled by wiring, and the connection between wiring parts having different rigidity can be firmly and reliably connected, and the connection part can be easily formed in the production. It is supposed to be.
Furthermore, in recent miniaturization of wireless suspensions, it is possible to meet the demands for miniaturization of wiring, easily perform the simulation for determining the outer shape of the support base corresponding to the required spring characteristics, and the control circuit and It is possible to provide a flexure that is a member of a wireless suspension in which a connection portion when performing electrical connection of the above by ultrasonic bonding is excellent in ultrasonic bonding properties.
At the same time, it is possible to provide a method for manufacturing such a flexure.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a schematic view showing an example of the arrangement of wiring and a supporting base material as an example of the embodiment of the wiring member of the present invention, and FIG. 1B is A11 in FIG. FIG. 1C is a diagram showing a cross section passing through B11-B21-B31 in FIG. 1A, and FIG. 1D is a diagram showing FIG. FIG. 2 is an enlarged view of the connecting portion 141 and shows a laminated structure through the connecting layer 110. FIGS. 2 to 4 are diagrams showing the steps of the manufacturing method for manufacturing the wiring member shown in FIG. FIG. 5 is a view for explaining another embodiment of the wiring member of the present invention.
In FIG. 1A, in order to make the state of the wiring easy to understand, the supporting base 170A, the rolled copper foil wiring 130, the electrolytic copper foil wiring 120, the insulating layer between them, and the protective layer covering the wiring are shown. Although not shown, in FIG. 1 (b) and FIG. 1 (c), an insulating layer and a protective layer between them are shown.
Moreover, in FIGS. 2-4, (a)-(q) is the state in the cross section which passes along A11-A21-A31 of Fig.1 (a), (a1)-(q1) is B11 of Fig.1 (a). -B21-B31 shows a state in a cross section, and (a1) to (q1) respectively correspond to (a) to (q) in a process.
1 to 5, 110 is a connection layer, 111 and 113 are Ni layers, 112 is an Au layer, 120 is an electrolytic copper foil, 120A is a tip portion, 121 and 122 are electrolytic copper foil wirings, 130 is a rolled copper foil, 130A is a connection part (also referred to as a terminal part), 131 to 133 are rolled copper foil wiring, 132A is a connection opening, 132B is a connection part, 141 to 143 are connection parts, 150 is an insulating layer part, 160 is a plating part, 170 Is a metal layer, 170A is a support substrate, 181 to 184 are resists, 181A to 183A are openings (of the resist), 190 is a cover layer (also referred to as a protective layer), 510 is a first wiring portion, and 520 is a second substrate A wiring part 530 is a third wiring part.

First, an example of an embodiment of a wiring member of the present invention will be described with reference to FIG.
In the wiring member of this example, wiring is provided on a plate-like support base material 170 made of stainless steel that expresses a spring characteristic that is externally processed into a predetermined shape via an insulating layer (insulating layer portion 150) made of polyimide resin. It is a flexure that is a member of the wireless suspension for the magnetic head suspension assembly formed, and connects the slider and control circuit by wiring,
The wiring is composed of two types of electrolytic copper foil 120 and rolled copper foil 130, and at least an ultrasonic bonding connection portion (connecting portion 130A) of the wiring is formed by the rolled copper foil 130, and the magnetic head suspension is used. The front end portion 120 </ b> A on the slider side is formed of the electrolytic copper foil 120.
In particular, the connection portions (141, 142) between the wiring portion made of electrolytic copper foil and the wiring portion made of rolled copper foil, and the wiring portions are made up of the Ni layer 111, the Au layer 112, and the Ni layer 113 in this order. It is a laminated structure in which layers are laminated via conductive connection layers.
In addition, the wireless suspension which is the wiring member of this example is electrically connected to the control circuit side via the relay wiring by ultrasonic bonding with the relay wiring for relaying to the control circuit side for controlling this. The connection is made.
In the wiring member of this example, it is produced by the manufacturing process shown in FIGS. 2 to 4. From the electrolytic copper foil 120 according to the wiring shape to be formed on one surface of the rolled copper foil 130, simply. When the wiring portion to be formed is laminated through the conductive connection layer made of the Ni layer 111, the Au layer 112, and the Ni layer 113 that serve as an etching stopper layer when the rolled copper foil is etched from the rolled copper foil side, rolling is performed. The wiring portion made of the copper foil 130 is formed by etching.
In this example, the insulating layer 150 is formed by sequentially laminating polyimide resin as an adhesive layer for bonding the supporting base material 270A on the supporting base 170A side of the polyimide resin as the insulating layer. is there.
The insulating layer and the adhesive layer that form the insulating layer 150 are both made of polyimide resin, so that they are chemically, mechanically, and electrically stable.
The cover layer 190 is also made of polyimide resin.
In this example, the connection between the electrolytic copper foil wiring 121 and the rolled copper foil wiring 131 is made by a connecting portion 141 provided between the both wirings, and the electrolytic copper foil wiring 122 and the rolled copper foil wiring 133 The connection of the rolled copper foil wiring 132 and the support base material 270A is made by the connection part 143 of the via structure provided between the two wirings. In this case, the rolled copper foil wirings 231 and 233 are connected to the signal wiring, and the rolled copper foil wiring 232 is connected to the ground.
In the via-structure connection portion 143, electrolytic Cu or the like is plated and filled to make it conductive, or filled with a conductive paste, resin mixed with conductive particles, or the like and cured to make it electrically conductive. Connected to.

Next, an example of the manufacturing method of the wiring member of this example is demonstrated based on FIGS.
First, on one surface of the rolled copper foil 130, a conductive portion that becomes an etching stopper layer when the rolled copper foil is etched from the rolled copper foil side, in accordance with the wiring shape to be formed. The layers are stacked through a connection layer.
In this example, a resist 181 having an opening 181A was formed on one surface of the rolled copper foil 130 (FIG. 2A) in accordance with the shape of the wiring to be formed by resist plate-making (FIG. 2B). Ni plating, Au plating, and Ni plating are formed on the opening 181A in order to a thickness of about 0.5 μm, 0.05 μm, and 5 μm, respectively, and then electrolytically used as a wiring portion. Copper foil 120 is formed by plating on opening 181A. (Fig. 1 (c))
The resist 181 is not particularly limited as long as it has a desired resolution and proper processability, but a resist with good processability (such as a dry film resist) is usually preferable.

  Next, an insulating layer portion 150 in which an insulating layer and an adhesive layer are arranged in this order is provided on the wiring portion forming side made of the electrolytic copper foil 120 (FIG. 2D), and a metal layer 170 made of stainless steel is pasted through this. Match. (Fig. 2 (e))

Next, the rolled copper foil 130 in the via structure connection part 143 formation region was perforated, and the insulating layer 150 in the via structure connection part 143 formation region was perforated so as to reach the metal layer 170 side. A conductive material is disposed in the hole, and the rolled copper foil 130 side and the metal layer 170 side are electrically connected to conduct.
In this example, resist 182 is provided with an opening 182A for forming a connection portion 143 having a via structure on the wiring side by resist engraving (FIG. 2F), and the metal layer 170 is penetrated from the opening 182 by etching. . (Fig. 2 (g))
Next, the insulating layer 150 is opened from the opening 132A of the penetrating metal layer 170 so as to reach the metal layer 170 side (FIG. 3 (h)), and a conductive material is arranged in the opened hole, The rolled copper foil 130 side and the metal layer 170 side are electrically connected and conducted. (Fig. 3 (i))
The resist 182 is not particularly limited as long as it has a desired resolution and appropriate processability, but a resist with good processability (such as a dry film resist) is usually preferable.

Next, after removing the resist 182 (FIG. 3 (j)), it is formed into a wiring shape that forms a wiring portion made of the rolled copper foil 130 by an etching method using resist plate making. (FIG. 3 (k)) to FIG. 3 (l))
The resist 183 is not particularly limited as long as it has a desired resolution and appropriate processability, but a resist with good processability (for example, a dry film resist) is usually preferable.
As an etching solution for the rolled copper foil 130, a ferric chloride solution is usually used.

Next, the wiring portion made of the electrolytic copper foil 120 and the wiring portion made of the rolled copper foil 130 are covered with the protective film 190 while exposing a predetermined region including the ultrasonic bonding connection portion. (Fig. 3 (m))
Next, the outer shape of the metal layer 170 is processed by the etching method using resist plate making the insulating layer 150 as an etching stopper layer, and the resist (not shown) is removed. (Fig. 9 (n))
Next, in a state where the wiring side is covered with an etching resistant film (resist 184), the exposed insulating layer portion 150 is removed by etching. (Fig. 4 (o))
The insulating layer 150 is a polyimide resin and is etched with an organic alkali.
The resist 184 is not particularly limited as long as it has a desired resolution and appropriate processability, but a resist with good processability (such as a dry film resist) is usually preferable.

Next, after removing the resist 184 (FIG. 4 (p)),
A plating process is performed in which plating is performed on the exposed rolled copper foil surface and the exposed electrolytic copper foil surface, which serve as ultrasonic bonding connection portions. (Fig. 4 (q))
As the plating, those having good ultrasonic bonding properties are preferable. Usually, known Ni plating and Au plating are performed in this order, but are not limited thereto.
In this way, the wiring member of this example is formed.

In addition, the said manufacture example is one example and is not limited to this.
In some cases, in the manufacturing method of the wiring member of the present example, the rolled copper foil 130 in the via connection portion formation region is punched, and the insulating layer portion 150 in the via connection portion formation region reaches the metal layer 170 side. Drilling, arranging a conductive material in the drilled hole, electrically connecting the rolled copper foil 130 side and the metal layer 170 side (referred to as a connecting step), The step of forming a wiring shape for forming a wiring portion made of rolled copper foil by an etching method using resist plate-making (this is called a rolled copper foil wiring portion forming step) may be reversed in order.
Further, as shown in FIG. 5A, as in the case of the wiring member of the present example, the first wiring portion 510 and the second wiring portion 520 are used for wiring, and the first wiring portion 510 and the first wiring portion having different rigidity are provided. In addition to the form in which the second wiring part 520 is electrically connected by a conductive connection layer (not shown), as shown in FIG. 1 wiring portion 510, second wiring portion 520, and third wiring portion 530), and the first wiring portion 510 and the third wiring portion 530 are electrically connected to the second wiring portion 520, respectively. A form of electrical connection with a conductive connection layer (not shown) is also included.
As a manufacturing method in this case, for example, the same steps as the formation of the wiring portion made of the electrolytic copper foil 120 in the manufacturing method shown in FIGS. 2 to 3 are performed, and the first wiring portion 510 and the third wiring portion 530 are formed. In addition, each may be applied individually.
There may be a form having wiring composed of four or more wiring parts having different rigidity.

FIG. 1 (a) is a schematic view showing an arrangement state of wiring and a supporting base material in one example of the embodiment of the wiring member of the present invention, and FIG. 1 (b) is A11 in FIG. 1 (a). FIG. 1C is a diagram showing a cross section passing through B11-B21-B31 in FIG. 1A, and FIG. 1D is a diagram showing FIG. It is the figure which expanded the connection part 141 and showed the laminated structure through the connection layer 110. FIG. It is the figure which showed a part of process of the manufacturing method which manufactures the wiring member shown in FIG. FIG. 3 is a diagram showing a part of the process of the manufacturing method for manufacturing the wiring member shown in FIG. FIG. 4 is a diagram showing a part of the process of the manufacturing method for manufacturing the wiring member shown in FIG. It is a figure for demonstrating the other example of a wiring member of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 Connection layer 111, 113 Ni layer 112 Au layer 120 Electrolytic copper foil 120A Tip part 121, 122 Electrolytic copper foil wiring 130 Rolled copper foil 130A Connection part (it is also called a terminal part)
131-133 Rolled copper foil wiring 132A Connection opening 132B Connection part 141-143 Connection part 150 Insulating layer part 160 Plating part 170 Metal layer 170A Support base material 181-184 Resist 181A-183A (Resist) opening 190 Cover layer (protection) Also called layer)
510 1st wiring part 520 2nd wiring part 530 3rd wiring part

Claims (5)

A wiring member in which wiring is formed on a supporting base material, wherein the wiring is composed of two or more wiring portions having different rigidity, and the connection portions of the wiring portions having different rigidity are conductive connection layers. The support base material is made of a metal layer that expresses spring characteristics, is externally processed into a predetermined shape, forms the wiring via an insulating layer, and , the wiring member is a flexure is a member of the wireless suspension for a magnetic head suspension assembly, by the wiring, but connecting the slider and the control circuit, the wiring rolled copper wiring portion made of an electrolytic copper foil The magnetic head suspension slider is formed of a rolled copper foil at least for forming an ultrasonic bonding connection with the control circuit side of the wiring. Wire member characterized by forming the distal end side which is the side in the electrolytic copper foil.   The wiring member according to claim 1, wherein the conductive connection layer is formed by plating and stacking a Ni layer, an Au layer, and a Ni layer in this order.   The wiring member according to claim 1, wherein the metal layer that exhibits the spring characteristics is made of stainless steel. On the support base material which consists of a metal layer that expresses spring characteristics and is externally processed into a predetermined shape, the wiring part made of electrolytic copper foil and the wiring part made of rolled copper foil are interposed via an insulating layer. And a connection part between the wiring part made of electrolytic copper foil and the wiring part made of rolled copper foil is made into a laminated structure in which the wiring parts are laminated via a conductive connection layer, An ultrasonic bonding connection for electrical connection with the control circuit side by ultrasonic bonding is formed of rolled copper foil, and the tip side which is the slider side of the magnetic head suspension of the wiring is electrolyzed. it is formed by copper foil, a wireless suspension for a magnetic head suspension assembly flexure to manufacture, which is a member, a method for producing a flexure, in sequential order, (a) a on a surface of the rolled copper foil In accordance with the shape of the wiring to be formed, a wiring portion made of electrolytic copper foil is formed by laminating via a conductive connection layer that becomes an etching stopper layer when the rolled copper foil is etched from the rolled copper foil side. An electrolytic copper foil wiring portion forming step, and (b) an insulating layer portion in which an insulating layer and an adhesive layer are arranged in this order are provided on the wiring portion forming side made of the electrolytic copper foil, and the metal layer is bonded thereto There rows and combined Engineering degree paste, in tandem, to drilling the rolled copper foil (c) via connection portion formation region, reaching the insulating layer portion of the via connection portion formation region on the metal layer side A connecting step of electrically connecting the rolled copper foil side and the metal layer side to conduct electricity, and (d) by resist plate making Form the wiring shape to form the wiring part made of rolled copper foil by etching method. , Have rows and extent rolled copper foil wiring portion formed Engineering, further sequentially, (e) wiring portion made of an electrolytic copper foil, the wiring side consisting wiring portion made of rolled copper foil, of a predetermined including ultrasonic bonding connecting portion A protective film forming step of exposing a region and covering with a protective film; and (f) an outer shape processing step of performing an outer shape processing of the metal layer using the insulating layer portion as an etching stopper layer by an etching method using resist engraving. h) An etching removal step of etching and removing the insulating layer portion in the exposed region with the wiring side covered with an etching resistant film; and (i) an ultrasonic bonding connection portion. A method of manufacturing a flexure, comprising performing plating on the exposed rolled copper foil surface and the exposed electrolytic copper foil surface, respectively. A method of manufacturing a flexure according to claim 4, before Symbol a metal layer is stainless steel, the insulating layer, the adhesive layer, both, flexure method of manufacturing which is characterized by comprising a polyimide resin.

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