JP4458033B2 - Multilayer electronic circuit structure and manufacturing method thereof - Google Patents

Description

  The present invention relates to a multilayer electronic circuit structure in which circuit boards mainly used in portable electronic devices such as mobile phones are connected by connectors, and more particularly to a multilayer electronic circuit structure in which filter circuits are integrated and a method for manufacturing the same. .

  In many electronic devices, electronic components are surface-mounted on various circuit boards such as printed circuit boards. In order to reduce high-frequency noise generated from power lines of electronic components, predetermined terminals of electronic components are used. A filter circuit composed of passive elements such as a capacitor element, an inductor, and a resistor is installed on the pin.

  2. Description of the Related Art Conventionally, a circuit configuration in which one electrode terminal of a chip capacitor element is connected to a terminal pin and the other electrode terminal is grounded on the same plane as a circuit board on which electronic components are mounted. However, in such a configuration, a region for mounting a chip capacitor element is required around the electronic component, and thus the mounting density of the circuit board cannot be improved. Therefore, mounting a filter circuit for preventing noise of electronic components on a circuit board with a mounting area as small as possible has been studied.

  For example, FIG. 10 is a diagram illustrating an example in which a conventional noise filter is housed in a connector and integrated. In this conventional example, a plug insertion chamber 72 into which a plug is inserted into the housing 71 of the connector 70 and a storage chamber 73 at the rear thereof are provided, and a filter 80 composed of a capacitor element array or the like is stored in the storage chamber 73. An integrated configuration is shown. In the housing 71, a terminal 74a in which an extended portion of the terminal pin 74 protrudes into the storage chamber 73 and an end 75a of the terminal 75 connected to the printed wiring are arranged to face each other in the storage chamber 73, and further in the short side direction. The ground electrodes 76 are provided on both sides of the first electrode.

  The filter 80 includes an input-side external electrode 82, an output-side external electrode 84, and a ground electrode 86, and a capacitor element (not shown) corresponding to the terminal pin 74 is formed therein. The filter 80 is stored in the storage chamber 73 with the upper and lower surfaces sandwiched between the terminal 74 a of the terminal pin 74 and one end 75 a of the terminal 75 and the both side surfaces sandwiched between the ground electrodes 76.

  With such a configuration, a filter circuit for preventing noise is integrated with the connector to reduce the mounting area on the circuit board (see, for example, Patent Document 1).

  In addition, a male connector having a plurality of terminal pins and a metal shell positioned so as to surround the terminal pins and connected to the ground potential, and the terminal pins can be inserted through the recesses of the shell. A configuration including a simple sheet type noise filter is disclosed. The sheet type noise filter is provided with a noise removing circuit on a thin insulating sheet that can be elastically deformed. The sheet type noise filter has a plurality of holes through which terminal pins pass, and is mounted in a recess of the shell. In this state, a plurality of projecting pieces that elastically contact the inner surface of the shell protrude from the outer peripheral edge (see, for example, Patent Document 2).

In addition, in a connector having a plurality of terminal pins, a structure is disclosed in which a sheet-type noise absorbing element is disposed in a region surrounded by the terminal pins and connected to a circuit board. A sheet type noise filter is provided with a noise removing circuit on a thin insulating sheet that can be elastically deformed, and has a noise removing function by connecting it to a circuit board together with a connector (for example, And Patent Document 3). With this configuration, since the insulating sheet on which the noise filter circuit is formed is disposed between the connector and the circuit board, the mounting area of the circuit board can be reduced.
JP-A-6-20746 JP 11-329609 A JP 2004-335946 A

  However, in the first example, since the filter composed of the capacitor element array is arranged in the direction perpendicular to the circuit board surface, it is very difficult to reduce the height, and thinning is particularly required. It is difficult to use for portable electronic devices such as mobile phones.

  In the second example, since the sheet type noise filter is inserted into the terminal pin and the female connector is inserted into the terminal pin, the mounting configuration is simple. However, an element such as a capacitor element may be damaged when inserted into the terminal pin. In order to prevent this, it is necessary to use a sheet having a sufficient thickness so that it is not easily deformed by a load applied during insertion. Further, the connector having this configuration is not a surface mount type, and it is difficult to reduce the height as in the case of the first example.

  Further, in the third example, a sheet-type noise filter is disposed directly under the connector to constitute a thin noise filter for the connector. However, the capacitor element is simply inserted between the connector and the circuit board, and it is difficult to form a frequency filter required for the circuit configuration.

  Furthermore, if a circuit is formed by previously forming a capacitor element and a resistor on the same surface in order to form a sheet-type noise filter, the manufacturing process of the sheet-like noise filter becomes complicated, resulting in a decrease in yield. Cost is likely to increase.

  The present invention solves the above-described problems, and forms passive components having respective functions on separate sheet-like substrates, and forms a sheet in gap regions between the male connector and the female connector and the respective circuit boards. Providing a laminated electronic circuit structure capable of low profile and high-density mounting by arranging a substrate, connecting electrode terminals, fitting a connector together to form a predetermined filter circuit, and a method for manufacturing the same The purpose is to do.

  In order to achieve the above object, a stacked electronic circuit structure according to the present invention includes a male connector in which a first terminal is connected to a connection terminal of a first circuit board, and a connection terminal of a second circuit board. This is a laminated configuration in which a female connector to which a second terminal is connected is fitted. And the 1st sheet-like board | substrate with which the several 1st passive element was formed is arrange | positioned in the area | region part surrounded by the 1st terminal and 1st circuit board which are arrange | positioned at both sides of a male connector. The electrode terminal of the first passive element and the connection terminal of the first circuit board are connected, and one of the electrode terminals of the first passive element and the first terminal are connected by a wiring connecting between the connection terminals. Electrically connected. A second sheet-like substrate on which a plurality of second passive elements are formed is arranged in a region surrounded by the second terminals and the second circuit board arranged on both sides of the female connector. The electrode terminal of the second passive element and the connection terminal of the second circuit board are connected, and one of the electrode terminals of the second passive element and the second terminal are connected by a wiring connecting between the connection terminals. Electrically connected. A filter circuit is configured by the first passive element of the first sheet-like substrate and the second passive element of the second sheet-like substrate by fitting the male connector and the female connector. Yes.

  With such a configuration, the first and second passive elements are stacked in spite of being three-dimensionally arranged with respect to the male connector and the female connector, respectively. The thickness of can be the same as that in the case where the first passive element and the second passive element are not provided. As a result, it is possible to reduce the mounting area on the first circuit board or the second circuit board, and it is possible to realize a stacked electronic circuit structure having a higher function while being small and thin. Note that the first passive element and the second passive element are each preferably manufactured using a thin film formation technique.

  In the above configuration, the first sheet-like board is fixed on the surface of the male connector facing the first circuit board, and the second sheet-like board faces the second circuit board of the female connector. It may be fixed on the surface. With such a configuration, the first circuit board and the second circuit board can be collectively aligned and connected. In addition, it can be mounted on the circuit board at the same time as mounting of other electronic components, and the mounting process can be simplified.

  In the above configuration, the first sheet-like substrate and the second sheet-like substrate are provided on the surface of the male connector that faces the first circuit board and the surface of the female connector that faces the second circuit board. A recess for storing each of them may be provided. With such a configuration, even if the first sheet-like substrate and the second sheet-like substrate are arranged on the male connector and the female connector, respectively, the height can be reduced.

  In the above configuration, the first passive element may be a resistor element or a capacitor element, the second passive element may be a capacitor element or a resistor element, and the filter circuit may be a CR filter. Alternatively, the first passive element may be an inductance element, the second passive element may be a capacitor element, and the filter circuit may be an LC filter. Furthermore, the first passive element may be composed of a resistance element and an inductance element, the second passive element may be composed of a capacitor element, and the filter circuit may be composed of a CR filter and an LC filter.

  In the above configuration, for the first terminal and the second terminal set in advance, the connection terminals connected to the electrode terminals of the first passive element are connected by wiring, and the electrode terminals of the second passive element are connected. The wiring between the connection terminals that electrically connect the one and the second terminal may be opened. Or about the 1st terminal and 2nd terminal which were preset, you may connect between the connection terminals connected with the electrode terminal of a 1st passive element by wiring.

  By adopting such a configuration, a configuration in which the filter circuit is not connected to the terminal of the connector or a filter circuit including only the second passive element is formed by the wiring pattern configuration of the first circuit board and the second circuit board. The configuration can be easily realized.

  Also, the method for manufacturing a multilayer electronic circuit structure according to the present invention has a shape that is at least smaller than the area surrounded by the first terminals disposed on both sides of the male connector, and is located at a position corresponding to the first terminal. A step of forming a first sheet-like substrate provided with one passive element, and connection to positions corresponding to the first terminal of the male connector and the electrode terminal of the first passive element of the first sheet-like substrate, respectively Forming a first circuit board having a terminal, and a second shape at a position corresponding to the second terminal at least smaller than a region surrounded by the second terminals disposed on both sides of the female connector; A step of forming a second sheet-like substrate provided with passive elements, and connection terminals at positions corresponding to the second terminals of the female connector and the electrode terminals of the second passive elements of the second sheet-like substrate, respectively. A process for forming a second circuit board having A connection terminal of the first circuit board, an electrode terminal of the first passive element, and a first terminal of the male connector, respectively, and a connection terminal of the second circuit board And a step of aligning and connecting the electrode terminals of the second passive element and the second terminals of the female connector, and fitting the male connector and the female connector to each other. And a step of forming a filter circuit with the passive element and the second passive element.

  By adopting such a method, a laminated electronic circuit structure formed by laminating the first sheet-like substrate and the second sheet-like substrate can be produced by a simple manufacturing process.

  Further, in the above method, the step of connecting the connection terminal of the first circuit board, the electrode terminal of the first passive element, and the first terminal is surrounded by the first terminal of the male connector. The region portion is further provided with a step of fixing the first sheet-like substrate in correspondence with the first terminal and the electrode terminal of the first passive element, the connection terminal of the second circuit substrate, and the second passive Before the step of connecting the electrode terminal and the second terminal of the element, the second terminal and the electrode terminal of the second passive element are associated with the region surrounded by the second terminal of the female connector. A step of fixing the second sheet-like substrate may be further provided.

  With such a method, the first circuit board and the second connector are fixed in advance and integrated with the first sheet-like board and the male connector and the second sheet-like board and the female connector. Since the circuit board can be connected to the circuit board, the connection process can be simplified.

  Further, in the step of forming the first circuit board and the second circuit board in the above method, the first terminal and the second terminal that are set in advance are connected to the electrode terminals of the first passive element. It is good also as the method of connecting between by a wiring and making the wiring between the connection terminals which electrically connect one of the electrode terminals of a 2nd passive element, and a 2nd terminal into an open state. Alternatively, in the step of forming the first circuit board and the second circuit board, for the first terminal and the second terminal which are set in advance, the connection terminals connected to the electrode terminals of the first passive element are wired. It is good also as a method of connecting by.

  By adopting this method, it is possible to change only the wiring pattern of the first circuit board and the second circuit board, and to connect the filter circuit to the connector terminal, or a filter circuit consisting of only the second passive element. It is possible to easily realize the configuration.

  According to the multilayer electronic circuit structure of the present invention, although the filter circuit is three-dimensionally arranged with the connector, the overall height can be hardly changed, so that the size and thickness can be reduced. At the same time, there is a great effect that a multilayer electronic circuit structure having higher functions can be obtained. Further, by forming passive elements functioning as filter circuits individually on the respective sheet-like substrates, filter circuits corresponding to various combinations can be configured. For this reason, the manufacturing process of the sheet-like substrate can be simplified, and at the same time, the yield can be greatly improved, and a great effect is obtained that the multilayer electronic circuit structure can be manufactured at low cost.

  Hereinafter, the laminated electronic circuit structure of the present invention will be described with reference to the drawings. In addition, about the same element, the same code | symbol is attached | subjected and description may be abbreviate | omitted.

(First embodiment)
1A and 1B are views for explaining the structure of a multilayer electronic circuit structure according to a first embodiment of the present invention. FIG. 1A is a cross-sectional view, and FIG. 1B is a view showing a filter circuit configuration of a connector connecting portion. It is. FIG. 2 is a cross-sectional view showing the configurations of the first circuit board 10, the first sheet-like board 15, and the male connector 25, and the configuration in which these are connected. FIG. 3 is a plan view showing a state in which the first sheet-like substrate 15 is fixed on the surface of the male connector 25 facing the first circuit substrate 10. FIG. 4 is a cross-sectional view showing the configuration of each of the second circuit board 30, the second sheet-like board 35, and the female connector 45, and the configuration in which these are connected. FIG. 5 is a plan view showing a state in which the second sheet-like substrate 35 is fixed on the surface of the female connector 45 facing the second circuit substrate 30.

  Hereinafter, the stacked electronic circuit structure according to the present embodiment will be described with reference to FIGS. In the present embodiment, a case where the first passive element is a resistance element, the second passive element is a capacitor element, and the filter circuit is a CR filter will be described as an example. Hereinafter, the first passive element may be referred to as a resistance element, and the second passive element may be referred to as a capacitor element.

  As shown in FIG. 1, the stacked electronic circuit structure of the present embodiment includes a male connector 25 in which a first terminal is connected to a connection terminal of a first circuit board 10, and a second circuit board 30. And a female connector 45 having a second terminal connected to the connection terminal. And the 1st sheet-like board | substrate 15 in which the several 1st passive element was formed in the area | region part surrounded by the 1st terminal arrange | positioned at the both sides of the male connector 25 and the 1st circuit board 10 Is disposed, the electrode terminal of the first passive element and the connection terminal of the first circuit board 10 are connected, and one of the electrode terminals of the first passive element and the first terminal are between the connection terminals. It is electrically connected by the wiring to connect. In addition, a second sheet-like substrate 35 in which a plurality of second passive elements are formed in a region surrounded by the second terminals disposed on both sides of the female connector 45 and the second circuit board 30. Is arranged, the electrode terminal of the second passive element and the connection terminal of the second circuit board 30 are connected, and one of the electrode terminals of the second passive element and the second terminal are between the connection terminals. It is electrically connected by the wiring to connect. Then, by fitting the male connector 25 and the female connector 45, a CR filter is formed between the first passive element of the first sheet-like substrate 15 and the second passive element of the second sheet-like substrate 35. The circuit is configured.

  First, a configuration in which the first circuit board 10, the first sheet-like board 15, and the male connector 25 are integrated will be described with reference to FIGS.

  As shown in FIG. 2A, the first circuit board 10 is composed of at least a double-sided wiring board. An input wiring 12 is formed on one surface of the substrate 11. The input wiring 12 extends from both sides of the base material 11 toward the central portion, and is connected to connection terminals 13 c and 13 d formed on the other surface via a through conductor 14. Note that the input wiring 12, the through conductor 14, and the connection terminals 13 c and 13 d are formed corresponding to the number of the first terminals 27 of the male connector 25 corresponding to the pitch of the first terminals 27. Further, on the other surface of the base material 11, connection terminals 13 a and 13 f connected to the first terminal 27 and connection terminals 13 b and 13 e connected to the electrode terminals 17 and 22 of the first sheet-like substrate 15 are formed. Has been. These connection terminals 13 a, 13 b, 13 e, and 13 f are also formed by the number of the first terminals 27 of the male connector 25.

  Furthermore, in the case of the present embodiment, the connection terminal 13a and the connection terminal 13b are electrically connected by a wiring 13g. Similarly, the connection terminal 13e and the connection terminal 13f are electrically connected by a wiring 13h. As described above, the first circuit board 10 is formed, but various electronic components such as a semiconductor element and a passive component are mounted in an extended region (not shown). In some cases, an electronic component is built in the substrate 11 or a multilayer wiring configuration is used. Since the first circuit board 10 having such a configuration can be easily manufactured by a conventional process, the description of the manufacturing process is omitted.

  As shown in FIG. 2 (b), the first sheet-like substrate 15 is formed in an array in the number corresponding to the first terminals 27, in which the resistance elements 18 and 21 which are the first passive elements in the present embodiment. Has been placed. That is, the resistance element 18 is provided with electrode terminals 17 and 19 at both ends, and the resistance element 21 is similarly provided with electrode terminals 20 and 22 at both ends. The first sheet-like substrate 15 having such a structure is formed by forming aluminum (Al) or copper (Cu) on this surface by vapor deposition or plating, using a resin sheet such as polyimide resin as a base material 16, for example. A known resistance film such as tantalum nitride or cermet material is formed by vapor deposition or sputtering, and can be formed by pattern formation as shown in FIG.

  In order to protect the resistance elements 18 and 21 from the external environment, an insulating protective layer (not shown) may be formed except for the electrode terminals 17, 19, 20 and 22. By forming the insulating protective layer, the first sheet-like substrate 15 having excellent environmental resistance can be obtained. As the insulating protective layer, an ultraviolet curable resin is suitable because it is easily formed by a printing process and has excellent moisture resistance. However, the insulating protective layer is not particularly limited to such a material. An insulating film made of a material may be formed. Furthermore, the electrode terminals 17, 19, 20, and 22 are formed on the first circuit board 10 by forming a gold (Au) film of about 0.2 μm on a copper (Cu) film of 5 μm to 20 μm, for example. This is desirable because the solderability with the provided connection terminals 13b, 13c, 13d, and 13e can be improved.

  Further, as shown in FIG. 2C, the male connector 25 is configured by integrally molding a first terminal 27 with a housing 26, and the first terminal 27 is a connection terminal of the first circuit board 10. Connection portions connected to 13a and 13f are provided to protrude on both sides. Since such a male connector 25 can be a commercially available one, description thereof will be omitted.

  As shown in FIG. 3, the first sheet-like substrate 15 is fixed on the surface of the housing 26 surrounded by the first terminals 27 of the male connector 25. The first terminals 27 and the resistive elements 18 and 21 that are the first passive elements of the first sheet-like substrate 15 are respectively arranged at corresponding positions. For example, it is desirable to use an adhesive as a fixing method.

  After fixing the first sheet-like board 15 to the male connector 25 as shown in FIG. 3 using the first circuit board 10, the first sheet-like board 15 and the male connector 25 having such a configuration. 2D, the respective connection terminals 13a, 13b, 13c, 13d, 13e, and 13f of the first circuit board 10 and the electrode terminals 17, 19, 20, and 22 of the first sheet-like board 15 are shown. And the 1st terminal 27 of the male connector 25 is connected, for example by soldering, and the integrated structure is produced. In addition, you may connect with a conductive adhesive.

  Next, a configuration in which the second circuit board 30, the second sheet-like board 35, and the female connector 45 are integrated will be described.

  As shown in FIG. 4A, the second circuit board 30 is composed of at least a double-sided wiring board. Connection terminals 32 a, 32 b, 32 c, 32 d for connecting to the electrode terminals 37, 39, 41 of the second sheet-like substrate 35 and the second terminal 47 of the female connector 45 on one surface of the base material 31. 32e, a wiring 32f for connecting the connection terminal 32a and the connection terminal 32b, a wiring 32g for connecting the connection terminal 32d and the connection terminal 32e, and a wiring extending from the connection terminals 32a and 32e are formed. Further, the connection terminal 32 c is connected to the ground terminal 33 formed on the other surface via the through conductor 34. The connection terminals 32 a, 32 b, 32 c, 32 d, and 32 e are formed corresponding to the pitch of the second terminals 47 by the number of the second terminals 47 of the female connector 45. Since the connection terminal 32c is connected by the ground terminal 33 and the through conductor 34, it may be a common connection terminal. Further, the connection terminal 32c may be connected not only to the ground terminal 33 on the back surface through the through conductor 34 but also to the ground terminal of the female connector 45 on the front surface side.

  As described above, the second circuit board 30 is formed, but various electronic components such as a semiconductor element and a passive component are mounted in an extended region (not shown). In some cases, an electronic component is built in the base material 31 or a multilayer wiring configuration is used. Since the second circuit board 30 having such a configuration can be easily manufactured by a conventional process, the description of the manufacturing process is omitted.

  As shown in FIG. 4B, the second sheet-like substrate 35 is formed in an array in the number of capacitor elements 38 and 40, which are second passive elements, corresponding to the second terminals 47 in this embodiment. Has been placed. That is, the capacitor element 38 is provided with electrode terminals 37 and 39 at both ends, and the capacitor element 40 is similarly provided with electrode terminals 39 and 41 at both ends. The central electrode terminal 39 is commonly connected to the capacitor elements 38 and 40 on both sides.

  An example of a method for manufacturing the second sheet-like substrate 35 will be described. Similar to the first sheet-like substrate 15, a resin sheet such as polyimide resin is used as the base material 36, and capacitor elements 38 and 40 are formed in an array on the base material 36 by a thin film process. The electrode terminals 37, 39, and 41 for connecting to the connection terminals 32b, 32c, and 32d of the circuit board 30 can be similarly formed by a thin film process and a plating process.

  The capacitor elements 38 and 40 are manufactured as follows, for example. A lower electrode film (not shown) is formed on the substrate 36 at a predetermined position by, for example, mask vapor deposition. Thereafter, a dielectric film (not shown) is formed on the surface of the lower electrode film while leaving a part of the lower electrode film, for example, similarly by sputtering using a mask. An upper electrode film (not shown) is further formed on the dielectric film. Next, the second sheet-like substrate 35 can be obtained by forming the electrode terminals 37, 39, and 41.

  In addition, in order to protect the capacitor elements 38 and 40 from the external environment, an insulating protective layer (not shown) is formed except for the electrode terminals 37, 39 and 41, so that the second sheet having excellent environmental resistance. A shaped substrate 35 can be obtained.

Further, an example of a specific manufacturing method will be described. The lower electrode film is not particularly limited as long as it is a material having low resistance, good adhesion, and low reactivity with the dielectric film, but an aluminum (Al) film is a suitable material because of its ease of film formation. As the film formation method, vacuum deposition, sputtering, plating, or the like can be combined. The dielectric film is preferably a material having a large relative dielectric constant and a small temperature coefficient. For example, silicon dioxide (SiO ₂ ), barium titanate (BaTiO ₃ ), strontium titanate (SrTiO ₃ ), or titanium oxide ( A material generally used as a dielectric material such as TiO ₂ ) can also be used. As a film formation method using these materials, sputtering, vacuum deposition, sol-gel method, plasma chemical vapor deposition method (PCVD method), or the like can be used. Further, as the upper electrode film, the same material as that of the lower electrode film can be used as appropriate.

  Further, as the insulating protective layer, an ultraviolet curable resin is suitable because it is easily formed by a printing process and has excellent moisture resistance. However, the insulating protective layer is not particularly limited to such a material. An insulating film made of an inorganic material may be formed. Furthermore, the electrode terminals 37, 39, and 41 are provided on the second circuit board 30 if, for example, a copper (Cu) film is formed to 5 μm to 20 μm and a gold (Au) film is formed to about 0.2 μm. This is desirable because the solderability with the connection terminals 32b, 32c, and 32d can be improved.

  Next, as shown in FIG. 4C, the female connector 45 is configured by integrally molding the second terminal 47 with the housing 46, and the second terminal 47 is connected to the second circuit board 30. Connection portions connected to the terminals 32a and 32e are provided so as to protrude from both sides. Since such a female connector 45 can be a commercially available one, description thereof will be omitted.

  As shown in FIG. 5, the second sheet-like substrate 35 is fixed on the surface of the housing 46 surrounded by the second terminals 47 of the female connector 45. The second terminal 47 and the capacitor elements 38 and 40 that are the second passive elements of the second sheet-like substrate 35 are respectively arranged at corresponding positions. For this fixing, for example, it is easy and preferable to use an adhesive.

  After fixing the second sheet-like substrate 35 to the female connector 45 as shown in FIG. 5 using the second circuit board 30, the second sheet-like board 35 and the female connector 45 having such a configuration. 4D, the respective connection terminals 32a, 32b, 32c, 32d, 32e of the second circuit board 30 and the electrode terminals 37, 39, 41 of the second sheet-like board 35 and the female connector For example, the second terminal 47 of 45 is connected by soldering to produce an integrated configuration. In addition, you may connect with a conductive adhesive.

  When the male connector 25 and the female connector 45 are fitted together after the integrated configuration as shown in FIGS. 2D and 4D, the stacked electronic circuit structure shown in FIG. The body is obtained.

  The electrical connection between the first circuit board 10 and the second circuit board 30 by the male connector 25 and the female connector 45 is as follows. The input wiring 12 of the first circuit board 10 is connected to connection terminals 13 c and 13 d formed on the other surface via a through conductor 14. The connection terminals 13c and 13d and the electrode terminals 19 and 20 of the first sheet-like substrate 15 are connected by solder or the like. Further, the electrode terminals 17 and 22 and the connection terminals 13b and 13e are connected by solder or the like. The connection terminal 13a and the connection terminal 13b are connected by a wiring 13g, and the connection terminal 13e and the connection terminal 13f are connected by a wiring 13h. Therefore, the input signal (IN) flows to the first terminal 27 of the male connector 25 via the resistance elements 18 and 21, respectively.

  On the other hand, the second terminal 47 of the female connector 45 is connected to the connection terminals 32 a and 32 e of the second circuit board 30. Therefore, the input signal (IN) is sent to the wirings that are the extended portions of the connection terminals 32a and 32e via the resistance elements 18 and 21, the first terminal 27, the second terminal 47, and the connection terminals 32a and 32e. Is output.

  On the other hand, the connection terminal 32a and the connection terminal 32b of the second circuit board 30 and the connection terminal 32d and the connection terminal 32e are connected by wirings 32f and 32g, respectively. The connection terminals 32 b and 32 d are connected to one electrode terminal 37 and 41 of the capacitor elements 38 and 40 of the second sheet-like substrate 35. The other electrode terminal 39 of the capacitor elements 38, 40 is connected to the connection terminal 32 c of the second circuit board 30 and is connected to the ground terminal 33 through the through conductor 34.

  As can be seen from the above configuration, in this embodiment, as shown in FIG. 1B, resistance elements 18 and 21 are inserted in series with respect to the input signal (IN) and the output signal (OUT), and Capacitor elements 38 and 40 are connected in parallel with each other and one of the electrode terminals thereof is grounded to constitute a CR filter circuit.

  In the multilayer electronic circuit structure according to the present embodiment, the resistance elements 18 and 21 and the capacitor elements 38 and 40 constituting the CR filter are formed by a thin film process, respectively. Both sheet-like substrates 35 can be made very thin. The first sheet-like substrate 15 and the second sheet-like substrate 35 are placed in the gap between the male connector 25 and the first circuit board 10 and in the gap between the female connector 45 and the second circuit board 30, respectively. Therefore, even if a CR filter circuit is added, the mounting area of the first circuit board 10 and the second circuit board 30 does not increase. As a result, it is possible to realize a multilayer electronic circuit structure having a higher function, a smaller size, and a thinner thickness.

  In general, it is often unnecessary to connect a CR filter circuit to all of the terminals of the connector. The configuration in such a case is shown in FIG. FIG. 6 is a diagram illustrating a configuration in which noise removal is performed by connecting only a capacitor element to a terminal, and a case in which a resistor element and a capacitor element are not connected at all. Hereinafter, for convenience of explanation, the first terminal 27 and the second terminal 47 on the left side shown in FIG. 6A are referred to as the first terminal 27a and the second terminal 47a, and the first terminal 27 on the right side. The second terminal 47 is referred to as a first terminal 27b and a second terminal 47b.

  As shown in FIG. 6A, the connection terminals 13a, 13b and 13c of the first circuit board 10 to which the first terminal 27a is connected are electrically connected by wiring. As a result, the input signal (IN) input from the input wiring 12a flows to the first terminal 27a without passing through the resistance element 18.

  In addition, a wiring is provided between the connection terminal 32a of the second circuit board 30 to which the second terminal 47a is connected and the connection terminal 32b to which one electrode terminal 37 of the capacitor element 38 is connected. It is not open.

  By adopting such a wiring configuration, a circuit configuration in which the resistance element 18 and the capacitor element 38 are not connected at all can be obtained as shown in FIG.

  On the other hand, the connection terminals 13d, 13e, and 13f of the first circuit board 10 to which the first terminal 27b is connected are also electrically connected by wiring. As a result, the input signal (IN) input from the input wiring 12b flows to the first terminal 27b without passing through the resistance element 21.

  The connection terminal 32e of the second circuit board 30 to which the second terminal 47b is connected and the connection terminal 32d to which one electrode terminal 41 of the capacitor element 40 is connected are connected by wiring. Yes.

  With this wiring configuration, the capacitor element 40 is connected between the input signal (IN) and the output signal (OUT) as shown in FIG. 6C, and the other electrode terminal is connected to the ground terminal (G ) Is connected to the noise prevention circuit configuration.

  In the stacked electronic circuit structure according to the present embodiment, the first circuit board 15, the second sheet board 35, the male connector 25, and the female connector 45 are made constant while the first circuit board is kept constant. By simply changing the wiring pattern of 10 and the second circuit board, it is possible to freely set a configuration that does not connect a CR filter circuit, a noise prevention circuit of only a capacitor element, or a filter circuit according to the terminal. Therefore, the degree of freedom in designing the stacked electronic circuit structure can be expanded.

  Furthermore, the first passive elements 18 and 21 of the first sheet-like substrate 15 may be capacitor elements, and the second passive elements 38 and 40 of the second sheet-like substrate 35 may be resistance elements. With such a configuration, a capacitor element is connected between the input signal (IN) and the output signal (OUT), and one electrode terminal of the resistance element may be a high-pass filter circuit connected to the ground terminal. it can.

(Second Embodiment)
7A and 7B are views for explaining the structure of the multilayer electronic circuit structure according to the second embodiment of the present invention. FIG. 7A is a cross-sectional view, and FIGS. 7B and 7C are filter circuits of a connector connection portion. It is a figure which shows a structure. FIG. 8 is a plan view showing a state in which the first sheet-like substrate 50 used in the present embodiment is fixed on the surface of the male connector 25 facing the first circuit substrate 10. Further, FIG. 9 is a plan view of the first sheet-like substrate 50 of the present embodiment, where (a) is a plan view seen from the surface side on which a resistance element as a first passive element is formed, and (b). FIG. 5 is a plan view seen from the rear surface side in which an inductance element which is a first passive element is similarly formed.

  Hereinafter, the stacked electronic circuit structure according to the present embodiment will be described with reference to FIGS. In the present embodiment, a case where the first passive element includes a resistance element and an inductance element, the second passive element includes a capacitor element, and the filter circuit includes a CR filter and an LC filter will be described as an example. Hereinafter, the first passive element may be referred to as the resistance element 53 and the inductance element 62, and the second passive element may be referred to as the capacitor elements 38 and 40.

  As shown in FIG. 7, the stacked electronic circuit structure according to the present embodiment includes a male connector 25 in which a first terminal 27 is connected to a connection terminal of the first circuit board 10, and a second circuit board. This is a laminated structure in which a female connector 45 having a second terminal 47 connected to 30 connection terminals is fitted. Since this laminated structure is the same as that of the laminated electronic circuit structure according to the first embodiment, the description thereof is omitted.

  In the present embodiment, the first circuit board 10, the male connector 25, the second circuit board 30, the second sheet-like substrate 35, and the female connector 45 are the stacked electronic devices according to the first embodiment. It is the same as the circuit structure and is characterized in that the configuration of the first sheet-like substrate 50 is different as shown in FIG. That is, in the present embodiment, the first sheet-like substrate 50 is formed with the resistance elements 53 and 56 on the surface side in the same manner as the first sheet-like substrate 15 of the first embodiment. In a part of the region, a resistance element is not formed, and a region for forming the through conductors 60 and 61 and the electrode terminals 58 and 59 is provided in order to connect to the inductance element 62 provided on the back surface. On the back surface, as shown in FIG. 9B, an inductance element 62 formed of a conductor pattern is provided. The inductance element 62 is connected to electrode terminals 58 and 59 formed on the surface side through through conductors 60 and 61, respectively. Further, these electrode terminals 58 and 59 are arranged at the same position and the same pitch as the electrode terminals 52, 54, 55 and 57 of the resistance elements 53 and 56. As the base material 51, for example, a polyimide resin sheet is used as in the first embodiment. Further, in the back surface pattern shown in FIG. 9B, only the electrode terminal on the front surface side connected to the inductance element 62 is indicated by a dotted line, and the resistance element and its electrode terminal are omitted.

  The first sheet-like substrate 50 having the above configuration is connected as shown in FIG. The pitch of the electrode terminals 52, 54, 55, 57, 58, 59 of the first sheet-like substrate 50 is the same as the pitch of the first terminals 27 of the male connector 25. They can be connected by the same mounting method as the stacked electronic circuit structure. In addition, the cross section shown in FIG. 7 is a cross-sectional part along the AA line of FIG. Hereinafter, the filter circuit configuration will be described. For convenience of explanation, the left side of FIG. 7A is the first terminal 27c and the second terminal 47c, and the right side is the first terminal 27d and the second terminal. Terminal 47d.

  With respect to the first terminal 27c and the second terminal 47c on the left side, the input signal (IN) flows to the first terminal 27c via the resistance element 53, and via the first terminal 27c and the second terminal 47c. Output as an output signal (OUT). The connection terminal 32a of the second circuit board 30 to which the second terminal 47c is connected and the connection terminal 32b to which the electrode terminal 37 of the second sheet-like board 35 is connected are electrically connected by a wiring 32f. It is connected. Therefore, it is connected to the ground terminal 33 via the capacitor element 38. Thereby, as shown in FIG. 7B, a CR filter circuit is connected to these terminals.

  On the other hand, with respect to the first terminal 27d and the second terminal 47d on the right side, the input signal (IN) flows to the first terminal 27d via the inductance element 62, and passes through the first terminal 27d and the second terminal 47d. And output as an output signal (OUT). The connection terminal 32e of the second circuit board 30 to which the second terminal 47d is connected and the connection terminal 32d to which the electrode terminal 41 of the second sheet-like board 35 is connected are electrically connected by a wiring 32g. It is connected. Therefore, it is connected to the ground terminal 33 via the capacitor element 40. Thereby, as shown in FIG. 7C, an LC filter circuit is connected to these terminals.

  As described above, in the multilayer electronic circuit structure according to the present embodiment, the resistance elements 53 and 56 are disposed on the front surface side of the first sheet-like substrate 50, the inductance element 62 is disposed on the back surface side, and the first The electrode terminals 52, 54, 55, 57, 58, 59 for connecting to one circuit board 10 are arranged at positions corresponding to the first terminals 27 of the male connector 25. Thereby, the CR filter circuit and the LC filter circuit can be connected to the terminals set in advance.

  Further, in the present embodiment, similarly to the first embodiment, the predetermined connection terminals of the first circuit board and the second circuit board are short-circuited and opened by wiring, so that the filter is completely eliminated. A configuration in which a circuit is not connected or a configuration in which only a capacitor element is connected may be employed. Thereby, the required filter circuits can be connected to the terminals of the connector. That is, the multilayer electronic circuit structure of the present embodiment can be configured such that the CR filter, the LC filter, the noise prevention circuit using only C, and the filter circuit are not connected at all.

  In the first embodiment and the second embodiment, the resistance elements and the capacitor elements are formed by the number of connector terminals, but the present invention is not limited to this. When the terminal to which the filter circuit is connected is set in advance, the first sheet-like substrate and the second sheet-like substrate in which the resistance element and the capacitor element are formed only at the position corresponding to the terminal may be used. Good.

  Furthermore, the resistance element, the capacitor element, and the inductance element need not all have the same resistance value, capacitance, etc., but may have different values. Such different values can be easily achieved by changing the pattern shape and the number of turns.

  In the present embodiment, the first sheet substrate and the second sheet substrate are bonded in advance to the male connector and the female connector and then mounted on the first circuit substrate and the second circuit substrate. However, the present invention is not limited to this. After the first sheet-like board and the second sheet-like board are first mounted on the first circuit board and the second circuit board, the male connector and the female connector may be mounted respectively.

  The multilayer electronic circuit structure according to the present invention uses the gap between the male connector and the first circuit board and the gap between the female connector and the second circuit board, and the first sheet-like board and the second board. By providing a sheet-like substrate and configuring the filter circuit when the connectors are fitted together, a small and thin configuration can be realized, which is useful in the field of portable electronic devices such as cellular phones.

(A) is sectional drawing explaining the structure of the multilayer electronic circuit structure concerning the 1st Embodiment of this invention, (b) is a figure which shows the filter circuit structure of a connector connection part. Sectional drawing which shows each structure of the 1st circuit board, the 1st sheet-like board | substrate, and a male connector, and the structure which connected these in the multilayer electronic circuit structure of the embodiment The top view which shows the state which fixed the 1st sheet-like board | substrate on the surface facing the 1st circuit board of a male connector in the multilayer electronic circuit structure of the embodiment. Sectional drawing which shows each structure of the 2nd circuit board, the 2nd sheet-like board | substrate, and a female connector in the laminated type electronic circuit structure of the embodiment, and the structure which connected these The top view which shows the state which fixed the 2nd sheet-like board | substrate on the surface facing the 2nd circuit board of a female connector in the multilayer electronic circuit structure of the embodiment. In the multilayer electronic circuit structure of the same embodiment, a diagram showing a configuration when noise is removed by connecting only a capacitor element to a terminal and when a resistor element and a capacitor element are not connected at all (A) is sectional drawing explaining the structure of the multilayer electronic circuit structure concerning the 2nd Embodiment of this invention, (b) and (c) are figures which show the filter circuit structure of a connector connection part. The top view which shows the state which fixed the 1st sheet-like board | substrate used in the embodiment on the surface facing the 1st circuit board of a male connector. (A) is the top view seen from the surface side which formed the resistive element which is the 1st passive element of the 1st sheet-like board | substrate of the embodiment, (b) is the inductance element which is the 1st passive element. Plan view seen from the back side The figure which shows the example which accommodated the conventional noise filter in the connector, and was integrated

Explanation of symbols

10 First circuit board 11, 16, 31, 36, 51 Base material 12, 12a, 12b Input wiring 13a, 13b, 13c, 13d, 13e, 13f, 32a, 32b, 32c, 32d, 32e Connection terminal 13g, 13h, 32f, 32g Wiring 14, 34, 60, 61 Through conductor 15, 50 First sheet-like substrate 17, 19, 20, 22, 37, 39, 41, 52, 54, 55, 57, 58, 59 Electrode Terminal 18, 21, 53, 56 Resistance element (first passive element)
25 Male connector 26, 46, 71 Housing 27, 27a, 27b, 27c, 27d First terminal 30 Second circuit board 33 Ground terminal 35 Second sheet-like board 38, 40 Capacitor element (second passive element )
45 Female connector 47, 47a, 47b, 47c, 47d Second terminal 62 Inductance element (first passive element)
70 Connector 72 Plug insertion chamber 73 Storage chamber 74 Terminal pin 74a, 75 Terminal 75a One end 76, 86 Ground electrode 80 Filter 82 Input side external electrode 84 Output side external electrode

Claims (12)

Lamination formed by fitting a male connector in which a first terminal is connected to a connection terminal of a first circuit board and a female connector in which a second terminal is connected to a connection terminal of a second circuit board An electronic circuit structure of the configuration,
A first sheet-like substrate on which a plurality of first passive elements are formed is arranged in a region surrounded by the first terminal and the first circuit board arranged on both sides of the male connector. The electrode terminal of the first passive element and the connection terminal of the first circuit board are connected, and one of the electrode terminals of the first passive element and the first terminal are connected to the connection terminal. Are electrically connected by wiring connecting between
A second sheet-like substrate on which a plurality of second passive elements are formed is arranged in a region surrounded by the second terminal and the second circuit board arranged on both sides of the female connector. The electrode terminal of the second passive element and the connection terminal of the second circuit board are connected, and one of the electrode terminals of the second passive element and the second terminal are connected to the connection terminal. Are electrically connected by wiring connecting between
By fitting the male connector and the female connector, a filter circuit is formed between the first passive element of the first sheet-like substrate and the second passive element of the second sheet-like substrate. A laminated electronic circuit structure characterized by comprising: The first sheet-like board is fixed on a surface of the male connector facing the first circuit board, and the second sheet-like board faces the second circuit board of the female connector. The multilayer electronic circuit structure according to claim 1, wherein the multilayer electronic circuit structure is fixed on a surface. The first sheet-like substrate and the second sheet-like substrate are provided on the surface of the male connector that faces the first circuit board and the surface of the female connector that faces the second circuit board. The laminated electronic circuit structure according to claim 1, further comprising a recess for receiving each of the stacked electronic circuit structures. The first passive element is a resistor element or a capacitor element, the second passive element is a capacitor element or a resistor element, and the filter circuit is a CR filter. The laminated electronic circuit structure according to any one of the preceding items. 4. The method according to claim 1, wherein the first passive element is an inductance element, the second passive element is a capacitor element, and the filter circuit is an LC filter. 2. A laminated electronic circuit structure according to 1. The first passive element includes a resistance element and an inductance element, the second passive element includes a capacitor element, and the filter circuit includes a CR filter and an LC filter. Item 4. The stacked electronic circuit structure according to any one of Items 3 to 3. For the first terminal and the second terminal set in advance, the connection terminals connected to the electrode terminals of the first passive element are connected by wiring, and the electrode terminals of the second passive element are connected. The stacked type according to any one of claims 1 to 6, wherein the wiring between the connection terminals that electrically connect one of the second terminal and the second terminal is in an open state. Electronic circuit structure. The first terminal and the second terminal that are set in advance are connected by wiring between the connection terminals connected to the electrode terminals of the first passive element. The multilayer electronic circuit structure according to any one of 6 to 6. Forming a first sheet-like substrate having a first passive element at a position corresponding to the first terminal in a shape at least smaller than a region surrounded by first terminals arranged on both sides of the male connector And a process of
Forming a first circuit board having a connection terminal at a position corresponding to each of the first terminal of the male connector and the electrode terminal of the first passive element of the first sheet-like board;
Forming a second sheet-like substrate having a second passive element at a position corresponding to the second terminal, at least smaller than the area surrounded by the second terminals arranged on both sides of the female connector And a process of
Forming a second circuit board having a connection terminal at a position corresponding to each of the second terminal of the female connector and the electrode terminal of the second passive element of the second sheet-like board;
Aligning and connecting the connection terminal of the first circuit board, the electrode terminal of the first passive element, and the first terminal of the male connector;
Aligning and connecting the connection terminal of the second circuit board, the electrode terminal of the second passive element, and the second terminal of the female connector;
A multilayer electronic device comprising: a step of forming a filter circuit with the first passive element and the second passive element by fitting the male connector with the female connector. A method for manufacturing a circuit structure. Before connecting the connection terminal of the first circuit board, the electrode terminal of the first passive element, and the first terminal,
The step of fixing the first sheet-like substrate by associating the first terminal and the electrode terminal of the first passive element with a region surrounded by the first terminal of the male connector Further provided,
Before the step of connecting the connection terminal of the second circuit board to the electrode terminal and the second terminal of the second passive element,
A step of fixing the second sheet-like substrate by associating the second terminal with the electrode terminal of the second passive element in a region surrounded by the second terminal of the female connector; The method for manufacturing a multilayer electronic circuit structure according to claim 9, further comprising: In the step of forming the first circuit board and the second circuit board,
For the first terminal and the second terminal set in advance, the connection terminals connected to the electrode terminals of the first passive element are connected by wiring, and the electrode terminals of the second passive element are connected. 11. The manufacturing of the multilayer electronic circuit structure according to claim 9, wherein the wiring between the connection terminals that electrically connect one of the first terminal and the second terminal is opened. Method. In the step of forming the first circuit board and the second circuit board,
The preliminarily set first terminal and the second terminal are connected by wiring between the connection terminals connected to the electrode terminals of the first passive element. 10. A method for producing a laminated electronic circuit structure according to 10.

Images