JP4456916B2 - Low-contamination injection molding - Google Patents

Description

  The present invention relates to an injection-molded article containing a thermoplastic resin component and a carbon-based filler, and more specifically, the surface resistivity can be strictly controlled to a desired value in the semiconductive region, The present invention relates to a low-contamination injection-molded product in which the generation of burrs is remarkably reduced and the generation amount of foreign particles (particles) is extremely small. In addition to the above properties, the injection-molded product of the present invention can be selected from a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin that constitute the thermoplastic resin component. It is possible to control the property to a desired high level.

  The injection-molded article of the present invention can cope with ESD failures such as discharge phenomenon due to static electricity (Electro-Static Discharge) and electrostatic breakdown (Electro-Static Destroy), and has low contamination, so that it is a semiconductor. It is particularly suitable as a transport tray or container for electronic devices such as devices.

  Components used in the manufacturing process of semiconductors such as IC and LSI, and components for mounting them, components used in the manufacturing process of magnetic heads and hard disk drives, mounting components, components used in the manufacturing process of liquid crystal displays, and the components Resin materials used for molding mounted parts and the like are required to have excellent mechanical properties, heat resistance, chemical resistance, and dimensional stability. These components include, for example, trays and containers used for transportation (including transportation) in the electronic device manufacturing process. Examples of such trays and containers include wafer carriers, cleaning trays, IC chip trays, magnetic head trays for transferring hard disk drive components, and head gimbal assembly (HGA) trays.

  Conventionally, as a resin material in this technical field, for example, a thermoplastic resin excellent in heat resistance and chemical resistance such as polyether ether ketone, polyether imide, polysulfone, polyether sulfone, and polyphenylene sulfide has been used. Yes.

However, with the progress of high-density pitches in electronic devices, the use of parts made of resin materials with a surface resistivity exceeding 10 ¹³ Ω / □ makes it easier for the electronic devices to be charged due to the effects of frictional charging of the parts. Become. An electronic device that is charged and accumulates static electricity is damaged by electrostatic discharge or electrostatically adsorbs dust floating in the air. On the other hand, parts made of resin materials with a surface resistivity of less than 10 ⁵ Ω / □ are too fast to move charges in the resin parts, resulting in strong currents and high voltages generated during electrostatic discharge. May damage the electronic device.

From the viewpoint of protecting the electronic device from electrostatic failure and maintaining a high degree of cleanness without bringing in dust, the parts used in these technical fields have a surface resistivity of 10 ⁵ to 10 in the semiconductive region. Control within the range of ¹³ Ω / □ is required. Therefore, conventionally, there has been proposed a method for obtaining a molded body having a surface resistivity in a semiconductive region by using a resin material containing an antistatic agent or a conductive filler.

  However, the method of adding an antistatic agent to the resin material tends to lose the antistatic effect because the antistatic agent present on the surface of the molded product is removed by washing or friction. If the amount of the antistatic agent is increased so that the antistatic agent can easily bleed from the inside of the molded body to the surface, the antistatic effect can be maintained to some extent, but the bleeded antistatic agent can be applied to the surface of the molded body. Electronic devices and the environment are contaminated by dust adhering, and elution and volatilization of the antistatic agent. In addition, when a large amount of the antistatic agent is blended, the heat resistance of the molded product is lowered.

The method of blending a conductive filler with a volume resistivity of less than 10 ² Ω · cm, such as conductive carbon black or carbon fiber, into the resin material is largely separated from the electrical resistivity of the resin material and the conductive filler. The surface resistivity of the resulting molded product varies greatly due to slight differences in the blending ratio of the conductive filler and slight variations in molding conditions. Therefore, in the method of simply blending the conductive filler, the surface resistivity of the obtained molded body can be controlled strictly and stably so as to be a desired value within the range of 10 ⁵ to 10 ¹³ Ω / □. It is extremely difficult. Moreover, in the method of blending the conductive filler, the surface resistivity depending on the location of the molded body tends to vary greatly. A molded product with a large variation in surface resistivity has a mixture of places where the surface resistivity is too large and too small. For example, if it is used as a tray or container for transporting electronic device parts, it is sufficiently resistant to ESD damage. I can't respond.

In order to solve the above problem, the present applicant combines a thermoplastic resin with a carbon precursor having a volume resistivity of 10 ² to 10 ¹⁰ Ω · cm and a conductive filler having a volume resistivity of less than 10 ² Ω · cm. And an IC socket injection-molded using the resin composition (for example, Patent Documents 1 and 2). As the thermoplastic resin, polyether ether ketone, polyphenylene sulfide, polyether imide, polyether sulfone, polybutylene terephthalate, or the like is used.

  When the resin composition is injection-molded, an injection-molded body in which the surface resistivity is precisely controlled within a desired range limited in the semiconductive region can be obtained. However, it has been found that an injection molded product obtained by injection molding of the resin composition has a problem that a large amount of foreign particles are generated. Further, many of the injection molded articles have a problem that burrs are easily generated. If a high-melting crystalline thermoplastic resin such as polyetheretherketone or polyphenylene sulfide is used as the thermoplastic resin, burrs are more likely to occur. In addition, even if a thermoplastic resin is less likely to generate burrs under general injection molding conditions, burrs will be generated if high injection speed and high injection pressure injection molding conditions are used for injection molding of precision parts. It becomes easy to do.

  Since parts such as a transfer tray and a container used in a hard disk drive (HDD) manufacturing process are used in a clean room, if the amount of particles generated is large, it may cause contamination of the clean room or electronic device. Further, these parts are often used in a cleaning process with ultrapure water or a solvent, or are used after being cleaned themselves. When the amount of particles generated in these parts is large, the electronic device is contaminated in the cleaning process or the cleaning liquid is contaminated.

  When an electronic device such as a semiconductor device is contaminated with particles (foreign particles), the electrical characteristics, reliability, product yield, etc. of the electronic device are adversely affected. When the cleaning liquid is contaminated with particles, it becomes difficult to repeatedly use the cleaning liquid or it is necessary to frequently purify the cleaning liquid.

  In addition, an injection molded body in which burrs are likely to be generated has a problem that the burrs are likely to drop off and become foreign particles in a sliding condition or during cleaning with a cleaning liquid, in addition to the possibility of short circuit due to burrs.

Special Table 2002-53660 International Publication No. 02/082592 Pamphlet

  An object of the present invention is an injection-molded product obtained by injection molding a resin composition containing a thermoplastic resin component and a carbon-based filler, and the surface resistivity is set to a desired value in a semiconductive region. An object of the present invention is to provide a low-contamination injection-molded product that can be strictly controlled and has a very small amount of generation of foreign particles (particles). Another object of the present invention is to provide an injection-molded article having a short burr length in addition to the above-mentioned characteristics.

  As a result of diligent research to achieve the above-mentioned problems, the present inventors have found that in an injection-molded body formed by injection-molding a resin composition containing a thermoplastic resin component, a carbon precursor, and a conductive filler, It has been found that by using a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin as the plastic resin component, a low-contamination injection-molded product with a remarkably small amount of particles can be obtained.

  The injection-molded article obtained from the resin compositions specifically disclosed in the examples of Patent Documents 1 and 2 has a particle generation amount of about 3000 particles / ml with a particle size of 0.5 μm or less measured in pure water. Or it was exceeded, and in some cases it exceeded 6000 / ml. That is, it has been found that when a crystalline thermoplastic resin and an amorphous thermoplastic resin are used alone as the thermoplastic resin component, the amount of particles generated is remarkably large.

  In contrast, by using a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin, when measured under the same conditions, a particle generation amount of 0.5 μm or less in particle diameter measured in pure water can be obtained. It can be reduced to 1500 pieces / ml or less, and further to 1000 pieces / ml or less. Therefore, it can be said that the low-staining effect obtained by using a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin is a kind of synergistic effect.

  In addition, when each of the crystalline thermoplastic resin or the amorphous thermoplastic resin is used alone, it may be difficult to sufficiently suppress the generation of burrs, but by using both in combination, Generation of burrs can be stably suppressed to a low level.

  The injection molded article of the present invention can strictly control the surface resistivity to a desired value in the semiconductive region, and has little variation depending on the location of the surface resistivity. Furthermore, the injection molded article of the present invention can maintain heat resistance at a high level by using a crystalline thermoplastic resin and an amorphous thermoplastic resin in combination. By selecting a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin, in addition to the above properties, it has excellent electrical insulation, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. An injection molded body can be obtained. The present invention has been completed based on these findings.

According to the present invention, at least one crystalline thermoplastic resin (A1) selected from the group consisting of polyetheretherketone and polyarylene sulfide resin, selected from the group consisting of polyetherimide, polyethersulfone, and polycarbonate. The carbon precursor (B) 5 having a thermoplastic resin component (A) of 30 to 66 % by mass and a volume resistivity of 10 ² to 10 ¹⁰ Ω · cm containing at least one amorphous thermoplastic resin (A2). to 16 wt%, and a volume resistivity of 10 ² Omega · carbon fibers of less than cm conductive filler (C) 18 to 30 wt% of low contamination of the injection-molded body formed from a resin composition containing (1) As an evaluation of the amount of generated particles, an injection-molded plate (65 mm × 90 mm × 3 mm thickness) obtained by injection molding of a resin composition was placed in a 500 ml beaker, and pure water was added 5 After injecting 0 ml, it was treated with an ultrasonic oscillator (1200 W) for 1 minute, and the amount of particles with a particle size of 0.5 μm or less measured in pure water after treatment was 1500 particles / ml or less. As an evaluation of the above, using the pellets obtained by melt extrusion of the resin composition, the resin composition is completely contained in a mold having a cavity with a diameter of 70 mm and a thickness of 3 mm and maintained at the optimum mold temperature. Injection molding is performed at an injection pressure of 1.05 times the minimum filling pressure to be filled to produce a disk-shaped molded body, and the obtained disk-shaped molded body has a thickness of 20 μm provided on the periphery of the mold, A low-contamination injection-molded article having a burr length of 300 μm or less generated in a gap having a width of 5 mm (a slit for burr evaluation) and (3) a surface resistivity of the injection-molded article of 10 ⁷ to 10 ¹¹ Ω / □ Provided.

  According to the present invention, by using a resin composition containing a thermoplastic resin component and a carbon-based filler, the surface resistivity can be strictly controlled to a desired value in the semiconductive region, and at the time of injection molding It is possible to provide a low-contamination injection-molded product that can stably reduce the generation of burrs and that has a very small amount of particles. Further, according to the present invention, in addition to the above characteristics, mechanical characteristics, heat resistance, dimensional stability can be obtained by selecting a combination of a crystalline thermoplastic resin and an amorphous thermoplastic resin constituting the thermoplastic resin component. It is possible to provide an injection molded body capable of controlling the properties and the like to a desired high level.

1. Thermoplastic resin component:
The binding-crystalline thermoplastic resin, e.g., polyether ether ketone, polyarylene sulfide resin, thermoplastic polyester resin, a wholly aromatic polyester resin (liquid crystal polymer), polyamide resins, polymethyl pentene, polyacetal, fluororesin, polyolefin resin (For example, polyethylene, polypropylene), polyvinylidene chloride, polyisobutylene, polyisoprene, polybutene and the like are included.

  The crystalline thermoplastic resin is a crystalline thermoplastic resin having a melting point of preferably 150 ° C. or higher, more preferably 160 ° C. or higher, further preferably 200 ° C. or higher, particularly preferably 220 ° C. or higher, from the viewpoint of heat resistance. Is desirable. Specific examples of such high-melting crystalline thermoplastic resins together with melting points (representative values) include: polyether ether ketone (334 ° C.); polyarylene sulfide resins such as polyphenylene sulfide (280 to 295 ° C.); polybutylene Thermoplastic polyester resins such as terephthalate (224 to 228 ° C) and polyethylene terephthalate (248 to 260 ° C); wholly aromatic polyester resin (450 ° C or higher); nylon 6 (220 to 228 ° C), nylon 66 (260 to 265 ° C) ), Polyamide 46 such as nylon 46 (290 ° C.); polymethylpentene (235 ° C.); polyacetal (165 to 179 ° C.); polytetrafluoroethylene (327 ° C.), tetrafluoroethylene / hexafluoropropylene / perfluoroalkoxyvinyl D Ter copolymer (290-300 ° C), tetrafluoroethylene / ethylene copolymer (260-270 ° C), polyvinyl fluoride (227 ° C), tetrafluoroethylene / hexafluoropropylene copolymer (253-282 ° C) And fluororesins such as tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (302 to 310 ° C.).

Among these crystalline thermoplastic resins, polyether ether ketone, polyarylene sulfide resin, thermoplastic polyester resin, wholly aromatic polyester resin, polymethylpentene, polyacetal, polyamide resin, and fluororesin are preferable, and polyether ether ketone And polyphenylene sulfide is more preferred. From the viewpoint of particle generation and burr suppression, polyether ether ketone is particularly preferable. In the present invention, as the crystalline thermoplastic resins, polyether ether ketone, and the polyarylene sulfide resin, singly, some have can be used by combining observed.

Non-crystalline thermoplastic resin, e.g., polyetherimide, polyamideimide, polyimide, polysulfone, polyether sulfone, polyphenylene sulfide sulfone, polycarbonate, polystyrene, ABS resin, modified polyphenylene ether, polyurethane, polydimethylsiloxane, polyvinyl acetate , Polymethyl acrylate, polymethyl methacrylate, polyarylate, polyvinyl chloride, and the like.

  From the viewpoint of heat resistance, the amorphous thermoplastic resin is preferably an amorphous thermoplastic resin having a glass transition temperature of preferably 140 ° C. or higher, more preferably 150 ° C. or higher, and particularly preferably 170 ° C. or higher. When a specific example of an amorphous thermoplastic resin having a high glass transition temperature is exemplified together with a glass transition temperature (representative value), polyetherimide (217 ° C.), polyether sulfone (225 to 230 ° C.), polycarbonate (145 to 231 ° C.) ), Polyphenylene ether (220 ° C.), polyarylate (193 ° C.), polysulfone (190 ° C.), polyamideimide (280 to 285 ° C.), and the like.

Among these amorphous thermoplastic resins, polyetherimide, polyethersulfone, and polycarbonate are particularly preferable from the viewpoint of the generation amount of particles and suppression of burr generation. In the present invention, polyetherimide, polyethersulfone, and polycarbonate can be used alone or in combination of two or more as the amorphous thermoplastic resin .

Examples of the thermoplastic resin component (A), the crystalline thermoplastic resin is a polyetheretherketone or polyphenylene sulfide, amorphous thermoplastic resin is polyetherimide, a combination polyether sulfone or polycarbonate is not particularly preferred .

  The crystalline thermoplastic resin (A1) and the amorphous thermoplastic resin (A2) are usually 1 to 99% by mass of the crystalline thermoplastic resin (A1) and 99 to 1 mass of the amorphous thermoplastic resin (A2). % Can be used in any proportion within the range. From the viewpoint of effectively suppressing particle generation and burr generation, the crystalline thermoplastic resin (A1) 5 to 95% by mass and the amorphous thermoplastic resin (A2) 95 to 5% by mass are preferable, and the crystalline heat 10 to 90% by mass of the plastic resin (A1) and 90 to 10% by mass of the amorphous thermoplastic resin (A2) are more preferable.

  From the viewpoint of high heat resistance, the thermoplastic resin component (A) is composed of a crystalline thermoplastic resin (A1) exceeding 50% by mass and 95% by mass or less and an amorphous thermoplastic resin (A2) of 5% by mass to 50% by mass. The crystalline thermoplastic resin (A1) 55 to 90% by mass and the amorphous thermoplastic resin (A2) 10 to 45% by mass are more preferable.

  On the other hand, from the viewpoint of highly suppressing the generation amount of particles and the generation of burrs, the thermoplastic resin component (A) is an amorphous thermoplastic resin (5% by mass to less than 50% by mass of the crystalline thermoplastic resin (A1)). A2) more than 50% by mass and 95% by mass or less, preferably 10 to 45% by mass of the crystalline thermoplastic resin (A1) and 55 to 90% by mass of the amorphous thermoplastic resin (A2). It is more preferable.

In tree fat composition, the mixing ratio of the thermoplastic resin component (A) is 30 to 94 wt% in total of the crystalline thermoplastic resin and an amorphous thermoplastic resin, preferably from 40 to 90 wt%, More preferably, it is 50-80 mass%. In this invention, it is 30-66 mass%.

  When the blending ratio of the thermoplastic resin component (A) is too large, the surface resistivity of the molded body becomes high, and it becomes difficult to control the surface resistivity of the desired semiconductive region. On the other hand, if the blending ratio of the thermoplastic resin component (A) is too small, the surface resistivity of the molded body becomes too low, making it difficult to control the surface resistivity of the desired semiconductive region, and the molded body. The electrical insulation of the film is too low.

2. Carbon precursor:
The carbon precursor having a volume resistivity of 10 ² to 10 ¹⁰ Ω · cm used in the present invention can be obtained by baking an organic substance at a temperature of 400 ° C. to 900 ° C. in an inert atmosphere.

  More specifically, the carbon precursor used in the present invention is, for example, (i) heating tar or pitch such as petroleum tar, petroleum pitch, coal tar, coal pitch, etc., and performing aromatization and polycondensation. Depending on the method, oxidation and infusibilization in an oxidizing atmosphere, further heating and baking in an inert atmosphere, (ii) insolubilizing a thermoplastic resin such as polyacrylonitrile and polyvinyl chloride in an oxidizing atmosphere, It can be produced by a method of heating and baking in an inert atmosphere, or (iii) a method of heating and baking a thermosetting resin such as a phenol resin and a furan resin and then heating and baking in an inert atmosphere.

The carbon precursor means a substance that is not completely carbonized and has a carbon content of 97% by mass or less obtained by these treatments. When the organic substance is heated and fired in an inert atmosphere, the carbon content of the fired body obtained increases as the firing temperature rises. The carbon content of the carbon precursor can be easily controlled by appropriately setting the firing temperature. The carbon precursor having a volume resistivity of 10 ² to 10 ¹⁰ Ω · cm used in the present invention can be obtained as a carbon precursor having a carbon content of preferably 80 to 97% by mass and not completely carbonized. it can.

If the carbon content of the carbon precursor is too small, the volume resistivity becomes too high, and it becomes difficult to make the surface resistivity of the injection molded product obtained from the resin composition 10 ¹³ Ω / □ or less. The volume resistivity of the carbon precursor is preferably 10 ² to 10 ¹⁰ Ω · cm, more preferably 10 ³ to 10 ⁹ Ω · cm.

  Carbon precursors are usually used in the form of particles or fibers. The average particle diameter of the carbon precursor particles used in the present invention is preferably 1 mm or less. If the average particle diameter of the carbon precursor is too large, it is difficult to obtain a molded article having a good appearance when the resin composition is molded. The average particle diameter of the carbon precursor particles is usually 0.1 mm to 1 mm, preferably 0.5 to 500 μm, more preferably 1 to 100 μm. In many cases, good results can be obtained by using a carbon precursor having an average particle diameter of about 5 to 50 μm. The average diameter of the fibrous carbon precursor used in the present invention is preferably 0.1 mm or less. When the average diameter of the fibrous carbon precursor exceeds 0.1 mm, it becomes difficult to obtain a molded article having a good appearance. The fibrous carbon precursor is preferably a short fiber from the viewpoint of dispersibility in the resin composition.

In tree fat composition, the mixing ratio of the carbon precursor (B) is 5 to 40 wt%, preferably from 6 to 30 wt%, more preferably 10 to 22 wt%. In this invention, it is 5-16 mass%. If the blending ratio of the carbon precursor is too large, the mechanical properties of the injection molded product may be deteriorated. On the other hand, if the blending ratio of the carbon precursor is too small, it is difficult to sufficiently reduce the surface resistivity of the injection-molded product, and the variation depending on the location of the surface resistivity tends to increase.

3. Conductive filler:
The conductive filler having a volume resistivity of less than 10 ² Ω · cm used in the present invention is not particularly limited, and examples thereof include carbon fiber, graphite, conductive carbon black, and metal powder. Among these, conductive carbon materials such as carbon fiber, graphite, conductive carbon black, and mixtures thereof are preferable from the viewpoint of controllability and reproducibility of surface resistivity.

  Among conductive carbon materials, when used in combination with a carbon precursor, the surface resistivity of the injection-molded product can be strictly controlled to a semiconductive region, and the variation due to the location of the surface resistivity is sufficiently small. Further, carbon fiber is more preferable in that the amount of generated particles can be suppressed. Moreover, when carbon fiber is used, the mechanical characteristics of the injection-molded product can be improved.

  Examples of the carbon fiber used in the present invention include cellulose-based carbon fiber, polyacrylonitrile-based carbon fiber (PAN-based carbon fiber), lignin-based carbon fiber, and pitch-based carbon fiber. Among these carbon fibers, PAN-based carbon fibers and pitch-based carbon fibers are preferable.

  The average diameter of the carbon fibers is preferably 0.1 mm or less. When the average diameter of the carbon fibers exceeds 0.1 mm, it becomes difficult to obtain an injection molded article having a good appearance. The carbon fibers preferably have an average fiber length of 20 μm or more and are short fibers. When carbon fibers having an average fiber length of 20 μm or less are used, the effect of improving mechanical properties such as creep properties, elastic modulus, and strength is reduced.

  The conductive carbon black is not particularly limited as long as it has conductivity, and examples thereof include acetylene black, oil furnace black, thermal black, and channel black. The graphite is not particularly limited, and examples thereof include artificial graphite obtained by graphitizing coke, tar, pitch, and the like at high temperature, scaly graphite, scaly graphite, and natural graphite such as soil graphite.

In the present invention, carbon fiber is used as the conductive filler. The volume resistivity of the conductive filler used in the present invention is less than 10 ² Ω · cm, and the lower limit is usually the volume resistivity of a metal material such as metal powder or metal fiber.

In tree fat composition, the mixing ratio of the conductive filler (C) is 1 to 30 wt%, preferably from 6 to 29 wt%, more preferably 10 to 28 wt%. In this invention, it is 18-30 mass%. If the blending ratio of the conductive filler is too large, the surface resistivity of the injection molded product becomes too low, making it difficult to control the surface resistivity within the semiconductive region, or the surface resistivity depending on the location. Variations increase. If the blending ratio of the conductive filler is too small, it becomes difficult to control the surface resistivity of the injection molded body within the semiconductive region.

4). Other fillers:
Various fillers can be blended with the resin composition comprising the thermoplastic resin of the present invention for the purpose of further increasing mechanical strength and heat resistance. Examples of the filler include inorganic fibers such as glass fiber, asbestos fiber, silica fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber; polyamide, fluororesin, polyester Examples thereof include fibrous fillers such as high melting point organic fibrous materials such as resins and acrylic resins. The fibrous filler is preferably a non-conductive material such as glass fiber from the viewpoint of electrical insulation.

  Examples of the filler include mica, silica, talc, alumina, kaolin, calcium sulfate, calcium carbonate, titanium oxide, ferrite, clay, glass powder, zinc oxide, nickel carbonate, iron oxide, quartz powder, magnesium carbonate, A granular or powder filler such as barium sulfate can be used.

  These fillers can be used alone or in combination of two or more. The filler may be treated with a sizing agent or a surface treatment agent as necessary. Examples of the sizing agent or the surface treatment agent include functional compounds such as an ethoxy compound, an isocyanate compound, a silane compound, and a titanate compound. These compounds may be used after having been subjected to surface treatment or focusing treatment on the filler in advance, or may be added simultaneously with the preparation of the resin composition.

5). Additive:
In the resin composition used in the present invention, as other additives, for example, an impact modifier such as an epoxy group-containing α-olefin copolymer; a resin modifier such as ethylene glycidyl methacrylate; zinc carbonate, carbonic acid Mold corrosion inhibitors such as nickel; lubricants such as pentaerythritol tetrastearate; thermosetting resins; antioxidants; UV absorbers; nucleating agents such as boron nitride; flame retardants; A coloring agent; etc. can be added suitably.

6). Resin composition:
The resin composition used in the present invention can be prepared by facilities and methods generally used for preparing a thermoplastic resin composition. For example, each raw material component is premixed with a Henschel mixer, tumbler, etc., and if necessary, a filler such as glass fiber is added and further mixed, then kneaded using a single or twin screw extruder and extruded. To form pellets. A method of mixing a part of the required components into a master batch and then mixing with the remaining components. In addition, in order to improve the dispersibility of each component, some of the raw materials to be used are pulverized and mixed to obtain a uniform particle size. It is also possible to do.

7). Injection molded body:
The injection-molded article of the present invention can be produced by injection molding a resin composition containing the above components. As described above, the resin composition is preferably used in the form of pellets.

  Injection molding can be performed according to general injection molding conditions by appropriately adjusting the cylinder temperature, mold temperature, etc. of the injection molding machine according to the type of thermoplastic resin used. When the resin composition of the present invention is used, the generation of burrs can be effectively suppressed. Therefore, it is possible to increase the injection speed and injection pressure and to injection mold precision parts. The shape of the mold can be designed according to the shape of the desired injection-molded body.

  The injection molded product of the present invention has a particle generation amount of 0.5 μm or less measured in pure water of 1500 / ml, preferably 1000 / ml, more preferably 900 / ml, particularly preferably Is 800 pieces / ml or less, and contamination due to generation of particles (that is, foreign particles) is remarkably suppressed. The amount of particles generated in pure water is a value measured by the measurement method described in the examples, and may be referred to as “particle generation amount in liquid”.

  The injection-molded article of the present invention uses, for example, a resin composition mainly composed of polyether ether ketone or a resin composition mainly composed of an amorphous thermoplastic resin, so that the amount of particles generated is 0.5 μm or less. Is preferably 600 pieces / ml or less, more preferably 500 pieces / ml or less, and even more preferably 450 pieces / ml or less.

  The amount of generated particles can be an index of the amount of fine particles having a particle size of 0.5 μm or less. When the generation amount of particles having a particle size of 0.5 μm or less is sufficiently small, the generation amount of fine particles having a particle size exceeding 0.5 μm tends to be remarkably reduced.

The surface resistivity of the elevation-molded body is preferably ¹⁰ 5 ^{~10 13 Ω} / □, more preferably ¹⁰ 6 ^{~10 12 Ω} / □, particularly preferably from ¹⁰ 7 ^{~10 11 Ω} / □. In the present invention, the surface resistivity is 10 ⁷ to 10 ¹¹ Ω / □. In general, the surface resistivity of a sample represents the resistance per unit surface area, and its unit is Ω, but in order to distinguish it from mere resistance, Ω / □ or Ω / sq. (Ohm par square). The surface resistivity is a value measured by the method described in the examples.

  The injection molded product of the present invention has extremely small variation in surface resistivity depending on the location. The variation in the surface resistivity can be expressed by the ratio (MAX / MIN) of the maximum surface resistivity (MAX) and the minimum surface resistivity (MIN) of the injection molded body. This ratio (MAX / MIN) is a value measured by the method described in the examples. The variation in surface resistivity (MAX / MIN) of the injection molded article of the present invention is usually 1000 or less, preferably 500 or less, more preferably 100 or less.

  The injection molded product of the present invention has a burr length measured by the method described in the examples, preferably 300 μm or less, more preferably 280 μm or less, and particularly preferably 250 μm or less. This burr length varies depending on the type of thermoplastic resin component used, and when using a thermoplastic resin component mainly composed of a crystalline thermoplastic resin, such as polyphenylene sulfide, which tends to generate burr even by general injection molding. Tend to be relatively long. However, even in that case, by using the resin composition of the present invention, the burr length can be remarkably shortened as compared with the case where polyphenylene sulfide is used alone as a resin component.

  When a resin composition mainly composed of polyether ether ketone or a resin composition mainly composed of an amorphous thermoplastic resin is used, the burr length of the injection-molded body is preferably 100 μm or less, more preferably 80 μm or less. Can be small.

  The injection-molded article of the present invention includes components used in the manufacturing process of semiconductors such as IC and LSI and mounting components thereof, components used in the manufacturing process of magnetic heads and hard disk drives, mounting components thereof, and liquid crystal display manufacturing. It can be suitably used as a component used in the process and its mounting component.

  The injection-molded product of the present invention is particularly suitable as a tray or a container used for transportation in the manufacturing process of an electronic device. Examples of such trays and containers include wafer carriers, cleaning trays, IC chip trays, magnetic head trays for transporting hard disk drive components, and head gimbal assemblies (HGA). Among these, the injection-molded article of the present invention is suitably applied to magnetic head trays and head gimbal assembly (HGA) trays for conveying hard disk drive (HDD) parts that are required to avoid contamination extremely. can do.

  These trays are, for example, plate-shaped molded bodies provided with a large number of through-holes, and are configured so that a large number of magnetic heads and HGAs are placed thereon and fixed and conveyed through the through-holes. Yes. When such a molded body is produced by injection molding, in general, burrs are easily generated in each part including the through hole, and the amount of generated particles is increased. And the conventional tray is formed from the resin composition which mix | blended conductive carbon black independently, and has a large variation in surface resistivity. On the other hand, the injection-molded article of the present invention is remarkably suppressed in the generation amount of particles and the generation of burrs even in the tray having such a shape, and the variation in surface resistivity is small.

  The injection-molded product of the present invention can be used as it is or after being subjected to secondary processing such as cutting, drilling or cutting. In the electric / electronic field, the injection molded body of the present invention including the above-mentioned uses includes, for example, a wafer carrier, wafer cassette, spin chuck, tote bottle, wafer boat, IC chip tray, IC chip carrier, IC card, IC. Test socket, burn-in socket, pin grid array socket, quad flat package, leadless chip carrier, dual inline package, small outline package, reel packing, various cases, storage tray, storage bin, transport device parts, magnetic card reader, etc. Is mentioned.

  In the OA equipment field, for example, charging members such as charging rolls, transfer rolls, and developing rolls in image forming apparatuses such as electrophotographic copying machines and electrostatic recording apparatuses, transfer drums for recording apparatuses, printed circuit board cassettes, bushes, paper, Bill transport parts, paper feed rails, font cartridges, ink ribbon canisters, guide pins, trays, rollers, gears, sprockets, computer housings, modem housings, monitor housings, CD-ROM housings, printer housings, connectors, computer slots, etc. Can be mentioned.

  In the field of communication equipment, mobile phone parts, pagers, various sliding materials and the like can be mentioned. In the automotive field, interior materials, under hoods, electronic / electric equipment housings, gas tank caps, fuel filters, fuel line connectors, fuel line clips, fuel tanks, equipment beads, door handles, various parts, and the like. In other fields, electric wire supports, radio wave absorbers, floor materials, pallets, shoe soles, blower fans, planar heating elements, polyswitches, and the like can be given.

  Hereinafter, the present invention will be described more specifically with reference to production examples, examples, and comparative examples, but the present invention is not limited to these examples. The measuring method of physical properties is as follows.

(1) Measurement of surface resistivity:
When the volume resistivity of the sample was 10 ⁸ Ω · cm or more, it was measured at an applied voltage of 100 V in accordance with JIS K6911. When the volume resistivity of the sample was less than 10 ⁸ Ω · cm, it was measured according to JIS K7194 (resistivity measurement test method using a 4-probe method of conductive plastics). The surface resistivity of the micro area was measured using a Hirester UP manufactured by Mitsubishi Chemical Corporation, using a probe that can be measured by a self-made pin type electrode, and an applied voltage of 100V.

  For the measurement of the surface resistivity, a test plate (65 mm × 90 mm × 3 mm thickness) obtained by injection molding of the resin composition was used. The surface resistivity was measured on five points on the test plate. The surface resistivity is shown as an average value. Further, the ratio (MAX / MIN) was calculated from the maximum value (MAX) and the minimum value (MIN) among the five measured values, and used as an index indicating variation in surface resistivity.

(2) Burr evaluation method:
Using the pellets obtained by melt extrusion of the resin composition, the minimum is such that the resin composition is completely filled into a mold having a cavity with a diameter of 70 mm and a thickness of 3 mm and maintained at an optimal mold temperature. Injection molding was performed at an injection pressure of 1.05 times the filling pressure to produce a disk-shaped molded body. About the obtained disk-shaped molded object, the burr | flash length which arises in the gap | interval (slit for burr | flash evaluation) of thickness 20 micrometers provided in the metal mold | die circumference part and width 5mm was measured using the expansion projector.

  The optimum mold temperature varies depending on the type of thermoplastic resin constituting the resin composition. The optimum mold temperature is, for example, 180 to 190 ° C. in the case of a resin composition mainly composed of polyether ether ketone. In the case of a resin composition containing polyphenylene sulfide, polyethersulfone, and polyetherimide as main components, the temperature is 150 to 160 ° C. In the case of the resin composition which has a polycarbonate as a main component, it is 110-120 degreeC.

(3) Measurement of particle generation amount:
An injection-molded plate (65 mm × 90 mm × 3 mm thickness) obtained by injection molding of the resin composition was placed in a 500 ml beaker, 500 ml of pure water was injected, and then treated with an ultrasonic oscillator (1200 W) for 1 minute. The amount of particles generated in the pure water after the treatment was measured using a liquid particle counter (manufactured by RION). The unit was expressed in units / ml.

[Production Example 1] Production Example of Carbon Precursor A softening point of 210 ° C., a quinoline insoluble content of 1% by weight, an H / C atomic ratio of 0.63 and a petroleum pitch of 68 kg and naphthalene of 32 kg, an inner volume of 300 with a stirring blade The mixture was charged into a liter pressure vessel, heated to 190 ° C., dissolved and mixed, then cooled to 80 to 90 ° C. and extruded to obtain a string-like molded body having a diameter of about 500 μm. Next, this string-like molded body was pulverized so that the ratio of diameter to length was about 1.5, and the obtained pulverized product was heated to 93 ° C. with 0.53% polyvinyl alcohol (saponification degree: 88% ) Dropped into an aqueous solution, stirred and dispersed, and cooled to obtain a spherical pitch formed body.

  Further, filtration was performed to remove moisture, and naphthalene in the pitch molded body was extracted and removed with about 6 times as much n-hexane as the spherical pitch molded body. The spherical pitch molded body thus obtained was oxidized for 1 hour while being heated air at 260 ° C. to obtain an oxidized pitch. This oxidized pitch was heat treated in a nitrogen stream at 580 ° C. for 1 hour and then pulverized to obtain carbon precursor particles having an average particle diameter of about 25 μm. The carbon content of the carbon precursor particles was 91.0% by mass.

In order to examine the volume resistivity of this carbon precursor, the oxidized pitch was pulverized, and further sieved with a mesh having an opening of about 100 μm to remove particles of 100 μm or more. 13 g of this pulverized oxidized pitch powder was filled into a cylindrical mold having a cross-sectional area of 80 cm ² and molded at a pressure of 196 MPa to obtain a compact. This molded body was heat-treated in a nitrogen stream at 580 ° C., which is the same temperature as the heat treatment temperature in the above-mentioned method for producing carbon precursor particles, for 1 hour to obtain a carbon precursor volume resistivity measurement sample (molded body). It was. The volume resistivity of this sample was measured according to JIS K7194. As a result, the volume resistivity of the carbon precursor was 3 × 10 ⁷ Ω · cm.

[Example 1]
Polyetheretherketone (PEEK; manufactured by Victrex MC, trade name “PEEK450P”, melting point 334 ° C.) 49.0% by mass, polyetherimide (PEI; manufactured by GE Plastics, trade name “Ultem 1010”, glass transition) Temperature 217 ° C.) 10.0% by mass, carbon precursor (Production Example 1) 16.0% by mass, and PAN-based carbon fiber (manufactured by Toho Rayon Co., Ltd., trade name “Vesfite HTA3000”, volume resistivity 10 ² Ω · 25.0% by mass) was uniformly dry blended with a tumbler mixer, supplied to a 45 mmφ twin-screw kneading extruder (PCM-45 manufactured by Ikegai Steel Corporation), and melt-extruded to produce pellets.

  After drying the pellets produced above, injection molding was performed using an injection molding machine (“IS-75” manufactured by Toshiba Machine Co., Ltd.) to produce a surface resistance measurement test plate and a burr evaluation disk-shaped molded body. Injection molding was performed with the cylinder temperature (maximum temperature) of the injection molding machine being 390 ° C., the feed part (root) temperature being 230 ° C., and the mold temperature being 190 ° C. The results are shown in Table 1.

[Example 2]
A surface resistance measurement test plate and a burr evaluation disk-shaped molded body were prepared in the same manner as in Example 1 except that the blending ratio of each component was changed as shown in Table 1. The results are shown in Table 1.

[Examples 3 and 4]
Instead of polyetherimide, polyethersulfone (PES; manufactured by Sumitomo Chemical Co., Ltd., trade name “Sumika Excel PES3600G”, glass transition temperature 225 ° C.) was used, and the blending ratio of each component was changed as shown in Table 1. Except for this, a surface resistance measurement test plate and a burr evaluation disk-shaped body were prepared in the same manner as in Example 1. The results are shown in Table 1.

[Comparative Example 1]
As the thermoplastic resin component, a non-crystalline thermoplastic resin was not used, only polyether ether ketone was used, and the blending ratio of each component was changed as shown in Table 1, and the same as in Example 1. Thus, a test plate for measuring surface resistance and a disk-shaped molded body for burr evaluation were prepared. The results are shown in Table 1.

[Comparative Example 2]
As the thermoplastic resin component, a non-crystalline thermoplastic resin was not used, only polyether ether ketone was used, and the blending ratio of each component was changed as shown in Table 1, and the same as in Example 1. Thus, a test plate for measuring surface resistance and a disk-shaped molded body for burr evaluation were prepared. The results are shown in Table 1.

  Since this injection molded body does not contain a carbon precursor, the surface resistivity is extremely unstable, and the variation depending on the location is too large, so the burr length and the amount of particles generated in the liquid were not measured.

(footnote)
(1) PEEK: Polyetheretherketone, manufactured by Victrex MC, trade name “PEEK450P”, melting point 334 ° C.
(2) PEI: polyetherimide, manufactured by GE Plastics, trade name “Ultem 1010”, glass transition temperature 217 ° C.
(3) PES: Polyethersulfone, manufactured by Sumitomo Chemical Co., Ltd., trade name “Sumika Excel PES3600G”, glass transition temperature 225 ° C.
(4) Carbon precursor: produced in Production Example 1. The volume resistivity is 3 × 10 ⁷ Ω · cm, and the carbon content is 91.0% by mass.
(5) PAN-based carbon fiber: manufactured by Toho Rayon Co., Ltd., trade name “Besfight HTA3000”, volume resistivity of less than 10 ² Ω · cm.

<Discussion>
As shown in Table 1, an injection molded article (Comparative Example 1) using only PEEK as a thermoplastic resin component and not using an amorphous thermoplastic resin has a particle generation amount of 0.5 μm or less. Is as large as 3200 particles / ml, the number of particles exceeding 0.5 μm is large, and the burr length is as long as 180 μm.

  In addition, the injection molded body (Comparative Example 2) using only the PEEK as the thermoplastic resin component and not containing the carbon precursor has an extremely unstable surface resistivity and varies depending on the location. Is too large to cope with an ESD failure.

In contrast, the injection molded body (Examples 1 to 4) using a resin composition containing PEEK as a main component and combining PEI or PES as an amorphous thermoplastic resin has a surface resistivity of E + 07Ω / □ ( That is, it is 10 ⁷ Ω / □), is stably controlled in the semiconductive region, has little variation in surface resistivity, and can cope with ESD failure. Moreover, these injection-molded bodies have a burr length as short as 40 to 60 μm, and the generation amount of particles of 0.5 μm or less in the liquid is extremely low as 320 to 440 particles / ml.

[Example 5]
Polyphenylene sulfide (PPS; Kureha Chemical Industries, trade name “Fortron KPS W214”, melting point 288 ° C.) 54.0% by mass, polyethersulfone (PES; Sumitomo Chemical Co., trade name “Sumika Excel PES3600G”, glass) Transition temperature 225 ° C.) 10.0% by mass, carbon precursor (Production Example 1) 16.0% by mass, and PAN-based carbon fiber (manufactured by Toho Rayon Co., Ltd., trade name “Vesfite HTA3000”, volume resistivity 10 ² Ω (Less than cm) 20.0% by mass was uniformly dry blended with a tumbler mixer, supplied to a 45 mmφ twin-screw kneading extruder (PCM-45 manufactured by Ikegai Steel Corporation), and melt-extruded to produce pellets.

  After drying the pellets produced above, injection molding was performed using an injection molding machine (“IS-75” manufactured by Toshiba Machine Co., Ltd.) to produce a surface resistance measurement test plate and a burr evaluation disk-shaped molded body. Injection molding was performed with the cylinder temperature (maximum temperature) of the injection molding machine being 320 ° C., the feed part (root) temperature being 230 ° C., and the mold temperature being 145 ° C. The results are shown in Table 2.

[Example 6]
Test for measuring surface resistance in the same manner as in Example 5 except that polyetherimide (PEI; trade name “Ultem 1010”, glass transition temperature 217 ° C.) was used instead of polyethersulfone. A disc and a disk-shaped molded body for burr evaluation were prepared. The results are shown in Table 2.

[Example 7]
Instead of polyethersulfone, polycarbonate (PC; manufactured by Teijin Kasei Co., Ltd., trade name “Panlite L-1225W”, glass transition temperature 150 ° C.) is used. The cylinder temperature (maximum temperature) of the injection molding machine is 320 ° C., the feed section ( Root) A test plate for measuring surface resistance and a disk-shaped molded body for burr evaluation were prepared in the same manner as in Example 5 except that the injection molding conditions were a temperature of 230 ° C. and a mold temperature of 140 ° C. The results are shown in Table 2.

[Comparative Example 3]
Surface as in Example 5, except that amorphous thermoplastic resin was not used as the thermoplastic resin component, only polyphenylene sulfide was used, and the blending ratio of each component was changed as shown in Table 2. A test plate for resistance measurement and a disk-shaped molded body for burr evaluation were prepared. The results are shown in Table 2.

(footnote)
(1) PPS: polyphenylene sulfide, manufactured by Kureha Chemical Industry Co., Ltd., trade name “Fortron KPS W214”, melting point 288 ° C.
(2) PEI: polyetherimide, manufactured by GE Plastics, trade name “Ultem 1010”, glass transition temperature 217 ° C.
(3) PES: Polyethersulfone, manufactured by Sumitomo Chemical Co., Ltd., trade name “Sumika Excel PES3600G”, glass transition temperature 225 ° C.
(4) PC: Polycarbonate, manufactured by Teijin Chemicals Ltd., trade name “Panlite L-1225W”, glass transition temperature 150 ° C.
(5) Carbon precursor: produced in Production Example 1. The volume resistivity of 3 × 10 ⁷ Ω · cm, a carbon content of 91.0 wt%.
(6) PAN-based carbon fiber: manufactured by Toho Rayon Co., Ltd., trade name “Besfight HTA3000”, volume resistivity less than 10 ² Ω · cm.

<Discussion>
As shown in Table 2, the injection molded body (Comparative Example 3) using a resin composition that uses only PPS as a thermoplastic resin component and does not use an amorphous thermoplastic resin has a particle generation amount of 0.5 μm or less. Is very high at 6600 particles / ml, the number of particles exceeding 0.5 μm is very large, and the burr length is as long as 420 μm.

On the other hand, the injection molded body (Examples 5 to 7) using a resin composition containing PPS as a main component and combined with PEI or PES as an amorphous thermoplastic resin has a surface resistivity of E + 07Ω / □ ( That is, it is 10 ⁷ Ω / □), is stably controlled in the semiconductive region, has little variation in surface resistivity, and can cope with ESD failure. Moreover, these injection-molded bodies have a burr length as short as 200 to 250 μm as compared with the injection-molded body of Comparative Example 3, and the amount of generated particles of 0.5 μm or less in the liquid is 760 to 790. The level is as low as / ml.

[Example 8]
As shown in Table 3, a cylinder composition (maximum temperature) of 350 ° C. of an injection molding machine using a resin composition in which the blending ratio of polyphenylene sulfide (PPS) is small and the blending ratio of polyethersulfone (PES) is the main component. A surface resistance measurement test plate and a burr evaluation disk-shaped molded body were produced in the same manner as in Example 5 except that the injection molding conditions were a feed part (base) temperature of 250 ° C. and a mold temperature of 150 ° C. The results are shown in Table 3.

[Example 9]
As shown in Table 3, a cylinder temperature (maximum temperature) of 360 ° C. of an injection molding machine using a resin composition in which the blending ratio of polyphenylene sulfide (PPS) is small and the blending ratio of polyetherimide (PEI) is the main component. A surface resistance measurement test plate and a burr evaluation disk-shaped molded body were produced in the same manner as in Example 6 except that the injection molding conditions were a feed part (base) temperature of 250 ° C. and a mold temperature of 165 ° C. The results are shown in Table 3.

[Example 10]
As shown in Table 3, using a resin composition in which the blending ratio of polyphenylene sulfide (PPS) is small and the blending ratio of polycarbonate (PC) is the main component, the cylinder temperature (maximum temperature) of 300 ° C. of the injection molding machine is fed. A surface resistance measurement test plate and a burr evaluation disk-shaped molded body were produced in the same manner as in Example 6 except that the injection molding conditions were a part (base) temperature of 220 ° C. and a mold temperature of 120 ° C. The results are shown in Table 3.

[Example 11]
As shown in Table 3, the cylinder temperature (maximum temperature) of the injection molding machine using a resin composition in which the blending ratio of polyether ether ketone (PEEK) is small and the blending ratio of polyethersulfone (PES) is the main component. A test plate for measuring surface resistance and a disk-shaped molded body for burr evaluation were prepared in the same manner as in Example 3 except that the injection molding conditions were 350 ° C, the feed part (base) temperature was 250 ° C, and the mold temperature was 150 ° C. did. The results are shown in Table 3.

[Comparative Example 4]
The same as Example 9 except that the crystalline thermoplastic resin was not used as the thermoplastic resin component, only polyetherimide (PEI) was used, and the blending ratio of each component was changed as shown in Table 1. Thus, a surface resistance measurement test plate and a burr evaluation disk-shaped molded body were prepared. The results are shown in Table 3.

[Comparative Example 5]
The same as Example 8 except that the crystalline thermoplastic resin was not used as the thermoplastic resin component, only polyethersulfone (PES) was used, and the blending ratio of each component was changed as shown in Table 1. Thus, a surface resistance measurement test plate and a burr evaluation disk-shaped molded body were prepared. The results are shown in Table 3.

  Since this injection molded body does not contain a carbon precursor, the surface resistivity is extremely unstable, and the variation depending on the location is too large, so the burr length and the amount of particles generated in the liquid were not measured.

(footnote)
(1) PEEK: Polyetheretherketone, manufactured by Victrex MC, trade name “PEEK450P”, melting point 334 ° C.
(2) PPS: polyphenylene sulfide, manufactured by Kureha Chemical Industry Co., Ltd., trade name “Fortron KPS W214”, melting point 288 ° C.
(3) PEI: polyetherimide, manufactured by GE Plastics, trade name “Ultem 1010”, glass transition temperature 217 ° C.
(4) PES: Polyethersulfone, manufactured by Sumitomo Chemical Co., Ltd., trade name “Sumika Excel PES3600G”, glass transition temperature 225 ° C.
(5) PC: Polycarbonate, manufactured by Teijin Chemicals Ltd., trade name “Panlite L-1225W”, glass transition temperature 150 ° C.
(6) Carbon precursor: produced in Production Example 1. The volume resistivity is 3 × 10 ⁷ Ω · cm, and the carbon content is 91.0% by mass.
(7) PAN-based carbon fiber: manufactured by Toho Rayon Co., Ltd., trade name “Besfight HTA3000”, volume resistivity of less than 10 ² Ω · cm.

<Discussion>
As shown in Table 3, as a thermoplastic resin component, an injection-molded body (Comparative Example 4 ) of a resin composition containing only polyetherimide (PEI), which is an amorphous thermoplastic resin, is 0.5 μm or less. The amount of particles generated is very high at 3700 particles / ml, the number of particles exceeding 0.5 μm is very large, and the contamination resistance is insufficient.

  In addition, as a thermoplastic resin component, an injection-molded article (Comparative Example 5) using a resin composition that uses only polyethersulfone (PES), which is an amorphous thermoplastic resin, and does not contain a carbon precursor is: The surface resistivity is extremely unstable, and the variation depending on the location is too large, so that the ESD failure cannot be dealt with.

In contrast, the main component is an amorphous thermoplastic resin such as polyethersulfone (PES), polyetherimide (PEI) or polycarbonate (PC), and these are crystalline resins such as polyphenylene sulfide (PPS) or polyetherether. Injection molded articles (Examples 8 to 11) using a resin composition combined with ketone (PEEK) have a surface resistivity of E + 07Ω / □ (that is, 10 ⁷ Ω / □) and are stable in the semiconductive region. And the variation in surface resistivity is small, and it is possible to cope with ESD failure. Moreover, these injection-molded bodies have a burr length as short as 40 to 65 μm, and the generation amount of particles of 0.5 μm or less in the liquid is extremely low as 310 to 410 particles / ml.

  The injection-molded article of the present invention includes components used in the manufacturing process of semiconductors such as IC and LSI and mounting components thereof, components used in the manufacturing process of magnetic heads and hard disk drives, mounting components thereof, and liquid crystal display manufacturing. It can be used as a component used in the process and its mounting component.

  The injection-molded article of the present invention can cope with an ESD failure such as a discharge phenomenon due to static electricity and electrostatic damage caused by the phenomenon, and has low contamination, so that a tray or a container for transporting an electronic device such as a semiconductor device, etc. Is particularly suitable.

Claims (9)

At least one crystalline thermoplastic resin (A1) selected from the group consisting of polyetheretherketone and polyarylene sulfide resin and at least one non- crystalline group selected from the group consisting of polyetherimide, polyethersulfone, and polycarbonate. A thermoplastic resin component (A) containing a crystalline thermoplastic resin (A2) 30 to 66 mass%, a volume resistivity 10 ² to 10 ¹⁰ Ω · cm of a carbon precursor (B) 5 to 16 mass%, and a volume resistivity of 10 ² Ω · cm below the carbon fibers in which the conductive filler (C) 18 low contamination of the injection-molded body formed from a resin composition containing 30 mass%, (1) As an evaluation of the amount of generated particles, an injection-molded plate (65 mm × 90 mm × 3 mm thickness) obtained by injection molding the resin composition was placed in a 500 ml beaker, and 500 ml of pure water was injected. In addition, the number of particles generated with a particle size of 0.5 μm or less measured in an ultrasonic oscillator (1200 W) for 1 minute and measured in pure water after treatment was 1500 particles / ml or less. Using the pellets obtained by melt extrusion of the resin composition, the minimum is such that the resin composition is completely filled into a mold having a cavity with a diameter of 70 mm and a thickness of 3 mm and maintained at an optimal mold temperature. Injection molding is performed at an injection pressure of 1.05 times the filling pressure, and a disk-shaped molded body is produced. About the obtained disk-shaped molded body, a gap of 20 μm in thickness and 5 mm in width provided on the periphery of the mold A low-contamination injection-molded article having a burr length of 300 μm or less (slit for burr evaluation) and (3) a surface resistivity of the injection-molded article of 10 ⁷ to 10 ¹¹ Ω / □ . Maximum surface resistivity (MAX) and the minimum surface resistivity (MIN) and the ratio (MAX / MIN) the variation of the surface resistivity represented by is 1000 or less claim 1 Symbol placement injection molded body. The injection according to claim 1 or 2, wherein the thermoplastic resin component (A) contains 1 to 99% by mass of the crystalline thermoplastic resin (A1) and 99 to 1% by mass of the amorphous thermoplastic resin (A2). Molded body. Thermoplastic resin component (A), the crystalline thermoplastic resin (A1) 50 wt% excess 95 wt% or less and an amorphous thermoplastic resin (A2) one containing a less than 5 wt% to 50 wt% of claim 3 The injection-molded article described. Thermoplastic resin component (A), the crystalline thermoplastic resin (A1) 5 wt% or more but less than 50% by weight and an amorphous thermoplastic resin (A2) according to claim 3 are those containing a 50 wt% excess 95 wt% or less The injection-molded article described. The injection-molded article according to any one of claims 1 to 5 , wherein the conductive filler (C) is at least one carbon fiber selected from the group consisting of polyacrylonitrile-based carbon fibers and pitch-based carbon fibers. The injection-molded article according to any one of claims 1 to 6 , which is a tray or a container for transporting an electronic device. The injection-molded article according to claim 7, which is a tray or a container for transporting hard disk drive components. The injection-molded article according to claim 7, which is a magnetic head tray or a head gimbal assembly (HGA) tray.