JP4479751B2 - Discharge amount adjustment method, liquid material discharge method, color filter manufacturing method, liquid crystal display device manufacturing method, and electro-optical device manufacturing method - Google Patents

Abstract

The invention provides an ejection rate measurement method, an ejection rate adjusting method, a liquid ejection method, a color filter manufacturing method, a manufacture method of the liquid display device and a manufacture method of the electric lighting device. The ejection rate measurement method for a device having a plurality of droplet ejection head columns mounted on a plurality of carriages includes the steps of (a) measuring an ejection rate of a liquid ejected from a droplet ejection head included in one of the plurality of droplet ejection head columns sandwiched between other two of the plurality of droplet ejection head columns, (b) sandwiching, after step (a), one of the plurality of droplet ejection head columns, which has not been sandwiched between other two of the plurality of droplet ejection head columns in step (a), between other two of the plurality of droplet ejection head columns, and measuring an ejection rate of a liquid ejected from a droplet ejection head included in one of the plurality of droplet ejection head columns sandwiched between other two of the plurality of droplet ejection head columns.

Description

  The present invention relates to a discharge amount measuring method, a discharge amount adjusting method, a liquid material discharge method, a color filter manufacturing method, a liquid crystal display device manufacturing method, and an electro-optical device manufacturing method. The present invention relates to a method for accurately measuring the ejection amount of ejected droplets.

  2. Description of the Related Art Conventionally, as a method for ejecting droplets onto a workpiece, a method for ejecting droplets using an ink jet droplet ejecting apparatus is known. The droplet discharge device moves along a table on which a workpiece such as a substrate is placed and the workpiece is moved in one direction, and a guide rail arranged in a direction perpendicular to the moving direction of the table at a position above the table. And a carriage. An ink jet head (hereinafter referred to as a droplet discharge head) is disposed on the carriage, and droplets are discharged onto the workpiece and applied.

  Various materials are used for the functional liquid to be applied by discharging the functional liquid into droplets after being discharged onto the workpiece. Many functional fluids change in viscosity with temperature, and fluid resistance changes as the viscosity changes. As the fluid resistance changes, the flow velocity of the functional liquid flowing through the flow path in the droplet discharge head changes. As the flow rate of the functional liquid changes, the discharge amount per dot fluctuates, and it is difficult to accurately measure the discharge amount.

  In order to solve this problem, Patent Document 1 discloses a method for accurately measuring the discharge amount per dot. According to this, after the droplet discharge device is installed in the chamber, the temperature and humidity in the chamber are adjusted to control the environment of the droplet discharge device and measure the discharge amount.

JP 2004-209429 A

  When the cavity of the droplet discharge head is pressurized using a piezoelectric element, part of the energy applied to the operation of the piezoelectric element is converted into heat, which causes the temperature of the droplet discharge head to rise. Further, when the piezoelectric element is not driven, the piezoelectric element does not generate heat, and the droplet discharge head dissipates heat, which causes the temperature of the droplet discharge head to fluctuate.

  When measuring the discharge amount, the discharge amount is affected by the temperature. Therefore, when the head temperature at the time of measurement is not measured under substantially the same temperature condition, there is a problem that the measurement accuracy is lowered.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
In the discharge amount measuring method according to this application example, the discharge amount of the liquid material discharged from the droplet discharge head of the droplet discharge head row in which a plurality of droplet discharge heads are arranged and mounted on a plurality of carriages is determined. A discharge amount measuring method for measuring, wherein a plurality of the droplet discharge head arrays are arranged, the liquid material is discharged from the droplet discharge head, and the droplet discharge head array in the droplet discharge head array A first measurement step of measuring the discharge amount of the liquid material discharged from the droplet discharge head sandwiched between and the first measurement step, and in the first measurement step, the other liquid After the liquid droplets are ejected by sandwiching the liquid droplet ejection head that was not sandwiched between the liquid droplet ejection heads by the other liquid droplet ejection heads, the liquid material ejected from the liquid droplet ejection heads A second measuring step for measuring the discharge amount It is characterized in.

  According to this discharge amount measuring method, the measurement of the discharge amount is divided into the first measurement step and the second measurement step.

  When the liquid is discharged as droplets from the nozzle, the liquid is pressurized. By pressurizing the liquid, the pressure of the liquid is increased. At this time, the liquid is in contact with the gas at the nozzle. Since the pressure of the liquid becomes higher than the pressure of the gas, a part of the liquid becomes droplets and is discharged into the gas.

  When pressurizing a liquid, a part of the energy to pressurize is converted into heat. Then, the temperature of the droplet discharge head rises. Many liquids have low viscosity because the kinetic energy of molecules constituting the liquid increases as the temperature rises. When the viscosity of the liquid material changes, the fluid resistance when passing through a flow path such as a nozzle changes. And the discharge amount of the liquid discharged from the nozzle changes.

  In the first measurement step, the liquid material is discharged by arranging a plurality of droplet discharge head arrays. At this time, the droplet ejection head row is sandwiched between other droplet ejection head rows, and the droplet ejection head row is not sandwiched between other droplet ejection heads. There is a droplet discharge head. Then, since the temperature of each droplet discharge head rises when discharging, the temperature of all the droplet discharge heads to be discharged rises.

  The droplet discharge head that is not sandwiched between the other droplet discharge head rows is in contact with the air flow and easily dissipates heat, so that the temperature is difficult to rise. On the other hand, since the temperature of the liquid droplet ejection head array sandwiched between other liquid droplet ejection head arrays also rises in temperature, the temperature of the liquid droplet ejection head arrays is difficult to dissipate. It has become. That is, a droplet discharge head that belongs to a droplet discharge head row that is sandwiched between other droplet discharge head rows is a liquid that belongs to a droplet discharge head row that is not sandwiched between other droplet discharge head rows. Compared with the droplet discharge head, the temperature is likely to rise.

  In this measurement method, in the first measurement step, the ejection amount when ejecting from a droplet ejection head belonging to a droplet ejection head row that is sandwiched between other droplet ejection head rows is measured. In the second measurement step, the liquid material was discharged by sandwiching the droplet discharge head row that was not sandwiched between the other droplet discharge head rows in the first measurement step. After that, the discharge amount is measured. That is, in the first measurement process and the second measurement process, the discharge amount when discharging from the droplet discharge head belonging to the droplet discharge head row sandwiched between the other droplet discharge head rows is measured. . Therefore, the droplet discharge head can measure the discharge amount at substantially the same temperature. As a result, it is possible to accurately measure the discharge amount.

[Application Example 2]
In the discharge amount measuring method according to the application example, the first measurement step and the second measurement step include a pre-discharge standby step in which the droplet discharge head scheduled to measure the discharge amount waits, and the liquid state A discharge step for measurement for discharging the body, and a measurement step for measuring the discharge amount of the discharged liquid material, wherein the droplet discharge head is warm-up driven in the standby step before discharge. And

  According to this discharge amount measuring method, in the standby step before discharge, the droplet discharge head is warmed up to raise the temperature of the droplet discharge head. Then, the ejection amount in a state where the temperature of the droplet ejection head is high is measured. When the liquid material is discharged onto the workpiece, the droplet discharge head discharges the liquid material, so that the temperature of the droplet discharge head rises. In other words, the droplet discharge head can measure the discharge amount at substantially the same temperature as when the liquid material is discharged onto the work by being warmed up. Therefore, it is possible to accurately measure the discharge amount when discharging the liquid material onto the workpiece.

[Application Example 3]
In the discharge amount measuring method according to the application example, the warm-up driving is performed by driving to the extent that the liquid material is not discharged from the droplet discharge head, and performing the warm-up drive.

  According to this discharge amount measuring method, the warm-up drive is performed to such an extent that droplets are not discharged from the nozzle. Accordingly, since droplets are not discharged unnecessarily, a resource-saving discharge amount measuring method can be achieved.

[Application Example 4]
In the discharge amount measuring method according to the application example described above, the warm-up driving is performed at a place substantially the same as a place where the liquid material is discharged in the measurement discharge step.

  According to this discharge amount measuring method, after the droplet discharge head is warm-up driven, the location at which the droplet discharge head discharges the liquid material for measurement and the location for warm-up drive are substantially the same location. It is not necessary to move to a place where the liquid material is discharged for measurement. Accordingly, since the droplet discharge head can be discharged without cooling while moving the droplet discharge head, the dispersion at the temperature of the droplet discharge head can be reduced and the discharge amount can be measured. As a result, the discharge amount can be measured with high accuracy.

[Application Example 5]
The discharge amount measuring method according to the application example, wherein in the first measurement step, the discharge in all the droplet discharge heads to be measured among the droplet discharge heads mounted on one carriage. After measuring the amount, the discharge amount in all the droplet discharge heads to be measured among the droplet discharge heads mounted on the other carriages is measured and sequentially mounted on each carriage. In the second measurement step, all of the droplet discharge heads mounted on one carriage are to be measured in the second measurement step. After measuring the discharge amount in the droplet discharge head, the discharge in all the droplet discharge heads to be measured among the droplet discharge heads mounted on another carriage Was measured, successively, and measuring the ejection rate in all of the droplet ejection heads is expected to measure mounted on each said carriage.

  According to this discharge amount measuring method, after all the discharge amounts in the droplet discharge heads mounted on one carriage are measured, the carriages are sequentially changed, and the droplet discharge heads mounted on each carriage. The amount of discharge is measured. Therefore, measurement is performed using a method that reduces the amount of movement of the carriage. As a result, since the energy for moving the carriage can be reduced, a resource-saving measurement method can be achieved.

[Application Example 6]
In the discharge amount measuring method according to the application example, a plurality of rows of the droplet discharge heads are formed by the plurality of droplet discharge head columns mounted on the plurality of carriages, and in the first measurement step, After measuring the discharge amount of a part of the droplet discharge heads to be measured mounted on one carriage, the inside of the droplet discharge heads mounted on another carriage Measuring the discharge amount in the droplet discharge heads belonging to the row of the droplet discharge heads for which the discharge amount has been measured, the droplet discharge heads located close to the measured droplet discharge head, and sequentially Measuring the discharge amount of the droplet discharge heads to be measured mounted on each carriage, and measuring the droplet discharge amount to be measured mounted on one carriage in the second measurement step. After measuring the discharge amount of a part of the droplet discharge heads, the droplets belong to the row of the droplet discharge heads measured for the discharge amount among the droplet discharge heads mounted on another carriage. The droplet discharge head, which measures the discharge amount of the droplet discharge head located near the measured droplet discharge head, and sequentially mounts the droplets to be measured mounted on each carriage. The discharge amount in the discharge head is measured, and the first measurement step and the second measurement step are repeated to measure the discharge amount of the droplet discharge head in all the rows to be measured. And

  According to this discharge amount measuring method, after measuring the discharge amount in a droplet discharge head located in a close place in the droplet discharge heads belonging to the same row, the measurement is sequentially performed by changing the row. When measuring the discharge amount of the droplet discharge head, the droplet discharge head is measured in an environment where the temperature is controlled. At this time, the temperature often changes with a large period. At this time, the discharge amount of the droplet discharge head located in the vicinity of the row where the droplet discharge head is located is continuously measured. Therefore, the heads at close positions in the same row can measure the ejection amount with an error due to the influence of substantially the same temperature.

[Application Example 7]
In the discharge amount measuring method according to the application example, a plurality of rows of the droplet discharge heads are formed by the plurality of droplet discharge head columns mounted on the plurality of carriages, and in the first measurement step, The discharge amount of a part of the droplet discharge heads to be measured mounted on one carriage was measured, and in the second measurement step, the discharge amount was measured in the first measurement step. A discharge amount in the droplet discharge head that is located next to the droplet discharge head and belongs to the row of the droplet discharge head is measured, and the first measurement step and the second measurement step are repeated, Among the droplet discharge heads belonging to the row, the discharge amount of all the droplet discharge heads to be measured is measured, and the droplet discharge heads that are not measured are switched to the row to which the droplet discharge head belongs. 1 measurement process By repeating said second measuring step, and measuring the discharge amount of the liquid drop ejecting head.

  According to this discharge amount measuring method, after measuring the discharge amount in one droplet discharge head, the discharge amount of the droplet discharge head located next to the measured droplet discharge head is measured. Therefore, even when there is a change in the ambient temperature, the heads at positions close to each other in the same row can measure the ejection amount with an error due to the influence of substantially the same temperature.

[Application Example 8]
In the discharge amount adjusting method according to this application example, the discharge amount of the liquid material discharged from the droplet discharge head in the droplet discharge head row in which a plurality of droplet discharge heads are arranged and mounted on a plurality of carriages is determined. A discharge amount adjusting method for adjusting, wherein a plurality of the droplet discharge head arrays are arranged, the liquid material is discharged from the droplet discharge head, and the droplet discharge head array in the droplet discharge head array A first measurement step of measuring the discharge amount of the liquid material discharged from the droplet discharge head sandwiched between the first and second steps of adjusting the discharge amount of the droplet discharge head measured in the first measurement step One adjustment step and after the first adjustment step, and in the first measurement step, the droplet discharge heads that are not sandwiched between the other droplet discharge head rows are connected to the other droplet discharge head rows. And after discharging the liquid material, A second measurement step for measuring the discharge amount of the liquid material discharged from the droplet discharge head, and a second adjustment step for adjusting the discharge amount of the droplet discharge head measured in the second measurement step It is characterized by having.

  According to this discharge amount adjustment method, after adjusting the droplet discharge head measured in the first measurement step in the first adjustment step, the droplet discharge head measured in the second measurement step is used as the second adjustment step. Have been adjusted. The discharge amount is adjusted in the first adjustment step and the second adjustment step based on the measurement result obtained by measuring the discharge amount with high accuracy in the first measurement step and the second measurement step. Therefore, the discharge amount can be adjusted with high accuracy in the first adjustment process and the second adjustment process.

[Application Example 9]
A discharge amount adjusting method according to the application example, wherein the first measurement step and the first adjustment step are repeated to make the discharge amount close to a target discharge amount, and the second measurement. It has a 2nd discharge amount adjustment process which repeats a process and the said 2nd adjustment process, and makes the said discharge amount close to a target discharge amount, It is characterized by the above-mentioned.

  This discharge amount adjustment method includes a first discharge amount adjustment step and a second discharge amount adjustment step. In the first discharge amount adjustment step, the discharge amount is adjusted in the first adjustment step based on the measurement result of the discharge amount measured in the first measurement step. Next, the discharge amount is brought close to the target discharge amount by repeating the first measurement step and the first adjustment step. Therefore, the discharge amount can be adjusted with high accuracy compared to a method in which the adjustment process is performed only once.

  Since the second discharge amount adjustment is performed in the same manner, the discharge amount can be adjusted with higher accuracy than the method in which the adjustment process is performed only once. As a result, it is possible to provide a method capable of accurately adjusting the discharge amount.

[Application Example 10]
In the discharge amount adjusting method according to the application example, the first measurement step and the second measurement step include a pre-discharge standby step in which the liquid droplet discharge head scheduled to measure the discharge amount, and the liquid state A discharge step for measurement for discharging the body, and a measurement step for measuring the discharge amount of the discharged liquid material, wherein the droplet discharge head is warm-up driven in the standby step before discharge. And

  According to this discharge amount adjusting method, in the standby step before discharge, the droplet discharge head is warmed up to raise the temperature of the droplet discharge head. Then, the ejection amount in a state where the temperature of the droplet ejection head is high is measured. When the liquid material is discharged onto the workpiece, the droplet discharge head discharges the liquid material, so that the temperature of the droplet discharge head rises. In other words, the droplet discharge head adjusts the discharge amount after measuring the discharge amount at substantially the same temperature as when the liquid material is discharged onto the work by driving warm-up. Accordingly, it is possible to accurately adjust the discharge amount when discharging the liquid material onto the workpiece.

[Application Example 11]
In the discharge amount adjusting method according to the application example described above, the warm-up driving is performed by driving the liquid material to such an extent that the liquid material is not discharged from the droplet discharge head.

  According to this discharge amount adjusting method, the warm-up drive is performed to such an extent that droplets are not discharged from the nozzle. Therefore, since the droplets are not discharged unnecessarily, a resource-saving discharge amount adjustment method can be achieved.

[Application Example 12]
In the discharge amount adjusting method according to the application example, the warm-up driving is performed at substantially the same place as the place where the liquid material is discharged in the measurement discharge step.

  According to this discharge amount adjustment method, after the droplet discharge head is warm-up driven, the location where the droplet discharge head discharges the liquid for measurement and the location where the warm-up drive is performed are substantially the same. It is not necessary to move to a place where the liquid material is discharged for measurement. Accordingly, since the liquid droplet ejection head can be ejected without being cooled during the movement of the liquid droplet ejection head, the dispersion at the temperature of the liquid droplet ejection head can be reduced and the ejection amount can be measured. As a result, the discharge amount can be measured with high accuracy.

[Application Example 13]
In the discharge amount adjustment method according to the application example, in the first discharge amount adjustment step, the droplet discharge head belonging to the droplet discharge head row sandwiched between the droplet discharge head rows, and the liquid A discharge amount of the liquid material discharged from the droplet discharge head belonging to the droplet discharge head row not sandwiched between the droplet discharge head rows is adjusted.

  According to this discharge amount adjustment method, in the first measurement step, the droplet discharge heads belonging to the droplet discharge head row not sandwiched between other droplet discharge heads are the first discharge amount adjustment step and the second discharge amount. In both of the adjustment steps, the discharge amount is adjusted.

  In the first measurement step, the discharge amount of the droplet discharge heads belonging to the droplet discharge head row that is not sandwiched between the other droplet discharge head rows is adjusted in the first discharge amount adjustment step. Then, after adjusting the discharge amount of the droplet discharge head to be close to the target discharge amount, the discharge amount is adjusted again in the second discharge amount adjustment step. In the second discharge amount adjustment step, the temperature of the droplet discharge head rises higher than the temperature in the first discharge amount adjustment step. Then, the droplet discharge head can be adjusted with a smaller number of repetitions compared to the case where the droplet discharge head is not adjusted in the first discharge amount adjustment step. As a result, an adjustment method with good productivity can be achieved.

[Application Example 14]
In the discharge amount adjusting method according to the application example, at least one of a step including the first measurement step and the first adjustment step, and a step including the second measurement step and the second adjustment step. In the process, a plurality of measurement steps and adjustment steps are performed, and the adjustment step includes a coarse adjustment step and a fine adjustment step.

  Here, the difference between the coarse adjustment process and the fine adjustment process is the magnitude of the discharge amount when adjusting. In the coarse adjustment process, the discharge amount is largely changed as compared with the fine adjustment process. According to this discharge amount adjustment method, coarse adjustment and fine adjustment are performed. At this time, compared with the case where the fine adjustment is repeated and the discharge amount is adjusted little by little, the rough adjustment makes it possible to perform the combination of the step of changing the discharge amount largely and the fine adjustment step with a smaller number of times. It is often adjusted to the discharge amount. Therefore, adjustment can be performed with high productivity.

[Application Example 15]
In the discharge amount adjusting method according to the application example, in the measurement step performed before the coarse adjustment step, the amount of the liquid material to be discharged is discharged in the measurement step performed before the fine adjustment step. It is characterized in that the amount is smaller than the amount of the liquid.

  According to this discharge amount adjusting method, the coarse adjustment step measures the discharge amount with a smaller discharge amount than the fine adjustment step. Accordingly, it is possible to reduce the consumption of the discharged liquid material. As a result, a resource-saving adjustment method can be achieved.

[Application Example 16]
In the discharge amount adjusting method according to the application example described above, in the measurement step performed before the coarse adjustment step, the number of times the liquid material is discharged from the droplet discharge head per unit time is the number before the fine adjustment step. In the measurement process performed in step (b), the number of times is larger than the number of times the liquid material is ejected from the droplet ejection head per unit time.

  According to this discharge amount adjusting method, the number of times of discharge per unit time is increased in the coarse adjustment step compared to the fine adjustment step. In the coarse adjustment process and the fine adjustment process, when the discharge amount is measured by performing approximately the same number of discharges, the coarse adjustment process can be performed in a shorter time. Therefore, it is possible to adjust with high productivity.

[Application Example 17]
In the discharge amount adjusting method according to the application example, in the first adjustment step, the discharge from all the droplet discharge heads to be measured among the droplet discharge heads mounted on one carriage. After measuring the amount, among the droplet discharge heads mounted on the other carriages, the discharge amount in all the droplet discharge heads that are to be adjusted is adjusted and sequentially mounted on each carriage. In the second adjustment step, all of the droplet discharge heads mounted on one carriage are scheduled to be adjusted in the second adjustment step. After adjusting the discharge amount in the droplet discharge head, the discharge in all the droplet discharge heads to be adjusted among the droplet discharge heads mounted on another carriage Adjust sequentially and adjusting measuring discharge amounts in all of the droplet ejection heads is expected to adjust mounted on each said carriage.

  According to this discharge amount adjusting method, after measuring all the discharge amounts in the droplet discharge heads mounted on one carriage, the droplet discharge heads mounted on each carriage are sequentially changed. The discharge amount is adjusted. Therefore, adjustment is performed using a method that reduces the amount of movement of the carriage. As a result, since the energy for moving the carriage can be reduced, a resource-saving adjustment method can be achieved.

[Application Example 18]
In the discharge amount adjusting method according to the application example described above, a plurality of rows of the droplet discharge heads are formed by the plurality of droplet discharge head columns mounted on the plurality of carriages, and in the first adjustment step After adjusting the discharge amount of some of the droplet discharge heads to be adjusted mounted on one carriage, the inside of the droplet discharge head mounted on another carriage Adjusting the discharge amount of a part of the droplet discharge heads belonging to the row of the droplet discharge heads whose discharge amount has been adjusted, and sequentially discharging the droplet discharge heads to be adjusted mounted on the carriages In the second adjustment step, after adjusting the discharge amount of a part of the droplet discharge heads to be adjusted mounted on one carriage in the second adjustment step, the second adjustment step is performed. Among the droplet discharge heads mounted on the wedge, the discharge amount in a part of the droplet discharge heads belonging to the row of the droplet discharge heads whose discharge amount is adjusted is adjusted and sequentially mounted on each carriage The droplet discharge heads in all the rows scheduled to be adjusted by adjusting the discharge amount in the droplet discharge heads to be adjusted and repeating the first adjustment step and the second adjustment step. The amount of discharge is adjusted.

  According to this discharge amount adjustment method, after measuring the discharge amount in a droplet discharge head located in a nearby place in the droplet discharge heads belonging to the same row, the measurement is sequentially performed by changing the row. When measuring the discharge amount of the droplet discharge head, the droplet discharge head is measured in an environment where the temperature is controlled. At this time, the temperature often changes with a large period. At this time, the discharge amount of a droplet discharge head located in the vicinity of a row of a droplet discharge head is continuously adjusted. Therefore, the heads at close positions in the same row can adjust the ejection amount with an error due to the influence of substantially the same temperature.

[Application Example 19]
In the discharge amount adjusting method according to the application example described above, a plurality of rows of the droplet discharge heads are formed by the plurality of droplet discharge head columns mounted on the plurality of carriages, and in the first adjustment step The discharge amount of a part of the droplet discharge heads to be adjusted mounted on one carriage is adjusted, and the second adjustment step is adjusted in the first adjustment step. The discharge amount in the droplet discharge heads located next to the droplet discharge heads and belonging to the row of the droplet discharge heads is adjusted, and the first adjustment step and the second adjustment step are repeated to obtain a predetermined value. Adjusting the discharge amount in the droplet discharge head belonging to the row, switching to the row to which the non-adjusted droplet discharge head belongs, and repeating the first adjustment step and the second adjustment step, Droplet discharge And adjusting the discharge amount in the head.

  According to this discharge amount adjusting method, after adjusting the discharge amount in one droplet discharge head, the discharge amount of the droplet discharge head located next to the adjusted droplet discharge head is adjusted. Therefore, even when there is a change in the ambient temperature, the heads at positions close to each other in the same row can adjust the ejection amount with an error due to the influence of substantially the same temperature.

[Application Example 20]
In the discharge amount adjusting method according to this application example, the discharge amount of the liquid material discharged from the droplet discharge head in the droplet discharge head row in which a plurality of droplet discharge heads are arranged and mounted on a plurality of carriages is determined. A discharge amount adjusting method for adjusting, wherein a plurality of the droplet discharge head arrays are arranged, the liquid material is discharged from the droplet discharge head, and the droplet discharge head array in the droplet discharge head array A first measurement step of measuring the discharge amount of the liquid material discharged from the droplet discharge head sandwiched between the first and second steps of adjusting the discharge amount of the droplet discharge head measured in the first measurement step One adjustment step and after the first adjustment step, and in the first measurement step, the droplet discharge heads that are not sandwiched between the other droplet discharge head rows are connected to the other droplet discharge head rows. And after discharging the liquid material, A second measurement step for measuring the discharge amount of the liquid material discharged from the droplet discharge head, and a second adjustment step for adjusting the discharge amount of the droplet discharge head measured in the second measurement step And repeating the first measurement step and the first adjustment step to repeat the first discharge amount adjustment step of bringing the discharge amount close to the target discharge amount, the second measurement step, and the second adjustment step. And a second discharge amount adjusting step for bringing the discharge amount close to the target discharge amount, and the first discharge amount adjusting step belongs to the droplet discharge head row sandwiched between the droplet discharge head rows. In addition to the droplet discharge head, the discharge amount of the liquid material discharged from the droplet discharge head belonging to the droplet discharge head row not sandwiched by the droplet discharge head row is roughly adjusted. To do.

  According to this discharge amount adjustment method, the droplet discharge head can be adjusted with a smaller number of repetitions than when the droplet discharge head is not adjusted in the first discharge amount adjustment step. As a result, an adjustment method with good productivity can be achieved.

[Application Example 21]
In the discharge amount adjustment method according to the application example, in the first discharge amount adjustment step, the discharge amount of the liquid material discharged from the droplet discharge head not sandwiched between the droplet discharge head rows is It is characterized in that the discharge amount is adjusted to be smaller than the discharge amount of the liquid material discharged from the droplet discharge heads sandwiched between the droplet discharge head rows.

  According to this discharge amount adjustment method, adjustment is made so that the discharge amount of the liquid material discharged from the droplet discharge heads not sandwiched between the droplet discharge head rows is reduced. Since the droplet discharge heads not sandwiched between the droplet discharge head rows are affected by the wind, the temperature is lowered. And when temperature falls, discharge amount decreases. After adjusting to discharge the liquid material of the target discharge amount, when measuring the discharge amount sandwiched between other droplet discharge heads, the temperature of the droplet discharge head becomes high, so the discharge amount is the target The discharge amount will be exceeded.

  Here, the discharge amount of the liquid material discharged from the droplet discharge heads not sandwiched between the droplet discharge head rows is adjusted to be smaller than the target discharge amount. Therefore, when measuring the discharge amount sandwiched between other droplet discharge heads, the adjustment can be started from the discharge amount close to the target discharge amount. As a result, since adjustment can be performed with a small number of adjustments, adjustment can be performed with high productivity.

[Application Example 22]
In the discharge amount adjusting method according to the application example, in the second measurement step, the discharge amount of the liquid material discharged from the droplet discharge heads sandwiched between the droplet discharge head rows may be the first amount. After changing the setting so that a discharge amount smaller than the discharge amount set in the discharge amount adjustment step is discharged, the liquid material is discharged, and the discharge amount is adjusted in the second adjustment step. To do.

  According to this discharge amount adjustment method, adjustment is made so that the discharge amount of the liquid material discharged from the droplet discharge heads not sandwiched between the droplet discharge head rows is smaller than the target discharge amount. Therefore, when measuring the discharge amount sandwiched between other droplet discharge heads, the adjustment can be started from the discharge amount close to the target discharge amount. As a result, since adjustment can be performed with a small number of adjustments, adjustment can be performed with high productivity.

[Application Example 23]
The liquid material ejection method according to this application example is a liquid material ejection method in which a liquid material is ejected from a droplet ejection head onto a workpiece, the ejection amount adjusting step for adjusting the ejection amount, and droplets on the workpiece. And an application step for discharging, wherein the adjustment is performed using the discharge amount adjustment method described in the application example.

  According to this liquid material discharge method, after measuring the discharge amount, by adjusting the discharge amount, the discharge amount is set to a desired discharge amount and discharged onto the workpiece. Since the discharge amount is adjusted based on the measurement value of the discharge amount measured with high accuracy, the discharge amount discharged onto the workpiece can be discharged with the discharge amount adjusted with high accuracy. As a result, the discharge amount can be discharged onto the workpiece with high accuracy.

[Application Example 24]
A color filter manufacturing method according to this application example is a color filter manufacturing method including a step of applying and forming color ink on a substrate, and using the liquid discharge method according to the application example described above, The color ink is ejected and applied to the substrate.

  According to this color filter manufacturing method, since the color ink discharge amount is discharged and applied with high accuracy, the color filter can be applied with high accuracy.

[Application Example 25]
The manufacturing method of the liquid crystal display device according to this application example includes the steps of forming an alignment film on the first substrate and the second substrate, and sandwiching the liquid crystal between the first substrate and the second substrate. A method of manufacturing a liquid crystal display device, comprising: discharging a material of the alignment film onto at least one of the first substrate and the second substrate using the liquid discharge method described in the application example. The alignment film is formed by solidifying after coating.

  According to the method for manufacturing a liquid crystal display device, since the discharge amount in the alignment film material is discharged and applied with high accuracy, the liquid crystal display device manufacturing method in which the application amount in the alignment film material is applied with high accuracy is provided. be able to.

[Application Example 26]
A method of manufacturing a liquid crystal display device according to this application example includes a step of forming a liquid crystal between a first substrate and a second substrate after applying the liquid crystal to the first substrate. A manufacturing method is characterized in that the liquid crystal is discharged and applied to the first substrate by using the liquid discharge method described in the application example.

  According to this method for manufacturing a liquid crystal display device, since the liquid crystal discharge amount is discharged and applied with high accuracy, a liquid crystal display device manufacturing method in which the liquid crystal application amount can be applied with high accuracy can be obtained.

[Application Example 27]
A method for manufacturing an electro-optical device according to this application example is a method for manufacturing an electro-optical device including a step of forming a light-emitting element by applying a light-emitting element forming material to a substrate and then solidifying the material. The light emitting element forming material is discharged and applied onto the substrate using the liquid material discharge method described in 1. above.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the light-emitting element forming material is accurately discharged and applied, the method of manufacturing the electro-optical device in which the light-emitting element forming material is applied with high accuracy is provided. be able to.

[Application Example 28]
A method for manufacturing an electro-optical device according to this application example is a method for manufacturing an electro-optical device including a step of forming an electrode by applying a liquid electrode material to a substrate and then solidifying the electrode material. The electrode material of the liquid material is discharged and applied to the substrate using the liquid material discharge method described in 1.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the liquid electrode material is accurately discharged and applied, the electro-optical device in which the electrode material is formed by applying the electrode material application amount with high accuracy It can be set as the manufacturing method of this.

[Application Example 29]
A method for manufacturing an electro-optical device according to this application example is a method for manufacturing an electro-optical device including a step of forming a wiring by applying a liquid wiring material to a substrate and then solidifying the substrate. The wiring material of the liquid material is discharged and applied to the substrate using the liquid material discharging method described in 1.

  According to this method for manufacturing an electro-optical device, since the discharge amount of the wiring material of the liquid material is discharged and applied with high accuracy, the application amount of the wiring material is applied with high accuracy and the wiring is formed. It can be set as the manufacturing method of this.

[Application Example 30]
A method of manufacturing an electro-optical device according to this application example is a method of manufacturing an electro-optical device including a step of forming a semiconductor by applying a liquid semiconductor material to a substrate, solidifying the substrate, and heating the substrate. The liquid material discharge method described in the above application example is used to discharge and apply the liquid semiconductor material to the substrate.

  According to this method of manufacturing an electro-optical device, since the discharge amount of the liquid semiconductor material is accurately discharged and applied, the electro-optical device in which the semiconductor material is applied with high accuracy and the semiconductor is formed It can be set as the manufacturing method of this.

Hereinafter, embodiments will be described with reference to the drawings.
In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.
(First embodiment)
In the present embodiment, a droplet discharge device and a characteristic example when a liquid material is discharged as a droplet using the droplet discharge device will be described with reference to FIGS.

(Droplet discharge device)
First, a droplet discharge device 1 that discharges and applies droplets to a workpiece will be described with reference to FIGS. There are various types of droplet discharge devices, but a device using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can eject fine droplets.

FIG. 1 is a schematic perspective view showing the configuration of the droplet discharge device. A functional liquid is discharged and applied by the droplet discharge device 1.
As shown in FIG. 1, the droplet discharge device 1 includes a base 2 formed in a rectangular parallelepiped shape. In the present embodiment, the longitudinal direction of the base 2 is the Y direction, and the direction orthogonal to the Y direction is the X direction.

  On the upper surface 2a of the base 2, a pair of guide rails 3a, 3b extending in the Y direction is provided so as to protrude over the entire width in the Y direction. On the upper side of the base 2, a stage 4 is attached as a table constituting a scanning means having a linear motion mechanism (not shown) corresponding to the guide rails 3 a and 3 b. The linear movement mechanism of the stage 4 is, for example, a screw type linear movement mechanism including a screw shaft (drive shaft) extending in the Y direction along the guide rails 3a and 3b and a ball nut screwed to the screw shaft. The drive shaft is connected to a Y-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in units of steps. When a drive signal corresponding to a predetermined number of steps is input to the Y-axis motor, the Y-axis motor rotates forward or reversely, and the stage 4 is predetermined along the Y direction by an amount corresponding to the same number of steps. Forward or backward at a speed of (scan in the Y direction).

  Further, a main scanning position detector 5 is disposed on the upper surface 2a of the base 2 in parallel with the guide rails 3a and 3b so that the position of the stage 4 can be measured.

  A placement surface 6 is formed on the upper surface of the stage 4, and a suction-type substrate chuck mechanism (not shown) is provided on the placement surface 6. When a substrate 7 as a workpiece is placed on the placement surface 6, the substrate 7 is positioned and fixed at a predetermined position on the placement surface 6 by a substrate chuck mechanism.

  A pair of support bases 8a and 8b are erected on both sides of the base 2 in the X direction, and a guide member 9 extending in the X direction is installed on the pair of support bases 8a and 8b.

  On the upper side of the guide member 9, a storage tank 10 for storing the liquid to be discharged is provided. On the other hand, a guide rail 11 extending in the X direction is provided below the guide member 9 so as to protrude over the entire width in the X direction.

  The carriage 12 arranged so as to be movable along the guide rail 11 is composed of six carriages, a first carriage 12a to a sixth carriage 12f. Each of the carriages 12a to 12f has a prismatic shape whose bottom surface is a substantially parallelogram. Is formed. Each of the carriages 12a to 12f includes a linear motion mechanism, and each of the carriages 12a to 12f is individually movable. The linear motion mechanism is, for example, a screw type linear motion mechanism including a screw shaft (drive shaft) extending in the X direction along the guide rail 11 and a ball nut screwed to the screw shaft. The motor is connected to an X-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in steps. When a drive signal corresponding to a predetermined number of steps is input to the X-axis motor, the X-axis motor rotates forward or backward, and the carriage 12 moves forward or backward along the X direction by the amount corresponding to the same number of steps. Move (scan in X direction). A sub-scanning position detection device 13 is arranged between the guide member 9 and the carriage 12 so that the positions of the carriages 12a to 12f can be measured. A droplet discharge head 14 is provided on the lower surface of the carriage 12 (the surface on the stage 4 side).

  A cleaning unit 15 is disposed on the upper side of the base 2 and on one side of the stage 4 (the direction opposite to the Y direction in the drawing). The cleaning unit 15 includes a maintenance stage 16, a first flushing unit 17, a second flushing unit 18, a capping unit 19, a wiping unit 20, a weight measuring device 21, and the like disposed on the maintenance stage 16. Yes.

  The maintenance stage 16 is located on the guide rails 3 a and 3 b and includes a linear motion mechanism similar to that of the stage 4. Then, the position is detected using a maintenance stage position detector (not shown) and moved by a linear motion mechanism, so that it can be moved to a desired place and stopped. Then, the maintenance stage 16 moves along the guide rails 3a and 3b, so that the first flushing unit 17, the second flushing unit 18, the capping unit 19, and the wiping unit 20 are disposed at positions facing the droplet discharge heads 14. Any one of the weight measuring devices 21 is arranged.

  The first flushing unit 17 and the second flushing unit 18 are devices that receive droplets ejected from the droplet ejection head 14 when the flow path in the droplet ejection head 14 is washed. When the functional liquid in the liquid droplet ejection head 14 is volatilized, the viscosity of the functional liquid is increased, so that it is difficult to eject the functional liquid. In this case, in order to remove the functional liquid having a high viscosity from the droplet discharge head 14, the droplet discharge head 14 discharges the droplets for cleaning. The function of receiving the droplets is performed by the first flushing unit 17 and the second flushing unit 18.

  The capping unit 19 is a device having a function of covering the droplet discharge head 14 and a function of sucking the functional liquid of the droplet discharge head 14. The liquid droplets ejected from the liquid droplet ejection head 14 may be volatile. When the solvent of the functional liquid present in the liquid droplet ejection head 14 volatilizes from the nozzle, the viscosity of the functional liquid changes and the nozzle is clogged. Sometimes. The capping unit 19 is configured to prevent the nozzle from being clogged by covering the droplet discharge head 14.

  Further, when solid matter is mixed into the droplet discharge head 14 and the droplet cannot be discharged, the functional liquid and solid matter inside the droplet discharge head 14 are sucked and removed. And nozzle clogging is eliminated.

  The wiping unit 20 is a device that wipes the nozzle plate on which the nozzles of the droplet discharge head 14 are arranged. The nozzle plate is a member disposed on the surface of the droplet discharge head 14 that faces the substrate 7. When droplets adhere to the nozzle plate, the droplets adhering to the nozzle plate may come into contact with the substrate 7, and the droplets may adhere to an unexpected location on the substrate 7.

  Further, when a droplet is attached around the nozzle, the droplet attached to the nozzle plate comes into contact with the discharged droplet, and the trajectory of the discharged droplet is bent. Therefore, the place to apply may be different from the place to apply. The wiping unit 20 prevents droplets from adhering to unscheduled locations on the substrate 7 by wiping the nozzle plate.

  The weight measuring device 21 is provided with twelve electronic balances, and a tray is disposed on each electronic balance. Three electronic balances are arranged in one row and are formed substantially in the Y direction, and this row is arranged in four rows. Then, the droplet is discharged from the droplet discharge head 14 to the tray, and the electronic balance measures the weight of the droplet. The tray is provided with a sponge-like absorber so that the ejected liquid droplets bounce and do not come out of the tray. This electronic balance measures the weight of the tray before and after the droplet discharge head 14 discharges droplets. And the weight of the droplet to discharge can be measured by calculating the difference of the weight of the saucer before and after discharge.

  A first flushing unit 17 and a second flushing unit 18 are disposed on both sides of the weight measuring device 21. While the discharge amount discharged from some of the droplet discharge heads 14 is being measured, the other droplet discharge heads 14 are positioned at positions facing the first flushing unit 17 or the second flushing unit 18. Thus, it is possible to discharge droplets.

  The droplet discharge device 1 includes support columns 22 at four corners, and an air control device 23 at the top (upper side in the figure). The air control device 23 includes a fan, a filter, a cooling / heating device, a humidity adjusting device, and the like. The fan (blower) takes in the air in the factory, passes through the filter, removes dust and dirt in the air, and supplies purified air.

  The air conditioner is a device that controls the temperature of the supplied air so that the atmospheric temperature of the droplet discharge device 1 is maintained within a predetermined temperature range. The humidity adjusting device is a device that controls the humidity of air supplied by dehumidifying or humidifying air so that the atmospheric humidity of the droplet discharge device 1 is maintained within a predetermined humidity range.

  A sheet 24 is disposed between the four support columns 22 to block the air flow. Air supplied from the air control device 23 flows from the air control device 23 toward the floor 25 (in the direction opposite to the Z direction in the figure), and dust and dirt in the space surrounded by the sheet 24 move toward the floor 25. To flow. Thereby, it is difficult for dust and dirt to adhere to the substrate 7.

  Further, the sheet 24 restricts the flow of air, so that the temperature and humidity in the space surrounded by the sheet 24 are hardly affected from the outside of the sheet 24. The air control device 23 can easily control the temperature and humidity in the space surrounded by the seat 24.

  FIG. 2A is a schematic plan view showing the carriage. As shown in FIG. 2A, one carriage 12 has three droplet discharge heads 14 arranged in one row and formed in a substantially Y direction, and this row is arranged in two rows. Yes. A nozzle plate 30 is disposed on the surface of the droplet discharge head 14, and a plurality of nozzles 31 are formed on the nozzle plate 30. The number of nozzles 31 may be set according to the pattern to be ejected and the size of the substrate 7. In this embodiment, for example, two nozzles 31 are arranged in one nozzle plate 30, Fifteen nozzles 31 are arranged in each row.

  FIG. 2B is a schematic side view showing the carriage, and is a view of the carriage shown in FIG. As shown in FIG. 2B, the carriage 12 includes a base plate 32. A moving mechanism 33 is disposed on the upper side of the base plate 32, and a mechanism for moving the carriage 12 along the guide rail 11 is accommodated.

  A drive circuit board 35 is disposed below the base plate 32 via a support portion 34. A head drive circuit 36 is disposed below the drive circuit board 35. Further, a head mounting plate 38 is disposed on the base plate 32 via a support portion 37, and the droplet discharge head 14 is disposed on the lower surface of the head mounting plate 38. The head drive circuit 36 and the droplet discharge head 14 are connected by a cable (not shown), and a drive signal output from the head drive circuit 36 is input to the droplet discharge head 14.

  A supply device 39 is disposed below the base plate 32, and the storage tank 10 and the supply device 39, and the supply device 39 and the droplet discharge head 14 are connected by a tube (not shown). Yes. The functional liquid supplied from the storage tank 10 is supplied to the droplet discharge head 14 by the supply device 39.

  FIG. 2C is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. As shown in FIG. 2C, the droplet discharge head 14 includes a nozzle plate 30, and a nozzle 31 is formed on the nozzle plate 30. A cavity 40 communicating with the nozzle 31 is formed on the upper side of the nozzle plate 30 and at a position facing the nozzle 31. A functional liquid 41 as a liquid material stored in the storage tank 10 is supplied to the cavity 40 of the droplet discharge head 14.

  Above the cavity 40, a vibration plate 42 that vibrates in the vertical direction (Z direction) and expands and contracts the volume in the cavity 40 and a piezoelectric element 43 that expands and contracts in the vertical direction and vibrates the vibration plate 42 are disposed. Has been. The piezoelectric element 43 expands and contracts in the vertical direction to pressurize and vibrate the diaphragm 42, and the diaphragm 42 pressurizes the cavity 40 by enlarging and reducing the volume in the cavity 40. Thereby, the pressure in the cavity 40 fluctuates, and the functional liquid 41 supplied into the cavity 40 is discharged through the nozzle 31.

  When the droplet discharge head 14 receives a nozzle drive signal for controlling and driving the piezoelectric element 43, the piezoelectric element 43 expands and the diaphragm 42 reduces the volume in the cavity 40. As a result, the functional liquid 41 corresponding to the reduced volume is discharged as droplets 44 from the nozzle 31 of the droplet discharge head 14. When the droplets 44 are ejected from the nozzles 31, a part of the energy applied to the droplet ejection head 14 is converted into heat in order to eject the droplets 44. Then, the droplet discharge head 14 is heated and the temperature rises.

  FIG. 3 is an electric control block diagram of the droplet discharge device. In FIG. 3, the droplet discharge device 1 includes a CPU (arithmetic processing unit) 48 that performs various arithmetic processes as a processor, and a memory 49 that stores various types of information.

  The main scanning drive device 50, the sub-scanning drive device 51, the main scanning position detection device 5, the sub-scanning position detection device 13, and the head drive circuit 36 that drives the droplet discharge head 14 are connected via an input / output interface 52 and a data bus 53. Connected to the CPU 48. Further, the input device 54, the display device 55, the weight measuring device 21, the first flushing unit 17, the second flushing unit 18, the capping unit 19, and the wiping unit 20 are also connected to the CPU 48 via the input / output interface 52 and the data bus 53. ing. Similarly, in the cleaning unit 15, a maintenance stage driving device 56 that drives the maintenance stage 16 and a maintenance stage position detection device 57 that detects the position of the maintenance stage 16 are also connected to the CPU 48 via the input / output interface 52 and the data bus 53. ing.

  The main scanning drive device 50 is a device that controls the movement of the stage 4, and the sub-scanning drive device 51 is a device that controls the movement of the carriage 12. The main scanning position detection device 5 recognizes the position of the stage 4 and the main scanning driving device 50 controls the movement of the stage 4 so that the stage 4 can be moved and stopped to a desired position. Yes. Similarly, the sub-scanning position detection device 13 recognizes the position of the carriage 12 and the sub-scanning driving device 51 controls the movement of the carriage 12 so that the carriage 12 can be moved and stopped to a desired position. It has become.

  The input device 54 is a device that inputs various processing conditions for ejecting the droplets 44. For example, the input device 54 is a device that receives and inputs coordinates for ejecting the droplets 44 on the substrate 7 from an external device (not shown). The display device 55 is a device that displays processing conditions and work status, and an operator performs an operation using the input device 54 based on information displayed on the display device 55.

  The weight measuring device 21 includes an electronic balance and a saucer, and measures the weight of the droplet 44 ejected by the droplet ejection head 14 and the saucer that receives the droplet 44. The weight of the tray before and after the droplet 44 is discharged is measured, and the measured value is transmitted to the CPU 48.

  The maintenance stage driving device 56 selects one device from the first flushing unit 17, the second flushing unit 18, the capping unit 19, the wiping unit 20, and the weight measuring device 21, and places it at a location facing the droplet discharge head 14. It is a device that moves the maintenance stage 16 so as to be positioned. Then, after the maintenance stage position detection device 57 detects the position of the maintenance stage 16, the maintenance stage driving device 56 moves the maintenance stage 16, so that the desired device or unit can reliably operate the droplet discharge head 14. It is possible to move to a place opposite to.

  The memory 49 is a concept including a semiconductor memory such as a RAM and a ROM, and an external storage device such as a hard disk and a CD-ROM. Functionally, a storage area is set for storing program software 58 in which a procedure for controlling operations in the droplet discharge device 1 is described. Further, a storage area for storing discharge position data 59 which is coordinate data of the discharge position in the substrate 7 is also set.

  In addition, warm-up drive data 60 such as drive count data is set in the warm-up drive of the droplet discharge head 14. Further, when measuring the weight of the droplet 44 discharged from the nozzle 31, a storage area for storing measurement drive data 61 for driving the piezoelectric element 43 is set.

  Further, a storage area for storing a main scanning movement amount for moving the substrate 7 in the main scanning direction (Y direction) and a sub scanning movement amount for moving the carriage 12 in the sub scanning direction (X direction); A storage area that functions as a work area, a temporary file, and the like, and various other storage areas are set.

  The CPU 48 performs control for ejecting the functional liquid as droplets 44 at predetermined positions on the surface of the substrate 7 in accordance with the program software 58 stored in the memory 49. As a specific function realization part, it has the weight measurement calculating part 62 which performs the calculation for implement | achieving weight measurement. Further, when the droplet discharge head 14 is warm-up driven, the cleaning calculation unit 63 that calculates the timing for cleaning the droplet discharge head 14, the selection of the droplet discharge head 14 that is warm-up driven, and the warm-up drive time And a warm-up control calculation unit 64 that performs the above control.

  In addition, it includes a discharge calculation unit 65 that performs calculation for discharging the droplets 44 by the droplet discharge head 14. If the discharge calculation unit 65 is divided in detail, it has a discharge start position calculation unit 66 for setting the droplet discharge head 14 to an initial position for droplet discharge. Further, the ejection calculation unit 65 includes a main scanning control calculation unit 67 that calculates control for scanning and moving the substrate 7 in the main scanning direction (Y direction) at a predetermined speed. In addition, the ejection calculation unit 65 includes a sub-scanning control calculation unit 68 that calculates control for moving the droplet discharge head 14 in the sub-scanning direction (X direction) by a predetermined sub-scanning amount. Further, the discharge calculation unit 65 includes various types such as a nozzle discharge control calculation unit 69 that performs calculation for controlling which nozzle among a plurality of nozzles in the droplet discharge head 14 is operated to discharge the functional liquid. It has a function calculation unit.

(Discharge method)
Next, an ejection method for ejecting and applying a functional liquid onto the substrate 7 using the above-described droplet ejection apparatus 1 will be described with reference to FIGS. FIG. 4 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate. 5 to 9 are diagrams for explaining a discharge method using a droplet discharge device.

  Step S1 corresponds to an adjustment order setting step, and is a step of setting an order for adjusting the discharge amount of the droplet discharge head. Next, the process proceeds to step S2. Step S2 corresponds to a standby process before discharge, and is a process of warming up the droplet discharge head. Next, the process proceeds to step S3. Step S3 corresponds to a moving process, and is a process of moving the droplet discharge head to a location facing the weight measuring device. Next, the process proceeds to step S4. Step S4 corresponds to a measurement discharge step, and is a step of discharging a predetermined number of times from the nozzle to the tray of the weight measuring device. Next, the process proceeds to step S5. Step S5 corresponds to a measurement process, and measures the weight of the pan of the weight measuring device. And it is the process of calculating the discharge amount per discharge. Steps S2 to S5 constitute the first measurement step of Step S21. Next, the process proceeds to step S6.

  Step S6 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S5 is compared with the target discharge amount that is the target to be adjusted. In this step, it is determined whether the difference from the quantity is smaller than a specified value. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S7. In step S6, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S8. Step S7 corresponds to the first adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. Next, the process proceeds to step S4.

  Step S8 corresponds to a step of determining whether all the heads to be adjusted have been adjusted, and is a step of determining whether all of the droplet discharge heads set to be adjusted in step S1 have been adjusted. When there is a droplet ejection head whose ejection amount is not adjusted among the droplet ejection heads to be adjusted (NO), the process proceeds to step S3. In step S8, when the discharge amount of all droplet discharge heads in the droplet discharge head to be adjusted is adjusted (YES), the process proceeds to step S9. Steps S2 to S8 constitute the first discharge amount adjustment step of Step S22.

  Step S9 corresponds to a moving step, and is a step of moving the droplet discharge head from a location facing the second flushing unit and the weight measuring device to a location facing the first flushing unit. Next, the process proceeds to step S10. Step S10 corresponds to a standby step before discharge, and is a step of warming up the droplet discharge head. Next, the process proceeds to step S11. Step S11 corresponds to a moving step, and is a step of moving the droplet discharge head to a location facing the weight measuring device. Next, the process proceeds to step S12. Step S12 corresponds to a measurement discharge step, and is a step of discharging a predetermined number of times from the nozzle to the tray of the weight measuring device. Next, the process proceeds to step S13. Step S13 corresponds to a measurement process, and measures the weight of the pan of the weight measuring device. And it is the process of calculating the discharge amount per discharge. The steps S10 to S13 constitute the second measurement process of step S23. Next, the process proceeds to step S14.

  Step S14 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S13 is compared with the target discharge amount that is the target to be adjusted, and the discharge amount and the target discharge amount are compared. In this step, it is determined whether the difference from the quantity is smaller than a specified value. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S15. In step S14, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S16. Step S15 corresponds to the second adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. Next, the process proceeds to step S12.

  Step S16 corresponds to a step of determining whether all the heads to be adjusted have been adjusted, and is a step of determining whether all adjustments have been made in the droplet discharge heads set to be adjusted in step S1. When there is a droplet ejection head whose ejection amount is not adjusted among the droplet ejection heads to be adjusted (NO), the process proceeds to step S11. In step S16, when all the discharge amounts of the droplet discharge heads to be adjusted in the droplet discharge heads are adjusted (YES), the process proceeds to step S17. The step S10 to step S16 constitutes the second discharge amount adjustment step of step S24.

  Step S <b> 17 corresponds to a coating process, and is a process in which droplets are ejected and applied to the substrate. Thus, the manufacturing process for discharging and applying the functional liquid to the substrate is completed.

Next, with reference to FIGS. 5 to 9, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately adjusted and applied to the workpiece in correspondence with the steps shown in FIG. 4 will be described in detail. .
FIG. 5 is a diagram corresponding to step S <b> 1 and is a diagram for explaining the order of adjusting the ejection amount of the droplet ejection head. FIG. 5A is a diagram for explaining the order of adjusting the discharge amount of the droplet discharge head in the first discharge amount adjustment step. As shown in FIG. 5A, the carriage 12 is composed of six carriages, a first carriage 12a to a sixth carriage 12f. The first carriage 12 a includes a first head row 71 and a second head row 72. In each of the first head row 71 and the second head row 72, three droplet discharge heads 14 are arranged obliquely with respect to the Y direction.

  Similarly, the second carriage 12b includes a third head row 73 and a fourth head row 74, and the third carriage 12c includes a fifth head row 75 and a sixth head row 76. The fourth carriage 12d includes a seventh head row 77 and an eighth head row 78, and the fifth carriage 12e includes a ninth head row 79 and a tenth head row 80. Similarly, the sixth carriage 12 f includes an eleventh head row 81 and a twelfth head row 82. Similarly to the first head row 71, the third head row 73 to the twelfth head row 82 each have three droplet discharge heads 14 arranged obliquely with respect to the Y direction. Each of the first head row 71 to the twelfth head row 82 is a droplet discharge head row.

  In the first discharge amount adjustment step in step S22, the carriage 12 is divided into three groups for adjustment. First, the first carriage 12a and the second carriage 12b are set together as the first group 83, and the second is set as the second group 84 including the third carriage 12c and the fourth carriage 12d. To do. Thirdly, the fifth carriage 12e and the sixth carriage 12f are combined and set as the third group 85.

  In the first group 83, the ejection amount of the droplet ejection head 14 in the first head row 71 to the third head row 73 is adjusted. In the second group 84, the ejection amount of the droplet ejection head 14 in the sixth head row 76 and the seventh head row 77 is adjusted. In the third group 85, the ejection amount of the droplet ejection head 14 in the tenth head column 80 to the twelfth head column 82 is adjusted.

  FIG. 5B is a diagram for explaining the order of adjusting the discharge amount of the droplet discharge head in the second discharge amount adjustment step of step S24. As shown in FIG. 5B, in the second discharge amount adjustment step in step S24, the carriage 12 is divided into two groups for adjustment. First, the second carriage 12b and the third carriage 12c are set together as a fourth group 86, and the second is set as the fifth group 87 including the fourth carriage 12d and the fifth carriage 12e. To do.

  In the fourth group 86, the ejection amount of the droplet ejection head 14 in the fourth head row 74 and the fifth head row 75 is adjusted. In the fifth group 87, the ejection amount of the droplet ejection head 14 in the eighth head row 78 and the ninth head row 79 is adjusted.

  With the above settings, by performing step S22 and step S24, the ejection amount of the droplet ejection head 14 in all the head arrays of the first head array 71 to the twelfth head array 82 is measured.

  FIG. 6A is a diagram corresponding to step S2. As shown in FIG. 6A, the first carriage 12 a to the sixth carriage 12 f are moved to a location facing the first flushing unit 17. Then, by inputting the non-ejection drive waveform 90 to the droplet ejection heads 14 of the first head row 71 to the twelfth head row 82, the droplet ejection heads 14 of the first head row 71 to the twelfth head row 82 The piezoelectric element 43 is driven to such an extent that no droplets are ejected. Then, when the piezoelectric element 43 is driven, warm-up driving for warming up the droplet discharge head 14 is performed. Then, since the droplet discharge heads 14 of the first head column 71 to the twelfth head column 82 are heated, the temperature of the droplet discharge head 14 rises. In addition, the standby droplet discharge head 14 prevents the nozzle 31 from drying by performing flushing to discharge the droplet 44 to the first flushing unit 17 at a predetermined interval.

  FIG. 6B is a diagram corresponding to step S3. As shown in FIG. 6B, the first carriage 12 a and the second carriage 12 b are moved to a location facing the weight measuring device 21. Then, the droplet discharge heads 14 of the first head row 71 to the fourth head row 74 are positioned at positions facing the weight measuring device 21. At this time, the droplet discharge heads 14 of the fifth head row 75 to the twelfth head row 82 mounted on the third carriage 12c to the sixth carriage 12f wait in a place facing the first flushing unit 17, Perform warm-up drive and flushing.

  FIG. 6C to FIG. 7C are diagrams corresponding to step S4. As shown in FIG. 6C, by inputting an ejection drive waveform 91 to the droplet ejection heads 14 of the first head row 71 to the fourth head row 74, the droplets 44 are transferred from the nozzles 31 to the weight measuring device 21. Discharge.

  7A and 7B are time charts showing drive waveforms of the droplet discharge head. FIG. 7A is an example when droplets 44 are continuously discharged from the droplet discharge head 14, and the head drive circuit 36 displays three discharge drive waveforms 91 for driving the piezoelectric elements 43. . The horizontal axis of the figure shows the passage of time 92, and the vertical axis shows the change of the drive voltage 93. The ejection drive waveform 91 has a substantially trapezoidal waveform, and the ejection voltage 94 and the ejection pulse width 95, which are the peak values of the drive voltage during ejection, are set to a predetermined voltage and time. A discharge waveform period 96 that is a period of the discharge drive waveform 91 is also formed at a predetermined time interval. The discharge voltage 94, the discharge pulse width 95, and the discharge waveform period 96 need to be set according to the dynamic characteristics of the piezoelectric element 43 and the diaphragm 42. Therefore, it is desirable to carry out a preliminary test for actual ejection to derive optimum ejection conditions.

  FIG. 7B shows three non-ejection drive waveforms 90 that are an example of warm-up driving by driving the droplet ejection head 14 without ejecting the droplets 44. The non-ejection drive waveform 90 has a substantially trapezoidal waveform, and the non-ejection voltage 97, which is the peak value of the drive voltage during non-ejection, causes the piezoelectric element 43 to vibrate greatly within a range where the droplets 44 are not ejected. Better. In the present embodiment, for example, the non-ejection voltage 97 employs a voltage that is about one third of the ejection voltage 94. A non-ejection pulse width 98 that is a pulse width at the time of non-ejection employs the same value as the ejection pulse width 95. The non-ejection waveform period 99 that is the waveform period of the non-ejection drive waveform 90 is set to an interval at which the piezoelectric element 43 vibrates. In the present embodiment, for example, the non-ejection waveform period 99 employs the same time interval as the ejection waveform period 96.

  FIG. 7C is a graph showing the relationship between the number of drive ejections and the head temperature when the droplet ejection heads are continuously driven. In FIG. 7C, the horizontal axis indicates the passage of the number of ejections 100, which is the number of ejections of the droplet 44, and the vertical axis indicates the change in the head temperature 101. The transition of the head temperature 101 with respect to the number of ejections 100 when the piezoelectric element 43 is continuously driven to eject the droplets 44 is shown in the outer head temperature curve 102 and the inner head temperature curve 103. The outer head temperature curve 102 is the temperature of the droplet discharge heads 14 in the first head row 71 and the fourth head row 74 in FIG. 6C, and the inner head temperature curve 103 is the second head row 72 and the third head. This is the temperature of the droplet discharge heads 14 in the row 73.

  In the outer head temperature curve 102 at the discharge start point 102a when the discharge is started, the head temperature 101 increases as the number of discharges 100 passes. In the temperature rise region 102b, the head temperature 101 rises as the number of ejections 100 passes.

  Then, even if the number of ejections 100 has elapsed, the head temperature 101 shifts to a temperature equilibrium region 102c where the head temperature 101 does not increase. In the temperature equilibrium region 102c, the thermal energy radiated by the droplet discharge head 14 and the thermal energy generated by ejection are in an equilibrium state. When the head temperature 101 rises, the temperature difference between the head temperature 101 and the gas surrounding the droplet discharge head 14 (hereinafter referred to as ambient gas) increases. The greater the difference between the head temperature 101 and the ambient gas temperature, the greater the heat energy dissipated from the droplet discharge head 14. Therefore, the head temperature 101 does not increase and stabilizes at a certain head temperature 101. This temperature is set as the equilibrium head temperature 102d.

  Similarly, in the inner head temperature curve 103, the head temperature 101 rises as the number of ejections 100 increases from the ejection start point 103a between the temperature rise regions 103b. In the temperature equilibrium region 103c, the head temperature 101 is stabilized at the equilibrium head temperature 103d.

  Since the droplet discharge heads 14 of the second head row 72 and the third head row 73 are sandwiched between the first head row 71 and the fourth head row 74, it is difficult to dissipate heat to the surrounding gas. Therefore, the inner head temperature curve 103 changes at a head temperature 101 higher than the outer head temperature curve 102. The balanced head temperature 103d is stabilized at a temperature higher than the balanced head temperature 102d.

  In step S <b> 5, the ejection amount in the droplet ejection heads 14 of the first head row 71 to the third head row 73 is measured. In step S17, the first head row 71 is ejected while being positioned in the outer row. Therefore, in step S4, the first head row 71 is ejected under substantially the same arrangement conditions as in step S17. Similarly, the second head row 72 and the third head row 73 are positioned in the inner row in step S17, and are ejected while being sandwiched between the first head row 71 and the fourth head row 74. That is, the droplet discharge heads 14 of the first head row 71 to the third head row 73 discharge in step S4 under substantially the same arrangement conditions as in step S17. On the other hand, since the fourth head row 74 is positioned and ejected in the inner row in step S17, the fourth head row 74 is ejected in step S4 under different arrangement conditions from step S17. In step S4 and step S17, the ejection amount in the droplet ejection heads 14 of the first head row 71 to the third head row 73 ejected under substantially the same arrangement conditions is measured.

  The measurement of the ejection amount is calculated by dividing the weight of the droplet 44 ejected in step S4 by the number of ejections. The number of times of ejection may be any number that can be measured by averaging the variation of the ejection amount for each time. For example, in this embodiment, 100 times is adopted. Then, the discharge amount is measured for each droplet discharge head 14.

  FIG. 7D is a graph corresponding to step S7 and is a graph showing the relationship between the drive voltage and the discharge amount when driving the droplet discharge head. In FIG. 7D, the horizontal axis indicates the drive voltage 93, and the right side is higher than the left side. The vertical axis indicates the discharge amount 104 discharged by the droplet discharge head, and the upper side indicates a larger amount than the lower side. A voltage discharge amount curve 105 shows a relationship in which the discharge amount 104 changes when the drive voltage 93 is changed.

  As shown by the voltage discharge amount curve 105, when the drive voltage 93 is increased, the discharge amount 104 increases. When the drive voltage 93 is changed, the droplet discharge head 14 is designed so that the voltage range in which the discharge amount 104 changes is the drive voltage range 105a, and the discharge voltage 94 enters the range. The voltage discharge amount curve 105 is an example, and the voltage discharge amount curve 105 also varies as the head temperature 101 varies.

  In step S7, the target discharge amount 106, which is the target discharge amount 104, is compared with the discharge amount 104 measured in step S5. Then, the difference of the drive voltage 93 corresponding to the difference between the target discharge amount 106 and the measured discharge amount 104 is calculated. When the discharge amount 104 measured from the target discharge amount 106 is smaller, the discharge voltage 94 is increased by a voltage corresponding to the difference of the drive voltage 93. On the other hand, when the discharge amount 104 measured is larger than the target discharge amount 106, the discharge voltage 94 is lowered by a voltage corresponding to the difference of the drive voltage 93.

  Then, by repeating Steps S4 to S7, the discharge amount 104 is brought close to the target discharge amount 106. In step S6, when the difference between the target discharge amount 106 and the measured discharge amount 104 becomes smaller than the specified value, the discharge amount 104 in the droplet discharge heads 14 of the first head row 71 to the fourth head row 74 is adjusted. finish.

  FIG. 8A and FIG. 8B are diagrams corresponding to step S22. As shown in FIG. 8A, in step S3, the first carriage 12a and the second carriage 12b are moved from a location facing the weight measuring device 21 to a location facing the second flushing unit 18. Then, the third carriage 12 c and the fourth carriage 12 d are moved from a location facing the first flushing unit 17 to a location facing the weight measuring device 21. The fifth carriage 12 e and the sixth carriage 12 f stand by at a place facing the first flushing unit 17.

  In step S4, the non-ejection drive waveform 90 is input to the droplet ejection heads 14 of the first head row 71 to the fourth head row 74 and the ninth head row 79 to the twelfth head row 82 to drive warm-up. Then, the droplets 44 are discharged from the droplet discharge heads 14 of the first head row 71 to the fourth head row 74 to the second flushing unit 18 to perform the flushing operation. Similarly, the droplets 44 are discharged from the droplet discharge heads 14 of the ninth head column 79 to the twelfth head column 82 to the first flushing unit 17 to perform the flushing operation.

  The ejection drive waveform 91 is input to the droplet ejection heads 14 of the fifth head row 75 to the eighth head row 78, and the droplets 44 are ejected to the weight measuring device 21 a predetermined number of times. In step S5, the weight of the discharged droplet 44 is measured. At this time, the weight of the droplets 44 ejected from the droplet ejection heads 14 of the sixth head row 76 and the seventh head row 77 sandwiched between the fifth head row 75 and the eighth head row 78 is measured.

  Then, the discharge amount is calculated by dividing by the number of times of discharge. Next, adjustment is performed in step S7. Steps S4 to S7 are repeated, and when the difference between the target discharge amount 106 and the measured discharge amount 104 becomes smaller than a specified value, discharge from the droplet discharge heads 14 of the sixth head row 76 and the seventh head row 77 is performed. Finish adjusting the amount.

  Next, as shown in FIG. 8B, in step S <b> 3, the third carriage 12 c and the fourth carriage 12 d are moved from a location facing the weight measuring device 21 to a location facing the second flushing unit 18. Then, the fifth carriage 12 e and the sixth carriage 12 f are moved from a location facing the first flushing unit 17 to a location facing the weight measuring device 21. The first carriage 12 a and the second carriage 12 b continue to stand by at a location facing the second flushing unit 18.

  In step S4, the non-ejection drive waveform 90 is input to the droplet ejection heads 14 of the first head row 71 to the eighth head row 78 to perform warm-up driving. Then, the droplets 44 are periodically ejected from the droplet ejection heads 14 of the first head row 71 to the eighth head row 78 to the second flushing unit 18 to perform the flushing operation.

  The ejection driving waveform 91 is input to the droplet ejection heads 14 of the ninth head row 79 to the twelfth head row 82, and the droplets 44 are ejected to the weight measuring device 21 a predetermined number of times. In step S5, the weight of the discharged droplet 44 is measured. At this time, the weight of the droplets 44 ejected from the droplet ejection heads 14 of the tenth head column 80 and the eleventh head column 81 sandwiched between the ninth head column 79 and the twelfth head column 82 is measured. Further, the weight of the droplet 44 ejected from the droplet ejection head 14 of the twelfth head row 82 at the right end is measured.

  Then, the discharge amount is calculated by dividing by the number of times of discharge. Next, adjustment is performed in step S7. Steps S4 to S7 are repeated, and when the difference between the target discharge amount 106 and the measured discharge amount 104 becomes smaller than a specified value, discharge from the droplet discharge heads 14 of the tenth head row 80 to the twelfth head row 82 is performed. Finish adjusting the amount.

  FIG. 8C is a diagram corresponding to step S9 and step S10. As shown in FIG. 8C, the fifth carriage 12 e and the sixth carriage 12 f are moved from a location facing the weight measuring device 21 to a location facing the first flushing unit 17. Then, the first carriage 12 a to the fourth carriage 12 d are moved from a location facing the second flushing unit 18 to a location facing the first flushing unit 17.

  Next, in step S10, the non-ejection drive waveform 90 is input to the droplet ejection heads 14 of the first head row 71 to the twelfth head row 82 to perform warm-up driving. Then, the droplets 44 are periodically discharged from the droplet discharge heads 14 of the first head row 71 to the twelfth head row 82 to the first flushing unit 17 to perform the flushing operation.

  FIG. 9A and FIG. 9B are diagrams corresponding to step S24. As shown in FIG. 9A, in step S <b> 11, the first carriage 12 a is moved from a location facing the first flushing unit 17 to a location facing the second flushing unit 18. Then, the second carriage 12 b and the third carriage 12 c are moved from a location facing the first flushing unit 17 to a location facing the weight measuring device 21. The fourth carriage 12 d to the sixth carriage 12 f stand by at a place facing the first flushing unit 17.

  In step S12, the non-ejection drive waveform 90 is input to the droplet ejection heads 14 of the first head row 71, the second head row 72, and the seventh head row 77 to the twelfth head row 82, and warm-up driving is performed. Then, the droplets 44 are periodically discharged from the droplet discharge heads 14 of the first head row 71 and the second head row 72 to the second flushing unit 18 to perform a flushing operation. Similarly, the droplets 44 are periodically discharged from the droplet discharge heads 14 of the seventh head column 77 to the twelfth head column 82 to the first flushing unit 17 to perform the flushing operation.

  The ejection driving waveform 91 is input to the droplet ejection heads 14 of the third head row 73 to the sixth head row 76, and the droplets 44 are ejected to the weight measuring device 21 a predetermined number of times. In step S13, the weight of the discharged droplet 44 is measured. At this time, the weight of the droplets 44 ejected from the droplet ejection heads 14 of the fourth head row 74 and the fifth head row 75 sandwiched between the third head row 73 and the sixth head row 76 is measured.

  Then, the discharge amount is calculated by dividing by the number of times of discharge. Next, it adjusts in step S15. Steps S12 to S15 are repeated, and when the difference between the target discharge amount 106 and the measured discharge amount 104 becomes smaller than a specified value, discharge from the droplet discharge heads 14 of the fourth head row 74 and the fifth head row 75 is performed. Finish adjusting the amount.

  Next, as shown in FIG. 9B, in step S <b> 11, the second carriage 12 b and the third carriage 12 c are moved from a location facing the weight measuring device 21 to a location facing the second flushing unit 18. Then, the fourth carriage 12 d and the fifth carriage 12 e are moved from a location facing the first flushing unit 17 to a location facing the weight measuring device 21. The first carriage 12 a stands by at a place facing the second flushing unit 18, and the sixth carriage 12 f stands by at a place facing the first flushing unit 17.

  In step S12, the non-ejection drive waveform 90 is input to the droplet ejection heads 14 of the first head row 71 to the sixth head row 76, the eleventh head row 81, and the twelfth head row 82 to perform warm-up driving. Then, the droplets 44 are periodically discharged from the droplet discharge heads 14 of the first head row 71 to the sixth head row 76 to the second flushing unit 18 to perform the flushing operation. Similarly, the droplets 44 are periodically discharged from the droplet discharge heads 14 of the eleventh head column 81 and the twelfth head column 82 to the first flushing unit 17 to perform the flushing operation.

  The ejection driving waveform 91 is input to the droplet ejection heads 14 of the seventh head row 77 to the tenth head row 80, and the droplets 44 are ejected to the weight measuring device 21 a predetermined number of times. In step S13, the weight of the discharged droplet 44 is measured. At this time, the weight of the droplets 44 ejected from the droplet ejection heads 14 of the eighth head column 78 and the ninth head column 79 sandwiched between the seventh head column 77 and the tenth head column 80 is measured.

  Then, the discharge amount is calculated by dividing by the number of times of discharge. Next, it adjusts in step S15. Steps S12 to S15 are repeated, and when the difference between the target discharge amount 106 and the measured discharge amount 104 becomes smaller than a specified value, discharge in the droplet discharge heads 14 of the eighth head row 78 and the ninth head row 79 is performed. Finish adjusting the amount.

  Through the above steps, the droplet discharge heads 14 of the second head column 72 to the eleventh head column 81 have the discharge amount when discharging the droplets 44 while being sandwiched between the adjacent droplet discharge heads 14. After the measurement, the discharge amount is adjusted. This is the same form as the form of the droplet discharge head 14 when discharging in step S17. Then, the droplet discharge heads 14 of the first head row 71 and the twelfth head row 82 measure the discharge amount when discharging the droplets 44 without being sandwiched between the droplet discharge heads 14, and then discharge the droplets. The amount is adjusted. This is also the same form as the form of the droplet discharge head 14 when discharging in step S17. That is, the discharge amount is adjusted in the same form as that of the droplet discharge head 14 when discharging in step S17.

  FIG. 9C corresponds to step S17. As shown in FIG. 9C, the carriage 12 and the stage 4 are moved, and the droplet discharge head 14 and the substrate 7 are moved so that the droplet discharge head 14 and the substrate 7 face each other. Next, based on a predetermined drawing pattern, droplets 44 are ejected and applied to the substrate 7. The planned drawing pattern is applied and step S17 is ended, and the manufacturing process of applying droplets onto the substrate 7 is ended.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the measurement of the discharge amount is divided into the first measurement process of step S21 and the second measurement process of step S23. In step S21, the discharge amount when discharging from the droplet discharge heads 14 belonging to the droplet discharge head row sandwiched between other droplet discharge head rows is measured. That is, the ejection when ejecting from the droplet ejection heads 14 belonging to the second head row 72, the third head row 73, the sixth head row 76, the seventh head row 77, the tenth head row 80, and the eleventh head row 81. The amount is being measured.

  In step S23, the liquid discharge is performed after the liquid droplet is ejected by sandwiching the liquid droplet ejection head array that is not sandwiched between the other liquid droplet ejection head arrays in step S21. Is measuring. Then, the discharge amount when discharging from the droplet discharge heads 14 belonging to the fourth head row 74, the fifth head row 75, the eighth head row 78, and the ninth head row 79 is measured. That is, in step S21 and step S23, the discharge amount when discharging from the droplet discharge heads 14 belonging to the droplet discharge head row sandwiched between other droplet discharge head rows is measured. Therefore, the droplet discharge heads 14 of the second head row 72 to the eleventh head row 81 can measure the discharge amount at substantially the same temperature. As a result, it is possible to accurately measure the discharge amount.

  (2) According to this embodiment, in the standby process before discharge in step S2 and step S10, the droplet discharge head is warmed up to raise the temperature of the droplet discharge head 14. Then, the ejection amount in a state where the temperature of the droplet ejection head is high is measured. When the droplets 44 are ejected onto the substrate 7, the droplet ejection head 14 ejects the droplets 44, so that the temperature of the droplet ejection head 14 rises. That is, the droplet discharge head 14 can measure the discharge amount at substantially the same temperature as when the droplets 44 are discharged onto the substrate 7 by being warmed up. Therefore, it is possible to accurately measure the discharge amount when the droplets 44 are discharged onto the substrate 7.

  (3) According to the present embodiment, the warm-up operation is performed so that the droplets 44 are not ejected from the nozzles 31 of the droplet ejection head 14. Accordingly, since the droplets 44 are not discharged unnecessarily, a resource-saving discharge amount measuring method can be obtained.

  (4) According to this embodiment, after adjusting the droplet discharge head 14 measured in the first measurement process in step S21 in the first adjustment process in step S7, the measurement is performed in the second measurement process in step S23. The droplet discharge head thus adjusted is adjusted in the second adjustment step of step S15. In step S21 and step S23, the discharge amount is adjusted in step S7 and step S15 based on the measurement result obtained by measuring the discharge amount with high accuracy. Therefore, in step S7 and step S15, the discharge amount can be adjusted with high accuracy.

  (5) According to this embodiment, it has the 1st discharge amount adjustment process of Step S22, and the 2nd discharge amount adjustment process of Step S24. In step S22, the discharge amount is adjusted in the first adjustment step in step S7 based on the measurement result of the discharge amount measured in the first measurement step in step S21. Next, by repeating Step S21 and Step S7, the discharge amount is brought close to the target discharge amount. Therefore, compared with the method in which step S7 is performed only once, the discharge amount can be adjusted with high accuracy.

  And since it is performed similarly also in step S24, compared with the method of performing the 2nd adjustment process of step S15 only once, discharge amount can be adjusted with a sufficient precision. As a result, it is possible to provide a method capable of accurately adjusting the discharge amount.

(Second Embodiment)
In the present embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 4 and 5.
This embodiment is different from the first embodiment in that the discharge amount in all the droplet discharge heads 14 is adjusted in the first discharge amount adjustment step.

  That is, in FIG. 4, except step S7 of step S22 and step S15 of step S24, it is the same as 1st Embodiment, and description is abbreviate | omitted. In step S7, the ejection amount of the droplet ejection heads 14 belonging to the first head row 71 to the twelfth head row 82 shown in FIG. 5 is adjusted.

  Accordingly, the droplet discharge heads 14 belonging to the fourth head row 74, the fifth head row 75, the eighth head row 78, and the ninth head row 79 are discharged without being sandwiched by other droplet discharge head rows. Thereafter, the discharge amount to be measured is adjusted by adjusting the discharge amount to the target discharge amount 106.

  In step S15, the same adjustment as in the first embodiment is performed. Accordingly, the droplet discharge heads 14 belonging to the fourth head row 74, the fifth head row 75, the eighth head row 78, and the ninth head row 79 adjust the discharge amount in two steps, step S7 and step S15. Is done.

  In step S24, when the discharge and adjustment are repeated, the droplet discharge heads 14 belonging to the fourth head row 74, the fifth head row 75, the eighth head row 78, and the ninth head row 79 are changed in step S22. Since it has been adjusted once, the adjustment may be completed with a small number of repetitions. After the adjustment, in step S17, the droplets 44 are ejected and applied to the substrate 7 based on a predetermined drawing pattern. The planned drawing pattern is applied and step S17 is ended, and the manufacturing process of applying droplets onto the substrate 7 is ended.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to the present embodiment, in the first measurement process of step S21, the droplet discharge heads 14 belonging to the droplet discharge head row not sandwiched between other droplet discharge head rows are the first of step S22. In the discharge amount adjustment step, the discharge amount is adjusted once. Accordingly, since the discharge amount of the droplet discharge head 14 is adjusted to be close to the target discharge amount, the temperature of the droplet discharge head 14 is set to step S22 in the second discharge amount adjustment step of step S24. Even when the temperature rises above, the adjustment can be made with a small number of repetitions. As a result, an adjustment method with good productivity can be achieved.

(Third embodiment)
In this embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIG. FIG. 10 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate.
This embodiment is different from the first embodiment in that the discharge amount is adjusted by dividing into rough adjustment and fine adjustment in the first discharge amount adjustment step and the second discharge amount adjustment step.

  10, steps S31 to S33 are steps corresponding to steps S1 to S3 shown in FIG. Step S34 corresponds to a discharge measurement step, and discharge is performed a predetermined number of times from the nozzle to the tray of the weight measuring device. For example, 100 discharges are performed. Thereafter, the weight of the tray of the weight measuring device is measured. And it is the process of calculating the discharge amount per discharge. Next, the process proceeds to step S35. Step S35 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S34 is compared with the target discharge amount that is the target to be adjusted, and the discharge amount and the target discharge amount are compared. In this step, it is determined whether the difference from the quantity is smaller than a specified value. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S36. In step S35, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S37. Step S36 corresponds to an adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. Next, the process proceeds to step S34. The rough adjustment process of step S61 is comprised by the step of step S34-step S36.

  Step S37 corresponds to a discharge measurement step, and discharges a predetermined number of times from the nozzle to the tray of the weight measuring device. In this step, the number of ejections is larger than the number of ejections in step S34. For example, 1000 discharges are performed. Accordingly, the discharge amount in this step is larger than the discharge amount in step S34. Thereafter, the weight of the tray of the weight measuring device is measured. And it is the process of calculating the discharge amount per discharge. Next, the process proceeds to step S38. Step S38 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S37 is compared with the target discharge amount that is the target to be adjusted, and the discharge amount and the target discharge amount are compared. In this step, it is determined whether the difference from the quantity is smaller than a specified value. This specified value is set in a range narrower than the specified value in step S35. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S39. In step S38, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S40. Step S39 corresponds to an adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. The change amount of the discharge amount adjusted in this step is set to an amount smaller than the change amount adjusted in step S36. Next, the process proceeds to step S37. The fine adjustment process of step S62 is comprised by the step of step S37-step S39.

  Step S40 corresponds to a step of determining whether all the heads to be adjusted have been adjusted, and is a step of determining whether all of the droplet discharge heads set to be adjusted in step S31 have been adjusted. When there is a droplet discharge head whose discharge amount is not adjusted among the droplet discharge heads to be adjusted (NO), the process proceeds to step S34. In step S40, when the discharge amount of all droplet discharge heads in the droplet discharge head to be adjusted is adjusted (YES), the process proceeds to step S41. Steps S32 to S40 constitute the first discharge amount adjustment step of Step S63.

  Step S41 corresponds to a moving step, and is a step of moving the droplet discharge head from a location facing the second flushing unit and the weight measuring device to a location facing the first flushing unit. Next, the process proceeds to step S42. Step S42 corresponds to a standby step before discharge, and is a step of warming up the droplet discharge head. Next, the process proceeds to step S43. Step S43 corresponds to a moving step, and is a step of moving the droplet discharge head to a location facing the weight measuring device. Next, the process proceeds to step S44. Step S44 corresponds to a discharge measurement step, and discharge is performed a predetermined number of times from the nozzle to the tray of the weight measuring device. For example, 100 discharges are performed. Thereafter, the weight of the tray of the weight measuring device is measured. And it is the process of calculating the discharge amount per discharge. Next, the process proceeds to step S45. Step S45 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S44 is compared with the target discharge amount that is the target to be adjusted, and the discharge amount and the target discharge amount are compared. In this step, it is determined whether the difference from the quantity is smaller than a specified value. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S46. In step S45, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S47. Step S46 corresponds to an adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. Next, the process proceeds to step S44. The steps S44 to S46 constitute the coarse adjustment step of step S64.

  Step S47 corresponds to a discharge measurement step, and discharge is performed a predetermined number of times from the nozzle to the tray of the weight measuring device. For example, 1000 discharges are performed. The number of ejections in this step is greater than the number of ejections in step S44. Accordingly, the discharge amount in this step is larger than the discharge amount in step S44. Thereafter, the weight of the tray of the weight measuring device is measured. And it is the process of calculating the discharge amount per discharge. Next, the process proceeds to step S48. Step S48 corresponds to a step of determining whether or not the discharge amount has reached the target discharge amount. The discharge amount measured in step S47 is compared with the target discharge amount that is the target to be adjusted, and the discharge amount and the target discharge amount are compared. In this step, it is determined whether the difference from the quantity is smaller than a specified value. This specified value is set in a range narrower than the specified value in step S45. When the difference between the discharge amount and the target discharge amount is larger than the specified value (NO), the process proceeds to step S49. In step S48, when the difference between the discharge amount and the target discharge amount is smaller than the specified value (YES), the process proceeds to step S50. Step S49 corresponds to an adjustment step, and is a step of adjusting the discharge amount discharged from the droplet discharge head. The change amount of the discharge amount adjusted in this step is set to an amount smaller than the change amount adjusted in step S46. Next, the process proceeds to step S47. The fine adjustment process of step S65 is comprised by the step of step S47-step S49.

  Step S50 corresponds to a step of determining whether all the heads to be adjusted have been adjusted, and is a step of determining whether all of the droplet discharge heads set to be adjusted in step S31 have been adjusted. When there is a droplet ejection head whose ejection amount is not adjusted among the droplet ejection heads to be adjusted (NO), the process proceeds to step S44. In step S40, when the discharge amount of all droplet discharge heads in the droplet discharge head to be adjusted is adjusted (YES), the process proceeds to step S51. The step S42 to step S50 constitute the second discharge amount adjustment step of step S66.

  Step S51 corresponds to an application process, and is a process of applying droplets onto the substrate. Thus, the manufacturing process for discharging and applying the functional liquid to the substrate is completed.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to this embodiment, the rough adjustment process in step S61 and step S64 and the fine adjustment process in step S62 and step S65 are performed. At this time, compared with the case where the fine adjustment is repeated and the discharge amount is adjusted little by little, the rough adjustment makes it possible to perform the combination of the step of changing the discharge amount largely and the fine adjustment step with a smaller number of times. In many cases, the discharge amount can be adjusted. Therefore, adjustment can be performed with high productivity.

  (2) According to this embodiment, in the rough adjustment process in step S61 and step S64, the discharge amount is measured with a smaller discharge amount than in the fine adjustment process in step S62 and step S65. Accordingly, it is possible to reduce the consumption of the discharged liquid material. As a result, a resource-saving adjustment method can be achieved.

(Fourth embodiment)
In this embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIG. This embodiment is different from the third embodiment in that the number of ejections per unit time in the coarse adjustment step and the fine adjustment step is different.

  That is, in FIG. 10, in each discharge measurement process of step S34, step S37, step S44, and step S47, the number of discharges is set to the same number, for example, 1000. In step S51, for example, when the functional liquid 41 is applied by discharging five times in one second, in step S37 and step S47 belonging to the fine adjustment process, discharging is performed five times in one second. Next, in step S34 and step S44 belonging to the rough adjustment process, for example, the discharge is performed 10 times per second and the measurement is performed. That is, in the coarse adjustment process, the number of discharges per unit time is increased and the discharge is performed in a short time compared to the fine adjustment process.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment and the effect (1) in the third embodiment, the following effects are obtained.
(1) According to this embodiment, in steps S34 and S44 belonging to the coarse adjustment process, the number of times of ejection per unit time is increased compared to the fine adjustment process. In the coarse adjustment step and the fine adjustment step, when the discharge amount is measured by performing the same number of discharges, the coarse adjustment step can be performed in a shorter time. Therefore, it is possible to adjust with high productivity.

(Fifth embodiment)
In the present embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 4 and 5. This embodiment is different from the second embodiment in that, in the first discharge amount adjustment step, the discharge amount of the head row that is not sandwiched is adjusted to be smaller than the discharge amount of the head row that is sandwiched. It is in.

  That is, in step S6 shown in FIG. 4, the discharge amount is compared with the target discharge amount. At this time, in the first group 83 shown in FIG. 5A, the target discharge amounts of the first head row 71, the second head row 72, and the third head row 73 are the target discharge amounts when discharging in step S17. And The target discharge amount of the fourth head row 74 is set to be smaller than the target discharge amount when discharging in step S17. Then, in step S7, the discharge amount is adjusted so as to be each target discharge amount.

  Similarly, in the second group 84, the target discharge amount of the sixth head row 76 and the seventh head row 77 is set as the target discharge amount when discharging in step S17. And the target discharge amount of the 5th head row | line | column 75 and the 8th head row | line | column 78 is set smaller than the target discharge amount at the time of discharging in step S17. In the third group 85, the target discharge amounts of the tenth head row 80, the eleventh head row 81, and the twelfth head row 82 are set as the target discharge amounts when discharging in step S17. The target discharge amount of the ninth head row 79 is set to be smaller than the target discharge amount when discharging in step S17.

  Next, in step S14, the discharge amount is compared with the target discharge amount. At this time, since the fourth head row 74 and the fifth head row 75 are sandwiched between the third head row 73 and the sixth head row 76 in the fourth group 86 shown in FIG. The temperature of the discharge head 14 has risen and has increased from the discharge amount in step S4. However, in step S6, the target discharge amount is set to be smaller than the target discharge amount when discharging in step S17. Therefore, in step S14, the discharge amount is close to the target discharge amount when discharging in step S17. In many cases, it becomes a discharge amount. Similarly, in the fifth group 87, the discharge amounts of the eighth head row 78 and the ninth head row 79 are often close to the target discharge amount when discharging in step S17. Therefore, it is possible to reduce the number of times to repeat Step S12 to Step S15.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to the present embodiment, in step S7, the discharge amount of the liquid material discharged from the droplet discharge heads not sandwiched between the droplet discharge head rows is smaller than the target discharge amount discharged in step S17. To be adjusted. Therefore, when measuring the discharge amount sandwiched between other droplet discharge heads, the discharge amount can be adjusted from the discharge amount close to the target discharge amount to be discharged in step S17. As a result, since adjustment can be performed with a small number of adjustments, adjustment can be performed with high productivity.

(Sixth embodiment)
In the present embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 4 and 5. This embodiment is different from the second embodiment in that in the first discharge amount adjustment step, the discharge amount of the head row not sandwiched is set to a discharge amount smaller than the discharge amount of the head row sandwiched. Is performed at the measurement discharge process point in the second discharge amount adjustment process.

  That is, step S1 to step S11 shown in FIG. 4 are performed in the same manner as in the second embodiment. In step S12, the discharge amount is changed with respect to the discharge amount adjusted in step S7. Specifically, the setting is changed so that the discharge amount of the fourth head row 74 and the fifth head row 75 of the fourth group 86 shown in FIG. 5 is discharged less than the discharge amount set in step S22. After discharging.

  Since the fourth head row 74 and the fifth head row 75 are sandwiched between the third head row 73 and the sixth head row 76, the temperature of the droplet discharge head 14 has risen, and the discharge amount in step S22. It is increasing more. However, in step S12, the discharge amount is set to be smaller than the target discharge amount when discharging in step S22. Therefore, in step S14, the discharge amount is close to the target discharge amount when discharging in step S17. It is often a quantity. Therefore, it is possible to reduce the number of times to repeat Step S12 to Step S15.

  Similarly, in the fifth group 87, the discharge amount of the eighth head row 78 and the ninth head row 79 is set so that a discharge amount smaller than the discharge amount set in step S22 is discharged in step S12. Discharge after change. As a result, the number of times that Steps S12 to S15 are repeated can be reduced.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to the present embodiment, in step S22, the droplet discharge heads 14 not sandwiched between the droplet discharge head arrays are adjusted to reduce the discharge amount in step S12. Therefore, when measuring the discharge amount sandwiched between other droplet discharge heads in step S12, the discharge amount can be adjusted from the discharge amount approaching the target of the discharge amount discharged in step S17. As a result, since adjustment can be performed with a small number of adjustments, adjustment can be performed with high productivity.

(Seventh embodiment)
In this embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 5, 11, and 12. FIG. 11 is a schematic perspective view showing a configuration of a droplet discharge device, and FIG. 12 is a flowchart showing a manufacturing process for discharging and applying droplets to a substrate. This embodiment differs from the second embodiment in that when the number of rows in the arrangement of droplet ejection heads is larger than that of the weight measuring device, after measuring the ejection amount of the droplet ejection head in the same carriage, The point is to measure the discharge amount of the droplet discharge head in the carriage.

  That is, as shown in FIG. 11, the droplet discharge device 108 has four weight measuring devices 109 arranged in a row in the X direction. Then, as shown in FIG. 5, droplets are discharged to the first carriage 12a to the sixth carriage 12f over three rows of the first head row 110, the second head row 111, and the third head row 112 as rows. A head 14 is arranged. That is, the adjustment procedure when the number of rows of the droplet discharge heads 14 mounted on the carriage 12 is larger than the number of rows of the droplet discharge heads 14 that can be measured at one time by the weight measuring device 109 will be described.

  In the flowchart of FIG. 12, step S71 corresponds to an adjustment order setting step, and is a step of setting an order for adjusting the discharge amount of the droplet discharge head. Next, the process proceeds to step S72. Step S72 corresponds to a moving step, and is a step of moving the carriage to move the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S73. Step S73 corresponds to a first discharge amount adjustment step, and is a step of adjusting the discharge amount by discharging the functional liquid from the droplet discharge heads in one row and measuring the discharge amount. Next, the process proceeds to step S74.

  Step S74 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted in the same carriage, and a step of determining whether or not the discharge amounts in the droplet discharge heads of all three rows have been adjusted. It is. When there is a line that has not been adjusted (NO), the process proceeds to step S72. In step S74, when the discharge amounts in the droplet discharge heads of all three rows are adjusted (YES), the process proceeds to step S75. Step S75 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted, and is a step of determining whether or not all the droplet discharge heads set to be adjusted in step S71 have been adjusted. When there is a droplet discharge head whose discharge amount is not adjusted among the droplet discharge heads to be adjusted (NO), the process proceeds to step S72. In step S75, when the discharge amount of all the droplet discharge heads in the droplet discharge head to be adjusted is adjusted (YES), the process proceeds to step S76.

  Step S76 corresponds to a moving step, and is a step of moving the carriage and moving the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S77. Step S77 corresponds to the second discharge amount adjustment step, and after arranging the head row different from step S73, the functional liquid is discharged from the droplet discharge heads in one row, the discharge amount is measured, and the discharge amount is adjusted. It is a process to do. Next, the process proceeds to step S78. Step S78 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted in the same carriage, and a step of determining whether or not the discharge amounts in the droplet discharge heads of all three rows have been adjusted. It is. When there is a line that has not been adjusted (NO), the process proceeds to step S76. In step S78, when the ejection amounts in the droplet ejection heads for all three rows are adjusted (YES), the process proceeds to step S79. Step S79 corresponds to a step of determining whether all the heads to be adjusted have been adjusted, and is a step of determining whether all of the droplet discharge heads set to be adjusted in step S71 have been adjusted. When there is a droplet ejection head whose ejection amount is not adjusted among the droplet ejection heads to be adjusted (NO), the process proceeds to step S76. In step S79, when the discharge amount of all the droplet discharge heads in the droplet discharge head to be adjusted is adjusted (YES), the process proceeds to step S80. Step S80 corresponds to an application process, and is a process for applying droplets onto the substrate. Thus, the manufacturing process for discharging and applying the functional liquid to the substrate is completed.

  Next, with reference to FIG. 5, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately adjusted in correspondence with the steps shown in FIG. 12 and applied to the workpiece will be described in detail. Step S71 is the same as step S1 shown in FIG. In step S <b> 72, the droplet discharge heads 14 in the first head row 110 of the first group 83 are moved to a location facing the weight measuring device 21. Thereafter, in step S73, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the first group 83 is adjusted. In step S74 and step S72, the second head row 111 of the first group 83 is moved to a location facing the weight measuring device 21. Thereafter, in step S73, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the second head row 111 of the first group 83 is adjusted. Through similar steps, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the third head row 112 of the first group 83 is adjusted.

  Next, in step S75 and step S72, the first head row 110 of the second group 84 is moved to a location facing the weight measuring device 21. Thereafter, in step S73, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the first group 83 is adjusted. Then, by repeating Step S72 to Step S74, the discharge amount of the functional liquid 41 discharged from the droplet discharge heads 14 of the second head row 111 and the third head row 112 of the second group 84 is adjusted. Next, through the same steps, the discharge amount of the functional liquid 41 discharged from the droplet discharge heads 14 of the first head row 110 to the third head row 112 of the third group 85 is adjusted.

  Next, in step S <b> 76, the first head row 110 of the fourth group 86 is moved to a location facing the weight measuring device 21. Thereafter, in step S77, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the fourth group 86 is adjusted. At this time, the discharge amounts of the fourth head row 74 and the fifth head row 75 in the droplet discharge heads 14 are adjusted. Then, by repeating Steps S76 to S78, the discharge amount of the functional liquid 41 discharged from the droplet discharge heads 14 of the second head row 111 and the third head row 112 of the fourth group 86 is adjusted. Next, through the same steps, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 of the first head row 110 to the third head row 112 of the fifth group 87 is adjusted.

  Then, after the adjustment, in step S80, the droplets 44 are ejected and applied to the substrate 7 based on a predetermined drawing pattern. The planned drawing pattern is applied and step S80 is ended, and the manufacturing process of discharging and applying droplets to the substrate 7 is ended.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to this embodiment, after all the discharge amounts in the droplet discharge heads 14 mounted on one carriage 12 are measured, the carriages 12 are sequentially changed and mounted on each carriage 12. The discharge amount in the droplet discharge head 14 is measured and adjusted. Therefore, measurement and adjustment are performed by reducing the amount of movement of the carriage 12. As a result, a resource-saving measurement method and adjustment method can be obtained.

(Eighth embodiment)
In this embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 5 and 13. FIG. 13 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate. This embodiment differs from the seventh embodiment in that adjustment is performed for each row of the droplet discharge head group.

  In the flowchart of FIG. 13, step S91 corresponds to an adjustment order setting step, and is a step of setting an order for adjusting the discharge amount of the droplet discharge head. Next, the process proceeds to step S92. Step S92 corresponds to a moving step, and is a step of moving the carriage and moving the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S93. Step S93 corresponds to the first discharge amount adjustment step, and is a step of adjusting the discharge amount by discharging the functional liquid from one row of droplet discharge heads to measure the discharge amount. Next, the process proceeds to step S94. Step S94 corresponds to a moving step, and is a step of moving the carriage and moving the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S95. Step S95 corresponds to the second discharge amount adjustment step, and after disposing the head row different from step S93, the functional liquid is discharged from the liquid droplet discharge heads in one row, and the discharge amount is measured. Is a step of adjusting Next, the process proceeds to step S96.

  Step S96 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted in the same row, and is a step of determining whether or not the discharge amounts in all the droplet discharge heads in 12 columns have been adjusted. is there. When there is an unadjusted column (NO), the process proceeds to step S92. In step S96, when the ejection amounts in all the 12 droplet ejection heads are adjusted (YES), the process proceeds to step S97. Step S97 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted, and a step of determining whether or not the droplet discharge heads of all rows set to be adjusted in step S91 have been adjusted. It is. When there is a droplet ejection head whose ejection amount is not adjusted among the droplet ejection heads to be adjusted (NO), the process proceeds to step S92. In step S97, when the discharge amounts of all the droplet discharge heads in the droplet discharge heads to be adjusted are adjusted (YES), the process proceeds to step S98. Step S98 corresponds to a coating process, and is a process for discharging and applying droplets to the substrate. Thus, the manufacturing process for discharging and applying the functional liquid to the substrate is completed.

  Next, with reference to FIG. 5, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately adjusted and applied to the workpiece in correspondence with the steps shown in FIG. 13 will be described in detail. Step S91 is the same as step S1 shown in FIG. In step S <b> 92, the first head row 110 of the first group 83 is moved to a location facing the weight measuring device 21. In step S93, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the first group 83 is adjusted. In step S94, the first head row 110 of the fourth group 86 is moved to a location facing the weight measuring device 21. Thereafter, in step S95, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the fourth group 86 is adjusted. At this time, the discharge amounts of the fourth head row 74 and the fifth head row 75 in the droplet discharge heads 14 are adjusted.

  Next, in step S <b> 96 and step S <b> 92, the first head row 110 of the second group 84 is moved to a location facing the weight measuring device 21. Thereafter, in step S93 to step S95, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the second group 84 and the fifth group 87 is adjusted.

  Next, in step S <b> 96 and step S <b> 92, the first head row 110 of the third group 85 is moved to a location facing the weight measuring device 21. In step S92, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the third group 85 is adjusted. Thereafter, in step S94 and step S95, since there is no liquid droplet ejection head 14 that requires adjustment, the step is omitted and the process proceeds to step S97. Through the above steps, the ejection amount of the functional liquid 41 ejected from the droplet ejection head 14 in the first head row 110 of the first head column 71 to the twelfth head column 82 is adjusted.

  Next, in step S97, it is confirmed that all adjustments of the droplet discharge heads 14 in the first head row 110 have been performed, and a determination is made to shift to adjustment of the droplet discharge heads 14 in the second head row 111. In step S92, the droplet discharge heads 14 in the second head row 111 of the first group 83 are moved to a location facing the weight measuring device 21. Thereafter, Steps S92 to S97 are repeated to adjust the droplet discharge heads 14 in the second head row 111. At this time, the droplet discharge head 14 is adjusted in the order of the first group 83, the fourth group 86, the second group 84, the fifth group 87, and the third group 85. Next, the process proceeds to the third head row 112, and the ejection amount of the functional liquid 41 ejected from the droplet ejection head 14 is adjusted in the same order.

  After the adjustment, in step S98, the droplets 44 are ejected and applied to the substrate 7 based on a predetermined drawing pattern. The planned drawing pattern is applied and step S98 is ended, and the manufacturing process of discharging and applying droplets to the substrate 7 is ended.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to the present embodiment, after adjusting the discharge amount in one droplet discharge head 14, the discharge amount of the droplet discharge head located next to the adjusted droplet discharge head 14 is adjusted. . Therefore, even when there is a change in the ambient temperature, the droplet discharge heads 14 located at close positions in the same row can adjust the discharge amount with an error due to the influence of substantially the same temperature.

  (2) According to the present embodiment, the droplet discharge heads 14 at adjacent positions in the same row can adjust the discharge amount with an error due to the influence of substantially the same temperature. can do. As a result, application can be performed without forming a vertical line in the scanning direction of the droplet discharge head 14 (Y direction in FIG. 5).

(Ninth embodiment)
In the present embodiment, an embodiment of a characteristic adjustment method for adjusting the discharge amount of the droplet discharge device will be described with reference to FIGS. 5 and 14. FIG. 14 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate. This embodiment is different from the eighth embodiment in that, after all the first ejection steps are performed in the same row, the second ejection step is performed, and adjustment is performed for each row of the droplet ejection head group. In the point.

  In the flowchart of FIG. 14, step S <b> 101 corresponds to an adjustment order setting step, and is a step of setting the order for adjusting the discharge amount of the droplet discharge head. Next, the process proceeds to step S102. Step S102 corresponds to a moving step, and is a step of moving the carriage and moving the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S103. Step S103 corresponds to a first discharge amount adjustment step, and is a step of adjusting the discharge amount by discharging the functional liquid from one row of droplet discharge heads to measure the discharge amount. Next, the process proceeds to step S104. Step S104 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted in the same row, and the ejection amounts of all the droplet ejection heads in the first group, the second group, and the third group are determined. This is a step of determining whether adjustment has been made. When there is an unadjusted droplet discharge head group (NO), the process proceeds to step S102. In step S104, when the discharge amount in all the droplet discharge heads of the first group, the second group, and the third group is adjusted (YES), the process proceeds to step S105. Step S105 corresponds to a moving step, and is a step of moving the carriage and moving the droplet discharge head to be measured to a location facing the weight measuring device. Next, the process proceeds to step S106. Step S106 corresponds to the second discharge amount adjusting step, and is a step of adjusting the discharge amount in all the droplet discharge heads of the fourth group and the fifth group. Next, the process proceeds to step S107.

  Step S107 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted in the same row, and the discharge amounts of all the droplet discharge heads in the same row in the fourth group and the fifth group are totaled. This is a step of determining whether or not the adjustment has been made. When there is an unadjusted droplet discharge head group (NO), the process proceeds to step S105. In step S107, when the discharge amounts of all the droplet discharge heads in the same row in the fourth group and the fifth group are adjusted (YES), the process proceeds to step S108. Step S108 corresponds to a step of determining whether or not all the heads to be adjusted have been adjusted, and a step of determining whether or not the droplet discharge heads of all rows set to be adjusted in step S101 have been adjusted. It is. When there is a droplet discharge head whose discharge amount is not adjusted among the droplet discharge heads to be adjusted (NO), the process proceeds to step S102. In step S108, when the discharge amounts of all the droplet discharge heads in the droplet discharge head to be adjusted are adjusted (YES), the process proceeds to step S109. Step S109 corresponds to a coating process, and is a process for discharging and applying droplets to the substrate. Thus, the manufacturing process for discharging and applying the functional liquid to the substrate is completed.

  Next, with reference to FIG. 5, a manufacturing method in which the discharge amount discharged from the droplet discharge head is accurately adjusted in correspondence with the steps shown in FIG. 14 and applied to the workpiece will be described in detail. Step S101 is the same as step S1 shown in FIG. In step S <b> 102, the first head row 110 of the first group 83 is moved to a location facing the weight measuring device 21. In step S103, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the first group 83 is adjusted.

  In step S104, the second group 84 is set as the next droplet discharge head group to be adjusted. Next, in step S <b> 102, the first head row 110 of the second group 84 is moved to a location facing the weight measuring device 21. Thereafter, in step S103, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the second group 84 is adjusted. In step S104, the third group 85 is set as a droplet discharge head group to be adjusted next. Thereafter, in step S102 and step S103, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the third group 85 is adjusted. In the next step S104, it is confirmed that the adjustment of the first head row 110 of the first group 83, the second group 84, and the third group 85 is completed.

  Next, in step S <b> 105, the first head row 110 of the fourth group 86 is moved to a location facing the weight measuring device 21. Thereafter, in step S106, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the fourth group 86 is adjusted. Next, in step S107, the fifth group 87 is set as a droplet discharge head group to be adjusted next. In step S <b> 105, the first head row 110 of the fifth group 87 is moved to a location facing the weight measuring device 21. Thereafter, in step S106, the ejection amount of the functional liquid 41 ejected from the droplet ejection heads 14 in the first head row 110 of the fifth group 87 is adjusted. Next, in step S107, it is confirmed that the fourth group 86 and the fifth group 87 have been adjusted.

  Next, in step S108, it is confirmed that all adjustments of the droplet discharge heads 14 in the first head row 110 have been performed, and a determination is made to shift to adjustment of the droplet discharge heads 14 in the second head row 111. Then, steps S102 to S108 are repeated to adjust the droplet discharge heads 14 in the second head row 111. At this time, the droplet discharge head 14 is adjusted in the order of the first group 83, the second group 84, the third group 85, the fourth group 86, and the fifth group 87. Next, the process proceeds to the third head row 112, and the ejection amount of the functional liquid 41 ejected from the droplet ejection head 14 is adjusted in the same order.

  After the adjustment, in step S109, the droplets 44 are ejected and applied to the substrate 7 based on a predetermined drawing pattern. The planned drawing pattern is applied and step S109 is ended, and the manufacturing process for discharging and applying droplets to the substrate 7 is ended.

As described above, according to the present embodiment, in addition to the effects (1) to (5) in the first embodiment, the following effects are obtained.
(1) According to this embodiment, in the droplet discharge heads 14 belonging to the same row, after measuring the discharge amount in the droplet discharge head 14 located in a close place, the rows are sequentially changed and measured. When measuring the discharge amount of the droplet discharge head 14, the droplet discharge head 14 is measured in an environment where the temperature is controlled. At this time, the temperature often changes with a large period. At this time, the discharge amount of the droplet discharge head located in the vicinity of a certain droplet discharge head is continuously adjusted. Accordingly, the droplet discharge heads 14 located at close positions in the same row can adjust the discharge amount with an error due to the influence of substantially the same temperature.

  (2) According to the present embodiment, the droplet discharge heads 14 at positions close to the same row can adjust the discharge amount with an error due to the influence of substantially the same temperature. be able to. As a result, application can be performed without forming vertical lines in the scanning direction of the droplet discharge head 14.

  (3) According to the present embodiment, when adjusting the discharge amount in the droplet discharge heads 14 of the first group 83 in step S103, the droplet discharge heads 14 of the second group 84 are adjusted to the carriage 12 to be adjusted next. Are arranged side by side. Then, the fifth head row 75 to the eighth head row 78 to be measured next stand by in the same order as that for measurement. At this time, the sixth head row 76 and the seventh head row 77 are sandwiched between the fifth head row 75 and the eighth head row 78 even when waiting. Accordingly, the sixth head row 76 and the seventh head row 77 can shift from the standby state to the adjustment process with little temperature change. As a result, the droplet discharge head 14 can be adjusted with little temperature change, and can be adjusted with high accuracy.

(Tenth embodiment)
Next, an embodiment in which a liquid crystal display device is manufactured by applying the ejection method described above will be described with reference to FIG.

  First, a liquid crystal display device which is one of electro-optical devices including a color filter will be described. FIG. 15 is a schematic exploded perspective view showing the structure of the liquid crystal display device.

  As shown in FIG. 15, the liquid crystal display device 120 as an electro-optical device includes a transmissive liquid crystal display panel 121 and an illumination device 123 that illuminates the liquid crystal display panel 121. The liquid crystal display panel 121 is arranged with the liquid crystal 122 sandwiched between an element substrate 124 as a first substrate and a counter substrate 125 as a second substrate. A lower polarizing plate 126 is disposed on the lower surface of the element substrate 124, and an upper polarizing plate 127 is disposed on the upper surface of the counter substrate 125.

  The element substrate 124 includes a substrate 128 made of a light transmissive material, and an insulating film 129 is formed on the substrate 128. On the insulating film 129, pixel electrodes 130 as electrodes are formed in a matrix. Each pixel electrode 130 is formed with a TFT (Thin Film Transistor) element 131 as a semiconductor having a switching function. The pixel electrode 130 is connected to the drain terminal of the TFT element 131.

  Surrounding each pixel electrode 130 and the TFT element 131, a scanning line 132 as a wiring and a data line 133 as a wiring are formed in a grid pattern. The scanning line 132 is connected to the gate terminal of the TFT element 131, and the data line 133 is connected to the source terminal of the TFT element 131.

  An alignment film 135 is formed on the liquid crystal 122 side of the element layer 134 including the pixel electrode 130, the TFT element 131, the scanning line 132, the data line 133, and the like.

  The counter substrate 125 includes a substrate 137 made of a light transmissive material. A lower layer bank 138 made of a light-shielding material is formed in a lattice shape below the substrate 137, and an upper layer bank 139 made of an organic compound or the like is formed below the lower layer bank 138. The lower layer bank 138 and the upper layer bank 139 constitute a partition 140.

  Red (R), green (G), and blue (B) color filters 141R, 141G, and 141B are formed as colored layers 141 in the recesses partitioned in a matrix by the partition 140. An overcoat layer 142 is formed as a planarizing layer that covers the partition wall 140 and the color filters 141R, 141G, and 141B. A counter electrode 143 as an electrode made of a transparent conductive film such as ITO (Indium Tin Oxide) is formed so as to cover the overcoat layer 142. Further, an alignment film 144 is formed on the liquid crystal 122 side of the counter electrode 143. The alignment film 144 and the alignment film 135 are formed with groove-shaped unevenness, and the liquid crystal 122 is formed along the unevenness.

  The liquid crystal 122 has a property that the tilt angle of the liquid crystal 122 changes when a voltage is applied to the pixel electrode 130 and the counter electrode 143 sandwiching the liquid crystal 122, and the voltage applied to the liquid crystal 122 by the switching operation of the TFT element 131. Is controlled to control the tilt angle of the liquid crystal 122 to perform the operation of transmitting or blocking light for each pixel. In addition, since light does not naturally enter the pixel where the light is blocked by the liquid crystal 122, the color is black. In this way, by operating the liquid crystal 122 as a shutter by the switching operation of the TFT, the transmission of light is controlled for each pixel, and the image can be displayed by blinking the pixel.

  The pixel electrode 130 is electrically connected to the drain terminal of the TFT element 131. By turning on the TFT for a certain period, the pixel signal supplied from the data line 133 is given to each pixel electrode 130 at a predetermined timing. Supplied in. The voltage level of the pixel signal having a predetermined level supplied to the pixel electrode 130 in this way is held between the counter electrode 143 and the pixel electrode 130 of the counter substrate 125, and the liquid crystal 122 is selected according to the voltage level of the pixel signal. The amount of transmitted light changes.

  The illumination device 123 includes a light source, and includes a light guide plate, a diffusion plate, a reflection plate, and the like that can emit light from the light source toward the liquid crystal display panel 121. As the light source, a white LED, EL, cold cathode tube, or the like can be used. In this embodiment, a cold cathode tube is employed.

  The lower polarizing plate 126 and the upper polarizing plate 127 may be combined with an optical functional film such as a retardation film used for the purpose of improving the viewing angle dependency. The liquid crystal display panel 121 is not limited to a TFT element as an active element, but may include a TFD (Thin Film Diode) element, or may be a passive liquid crystal display device in which electrodes constituting pixels intersect with each other. .

  In the process of forming the color filters 141R, 141G, and 141B on the counter substrate 125, the ejection methods in the first to ninth embodiments are used. Specifically, the lower layer bank 138 and the upper layer bank 139 are formed on the substrate 137, and the partition 140 is formed. The method for forming the partition wall 140 is well known and will not be described. And the color ink of each color is manufactured by melt | dissolving the material of color filter 141R, 141G, 141B in a solvent, or disperse | distributing it to a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, this color ink is discharged and applied to the concave portion surrounded by the partition 140.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the color ink The liquid is discharged and applied. Thereafter, the applied color ink is heated and dried to solidify, thereby forming the color filters 141R, 141G, and 141B.

  Further, in the step of forming the counter electrode 143 below the overcoat layer 142 in the counter substrate 125, the ejection methods in the first to ninth embodiments are used. Specifically, the material liquid of the electrode film is manufactured by dissolving the material of the counter electrode 143 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the surface of the overcoat layer 142.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Then, the counter electrode 143 is formed by heating and drying and solidifying the applied electrode film material liquid.

  Further, in the step of forming the alignment film 144 below the counter electrode 143 in the counter substrate 125, the ejection methods in the first to ninth embodiments are used. Specifically, a material liquid for the alignment film is manufactured by dissolving the material of the alignment film 144 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the alignment film is discharged and applied to the lower side of the counter electrode 143.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the alignment film The material liquid is discharged and applied. Thereafter, the alignment film 144 is formed by solidifying the applied alignment film material by heating and drying.

  Further, in the process of forming the scanning lines 132 and the data lines 133 in the element layer 134 of the element substrate 124, the ejection method in the first to ninth embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is to be formed becomes a recess. Then, a wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid is discharged and applied. Then, the scanning line 132 and the data line 133 are formed by heating and drying and solidifying the applied wiring material liquid.

  Further, in the step of forming the TFT element 131 in the element layer 134 in the element substrate 124, the ejection method in the first to ninth embodiments is used. Specifically, a bank is formed of an insulating film so that the place where the TFT element 131 is formed becomes a recess. Then, a material liquid for the TFT element is manufactured by dissolving the material of the TFT element such as silicon in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the TFT element is discharged and applied to the recesses formed between the banks.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the TFT element The material liquid is discharged and applied. Thereafter, the material liquid of the TFT element is heated and dried to solidify and crystallize. Thereafter, after ion doping, an insulating film and a terminal are formed to form a TFT element 131.

  Further, in the step of forming the pixel electrode 130 on the surface of the element layer 134 in the element substrate 124, the ejection method in the first to ninth embodiments is used. Specifically, a material liquid for the electrode film is manufactured by dissolving the material of the pixel electrode 130 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the surface of the element layer 134.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Then, the pixel electrode 130 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the alignment film 135 above the element layer 134 in the element substrate 124, the ejection method in the first to ninth embodiments is used. Specifically, a material liquid for the alignment film is manufactured by dissolving the material for the alignment film 135 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the alignment film is discharged and applied to the upper side of the element layer 134.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the alignment film The material liquid is discharged and applied. Then, the alignment film 135 is formed by solidifying the applied alignment film material by heating and drying.

  Further, in order to sandwich the liquid crystal 122 between the element substrate 124 and the counter substrate 125, the ejection method in the first to ninth embodiments is used in the step of applying the liquid crystal 122 to the element substrate 124. Specifically, the liquid crystal material liquid is discharged and applied to the upper side of the alignment film 135 using the droplet discharge device 1 or the droplet discharge device 108.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid is discharged and applied.

As described above, this embodiment has the following effects.
(1) According to this embodiment, in the process of manufacturing the color filters 141R, 141G, and 141B, the discharge method of the color ink can be accurately performed by using the discharge method according to the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the color filters 141R, 141G, and 141B in which the color ink application amount is accurately applied.

  (2) According to the present embodiment, in the process of manufacturing the alignment films 135 and 144, the discharge method in the material of the alignment film can be accurately performed by using the discharge method in the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the alignment films 135 and 144 in which the application amount of the alignment film material is applied with high accuracy.

  (3) According to the present embodiment, in the step of applying the liquid crystal, the discharge method of the first to ninth embodiments is used to accurately discharge and apply the liquid crystal discharge amount. . Accordingly, it is possible to manufacture the liquid crystal display device 120 in which the amount of liquid crystal applied is accurately applied.

  (4) According to the present embodiment, in the process of manufacturing the pixel electrode 130 and the counter electrode 143, the discharge amount of the electrode material can be accurately controlled by using the discharge method according to the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the pixel electrode 130 and the counter electrode 143 to which the application amount of the electrode material is applied with high accuracy.

  (5) According to the present embodiment, in the process of manufacturing the scanning line 132 and the data line 133, the ejection amount of the wiring material can be accurately controlled by using the ejection method according to the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 132 and the data lines 133 in which the amount of wiring material applied is accurately applied.

  (6) According to the present embodiment, in the process of manufacturing the TFT element 131, by using the ejection method according to the first to ninth embodiments, the ejection amount of the semiconductor material can be ejected with high accuracy and applied. is doing. Therefore, it is possible to manufacture the TFT element 131 in which the semiconductor material is applied with high accuracy.

(Eleventh embodiment)
Next, an embodiment in which an organic EL device is manufactured by applying the above-described ejection method will be described with reference to FIG.

  First, an organic EL device that is one of electro-optical devices will be described. FIG. 16 is a schematic exploded perspective view showing the structure of the organic EL device.

  As shown in FIG. 16, the organic EL device 147 as an electro-optical device includes a substrate 148. An insulating film 149 is formed on the upper side of the substrate 148. On the insulating film 149, contact electrodes 150 are formed in a matrix, and TFT elements 151 serving as a semiconductor having a switching function are formed at positions adjacent to the contact electrodes 150. A contact electrode 150 is connected to the drain terminal of the TFT element 151.

  Scanning lines 152 as wirings and data lines 153 as wirings are formed in a grid pattern so as to surround each contact electrode 150 and TFT element 151. The scanning line 152 is connected to the gate terminal of the TFT element 151, and the data line 153 is connected to the source terminal of the TFT element 151.

  An element layer 154 including a contact electrode 150, a TFT element 151, a scanning line 152, a data line 153, and the like is formed. An insulating film 155 is formed above the element layer 154, and banks 156 are formed in a lattice shape above the insulating film 155.

  A pixel electrode 157 as an electrode is formed at each bottom of the concave region formed by the bank 156, and the pixel electrode 157 is electrically connected to the contact electrode 150. A hole transport layer 158 as a light emitting element is formed on the upper surface of the pixel electrode 157, and light emitting layers 159 R, 159 G, and 159 B as light emitting elements are formed on the upper surface of the hole transport layer 158. The hole transport layer 158 and the light emitting layers 159R, 159G, and 159B form a functional layer 160 as a light emitting element.

  The light emitting layer 159R is a light emitting layer made of an organic light emitting material that emits red light, and the light emitting layer 159G as a light emitting element is a light emitting layer made of an organic light emitting material that emits green light. Similarly, the light emitting layer 159B as the light emitting element is a light emitting layer made of an organic light emitting material that emits blue light.

  A cathode 161 as an electrode made of a light-transmitting conductive material or the like is formed over the entire upper surface of the functional layer 160 and the bank 156. In the present embodiment, the cathode 161 employs, for example, ITO.

  A sealing film 162 made of a light transmissive material or the like is formed on the upper surface of the cathode 161 to prevent the cathode 161 and the functional layer 160 from being oxidized by oxygen in the air.

  When a voltage is applied between the pixel electrode 157 and the cathode 161, the hole transport layer 158 flows only holes. The light emitting layers 159R, 159G, and 159B have a property of emitting light by energy when the holes supplied from the hole transport layer 158 and the electrons supplied from the cathode 161 are combined. The TFT element 151 performs a switching operation and controls the amount of light emitted from the light emitting layers 159R, 159G, and 159B by controlling the voltage applied to the functional layer 160. In this manner, by controlling the amount of light emitted by the light emitting layers 159R, 159G, and 159B, the amount of light can be controlled for each pixel, and the image can be displayed by blinking the pixel.

  The pixel electrode 157 is electrically connected to the drain terminal of the TFT element 151, and the pixel signal supplied from the data line 153 is supplied to each pixel electrode 157 at a predetermined timing by turning on the TFT for a certain period. Supplied in. The voltage level of the pixel signal having a predetermined level supplied to the pixel electrode 157 in this manner is held between the cathode 161 and the pixel electrode 157, and the light emitting layers 159R, 159G, and 159B are used according to the voltage level of the pixel signal. The amount of light emitted changes.

  In the step of forming the wiring of the scanning line 152 and the data line 153 in the element layer 154, the ejection method in the first to ninth embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is formed becomes a recess. Then, the wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid is discharged and applied. Then, the scanning line 152 and the data line 153 are formed by heating and drying and solidifying the applied wiring material liquid.

  Further, in the step of forming the TFT element 151 in the element layer 154, the ejection method in the first to ninth embodiments is used. Specifically, a bank is formed with an insulating film so that the place where the TFT element 151 is formed becomes a recess. Then, a material liquid for the TFT element is manufactured by dissolving the material of the TFT element such as silicon in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the TFT element is discharged and applied to the recesses formed between the banks.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the TFT element The material liquid is discharged and applied. Thereafter, the material liquid of the TFT element is heated and dried to solidify and crystallize. Then, after ion doping, the TFT element 151 is formed by forming an insulating film and a terminal.

  Further, in the step of forming the pixel electrode 157 on the surface of the insulating film 155, the ejection method in the first to ninth embodiments is used. Specifically, a material liquid of the electrode film is manufactured by dissolving the material of the pixel electrode 157 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the surface of the insulating film 155.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Then, the pixel electrode 157 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the hole transport layer 158 on the surface of the pixel electrode 157, the ejection method in the first to ninth embodiments is used. Specifically, the material liquid of the hole transport layer is manufactured by dissolving the material of the hole transport layer 158 as the light emitting element forming material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the hole transport layer is discharged and applied to the surface of the pixel electrode 157.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid of the transport layer is discharged and applied. Thereafter, the hole transport layer 158 is formed by heating and solidifying the material liquid of the hole transport layer by heating.

  Further, in the step of forming the light emitting layers 159R, 159G, and 159B on the surface of the hole transport layer 158, the ejection method in the first to ninth embodiments is used. Specifically, the material liquid of the light emitting layer is manufactured by dissolving the material of the light emitting layers 159R, 159G, and 159B as the light emitting element forming material in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the light emitting layer is discharged and applied to the surface of the hole transport layer 158.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the light emitting layer The material liquid is discharged and applied. Then, the light emitting layer 159R, 159G, and 159B are formed by heat-drying and solidifying the material liquid of a light emitting layer.

  Further, in the step of forming the cathode 161 on the upper surface of the functional layer 160 and the bank 156, the ejection method in the first to ninth embodiments is used. Specifically, the material of the cathode 161 is dissolved in a solvent or dispersed in a dispersion medium to produce a cathode material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the cathode material liquid is discharged and applied to the upper surfaces of the functional layer 160 and the bank 156.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid is discharged and applied. Thereafter, the cathode 161 is formed by solidifying the cathode material liquid by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the scanning line 152 and the data line 153, the ejection amount of the wiring material can be accurately controlled by using the ejection method in the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 152 and the data lines 153 in which the coating amount of the wiring material is accurately applied.

  (2) According to the present embodiment, in the process of manufacturing the TFT element 151, by using the ejection method in the first to ninth embodiments, the ejection amount of the semiconductor material can be ejected with high accuracy and applied. is doing. Therefore, it is possible to manufacture the TFT element 151 to which the semiconductor material is applied with high accuracy.

  (3) According to the present embodiment, in the process of manufacturing the pixel electrode 157 and the cathode 161, the discharge method of the first to ninth embodiments is used to accurately discharge the discharge amount of the electrode material. And apply. Accordingly, it is possible to manufacture the pixel electrode 157 and the cathode 161 to which the electrode material is applied with high accuracy.

  (4) According to the present embodiment, in the process of manufacturing the functional layer 160, the discharge amount of the light emitting element forming material is discharged with high accuracy by using the discharge method in the first to ninth embodiments. Apply. Therefore, the functional layer 160 to which the application amount of the light emitting element forming material is accurately applied can be manufactured.

(Twelfth embodiment)
Next, an embodiment in which a surface electric field display device is manufactured by applying the above-described ejection method will be described with reference to FIG.

  First, a surface electric field display device which is one of electro-optical devices will be described. FIG. 17 is a schematic exploded perspective view showing the structure of the surface electric field display device.

  As shown in FIG. 17, the surface electric field display device 163 as an electro-optical device mainly includes an element substrate 164 and a counter substrate 165. The element substrate 164 includes a substrate 166. An insulating film 167 is formed over the substrate 166. On the insulating film 167, electron-emitting devices 168 as a pair of substantially circular electrodes are formed in a matrix. When one electron-emitting device 168 does not function, the other electron-emitting device 168 operates. It is like that. The scanning lines 169 as wirings and the data lines 170 as wirings are formed in a grid pattern so as to surround each pair of electron-emitting devices 168. One pair of data lines 170 is disposed between a pair of electron-emitting devices 168.

  The electron-emitting device 168 is divided into two by a line passing through the center, and one of the electron-emitting devices 168 is connected to the scanning line 169. The other side of the electron-emitting device 168 is connected to the data line 170. The electron emission element 168, the scanning line 169, the data line 170, and the like constitute an element layer 171.

  The counter substrate 165 includes a substrate 172 made of a light transmissive material. An anode 173 as an electrode made of a light transmissive material is formed below the substrate 172. A color fluorescent film 174 as a light emitting element is formed on the lower surface of the anode 173, and a protective film 175 is formed so as to cover the color fluorescent film 174 and the anode 173.

  The element substrate 164 and the counter substrate 165 are bonded to each other through a spacer (not shown), and the element substrate 164 and the counter substrate 165 are degassed to be in a substantially vacuum state.

  In the electron-emitting device 168 in which the electrode is divided into two, when a voltage is applied between the two electrodes, the gap between the electrodes is formed narrow, so that minute electrons pass between the two electrodes. Then, when an electric field is formed by applying a voltage between the electron-emitting device 168 and the anode 173, an electromagnetic force acts on the electrons passing between the two electrodes, so that the electrons move to the anode 173. .

  Some of the electrons that move toward the anode 173 collide with the color phosphor film 174. The color phosphor film 174 emits light because it converts energy from electron collision into light. The surface electric field display device 163 includes a data voltage driving circuit and a scanning voltage driving circuit (not shown), and the data voltage driving circuit and the scanning voltage driving circuit control the voltage applied to the electron-emitting device 168. Since the voltage applied to the electron-emitting device 168 and the amount of light emitted from the color fluorescent film 174 have a positive correlation, the data voltage driving circuit and the scanning voltage driving circuit can control the amount of light emitted from the color fluorescent film 174. It has become.

  The data voltage driving circuit and the scanning voltage driving circuit can display an image by controlling the amount of light for each pixel and blinking the pixel. The color fluorescent film 174 is provided with fluorescent films of respective colors that emit red, blue, and green light. The data voltage driving circuit and the scanning voltage driving circuit select and control the color to be emitted. A color image can be displayed.

  In the step of forming the scanning lines 169 and the data lines 170 in the element layer 171, the ejection method in the first to ninth embodiments is used. Specifically, a bank is formed of an insulating film so that a place where a wiring is to be formed becomes a recess. Then, a wiring material liquid is manufactured by dissolving the wiring material in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this wiring is discharged and applied to the recesses formed between the banks.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, The material liquid is discharged and applied. Then, the scanning line 169 and the data line 170 are formed by solidifying the applied wiring material liquid by heating and drying.

  Further, in the step of forming the electron-emitting device 168 in the device layer 171, the ejection method in the first to ninth embodiments is used. Specifically, an electrode film material liquid is manufactured by dissolving an electrode material in the electron-emitting device 168 in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged onto the surface of the insulating film 167 and applied.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Thereafter, the electrode film in the electron-emitting device 168 is formed by heating and solidifying the material liquid of the electrode film.

  Further, in the step of forming the anode 173 on the surface of the substrate 172, the ejection method in the first to ninth embodiments is used. Specifically, the electrode film material for the anode 173 is dissolved in a solvent or dispersed in a dispersion medium to produce an electrode film material solution. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the surface of the substrate 172.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Then, the anode 173 is formed by solidifying the electrode film material liquid by heating and drying.

  Further, in the step of forming the color fluorescent film 174 on the surface of the anode 173, the ejection method in the first to ninth embodiments is used. Specifically, a color fluorescent film material solution is produced by dissolving a color fluorescent film material as a light emitting element forming material in a solvent or dispersing in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the surface of the anode 173.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the color fluorescence The material liquid of the film is discharged and applied. Thereafter, the color phosphor film 174 is formed by solidifying the material liquid of the color phosphor film by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the scanning line 169 and the data line 170, the ejection amount of the wiring material can be accurately controlled by using the ejection method according to the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the scanning lines 169 and the data lines 170 to which the wiring material is applied with high accuracy.

  (2) According to the present embodiment, in the process of manufacturing the electron-emitting device 168 and the anode 173, the discharge amount of the electrode material can be accurately controlled by using the discharge method according to the first to ninth embodiments. Discharge and apply. Therefore, it is possible to manufacture the electron-emitting device 168 and the anode 173 in which the application amount of the electrode material is accurately applied.

  (3) According to the present embodiment, in the process of manufacturing the color phosphor film 174, the ejection amount of the color phosphor film forming material can be accurately controlled by using the ejection method according to the first to ninth embodiments. Discharge and apply. Accordingly, it is possible to manufacture the color fluorescent film 174 on which the coating amount of the color fluorescent film forming material is accurately applied.

(13th Embodiment)
Next, an embodiment in which a plasma display device is manufactured by applying the above-described ejection method will be described with reference to FIG.

  First, a plasma display device which is one of electro-optical devices will be described. FIG. 18 is a schematic exploded perspective view showing the structure of the plasma display device.

  As shown in FIG. 18, a plasma display device 178 as an electro-optical device mainly includes a back plate 179 and a front plate 180. The back plate 179 includes a substrate 181. An insulating film 182 is formed on the upper surface of the substrate 181, and address electrodes 183 and insulating films 184 as electrodes are formed in stripes on the upper surface of the insulating film 182.

  A dielectric layer 185 is formed on the top surfaces of the address electrodes 183 and the insulating film 184. Grid-shaped ribs 186 are formed on the top surface of the dielectric layer 185, and red (R) and green (G) formed by phosphors or the like at the bottoms of the concave regions formed by being surrounded by the ribs 186. The light emitting layers 187R, 187G, and 187B are formed as blue (B) light emitting elements. The light emitting layers 187R, 187G, and 187B are formed at locations facing the address electrodes 183.

  The front plate 180 includes a substrate 188 made of a light transmissive material, and an insulating film 189 is formed on the lower surface of the substrate 188. A bus electrode 190 as an electrode is formed on the lower surface of the insulating film 189 in a direction orthogonal to the direction in which the address electrode 183 extends. A sustain electrode 191 as a rectangular electrode made of a light-transmitting material is formed adjacent to the bus electrode 190 and facing the light emitting layers 187R, 187G, and 187B, and the bus electrode 190 and the sustain electrode 191 are connected to each other. Are electrically connected.

  A dielectric layer 192 is formed on the lower surface of the sustain electrode 191, and an insulating film 193 made of a non-light-transmissive insulating material is formed on the lower surface of the bus electrode 190. Then, the back plate 179 and the front plate 180 are joined, and the back plate 179 and the front plate 180 are degassed and brought into a substantially vacuum state, and then a gas such as xenon gas is enclosed.

  When a pulse voltage is applied between the address electrode 183 and the sustain electrode 191, plasma is generated between the dielectric layer 185 and the dielectric layer 192. The plasma emits ultraviolet light, and the emitted ultraviolet light excites phosphors contained in the light emitting layers 187R, 187G, and 187B, and red, green, and blue visible light is emitted.

  The plasma display device 178 includes a drive circuit that controls a pulse voltage applied between the address electrode 183 and the sustain electrode 191. This drive circuit can control the amount of light emitted for each pixel by controlling the voltage value and timing of the pulse voltage, and can display an image by blinking the pixel.

  In the step of forming the address electrode 183 on the surface of the insulating film 182 of the back plate 179, the ejection method in the first to ninth embodiments is used. Specifically, a bank-shaped insulating film 184 is formed over the insulating film 182. Next, the material of the electrode film is manufactured by dissolving the material of the address electrode 183 in a solvent or dispersing it in a dispersion medium. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the electrode film is discharged and applied to the concave portion formed by the insulating film 184.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Thereafter, the address electrode 183 is formed by solidifying the electrode film material liquid by heating and drying.

  In the step of forming the bus electrode 190 and the sustain electrode 191 on the surface of the insulating film 189 of the front plate 180, the ejection method in the first to ninth embodiments is used. Specifically, a bank-shaped insulating film 193 is formed over the insulating film 189. Next, the material of the bus electrode 190 and the sustain electrode 191 is dissolved in a solvent or dispersed in a dispersion medium to produce a material liquid for the electrode film. Next, using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of this electrode film is discharged and applied to the recess formed by the insulating film 193.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the electrode film The material liquid is discharged and applied. Thereafter, the bus electrode 190 and the sustain electrode 191 are formed by heat drying and solidifying the material liquid of the electrode film.

  Furthermore, in the step of forming the light emitting layers 187R, 187G, and 187B on the surface of the dielectric layer 185, the ejection method in the first to ninth embodiments is used. Specifically, the material liquid of the light emitting layer is manufactured by dissolving the material of the light emitting layers 187R, 187G, and 187B as the light emitting element forming material in a solvent or dispersing in a dispersion medium. Next, by using the droplet discharge device 1 or the droplet discharge device 108, the material liquid of the light emitting layer is discharged and applied to the surface of the dielectric layer 185.

  At this time, after adjusting the discharge amount of the droplet discharge head 14 in the same steps as the first discharge amount adjustment step and the second discharge amount adjustment step in the first to ninth embodiments, the light emitting layer The material liquid is discharged and applied. Thereafter, the light emitting layer 187R, 187G, and 187B are formed by solidifying the material liquid of the light emitting layer by heating and drying.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the process of manufacturing the address electrode 183, the bus electrode 190, and the sustain electrode 191, the discharge of the electrode material is performed by using the discharge method in the first to ninth embodiments. The amount is accurately discharged and applied. Therefore, it is possible to manufacture the address electrode 183, the bus electrode 190, and the sustain electrode 191 that have been applied with an accurate application amount of the electrode material.

  (2) According to this embodiment, in the process of manufacturing the light emitting layers 187R, 187G, and 187B, the discharge amount of the light emitting element forming material can be reduced by using the discharge method in the first to ninth embodiments. It is discharged and applied with high accuracy. Accordingly, it is possible to manufacture the light emitting layers 187R, 187G, and 187B in which the amount of the light emitting layer applied is accurately applied.

In addition, embodiment is not limited to embodiment mentioned above, A various change and improvement can also be added. A modification will be described below.
(Modification 1)
In the first embodiment, in the droplet discharge device 1 or the droplet discharge device 108, six carriages 12 are arranged, and in each carriage 12, six droplet discharge heads 14 are arranged in two rows. . The number of carriages 12 and the number of droplet discharge heads 14 mounted on each carriage 12 may be set according to the form of the apparatus.

(Modification 2)
In the first embodiment, the piezoelectric element 43 is used as the pressurizing means for pressurizing the cavity 40, but other methods may be used. For example, the diaphragm 42 may be deformed and pressurized using a coil and a magnet. Alternatively, heater wiring may be disposed in the cavity 40 to expand and pressurize the gas contained in the functional liquid 41. In addition, the diaphragm 42 may be deformed and pressurized using electrostatic attraction and repulsion. In any case, the first embodiment is described by measuring and adjusting the droplets 44 ejected by the droplet ejection heads 14 belonging to the droplet ejection head row sandwiched between the other droplet ejection head rows. The same effect can be obtained.

(Modification 3)
In the first embodiment, the discharge amount is calculated by measuring the weight of the droplet 44 discharged from the nozzle 31. However, the discharge amount may be measured by measuring the volume of the discharge amount. For example, the discharge amount may be estimated by collecting the droplets 44 to be discharged into a tube having a constant cross-sectional area and measuring the volume by measuring the length of the liquid in the tube. In the case of a highly volatile liquid, measurement can be performed in a state where it is difficult to volatilize.

(Modification 4)
In the first embodiment, the droplet discharge device 1 includes twelve weight measuring devices 21 and measures the discharge amount of the droplets 44 discharged from the droplet discharge head 14. The number of weight measuring devices 21 is not limited to 12, but may be less than 12 or 12 or more. As the number of the weight measuring devices 21 is larger, the number of droplet ejection heads 14 that can be simultaneously measured is larger, so that the ejection amount can be measured with high productivity.

(Modification 5)
In the first embodiment, in the pre-discharge standby process in steps S2 and S10, the piezoelectric element 43 is driven and warmed up so as not to discharge the droplets 44, but the droplets 44 are discharged and warmed up. The machine may be driven. Compared to the case where the droplets 44 are not ejected, ejecting the droplets 44 can apply a larger amount of energy to the piezoelectric element 43, so that warm-up driving can be performed in a short time.

(Modification 6)
In the first embodiment, the discharge amount is adjusted in the two adjustment steps of the first discharge amount adjustment step in step S22 and the second discharge amount adjustment step in step S24. However, the adjustment step is performed three or more times. The head group may be divided and adjusted as described in step (b). The process may be designed according to the number of weight measuring devices 21 provided in the droplet discharge device 1.

(Modification 7)
In the first embodiment, six droplet discharge heads 14 are arranged on one carriage 12. Not limited to this, one carriage 12 may be equipped with less than six or more than six droplet discharge heads 14. Since the amount of the functional liquid 41 that can be ejected at a time can be increased when the number of liquid droplet ejection heads 14 to be mounted is increased, the liquid can be applied with high productivity. And it can set according to a production form.

(Modification 8)
In the third embodiment, the number of ejections is set to 100 in steps S34 and S44, and the number of ejections is set to 1000 in steps S37 and S47. The number of discharges is not limited to this, and may be set to a number that can be measured accurately. In step S37 and step S47, since fine adjustment is performed, the number of times greater than the number of ejections in step S34 and step S44 can be measured with high accuracy, which is preferable.

(Modification 9)
In the tenth embodiment, color filters 141R, 141G, and 141B are provided inside the liquid crystal display panel 121. The color filters 141 </ b> R, 141 </ b> G, and 141 </ b> B may not be provided inside the liquid crystal display panel 121, and may be provided as separate components from the liquid crystal display panel 121. The yield of the liquid crystal display device 120 can be improved by combining the non-defective product of the liquid crystal display panel 121 selected in the inspection process and the non-defective product having the color filter selected in the inspection process.

1 is a schematic perspective view illustrating a configuration of a droplet discharge device according to a first embodiment. (A) is a schematic plan view of the carriage, (b) is a schematic side view for explaining the structure of the carriage, and (c) is a schematic cross-sectional view of a main part for explaining the structure of the droplet discharge head. The electric control block diagram of a droplet discharge device. The flowchart which shows the manufacturing process which discharges and applies a droplet to a board | substrate. The figure for demonstrating the order which adjusts the discharge amount of a droplet discharge head. FIG. 6 illustrates a discharge method using a droplet discharge device. (A) And (b) is a time chart which shows the drive waveform of a droplet discharge head, (c) is a graph which shows the relationship between drive discharge frequency and nozzle temperature, (d) is a drive voltage, discharge amount, The graph which shows the relationship. FIG. 6 illustrates a discharge method using a droplet discharge device. FIG. 6 illustrates a discharge method using a droplet discharge device. 10 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate according to a third embodiment. FIG. 10 is a schematic perspective view illustrating a configuration of a droplet discharge device according to a seventh embodiment. The flowchart which shows the manufacturing process which discharges and applies a droplet to a board | substrate. The flowchart which shows the manufacturing process which discharges and applies a droplet to the board | substrate which concerns on 8th Embodiment. 10 is a flowchart showing a manufacturing process in which droplets are ejected and applied to a substrate according to a ninth embodiment. FIG. 20 is a schematic exploded perspective view showing a structure of a liquid crystal display device according to a tenth embodiment. FIG. 20 is a schematic exploded perspective view showing the structure of an organic EL device according to an eleventh embodiment. The schematic exploded perspective view which shows the structure of the surface electric field display apparatus which concerns on 12th Embodiment. The schematic exploded perspective view which shows the structure of the plasma display apparatus which concerns on 13th Embodiment.

Explanation of symbols

  7 ... Substrate as a work, 12 ... Carriage, 12a ... First carriage, 12b ... Second carriage, 12c ... Third carriage, 12d ... Fourth carriage, 12e ... Fifth carriage, 12f ... Sixth carriage, 14 ... Liquid Drop ejection head, 41... Functional liquid as liquid, 44. Droplet, 71. First head row as droplet ejection head row, 72... Second head row as droplet ejection head row, 73. Third head row as an ejection head row, 74... Fourth head row as a droplet ejection head row, 75. Fifth head row as a droplet ejection head row, 76. Sixth head as a droplet ejection head row , 77... Seventh head row as the droplet discharge head row, 78. Eighth head row as the droplet discharge head row, 79. Ninth head row as the droplet discharge head row, 80. Column The tenth head row, 81... The eleventh head row as the droplet discharge head row, 82... The twelfth head row as the droplet discharge head row, 104. , 111... Second head row as row, 112... Third head row as row, 120... Liquid crystal display device as electro-optical device, 122... Liquid crystal, 124. ... Opposite substrate as substrate, 130, 157... Pixel electrode as electrode, 131, 151... TFT element as semiconductor, 132, 152, 169... Scanning line as wiring, 133, 153, 170. 135, 144... Alignment film, 141B, 141G, 141R... Color filter, 143... Counter electrode as an electrode, 147. 8, 166, 172, 181, 188 ... substrate, 158 ... hole transport layer as light emitting element, 159B, 159G, 159R ... light emitting layer as light emitting element, 160 ... functional layer as light emitting element, 161 ... as electrode Cathode, 163... Surface electric field display device as electro-optical device, 168... Electron emission element as electrode, 173... Anode as electrode, 178... Plasma display device as electro-optical device, 183. ... bus electrode as electrode, 191 ... sustain electrode as electrode.

Claims (20)

A discharge amount adjusting method for adjusting the discharge amount of a plurality of droplet discharge heads or et liquid material discharged constituting a plurality of liquid droplet ejection head array,
Among the previous SL plurality of droplet ejection heads column, the liquid material from the liquid drop ejecting head which constitutes the third droplet ejection head array disposed between the first and second droplet ejection head row A first measurement step of discharging and measuring a discharge amount of the discharged liquid material;
A first adjustment step of adjusting the discharge amount of the droplet discharge head measured in the first measurement step;
Previous SL second droplet ejection head row, disposed between the other of the liquid droplet ejection head array, the liquid material ejected from the liquid drop ejecting head which constitutes the second droplet ejection head array a second measuring step of measuring the discharge amount of the liquid material out ejection,
And a second adjustment step of adjusting the discharge amount of the droplet discharge head measured in the second measurement step. The discharge amount adjusting method according to claim 1 ,
A first discharge amount adjustment step of repeating the first measurement step and the first adjustment step to bring the discharge amount close to a target discharge amount;
A discharge amount adjustment method comprising: a second discharge amount adjustment step of repeating the second measurement step and the second adjustment step to bring the discharge amount close to a target discharge amount. The discharge amount adjusting method according to claim 1 ,
The first measurement step and the second measurement step are:
A pre-discharge standby step in which the liquid droplet discharge head scheduled to measure the discharge amount waits;
A measurement discharge step of discharging the liquid material;
Measuring step of measuring the discharge amount of the discharged liquid material,
In the standby step before discharge, the droplet discharge head is warm-up driven. The discharge amount adjusting method according to claim 3 ,
The warming-up driving is performed so as not to eject the liquid material from the droplet ejection head, and the warming-up driving is performed. The discharge amount adjusting method according to claim 3 ,
The warming-up driving is performed by performing warm-up driving at substantially the same location as the location where the liquid material is ejected in the measurement ejection step. The discharge amount adjusting method according to claim 2 ,
In the first ejection amount adjustment step, said first and second droplet ejection the liquid drop ejecting head head rows disposed between belonging to the third droplet ejection head row and, before Symbol second A discharge amount adjusting method, comprising adjusting a discharge amount of the liquid material discharged from the droplet discharge head belonging to the droplet discharge head row. The discharge amount adjusting method according to claim 1 ,
In at least one of the step consisting of the first measurement step and the first adjustment step and the step consisting of the second measurement step and the second adjustment step, a plurality of measurement steps and adjustment steps are performed,
The adjustment process includes a rough adjustment process and a fine adjustment process. The discharge amount adjustment method according to claim 7 ,
In the measurement step performed before the rough adjustment step, the amount of the liquid material to be discharged is smaller than the amount of the liquid material to be discharged in the measurement step performed before the fine adjustment step. A discharge amount adjusting method characterized by the above. The discharge amount adjustment method according to claim 7 ,
In the measurement step performed before the coarse adjustment step, the number of times that the liquid material is discharged from the droplet discharge head per unit time is determined from the droplet discharge head in the measurement step performed before the fine adjustment step. The discharge amount adjusting method, wherein the liquid material is discharged more times than the number of times of discharging the liquid material per unit time. The discharge amount adjusting method according to claim 1 ,
In the first adjustment step, among the droplet discharge heads mounted on one carriage, the discharge amount in all the droplet discharge heads to be measured is measured, and then mounted on another carriage. Among the droplet discharge heads, the discharge amount of all the droplet discharge heads to be adjusted is adjusted, and all the droplet discharges scheduled to be mounted on the carriages are sequentially adjusted. Adjust the discharge amount at the head,
In the second adjustment step, after adjusting the discharge amount of all the droplet discharge heads to be adjusted among the droplet discharge heads mounted on one carriage, the droplets are mounted on another carriage. Among the droplet discharge heads, the discharge amount of all the droplet discharge heads to be adjusted is adjusted, and all the droplet discharges scheduled to be mounted on the carriages are sequentially adjusted. ejection amount adjustment method characterized by the tone pollock Rukoto discharge amount in the head. The discharge amount adjusting method according to claim 1 ,
A plurality of the liquid droplet ejection head columns mounted on a plurality of keys Yarijji, a plurality of rows of the droplet discharge head is formed,
In the first adjustment step, after adjusting the discharge amount of a part of the droplet discharge heads of the droplet discharge heads to be adjusted mounted on one carriage, the one mounted on another carriage Among the droplet discharge heads, the discharge amount in a part of the droplet discharge heads belonging to the row of the droplet discharge heads whose discharge amount has been adjusted is adjusted, and sequentially adjusted to be mounted on each carriage. Adjust the discharge amount in the droplet discharge head,
In the second adjustment step, after adjusting the discharge amount of a part of the droplet discharge heads to be adjusted mounted on one carriage, the droplet mounted on another carriage is adjusted. Among the droplet discharge heads, the discharge amount in a part of the droplet discharge heads belonging to the row of the droplet discharge heads whose discharge amount has been adjusted is adjusted, and sequentially adjusted to be mounted on each carriage. Adjust the discharge amount in the droplet discharge head,
A discharge amount adjusting method, wherein the first adjustment step and the second adjustment step are repeated to adjust the discharge amount of the droplet discharge head in all the rows to be adjusted. The discharge amount adjusting method according to claim 1 ,
A plurality of the liquid droplet ejection head columns mounted on a plurality of keys Yarijji, a plurality of rows of the droplet discharge head is formed,
Adjusting the discharge amount of a part of the droplet discharge heads of the droplet discharge heads to be adjusted mounted on one carriage in the first adjustment step;
In the second adjustment step, the discharge amount in the droplet discharge head that is located next to the droplet discharge head adjusted in the first adjustment step and belongs to the row of the droplet discharge head is adjusted,
Repeating the first adjustment step and the second adjustment step to adjust the discharge amount in the droplet discharge head belonging to a predetermined row;
Switching to the row to which the unadjusted droplet discharge head belongs, and repeating the first adjustment step and the second adjustment step to adjust the discharge amount in the droplet discharge head Quantity adjustment method. A liquid material discharge method for discharging a liquid material onto a workpiece from a droplet discharge head,
A discharge amount adjusting step for adjusting the discharge amount;
An application step of discharging droplets onto the workpiece,
And in the discharge amount adjusting step, method for discharging a liquid body characterized by adjusted using the discharge amount adjustment method according to any one of claims 1 to 12. A color filter manufacturing method comprising a step of applying and forming color ink on a substrate, wherein the color ink is discharged onto the substrate and applied using the liquid material discharge method according to claim 13. A method for producing a color filter characterized by the above. A method for manufacturing a liquid crystal display device, comprising: forming an alignment film on a first substrate and a second substrate; and forming a liquid crystal between the first substrate and the second substrate. The material for the alignment film is discharged and applied to at least one of the first substrate and the second substrate using the liquid material discharge method according to claim 13 , and then the alignment is solidified. A method of manufacturing a liquid crystal display device, comprising forming a film. After applying the liquid to the first substrate, between the first substrate and the second substrate, a manufacturing method of a liquid crystal display device having a step of forming across the liquid crystal, liquid of claim 13 A method of manufacturing a liquid crystal display device, wherein the liquid crystal is discharged and applied to the first substrate using a body discharge method. A method for manufacturing an electro-optical device including a step of forming a light emitting element by applying a light emitting element forming material to a substrate and then solidifying the substrate, using the method for discharging a liquid material according to claim 13 , A method of manufacturing an electro-optical device, wherein the light emitting element forming material is discharged and applied onto a substrate. After applying the electrode material of the liquid material to a substrate, by solidifying, a method of manufacturing an electro-optical device having a step of forming an electrode using the method for discharging a liquid material according to claim 13, wherein A method of manufacturing an electro-optical device, wherein the electrode material of the liquid material is discharged and applied to a substrate. After applying the wiring material of the liquid material to a substrate, by solidifying, a method of manufacturing an electro-optical device comprising the step of forming the wiring, by using the liquid discharging method of according to claim 13, wherein A method of manufacturing an electro-optical device, wherein the wiring material of the liquid material is discharged and applied to a substrate. The semiconductor material of the liquid material applied to a substrate, after solidification, by heating, a method of manufacturing an electro-optical device comprising the step of forming a semiconductor, a method for discharging a liquid material according to claim 13 A method of manufacturing an electro-optical device, wherein the semiconductor material of the liquid material is discharged and applied to the substrate.

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