JP4467660B2 - Processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention ,place More specifically, the liquid crystal display substrate (hereinafter referred to as the “LCD substrate”) has been improved with respect to the processing apparatus, and an articulated transfer arm that transfers an object to be processed such as a semiconductor wafer has been improved. Where It relates to a science device.
[0002]
[Prior art]
As this type of conventional processing apparatus, for example, a multi-chamber processing apparatus is widely used. The multi-chamber processing apparatus is connected to, for example, a plurality of (for example, three chambers) processing chambers that perform the same type or different types of processing on a target object (for example, an LCD substrate) under reduced pressure, and these processing chambers. A transfer chamber; a load lock chamber connected to the transfer chamber in the same manner as the processing chamber; and a transfer mechanism for transferring an LCD substrate between the load lock chamber and a carrier disposed in the mounting mechanism. ing.
[0003]
When performing a predetermined process on the LCD substrate, the articulated transfer arm of the transfer mechanism is bent and stretched, and the LCD substrate is taken out one by one from the carrier arranged in the mounting mechanism, and then the transfer mechanism is removed from the carrier. Move to the processing chamber and face the load lock chamber. Next, the gate valve at the loading / unloading port of the load lock chamber opens, and when the atmospheric pressure is reached, the LCD substrate is loaded into the load lock chamber via the transfer arm and the transfer arm is retracted from the load lock chamber, and then the gate valve is closed and loaded. Seal the lock chamber. Thereafter, the air in the load lock chamber is replaced with an inert gas such as nitrogen gas, and the inert gas in the load lock chamber is exhausted to bring the load lock chamber into a decompressed state similar to that in the transfer chamber. Next, after the gate valve on the transfer chamber side is opened and the load lock chamber communicates with the transfer chamber, the transfer arm in the transfer chamber is driven, and the LCD substrate in the load lock chamber is transferred into the transfer chamber via the transfer arm. Close the valve. When the transfer chamber is cut off from the load lock chamber, the gate valve on the processing chamber side opens, and after the LCD substrate is loaded into the processing chamber via the transfer arm, the transfer arm is retracted from the processing chamber and the gate valve is closed. Then, the processing chamber and the transfer chamber are shut off, and processing such as etching and film formation is started in the processing chamber. When the processing of the LCD substrate is completed in the processing chamber, the LCD substrate is processed from the processing chamber to the original location in the carrier by following the path opposite to that described above via the transfer arm and transfer mechanism in the transfer chamber. To return. If another process is subsequently performed on the LCD substrate, the processed LCD substrate is carried into the processing chamber to be processed next through the transfer arm in the transfer chamber, and after the processing, Return the processed LCD substrate to the original location in the carrier.
[0004]
[Problems to be solved by the invention]
However, in the case of the conventional transfer mechanism, for example, when the object to be processed such as an LCD substrate is enlarged, the distance between the transfer arm and the delivery position of the object to be processed becomes longer according to the object to be processed. As shown in FIG. 17, since the articulated transfer arm 100 is fixed via the rotating shaft 101, the lengths L′ L1 ′ of the first and second arms 102 and 103 become longer, and the object to be processed In order to support the arm, the rigidity of each arm 102, 103 must be strengthened according to its weight, but there is a limit to this rigidity strengthening, and the rigidity suitable for the enlargement of the workpiece There was a problem that it was difficult to obtain an articulated transfer arm having Further, there is a problem that the operation time becomes longer as the transfer arm becomes longer.
[0005]
The present invention has been made to solve the above problems, and it is not necessary to lengthen each arm of the transfer arm in accordance with the increase in the size of the object to be processed such as an LCD substrate, and the operation time of the transfer arm is reduced. Can be shortened In addition, the environment in the load lock chamber can always be kept clean even when the object to be processed is transported under atmospheric pressure, and there is no possibility of contaminating the object to be processed in the transport process. An object is to provide a processing apparatus.
[0006]
[Means for Solving the Problems]
The processing apparatus according to claim 1 of the present invention is disposed between at least one processing chamber for performing a predetermined processing on an object to be processed under reduced pressure, and at least one carrier in the processing chamber, and the above processing. A transfer mechanism that transfers the object to be processed between the chamber and the carrier, and the transfer mechanism drives the transfer arm and an articulated transfer arm that transfers the object to be processed. In a processing apparatus comprising a drive mechanism for transferring the object to be processed between a processing chamber and the carrier via a load lock chamber, the air in the load lock chamber is evacuated. By filter Cleaning Outside Ventilate with air With the above filter A ventilation mechanism is provided on the back of the load lock chamber via a gate valve. , The load lock chamber is provided in the transfer mechanism so as to be connectable to the processing chamber, and the transfer arm is provided in the load lock chamber and is transferred to the processing chamber or the carrier facing the transfer arm. A straight drive mechanism for moving the arm forward and backward is provided in the load lock chamber.
[0013]
In addition, the present invention Claim 2 The processing device described in Claim 1 In the invention described in (1), the rectilinear drive mechanism moves the transfer arm. That It has a guide rail that guides in the moving direction, an endless belt that reciprocates the transport arm along the guide rail, and a rotational drive mechanism that rotationally drives the endless belt.
[0014]
Further, the processing apparatus according to claim 3 of the present invention is the claim. 1 In the described invention, the linear drive mechanism includes a guide rail that guides the transport arm in the moving direction thereof, and a cylinder mechanism that reciprocates the transport arm along the guide rail. is there.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on the embodiment shown in FIGS.
For example, as shown in FIG. 1, the processing apparatus of the present embodiment performs a predetermined process (for example, an etching process, a film forming process, etc.) on an object to be processed (for example, an LCD substrate) 1 under a predetermined reduced pressure. A processing unit 3 having two processing chambers 2, three mounting units 4 for mounting, for example, 25 carriers C for LCD substrates 1 to be processed by the processing unit 3; 4 and a transfer unit 5 for transferring the LCD substrate 1. The LCD substrates 1 in the carrier C are taken out one by one through the transfer unit 4, and the LCD substrate is put into each processing chamber 2. 1 is carried in, a predetermined process is performed therein, and after the process, the reverse path is followed to return from the process chamber 2 to the original location in the carrier C.
[0016]
Thus, the gate valve unit 6 and the connection unit 7 are attached to the front of the processing chamber 2 in an airtight state, and the processing chamber 2 and the transfer unit 5 are directly connected via the connection unit 7. It is like that. An openable / closable lid 8 is attached to the upper part of the processing chamber 2. For example, during maintenance, the lid 8 is opened to a position indicated by a dashed line as shown by an arrow in FIG. It is. A vacuum pump 9 is disposed in the processing unit 3, and the inside of the processing chamber 2 is depressurized by the vacuum pump 9 so as to maintain a predetermined degree of vacuum. The placement unit 4 and the transport unit 5 are both disposed on the base 10, for example.
[0017]
As shown in FIGS. 1 and 2, the transfer unit 5 includes an articulated transfer arm 11 for transferring the LCD substrate 1, a substantially rectangular load lock chamber 12 in which the transfer arm 11 is housed, A drive unit 13 for moving the load lock chamber 12 between the processing chamber 2 and the mounting unit 4 and a pair of guide rails 14 for moving and guiding the driving unit 13 between the processing chamber 2 and the mounting unit 4 are provided. ing. The drive unit 13 includes, for example, a turning drive mechanism 15 mainly composed of a motor (not shown) for turning the load lock chamber 12, and an elevating drive mechanism 16 mainly constituted by a rack and pinion that raises and lowers the turning drive mechanism 15. The load lock chamber 12 is rotated by, for example, 180 ° between the processing chamber 2 and the mounting unit 4 by the swing drive mechanism 15, and the load lock chamber 12 is moved to an arbitrary position in the carrier C via the lift drive mechanism 16. The LCD substrate 1 and the gate valve unit 6 of the processing chamber 2 are moved up and down according to the height of each. As shown in FIGS. 1 and 2, the load lock chamber 12 is disposed on a substrate 15A constituting the turning drive mechanism 15, and is turned through the substrate 15A.
[0018]
As shown in FIGS. 1 and 2, the load lock chamber 12 reciprocates along the guide rails 17 via a pair of air cylinders 18 disposed on the substrate 15A. In other words, the pair of air cylinders 18 are fixed on the substrate 15 </ b> A in parallel with the outside of the pair of guide rails 17. The tip of the rod 18 </ b> A of the air cylinder 18 is connected to a connecting member 12 </ b> C fixed to both side surfaces of the load lock chamber 12. Accordingly, when the LCD substrate 1 is transferred between the transport unit 5 and the carrier C or the processing chamber 2, the load lock chamber 12 is reciprocated on the substrate 15 A according to the guide rail 17 via the air cylinder 18. It has become. In FIG. 2, the air cylinder 18 is not shown.
[0019]
Further, as shown in FIGS. 3A and 3B, the transfer arm 11 is connected to a motor 11A fixed to the back surface of the substrate 19A, the motor 11A and the rotating shaft 11B, and the substrate 19A. And a fork-type hand 11E connected to the first arm 11C and the second arm 11D and supporting the LCD substrate 1 by driving the motor 11A. 1. The second arms 11C and 11D and the hand 11E are bent and extended so that the hand 11E can be taken in and out of the loading / unloading port 12A of the load lock chamber 12. In addition, the transfer arm 11 moves back and forth in the load lock chamber 12 via the linear drive mechanism 19 so that the LCD substrate 1 is directly exchanged with the carrier C or the processing chamber 2. Thus, since the transfer arm 11 moves in the load lock chamber 12 via the linear drive mechanism 19, even if the first and second arms 11C and 11D are shortened by a distance corresponding to the movement amount, the carrier C or the processing is performed. The LCD substrate 1 can be exchanged with the chamber 2. Since the first and second arms 11C and 11D can be shortened, the rigidity of the arms 11C and 11D can be enhanced, and the operating time of the first and second arms 11C and 11D can be shortened to increase the throughput. be able to.
[0020]
The linear drive mechanism 19 is engaged with the substrate 19A that supports the transfer arm 11, and an engagement member 19C that is disposed on the base 19B that is spaced from the substrate 19A and is fixed to the back surface of the substrate 19A. And a drive mechanism 19E that moves the transport arm 11 according to the guide rails 19D. The drive mechanism 19E includes a motor 19F, a drive pulley 19G that rotates forward and backward by the motor 19F, a driven pulley 19H that is paired with the drive pulley 19G, and a pulley wound around the pulleys 19G and 19H and a guide. And an endless belt 19I provided in parallel to the rail 19D. The transfer arm 11 is connected to an endless belt 19I through a substrate 19A. A long hole 19J through which the motor 11A of the transfer arm 11 passes is formed in the base 19B, and the motor 11A moves in the long hole 19J when the transfer arm 11 moves according to the guide rail 19D.
[0021]
In the present invention, a rectilinear drive mechanism 20 shown in FIG. 4 may be used in place of the rectilinear drive mechanism 19 shown in FIGS. As shown in the figure, the linear drive mechanism 20 is configured substantially in the same manner as the linear drive 19 except that an air cylinder 20F is connected to a substrate 20A that supports the transport arm 11 as a drive mechanism 20E. Yes.
[0022]
By the way, since the load lock chamber 12 is opened in the clean room when the LCD substrate 1 is transferred, air around the device enters the load lock chamber 12 and particles generated around the device are generated. There is a risk that the inside will be contaminated. In order to prevent the load lock chamber 120 shown in FIG. 5 and FIG. 6 from such contamination, the inside of the load lock chamber 120 is always maintained at a positive pressure using a ventilation mechanism when the load lock chamber 120 is open to the atmosphere. The surrounding air does not enter the load lock chamber 120. In other respects, the load lock chamber 12 is configured according to the above.
[0023]
That is, a ventilation mechanism 121 is attached to the back surface of the load lock chamber 120 shown in FIGS. As shown in FIGS. 5 and 6, the ventilation mechanism 121 includes, for example, a gate valve unit 122, a HEPA filter 123, and a blower fan 124, which are sequentially arranged from the back side to the outside in this order. Therefore, when the load lock chamber 120 transfers the LCD substrate 1 between the carrier C and the processing chamber 2, the gate valve unit 122 and the blower fan 124 are driven, and the gate valve 122 A is placed on the back surface of the load lock chamber 120. The formed opening 120C is opened and air in the clean room is blown into the load lock chamber 120 from the blower fan 124, flows out from the carry-in / out port 120A, and the load lock chamber 120 is always kept in a positive pressure state. The air does not enter the load lock chamber 120. The air flowing in the load lock chamber 120 is cleaned by removing particles generated around the device contained in the air through the HEPA filter 123, and there is no possibility of contaminating the LCD substrate 1.
[0024]
The load lock chamber 120 ′ shown in FIG. 7 is configured in accordance with the load lock chamber 120 shown in FIGS. 5 and 6 except that a double arm transfer arm 11 ′ is used as the transfer arm. That is, the load lock chamber 120 ′ includes a gate valve unit 122 ′, a HEPA filter 123 ′, and a blower fan 124 ′ as a ventilation mechanism 121 ′, and always keeps the load lock chamber 120 ′ at a positive pressure with clean air. The air around the device does not enter. By adopting the double arm in this way, the carry-in / out efficiency of the LCD substrate 1 can be increased.
[0025]
When the LCD substrate 1 is transferred between the load lock chamber 12 and the processing chamber 2, the load lock chamber 12 is connected to the gate of the processing chamber 2 via the connection unit 7 as shown in FIGS. After connecting to the valve unit 6, the load lock chamber 12 is evacuated in accordance with the degree of vacuum in the processing chamber 2. In FIG. 8, only the load lock chamber 12 of the transport unit 4 is shown for convenience of explanation.
[0026]
That is, as shown in FIGS. 9 and 10, the gate valve unit 6 includes a gate valve 6A that opens and closes the loading / unloading port of the processing chamber 2 and a frame body 6B to which the gate valve 6A is attached. ing. Seal members 6C each composed of an O-ring or the like are mounted on both surfaces of the frame body 6B, and these seal members 6C maintain the airtightness between the gate valve unit 6, the processing chamber 2 and the connection unit 7. . Further, as shown in FIG. 9, seal members 6D are attached to the upper and lower ends of the gate valve 6A, and the seal between the gate valve 6A and the processing chamber 2 is maintained by these seal members 6D. An introduction pipe 6E for introducing an inert gas such as nitrogen gas is attached to the upper part of the frame body 6B, and an exhaust pipe 6F is attached to the lower part thereof. Then, as shown by an arrow in FIG. 9, an inert gas is introduced from the introduction pipe 6 </ b> E and exhausted from the exhaust pipe 6 </ b> F, and the air in the load lock chamber 12 is connected to the processing chamber 2. Is replaced with an inert gas, and then the inside is evacuated until a predetermined degree of vacuum is reached.
[0027]
As shown in FIGS. 8A and 9, the connection unit 7 is joined to the gate valve unit 6 in an airtight state. The connection unit 7 includes a frame body 7A joined to the frame body 6B and a pair of lock mechanisms 7B attached to both sides of the frame body 7A, and joined to the connection unit 7 via the lock mechanism 7B. The load lock chamber 12 is locked and the load lock chamber 12 is connected to the processing chamber 2 side. As shown in FIGS. 8A, 8B, and 11, for example, each lock mechanism 7B includes left and right guide rails 7C fixed to both sides of the front surface of the frame 7A, and the guide rails 7C. The left and right engaging members 7D respectively engaged with the flanges 12D formed on the left and right of the loading / unloading port of the load lock chamber 12, and the engaging members 7D connected to the engaging members 7D and the guide rails 7C. The left and right first air cylinders 7E that are lifted and lowered according to the above and the flanges 12D of the load lock chambers 12 that are respectively attached to and engaged with the respective engaging members 7D are equally pressed to thereby make the load lock chamber 12 the frame body. And a second air cylinder 7F that is in close contact with 7A. Therefore, when the load lock chamber 12 is joined to the processing chamber 2 side as shown in FIG. 8A, the lock mechanism 7B is driven so that the load lock chamber 12 comes into close contact with the frame 7A of the connection unit 7. It is. Further, as shown in FIG. 8B, for example, a spring 22 is attached to the back of the load lock chamber 12, and the load lock chamber 12 is elastically contacted to the processing chamber 2 via the spring 22 to lock the lock mechanism 7B. May function smoothly. In FIG. 9, 7G is a seal member made of an O-ring or the like.
[0028]
In the present invention, a lock mechanism 23 shown in FIGS. 12A and 12B may be attached in place of the lock mechanism 7B. As shown in the figure, the lock mechanism 23 includes a clamp 23A that rotates in the forward and reverse directions and an air cylinder 23B that moves the clamp 23A forward and backward, and is attached to the peripheral surface of the frame 7A. On the other hand, the load lock chamber 12 is formed with a flange 12E on the entire periphery of the carry-in / out entrance, and the load lock chamber 12 is locked to the processing chamber 2 via the flange 12E.
[0029]
Further, in the present invention, the load lock chamber and the processing chamber can be aligned more smoothly by making the load lock chamber a floating structure as shown in FIGS. The load lock chamber 51 is supported by a floating mechanism 52 as shown in the drawings. The floating mechanism 52 includes a substrate 52A having an L-shaped side surface, and first, second, and third springs 52B, 52C that are disposed on the substrate 52A and elastically support the load lock chamber 51. 52D. The first spring 52B is elastically mounted between a support column 52E erected on both sides of the load lock chamber 51 and a flange 51A extending from the upper surface of the load lock chamber 51 to the side, and the second spring 52C. Is mounted between the vertical wall surface of the base 52 and the back surface of the load lock chamber 51, and the third spring 52D is mounted between the lower surface of the load lock chamber 51 and the substrate 52A. The support mechanism 19 is attached to the substrate 52A of the load lock chamber 51. Accordingly, when the load lock chamber 51 is connected to the processing chamber 2, the load lock chamber 51 slightly fluctuates in all directions as shown by the arrows in FIG. 13 via the first, second, and third springs 52B, 52C, and 52D. Then, the positional shift between the load lock chamber 51 and the processing chamber 2 is absorbed, and the load lock chamber 51 and the processing chamber 2 are smoothly connected without impact. In FIG. 13, 50 is an articulated transfer arm, 53 is a bellows, and these are configured in the same manner as described above.
[0030]
Next, the processing method of the present invention using the processing apparatus of the present embodiment will be described with reference to FIGS. First, when the LCD substrate 1 is taken out from the carrier C, the transport unit 4 moves to the predetermined carrier C on the mounting mechanism 4 according to the guide rail 14 on the base 10, and then, as shown in FIG. Next, the loading / unloading port 12 </ b> A of the load lock chamber 12 is opposed to the carrier C via the turning drive mechanism 15. Next, the load lock chamber 12 is raised and lowered via the raising / lowering drive mechanism 16, and the height of the hand 11E of the transfer arm 11 is adjusted to the height of the LCD substrate 1 to be taken out.
[0031]
In this state, the air cylinder 18 is driven and the load lock chamber 12 moves according to the guide rail 17, and the load lock chamber 12 approaches the carrier C and stops as shown in FIG. At this time, the rectilinear drive mechanism 19 is driven, and the transfer arm 11 moves according to the guide rail 19 </ b> D to approach the carrier C further than the load lock chamber 12. Further, the motor 11A rotates and the first and second arms 11C and 11D and the hand 11E extend through the rotating shaft 11B, and the hand 11E enters the carrier C. Next, the load lock chamber 12 is lifted and lowered slightly via the lift drive mechanism 16, and the LCD substrate 1 in the carrier C is placed on the hand 11E.
[0032]
Next, the transfer arm 11 is retracted in the load lock chamber 12 via the linear drive mechanism 19, and the motor 11A of the transfer arm 11 rotates reversely, via the rotary shaft 11B as shown in FIG. The first and second arms 11C and 11D and the hand 11E are bent to bring the LCD substrate 1 from the carrier C into the load lock chamber 12. Thereafter, the air cylinder 18 is driven to move the load lock chamber 12 in accordance with the guide rail 17, and the load lock chamber 12 moves away from the carrier C and returns to the original position.
[0033]
Thereafter, the load lock chamber 12 is rotated by 180 ° via the turning drive mechanism 15 and the lift drive mechanism 16 as shown in FIG. 4D, and the carry-in / out port 12A is adjusted to the height of the connection unit 7 in the processing chamber 2. Stop in the state. Next, the air cylinder 18 is driven, and the load lock chamber 12 approaches the processing chamber 2 as shown in (e) of the figure, and the carry-in / out port 12A comes into contact with the frame 7A of the connection unit 7 on the processing chamber 2 side. . At the same time, the first air cylinder 7E of the locking mechanism 7B of the connection unit 7 is driven, and the engaging member 7D is lifted according to the guide rail 7C to engage with the flange 12E of the load lock chamber 12, and at the same time, the second air cylinder 7F is Driven to bring the load lock chamber 12 into close contact with the frame 7 </ b> A of the connection unit 7.
[0034]
At this time, if the load lock chamber 51 has a floating structure as shown in FIGS. 13 and 14, the load lock chamber 51 comes into contact with the connection unit 7 without any impact, and the contact with the connection unit 7. Even if there is a slight misalignment, the misalignment is absorbed by the floating mechanism 52, and the load lock chamber 51 and the connection unit 7 can be smoothly connected via the lock mechanism 7B.
[0035]
Subsequently, an inert gas (for example, nitrogen gas) is introduced from the introduction pipe 6E of the gate valve unit 6, and the air in the load lock chamber 12 is exhausted from the exhaust pipe 6F to replace the internal air with nitrogen gas and load lock. The inside of the chamber 12 is evacuated to a state close to the degree of vacuum in the processing chamber 2.
[0036]
After the inside of the load lock chamber 12 reaches a predetermined degree of vacuum, the gate valve 6A is opened, and the linear drive mechanism 19 is driven in the load lock chamber 12 to move the transfer arm 11 toward the processing chamber 2 as shown in FIG. As the motor 11A moves forward, the motor 11A of the transport arm 11 rotates, and the first and second arms 11C and 11D and the hand 11E extend through the rotating shaft 11B as shown in FIG. 2, the LCD substrate 1 on the hand 11 </ b> E is delivered to the mounting table 2 </ b> A in the processing chamber 2. At this time, if the processed LCD substrate 1 exists on the mounting table 2 </ b> A, the processed LCD substrate 1 is received by the hand 11 </ b> E, the linear drive mechanism 19 is driven, and the transfer arm 11 enters the load lock chamber 12. At the same time, the motor 11 A of the transfer arm 11 is driven to bring the LCD substrate 1 from the processing chamber 2 into the load lock chamber 12. Subsequently, the processed LCD substrate 1 is returned to the original location in the carrier C in the reverse procedure to the case where the LCD substrate 1 is carried into the processing chamber 2.
[0037]
When the load lock chambers 120 and 120 ′ shown in FIGS. 5 to 7 are used, the LCD substrate 1 is exchanged between the carrier C and the processing chamber 2 through the load lock chambers 120 and 120 ′. When ventilating, the ventilation mechanism 121, 121 'is driven to blow air while cleaning the outside air into the load lock chamber 120, 120', and the inside is always kept at a positive pressure with clean air, and the air around the device is inside In this way, the LCD substrate 1 is prevented from being contaminated with particles. That is, when the ventilation mechanism 121, 121 ′ is driven, the blower fans 124, 124 ′ are started, and the gate valves 122A, 122′A are driven to open the openings 120C, 120′C of the load lock chambers 120, 120 ′. After the air is opened and the outside air is cleaned by the HEPA filters 123 and 123 ′, the air flows into the inside through the openings 120C and 120′C of the load lock chambers 120 and 120 ′, and flows out from the carry-in / out ports 120A and 120′A. . As a result, the air around the apparatus does not enter the load lock chambers 120 and 120 ′, and the interior is always in a clean environment. When the load lock chambers 120 and 120 ′ are connected to the processing chamber 2, the ventilation mechanisms 121 and 121 ′ are stopped, and the load lock chambers 120 and 120 ′ Airtight Hold. Subsequent steps are as described above. Further, when the processed LCD substrate 1 is returned from the processing chamber 2, the ventilation mechanisms 121 and 121 ′ operate to enter the load lock chambers 120 and 120 ′. apparatus Prevent surrounding air from entering directly.
[0038]
As described above, according to the present embodiment, since the linear drive mechanism 19 that moves the transfer arm 11 forward and backward with respect to the processing chamber 2 or the carrier C facing the transfer arm 11 is provided in the load lock chamber 12, the load lock chamber 12, the distance by which the transfer arm 11 is extended by the movement distance of the transfer arm 11 by the linear drive mechanism 19, that is, the lengths L and L 1 of the first and second arms 11 C and 11 D can be shortened. The rigidity of the second arms 11C and 11D is set to the LCD substrate 1 Weight of It can be strengthened according to. Further, in the present embodiment, it is not necessary to lengthen the first and second arms 11C and 11D in accordance with the increase in the size of the LCD substrate 1, so that the operation time of the transfer arm 11 can be shortened and the throughput can be increased. it can.
[0039]
In addition, according to the present embodiment, the load lock chambers 120, 120 ′ Ventilate inside air with clean external air Ventilation mechanism 121, 121 ' On the back of the load lock chamber 120, 120 ′ via the HEPA filter 123 and the gate valve 122A Because it is provided, when transferring the LCD substrate 1 under atmospheric pressure, The degree of freedom of movement of the load lock chambers 120 and 120 ′ by the transfer unit 5 can be secured. A clean environment is always maintained in the load lock chambers 120 and 120 ′, and contamination of the LCD substrate 1 by particles can be reliably prevented.
[0040]
In addition, this invention is not restrict | limited at all to the said embodiment, Each component can be design-changed suitably as needed. For example, in the above-described embodiment, the transport mechanism applied to a novel processing apparatus that has been configured so that the load lock chamber 12 can be moved as a part of the transport unit 5 has been described. However, the transport mechanism of the present invention is conventional. The present invention can also be applied to a processing apparatus in which a load lock chamber is connected as a part of the processing chamber. In this case, the transfer arm of the transfer mechanism exchanges an object to be processed such as an LCD substrate between the load lock chamber of the process chamber and the carrier.
[0041]
【The invention's effect】
According to the present invention, The object to be processed is disposed between at least one processing chamber for performing a predetermined process on the object to be processed under reduced pressure, and at least one carrier in the processing chamber, and between the processing chamber and the carrier. A transfer mechanism for transferring, and the transfer mechanism drives an articulated transfer arm for transferring the object to be processed and a load lock chamber between the processing chamber and the carrier by driving the transfer arm. And a drive mechanism for exchanging the object to be processed, the ventilation mechanism with the filter for ventilating the air in the load lock chamber with external air purified by a filter, and a gate valve. The load lock chamber is provided on the back surface of the load lock chamber, the load lock chamber is provided in the transfer mechanism so as to be connectable to the processing chamber, and the transfer arm is connected to the load lock Due to the provision of a linear driving mechanism for advancing and retreating the transfer arm in the load lock chamber to said process chamber or the carrier facing the carrier arm is provided on the inside, For LCD substrate It is not necessary to lengthen each arm of the transfer arm in accordance with the increase in the size of the object to be processed, etc., and the operation time of the transfer arm can be shortened, and when the object to be processed is transferred under atmospheric pressure But In addition to ensuring freedom of movement of the load lock chamber It is possible to provide a processing apparatus that can always keep the environment inside the load lock chamber clean and does not contaminate the object to be processed in the conveyance process.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a processing apparatus of the present invention.
FIG. 2 is a perspective view showing a placement mechanism and a transport unit of the processing apparatus shown in FIG.
3A and 3B are views showing a main part of an embodiment of the transfer mechanism of the present invention housed in the load lock chamber of the transfer unit shown in FIG. 2, wherein FIG. 3A is a perspective view thereof, and FIG. FIG.
FIG. 4 is a plan view showing a main part of another embodiment of the transport mechanism of the present invention.
5 is a perspective view showing a main part of a load lock chamber of a type different from the load lock chamber shown in FIG. 2. FIG.
6 is a cross-sectional view showing a main part of the load lock chamber shown in FIG. 5. FIG.
7 is a perspective view showing a main part of a load lock chamber of another type different from the load lock chamber shown in FIG. 2. FIG.
8 is a partially enlarged view showing a state where the load lock chamber and the processing chamber shown in FIG. 1 are connected, (a) is a perspective view thereof, and (b) is a part of (a). It is sectional drawing.
9 is a cross-sectional view showing a gate valve unit and a connection unit of the processing chamber shown in FIG.
10 is a perspective view showing the gate valve unit shown in FIG. 9. FIG.
11 is a perspective view showing a lock mechanism of the connection unit shown in FIG.
12A and 12B are views showing another type of locking mechanism different from the locking mechanism shown in FIG. 11, wherein FIG. 12A is a perspective view showing a state immediately before the processing chamber and the load lock chamber are connected, and FIG. It is a perspective view which shows the state which connected the load lock chamber to the process chamber with the locking mechanism of a).
FIG. 13 is a perspective view showing a floating type load lock chamber.
14 is a cross-sectional view of the main part in a state immediately before connecting the load lock chamber and the processing chamber shown in FIG. 13;
FIGS. 15A to 15F are explanatory views for explaining a transfer process of the processing apparatus shown in FIG. 1;
16 is a conceptual diagram illustrating the configuration and operation of the transfer arm shown in FIGS. 3 and 4. FIG.
FIG. 17 is a conceptual diagram illustrating the configuration and operation of a transfer arm of a conventional transfer mechanism.
[Explanation of symbols]
1 LCD substrate (object to be processed)
2 treatment room
4 Placement unit (placement mechanism)
5 Transport unit (transport mechanism)
6F Exhaust pipe (exhaust means)
7B Lock mechanism
11 Transfer arm
12, 120, 120 'load lock room
13 Drive unit (drive mechanism)
19 Straight drive mechanism
19D guide rail
19E Drive mechanism
19F motor
19G Drive pulley
19H Driven pulley
19I endless belt
20 Linear drive mechanism
20E Drive mechanism
20F Air cylinder (cylinder mechanism)
121, 121 Ventilation mechanism

Claims (3)

The object to be processed is disposed between at least one processing chamber for performing a predetermined process on the object to be processed under reduced pressure, and at least one carrier in the processing chamber, and between the processing chamber and the carrier. A transfer mechanism that transfers the multi-joint transfer arm for transferring the object to be processed, and a load lock chamber between the processing chamber and the carrier by driving the transfer arm. And a drive mechanism for exchanging the object to be processed, the ventilation mechanism with the filter for ventilating the air in the load lock chamber with external air purified by a filter, and a gate valve. It is provided on the back surface of the load lock chamber through, connectable to the load lock chamber to said process chamber provided in the transport mechanism, and said load lock said transfer arm Processing apparatus characterized by a linear driving mechanism for advancing and retreating the transfer arm to said process chamber or the carrier facing the carrier arm provided on the load lock chamber is provided on the inside.   The linear drive mechanism includes a guide rail that guides the transport arm in its moving direction, an endless belt that reciprocates the transport arm along the guide rail, and a rotational drive mechanism that rotationally drives the endless belt. The processing apparatus according to claim 1, further comprising: 2. The process according to claim 1, wherein the linear drive mechanism includes a guide rail that guides the transport arm in a moving direction thereof, and a cylinder mechanism that reciprocates the transport arm along the guide rail. apparatus.

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